BGM220S Wireless Gecko Bluetooth®
Module Data Sheet
The BGM220S is a module designed and built to meet the performance, security, and reliability requirements of battery-powered
IoT products running on Bluetooth networks.
Based on the EFR32BG22 SoC, the BGM220S enables Bluetooth® Low Energy connectivity while delivering best-in-class RF range and performance, future-proof capability for
feature and OTA firmware updates, enhanced security features, and low energy consumption.
BGM220S modules are a full solution that comes with fully-upgradeable, robust software
stacks, world-wide regulatory certifications, advanced development and debugging
tools, and support that will minimize and simplify the engineering and development of
your end-products helping to accelerate their time-to-market.
KEY FEATURES
• Bluetooth 5.2
• Built-in antenna or RF pin
• Up to 6 dBm TX power
• -98.6 dBm BLE RX sensitivity at 1 Mbps
• 32-bit ARM Cortex-M33 core at up to 76.8
MHz
• 512/32 kB of Flash/RAM memory
• Optimal selection of MCU peripherals
• 25 GPIO pins
• 6 mm × 6 mm × 1.1 mm
The BGM220S is intended for a broad range of applications, including:
• Asset Tags and Beacons
• Portable Medical
• Sports, Fitness, and Wellness devices
• Connected Home
• Industrial and Building Automation
• Bluetooth mesh Low Power Nodes
Crystals
Core / Memory
ARM CortexTM M33 processor
with DSP extensions,
FPU and TrustZone
ETM
Debug Interface
38.4 MHz
Flash Program
Memory
LDMA
Controller
RAM Memory
Clock Management
HF Crystal
Oscillator
HF
RC Oscillator
Fast Startup
RC Oscillator
Precision LF
RC Oscillator
LF Crystal
Oscillator
Ultra LF RC
Oscillator
Energy
Management
Security
Voltage
Regulator
DC-DC
Converter
Crypto Acceleration
Power-On
Reset
Brown-Out
Detector
True Random
Number Generator
32-bit bus
Peripheral Reflex System
Antenna
Discrete
Antenna
Radio Subsystem
RFSENSE
w/ OOK Detect
DEMOD
Matching
RX/TX Frontend
with Integrated PA
IFADC
AGC
Frequency
Synthesizer
MOD
Serial
Interfaces
I/O Ports
Timers and Triggers
Analog I/F
TM
ARM Cortex
M0+ Radio
Controller
USART
External
Interrupts
Timer/
Counter
Protocol
Timer
ADC
BUFC RAM
PDM
General
Purpose I/O
Low Energy
Timer
Watchdog
Timer
Temperature
Sensor
FRC
EUART
Pin Reset
Real Time
Capture
Counter
Back-Up Real
Time Counter
CRC
I2C
Pin Wakeup
Lowest power mode with peripheral operational:
EM0—Active
silabs.com | Building a more connected world.
EM1—Sleep
EM2—Deep Sleep
EM3—Stop
Copyright © 2022 by Silicon Laboratories
EM4—Shutoff
Rev. 1.1
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Feature List
1. Feature List
• Supported Protocols
• Bluetooth Low Energy (Bluetooth 5.2)
• Direction finding
• 1M, 2M, and LE Coded PHYs
• Bluetooth Mesh Low Power Node
• Wireless System-on-Chip
• 2.4 GHz radio
• TX power up to 6 dBm
• High-performance 32-bit ARM Cortex-M33® with DSP instruction and floating-point unit for efficient signal processing
• Up to 512 kB flash program memory
• 32 kB RAM data memory
• Embedded Trace Macrocell (ETM) for advanced debugging
• High Receiver Performance
• -106.4 dBm sensitivity (0.1% BER) at 125 kbps GFSK
• -102.3 dBm sensitivity (0.1% BER) at 500 kbps GFSK
• -98.6 dBm sensitivity (0.1% BER) at 1 Mbps GFSK
• -95.9 dBm sensitivity (0.1% BER) at 2 Mbps GFSK
• Low-Energy Consumption
• 4.2 mA RX current at 1 Mbps GFSK
• 4.6 mA TX current at 0 dBm output power
• 26 µA/MHz in Active Mode (EM0)
• 1.40 μA EM2 DeepSleep current (RTCC running from
LFXO, Full RAM retention)
• Regulatory Certifications1
•
•
•
•
•
CE and UKCA - EU and UK
FCC - USA
ISED - Canada
MIC - Japan
KC - South Korea
• Wide Operating Range
• 1.8 to 3.8 V
• -40 to +105 °C and -40 to +85 °C Versions Available
• Dimensions
• 6 mm × 6 mm × 1.1 mm
• Security Features
• Secure Boot with Root of Trust and Secure Loader (RTSL)
• Hardware Cryptographic Acceleration for AES128/256,
SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA,
and ECDH
• True Random Number Generator (TRNG) compliant with
NIST SP800-90 and AIS-31
• ARM® TrustZone®
• Secure Debug with lock/unlock
• Wide Selection of MCU Peripherals
• Analog to Digital Converter (ADC)
• 12-bit @ 1 Msps
• 16-bit @ 76.9 ksps
• 25 General Purpose I/O pins with output state retention and
asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 4 × 16-bit Timer/Counter with 3 Compare/Capture/PWM
channels
• 1 × 32-bit Timer/Counter with 3 Compare/Capture/PWM
channels
• 32-bit Real Time Counter
• 24-bit Low Energy Timer for waveform generation
• 1 × Watchdog Timer
• 2 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
• 1 × Enhanced Universal Asynchronous Receiver/Transmitter (EUART)
• 2 × I2C interface with SMBus support
• Digital microphone interface (PDM)
• RFSENSE with selective OOK mode
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Rev. 1.1 | 2
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Ordering Information
2. Ordering Information
Table 2.1. Ordering Information
Ordering Code
Protocol Stack
TX Power
Rating
Max CPU
Speed
Antenna
RF
Shield
Flash
(kB)
RAM
(kB)
GPIO
Temp Range
BGM220SC12WGA2
Bluetooth 5.2
0 dBm
38.4 MHz
Built-in
No
352
32
25
-40 to 85 °C
BGM220SC22HNA2
Bluetooth 5.2
• Direction Finding Rx
6 dBm
76.8 MHz
Built-in
Yes
512
32
25
-40 to 105 °C
BGM220SC22WGA2
Bluetooth 5.2
6 dBm
76.8 MHz
Built-in
Yes
352
32
25
-40 to 85 °C
Note:
1. End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with
the formal certification test reports.
2. Devices are pre-programmed with BGAPI UART DFU bootloader v1.10.2.
3. Throughout this document, the devices in the table above may be referred to by their product family name (e.g. BGM220S), by
model name (BGM220S12A for 0 dBm TX power, BGM220S22A for 6 dBm TX power), or by full ordering code.
4. LE Long Range (125 kbps and 500 kbps) PHYs are only supported on part numbers which include direction-finding capability.
5. In accordance with the Bluetooth specification, the module operates over the following frequency range: 2402 - 2480 MHz. The
module is also capable of operating in a separate custom transmit-only mode where proprietary packets are sent over the channels
2401 MHz and 2481 MHz using the same 1 Mbps GFSK modulation.
6. All devices in the table above support transmitting CTE (Constant Tone Extension) which is required in Direction Finding, but only
specific devices support CTE receive. These devices are marked with "Direction Finding Rx" in the Protocol Stack Column.
7. The SLWSTK6103A Wireless Starter Kit is available for BGM220S evaluation and development, as well as the SLWRB4312A
radio board.
silabs.com | Building a more connected world.
Rev. 1.1 | 3
Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 Introduction .
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3.2 EFR32BG22 SoC .
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3.3 Antenna .
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3.4 Power Supply .
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4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Absolute Maximum Ratings.
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4.2 General Operating Conditions .
4.2.1 DC-DC Operating Limits .
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.10
4.3 MCU Current Consumption with 3 V Supply .
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4.4 Radio Current Consumption with 3 V Supply .
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4.5 RF Transmitter General Characteristics for the 2.4 GHz Band .
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4.6 RF Receiver General Characteristics for the 2.4 GHz Band .
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4.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate .
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4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate .
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.15
4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate .
.16
4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate .
.17
4.11 High-Frequency Crystal
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4.12 Low Frequency Crystal Oscillator .
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4.13 Precision Low Frequency RC Oscillator (LFRCO) .
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.19
4.14 GPIO Pins .
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.20
4.15 Microcontroller Peripherals
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.21
4.16 Typical Performance Curves . . . .
4.16.1 Antenna Typical Characteristics .
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.21
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5. Reference Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . .
24
5.1 Network Co-Processor (NCP) Application with UART Host .
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.24
5.2 SoC Application
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6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.1 44-Pin SiP Module Device Pinout.
