BGX220S Wireless Gecko Bluetooth
Xpress Module Data Sheet
The BGX220S is a wireless cable replacement module that eliminates Bluetooth firmware development complexity with a serial interface that can operate as a raw data stream or control the device through an abstracted command API. The BGX220S can facilitate a device-to-device cable replacement link or communicate
with mobile devices through the Xpress Bluetooth mobile library.
The device integrates a Bluetooth 5.2 compliant stack to futureproof applications as Bluetooth 5.2 adoption increases.
BGX220S modules are a full solution that comes with fully-upgradeable, robust software
stacks, world-wide regulatory certifications, and support that will minimize and simplify
the engineering and development of your end-products helping to accelerate their timeto-market.
KEY FEATURES
• Bluetooth 5.2 Technologies
• Bluetooth Low Energy
• Built-in antenna
• Up to 6 dBm TX power
• -98.6 dBm BLE RX sensitivity at 1 Mbps
• 8 GPIO pins
• I2C master interface
• Input pin event monitoring and response
• 6.0 mm x 6.0 mm
The BGX220S is intended for a broad range of applications, including:
• Health, sports, and wellness devices
• Industrial, home, and building automation
• Smart phone, tablet, and PC accessories
GPIO
control
RX/TX and flow
control
Serial interface
Command
parser
Raw data
stream
buffers
silabs.com | Building a more connected world.
Bluetooth
controller
Radio
Bluetooth 5
compliant
stack
Radio
transceiver
Timers
Chip
antenna
OTA
manager
Matching
network
Rev. 1.0
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Ordering Information
1. Ordering Information
Table 1.1. Ordering Information
Ordering Code
BGX220S22HNA21
Protocol Stack
• Bluetooth 5.2
TX Power
Rating
Antenna
RF Shield
6 dBm
Built-in
Yes
Flash
(kB)
RAM
(kB)
GPIO
Temp Range
512
32
8
-40 to 105 °C
Note:
1. End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with
the formal certification test reports.
2. Throughout this document, the device in the table above may be referred to by their product family name (e.g. BGX220S), by
model name (BGX220S22A), or by full ordering code.
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Rev. 1.0 | 2
Table of Contents
1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Block Diagram .
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. 5
2.2 EFR32BG22 SoC .
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. 6
2.3 Antenna .
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. 6
2.4 Power Supply .
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. 6
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Absolute Maximum Ratings.
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. 7
3.2 General Operating Conditions .
3.2.1 DC-DC Operating Limits .
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3.3 Power Consumption .
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.10
3.4 RF Transmitter General Characteristics for the 2.4 GHz Band .
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.11
3.5 RF Receiver General Characteristics for the 2.4 GHz Band .
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.11
3.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate .
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.12
3.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate .
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.13
3.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate .
.14
3.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate .
.15
3.10 Non-Volatile Configuration Storage.
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.16
3.11 High-Frequency Crystal
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.16
3.12 GPIO Pins .
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.17
3.13 Typical Performance Curves . . . .
3.13.1 Antenna Typical Characteristics .
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.17
.18
4. Reference Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . .
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4.1 Typical Connections .
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.19
5. 44-Pin SiP Module Device Pinout . . . . . . . . . . . . . . . . . . . . . . . 20
6. Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1 Introduction .
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.22
6.2 Communication Use Cases .
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.22
6.3 Embedded Interface .
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.22
6.4 Command Mode and Streaming Mode .
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.22
6.5 Command API .
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.23
6.6 GPIO Control
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.23
6.7 Device Configuration .
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.23
6.8 Security Features .
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.23
6.9 OTA
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.23
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22
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silabs.com | Building a more connected world.
.
Rev. 1.0 | 3
6.10 Direct Test Mode Support .
7. Design Guidelines
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.23
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.1 Layout and Placement .
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.24
7.2 Best Design Practices
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.27
7.3 Radio Performance vs. Carrier Board Size
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.29
7.4 Proximity to Other Materials
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.29
7.5 Proximity to Human Body .
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.30
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8. Package Specifications
8.1 Package Dimensions .
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.31
8.2 Recommended PCB Land Pattern .
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.33
8.3 Top Marking .
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.34
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9. Soldering Recommendations
10. Tape and Reel
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
11.1 Certifications for Model BGM220S22A
.
.38
12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
39
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Rev. 1.0 | 4
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
System Overview
2. System Overview
2.1 Block Diagram
The BGX220S module combines an energy-friendly MCU with a highly integrated radio transceiver in a SiP module with a robust, integrated antenna. This section gives a short introduction to the features of the module.
Note that features in the module are not directly configurable in this pre-programmed product, and are instead controlled through the
abstracted command and variable set.
The block diagram for the BGX220S module is shown in the figure below. The wireless module includes the EFR32BG22 wireless System on a Chip (SoC), required decoupling capacitors and inductors, 38.4 MHz crystal, RF matching circuit, and integrated antenna.
