BGM210PB22JIA2

BGM210P Wireless Gecko Bluetooth Module Data Sheet The BGM210P is a module designed and built to meet the performance, security, and reliability requirements of line-powered IoT products for Bluetooth networks. KEY FEATURES Based on the EFR32BG21 SoC, it enables Bluetooth® Low Energy and Bluetooth Mesh connectivity while delivering best-in-class RF range and performance, future-proof capability for feature and OTA firmware updates, state-of-the-art security, low active current consumption, and a temperature rating suited for operation in demanding environmental conditions. • Bluetooth 5.1 and Bluetooth Mesh connectivity • Built-in antenna and RF pin • +10 and +20 dBm TX power variants • -97.0 dBm Bluetooth RX sensitivity at 1 Mbps • 32-bit ARM Cortex-M33 core at 38.4 MHz The BGM210P is a complete solution that comes with robust and fully-upgradeable software stacks, world-wide regulatory certifications, advanced development and debugging tools, and support that will simplify and minimize the development cycle and deployment of your end-product helping to accelerate its time-to-market. • 1024/96 kB of Flash/RAM memory The BGM210P is targeted for a broad range of applications, including: • Smart home • Connected lighting • Building automation and security • Factory automation • -40 to +125 oC Core / Memory ARM CortexTM M33 processor with DSP extensions, FPU and TrustZone ETM Secure Debug Crystal Flash Program Memory Secure Boot with RTSL • Optimal set of MCU peripherals • 20 GPIO pins • 12.9 mm x 15.0 mm x 2.2 mm Clock Management HF Crystal Oscillator 38.4 MHz Extended Unique Identifier EM2 HF RC Oscillator LDMA Controller LF Crystal Oscillator RAM Memory • Secure Element or Secure Vault HF RC Oscillator Energy Management Fast Startup RC Oscillator LF RC Oscillator Crypto Acceleration Voltage Regulator Brown-Out Detector Ultra LF RC Oscillator Security TRNG DPA Countermeasures Power-On Reset Secure Debug Authentication Anti-Tamper 32-bit bus Peripheral Reflex System Antenna Radio Transceiver Matching FRC LNA I Q PGA IFADC BUFC DEMOD RF Frontend Chip Antenna Serial Interfaces Timers and Triggers Analog I/F USART External Interrupts Timer/Counter Protocol Timer ADC I2C General Purpose I/O Low Energy Timer Watchdog Timer Analog Comparator PA RAC Frequency Synth PA CRC AGC RF Pin I/O Ports MOD Pin Reset Real Time Capture Counter Pin Wakeup Back-Up Real Time Counter Lowest power mode with peripheral operational: EM0—Active EM1—Sleep silabs.com | Building a more connected world. EM2—Deep Sleep EM3—Stop EM4—Shutoff Rev. 1.1 BGM210P Wireless Gecko Bluetooth Module Data Sheet Features 1. Features • Supported Protocols • Bluetooth 5.1 • Bluetooth Low Energy • Bluetooth Mesh • AoA/AoD • Wireless System-on-Chip • 2.4 GHz radio • TX power up to +20 dBm • High-performance 32-bit ARM Cortex-M33® with DSP instruction and floating-point unit for efficient signal processing • 1024 kB flash program memory • 96 kB RAM data memory • Embedded Trace Macrocell (ETM) for advanced debugging • Receiver Performance • -104.5 dBm sensitivity (0.1% BER) at 125 kbps GFSK • -100.1 dBm sensitivity (0.1% BER) at 500 kbps GFSK • -97.0 dBm sensitivity (0.1% BER) at 1 Mbps GFSK • -94.1 dBm sensitivity (0.1% BER) at 2 Mbps GFSK • Current Consumption • 9.3 mA RX current at 1 Mbps GFSK • 16.1 mA TX current at 0 dBm (BGM210Px22) • 34.1 mA TX current at 10 dBm (BGM210Px22) • 173 mA TX current at 20 dBm (BGM210Px32) • 50.9µA/MHz in Active Mode (EM0) • 5.1μA EM2 DeepSleep current (RTCC running from LFXO, Bluetooth Stack not running) • 8.5μA EM2 DeepSleep current (RTCC running from LFXO, Bluetooth Stack running) • Regulatory Certifications • CE • ISED • FCC • South Korea • Japan • Operating Range • 1.71 to 3.8 V • -40 to +125 °C • Dimensions • 12.9 mm x 15.0 mm x 2.2 mm • Security2 • Secure Boot with Root of Trust and Secure Loader (RTSL)1 • Hardware Cryptographic Acceleration for AES128/192/256, ChaCha20-Poly1305, SHA-1, SHA-2/256/384/512, ECDSA +ECDH (P-192, P-256, P-384, P-521), Ed25519 and Curve25519, J-PAKE, PBKDF2 • True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31 • ARM® TrustZone® • Secure Debug Interface lock/unlock • DPA Countermeasures1 • Secure Key Management with PUF • Anti-Tamper • Secure Attestation • MCU Peripherals • 12-bit 1 Msps SAR Analog to Digital Converter (ADC) • 2 × Analog Comparator (ACMP) • 20 General Purpose I/O pins with output state retention and asynchronous interrupts • 8 Channel DMA Controller • 12 Channel Peripheral Reflex System (PRS) • 3 × 16-bit Timer/Counter (3 Compare/Capture/PWM channels) • 1 × 32-bit Timer/Counter (3 Compare/Capture/PWM channels) • 32-bit Real Time Counter • 24-bit Low Energy Timer for waveform generation • 2 × Watchdog Timer • 3 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S) • 2 × I2C interface with SMBus support 1. With Secure Element (SE) firmware v1.1.2 or newer 2. See Table 3.2 Security Features and Levels on page 7 for details on security level differences between BGM210PB and BGM210PA part numbers. silabs.com | Building a more connected world. Rev. 1.1 | 2 BGM210P Wireless Gecko Bluetooth Module Data Sheet Ordering Information 2. Ordering Information Table 2.1. Ordering Information Flash (kB) RAM (kB) Built-in and RF pin 1024 96 20 -40 to 125 °C Cut Tape Secure Element Built-in and RF pin 1024 96 20 -40 to 125 °C Reel 20 dBm Secure Element Built-in and RF pin 1024 96 20 -40 to 125 °C Cut Tape Bluetooth 5.1 20 dBm Secure Element Built-in and RF pin 1024 96 20 -40 to 125 °C Reel BGM210PB22JIA2 Bluetooth 5.1 10 dBm Secure Vault Built-in and RF pin 1024 96 20 -40 to 125 °C Cut Tape BGM210PB22JIA2R Bluetooth 5.1 10 dBm Secure Vault Built-in and RF pin 1024 96 20 -40 to 125 °C Reel BGM210PB32JIA2 Bluetooth 5.1 20 dBm Secure Vault Built-in and RF pin 1024 96 20 -40 to 125 °C Cut Tape BGM210PB32JIA2R Bluetooth 5.1 20 dBm Secure Vault Built-in and RF pin 1024 96 20 -40 to 125 °C Reel TX Power Security Level Ordering Code Protocol Stack BGM210PA22JIA2 Bluetooth 5.1 10 dBm Secure Element BGM210PA22JIA2R Bluetooth 5.1 10 dBm BGM210PA32JIA2 Bluetooth 5.1 BGM210PA32JIA2R Antenna GPIO Temp Range Packaging All BGM210P devices operate in the 2.4 GHz ISM frequency band. Refer to 4.5 RF Transmitter General Characteristics for maximum TX power figures. End-product manufacturers must verify that the module is configured to comply with the proper regulatory limits for each region, in accordance with the formal certification test reports for the device. BGM210P modules are pre-programmed with BGAPI UART DFU bootloader. Devices may be referred to by their product family name (BGM210P), model name (BGM210P22A / BGM210P32A) or full ordering code throughout this document. The SLWSTK6102A Wireless Gecko Module Starter Kit is available for BGM210P evaluation and development, as well as the SLWRB4308A (+20 dBm TX, Secure Element), SLWRB4308B (+10 dBm TX, Secure Element), SLWRB4308C (+20 dBm TX, Secure Vault) and SLWRB4308D (+10 dBm TX, Secure Vault) radio boards. silabs.com | Building a more connected world. Rev. 1.1 | 3 Table of Contents 1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.2 EFR32BG21 SoC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.3 Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.4 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.5 Security . . . . . . . . . . . . . . . . . . . 3.5.1 Secure Boot with Root of Trust and Secure Loader (RTSL) 3.5.2 Cryptographic Accelerator. . . . . . . . . . . . 3.5.3 True Random Number Generator . . . . . . . . . 3.5.4 Secure Debug with Lock/Unlock. . . . . . . . . . 3.5.5 DPA Countermeasures. . . . . . . . . . . . . 3.5.6 Secure Key Management with PUF . . . . . . . . 3.5.7 Anti-Tamper . . . . . . . . . . . . . . . . 3.5.8 Secure Attestation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4. Electrical Specifications 7 7 8 8 8 8 8 9 9 . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . .10 4.2 General Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . .11 4.3 MCU Current Consumption at 3.0V . . . . . . . . . . . . . . . . . . . . . . .12 4.4 Radio Current Consumption at 3.0V . . . . . . . . . . . . . . . . . . . . . . .13 4.5 RF Transmitter General Characteristics . . . . . . . . . . . . . . . . . . . . .14 4.6 RF Receiver General Characteristics . . . . . . . . . . . . . . . . . . . . .15 4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps . . . . . . . . . . . . .16 4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps . . . . . . . . . . . . .17 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps . . . . . . . . . . . .18 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps . . . . . . . . . . . .19 4.11 High-Frequency Crystal . . . . . . . . . . . . . . . . . . . . . . . . . .20 4.12 GPIO Pins . . . . . . . . . . . . . . . . . . . . . . . . . . .21 4.13 Microcontroller Peripherals . . . . . . . . . . . . . . . . . . . . . . . . .22 4.14 Typical Performance Curves . . . . 