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.26
6.2 Alternate Function Table.
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.28
6.3 Analog Peripheral Connectivity
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.28
6.4 Digital Peripheral Connectivity .
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.29
7. Design Guidelines
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Rev. 1.1 | 4
7.1 Layout and Placement .
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.32
7.2 Best Design Practices
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.35
7.3 Radio Performance vs. Carrier Board Size
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.37
7.4 Proximity to Other Materials
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.38
7.5 Proximity to Human Body .
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.38
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8. Package Specifications
8.1 Package Dimensions .
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.39
8.2 Recommended PCB Land Pattern .
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.41
8.3 Top Marking .
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9. Soldering Recommendations
10. Tape and Reel
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11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
11.1 Regulatory Certifications . . .
11.1.1 Qualified Antennas. . . .
11.1.2 EU and UK - CE and UKCA .
11.1.3 USA - FCC . . . . . .
11.1.4 ISED Canada . . . . .
11.1.5 Proximity to Human Body .
11.1.6 Japan - MIC . . . . . .
11.1.7 South Korea - KC . . . .
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.54
11.2 Standards-Based Certifications .
11.2.1 Bluetooth Qualification . .
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.54
.54
12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
55
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Rev. 1.1 | 5
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
System Overview
3. System Overview
3.1 Introduction
The BGM220S module combines an energy-friendly MCU with a highly integrated radio transceiver in a SiP module with a robust, integrated antenna. This section gives a short introduction to the features of the module.
The block diagram for the BGM220S module is shown in the figure below. The wireless module includes the EFR32BG22 wireless System on a Chip (SoC), required decoupling capacitors and inductors, 38.4 MHz crystal, RF matching circuit, and integrated antenna.
2400 – 2483.5 MHz
External
Antenna
1.8 - 3.8 V
2400 – 2483.5 MHz
or
VREGVDD
ANT_OUT
Integral
Antenna
ANT_IN
IOVDD
Supply Decoupling
and DC-DC Support
VREG
DECOUPLE
0 Ohm
RF Match
RF_2G4
Silicon Labs
EFR32BG22
(up to 25)
HF XTAL
38.4 MHz
GPIO
GND
Figure 3.1. BGM220S Block Diagram
A simplified internal schematic for the BGM220S module is shown in the figure below.
EFR32BG22
VREGVDD
VREGVDD
AVDD
4.7µF
IOVDD
IOVDD
VREGSW
2.2µH
VREG
DVDD
RFVDD
PAVDD
4.7µF
DECOUPLE
2.2µF
DECOUPLE
RF2G4_IO
Integral
Antenna
ANT_OUT
ANT_IN
Matching
Network
RF_2G4
PA0x
PB0x
PC0x
PD0x
HFXTAL_I
HFXTAL_O
PAx (0-8)
PBx (0-4)
PCx (0-6)
PDx (0-3)
38.4 MHz
Figure 3.2. BGM220S Module Schematic
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Rev. 1.1 | 6
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
System Overview
3.2 EFR32BG22 SoC
The EFR32BG22 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 512 kB of flash memory, a rich set
of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG22 Wireless Gecko Reference
Manual and the EFR32BG22 Data Sheet for details.
3.3 Antenna
BGM220S modules include an integral antenna on board with the characteristics detailed in the tables below.
Table 3.1. Antenna Efficiency and Peak Gain (BGM220S12A)
Parameter
With optimal layout Note
Efficiency
-1.4 to -2.6 dB
Peak gain
1.5 dBi
Antenna efficiency, gain and radiation pattern are highly dependent on the application PCB layout and mechanical design. Refer
to 7. Design Guidelines for recommendations to achieve optimal
antenna performance.
Table 3.2. Antenna Efficiency and Peak Gain (BGM220S22A)
Parameter
With optimal layout Note
Efficiency
-1 to -2 dB
Peak gain
2.3 dBi
Antenna efficiency, gain and radiation pattern are highly dependent on the application PCB layout and mechanical design. Refer
to 7. Design Guidelines for recommendations to achieve optimal
antenna performance.
3.4 Power Supply
The BGM220S requires a single nominal supply level of 3.0 V to operate. All necessary decoupling and filtering components are included in the module, and the supply is fully regulated internally.
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Rev. 1.1 | 7
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4. Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on TA=25 °C and VREGVDD supply at 3.0 V, by production test and/or technology characterization.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
4.1 Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter
Symbol
Storage temperature range
Min
Typ
Max
Unit
TSTG
-40
—
+125
°C
Voltage on any supply pin
VDDMAX
-0.3
—
3.8
V
Junction temperature
TJMAX
-G grade
—
—
+105
°C
-N grade
—
—
+105
°C
—
—
1.0
V / µs
-0.3
—
VIOVDD +
0.3
V
—
—
+10
dBm
-0.3
—
VVREG +
0.3
V
Voltage ramp rate on any
supply pin
VDDRAMPMAX
DC voltage on any GPIO pin
VDIGPIN
Input RF level on RF pin
RF_2G4
PRFMAX2G4
Absolute voltage on RF pin
RF_2G4
VMAX2G4
Test Condition
Total current into VDD power IVDDMAX
lines
Source
—
—
200
mA
Total current into VSS
ground lines
IVSSMAX
Sink
—
—
200
mA
Current per I/O pin
IIOMAX
Sink
—
—
50
mA
Source
—
—
50
mA
Sink
—
—
200
mA
Source
—
—
200
mA
Current for all I/O pins
IIOALLMAX
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Rev. 1.1 | 8
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.2 General Operating Conditions
This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum
values of all other tables are specifed over this operating range, unless otherwise noted.
Table 4.2. General Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Operating ambient temperature range
TA
-G temperature grade
-40
—
+85
°C
-N temperature grade
-40
—
+105
°C
IOVDDx operating supply
voltage (All IOVDD pins)
VIOVDDx
1.71
3.0
3.8
V
VREGVDD operating supply
voltage
VVREGVDD
DCDC in regulation1
2.2
3.0
3.8
V
DCDC in bypass
1.8
3.0
3.8
V
HCLK and SYSCLK frequen- fHCLK
cy
VSCALE2, MODE = WS1
—
—
76.8
MHz
VSCALE2, MODE = WS0
—
—
40
MHz
PCLK frequency
VSCALE2
—
—
50
MHz
VSCALE1
—
—
40
MHz
VSCALE2
—
—
76.8
MHz
VSCALE1
—
—
40
MHz
VSCALE2
—
—
76.8
MHz
VSCALE1
—
—
40
MHz
VSCALE2 or VSCALE1
—
38.4
—
MHz
fPCLK
EM01 Group A clock frequency
fEM01GRPACLK
EM01 Group B clock frequency
fEM01GRPBCLK
Radio HCLK frequency2
fRHCLK
Note:
1. The supported maximum VVREGVDD in regulation mode is a function of temperature and 10-year lifetime average load current.
See more details in 4.2.1 DC-DC Operating Limits.
2. The recommended radio crystal frequency is 38.4 MHz. Any crystal frequency other than 38.4 is expressly not supported.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.2.1 DC-DC Operating Limits
The maximum supported voltage on the VREGVDD supply pin is limited under certain conditions. Maximum input voltage is a function
of temperature and the average load current over a 10-year lifetime. Figure 4.1 Lifetime average load current limit vs. Maximum input
voltage on page 10 shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the
reliability and performance of the DC-DC converter.
Average Lifetime ILOAD (mA)
The average load current for an application can typically be determined by examining the current profile during the time the device is
powered. For example, an application that is continuously powered which spends 99% of the time asleep consuming 2 µA and 1% of
the time active and consuming 10 mA has an average lifetime load current of about 102 µA.
60
Tj ≤ 105 °C
5
3.3
Maximum VVREGVDD (V)
3.8
Figure 4.1. Lifetime average load current limit vs. Maximum input voltage
Maximum ILOAD (mA)
The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting.
Figure 4.2 Transient maximum load current vs. Minimum input voltage on page 10 shows the max load current vs. input voltage for
different DC-DC peak inductor current settings.
60
36
IPEAK = 150 mA
IPEAK = 90 mA
5
1.8
2.2
Minimum VVREGVDD (V)
Figure 4.2. Transient maximum load current vs. Minimum input voltage
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.3 MCU Current Consumption with 3 V Supply
Unless otherwise indicated, typical conditions are: Module supply voltage = 3.0 V. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C.