2400 – 2483.5 MHz
External
Antenna
1.8 - 3.8 V
2400 – 2483.5 MHz
or
VREGVDD
ANT_OUT
Integral
Antenna
ANT_IN
IOVDD
Supply Decoupling
and DC-DC Support
VREG
DECOUPLE
0 Ohm
RF Match
RF_2G4
Silicon Labs
EFR32BG22
(up to 8)
HF XTAL
38.4 MHz
GPIO
GND
Figure 2.1. BGX220S Block Diagram
A simplified internal schematic for the BGX220S module is shown in Figure 2.2 BGX220S Module Schematic on page 5.
EFR32BG22
VREGVDD
VREGVDD
AVDD
4.7µF
IOVDD
IOVDD
VREGSW
2.2µH
ANT_OUT
ANT_IN
Matching
Network
RF_2G4
GPIOx
VREG
DVDD
RFVDD
PAVDD
4.7µF
DECOUPLE
RF2G4_IO
Integral
Antenna
2.2µF
DECOUPLE
HFXTAL_I
HFXTAL_O
GPIO(0-7)
38.4 MHz
Figure 2.2. BGX220S Module Schematic
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Rev. 1.0 | 5
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
System Overview
2.2 EFR32BG22 SoC
The EFR32BG22 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 512 kB of flash memory, a rich set
of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG22 Wireless Gecko Reference
Manual and the EFR32BG22 Data Sheet for details.
Note that the Flash and other features in this product are not directly accessible, and are instead accessed through the product's abstracted command and variable set.
2.3 Antenna
BGX220S modules include an integral antenna on board with the characteristics detailed in the tables below.
Table 2.1. Antenna Efficiency and Peak Gain
Parameter
With optimal layout Note
Efficiency
-1 to -2 dB
Peak gain
2.3 dBi
Antenna efficiency, gain and radiation pattern are highly dependent on the application PCB layout and mechanical design. Refer
to 7. Design Guidelines for recommendations to achieve optimal
antenna performance.
2.4 Power Supply
The BGX220S requires a single nominal supply level of 3.0 V to operate. All necessary decoupling and filtering components are included in the module.
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Rev. 1.0 | 6
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3. Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on TA=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization.
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
3.1 Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 3.1. Absolute Maximum Ratings
Parameter
Symbol
Storage temperature range
Test Condition
Min
Typ
Max
Unit
TSTG
-50
—
+150
°C
Voltage on any supply pin
VDDMAX
-0.3
—
3.8
V
Junction temperature
TJMAX
—
—
+105
°C
Voltage ramp rate on any
supply pin
VDDRAMPMAX
—
—
1.0
V / µs
DC voltage on any GPIO pin
VDIGPIN
-0.3
—
VIOVDD +
0.3
V
Input RF level on RF pin
RF_2G4
PRFMAX2G4
—
—
+10
dBm
Absolute voltage on RF pin
RF_2G4
VMAX2G4
-0.3
—
VVREG +
0.3
V
-N grade
Total current into VDD power IVDDMAX
lines
Source
—
—
200
mA
Total current into VSS
ground lines
IVSSMAX
Sink
—
—
200
mA
Current per I/O pin
IIOMAX
Sink
—
—
50
mA
Source
—
—
50
mA
Sink
—
—
200
mA
Source
—
—
200
mA
Current for all I/O pins
IIOALLMAX
silabs.com | Building a more connected world.
Rev. 1.0 | 7
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.2 General Operating Conditions
This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum
values of all other tables are specifed over this operating range, unless otherwise noted.
Table 3.2. General Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Operating ambient temperature range
TA
-N temperature grade
-40
—
+105
°C
IOVDDx operating supply
voltage (All IOVDD pins)
VIOVDDx
1.71
3.0
3.8
V
VREGVDD operating supply
voltage
VVREGVDD
DCDC in regulation1
2.2
3.0
3.8
V
DCDC in bypass
1.8
3.0
3.8
V
Note:
1. The supported maximum VVREGVDD in regulation mode is a function of temperature and 10-year lifetime average load current.
See more details in 3.2.1 DC-DC Operating Limits.
silabs.com | Building a more connected world.
Rev. 1.0 | 8
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.2.1 DC-DC Operating Limits
The maximum supported voltage on the VDD supply pin is limited under certain conditions. Maximum input voltage is a function of temperature and the average load current over a 10-year lifetime. Figure 3.1 Lifetime average load current limit vs. Maximum input voltage
on page 9 shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the reliability
and performance of the DC-DC converter.
Average Lifetime ILOAD (mA)
The average load current for an application can typically be determined by examining the current profile during the time the device is
powered. For example, an application that is continuously powered which spends 99% of the time asleep consuming 2 µA and 1% of
the time active and consuming 10 mA has an average lifetime load current of about 102 µA.
60
Tj ≤ 105 °C
5
3.3
Maximum VVREGVDD (V)
3.8
Figure 3.1. Lifetime average load current limit vs. Maximum input voltage
Maximum ILOAD (mA)
The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting.
Figure 3.2 Transient maximum load current vs. Minimum input voltage on page 9 shows the max load current vs. input voltage for
different DC-DC peak inductor current settings.
