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C8051F015-TB

C8051F015-TB

  • 厂商:

    SILABS(芯科科技)

  • 封装:

    TQFP-64_10X10MM

  • 描述:

    C8051F015 - MCU 8-Bit 8051 Embedded Evaluation Board

  • 数据手册
  • 价格&库存
C8051F015-TB 数据手册
C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Mixed-Signal 32KB ISP FLASH MCU Family ANALOG PERIPHERALS HIGH SPEED 8051 C CORE - - Programmable Hysteresis Values Configurable to Generate Interrupts or Reset - 2.4V; 15 ppm/C Available on External Pin - Precision VDD Monitor/Brown-out Detector SUPPLY VOLTAGE ........................ 2.7V to 3.6V - N ot R ec DIGITAL I/O SAR SMBus ADC SPI Bus UART VREF Timer 0 12-Bit DAC + + 12-Bit DAC - Port 0 PCA Timer 1 Timer 2 - VOLTAGE COMPARATORS Timer 3 Port 1 om AMUX TEMP SENSOR Rev. 1.7 11/03 Typical Operating Current: 12.5mA @ 25MHz Multiple Power Saving Sleep and Shutdown Modes 64-Pin TQFP, 48-Pin TQFP, 32-Pin LQFP Temperature Range: –40C to +85C ANALOG PERIPHERALS PGA Internal Programmable Oscillator: 2-to-16MHz External Oscillator: Crystal, RC,C, or Clock Can Switch Between Clock Sources on-the-fly; Useful in Power Saving Modes Port 2 - - fo r - 4 Byte-Wide Port I/O; All are 5V tolerant Hardware SMBusTM (I2CTM Compatible), SPITM, and UART Serial Ports Available Concurrently Programmable 16-bit Counter/Timer Array with Five Capture/Compare Modules Four General Purpose 16-bit Counter/Timers Dedicated Watch-Dog Timer Bi-directional Reset CLOCK SOURCES m en de d - On-Chip Debug Circuitry Facilitates Full Speed, NonIntrusive In-System Debug (No Emulator Required!) Provides Breakpoints, Single Stepping, Watchpoints, Stack Monitor Inspect/Modify Memory and Registers Superior Performance to Emulation Systems Using ICEChips, Target Pods, and Sockets IEEE1149.1 Compliant Boundary Scan Low Cost Development Kit D - ON-CHIP JTAG DEBUG & BOUNDARY SCAN - 256 Bytes Internal Data RAM (F000/01/02/10/11/12) 2304 Bytes Internal Data RAM (F005/06/07/15/16/17) 32k Bytes FLASH; In-System Programmable in 512 byte Sectors DIGITAL PERIPHERALS Voltage Reference   - - Two 12-bit DACs Two Analog Comparators   - MEMORY Port 3 - - Pipelined Instruction Architecture; Executes 70% of Instruction Set in 1 or 2 System Clocks Up to 25MIPS Throughput with 25MHz Clock 21 Vectored Interrupt Sources N ew    12-Bit (C8051F000/1/2, C8051F005/6/7) 10-bit (C8051F010/1/2, C8051F015/6/7) 1LSB INL; No Missing Codes Programmable Throughput up to 100ksps Up to 8 External Inputs; Programmable as SingleEnded or Differential Programmable Amplifier Gain: 16, 8, 4, 2, 1, 0.5 Data Dependent Windowed Interrupt Generator Built-in Temperature Sensor ( 3C) CROSSBAR      es ig ns SAR ADC HIGH-SPEED CONTROLLER CORE 8051 CPU CLOCK DEBUG JTAG (25MIPS) CIRCUIT CIRCUITRY 32KB 256/2304 B 21 SANITY ISP FLASH SRAM INTERRUPTS CONTROL Copyright © 2003 by Silicon Laboratories C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 TABLE OF CONTENTS 1. SYSTEM OVERVIEW ......................................................................................................... 8 ABSOLUTE MAXIMUM RATINGS*.............................................................................. 20 GLOBAL DC ELECTRICAL CHARACTERISTICS .................................................... 20 PINOUT AND PACKAGE DEFINITIONS ..................................................................... 21 m en de d 2. 3. 4. fo r N ew D es ig ns Table 1.1. Product Selection Guide .....................................................................................................................8 Figure 1.1. C8051F000/05/10/15 Block Diagram ...............................................................................................9 Figure 1.2. C8051F001/06/11/16 Block Diagram .............................................................................................10 Figure 1.3. C8051F002/07/12/17 Block Diagram .............................................................................................11 1.1. CIP-51TM CPU .........................................................................................................................................12 Figure 1.4. Comparison of Peak MCU Execution Speeds .................................................................................12 Figure 1.5. On-Board Clock and Reset..............................................................................................................13 1.2. On-Board Memory...................................................................................................................................14 Figure 1.6. On-Board Memory Map ..................................................................................................................14 1.3. JTAG Debug and Boundary Scan............................................................................................................15 Figure 1.7. Debug Environment Diagram .........................................................................................................15 1.4. Programmable Digital I/O and Crossbar .................................................................................................16 Figure 1.8. Digital Crossbar Diagram................................................................................................................16 1.5. Programmable Counter Array..................................................................................................................17 Figure 1.9. PCA Block Diagram .......................................................................................................................17 1.6. Serial Ports ...............................................................................................................................................17 1.7. Analog to Digital Converter ....................................................................................................................18 Figure 1.10. ADC Diagram ...............................................................................................................................18 1.8. Comparators and DACs ...........................................................................................................................19 Figure 1.11. Comparator and DAC Diagram.....................................................................................................19 Table 4.1. Pin Definitions ..................................................................................................................................21 Figure 4.1. TQFP-64 Pinout Diagram ...............................................................................................................23 Figure 4.2. TQFP-64 Package Drawing ............................................................................................................24 Figure 4.3. TQFP-48 Pinout Diagram ...............................................................................................................25 Figure 4.4. TQFP-48 Package Drawing ............................................................................................................26 Figure 4.5. LQFP-32 Pinout Diagram ...............................................................................................................27 Figure 4.6. LQFP-32 Package Drawing ............................................................................................................28 ADC (12-Bit, C8051F000/1/2/5/6/7 Only) .......................................................................... 29 Figure 5.1. 12-Bit ADC Functional Block Diagram..........................................................................................29 5.1. Analog Multiplexer and PGA ..................................................................................................................29 5.2. ADC Modes of Operation........................................................................................................................30 Figure 5.2. 12-Bit ADC Track and Conversion Example Timing .....................................................................30 Figure 5.3. Temperature Sensor Transfer Function ...........................................................................................31 Figure 5.4. AMX0CF: AMUX Configuration Register (C8051F00x) ..............................................................31 Figure 5.5. AMX0SL: AMUX Channel Select Register (C8051F00x) .............................................................32 Figure 5.6. ADC0CF: ADC Configuration Register (C8051F00x) ...................................................................33 Figure 5.7. ADC0CN: ADC Control Register (C8051F00x) ............................................................................34 Figure 5.8. ADC0H: ADC Data Word MSB Register (C8051F00x) ...............................................................35 Figure 5.9. ADC0L: ADC Data Word LSB Register (C8051F00x).................................................................35 5.3. ADC Programmable Window Detector ...................................................................................................36 Figure 5.10. ADC0GTH: ADC Greater-Than Data High Byte Register (C8051F00x) ....................................36 Figure 5.11. ADC0GTL: ADC Greater-Than Data Low Byte Register (C8051F00x) .....................................36 Figure 5.12. ADC0LTH: ADC Less-Than Data High Byte Register (C8051F00x) .........................................36 Figure 5.13. ADC0LTL: ADC Less-Than Data Low Byte Register (C8051F00x)...........................................36 Figure 5.14. 12-Bit ADC Window Interrupt Examples, Right Justified Data ...................................................37 Figure 5.15. 12-Bit ADC Window Interrupt Examples, Left Justified Data .....................................................37 Figure 5.15. 12-Bit ADC Window Interrupt Examples, Left Justified Data .....................................................38 N ot R ec om 5. Rev. 1.7 2 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 5.1. 12-Bit ADC Electrical Characteristics..............................................................................................38 Table 5.1. 12-Bit ADC Electrical Characteristics..............................................................................................39 6. ADC (10-Bit, C8051F010/1/2/5/6/7 Only) .......................................................................... 40 7. fo r N ew D es ig ns Figure 6.1. 10-Bit ADC Functional Block Diagram..........................................................................................40 6.1. Analog Multiplexer and PGA ..................................................................................................................40 6.2. ADC Modes of Operation........................................................................................................................41 Figure 6.2. 10-Bit ADC Track and Conversion Example Timing .....................................................................41 Figure 6.3. Temperature Sensor Transfer Function ...........................................................................................42 Figure 6.4. AMX0CF: AMUX Configuration Register (C8051F01x) ..............................................................42 Figure 6.5. AMX0SL: AMUX Channel Select Register (C8051F01x) .............................................................43 Figure 6.6. ADC0CF: ADC Configuration Register (C8051F01x) ...................................................................44 Figure 6.7. ADC0CN: ADC Control Register (C8051F01x) ............................................................................45 Figure 6.8. ADC0H: ADC Data Word MSB Register (C8051F01x) ...............................................................46 Figure 6.9. ADC0L: ADC Data Word LSB Register (C8051F01x).................................................................46 6.3. ADC Programmable Window Detector ...................................................................................................47 Figure 6.10. ADC0GTH: ADC Greater-Than Data High Byte Register (C8051F01x) ....................................47 Figure 6.11. ADC0GTL: ADC Greater-Than Data Low Byte Register (C8051F01x) .....................................47 Figure 6.12. ADC0LTH: ADC Less-Than Data High Byte Register (C8051F01x) .........................................47 Figure 6.13. ADC0LTL: ADC Less-Than Data Low Byte Register (C8051F01x)...........................................47 Figure 6.14. 10-Bit ADC Window Interrupt Examples, Right Justified Data ...................................................48 Figure 6.15. 10-Bit ADC Window Interrupt Examples, Left Justified Data .....................................................48 Figure 6.15. 10-Bit ADC Window Interrupt Examples, Left Justified Data .....................................................49 Table 6.1. 10-Bit ADC Electrical Characteristics..............................................................................................49 Table 6.1. 10-Bit ADC Electrical Characteristics..............................................................................................50 DACs, 12 BIT VOLTAGE MODE..................................................................................... 51 8. m en de d Figure 7.1. DAC Functional Block Diagram ......................................................................................................51 Figure 7.2. DAC0H: DAC0 High Byte Register ...............................................................................................52 Figure 7.3. DAC0L: DAC0 Low Byte Register ................................................................................................52 Figure 7.4. DAC0CN: DAC0 Control Register .................................................................................................52 Figure 7.5. DAC1H: DAC1 High Byte Register ...............................................................................................53 Figure 7.6. DAC1L: DAC1 Low Byte Register ................................................................................................53 Figure 7.7. DAC1CN: DAC1 Control Register .................................................................................................53 Table 7.1. DAC Electrical Characteristics .........................................................................................................54 COMPARATORS ............................................................................................................... 55 9. om Figure 8.1. Comparator Functional Block Diagram ..........................................................................................55 Figure 8.2. Comparator Hysteresis Plot .............................................................................................................56 Figure 8.3. CPT0CN: Comparator 0 Control Register ......................................................................................57 Figure 8.4. CPT1CN: Comparator 1 Control Register ......................................................................................58 Table 8.1. Comparator Electrical Characteristics ..............................................................................................59 VOLTAGE REFERENCE ................................................................................................. 60 ec Figure 9.1. Voltage Reference Functional Block Diagram ...............................................................................60 Figure 9.2. REF0CN: Reference Control Register ............................................................................................61 Table 9.1. Reference Electrical Characteristics .................................................................................................61 R 10. CIP-51 CPU.......................................................................................................................... 62 N ot Figure 10.1. CIP-51 Block Diagram ..................................................................................................................62 10.1. INSTRUCTION SET...........................................................................................................................63 Table 10.1. CIP-51 Instruction Set Summary ....................................................................................................65 10.2. MEMORY ORGANIZATION ............................................................................................................68 Figure 10.2. Memory Map .................................................................................................................................69 10.3. SPECIAL FUNCTION REGISTERS ..................................................................................................70 Table 10.2. Special Function Register Memory Map ........................................................................................70 Table 10.3. Special Function Registers .............................................................................................................70 Figure 10.3. SP: Stack Pointer ...........................................................................................................................74 Figure 10.4. DPL: Data Pointer Low Byte ........................................................................................................74 3 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 D es ig ns Figure 10.5. DPH: Data Pointer High Byte .......................................................................................................74 Figure 10.6. PSW: Program Status Word ..........................................................................................................75 Figure 10.7. ACC: Accumulator........................................................................................................................76 Figure 10.8. B: B Register .................................................................................................................................76 10.4. INTERRUPT HANDLER ...................................................................................................................77 Table 10.4. Interrupt Summary ..........................................................................................................................78 Figure 10.9. IE: Interrupt Enable .......................................................................................................................79 Figure 10.10. IP: Interrupt Priority ....................................................................................................................80 Figure 10.11. EIE1: Extended Interrupt Enable 1 .............................................................................................81 Figure 10.12. EIE2: Extended Interrupt Enable 2 .............................................................................................82 Figure 10.13. EIP1: Extended Interrupt Priority 1 ............................................................................................83 Figure 10.14. EIP2: Extended Interrupt Priority 2 ............................................................................................84 10.5. Power Management Modes .................................................................................................................85 Figure 10.15. PCON: Power Control Register ..................................................................................................86 11. FLASH MEMORY.............................................................................................................. 87 fo r N ew 11.1. Programming The Flash Memory ........................................................................................................87 Table 11.1. FLASH Memory Electrical Characteristics ....................................................................................87 11.2. Non-volatile Data Storage ...................................................................................................................88 11.3. Security Options ..................................................................................................................................88 Figure 11.1. PSCTL: Program Store RW Control .............................................................................................88 Figure 11.2. Flash Program Memory Security Bytes .........................................................................................89 Figure 11.3. FLACL: Flash Access Limit (C8051F005/06/07/15/16/17 only) .................................................90 Figure 11.4. FLSCL: Flash Memory Timing Prescaler .....................................................................................91 12. EXTERNAL RAM (C8051F005/06/07/15/16/17) .............................................................. 92 Figure 12.1. EMI0CN: External Memory Interface Control .............................................................................92 13. RESET SOURCES .............................................................................................................. 93 om m en de d Figure 13.1. Reset Sources Diagram .................................................................................................................93 13.1. Power-on Reset ....................................................................................................................................94 13.2. Software Forced Reset .........................................................................................................................94 Figure 13.2. VDD Monitor Timing Diagram ....................................................................................................94 13.3. Power-fail Reset...................................................................................................................................94 13.4. External Reset ......................................................................................................................................95 13.5. Missing Clock Detector Reset .............................................................................................................95 13.6. Comparator 0 Reset .............................................................................................................................95 13.7. External CNVSTR Pin Reset ...............................................................................................................95 13.8. Watchdog Timer Reset ........................................................................................................................95 Figure 13.3. WDTCN: Watchdog Timer Control Register ...............................................................................96 Figure 13.4. RSTSRC: Reset Source Register...................................................................................................97 Table 13.1. Reset Electrical Characteristics ......................................................................................................98 14. OSCILLATOR .................................................................................................................... 99 N ot R ec Figure 14.1. Oscillator Diagram ........................................................................................................................99 Figure 14.2. OSCICN: Internal Oscillator Control Register ...........................................................................100 Table 14.1. Internal Oscillator Electrical Characteristics ................................................................................100 Figure 14.3. OSCXCN: External Oscillator Control Register .........................................................................101 14.1. External Crystal Example ..................................................................................................................102 14.2. External RC Example ........................................................................................................................102 14.3. External Capacitor Example ..............................................................................................................102 15. PORT INPUT/OUTPUT ................................................................................................... 103 15.1. Priority Cross Bar Decoder ................................................................................................................103 15.2. Port I/O Initialization .........................................................................................................................103 Figure 15.1. Port I/O Functional Block Diagram ............................................................................................104 Figure 15.2. Port I/O Cell Block Diagram .......................................................................................................104 Table 15.1. Crossbar Priority Decode .............................................................................................................105 Figure 15.3. XBR0: Port I/O CrossBar Register 0 ..........................................................................................106 Rev. 1.7 4 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 D es ig ns Figure 15.4. XBR1: Port I/O CrossBar Register 1 ..........................................................................................107 Figure 15.5. XBR2: Port I/O CrossBar Register 2 ..........................................................................................108 15.3. General Purpose Port I/O ...................................................................................................................109 15.4. Configuring Ports Which are not Pinned Out ....................................................................................109 Figure 15.6. P0: Port0 Register .......................................................................................................................109 Figure 15.7. PRT0CF: Port0 Configuration Register ......................................................................................109 Figure 15.8. P1: Port1 Register .......................................................................................................................110 Figure 15.9. PRT1CF: Port1 Configuration Register ......................................................................................110 Figure 15.10. PRT1IF: Port1 Interrupt Flag Register ......................................................................................110 Figure 15.11. P2: Port2 Register .....................................................................................................................111 Figure 15.12. PRT2CF: Port2 Configuration Register ....................................................................................111 Figure 15.13. P3: Port3 Register .....................................................................................................................112 Figure 15.14. PRT3CF: Port3 Configuration Register ....................................................................................112 Table 15.2. Port I/O DC Electrical Characteristics ..........................................................................................112 16. SMBus / I2C Bus................................................................................................................ 113 m en de d fo r N ew Figure 16.1. SMBus Block Diagram ...............................................................................................................113 Figure 16.2. Typical SMBus Configuration ....................................................................................................114 16.1. Supporting Documents ......................................................................................................................114 16.2. Operation ...........................................................................................................................................115 Figure 16.3. SMBus Transaction .....................................................................................................................115 16.3. Arbitration .........................................................................................................................................116 16.4. Clock Low Extension ........................................................................................................................116 16.5. Timeouts ............................................................................................................................................116 16.6. SMBus Special Function Registers....................................................................................................116 Figure 16.4. SMB0CN: SMBus Control Register ............................................................................................118 Figure 16.5. SMB0CR: SMBus Clock Rate Register ......................................................................................119 Figure 16.6. SMB0DAT: SMBus Data Register .............................................................................................120 Figure 16.7. SMB0ADR: SMBus Address Register .......................................................................................120 Figure 16.8. SMB0STA: SMBus Status Register ............................................................................................121 Table 16.1. SMBus Status Codes ....................................................................................................................122 17. SERIAL PERIPHERAL INTERFACE BUS .................................................................. 123 ec om Figure 17.1. SPI Block Diagram .....................................................................................................................123 Figure 17.2. Typical SPI Interconnection ........................................................................................................124 17.1. Signal Descriptions ............................................................................................................................124 17.2. Operation ...........................................................................................................................................125 Figure 17.3. Full Duplex Operation.................................................................................................................125 17.3. Serial Clock Timing ...........................................................................................................................126 Figure 17.4. Data/Clock Timing Diagram .......................................................................................................126 17.4. SPI Special Function Registers ..........................................................................................................127 Figure 17.5. SPI0CFG: SPI Configuration Register ........................................................................................127 Figure 17.6. SPI0CN: SPI Control Register ....................................................................................................128 Figure 17.7. SPI0CKR: SPI Clock Rate Register ............................................................................................129 Figure 17.8. SPI0DAT: SPI Data Register ......................................................................................................129 R 18. UART .................................................................................................................................. 130 N ot Figure 18.1. UART Block Diagram ................................................................................................................130 18.1. UART Operational Modes .................................................................................................................131 Table 18.1. UART Modes ...............................................................................................................................131 Figure 18.2. UART Mode 0 Interconnect........................................................................................................131 Figure 18.3. UART Mode 0 Timing Diagram .................................................................................................131 Figure 18.4. UART Mode 1 Timing Diagram .................................................................................................132 Figure 18.5. UART Modes 1, 2, and 3 Interconnect Diagram ........................................................................133 Figure 18.6. UART Modes 2 and 3 Timing Diagram......................................................................................134 18.2. Multiprocessor Communications .......................................................................................................135 Figure 18.7. UART Multi-Processor Mode Interconnect Diagram .................................................................135 5 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 18.2. Oscillator Frequencies for Standard Baud Rates ..........................................................................136 Figure 18.8. SBUF: Serial (UART) Data Buffer Register ...............................................................................136 Figure 18.9. SCON: Serial Port Control Register............................................................................................137 19. TIMERS ............................................................................................................................. 138 m en de d fo r N ew D es ig ns 19.1. Timer 0 and Timer 1 ..........................................................................................................................138 Figure 19.1. T0 Mode 0 Block Diagram..........................................................................................................139 Figure 19.2. T0 Mode 2 Block Diagram..........................................................................................................140 Figure 19.3. T0 Mode 3 Block Diagram..........................................................................................................141 Figure 19.4. TCON: Timer Control Register...................................................................................................142 Figure 19.5. TMOD: Timer Mode Register.....................................................................................................143 Figure 19.6. CKCON: Clock Control Register ................................................................................................144 Figure 19.7. TL0: Timer 0 Low Byte ..............................................................................................................145 Figure 19.8. TL1: Timer 1 Low Byte ..............................................................................................................145 Figure 19.9. TH0: Timer 0 High Byte .............................................................................................................145 Figure 19.10. TH1: Timer 1 High Byte ...........................................................................................................145 19.2. Timer 2 ..............................................................................................................................................146 Figure 19.11. T2 Mode 0 Block Diagram........................................................................................................147 Figure 19.12. T2 Mode 1 Block Diagram........................................................................................................148 Figure 19.13. T2 Mode 2 Block Diagram........................................................................................................149 Figure 19.14. T2CON: Timer 2 Control Register............................................................................................150 Figure 19.15. RCAP2L: Timer 2 Capture Register Low Byte ........................................................................151 Figure 19.16. RCAP2H: Timer 2 Capture Register High Byte .......................................................................151 Figure 19.17. TL2: Timer 2 Low Byte ............................................................................................................151 Figure 19.18. TH2: Timer 2 High Byte ...........................................................................................................151 19.3. Timer 3 ..............................................................................................................................................152 Figure 19.19. Timer 3 Block Diagram.............................................................................................................152 Figure 19.20. TMR3CN: Timer 3 Control Register ........................................................................................152 Figure 19.21. TMR3RLL: Timer 3 Reload Register Low Byte ......................................................................153 Figure 19.22. TMR3RLH: Timer 3 Reload Register High Byte .....................................................................153 Figure 19.23. TMR3L: Timer 3 Low Byte ......................................................................................................153 Figure 19.24. TMR3H: Timer 3 High Byte .....................................................................................................153 20. PROGRAMMABLE COUNTER ARRAY ..................................................................... 154 N ot R ec om Figure 20.1. PCA Block Diagram ...................................................................................................................154 20.1. Capture/Compare Modules ................................................................................................................155 Table 20.1. PCA0CPM Register Settings for PCA Capture/Compare Modules .............................................155 Figure 20.2. PCA Interrupt Block Diagram.....................................................................................................155 Figure 20.3. PCA Capture Mode Diagram ......................................................................................................156 Figure 20.4. PCA Software Timer Mode Diagram..........................................................................................157 Figure 20.5. PCA High Speed Output Mode Diagram ....................................................................................157 Figure 20.6. PCA PWM Mode Diagram .........................................................................................................158 20.2. PCA Counter/Timer ...........................................................................................................................159 Table 20.2. PCA Timebase Input Options .......................................................................................................159 Figure 20.7. PCA Counter/Timer Block Diagram ...........................................................................................159 20.3. Register Descriptions for PCA ..........................................................................................................160 Figure 20.8. PCA0CN: PCA Control Register .................................................................................................160 Figure 20.9. PCA0MD: PCA Mode Register ..................................................................................................161 Figure 20.10. PCA0CPMn: PCA Capture/Compare Registers ........................................................................162 Figure 20.11. PCA0L: PCA Counter/Timer Low Byte ...................................................................................163 Figure 20.12. PCA0H: PCA Counter/Timer High Byte ..................................................................................163 Figure 20.13. PCA0CPLn: PCA Capture Module Low Byte ..........................................................................163 Figure 20.14. PCA0CPHn: PCA Capture Module High Byte .........................................................................163 21. JTAG (IEEE 1149.1) ......................................................................................................... 