Table 4.3. MCU Current Consumption with 3 V Supply
Parameter
Symbol
Current consumption in EM0 IACTIVE
mode with all peripherals disabled
Current consumption in EM1 IEM1
mode with all peripherals disabled
Current consumption in EM2 IEM2_VS
mode, VSCALE0
Current consumption in EM3 IEM3_VS
mode, VSCALE0
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Test Condition
Min
Typ
Max
Unit
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running while loop from flash,
VSCALE2
—
27
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running CoreMark loop from flash,
VSCALE2
—
37
—
µA/MHz
38.4 MHz crystal, CPU running
Prime from flash
—
28
—
µA/MHz
38.4 MHz crystal, CPU running
while loop from flash
—
26
—
µA/MHz
38.4 MHz crystal, CPU running
CoreMark loop from flash
—
38
—
µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
—
22
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running Prime from flash,
VSCALE2
—
28
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal,
VSCALE2
—
17
—
µA/MHz
38.4 MHz crystal
—
17
—
µA/MHz
38 MHz HFRCO
—
13
—
µA/MHz
Full RAM retention and RTC running from LFXO
—
1.40
—
µA
Full RAM retention and RTC running from LFRCO
—
1.40
—
µA
Full RAM retention and RTC running from LFRCO in precision
mode
—
1.75
—
µA
24 kB RAM retention and RTC
running from LFXO
—
1.32
—
µA
24 kB RAM retention and RTC
running from LFRCO in precision
mode
—
1.66
—
µA
8 kB RAM retention and RTC running from LFXO
—
1.21
—
µA
8 kB RAM retention and RTC running from LFRCO
—
1.20
—
µA
8 kB RAM retention and RTC running from ULFRCO
—
1.05
—
µA
Rev. 1.1 | 11
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
Parameter
Symbol
Current consumption in EM4 IEM4
mode
Additional current in EM2 or
EM3 when any peripheral in
PD0B is enabled1
Test Condition
No BURTC, No LF Oscillator,
DCDC bypassed
IPD0B_VS
Min
Typ
Max
Unit
—
0.17
—
µA
—
0.37
—
µA
Note:
1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the
peripherals in each power domain.
4.4 Radio Current Consumption with 3 V Supply
RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VREGVDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions
across process variation at TA = 25 °C.
Table 4.4. Radio Current Consumption with 3 V Supply
Parameter
Symbol
System current consumption IRX_ACTIVE
in receive mode, active packet reception
System current consumption IRX_LISTEN
in receive mode, listening for
packet
System current consumption ITX
in transmit mode
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Test Condition
Min
Typ
Max
Unit
125 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.2
—
mA
500 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.3
—
mA
1 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.2
—
mA
2 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.8
—
mA
125 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.3
—
mA
500 kbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.3
—
mA
1 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.2
—
mA
2 Mbit/s, 2GFSK, f = 2.4 GHz,
Bluetooth stack running
—
4.7
—
mA
f = 2.4 GHz, CW, 0 dBm output
power
—
4.6
—
mA
f = 2.4 GHz, CW, 6 dBm output
power
—
8.8
—
mA
Rev. 1.1 | 12
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.5 RF Transmitter General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.5. RF Transmitter General Characteristics for the 2.4 GHz Band
Parameter
Symbol
RF tuning frequency range
FRANGE
Maximum TX power1
POUTMAX
Minimum active TX Power
POUTMIN
Output power variation vs
VREGVDD supply voltage
variation, frequency = 2450
MHz
POUTVAR_V
Output power variation vs
temperature, Frequency =
2450 MHz
POUTVAR_T
Output power variation vs RF POUTVAR_F
frequency
Test Condition
Min
Typ
Max
Unit
2400
—
2483.5
MHz
6 dBm output power
—
6.0
—
dBm
0 dBm output power
—
-0.5
—
dBm
—
-27
—
dBm
6 dBm output power with
VREGVDD voltage swept from
1.8 V to 3.0 V
—
0.04
—
dB
0 dBm output power, with
VREGVDD voltage swept from
1.8 to 3.0 V
—
0.04
—
dB
6 dBm output power, (-40 to +105
°C)
—
0.2
—
dB
0 dBm output power, (-40 to +105
°C)
—
1.3
—
dB
6 dBm output power, (-40 to +85
°C)
—
0.1
—
dB
0 dBm output power, (-40 to +85
°C)
—
1.0
—
dB
6 dBm output power
—
0.09
—
dB
0 dBm output power
—
0.15
—
dB
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices covered in this data sheet can be found in the Max TX Power column of the Ordering Information Table.
4.6 RF Receiver General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.6. RF Receiver General Characteristics for the 2.4 GHz Band
Parameter
Symbol
RF tuning frequency range
FRANGE
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Test Condition
Min
Typ
Max
Unit
2400
—
2483.5
MHz
Rev. 1.1 | 13
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-98.6
—
dBm
Signal is reference signal, 255
byte payload1
—
-97.2
—
dBm
With non-ideal signals3 1
—
-96.6
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
8.7
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 5 4 6
—
-6.6
—
dB
Interferer is reference signal at -1
MHz offset1 5 4 6
—
-6.5
—
dB
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-40.9
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-39.9
—
dB
Interferer is reference signal at +3
MHz offset1 5 4 6
—
-45.9
—
dB
Interferer is reference signal at -3
MHz offset1 5 4 6
—
-46.2
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-23.5
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 6
—
-40.9
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 6
—
-6.6
—
dB
n = 3 (see note7)
—
-17.1
—
dBm
Intermodulation performance IM
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -67 dBm.
5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.
6. With allowed exceptions.
7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.8. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-95.9
—
dBm
Signal is reference signal, 255
byte payload1
—
-94.3
—
dBm
With non-ideal signals3 1
—
-94.0
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
8.8
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-9.2
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-6.6
—
dB
Interferer is reference signal at +4
MHz offset1 5 4 6
—
-43.3
—
dB
Interferer is reference signal at -4
MHz offset1 5 4 6
—
-44.0
—
dB
Interferer is reference signal at +6
MHz offset1 5 4 6
—
-48.6
—
dB
Interferer is reference signal at -6
MHz offset1 5 4 6
—
-50.7
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-23.8
—
dB
Selectivity to image frequency ± 2 MHz
C/IIM_1
Interferer is reference signal at image frequency +2 MHz with 1
MHz precision1 6
—
-43.3
—
dB
Interferer is reference signal at image frequency -2 MHz with 1 MHz
precision1 6
—
-9.2
—
dB
n = 3 (see note7)
—
-18.8
—
dBm
Intermodulation performance IM
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -64 dBm.
5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.
6. With allowed exceptions.
7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-102.3
—
dBm
Signal is reference signal, 255
byte payload1
—
-100.9
—
dBm
With non-ideal signals3 1
—
-99.8
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
2.7
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 5 4 6
—
-8.0
—
dB
Interferer is reference signal at -1
MHz offset1 5 4 6
—
-7.9
—
dB
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-46.5
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-49.9
—
dB
Interferer is reference signal at +3
MHz offset1 5 4 6
—
-48.9
—
dB
Interferer is reference signal at -3
MHz offset1 5 4 6
—
-53.8
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-48.3
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 6
—
-49.9
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 6
—
-46.5
—
dB
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -72 dBm.
5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.
6. With allowed exceptions.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-106.4
—
dBm
Signal is reference signal, 255
byte payload1
—
-106.0
—
dBm
With non-ideal signals3 1
—
-105.6
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
0.9
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 5 4 6
—
-13.6
—
dB
Interferer is reference signal at -1
MHz offset1 5 4 6
—
-13.4
—
dB
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-52.6
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-55.8
—
dB
Interferer is reference signal at +3
MHz offset1 5 4 6
—
-53.7
—
dB
Interferer is reference signal at -3
MHz offset1 5 4 6
—
-59.0
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-52.7
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 6
—
-53.7
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 6
—
-52.6
—
dB
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -79 dBm.