60
36
IPEAK = 150 mA
IPEAK = 90 mA
5
1.8
2.2
Minimum VVREGVDD (V)
Figure 3.2. Transient maximum load current vs. Minimum input voltage
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Rev. 1.0 | 9
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.3 Power Consumption
Table 3.3. Power Consumption
Parameter
Symbol
Test Condition
Active supply current, Unconnected, Idle
IACTIVE_IDLE
Active supply current, Adver- IACTIVE_ADV
tising
Active supply current, Connected, 15 ms Interval
Supply current in low power
mode
IACTIVE_CONN
ILPM
Min
Typ
Max
Unit
Baud rate ≤ 9600 bps
—
2.0
—
µA
Baud rate > 9600 bps
—
1.0
—
mA
Interval = 546.25 ms, Baud rate ≤
9600 bps
—
30
—
µA
Interval = 20 ms, Baud rate ≤
9600 bps
—
0.67
—
mA
Interval = 546.25 ms, Baud rate >
9600 bps
—
1.0
—
mA
Interval = 20 ms, Baud rate >
9600 bps
—
1.6
Idle, Baud Rate ≤ 9600 bps
—
325
—
µA
TX/RX (acknowledged) at highest
throughput, Baud Rate ≤ 9600
bps
—
TX: 4.7
—
mA
Idle, Baud Rate > 9600 bps
—
3.6
—
mA
TX/RX (acknowledged) at highest
throughput, Baud Rate > 9600
bps
—
TX: 3.8
—
mA
Radio disabled
—
2.25
—
µA
Radio enabled, Advertising, Interval = 546.25 ms
—
26
—
µA
Radio enabled, Advertising, Interval = 20 ms
—
0.65
—
mA
mA
RX: 3.8
RX: 3.7
Note:
1. All current consumption figures were measured using Bluetooth Xpress firmware version 1.3.2.
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Rev. 1.0 | 10
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.4 RF Transmitter General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 3.4. RF Transmitter General Characteristics for the 2.4 GHz Band
Parameter
Symbol
RF tuning frequency range
FRANGE
Maximum TX power1
POUTMAX
Minimum active TX Power
POUTMIN
Output power variation vs
VREGVDD supply voltage
variation, frequency = 2450
MHz
POUTVAR_V
Output power variation vs
temperature, Frequency =
2450 MHz
POUTVAR_T
Output power variation vs RF POUTVAR_F
frequency
Test Condition
Min
Typ
Max
Unit
2400
—
2483.5
MHz
6 dBm output power
—
6.0
—
dBm
0 dBm output power
—
-0.5
—
dBm
—
-27
—
dBm
6 dBm output power with
VREGVDD voltage swept from
1.8 V to 3.0 V
—
0.04
—
dB
0 dBm output power, with
VREGVDD voltage swept from
1.8 to 3.0 V
—
0.04
—
dB
6 dBm output power, (-40 to +105
°C)
—
0.2
—
dB
0 dBm output power, (-40 to +105
°C)
—
1.3
—
dB
6 dBm output power
—
0.09
—
dB
0 dBm output power
—
0.15
—
dB
Note:
1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices covered in this data sheet can be found in the Max TX Power column of the Ordering Information Table.
3.5 RF Receiver General Characteristics for the 2.4 GHz Band
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 3.5. RF Receiver General Characteristics for the 2.4 GHz Band
Parameter
Symbol
RF tuning frequency range
FRANGE
silabs.com | Building a more connected world.
Test Condition
Min
Typ
Max
Unit
2400
—
2483.5
MHz
Rev. 1.0 | 11
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 3.6. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-98.6
—
dBm
Signal is reference signal, 255
byte payload1
—
-97.2
—
dBm
With non-ideal signals3 1
—
-96.6
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
8.7
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 5 4 6
—
-6.6
—
dB
Interferer is reference signal at -1
MHz offset1 5 4 6
—
-6.5
—
dB
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-40.9
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-39.9
—
dB
Interferer is reference signal at +3
MHz offset1 5 4 6
—
-45.9
—
dB
Interferer is reference signal at -3
MHz offset1 5 4 6
—
-46.2
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-23.5
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 6
—
-40.9
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 6
—
-6.6
—
dB
n = 3 (see note7)
—
-17.1
—
dBm
Intermodulation performance IM
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -67 dBm.
5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
6. With allowed exceptions.
7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4
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Rev. 1.0 | 12
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 3.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-95.9
—
dBm
Signal is reference signal, 255
byte payload1
—
-94.3
—
dBm
With non-ideal signals3 1
—
-94.0
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
8.8
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-9.2
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-6.6
—
dB
Interferer is reference signal at +4
MHz offset1 5 4 6
—
-43.3
—
dB
Interferer is reference signal at -4
MHz offset1 5 4 6
—
-44.0
—
dB
Interferer is reference signal at +6
MHz offset1 5 4 6
—
-48.6
—
dB
Interferer is reference signal at -6
MHz offset1 5 4 6
—
-50.7
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-23.8
—
dB
Selectivity to image frequency ± 2 MHz
C/IIM_1
Interferer is reference signal at image frequency +2 MHz with 1
MHz precision1 6
—
-43.3
—
dB
Interferer is reference signal at image frequency -2 MHz with 1 MHz
precision1 6
—
-9.2
—
dB
n = 3 (see note7)
—
-18.8
—
dBm
Intermodulation performance IM
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -64 dBm.