4.14.1 Antenna Radiation and Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 .23 5. Reference Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 . . . . . 5.1 Network Co-Processor (NCP) Application with UART Host . . . . . . . . . . . . . . .24 5.2 SoC Application . . . . . . . . . . . . . .25 . . . . . . . . . . . . . . . 6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 6.1 Module Pinout . . . . silabs.com | Building a more connected world. . . . . . . . . . . . . . . . . . . . . . . . . . .26 Rev. 1.1 | 4 6.2 Alternate Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . .27 6.3 Analog Peripheral Connectivity . . . . . . . . . . . . . . . . . . . . . . . .27 6.4 Digital Peripheral Connectivity . . . . . . . . . . . . . . . . . . . . . . . . .28 7. Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.1 Layout and Placement . . . . . . . . . . . . . . . . . . . . . . . . . . .31 7.2 Proximity to Other Materials . . . . . . . . . . . . . . . . . . . . . . . . .33 7.3 Proximity to Human Body . . . . . . . . . . . . . . . . . . . . . . . . . .33 7.4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 7.5 Debug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 7.6 Packet Trace Interface (PTI) . . . . . . . . . . . . . . . . . . . . . . . . .34 8. Package Specifications 8.1 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . 35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 8.2 PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 8.3 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 9. Soldering Recommendations 10. Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . 38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 10.1 Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 10.2 Moisture Sensitivity Level . . . . . . . . . . . . . . . . . . . . . . . . . .39 11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 11.1 Qualified Antennas . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 11.2 CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 11.3 FCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 11.4 ISED Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 11.5 Japan . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 11.6 KC South Korea . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 11.7 Proximity to Human Body . . . . . . . . . . . . . . . . . . . . . . . . . .46 11.8 Bluetooth Qualification . . . . . . . . . . . . . . . . . . . . . . . . . .46 12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 . . . silabs.com | Building a more connected world. . Rev. 1.1 | 5 BGM210P Wireless Gecko Bluetooth Module Data Sheet System Overview 3. System Overview 3.1 Block Diagram The BGM210P module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4 GHz wireless connectivity and support robust networking capabilities via multiple protocols. Built around the EFR32BG21 Wireless Gecko SoC, the BGM210P includes, both, a built-in antenna and a 50 Ω-matched RF pin, RF matching networks (optimized for transmit power efficiency), supply decoupling and filtering components, a 38.4 MHz reference crystal, and an RF shield. Also, it allows using an external 32 kHz crystal as a low frequency reference signal via GPIO pins. Since the RF matching networks are optimized for transmit power efficiency, modules rated for +20 dBm will show non-optimal current consumption and performance when operated at a lower output power (e.g. +10 or 0 dBm). The same applies for modules rated for +10 dBm. VDD Supply Decoupling Antenna IOVDD RF Match RFPIN Silicon Labs EFR32BG21 RF Match HF XTAL (up to 20) External LF XTAL option RF SHIELD GPIO GND Figure 3.1. BGM210P Block Diagram 3.2 EFR32BG21 SoC The EFR32BG21 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1 MB of Flash memory, a dedicated core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG21 Wireless Gecko Reference Manual and the EFR32BG21 Data Sheet for details. 3.3 Antenna BGM210P modules include a built-in antenna with the characteristics detailed in the table below. They also include a 50 Ω-matched RF pin to enable the use of an external antenna instead of the one built-in. See Section 4.14.1 Antenna Radiation and Efficiency and Section 11.1 Qualified Antennas for other relevant details. Antenna diversity is not supported. Table 3.1. Antenna Efficiency and Peak Gain Parameter With optimal layout Note Efficiency -1 to -2 dB Peak gain 1.86 dBi silabs.com | Building a more connected world. Antenna efficiency, gain and radiation pattern are highly dependent on the application PCB layout and mechanical design. Refer to the Design Guidelines for recommendations to achieve optimal antenna performance. Rev. 1.1 | 6 BGM210P Wireless Gecko Bluetooth Module Data Sheet System Overview 3.4 Power Supply The BGM210P requires a single nominal supply level of 3.0 V to operate. However, it can support use cases needing different levels for the main supply (VDD) and for digital IO (IOVDD). The DECOUPLE pin exposes the SoC's on-chip digital supply regulator output and allows introducing an external digital supply source via a PMIC, for example. The default recommendation is to leave the DECOUPLE pin disconnected. All necessary components for supply decoupling and filtering are included in the module. 3.5 Security BGM210P modules support one of two levels in the Security Portfolio offered by Silicon Labs: Secure Vault or Secure Element. Secure Vault is a collection of technologies that deliver state-of-the-art security and upgradability features to protect and future-proof IoT devices against costly threats, attacks and tampering. Secure Element is the hardware-based subsystem at the core of Secure Vault that enables a subset of its features only. BGM210PB part numbers support Secure Vault and BGM210PA part numbers support Secure Element. Table 3.2. Security Features and Levels Feature Secure Element Secure Vault Secure Boot with Root of Trust and Secure Loader (RTSL) X X Cryptographic Accelerator X X ARM TrustZone X X True Random Number Generator (TRNG) X X Secure Debug with Lock/Unlock X X DPA Countermeasures X X Secure Key Management with PUF X Anti-Tamper X Secure Attestation X 3.5.1 Secure Boot with Root of Trust and Secure Loader (RTSL) The Secure Boot with RTSL authenticates a chain of trusted firmware that begins from an immutable memory (ROM). It prevents malware injection, prevents rollback, ensures that only authentic firmware is executed and protects Over The Air updates. More information on this feature can be found in the Application Note AN1218: Series 2 Secure Boot with RTSL. silabs.com | Building a more connected world. Rev. 1.1 | 7 BGM210P Wireless Gecko Bluetooth Module Data Sheet System Overview 3.5.2 Cryptographic Accelerator The Cryptographic Accelerator is an autonomous hardware accelerator with Differential Power Analysis (DPA) countermeasures to protect keys. It supports AES encryption and decryption with 128/192/256-bit keys, ChaCha20 encryption, and Elliptic Curve Cryptography (ECC) to support public key operations and hashes. Supported block cipher modes of operation for AES include: • ECB (Electronic Code Book) • CTR (Counter Mode) • CBC (Cipher Block Chaining) • CFB (Cipher Feedback) • GCM (Galois Counter Mode) • CCM (Counter with CBC-MAC) • CBC-MAC (Cipher Block Chaining Message Authentication Code) • GMAC (Galois Message Authentication Code) The Cryptographic Accelerator accelerates Elliptical Curve Cryptography and supports the NIST (National Institute of Standards and Technology) recommended curves including P-192, P-256, P-384, and P-521 for ECDH (Elliptic Curve Diffie-Hellman) key derivation and ECDSA (Elliptic Curve Digital Signature Algorithm) sign and verify operations. Also supported is the non-NIST Curve25519 for ECDH and Ed25519 for EdDSA (Edwards-curve Digital Signature Algorithm) sign and verify operations. Secure Vault also supports ECJ-PAKE (Elliptic Curve variant of Password Authenticated Key Exchange by Juggling) and PBKDF2 (Password-Based Key Derivation Function 2). Supported hashes include SHA-1, SHA-2/256/384/512 and Poly1305. This implementation provides a fast and energy efficient solution to state of the art cryptographic needs. 3.5.3 True Random Number Generator The True Random Number Generator module is a non-deterministic random number generator that harvests entropy from a thermal energy source. It includes start-up health tests for the entropy source as required by NIST SP800-90B and AIS-31 as well as online health tests required for NIST SP800-90C. The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator. 3.5.4 Secure Debug with Lock/Unlock For obvious security reasons, it is critical for a product to have its debug interface locked before being released in the field. In addition, the Secure Vault also provides a secure debug unlock function that allows authenticated access based on public key cryptography. This functionality is particularly useful for supporting failure analysis while maintaining confidentiality of IP and sensitive enduser data. More information on this feature can be found in the Application Note AN1190: Series 2 Secure Debug. 