5. Measured frequency is 2401 MHz ≤ Fc ≤ 2481 MHz.
6. With allowed exceptions.
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Rev. 1.1 | 17
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.11 High-Frequency Crystal
Table 4.11. High-Frequency Crystal
Parameter
Symbol
Crystal frequency
Test Condition
Min
Typ
Max
Unit
fHFXTAL
—
38.4
—
MHz
Initial calibrated accuracy
ACCHFXTAL
-10
—
10
ppm
Temperature drift
DRIFTHFXTAL
-20
—
20
ppm
Min
Typ
Max
Unit
—
32.768
—
kHz
GAIN = 0
—
—
80
kΩ
GAIN = 1 to 3
—
—
100
kΩ
GAIN = 0
4
—
6
pF
GAIN = 1
6
—
10
pF
GAIN = 2 (see note2)
10
—
12.5
pF
GAIN = 3 (see note2)
12.5
—
18
pF
Across specified temperature
range
4.12 Low Frequency Crystal Oscillator
Table 4.12. Low Frequency Crystal Oscillator
Parameter
Symbol
Crystal Frequency
FLFXO
Supported Crystal equivalent ESRLFXO
series resistance (ESR)
Supported range of crystal
load capacitance 1
CLFXO_CL
Test Condition
Current consumption
ICL12p5
ESR = 70 kOhm, CL = 12.5 pF,
GAIN3 = 2, AGC4 = 1
—
357
—
nA
Startup Time
TSTARTUP
ESR = 70 kOhm, CL = 7 pF,
GAIN3 = 1, AGC4 = 1
—
63
—
ms
On-chip tuning cap step size
SSLFXO
—
0.26
—
pF
On-chip tuning capacitor val- CLFXO_MIN
ue at minimum setting5
CAPTUNE = 0
—
4
—
pF
On-chip tuning capacitor val- CLFXO_MAX
ue at maximum setting5
CAPTUNE = 0x4F
—
24.5
—
pF
Note:
1. Total load capacitance seen by the crystal
2. Crystals with a load capacitance of greater than 12 pF require external load capacitors.
3. In LFXO_CAL Register
4. In LFXO_CFG Register
5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two
caps will be seen in series by the crystal
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Rev. 1.1 | 18
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.13 Precision Low Frequency RC Oscillator (LFRCO)
Table 4.13. Precision Low Frequency RC Oscillator (LFRCO)
Parameter
Symbol
Nominal oscillation frequency
FLFRCO
Frequency accuracy
FLFRCO_ACC
Test Condition
Min
Typ
Max
Unit
—
32.768
—
kHz
-3
—
3
%
-500
—
500
ppm
Normal mode
—
204
—
µs
Precision mode1
—
11.7
—
ms
Normal mode
—
175
—
nA
Precision mode1, T = stable at 25
°C 3
—
655
—
nA
Normal mode
Precision mode1, across operating temperature range2
Startup time
Current consumption
tSTARTUP
ILFRCO
Note:
1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4.
2. Includes ± 40 ppm frequency tolerance of the HFXO crystal.
3. Includes periodic re-calibration against HFXO crystal oscillator.
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Rev. 1.1 | 19
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.14 GPIO Pins
Unless otherwise indicated, typical conditions are: IOVDD = 3.0 V.
Table 4.14. GPIO Pins
Parameter
Symbol
Test Condition
Leakage current
ILEAK_IO
Input low voltage1
Input high voltage1
Hysteresis of input voltage
Output high voltage
Output low voltage
GPIO rise time
GPIO fall time
Pull up/down resistance2
VIL
VIH
VHYS
VOH
VOL
TGPIO_RISE
TGPIO_FALL
RPULL
Maximum filtered glitch width TGF
RESETn low time to ensure
pin reset
TRESET
Min
Typ
Max
Unit
MODEx = DISABLED, IOVDD =
1.71 V
—
1.9
—
nA
MODEx = DISABLED, IOVDD =
3.0 V
—
2.5
—
nA
Any GPIO pin
—
—
0.3*IOVDD
V
RESETn
—
—
0.3*DVDD
V
Any GPIO pin
0.7*IOVDD
—
—
V
RESETn
0.7*DVDD
—
—
V
Any GPIO pin
0.05*IOVD
D
—
—
V
RESETn
0.05*DVDD
—
—
V
Sourcing 20mA, IOVDD = 3.0 V
0.8 *
IOVDD
—
—
V
Sourcing 8mA, IOVDD = 1.71 V
0.6 *
IOVDD
—
—
V
Sinking 20mA, IOVDD = 3.0 V
—
—
0.2 *
IOVDD
V
Sinking 8mA, IOVDD = 1.71 V
—
—
0.4 *
IOVDD
V
IOVDD = 3.0 V, Cload = 50pF,
SLEWRATE = 4, 10% to 90%
—
8.4
—
ns
IOVDD = 1.71 V, Cload = 50pF,
SLEWRATE = 4, 10% to 90%
—
13
—
ns
IOVDD = 3.0 V, Cload = 50pF,
SLEWRATE = 4, 90% to 10%
—
7.1
—
ns
IOVDD = 1.71 V, Cload = 50pF,
SLEWRATE = 4, 90% to 10%
—
11.9
—
ns
Any GPIO pin. Pull-up to IOVDD:
MODEn = DISABLE DOUT=1.
Pull-down to VSS: MODEn =
WIREDORPULLDOWN DOUT =
0.
35
44
55
kΩ
RESETn pin. Pull-up to DVDD
35
44
55
kΩ
MODE = INPUT, DOUT = 1
—
27
—
ns
100
—
—
ns
Note:
1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to DVDD.
2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to DVDD.
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Rev. 1.1 | 20
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.15 Microcontroller Peripherals
The MCU peripherals set available in BGM220S modules includes:
• ADC: 12-bit at 1 Msps, 16-bit at 76.9 ksps
• 16-bit and 32-bit Timers/Counters
• 24-bit Low Energy Timer for waveform generation
• 32-bit Real Time Counter
• USART (UART/SPI/SmartCards/IrDA/I2S)
• EUART (UART/IrDA)
• I2C peripheral interfaces
• PDM interface
• 12 Channel Peripheral Reflex System
For details on their electrical performance, consult the relevant portions of Section 4 in the SoC datasheet.
To learn which GPIO ports provide access to every peripheral, consult Analog Peripheral Connectivity and Digital Peripheral Connectivity.
4.16 Typical Performance Curves
Typical performance curves indicate typical characterized performance under the stated conditions.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
4.16.1 Antenna Typical Characteristics
Typical BGM220S radiation patterns for the on-board chip antenna under optimal operating conditions are plotted in the figures that
follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is
mounted on, as well as on the proximity of any mechanical design to the antenna.
Top Left: Phi 0o, Top Right: Phi 90o, Bottom Left: Theta 90o
Figure 4.3. BGM220S12A Typical 2D Antenna Radiation Patterns on 50 mm x 30 mm board
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Rev. 1.1 | 22
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Electrical Characteristics
Top Left: Phi 0o, Top Right: Phi 90o, Bottom Left: Theta 90o
Figure 4.4. BGM220S22A Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board
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Rev. 1.1 | 23
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Reference Diagrams
5. Reference Diagrams
5.1 Network Co-Processor (NCP) Application with UART Host
The BGM220S can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, programming/debug interface, and host interface connections are shown in the figure below. For more details, refer to AN958: Debugging
and Programming Interfaces for Custom Designs.
Antenna Loop
RESETn
0.1 µF
(optional)
PTI_FRAME
NC
PC03
PC05
PC04
PC06
NC
GND
NC
NC
RESETn
0 Ohm
ANT_OUT
PTI_DATA
(recommended)
PC02
ANT_IN
PC01
BGM220S
RF_2G4
PB04
PD02
PB03
PD03
PB02
IOVDD
PB01
VREGVDD
32.768 kHz
(optional)
VDD
VDD
PA08
PA07
PA06
PA05
PA04
VREG
PA03
PA02
PB00
SWO (PA03)
SWCLK (PA01)
PTI_DATA (PC04)
PA01
RTS
Mini Simplicity Debug Connector
SWO
SWDIO
SWCLK
CTS
TX
GPIO
RESETn
Host CPU
RX
GND
SWDIO (PA02)
PTI_FRAME (PC05)
2
4
6
8
10
PD01
PA00
RESETn
1
3
5
7
9
PD00
GND
DECOUPLE
VDD
PC00
GND
Figure 5.1. UART NCP Configuration
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Rev. 1.1 | 24
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Reference Diagrams
5.2 SoC Application
The BGM220S can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and programming/debug interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Interfaces for Custom Designs.
Antenna Loop
RESETn
0.1 µF
(optional)
PTI_FRAME
NC
PC03
PC04
PC05
PC06
GND
NC
NC
NC
RESETn
0 Ohm
ANT_OUT
PTI_DATA
(recommended)
PC02
ANT_IN
PC01
BGM220S
RF_2G4
PC00
GND
PD00
GND
PD01
PB04
PD02
PD03
PB02
IOVDD
PB01
VREGVDD
VDD
PA08
PA07
PA06
PA05
PA04
VREG
PA03
PA02
PA01
PA00
PB00
DECOUPLE
PB03
32.768 kHz
(optional)
RESETn
SWO
SWDIO
SWCLK
SWDIO (PA02)
PTI_FRAME (PC05)
1
3
5
7
9
2
4
6
8
10
SWO (PA03)
SWCLK (PA01)
PTI_DATA (PC04)
Mini Simplicity Debug Connector
Figure 5.2. Stand-Alone SoC Configuration
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Pin Definitions
6. Pin Definitions
6.1 44-Pin SiP Module Device Pinout
Figure 6.1. 44-Pin SiP Module Device Pinout
The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.2 Alternate Function Table, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral
Connectivity.