5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
6. With allowed exceptions.
7. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 3.8. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-102.3
—
dBm
Signal is reference signal, 255
byte payload1
—
-100.9
—
dBm
With non-ideal signals3 1
—
-99.8
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
2.7
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 5 4 6
—
-8.0
—
dB
Interferer is reference signal at -1
MHz offset1 5 4 6
—
-7.9
—
dB
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-46.5
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-49.9
—
dB
Interferer is reference signal at +3
MHz offset1 5 4 6
—
-48.9
—
dB
Interferer is reference signal at -3
MHz offset1 5 4 6
—
-53.8
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-48.3
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 6
—
-49.9
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 6
—
-46.5
—
dB
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -72 dBm.
5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
6. With allowed exceptions.
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate
Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V. RF center frequency 2.45 GHz.
Table 3.9. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Max usable receiver input
level
SAT
Signal is reference signal1
—
10
—
dBm
Sensitivity
SENS
Signal is reference signal, 37 byte
payload2
—
-106.4
—
dBm
Signal is reference signal, 255
byte payload1
—
-106.0
—
dBm
With non-ideal signals3 1
—
-105.6
—
dBm
Signal to co-channel interfer- C/ICC
er
(see notes)1 4
—
0.9
—
dB
N ± 1 Adjacent channel selectivity
Interferer is reference signal at +1
MHz offset1 5 4 6
—
-13.6
—
dB
Interferer is reference signal at -1
MHz offset1 5 4 6
—
-13.4
—
dB
Interferer is reference signal at +2
MHz offset1 5 4 6
—
-52.6
—
dB
Interferer is reference signal at -2
MHz offset1 5 4 6
—
-55.8
—
dB
Interferer is reference signal at +3
MHz offset1 5 4 6
—
-53.7
—
dB
Interferer is reference signal at -3
MHz offset1 5 4 6
—
-59.0
—
dB
N ± 2 Alternate channel selectivity
N ± 3 Alternate channel selectivity
C/I1
C/I2
C/I3
Selectivity to image frequency
C/IIM
Interferer is reference signal at image frequency with 1 MHz precision1 6
—
-52.7
—
dB
Selectivity to image frequency ± 1 MHz
C/IIM_1
Interferer is reference signal at image frequency +1 MHz with 1
MHz precision1 6
—
-53.7
—
dB
Interferer is reference signal at image frequency -1 MHz with 1 MHz
precision1 6
—
-52.6
—
dB
Note:
1. 0.017% Bit Error Rate.
2. 0.1% Bit Error Rate.
3. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1
4. Desired signal -79 dBm.
5. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz.
6. With allowed exceptions.
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Rev. 1.0 | 15
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.10 Non-Volatile Configuration Storage
Table 3.10. Non-volatile Configuration Storage
Parameter
Symbol
Test Condition
Supply voltage during update VFLASH
Min
Typ
Max
Unit
1.71
—
3.8
V
Min
Typ
Max
Unit
3.11 High-Frequency Crystal
Table 3.11. High-Frequency Crystal
Parameter
Symbol
Crystal frequency
fHFXTAL
—
38.4
—
MHz
Initial calibrated accuracy
ACCHFXTAL
-10
+/-5
10
ppm
Temperature drift
DRIFTHFXTAL
-20
—
20
ppm
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Test Condition
Across specified temperature
range
Rev. 1.0 | 16
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.12 GPIO Pins
Unless otherwise indicated, typical conditions are: IOVDD = 3.0 V.
Table 3.12. GPIO Pins
Parameter
Symbol
Test Condition
Leakage current
ILEAK_IO
Input low voltage1
Input high voltage1
Hysteresis of input voltage
Output high voltage
Output low voltage
GPIO rise time
GPIO fall time
Pull up/down resistance2
VIL
VIH
VHYS
VOH
VOL
TGPIO_RISE
TGPIO_FALL
RPULL
Maximum filtered glitch width TGF
Min
Typ
Max
Unit
MODEx = DISABLED, IOVDD =
1.71 V
—
1.9
—
nA
MODEx = DISABLED, IOVDD =
3.0 V
—
2.5
—
nA
Any GPIO pin
—
—
0.3*IOVDD
V
RESETn
—
—
0.3*DVDD
V
Any GPIO pin
0.7*IOVDD
—
—
V
RESETn
0.7*DVDD
—
—
V
Any GPIO pin
0.05*IOVD
D
—
—
V
RESETn
0.05*DVDD
—
—
V
Sourcing 20mA, IOVDD = 3.0 V
0.8 *
IOVDD
—
—
V
Sourcing 8mA, IOVDD = 1.71 V
0.6 *
IOVDD
—
—
V
Sinking 20mA, IOVDD = 3.0 V
—
—
0.2 *
IOVDD
V
Sinking 8mA, IOVDD = 1.71 V
—
—
0.4 *
IOVDD
V
IOVDD = 3.0 V, Cload = 50pF,
SLEWRATE = 4, 10% to 90%
—
8.4
—
ns
IOVDD = 1.71 V, Cload = 50pF,
SLEWRATE = 4, 10% to 90%
—
13
—
ns
IOVDD = 3.0 V, Cload = 50pF,
SLEWRATE = 4, 90% to 10%
—
7.1
—
ns
IOVDD = 1.71 V, Cload = 50pF,
SLEWRATE = 4, 90% to 10%
—
11.9
—
ns
Any GPIO pin. Pull-up to IOVDD:
MODEn = DISABLE DOUT=1.