3.5.5 DPA Countermeasures The AES and ECC accelerators have Differential Power Analysis (DPA) countermeasures support. This makes it very expensive from a time and effort standpoint to use DPA to recover secret keys. 3.5.6 Secure Key Management with PUF Key material in Secure Vault is protected by what is called "key wrapping" with a standardized symmetric encryption mechanism. This method has the advantage of being able to protect a virtually unlimited number of keys, limited only by the storage that is accessible by the M33 (which includes off-chip storage as well). The symmetric key used for this wrapping and unwrapping must be highly secure as it can expose all other key material in the system. The Secure Vault Key Management system uses a Physically Unclonable Function (PUF) to generate a persistent device-unique seed key on power up to dynamically generate this critical wrapping/unwrapping key which is only visible by the AES encryption engine and is not retained when the device loses power. silabs.com | Building a more connected world. Rev. 1.1 | 8 BGM210P Wireless Gecko Bluetooth Module Data Sheet System Overview 3.5.7 Anti-Tamper There are internal tampers monitoring the system such as voltage, temperature, and electro-mechanical pulses as well as detecting tamper of the security sub-system itself. There are also 8 external configurable tamper pins for supporting external tamper sources like case tamper switches. For each tamper event, the user is able to select the severity of the tamper response ranging from an interrupt, to a reset, to destroying the PUF reconstruction data which will make all the protected key material un-recoverable and effectively render the device inoperable. The tamper system also has an internal resettable event counter with programmable trigger threshold and refresh periods to mitigate false positive tamper events. 3.5.8 Secure Attestation Secure Attestation begins with a secure identity that is created during the Silicon Labs manufacturing process. During device production, each device generates its own public/private keypair and securely stores the wrapped private key into immutable OTP memory, and this key never leaves the device. The corresponding public key is extracted from the device and inserted into a binary DER-encoded X.509 device certificate which is signed into a Silicon Labs CA chain and then programmed back into the chip into an immutable OTP memory. This secure identity can be used to authenticate the chip at any time in the life of the product. The production certification chain can be requested remotely from the product. This certification chain can be used to verify that the device was authentically produced by Silicon Labs. The device unique public key is also bound to the device certificate in the certification chain. A challenge can be sent to the chip at any point in time to be signed by the device private key. The public key in the device certificate can then be used to verify the challenge response, proving that the device has access to the securely-stored private key, which prevents counterfeit products or impersonation attacks. silabs.com | Building a more connected world. Rev. 1.1 | 9 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4. Electrical Specifications All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: • Typical values are based on TA=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization. • Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna. • Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. 4.1 Absolute Maximum Ratings Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. Table 4.1. Absolute Maximum Ratings Parameter Symbol Storage temperature range Test Condition Min Typ Max Unit TSTG -50 — +150 °C Voltage on any supply pin VDDMAX -0.3 — 3.8 V Voltage ramp rate on VDD supply pin VDDRAMPMAX — — 1.0 V / µs DC voltage on any GPIO pin VDIGPIN -0.3 — VIOVDD + 0.3 V Total current into VDD power IVDDMAX lines Source — — 200 mA Total current into GND pin IGNDMAX Sink — — 200 mA Current per I/O pin IIOMAX Sink — — 50 mA Source — — 50 mA Sink — — 200 mA Source — — 200 mA Current for all I/O pins IIOALLMAX silabs.com | Building a more connected world. Rev. 1.1 | 10 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.2 General Operating Conditions This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum values of all other tables are specifed over this operating range, unless otherwise noted. Table 4.2. General Operating Conditions Parameter Symbol Test Condition Min Typ Max Unit Operating ambient temperature range TA -I temperature grade -40 — +125 °C VDD Supply Voltage VDD 1.71 3.0 3.8 V 1.71 3.0 3.8 V MODE = WS1, RAMWSEN = 11 — — 80 MHz MODE = WS1, RAMWSEN = 01 — — 50 MHz MODE = WS0, RAMWSEN = 01 — — 39 MHz IOVDD operating supply volt- VIOVDD age (All IOVDD pins) HCLK and Core frequency fHCLK PCLK frequency fPCLK — — 50 MHz EM01 Group A clock frequency fEM01GRPACLK — — 80 MHz HCLK Radio frequency fHCLKRADIO 38 38.4 40 MHz Note: 1. Flash wait states are set by the MODE field in the MSC_READCTRL register. RAM wait states are enabled by setting the RAMWSEN bit in the SYSYCFG_DMEM0RAMCTRL register. silabs.com | Building a more connected world. Rev. 1.1 | 11 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.3 MCU Current Consumption at 3.0V Unless otherwise indicated, typical conditions are: VDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. Table 4.3. MCU Current Consumption at 3.0V Parameter Symbol Min Typ Max Unit 80 MHz HFRCO, CPU running Prime from flash — 50.9 — µA/MHz 80 MHz HFRCO, CPU running while loop from flash — 45.6 55.5 µA/MHz 80 MHz HFRCO, CPU running CoreMark loop from flash — 59.8 — µA/MHz 38.4 MHz crystal, CPU running while loop from flash — 63.8 — µA/MHz Current consumption in EM1 IEM1 mode with all peripherals disabled1 80 MHz HFRCO — 28.7 37.6 µA/MHz 38.4 MHz crystal — 46.9 — µA/MHz Current consumption in EM2 IEM2 mode Full RAM retention and RTC running from LFXO (Bluetooth Stack not running) — 5.1 — µA Full RAM retention, RTCC running, and Bluetooth Stack running from LFXO — 8.5 — µA 1 bank (16 kB) RAM retention and RTC running from LFRCO — 4.5 10.5 µA Full RAM retention and RTC running from ULFRCO — 4.8 11.4 µA 1 bank (16 kB) RAM retention and RTC running from ULFRCO — 4.3 — µA Current consumption in EM4 IEM4 mode No BURTC, no LF oscillator — 0.21 0.5 µA Current consumption during reset IRST Hard pin reset held — 146 — µA Current consumption per retained 16kB RAM bank in EM2 IRAM — 0.10 — µA Current consumption in EM0 IACTIVE mode with all peripherals disabled1 Current consumption in EM3 IEM3 mode Test Condition Note: 1. The typical EM0/EM1 current measurement includes some current consumed by the security core for periodical housekeeping purposes. This does not include current consumed by user-triggered security operations, such as cryptographic calculations. silabs.com | Building a more connected world. Rev. 1.1 | 12 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.4 Radio Current Consumption at 3.0V RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = 3.0V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. Table 4.4. Radio Current Consumption at 3.0V Parameter Symbol Test Condition Current consumption in receive mode, active packet reception IRX_ACTIVE Current consumption in receive mode, Stack running Current consumption in transmit mode IRX_LISTEN ITX Min Typ Max Unit 125 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running — 9.3 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running — 9.3 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running — 9.3 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running — 9.9 — mA 125 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running — 9.1 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running — 9.1 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running — 9.1 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooh stack running — 9.8 — mA f = 2.4 GHz, CW, 10 dBm Module, 0 dBm output power — 16.1 — mA f = 2.4 GHz, CW, 10 dBm Module, 10 dBm output power — 34.1 — mA f = 2.4 GHz, CW, 20 dBm Module, 10 dBm output power, VDD = 3.0 V — 59.7 — mA f = 2.4 GHz, CW, 20 dBm Module, POUT =19.2 dBm, VDD = 3.3 V 1 — 173 — mA Note: 1. The maximum power for Bluetooth Low-Energy is limited to 19.2 dBm. silabs.com | Building a more connected world. Rev. 1.1 | 13 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.5 RF Transmitter General Characteristics Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on