164 Figure 21.1. IR: JTAG Instruction Register ....................................................................................................164 21.1. Boundary Scan ...................................................................................................................................165 Rev. 1.7 6 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 N ot R ec om m en de d fo r N ew D es ig ns Table 21.1. Boundary Data Register Bit Definitions .......................................................................................165 Figure 21.2. DEVICEID: JTAG Device ID Register ......................................................................................166 21.2. Flash Programming Commands .........................................................................................................167 Figure 21.3. FLASHCON: JTAG Flash Control Register ...............................................................................168 Figure 21.4. FLASHADR: JTAG Flash Address Register ..............................................................................168 Figure 21.5. FLASHDAT: JTAG Flash Data Register....................................................................................169 Figure 21.6. FLASHSCL: JTAG Flash Scale Register ...................................................................................169 21.3. Debug Support ...................................................................................................................................170 7 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1. SYSTEM OVERVIEW es ig ns The C8051F000 family are fully integrated mixed-signal System on a Chip MCUs with a true 12-bit multi-channel ADC (F000/01/02/05/06/07), or a true 10-bit multi-channel ADC (F010/11/12/15/16/17). See the Product Selection Guide in Table 1.1 for a quick reference of each MCUs’ feature set. Each has a programmable gain pre-amplifier, two 12-bit DACs, two voltage comparators (except for the F002/07/12/17, which have one), a voltage reference, and an 8051-compatible microcontroller core with 32kbytes of FLASH memory. There are also I2C/SMBus, UART, and SPI serial interfaces implemented in hardware (not “bit-banged” in user software) as well as a Programmable Counter/Timer Array (PCA) with five capture/compare modules. There are also 4 general-purpose 16-bit timers and 4 byte-wide general-purpose digital Port I/O. The C8051F000/01/02/10/11/12 have 256 bytes of RAM and execute up to 20MIPS, while the C8051F005/06/07/15/16/17 have 2304 bytes of RAM and execute up to 25MIPS. N ew D With an on-board VDD monitor, WDT, and clock oscillator, the MCUs are truly stand-alone System-on-a-Chip solutions. Each MCU effectively configures and manages the analog and digital peripherals. The FLASH memory can be reprogrammed even in-circuit, providing non-volatile data storage, and also allowing field upgrades of the 8051 firmware. Each MCU can also individually shut down any or all of the peripherals to conserve power. fo r On-board JTAG debug support allows non-intrusive (uses no on-chip resources), full speed, in-circuit debug using the production MCU installed in the final application. This debug system supports inspection and modification of memory and registers, setting breakpoints, watchpoints, single stepping, and run and halt commands. All analog and digital peripherals are fully functional when using JTAG debug. m en de d Each MCU is specified for 2.7V-to-3.6V operation over the industrial temperature range (-45C to +85C). The Port I/Os, /RST, and JTAG pins are tolerant for input signals up to 5V. The C8051F000/05/10/15 are available in the 64-pin TQFP (see block diagram in Figure 1.1). The C8051F001/06/11/16 are available in the 48-pin TQFP (see block diagram in Figure 1.2). The C8051F002/07/12/17 are available in the 32-pin LQFP (see block diagram in Figure 1.3). C8051F001 20 32k 256    4  16 12 100 8   12 2 2 48TQFP C8051F002 20 32k 256    4  8 12 100 4   12 2 1 32LQFP C8051F005 25 32k 2304    4  32 12 100 8   12 2 2 64TQFP C8051F006 25 32k 2304    4  16 12 100 8   12 2 2 48TQFP C8051F007 25 32k 2304    4  8 12 100 4   12 2 1 32LQFP C8051F010 20 32k 256    4  32 10 100 8   12 2 2 64TQFP C8051F011 20 32k 256    4  16 10 100 8   12 2 2 48TQFP C8051F012 20 32k 256    4  8 10 100 4   12 2 1 32LQFP C8051F015 25 32k 2304    4  32 10 100 8   12 2 2 64TQFP C8051F016 25 32k 2304    4  16 10 100 8   12 2 2 48TQFP C8051F017 25 32k 2304    4  8 10 100 4   12 2 1 32LQFP Rev. 1.7 MIPS (Peak) ec R N ot 12 100 8   12 2 2 Package 32 Voltage Comparators  DAC Outputs 4 DAC Resolution  Temperature Sensor Programmable Counter Array  Voltage Reference Timers (16-bit)  ADC Inputs UART 256 ADC Max Speed (ksps) SPI 32k ADC Resolution (bits) SMBus/I2C 20 Digital Port I/O’s RAM C8051F000 om FLASH Memory Table 1.1. Product Selection Guide 64TQFP 8 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 1.1. C8051F000/05/10/15 Block Diagram Digital Power AV+ AV+ AGND AGND Analog Power UART SMBus SPI Bus PCA Debug HW Reset /RST VDD Monitor VREF 2048 byte XRAM System Clock C o r e SFR Bus om ec R N ot 9 Port 1 Latch Port 2 Latch DAC0 (12-Bit) DAC0 Port 0 Latch (F005/15 only) m en de d Internal Oscillator VREF Timer 3 256 byte RAM WDT External Oscillator Circuit XTAL1 XTAL2 32kbyte FLASH 8 0 5 1 D Boundary Scan Timers 0,1,2 N ew JTAG Logic fo r TCK TMS TDI TDO C R O S S B A R es ig ns VDD VDD VDD DGND DGND DGND Rev. 1.7 Port 3 Latch S W I T C H C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 1.2. C8051F001/06/11/16 Block Diagram VDD VDD DGND DGND DGND DGND Digital Power SMBus AV+ AV+ AGND AGND SPI Bus Analog Power PCA Debug HW Reset /RST VDD Monitor External Oscillator Circuit XTAL1 XTAL2 VREF VREF 256 byte RAM 2048 byte XRAM WDT (F006/16 only) System Clock C o r e Timer 3 Port 0 Latch Port 1 Latch Port 2 Latch S W I T C H SFR Bus m en de d Internal Oscillator 8 0 5 1 D Boundary Scan Timers 0,1,2 N ew JTAG Logic fo r TCK TMS TDI TDO 32kbyte FLASH C R O S S B A R es ig ns UART Port 3 Latch DAC0 (12-Bit) N ot R ec om DAC0 Rev. 1.7 10 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 1.3. C8051F002/07/12/17 Block Diagram VDD VDD Digital Power DGND DGND SMBus AV+ AV+ AGND AGND SPI Bus Analog Power PCA Debug HW Reset /RST VDD Monitor VREF 2048 byte XRAM (F007/17 only) System Clock C o r e N ot R ec om DAC1 11 Port 0 Latch Port 1 Latch SFR Bus DAC0 (12-Bit) DAC0 Timer 3 Port 2 Latch m en de d Internal Oscillator VREF 256 byte RAM WDT External Oscillator Circuit XTAL1 XTAL2 8 0 5 1 D Boundary Scan Timers 0,1,2 N ew JTAG Logic fo r TCK TMS TDI TDO 32kbyte FLASH Rev. 1.7 C R O S S B A R es ig ns UART Port 3 Latch S W I T C H C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1.1. CIP-51TM CPU 1.1.1. Fully 8051 Compatible 1.1.2. es ig ns The C8051F000 family utilizes Silicon Laboratories’ proprietary CIP-51 microcontroller core. The CIP-51 is fully compatible with the MCS-51TM instruction set. Standard 803x/805x assemblers and compilers can be used to develop software. The core has all the peripherals included with a standard 8052, including four 16-bit counter/timers, a full-duplex UART, 256 bytes of internal RAM space, 128 byte Special Function Register (SFR) address space, and four byte-wide I/O Ports. Improved Throughput N ew D The CIP-51 employs a pipelined architecture that greatly increases its instruction throughput over the standard 8051 architecture. In a standard 8051, all instructions except for MUL and DIV take 12 or 24 system clock cycles to execute with a maximum system clock of 12-to-24MHz. By contrast, the CIP-51 core executes 70% of its instructions in one or two system clock cycles, with only four instructions taking more than four system clock cycles. The CIP-51 has a total of 109 instructions. The number of instructions versus the system clock cycles to execute them is as follows: 26 1 50 2 5 2/3 14 3 7 3/4 3 4 1 4/5 2 5 1 8 fo r Instructions Clocks to Execute With the CIP-51’s maximum system clock at 25MHz, it has a peak throughput of 25MIPS. Figure 1.4 shows a comparison of peak throughputs of various 8-bit microcontroller cores with their maximum system clocks. m en de d Figure 1.4. Comparison of Peak MCU Execution Speeds 25 MIPS 20 15 5 Silicon Labs Microchip CIP-51 PIC17C75x (25MHz clk) (33MHz clk) Philips 80C51 (33MHz clk) ADuC812 8051 (16MHz clk) N ot R ec om 10 Rev. 1.7 12 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1.1.3. Additional Features The C8051F000 MCU family has several key enhancements both inside and outside the CIP-51 core to improve its overall performance and ease of use in the end applications. es ig ns The extended interrupt handler provides 21 interrupt sources into the CIP-51 (as opposed to 7 for the standard 8051), allowing the numerous analog and digital peripherals to interrupt the controller. An interrupt driven system requires less intervention by the MCU, giving it more effective throughput. The extra interrupt sources are very useful when building multi-tasking, real-time systems. N ew D There are up to seven reset sources for the MCU: an on-board VDD monitor, a Watchdog Timer, a missing clock detector, a voltage level detection from Comparator 0, a forced software reset, the CNVSTR pin, and the /RST pin. The /RST pin is bi-directional, accommodating an external reset, or allowing the internally generated POR to be output on the /RST pin. Each reset source except for the VDD monitor and Reset Input Pin may be disabled by the user in software. The WDT may be permanently enabled in software after a power-on reset during MCU initialization. fo r The MCU has an internal, stand alone clock generator which is used by default as the system clock after any reset. If desired, the clock source may be switched on the fly to the external oscillator, which can use a crystal, ceramic resonator, capacitor, RC, or external clock source to generate the system clock. This can be extremely useful in low power applications, allowing the MCU to run from a slow (power saving) external crystal source, while periodically switching to the fast (up to 16MHz) internal oscillator as needed. Figure 1.5. On-Board Clock and Reset VDD CNVSTR m en de d (Port I/O) Supply Monitor Crossbar (CNVSTR reset enable) + - Supply Reset Timeout (wired-OR) Comparator 0 CP0+ + - CP0- (CP0 reset enable) MCD Enable om System Clock XTAL1 Clock Select Software Reset CIP-51 Microcontroller Core Extended Interrupt Handler N ot R ec XTAL2 OSC 13 PRE WDT Enable EN EN Internal Clock Generator WDT WDT Strobe Missing Clock Detector (oneshot) Rev. 1.7 System Reset Reset Funnel /RST C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1.2. On-Board Memory es ig ns The CIP-51 has a standard 8051 program and data address configuration. It includes 256 bytes of data RAM, with the upper 128 bytes dual-mapped. Indirect addressing accesses the upper 128 bytes of general purpose RAM, and direct addressing accesses the 128 byte SFR address space. The lower 128 bytes of RAM are accessible via direct and indirect addressing. The first 32 bytes are addressable as four banks of general-purpose registers, and the next 16 bytes can be byte addressable or bit addressable. The CIP-51 in the C8051F005/06/07/15/16/17 MCUs additionally has a 2048 byte RAM block in the external data memory address space. This 2048 byte block can be addressed over the entire 64k external data memory address range (see Figure 1.6). N ew D The MCU’s program memory consists of 32k + 128 bytes of FLASH. This memory may be reprogrammed insystem in 512 byte sectors, and requires no special off-chip programming voltage. The 512 bytes from addresses 0x7E00 to 0x7FFF are reserved for factory use. There is also a single 128-byte sector at address 0x8000 to 0x807F, which may be useful as a small table for software constants or as additional program space. See Figure 1.6 for the MCU system memory map. Figure 1.6. On-Board Memory Map 0x7FFF 0x7E00 0x7DFF 128 Byte ISP FLASH DATA MEMORY INTERNAL DATA ADDRESS SPACE 0xFF RESERVED 0x80 0x7F Upper 128 RAM (Indirect Addressing Only) (Direct and Indirect Addressing) 0x30 0x2F m en de d FLASH (In-System Programmable in 512 Byte Sectors) 0x20 0x1F 0x00 0x0000 Special Function Register's (Direct Addressing Only) fo r PROGRAM MEMORY 0x807F 0x8000 Bit Addressable Lower 128 RAM (Direct and Indirect Addressing) General Purpose Registers EXTERNAL DATA ADDRESS SPACE 0x17FF (same 2048 byte RAM block ) 0x1000 0x0FFF (same 2048 byte RAM block ) 0x0800 0x07FF 0x0000 The same 2048 byte RAM block can be addressed on 2k boundaries throughout the 64k External Data Memory space. RAM - 2048 Bytes (accessable using MOVX instruction) N ot R ec om 0xFFFF (same 2048 byte RAM block ) 0xF800 Rev. 1.7 14 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1.3. JTAG Debug and Boundary Scan es ig ns The C8051F000 family has on-chip JTAG and debug circuitry that provide non-intrusive, full speed, in-circuit debug using the production part installed in the end application using the four-pin JTAG I/F. The JTAG port is fully compliant to IEEE 1149.1, providing full boundary scan for test and manufacturing purposes. Silicon Labs’ debug system supports inspection and modification of memory and registers, breakpoints, watchpoints, a stack monitor, and single stepping. No additional target RAM, program memory, timers, or communications channels are required. All the digital and analog peripherals are functional and work correctly while debugging. All the peripherals (except for the ADC) are stalled when the MCU is halted, during single stepping, or at a breakpoint in order to keep them in sync. fo r N ew D The C8051F000DK, C8051F005DK, C8051F010DK, and C8051F015DK are development kits with all the hardware and software necessary to develop application code and perform in-circuit debug with the C8051F000/1/2, F005/6/7, F010/1/2, and F015/6/7 MCUs respectively. The kit includes software with a developer’s studio and debugger, an integrated 8051 assembler, and an RS-232 to JTAG protocol translator module referred to as the EC. It also has a target application board with the associated MCU installed and a large prototyping area, plus the RS232 and JTAG cables, and wall-mount power supply. The Development Kit requires a Windows 95/98/NT/2000/XP computer with one available RS-232 serial port. As shown in Figure 1.7, the PC is connected via RS-232 to the EC. A six-inch ribbon cable connects the EC to the user’s application board, picking up the four JTAG pins and VDD and GND. The EC takes its power from the application board. It requires roughly 20mA at 2.7-3.6V. For applications where there is not sufficient power available from the target board, the provided power supply can be connected directly to the EC. m en de d This is a vastly superior configuration for developing and debugging embedded applications compared to standard MCU Emulators, which use on-board “ICE Chips” and target cables and require the MCU in the application board to be socketed. Silicon Labs’ debug environment both increases ease of use and preserves the performance of the precision analog peripherals. Figure 1.7. Debug Environment Diagram Silicon Labs Integrated Development Environment WINDOWS 95/98/NT/2000/XP RS-232 JTAG (x4), VDD, GND TARGET PCB VDD GND C8051 F005 N ot R ec om EC 15 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1.4. Programmable Digital I/O and Crossbar es ig ns The standard 8051 Ports (0, 1, 2, and 3) are available on the MCUs. All four ports are pinned out on the F000/05/10/15. Ports 0 and 1 are pinned out on the F001/06/11/16, and only Port 0 is pinned out on the F002/07/12/17. The Ports not pinned out are still available for software use as general purpose registers. The Port I/O behave like the standard 8051 with a few enhancements. Each Port I/O pin can be configured as either a push-pull or open-drain output. Also, the “weak pull-ups” which are normally fixed on an 8051 can be globally disabled, providing additional power saving capabilities for low power applications. D Perhaps the most unique enhancement is the Digital Crossbar. This is essentially a large digital switching network that allows mapping of internal digital system resources to Port I/O pins on P0, P1, and P2. (See Figure 1.8.) Unlike microcontrollers with standard multiplexed digital I/O, all combinations of functions are supported. N ew The on-board counter/timers, serial buses, HW interrupts, ADC Start of Conversion input, comparator outputs, and other digital signals in the controller can be configured to appear on the Port I/O pins specified in the Crossbar Control registers. This allows the user to select the exact mix of general purpose Port I/O and digital resources needed for his particular application. Highest Priority 2 SMBus 4 XBR0, XBR1, XBR2 Registers PRT0CF, PRT1CF, PRT2CF Registers 2 UART Lowest Priority 6 PCA 8 Comptr. Outputs 2 T0, T1, T2 6 8 om 8 (P0.0-P0.7) P0.0 Highest Priority P0.7 P1 I/O Cells P1.0 P2 I/O Cells P2.0 CNVSTR 8 P1.7 P2.7 Lowest Priority 8 P1 Port Latches (P1.0-P1.7) PRT3CF Register 8 P2 (P2.0-P2.7) P3 I/O Cells 8 P3 (P3.0-P3.7) P3.0 P3.7 N ot R ec P0 I/O Cells Digital Crossbar SYSCLK P0 External Pins Priority Decoder m en de d (Internal Digital Signals) SPI fo r Figure 1.8. Digital Crossbar Diagram Rev. 1.7 16 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1.5. Programmable Counter Array es ig ns The C8051F000 MCU family has an on-board Programmable Counter/Timer Array (PCA) in addition to the four 16-bit general-purpose counter/timers. The PCA consists of a dedicated 16-bit counter/timer timebase with 5 programmable capture/compare modules. The timebase gets its clock from one of four sources: the system clock divided by 12, the system clock divided by 4, Timer 0 overflow, or an External Clock Input (ECI). Each capture/compare module can be configured to operate in one of four modes: Edge-Triggered Capture, Software Timer, High Speed Output, or Pulse Width Modulator. The PCA Capture/Compare Module I/O and External Clock Input are routed to the MCU Port I/O via the Digital Crossbar. D Figure 1.9. PCA Block Diagram /4 System Clock /12 Capture/Compare Module 1 Capture/Compare Module 2 Capture/Compare Module 3 Capture/Compare Module 4 m en de d CEX4 CEX3 CEX2 CEX1 CEX0 ECI fo r Capture/Compare Module 0 N ew 16-Bit Counter/Timer T0 Overflow Crossbar ec om Port I/O Serial Ports R 1.6. N ot The C8051F000 MCU Family includes a Full-Duplex UART, SPI Bus, and I2C/SMBus. Each of the serial buses is fully implemented in hardware and makes extensive use of the CIP-51’s interrupts, thus requiring very little intervention by the CPU. The serial buses do not “share” resources such as timers, interrupts, or Port I/O, so any or all of the serial buses may be used together. 17 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1.7. Analog to Digital Converter es ig ns The C8051F000/1/2/5/6/7 has an on-chip 12-bit SAR ADC with a 9-channel input multiplexer and programmable gain amplifier. With a maximum throughput of 100ksps, the ADC offers true 12-bit accuracy with an INL of 1LSB. The ADC in the C8051F010/1/2/5/6/7 is similar, but with 10-bit resolution. Each ADC has a maximum throughput of 100ksps. Each ADC has an INL of 1LSB, offering true 12-bit accuracy with the C8051F00x, and true 10-bit accuracy with the C8051F01x. There is also an on-board 15ppm voltage reference, or an external reference may be used via the VREF pin. D The ADC is under full control of the CIP-51 microcontroller via the Special Function Registers. One input channel is tied to an internal temperature sensor, while the other eight channels are available externally. Each pair of the eight external input channels can be configured as either two single-ended inputs or a single differential input. The system controller can also put the ADC into shutdown to save power. N ew A programmable gain amplifier follows the analog multiplexer. The gain can be set in software from 0.5 to 16 in powers of 2. The gain stage can be especially useful when different ADC input channels have widely varied input voltage signals, or when it is necessary to “zoom in” on a signal with a large DC offset (in differential mode, a DAC could be used to provide the DC offset). fo r Conversions can be started in four ways; a software command, an overflow on Timer 2, an overflow on Timer 3, or an external signal input. This flexibility allows the start of conversion to be triggered by software events, external HW signals, or convert continuously. A completed conversion causes an interrupt, or a status bit can be polled in software to determine the end of conversion. The resulting 10 or 12-bit data word is latched into two SFRs upon completion of a conversion. The data can be right or left justified in these registers under software control. m en de d Compare registers for the ADC data can be configured to interrupt the controller when ADC data is within a specified window. The ADC can monitor a key voltage continuously in background mode, but not interrupt the controller unless the converted data is within the specified window. Figure 1.10. ADC Diagram AIN0 + AIN1 - AIN2 + AIN3 - AIN5 AIN6 + AIN7 - om ec R N ot REF Programmable Gain Amp 9-to-1 AMUX (SE or - DIFF) AIN4 VREF + X + - 100ksps SAR ADC (not bonded out on F002, F007, F012, and F017 TEMP SENSOR Control & Data SFR's Rev. 1.7 SFR Bus 18 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1.8. Comparators and DACs es ig ns The C8051F000 MCU Family has two 12-bit DACs and two comparators on chip (the second comparator, CP1, is not bonded out on the F002, F007, F012, and F017). The MCU data and control interface to each comparator and DAC is via the Special Function Registers. The MCU can place any DAC or comparator in low power shutdown mode. The comparators have software programmable hysteresis. Each comparator can generate an interrupt on its rising edge, falling edge, or both. The comparators’ output state can also be polled in software. These interrupts are capable of waking up the MCU from idle mode. The comparator outputs can be programmed to appear on the Port I/O pins via the Crossbar. CP0 (Port I/O) CP1 CROSSBAR CP0+ + CP0- - CP0 fo r (Port I/O) N ew Figure 1.11. Comparator and DAC Diagram D The DACs are voltage output mode and use the same voltage reference as the ADC. They are especially useful as references for the comparators or offsets for the differential inputs of the ADC. m en de d (not bonded out on F002, F007, F012, and F017) CP1+ + CP1 CP1- - REF ec om DAC0 DAC0 REF DAC1 N ot R DAC1 19 Rev. 1.7 CP0 CP1 SFR's (Data and Cntrl) CIP-51 and Interrupt Handler C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 2. ABSOLUTE MAXIMUM RATINGS* D es ig ns Ambient temperature under bias................................................................................................................. -55 to 125C Storage Temperature .................................................................................................................................. -65 to 150C Voltage on any Pin (except VDD and Port I/O) with respect to DGND ................................... -0.3V to (VDD + 0.3V) Voltage on any Port I/O Pin or /RST with respect to DGND ....................................................................-0.3V to 5.8V Voltage on VDD with respect to DGND ...................................................................................................-0.3V to 4.2V Maximum Total current through VDD, AV+, DGND and AGND ..................................................................... 800mA Maximum output current sunk by any Port pin ................................................................................................... 100mA Maximum output current sunk by any other I/O pin ............................................................................................. 25mA Maximum output current sourced by any Port pin .............................................................................................. 100mA Maximum output current sourced by any other I/O pin ........................................................................................ 25mA 3. N ew *Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. GLOBAL DC ELECTRICAL CHARACTERISTICS MIN 2.7 2.7 TYP 3.0 1 MAX 3.6 2 UNITS V mA 5 20 A 0.5 V 3.6 V mA mA A A 3.0 12.5 0.5 10 5 1.5 V -40 +85 C 0 25 MHz 0 20 MHz 18 18 ns ns N ot R ec om m en de d fo r -40C to +85C unless otherwise specified. PARAMETER CONDITIONS Analog Supply Voltage (Note 1) Analog Supply Current Internal REF, ADC, DAC, Comparators all active Analog Supply Current with Internal REF, ADC, DAC, Comparators analog sub-systems inactive all disabled, oscillator disabled Analog-to-Digital Supply Delta ( | VDD – AV+ | ) Digital Supply Voltage Digital Supply Current with VDD = 2.7V, Clock=25MHz CPU active VDD = 2.7V, Clock=1MHz VDD = 2.7V, Clock=32kHz Digital Supply Current Oscillator not running (shutdown) Digital Supply RAM Data Retention Voltage Specified Operating Temperature Range SYSCLK (System Clock C8051F005/6/7, C8051F015/6/7 Frequency) (Note 2) SYSCLK (System Clock C8051F000/1/2, C8051F010/1/2 Frequency) (Note 2) Tsysl (SYSCLK Low Time) Tsysh (SYSCLK High Time) Note 1: Analog Supply AV+ must be greater than 1V for VDD monitor to operate. Note 2: SYSCLK must be at least 32 kHz to enable debugging. Rev. 1.7 20 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 4. PINOUT AND PACKAGE DEFINITIONS Table 4.1. Pin Definitions F002 F007 F012 F017 31, 40, 62 30, 41, 61 23, 32 18, 20 Digital Voltage Supply. 17, 21 Digital Ground. 9, 29 8, 30 14 13 15 Positive Analog Voltage Supply. TCK TMS TDI 16, 17 5, 15 22 21 28 22, 33, 27, 19 13, 43 44, 12 18 17 20 D In D In D In TDO 29 21 16 D Out XTAL1 18 14 10 A In XTAL2 19 15 11 A Out /RST 20 16 12 D I/O VREF 6 3 3 A I/O CP0+ CP0CP1+ CP1DAC0 4 3 2 1 64 2 1 45 46 48 2 1 32 A A A A A 63 47 ec 31 A Out AIN0 7 4 4 A In AIN1 8 5 5 A In AIN2 9 6 6 A In AIN3 10 7 7 A In AIN4 11 8 A In AIN5 12 9 A In AV+ N ot DAC1 21 om AGND Analog Ground. In In In In Out N ew DGND Description JTAG Test Clock with internal pull-up. JTAG Test-Mode Select with internal pull-up. JTAG Test Data Input with internal pull-up. TDI is latched on a rising edge of TCK. JTAG Test Data Output with internal pull-up. Data is shifted out on TDO on the falling edge of TCK. TDO output is a tri-state driver. Crystal Input. This pin is the return for the internal oscillator circuit for a crystal or ceramic resonator. For a precision internal clock, connect a crystal or ceramic resonator from XTAL1 to XTAL2. If overdriven by an external CMOS clock, this becomes the system clock. Crystal Output. This pin is the excitation driver for a crystal or ceramic resonator. Chip Reset. Open-drain output of internal Voltage Supply monitor. Is driven low when VDD is < 2.7V. An external source can force a system reset by driving this pin low. Voltage Reference. When configured as an input, this pin is the voltage reference for the MCU. Otherwise, the internal reference drives this pin. Comparator 0 Non-Inverting Input. Comparator 0 Inverting Input. Comparator 1 Non-Inverting Input. Comparator 1 Inverting Input. Digital to Analog Converter Output 0. The DAC0 voltage output. (See Section 7 DAC Specification for complete description). Digital to Analog Converter Output 1. The DAC1 voltage output. (See Section 7 DAC Specification for complete description). Analog Mux Channel Input 0. (See ADC Specification for complete description). Analog Mux Channel Input 1. (See ADC Specification for complete description). Analog Mux Channel Input 2. (See ADC Specification for complete description). Analog Mux Channel Input 3. (See ADC Specification for complete description). Analog Mux Channel Input 4. (See ADC Specification for complete description). Analog Mux Channel Input 5. (See ADC Specification for complete description). fo r VDD Type m en de d Name D F001 F006 F011 F016 R es ig ns Pin Numbers F000 F005 F010 F015 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Pin Numbers 13 10 A In AIN7 14 11 A In P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 39 42 47 48 49 50 55 56 38 37 36 35 34 32 60 59 33 27 54 53 52 51 44 43 26 25 24 23 58 57 46 45 31 34 35 36 37 38 39 40 30 29 28 26 25 24 42 41 D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O Analog Mux Channel Input 6. (See ADC Specification for complete description). Analog Mux Channel Input 7. (See ADC Specification for complete description). Port0 Bit0. (See the Port I/O Sub-System section for complete description). Port0 Bit1. (See the Port I/O Sub-System section for complete description). Port0 Bit2. (See the Port I/O Sub-System section for complete description). Port0 Bit3. (See the Port I/O Sub-System section for complete description). Port0 Bit4. (See the Port I/O Sub-System section for complete description). Port0 Bit5. (See the Port I/O Sub-System section for complete description). Port0 Bit6. (See the Port I/O Sub-System section for complete description). Port0 Bit7. (See the Port I/O Sub-System section for complete description). Port1 Bit0. (See the Port I/O Sub-System section for complete description). Port1 Bit1. (See the Port I/O Sub-System section for complete description). Port1 Bit2. (See the Port I/O Sub-System section for complete description). Port1 Bit3. (See the Port I/O Sub-System section for complete description). Port1 Bit4. (See the Port I/O Sub-System section for complete description). Port1 Bit5. (See the Port I/O Sub-System section for complete description). Port1 Bit6. (See the Port I/O Sub-System section for complete description). Port1 Bit7. (See the Port I/O Sub-System section for complete description). Port2 Bit0. (See the Port I/O Sub-System section for complete description). Port2 Bit1. (See the Port I/O Sub-System section for complete description). Port2 Bit2. (See the Port I/O Sub-System section for complete description). Port2 Bit3. (See the Port I/O Sub-System section for complete description). Port2 Bit4. (See the Port I/O Sub-System section for complete description). Port2 Bit5. (See the Port I/O Sub-System section for complete description). Port2 Bit6. (See the Port I/O Sub-System section for complete description). Port2 Bit7. (See the Port I/O Sub-System section for complete description). Port3 Bit0. (See the Port I/O Sub-System section for complete description). Port3 Bit1. (See the Port I/O Sub-System section for complete description). Port3 Bit2. (See the Port I/O Sub-System section for complete description). Port3 Bit3. (See the Port I/O Sub-System section for complete description). Port3 Bit4. (See the Port I/O Sub-System section for complete description). Port3 Bit5. (See the Port I/O Sub-System section for complete description). Port3 Bit6. (See the Port I/O Sub-System section for complete description). Port3 Bit7. (See the Port I/O Sub-System section for complete description). N ot R ec om m en de d 19 22 23 24 25 26 27 28 Description es ig ns AIN6 Type D F002 F007 F012 F017 N ew F001 F006 F011 F016 Name fo r F000 F005 F010 F015 Rev. 1.7 22 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 1 48 P0.3 2 47 CP0- 3 46 P0.2 P3.6 CP0+ 4 45 P3.7 AGND VRE F 5 44 P2.6 AIN0 7 AIN1 8 AIN2 9 AIN3 10 AIN4 11 AIN5 12 AIN6 13 AIN7 14 AGND AV+ 15 43 42 41 32 31 30 29 fo r 28 27 26 25 24 23 22 21 20 19 18 AV+ XTAL1 XTAL2 /RST TM S TCK P3.3 P3.2 P3.1 P3.0 P2.1 TDI TDO DGND VD D P1.5 17 m en de d om ec R N ot 23 40 D 39 P0.0 38 P1.0 37 P1.1 36 P1.2 P1.3 35 16 Rev. 1.7 P2.7 P0.1 DGND VD N ew C8051F000 C8051F005 C8051F010 C8051F015 6 D CP1CP1+ es ig ns 49 50 51 52 P2.2 P2.3 P2.4 P2.5 P0.5 P0.4 53 54 55 56 57 58 59 60 61 62 63 64 DAC 0 DAC 1 VD D DGND P1.6 P1.7 P3.4 P3.5 P0.7 P0.6 Figure 4.1. TQFP-64 Pinout Diagram 34 33 P1.4 P2.0 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 4.2. TQFP-64 Package Drawing es ig ns D D1 - - D MIN NOM (mm) (mm) ( A - N ew A1 0.05 E1 E A2 0.95 - fo r b 0.17 0.22 PIN 1 DESIGNATOR m en de d 64 1 e - 12.00 D1 - 10.00 e - 0.50 E 12 00 N ot R ec om A2 D Rev. 1.7 24 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 CP1- CP1+ AGND AV+ P1.6 P1.7 P0.7 P0.6 P0.5 P0.4 46 45 44 43 42 41 40 39 38 37 es ig ns DAC1 47 23 24 VDD P1.5 ec R N ot 25 36 P0.3 35 P0.2 34 P0.1 33 DGND 32 VDD D DAC0 N ew 12 22 AGND DGND 11 21 AIN7 TDO 10 fo r AIN6 20 9 TDI AIN5 19 8 DGND AIN4 18 7 TCK AIN3 17 6 TMS AIN2 C8051F001 C8051F006 C8051F011 C8051F016 16 5 /RST AIN1 15 4 XTAL2 AIN0 14 3 m en de d VREF XTAL1 2 13 CP0+ AV+ 1 om CP0- 48 Figure 4.3. TQFP-48 Pinout Diagram Rev. 1.7 31 P0.0 30 P1.0 29 P1.1 28 P1.2 27 DGND 26 P1.3 25 P1.4 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 4.4. TQFP-48 Package Drawing D A E1 E - es ig ns MIN NOM MAX (mm) (mm) (mm) D1 A1 0.05 - 1.20 - 0.15 48 1 fo r PIN 1 IDENTIFIER 0.17 0.22 0.27 N ew b D A2 0.95 1.00 1.05 e A2 D - 9.00 - D1 - 7.00 - e - 0.50 - E - 9.00 - E1 - 7.00 - m en de d A A1 N ot R ec om b Rev. 1.7 26 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 27 DAC1 AGND AV+ P0.7 P0.6 P0.5 P0.4 31 30 29 28 27 26 25 es ig ns DAC0 D N ew 15 16 TDO N ot R ec TDI 8 fo r AGND 14 7 TCK AIN3 13 6 TMS AIN2 12 5 /RST AIN1 11 4 XTAL2 AIN0 C8051F002 C8051F007 C8051F012 C8051F017 10 3 XTAL1 VREF 9 2 m en de d CP0+ 24 AV+ 1 om CP0- 32 Figure 4.5. LQFP-32 Pinout Diagram Rev. 1.7 P0.3 23 P0.2 22 P0.1 21 DGND 20 VDD 19 P0.0 18 VDD 17 DGND C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 4.6. LQFP-32 Package Drawing es ig ns D MIN NOM MAX (mm) (mm) (mm) D1 A - E1 E 1 fo r A2 m en de d A D - 9.00 - D1 - 7.00 - e - 0.80 - E - 9.00 - E1 - 7.00 - N ot R ec om b A1 e 0.15 0.30 0.37 0.45 N ew PIN 1 IDENTIFIER - A2 1.35 1.40 1.45 b 32 1.60 D A1 0.05 - Rev. 1.7 28 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 5. ADC (12-Bit, C8051F000/1/2/5/6/7 Only) ADC0GTH ADC0GTL ADC0LTH ADC0LTL D Figure 5.1. 12-Bit ADC Functional Block Diagram es ig ns The ADC subsystem for the C8051F000/1/2/5/6/7 consists of a 9-channel, configurable analog multiplexer (AMUX), a programmable gain amplifier (PGA), and a 100ksps, 12-bit successive-approximation-register ADC with integrated track-and-hold and programmable window detector (see block diagram in Figure 5.1). The AMUX, PGA, Data Conversion Modes, and Window Detector are all configurable under software control via the Special Function Register’s shown in Figure 5.1. The ADC subsystem (ADC, track-and-hold and PGA) is enabled only when the ADCEN bit in the ADC Control register (ADC0CN, Figure 5.7) is set to 1. The ADC subsystem is in low power shutdown when this bit is 0. The Bias Enable bit (BIASE) in the REF0CN register (see Figure 9.2) must be set to 1 in order to supply bias to the ADC. 24 + AIN3 AIN5 9-to-1 AMUX + (SE or - DIFF) AIN6 + AIN7 - N ew AIN2 ADCEN AV+ - 12-Bit SAR fo r X + - ADC0CF TMR3 OV T2 OV CNVSTR ADBUSY(w) ADCEN ADCTM ADCINT ADBUSY ADSTM1 ADSTM0 ADWINT ADLJST AMPGN2 AMPGN1 AMPGN0 ADCSC2 ADCSC1 ADCSC0 AIN67IC AIN45IC AIN23IC AIN01IC 5.1. AMX0SL om AMX0CF AMXAD3 AMXAD2 AMXAD1 AMXAD0 TEMP SENSOR AGND 12 ADC AGND m en de d AIN4 ADWINT ADC0L - 12 ADC0H AIN1 AV+ Conversion Start + REF SYSCLK AIN0 COMB LOGIC ADC0CN Analog Multiplexer and PGA N ot R ec Eight of the AMUX channels are available for external measurements while the ninth channel is internally connected to an on-board temperature sensor (temperature transfer function is shown in Figure 5.3). Note that the PGA gain is applied to the temperature sensor reading. AMUX input pairs can be programmed to operate in either the differential or single-ended mode. This allows the user to select the best measurement technique for each input channel, and even accommodates mode changes “on-the-fly”. The AMUX defaults to all single-ended inputs upon reset. There are two registers associated with the AMUX: the Channel Selection register AMX0SL (Figure 5.5), and the Configuration register AMX0CF (Figure 5.4). The table in Figure 5.5 shows AMUX functionality by channel for each possible configuration. The PGA amplifies the AMUX output signal by an amount determined by the AMPGN2-0 bits in the ADC Configuration register, ADC0CF (Figure 5.6). The PGA can be softwareprogrammed for gains of 0.5, 1, 2, 4, 8 or 16. It defaults to unity gain on reset. 29 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 5.2. ADC Modes of Operation es ig ns The ADC uses VREF to determine its full-scale voltage, thus the reference must be properly configured before performing a conversion (see Section 9). The ADC has a maximum conversion speed of 100ksps. The ADC conversion clock is derived from the system clock. Conversion clock speed can be reduced by a factor of 2, 4, 8 or 16 via the ADCSC bits in the ADC0CF Register. This is useful to adjust conversion speed to accommodate different system clock speeds. D A conversion can be initiated in one of four ways, depending on the programmed states of the ADC Start of Conversion Mode bits (ADSTM1, ADSTM0) in ADC0CN. Conversions may be initiated by: 1. Writing a 1 to the ADBUSY bit of ADC0CN; 2. A Timer 3 overflow (i.e. timed continuous conversions); 3. A rising edge detected on the external ADC convert start signal, CNVSTR; 4. A Timer 2 overflow (i.e. timed continuous conversions). N ew Writing a 1 to ADBUSY provides software control of the ADC whereby conversions are performed “on-demand”. During conversion, the ADBUSY bit is set to 1 and restored to 0 when conversion is complete. The falling edge of ADBUSY triggers an interrupt (when enabled) and sets the ADCINT interrupt flag. Note: When conversions are performed “on-demand”, the ADCINT flag, not ADBUSY, should be polled to determine when the conversion has completed. Converted data is available in the ADC data word MSB and LSB registers, ADC0H, ADC0L. Converted data can be either left or right justified in the ADC0H:ADC0L register pair (see example in Figure 5.9) depending on the programmed state of the ADLJST bit in the ADC0CN register. m en de d fo r The ADCTM bit in register ADC0CN controls the ADC track-and-hold mode. In its default state, the ADC input is continuously tracked, except when a conversion is in progress. Setting ADCTM to 1 allows one of four different low power track-and-hold modes to be specified by states of the ADSTM1-0 bits (also in ADC0CN): 1. Tracking begins with a write of 1 to ADBUSY and lasts for 3 SAR clocks; 2. Tracking starts with an overflow of Timer 3 and lasts for 3 SAR clocks; 3. Tracking is active only when the CNVSTR input is low; 4. Tracking starts with an overflow of Timer 2 and lasts for 3 SAR clocks. Modes 1, 2 and 4 (above) are useful when the start of conversion is triggered with a software command or when the ADC is operated continuously. Mode 3 is used when the start of conversion is triggered by external hardware. In this case, the track-and-hold is in its low power mode at times when the CNVSTR input is high. Tracking can also be disabled (shutdown) when the entire chip is in low power standby or sleep modes. Figure 5.2. 12-Bit ADC Track and Conversion Example Timing om A. ADC Timing for External Trigger Source CNVSTR (ADSTM[1:0]=10) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 N ot R ec SAR Clocks ADCTM=1 ADCTM=0 Low Power or Convert Track Track Or Convert Convert Low Power Mode Convert Track B. ADC Timing for Internal Trigger Sources Timer2, Timer3 Overflow; Write 1 to ADBUSY (ADSTM[1:0]=00, 01, 11) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 SAR Clocks ADCTM=1 Low Power or Convert Track 1 2 3 Convert 4 5 6 7 8 9 Low Power Mode 10 11 12 13 14 15 16 SAR Clocks ADCTM=0 Track or Convert Convert Rev. 1.7 Track 30 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 5.3. Temperature Sensor Transfer Function (Volts) es ig ns 1.000 0.900 0.800 D VTEMP = 0.00286(TEMP C) + 0.776 0.700 N ew for PGA Gain = 1 0.600 0.500 0 50 100 (Celsius) fo r -50 R/W R/W - - Bit7 Bit6 m en de d Figure 5.4. AMX0CF: AMUX Configuration Register (C8051F00x) R/W R/W R/W R/W R/W R/W Reset Value - - AIN67IC AIN45IC AIN23IC AIN01IC 00000000 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: R ec om Bits7-4: UNUSED. Read = 0000b; Write = don’t care Bit3: AIN67IC: AIN6, AIN7 Input Pair Configuration Bit 0: AIN6 and AIN7 are independent singled-ended inputs 1: AIN6, AIN7 are (respectively) +, - differential input pair Bit2: AIN45IC: AIN4, AIN5 Input Pair Configuration Bit 0: AIN4 and AIN5 are independent singled-ended inputs 1: AIN4, AIN5 are (respectively) +, - differential input pair Bit1: AIN23IC: AIN2, AIN3 Input Pair Configuration Bit 0: AIN2 and AIN3 are independent singled-ended inputs 1: AIN2, AIN3 are (respectively) +, - differential input pair Bit0: AIN01IC: AIN0, AIN1 Input Pair Configuration Bit 0: AIN0 and AIN1 are independent singled-ended inputs 1: AIN0, AIN1 are (respectively) +, - differential input pair N ot NOTE: The ADC Data Word is in 2’s complement format for channels configured as differential. 