SN 7002
SIPMOS ® Small-Signal Transistor • N channel • Enhancement mode • Logic Level
• VGS(th) = 0.8...2.0V
Pin 1 G
Pin 2 S
Pin 3 D
Type SN 7002 Type SN 7002
VDS
60 V
ID
0.19 A
RDS(on)
5Ω
Package SOT-23
Marking sSG
Ordering Code Q67000-S063
Tape and Reel Information E6327
Maximum Ratings Parameter Drain source voltage Drain-gate voltage Symbol Values 60 60 Unit V
VDS VDGR VGS Vgs ID
RGS = 20 kΩ
Gate source voltage Gate-source peak voltage,aperiodic Continuous drain current
± 14 ± 20 A 0.19
TA = 25 °C
DC drain current, pulsed
IDpuls
0.76
TA = 25 °C
Power dissipation
Ptot
0.36
W
TA = 25 °C
Semiconductor Group
1
Sep-13-1996
SN 7002
Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1
1) For package mounted on aluminium 15 mm x 16.7 mm x 0.7 mm
Symbol
Values -55 ... + 150 -55 ... + 150 ≤ 350 ≤ 285 E 55 / 150 / 56
Unit °C K/W
Tj Tstg RthJA
Therminal resistance, chip-substrate- reverse side 1)RthJSR
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit
V(BR)DSS
60 1.4 0.1 1 2 3 2
V
VGS = 0 V, ID = 0.25 mA, Tj = 25 °C
Gate threshold voltage
VGS(th)
0.8
VGS=VDS, ID = 1 mA
Zero gate voltage drain current
IDSS
1 5
µA
VDS = 60 V, VGS = 0 V, Tj = 25 °C VDS = 60 V, VGS = 0 V, Tj = 125 °C
Gate-source leakage current
IGSS
10
nA Ω 5 7.5
VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance
RDS(on)
VGS = 10 V, ID = 0.5 A VGS = 4.5 V, ID = 0.05 A
Semiconductor Group
2
Sep-13-1996
SN 7002
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit
gfs
0.1 0.2 60 15 15 -
S pF 80 25 25 ns 5 8
VDS≥ 2 * ID * RDS(on)max, ID = 0.2 A
Input capacitance
Ciss Coss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Output capacitance
VGS = 0 V, VDS = 25 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = 30 V, VGS = 10 V, ID = 0.29 A RGS = 50 Ω
Rise time
tr
5 8
VDD = 30 V, VGS = 10 V, ID = 0.29 A RGS = 50 Ω
Turn-off delay time
td(off)
12 16
VDD = 30 V, VGS = 10 V, ID = 0.29 A RGS = 50 Ω
Fall time
tf
13 17
VDD = 30 V, VGS = 10 V, ID = 0.29 A RGS = 50 Ω
Semiconductor Group
3
Sep-13-1996
SN 7002
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS A 1 0.19 0.76 V 1.2 Values typ. max. Unit
TA = 25 °C
Inverse diode direct current,pulsed
ISM
-
TA = 25 °C
Inverse diode forward voltage
VSD
VGS = 0 V, IF = 0.5 A, Tj = 25 °C
Semiconductor Group
4
Sep-13-1996
SN 7002
Power dissipation Ptot = ƒ(TA)
Drain current ID = ƒ(TA) parameter: VGS ≥ 10 V
0.20 A
0.40 W
Ptot
0.32 0.28 0.24 0.20 0.16 0.12 0.08 0.04 0.00 0 20 40 60 80 100 120 °C 160
ID
0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 20 40 60 80 100 120 °C 160
TA
TA
Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25°C
Drain-source breakdown voltage V(BR)DSS = ƒ(Tj)
71 V 68 66
V(BR)DSS
64 62 60
58 56 54 -60
-20
20
60
100
°C
160
Tj
Semiconductor Group
5
Sep-13-1996
SN 7002
Typ. output characteristics ID = ƒ(VDS) parameter: tp = 80 µs , Tj = 25 °C
0.45 A
Typ. drain-source on-resistance RDS (on) = ƒ(ID) parameter: tp = 80 µs, Tj = 25 °C
16
Ptot = 0W
b k i hg f jl e
VGS [V] a 2.0
b c 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0
Ω
RDS (on)
12
ca
ID
0.35 0.30
d
d e f g
10
0.25 0.20 0.15 0.10 0.05 0.00
a
8
c
h i j k l
6
d e f lk g h ij
c 3.0 d 3.5 e f 4.0 4.5 g 5.0 h i 6.0 7.0 j 8.0
4
2 VGS [V] =
a 2.0 b 2.5
0 V 5.0 0.00 0.04 0.08 0.12 0.16 A
b
k l 9.0 10.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
0.24
VDS
ID
Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 µs
Typ. forward transconductance gfs = f (ID) parameter: tp = 80 µs,
1.1 A
0.40
S
ID
0.9 0.8 0.7 0.6
gfs
0.30
0.25
0.20 0.5 0.4 0.3 0.2 0.05 0.1 0.0 0 1 2 3 4 5 6 7 8 V 10 0.00 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 A 1.0 0.15
0.10
VGS
ID
Semiconductor Group
6
Sep-13-1996
SN 7002
Drain-source on-resistance RDS (on) = ƒ(Tj ) parameter: ID = 0.5 A, VGS = 10 V
16
Gate threshold voltage VGS (th) = ƒ(Tj) parameter: VGS = VDS, ID = 1 mA
4.6 V 4.0
Ω
RDS (on)
12
VGS(th)
3.6 3.2
10
2.8 2.4
8
98% 98%
2.0 1.6 1.2
6
typ
4
typ
2
2%
0.8 0.4
0 -60 -20 20 60 100 °C 160
0.0 -60 -20 20 60 100 °C 160
Tj
Tj
Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz
10 3
Forward characteristics of reverse diode IF = ƒ(VSD) parameter: Tj , tp = 80 µs
10 0
pF C 10 2
A
IF
10 -1
Ciss
10 1
Coss
10 -2
Tj = 25 °C typ Crss Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%)
10 0 0 10 -3 0.0
5
10
15
20
25
30
V VDS
40
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Semiconductor Group
7
Sep-13-1996
SN 7002
Package outlines SOT-23 Dimensions in mm
Semiconductor Group
8
Sep-13-1996