RF2G4_IO2 port. Table 4.5. RF Transmitter General Characteristics Parameter Symbol RF tuning frequency range FRANGE Maximum TX output power 1 POUTMAX Minimum active TX Power Output power step size Output power variation vs VDD supply voltage, Freq = 2450MHz Output power variation vs temperature, Freq = 2450MHz POUTMIN POUTSTEP POUTVAR_V POUTVAR_T Output power variation vs RF POUTVAR_F frequency Test Condition Min Typ Max Unit 2400 — 2483.5 MHz 20 dBm Module, BLE, VDD = 3.3V2 — 19.2 — dBm 10 dBm Module — 10 — dBm 20 dBm Module, VDD = 3.3 V — -20.5 — dBm 10 dBm Module — -19.3 — dBm 10 dBm Module, -5 dBm < POUT < 0 dBm — 1.5 — dB 10 dBm Module, 0 dBm < POUT < 10 dBm — 1.0 — dB 20 dBm Module, 0 dBm < POUT < 5 dBm — 0.7 — dB 20 dBm Module, 5 dBm < POUT < POUTMAX — 0.5 — dB 20 dBm Module, POUT = POUTMAX VDD swept from 3.0V to 3.8V. — 1.0 — dB 10 dBm Module, POUT = POUTMAX VDD swept from 1.8V to 3.0V. — 0.2 — dB 20 dBm Module, POUT = POUTMAX, VDD = 3.3V, temperature swept from -40 to +125 °C. — 1.5 — dB 10 dBm Module, POUT = POUTMAX, VDD = 3.0V, temperature swept from -40 to +125 °C. — 0.3 — dB 20 dBm Module, POUT = POUTMAX, VDD = 3.3V, Freq. swept from 2400 to 2483.5 MHz — 0.2 — dB 10 dBm Module, POUT = POUTMAX, VDD = 3.0V, Freq. swept from 2400 to 2483.5 MHz — 0.2 — dB Note: 1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices covered in this data sheet can be found in the TX Power column of the Ordering Information Table. 2. The maximum power for Bluetooth Low-Energy. silabs.com | Building a more connected world. Rev. 1.1 | 14 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.6 RF Receiver General Characteristics Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on RF2G4_IO2 port. Table 4.6. RF Receiver General Characteristics Parameter Symbol RF tuning frequency range FRANGE silabs.com | Building a more connected world. Test Condition Min Typ Max Unit 2400 — 2483.5 MHz Rev. 1.1 | 15 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.7. RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal, packet length is 37 bytes1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -97.0 — dBm With non-ideal signals2 1 — -96.7 — dBm Signal to co-channel interfer- C/ICC er (see notes)1 3 — +6.6 — dB N ± 1 Adjacent channel selectivity Interferer is reference signal at +1 MHz offset1 4 3 5 — -8.3 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -8.7 — dB Interferer is reference signal at +2 MHz offset1 4 3 5 — -42.1 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -48.9 — dB Interferer is reference signal at +3 MHz offset1 4 3 5 — -42.4 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -54.8 — dB N ± 2 Alternate channel selectivity N ± 3 Alternate channel selectivity C/I1 C/I2 C/I3 Selectivity to image frequency C/IIM Interferer is reference signal at image frequency with 1 MHz precision1 5 — -42.1 — dB Selectivity to image frequency ± 1 MHz C/IIM_1 Interferer is reference signal at image frequency +1 MHz with 1 MHz precision1 5 — -42.4 — dB Interferer is reference signal at image frequency -1 MHz with 1 MHz precision1 5 — -8.3 — dB n=36 — -23 — dBm Intermodulation performance IM Note: 1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -67 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 silabs.com | Building a more connected world. Rev. 1.1 | 16 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.8. RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal, packet length is 37 bytes1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -94.1 — dBm With non-ideal signals2 1 — -93.9 — dBm Signal to co-channel interfer- C/ICC er (see notes)1 3 — +6.0 — dB N ± 1 Adjacent channel selectivity Interferer is reference signal at +2 MHz offset1 4 3 5 — -8.0 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -8.8 — dB Interferer is reference signal at +4 MHz offset1 4 3 5 — -42.2 — dB Interferer is reference signal at -4 MHz offset1 4 3 5 — -50.3 — dB Interferer is reference signal at +6 MHz offset1 4 3 5 — -54.4 — dB Interferer is reference signal at -6 MHz offset1 4 3 5 — -55.4 — dB N ± 2 Alternate channel selectivity N ± 3 Alternate channel selectivity C/I1 C/I2 C/I3 Selectivity to image frequency C/IIM Interferer is reference signal at image frequency with 1 MHz precision1 5 — -8.0 — dB Selectivity to image frequency ± 1 MHz C/IIM_1 Interferer is reference signal at image frequency +2 MHz with 1 MHz precision1 5 — -42.2 — dB Interferer is reference signal at image frequency -2 MHz with 1 MHz precision1 5 — +6.0 — dB n = 36 — -22.3 — dBm Intermodulation performance IM Note: 1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -67 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 silabs.com | Building a more connected world. Rev. 1.1 | 17 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal, packet length is 37 bytes1 — 10 — dBm Sensitivity SENS Signal is reference signal1 — -100.1 — dBm With non-ideal signals2 1 — -99.3 — dBm Signal to co-channel interfer- C/ICC er (see notes)1 3 — +2.1 — dB N ± 1 Adjacent channel selectivity Interferer is reference signal at +1 MHz offset1 4 3 5 — -9.0 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -9.5 — dB Interferer is reference signal at +2 MHz offset1 4 3 5 — -44.4 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -51.9 — dB Interferer is reference signal at +3 MHz offset1 4 3 5 — -44.3 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -58.3 — dB N ± 2 Alternate channel selectivity N ± 3 Alternate channel selectivity C/I1 C/I2 C/I3 Selectivity to image frequency C/IIM Interferer is reference signal at image frequency with 1 MHz precision1 5 — -44.4 — dB Selectivity to image frequency ± 1 MHz C/IIM_1 Interferer is reference signal at image frequency +1 MHz with 1 MHz precision1 5 — -44.3 — dB Interferer is reference signal at image frequency -1 MHz with 1 MHz precision1 5 — -9.0 — dB Note: 1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -72 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. silabs.com | Building a more connected world. Rev. 1.1 | 18 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps Unless otherwise indicated, typical conditions are: TA = 25 °C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal, packet length is 37 bytes1 — 10 — dBm Sensitivity SENS Signal is reference signal1 — -104.5 — dBm With non-ideal signals2 1 — -104.2 — dBm Signal to co-channel interfer- C/ICC er (see notes)1 3 — +0.8 — dB N ± 1 Adjacent channel selectivity Interferer is reference signal at +1 MHz offset1 4 3 5 — -13.1 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -13.6 — dB Interferer is reference signal at +2 MHz offset1 4 3 5 — -49.5 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -56.9 — dB Interferer is reference signal at +3 MHz offset1 4 3 5 — -47.0 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -63.1 — dB N ± 2 Alternate channel selectivity N ± 3 Alternate channel selectivity C/I1 C/I2 C/I3 Selectivity to image frequency C/IIM Interferer is reference signal at image frequency with 1 MHz precision1 5 — -49.5 — dB Selectivity to image frequency ± 1 MHz C/IIM_1 Interferer is reference signal at image frequency +1 MHz with 1 MHz precision1 5 — -47.0 — dB Interferer is reference signal at image frequency -1 MHz with 1 MHz precision1 5 — -13.1 — dB Note: 1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -79 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. silabs.com | Building a more connected world. Rev. 1.1 | 19 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.11 High-Frequency Crystal Table 4.11. High-Frequency Crystal Parameter Symbol Crystal frequency Min Typ Max Unit fHFXTAL — 38.4 — MHz Initial calibrated accuracy ACCHFXTAL -10 — +10 ppm Temperature drift DRIFTHFXTAL -30 — +30 ppm silabs.com | Building a more connected world. Test Condition Across specified temperature range Rev. 1.1 | 20 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.12 GPIO Pins Unless otherwise indicated, typical conditions are: VDD = IOVDD = 3.0 V. Table 4.12. GPIO Pins Parameter Symbol Test Condition Min Typ Max Unit Leakage current ILEAK_IO MODEx = DISABLED, IOVDD = 1.71V — 1.9 — nA MODEx = DISABLED, IOVDD = 3.0 V — 2.5 — nA MODEx = DISABLED, IOVDD = 3.8 V TA = 125 °C — — 200 nA Input low voltage1 VIL Any GPIO pin — — 0.3*IOVDD V Input high voltage1 VIH Any GPIO pin 0.7*IOVDD — — V Output low voltage VOL Sinking 20mA, IOVDD = 3.0 V — — 0.2 * IOVDD V Sinking 8mA, IOVDD = 1.62 V — — 0.4 * IOVDD V Sourcing 20mA, IOVDD = 3.0 V 0.8 * IOVDD — — V Sourcing 8mA, IOVDD = 1.62 V 0.6 * IOVDD — — V IOVDD = 3.0V, Cload = 50pF, SLEWRATE = 4, 10% to 90% — 8.4 — ns IOVDD = 1.7V, Cload = 50pF, SLEWRATE = 4, 10% to 90% — 13 — ns IOVDD = 3.0V, Cload = 50pF, SLEWRATE = 4, 90% to 10% — 7.1 — ns IOVDD = 1.7V, Cload = 50pF, SLEWRATE = 4, 90% to 10% — 11.9 — ns pull-up: MODEn = DISABLE DOUT=1, pull-down: MODEn = WIREDORPULLDOWN DOUT = 0 35 44 55 kΩ MODE = INPUT, DOUT = 1 — 26 — ns Output high voltage GPIO rise time GPIO fall time Pull up/down resistance2 VOH TGPIO_RISE TGPIO_FALL RPULL Maximum filtered glitch width TGF Note: 1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to VDD. 2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to VDD. silabs.com | Building a more connected world. Rev. 1.1 | 21 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.13 Microcontroller Peripherals The MCU peripherals set available in BGM210P modules includes: • 12-bit 1 Msps ADC • Analog Comparators • 16-bit and 32-bit Timers/Counters • 24-bit Low Energy Timer for waveform generation • 32-bit Real Time Counter • USART (UART/SPI/SmartCards/IrDA/I2S) • I2C peripheral interfaces • 12 Channel Peripheral Reflex System For details on their electrical performance, consult the relevant portions of Section 4 in the SoC's datasheet. To learn which GPIO ports provide access to every peripheral, consult Section 6.3 Analog Peripheral Connectivity and 6.4 Digital Peripheral Connectivity. 