Table 6.1. 44-Pin SiP Module Device Pinout
Pin Name
Pin(s)
Description
NC
1
Do not connect
RF_2G4
3
GND
Pin Name
Pin(s)
Description
ANT_IN
2
Antenna In
2.4 GHz RF input/output
GND
4
Ground
5
Ground
PB04
6
GPIO
PB03
7
GPIO
PB02
8
GPIO
PB01
9
GPIO
PB00
10
GPIO
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Pin Definitions
Pin Name
Pin(s)
Description
Pin Name
Pin(s)
Description
PA00
11
GPIO
PA01
12
GPIO
PA02
13
GPIO
DECOUPLE
14
Decouple output for on-chip voltage
regulator. This pin is internally decoupled, and should be left disconnected.
PA03
15
GPIO
PA04
16
GPIO
PA05
17
GPIO
PA06
18
GPIO
PA07
19
GPIO
PA08
20
GPIO
VREG
21
Regulated supply voltage. This pin is internally connected to the SoC DVDD,
RFVDD, and PAVDD supply lines. It is
not intended to power external circuitry.
VREGVDD
22
Module input power supply. This pin is
internally connected to the SoC AVDD
and VREGVDD supply lines.
IOVDD
23
I/O power supply
PD03
24
GPIO
PD02
25
GPIO
PD01
26
GPIO
PD00
27
GPIO
PC00
28
GPIO
PC01
29
GPIO
PC02
30
GPIO
PC03
31
GPIO
PC04
32
GPIO
PC05
33
GPIO
PC06
34
GPIO
RESETn
35
Reset Pin. The RESETn pin is internally
pulled up to VREG (DVDD).
GND
36
Ground
NC
37
Do not connect
NC
38
Do not connect
NC
39
Do not connect
ANT_OUT
40
Antenna Out
GND
41
Ground
GND
42
Ground
GND
43
Ground
GND
44
Ground
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Rev. 1.1 | 27
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Pin Definitions
6.2 Alternate Function Table
A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows what functions are
available on each device pin.
Table 6.2. GPIO Alternate Function Table
GPIO
Alternate Functions
PB03
GPIO.EM4WU4
PB01
GPIO.EM4WU3
PB00
IADC0.VREFN
PA00
IADC0.VREFP
PA01
GPIO.SWCLK
PA02
GPIO.SWDIO
GPIO.SWV
PA03
GPIO.TDO
GPIO.TRACEDATA0
PA04
GPIO.TDI
GPIO.TRACECLK
PA05
GPIO.EM4WU0
PD02
GPIO.EM4WU9
LFXO.LFXTAL_I
PD01
LFXO.LF_EXTCLK
PD00
PC00
PC05
LFXO.LFXTAL_O
GPIO.EM4WU6
GPIO.THMSW_EN
GPIO.EM4WU7
6.3 Analog Peripheral Connectivity
Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative
inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the
device Reference Manual for more details on the ABUS and analog peripherals.
Table 6.3. ABUS Routing Table
Peripheral
IADC0
Signal
PA
PB
PC
PD
EVEN
ODD
EVEN
ODD
EVEN
ODD
EVEN
ODD
ANA_NEG
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
ANA_POS
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
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Rev. 1.1 | 28
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Pin Definitions
6.4 Digital Peripheral Connectivity
Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port.
Table 6.4. DBUS Routing Table
Peripheral.Resource
PORT
PA
PB
PC
PD
CMU.CLKIN0
Available
Available
CMU.CLKOUT0
Available
Available
CMU.CLKOUT1
Available
Available
CMU.CLKOUT2
Available
Available
EUART0.CTS
Available
Available
Available
Available
EUART0.RTS
Available
Available
Available
Available
EUART0.RX
Available
Available
Available
Available
EUART0.TX
Available
Available
Available
Available
FRC.DCLK
Available
Available
FRC.DFRAME
Available
Available
FRC.DOUT
Available
Available
I2C0.SCL
Available
Available
Available
Available
I2C0.SDA
Available
Available
Available
Available
I2C1.SCL
Available
Available
I2C1.SDA
Available
Available
LETIMER0.OUT0
Available
Available
LETIMER0.OUT1
Available
Available
MODEM.ANT0
Available
Available
Available
Available
MODEM.ANT1
Available
Available
Available
Available
MODEM.ANT_ROLL_OVER
Available
Available
MODEM.ANT_RR0
Available
Available
MODEM.ANT_RR1
Available
Available
MODEM.ANT_RR2
Available
Available
MODEM.ANT_RR3
Available
Available
MODEM.ANT_RR4
Available
Available
MODEM.ANT_RR5
Available
Available
MODEM.ANT_SW_EN
Available
Available
MODEM.ANT_SW_US
Available
Available
MODEM.ANT_TRIG
Available
Available
MODEM.ANT_TRIG_STOP
Available
Available
MODEM.DCLK
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Available
Available
Rev. 1.1 | 29
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Pin Definitions
Peripheral.Resource
PORT
PA
PB
PC
PD
MODEM.DIN
Available
Available
MODEM.DOUT
Available
Available
PDM.CLK
Available
Available
Available
Available
PDM.DAT0
Available
Available
Available
Available
PDM.DAT1
Available
Available
Available
Available
PRS.ASYNCH0
Available
Available
PRS.ASYNCH1
Available
Available
PRS.ASYNCH10
Available
Available
PRS.ASYNCH11
Available
Available
PRS.ASYNCH6
Available
Available
PRS.ASYNCH7
Available
Available
PRS.ASYNCH8
Available
Available
PRS.ASYNCH9
Available
Available
PRS.ASYNCH2
Available
Available
PRS.ASYNCH3
Available
Available
PRS.ASYNCH4
Available
Available
PRS.ASYNCH5
Available
Available
PRS.SYNCH0
Available
Available
Available
Available
PRS.SYNCH1
Available
Available
Available
Available
PRS.SYNCH2
Available
Available
Available
Available
PRS.SYNCH3
Available
Available
Available
Available
TIMER0.CC0
Available
Available
Available
Available
TIMER0.CC1
Available
Available
Available
Available
TIMER0.CC2
Available
Available
Available
Available
TIMER0.CDTI0
Available
Available
Available
Available
TIMER0.CDTI1
Available
Available
Available
Available
TIMER0.CDTI2
Available
Available
Available
Available
TIMER1.CC0
Available
Available
Available
Available
TIMER1.CC1
Available
Available
Available
Available
TIMER1.CC2
Available
Available
Available
Available
TIMER1.CDTI0
Available
Available
Available
Available
TIMER1.CDTI1
Available
Available
Available
Available
TIMER1.CDTI2
Available
Available
Available
Available
TIMER2.CC0
Available
Available
TIMER2.CC1
Available
Available
TIMER2.CC2
Available
Available
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Rev. 1.1 | 30
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Pin Definitions
Peripheral.Resource
PORT
PA
PB
PC
PD
TIMER2.CDTI0
Available
Available
TIMER2.CDTI1
Available
Available
TIMER2.CDTI2
Available
Available
TIMER3.CC0
Available
Available
TIMER3.CC1
Available
Available
TIMER3.CC2
Available
Available
TIMER3.CDTI0
Available
Available
TIMER3.CDTI1
Available
Available
TIMER3.CDTI2
Available
Available
TIMER4.CC0
Available
Available
TIMER4.CC1
Available
Available
TIMER4.CC2
Available
Available
TIMER4.CDTI0
Available
Available
TIMER4.CDTI1
Available
Available
TIMER4.CDTI2
Available
Available
USART0.CLK
Available
Available
Available
Available
USART0.CS
Available
Available
Available
Available
USART0.CTS
Available
Available
Available
Available
USART0.RTS
Available
Available
Available
Available
USART0.RX
Available
Available
Available
Available
USART0.TX
Available
Available
Available
Available
USART1.CLK
Available
Available
USART1.CS
Available
Available
USART1.CTS
Available
Available
USART1.RTS
Available
Available
USART1.RX
Available
Available
USART1.TX
Available
Available
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Rev. 1.1 | 31
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Design Guidelines
7. Design Guidelines
7.1 Layout and Placement
For optimal performance of the BGM220S the following guidelines are recommended:
• Place the module 1.50 mm from the edge of the copper “keep-in” area at the middle of the long edge of the application PCB, as
illustrated in Figure 7.1 Recommended Layout for BGM220S on page 32.
• Copy the exact antenna design from Figure 7.2 Antenna Layout With Coordinates on page 33 with the values for coordinates A to
L given in Table 7.1 Antenna Polygon Coordinates, Referenced to Center of BGM220S on page 33.
• Make a cutout in all lower layers aligned with the right edge and the bottom edge of the antenna as indicated by the yellow box in
Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 34.
• Connect all ground pads directly to a solid ground plane in the top layer.
• Connect RF_2G4 to ANT_IN through a 0-ohm resistor.