31 Rev. 1.7 0xBA C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 5.5. AMX0SL: AMUX Channel Select Register (C8051F00x) R/W R/W R/W R/W R/W R/W R/W Reset Value - - - - AMXAD3 AMXAD2 AMXAD1 AMXAD0 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W Bits7-4: UNUSED. Read = 0000b; Write = don’t care Bits3-0: AMXAD3-0: AMUX Address Bits 0000-1111: ADC Inputs selected per chart below 0010 0011 AIN1 AIN2 AIN3 AIN4 AIN2 AIN3 AIN4 0001 +(AIN0) -(AIN1) 0010 AIN0 B I T S 0011 +(AIN0) -(AIN1) 0100 AIN0 0101 +(AIN0) -(AIN1) 0110 AIN0 0111 +(AIN0) -(AIN1) 1000 AIN0 1001 +(AIN0) -(AIN1) 1010 AIN0 1011 +(AIN0) -(AIN1) 1100 AIN0 1101 +(AIN0) -(AIN1) 1110 AIN0 1111 +(AIN0) -(AIN1) AIN1 AIN1 AIN1 +(AIN2) -(AIN3) +(AIN2) -(AIN3) om AIN1 AIN1 AIN1 TEMP SENSOR AIN5 AIN6 AIN7 TEMP SENSOR AIN5 AIN6 AIN7 TEMP SENSOR AIN6 AIN7 TEMP SENSOR +(AIN4) -(AIN5) AIN6 AIN7 TEMP SENSOR +(AIN4) -(AIN5) AIN6 AIN7 TEMP SENSOR +(AIN4) -(AIN5) AIN6 AIN7 TEMP SENSOR +(AIN4) -(AIN5) AIN2 AIN3 AIN4 AIN5 +(AIN6) -(AIN7) TEMP SENSOR AIN2 AIN3 AIN4 AIN5 +(AIN6) -(AIN7) TEMP SENSOR +(AIN2) -(AIN3) AIN4 AIN5 +(AIN6) -(AIN7) TEMP SENSOR +(AIN2) -(AIN3) AIN4 AIN5 +(AIN6) -(AIN7) TEMP SENSOR AIN2 AIN3 +(AIN4) -(AIN5) +(AIN6) -(AIN7) TEMP SENSOR AIN2 AIN3 +(AIN4) -(AIN5) +(AIN6) -(AIN7) TEMP SENSOR +(AIN2) -(AIN3) +(AIN4) -(AIN5) +(AIN6) -(AIN7) TEMP SENSOR +(AIN2) -(AIN3) +(AIN4) -(AIN5) +(AIN6) -(AIN7) TEMP SENSOR N ot R ec AIN1 AIN7 TEMP SENSOR AIN4 AIN3 1xxx AIN7 +(AIN2) -(AIN3) AIN2 AIN6 0111 AIN6 AIN4 AIN3 0110 AIN5 +(AIN2) -(AIN3) AIN2 AIN5 fo r AIN0 m en de d 0000 N ew 0001 A M X 0 C F 3 0 AMXAD3-0 0100 0101 0000 D 0xBB Rev. 1.7 32 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 5.6. ADC0CF: ADC Configuration Register (C8051F00x) R/W R/W R/W R/W R/W R/W R/W Reset Value ADCSC1 ADCSC0 - - AMPGN2 AMPGN1 AMPGN0 01100000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W ADCSC2 N ot R ec om m en de d N ew fo r Bits7-5: ADCSC2-0: ADC SAR Conversion Clock Period Bits 000: SAR Conversion Clock = 1 System Clock 001: SAR Conversion Clock = 2 System Clocks 010: SAR Conversion Clock = 4 System Clocks 011: SAR Conversion Clock = 8 System Clocks 1xx: SAR Conversion Clock = 16 Systems Clocks (Note: the SAR Conversion Clock should be  2MHz) Bits4-3: UNUSED. Read = 00b; Write = don’t care Bits2-0: AMPGN2-0: ADC Internal Amplifier Gain 000: Gain = 1 001: Gain = 2 010: Gain = 4 011: Gain = 8 10x: Gain = 16 11x: Gain = 0.5 D 0xBC 33 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 5.7. ADC0CN: ADC Control Register (C8051F00x) R/W R/W R/W R/W R/W R/W R/W R/W ADCEN ADCTM ADCINT ADBUSY ADSTM1 ADSTM0 ADWINT ADLJST 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 0xE8 es ig ns (bit addressable) Reset Value ADCEN: ADC Enable Bit 0: ADC Disabled. ADC is in low power shutdown. 1: ADC Enabled. ADC is active and ready for data conversions. Bit6: ADCTM: ADC Track Mode Bit 0: When the ADC is enabled, tracking is always done unless a conversion is in process 1: Tracking Defined by ADSTM1-0 bits ADSTM1-0: 00: Tracking starts with the write of 1 to ADBUSY and lasts for 3 SAR clocks 01: Tracking started by the overflow of Timer 3 and last for 3 SAR clocks 10: ADC tracks only when CNVSTR input is logic low 11: Tracking started by the overflow of Timer 2 and last for 3 SAR clocks Bit5: ADCINT: ADC Conversion Complete Interrupt Flag (Must be cleared by software) 0: ADC has not completed a data conversion since the last time this flag was cleared 1: ADC has completed a data conversion Bit4: ADBUSY: ADC Busy Bit Read 0: ADC Conversion complete or no valid data has been converted since a reset. The falling edge of ADBUSY generates an interrupt when enabled. 1: ADC Busy converting data Write 0: No effect 1: Starts ADC Conversion if ADSTM1-0 = 00b Bits3-2: ADSTM1-0: ADC Start of Conversion Mode Bits 00: ADC conversion started upon every write of 1 to ADBUSY 01: ADC conversions taken on every overflow of Timer 3 10: ADC conversion started upon every rising edge of CNVSTR 11: ADC conversions taken on every overflow of Timer 2 Bit1: ADWINT: ADC Window Compare Interrupt Flag (Must be cleared by software) 0: ADC Window Comparison Data match has not occurred 1: ADC Window Comparison Data match occurred Bit0: ADLJST: ADC Left Justify Data Bit 0: Data in ADC0H:ADC0L Registers is right justified 1: Data in ADC0H:ADC0L Registers is left justified N ot R ec om m en de d fo r N ew D Bit7: Rev. 1.7 34 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 5.8. ADC0H: ADC Data Word MSB Register (C8051F00x) R/W R/W R/W R/W R/W R/W R/W R/W Reset Value Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 00000000 es ig ns 0xBF Bits7-0: ADC Data Word Bits For ADLJST = 1: Upper 8-bits of the 12-bit ADC Data Word. For ADLJST = 0: Bits7-4 are the sign extension of Bit3. Bits 3-0 are the upper 4-bits of the 12-bit ADC Data Word. D Figure 5.9. ADC0L: ADC Data Word LSB Register (C8051F00x) R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 R/W R/W R/W Reset Value Bit2 Bit1 Bit0 SFR Address: N ew R/W 00000000 0xBE fo r Bits7-0: ADC Data Word Bits For ADLJST = 1: Bits7-4 are the lower 4-bits of the 12-bit ADC Data Word. Bits3-0 will always read 0. For ADLJST = 0: Bits7-0 are the lower 8-bits of the 12-bit ADC Data Word. m en de d NOTE: Resulting 12-bit ADC Data Word appears in the ADC Data Word Registers as follows: ADC0H[3:0]:ADC0L[7:0], if ADLJST = 0 (ADC0H[7:4] will be sign extension of ADC0H.3 if a differential reading, otherwise = 0000b) ADC0H[7:0]:ADC0L[7:4], if ADLJST = 1 (ADC0L[3:0] = 0000b) om EXAMPLE: ADC Data Word Conversion Map, AIN0 Input in Single-Ended Mode (AMX0CF=0x00, AMX0SL=0x00) ADC0H:ADC0L ADC0H:ADC0L AIN0 – AGND (ADLJST = 0) (ADLJST = 1) (Volts) ec REF x (4095/4096) REF x ½ REF x (2047/4096) 0 0x0FFF 0x0800 0x07FF 0x0000 0xFFF0 0x8000 0x7FF0 0x0000 N ot R EXAMPLE: ADC Data Word Conversion Map, AIN0-AIN1 Differential Input Pair (AMX0CF=0x01, AMX0SL=0x00) ADC0H:ADC0L ADC0H:ADC0L AIN0 – AIN1 (Volts) (ADLJST = 0) (ADLJST = 1) REF x (2047/2048) 0x07FF 0x7FF0 0 0x0000 0x0000 -REF x (1/2048) 0xFFFF 0xFFF0 -REF 0xF800 0x8000 35 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 5.3. ADC Programmable Window Detector es ig ns The ADC programmable window detector is very useful in many applications. It continuously compares the ADC output to user-programmed limits and notifies the system when an out-of-band condition is detected. This is especially effective in an interrupt-driven system, saving code space and CPU bandwidth while delivering faster system response times. The window detector interrupt flag (ADWINT in ADC0CN) can also be used in polled mode. The high and low bytes of the reference words are loaded into the ADC Greater-Than and ADC Less-Than registers (ADC0GTH, ADC0GTL, ADC0LTH, and ADC0LTL). Figure 5.14 and Figure 5.15 show example comparisons for reference. Notice that the window detector flag can be asserted when the measured data is inside or outside the user-programmed limits, depending on the programming of the ADC0GTx and ADC0LTx registers. R/W R/W R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 R/W Reset Value Bit0 SFR Address: N ew R/W D Figure 5.10. ADC0GTH: ADC Greater-Than Data High Byte Register (C8051F00x) Bits7-0: The high byte of the ADC Greater-Than Data Word. 11111111 0xC5 R/W R/W R/W Bit7 Bit6 Bit5 Bit4 R/W R/W R/W R/W Reset Value Bit3 Bit2 Bit1 Bit0 SFR Address: m en de d R/W fo r Figure 5.11. ADC0GTL: ADC Greater-Than Data Low Byte Register (C8051F00x) 11111111 0xC4 Bits7-0: The low byte of the ADC Greater-Than Data Word. Definition: ADC Greater-Than Data Word = ADC0GTH:ADC0GTL Figure 5.12. ADC0LTH: ADC Less-Than Data High Byte Register (C8051F00x) R/W Bit7 Bit6 R/W R/W R/W R/W R/W R/W Reset Value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 00000000 0xC7 om R/W ec Bits7-0: The high byte of the ADC Less-Than Data Word. R Figure 5.13. ADC0LTL: ADC Less-Than Data Low Byte Register (C8051F00x) R/W R/W R/W R/W R/W R/W R/W R/W Reset Value Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: N ot 00000000 0xC6 Bits7-0: These bits are the low byte of the ADC Less-Than Data Word. Definition: ADC Less-Than Data Word = ADC0LTH:ADC0LTL Rev. 1.7 36 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 5.14. 12-Bit ADC Window Interrupt Examples, Right Justified Data Input Voltage (AD0 - AGND) ADC Data Word REF x (4095/4096) REF x (4095/4096) 0x0FFF ADC Data Word 0x0FFF ADWINT not affected ADWINT=1 0x0201 REF x (512/4096) 0x0200 0x0201 REF x (512/4096) ADC0LTH:ADC0LTL 0x01FF 0x0200 0x01FF ADWINT=1 0x0101 0x0100 0x0101 REF x (256/4096) ADC0GTH:ADC0GTL 0x00FF 0 0x0000 fo r m en de d An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x0100 or > 0x0200. ADC Data Word Input Voltage (AD0 - AD1) ADC Data Word 0x07FF REF x (2047/2048) 0x07FF ADWINT not affected ADWINT=1 0x0101 REF x (256/2048) 0x0100 ADC0LTH:ADC0LTL 0x0101 REF x (256/2048) om 0x00FF 0xFFFF ADWINT=1 0x0000 ADC0GTH:ADC0GTL REF x (-1/2048) R ec 0xFFFE 0xFFFF ADC0GTH:ADC0GTL ADWINT not affected ADC0LTH:ADC0LTL 0xFFFE ADWINT=1 ADWINT not affected 0xF800 -REF 0xF800 Given: Given: AMX0SL = 0x00, AMX0CF = 0x01, ADLJST = 0, ADC0LTH:ADC0LTL = 0x0100, ADC0GTH:ADC0GTL = 0xFFFF. AMX0SL = 0x00, AMX0CF = 0x01, ADLJST = 0, ADC0LTH:ADC0LTH = 0xFFFF, ADC0GTH:ADC0GTL = 0x0100. An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x0100 and > 0xFFFF. (Two’s Complement math, 0xFFFF = -1.) An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0xFFFF or > 0x0100. (Two’s Complement math, 0xFFFF = -1.) N ot 37 -REF 0x0100 0x00FF 0x0000 REF x (-1/2048) ADWINT=1 Given: AMX0SL = 0x00, AMX0CF = 0x00, ADLJST = 0, ADC0LTH:ADC0LTL = 0x0100, ADC0GTH:ADC0GTL = 0x0200. An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x0200 and > 0x0100. REF x (2047/2048) ADC0LTH:ADC0LTL N ew 0x0000 Given: AMX0SL = 0x00, AMX0CF = 0x00, ADLJST = 0, ADC0LTH:ADC0LTL = 0x0200, ADC0GTH:ADC0GTL = 0x0100. Input Voltage (AD0 - AD1) ADWINT not affected 0x00FF ADWINT not affected 0 0x0100 ADC0GTH:ADC0GTL D REF x (256/4096) es ig ns Input Voltage (AD0 - AGND) Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 5.15. 12-Bit ADC Window Interrupt Examples, Left Justified Data Input Voltage (AD0 - AGND) ADC Data Word REF x (4095/4096) REF x (4095/4096) 0xFFF0 ADC Data Word 0xFFF0 ADWINT not affected ADWINT=1 0x2010 REF x (512/4096) 0x2000 0x2010 ADC0LTH:ADC0LTL REF x (512/4096) 0x1FF0 0x2000 0x1FF0 ADWINT=1 0x1000 0x1010 ADC0GTH:ADC0GTL REF x (256/4096) ADWINT not affected 0x0000 0 Given: AMX0SL = 0x00, AMX0CF = 0x00, ADLJST = 1, ADC0LTH:ADC0LTL = 0x2000, ADC0GTH:ADC0GTL = 0x1000. 0x0000 An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x1000 or > 0x2000. m en de d REF x (2047/2048) ADC Data Word Input Voltage (AD0 - AD1) ADC Data Word 0x7FF0 REF x (2047/2048) 0x7FF0 ADWINT not affected ADWINT=1 0x1010 REF x (256/2048) 0x1000 ADC0LTH:ADC0LTL 0x1010 REF x (256/2048) om 0x0FF0 0xFFF0 ADWINT=1 0x0000 ADC0GTH:ADC0GTL REF x (-1/2048) ec 0xFFE0 R -REF 0x1000 0x0FF0 0x0000 REF x (-1/2048) ADWINT=1 Given: AMX0SL = 0x00, AMX0CF = 0x00, ADLJST = 1, ADC0LTH:ADC0LTL = 0x1000, ADC0GTH:ADC0GTL = 0x2000. An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x2000 and > 0x1000. Input Voltage (AD0 - AD1) ADC0LTH:ADC0LTL fo r 0 0x1000 ADWINT not affected 0x0FF0 N ew 0x0FF0 ADC0GTH:ADC0GTL D 0x1010 REF x (256/4096) es ig ns Input Voltage (AD0 - AGND) 0xFFF0 ADC0GTH:ADC0GTL ADWINT not affected ADC0LTH:ADC0LTL 0xFFE0 ADWINT=1 ADWINT not affected 0x8000 -REF 0x8000 Given: AMX0SL = 0x00, AMX0CF = 0x01, ADLJST = 1, ADC0LTH:ADC0LTL = 0x1000, ADC0GTH:ADC0GTL = 0xFFF0. AMX0SL = 0x00, AMX0CF = 0x01, ADLJST = 1, ADC0LTH:ADC0LTH = 0xFFF0, ADC0GTH:ADC0GTL = 0x1000. An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x1000 and > 0xFFF0. (Two’s Complement math.) An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0xFFF0 or > 0x1000. (Two’s Complement math.) N ot Given: Rev. 1.7 38 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 5.1. 12-Bit ADC Electrical Characteristics N ot R ec om m en de d fo r N ew D es ig ns VDD = 3.0V, AV+ = 3.0V, VREF = 2.40V (REFBE=0), PGA Gain = 1, -40C to +85C unless otherwise specified. PARAMETER CONDITIONS MIN TYP MAX UNITS DC ACCURACY Resolution 12 bits Integral Nonlinearity LSB 1 Differential Nonlinearity Guaranteed Monotonic LSB 1 Offset Error LSB -3  1 Full Scale Error Differential mode LSB -7  3 Offset Temperature  0.25 ppm/C Coefficient DYNAMIC PERFORMANCE (10kHz sine-wave input, 0 to –1dB of full scale, 100ksps) Signal-to-Noise Plus 66 69 dB Distortion Total Harmonic Distortion Up to the 5th harmonic -75 dB Spurious-Free Dynamic 80 dB Range CONVERSION RATE Conversion Time in SAR 16 clocks Clocks SAR Clock Frequency C8051F000, ‘F001, ‘F002 2.0 MHz C8051F005, ‘F006, ‘F007 2.5 MHz Track/Hold Acquisition 1.5 s Time Throughput Rate 100 ksps ANALOG INPUTS Voltage Conversion Range Single-ended Mode (AINn – AGND) 0 VREF V Differential Mode |(AINn+) – (AINm-)| - 1LSB Input Voltage Any AINn pin AGND AV+ V Input Capacitance 10 pF TEMPERATURE SENSOR Linearity  0.20 C Absolute Accuracy 3 C Gain PGA Gain = 1 2.86 mV/C PGA Gain = 1 Gain Error (1)  33.5 V/C Offset 776 mV PGA Gain = 1, Temp = 0C mV Offset Error (1) PGA Gain = 1, Temp = 0C  8.51 POWER SPECIFICATIONS Power Supply Current (AV+ Operating Mode, 100ksps 450 900 A supplied to ADC) Power Supply Rejection mV/V  0.3 39 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 6. ADC (10-Bit, C8051F010/1/2/5/6/7 Only) ADC0GTH ADC0GTL ADC0LTH ADC0LTL D Figure 6.1. 10-Bit ADC Functional Block Diagram es ig ns The ADC subsystem for the C8051F010/1/2/5/6/7 consists of a 9-channel, configurable analog multiplexer (AMUX), a programmable gain amplifier (PGA), and a 100ksps, 10-bit successive-approximation-register ADC with integrated track-and-hold and programmable window detector (see block diagram in Figure 6.1). The AMUX, PGA, Data Conversion Modes, and Window Detector are all configurable under software control via the Special Function Register’s shown in Figure 6.1. The ADC subsystem (ADC, track-and-hold and PGA) is enabled only when the ADCEN bit in the ADC Control register (ADC0CN, Figure 6.7) is set to 1. The ADC subsystem is in low power shutdown when this bit is 0. The Bias Enable bit (BIASE) in the REF0CN register (see Figure 9.2) must be set to 1 in order to supply bias to the ADC. 20 + AIN3 AIN5 9-to-1 AMUX + (SE or - DIFF) AIN6 + AIN7 - N ew AIN2 ADCEN AV+ - 10-Bit SAR fo r X + - ADC0CF CNVSTR ADBUSY(w) ADCEN ADCTM ADCINT ADBUSY ADSTM1 ADSTM0 ADWINT ADLJST AMPGN2 AMPGN1 AMPGN0 ADCSC2 ADCSC1 ADCSC0 AIN67IC AIN45IC AIN23IC AIN01IC 6.1. AMX0SL TMR3 OV T2 OV ADC0CN om AMX0CF AMXAD3 AMXAD2 AMXAD1 AMXAD0 TEMP SENSOR AGND 10 ADC AGND m en de d AIN4 ADWINT ADC0L - 10 ADC0H AIN1 AV+ Conversion Start + REF SYSCLK AIN0 COMB LOGIC Analog Multiplexer and PGA N ot R ec Eight of the AMUX channels are available for external measurements while the ninth channel is internally connected to an on-board temperature sensor (temperature transfer function is shown in Figure 6.3). Note that the PGA gain is applied to the temperature sensor reading. AMUX input pairs can be programmed to operate in either the differential or single-ended mode. This allows the user to select the best measurement technique for each input channel, and even accommodates mode changes “on-the-fly”. The AMUX defaults to all single-ended inputs upon reset. There are two registers associated with the AMUX: the Channel Selection register AMX0SL (Figure 6.5), and the Configuration register AMX0CF (Figure 6.4). The table in Figure 6.5 shows AMUX functionality by channel for each possible configuration. The PGA amplifies the AMUX output signal by an amount determined by the AMPGN2-0 bits in the ADC Configuration register, ADC0CF (Figure 6.6). The PGA can be softwareprogrammed for gains of 0.5, 1, 2, 4, 8 or 16. It defaults to unity gain on reset. Rev. 1.7 40 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 6.2. ADC Modes of Operation es ig ns The ADC uses VREF to determine its full-scale voltage, thus the reference must be properly configured before performing a conversion (see Section 9). The ADC has a maximum conversion speed of 100ksps. The ADC conversion clock is derived from the system clock. Conversion clock speed can be reduced by a factor of 2, 4, 8 or 16 via the ADCSC bits in the ADC0CF Register. This is useful to adjust conversion speed to accommodate different system clock speeds. D A conversion can be initiated in one of four ways, depending on the programmed states of the ADC Start of Conversion Mode bits (ADSTM1, ADSTM0) in ADC0CN. Conversions may be initiated by: 1. Writing a 1 to the ADBUSY bit of ADC0CN; 2. A Timer 3 overflow (i.e. timed continuous conversions); 3. A rising edge detected on the external ADC convert start signal, CNVSTR; 4. A Timer 2 overflow (i.e. timed continuous conversions). N ew Writing a 1 to ADBUSY provides software control of the ADC whereby conversions are performed “on-demand”. During conversion, the ADBUSY bit is set to 1 and restored to 0 when conversion is complete. The falling edge of ADBUSY triggers an interrupt (when enabled) and sets the ADCINT interrupt flag. Note: When conversions are performed “on-demand”, the ADCINT flag, not ADBUSY, should be polled to determine when the conversion has completed. Converted data is available in the ADC data word MSB and LSB registers, ADC0H, ADC0L. Converted data can be either left or right justified in the ADC0H:ADC0L register pair (see example in Figure 6.9) depending on the programmed state of the ADLJST bit in the ADC0CN register. m en de d fo r The ADCTM bit in register ADC0CN controls the ADC track-and-hold mode. In its default state, the ADC input is continuously tracked, except when a conversion is in progress. Setting ADCTM to 1 allows one of four different low power track-and-hold modes to be specified by states of the ADSTM1-0 bits (also in ADC0CN): 1. Tracking begins with a write of 1 to ADBUSY and lasts for 3 SAR clocks; 2. Tracking starts with an overflow of Timer 3 and lasts for 3 SAR clocks; 3. Tracking is active only when the CNVSTR input is low; 4. Tracking starts with an overflow of Timer 2 and lasts for 3 SAR clocks. Modes 1, 2 and 4 (above) are useful when the start of conversion is triggered with a software command or when the ADC is operated continuously. Mode 3 is used when the start of conversion is triggered by external hardware. In this case, the track-and-hold is in its low power mode at times when the CNVSTR input is high. Tracking can also be disabled (shutdown) when the entire chip is in low power standby or sleep modes. Figure 6.2. 10-Bit ADC Track and Conversion Example Timing om A. ADC Timing for External Trigger Source CNVSTR (ADSTM[1:0]=10) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 N ot R ec SAR Clocks ADCTM=1 ADCTM=0 Low Power or Convert Track Track Or Convert Convert Low Power Mode Convert Track B. ADC Timing for Internal Trigger Sources Timer2, Timer3 Overflow; Write 1 to ADBUSY (ADSTM[1:0]=00, 01, 11) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 SAR Clocks ADCTM=1 Low Power or Convert Track 1 2 3 Convert 4 5 6 7 8 9 Low Power Mode 10 11 12 13 14 15 16 SAR Clocks ADCTM=0 41 Track or Convert Convert Rev. 1.7 Track C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 6.3. Temperature Sensor Transfer Function (Volts) es ig ns 1.000 0.900 0.800 D VTEMP = 0.00286(TEMP C) + 0.776 0.700 N ew for PGA Gain = 1 0.600 0.500 0 50 100 (Celsius) fo r -50 R/W R/W - - Bit7 Bit6 m en de d Figure 6.4. AMX0CF: AMUX Configuration Register (C8051F01x) R/W R/W R/W R/W R/W R/W Reset Value - - AIN67IC AIN45IC AIN23IC AIN01IC 00000000 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 0xBA R ec om Bits7-4: UNUSED. Read = 0000b; Write = don’t care Bit3: AIN67IC: AIN6, AIN7 Input Pair Configuration Bit 0: AIN6 and AIN7 are independent singled-ended inputs 1: AIN6, AIN7 are (respectively) +, - differential input pair Bit2: AIN45IC: AIN4, AIN5 Input Pair Configuration Bit 0: AIN4 and AIN5 are independent singled-ended inputs 1: AIN4, AIN5 are (respectively) +, - differential input pair Bit1: AIN23IC: AIN2, AIN3 Input Pair Configuration Bit 0: AIN2 and AIN3 are independent singled-ended inputs 1: AIN2, AIN3 are (respectively) +, - differential input pair Bit0: AIN01IC: AIN0, AIN1 Input Pair Configuration Bit 0: AIN0 and AIN1 are independent singled-ended inputs 1: AIN0, AIN1 are (respectively) +, - differential input pair N ot NOTE: The ADC Data Word is in 2’s complement format for channels configured as differential. Rev. 1.7 42 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 6.5. AMX0SL: AMUX Channel Select Register (C8051F01x) R/W R/W R/W R/W R/W R/W R/W Reset Value - - - - AMXAD3 AMXAD2 AMXAD1 AMXAD0 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W Bits7-4: UNUSED. Read = 0000b; Write = don’t care Bits3-0: AMXAD3-0: AMUX Address Bits 0000-1111: ADC Inputs selected per chart below 0000 AIN0 AIN1 AIN2 AIN3 AIN4 0001 +(AIN0) -(AIN1) AIN2 AIN3 AIN4 0010 AIN0 0011 +(AIN0) -(AIN1) 0100 AIN0 0101 +(AIN0) -(AIN1) 0110 AIN0 0111 +(AIN0) -(AIN1) 1000 AIN0 1001 +(AIN0) -(AIN1) 1010 AIN0 1011 +(AIN0) -(AIN1) 1100 AIN0 1101 +(AIN0) -(AIN1) 1110 AIN0 1111 +(AIN0) -(AIN1) AIN1 AIN1 AIN1 +(AIN2) -(AIN3) +(AIN2) -(AIN3) AIN5 AIN6 AIN7 TEMP SENSOR AIN5 AIN6 AIN7 TEMP SENSOR AIN6 AIN7 TEMP SENSOR +(AIN4) -(AIN5) AIN6 AIN7 TEMP SENSOR +(AIN4) -(AIN5) AIN6 AIN7 TEMP SENSOR +(AIN4) -(AIN5) AIN6 AIN7 TEMP SENSOR +(AIN4) -(AIN5) AIN1 AIN1 AIN1 AIN2 AIN3 AIN4 AIN5 +(AIN6) -(AIN7) TEMP SENSOR AIN2 AIN3 AIN4 AIN5 +(AIN6) -(AIN7) TEMP SENSOR +(AIN2) -(AIN3) AIN4 AIN5 +(AIN6) -(AIN7) TEMP SENSOR +(AIN2) -(AIN3) AIN4 AIN5 +(AIN6) -(AIN7) TEMP SENSOR AIN2 AIN3 +(AIN4) -(AIN5) +(AIN6) -(AIN7) TEMP SENSOR AIN2 AIN3 +(AIN4) -(AIN5) +(AIN6) -(AIN7) TEMP SENSOR +(AIN2) -(AIN3) +(AIN4) -(AIN5) +(AIN6) -(AIN7) TEMP SENSOR +(AIN2) -(AIN3) +(AIN4) -(AIN5) +(AIN6) -(AIN7) TEMP SENSOR N ot R ec AIN1 43 TEMP SENSOR TEMP SENSOR AIN4 AIN3 AIN7 AIN7 +(AIN2) -(AIN3) AIN2 1xxx AIN6 AIN4 AIN3 AIN6 0111 AIN5 +(AIN2) -(AIN3) AIN2 AIN5 0110 N ew 0011 om 3 0 0010 fo r B I T S 0001 m en de d A M X 0 C F AMXAD3-0 0100 0101 0000 D 0xBB Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 6.6. ADC0CF: ADC Configuration Register (C8051F01x) R/W R/W R/W R/W R/W R/W R/W Reset Value ADCSC1 ADCSC0 - - AMPGN2 AMPGN1 AMPGN0 01100000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W ADCSC2 N ew N ot R ec om m en de d fo r Bits7-5: ADCSC2-0: ADC SAR Conversion Clock Period Bits 000: SAR Conversion Clock = 1 System Clock 001: SAR Conversion Clock = 2 System Clocks 010: SAR Conversion Clock = 4 System Clocks 011: SAR Conversion Clock = 8 System Clocks 1xx: SAR Conversion Clock = 16 Systems Clocks (Note: Conversion clock should be  2MHz.) Bits4-3: UNUSED. Read = 00b; Write = don’t care Bits2-0: AMPGN2-0: ADC Internal Amplifier Gain 000: Gain = 1 001: Gain = 2 010: Gain = 4 011: Gain = 8 10x: Gain = 16 11x: Gain = 0.5 D 0xBC Rev. 1.7 44 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 6.7. ADC0CN: ADC Control Register (C8051F01x) R/W R/W R/W R/W R/W R/W R/W R/W ADCEN ADCTM ADCINT ADBUSY ADSTM1 ADSTM0 ADWINT ADLJST 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: ADCEN: ADC Enable Bit 0: ADC Disabled. ADC is in low power shutdown. 1: ADC Enabled. ADC is active and ready for data conversions. Bit6: ADCTM: ADC Track Mode Bit 0: When the ADC is enabled, tracking is always done unless a conversion is in process 1: Tracking Defined by ADSTM1-0 bits ADSTM1-0: 00: Tracking starts with the write of 1 to ADBUSY and lasts for 3 SAR clocks 01: Tracking started by the overflow of Timer 3 and last for 3 SAR clocks 10: ADC tracks only when CNVSTR input is logic low 11: Tracking started by the overflow of Timer 2 and last for 3 SAR clocks Bit5: ADCINT: ADC Conversion Complete Interrupt Flag (Must be cleared by software) 0: ADC has not completed a data conversion since the last time this flag was cleared 1: ADC has completed a data conversion Bit4: ADBUSY: ADC Busy Bit Read 0: ADC Conversion complete or no valid data has been converted since a reset. The falling edge of ADBUSY generates an interrupt when enabled. 1: ADC Busy converting data Write 0: No effect 1: Starts ADC Conversion if ADSTM1-0 = 00b Bits3-2: ADSTM1-0: ADC Start of Conversion Mode Bits 00: ADC conversion started upon every write of 1 to ADBUSY 01: ADC conversions taken on every overflow of Timer 3 10: ADC conversion started upon every rising edge of CNVSTR 11: ADC conversions taken on every overflow of Timer 2 Bit1: ADWINT: ADC Window Compare Interrupt Flag (Must be cleared by software) 0: ADC Window Comparison Data match has not occurred 1: ADC Window Comparison Data match occurred Bit0: ADLJST: ADC Left Justify Data Bit 0: Data in ADC0H:ADC0L Registers is right justified 1: Data in ADC0H:ADC0L Registers is left justified N ot R ec om m en de d fo r N ew D Bit7: 45 0xE8 es ig ns (bit addressable) Reset Value Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 6.8. ADC0H: ADC Data Word MSB Register (C8051F01x) R/W R/W R/W R/W R/W R/W R/W R/W Reset Value Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 00000000 es ig ns 0xBF Bits7-0: ADC Data Word Bits For ADLJST = 1: Upper 8-bits of the 10-bit ADC Data Word. For ADLJST = 0: Bits7-2 are the sign extension of Bit1. Bits 1-0 are the upper 2-bits of the 10-bit ADC Data Word. D Figure 6.9. ADC0L: ADC Data Word LSB Register (C8051F01x) R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 R/W R/W R/W Reset Value Bit2 Bit1 Bit0 SFR Address: N ew R/W 00000000 0xBE fo r Bits7-0: ADC Data Word Bits For ADLJST = 1: Bits7-6 are the lower 2-bits of the 10-bit ADC Data Word. Bits5-0 will always read 0. For ADLJST = 0: Bits7-0 are the lower 8-bits of the 10-bit ADC Data Word. m en de d NOTE: Resulting 10-bit ADC Data Word appears in the ADC Data Word Registers as follows: ADC0H[1:0]:ADC0L[7:0], if ADLJST = 0 (ADC0H[7:2] will be sign extension of ADC0H.1 if a differential reading, otherwise = 000000b) ADC0H[7:0]:ADC0L[7:6], if ADLJST = 1 (ADC0L[5:0] = 000000b) om EXAMPLE: ADC Data Word Conversion Map, AIN0 Input in Single-Ended Mode (AMX0CF=0x00, AMX0SL=0x00) ADC0H:ADC0L ADC0H:ADC0L AIN0 – AGND (ADLJST = 0) (ADLJST = 1) (Volts) ec REF x (1023/1024) REF x ½ REF x (511/1024) 0 0x03FF 0x0200 0x01FF 0x0000 0xFFC0 0x8000 0x7FC0 0x0000 N ot R EXAMPLE: ADC Data Word Conversion Map, AIN0-AIN1 Differential Input Pair (AMX0CF=0x01, AMX0SL=0x00) ADC0H:ADC0L ADC0H:ADC0L AIN0 – AIN1 (Volts) (ADLJST = 0) (ADLJST = 1) REF x (511/512) 0x01FF 0x7FC0 0 0x0000 0x0000 -REF x (1/512) 0xFFFF 0xFFC0 -REF 0xFE00 0x8000 Rev. 1.7 46 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 6.3. ADC Programmable Window Detector es ig ns The ADC programmable window detector is very useful in many applications. It continuously compares the ADC output to user-programmed limits and notifies the system when an out-of-band condition is detected. This is especially effective in an interrupt-driven system, saving code space and CPU bandwidth while delivering faster system response times. The window detector interrupt flag (ADWINT in ADC0CN) can also be used in polled mode. The high and low bytes of the reference words are loaded into the ADC Greater-Than and ADC Less-Than registers (ADC0GTH, ADC0GTL, ADC0LTH, and ADC0LTL). Figure 6.14 and Figure 6.15 show example comparisons for reference. Notice that the window detector flag can be asserted when the measured data is inside or outside the user-programmed limits, depending on the programming of the ADC0GTx and ADC0LTx registers. R/W R/W R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 R/W Reset Value Bit0 SFR Address: N ew R/W D Figure 6.10. ADC0GTH: ADC Greater-Than Data High Byte Register (C8051F01x) Bits7-0: The high byte of the ADC Greater-Than Data Word. 11111111 0xC5 R/W R/W R/W Bit7 Bit6 Bit5 Bit4 R/W R/W R/W R/W Reset Value Bit3 Bit2 Bit1 Bit0 SFR Address: m en de d R/W fo r Figure 6.11. ADC0GTL: ADC Greater-Than Data Low Byte Register (C8051F01x) 11111111 0xC4 Bits7-0: The low byte of the ADC Greater-Than Data Word. Definition: ADC Greater-Than Data Word = ADC0GTH:ADC0GTL Figure 6.12. ADC0LTH: ADC Less-Than Data High Byte Register (C8051F01x) Bit7 R/W R/W om R/W Bit6 Bit5 R/W R/W R/W R/W R/W Reset Value Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 00000000 0xC7 ec Bits7-0: The high byte of the ADC Less-Than Data Word. R Figure 6.13. ADC0LTL: ADC Less-Than Data Low Byte Register (C8051F01x) R/W R/W R/W R/W R/W R/W R/W R/W Reset Value Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: N ot 00000000 Bit7 0xC6 Bits7-0: These bits are the low byte of the ADC Less-Than Data Word. Definition: ADC Less-Than Data Word = ADC0LTH:ADC0LTL 47 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 6.14. 10-Bit ADC Window Interrupt Examples, Right Justified Data Input Voltage (AD0 - AGND) ADC Data Word REF x (1023/1024) REF x (1023/1024) 0x03FF ADC Data Word 0x03FF ADWINT not affected ADWINT=1 0x0201 REF x (512/1024) 0x0200 0x0201 ADC0LTH:ADC0LTL REF x (512/1024) 0x01FF 0x0200 0x01FF ADWINT=1 0x0101 0x0100 0x0101 ADC0GTH:ADC0GTL REF x (256/1024) 0x00FF 0 0x0000 Given: AMX0SL = 0x00, AMX0CF = 0x00, ADLJST = 0, ADC0LTH:ADC0LTL = 0x0100, ADC0GTH:ADC0GTL = 0x0200. An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x0100 or > 0x0200. m en de d An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x0200 and > 0x0100. ADC Data Word Input Voltage (AD0 - AD1) ADC Data Word 0x01FF REF x (511/512) 0x01FF ADWINT not affected ADWINT=1 0x0101 REF x (256/512) 0x0100 ADC0LTH:ADC0LTL 0x0101 REF x (256/512) 0x00FF 0x0100 0x00FF om ADWINT=1 0x0000 REF x (-1/512) 0xFFFF 0x0000 ADC0GTH:ADC0GTL REF x (-1/512) ec 0xFFFE 0xFFFF ADC0GTH:ADC0GTL ADWINT not affected ADC0LTH:ADC0LTL 0xFFFE ADWINT=1 ADWINT not affected 0xFE00 -REF R -REF ADWINT=1 fo r Given: AMX0SL = 0x00, AMX0CF = 0x00, ADLJST = 0, ADC0LTH:ADC0LTL = 0x0200, ADC0GTH:ADC0GTL = 0x0100. REF x (511/512) ADC0LTH:ADC0LTL N ew 0x0000 Input Voltage (AD0 - AD1) ADWINT not affected 0x00FF ADWINT not affected 0 0x0100 ADC0GTH:ADC0GTL D REF x (256/1024) es ig ns Input Voltage (AD0 - AGND) 0xFE00 Given: AMX0SL = 0x00, AMX0CF = 0x01, ADLJST = 0, ADC0LTH:ADC0LTL = 0x0100, ADC0GTH:ADC0GTL = 0xFFFF. AMX0SL = 0x00, AMX0CF = 0x01, ADLJST = 0, ADC0LTH:ADC0LTH = 0xFFFF, ADC0GTH:ADC0GTL = 0x0100. An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x0100 and > 0xFFFF. (Two’s Complement math, 0xFFFF = -1.) An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0xFFFF or > 0x0100. (Two’s Complement math, 0xFFFF = -1.) N ot Given: Rev. 1.7 48 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 6.15. 10-Bit ADC Window Interrupt Examples, Left Justified Data Input Voltage (AD0 - AGND) ADC Data Word 0xFFC0 REF x (1023/1024) REF x (1023/1024) ADC Data Word 0xFFC0 ADWINT not affected ADWINT=1 0x8040 REF x (512/1024) 0x8000 0x8040 REF x (512/1024) ADC0LTH:ADC0LTL 0x7FC0 0x8000 0x7FC0 ADWINT=1 0x4040 0x4000 0x4040 REF x (256/1024) ADC0GTH:ADC0GTL 0x3FC0 0 0x0000 fo r m en de d An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x4000 or > 0x8000. Input Voltage (AD0 - AD1) ADC Data Word Input Voltage (AD0 - AD1) ADC Data Word REF x (511/512) 0x7FC0 REF x (511/512) 0x7FC0 ADWINT not affected ADWINT=1 0x2040 ADC0LTH:ADC0LTL 0x2040 REF x (128/512) om 0x1FC0 0xFFC0 ADWINT=1 0x0000 ADC0GTH:ADC0GTL REF x (-1/512) ec 0xFF80 ADWINT not affected ADC0LTH:ADC0LTL ADWINT=1 ADWINT not affected 0x8000 -REF 0x8000 Given: Given: AMX0SL = 0x00, AMX0CF = 0x01, ADLJST = 1, ADC0LTH:ADC0LTL = 0x2000, ADC0GTH:ADC0GTL = 0xFFC0. AMX0SL = 0x00, AMX0CF = 0x01, ADLJST = 1, ADC0LTH:ADC0LTH = 0xFFC0, ADC0GTH:ADC0GTL = 0x2000. An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x2000 and > 0xFFC0. (Two’s Complement math.) An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0xFFC0 or > 0x2000. (Two’s Complement math.) N ot 49 0xFFC0 ADC0GTH:ADC0GTL 0xFF80 R -REF 0x2000 0x1FC0 0x0000 REF x (-1/512) ADWINT=1 Given: AMX0SL = 0x00, AMX0CF = 0x00, ADLJST = 1, ADC0LTH:ADC0LTL = 0x4000, ADC0GTH:ADC0GTL = 0x8000. An ADC End of Conversion will cause an ADC Window Compare Interrupt (ADWINT=1) if the resulting ADC Data Word is < 0x8000 and > 0x4000. 0x2000 ADC0LTH:ADC0LTL N ew 0x0000 Given: AMX0SL = 0x00, AMX0CF = 0x00, ADLJST = 1, ADC0LTH:ADC0LTL = 0x8000, ADC0GTH:ADC0GTL = 0x4000. REF x (128/512) ADWINT not affected 0x3FC0 ADWINT not affected 0 0x4000 ADC0GTH:ADC0GTL D REF x (256/1024) es ig ns Input Voltage (AD0 - AGND) Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 6.1. 10-Bit ADC Electrical Characteristics N ot R ec om m en de d fo r N ew D es ig ns VDD = 3.0V, AV+ = 3.0V, VREF = 2.40V (REFBE=0), PGA Gain = 1, -40C to +85C unless otherwise specified. PARAMETER CONDITIONS MIN TYP MAX UNITS DC ACCURACY Resolution 10 bits Integral Nonlinearity LSB ½ 1 Differential Nonlinearity Guaranteed Monotonic LSB ½ 1 Offset Error LSB  0.5 Full Scale Error Differential mode LSB -1.5  0.5 Offset Temperature  0.25 ppm/C Coefficient DYNAMIC PERFORMANCE (10kHz sine-wave input, 0 to –1dB of full scale, 100ksps) Signal-to-Noise Plus 59 61 dB Distortion Total Harmonic Distortion Up to the 5th harmonic -70 dB Spurious-Free Dynamic 80 dB Range CONVERSION RATE Conversion Time in SAR 16 clocks Clocks SAR Clock Frequency C8051F000, ‘F001, ‘F002 2.0 MHz C8051F005, ‘F006, ‘F007 2.5 MHz Track/Hold Acquisition 1.5 s Time Throughput Rate 100 ksps ANALOG INPUTS Voltage Conversion Range Single-ended Mode (AINn – AGND) 0 VREF V Differential Mode |(AINn+) – (AINm-)| - 1LSB Input Voltage Any AINn pin AGND AV+ V Input Capacitance 10 pF TEMPERATURE SENSOR Linearity  0.20 C Absolute Accuracy 3 C Gain PGA Gain = 1 2.86 mV/C PGA Gain = 1 Gain Error (1)  33.5 V/C Offset 776 mV PGA Gain = 1, Temp = 0C mV Offset Error (1) PGA Gain = 1, Temp = 0C  8.51 POWER SPECIFICATIONS Power Supply Current (AV+ Operating Mode, 100ksps 450 900 A supplied to ADC) Power Supply Rejection mV/V  0.3 Rev. 1.7 50 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 7. DACs, 12 BIT VOLTAGE MODE es ig ns The C8051F000 MCU family has two 12-bit voltage-mode Digital to Analog Converters. Each DAC has an output swing of 0V to VREF-1LSB for a corresponding input code range of 0x000 to 0xFFF. Using DAC0 as an example, the 12-bit data word is written to the low byte (DAC0L) and high byte (DAC0H) data registers. Data is latched into DAC0 after a write to the corresponding DAC0H register, so the write sequence should be DAC0L followed by DAC0H if the full 12-bit resolution is required. The DAC can be used in 8-bit mode by initializing DAC0L to the desired value (typically 0x00), and writing data to only DAC0H with the data shifted to the left. DAC0 Control Register (DAC0CN) provides a means to enable/disable DAC0 and to modify its input data formatting. D The DAC0 enable/disable function is controlled by the DAC0EN bit (DAC0CN.7). Writing a 1 to DAC0EN enables DAC0 while writing a 0 to DAC0EN disables DAC0. While disabled, the output of DAC0 is maintained in a high-impedance state, and the DAC0 supply current falls to 1A or less. Also, the Bias Enable bit (BIASE) in the REF0CN register (see Figure 9.2) must be set to 1 in order to supply bias to DAC0. The voltage reference for DAC0 must also be set properly (see Section 9). fo r N ew In some instances, input data should be shifted prior to a DAC0 write operation to properly justify data within the DAC input registers. This action would typically require one or more load and shift operations, adding software overhead and slowing DAC throughput. To alleviate this problem, the data-formatting feature provides a means for the user to program the orientation of the DAC0 data word within data registers DAC0H and DAC0L. The three DAC0DF bits (DAC0CN.[2:0]) allow the user to specify one of five data word orientations as shown in the DAC0CN register definition. DAC1 is functionally the same as DAC0 described above. The electrical specifications for both DAC0 and DAC1 are given in Table 7.1. REF DAC0L om 8 Dig. MUX DAC0DF2 DAC0DF1 DAC0DF0 DAC0H DAC0CN DAC0EN m en de d Figure 7.1. DAC Functional Block Diagram 12 DAC0 AV+ + DAC0 - AGND 8 51 REF 8 Dig. MUX DAC1H DAC1DF2 DAC1DF1 DAC1DF0 DAC1L N ot R DAC1CN ec DAC1EN 12 AV+ + DAC1 DAC1 - AGND 8 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 7.2. DAC0H: DAC0 High Byte Register R/W R/W R/W R/W R/W R/W R/W R/W Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: Bits7-0: DAC0 Data Word Most Significant Byte. Figure 7.3. DAC0L: DAC0 Low Byte Register Bit7 R/W Bit6 R/W Bit5 Bit4 R/W Bit3 R/W R/W Bit2 Bit1 R/W D R/W Bit0 Reset Value 00000000 SFR Address: 0xD2 N ew R/W es ig ns 0xD3 Bits7-0: DAC0 Data Word Least Significant Byte. Figure 7.4. DAC0CN: DAC0 Control Register R/W R/W R/W - - - Bit7 Bit6 Bit5 Bit4 R/W R/W R/W Reset Value - DAC0DF2 DAC0DF1 DAC0DF0 00000000 Bit3 Bit2 Bit1 Bit0 SFR Address: 0xD4 DAC0EN: DAC0 Enable Bit 0: DAC0 Disabled. DAC0 Output pin is disabled; DAC0 is in low power shutdown mode. 1: DAC0 Enabled. DAC0 Output is pin active; DAC0 is operational. Bits6-3: UNUSED. Read = 0000b; Write = don’t care Bits2-0: DAC0DF2-0: DAC0 Data Format Bits 000: The most significant nybble of the DAC0 Data Word is in DAC0H[3:0], while the least significant byte is in DAC0L. DAC0H DAC0L m en de d Bit7: R/W fo r R/W DAC0EN MSB LSB om 001: The most significant 5-bits of the DAC0 Data Word is in DAC0H[4:0], while the least significant 7-bits is in DAC0L[7:1]. DAC0H DAC0L MSB LSB ec 010: The most significant 6-bits of the DAC0 Data Word is in DAC0H[5:0], while the least significant 6-bits is in DAC0L[7:2]. DAC0H DAC0L R N ot MSB LSB 011: The most significant 7-bits of the DAC0 Data Word is in DAC0H[6:0], while the least significant 5-bits is in DAC0L[7:3]. DAC0H DAC0L MSB LSB 1xx: The most significant byte of the DAC0 Data Word is in DAC0H, while the least significant nybble is in DAC0L[7:4]. DAC0H DAC0L MSB LSB Rev. 1.7 52 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 7.5. DAC1H: DAC1 High Byte Register R/W R/W R/W R/W R/W R/W R/W R/W Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: Bits7-0: DAC1 Data Word Most Significant Byte. Figure 7.6. DAC1L: DAC1 Low Byte Register Bit7 R/W Bit6 Bit5 R/W Bit4 R/W Bit3 Bits7-0: DAC1 Data Word Least Significant Byte. R/W R/W Bit2 Bit1 R/W D R/W Bit0 N ew R/W es ig ns 0xD6 Reset Value 00000000 SFR Address: 0xD5 Figure 7.7. DAC1CN: DAC1 Control Register R/W R/W R/W R/W R/W R/W R/W Reset Value - - - - DAC1DF2 DAC1DF1 DAC1DF0 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 0xD7 DAC1EN: DAC1 Enable Bit 0: DAC1 Disabled. DAC1 Output pin is disabled; DAC1 is in low power shutdown mode. 1: DAC1 Enabled. DAC1 Output is pin active; DAC1 is operational. Bits6-3: UNUSED. Read = 0000b; Write = don’t care Bits2-0: DAC1DF2-0: DAC1 Data Format Bits 000: The most significant nybble of the DAC1 Data Word is in DAC1H[3:0], while the least significant byte is in DAC1L. DAC1H DAC1L m en de d Bit7: fo r R/W DAC1EN MSB LSB om 001: The most significant 5-bits of the DAC1 Data Word is in DAC1H[4:0], while the least significant 7-bits is in DAC1L[7:1]. DAC1H DAC1L MSB LSB ec 010: The most significant 6-bits of the DAC1 Data Word is in DAC1H[5:0], while the least significant 6-bits is in DAC1L[7:2]. DAC1H DAC1L LSB N ot R MSB 011: The most significant 7-bits of the DAC1 Data Word is in DAC1H[6:0], while the least significant 5-bits is in DAC1L[7:3]. DAC1H DAC1L MSB LSB 1xx: The most significant byte of the DAC1 Data Word is in DAC1H, while the least significant nybble is in DAC1L[7:4]. DAC1H DAC1L MSB 53 LSB Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 7.1. DAC Electrical Characteristics UNITS bits LSB LSB N ew D es ig ns VDD = 3.0V, AV+ = 3.0V, REF = 2.40V (REFBE=0), No Output Load unless otherwise specified. PARAMETER CONDITIONS MIN TYP MAX STATIC PERFORMANCE Resolution 12 Integral Nonlinearity For Data Word Range 0x014 to 0xFEB 2 Differential Nonlinearity Guaranteed Monotonic (codes 0x014 to 1 0xFEB) Output Noise No Output Filter 250 100kHz Output Filter 128 10kHz Output Filter 41 Offset Error Data Word = 0x014 3 30 Offset Tempco 6 Full-Scale Error 20 60 Full-Scale Error Tempco 10 -60 VDD Power-Supply Rejection Ratio DACnEN=0 100 Output Impedance in Shutdown Mode 300 Output Current m en de d fo r Output Short Circuit Current Data Word = 0xFFF DYNAMIC PERFORMANCE Voltage Output Slew Rate Load = 40pF Output Settling Time To ½ Load = 40pF, Output swing from code LSB 0xFFF to 0x014 Output Voltage Swing mV ppm/C mV ppm/C dB k A 15 mA 0.44 10 V/s s 0 REF1LSB V 10 s 60 ppm 110 400 A N ot R ec om Startup Time DAC Enable asserted ANALOG OUTPUTS Load Regulation IL = 0.01mA to 0.3mA at code 0xFFF CURRENT CONSUMPTION (each DAC) Power Supply Current (AV+ Data Word = 0x7FF supplied to DAC) Vrms Rev. 1.7 54 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 8. COMPARATORS es ig ns The MCU family has two on-chip analog voltage comparators as shown in Figure 8.1. The inputs of each Comparator are available at the package pins. The output of each comparator is optionally available at the package pins via the I/O crossbar (see Section 15.1). When assigned to package pins, each comparator output can be programmed to operate in open drain or push-pull modes (see section 15.3). D The hysteresis of each comparator is software-programmable via its respective Comparator control register (CPT0CN, CPT1CN). The user can program both the amount of hysteresis voltage (referred to the input voltage) and the positive and negative-going symmetry of this hysteresis around the threshold voltage. The output of the comparator can be polled in software, or can be used as an interrupt source. Each comparator can be individually enabled or disabled (shutdown). When disabled, the comparator output (if assigned to a Port I/O pin via the Crossbar) defaults to the logic low state, its interrupt capability is suspended and its supply current falls to less than 1A. Comparator 0 inputs can be externally driven from -0.25V to (AV+) + 0.25V without damage or upset. N ew The Comparator 0 hysteresis is programmed using bits 3-0 in the Comparator 0 Control Register CPT0CN (shown in Figure 8.3). The amount of negative hysteresis voltage is determined by the settings of the CP0HYN bits. As shown in Figure 8.2, settings of 10, 4 or 2mV of negative hysteresis can be programmed, or negative hysteresis can be disabled. In a similar way, the amount of positive hysteresis is determined by the setting the CP0HYP bits. m en de d fo r Comparator interrupts can be generated on both rising-edge and falling-edge output transitions. (For Interrupt enable and priority control, see Section 10.4). The CP0FIF flag is set upon a Comparator 0 falling-edge interrupt, and the CP0RIF flag is set upon the Comparator 0 rising-edge interrupt. Once set, these bits remain set until cleared by the CPU. The Output State of Comparator 0 can be obtained at any time by reading the CP0OUT bit. Note the comparator output and interrupt should be ignored until the comparator settles after power-up. Comparator 0 is enabled by setting the CP0EN bit, and is disabled by clearing this bit. Note there is a 20usec settling time for the comparator output to stabilize after setting the CP0EN bit or a power-up. Comparator 0 can also be programmed as a reset source. For details, see Section 13. The operation of Comparator 1 is identical to that of Comparator 0, except the Comparator 1 is controlled by the CPT1CN Register (Figure 8.4). Comparator 1 can not be programmed as a reset source. Also, the input pins for Comparator 1 are not pinned out on the F002, F007, F012, or F017 devices. The complete electrical specifications for the Comparators are given in Table 8.1. Figure 8.1. Comparator Functional Block Diagram CP0EN CPT0CN CP0HYP1 CP0HYP0 Reset Decision Tree CP0HYN0 + CP0- - D SET CLR Q D Q SET CLR Q Q (SYNCHRONIZER) Crossbar Interrupt Handler AGND CP1EN CP1OUT CP1RIF AV+ CP1FIF CP1HYP1 CP1HYP0 CP1HYN1 CP1HYN0 CP1+ + CP1- - D not available on F002, F007, F012, and F017 55 AV+ CP0HYN1 CPT1CN N ot CP0RIF CP0FIF CP0+ R ec om CP0OUT AGND Rev. 1.7 SET CLR Q Q D SET CLR Q Q (SYNCHRONIZER) Crossbar Interrupt Handler C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 8.2. Comparator Hysteresis Plot VIN- CP0+ CP0- + CP0 _ es ig ns VIN+ OUT D CIRCUIT CONFIGURATION Positive Hysteresis Voltage (Programmed with CP0HYSP Bits) N ew VIN- INPUTS Negative Hysteresis Voltage (Programmed by CP0HYSN Bits) VOH m en de d OUTPUT fo r VIN+ VOL Negative Hysteresis Disabled Maximum Positive Hysteresis N ot R ec om Positive Hysteresis Disabled Maximum Negative Hysteresis Rev. 1.7 56 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 8.3. CPT0CN: Comparator 0 Control Register R/W R R/W R/W R/W R/W R/W R/W CP0EN CP0OUT CP0RIF CP0FIF CP0HYP1 CP0HYP0 CP0HYN1 CP0HYN0 Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns 0x9E CP0EN: Comparator 0 Enable Bit 0: Comparator 0 Disabled. 