4.14 Typical Performance Curves Typical performance curves indicate typical characterized performance under the stated conditions. silabs.com | Building a more connected world. Rev. 1.1 | 22 BGM210P Wireless Gecko Bluetooth Module Data Sheet Electrical Specifications 4.14.1 Antenna Radiation and Efficiency Typical BGM210P radiation patterns and efficiency for the on-board chip antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. Figure 4.1. Typical 2D Antenna Radiation Patterns and Efficiency Top Left: Phi 0o, Top Right: Phi 90o, Bottom Left: Theta 90o, Bottom Right: Radiation Efficiency vs Application Board GND Plane Width silabs.com | Building a more connected world. Rev. 1.1 | 23 BGM210P Wireless Gecko Bluetooth Module Data Sheet Reference Diagrams 5. Reference Diagrams The interconnection labels in the following diagrams correspond to supported pin functions as described in Sections 7.5 Debug, 7.6 Packet Trace Interface (PTI) and 6.4 Digital Peripheral Connectivity. 5.1 Network Co-Processor (NCP) Application with UART Host The BGM210P can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Interfaces for Custom Designs. For an example of how to enable the virtual COM port (VCOM) when relevant, see radio board user guides UG388 or UG389. Figure 5.1. UART NCP Configuration In systems where IOVDD is not equal to VDD, pin 1 of the mini simplicity debug connector should be connected to the IOVDD pin of the BGM210P module, and the module should be powered through an external power supply. If the host CPU is operated at a different voltage level than the BGM210P, then IOVDD and pin 1 of the mini simplicity debug connector should be powered with the same voltage level as the host CPU or, else, an external voltage level shifter will be required. silabs.com | Building a more connected world. Rev. 1.1 | 24 BGM210P Wireless Gecko Bluetooth Module Data Sheet Reference Diagrams 5.2 SoC Application The BGM210P can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Interfaces for Custom Designs. For an example of how to enable the virtual COM port (VCOM) when relevant, see radio board user guides UG388 or UG389. Figure 5.2. Stand-Alone SoC Configuration Figure 5.3. Stand-Alone SoC Configuration with External Antenna silabs.com | Building a more connected world. Rev. 1.1 | 25 BGM210P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions 6. Pin Definitions 6.1 Module Pinout Pin 1 Index 6 26 PC05 PA03 7 25 PC04 PA04 8 24 PC03 PA05 9 23 PC02 PA06 10 22 PC01 DECOUPLE 11 21 PC00 GND 12 20 GND 19 RESETn PA02 18 27 PD00 5 17 GND PA01 PD01 28 16 4 PD02 RF2G4_IO2 PA00 15 29 PD03 3 14 GND PB00 PD04 GND 30 13 31 2 VDD 1 IOVDD GND PB01 Figure 6.1. BGM210P Module Pinout The next table shows the BGM210P pinout and general descriptions for each pin. Refer to Sections 6.2 Alternate Pin Functions, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity for details on functions and peripherals supported by GPIOs. Table 6.1. BGM210P Module Pin Definitions Pin Name No. Description Pin Name No. Description GND 1 Ground PB01 2 GPIO PB00 3 GPIO PA00 4 GPIO PA01 5 GPIO PA02 6 GPIO PA03 7 GPIO PA04 8 GPIO PA05 9 GPIO PA06 10 GPIO DECOUPLE 11 Decouple output for on-chip voltage regulator. Do Not Connect 3. GND 12 Ground VDD 13 Power supply IOVDD 14 Digital IO power supply PD04 15 GPIO PD03 16 GPIO PD02 17 GPIO PD01 18 GPIO PD00 19 GPIO GND 20 Ground PC00 21 GPIO PC01 22 GPIO PC02 23 GPIO PC03 24 GPIO PC04 25 GPIO PC05 26 GPIO RESETn 27 Reset Pin1 GND 28 Ground RF2G4_IO2 29 2.4 GHz RF input/output2 GND 30 Ground GND 31 Ground silabs.com | Building a more connected world. Rev. 1.1 | 26 BGM210P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions Pin Name No. Description Pin Name No. Description Note: 1. Connected to pull-up resistor to VDD internally. External pull-up is not required. 2. 50 Ohm-matched RF pin for external antenna support. Connect to GND when not used. 3. The DECOUPLE pin exposes the SoC's on-chip digital supply regulator output and allows introducing an external digital supply source via a PMIC, for example. The default recommendation is to leave the DECOUPLE pin disconnected. 6.2 Alternate Pin Functions Some GPIOs support alternate functions like debugging, wake-up from EM4, external low frequency crystal access, etc.. The following table shows which module pins have alternate capabilities and the functions they support. Refer to the SoC's reference manual for more information. Table 6.2. GPIO Alternate Functions Table GPIO Alternate Function PB01 GPIO.EM4WU3 PA01 GPIO.SWCLK PA02 GPIO.SWDIO PA03 GPIO.SWV GPIO.TDO PA04 GPIO.TDI GPIO.TRACECLK PA05 GPIO.EM4WU0 PD02 GPIO.EM4WU9 PD01 LFXO.LFXTAL_I PD00 LFXO.LFXTAL_O PC00 GPIO.EM4WU6 PC05 GPIO.EM4WU7 GPIO.TRACEDATA0 LFXO.LF_EXTCLK 6.3 Analog Peripheral Connectivity Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the SoC's Reference Manual for more details on the ABUS and analog peripherals. Table 6.3. ABUS Routing Table Peripheral ACMP0 ACMP1 IADC0 Signal PA PB PC PD EVEN ODD EVEN ODD EVEN ODD EVEN ODD ana_neg Yes Yes Yes Yes Yes Yes Yes Yes ana_pos Yes Yes Yes Yes Yes Yes Yes Yes ana_neg Yes Yes Yes Yes Yes Yes Yes Yes ana_pos Yes Yes Yes Yes Yes Yes Yes Yes ana_neg Yes Yes Yes Yes Yes Yes Yes Yes ana_pos Yes Yes Yes Yes Yes Yes Yes Yes silabs.com | Building a more connected world. Rev. 1.1 | 27 BGM210P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions 6.4 Digital Peripheral Connectivity Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. Table 6.4. DBUS Routing Table Peripheral.Resource PORT PA PB PC PD ACMP0.DIGOUT Available Available Available Available ACMP1.DIGOUT Available Available Available Available CMU.CLKIN0 Available Available CMU.CLKOUT0 Available Available CMU.CLKOUT1 Available Available FRC.DCLK Available Available FRC.DFRAME Available Available FRC.DOUT Available Available CMU.CLKOUT2 Available Available I2C0.SCL Available Available Available Available I2C0.SDA Available Available Available Available I2C1.SCL Available Available I2C1.SDA Available Available PRS.ASYNCH10 Available Available PRS.ASYNCH11 Available Available PRS.ASYNCH6 Available Available PRS.ASYNCH7 Available Available PRS.ASYNCH8 Available Available PRS.ASYNCH9 Available Available LETIMER0.OUT0 Available Available LETIMER0.OUT1 Available Available PRS.ASYNCH0 Available Available PRS.ASYNCH1 Available Available PRS.ASYNCH2 Available Available PRS.ASYNCH3 Available Available PRS.ASYNCH4 Available Available PRS.ASYNCH5 Available Available PRS.SYNCH0 Available Available Available Available PRS.SYNCH1 Available Available Available Available PRS.SYNCH2 Available Available Available Available PRS.SYNCH3 Available Available Available Available silabs.com | Building a more connected world. Rev. 1.1 | 28 BGM210P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions Peripheral.Resource PORT PA PB PC PD TIMER0.CC0 Available Available Available Available TIMER0.CC1 Available Available Available Available TIMER0.CC2 Available Available Available Available TIMER0.CDTI0 Available Available Available Available TIMER0.CDTI1 Available Available Available Available TIMER0.CDTI2 Available Available Available Available TIMER1.CC0 Available Available Available Available TIMER1.CC1 Available Available Available Available TIMER1.CC2 Available Available Available Available TIMER1.CDTI0 Available Available Available Available TIMER1.CDTI1 Available Available Available Available TIMER1.CDTI2 Available Available Available Available TIMER2.CC0 Available Available TIMER2.CC1 Available Available TIMER2.CC2 Available Available TIMER2.CDTI0 Available Available TIMER2.CDTI1 Available Available TIMER2.CDTI2 Available Available TIMER3.CC0 Available Available TIMER3.CC1 Available Available TIMER3.CC2 Available Available TIMER3.CDTI0 Available Available TIMER3.CDTI1 Available Available TIMER3.CDTI2 