• The 0-ohm gives the ability to test conducted and to evaluate the antenna impedance in the design.
• Place ground vias as close to the ground pads of the BGM220S as possible.
• Place ground vias along the antenna loop right and bottom side.
• Place ground vias along the edges of the application board.
• Do not place plastic or any other dielectric material in contact with the antenna.
• A minimum clearance of 0.5 mm is advised.
• Solder mask, conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region.
Figure 7.1. Recommended Layout for BGM220S
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Design Guidelines
Figure 7.2. Antenna Layout With Coordinates
Table 7.1. Antenna Polygon Coordinates, Referenced to Center of BGM220S
Point
BGM220SC12WGA2
BGM220SC22WGA2
BGM220SC22HNA2
A
(2.87, 2.13)
(2.87, 2.13)
B
(2.54, 2.13)
(2.54, 2.13)
C
(2.54, 3.69)
(2.54, 3.69)
D
(3.36, 4.51)
(3.36, 4.51)
E
(8.85, 4.51)
(7.75, 4.51)
F
(8.85, 4.15)
(7.75, 4.15)
G
(6.84, 4.15)
(6.84, 4.15)
H
(6.21, 3.52)
(6.21, 3.52)
I
(4.26, 3.52)
(4.26, 3.52)
J
(3.97, 3.81)
(3.97, 3.81)
K
(3.10, 3.81)
(3.10, 3.81)
L
(2.87, 3.58)
(2.87, 3.58)
Wloop
5.98
4.88
Hloop
4.15
4.15
Note:
1. All coordinates and dimensions listed in mm.
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Rev. 1.1 | 33
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Design Guidelines
Figure 7.3. Antenna Clearance in Inner and Bottom Layers
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Rev. 1.1 | 34
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Design Guidelines
7.2 Best Design Practices
The design of a good RF system relies on thoughtful placement and routing of the RF signals. The following guidelines are recommended:
•
•
•
•
Place the BGM220S and antenna close to the center of the longest edge of the application board.
Do not place any circuitry between the board edge and the antenna.
Make sure to tie all GND planes in the application board together with as many vias as can be fitted.
Generally ground planes are recommended in all areas of the application board except in the antenna keep-out area shown in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 34.
• Open-ended stubs of copper in the outer layer ground planes must be removed if they are more than 5 mm long to avoid radiation of
spurious emissions.
• The width of the GND plane to the sides of the BGM220S will impact the efficiency of the on-board chip antenna.
• To achieve optimal performance, a GND plane width of 50 mm for BGM220S12A or 55 mm for BGM220S22A is recommended
as seen on Figure 7.4 Illustration of Recommended Board Width on page 35.
• See 4.16.1 Antenna Typical Characteristics for reference.
Figure 7.5 Non-Optimal Layout Examples on page 36 illustrates layout scenarios that will lead to severely degraded RF performance
for the application board.
Figure 7.4. Illustration of Recommended Board Width
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Design Guidelines
Figure 7.5. Non-Optimal Layout Examples
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Rev. 1.1 | 36
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Design Guidelines
7.3 Radio Performance vs. Carrier Board Size
For many applications, the carrier board size is determined by the overall form factor or size of the additional circuitry. The recommended carrier board width of 50 mm for the BGM220S12A and 55 mm for the BGM220S22A is thus not always possible in the end-application. If another form factor is required, the antenna performance of the integrated antenna will be compromised but it may still be
sufficiently good for providing the required link quality and range of the end-application. Figure 7.6 Efficiency of the Integrated Antenna
as Function of the Carrier Board Size for BGM220S12A on page 37 and Figure 7.7 Efficiency of the Integrated Antenna as Function
of the Carrier Board Size for BGM220S22A on page 38 show the total efficiency of the integrated antenna for different carrier board
sizes. As can be seen the best performance is achieved for the carrier board size of 50 mm x 30 mm for the BGM220S12A and 55 mm
x 25 mm for the BGM220S22A, with relatively constant performance for larger boards and rapidly declining performance for smaller
boards.
The performance of all the sizes tested will be adequate for more than 15 m line-of-sight range and all of the sizes are thus usable.
WARNING: Any antenna tuning or change of the loop dimensions will void the modular certification of modules with modular
certification. In that case, a Permissive Change to the modular approval is required.
Figure 7.6. Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S12A
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Rev. 1.1 | 37
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Design Guidelines
Figure 7.7. Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGM220S22A
7.4 Proximity to Other Materials
Placing plastic or any other dielectric material directly in contact with the antenna may cause performance degradation. A clearance of
minimum 0.5 mm is recommended to avoid excessive detuning of the antenna. Solder mask, conformal coating, and other thin dielectric layers are acceptable directly on top of the antenna region. Any metallic objects in close proximity to the antenna will prevent the
antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction
from the antenna except in the directions of the application PCB ground planes.
7.5 Proximity to Human Body
Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. Furthermore, additional certification may be required if the module is used in a wearable device.
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Rev. 1.1 | 38
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Package Specifications
8. Package Specifications
8.1 Package Dimensions
The package dimensions are shown in Figure 8.1 Package Dimensions - Full on page 39 and Figure 8.2 Package Dimensions - Detail
on page 39.
Figure 8.1. Package Dimensions - Full
Figure 8.2. Package Dimensions - Detail
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Package Specifications
Table 8.1. Package Dimensions
Dimension
MIN
NOM
MAX
A
1.080
1.180
1.280
A1
0.140
0.180
0.220
A2
0.950
1.000
1.050
b
0.200
0.250
0.300
D
6.000 BSC
D1
4.500 BSC
e
0.500 BSC
E
6.000 BSC
E1
4.500 BSC
L
0.300
0.350
0.400
L1
0.125
0.175
0.225
L2
0.575
0.625
0.675
L3
0.450
0.500
0.550
eD1
0.450 BSC
eD2
0.900 BSC
eE1
0.450 BSC
eE2
0.900 BSC
aaa
0.100
bbb
0.100
ccc
0.100
ddd
0.100
eee
0.100
Note:
1. The dimensions in parenthesis are reference.
2. All dimensions in millimeters (mm).
3. Unless otherwise specified, tolerances are:
a. Decimal: X.X = +/- 0.1
X.XX = +/- 0.05
X.XXX = +/- 0.03
b. Angular: +/- 0.1 (In Deg)
4. Hatching lines means package shielding area.
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Rev. 1.1 | 40
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Package Specifications
8.2 Recommended PCB Land Pattern
The recommended PCB Land Pattern is shown in Figure 8.3 Module Land Pattern on page 41
Figure 8.3. Module Land Pattern
Table 8.2. PCB Land Pattern Dimensions
Dimension
Typ (mm)
D1
4.50
D2
2.65
E1
4.50
E2
2.25
eD1
0.45
eD2
0.90
b
0.25
e
0.50
L
0.35
L1
0.50
Note:
1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
4. The stencil thickness should be 0.100 mm (4 mils).
5. The stencil aperture to land pad size recommendation is 80% paste coverage.
6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use
different parameters and fine tune their SMT process as required for their application and tooling.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Package Specifications
8.3 Top Marking
Figure 8.4. BGM220S Top Marking
Table 8.3. Top Marking Definition
OPN
Line 1 Marking
Line 2 Marking
Line 3 Marking
BGM220SC12WGA2
BGM220S12A
SC12WGA2
See note below
BGM220SC22HNA2
BGM220S22A
SC22HNA2
See note below
BGM220SC22WGA2
BGM220S22A
SC22WGA2
See note below
Note: YY = Year. WW = Work Week, TTTTTTT = Trace Code
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Soldering Recommendations
9. Soldering Recommendations
It is recommended that final PCB assembly of the BGM220S follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface
mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements.
CLASS 1 General Electronic Products
Includes products suitable for applications where the major requirement is function of the completed assembly.
CLASS 2 Dedicated Service Electronic Products
Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not
critical. Typically the end-use environment would not cause failures.
CLASS 3 High Performance/Harsh Environment Electronic Products
Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated,
end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical
systems.
Note: General SMT application notes are provided in the AN1223 document.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Tape and Reel
10. Tape and Reel
BGM220S modules are delivered to the customer in tray (490 pcs / tray) or reel (2500 pcs / reel) packaging with the dimensions below.
All dimensions are given in mm unless otherwise indicated.
Figure 10.1. Carrier Tape Dimensions
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Tape and Reel
Figure 10.2. Reel Dimensions
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Certifications
11. Certifications
This section details the regulatory certification status of BGM220S modules in various regions. BGM220S modules are also referred to
by their model name BGM220S12A/BGM220S22A.