Pull-down to VSS: MODEn =
WIREDORPULLDOWN DOUT =
0.
35
44
55
kΩ
RESETn pin. Pull-up to DVDD
35
44
55
kΩ
MODE = INPUT, DOUT = 1
—
27
—
ns
Note:
1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to DVDD.
2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to DVDD.
3.13 Typical Performance Curves
Typical performance curves indicate typical characterized performance under the stated conditions.
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Electrical Characteristics
3.13.1 Antenna Typical Characteristics
Typical BGX220S radiation patterns for the on-board chip antenna under optimal operating conditions are plotted in the figures that
follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is
mounted on, as well as on the proximity of any mechanical design to the antenna.
Top Left: Phi 0o, Top Right: Phi 90o, Bottom Left: Theta 90o
Figure 3.3. BGX220S Typical 2D Antenna Radiation Patterns on 55 mm x 20 mm board
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Rev. 1.0 | 18
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Reference Diagrams
4. Reference Diagrams
4.1 Typical Connections
The BGX220S can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply and host
interface connections are shown in the figure below.
Note that an external pull-up should not be placed on the reset pin.
Antenna Loop
RESETn
NC
NC
NC
NC
NC
NC
GND
NC
NC
RESETn
0 Ohm
ANT_OUT
0.1 µF
(optional)
NC
ANT_IN
NC
BGX220S
RF_2G4
NC
NC
GND
NC
GND
GPIO0
BOOT
GPIO1
NC
VREG
VDD
GPIO7
GPIO6
GPIO5
UART_CTS
UART_RTS
UART_RX
DECOUPLE
GPIO4
NC
VREGVDD
NC
IOVDD
GPIO3
UART_TX
GPIO2
VDD
RTS
CTS
TX
GPIO
RESETn
Host CPU
GND
RX
Figure 4.1. Typical Connection Diagram
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
44-Pin SiP Module Device Pinout
NC
NC
NC
NC
RESETn
GND
NC
NC
NC
ANT_OUT
5. 44-Pin SiP Module Device Pinout
NC
NC
ANT_IN
NC
RF_2G4
NC
GND
GND
GND
NC
GND
NC
GPIO0
GND
GPIO1
BOOT
GND
NC
GPIO7
GPIO6
GPIO5
UART_CTS
UART_RTS
VREG
UART_RX
GPIO4
DECOUPLE
VREGVDD
NC
GPIO3
NC
IOVDD
UART_TX
GPIO2
Figure 5.1. 44-Pin SiP Module Device Pinout
Table 5.1. 44-Pin SiP Module Device Pinout
Pin Name
Pin(s)
Description
NC
1
No connect
RF_2G4
3
2.4 GHz RF input/output
GND
5
GPIO1
Pin Name
Pin(s)
Description
ANT_IN
2
Antenna In
GND
4
Ground
Ground
GPIO0
6
Pin with input/output functionality configured through the command API.
7
Pin with input/output functionality configured through the command API.
GPIO2
8
Pin with input/output functionality configured through the command API.
GPIO3
9
Pin with input/output functionality configured through the command API.
GPIO4
10
Pin with input/output functionality configured through the command API.
UART_TX
11
Digital output
NC
12
No connect
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
44-Pin SiP Module Device Pinout
Pin Name
Pin(s)
Description
NC
13
No connect
DECOUPLE
14
Decouple output for on-chip voltage
regulator. This pin is internally decoupled, and should be left disconnected.
UART_RX
15
Digital input
UART_RTS
16
Digital output
UART_CTS
17
Digital input
GPIO5
18
Pin with input/output functionality configured through the command API.
GPIO6
19
Pin with input/output functionality configured through the command API.
GPIO7
20
Pin with input/output functionality configured through the command API.
VREG
21
Regulated supply voltage. This pin is internally connected to the SoC DVDD,
RFVDD, and PAVDD supply lines. It is
not intended to power external circuitry.
VREGVDD
22
Module input power supply. This pin is
internally connected to the SoC AVDD
and VREGVDD supply lines.
IOVDD
23
I/O power supply
NC
24
No connect
BOOT
25
Active-low digital input to force module
entrance into DFU bootloader state
upon device reset. See command API
documentation for functional details.
NC
26
No connect
NC
27
No connect
NC
28
No connect
NC
29
No connect
NC
30
No connect
NC
31
No connect
NC
32
No connect
NC
33
No connect
NC
34
No connect
RESETn
35
Reset Pin. The RESETn pin is internally
pulled up to VREG (DVDD).