Available Available USART0.CLK Available Available Available Available USART0.CS Available Available Available Available USART0.CTS Available Available Available Available USART0.RTS Available Available Available Available USART0.RX Available Available Available Available USART0.TX Available Available Available Available USART1.CLK Available Available USART1.CS Available Available USART1.CTS Available Available USART1.RTS Available Available USART1.RX Available Available USART1.TX Available Available silabs.com | Building a more connected world. Rev. 1.1 | 29 BGM210P Wireless Gecko Bluetooth Module Data Sheet Pin Definitions Peripheral.Resource PORT PA PC PD USART2.CLK Available Available USART2.CS Available Available USART2.CTS Available Available USART2.RTS Available Available USART2.RX Available Available USART2.TX Available Available silabs.com | Building a more connected world. PB Rev. 1.1 | 30 BGM210P Wireless Gecko Bluetooth Module Data Sheet Design Guidelines 7. Design Guidelines 7.1 Layout and Placement For optimal performance of the BGM210P, • Place the module aligned to the edge of the application PCB, as illustrated in the figures below. • Leave the antenna clearance area void of any traces, components, or copper on all layers of the application PCB if you are going to use the on-board chip antenna • Antenna clearance area is not necessary if you are using an external antenna attached to the RF pin. • For external antenna use cases, use a 50 Ω grounded coplanar transmission line to trace the signal from the RF pin to an external RF connector if applicable (see Figure 7.2 Recommended Layout for BGM210P Using External Antenna on page 32). • A general rule is to use 50 Ω transmission lines where the length of the RF trace is longer than λ/16 at the fundamental frequency, which for 2.4 GHz is approximately 7.8 mm. • A U.FL connector can be used in the host PCB for the connection to an external antenna. The use of a U.FL connector is also recommended for conductive tests. The integrator must use a unique connector, such as a “reverse polarity SMA” or “reverse thread SMA”, if detachable antenna is offered with the host chassis. This is especially required for the FCC and ISED approvals to remain valid, and any other kind of direct connector to the antenna might require a permissive change. • A trace length of 2.6 mm was used in the certifications host board to connect the module RF pin to the U.FL connector. • For reference, Figure 7.4 RF Trace Design Example on page 33 shows a set of parameters for a 50 Ω trace. Trace impedance should always be matched to the particular stack-up used on the host board. • Connect all ground pads directly to a solid ground plane. • Place the ground vias as close to the ground pads as possible. • Do not place plastic or any other dielectric material in contact with the antenna. Align module edge with PCB edge GND Place vias close to each of the module’s GND pads Antenna Clearance No metal in this area GND GND GND Wireless Module (Top View) GND GND Place vias along all PCB edges Figure 7.1. Recommended Layout for BGM210P Using On-Board Chip Antenna silabs.com | Building a more connected world. Rev. 1.1 | 31 BGM210P Wireless Gecko Bluetooth Module Data Sheet Design Guidelines Align module edge with PCB edge (optional, not mandatory) GND GND GND U.FL connector for external antenna RF2G4_IO2 Place vias close to each of the module’s GND pads GND 50 Ohm trace for RF signal Wireless Module (Top View) GND GND Place vias along all PCB edges Figure 7.2. Recommended Layout for BGM210P Using External Antenna The figure below illustrates layout scenarios to avoid that will lead to severely degraded RF performance for modules that use the onboard chip antenna. This recommendation is not applicable to design cases using an external antenna. Copper Clearance Area GND plane width X Figure 7.3. Non-Optimal Layout Examples The width of the application PCB's GND plane under the module will impact the efficiency of the on-board chip antenna. To achieve optimal performance, a GND plane width of 50 mm is recommended. See Figure 4.1 Typical 2D Antenna Radiation Patterns and Efficiency on page 23 for reference. silabs.com | Building a more connected world. Rev. 1.1 | 32 BGM210P Wireless Gecko Bluetooth Module Data Sheet Design Guidelines Figure 7.4. RF Trace Design Example 7.2 Proximity to Other Materials Avoid placing plastic or any other dielectric material in close proximity to the antenna. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes. 7.3 Proximity to Human Body Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. 7.4 Reset The BGM210P can be reset by pulling the RESET line low, by the internal watchdog timer, or by software command. The reset state does not provide power saving functionality and it is not recommended as a means to conserve power. 7.5 Debug See AN958: Debugging and Programming Interfaces for Custom Designs. The BGM210P supports hardware debugging via 4-pin JTAG or 2-pin serial-wire debug (SWD) interfaces. It is recommended to expose the debug pins in your own hardware design for firmware update and debug purposes. The table below lists the required pins for JTAG and SWD debug interfacing, which are also presented in Section 6.2 Alternate Pin Functions. If JTAG interfacing is enabled, the module must be power cycled to return to a SWD debug configuration if necessary. Table 7.1. Debug Pins Pin Name Pin Number JTAG Signal SWD Signal PA04 4 TDI N/A This pin is disabled after reset. Once enabled the pin has a built-in pull-up. PA03 3 TDO N/A This pin is disabled after reset. PA02 2 TMS SWDIO Pin is enabled after reset and has a built-in pull-up. PA01 1 TCK SWCLK Pin is enabled after reset and has a built-in pull-down. silabs.com | Building a more connected world. Comments Rev. 1.1 | 33 BGM210P Wireless Gecko Bluetooth Module Data Sheet Design Guidelines 7.6 Packet Trace Interface (PTI) The BGM210P integrates a true PHY-level packet trace interface (PTI) peripheral that can capture packets non-intrusively to monitor and log device and network traffic without burdening processing resources in the module's SoC. The PTI generates two output signals that can serve as a powerful debugging tool, especially in conjunction with other hardware and software development tools available from Silicon Labs. The PTI_DATA and PTI_FRAME signals can be accessed through any GPIO on ports C and D (see FRC.DOUT and FRC.DFRAME peripheral resources in Table 6.4 DBUS Routing Table on page 28). silabs.com | Building a more connected world. Rev. 1.1 | 34 BGM210P Wireless Gecko Bluetooth Module Data Sheet Package Specifications 8. Package Specifications 8.1 Package Outline Figure 8.1. Top and Side Views Figure 8.2. Bottom View silabs.com | Building a more connected world. Rev. 1.1 | 35 BGM210P Wireless Gecko Bluetooth Module Data Sheet Package Specifications 8.2 PCB Land Pattern Figure 8.3. Recommended Land Pattern for Built-in Antenna Use Case Figure 8.4. Recommended Land Pattern for RF Pin Use Case silabs.com | Building a more connected world. Rev. 1.1 | 36 BGM210P Wireless Gecko Bluetooth Module Data Sheet Package Specifications 8.3 Package Marking The figure below shows the module markings engraved on the RF shield. Figure 8.5. BGM210P Top Marking Mark Description The package marking consists of: • BGM210Pxxxxxxx - Part number designation • Model: BGM210Pxxx - Model number designation • QR Code: YYWWMMABCDE • YY – Last two digits of the assembly year • WW – Two-digit workweek when the device was assembled • MMABCDE – Silicon Labs unit code • YYWWTTTTTT • YY – Last two digits of the assembly year • WW – Two-digit workweek when the device was assembled • TTTTTT – Manufacturing trace code. The first letter is the device revision • Certification marks such as the CE logo, FCC and IC IDs, etc will be engraved on the grayed out area, according to regulatory body requirements silabs.com | Building a more connected world. Rev. 1.1 | 37 BGM210P Wireless Gecko Bluetooth Module Data Sheet Soldering Recommendations 9. Soldering Recommendations It is recommended that final PCB assembly of the BGM210P follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. CLASS 1 General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. CLASS 2 Dedicated Service Electronic Products Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. CLASS 3 High Performance/Harsh Environment Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. Note: General SMT application notes are provided in the AN1223 document. silabs.com | Building a more connected world. Rev. 1.1 | 38 BGM210P Wireless Gecko Bluetooth Module Data Sheet Tape and Reel 10. Tape and Reel 10.1 Tape and Reel BGM210P modules are delivered to the customer in cut tape (100 pcs) or reel (1000 pcs) packing with the dimensions below. All dimensions are given in mm unless otherwise