1: Comparator 0 Enabled. Bit6: CP0OUT: Comparator 0 Output State Flag 0: Voltage on CP0+ < CP01: Voltage on CP0+ > CP0Bit5: CP0RIF: Comparator 0 Rising-Edge Interrupt Flag 0: No Comparator 0 Rising-Edge Interrupt has occurred since this flag was cleared 1: Comparator 0 Rising-Edge Interrupt has occurred since this flag was cleared Bit4: CP0FIF: Comparator 0 Falling-Edge Interrupt Flag 0: No Comparator 0 Falling-Edge Interrupt has occurred since this flag was cleared 1: Comparator 0 Falling-Edge Interrupt has occurred since this flag was cleared Bit3-2: CP0HYP1-0: Comparator 0 Positive Hysteresis Control Bits 00: Positive Hysteresis Disabled 01: Positive Hysteresis = 2mV 10: Positive Hysteresis = 4mV 11: Positive Hysteresis = 10mV Bit1-0: CP0HYN1-0: Comparator 0 Negative Hysteresis Control Bits 00: Negative Hysteresis Disabled 01: Negative Hysteresis = 2mV 10: Negative Hysteresis = 4mV 11: Negative Hysteresis = 10mV N ot R ec om m en de d fo r N ew D Bit7: 57 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 8.4. CPT1CN: Comparator 1 Control Register R R/W R/W R/W R/W R/W R/W CP1OUT CP1RIF CP1FIF CP1HYP1 CP1HYP0 CP1HYN1 CP1HYN0 Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W CP1EN 0x9F CP1EN: Comparator 1 Enable Bit 0: Comparator 1 Disabled. 1: Comparator 1 Enabled. Bit6: CP1OUT: Comparator 1 Output State Flag 0: Voltage on CP1+ < CP11: Voltage on CP1+ > CP1Bit5: CP1RIF: Comparator 1 Rising-Edge Interrupt Flag 0: No Comparator 1 Rising-Edge Interrupt has occurred since this flag was cleared 1: Comparator 1 Rising-Edge Interrupt has occurred since this flag was cleared Bit4: CP1FIF: Comparator 1 Falling-Edge Interrupt Flag 0: No Comparator 1 Falling-Edge Interrupt has occurred since this flag was cleared 1: Comparator 1 Falling-Edge Interrupt has occurred since this flag was cleared Bit3-2: CP1HYP1-0: Comparator 1 Positive Hysteresis Control Bits 00: Positive Hysteresis Disabled 01: Positive Hysteresis = 2mV 10: Positive Hysteresis = 4mV 11: Positive Hysteresis = 10mV Bit1-0: CP1HYN1-0: Comparator 1 Negative Hysteresis Control Bits 00: Negative Hysteresis Disabled 01: Negative Hysteresis = 2mV 10: Negative Hysteresis = 4mV 11: Negative Hysteresis = 10mV N ot R ec om m en de d fo r N ew D Bit7: Rev. 1.7 58 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 8.1. Comparator Electrical Characteristics 2 4 10 -0.25 0 4.5 9 17 0 4.5 9 17 MAX m en de d fo r -5 -10 N ot R ec om Note 1: CPnHYP1-0 = CPnHYN1-0 = 00. 59 Rev. 1.7 7 0.001 20 0.1 1.5 UNITS s s mV/V es ig ns 2 4 10 TYP 4 12 1.5 4 1 7 13 25 1 7 13 25 (AV+) + 0.25 D MIN N ew VDD = 3.0V, AV+ = 3.0V, -40C to +85C unless otherwise specified. PARAMETER CONDITIONS Response Time1 (CP+) – (CP-) = 100mV (Note 1) Response Time2 (CP+) – (CP-) = 10mV (Note 1) Common Mode Rejection Ratio Positive Hysteresis1 CPnHYP1-0 = 00 Positive Hysteresis2 CPnHYP1-0 = 01 Positive Hysteresis3 CPnHYP1-0 = 10 Positive Hysteresis4 CPnHYP1-0 = 11 Negative Hysteresis1 CPnHYN1-0 = 00 Negative Hysteresis2 CPnHYN1-0 = 01 Negative Hysteresis3 CPnHYN1-0 = 10 Negative Hysteresis4 CPnHYN1-0 = 11 Inverting or Non-inverting Input Voltage Range Input Capacitance Input Bias Current Input Offset Voltage POWER SUPPLY Power-up Time CPnEN from 0 to 1 Power Supply Rejection Supply Current Operating Mode (each comparator) at DC mV mV mV mV mV mV mV mV V +5 +10 pF nA mV 1 10 s mV/V A C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 9. VOLTAGE REFERENCE es ig ns The voltage reference circuit consists of a 1.2V, 15ppm/C (typical) bandgap voltage reference generator and a gain-of-two output buffer amplifier. The reference voltage on VREF can be connected to external devices in the system, as long as the maximum load seen by the VREF pin is less than 200A to AGND (see Figure 9.1). N ew D If a different reference voltage is required, an external reference can be connected to the VREF pin and the internal bandgap and buffer amplifier disabled in software. The external reference voltage must still be less than AV+ 0.3V. The Reference Control Register, REF0CN (defined in Figure 9.2), provides the means to enable or disable the bandgap and buffer amplifier. The BIASE bit in REF0CN enables the bias circuitry for the ADC and DACs while the REFBE bit enables the bandgap reference and buffer amplifier which drive the VREF pin. When disabled, the supply current drawn by the bandgap and buffer amplifier falls to less than 1uA (typical) and the output of the buffer amplifier enters a high impedance state. If the internal bandgap is used as the reference voltage generator, BIASE and REFBE must both be set to 1. If an external reference is used, REFBE must be set to 0 and BIASE must be set to 1. If neither the ADC nor the DAC are being used, both of these bits can be set to 0 to conserve power. The electrical specifications for the Voltage Reference are given in Table 9.1. The temperature sensor connects to the highest order input of the A/D converter’s input multiplexer (see Figure 5.1 and Figure 5.5 for details). The TEMPE bit within REF0CN enables and disables the temperature sensor. While disabled, the temperature sensor defaults to a high impedance state and any A/D measurements performed on the sensor while disabled result in meaningless data. AGND EN REF0CN R1 External Voltage Reference Circuit m en de d AV+ fo r Figure 9.1. Voltage Reference Functional Block Diagram TEMPE BIASE REFBE VREF Bias Generator EN (to Analog Mux) (Bias to ADC and DAC) AGND 2.4V Reference EN (to ADC and DAC) AGND RLOAD ec 200uA (max) om External Equivalent Load Circuit Temp Sensor N ot R AGND Rev. 1.7 60 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 9.2. REF0CN: Reference Control Register R/W R/W R/W R/W R/W R/W R/W R/W Reset Value - - - - - TEMPE BIASE REFBE 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns 0xD1 N ew D Bits7-3: UNUSED. Read = 00000b; Write = don’t care Bit2: TEMPE: Temperature Sensor Enable Bit 0: Internal Temperature Sensor Off. 1: Internal Temperature Sensor On. Bit1: BIASE: Bias Enable Bit for ADC and DAC’s 0: Internal Bias Off. 1: Internal Bias On (required for use of ADC or DAC’s). Bit0: REFBE: Internal Voltage Reference Buffer Enable Bit 0: Internal Reference Buffer Off. System reference can be driven from external source on VREF pin. 1: Internal Reference Buffer On. System reference provided by internal voltage reference. fo r Table 9.1. Reference Electrical Characteristics MIN TYP MAX UNITS 2.34 2.43 2.50 30 50 V mA A 15 ppm/C 0.5 2 20 10 ppm/A ms s s om m en de d VDD = 3.0V, AV+ = 3.0V, -40C to +85C unless otherwise specified. PARAMETER CONDITIONS INTERNAL REFERENCE (REFBE = 1) Output Voltage 25C ambient VREF Short Circuit Current VREF Power Supply Current (supplied by AV+) VREF Temperature Coefficient Load Regulation Load = (0-to-200A) to AGND (Note 1) VREF Turn-on Time1 4.7F tantalum, 0.1F ceramic bypass VREF Turn-on Time2 0.1F ceramic bypass VREF Turn-on Time3 no bypass cap EXTERNAL REFERENCE (REFBE = 0) Input Voltage Range 0 ec Input Current 1.00 (AV+) – 0.3V 1 V A N ot R Note 1: The reference can only source current. When driving an external load, it is recommended to add a load resistor to AGND. 61 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 10. CIP-51 CPU es ig ns The MCUs’ system CPU is the CIP-51. The CIP-51 is fully compatible with the MCS-51TM instruction set. Standard 803x/805x assemblers and compilers can be used to develop software. The MCU family has a superset of all the peripherals included with a standard 8051. Included are four 16-bit counter/timers (see description in Section 19), a full-duplex UART (see description in Section 18), 256 bytes of internal RAM, 128 byte Special Function Register (SFR) address space (see Section 10.3), and four byte-wide I/O Ports (see description in Section 14). The CIP-51 also includes on-chip debug hardware (see description in Section 21), and interfaces directly with the MCUs’ analog and digital subsystems providing a complete data acquisition or control-system solution in a single integrated circuit. D Features The CIP-51 Microcontroller core implements the standard 8051 organization and peripherals as well as additional custom peripherals and functions to extend its capability (see Figure 10.1 for a block diagram). The CIP-51 includes the following features: - Fully Compatible with MCS-51 Instruction Set 25 MIPS Peak Throughput with 25MHz Clock 0 to 25MHz Clock Frequency (on ‘F0x5/6/7) Four Byte-Wide I/O Ports Extended Interrupt Handler Reset Input Power Management Modes On-chip Debug Circuitry Program and Data Memory Security N ew - fo r Figure 10.1. CIP-51 Block Diagram D8 D8 ACCUMULATOR STACK POINTER TMP2 PSW D8 D8 ALU SRAM ADDRESS REGISTER SRAM (256 X 8) D8 TMP1 D8 DATA BUS B REGISTER D8 D8 D8 m en de d DATA BUS ec om DATA BUS D8 DATA POINTER D8 D8 SFR BUS INTERFACE SFR_CONTROL SFR_WRITE_DATA SFR_READ_DATA DATA BUS PC INCREMENTER PROGRAM COUNTER (PC) R N ot SFR_ADDRESS BUFFER PRGM. ADDRESS REG. MEM_ADDRESS D8 MEM_CONTROL A16 MEMORY INTERFACE MEM_WRITE_DATA MEM_READ_DATA PIPELINE RESET D8 CONTROL LOGIC SYSTEM_IRQs CLOCK D8 STOP IDLE POWER CONTROL REGISTER INTERRUPT INTERFACE EMULATION_IRQ D8 Rev. 1.7 62 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 es ig ns Performance The CIP-51 employs a pipelined architecture that greatly increases its instruction throughput over the standard 8051 architecture. In a standard 8051, all instructions except for MUL and DIV take 12 or 24 system clock cycles to execute, and usually have a maximum system clock of 12MHz. By contrast, the CIP-51 core executes 70% of its instructions in one or two system clock cycles, with no instructions taking more than eight system clock cycles. With the CIP-51’s maximum system clock at 25MHz, it has a peak throughput of 25MIPS. The CIP-51 has a total of 109 instructions. The number of instructions versus the system clock cycles required to execute them is as follows: 26 1 50 2 5 2/3 14 3 7 3/4 3 4 1 4/5 2 5 1 8 D Instructions Clocks to Execute N ew Programming and Debugging Support A JTAG-based serial interface is provided for in-system programming of the Flash program memory and communication with on-chip debug support circuitry. The reprogrammable Flash can also be read and changed a single byte at a time by the application software using the MOVC and MOVX instructions. This feature allows program memory to be used for non-volatile data storage as well as updating program code under software control. fo r The on-chip debug support circuitry facilitates full speed in-circuit debugging, allowing the setting of hardware breakpoints and watch points, starting, stopping and single stepping through program execution (including interrupt service routines), examination of the program’s call stack, and reading/writing the contents of registers and memory. This method of on-chip debugging is completely non-intrusive and non-invasive, requiring no RAM, Stack, timers, or other on-chip resources. 10.1. m en de d The CIP-51 is supported by development tools from Silicon Laboratories and third party vendors. Silicon Labs provides an integrated development environment (IDE) including editor, macro assembler, debugger and programmer. The IDE’s debugger and programmer interface to the CIP-51 via its JTAG interface to provide fast and efficient in-system device programming and debugging. Third party macro assemblers and C compilers are also available. INSTRUCTION SET om The instruction set of the CIP-51 System Controller is fully compatible with the standard MCS-51™ instruction set. Standard 8051 development tools can be used to develop software for the CIP-51. All CIP-51 instructions are the binary and functional equivalent of their MCS-51™ counterparts, including opcodes, addressing modes and effect on PSW flags. However, instruction timing is different than that of the standard 8051. 10.1.1. Instruction and CPU Timing ec In many 8051 implementations, a distinction is made between machine cycles and clock cycles, with machine cycles varying from 2 to 12 clock cycles in length. However, the CIP-51 implementation is based solely on clock cycle timing. All instruction timings are specified in terms of clock cycles. R Due to the pipelined architecture of the CIP-51, most instructions execute in the same number of clock cycles as there are program bytes in the instruction. Conditional branch instructions take one less clock cycle to complete when the branch is not taken as opposed to when the branch is taken. Table 10.1 is the CIP-51 Instruction Set Summary, which includes the mnemonic, number of bytes, and number of clock cycles for each instruction. N ot 10.1.2. MOVX Instruction and Program Memory The MOVX instruction is typically used to access external data memory. In the CIP-51, the MOVX instruction can access the on-chip program memory space implemented as reprogrammable Flash memory using the control bits in the PSCTL register (see Figure 11.1). This feature provides a mechanism for the CIP-51 to update program code and use the program memory space for non-volatile data storage. For the products with RAM mapped into external data memory space (C8051F005/06/07/15/16/17), MOVX is still used to read/write this memory with the PSCTL 63 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 N ot R ec om m en de d fo r N ew D es ig ns register configured for accessing the external data memory space. Refer to Section 11 (Flash Memory) for further details. Rev. 1.7 64 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 10.1. CIP-51 Instruction Set Summary N ot R Rev. 1.7 es ig ns Clock Cycles 1 2 1 2 1 2 1 2 1 2 1 2 1 1 2 1 1 1 2 1 1 1 1 1 1 2 2 2 1 2 2 2 1 2 2 2 1 1 2 2 1 1 2 2 1 4 8 1 1 2 1 2 2 3 1 2 1 2 2 3 1 2 1 2 2 3 1 1 1 1 1 2 2 2 2 3 1 2 2 2 2 3 1 2 2 2 2 3 1 1 1 1 D ARITHMETIC OPERATIONS Add register to A Add direct byte to A Add indirect RAM to A Add immediate to A Add register to A with carry Add direct byte to A with carry Add indirect RAM to A with carry Add immediate to A with carry Subtract register from A with borrow Subtract direct byte from A with borrow Subtract indirect RAM from A with borrow Subtract immediate from A with borrow Increment A Increment register Increment direct byte Increment indirect RAM Decrement A Decrement register Decrement direct byte Decrement indirect RAM Increment Data Pointer Multiply A and B Divide A by B Decimal Adjust A LOGICAL OPERATIONS AND Register to A AND direct byte to A AND indirect RAM to A AND immediate to A AND A to direct byte AND immediate to direct byte OR Register to A OR direct byte to A OR indirect RAM to A OR immediate to A OR A to direct byte OR immediate to direct byte Exclusive-OR Register to A Exclusive-OR direct byte to A Exclusive-OR indirect RAM to A Exclusive-OR immediate to A Exclusive-OR A to direct byte Exclusive-OR immediate to direct byte Clear A Complement A Rotate A left Rotate A left through carry fo r ec om ANL A,Rn ANL A,direct ANL A,@Ri ANL A,#data ANL direct,A ANL direct,#data ORL A,Rn ORL A,direct ORL A,@Ri ORL A,#data ORL direct,A ORL direct,#data XRL A,Rn XRL A,direct XRL A,@Ri XRL A,#data XRL direct,A XRL direct,#data CLR A CPL A RL A RLC A 65 Bytes m en de d ADD A,Rn ADD A,direct ADD A,@Ri ADD A,#data ADDC A,Rn ADDC A,direct ADDC A,@Ri ADDC A,#data SUBB A,Rn SUBB A,direct SUBB A,@Ri SUBB A,#data INC A INC Rn INC direct INC @Ri DEC A DEC Rn DEC direct DEC @Ri INC DPTR MUL AB DIV AB DA A Description N ew Mnemonic C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Rotate A right Rotate A right through carry Swap nibbles of A DATA TRANSFER Move register to A Move direct byte to A Move indirect RAM to A Move immediate to A Move A to register Move direct byte to register Move immediate to register Move A to direct byte Move register to direct byte Move direct byte to direct Move indirect RAM to direct byte Move immediate to direct byte Move A to indirect RAM Move direct byte to indirect RAM Move immediate to indirect RAM Load data pointer with 16-bit constant Move code byte relative DPTR to A Move code byte relative PC to A Move external data (8-bit address) to A Move A to external data (8-bit address) Move external data (16-bit address) to A Move A to external data (16-bit address) Push direct byte onto stack Pop direct byte from stack Exchange register with A Exchange direct byte with A Exchange indirect RAM with A Exchange low nibble of indirect RAM with A BOOLEAN MANIPULATION Clear carry Clear direct bit Set carry Set direct bit Complement carry Complement direct bit AND direct bit to carry AND complement of direct bit to carry OR direct bit to carry OR complement of direct bit to carry Move direct bit to carry Move carry to direct bit Jump if carry is set Jump if carry not set Jump if direct bit is set Jump if direct bit is not set Jump if direct bit is set and clear bit N ot R ec om CLR C CLR bit SETB C SETB bit CPL C CPL bit ANL C,bit ANL C,/bit ORL C,bit ORL C,/bit MOV C,bit MOV bit,C JC rel JNC rel JB bit,rel JNB bit,rel JBC bit,rel fo r m en de d MOV A,Rn MOV A,direct MOV A,@Ri MOV A,#data MOV Rn,A MOV Rn,direct MOV Rn,#data MOV direct,A MOV direct,Rn MOV direct,direct MOV direct,@Ri MOV direct,#data MOV @Ri,A MOV @Ri,direct MOV @Ri,#data MOV DPTR,#data16 MOVC A,@A+DPTR MOVC A,@A+PC MOVX A,@Ri MOVX @Ri,A MOVX A,@DPTR MOVX @DPTR,A PUSH direct POP direct XCH A,Rn XCH A,direct XCH A,@Ri XCHD A,@Ri 1 1 1 1 2 1 2 1 2 2 2 2 3 2 3 1 2 2 3 1 1 1 1 1 1 2 2 1 2 1 1 1 2 2 2 1 2 2 2 2 3 2 3 2 2 2 3 3 3 3 3 3 3 2 2 1 2 2 2 1 2 1 2 1 2 2 2 2 2 2 2 2 2 3 3 3 1 2 1 2 1 2 2 2 2 2 2 2 2/3 2/3 3/4 3/4 3/4 es ig ns RR A RRC A SWAP A Clock Cycles 1 1 1 Bytes D Description N ew Mnemonic Rev. 1.7 66 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 CJNE @Ri,#data,rel fo r DJNZ Rn,rel DJNZ direct,rel NOP PROGRAM BRANCHING Absolute subroutine call Long subroutine call Return from subroutine Return from interrupt Absolute jump Long jump Short jump (relative address) Jump indirect relative to DPTR Jump if A equals zero Jump if A does not equal zero Compare direct byte to A and jump if not equal Compare immediate to A and jump if not equal Compare immediate to register and jump if not equal Compare immediate to indirect and jump if not equal Decrement register and jump if not zero Decrement direct byte and jump if not zero No operation Clock Cycles 2 3 1 1 2 3 2 1 2 2 3 3 3 3 4 5 5 3 4 3 3 2/3 2/3 3/4 3/4 3/4 3 4/5 2 3 1 2/3 3/4 1 es ig ns ACALL addr11 LCALL addr16 RET RETI AJMP addr11 LJMP addr16 SJMP rel JMP @A+DPTR JZ rel JNZ rel CJNE A,direct,rel CJNE A,#data,rel CJNE Rn,#data,rel Bytes D Description N ew Mnemonic m en de d Notes on Registers, Operands and Addressing Modes: Rn - Register R0-R7 of the currently selected register bank. @Ri - Data RAM location addressed indirectly through register R0-R1 rel - 8-bit, signed (two’s compliment) offset relative to the first byte of the following instruction. Used by SJMP and all conditional jumps. direct - 8-bit internal data location’s address. This could be a direct-access Data RAM location (0x00-0x7F) or an SFR (0x80-0xFF). om #data - 8-bit constant #data 16 - 16-bit constant ec bit - Direct-addressed bit in Data RAM or SFR. R addr 11 - 11-bit destination address used by ACALL and AJMP. The destination must be within the same 2Kbyte page of program memory as the first byte of the following instruction. N ot addr 16 - 16-bit destination address used by LCALL and LJMP. The destination may be anywhere within the 64K-byte program memory space. There is one unused opcode (0xA5) that performs the same function as NOP. All mnemonics copyrighted © Intel Corporation 1980. 67 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 10.2. MEMORY ORGANIZATION es ig ns The memory organization of the CIP-51 System Controller is similar to that of a standard 8051. There are two separate memory spaces: program memory and data memory. Program and data memory share the same address space but are accessed via different instruction types. There are 256 bytes of internal data memory and 64K bytes of internal program memory address space implemented within the CIP-51. The CIP-51 memory organization is shown in Figure 10.2. 10.2.1. Program Memory The CIP-51 has a 64K-byte program memory space. The MCU implements 32896 bytes of this program memory space as in-system, reprogrammable Flash memory, organized in a contiguous block from addresses 0x0000 to 0x807F. Note: 512 bytes (0x7E00 – 0x7FFF) of this memory are reserved for factory use and are not available for user program storage. N ew D Program memory is normally assumed to be read-only. However, the CIP-51 can write to program memory by setting the Program Store Write Enable bit (PSCTL.0) and using the MOVX instruction. This feature provides a mechanism for the CIP-51 to update program code and use the program memory space for non-volatile data storage. Refer to Section 11 (Flash Memory) for further details. 10.2.2. Data Memory fo r The CIP-51 implements 256 bytes of internal RAM mapped into the data memory space from 0x00 through 0xFF. The lower 128 bytes of data memory are used for general purpose registers and scratch pad memory. Either direct or indirect addressing may be used to access the lower 128 bytes of data memory. Locations 0x00 through 0x1F are addressable as four banks of general purpose registers, each bank consisting of eight byte-wide registers. The next 16 bytes, locations 0x20 through 0x2F, may be addressed as bytes or as 128 bit locations accessible with the directbit addressing mode. m en de d The upper 128 bytes of data memory are accessible only by indirect addressing. This region occupies the same address space as the Special Function Registers (SFR) but is physically separate from the SFR space. The addressing mode used by an instruction when accessing locations above 0x7F determines whether the CPU accesses the upper 128 bytes of data memory space or the SFRs. Instructions that use direct addressing will access the SFR space. Instructions using indirect addressing above 0x7F will access the upper 128 bytes of data memory. Figure 10.2 illustrates the data memory organization of the CIP-51. The C8051F005/06/07/15/16/17 also have 2048 bytes of RAM in the external data memory space of the CIP-51, accessible using the MOVX instruction. Refer to Section 12 (External RAM) for details. 10.2.3. General Purpose Registers ec om The lower 32 bytes of data memory, locations 0x00 through 0x1F, may be addressed as four banks of generalpurpose registers. Each bank consists of eight byte-wide registers designated R0 through R7. Only one of these banks may be enabled at a time. Two bits in the program status word, RS0 (PSW.3) and RS1 (PSW.4), select the active register bank (see description of the PSW in Figure 10.6). This allows fast context switching when entering subroutines and interrupt service routines. Indirect addressing modes use registers R0 and R1 as index registers. R 10.2.4. Bit Addressable Locations N ot In addition to direct access to data memory organized as bytes, the sixteen data memory locations at 0x20 through 0x2F are also accessible as 128 individually addressable bits. Each bit has a bit address from 0x00 to 0x7F. Bit 0 of the byte at 0x20 has bit address 0x00 while bit 7 of the byte at 0x20 has bit address 0x07. Bit 7 of the byte at 0x2F has bit address 0x7F. A bit access is distinguished from a full byte access by the type of instruction used (bit source or destination operands as opposed to a byte source or destination). The MCS-51™ assembly language allows an alternate notation for bit addressing of the form XX.B where XX is the byte address and B is the bit position within the byte. For example, the instruction: MOV C, 22h.3 moves the Boolean value at 0x13 (bit 3 of the byte at location 0x22) into the user Carry flag. Rev. 1.7 68 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 10.2. Memory Map 128 Byte ISP FLASH 0x8000 0x7FFF 0x7E00 0xFF RESERVED 0x80 0x7F 0x7DFF Upper 128 RAM (Indirect Addressing Only) (Direct and Indirect Addressing) (In-System Programmable in 512 Byte Sectors) 0x30 0x2F 0x20 0x1F 0x00 0x0000 Bit Addressable General Purpose Registers Special Function Register's (Direct Addressing Only) Lower 128 RAM (Direct and Indirect Addressing) N ew FLASH es ig ns 0x807F DATA MEMORY INTERNAL DATA ADDRESS SPACE D PROGRAM MEMORY EXTERNAL DATA ADDRESS SPACE 0xFFFF (same 2048 byte RAM block ) fo r 0xF800 m en de d 0x17FF (same 2048 byte RAM block ) 0x1000 0x0FFF 0x0800 0x07FF 0x0000 10.2.5. Stack (same 2048 byte RAM block ) The same 2048 byte RAM block can be addressed on 2k boundaries throughout the 64k External Data Memory space. RAM - 2048 Bytes (accessable using MOVX command) ec om A programmer’s stack can be located anywhere in the 256-byte data memory. The stack area is designated using the Stack Pointer (SP, 0x81) SFR. The SP will point to the last location used. The next value pushed on the stack is placed at SP+1 and then SP is incremented. A reset initializes the stack pointer to location 0x07. Therefore, the first value pushed on the stack is placed at location 0x08, which is also the first register (R0) of register bank 1. Thus, if more than one register bank is to be used, the SP should be initialized to a location in the data memory not being used for data storage. The stack depth can extend up to 256 bytes. N ot R The MCUs also have built-in hardware for a stack record. The stack record is a 32-bit shift register, where each Push or increment SP pushes one record bit onto the register, and each Call or interrupt pushes two record bits onto the register. (A Pop or decrement SP pops one record bit, and a Return pops two record bits, also.) The stack record circuitry can also detect an overflow or underflow on the Stack, and can notify the debug software even with the MCU running full-speed debug. 69 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 10.3. SPECIAL FUNCTION REGISTERS es ig ns The direct-access data memory locations from 0x80 to 0xFF constitute the special function registers (SFRs). The SFRs provide control and data exchange with the CIP-51’s resources and peripherals. The CIP-51 duplicates the SFRs found in a typical 8051 implementation as well as implementing additional SFRs used to configure and access the sub-systems unique to the MCU. This allows the addition of new functionality while retaining compatibility with the MCS-51™ instruction set. Table 10.3 lists the SFRs implemented in the CIP-51 System Controller. D The SFR registers are accessed any time the direct addressing mode is used to access memory locations from 0x80 to 0xFF. SFRs with addresses ending in 0x0 or 0x8 (e.g. P0, TCON, P1, SCON, IE, etc.) are bit-addressable as well as byte-addressable. All other SFRs are byte-addressable only. Unoccupied addresses in the SFR space are reserved for future use. Accessing these areas will have an indeterminate effect and should be avoided. Refer to the corresponding pages of the datasheet, as indicated in Table 10.3, for a detailed description of each register. Table 10.2. Special Function Register Memory Map SPI0CN PCA0H PCA0CPH0 PCA0CPH1 PCA0CPH2 B PCA0L PCA0CPL0 PCA0CPL1 ACC XBR0 XBR1 XBR2 PCA0CN PCA0MD PCA0CPM0 PCA0CPM1 PSW REF0CN SMB0CN P3 EIP2 PCA0CPL4 RSTSRC EIE1 EIE2 PCA0CPM2 PCA0CPM3 PCA0CPM4 DAC1H DAC1CN ADC0LTL ADC0LTH ADC0L ADC0H DAC0L DAC0H DAC0CN DAC1L RCAP2H TL2 TH2 SMB0STA SMB0DAT SMB0ADR ADC0GTL AMX0CF AMX0SL ADC0CF OSCXCN OSCICN IP ADC0GTH SMB0CR FLSCL PRT1IF m en de d IE P2 PRT0CF SCON P1 TCON P0 0(8) PRT2CF PRT3CF SPI0CKR CPT0CN CPT1CN SPI0CFG SPI0DAT TMR3CN TMR3RLL TMR3RLH TMR3L TMR3H TH0 TH1 TMOD TL0 TL1 DPL DPH 1(9) 2(A) 3(B) FLACL*** EMI0CN*** PRT1CF SBUF SP WDTCN EIP1 PCA0CPL3 RCAP2L T2CON PCA0CPH4 PCA0CPL2 fo r ADC0CN PCA0CPH3 N ew F8 F0 E8 E0 D8 D0 C8 C0 B8 B0 A8 A0 98 90 88 80 CKCON PSCTL PCON 4(C) 5(D) 6(E) 7(F) om Bit Addressable Table 10.3. Special Function Registers ec SFRs are listed in alphabetical order. All undefined SFR locations are reserved. * Refers to a register in the C8051F000/1/2/5/6/7 only. ** Refers to a register in the C8051F010/1/2/5/6/7 only. *** Refers to a register in the C8051F005/06/07/15/16/17 only. Register Description Page No. 0xE0 0xBC 0xE8 0xC5 0xC4 0xBF ACC ADC0CF ADC0CN ADC0GTH ADC0GTL ADC0H Accumulator ADC Configuration ADC Control ADC Greater-Than Data Word (High Byte) ADC Greater-Than Data Word (Low Byte) ADC Data Word (High Byte) 76 33*, 42** 34*, 45** 36*, 47** 36*, 47** 35*, 46** 0xBE ADC0L ADC Data Word (Low Byte) 35*, 46** N ot R Address Rev. 1.7 70 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Page No. ADC0LTH ADC0LTL AMX0CF AMX0SL B CKCON CPT0CN CPT1CN DAC0CN DAC0H DAC0L DAC1CN DAC1H DAC1L DPH DPL EIE1 EIE2 EIP1 EIP2 EMI0CN FLACL FLSCL IE IP OSCICN OSCXCN P0 P1 P2 P3 PCA0CN PCA0CPH0 PCA0CPH1 PCA0CPH2 PCA0CPH3 PCA0CPH4 PCA0CPL0 PCA0CPL1 PCA0CPL2 PCA0CPL3 ADC Less-Than Data Word (High Byte) ADC Less-Than Data Word (Low Byte) ADC MUX Configuration ADC MUX Channel Selection B Register Clock Control Comparator 0 Control Comparator 1 Control DAC 0 Control DAC 0 Data Word (High Byte) DAC 0 Data Word (Low Byte) DAC 1 Control DAC 1 Data Word (High Byte) DAC 1 Data Word (Low Byte) Data Pointer (High Byte) Data Pointer (Low Byte) Extended Interrupt Enable 1 Extended Interrupt Enable 2 External Interrupt Priority 1 External Interrupt Priority 2 External Memory Interface Control Flash Access Limit Flash Memory Timing Prescaler Interrupt Enable Interrupt Priority Control Internal Oscillator Control External Oscillator Control Port 0 Latch Port 1 Latch Port 2 Latch Port 3 Latch Programmable Counter Array 0 Control PCA Capture Module 0 Data Word (High Byte) PCA Capture Module 1 Data Word (High Byte) PCA Capture Module 2 Data Word (High Byte) PCA Capture Module 3 Data Word (High Byte) PCA Capture Module 4 Data Word (High Byte) PCA Capture Module 0 Data Word (Low Byte) PCA Capture Module 1 Data Word (Low Byte) PCA Capture Module 2 Data Word (Low Byte) PCA Capture Module 3 Data Word (Low Byte) 36*, 47** 36*, 47** 31*, 42** 32*, 43** 76 144 56 58 52 52 52 53 53 53 74 74 81 82 83 84 92*** 90*** 91 79 80 100 101 109 110 111 112 160 163 163 163 163 163 163 163 163 163 D N ew fo r om R N ot 71 es ig ns Description ec 0xC7 0xC6 0xBA 0xBB 0xF0 0x8E 0x9E 0x9F 0xD4 0xD3 0xD2 0xD7 0xD6 0xD5 0x83 0x82 0xE6 0xE7 0xF6 0xF7 0xAF 0xB7 0xB6 0xA8 0xB8 0xB2 0xB1 0x80 0x90 0xA0 0xB0 0xD8 0xFA 0xFB 0xFC 0xFD 0xFE 0xEA 0xEB 0xEC 0xED Register m en de d Address Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Register Description 0xEE 0xDA 0xDB 0xDC 0xDD 0xDE 0xF9 0xE9 0xD9 0x87 0xA4 0xA5 0xAD 0xA6 0xA7 0x8F 0xD0 0xCB 0xCA 0xD1 0xEF PCA0CPL4 PCA0CPM0 PCA0CPM1 PCA0CPM2 PCA0CPM3 PCA0CPM4 PCA0H PCA0L PCA0MD PCON PRT0CF PRT1CF PRT1IF PRT2CF PRT3CF PSCTL PSW RCAP2H RCAP2L REF0CN RSTSRC PCA Capture Module 4 Data Word (Low Byte) Programmable Counter Array 0 Capture/Compare 0 Programmable Counter Array 0 Capture/Compare 1 Programmable Counter Array 0 Capture/Compare 2 Programmable Counter Array 0 Capture/Compare 3 Programmable Counter Array 0 Capture/Compare 4 PCA Counter/Timer Data Word (High Byte) PCA Counter/Timer Data Word (Low Byte) Programmable Counter Array 0 Mode Power Control Port 0 Configuration Port 1 Configuration Port 1 Interrupt Flags Port 2 Configuration Port 3 Configuration Program Store RW Control Program Status Word Counter/Timer 2 Capture (High Byte) Counter/Timer 2 Capture (Low Byte) Voltage Reference Control Register Reset Source Register 0x99 SBUF Serial Data Buffer (UART) 0x98 SCON Serial Port Control (UART) 137 0xC3 0xC0 0xCF 0xC2 0xC1 0x81 SMB0ADR SMB0CN SMB0CR SMB0DAT SMB0STA SP SMBus 0 Address SMBus 0 Control SMBus 0 Clock Rate SMBus 0 Data SMBus 0 Status Stack Pointer 120 118 119 120 121 74 SPI0CFG SPI0CKR SPI0CN SPI0DAT T2CON TCON TH0 TH1 TH2 TL0 TL1 TL2 Serial Peripheral Interface Configuration SPI Clock Rate SPI Bus Control SPI Port 1Data Counter/Timer 2 Control Counter/Timer Control Counter/Timer 0 Data Word (High Byte) Counter/Timer 1 Data Word (High Byte) Counter/Timer 2 Data Word (High Byte) Counter/Timer 0 Data Word (Low Byte) Counter/Timer 1 Data Word (Low Byte) Counter/Timer 2 Data Word (Low Byte) 127 129 128 129 150 142 145 145 151 145 145 151 N ot R Rev. 1.7 163 162 162 162 162 162 163 163 161 86 109 110 110 111 112 88 75 151 151 61 97 es ig ns D N ew fo r m en de d ec 0x9A 0x9D 0xF8 0x9B 0xC8 0x88 0x8C 0x8D 0xCD 0x8A 0x8B 0xCC Page No. om Address 136 72 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Page No. N ot R ec om m en de d fo r 0x89 TMOD Counter/Timer Mode 0x91 TMR3CN Timer 3 Control 0x95 TMR3H Timer 3 High 0x94 TMR3L Timer 3 Low 0x93 TMR3RLH Timer 3 Reload High 0x92 TMR3RLL Timer 3 Reload Low 0xFF WDTCN Watchdog Timer Control 0xE1 XBR0 Port I/O Crossbar Configuration 1 0xE2 XBR1 Port I/O Crossbar Configuration 2 0xE3 XBR2 Port I/O Crossbar Configuration 3 0x84-86, 0x96-97, 0x9C, 0xA1-A3, 0xA9-AC, 0xAE, 0xB3-B5, 0xB9, Reserved 0xBD, 0xC9, 0xCE, 0xDF, 0xE4-E5, 0xF1-F5 * Refers to a register in the C8051F000/1/2/5/6/7 only. ** Refers to a register in the C8051F010/1/2/5/6/7 only. *** Refers to a register in the C8051F005/06/07/15/16/17 only. 73 Rev. 1.7 143 152 153 153 153 153 96 105 107 108 es ig ns Description D Register N ew Address C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 10.3.1. Register Descriptions Figure 10.3. SP: Stack Pointer R/W R/W R/W R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 es ig ns Following are descriptions of SFRs related to the operation of the CIP-51 System Controller. Reserved bits should not be set to logic l. Future product versions may use these bits to implement new features in which case the reset value of the bit will be logic 0, selecting the feature’s default state. Detailed descriptions of the remaining SFRs are included in the sections of the datasheet associated with their corresponding system function. R/W Reset Value Bit0 SFR Address: 00000111 D 0x81 N ew Bits 7-0: SP: Stack Pointer. The stack pointer holds the location of the top of the stack. The stack pointer is incremented before every PUSH operation. The SP register defaults to 0x07 after reset. Figure 10.4. DPL: Data Pointer Low Byte R/W R/W R/W Bit7 Bit6 Bit5 Bit4 R/W R/W fo r R/W Bit3 Bit2 R/W R/W Reset Value Bit1 Bit0 SFR Address: 00000000 0x82 m en de d Bits 7-0: DPL: Data Pointer Low. The DPL register is the low byte of the 16-bit DPTR. DPTR is used to access indirectly addressed RAM and Flash Memory. Figure 10.5. DPH: Data Pointer High Byte Bit7 R/W R/W om R/W Bit6 Bit5 R/W R/W R/W R/W R/W Reset Value Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 00000000 0x83 N ot R ec Bits 7-0: DPH: Data Pointer High. The DPH register is the high byte of the 16-bit DPTR. DPTR is used to access indirectly addressed RAM and Flash Memory. Rev. 1.7 74 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 10.6. PSW: Program Status Word R/W R/W R/W R/W R/W R/W R/W CY AC F0 RS1 RS0 OV F1 PARITY 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: (bit addressable) CY: Carry Flag. This bit is set when the last arithmetic operation results in a carry (addition) or a borrow (subtraction). It is cleared to 0 by all other arithmetic operations. Bit6: AC: Auxiliary Carry Flag. This bit is set when the last arithmetic operation results in a carry into (addition) or a borrow from (subtraction) the high order nibble. It is cleared to 0 by all other arithmetic operations. Bit5: F0: User Flag 0. This is a bit-addressable, general purpose flag for use under software control. N ew D Bit7: Bits4-3: RS1-RS0: Register Bank Select. These bits select which register bank is used during register accesses. Register Bank 0 1 2 3 Address 0x00-0x07 0x08-0x0F 0x10-0x17 0x18-0x1F fo r RS0 0 1 0 1 m en de d RS1 0 0 1 1 Note: Any instruction which changes the RS1-RS0 bits must not be immediately followed by the “MOV Rn, A” instruction. F1: User Flag 1. This is a bit-addressable, general purpose flag for use under software control. ec Bit1: OV: Overflow Flag. This bit is set to 1 under the following circumstances:  An ADD, ADDC, or SUBB instruction causes a sign-change overflow.  A MUL instruction results in an overflow (result is greater than 255) .  A DIV instruction causes a divide-by-zero condition. The OV bit is cleared to 0 by the ADD, ADDC, SUBB, MUL, and DIV instructions in all other cases. om Bit2: PARITY: Parity Flag. (Read only) This bit is set to 1 if the sum of the eight bits in the accumulator is odd and cleared if the sum is even. N ot R Bit0: 75 Rev. 1.7 Reset Value es ig ns R/W 0xD0 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 10.7. ACC: Accumulator R/W R/W R/W R/W R/W R/W R/W ACC.7 ACC.6 ACC.5 ACC.4 ACC.3 ACC.2 ACC.1 ACC.0 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: (bit addressable) R/W R/W R/W R/W B.6 B.5 B.4 B.3 Bit7 Bit6 Bit5 Bit4 Bit3 N ew Figure 10.8. B: B Register B.7 0xE0 D Bits 7-0: ACC: Accumulator This register is the accumulator for arithmetic operations. R/W Reset Value es ig ns R/W R/W R/W R/W B.2 B.1 B.0 00000000 Bit2 Bit1 Bit0 SFR Address: (bit addressable) Reset Value 0xF0 N ot R ec om m en de d fo r Bits 7-0: B: B Register This register serves as a second accumulator for certain arithmetic operations. Rev. 1.7 76 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 10.4. INTERRUPT HANDLER es ig ns The CIP-51 includes an extended interrupt system supporting a total of 22 interrupt sources with two priority levels. The allocation of interrupt sources between on-chip peripherals and external inputs pins varies according to the specific version of the device. Each interrupt source has one or more associated interrupt-pending flag(s) located in an SFR. When a peripheral or external source meets a valid interrupt condition, the associated interrupt-pending flag is set to logic 1. D If interrupts are enabled for the source, an interrupt request is generated when the interrupt-pending flag is set. As soon as execution of the current instruction is complete, the CPU generates an LCALL to a predetermined address to begin execution of an interrupt service routine (ISR). Each ISR must end with an RETI instruction, which returns program execution to the next instruction that would have been executed if the interrupt request had not occurred. If interrupts are not enabled, the interrupt-pending flag is ignored by the hardware and program execution continues as normal. (The interrupt-pending flag is set to logic 1 regardless of the interrupt’s enable/disable state.) N ew Each interrupt source can be individually enabled or disabled through the use of an associated interrupt enable bit in an SFR (IE-EIE2). However, interrupts must first be globally enabled by setting the EA bit (IE.7) to logic 1 before the individual interrupt enables are recognized. Setting the EA bit to logic 0 disables all interrupt sources regardless of the individual interrupt-enable settings. 