GND
36
Ground
NC
37
No connect
NC
38
No connect
NC
39
No connect
ANT_OUT
40
Antenna Out
GND
41
Ground
GND
42
Ground
GND
43
Ground
GND
44
Ground
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Pin Name
Pin(s)
Description
Rev. 1.0 | 21
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Functional overview
6. Functional overview
6.1 Introduction
The BGX220S creates a Bluetooth 5.2 compliant Bluetooth Low Energy cable replacement interface, facilitating a Bluetooth Low Energy link to a second embedded device or a mobile device. An embedded MCU controls the device and communicates across the Bluetooth Low Energy link through a serial interface and control signals. Parameters stored in non-volatile memory and configurable through
the serial interface adjust performance characteristics of the device. Silicon Labs offers iOS and Android mobile libraries for Bluetooth
Xpress devices to speed mobile development and simplify communication with the device. This library also controls OTA management,
facilitating secure and reliable updates to the device’s embedded stack.
This functional overview does not cover each command supported by the command API. The complete command API specification is
available at docs.silabs.com.
6.2 Communication Use Cases
The BGX220S family facilitates two types of Bluetooth Low Energy communication links:
• BGX-to-mobile
• BGX-to-BGX
In the BGX-to-mobile communication use case, the BGX220S operates as a peripheral that is discoverable and connectable when configured to that state through either the command API or the pin states driven by the embedded MCU. Using the Xpress mobile library,
mobile applications can scan for BGX220S devices, connect, and communicate with the device in both streaming and remote command
modes, where the mobile app can execute command API functions remotely.
In the BGX-to-BGX communication use case, one BGX220S must be configured as the central device and one or more other BGX
devices should be configured as a peripheral. Devices can be configured at runtime through the command API, or those settings can be
saved to non-volatile memory so that each device wakes from power-on or low power states as either a peripheral or central. For more
information on advertising and connection options, please see the command API documentation.
6.3 Embedded Interface
The BGX220S family uses an 8-N-1 USART interface for data and flow control signaling. The interface is used both for a raw data
streaming interface and a command interface, depending on additional hardware pin configuration.
UART_TX and UART_RX are defined with flow directions relative to the BGX. Bytes sent from the embedded host to the BGX use the
UART_RX pin. Bytes sent from the BGX to the embedded host appear on the UART_TX pin.
UART_CTS is a digital input that controls the state of the UART_RTS digital output on the other end of the wireless link. Assertion of a
CTS/RTS pair signals that the embedded MCU driving its respective UART_CTS is available to receive bytes.
The baud rate of the BGX220S is a configurable parameter. For information on the process by which a baud rate change gets processed and executed by the device, please see the command API documentation.
State control signals and visual indicators described below can be assigned to any of the GPIO pins through the command API. These
settings can be stored in non-volatile memory and take effect during the next power cycle. For information on configuration of standard
GPIO and available special function I/O available on the device, please see the command API documentation.
6.4 Command Mode and Streaming Mode
The BGX220S is designed to wake and offer optimized serial interface with hardware flow control. Hardware flow control signaling is
disabled by default. When operating in a peripheral role and when flow control signals are monitored, the device may never need to
leave streaming mode during operation.
However, when use cases require more advanced runtime configuration, the device can switch to command interface through pin or
escape sequence. Commands defined here can control scanning, advertising, connection state, and GPIO settings.
The command interface is also used to configure and store customizable parameters.
Streaming mode can be switched to command mode through an escape sequence of characters if the sequence has been previously
saved in the device's configuration. A command can be issued in command mode to switch to streaming mode. Stream mode and command mode entrance can be controlled through a device port pin state, if a pin has been previously defined for that purpose.
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Rev. 1.0 | 22
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Functional overview
6.5 Command API
Each command begins with a command name followed by arguments, and the syntax of each command is defined in the command API
documentation.
The command interface saves settings as key-value pairs. These values can be used at runtime to modify the operational state, and
they can also be stored in non-volatile memory. Values stored in non-volatile memory function to configure the device's startup/default
state.
6.6 GPIO Control
The BGX220S offers 8 GPIO pins. These pins can be configured as state control pins or visual indicator pins. Alternatively, they can be
used as general purpose I/O pins. Digital output settings can be set and digital input state can be read through the command interface
locally or remotely through the remote command execution using the mobile libraries.
6.7 Device Configuration
Device configuration is handled through the command API, where commands are executed when the serial interface is set to operate in
command mode. These commands can also be executed remotely through the mobile library unless prohibited through previous configuration.
Additionally, a device configuration can be generated and saved using Simplicity Studio's Xpress Configurator tool. A generated configuration can be submitted to Silicon Labs through the process defined in that application. Silicon Labs will then validate the configuration
request, generate a custom orderable part number, and deliver first article samples for testing. Developers should contact sales representatives for more information about this process. Once first article samples have been validated by the customer, this custom orderable part number can be ordered directly from Silicon Labs.
6.8 Security Features
BGX220S devices communicate with LE secure connections, establishing encrypted communication upon connection.