indicated. Pin 1 is found in Quadrant 1 (upper left side of carrier) with respect to the direction of feed indicated by the arrow in the figure. Figure 10.1. Carrier Tape Dimensions Figure 10.2. Reel Dimensions 10.2 Moisture Sensitivity Level BGM210P modules are delivered in packing that conforms to moisture sensitivity level 3 (MSL3) requirements. silabs.com | Building a more connected world. Rev. 1.1 | 39 BGM210P Wireless Gecko Bluetooth Module Data Sheet Certifications 11. Certifications This section details the regulatory certification status of the module in various regions. The address for the module manufacturer and certification applicant is: SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 11.1 Qualified Antennas BGM210P modules have been tested and certified both with the built-in antenna and with an external antenna attached to the RF pin (RF2G4_IO2). Performance characteristics for the built-in antenna are presented in Table 3.1 Antenna Efficiency and Peak Gain on page 6 and Figure 4.1 Typical 2D Antenna Radiation Patterns and Efficiency on page 23. Details for the external antenna qualified are summarized in the table below. Table 11.1. Qualified External Antennas for BGM210P Antenna Type Maximum Gain Impedance Connectorized Coaxial Dipole 2.14 dBi 50 Ω Any antenna of the same general type and of equal or less directional gain as listed in the above table can be used in the regulatory areas that have a full modular radio approval (USA, Canada, Korea, Japan) as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced. In countries applying the ETSI standards, like the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. If an antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) with a gain less than or equal to 2.14 dBi is needed, it can be added as a permissive change, requiring some radiated emission testing. Antenna types with more gain than 2.14 dBi may require a fully new certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house and/or certification body for understanding the correct approach. You might also want or need to get in touch with Silicon Labs for any authorization letter that your certification body might ask for. 11.2 CE The BGM210P module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU). Please note that every application using the BGM210P will need to perform the radio EMC tests on the end product, according to EN 301 489-17. It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product. The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF radiated testing with the end-product assembly. A formal Declaration of Conformity (DoC) is available via https://www.silabs.com/. 11.3 FCC This device complies with Part 15 of the FCC Rules when operating with the embedded antenna or with the antenna type(s) listed in Table 11.1. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. This transmitter also meets the Portable requirements at distances equal or above 5.3 mm for the BGM210P22A and 44.0 mm for the BGM210P32A. These distances are reported for convenience also in Table 11.2. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. silabs.com | Building a more connected world. Rev. 1.1 | 40 BGM210P Wireless Gecko Bluetooth Module Data Sheet Certifications OEM Responsibilities to comply with FCC Regulations This module has been tested for compliance to FCC Part 15. OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. • General Considerations This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rule requirements if applicable. • Manual Information to the End User The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual. • OEM/Host Manufacturer Responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. Separation • To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.2 must be maintained between the human body and the radiator (antenna) at all times. In particular, the minimum distance must be 5.3 mm for the BGM210P22A and 44.0 mm for the BGM210P32A. • This transmitter module is tested in a standalone mobile RF exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation will be required, ultimately leading to a Class II Permissive Change, or more rarely to a new grant. • Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The evaluation (SAR) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body as the grant holder’s agent. End Product Labeling BGM210P modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: "Contains Transmitter Module FCC ID: QOQGM210P" Or "Contains FCC ID: QOQGM210P" The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. silabs.com | Building a more connected world. Rev. 1.1 | 41 BGM210P Wireless Gecko Bluetooth Module Data Sheet Certifications Class B Device Notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna • Increase the separation between the equipment and receiver • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected • Consult the dealer or an experienced radio/TV technician for help silabs.com | Building a more connected world. Rev. 1.1 | 42 BGM210P Wireless Gecko Bluetooth Module Data Sheet Certifications 11.4 ISED Canada ISED This radio transmitter (IC: 5123A-GM210P) has been approved by Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada) to operate with the embedded antenna and with the antenna type(s) listed in 11.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or greater, in accordance to the limit(s) exposed in the RF Exposure Analysis. For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above 20 mm for the BGM210P22A and 40 mm for the BGM210P32A. If the separation distance from the human body is less than the values stated above, which are also reported in Table 11.2 for convenience, the OEM integrator is responsible for evaluating the SAR. OEM Responsibilities to comply with IC Regulations The module has been certified for integration into products only by OEM integrators under the following conditions: • The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times. • The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the ISED authorization to remain valid, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body typically acting as the certificate holder’s agent. End Product Labeling The BGM210P module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: “Contains Transmitter Module IC: 5123A-GM210P ” or “Contains IC: 5123A-GM210P” The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). CAN ICES-003 (B) This Class B digital apparatus complies with Canadian ICES-003. silabs.com | Building a more connected world. Rev. 1.1 | 43 BGM210P Wireless Gecko Bluetooth Module Data Sheet Certifications ISED (Français) Le présent émetteur radio (IC: 5123A-GM210P) a été approuvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la section 11.1 Qualified Antennas, avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil. . L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNRd’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exemptsde licence. L’exploitation est autorisée aux deux conditions suivantes: 1. L’appareil nedoit pas produire de brouillage; 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptibled’en compromettre le fonctionnement. Déclaration d'exposition RF L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5. Le module répond aux exigences pour les cas d'utilisation Mobile lorsque la distance minimale de séparation du corps humain est de 20 cm ou plus, conformément à la (aux) limite(s) exposée(s) dans l'analyse de l'exposition RF. Pour les cas d'utilisation Portables, l'exposition aux fréquences radio ou l'évaluation du SAR n'est pas nécessaire lorsque les distances de séparation du corps humain sont égales ou supérieures à 20 mm pour le BGM210P22A et à 40 mm pour le BGM210P32A. Si la distance de séparation du corps humain est inférieure aux valeurs indiquées ci-dessus, également indiquées dans le tableau 11.2 pour des raisons de commodité, l'intégrateur OEM est responsable de l'évaluation du SAR. Responsabilités du fabricant de se conformer à la réglementation IC Le module a été certifié pour l'intégration dans les produits uniquement par les intégrateurs OEM dans les conditions suivantes: • L'antenne doit être installée de manière à maintenir une distance de séparation minimale, comme indiqué ci-dessus, entre le radiateur (antenne) et toutes les personnes. • Le module émetteur ne doit pas être localisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. Remarque Importante: Au cas où ces conditions ne pourraient pas être remplies, le produit final devra être soumis à des tests supplémentaires pour évaluer l'exposition RF, afin que l'autorisation ISED reste valable, et une modification permissive devra être appliquée à l'aide de propre organisme de certification de télécommunication du client en général agissant en tant que titulaire du certificat mandataire. Étiquetage