10.4.1. MCU Interrupt Sources and Vectors fo r Some interrupt-pending flags are automatically cleared by the hardware when the CPU vectors to the ISR. However, most are not cleared by the hardware and must be cleared by software before returning from the ISR. If an interrupt-pending flag remains set after the CPU completes the return-from-interrupt (RETI) instruction, a new interrupt request will be generated immediately and the CPU will re-enter the ISR after the completion of the next instruction. m en de d The MCUs allocate 12 interrupt sources to on-chip peripherals. Up to 10 additional external interrupt sources are available depending on the I/O pin configuration of the device. Software can simulate an interrupt by setting any interrupt-pending flag to logic 1. If interrupts are enabled for the flag, an interrupt request will be generated and the CPU will vector to the ISR address associated with the interrupt-pending flag. MCU interrupt sources, associated vector addresses, priority order and control bits are summarized in Table 10.4. Refer to the datasheet section associated with a particular on-chip peripheral for information regarding valid interrupt conditions for the peripheral and the behavior of its interrupt-pending flag(s). 10.4.2. External Interrupts ec om Two of the external interrupt sources (/INT0 and /INT1) are configurable as active-low level-sensitive or active-low edge-sensitive inputs depending on the setting of IT0 (TCON.0) and IT1 (TCON.2). IE0 (TCON.1) and IE1 (TCON.3) serve as the interrupt-pending flag for the /INT0 and /INT1 external interrupts, respectively. If an /INT0 or /INT1 external interrupt is configured as edge-sensitive, the corresponding interrupt-pending flag is automatically cleared by the hardware when the CPU vectors to the ISR. When configured as level sensitive, the interruptpending flag follows the state of the external interrupt’s input pin. The external interrupt source must hold the input active until the interrupt request is recognized. It must then deactivate the interrupt request before execution of the ISR completes or another interrupt request will be generated. N ot R The remaining four external interrupts (External Interrupts 4-7) are active-low, edge-sensitive inputs. The interruptpending flags for these interrupts are in the Port 1 Interrupt Flag Register shown in Figure 15.10. 77 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 10.4. Interrupt Summary 5 6 SMBus Interface ADC0 Window Comparison Programmable Counter Array 0 0x003B 0x0043 0x004B 7 8 9 Comparator 0 Falling Edge Comparator 0 Rising Edge Comparator 1 Falling Edge Comparator 1 Rising Edge Timer 3 Overflow ADC0 End of Conversion External Interrupt 4 External Interrupt 5 External Interrupt 6 External Interrupt 7 Unused Interrupt Location External Crystal OSC Ready 0x0053 0x005B 0x0063 0x006B 0x0073 0x007B 0x0083 0x008B 0x0093 0x009B 0x00A3 0x00AB 10 11 12 13 14 15 16 17 18 19 20 21 m en de d Always enabled EX0 (IE.0) ET0 (IE.1) EX1 (IE.2) ET1 (IE.3) ES (IE.4) es ig ns 0x002B 0x0033 None IE0 (TCON.1) TF0 (TCON.5) IE1 (TCON.3) TF1 (TCON.7) RI (SCON.0) TI (SCON.1) TF2 (T2CON.7) SPIF (SPI0CN.7) WCOL (SPI0CN.6) MODF (SPI0CN.5) RXOVRN (SPI0CN.4) SI (SMB0CN.3) ADWINT (ADC0CN.2) CF (PCA0CN.7) CCFn (PCA0CN.n) CP0FIF (CPT0CN.4) CP0RIF (CPT0CN.5) CP1FIF (CPT1CN.4) CP1RIF (CPT1CN.5) TF3 (TMR3CN.7) ADCINT (ADC0CN.5) IE4 (PRT1IF.4) IE5 (PRT1IF.5) IE6 (PRT1IF.6) IE7 (PRT1IF.7) None XTLVLD (OSCXCN.7) Enable ET2 (IE.5) ESPI0 (EIE1.0) D Timer 2 Overflow (or EXF2) Serial Peripheral Interface Interrupt-Pending Flag N ew Priority Order Top 0 1 2 3 4 fo r Reset External Interrupt 0 (/INT0) Timer 0 Overflow External Interrupt 1 (/INT1) Timer 1 Overflow Serial Port (UART) Interrupt Vector 0x0000 0x0003 0x000B 0x0013 0x001B 0x0023 Interrupt Source ESMB0 (EIE1.1) EWADC0 (EIE1.2) EPCA0 (EIE1.3) ECP0F (EIE1.4) ECP0R (EIE1.5) ECP1F (EIE1.6) ECP1R (EIE1.7) ET3 (EIE2.0) EADC0 (EIE2.1) EX4 (EIE2.2) EX5 (EIE2.3) EX6 (EIE2.4) EX7 (EIE2.5) Reserved (EIE2.6) EXVLD (EIE2.7) 10.4.3. Interrupt Priorities om Each interrupt source can be individually programmed to one of two priority levels: low or high. A low priority interrupt service routine can be preempted by a high priority interrupt. A high priority interrupt cannot be preempted. Each interrupt has an associated interrupt priority bit in an SFR (IP-EIP2) used to configure its priority level. Low priority is the default. If two interrupts are recognized simultaneously, the interrupt with the higher priority is serviced first. If both interrupts have the same priority level, a fixed priority order is used to arbitrate. ec 10.4.4. Interrupt Latency N ot R Interrupt response time depends on the state of the CPU when the interrupt occurs. Pending interrupts are sampled and priority decoded each system clock cycle. Therefore, the fastest possible response time is 5 system clock cycles: 1 clock cycle to detect the interrupt and 4 clock cycles to complete the LCALL to the ISR. If an interrupt is pending when a RETI is executed, a single instruction is executed before an LCALL is made to service the pending interrupt. Therefore, the maximum response time for an interrupt (when no other interrupt is currently being serviced or the new interrupt is of greater priority) occurs when the CPU is performing an RETI instruction followed by a DIV as the next instruction. In this case, the response time is 18 system clock cycles: 1 clock cycle to detect the interrupt, 5 clock cycles to execute the RETI, 8 clock cycles to complete the DIV instruction and 4 clock cycles to execute the LCALL to the ISR. If the CPU is executing an ISR for an interrupt with equal or higher priority, the new interrupt will not be serviced until the current ISR completes, including the RETI and following instruction. Rev. 1.7 78 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 10.4.5. Interrupt Register Descriptions Figure 10.9. IE: Interrupt Enable R/W R/W R/W R/W R/W R/W R/W EA IEGF0 ET2 ES ET1 EX1 ET0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 es ig ns The SFRs used to enable the interrupt sources and set their priority level are described below. Refer to the datasheet section associated with a particular on-chip peripheral for information regarding valid interrupt conditions for the peripheral and the behavior of its interrupt-pending flag(s). R/W 00000000 Bit0 SFR Address: D (bit addressable) EA: Enable All Interrupts. This bit globally enables/disables all interrupts. It overrides the individual interrupt mask settings. 0: Disable all interrupt sources. 1: Enable each interrupt according to its individual mask setting. Bit6: IEGF0: General Purpose Flag 0. This is a general purpose flag for use under software control. Bit5: ET2: Enable Timer 2 Interrupt. This bit sets the masking of the Timer 2 interrupt. 0: Disable all Timer 2 interrupts. 1: Enable interrupt requests generated by the TF2 flag (T2CON.7) Bit4: ES: Enable Serial Port (UART) Interrupt. This bit sets the masking of the Serial Port (UART) interrupt. 0: Disable all UART interrupts. 1: Enable interrupt requests generated by the R1 flag (SCON.0) or T1 flag (SCON.1). Bit3: ET1: Enable Timer 1 Interrupt. This bit sets the masking of the Timer 1 interrupt. 0: Disable all Timer 1 interrupts. 1: Enable interrupt requests generated by the TF1 flag (TCON.7). Bit2: EX1: Enable External Interrupt 1. This bit sets the masking of external interrupt 1. 0: Disable external interrupt 1. 1: Enable interrupt requests generated by the /INT1 pin. ec om m en de d fo r N ew Bit7: R Bit1: N ot Bit0: 79 ET0: Enable Timer 0 Interrupt. This bit sets the masking of the Timer 0 interrupt. 0: Disable all Timer 0 interrupts. 1: Enable interrupt requests generated by the TF0 flag (TCON.5). EX0: Enable External Interrupt 0. This bit sets the masking of external interrupt 0. 0: Disable external interrupt 0. 1: Enable interrupt requests generated by the /INT0 pin. Rev. 1.7 Reset Value EX0 0xA8 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 10.10. IP: Interrupt Priority R/W R/W R/W R/W R/W R/W R/W - - PT2 PS PT1 PX1 PT0 PX0 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: PT2 Timer 2 Interrupt Priority Control. This bit sets the priority of the Timer 2 interrupts. 0: Timer 2 interrupts set to low priority level. 1: Timer 2 interrupts set to high priority level. Bit4: PS: Serial Port (UART) Interrupt Priority Control. This bit sets the priority of the Serial Port (UART) interrupts. 0: UART interrupts set to low priority level. 1: UART interrupts set to high priority level. Bit3: PT1: Timer 1 Interrupt Priority Control. This bit sets the priority of the Timer 1 interrupts. 0: Timer 1 interrupts set to low priority level. 1: Timer 1 interrupts set to high priority level. Bit2: PX1: External Interrupt 1 Priority Control. This bit sets the priority of the External Interrupt 1 interrupts. 0: External Interrupt 1 set to low priority level. 1: External Interrupt 1 set to high priority level. Bit1: PT0: Timer 0 Interrupt Priority Control. This bit sets the priority of the Timer 0 interrupts. 0: Timer 0 interrupt set to low priority level. 1: Timer 0 interrupt set to high priority level. Bit0: PX0: External Interrupt 0 Priority Control. This bit sets the priority of the External Interrupt 0 interrupts. 0: External Interrupt 0 set to low priority level. 1: External Interrupt 0 set to high priority level. N ot R ec om m en de d fo r N ew Bit5: 0xB8 D (bit addressable) Bits7-6: UNUSED. Read = 11b, Write = don’t care. Reset Value es ig ns R/W Rev. 1.7 80 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 10.11. EIE1: Extended Interrupt Enable 1 R/W R/W R/W R/W R/W R/W R/W ECP1F ECP0R ECP0F EPCA0 EWADC0 ESMB0 ESPI0 Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W ECP1R ECP1R: Enable Comparator 1 (CP1) Rising Edge Interrupt. This bit sets the masking of the CP1 interrupt. 0: Disable CP1 Rising Edge interrupt. 1: Enable interrupt requests generated by the CP1RIF flag (CPT1CN.5). Bit6: ECP1F: Enable Comparator 1 (CP1) Falling Edge Interrupt. This bit sets the masking of the CP1 interrupt. 0: Disable CP1 Falling Edge interrupt. 1: Enable interrupt requests generated by the CP1FIF flag (CPT1CN.4). Bit5: ECP0R: Enable Comparator 0 (CP0) Rising Edge Interrupt. This bit sets the masking of the CP0 interrupt. 0: Disable CP0 Rising Edge interrupt. 1: Enable interrupt requests generated by the CP0RIF flag (CPT0CN.5). Bit4: ECP0F: Enable Comparator 0 (CP0) Falling Edge Interrupt. This bit sets the masking of the CP0 interrupt. 0: Disable CP0 Falling Edge interrupt. 1: Enable interrupt requests generated by the CP0FIF flag (CPT0CN.4). Bit3: EPCA0: Enable Programmable Counter Array (PCA0) Interrupt. This bit sets the masking of the PCA0 interrupts. 0: Disable all PCA0 interrupts. 1: Enable interrupt requests generated by PCA0. Bit2: EWADC0: Enable Window Comparison ADC0 Interrupt. This bit sets the masking of ADC0 Window Comparison interrupt. 0: Disable ADC0 Window Comparison Interrupt. 1: Enable Interrupt requests generated by ADC0 Window Comparisons. fo r m en de d om ESMB0: Enable SMBus 0 Interrupt. This bit sets the masking of the SMBus interrupt. 0: Disable all SMBus interrupts. 1: Enable interrupt requests generated by the SI flag (SMB0CN.3). ec Bit1: N ew Bit7: ESPI0: Enable Serial Peripheral Interface 0 Interrupt. This bit sets the masking of SPI0 interrupt. 0: Disable all SPI0 interrupts. 1: Enable Interrupt requests generated by SPI0. N ot R Bit0: 81 D 0xE6 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 10.12. EIE2: Extended Interrupt Enable 2 R/W R/W R/W R/W R/W R/W R/W - EX7 EX6 EX5 EX4 EADC0 ET3 Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W EXVLD 0xE7 EXVLD: Enable External Clock Source Valid (XTLVLD) Interrupt. This bit sets the masking of the XTLVLD interrupt. 0: Disable all XTLVLD interrupts. 1: Enable interrupt requests generated by the XTLVLD flag (OSCXCN.7) Bit6: Reserved. Must Write 0. Reads 0. Bit5: EX7: Enable External Interrupt 7. This bit sets the masking of External Interrupt 7. 0: Disable External Interrupt 7. 1: Enable interrupt requests generated by the External Interrupt 7 input pin. Bit4: EX6: Enable External Interrupt 6. This bit sets the masking of External Interrupt 6. 0: Disable External Interrupt 6. 1: Enable interrupt requests generated by the External Interrupt 6 input pin. Bit3: EX5: Enable External Interrupt 5. This bit sets the masking of External Interrupt 5. 0: Disable External Interrupt 5. 1: Enable interrupt requests generated by the External Interrupt 5 input pin. Bit2: EX4: Enable External Interrupt 4. This bit sets the masking of External Interrupt 4. 0: Disable External Interrupt 4. 1: Enable interrupt requests generated by the External Interrupt 4 input pin. Bit1: EADC0: Enable ADC0 End of Conversion Interrupt. This bit sets the masking of the ADC0 End of Conversion Interrupt. 0: Disable ADC0 Conversion Interrupt. 1: Enable interrupt requests generated by the ADC0 Conversion Interrupt. N ew fo r m en de d om ET3: Enable Timer 3 Interrupt. This bit sets the masking of the Timer 3 interrupt. 0: Disable all Timer 3 interrupts. 1: Enable interrupt requests generated by the TF3 flag (TMR3CN.7) N ot R ec Bit0: D Bit7: Rev. 1.7 82 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 10.13. EIP1: Extended Interrupt Priority 1 R/W R/W R/W R/W R/W R/W R/W PCP1F PCP0R PCP0F PPCA0 PWADC0 PSMB0 PSPI0 Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W PCP1R PCP1R: Comparator 1 (CP1) Rising Interrupt Priority Control. This bit sets the priority of the CP1 interrupt. 0: CP1 rising interrupt set to low priority level. 1: CP1 rising interrupt set to high priority level. Bit6: PCP1F: Comparator 1 (CP1) Falling Interrupt Priority Control. This bit sets the priority of the CP1 interrupt. 0: CP1 falling interrupt set to low priority level. 1: CP1 falling interrupt set to high priority level. Bit5: PCP0R: Comparator 0 (CP0) Rising Interrupt Priority Control. This bit sets the priority of the CP0 interrupt. 0: CP0 rising interrupt set to low priority level. 1: CP0 rising interrupt set to high priority level. Bit4: PCP0F: Comparator 0 (CP0) Falling Interrupt Priority Control. This bit sets the priority of the CP0 interrupt. 0: CP0 falling interrupt set to low priority level. 1: CP0 falling interrupt set to high priority level. Bit3: PPCA0: Programmable Counter Array (PCA0) Interrupt Priority Control. This bit sets the priority of the PCA0 interrupt. 0: PCA0 interrupt set to low priority level. 1: PCA0 interrupt set to high priority level. Bit2: PWADC0: ADC0 Window Comparator Interrupt Priority Control. This bit sets the priority of the ADC0 Window interrupt. 0: ADC0 Window interrupt set to low priority level. 1: ADC0 Window interrupt set to high priority level. fo r m en de d om PSMB0: SMBus 0 Interrupt Priority Control. This bit sets the priority of the SMBus interrupt. 0: SMBus interrupt set to low priority level. 1: SMBus interrupt set to high priority level. ec Bit1: N ew Bit7: PSPI0: Serial Peripheral Interface 0 Interrupt Priority Control. This bit sets the priority of the SPI0 interrupt. 0: SPI0 interrupt set to low priority level. 1: SPI0 interrupt set to high priority level. N ot R Bit0: 83 D 0xF6 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 10.14. EIP2: Extended Interrupt Priority 2 R/W R/W R/W R/W R/W R/W R/W - PX7 PX6 PX5 PX4 PADC0 PT3 Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W PXVLD 0xF7 PXVLD: External Clock Source Valid (XTLVLD) Interrupt Priority Control. This bit sets the priority of the XTLVLD interrupt. 0: XTLVLD interrupt set to low priority level. 1: XTLVLD interrupt set to high priority level. Bit6: Reserved: Must write 0. Reads 0. Bit5: PX7: External Interrupt 7 Priority Control. This bit sets the priority of the External Interrupt 7. 0: External Interrupt 7 set to low priority level. 1: External Interrupt 7 set to high priority level. Bit4: PX6: External Interrupt 6 Priority Control. This bit sets the priority of the External Interrupt 6. 0: External Interrupt 6 set to low priority level. 1: External Interrupt 6 set to high priority level. Bit3: PX5: External Interrupt 5 Priority Control. This bit sets the priority of the External Interrupt 5. 0: External Interrupt 5 set to low priority level. 1: External Interrupt 5 set to high priority level. Bit2: PX4: External Interrupt 4 Priority Control. This bit sets the priority of the External Interrupt 4. 0: External Interrupt 4 set to low priority level. 1: External Interrupt 4 set to high priority level. Bit1: PADC0: ADC End of Conversion Interrupt Priority Control. This bit sets the priority of the ADC0 End of Conversion Interrupt. 0: ADC0 End of Conversion interrupt set to low priority level. 1: ADC0 End of Conversion interrupt set to high priority level. N ew fo r m en de d om PT3: Timer 3 Interrupt Priority Control. This bit sets the priority of the Timer 3 interrupts. 0: Timer 3 interrupt set to low priority level. 1: Timer 3 interrupt set to high priority level. N ot R ec Bit0: D Bit7: Rev. 1.7 84 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 10.5. Power Management Modes es ig ns The CIP-51 core has two software programmable power management modes: Idle and Stop. Idle mode halts the CPU while leaving the external peripherals and internal clocks active. In Stop mode, the CPU is halted, all interrupts and timers (except the Missing Clock Detector) are inactive, and the system clock is stopped. Since clocks are running in Idle mode, power consumption is dependent upon the system clock frequency and the number of peripherals left in active mode before entering Idle. Stop mode consumes the least power. Figure 10.15 describes the Power Control Register (PCON) used to control the CIP-51’s power management modes. D Although the CIP-51 has Idle and Stop modes built in (as with any standard 8051 architecture), power management of the entire MCU is better accomplished by enabling/disabling individual peripherals as needed. Each analog peripheral can be disabled when not in use and put into low power mode. Digital peripherals, such as timers or serial buses, draw little power whenever they are not in use. Turning off the oscillator saves even more power, but requires a reset to restart the MCU. 10.5.1. Idle Mode N ew Setting the Idle Mode Select bit (PCON.0) causes the CIP-51 to halt the CPU and enter Idle mode as soon as the instruction that sets the bit completes. All internal registers and memory maintain their original data. All analog and digital peripherals can remain active during Idle mode. fo r Idle mode is terminated when an enabled interrupt or /RST is asserted. The assertion of an enabled interrupt will cause the Idle Mode Selection bit (PCON.0) to be cleared and the CPU will resume operation. The pending interrupt will be serviced and the next instruction to be executed after the return from interrupt (RETI) will be the instruction immediately following the one that set the Idle Mode Select bit. If Idle mode is terminated by an internal or external reset, the CIP-51 performs a normal reset sequence and begins program execution at address 0x0000. // in ‘C’: PCON |= 0x01; PCON = PCON; // set IDLE bit // ... followed by a 3-cycle dummy instruction ; set IDLE bit ; ... followed by a 3-cycle dummy instruction om ; in assembly: ORL PCON, #01h MOV PCON, PCON m en de d Note: If the instruction following the write of the IDLE bit is a single-byte instruction and an interrupt occurs during the execution phase of the instruction that sets the IDLE bit, the CPU may not wake from Idle mode when a future interrupt occurs. Any instructions that set the IDLE bit should be followed by an instruction that has 2 or more opcode bytes, for example: N ot R ec If enabled, the WDT will eventually cause an internal watchdog reset and thereby terminate the Idle mode. This feature protects the system from an unintended permanent shutdown in the event of an inadvertent write to the PCON register. If this behavior is not desired, the WDT may be disabled by software prior to entering the Idle mode if the WDT was initially configured to allow this operation. This provides the opportunity for additional power savings, allowing the system to remain in the Idle mode indefinitely, waiting for an external stimulus to wake up the system. Refer to Section 13.8 Watchdog Timer for more information on the use and configuration of the WDT. 10.5.2. Stop Mode Setting the Stop Mode Select bit (PCON.1) causes the CIP-51 to enter Stop mode as soon as the instruction that sets the bit completes. In Stop mode, the CPU and oscillators are stopped, effectively shutting down all digital peripherals. Each analog peripheral must be shut down individually prior to entering Stop Mode. Stop mode can only be terminated by an internal or external reset. On reset, the CIP-51 performs the normal reset sequence and begins program execution at address 0x0000. 85 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 10.15. PCON: Power Control Register R/W R/W R/W R/W R/W R/W R/W SMOD GF4 GF3 GF2 GF1 GF0 STOP Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 es ig ns If enabled, the Missing Clock Detector will cause an internal reset and thereby terminate the Stop mode. The Missing Clock Detector should be disabled if the CPU is to be put to sleep for longer than the MCD timeout of 100sec. R/W Reset Value IDLE 00000000 Bit0 SFR Address: 0x87 SMOD: Serial Port Baud Rate Doubler Enable. 0: Serial Port baud rate is that defined by Serial Port Mode in SCON. 1: Serial Port baud rate is double that defined by Serial Port Mode in SCON. N ew D Bit7: Bits6-2: GF4-GF0: General Purpose Flags 4-0. These are general purpose flags for use under software control. STOP: Stop Mode Select. Setting this bit will place the CIP-51 in Stop mode. This bit will always be read as 0. 1: Goes into power down mode. (Turns off internal oscillator). Bit0: IDLE: Idle Mode Select. Setting this bit will place the CIP-51 in Idle mode. This bit will always be read as 0. 1: Goes into idle mode. (Shuts off clock to CPU, but clock to Timers, Interrupts, Serial Ports, and Analog Peripherals are still active.) N ot R ec om m en de d fo r Bit1: Rev. 1.7 86 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 11. FLASH MEMORY 11.1. es ig ns These devices include 32k + 128 bytes of on-chip, reprogrammable Flash memory for program code and nonvolatile data storage. The Flash memory can be programmed in-system, a single byte at a time, through the JTAG interface or by software using the MOVX instruction. Once cleared to 0, a Flash bit must be erased to set it back to 1. The bytes would typically be erased (set to 0xFF) before being reprogrammed. The write and erase operations are automatically timed by hardware for proper execution. Data polling to determine the end of the write/erase operation is not required. The Flash memory is designed to withstand at least 20,000 write/erase cycles. Refer to Table 11.1 for the electrical characteristics of the Flash memory. Programming The Flash Memory D The simplest means of programming the Flash memory is through the JTAG interface using programming tools provided by Silicon Labs or a third party vendor. This is the only means for programming a non-initialized device. For details on the JTAG commands to program Flash memory, see Section 21.2. N ew The Flash memory can be programmed by software using the MOVX instruction with the address and data byte to be programmed provided as normal operands. Before writing to Flash memory using MOVX, Flash write operations must be enabled by setting the PSWE Program Store Write Enable bit (PSCTL.0) to logic 1. Writing to Flash remains enabled until the PSWE bit is cleared by software. 1. 2. 3. 4. 5. 6. Enable Flash Memory write/erase in FLSCL Register using FLASCL bits. Set PSEE (PSCTL.1) to enable Flash sector erase. Set PSWE (PSCTL.0) to enable Flash writes. Use MOVX to write a data byte to any location within the 512-byte sector to be erased. Clear PSEE to disable Flash sector erase. Use MOVX to write a data byte to the desired byte location within the erased 512-byte sector. Repeat until finished. (Any number of bytes can be written from a single byte to and entire sector.) Clear the PSWE bit to disable Flash writes. om 7. m en de d fo r Writes to Flash memory can clear bits but cannot set them. Only an erase operation can set bits in Flash. Therefore, the byte location to be programmed must be erased before a new value can be written. The 32kbyte Flash memory is organized in 512-byte sectors. The erase operation applies to an entire sector (setting all bytes in the sector to 0xFF). Setting the PSEE Program Store Erase Enable bit (PSCTL.1) and PSWE (PSCTL.0) bit to logic 1 and then using the MOVX command to write a data byte to any byte location within the sector will erase an entire 512-byte sector. The data byte written can be of any value because it is not actually written to the Flash. Flash erasure remains enabled until the PSEE bit is cleared by software. The following sequence illustrates the algorithm for programming the Flash memory by software: R ec Write/Erase timing is automatically controlled by hardware based on the prescaler value held in the Flash Memory Timing Prescaler register (FLSCL). The 4-bit prescaler value FLASCL determines the time interval for write/erase operations. The FLASCL value required for a given system clock is shown in Figure 11.4, along with the formula used to derive the FLASCL values. When FLASCL is set to 1111b, the write/erase operations are disabled. Note that code execution in the 8051 is stalled while the Flash is being programmed or erased. Table 11.1. FLASH Memory Electrical Characteristics N ot VDD = 2.7 to 3.6V, -40C to +85C unless otherwise specified. PARAMETER CONDITIONS Endurance Erase Cycle Time Write Cycle Time 87 Rev. 1.7 MIN 20k 10 40 TYP 100k MAX UNITS Erase/Wr ms s C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 11.2. Non-volatile Data Storage es ig ns The Flash memory can be used for non-volatile data storage as well as program code. This allows data such as calibration coefficients to be calculated and stored at run time. Data is written using the MOVX instruction and read using the MOVC instruction. 11.3. D The MCU incorporates an additional 128-byte sector of Flash memory located at 0x8000 – 0x807F. This sector can be used for program code or data storage. However, its smaller sector size makes it particularly well suited as general purpose, non-volatile scratchpad memory. Even though Flash memory can be written a single byte at a time, an entire sector must be erased first. In order to change a single byte of a multi-byte data set, the data must be moved to temporary storage. Next, the sector is erased, the data set updated and the data set returned to the original sector. The 128-byte sector-size facilitates updating data without wasting program memory space by allowing the use of internal data RAM for temporary storage. (A normal 512-byte sector is too large to be stored in the 256-byte internal data memory.) Security Options fo r N ew The CIP-51 provides security options to protect the Flash memory from inadvertent modification by software as well as prevent the viewing of proprietary program code and constants. The Program Store Write Enable (PSCTL.0) and the Program Store Erase Enable (PSCTL.1) bits protect the Flash memory from accidental modification by software. These bits must be explicitly set to logic 1 before software can modify the Flash memory. Additional security features prevent proprietary program code and data constants from being read or altered across the JTAG interface or by software running on the system controller. m en de d A set of security lock bytes stored at 0x7DFE and 0x7DFF protect the Flash program memory from being read or altered across the JTAG interface. Each bit in a security lock-byte protects one 4kbyte block of memory. Clearing a bit to logic 0 in a Read lock byte prevents the corresponding block of Flash memory from being read across the JTAG interface. Clearing a bit in the Write/Erase lock byte protects the block from JTAG erasures and/or writes. The Read lock byte is at location 0x7DFF. The Write/Erase lock byte is located at 0x7DFE. Figure 11.2 shows the location and bit definitions of the security bytes. The 512-byte sector containing the lock bytes can be written to, but not erased by software. Writing to the reserved area should not be performed. Figure 11.1. PSCTL: Program Store RW Control R/W - - Bit7 Bit6 R/W R/W R/W R/W R/W R/W - - - - PSEE PSWE Reset Value 00000000 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 0x8F om R/W Bits7-2: UNUSED. Read = 000000b, Write = don’t care. PSEE: Program Store Erase Enable. Setting this bit allows an entire page of the Flash program memory to be erased provided the PSWE bit is also set. After setting this bit, a write to Flash memory using the MOVX instruction will erase the entire page that contains the location addressed by the MOVX instruction. The value of the data byte written does not matter. 0: Flash program memory erasure disabled. 1: Flash program memory erasure enabled. N ot R ec Bit1: Bit0: PSWE: Program Store Write Enable. Setting this bit allows writing a byte of data to the Flash program memory using the MOVX instruction. The location must be erased before writing data. 0: Write to Flash program memory disabled. 1: Write to Flash program memory enabled. Rev. 1.7 88 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 11.2. Flash Program Memory Security Bytes Reserved 0x7E00 0x7DFF Write/Erase Lock Byte 0x7DF E 0x7DFD Program Memory Space Software Read Limit 0x0000 Read and Write/Erase Security Bits. (Bit 7 is MSB.) Bit Memory Block 7 6 5 4 3 2 1 0 0x7000 - 0x7DFD 0x6000 - 0x6FFF 0x5000 - 0x5FFF 0x4000 - 0x4FFF 0x3000 - 0x3FFF 0x2000 - 0x2FFF 0x1000 - 0x1FFF 0x0000 - 0x0FFF N ew Read Lock Byte es ig ns 0x807F 0x8000 0x7FFF D (This Block locked only if all other blocks are locked) m en de d fo r FLASH Read Lock Byte Bits7-0: Each bit locks a corresponding block of memory. (Bit 7 is MSB.) 0: Read operations are locked (disabled) for corresponding block across the JTAG interface. 1: Read operations are unlocked (enabled) for corresponding block across the JTAG interface. FLASH Write/Erase Lock Byte Bits7-0: Each bit locks a corresponding block of memory. 0: Write/Erase operations are locked (disabled) for corresponding block across the JTAG interface. 1: Write/Erase operations are unlocked (enabled) for corresponding block across the JTAG interface. FLASH Access Limit Register (FLACL) The content of this register is used as the high byte of the 16-bit software read limit address. The 16bit read limit address value is calculated as 0xNN00 where NN is replaced by the contents of this register. Software running at or above this address is prohibited from using the MOVX or MOVC instructions to read, write, or erase, locations below this address. Any attempts to read locations below this limit will return the value 0x00. R ec om The lock bits can always be read and cleared to logic 0 regardless of the security setting applied to the block containing the security bytes. This allows additional blocks to be protected after the block containing the security bytes has been locked. However, the only means of removing a lock once set is to erase the entire program memory space by performing a JTAG erase operation (i.e. cannot be done in user firmware). NOTE: Addressing either security byte while performing a JTAG erase operation will automatically initiate erasure of the entire program memory space (except for the reserved area). This erasure can only be performed via JTAG. If a non-security byte in the 0x7C00-0x7DFF page is addressed during erasure, only that page (including the security bytes) will be erased. N ot The Flash Access Limit security feature (see Figure 11.3) protects proprietary program code and data from being read by software running on the C8051F005/06/07/15/16/17 MCUs. This feature provides support for OEMs that wish to program the MCU with proprietary value-added firmware before distribution. The value-added firmware can be protected while allowing additional code to be programmed in remaining program memory space later. The Software Read Limit (SRL) is a 16-bit address that establishes two logical partitions in the program memory space. The first is an upper partition consisting of all the program memory locations at or above the SRL address, and the second is a lower partition consisting of all the program memory locations starting at 0x0000 up to (but excluding) the SRL address. Software in the upper partition can execute code in the lower partition, but is 89 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 es ig ns prohibited from reading locations in the lower partition using the MOVC instruction. (Executing a MOVC instruction from the upper partition with a source address in the lower partition will always return a data value of 0x00.) Software running in the lower partition can access locations in both the upper and lower partition without restriction. The Value-added firmware should be placed in the lower partition. On reset, control is passed to the value-added firmware via the reset vector. Once the value-added firmware completes its initial execution, it branches to a predetermined location in the upper partition. If entry points are published, software running in the upper partition may execute program code in the lower partition, but it cannot read the contents of the lower partition. Parameters may be passed to the program code running in the lower partition either through the typical method of placing them on the stack or in registers before the call or by placing them in prescribed memory locations in the upper partition. N ew D The SRL address is specified using the contents of the Flash Access Register. The 16-bit SRL address is calculated as 0xNN00, where NN is the contents of the SRL Security Register. Thus, the SRL can be located on 256-byte boundaries anywhere in program memory space. However, the 512-byte erase sector size essentially requires that a 512 boundary be used. The contents of a non-initialized SRL security byte is 0x00, thereby setting the SRL address to 0x0000 and allowing read access to all locations in program memory space by default. Figure 11.3. FLACL: Flash Access Limit (C8051F005/06/07/15/16/17 only) R/W R/W R/W Bit7 Bit6 Bit5 Bit4 R/W R/W fo r R/W Bit3 Bit2 R/W R/W Reset Value Bit1 Bit0 SFR Address: 00000000 0xB7 N ot R ec om m en de d Bits 7-0: FLACL: Flash Access Limit. This register holds the high byte of the 16-bit program memory read/write/erase limit address. The entire 16-bit access limit address value is calculated as 0xNN00 where NN is replaced by contents of FLACL. A write to this register sets the Flash Access Limit. This register can only be written once after any reset. Any subsequent writes are ignored until the next reset. Rev. 1.7 90 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 11.4. FLSCL: Flash Memory Timing Prescaler R/W R/W R/W FRAE - - Bit7 Bit6 Bit5 Bit4 R/W R/W R/W R/W Bit3 Bit2 Reset Value 10001111 FLASCL es ig ns R/W FOSE Bit1 Bit0 SFR Address: 0xB6 FOSE: Flash One-Shot Timer Enable 0: Flash One-shot timer disabled. 1: Flash One-shot timer enabled Bit6: FRAE: Flash Read Always Enable 0: Flash reads per one-shot timer 1: Flash always in read mode Bits5-4: UNUSED. Read = 00b, Write = don’t care. Bits3-0: FLASCL: Flash Memory Timing Prescaler. This register specifies the prescaler value for a given system clock required to generate the correct timing for Flash write/erase operations. If the prescaler is set to 1111b, Flash write/erase operations are disabled. 0000: System Clock < 50kHz 0001: 50kHz  System Clock < 100kHz 0010: 100kHz  System Clock < 200kHz 0011: 200kHz  System Clock < 400kHz 0100: 400kHz  System Clock < 800kHz 0101: 800kHz  System Clock < 1.6MHz 0110: 1.6MHz  System Clock < 3.2MHz 0111: 3.2MHz  System Clock < 6.4MHz 1000: 6.4MHz  System Clock < 12.8MHz 1001: 12.8MHz  System Clock < 25.6MHz 1010: 25.6MHz  System Clock < 51.2MHz * 1011, 1100, 1101, 1110: Reserved Values 1111: Flash Memory Write/Erase Disabled m en de d fo r N ew D Bit7: The prescaler value is the smallest value satisfying the following equation: FLASCL > log2(System Clock / 50kHz) N ot R ec om * For test purposes. The C8051F000 family is not guaranteed for operation over 25MHz. 91 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 12. EXTERNAL RAM (C8051F005/06/07/15/16/17) es ig ns The C8051F005/06/07/15/16/17 MCUs include 2048 bytes of RAM mapped into the external data memory space. All of these address locations may be accessed using the external move instruction (MOVX) and the data pointer (DPTR), or using MOVX indirect addressing mode. If the MOVX instruction is used with an 8-bit address operand (such as @R1), then the high byte of the 16-bit address is provided by the External Memory Interface Control Register (EMI0CN as shown in Figure 12.1). Note: the MOVX instruction is also used for writes to the Flash memory. See Section 11 for details. The MOVX instruction accesses XRAM by default (i.e. PSTCL.0 = 0). D For any of the addressing modes the upper 5-bits of the 16-bit external data memory address word are “don’t cares”. As a result, the 2048-byte RAM is mapped modulo style over the entire 64k external data memory address range. For example, the XRAM byte at address 0x0000 is also at address 0x0800, 0x1000, 0x1800, 0x2000, etc. This is a useful feature when doing a linear memory fill, as the address pointer doesn’t have to be reset when reaching the RAM block boundary. R R R R R - - - - - Bit7 Bit6 Bit5 Bit4 Bit3 N ew Figure 12.1. EMI0CN: External Memory Interface Control R/W R/W R/W PGSEL2 PGSEL1 PGSEL0 Reset Value 00000000 Bit2 Bit1 Bit0 SFR Address: 0xAF N ot R ec om m en de d fo r Bits 7-3: Not Used – reads 00000b Bits 2-0: PGSEL[2:0]: XRAM Page Select Bits The XRAM Page Select Bits provide the high byte of the 16-bit external data memory address when using an 8-bit MOVX command, effectively selecting a 256-byte page of RAM. The upper 5-bits are “don’t cares”, so the 2k address blocks are repeated modulo over the entire 64k external data memory address space. 000: xxxxx000b 001: xxxxx001b 010: xxxxx010b 011: xxxxx011b 100: xxxxx100b 101: xxxxx101b 110: xxxxx110b 111: xxxxx111b Rev. 1.7 92 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 13. RESET SOURCES es ig ns The reset circuitry of the MCUs allows the controller to be easily placed in a predefined default condition. On entry to this reset state, the CIP-51 halts program execution, forces the external port pins to a known state and initializes the SFRs to their defined reset values. Interrupts and timers are disabled. On exit, the program counter (PC) is reset, and program execution starts at location 0x0000. All of the SFRs are reset to predefined values. The reset values of the SFR bits are defined in the SFR detailed descriptions. The contents of internal data memory are not changed during a reset and any previously stored data is preserved. However, since the stack pointer SFR is reset, the stack is effectively lost even though the data on the stack are not altered. D The I/O port latches are reset to 0xFF (all logic ones), activating internal weak pull-ups which take the external I/O pins to a high state. The weak pull-ups are enabled during and after the reset. If the source of reset is from the VDD Monitor or writing a 1 to PORSF, the /RST pin is driven low until the end of the VDD reset timeout. N ew On exit from the reset state, the MCU uses the internal oscillator running at 2MHz as the system clock by default. Refer to Section 14 for information on selecting and configuring the system clock source. The Watchdog Timer is enabled using its longest timeout interval. (Section 13.8 details the use of the Watchdog Timer.) fo r There are seven sources for putting the MCU into the reset state: power-on/power-fail, external /RST pin, external CNVSTR signal, software commanded, Comparator 0, Missing Clock Detector, and Watchdog Timer. Each reset source is described below: m en de d Figure 13.1. Reset Sources Diagram VDD (Port I/O) CNVSTR Crossbar CNVRSEF Supply Monitor Supply Reset Timeout + - (wired-OR) Comparator 0 + - C0RSEF om CP0- N ot 93 Reset Funnel Missing Clock Detector (oneshot) WDT MCD Enable EN (Software Reset) EN WDT Enable R ec System Clock SWRSF PRE WDT Strobe CP0+ CIP-51 Core Rev. 1.7 System Reset /RST C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 13.1. Power-on Reset es ig ns The C8051F000 family incorporates a power supply monitor that holds the MCU in the reset state until VDD rises above the VRST level during power-up. (See Figure 13.2 for timing diagram, and refer to Table 13.1 for the Electrical Characteristics of the power supply monitor circuit.) The /RST pin is asserted (low) until the end of the 100ms VDD Monitor timeout in order to allow the VDD supply to become stable. 13.2. Software Forced Reset N ew Writing a 1 to the PORSF bit forces a Power-On Reset as described in Section 13.1. D On exit from a power-on reset, the PORSF flag (RSTSRC.1) is set by hardware to logic 1. All of the other reset flags in the RSTSRC Register are indeterminate. PORSF is cleared by a reset from any other source. Since all resets cause program execution to begin at the same location (0x0000), software can read the PORSF flag to determine if a power-up was the cause of reset. The content of internal data memory should be assumed to be undefined after a power-on reset. 