Device OTA requires an encrypted image signed by Silicon Laboratories. Only firmware developed, signed, and encrypted by Silicon
Labs can be bootloaded successfully on the device.
6.9 OTA
The BGX220S supports secure OTA of the embedded stack and the command interface. Images are encrypted and signed by Silicon
Laboratories. OTA can be performed through the mobile library APIs. Specific device firmware versions can be selected and programmed through these APIs. See command API documentation for more information.
For information on new functionality including firmware updates to BGX220S, please see docs.silabs.com. BGX220S module OPN firmware will not be updated to include newly released features available through OTA and DFU updates provided by Silicon Labs. Module
OPN firmware will only be updated at manufacturing time to provide security-related enhancements.
Contact Silicon Labs technical support for information on customer factory programming options for custom OPN ordering with a specified device firmware version and for customer factory programming options.
6.10 Direct Test Mode Support
The BGX220S's command API offers a command set that configures the device to support the Direct Test Mode (DTM) protocol as
defined in the Bluetooth Core Specification Version 4.2, Volume 6, part F.
See the command API for information about commands to support specific DTM test procedures.
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Rev. 1.0 | 23
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Design Guidelines
7. Design Guidelines
7.1 Layout and Placement
For optimal performance of the BGX220S the following guidelines are recommended:
• Place the module 1.50 mm from the edge of the copper “keep-in” area at the middle of the long edge of the application PCB, as
illustrated in Figure 7.1 Recommended Layout for BGX220S on page 24.
• Copy the exact antenna design from Figure 7.2 Antenna Layout With Coordinates on page 25 with the values for coordinates A to
L given in Table 7.1 Antenna Polygon Coordinates, Referenced to Center of BGX220S on page 25.
• Make a cutout in all lower layers aligned with the right edge and the bottom edge of the antenna as indicated by the yellow box in
Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 26.
• Connect all ground pads directly to a solid ground plane in the top layer.
• Connect RF_2G4 to ANT_IN through a 0-ohm resistor.
• The 0-ohm gives the ability to test conducted and to evaluate the antenna impedance in the design.
• Place ground vias as close to the ground pads of the BGX220S as possible.
• Place ground vias along the antenna loop right and bottom side.
• Place ground vias along the edges of the application board.
• Do not place plastic or any other dielectric material in contact with the antenna.
• A minimum clearance of 0.5 mm is advised.
• Solder mask, conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region.
Figure 7.1. Recommended Layout for BGX220S
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Rev. 1.0 | 24
BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Design Guidelines
Figure 7.2. Antenna Layout With Coordinates
Table 7.1. Antenna Polygon Coordinates, Referenced to Center of BGX220S
Point
BGX220S22HNA21
A
(2.87, 2.13)
B
(2.54, 2.13)
C
(2.54, 3.69)
D
(3.36, 4.51)
E
(7.75, 4.51)
F
(7.75, 4.15)
G
(6.84, 4.15)
H
(6.21, 3.52)
I
(4.26, 3.52)
J
(3.97, 3.81)
K
(3.10, 3.81)
L
(2.87, 3.58)
Wloop
4.88
Hloop
4.15
Note:
1. All coordinates and dimensions listed in mm.
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Design Guidelines
Figure 7.3. Antenna Clearance in Inner and Bottom Layers
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Design Guidelines
7.2 Best Design Practices
The design of a good RF system relies on thoughtful placement and routing of the RF signals. The following guidelines are recommended:
•
•
•
•
Place the BGX220S and antenna close to the center of the longest edge of the application board.
Do not place any circuitry between the board edge and the antenna.
Make sure to tie all GND planes in the application board together with as many vias as can be fitted.
Generally ground planes are recommended in all areas of the application board except in the antenna keep-out area shown in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 26.
• Open-ended stubs of copper in the outer layer ground planes must be removed if they are more than 5 mm long to avoid radiation of
spurious emissions.
• The width of the GND plane to the sides of the BGX220S will impact the efficiency of the on-board chip antenna.
• To achieve optimal performance, a GND plane width of 55 mm for BGX220S is recommended as seen on Figure 7.4 Illustration
of Recommended Board Width on page 27.
• See 3.13.1 Antenna Typical Characteristics for reference.
Figure 7.5 Non-Optimal Layout Examples on page 28 illustrates layout scenarios that will lead to severely degraded RF performance
for the application board.
Figure 7.4. Illustration of Recommended Board Width
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Design Guidelines
Figure 7.5. Non-Optimal Layout Examples
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Design Guidelines
7.3 Radio Performance vs. Carrier Board Size
For many applications, the carrier board size is determined by the overall form factor or size of the additional circuitry. The recommended carrier board width of 55 mm for BGX220S22A is thus not always possible in the end-application. If another form factor is required,
the antenna performance of the integrated antenna will be compromised but it may still be sufficiently good for providing the required
link quality and range of the end-application. Figure 7.6 Efficiency of the Integrated Antenna as Function of the Carrier Board Size for
BGX220S22A on page 29, which is also representative of antenna efficiency of the BGX220S, show the total efficiency of the integrated antenna for different carrier board sizes. As can be seen the best performance is achieved for the carrier board size of 55 mm x 25
mm for the BGX220S22A, with relatively constant performance for larger boards and rapidly declining performance for smaller boards.