des produits finis Les modules BGM210P est étiqueté avec son propre ID de certification.Si l'ID de certification n'est pas visible lorsque le module est installé dans un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette faisant référence au module inclus. Dans ce cas, le produit final doit être étiqueté dans une zone visible avec les éléments suivants: “Contient le module transmetteur IC: 5123A-GM210P ” or “Contient IC: 5123A-GM210P” L’intégrateur OEM doit être conscient de ne pas fournir à l’utilisateur final d’informations sur la procédure d’installation ou de retrait de ce module RF ni sur la modification des paramètres liés à la RF dans le manuel d’utilisation du produit final. Tant que toutes les conditions ci-dessus sont remplies, aucun test supplémentaire de l'émetteur ne sera nécessaire. Toutefois, l’intégrateur OEM reste responsable de l’essai de son produit final pour déterminer les exigences de conformité supplémentaires requises avec ce module installé (par exemple, émissions d’appareils numériques, exigences relatives aux périphériques PC, etc.) CAN ICES-003 (B) Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. silabs.com | Building a more connected world. Rev. 1.1 | 44 BGM210P Wireless Gecko Bluetooth Module Data Sheet Certifications 11.5 Japan The BGM210P22A low power variants are certified in Japan with number 020-190254. Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment places the certification mark and certification number on the outside of the host equipment. This combination of mark and number, and their relative placement, is depicted in Figure 9.1, and depending on the size of the module it might also appear on the top shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Certification Text to be Placed on the Outside Surface of the Host Equipment: Translation of the text: “This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” The "Giteki" marking shown in the following figures must be affixed to an easily noticeable section of the specified radio-enabled host equipment. Note that such section may be required to contain additional information if the end-device embedding the module is also subject to a telecom approval. The manufacturer of the final product is also responsible to provide a Japanese language version of the User Manual and/or Installation Instructions as a companion document coming with the final product when placed on the market in Japan. Figure 11.1. GITEKI Mark and ID Figure 11.2. Detail of GITEKI Mark silabs.com | Building a more connected world. Rev. 1.1 | 45 BGM210P Wireless Gecko Bluetooth Module Data Sheet Certifications 11.6 KC South Korea The BGM210P22A low-power variants have a RF certification for import and use in South Korea. Their certification number is R-CBGT-GM210P. When integrating the RF-certified module, an end-product is exempted from doing the RF emission testing as long as the recommended design guidance is followed, and the approved antennas are used. EMC testing, and any other relevant tests, might still be required for full compliance. 11.7 Proximity to Human Body When using the module in an application where the radio is located close to the human body, the human RF exposure must be evaluated. FCC, ISED, and CE all have different standards for evaluating the RF exposure, and because of this, each standard requires a different minimum separation distance between the module and human body. Certification of BGM210P allows for the minimum separation distances detailed in the table below in Portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without any need for RF exposure evaluation. Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption Certification BGM210P22A BGM210P32A FCC 5.3 mm 44.0 mm ISED 20 mm 40 mm CE The RF exposure must always be evaluated using the end-product when transmitting with power levels higher than 20 mW (13 dBm). For FCC and ISED, using the module in end-products where the separation distance from the human body is smaller than that listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or Change of ID to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the endproduct in all cases when transmitting at more than the power level indicated in the table. Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected. 11.8 Bluetooth Qualification The BGM210P modules come at launch with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component having Declaration ID of D043475 and QDID of 129390, and having a listing date of 2019-04-02. Because the validity set by the SIG for Tested Components is currently of 3 years, during the product lifetime Silicon Labs will renew this Component as it expires, whenever applicable. Renewed Tested Components will come with new DIDs and QDIDs, and these will be then referred to in end-product listings. Such new DIDs and QDIDs can be discovered starting from the original ones.This module’s RF-PHY Tested Component should be combined with the latest Wireless Gecko Link Layer and Host pre-qualified Components by Silicon Labs, when in the process of qualifying an end-product embedding the BGM210P via the SIG’s Launch Studio. silabs.com | Building a more connected world. Rev. 1.1 | 46 BGM210P Wireless Gecko Bluetooth Module Data Sheet Revision History 12. Revision History Revision 1.1 August, 2020 • Updated security wording in Front Page and added Core/Memory and Security components to block diagram enabled with Secure Vault • Updated list of security features and corrected number of 16-bit Timer/Counter (from 2 x to 3 x) in 1. Features • Added BGM210PBxxxxxx part numbers to Table 2.1 Ordering Information on page 3 and updated footnotes • Added 3.5 Security • Added VCOM TX/RX pin labels to J1 connector in 5. Reference Diagrams and references to UG388/UG389 for example on how to enable VCOM • Added footnote on DECOUPLE pin to Table 6.1 BGM210P Module Pin Definitions on page 26 • Added comment to Figure 7.3 Non-Optimal Layout Examples on page 32 noting that figure applies to module use cases with onboard chip antenna only • Updated graphic type for Figure 8.1 Top and Side Views on page 35 • Removed top marking figures for BGM210P0 part numbers and added those for BGM210PB part numbers in 8.3 Package Marking • Added comment on pin 1 orientation in 10.1 Tape and Reel • Added 10.2 Moisture Sensitivity Level • Added 11.8 Bluetooth Qualification Revision 1.0 January, 2020 • • • • • • • • • • • • • • • • Corrected LETIMER's lowest power mode in front page block diagram from EM2 to EM3 Added RF Pin to front page block diagram Removed BGM210P0xxxxxx part numbers from Ordering Information table Replaced "Chip" with "Built-in" antenna throughout document Added sentence in Section 3.3 Antenna clarifying that antenna diversity is not supported Added text in Section 3.4 Power Supply about DECOUPLE pin Corrected lower limit for operating voltage range from 1.8 to 1.71 V in Section 4. Electrical Specifications Resolved remaining TBD entries in Section 4. Electrical Specifications Changed "3.3V" net label to "VDD" and connected pins U1.20 and U1.29 to GND in Section 5. Reference Diagrams Added supply connection recommendation for NCP use cases with different IOVDD and VDD levels in Section 5.1 Network Co-Processor (NCP) Application with UART Host Updated DECOUPLE pin description to "Do Not Connect", and added notes on RESET and RF2G4_IO2 pins to Table 6.1 BGM210P Module Pin Definitions on page 26 Corrected edge-alignment placement recommendation to "Optional, not mandatory" in Figure 7.2 Recommended Layout for BGM210P Using External Antenna on page 32 Added Sections 7.4 Reset, 7.5 Debug and 7.6 Packet Trace Interface (PTI) Renamed Section 8.1 Dimensions as 8.1 Package Outline Renamed Fig 8.1 Module Dimensions as Figure 8.1 Top and Side Views on page 35 and added Figure 8.2 Bottom View on page 35 Added Japan and South Korea certifications Revision 0.5.1 September, 2019 • Update wording for FCC and ISED certifications section • Updated Design Guidelines silabs.com | Building a more connected world. Rev. 1.1 | 47 BGM210P Wireless Gecko Bluetooth Module Data Sheet Revision History Revision 0.5 September, 2019 • Initial Production Release. • Updated with latest values, certifications, security, etc • Updated with OPNs for Reel packaging • Added System Overview • Updated Electrical Specifications with latest values • Added Reference Diagrams • Updated wording and figures in Design Guidelines • Updated figures in Package Specifications and added Marking section • Added Tape and Reel dimensions • Updated Certifications information • General wording, spelling, and grammar fixes. Revision 0.1 April, 2019 • Initial Release. silabs.com | Building a more connected world. Rev. 1.1 | 48 Simplicity Studio One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! 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