2.70 2.40 VRST t /RST om Logic HIGH m en de d 1.0 VD D 2.0 fo r volts Figure 13.2. VDD Monitor Timing Diagram 100ms 100ms ec Logic LOW Power-fail Reset R 13.3. N ot When a power-down transition or power irregularity causes VDD to drop below VRST, the power supply monitor will drive the /RST pin low and return the CIP-51 to the reset state (see Figure 13.2). When VDD returns to a level above VRST, the CIP-51 will leave the reset state in the same manner as that for the power-on reset. Note that even though internal data memory contents are not altered by the power-fail reset, it is impossible to determine if VDD dropped below the level required for data retention. If the PORSF flag is set, the data may no longer be valid. Rev. 1.7 94 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 13.4. External Reset 13.5. es ig ns The external /RST pin provides a means for external circuitry to force the MCU into a reset state. Asserting an active-low signal on the /RST pin will cause the MCU to enter the reset state. Although there is a weak internal pullup, it may be desirable to provide an external pull-up and/or decoupling of the /RST pin to avoid erroneous noise-induced resets. The MCU will remain in reset until at least 12 clock cycles after the active-low /RST signal is removed. The PINRSF flag (RSTSRC.0) is set on exit from an external reset. The /RST pin is also 5V tolerant. Missing Clock Detector Reset Comparator 0 Reset N ew 13.6. D The Missing Clock Detector is essentially a one-shot circuit that is triggered by the MCU system clock. If the system clock goes away for more than 100s, the one-shot will time out and generate a reset. After a Missing Clock Detector reset, the MCDRSF flag (RSTSRC.2) will be set, signifying the MSD as the reset source; otherwise, this bit reads 0. The state of the /RST pin is unaffected by this reset. Setting the MSCLKE bit in the OSCICN register (see Figure 14.2) enables the Missing Clock Detector. 13.7. External CNVSTR Pin Reset fo r Comparator 0 can be configured as an active-low reset input by writing a 1 to the C0RSEF flag (RSTSRC.5). Comparator 0 should be enabled using CPT0CN.7 (see Figure 8.3) at least 20s prior to writing to C0RSEF to prevent any turn-on chatter on the output from generating an unwanted reset. When configured as a reset, if the non-inverting input voltage (on CP0+) is less than the inverting input voltage (on CP0-), the MCU is put into the reset state. After a Comparator 0 Reset, the C0RSEF flag (RSTSRC.5) will read 1 signifying Comparator 0 as the reset source; otherwise, this bit reads 0. The state of the /RST pin is unaffected by this reset. Also, Comparator 0 can generate a reset with or without the system clock. 13.8. m en de d The external CNVSTR signal can be configured as an active-low reset input by writing a 1 to the CNVRSEF flag (RSTSRC.6). The CNVSTR signal can appear on any of the P0, P1, or P2 I/O pins as described in Section 15.1. (Note that the Crossbar must be configured for the CNVSTR signal to be routed to the appropriate Port I/O.) The Crossbar should be configured and enabled before the CNVRSEF is set to configure CNVSTR as a reset source. When configured as a reset, CNVSTR is active-low and level sensitive. After a CNVSTR reset, the CNVRSEF flag (RSTSRC.6) will read 1 signifying CNVSTR as the reset source; otherwise, this bit reads 0. The state of the /RST pin is unaffected by this reset. Watchdog Timer Reset ec om The MCU includes a programmable Watchdog Timer (WDT) running off the system clock. The WDT will force the MCU into the reset state when the watchdog timer overflows. To prevent the reset, the WDT must be restarted by application software before the overflow occurs. If the system experiences a software/hardware malfunction preventing the software from restarting the WDT, the WDT will overflow and cause a reset. This should prevent the system from running out of control. N ot R The WDT is automatically enabled and started with the default maximum time interval on exit from all resets. If desired the WDT can be disabled by system software or locked on to prevent accidental disabling. Once locked, the WDT cannot be disabled until the next system reset. The state of the /RST pin is unaffected by this reset. 95 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 13.8.1. Watchdog Usage es ig ns The WDT consists of a 21-bit timer running from the programmed system clock. The timer measures the period between specific writes to its control register. If this period exceeds the programmed limit, a WDT reset is generated. The WDT can be enabled and disabled as needed in software, or can be permanently enabled if desired. Watchdog features are controlled via the Watchdog Timer Control Register (WDTCN) shown in Figure 13.3. Enable/Reset WDT The watchdog timer is both enabled and the countdown restarted by writing 0xA5 to the WDTCN register. The user’s application software should include periodic writes of 0xA5 to WDTCN as needed to prevent a watchdog timer overflow. The WDT is enabled and restarted as a result of any system reset. N ew D Disable WDT Writing 0xDE followed by 0xAD to the WDTCN register disables the WDT. The following code segment illustrates disabling the WDT. CLR EA ; disable all interrupts MOV WDTCN,#0DEh ; disable software MOV WDTCN,#0ADh ; watchdog timer SETB EA ; re-enable interrupts The writes of 0xDE and 0xAD must occur within 4 clock cycles of each other, or the disable operation is ignored. Interrupts should be disabled during this procedure to avoid delay between the two writes. m en de d fo r Disable WDT Lockout Writing 0xFF to WDTCN locks out the disable feature. Once locked out, the disable operation is ignored until the next system reset. Writing 0xFF does not enable or reset the watchdog timer. Applications always intending to use the watchdog should write 0xFF to WDTCN in their initialization code. Setting WDT Interval WDTCN.[2:0] control the watchdog timeout interval. The interval is given by the following equation: 43+WDTCN[2:0] x TSYSCLK , (where TSYSCLK is the system clock period). For a 2MHz system clock, this provides an interval range of 0.032msec to 524msec. WDTCN.7 must be a 0 when setting this interval. Reading WDTCN returns the programmed interval. WDTCN.[2:0] is 111b after a system reset. R/W R/W R/W R/W R/W R/W R/W R/W Reset Value Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: xxxxx111 0xFF ec Bit7 om Figure 13.3. WDTCN: Watchdog Timer Control Register N ot R Bits7-0: WDT Control Writing 0xA5 both enables and reloads the WDT. Writing 0xDE followed within 4 clocks by 0xAD disables the WDT. Writing 0xFF locks out the disable feature. Bit4: Watchdog Status Bit (when Read) Reading the WDTCN.[4] bit indicates the Watchdog Timer Status. 0: WDT is inactive 1: WDT is active Bits2-0: Watchdog Timeout Interval Bits The WDTCN.[2:0] bits set the Watchdog Timeout Interval. When writing these bits, WDTCN.7 must be set to 0. Rev. 1.7 96 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 13.4. RSTSRC: Reset Source Register R/W R/W R/W R R R/W R CNVRSEF C0RSEF SWRSEF WDTRSF MCDRSF PORSF PINRSF Reset Value xxxxxxxx Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R JTAGRST 0xEF (Note: Do not use read-modify-write operations on this register.) JTAGRST. JTAG Reset Flag. 0: JTAG is not currently in reset state. 1: JTAG is in reset state. CNVRSEF: Convert Start Reset Source Enable and Flag Write 0: CNVSTR is not a reset source 1: CNVSTR is a reset source (active low) Read 0: Source of prior reset was not from CNVSTR 1: Source of prior reset was from CNVSTR C0RSEF: Comparator 0 Reset Enable and Flag Write 0: Comparator 0 is not a reset source 1: Comparator 0 is a reset source (active low) Read Note: The value read from C0RSEF is not defined if Comparator 0 has not been enabled as a reset source. 0: Source of prior reset was not from Comparator 0 1: Source of prior reset was from Comparator 0 SWRSF: Software Reset Force and Flag Write 0: No Effect 1: Forces an internal reset. /RST pin is not effected. Read 0: Prior reset source was not from write to the SWRSF bit. 1: Prior reset source was from write to the SWRSF bit. WDTRSF: Watchdog Timer Reset Flag 0: Source of prior reset was not from WDT timeout. 1: Source of prior reset was from WDT timeout. MCDRSF: Missing Clock Detector Flag 0: Source of prior reset was not from Missing Clock Detector timeout. 1: Source of prior reset was from Missing Clock Detector timeout. PORSF: Power-On Reset Force and Flag Write 0: No effect 1: Forces a Power-On Reset. /RST is driven low. Read 0: Source of prior reset was not from POR. 1: Source of prior reset was from POR. PINRSF: HW Pin Reset Flag 0: Source of prior reset was not from /RST pin. 1: Source of prior reset was from /RST pin. D Bit7: N ew Bit6: m en de d fo r Bit5: Bit4: ec Bit2: om Bit3: N ot R Bit1: Bit0: 97 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 13.1. Reset Electrical Characteristics MIN TYP 0.7 x VDD /RST Input Low Voltage 20 /RST rising edge after crossing reset threshold Time from last system clock to reset generation 1.0 1.0 2.40 80 100 2.55 100 220 V 2.70 120 A V V V ms 500 s D /RST = 0.0V UNITS V V N ot R ec om m en de d fo r Missing Clock Detector Timeout 0.3 x VDD N ew /RST Input Leakage Current VDD for /RST Output Valid AV+ for /RST Output Valid VDD POR Threshold (VRST) Reset Time Delay MAX 0.6 es ig ns -40C to +85C unless otherwise specified. PARAMETER CONDITIONS /RST Output Low Voltage IOL = 8.5mA, VDD = 2.7 to 3.6V /RST Input High Voltage Rev. 1.7 98 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 14. OSCILLATOR es ig ns Each MCU includes an internal oscillator and an external oscillator drive circuit, either of which can generate the system clock. The MCUs boot from the internal oscillator after any reset. The internal oscillator starts up instantly. It can be enabled/disabled and its frequency can be changed using the Internal Oscillator Control Register (OSCICN) as shown in Figure 14.2. The internal oscillator’s electrical specifications are given in Table 14.1. D Both oscillators are disabled when the /RST pin is held low. The MCUs can run from the internal oscillator or external oscillator, and switch between the two at will using the CLKSL bit in the OSCICN Register. The external oscillator requires an external resonator, parallel-mode crystal, capacitor, or RC network connected to the XTAL1/XTAL2 pins (see Figure 14.1). The oscillator circuit must be configured for one of these sources in the OSCXCN register. An external CMOS clock can also provide the system clock via overdriving the XTAL1 pin. The XTAL1 and XTAL2 pins are 3.6V (not 5V) tolerant. The external oscillator can be left enabled and running even when the MCU has switched to using the internal oscillator. N ew Figure 14.1. Oscillator Diagram VDD EN Internal Clock Generator opt. 2 fo r IFRDY CLKSL IOSCEN IFCN1 IFCN0 MSCLKE OSCICN m en de d AV+ AV+ XTAL1 XTAL2 XTAL1 XTAL1 XTAL2 Input Circuit OSC XFCN2 XFCN1 XFCN0 opt. 3 XTAL1 XTLVLD XOSCMD2 XOSCMD1 XOSCMD0 opt. 4 opt. 1 AGND N ot R ec om OSCXCN 99 Rev. 1.7 SYSCLK C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 14.2. OSCICN: Internal Oscillator Control Register R/W R/W R R/W R/W R/W R/W - - IFRDY CLKSL IOSCEN IFCN1 IFCN0 Reset Value 00000100 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W MSCLKE 0xB2 MSCLKE: Missing Clock Enable Bit 0: Missing Clock Detector Disabled 1: Missing Clock Detector Enabled; triggers a reset if a missing clock is detected Bits6-5: UNUSED. Read = 00b, Write = don’t care Bit4: IFRDY: Internal Oscillator Frequency Ready Flag 0: Internal Oscillator Frequency not running at speed specified by the IFCN bits. 1: Internal Oscillator Frequency running at speed specified by the IFCN bits. Bit3: CLKSL: System Clock Source Select Bit 0: Uses Internal Oscillator as System Clock. 1: Uses External Oscillator as System Clock. Bit2: IOSCEN: Internal Oscillator Enable Bit 0: Internal Oscillator Disabled 1: Internal Oscillator Enabled Bits1-0: IFCN1-0: Internal Oscillator Frequency Control Bits 00: Internal Oscillator typical frequency is 2MHz. 01: Internal Oscillator typical frequency is 4MHz. 10: Internal Oscillator typical frequency is 8MHz. 11: Internal Oscillator typical frequency is 16MHz. m en de d fo r N ew D Bit7: Table 14.1. Internal Oscillator Electrical Characteristics MIN 1.5 3.1 6.2 12.3 TYP 2 4 8 16 200 MAX 2.4 4.8 9.6 19.2 UNITS MHz A 4 ppm/C 6.4 %/V N ot R ec om -40C to +85C unless otherwise specified. PARAMETER CONDITIONS Internal Oscillator OSCICN.[1:0] = 00 Frequency OSCICN.[1:0] = 01 OSCICN.[1:0] = 10 OSCICN.[1:0] = 11 Internal Oscillator Current OSCICN.2 = 1 Consumption (from VDD) Internal Oscillator Temperature Stability Internal Oscillator Power Supply (VDD) Stability Rev. 1.7 100 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 14.3. OSCXCN: External Oscillator Control Register Bit7 R/W XOSCMD2 Bit6 R/W XOSCMD1 Bit5 R/W XOSCMD0 Bit4 R/W R/W R/W R/W - XFCN2 XFCN1 XFCN0 Reset Value 00110000 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R XTLVLD 0xB1 XTLVLD: Crystal Oscillator Valid Flag (Valid only when XOSCMD = 1xx.) 0: Crystal Oscillator is unused or not yet stable 1: Crystal Oscillator is running and stable (should read 1ms after Crystal Oscillator is enabled to avoid transient condition). Bits6-4: XOSCMD2-0: External Oscillator Mode Bits 00x: Off. XTAL1 pin is grounded internally. 010: System Clock from External CMOS Clock on XTAL1 pin. 011: System Clock from External CMOS Clock on XTAL1 pin divided by 2. 10x: RC/C Oscillator Mode with divide by 2 stage. 110: Crystal Oscillator Mode 111: Crystal Oscillator Mode with divide by 2 stage. Bit3: RESERVED. Read = undefined, Write = don’t care Bits2-0: XFCN2-0: External Oscillator Frequency Control Bits 000-111: see table below 000 001 010 011 100 101 110 111 Crystal (XOSCMD = 11x) f  12.5kHz 12.5kHz < f  30.3kHz 30.35kHz < f  93.8kHz 93.8kHz < f  267kHz 267kHz < f  722kHz 722kHz < f  2.23MHz 2.23MHz < f  6.74MHz f > 6.74MHz RC (XOSCMD = 10x) C (XOSCMD = 10x) f  25kHz 25kHz < f  50kHz 50kHz < f  100kHz 100kHz < f  200kHz 200kHz < f  400kHz 400kHz < f  800kHz 800kHz < f  1.6MHz 1.6MHz < f  3.2MHz K Factor = 0.44 K Factor = 1.4 K Factor = 4.4 K Factor = 13 K Factor = 38 K Factor = 100 K Factor = 420 K Factor = 1400 m en de d XFCN fo r N ew D Bit7: om CRYSTAL MODE (Circuit from Figure 14.1, Option 1; XOSCMD = 11x) Choose XFCN value to match the crystal or ceramic resonator frequency. R ec RC MODE (Circuit from Figure 14.1, Option 2; XOSCMD = 10x) Choose oscillation frequency range where: f = 1.23(103) / (R * C), where f = frequency of oscillation in MHz C = capacitor value in pF R = Pull-up resistor value in k N ot C MODE (Circuit from Figure 14.1, Option 3; XOSCMD = 10x) Choose K Factor (KF) for the oscillation frequency desired: f = KF / (C * AV+), where f = frequency of oscillation in MHz C = capacitor value on XTAL1, XTAL2 pins in pF AV+ = Analog Power Supply on MCU in volts 101 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 14.1. External Crystal Example es ig ns If a crystal or ceramic resonator were used to generate the system clock for the MCU, the circuit would be as shown in Figure 14.1, Option 1. For an ECS-110.5-20-4 crystal, the resonate frequency is 11.0592MHz, the intrinsic capacitance is 7pF, and the ESR is 60. The compensation capacitors should be 33pF each, and the PWB parasitic capacitance is estimated to be 2pF. The appropriate External Oscillator Frequency Control value (XFCN) from the Crystal column in the table in Figure 14.3 (OSCXCN Register) should be 111b. D Because the oscillator detect circuitry needs time to settle after the crystal oscillator is enabled, software should wait at least 1ms between enabling the crystal oscillator and polling the XTLVLD bit. The recommend procedure is: 1. Enable the external oscillator 2. Wait at least 1 ms 3. Poll for XTLVLD '0' ==> '1' 4. Switch to the external oscillator N ew Switching to the external oscillator before the crystal oscillator has stabilized could result in unpredictable behavior. NOTE: Crystal oscillator circuits are quite sensitive to PCB layout. The crystal should be placed as close as possible to the XTAL pins on the device, keeping the traces as short as possible and shielded with ground plane from any other traces which could introduce noise or interference. 14.2. External RC Example m en de d fo r If an external RC network were used to generate the system clock for the MCU, the circuit would be as shown in Figure 14.1, Option 2. The capacitor must be no greater than 100pF, but using a very small capacitor will increase the frequency drift due to the PWB parasitic capacitance. To determine the required External Oscillator Frequency Control value (XFCN) in the OSCXCN Register, first select the RC network value to produce the desired frequency of oscillation. If the frequency desired is 100kHz, let R = 246k and C = 50pF: f = 1.23(103)/RC = 1.23(103) / [246 * 50] = 0.1MHz = 100kHz XFCN  log2(f/25kHz) XFCN  log2(100kHz/25kHz) = log2(4) XFCN  2, or code 010 14.3. External Capacitor Example ec om If an external capacitor were used to generate the system clock for the MCU, the circuit would be as shown in Figure 14.1, Option 3. The capacitor must be no greater than 100pF, but using a very small capacitor will increase the frequency inaccuracy due to the PWB parasitic capacitance. To determine the required External Oscillator Frequency Control value (XFCN) in the OSCXCN Register, select the capacitor to be used and find the frequency of oscillation from the equations below. Assume AV+ = 3.0V and C = 50pF: R f = KF / (C * VDD) = KF / (50 * 3) f = KF / 150 N ot If a frequency of roughly 90kHz is desired, select the K Factor from the table in Figure 14.3 as KF = 13: f = 13 /150 = 0.087MHz, or 87kHz Therefore, the XFCN value to use in this example is 011. Rev. 1.7 102 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 15. PORT INPUT/OUTPUT es ig ns The MCUs have a wide array of digital resources, which are available through four digital I/O ports, P0, P1, P2 and P3. Each of the pins on Ports 0, 1, and 2 can be defined as either its corresponding port I/O or one of the internal digital resources assigned as shown in Figure 15.1. The designer has complete control over which functions are assigned, limited only by the number of physical I/O pins available on the selected package (the C8051F000/05/10/15 have all four ports pinned out, the F001/06/11/16 have P0 and P1, and the F002/07/12/17 have P0). This resource assignment flexibility is achieved through the use of a Priority CrossBar Decoder. (Note that the state of a Port I/O pin can always be read in the corresponding Port latch regardless of the Crossbar settings). N ew D The CrossBar assigns the selected internal digital resources to the I/O pins based on the Priority Decode Table 15.1. The registers XBR0, XBR1, and XBR2, defined in Figure 15.3, Figure 15.4, and Figure 15.5 are used to select an internal digital function or let an I/O pin default to being a Port I/O. The crossbar functions identically for each MCU, with the caveat that P2 is not pinned out on the F001/06/11/16, and both P1 and P2 are not pinned out on the F002/07/12/17. Digital resources assigned to port pins that are not pinned out cannot be accessed. All Port I/Os are 5V tolerant (Refer to Figure 15.2 for the port cell circuit.) The Port I/O cells are configured as either push-pull or open-drain in the Port Configuration Registers (PRT0CF, PRT1CF, PRT2CF, PRT3CF). Complete Electrical Specifications for Port I/O are given in Table 15.2. 15.1. Priority Cross Bar Decoder fo r One of the design goals of this MCU family was to make the entire palette of digital resources available to the designer even on reduced pin count packages. The Priority CrossBar Decoder provides an elegant solution to the problem of connecting the internal digital resources to the physical I/O pins. m en de d The Priority CrossBar Decode (Table 15.1) assigns a priority to each I/O function, starting at the top with the SMBus. As the table illustrates, when selected, its two signals will be assigned to Pin 0 and 1 of I/O Port 0. The decoder always fills I/O bits from LSB to MSB starting with Port 0, then Port 1, finishing if necessary with Port 2. If you choose not to use a resource, the next function down on the table will fill the priority slot. In this way it is possible to choose only the functions required by the design, making full use of the available I/O pins. Also, any extra Port I/O are grouped together for more convenient use in application code. Port I/O Initialization ec 15.2. om Registers XBR0, XBR1 and XBR2 are used to assign the digital I/O resources to the physical I/O Port pins. It is important to understand that when the SMBus, SPI Bus, or UART is selected, the crossbar assigns all pins associated with the selected bus. It would be impossible for instance to assign the RX pin from the UART function without also assigning the TX function. Standard Port I/Os appear contiguously after the prioritized functions have been assigned. For example, if you choose functions that take the first 14 Port I/O (P0.[7:0], P1.[5:0]), you would have 18 Port I/O left unused by the crossbar (P1.[7:6], P2 and P3). N ot R Port I/O initialization is straightforward. Registers XBR0, XBR1 and XBR2 must be loaded with the appropriate values to select the digital I/O functions required by the design. Setting the XBARE bit in XBR2 to 1 enables the CrossBar. Until the Crossbar is enabled, the external pins remain as standard Ports in input mode regardless of the XBRn Register settings. For given XBRn Register settings, one can determine the I/O pin-out using the Priority Decode Table; as an alternative, the Code Configuration Wizard function of the IDE software will determine the Port I/O pin-assignments based on the XBRn Register settings. The output driver characteristics of the I/O pins are defined using the Port Configuration Registers PRT0CF, PRT1CF, PRT2CF and PRT3CF (see Figure 15.7, Figure 15.9, Figure 15.12, and Figure 15.14). Each Port Output driver can be configured as either Open Drain or Push-Pull. This is required even for the digital resources selected in the XBRn registers and is not automatic. The only exception to this is the SMBus (SDA, SCL) and UART Receive (RX, when in mode 0) pins which are Open-drain regardless of the PRTnCF settings. When the WEAKPUD bit in XBR2 is 0, a weak pullup is enabled for all Port I/O configured as open-drain. WEAKPUD does 103 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 not affect the push-pull Port I/O. Furthermore, the weak pullup is turned off on an open-drain output that is driving a 0 to avoid unnecessary power dissipation. es ig ns The third and final step is to initialize the individual resources selected using the appropriate setup registers. Initialization procedures for the various digital resources may be found in the detailed explanation of each available function. The reset state of each register is shown in the figures that describe each individual register. Figure 15.1. Port I/O Functional Block Diagram 2 SMBus SPI PRT0CF, PRT1CF, PRT2CF Registers 2 External Pins 6 PCA Priority Decoder 2 Comptr. Outputs 8 T0, T1, T2, T2EX, /INT0, /INT1 6 Digital Crossbar 8 /SYSCLK CNVSTR 8 P0 8 (P0.0-P0.7) P0.0 P1 I/O Cells fo r Lowest Priority P0 I/O Cells D UART (Internal Digital Signals) XBR0, XBR1, XBR2 Registers 4 N ew Highest Priority Highest Priority P0.7 P1.0 P1.7 P2.0 P2 I/O Cells P2.7 Lowest Priority Port Latches m en de d 8 P1 (P1.0-P1.7) 8 P2 (P2.0-P2.7) 8 (P3.0-P3.7) P3.0 P3 I/O Cells P3.7 om P3 PRT3CF Register Figure 15.2. Port I/O Cell Block Diagram ec WEAKPUD VDD PUSH-PULL N ot R /PORT-OUTENABLE VDD (WEAK) PORT PAD PORT-OUTPUT VDD DGND PORT-INPUT Rev. 1.7 104 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 15.1. Crossbar Priority Decode P0  SCK MISO   MOSI   NSS  TX RX  CEX0 CEX1 CEX2      CEX3 CEX4      P1 4     5     6    7 0 1 2 3 P2 4 5 6 7 0 1 2 3 4 5 6 7                          CP0 CP1 T0 /INT0 T1 /INT1 T2 T2EX /SYSCLK om CNVSTR m en de d fo r ECI 3 es ig ns SCL 2 D  SDA 1 N ew PIN I/O 0 N ot R ec In the Priority Decode Table, a dot () is used to show the external Port I/O pin (column) to which each signal (row) can be assigned by the user application code via programming registers XBR2, XBR1, and XBR0. 105 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 15.3. XBR0: Port I/O CrossBar Register 0 R/W ECIE R/W Bit7 Bit6 R/W R/W PCA0ME Bit5 Bit4 Bit3 R/W R/W UARTEN SPI0OEN R/W Bit2 Bit1 SMB0OEN Bit0 Reset Value 00000000 SFR Address: es ig ns R/W CP0OEN CP0OEN: Comparator 0 Output Enable Bit 0: CP0 unavailable at Port pin. 1: CP0 routed to Port Pin. Bit6: ECIE: PCA0 Counter Input Enable Bit 0: ECI unavailable at Port pin. 1: ECI routed to Port Pin. Bits3-5: PCA0ME: PCA Module I/O Enable Bits 000: All PCA I/O unavailable at Port pins. 001: CEX0 routed to Port Pin. 010: CEX0, CEX1 routed to 2 Port Pins. 011: CEX0, CEX1, CEX2 routed to 3 Port Pins. 100: CEX0, CEX1, CEX2, CEX3 routed to 4 Port Pins. 101: CEX0, CEX1, CEX2, CEX3, CEX4 routed to 5 Port Pins. 110: RESERVED 111: RESERVED Bit2: UARTEN: UART I/O Enable Bit 0: UART I/O unavailable at Port pins. 1: RX, TX routed to 2 Port Pins. Bit1: SPI0OEN: SPI Bus I/O Enable Bit 0: SPI I/O unavailable at Port pins. 1: MISO, MOSI, SCK, and NSS routed to 4 Port Pins. Bit0: SMB0OEN: SMBus Bus I/O Enable Bit 0: SMBus I/O unavailable at P0.0, P0.1. 1: SDA routed to P0.0, SCL routed to P0.1. N ot R ec om m en de d fo r N ew Bit7: D 0xE1 Rev. 1.7 106 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 15.4. XBR1: Port I/O CrossBar Register 1 R/W R/W R/W R/W R/W R/W R/W T2EXE T2E INT1E T1E INT0E T0E CP1OEN Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W SYSCKE SYSCKE: SYSCLK Output Enable Bit 0: SYSCLK unavailable at Port pin. 1: SYSCLK output routed to Port Pin. T2EXE: T2EX Enable Bit 0: T2EX unavailable at Port pin. 1: T2EX routed to Port Pin. T2E: T2 Enable Bit 0: T2 unavailable at Port pin. 1: T2 routed to Port Pin. INT1E: /INT1 Enable Bit 0: /INT1 unavailable at Port pin. 1: /INT1 routed to Port Pin. T1E: T1 Enable Bit 0: T1 unavailable at Port pin. 1: T1 routed to Port Pin. INT0E: /INT0 Enable Bit 0: /INT0 unavailable at Port pin. 1: /INT0 routed to Port Pin. T0E: T0 Enable Bit 0: T0 unavailable at Port pin. 1: T0 routed to Port Pin. CP1OEN: Comparator 1 Output Enable Bit 0: CP1 unavailable at Port pin. 1: CP1 routed to Port Pin. Bit6: Bit5: Bit4: Bit3: fo r Bit2: m en de d Bit1: N ot R ec om Bit0: 107 N ew Bit7: D 0xE2 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 15.5. XBR2: Port I/O CrossBar Register 2 R/W R/W R/W R/W R/W R/W R/W XBARE - - - - - CNVSTE Reset Value 00000000 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W WEAKPUD Bit7 0xE3 WEAKPUD: Port I/O Weak Pull-up Disable Bit 0: Weak Pull-ups Enabled (except for Ports whose I/O are configured as push-pull) 1: Weak Pull-ups Disabled Bit6: XBARE: Crossbar Enable Bit 0: Crossbar Disabled 1: Crossbar Enabled Bits5-1: UNUSED. Read = 00000b, Write = don’t care. Bit0: CNVSTE: ADC Convert Start Input Enable Bit 0: CNVSTR unavailable at Port pin. 1: CNVSTR routed to Port Pin. N ew D Bit7: fo r Example Usage of XBR0, XBR1, XBR2: When selected, the digital resources fill the Port I/O pins in order (top to bottom as shown in Table 15.1) starting with P0.0 through P0.7, and then P1.0 through P1.7, and finally P2.0 through P2.7. If the digital resources are not mapped to the Port I/O pins, they default to their matching internal Port Register bits. m en de d Example1: If XBR0 = 0x11, XBR1 = 0x00, and XBR2 = 0x40: P0.0=SDA, P0.1=SCL, P0.2=CEX0, P0.3=CEX1, P0.4 … P2.7 map to corresponding Port I/O. N ot R ec om Example2: If XBR0 = 0x80, XBR1 = 0x04, and XBR2 = 0x41: P0.0=CP0, P0.1=/INT0, P0.2 = CNVSTR, P0.3 … P2.7 map to corresponding Port I/O. Rev. 1.7 108 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 15.3. General Purpose Port I/O 15.4. es ig ns Each MCU has four byte-wide, bi-directional parallel ports that can be used general purpose I/O. Each port is accessed through a corresponding special function register (SFR) that is both byte addressable and bit addressable. When writing to a port, the value written to the SFR is latched to maintain the output data value at each pin. When reading, the logic levels of the port’s input pins are returned regardless of the XBRn settings (i.e. even when the pin is assigned to another signal by the Crossbar, the Port Register can always still read its corresponding Port I/O pin). The exception to this is the execution of the read-modify-write instructions. The read-modify-write instructions when operating on a port SFR are the following: ANL, ORL, XRL, JBC, CPL, INC, DEC, DJNZ and MOV, CLR or SET, when the destination is an individual bit in a port SFR. For these instructions, the value of the port register (not the pin) is read, modified, and written back to the SFR. Configuring Ports Which are not Pinned Out N ew D P2 and P3 are not pinned out on the F001/06/11/16. P1, P2, and P3 are not pinned out on the F002/07/12/17. These port registers (and corresponding interrupts, where applicable) are still available for software use in these reduced pin count MCUs. Whether used or not in software, it is recommended not to let these port drivers go to high impedance state. This is prevented after reset by having the weak pull-ups enabled as described in the XBR2 register. It is recommended that each output driver for ports not pinned out should be configured as push-pull using the corresponding PRTnCF register. This will inhibit a high impedance state even if the weak pull-up is disabled. Figure 15.6. P0: Port0 Register R/W R/W P0.5 P0.4 Bit7 Bit6 Bit5 Bit4 R/W R/W R/W R/W P0.3 P0.2 P0.1 P0.0 11111111 Bit3 Bit2 Bit1 Bit0 SFR Address: fo r R/W P0.6 (bit addressable) Reset Value 0x80 m en de d R/W P0.7 Bits7-0: P0.[7:0] (Write – Output appears on I/O pins per XBR0, XBR1, and XBR2 Registers) 0: Logic Low Output. 1: Logic High Output (high-impedance if corresponding PRT0CF.n bit = 0) (Read – Regardless of XBR0, XBR1, and XBR2 Register settings). 0: P0.n pin is logic low. 1: P0.n pin is logic high. R/W R/W R/W R/W R/W R/W R/W R/W Reset Value Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: ec Bit7 om Figure 15.7. PRT0CF: Port0 Configuration Register 00000000 0xA4 N ot R Bits7-0: PRT0CF.[7:0]: Output Configuration Bits for P0.7-P0.0 (respectively) 0: Corresponding P0.n Output mode is Open-Drain. 1: Corresponding P0.n Output mode is Push-Pull. 109 (Note: When SDA, SCL, and RX appear on any of the P0 I/O, each are open-drain regardless of the value of PRT0CF). Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 15.8. P1: Port1 Register R/W R/W R/W R/W R/W R/W R/W P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 11111111 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: (bit addressable) 0x90 N ew D Bits7-0: P1.[7:0] (Write – Output appears on I/O pins per XBR0, XBR1, and XBR2 registers) 0: Logic Low Output. 1: Logic High Output (high-impedance if corresponding PRT1CF.n bit = 0) (Read – Regardless of XBR0, XBR1, and XBR2 Register settings). 0: P1.n pin is logic low. 1: P1.n pin is logic high. Reset Value es ig ns R/W P1.7 Figure 15.9. PRT1CF: Port1 Configuration Register R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 R/W R/W R/W Reset Value Bit2 Bit1 Bit0 SFR Address: 00000000 0xA5 fo r R/W m en de d Bits7-0: PRT1CF.[7:0]: Output Configuration Bits for P1.7-P1.0 (respectively) 0: Corresponding P1.n Output mode is Open-Drain. 1: Corresponding P1.n Output mode is Push-Pull. Figure 15.10. PRT1IF: Port1 Interrupt Flag Register R/W R/W IE7 IE6 Bit7 Bit6 R/W R/W R/W R/W R/W IE5 IE4 - - - - Reset Value 00000000 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 0xAD IE7: External Interrupt 7 Pending Flag. 0: No falling edge detected on P1.7. 1: This flag is set by hardware when a falling edge on P1.7 is detected. Bit6: IE6: External Interrupt 6 Pending Flag. 0: No falling edge detected on P1.6. 1: This flag is set by hardware when a falling edge on P1.6 is detected. Bit5: IE5: External Interrupt 5 Pending Flag. 0: No falling edge detected on P1.5. 1: This flag is set by hardware when a falling edge on P1.5 is detected. Bit4: IE4: External Interrupt 4 Pending Flag. 0: No falling edge detected on P1.4. 1: This flag is set by hardware when a falling edge on P1.4 is detected. Bits3-0: UNUSED. Read = 0000b, Write = don’t care. N ot R ec om Bit7: R/W Rev. 1.7 110 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 15.11. P2: Port2 Register R/W R/W R/W R/W R/W R/W R/W P2.6 P2.5 P2.4 P2.3 P2.2 P2.1 P2.0 11111111 Bit7 Bit6 Bit Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: (bit addressable) 0xA0 N ew D Bits7-0: P2.[7:0] (Write – Output appears on I/O pins per XBR0, XBR1, and XBR2 registers) 0: Logic Low Output. 1: Logic High Output (high-impedance if corresponding PRT2CF.n bit = 0) (Read – Regardless of XBR0, XBR1, and XBR2 Register settings). 0: P2.n is logic low. 1: P2.n is logic high. Reset Value es ig ns R/W P2.7 Figure 15.12. PRT2CF: Port2 Configuration Register R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 R/W R/W R/W Reset Value Bit2 Bit1 Bit0 SFR Address: fo r R/W N ot R ec om m en de d Bits7-0: PRT2CF.[7:0]: Output Configuration Bits for P2.7-P2.0 (respectively) 0: Corresponding P2.n Output mode is Open-Drain. 1: Corresponding P2.n Output mode is Push-Pull. 111 Rev. 1.7 00000000 0xA6 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 15.13. P3: Port3 Register R/W R/W R/W R/W R/W R/W R/W P3.6 P3.5 P3.4 P3.3 P3.2 P3.1 P3.0 Reset Value 11111111 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W P3.7 (bit addressable) N ew D Bits7-0: P3.[7:0] (Write) 0: Logic Low Output. 1: Logic High Output (high-impedance if corresponding PRT3CF.n bit = 0) (Read) 0: P3.n is logic low. 1: P3.n is logic high. 0xB0 Figure 15.14. PRT3CF: Port3 Configuration Register R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 R/W R/W R/W Reset Value Bit2 Bit1 Bit0 SFR Address: 00000000 0xA7 fo r R/W m en de d Bits7-0: PRT3CF.[7:0]: Output Configuration Bits for P3.7-P3.0 (respectively) 0: Corresponding P3.n Output mode is Open-Drain. 1: Corresponding P3.n Output mode is Push-Pull. Table 15.2. Port I/O DC Electrical Characteristics om VDD = 2.7 to 3.6V, -40C to +85C unless otherwise specified. PARAMETER CONDITIONS Output High Voltage IOH = -10uA, Port I/O push-pull IOH = -3mA, Port I/O push-pull MIN VDD – 0.1 VDD – 0.7 ec IOH = -10mA, Port I/O push-pull 0.1 0.6 V 0.7 x VDD V Input Low Voltage N ot UNITS V 1.0 Input High Voltage Input Leakage Current MAX VDD – 0.8 IOL = 10uA IOL = 8.5mA IOL = 25mA R Output Low Voltage TYP 0.3 x VDD DGND < Port Pin < VDD, Pin Tri-state Weak Pull-up Off Weak Pull-up On Capacitive Loading Rev. 1.7 1 30 5 V A pF 112 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 16. SMBus / I2C Bus es ig ns The SMBus serial I/O interface is compliant with the System Management Bus Specification, version 1.1. It is a two-wire, bi-directional serial bus, which is also compatible with the I2C serial bus. Reads and writes to the interface by the system controller are byte oriented with the SMBus interface autonomously controlling the serial transfer of the data. Data can be transferred at up to 1/8th of the system clock if desired (this can be faster than allowed by the SMBus specification, depending on the system clock used). A method of extending the clock-low duration is used to accommodate devices with different speed capabilities on the same bus. D Two types of data transfers are possible: data transfers from a master transmitter to an addressed slave receiver, and data transfers from an addressed slave transmitter to a master receiver. The master device initiates both types of data transfers and provides the serial clock pulses. The SMBus interface may operate as a master or a slave. Multiple master devices on the same bus are also supported. If two or more masters attempt to initiate a data transfer simultaneously, an arbitration scheme is employed with a single master always winning the arbitration. N ew Figure 16.1. SMBus Block Diagram SFR Bus SMB0STA E S S S A F T N T T I A T O S A O E E M B S T A 7 S T A 6 S T A 5 S T A 4 S T A 3 S T A 2 SMB0CR S T A 1 S T A 0 C C C C C C C C R R R R R R R R 7 6 5 4 3 2 1 0 fo r SMB0CN B U S Y Clock Divide Logic m en de d SYSCLK SCL FILTER SMBUS CONTROL LOGIC SMBUS IRQ Interrupt Request Arbitration SCL Synchronization Status Generation SCL Generation (Master Mode) IRQ Generation SCL Control SDA Control C R O S S B A R B A=B A=B om Data Path Control N A B A ec 0000000b 7 MSBs 8 N ot R 7 113 S L V 6 S L V 5 SMB0DAT 7 6 5 4 3 2 1 0 8 S L V 4 S L V 3 S L V 2 S L V 1 8 SDA FILTER 1 S L V G 0 C N 0 Read SMB0DAT SMB0ADR Write to SMB0DAT SFR Bus Rev. 1.7 Port I/O C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 16.2. Typical SMBus Configuration VDD = 3V VDD = 5V VDD = 3V Master Device Slave Device 1 Slave Device 2 16.1. SDA SCL m en de d fo r N ew D VDD = 5V es ig ns Figure 16.2 shows a typical SMBus configuration. The SMBus interface will work at any voltage between 3.0V and 5.0V and different devices on the bus may operate at different voltage levels. The SCL (serial clock) and SDA (serial data) lines are bi-directional. They must be connected to a positive power supply voltage through a pull-up resistor or similar circuit. When the bus is free, both lines are pulled high. Every device connected to the bus must have an open-drain or open-collector output for both the SCL and SDA lines. The maximum number of devices on the bus is limited only by the requirement that the rise and fall times on the bus will not exceed 300ns and 1000ns, respectively. Supporting Documents N ot R ec om It is assumed the reader is familiar with or has access to the following supporting documents: 1. The I2C-bus and how to use it (including specifications), Philips Semiconductor. 2. The I2C-Bus Specification -- Version 2.0, Philips Semiconductor. 3. System Management Bus Specification -- Version 1.1, SBS Implementers Forum. Rev. 1.7 114 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 16.2. Operation es ig ns A typical SMBus transaction consists of a START condition, followed by an address byte, one or more bytes of data, and a STOP condition. The address byte and each of the data bytes are followed by an ACKNOWLEDGE bit from the receiver. The address byte consists of a 7-bit address plus a direction bit. The direction bit (R/W) occupies the least-significant bit position of the address. The direction bit is set to logic 1 to indicate a “READ” operation and cleared to logic 0 to indicate a “WRITE” operation. A general call address (0x00 +R/W) is recognized by all slave devices allowing a master to address multiple slave devices simultaneously. N ew D All transactions are initiated by the master, with one or more addressed slave devices as the target. The master generates the START condition and then transmits the address and direction bit. If the transaction is a WRITE operation from the master to the slave, the master transmits the data a byte at a time waiting for an ACKNOWLEDGE from the slave at the end of each byte. If it is a READ operation, the slave transmits the data waiting for an ACKNOWLEDGE from the master at the end of each byte. At the end of the data transfer, the master generates a STOP condition to terminate the transaction and free the bus. Figure 16.3 illustrates a typical SMBus transaction. Figure 16.3. SMBus Transaction SLAVE ADDR R/W ACK DATA ACK DATA NACK STOP fo r START m en de d Time The SMBus interface may be configured to operate as either a master or a slave. At any particular time, it will be operating in one of the following four modes: 16.2.1. Master Transmitter Mode om Serial data is transmitted on SDA while the serial clock is output on SCL. The first byte transmitted contains the address of the target slave device and the data direction bit. In this case the data direction bit (R/W) will be logic 0 to indicate a “WRITE” operation. The master then transmits one or more bytes of serial data. After each byte is transmitted, an acknowledge bit is generated by the slave. To indicate the beginning and the end of the serial transfer, the master device outputs START and STOP conditions. 16.2.2. Master Receiver Mode R ec Serial data is received on SDA while the serial clock is output on SCL. The first byte is transmitted by the master and contains the address of the target slave and the data direction bit. In this case the data direction bit (R/W) will be logic 1 to indicate a “READ” operation. Serial data is then received from the slave on SDA while the master outputs the serial clock. The slave transmits one or more bytes of serial data. After each byte is received, an acknowledge bit is transmitted by the master. The master outputs START and STOP conditions to indicate the beginning and end of the serial transfer. N ot 16.2.3. Slave Transmitter Mode Serial data is transmitted on SDA while the serial clock is received on SCL. First, a byte is received that contains an address and data direction bit. In this case the data direction bit (R/W) will be logic 1 to indicate a “READ” operation. If the received address matches the slave’s assigned address (or a general call address is received) one or more bytes of serial data are transmitted to the master. After each byte is received, an acknowledge bit is transmitted by the master. The master outputs START and STOP conditions to indicate the beginning and end of the serial transfer. 