The performance of all the sizes tested will be adequate for more than 15 m line-of-sight range and all of the sizes are thus usable.
WARNING: Any antenna tuning or change of the loop dimensions will void the modular certification of modules with modular
certification. In that case, a Permissions Change to the modular approval is required.
Figure 7.6. Efficiency of the Integrated Antenna as Function of the Carrier Board Size for BGX220S22A
7.4 Proximity to Other Materials
Placing plastic or any other dielectric material directly in contact with the antenna may cause performance degradation. A clearance of
minimum 0.5 mm is recommended to avoid excessive detuning of the antenna. Solder mask, conformal coating, and other thin dielectric layers are acceptable directly on top of the antenna region. Any metallic objects in close proximity to the antenna will prevent the
antenna from radiating freely. The minimum recommended distance of metallic and/or conductive objects is 10 mm in any direction
from the antenna except in the directions of the application PCB ground planes.
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Design Guidelines
7.5 Proximity to Human Body
Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. Furthermore, additional certification may be required if the module is used in a wearable device.
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Package Specifications
8. Package Specifications
8.1 Package Dimensions
The package dimensions are shown in Figure 8.1 Package Dimensions - Full on page 31 and Figure 8.2 Package Dimensions - Detail
on page 31.
Figure 8.1. Package Dimensions - Full
Figure 8.2. Package Dimensions - Detail
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Package Specifications
Table 8.1. Package Dimensions
Dimension
MIN
NOM
MAX
A
1.080
1.180
1.280
A1
0.140
0.180
0.220
A2
0.950
1.000
1.050
b
0.200
0.250
0.300
D
6.000 BSC
D1
4.500 BSC
e
0.500 BSC
E
6.000 BSC
E1
4.500 BSC
L
0.300
0.350
0.400
L1
0.125
0.175
0.225
L2
0.575
0.625
0.675
L3
0.450
0.500
0.550
eD1
0.450 BSC
eD2
0.900 BSC
eE1
0.450 BSC
eE2
0.900 BSC
aaa
0.100
bbb
0.100
ccc
0.100
ddd
0.100
eee
0.100
Note:
1. The dimensions in parenthesis are reference.
2. All dimensions in millimeters (mm).
3. Unless otherwise specified, tolerances are:
a. Decimal: X.X = +/- 0.1
X.XX = +/- 0.05
X.XXX = +/- 0.03
b. Angular: +/- 0.1 (In Deg)
4. Hatching lines means package shielding area.
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Package Specifications
8.2 Recommended PCB Land Pattern
The recommended PCB Land Pattern is shown in Figure 8.3 Module Land Pattern on page 33
Figure 8.3. Module Land Pattern
Table 8.2. PCB Land Pattern Dimensions
Dimension
Typ (mm)
D1
4.50
D2
2.65
E1
4.50
E2
2.25
eD1
0.45
eD2
0.90
b
0.25
e
0.50
L
0.35
L1
0.50
Note:
1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
4. The stencil thickness should be 0.100 mm (4 mils).
5. The stencil aperture to land pad size recommendation is 80% paste coverage.
6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use
different parameters and fine tune their SMT process as required for their application and tooling.
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Package Specifications
8.3 Top Marking
Figure 8.4. BGX220S Top Marking
Table 8.3. Top Marking Definition
OPN
Line 1 Marking
Line 2 Marking
Line 3 Marking
BGX220S22HNA21
BGX220S22A
SC22HNA2
See note below
Note: YY = Year. WW = Work Week, TTTTTTT = Trace Code
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Soldering Recommendations
9. Soldering Recommendations
It is recommended that final PCB assembly of the BGX220S follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface
mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements.
CLASS 1 General Electronic Products
Includes products suitable for applications where the major requirement is function of the completed assembly.
CLASS 2 Dedicated Service Electronic Products
Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not
critical. Typically the end-use environment would not cause failures.
CLASS 3 High Performance/Harsh Environment Electronic Products
Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated,
end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical
systems.
Note: General SMT application notes are provided in the AN1223 document.
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Tape and Reel
10. Tape and Reel
BGX220S modules are delivered to the customer in tray (490 pcs / tray) or reel (2500 pcs / reel) packaging with the dimensions below.
All dimensions are given in mm unless otherwise indicated.
Figure 10.1. Carrier Tape Dimensions
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Tape and Reel
Figure 10.2. Reel Dimensions
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Certifications
11. Certifications
Please refer to the corresponding chapter 11 of the BGM220S modules for all information regarding regulatory radio approvals and
Bluetooth qualification information. The BGX220S22A is derived from the BGM220S22A and shares the same test reports and certifications.
11.1 Certifications for Model BGM220S22A
Certification is not yet completed for the BGM220SC22WGA2 and BGM220SC22HNA2.
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BGX220S Wireless Gecko Bluetooth Xpress Module Data Sheet
Revision History
12. Revision History
Revision 1.0
Initial release.
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Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or
intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical”
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes
without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information.
Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or
the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly
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