The address for the module manufacturer and certification applicant is:
SILICON LABORATORIES FINLAND OY
Alberga Business Park, Bertel Jungin aukio 3,
02600 Espoo, Finland
11.1 Regulatory Certifications
11.1.1 Qualified Antennas
BGM220S modules have been tested and certified both with the on-board antennas and with external antennas attached to the RF pin
(RF_2G4). Performance characteristics for the integral antennas are presented in Table 3.1 Antenna Efficiency and Peak Gain
(BGM220S12A) on page 7, Table 3.2 Antenna Efficiency and Peak Gain (BGM220S22A) on page 7 and 4.16.1 Antenna Typical Characteristics. Details for the external qualified reference antennas are summarized in the table below.
Table 11.1. Qualified External Antennas for BGM220S
Model
Antenna Type
Maximum Gain
Impedance
BGM220S12A
Connectorized Coaxial Dipole
3.2 dBi
50 Ω
BGM220S22A
Connectorized Coaxial Dipole
2.8 dBi
50 Ω
Any external antenna of the same general type and of equal or less directional gain as listed in the above table, and having similar inband and out-of-band characteristics, can be used in the regulatory areas that have modular radio approvals, such as USA and Canada, as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced.
In the particular FCC case, in order to comply with e-CFR Title 47, Part 15, Subpart C, Section 15.203 the module integrator using an
external antenna must ensure it has a unique connector or it is undetachable. In countries applying the ETSI standards, like the EU
countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher
gain may violate some of the regulatory limits.
When using instead an external antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) or having nonsimilar in-band and out-of-band characteristics, but still with a gain less than or equal to the maximum gain listed in the table above, it
can be added as a permissive change to the existing grant/certificate. In most of these cases, some radiated emission testing is demanded, but no modular or end-product re-certification is required.
On the other hand, all products with antennas having more gain than the maximum gain listed in the table above are very likely to require a full new end-product certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house and/or a certification body for understanding the correct approach based on your unique design. You might also
want or need to get in touch with Silicon Labs for any authorization letter that your certification body might ask for.
11.1.2 EU and UK - CE and UKCA
The BGM220S modules have been tested against the relevant harmonized/designated standards and are in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU) and of the Radio Equipment
Regulations (RER) (S.I. 2017/1206).
Please notice that every end-product integrating a BGM220S module will need to perform the radio EMC tests on the whole assembly,
according to the ETSI 301 489-x relevant standards.
Furthermore, it is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product as a whole. The specific
product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufacturers
should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the external
antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI 300 328
standard.
The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product
web page which is reachable starting from https://www.silabs.com/.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Certifications
11.1.3 USA - FCC
This device complies with FCC’s e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI
C63.10.2013 standard) when operating with the embedded antenna or with the antenna type(s) listed in 11.1.1 Qualified Antennas. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance.
This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s)
exposed in the RF Exposure Analysis.
This transmitter also meets the Portable requirements at distances equal or above those listed for convenience in Table 11.2 Minimum
Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 52 and Table 11.3 Minimum Separation Distances for
SAR Evaluation Exemption (BGM220S22A) on page 52.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC
multi-transmitter product procedures.
OEM Responsibilities to comply with FCC Regulations
This module has been tested for compliance to FCC Part 15.
OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot
checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01.
• General Considerations
This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement, which is applicable to the final host. The final host will need to be assessed for compliance to this portion of
rule requirements, if applicable.
• Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module, or
how to change RF related parameters, in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warnings as shown in this manual.
• OEM / Host Manufacturer Responsibilities
OEM/Host manufacturers are ultimately responsible for the compliance of the host system.
The BGM220S12A has a limited single-modular transmitter approval due to the radio portion of the module not being contained in its
own RF shielding. Consequently, each new host will require a reassessment of radiated spurious emissions and a Class I Permissive Change to the grant. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC
Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with
the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other radio device or
system without retesting for compliance as multi-radio and combined equipment.
The BGM220S22A is a shielded design, and comes with full modular approval.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Certifications
Separation
• To meet the SAR exemption for portable conditions, the minimum separation distance indicated in
Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 52 and Table 11.3 Minimum
Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page 52 must be maintained between the human body
and the radiator (antenna) at all times.
• This transmitter module is tested in a standalone mobile RF exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the
exceptions rules to be applied, a separate additional SAR evaluation will be required, ultimately leading to a Class II Permissive
Change, or more rarely to a new grant.
• Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The evaluation (SAR) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with
the help of the customer's own Telecommunication Certification Body as the grant holder’s agent.
End Product Labeling
BGM220S modules are not labeled with their own FCC ID due to their size. Instead, the packaging label contains the FCC ID. In all
cases when the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a
visible area with the following:
For BGM220S12A
"Contains Transmitter Module FCC ID: QOQ-BGM220S"
Or
"Contains FCC ID: QOQ-BGM220S"
For BGM220S22A
"Contains Transmitter Module FCC ID: QOQ-BGM220S2"
Or
"Contains FCC ID: QOQ-BGM220S2"
Final note: As long as all the conditions in this and all the above sections are met, further RF testing of the transmitter with full modular
approval is not required. However, OEMs are still supposed to follow the good practice and the FCC recommendation to ensure the
compliance of the host by spot checking.
Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements which
might be mandatory with this module installed.
Class B Device Notice - BGM220S22A Only
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC
Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio / TV technician for help.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Certifications
11.1.4 ISED Canada
ISED
This radio transmitter (IC: 5123A-BGM220S for the BGM220S12A and IC: 5123A-BGM220S2 for the BGM220S22A) has been approved by Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada) to operate with the embedded antenna and with the antenna type(s) listed in 11.1.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device.
This device complies with ISED’s license-exempt RSS standards. Operation is subject to the following two conditions:
1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired operation of the device
RF Exposure Statement
Exception from routine SAR evaluation limits are given in RSS-102 Issue 5.
For the Portable use case, RF exposure or SAR evaluation is not required in all cases, at any distance from the human body, except
when the BGM220S22A is used at full power with the external reference dipole antenna, in which case the separation distance from the
human body must be of 13 mm or more for the exemption.
For more details, refer to the values stated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption
(BGM220S12A) on page 52 and Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on page
52: if the separation distances from the human body are less than the distances mentioned in the tables, then the OEM integrator is
responsible for evaluating the SAR.
The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or
greater, in accordance to the limit(s) exposed in the RF Exposure Analysis.
OEM Responsibilities to comply with IC Regulations
The module has been certified for integration into products only by OEM integrators under the following conditions:
• The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate
the RF exposure in order for the ISED authorization to remain valid, and a permissive change will have to be applied with the help of
the customer's own Telecommunication Certification Body typically acting as the certificate holder’s agent.
In the case of the BGM220S12A, this variant has a limited approval due to the radio portion of the module not being contained in its
own RF shielding: consequently, each new host will require a reassessment of the radiated spurious emissions, and the ISED will have
to be notified with a Class IV Permissive Change.
In the case of the BGM220S22A, this variant is a shielded design, and consequently comes with a full modular approval.
End Product Labeling
The BGM220S modules are not labeled with their own IC ID due to their size. Instead, the packaging label contains the IC ID. In all
cases when the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a
visible area with the following:
For BGM220S12A
“Contains Transmitter Module IC: 5123A-BGM220S ”
or
“Contains IC: 5123A-BGM220S”
For BGM220S22A
“Contains Transmitter Module IC: 5123A-BGM220S2 ”
or
“Contains IC: 5123A-BGM220S2”
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Certifications
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or
change RF related parameters in the user manual of the end product.
Final note: As long as all the conditions above are met, further RF testing of the transmitter with full modular approval is not required.
However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with
this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
CAN ICES-003 (B) - BGM220S22A Only
This Class B digital apparatus complies with Canadian ICES-003.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Certifications
ISEDC (Français)
Le présent émetteur radio (IC: 5123A-BGM220S pour le BGM220S12A and IC: 5123A-BGM220S2 pour le BGM220S22A) a été approuvé par Innovation, Sciences et Développement Économique Canada (ISED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la section 11.1.1 Qualified Antennas, avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits
d'utilisation avec cet appareil. .
Ce composant est conforme aux normes RSS, exonérées de licence d'ISED. Son mode de fonctionnement est soumis aux deux conditions suivantes:
1. Ce composant ne doit pas générer d’interférences.
2. Ce composant doit pouvoir être soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement.
Déclaration d'exposition RF
L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5.
Pour le cas d'utilisation Portable, l'exposition RF ou l'évaluation SAR n'est pas nécessaire dans tous les cas, à n'importe quelle distance du corps humain, sauf lorsque le BGM220S22A est utilisé à pleine puissance avec l'antenne dipôle de référence externe, auquel
cas la distance de séparation du le corps humain doit être de 13 mm ou plus pour l'exemption.
Pour plus de détails, reportez-vous aux valeurs indiquées dans Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A) on page 52 et Table 11.3 Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A) on
page 52: si les distances de séparation du corps humain sont inférieures aux distances mentionnées dans les tableaux, alors l'intégrateur OEM est responsable de l'évaluation du SAR.