115 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 16.2.4. Slave Receiver Mode 16.3. es ig ns Serial data is received on SDA while the serial clock is received on SCL. First, a byte is received that contains an address and data direction bit. In this case the data direction bit (R/W) will be logic 0 to indicate a “WRITE” operation. If the received address matches the slave’s assigned address (or a general call address is received) one or more bytes of serial data are received from the master. After each byte is received, an acknowledge bit is transmitted by the slave. The master outputs START and STOP conditions to indicate the beginning and end of the serial transfer. Arbitration 16.4. N ew D A master may start a transfer only if the bus is free. The bus is free after a STOP condition or after the SCL and SDA lines remains high for a specified time. Two or more master devices may attempt to generate a START condition at the same time. Since the devices that generated the START condition may not be aware that other masters are contending for the bus, an arbitration scheme is employed. The master devices continue to transmit until one of the masters transmits a HIGH level, while the other(s) master transmits a LOW level on SDA. The first master(s) transmitting the HIGH level on SDA looses the arbitration and is required to give up the bus. Clock Low Extension 16.5. fo r SMBus provides a clock synchronization mechanism, similar to I2C, which allows devices with different speed capabilities to coexist on the bus. A clock-low extension is used during a transfer in order to allow slower slave devices to communicate with faster masters. The slave can hold the SCL line LOW to extend the clock low period, effectively decreasing the serial clock frequency. Timeouts 16.5.1. SCL Low Timeout m en de d If the SCL line is held low by a slave device on the bus, no further communication is possible. Furthermore, the master cannot force the SCL line high to correct the error condition. To solve this problem, the SMBus protocol specifies that devices participating in a transfer must detect any clock cycle held low longer than 25ms as a “timeout” condition. Devices that have detected the timeout condition must reset the communication no later than 10ms after detecting the timeout condition. One of the MCU’s general-purpose timers, operating in 16-bit auto-reload mode, can be used to monitor the SCL line for this timeout condition. Timer 3 is specifically designed for this purpose. (Refer to the Timer 3 Section 19.3. for detailed information on Timer 3 operation.) om 16.5.2. SCL High (SMBus Free) Timeout The SMBus specification stipulates that if a device holds the SCL and SDA lines high for more that 50usec, the bus is designated as free. The SMB0CR register is used to detect this condition when the FTE bit in SMB0CN is set. SMBus Special Function Registers ec 16.6. N ot R The SMBus serial interface is accessed and controlled through five SFRs: SMB0CN Control Register, SMB0CR Clock Rate Register, SMB0ADR Address Register, SMB0DAT Data Register and SMB0STA Status Register. The system device may have one or more SMBus serial interfaces implemented. The five special function registers related to the operation of the SMBus interface are described in the following section. Rev. 1.7 116 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 16.6.1. Control Register es ig ns The SMBus Control register SMB0CN is used to configure and control the SMBus interface. All of the bits in the register can be read or written by software. Two of the control bits are also affected by the SMBus hardware. The Serial Interrupt flag (SI, SMB0CN.3) is set to logic 1 by the hardware when a valid serial interrupt condition occurs. It can only be cleared by software. The Stop flag (STO, SMB0CN.4) is cleared to logic 0 by hardware when a STOP condition is present on the bus. Setting the ENSMB flag to logic 1 enables the SMBus interface. Clearing the ENSMB flag to logic 0 disables the SMBus interface and removes it from the bus. Momentarily clearing the ENSMB flag and then resetting it to logic 1 will reset a SMBus communication. However, ENSMB should not be used to temporarily remove a device from the bus since the bus state information will be lost. Instead, the Assert Acknowledge (AA) flag should be used to temporarily remove the device from the bus (see description of AA flag below). N ew D Setting the Start flag (STA, SMB0CN.5) to logic 1 will put the SMBus in a master mode. If the bus is free, the SMBus hardware will generate a START condition. If the bus is not free, the SMBus hardware waits for a STOP condition to free the bus and then generates a START condition after a 5s delay per the SMB0CR value. (In accordance with the SMBus protocol, the SMBus interface also considers the bus free if the bus is idle for 50s and no STOP condition was recognized.) If STA is set to logic 1 while the SMBus is in master mode and one or more bytes have been transferred, a repeated START condition will be generated. To ensure proper operation, the STO flag should be explicitly cleared before setting STA to a logic 1. m en de d fo r When the Stop flag (STO, SMB0CN.4) is set to logic 1 while the SMBus interface is in master mode, the hardware generates a STOP condition on the SMBus. In a slave mode, the STO flag may be used to recover from an error condition. In this case, a STOP condition is not generated on the SMBus, but the SMBus hardware behaves as if a STOP condition has been received and enters the “not addressed” slave receiver mode. The SMBus hardware automatically clears the STO flag to logic 0 when a STOP condition is detected on the bus. The Serial Interrupt flag (SI, SMB0CN.3) is set to logic 1 by hardware when the SMBus interface enters one of 27 possible states. If interrupts are enabled for the SMBus interface, an interrupt request is generated when the SI flag is set. The SI flag must be cleared by software. While SI is set to logic 1, the clock-low period of the serial clock will be stretched and the serial transfer is suspended. om The Assert Acknowledge flag (AA, SMB0CN.2) is used to set the level of the SDA line during the acknowledge clock cycle on the SCL line. Setting the AA flag to logic 1 will cause an ACKNOWLEDGE (low level on SDA) to be sent during the acknowledge cycle if the device has been addressed. Setting the AA flag to logic 0 will cause a NOT ACKNOWLEDGE (high level on SDA) to be sent during acknowledge cycle. After the transmission of a byte in slave mode, the slave can be temporarily removed from the bus by clearing the AA flag. The slave’s own address and general call address will be ignored. To resume operation on the bus, the AA flag must be reset to logic 1 to allow the slave’s address to be recognized. R ec Setting the SMBus Free Timer Enable bit (FTE, SMB0CN.1) to logic 1 enables the SMBus Free Timeout feature. If SCL and SDA remain high for the SMBus Free Timeout given in the SMBus Clock Rate Register (Figure 16.5), the bus will be considered free and a Start will be generated if pending. The bus free period should be greater than 50s. N ot Setting the SMBus timeout enable bit (TOE, SMB0CN.0) to logic 1 enables Timer 3 to count up when the SCL line is low and Timer 3 is enabled. If Timer 3 overflows, a Timer 3 interrupt will be generated, which will alert the CPU that a SMBus SCL low timeout has occurred. 117 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 16.4. SMB0CN: SMBus Control Register R/W R/W R/W R/W R/W R/W R/W ENSMB STA STO SI AA FTE TOE 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: (bit addressable) Bit7: 0xC0 BUSY: Busy Status Flag. 0: SMBus is free 1: SMBus is busy ENSMB: SMBus Enable. This bit enables/disables the SMBus serial interface. 0: SMBus disabled. 1: SMBus enabled. STA: SMBus Start Flag. 0: No START condition is transmitted. 1: When operating as a master, a START condition is transmitted if the bus is free. (If the bus is not free, the START is transmitted after a STOP is received.) If STA is set after one or more bytes have been transmitted or received and before a STOP is received, a repeated START condition is transmitted. STO should be explicitly cleared before setting STA to logic 1. STO: SMBus Stop Flag. 0: No STOP condition is transmitted. 1: Setting STO to logic 1 causes a STOP condition to be transmitted. When a STOP condition is received, hardware clears STO to logic 0. If both STA and STO are set, a STOP condition is transmitted followed by a START condition. In slave mode, setting the STO flag causes SMBus to behave as if a STOP condition was received. SI: SMBus Serial Interrupt Flag. This bit is set by hardware when one of 27 possible SMBus states is entered. (Status code 0xF8 does not cause SI to be set.) When the SI interrupt is enabled, setting this bit causes the CPU to vector to the SMBus interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. AA: SMBus Assert Acknowledge Flag. This bit defines the type of acknowledge returned during the acknowledge cycle on the SCL line. 0: A “not acknowledge” (high level on SDA) is returned during the acknowledge cycle. 1: An “acknowledge” (low level on SDA) is returned during the acknowledge cycle. FTE: SMBus Free Timer Enable Bit 0: No timeout when SCL is high 1: Timeout when SCL high time exceeds limit specified by the SMB0CR value. TOE: SMBus Timeout Enable Bit 0: No timeout when SCL is low. 1: Timeout when SCL low time exceeds limit specified by Timer 3, if enabled. D Bit6: Reset Value es ig ns R BUSY N ew Bit5: m en de d fo r Bit4: Bit3: Bit1: N ot R ec Bit0: om Bit2: Rev. 1.7 118 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 16.6.2. Clock Rate Register Figure 16.5. SMB0CR: SMBus Clock Rate Register R/W R/W R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 R/W Reset Value Bit0 SFR Address: es ig ns R/W 00000000 0xCF D Bits7-0: SMB0CR.[7:0]: SMBus Clock Rate Preset The SMB0CR Clock Rate register controls the frequency of the serial clock SCL in master mode. The 8-bit word stored in the SMB0CR Register preloads a dedicated 8-bit timer. The timer counts up, and when it rolls over to 0x00, the SCL logic state toggles. N ew The SMB0CR setting should be bounded by the following equation, where SMB0CR is the unsigned 8-bit value in register SMB0CR, and SYSCLK is the system clock frequency in Hz: SMB0CR < ((288 - 0.85 * SYSCLK) / 1.125E6) The resulting SCL signal high and low times are given by the following equations: TLOW = (256 – SMB0CR) / SYSCLK fo r THIGH  (258 – SMB0CR) / SYSCLK + 625 ns Using the same value of SMB0CR from above, the Bus Free Timeout period is given in the following equation: N ot R ec om m en de d TBFT  10 * [(256 – SMB0CR) + 1] / SYSCLK 119 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 16.6.3. Data Register es ig ns The SMBus Data register SMB0DAT holds a byte of serial data to be transmitted or one that has just been received. Data remains stable in the register as long as SI is set to logic 1. Software can safely read or write to the data register when the SI flag is set. Software should not attempt to access the SMB0DAT register when the SMBus is enabled and the SI flag is cleared to logic 0 since the hardware may be in the process of shifting a byte of data in or out of the register. Data in SMB0DAT is always shifted out MSB first. After a byte has been received, the first bit of received data is located at the MSB of SMB0DAT. While data is being shifted out, data on the bus is simultaneously being shifted in. Therefore, SMB0DAT always contains the last data byte present on the bus. Thus, in the event of lost arbitration, the transition from master transmitter to slave receiver is made with the correct data in SMB0DAT. R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 R/W R/W N ew R/W D Figure 16.6. SMB0DAT: SMBus Data Register Bit2 Bit1 R/W Reset Value Bit0 SFR Address: 00000000 0xC2 m en de d fo r Bits7-0: SMB0DAT: SMBus Data. The SMB0DAT register contains a byte of data to be transmitted on the SMBus serial interface or a byte that has just been received on the SMBus serial interface. The CPU can read from or write to this register whenever the SI serial interrupt flag (SMB0CN.3) is set to logic one. The serial data in the register remains stable as long as the SI flag is set. When the SI flag is not set, the system may be in the process of shifting data in/out and the CPU should not attempt to access this register. 16.6.4. Address Register The SMB0ADR Address register holds the slave address for the SMBus interface. In slave mode, the seven mostsignificant bits hold the 7-bit slave address. The least significant bit, bit 0, is used to enable the recognition of the general call address (0x00). If bit 0 is set to logic 1, the general call address will be recognized. Otherwise, the general call address is ignored. The contents of this register are ignored when the SMBus hardware is operating in master mode. R/W SLV6 R/W R/W R/W R/W R/W R/W R/W SLV5 SLV4 SLV3 SLV2 SLV1 SLV0 GC 00000000 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: Reset Value 0xC3 ec Bit7 om Figure 16.7. SMB0ADR: SMBus Address Register N ot R Bits7-1: SLV6-SLV0: SMBus Slave Address. These bits are loaded with the 7-bit slave address to which the SMBus will respond when operating as a slave transmitter or slave receiver. SLV6 is the most significant bit of the address and corresponds to the first bit of the address byte received on the SMBus. Bit0: GC: General Call Address Enable. This bit is used to enable general call address (0x00) recognition. 0: General call address is ignored. 1: General call address is recognized. Rev. 1.7 120 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 16.6.5. Status Register es ig ns The SMB0STA Status register holds an 8-bit status code indicating the current state of the SMBus. There are 28 possible SMBus states, each with a corresponding unique status code. The five most significant bits of the status code vary while the three least-significant bits of a valid status code are fixed at zero when SI = 1. Therefore, all possible status codes are multiples of eight. This facilitates the use of status codes in software as an index used to branch to appropriate service routines (allowing 8 bytes of code to service the state or jump to a more extensive service routine). For the purposes of user software, the contents of the SMB0STA register is only defined when the SI flag is logic 1. Software should never write to the SMB0STA register. Doing so will yield indeterminate results. The 28 SMBus states, along with their corresponding status codes, are given in Table 16.1. D Figure 16.8. SMB0STA: SMBus Status Register R/W R/W R/W R/W STA6 STA5 STA4 STA3 Bit7 Bit6 Bit5 Bit4 Bit3 R/W R/W N ew R/W STA7 R/W STA1 STA0 11111000 Bit2 Bit1 Bit0 SFR Address: m en de d fo r Bits7-3: STA7-STA3: SMBus Status Code. These bits contain the SMBus Status Code. There are 28 possible status codes. Each status code corresponds to a single SMBus state. A valid status code is present in SMB0STA when the SI flag (SMB0CN.3) is set. The content of SMB0STA is not defined when the SI flag is logic 0. Writing to the SMB0STA register at any time will yield indeterminate results. N ot R ec om Bits2-0: STA2-STA0: The three least significant bits of SMB0STA are always read as logic 0 when the SI flag is logic 1. 121 Rev. 1.7 Reset Value STA2 0xC1 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 16.1. SMBus Status Codes 0x80 Slave Receiver 0x88 Slave Receiver 0x90 Slave Receiver m en de d 0x98 Slave Receiver Slave Receiver Slave Transmitter Slave Transmitter Slave Transmitter Slave Transmitter Slave Transmitter Slave Transmitter/Receiver All N ot R ec om 0xA0 0xA8 0xB0 0xB8 0xC0 0xC8 0xD0 0xF8 es ig ns Slave Receiver Slave Receiver Bus Error (i.e. illegal START, illegal STOP, …) START condition transmitted. Repeated START condition transmitted. Slave address + W transmitted. ACK received. Slave address + W transmitted. NACK received. Data byte transmitted. ACK received. Data byte transmitted. NACK received. Arbitration lost Slave address + R transmitted. ACK received. Slave address + R transmitted. NACK received Data byte received. ACK transmitted. Data byte received. NACK transmitted. SMB0’s own slave address + W received. ACK transmitted. Arbitration lost in transmitting slave address + R/W as master. Own slave address + W received. ACK transmitted. General call address (0x00) received. ACK returned. Arbitration lost in transmitting slave address + R/W as master. General call address received. ACK transmitted. SMB0’s own slave address + W received. Data byte received. ACK transmitted. SMB0’s own slave address + W received. Data byte received. NACK transmitted. General call address (0x00) received. Data byte received. ACK transmitted. General call address (0x00) received. Data byte received. NACK transmitted. A STOP or repeated START received while addressed as a slave. SMB0’s own slave address + R received. ACK transmitted. Arbitration lost in transmitting slave address + R/W as master. Own slave address + R received. ACK transmitted. Data byte transmitted. ACK received. Data byte transmitted. NACK received. Last data byte transmitted (AA=0). ACK received. SCL Clock High Timer per SMB0CR timed out (FTE=1) Idle D 0x70 0x78 SMBus State N ew All Master Transmitter/Receiver Master Transmitter/Receiver Master Transmitter Master Transmitter Master Transmitter Master Transmitter Master Transmitter Master Receiver Master Receiver Master Receiver Master Receiver Slave Receiver Slave Receiver Mode fo r Status Code (SMB0STA) 0x00 0x08 0x10 0x18 0x20 0x28 0x30 0x38 0x40 0x48 0x50 0x58 0x60 0x68 Rev. 1.7 122 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 17. SERIAL PERIPHERAL INTERFACE BUS es ig ns The Serial Peripheral Interface (SPI) provides access to a four-wire, full-duplex, serial bus. SPI supports the connection of multiple slave devices to a master device on the same bus. A separate slave-select signal (NSS) is used to select a slave device and enable a data transfer between the master and the selected slave. Multiple masters on the same bus are also supported. Collision detection is provided when two or more masters attempt a data transfer at the same time. The SPI can operate as either a master or a slave. When the SPI is configured as a master, the maximum data transfer rate (bits/sec) is one-half the system clock frequency. N ew D When the SPI is configured as a slave, the maximum data transfer rate (bits/sec) for full-duplex operation is 1/10 the system clock frequency, provided that the master issues SCK, NSS, and the serial input data synchronously with the system clock. If the master issues SCK, NSS, and the serial input data asynchronously, the maximum data transfer rate (bits/sec) must be less that 1/10 the system clock frequency. In the special case where the master only wants to transmit data to the slave and does not need to receive data from the slave (i.e. half-duplex operation), the SPI slave can receive data at a maximum data transfer rate (bits/sec) of ¼ the system clock frequency. This is provided that the master issues SCK, NSS, and the serial input data synchronously with the system clock. Figure 17.1. SPI Block Diagram SFR Bus S C R 5 S C R 4 S C R 3 S C R 2 SPI0CFG S C R 1 S C R 0 C K P H A C B B B F K C C C R P 2 1 0 S O 2 L SPI0CN F R S 1 F R S 0 S P I F W C O L M O D F m en de d SYSCLK S C R 6 Clock Divide Logic R X O V R N T X B S Y S L V S E L M S T E N S P I E N fo r SPI0CKR S C R 7 Bit Count Logic SPI CONTROL LOGIC SPI Clock (Master Mode) ec om Data Path Control SPI0DAT 7 6 5 4 3 2 1 0 R N ot Rx Data Receive Data Register Write to SPI0DAT Pin Control Logic MISO NSS Read SPI0DAT SFR Bus 123 SCK MOSI Tx Data Shift Register SPI IRQ Pin Control Interface Rev. 1.7 C R O S S B A R Port I/O C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 NSS NSS Slave Device Slave Device Slave Device D VDD N ew Master Device 17.1. es ig ns NSS Port I/O Port I/O Port I/O Figure 17.2. Typical SPI Interconnection Signal Descriptions MISO MOSI SCK 17.1.1. Master Out, Slave In fo r The four signals used by the SPI (MOSI, MISO, SCK, NSS) are described below. m en de d The master-out, slave-in (MOSI) signal is an output from a master device and an input to slave devices. It is used to serially transfer data from the master to the slave. Data is transferred most-significant bit first. 17.1.2. Master In, Slave Out The master-in, slave-out (MISO) signal is an output from a slave device and an input to the master device. It is used to serially transfer data from the slave to the master. Data is transferred most-significant bit first. A SPI slave places the MISO pin in a high-impedance state when the slave is not selected. 17.1.3. Serial Clock The serial clock (SCK) signal is an output from the master device and an input to slave devices. It is used to synchronize the transfer of data between the master and slave on the MOSI and MISO lines. om 17.1.4. Slave Select N ot R ec The slave select (NSS) signal is an input used to select the SPI module when in slave mode by a master, or to disable the SPI module when in master mode. When in slave mode, it is pulled low to initiate a data transfer and remains low for the duration of the transfer. Rev. 1.7 124 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 17.2. Operation es ig ns Only a SPI master device can initiate a data transfer. The SPI is placed in master mode by setting the Master Enable flag (MSTEN, SPI0CN.1). Writing a byte of data to the SPI data register (SPI0DAT) when in Master Mode starts a data transfer. The SPI master immediately shifts out the data serially on the MOSI line while providing the serial clock on SCK. The SPIF (SPI0CN.7) flag is set to logic 1 at the end of the transfer. If interrupts are enabled, an interrupt request is generated when the SPIF flag is set. The SPI master can be configured to shift in/out from one to eight bits in a transfer operation in order to accommodate slave devices with different word lengths. The SPIFRS bits in the SPI Configuration Register (SPI0CFG.[2:0]) are used to select the number of bits to shift in/out in a transfer operation. N ew D While the SPI master transfers data to a slave on the MOSI line, the addressed SPI slave device simultaneously transfers the contents of its shift register to the SPI master on the MISO line in a full-duplex operation. The data byte received from the slave replaces the data in the master’s data register. Therefore, the SPIF flag serves as both a transmit-complete and receive-data-ready flag. The data transfer in both directions is synchronized with the serial clock generated by the master. Figure 17.3 illustrates the full-duplex operation of an SPI master and an addressed slave. Figure 17.3. Full Duplex Operation MASTER DEVICE SLAVE DEVICE SPI SHIFT REGISTER 76543210 MISO MOSI fo r MOSI MISO SPI SHIFT REGISTER 76543210 VDD NSS NSS m en de d Receive Buffer Baud Rate Generator SCK Receive Buffer SCK Px.y ec om The SPI data register is double buffered on reads, but not on a write. If a write to SPI0DAT is attempted during a data transfer, the WCOL flag (SPI0CN.6) will be set to logic 1 and the write is ignored. The current data transfer will continue uninterrupted. A read of the SPI data register by the system controller actually reads the receive buffer. If the receive buffer still holds unread data from a previous transfer when the last bit of the current transfer is shifted into the SPI shift register, a receive overrun occurs and the RXOVRN flag (SPI0CN.4) is set to logic 1. The new data is not transferred to the receive buffer, allowing the previously received data byte to be read. The data byte causing the overrun is lost. N ot R When the SPI is enabled and not configured as a master, it will operate as an SPI slave. Another SPI device acting as a master will initiate a transfer by driving the NSS signal low. The master then shifts data out of the shift register on the MOSI pin using the its serial clock. The SPIF flag is set to logic 1 at the end of a data transfer (when the NSS signal goes high). The slave can load its shift register for the next data transfer by writing to the SPI data register. The slave must make the write to the data register at least one SPI serial clock cycle before the master starts the next transmission. Otherwise, the byte of data already in the slave’s shift register will be transferred. Multiple masters may reside on the same bus. A Mode Fault flag (MODF, SPI0CN.5) is set to logic 1 when the SPI is configured as a master (MSTEN = 1) and its slave select signal NSS is pulled low. When the Mode Fault flag is set, the MSTEN and SPIEN bits of the SPI control register are cleared by hardware, thereby placing the SPI module 125 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 in an “off-line” state. In a multiple-master environment, the system controller should check the state of the SLVSEL flag (SPI0CN.2) to ensure the bus is free before setting the MSTEN bit and initiating a data transfer. 17.3. Serial Clock Timing es ig ns As shown in Figure 17.4, four combinations of serial clock phase and polarity can be selected using the clock control bits in the SPI Configuration Register (SPI0CFG). The CKPHA bit (SPI0CFG.7) selects one of two clock phases (edge used to latch the data). The CKPOL bit (SPI0CFG.6) selects between an active-high or active-low clock. Both master and slave devices must be configured to use the same clock phase and polarity. Note: the SPI should be disabled (by clearing the SPIEN bit, SPI0CN.0) while changing the clock phase and polarity. N ew Figure 17.4. Data/Clock Timing Diagram D The SPI Clock Rate Register (SPI0CKR) as shown in Figure 17.7 controls the master mode serial clock frequency. This register is ignored when operating in slave mode. SCK (CKPOL = 0, CKPHA = 0) fo r SCK (CKPOL = 0, CKPHA = 1) m en de d SCK (CKPOL = 1, CKPHA = 0) SCK (CKPOL = 1, CKPHA = 1) MISO/MOSI Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB N ot R ec om NSS MSB Rev. 1.7 126 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 17.4. SPI Special Function Registers Figure 17.5. SPI0CFG: SPI Configuration Register R/W R/W R R R R/W R/W CKPHA CKPOL BC2 BC1 BC0 SPIFRS2 SPIFRS1 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 es ig ns The SPI is accessed and controlled through four special function registers in the system controller: SPI0CN Control Register, SPI0DAT Data Register, SPI0CFG Configuration Register, and SPI0CKR Clock Rate Register. The four special function registers related to the operation of the SPI Bus are described in the following section. R/W Reset Value SPIFRS0 00000111 Bit0 SFR Address: CKPHA: SPI Clock Phase. This bit controls the SPI clock phase. 0: Data sampled on first edge of SCK period. 1: Data sampled on second edge of SCK period. Bit6: CKPOL: SPI Clock Polarity. This bit controls the SPI clock polarity. 0: SCK line low in idle state. 1: SCK line high in idle state. N ew Bit7: D 0x9A BC2-BC0 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Bit Transmitted Bit 0 (LSB) Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 (MSB) m en de d 0 0 0 0 1 1 1 1 fo r Bits5-3: BC2-BC0: SPI Bit Count. Indicates which of the up to 8 bits of the SPI word have been transmitted. om Bits2-0: SPIFRS2-SPIFRS0: SPI Frame Size. These three bits determine the number of bits to shift in/out of the SPI shift register during a data transfer in master mode. They are ignored in slave mode. N ot R ec 0 0 0 0 1 1 1 1 SPIFRS 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Bits Shifted 1 2 3 4 5 6 7 8 . 127 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 17.6. SPI0CN: SPI Control Register R/W R/W R/W R R R/W R/W WCOL MODF RXOVRN TXBSY SLVSEL MSTEN SPIEN 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: (bit addressable) 0xF8 SPIF: SPI Interrupt Flag. This bit is set to logic 1 by hardware at the end of a data transfer. If interrupts are enabled, setting this bit causes the CPU to vector to the SPI0 interrupt service routine. This bit is not automatically cleared by hardware. It must be cleared by software. Bit6: WCOL: Write Collision Flag. This bit is set to logic 1 by hardware (and generates a SPI interrupt) to indicate a write to the SPI data register was attempted while a data transfer was in progress. It is cleared by software. Bit5: MODF: Mode Fault Flag. This bit is set to logic 1 by hardware (and generates a SPI interrupt) when a master mode collision is detected (NSS is low and MSTEN = 1). This bit is not automatically cleared by hardware. It must be cleared by software. Bit4: RXOVRN: Receive Overrun Flag. This bit is set to logic 1 by hardware (and generates a SPI interrupt) when the receive buffer still holds unread data from a previous transfer and the last bit of the current transfer is shifted into the SPI shift register. This bit is not automatically cleared by hardware. It must be cleared by software. Bit3: TXBSY: Transmit Busy Flag. This bit is set to logic 1 by hardware while a master mode transfer is in progress. It is cleared by hardware at the end of the transfer. Bit2: SLVSEL: Slave Selected Flag. This bit is set to logic 1 whenever the NSS pin is low indicating it is enabled as a slave. It is cleared to logic 0 when NSS is high (slave disabled). Bit1: MSTEN: Master Mode Enable. 0: Disable master mode. Operate in slave mode. 1: Enable master mode. Operate as a master. om m en de d fo r N ew D Bit7: SPIEN: SPI Enable. This bit enables/disables the SPI. 0: SPI disabled. 1: SPI enabled. N ot R ec Bit0: Reset Value es ig ns R/W SPIF Rev. 1.7 128 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 17.7. SPI0CKR: SPI Clock Rate Register R/W R/W R/W R/W R/W R/W R/W SCR6 SCR5 SCR4 SCR3 SCR2 SCR1 SCR0 Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W SCR7 0x9D for 0  SPI0CKR  255, N ew fSCK = 0.5 * fSYSCLK / (SPI0CKR + 1), D Bits7-0: SCR7-SCR0: SPI Clock Rate These bits determine the frequency of the SCK output when the SPI module is configured for master mode operation. The SCK clock frequency is a divided down version of the system clock, and is given in the following equations: R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 fo r Figure 17.8. SPI0DAT: SPI Data Register R/W R/W R/W R/W Reset Value Bit3 Bit2 Bit1 Bit0 SFR Address: 00000000 m en de d 0x9B N ot R ec om Bits7-0: SPI0DAT: SPI0 Transmit and Receive Data. The SPI0DAT register is used to transmit and receive SPI data. Writing data to SPI0DAT places the data immediately into the shift register and initiates a transfer when in Master Mode. A read of SPI0DAT returns the contents of the receive buffer. 129 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 18. UART es ig ns The UART is a serial port capable of asynchronous transmission. The UART can function in full duplex mode. In all modes, receive data is buffered in a holding register. This allows the UART to start reception of a second incoming data byte before software has finished reading the previous data byte. The UART has an associated Serial Control Register (SCON) and a Serial Data Buffer (SBUF) in the SFRs. The single SBUF location provides access to both transmit and receive registers. Reads access the Receive register and writes access the Transmit register automatically. N ew D The UART is capable of generating interrupts if enabled. The UART has two sources of interrupts: a Transmit Interrupt flag, TI (SCON.1) set when transmission of a data byte is complete, and a Receive Interrupt flag, RI (SCON.0) set when reception of a data byte is complete. The UART interrupt flags are not cleared by hardware when the CPU vectors to the interrupt service routine. They must be cleared manually by software. This allows software to determine the cause of the UART interrupt (transmit complete or receive complete). Figure 18.1. UART Block Diagram SFR Bus PCON SCON S M O D Write to SBUF T2CON S S S R T R T R M M M E B B I I 0 1 2 N 8 8 R C L K TB8 T C L K SET SBUF Q fo r D TX CLR Crossbar Zero Detector Baud Rate Generation Logic 1 2 0 0 16 01 10 Tx Clock 11 TCLK SM0, SM1 {MODE} 0 16 Timer 2 Overflow 1 01 10 Rx Clock 11 RCLK SYSCLK 32 1 64 0 Send Tx IRQ TI Serial Port Interrupt 00 Data Tx Control 00 1 SMOD Shift Stop Bit Gen. m en de d Start Timer 1 Overflow REN RB8 Enable MSB RI Rx IRQ Load SBUF Rx Control Start Shift 0x1FF Port I/O Bit Detector SMOD Input Shift Register (9 bits) om 12 Shift Load SBUF SBUF ec Read SBUF R SFR Bus Crossbar N ot RX Rev. 1.7 130 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 18.1. UART Operational Modes es ig ns The UART provides four operating modes (one synchronous and three asynchronous) selected by setting configuration bits in the SCON register. These four modes offer different baud rates and communication protocols. The four modes are summarized in Table 18.1 below. Detailed descriptions follow. Table 18.1. UART Modes Synchronization Synchronous Asynchronous Asynchronous Asynchronous Baud Clock SYSCLK/12 Timer 1 or Timer 2 Overflow SYSCLK/32 or SYSCLK/64 Timer 1 or Timer 2 Overflow Data Bits 8 8 9 9 Start/Stop Bits None 1 Start, 1 Stop 1 Start, 1 Stop 1 Start, 1 Stop D Mode 0 1 2 3 18.1.1. Mode 0: Synchronous Mode N ew Mode 0 provides synchronous, half-duplex communication. Serial data is transmitted and received on the RX pin. The TX pin provides the shift clock for both transmit and receive. The MCU must be the master since it generates the shift clock for transmission in both directions (see the interconnect diagram in Figure 18.2). fo r Eight data bits are transmitted/received, LSB first (see the timing diagram in Figure 18.3). Data transmission begins when an instruction writes a data byte to the SBUF register. The TI Transmit Interrupt Flag (SCON.1) is set at the end of the eighth bit time. Data reception begins when the REN Receive Enable bit (SCON.4) is set to logic 1 and the RI Receive Interrupt Flag (SCON.0) is cleared. One cycle after the eighth bit is shifted in, the RI flag is set and reception stops until software clears the RI bit. An interrupt will occur if enabled when either TI or RI is set. m en de d The Mode 0 baud rate is the system clock frequency divided by twelve. RX is forced to open-drain in mode 0, and an external pull-up will typically be required. Figure 18.2. UART Mode 0 Interconnect TX CLK RX DATA Shift Reg. om C8051Fxxx 8 Extra Outputs ec Figure 18.3. UART Mode 0 Timing Diagram N ot R RX (data out) MODE 0 TRANSMIT D0 D1 D2 D3 D5 D6 D7 TX (clk out) MODE 0 RECEIVE RX (data in) D0 D1 D2 TX 1: (clk out)UART, Variable Baud Rate 18.1.2. Mode 8-Bit 131 D4 Rev. 1.7 D3 D4 D5 D6 D7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 es ig ns Mode 1 provides standard asynchronous, full duplex communication using a total of 10 bits per data byte: one start bit, eight data bits (LSB first), and one stop bit (see the timing diagram in Figure 18.4). Data are transmitted from the TX pin and received at the RX pin (see the interconnection diagram in Figure 18.5). On receive, the eight data bits are stored in SBUF and the stop bit goes into RB8 (SCON.2). Data transmission begins when an instruction writes a data byte to the SBUF register. The TI Transmit Interrupt Flag (SCON.1) is set at the end of the transmission (the beginning of the stop-bit time). Data reception can begin any time after the REN Receive Enable bit (SCON.4) is set to logic 1. After the stop bit is received, the data byte will be loaded into the SBUF receive register if the following conditions are met: RI must be logic 0, and if SM2 is logic 1, the stop bit must be logic 1. MARK SPACE START BIT D0 D1 D2 D3 BIT TIMES D4 D5 D6 D7 STOP BIT fo r BIT SAMPLING N ew Figure 18.4. UART Mode 1 Timing Diagram D If these conditions are met, the eight bits of data are stored in SBUF, the stop bit is stored in RB8, and the RI flag is set. If these conditions are not met, SBUF and RB8 will not be loaded and the RI flag will not be set. An interrupt will occur if enabled when either TI or RI is set. m en de d The baud rate generated in Mode 1 is a function of timer overflow. The UART can use Timer 1 operating in 8-bit Counter/Timer with Auto-Reload Mode, or Timer 2 operating in Baud Rate Generator Mode to generate the baud rate (note that the TX and RX clock sources are selected separately). On each timer overflow event (a rollover from all ones (0xFF for Timer 1, 0xFFFF for Timer 2) to zero), a clock is sent to the baud rate logic. When Timer 1 is selected as a baud rate source, the SMOD bit (PCON.7) selects whether or not to divide the Timer 1 overflow rate by two. On reset, the SMOD bit is logic 0, thus selecting the lower speed baud rate by default. The SMOD bit affects the baud rate generated by Timer 1 as follows: Mode 1 Baud Rate = (1 / 32) * T1_OVERFLOWRATE (when the SMOD bit is set to logic 0). Mode 1 Baud Rate = (1 / 16) * T1_OVERFLOWRATE (when the SMOD bit is set to logic 1). om When Timer 2 is selected as a baud rate source, the baud rate generated by Timer 2 is as follows: Mode 1 Baud Rate = (1 / 16) * T2_OVERFLOWRATE. R ec The Timer 1 overflow rate is determined by the Timer 1 clock source (T1CLK) and reload value (TH1). The frequency of T1CLK can be selected as SYSCLK, SYSCLK/12, or an external clock source. The Timer 1 overflow rate can be calculated as follows: T1_OVERFLOWRATE = T1CLK / (256 – TH1). N ot For example, assume TMOD = 0x20. If T1M (CKCON.4) is logic 1, then the above equation becomes: T1_OVERFLOWRATE = (SYSCLK) / (256 – TH1). If T1M (CKCON.4) is logic 0, then the above equation becomes: T1_OVERFLOWRATE = (SYSCLK/12) / (256 – TH1). Rev. 1.7 132 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 The Timer 2 overflow rate, when in Baud Rate Generator Mode and using an internal clock source, is determined solely by the Timer 2 16-bit reload value (RCAP2H:RCAP2L). The Timer 2 clock source is fixed at SYSCLK/2. The Timer 2 overflow rate can be calculated as follows: es ig ns T2_OVERFLOWRATE = (SYSCLK/2) / (65536 – [RCAP2H:RCAP2L]). Timer 2 can be selected as the baud rate generator for RX and/or TX by setting RCLK (T2CON.5) and/or TCLK (T2CON.4), respectively. When either RCLK or TCLK is set to logic 1, Timer 2 interrupts are automatically disabled and the timer is forced into Baud Rate Generator Mode with SYSCLK/2 as its clock source. If a different timebase is required, setting the C/T2 bit (T2CON.1) to logic 1 will allow Timer 2 to be clocked from the external input pin T2. See the Timers section for complete timer configuration details. D Figure 18.5. UART Modes 1, 2, and 3 Interconnect Diagram TX RX TX MCU TX C8051Fxxx RX N ot R ec om m en de d RX 133 C8051Fxxx fo r OR N ew RS-232 LEVEL XLTR RS-232 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 18.1.3. Mode 2: 9-Bit UART, Fixed Baud Rate es ig ns Mode 2 provides asynchronous, full-duplex communication using a total of eleven bits per data byte: a start bit, 8 data bits (LSB first), a programmable ninth data bit, and a stop bit (see timing diagram in Figure 18.6). On transmit, the ninth data bit is determined by the value in TB8 (SCON.3). It can be assigned the value of the parity flag P in the PSW or used in multiprocessor communications. On receive, the ninth data bit goes into RB8 (SCON.2) and the stop bit is ignored. Data transmission begins when an instruction writes a data byte to the SBUF register. The TI Transmit Interrupt Flag (SCON.1) is set at the end of the transmission (the beginning of the stop-bit time). Data reception can begin any time after the REN Receive Enable bit (SCON.4) is set to logic 1. After the stop bit is received, the data byte will be loaded into the SBUF receive register if the following conditions are met: RI must be logic 0, and if SM2 is logic 1, the 9th bit must be logic 1. N ew D If these conditions are met, the eight bits of data are stored in SBUF, the ninth bit is stored in RB8 and the RI flag is set. If these conditions are not met, SBUF and RB8 will not be loaded and the RI flag will not be set. An interrupt will occur if enabled when either TI or RI are set. The baud rate in Mode 2 is a direct function of the system clock frequency as follows: Mode 2 Baud Rate = 2SMOD * (SYSCLK / 64). fo r The SMOD bit (PCON.7) selects whether to divide SYSCLK by 32 or 64. In the formula, 2 is raised to the power SMOD, resulting in a baud rate of either 1/32 or 1/64 of the system clock frequency. On reset, the SMOD bit is logic 0, thus selecting the lower speed baud rate by default. MARK START BIT SPACE BIT TIMES BIT SAMPLING m en de d Figure 18.6. UART Modes 2 and 3 Timing Diagram D0 D1 D2 D3 D4 D5 D6 D7 D8 STOP BIT 18.1.4. Mode 3: 9-Bit UART, Variable Baud Rate N ot R ec om Mode 3 is the same as Mode 2 in all respects except the baud rate is variable. The baud rate is determined in the same manner as for Mode 1. Mode 3 operation transmits 11 bits: a start bit, 8 data bits (LSB first), a programmable ninth data bit, and a stop bit. Timer 1 or Timer 2 overflows generate the baud rate just as with Mode 1. In summary, Mode 3 transmits using the same protocol as Mode 2 but with Mode 1 baud rate generation. Rev. 1.7 134 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 18.2. Multiprocessor Communications es ig ns Modes 2 and 3 support multiprocessor communication between a master processor and one or more slave processors by special use of the ninth data bit. When a master processor wants to transmit to one or more slaves, it first sends an address byte to select the target(s). An address byte differs from a data byte in that its ninth bit is logic 1; in a data byte, the ninth bit is always set to logic 0. D Setting the SM2 bit (SCON.5) of a slave processor configures its UART such that when a stop bit is received, the UART will generate an interrupt only if the ninth bit is logic one (RB8 = 1) signifying an address byte has been received. In the UART’s interrupt handler, software will compare the received address with the slave’s own assigned 8-bit address. If the addresses match, the slave will clear its SM2 bit to enable interrupts on the reception of the following data byte(s). Slaves that weren’t addressed leave their SM2 bits set and do not generate interrupts on the reception of the following data bytes, thereby ignoring the data. Once the entire message is received, the addressed slave resets its SM2 bit to ignore all transmissions until it receives the next address byte. N ew Multiple addresses can be assigned to a single slave and/or a single address can be assigned to multiple slaves, thereby enabling “broadcast” transmissions to more than one slave simultaneously. The master processor can be configured to receive all transmissions or a protocol can be implemented such that the master/slave role is temporarily reversed to enable half-duplex transmission between the original master and slave(s). TX Slave Device RX TX RX N ot R ec om RX Slave Device m en de d Master Device fo r Figure 18.7. UART Multi-Processor Mode Interconnect Diagram 135 Rev. 1.7 Slave Device VDD TX RX TX C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Table 18.2. Oscillator Frequencies for Standard Baud Rates D es ig ns Resulting Baud Rate** 115200 (115384) 115200 (113423) 115200 115200 115200 115200 115200 115200 115200 115200 115200 115200 115200 76800 57600 (57870) 28800 28800 (28921) 28800 (28846) 28800 (28911) 28800 28800 28800 28800 28800 28800 28800 28800 28800 28800 28800 N ew Timer 1 Load Value* 0xF3 0xF3 0xF4 0xF6 0xF7 0xF8 0xF9 0xFA 0xFB 0xFC 0xFD 0xFE 0xFF 0xEC 0xE5 0xCA 0xCB 0xCC 0xCD 0xD0 0xD8 0xDC 0xE0 0xE4 0xE8 0xEC 0xF0 0xF4 0xF8 0xFC fo r Divide Factor 208 205 192 160 144 128 112 96 80 64 48 32 16 320 434 868 848 833 819 768 640 576 512 448 384 320 256 192 128 64 m en de d Oscillator Frequency (MHz) 24.0 23.592 22.1184 18.432 16.5888 14.7456 12.9024 11.0592 9.216 7.3728 5.5296 3.6864 1.8432 24.576 25.0 25.0 24.576 24.0 23.592 22.1184 18.432 16.5888 14.7456 12.9024 11.0592 9.216 7.3728 5.5296 3.6864 1.8432 om * Assumes SMOD=1 and T1M=1. ** Numbers in parenthesis show the actual baud rate. Figure 18.8. SBUF: Serial (UART) Data Buffer Register R/W R/W R/W R/W R/W R/W R/W Reset Value Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: ec R/W 00000000 0x99 R Bit7 N ot Bits7-0: SBUF.