Le module répond aux exigences des cas d'utilisation mobile lorsque la distance de séparation minimale du corps humain est de 20 cm
ou plus, conformément aux limites exposées dans l'analyse d'exposition RF.
Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré
Le module a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions suivantes:
• L'antenne doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur
(antenne) et toutes les personnes avoisinante, ce à tout moment.
• Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée
plus haut.
Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Cependant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pourrait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de périphériques PC, etc.).
Remarque Importante:Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation
avec un autre émetteur), l'autorisation ISED n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être
apposé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le
transmetteur) et de l'obtention d'une autorisation ISED distincte.
Dans le cas du BGM220S12A, l'approbation de cette variante est limitée car la partie radio du module n'est pas incluse dans son
propre blindage RF: par conséquent, chaque nouvel hôte est requis dans tous les cas pour réévaluer les émissions rayonnées et le
bureau doit être informé par un C4PC.
Dans le cas du BGM220S22A, cette variante est une conception blindée et est par conséquent livrée avec une approbation modulaire
complète.
Étiquetage des produits finis
Les modules BGM220S ne sont pas étiquetés avec leur propre ID IC en raison de leur taille. Au lieu de cela, l'étiquette d'emballage
contient l'ID IC. Dans tous les cas, lorsque l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre produit, cet autre
produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module intégré. Dans un tel cas,
sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes:
Pour le BGM220S12A
“Contient le module transmetteur: 5123A-BGM220S ”
or
“Contient le circuit: 5123A-BGM220S”
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Certifications
Pour le BGM220S12A
“Contient le module transmetteur: 5123A-BGM220S2 ”
or
“Contient le circuit: 5123A-BGM220S2”
Note finale: L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la
façon d'installer ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio.
CAN ICES-003 (B) - BGM220S22A uniquement
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
11.1.5 Proximity to Human Body
When using the BGM220S modules in an application where the radio is located close to the human body, the human RF exposure must
be taken into account. FCC, ISED, and CE all have different standards and rules for evaluating the RF exposure. In particular, each
regulator has different requirements when it comes to the exemption from having to perform RF exposure and SAR (Specific Absorption
Rate) measurements, and the minimum separation distances between the module and human body varies accordingly. The properties
of the BGM220S modules allows for the minimum separation distances detailed in the tables below for SAR evaluation exemption in
portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without
any need for RF Exposure evaluation.
Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption (BGM220S12A)
Certification
BGM220S12A
FCC
0 mm
ISED
0 mm
CE
The RF exposure must always be evaluated using the end-product when transmitting with power
levels higher than 20 mW (13 dBm).
Table 11.3. Minimum Separation Distances for SAR Evaluation Exemption (BGM220S22A)
Certification
BGM220S22A
FCC
0 mm
ISED
13 mm with the reference external antenna
12 mm for integral antenna
CE
The RF exposure must always be evaluated using the end-product when transmitting with power
levels higher than 20 mW (13 dBm).
For FCC and ISED, using the module in end-products where the separation distance from the human body is smaller than that listed
above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or
Change of ID to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the endproduct in all cases when transmitting at more than the power level indicated in the table.
Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a
reduced range is to be expected.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Certifications
11.1.6 Japan - MIC
The BGM22S12A are certified in Japan with certification number 203-JN1080.
The BGM22S22A are certified in Japan with certification number 209-J00429.
It is the end-product manufacturer's responsibility to ensure that the module is configured to meet the limits documented in the formal
certification test report available at https://www.silabs.com/. If needed, refer to the API reference manual(s) to learn how to configure
the maximum RF TX power for the normal operations.
Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host
equipment places the certification mark and certification number on the outside of the host equipment. This combination of mark and
number, and their relative placement, is depicted in figure 11.1, and depending on the size of the module it might also appear on the top
shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese
language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host
and radio module to verify if they are actually using a radio device which is approved for use in Japan
Certification Text to be Placed on the Outside Surface of the Host Equipment:
Translation of the text:
“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under
the Radio Law.”
The "Giteki" marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment.
Note that additional information may be required if the device is also subject to a telecom approval.
Figure 11.1. GITEKI Mark and ID (BGM220S12A)
Figure 11.2. GITEKI Mark and ID (BGM220S22A)
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Certifications
Figure 11.3. GITEKI Mark
11.1.7 South Korea - KC
The BGM220S22A modules have a RF certification for import and use in South-Korea.
Certification number is: R-R-BGT-BGM220S2
When integrating the RF-certified module, an end-product is exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and the approved antennas are used.
EMC testing, and any other relevant test, might still be required for full compliance.
11.2 Standards-Based Certifications
11.2.1 Bluetooth Qualification
The BGM220S modules come at launch with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component having Declaration ID
of D044526 and QDID of 155407, and having a listing date of 2020-09-04.
The BGM220S modules additionally have a pre-qualified Bluetooth Low Energy RF-PHY Tested Component based on Core Specification 5.3 having Declaration ID of D056805 and QDID of 178495, and having a listing date of 2021-11-12.
Notice that the validity set by the SIG for Tested Components is currently of 3 years: during the product lifetime, Silicon Labs will reassess or re-qualify an RF-PHY Component as it expires, whenever applicable. In case of a re-qualification an RF-PHY Tesed Component will come with a new DID and a new QDID, and these will be then reffered to in end-product listings. Newer DIDs and QDIDs can
be discovered by using the search engine in the SIG's Launch Studio, or by asking Silicon Labs via the technical support platform.
This module’s RF-PHY Tested Component should be combined with the latest Wireless Gecko Link Layer and Host pre-qualified Components by Silicon Labs, when in the process of qualifying an end-product embedding the BGM220S via the SIG’s Launch Studio.
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BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Revision History
12. Revision History
Revision 1.1
January, 2022
•
•
•
•
•
•
•
•
•
•
Updated regulatory certifications in 1. Feature List.
Updated direction finding language in 2. Ordering Information.
Added kits available for evaluation in 2. Ordering Information.
Corrected Storage Temperature range in 4.1 Absolute Maximum Ratings.
Corrected initial calibrated accuracy in 4.11 High-Frequency Crystal.
Updated initial calibrated accuracy in 4.12 Low Frequency Crystal Oscillator.
Added footnote for crystal load capacitance with Gain=2 test condition in 4.12 Low Frequency Crystal Oscillator.
Added RESETn low time to ensure pin reset (T_RESET) specification to Table 4.14 GPIO Pins on page 20.
Updated 11.1.2 EU and UK - CE and UKCA.
Updated wording for 11.2.1 Bluetooth Qualification.
Revision 1.0
September, 2020
• Various wording updates to 11.1 Regulatory Certifications to introduce BGM220S22A model.
• Updated wording for 11.2.1 Bluetooth Qualification.
Revision 0.7
July, 2020
•
•
•
•
Updated 2. Ordering Information with devices for model BGM220S22A.
Added Table 3.2 Antenna Efficiency and Peak Gain (BGM220S22A) on page 7 for model BGM220S22A.
Updated 4. Electrical Characteristics with additional specifications for model BGM220S22A and latest characterization data.
Added Figure 4.4 BGM220S22A Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board on page 23 for model
BGM220S22A.
• Updated 7. Design Guidelines with guidelines and information covering model BGM220S22A.
• Added marking information for model BGM220S22A to Table 8.3 Top Marking Definition on page 42.
• Added section to note pending certification for model BGM220S22A.
Revision 0.6
June, 2020
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•
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Updated 4.2.1 DC-DC Operating Limits to relax lifetime safe operating region.
Updated 5. Reference Diagrams to mark PTI interface as recommended in figures.
Updated 4. Electrical Characteristics with latest characterization results and limits.
Updated 11. Certifications with additional certification details.
silabs.com | Building a more connected world.
Rev. 1.1 | 55
BGM220S Wireless Gecko Bluetooth® Module Data Sheet
Revision History
Revision 0.5
March, 2019
•
•
•
•
•
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•
•
•
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In the front page block diagram, updated the lowest energy mode for LETIMER.
Updated part numbers in 2. Ordering Information to reflect new ordering code scheme.
In 2. Ordering Information, added note about referencing by family, model, or ordering code.
Added 4.13 Precision Low Frequency RC Oscillator (LFRCO).
Added supply voltage, crystal frequencies and RF frequencies to Figure 3.1 BGM220S Block Diagram on page 6.
Updated 4. Electrical Characteristics with latest characterization details.
Updated 5. Reference Diagrams.
Added section 11. Certifications.
Added section 5. Reference Diagrams.
Added section 10. Tape and Reel.
Revision 0.1
September, 2019
Initial release.
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Rev. 1.1 | 56
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