[7:0]: Serial Data Buffer Bits 7-0 (MSB-LSB) This is actually two registers; a transmit and a receive buffer register. When data is moved to SBUF, it goes to the transmit buffer and is held for serial transmission. Moving a byte to SBUF is what initiates the transmission. When data is moved from SBUF, it comes from the receive buffer. Rev. 1.7 136 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 18.9. SCON: Serial Port Control Register R/W R/W R/W R/W R/W R/W R/W SM1 SM2 REN TB8 RB8 TI RI 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: D (bit addressable) Bits7-6: SM0-SM1: Serial Port Operation Mode. These bits select the Serial Port Operation Mode. SM0 SM1 Mode 0 0 Mode 0: Synchronous Mode 0 1 Mode 1: 8-Bit UART, Variable Baud Rate 1 0 Mode 2: 9-Bit UART, Fixed Baud Rate 1 1 Mode 3: 9-Bit UART, Variable Baud Rate SM2: Multiprocessor Communication Enable. The function of this bit is dependent on the Serial Port Operation Mode. Mode 0: No effect Mode 1: Checks for valid stop bit. 0: Logic level of stop bit is ignored. 1: RI will only be activated if stop bit is logic level 1. Mode 2 and 3: Multiprocessor Communications Enable. 0: Logic level of ninth bit is ignored. 1: RI is set and an interrupt is generated only when the ninth bit is logic 1. Bit4: REN: Receive Enable. This bit enables/disables the UART receiver. 0: UART reception disabled. 1: UART reception enabled. Bit3: TB8: Ninth Transmission Bit. The logic level of this bit will be assigned to the ninth transmission bit in Modes 2 and 3. It is not used in Modes 0 and 1. Set or cleared by software as required. Bit2: RB8: Ninth Receive Bit. The bit is assigned the logic level of the ninth bit received in Modes 2 and 3. In Mode 1, if SM2 is logic 0, RB8 is assigned the logic level of the received stop bit. RB8 is not used in Mode 0. om m en de d fo r N ew Bit5: TI: Transmit Interrupt Flag. Set by hardware when a byte of data has been transmitted by the UART (after the 8th bit in Mode 0, or at the beginning of the stop bit in other modes). When the UART interrupt is enabled, setting this bit causes the CPU to vector to the UART interrupt service routine. This bit must be cleared manually by software R ec Bit1: N ot Bit0: 137 RI: Receive Interrupt Flag. Set by hardware when a byte of data has been received by the UART (after the 8th bit in Mode 0, or after the stop bit in other modes – see SM2 bit for exception). When the UART interrupt is enabled, setting this bit causes the CPU to vector to the UART interrupt service routine. This bit must be cleared manually by software. Rev. 1.7 Reset Value es ig ns R/W SM0 0x98 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 19. TIMERS Timer 2: 16-bit counter/timer with auto-reload 16-bit counter/timer with capture Baud rate generator Timer 3: 16-bit timer with auto-reload D Timer 0 and Timer 1: 13-bit counter/timer 16-bit counter/timer 8-bit counter/timer with auto-reload Two 8-bit counter/timers (Timer 0 only) es ig ns Each MCU implements four counter/timers: three are 16-bit counter/timers compatible with those found in the standard 8051, and one is a 16-bit timer for use with the ADC, SMBus, or for general purpose use. These can be used to measure time intervals, count external events and generate periodic interrupt requests. Timer 0 and Timer 1 are nearly identical and have four primary modes of operation. Timer 2 offers additional capabilities not available in Timers 0 and 1. Timer 3 is similar to Timer 2, but without the capture or Baud Rate Generator modes. N ew When functioning as a timer, the counter/timer registers are incremented on each clock tick. Clock ticks are derived from the system clock divided by either one or twelve as specified by the Timer Clock Select bits (T2M-T0M) in CKCON. The twelve-clocks-per-tick option provides compatibility with the older generation of the 8051 family. Applications that require a faster timer can use the one-clock-per-tick option. 19.1. Timer 0 and Timer 1 fo r When functioning as a counter, a counter/timer register is incremented on each high-to-low transition at the selected input pin for T0, T1, or T2. Events with a frequency of up to one-fourth the system clock’s frequency can be counted. The input signal need not be periodic, but it should be held at a given level for at least two full system clock cycles to ensure the level is sampled. m en de d Timer 0 and Timer 1 are accessed and controlled through SFRs. Each counter/timer is implemented as a 16-bit register accessed as two separate bytes: a low byte (TL0 or TL1) and a high byte (TH0 or TH1). The Counter/Timer Control (TCON) register is used to enable Timer 0 and Timer 1 as well as indicate their status. Both counter/timers operate in one of four primary modes selected by setting the Mode Select bits M1-M0 in the Counter/Timer Mode (TMOD) register. Each timer can be configured independently. Following is a detailed description of each operating mode. 19.1.1. Mode 0: 13-bit Counter/Timer om Timer 0 and Timer 1 operate as a 13-bit counter/timer in Mode 0. The following describes the configuration and operation of Timer 0. However, both timers operate identically and Timer 1 is configured in the same manner as described for Timer 0. ec The TH0 register holds the eight MSBs of the 13-bit counter/timer. TL0 holds the five LSBs in bit positions TL0.4TL0.0. The three upper bits of TL0 (TL0.7-TL0.5) are indeterminate and should be masked out or ignored when reading. As the 13-bit timer register increments and overflows from 0x1FFF (all ones) to 0x0000, the timer overflow flag TF0 (TCON.5) is set and an interrupt will occur if enabled. N ot R The C/T0 bit (TMOD.2) selects the counter/timer’s clock source. Clearing C/T selects the system clock as the input for the timer. When C/T0 is set to logic 1, high-to-low transitions at the selected input pin increment the timer register. (Refer to Port I/O Section 15.1 for information on selecting and configuring external I/O pins.) Rev. 1.7 138 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 TR0 GATE0 0 X 1 0 1 1 1 1 X = Don’t Care /INT0 X X 0 1 Counter/Timer Disabled Enabled Disabled Enabled es ig ns Setting the TR0 bit (TCON.4) enables the timer when either GATE0 (TMOD.3) is 0 or the input signal /INT0 is logic-level one. Setting GATE0 to logic 1 allows the timer to be controlled by the external input signal /INT0, facilitating pulse width measurements. D Setting TR0 does not reset the timer register. The timer register should be initialized to the desired value before enabling the timer. N ew TL1 and TH1 form the 13-bit register for Timer 1 in the same manner as described above for TL0 and TH0. Timer 1 is configured and controlled using the relevant TCON and TMOD bits just as with Timer 0. Figure 19.1. T0 Mode 0 Block Diagram TMOD TTT 2 1 0 MMM 0 T0 Crossbar TR0 GATE0 /INT0 0 T T 1 1 MM 1 0 G A T E 0 C / T 0 T T 0 0 MM 1 0 m en de d 1 C / T 1 1 TCLK TL0 (5 bits) TH0 (8 bits) TCON 12 SYSCLK G A T E 1 fo r CKCON TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 Interrupt Crossbar om 19.1.2. Mode 1: 16-bit Counter/Timer N ot R ec Mode 1 operation is the same as Mode 0, except that the counter/timer registers use all 16 bits. The counter/timers are enabled and configured in Mode 1 in the same manner as for Mode 0. 139 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 19.1.3. Mode 2: 8-bit Counter/Timer with Auto-Reload Figure 19.2. T0 Mode 2 Block Diagram CKCON C / T 1 T T 1 1 MM 1 0 G A T E 0 C / T 0 T T 0 0 MM 1 0 D 12 TMOD G A T E 1 TTT 2 1 0 MMM 0 Crossbar 1 TCLK GATE0 TH0 (8 bits) TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 Interrupt Reload N ot R ec om m en de d Crossbar fo r TR0 /INT0 TL0 (8 bits) TCON T0 0 N ew SYSCLK 1 es ig ns Mode 2 configures Timer 0 and Timer 1 to operate as 8-bit counter/timers with automatic reload of the start value. The TL0 holds the count and TH0 holds the reload value. When the count in TL0 overflows from all ones to 0x00, the timer overflow flag TF0 (TCON.5) is set and the counter in TL0 is reloaded from TH0. If enabled, an interrupt will occur when the TF0 flag is set. The reload value in TH0 is not changed. TL0 must be initialized to the desired value before enabling the timer for the first count to be correct. When in Mode 2, Timer 1 operates identically to Timer 0. Both counter/timers are enabled and configured in Mode 2 in the same manner as Mode 0. Rev. 1.7 140 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 19.1.4. Mode 3: Two 8-bit Counter/Timers (Timer 0 Only) es ig ns Timer 0 and Timer 1 behave differently in Mode 3. Timer 0 is configured as two separate 8-bit counter/timers held in TL0 and TH0. The counter/timer in TL0 is controlled using the Timer 0 control/status bits in TCON and TMOD: TR0, C/T0, GATE0 and TF0. It can use either the system clock or an external input signal as its timebase. The TH0 register is restricted to a timer function sourced by the system clock. TH0 is enabled using the Timer 1 run control bit TR1. TH0 sets the Timer 1 overflow flag TF1 on overflow and thus controls the Timer 1 interrupt. Figure 19.3. T0 Mode 3 Block Diagram CKCON T T 1 1 MM 1 0 G A T E 0 C / T 0 T T 0 0 MM 1 0 TR1 TH0 (8 bits) SYSCLK 1 1 Crossbar C/T0 m en de d T0 0 fo r 0 TR0 GATE0 Crossbar N ot R ec om /INT0 141 Rev. 1.7 TL0 (8 bits) TCON 12 N ew TMOD C / T 1 G A T E 1 TTT 2 1 0 MMM D Timer 1 is inactive in Mode 3, so with Timer 0 in Mode 3, Timer 1 can be turned off and on by switching it into and out of its Mode 3. When Timer 0 is in Mode 3, Timer 1 can be operated in Modes 0, 1 or 2, but cannot be clocked by external signals nor set the TF1 flag and generate an interrupt. However, the Timer 1 overflow can be used for baud rate generation. Refer to Section 18 (UART) for information on configuring Timer 1 for baud rate generation. TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 Interrupt Interrupt C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 19.4. TCON: Timer Control Register R/W R/W R/W R/W R/W R/W R/W TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: (bit addressable) 0x88 TF1: Timer 1 Overflow Flag. Set by hardware when Timer 1 overflows. This flag can be cleared by software but is automatically cleared when the CPU vectors to the Timer 1 interrupt service routine. 0: No Timer 1 overflow detected. 1: Timer 1 has overflowed. Bit6: TR1: Timer 1 Run Control. 0: Timer 1 disabled. 1: Timer 1 enabled. Bit5: TF0: Timer 0 Overflow Flag. Set by hardware when Timer 0 overflows. This flag can be cleared by software but is automatically cleared when the CPU vectors to the Timer 0 interrupt service routine. 0: No Timer 0 overflow detected. 1: Timer 0 has overflowed. Bit4: TR0: Timer 0 Run Control. 0: Timer 0 disabled. 1: Timer 0 enabled. Bit3: IE1: External Interrupt 1. This flag is set by hardware when an edge/level of type defined by IT1 is detected. It can be cleared by software but is automatically cleared when the CPU vectors to the External Interrupt 1 service routine if IT1 = 1. This flag is the inverse of the /INT1 input signal’s logic level when IT1 = 0. Bit2: IT1: Interrupt 1 Type Select. This bit selects whether the configured /INT1 signal will detect falling edge or active-low level-sensitive interrupts. 0: /INT1 is level triggered. 1: /INT1 is edge triggered. om m en de d fo r N ew D Bit7: IE0: External Interrupt 0. This flag is set by hardware when an edge/level of type defined by IT0 is detected. It can be cleared by software but is automatically cleared when the CPU vectors to the External Interrupt 0 service routine if IT0 = 1. This flag is the inverse of the /INT0 input signal’s logic level when IT0 = 0. R ec Bit1: Reset Value es ig ns R/W N ot Bit0: IT0: Interrupt 0 Type Select. This bit selects whether the configured /INT0 signal will detect falling edge or active-low level-sensitive interrupts. 0: /INT0 is level triggered. 1: /INT0 is edge triggered. Rev. 1.7 142 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 19.5. TMOD: Timer Mode Register R/W R/W R/W R/W R/W R/W R/W C/T1 T1M1 T1M0 GATE0 C/T0 T0M1 T0M0 Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W GATE1 0x89 GATE1: Timer 1 Gate Control. 0: Timer 1 enabled when TR1 = 1 irrespective of /INT1 logic level. 1: Timer 1 enabled only when TR1 = 1 AND /INT1 = logic level one. Bit6: C/T1: Counter/Timer 1 Select. 0: Timer Function: Timer 1 incremented by clock defined by T1M bit (CKCON.4). 1: Counter Function: Timer 1 incremented by high-to-low transitions on external input pin (T1). Bits5-4: T1M1-T1M0: Timer 1 Mode Select. These bits select the Timer 1 operation mode. T1M0 0 1 0 1 Mode Mode 0: 13-bit counter/timer Mode 1: 16-bit counter/timer Mode 2: 8-bit counter/timer with auto-reload Mode 3: Timer 1 Inactive/stopped fo r T1M1 0 0 1 1 N ew D Bit7: GATE0: Timer 0 Gate Control. 0: Timer 0 enabled when TR0 = 1 irrespective of /INT0 logic level. 1: Timer 0 enabled only when TR0 = 1 AND /INT0 = logic level one. Bit2: C/T0: Counter/Timer Select. 0: Timer Function: Timer 0 incremented by clock defined by T0M bit (CKCON.3). 1: Counter Function: Timer 0 incremented by high-to-low transitions on external input pin (T0). m en de d Bit3: om Bits1-0: T0M1-T0M0: Timer 0 Mode Select. These bits select the Timer 0 operation mode. T0M0 0 1 0 1 Mode Mode 0: 13-bit counter/timer Mode 1: 16-bit counter/timer Mode 2: 8-bit counter/timer with auto-reload Mode 3: Two 8-bit counter/timers N ot R ec T0M1 0 0 1 1 143 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 19.6. CKCON: Clock Control Register R/W R/W R/W R/W R/W R/W R/W - - T2M T1M T0M Reserved Reserved Reserved Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W 0x8E Bits7-6: UNUSED. Read = 00b, Write = don’t care. T2M: Timer 2 Clock Select. This bit controls the division of the system clock supplied to Timer 2. This bit is ignored when the timer is in baud rate generator mode or counter mode (i.e. C/T2 = 1). 0: Timer 2 uses the system clock divided by 12. 1: Timer 2 uses the system clock. Bit4: T1M: Timer 1 Clock Select. This bit controls the division of the system clock supplied to Timer 1. 0: Timer 1 uses the system clock divided by 12. 1: Timer 1 uses the system clock. Bit3: T0M: Timer 0 Clock Select. This bit controls the division of the system clock supplied to Counter/Timer 0. 0: Counter/Timer uses the system clock divided by 12. 1: Counter/Timer uses the system clock. fo r N ew D Bit5: N ot R ec om m en de d Bits2-0: Reserved. Read = 000b, Must Write = 000. Rev. 1.7 144 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 19.7. TL0: Timer 0 Low Byte R/W R/W R/W R/W R/W R/W R/W R/W Reset Value Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns 00000000 Bits 7-0: TL0: Timer 0 Low Byte. The TL0 register is the low byte of the 16-bit Timer 0. Figure 19.8. TL1: Timer 1 Low Byte R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 R/W Bit2 Bit1 R/W Reset Value Bit0 SFR Address: 00000000 0x8B fo r Bits 7-0: TL1: Timer 1 Low Byte. The TL1 register is the low byte of the 16-bit Timer 1. R/W N ew R/W D 0x8A Figure 19.9. TH0: Timer 0 High Byte R/W Bit7 Bit6 R/W R/W R/W R/W R/W R/W Reset Value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: m en de d R/W 00000000 0x8C R/W Figure 19.10. TH1: Timer 1 High Byte R/W R/W R/W R/W R/W R/W R/W Reset Value Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: ec Bit7 om Bits 7-0: TH0: Timer 0 High Byte. The TH0 register is the high byte of the 16-bit Timer 0. 00000000 0x8D N ot R Bits 7-0: TH1: Timer 1 High Byte. The TH1 register is the high byte of the 16-bit Timer 1. 145 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 19.2. Timer 2 es ig ns Timer 2 is a 16-bit counter/timer formed by the two 8-bit SFRs: TL2 (low byte) and TH2 (high byte). As with Timers 0 and 1, Timer 2 can use either the system clock or transitions on an external input pin as its clock source. The Counter/Timer Select bit C/T2 bit (T2CON.1) selects the clock source for Timer 2. Clearing C/T2 selects the system clock as the input for the timer (divided by either one or twelve as specified by the Timer Clock Select bit T2M in CKCON). When C/T2 is set to 1, high-to-low transitions at the T2 input pin increment the counter/timer register. (Refer to Section 14 for information on selecting and configuring external I/O pins.) Timer 2 can also be used to start an ADC Data Conversion. D Timer 2 offers capabilities not found in Timer 0 and Timer 1. It operates in one of three modes: 16-bit Counter/Timer with Capture, 16-bit Counter/Timer with Auto-Reload or Baud Rate Generator Mode. Timer 2’s operating mode is selected by setting configuration bits in the Timer 2 Control (T2CON) register. Below is a summary of the Timer 2 operating modes and the T2CON bits used to configure the counter/timer. Detailed descriptions of each mode follow. CP/RL2 1 0 X X X X TR2 1 1 1 1 1 0 Mode 16-bit Counter/Timer with Capture 16-bit Counter/Timer with Auto-Reload Baud Rate Generator for TX Baud Rate Generator for RX Baud Rate Generator for TX and RX Off N ew TCLK 0 0 1 0 1 X N ot R ec om m en de d fo r RCLK 0 0 0 1 1 X Rev. 1.7 146 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 19.2.1. Mode 0: 16-bit Counter/Timer with Capture es ig ns In this mode, Timer 2 operates as a 16-bit counter/timer with capture facility. A high-to-low transition on the T2EX input pin causes the 16-bit value in Timer 2 (TH2, TL2) to be loaded into the capture registers (RCAP2H, RCAP2L). Timer 2 can use either SYSCLK, SYSCLK divided by 12, or high-to-low transitions on the external T2 pin as its clock source when operating in Counter/Timer with Capture mode. Clearing the C/T2 bit (T2CON.1) selects the system clock as the input for the timer (divided by one or twelve as specified by the Timer Clock Select bit T2M in CKCON). When C/T2 is set to logic 1, a high-to-low transition at the T2 input pin increments the counter/timer register. As the 16-bit counter/timer register increments and overflows from 0xFFFF to 0x0000, the TF2 timer overflow flag (T2CON.7) is set and an interrupt will occur if the interrupt is enabled. D Counter/Timer with Capture mode is selected by setting the Capture/Reload Select bit CP/RL2 (T2CON.0) and the Timer 2 Run Control bit TR2 (T2CON.2) to logic 1. The Timer 2 External Enable EXEN2 (T2CON.3) must also be set to logic 1 to enable a capture. If EXEN2 is cleared, transitions on T2EX will be ignored. N ew Figure 19.11. T2 Mode 0 Block Diagram CKCON TTT 2 1 0 MMM 12 1 T2 Crossbar 0 1 fo r 0 SYSCLK TL2 m en de d TCLK TH2 EXEN2 Crossbar N ot R ec om T2EX Capture 147 Rev. 1.7 RCAP2L T2CON TR2 RCAP2H CP/RL2 C/T2 TR2 EXEN2 TCLK RCLK EXF2 TF2 Interrupt C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 19.2.2. Mode 1: 16-bit Counter/Timer with Auto-Reload es ig ns The Counter/Timer with Auto-Reload mode sets the TF2 timer overflow flag when the counter/timer register overflows from 0xFFFF to 0x0000. An interrupt is generated if enabled. On overflow, the 16-bit value held in the two capture registers (RCAP2H, RCAP2L) is automatically loaded into the counter/timer register and the timer is restarted. Counter/Timer with Auto-Reload mode is selected by clearing the CP/RL2 bit. Setting TR2 to logic 1 enables and starts the timer. Timer 2 can use either the system clock or transitions on an external input pin as its clock source, as specified by the C/T2 bit. If EXEN2 is set to logic 1, a high-to-low transition on T2EX will also cause Timer 2 to be reloaded. If EXEN2 is cleared, transitions on T2EX will be ignored. D Figure 19.12. T2 Mode 1 Block Diagram CKCON 0 SYSCLK T2 Crossbar TR2 EXEN2 0 1 TCLK Reload TH2 Crossbar RCAP2L RCAP2H CP/RL2 C/T2 TR2 EXEN2 TCLK RCLK EXF2 TF2 Interrupt N ot R ec om m en de d T2EX TL2 fo r 1 T2CON 12 N ew TTT 2 1 0 MMM Rev. 1.7 148 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 19.2.3. Mode 2: Baud Rate Generator es ig ns Timer 2 can be used as a baud rate generator for the serial port (UART) when the UART is operated in modes 1 or 3 (refer to Section 18.1 for more information on UART operational modes). In Baud Rate Generator mode, Timer 2 works similarly to the auto-reload mode. On overflow, the 16-bit value held in the two capture registers (RCAP2H, RCAP2L) is automatically loaded into the counter/timer register. However, the TF2 overflow flag is not set and no interrupt is generated. Instead, the overflow event is used as the input to the UART’s shift clock. Timer 2 overflows can be used to generate baud rates for transmit and/or receive independently. The Baud Rate Generator mode is selected by setting RCLK (T2CON.5) and/or TCLK (T2CON.4) to logic one. When RCLK or TCLK is set to logic 1, Timer 2 operates in the auto-reload mode regardless of the state of the CP/RL2 bit. The baud rate for the UART, when operating in mode 1 or 3, is determined by the Timer 2 overflow rate: D Baud Rate = Timer 2 Overflow Rate / 16. N ew Note, in all other modes, the timebase for the timer is the system clock divided by one or twelve as selected by the T2M bit in CKCON. However, in Baud Rate Generator mode, the timebase is the system clock divided by two. No other divisor selection is possible. If a different time base is required, setting the C/T2 bit to logic 1 will allow the timebase to be derived from the external input pin T2. In this case, the baud rate for the UART is calculated as: Baud Rate = FCLK / [32 * (65536 – [RCAP2H:RCAP2L]) ] fo r Where FCLK is the frequency of the signal supplied to T2 and [RCAP2H:RCAP2L] is the 16-bit value held in the capture registers. m en de d As explained above, in Baud Rate Generator mode, Timer 2 does not set the TF2 overflow flag and therefore cannot generate an interrupt. However, if EXEN2 is set to logic 1, a high-to-low transition on the T2EX input pin will set the EXF2 flag and a Timer 2 interrupt will occur if enabled. Therefore, the T2EX input may be used as an additional external interrupt source. Figure 19.13. T2 Mode 2 Block Diagram SYSCLK 2 0 T2 C/T2 1 Crossbar TL2 TCLK Timer 2 Overflow TH2 1 2 RCAP2L S I GG TD FF OL 1 0 PE RX Clock 16 TX Clock RCLK RCAP2H 1 1 R N ot 149 S M O D 16 0 0 EXEN2 Crossbar PCON 0 Timer 1 Overflow T2EX Reload T2CON ec om TR2 CP/RL2 C/T2 TR2 EXEN2 TCLK RCLK EXF2 TF2 Rev. 1.7 TCLK Interrupt C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 19.14. T2CON: Timer 2 Control Register R/W R/W R/W R/W R/W R/W R/W TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2 CP/RL2 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: (bit addressable) TF2: Timer 2 Overflow Flag. Set by hardware when Timer 2 overflows from 0xFFFF to 0x0000 or reload value. When the Timer 2 interrupt is enabled, setting this bit causes the CPU to vector to the Timer 2 interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. TF2 will not be set when RCLK and/or TCLK are logic 1. Bit6: EXF2: Timer 2 External Flag. Set by hardware when either a capture or reload is caused by a high-to-low transition on the T2EX input pin and EXEN2 is logic 1. When the Timer 2 interrupt is enabled, setting this bit causes the CPU to vector to the Timer 2 Interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. Bit5: RCLK: Receive Clock Flag. Selects which timer is used for the UART’s receive clock in modes 1 or 3. 0: Timer 1 overflows used for receive clock. 1: Timer 2 overflows used for receive clock. Bit4: TCLK: Transmit Clock Flag. Selects which timer is used for the UART’s transmit clock in modes 1 or 3. 0: Timer 1 overflows used for transmit clock. 1: Timer 2 overflows used for transmit clock. Bit3: EXEN2: Timer 2 External Enable. Enables high-to-low transitions on T2EX to trigger captures or reloads when Timer 2 is not operating in Baud Rate Generator mode. 0: High-to-low transitions on T2EX ignored. 1: High-to-low transitions on T2EX cause a capture or reload. Bit2: TR2: Timer 2 Run Control. This bit enables/disables Timer 2. 0: Timer 2 disabled. 1: Timer 2 enabled. 0xC8 om m en de d fo r N ew D Bit7: C/T2: Counter/Timer Select. 0: Timer Function: Timer 2 incremented by clock defined by T2M (CKCON.5). 1: Counter Function: Timer 2 incremented by high-to-low transitions on external input pin (T2). R ec Bit1: Reset Value es ig ns R/W N ot Bit0: CP/RL2: Capture/Reload Select. This bit selects whether Timer 2 functions in capture or auto-reload mode. EXEN2 must be logic 1 for high-to-low transitions on T2EX to be recognized and used to trigger captures or reloads. If RCLK or TCLK is set, this bit is ignored and Timer 2 will function in auto-reload mode. 0: Auto-reload on Timer 2 overflow or high-to-low transition at T2EX (EXEN2 = 1). 1: Capture on high-to-low transition at T2EX (EXEN2 = 1). Rev. 1.7 150 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 19.15. RCAP2L: Timer 2 Capture Register Low Byte R/W R/W R/W R/W R/W R/W R/W R/W Reset Value Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns 00000000 0xCA D Bits 7-0: RCAP2L: Timer 2 Capture Register Low Byte. The RCAP2L register captures the low byte of Timer 2 when Timer 2 is configured in capture mode. When Timer 2 is configured in auto-reload mode, it holds the low byte of the reload value. R/W R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 N ew Figure 19.16. RCAP2H: Timer 2 Capture Register High Byte R/W R/W R/W Reset Value 00000000 Bit2 Bit1 Bit0 SFR Address: 0xCB m en de d fo r Bits 7-0: RCAP2H: Timer 2 Capture Register High Byte. The RCAP2H register captures the high byte of Timer 2 when Timer 2 is configured in capture mode. When Timer 2 is configured in auto-reload mode, it holds the high byte of the reload value. Figure 19.17. TL2: Timer 2 Low Byte R/W R/W Bit7 Bit6 R/W R/W R/W R/W R/W R/W Reset Value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 00000000 0xCC ec om Bits 7-0: TL2: Timer 2 Low Byte. The TL2 register contains the low byte of the 16-bit Timer 2. Figure 19.18. TH2: Timer 2 High Byte R/W R/W R/W R/W R/W R/W R/W Reset Value Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: R R/W 00000000 0xCD N ot Bits 7-0: TH2: Timer 2 High Byte. The TH2 register contains the high byte of the 16-bit Timer 2. 151 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 19.3. Timer 3 es ig ns Timer 3 is a 16-bit timer formed by the two 8-bit SFRs, TMR3L (low byte) and TMR3H (high byte). The input for Timer 3 is the system clock (divided by either one or twelve as specified by the Timer 3 Clock Select bit T3M in the Timer 3 Control Register TMR3CN). Timer 3 is always configured as an auto-reload timer, with the reload value held in the TMR3RLL (low byte) and TMR3RLH (high byte) registers. Timer 3 can be used to start an ADC Data Conversion, for SMBus timing (see Section 16.5), or as a general-purpose timer. Timer 3 does not have a counter mode. Figure 19.19. Timer 3 Block Diagram 12 T3M 0 (to ADC) SYSCLK TMR3L TF3 (from SMBus) TOE Reload Interrupt N ew TR3 SCL TMR3H TMR3CN TCLK D 1 TR3 T3M TMR3RLL TMR3RLH fo r Crossbar R/W R/W TF3 - Bit7 Bit6 R/W R/W R/W R/W R/W R/W - - - TR3 T3M - Reset Value 00000000 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 0x91 TF3: Timer3 Overflow Flag. Set by hardware when Timer 3 overflows from 0xFFFF to 0x0000. When the Timer 3 interrupt is enabled, setting this bit causes the CPU to vector to the Timer 3 Interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. om Bit7: m en de d Figure 19.20. TMR3CN: Timer 3 Control Register Bits6-3: UNUSED. Read = 0000b, Write = don’t care. TR3: Timer 3 Run Control. This bit enables/disables Timer 3. 0: Timer 3 disabled. 1: Timer 3 enabled. R ec Bit2: N ot Bit1: Bit0: T3M: Timer 3 Clock Select. This bit controls the division of the system clock supplied to Counter/Timer 3. 0: Counter/Timer 3 uses the system clock divided by 12. 1: Counter/Timer 3 uses the system clock. UNUSED. Read = 0, Write = don’t care. Rev. 1.7 152 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 19.21. TMR3RLL: Timer 3 Reload Register Low Byte R/W R/W R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 R/W Reset Value es ig ns R/W 00000000 Bit0 SFR Address: 0x92 D Bits 7-0: TMR3RLL: Timer 3 Reload Register Low Byte. Timer 3 is configured as an auto-reload timer. This register holds the low byte of the reload value. R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 R/W R/W R/W Reset Value 00000000 Bit2 Bit1 Bit0 SFR Address: 0x93 fo r R/W N ew Figure 19.22. TMR3RLH: Timer 3 Reload Register High Byte m en de d Bits 7-0: TMR3RLH: Timer 3 Reload Register High Byte. Timer 3 is configured as an auto-reload timer. This register holds the high byte of the reload value. Figure 19.23. TMR3L: Timer 3 Low Byte R/W R/W Bit7 Bit6 R/W R/W R/W R/W R/W R/W Reset Value Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 00000000 0x94 om Bits 7-0: TMR3L: Timer 3 Low Byte. The TMR3L register is the low byte of Timer 3. ec Figure 19.24. TMR3H: Timer 3 High Byte R R/W R/W R/W R/W R/W R/W R/W Reset Value Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 00000000 0x95 N ot Bit7 R/W Bits 7-0: TMR3H: Timer 3 High Byte. The TMR3H register is the high byte of Timer 3. 153 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 20. PROGRAMMABLE COUNTER ARRAY es ig ns The Programmable Counter Array (PCA) provides enhanced timer functionality while requiring less CPU intervention than the standard 8051 counter/timers. The PCA consists of a dedicated 16-bit counter/timer and five 16-bit capture/compare modules. Each capture/compare module has its own associated I/O line (CEXn) which is routed through the Crossbar to Port I/O when enabled (see Section 15.1 for details on configuring the Crossbar). The counter/timer is driven by a configurable timebase that can select between four inputs as its source: system clock divided by twelve, system clock divided by four, Timer 0 overflow, or an external clock signal on the ECI line. The PCA is configured and controlled through the system controller’s Special Function Registers. The basic PCA block diagram is shown in Figure 20.1. 00 /12 /4 01 N ew System Clock D Figure 20.1. PCA Block Diagram 16-Bit Counter/Timer 10 T0 Overflow Capture/Compare Module 1 Capture/Compare Module 2 Capture/Compare Module 3 Capture/Compare Module 4 CEX4 CEX3 CEX2 CEX1 ECI CEX0 m en de d Capture/Compare Module 0 fo r CPS=11 Port I/O N ot R ec om Crossbar Rev. 1.7 154 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 20.1. Capture/Compare Modules es ig ns Each module can be configured to operate independently in one of four operation modes: Edge-triggered Capture, Software Timer, High Speed Output, or Pulse Width Modulator. Each module has Special Function Registers (SFRs) associated with it in the CIP-51 system controller. These registers are used to exchange data with a module and configure the module’s mode of operation. Table 20.1 summarizes the bit settings in the PCA0CPMn registers used to place the PCA capture/compare modules into different operating modes. Setting the ECCFn bit in a PCA0CPMn register enables the module’s CCFn interrupt. Note: PCA0 interrupts must be globally enabled before individual CCFn interrupts are recognized. PCA0 interrupts are globally enabled by setting the EA bit (IE.7) and the EPCA0 bit (EIE1.3) to logic 1. See Figure 20.2 for details on the PCA interrupt configuration. CAPP CAPN MAT TOG PWM ECCF X 1 0 0 0 0 X X 0 1 0 0 0 X X 1 1 0 1 0 1 0 X = Don’t Care 1 0 0 0 0 1 1 X 0 0 1 0 0 0 0 1 X X X X Operation Mode Capture triggered by positive edge on CEXn Capture triggered by negative edge on CEXn Capture triggered by transition on CEXn Software Timer High Speed Output Pulse Width Modulator fo r N ew ECOM D Table 20.1. PCA0CPM Register Settings for PCA Capture/Compare Modules (for n = 0 to 4) PCA0CPMn ECCMT P E C A A AOWC OPP TGMC MP N n n n F n n n n PCA0CN CC FR CCCCC CCCCC FFFFF 4 3 2 1 0 om PCA Counter/ Timer Overflow m en de d Figure 20.2. PCA Interrupt Block Diagram PCA0MD C I D L 0 1 ECCF0 0 PCA Module 0 1 ECCF1 0 ec PCA Module 1 1 ECCF2 0 PCA Module 2 R CCE PPC SSF 1 0 1 ECCF3 N ot 0 155 PCA Module 3 1 ECCF4 0 PCA Module 4 1 Rev. 1.7 EPCA0 (EIE1.3) EA (IE.7) 0 0 1 1 Interrupt Priority Decoder C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 20.1.1. Edge-triggered Capture Mode Figure 20.3. PCA Capture Mode Diagram PCA0CN ECCMT P E C A A AOWC OPP TGMC MPN n n n F n n n n 0 0 0 0 Crossbar CEXn 1 fo r Port I/O CCCCC CCCCC FFFFF 4 3 2 1 0 (to CCFn) 0 CC FR N ew PCA0CPMn D PCA Interrupt es ig ns In this mode, a valid transition on the CEXn pin causes the PCA to capture the value of the PCA counter/timer and load it into the corresponding module’s 16-bit capture/compare register (PCA0CPLn and PCA0CPHn). The CAPPn and CAPNn bits in the PCA0CPMn register are used to select the type of transition that triggers the capture: low-tohigh transition (positive edge), high-to-low transition (negative edge), or either transition (positive or negative edge). When a capture occurs, the Capture/Compare Flag (CCFn) in PCA0CN is set to logic 1 and an interrupt request is generated if CCF interrupts are enabled. The CCFn bit is not automatically cleared by hardware when the CPU vectors to the interrupt service routine, and must be cleared by software. PCA0CPLn PCA0CPHn Capture 0 1 PCA0L PCA0H N ot R ec om m en de d PCA Timebase Rev. 1.7 156 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 20.1.2. Software Timer (Compare) Mode Figure 20.4. PCA Software Timer Mode Diagram Write to PCA0CPLn 0 ENB Reset Write to PCA0CPHn es ig ns In Software Timer mode, the PCA counter/timer is compared to the module’s 16-bit capture/compare register (PCA0CPHn and PCA0CPLn). When a match occurs, the Capture/Compare Flag (CCFn) in PCA0CN is set to logic 1 and an interrupt request is generated if CCF interrupts are enabled. The CCFn bit is not automatically cleared by hardware when the CPU vectors to the interrupt service routine, and must be cleared by software. Setting the ECOMn and MATn bits in the PCA0CPMn register enables Software Timer mode. PCA Interrupt ENB D 1 PCA0CPMn PCA0CN ECCMT P E C A A AOWC OPP TGMC MP N n n n F n n n n PCA0CPHn N ew 0 0 PCA0CPLn CC FR 0 0 x Enable Match PCA Timebase 0 1 fo r 16-bit Comparator CCCCC CCCCC FFFFF 4 3 2 1 0 PCA0L PCA0H m en de d 20.1.3. High Speed Output Mode In this mode, each time a match occurs between the PCA Timer Counter and a module’s 16-bit capture/compare register (PCA0CPHn and PCA0CPLn) the logic level on the module’s associated CEXn pin will toggle. Setting the TOGn, MATn, and ECOMn bits in the PCA0CPMn register enables the High-Speed Output mode. Figure 20.5. PCA High Speed Output Mode Diagram Write to PCA0CPLn Reset 0 ENB PCA0CPMn ENB om Write to PCA0CPHn ECCMT P E C A A AOWC OPP TGMC MP N n n n F n n n n 0 0 PCA Interrupt 0 x ec 1 N ot R PCA0CN PCA0CPLn Enable PCA0CPHn 16-bit Comparator Match CCCCC CCCCC FFFFF 4 3 2 1 0 0 1 TOGn Toggle PCA Timebase 157 CC FR 0 CEXn 1 PCA0L PCA0H Rev. 1.7 Crossbar Port I/O C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 20.1.4. Pulse Width Modulator Mode D Figure 20.6. PCA PWM Mode Diagram PCA0CPHn Write to PCA0CPLn es ig ns All of the modules can be used independently to generate pulse width modulated (PWM) outputs on their respective CEXn pin. The frequency of the output is dependent on the timebase for the PCA counter/timer. The duty cycle of the PWM output signal is varied using the module’s PCA0CPLn capture/compare register. When the value in the low byte of the PCA counter/timer (PCA0L) is equal to the value in PCA0CPLn, the output on the CEXn pin will be set. When the count value in PCA0L overflows, the CEXn output will be reset (see Figure 20.6). Also, when the counter/timer low byte (PCA0L) overflows from 0xFF to 0x00, PCA0CPLn is reloaded automatically with the value stored in the PCA0CPHn without software intervention. It is good practice to write to PCA0CPHn instead of PCA0CPLn to avoid glitches in the digital comparator. Setting the ECOMn and PWMn bits in the PCA0CPMn register enables Pulse Width Modulator mode. 0 ENB Reset PCA0CPMn ENB 1 E C CMT P E C A A A OWC OP P T GMC MP N n n n F nnn n 00 x 0 N ew Write to PCA0CPHn PCA0CPLn x Enable 8-bit Comparator match S SET Q CEXn Crossbar Port I/O PCA Timebase fo r R CLR Q PCA0L N ot R ec om m en de d Overflow Rev. 1.7 158 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 20.2. PCA Counter/Timer es ig ns The 16-bit PCA counter/timer consists of two 8-bit SFRs: PCA0L and PCA0H. PCA0H is the high byte (MSB) of the 16-bit counter/timer and PCA0L is the low byte (LSB). Reading PCA0L automatically latches the value of PCA0H at the same time. By reading the PCA0L Register first, this allows the PCA0H value to be held (at the time PCA0L was read) until the user reads the PCA0H Register. Reading PCA0H or PCA0L does not disturb the counter operation. The CPS1 and CPS0 bits in the PCA0MD register select the timebase for the counter/timer as shown in Table 20.2. D When the counter/timer overflows from 0xFFFF to 0x0000, the Counter Overflow Flag (CF) in PCA0MD is set to logic 1 and an interrupt request is generated if CF interrupts are enabled. Setting the ECF bit in PCA0MD to logic 1 enables the CF flag to generate an interrupt request. The CF bit is not automatically cleared by hardware when the CPU vectors to the interrupt service routine, and must be cleared by software. (Note: PCA0 interrupts must be globally enabled before CF interrupts are recognized. PCA0 interrupts are globally enabled by setting the EA bit (IE.7) and the EPCA0 bit in EIE1 to logic 1.) Clearing the CIDL bit in the PCA0MD register allows the PCA to continue normal operation while the microcontroller core is in Idle mode. CPS0 0 1 0 1 Timebase System clock divided by 12 System clock divided by 4 Timer 0 overflow High-to-low transitions on ECI (max rate = system clock divided by 4) fo r CPS1 0 0 1 1 N ew Table 20.2. PCA Timebase Input Options m en de d Figure 20.7. PCA Counter/Timer Block Diagram IDLE PCA0MD CCE PPC SSF 1 0 PCA0CN CC FR CCCCC CCCCC FFFFF 4 3 2 1 0 PCA0L read or write om C I D L SYSCLK/4 Timer 0 Overflow 01 0 10 1 159 PCA0H PCA0L Overflow To PCA Interrupt System CF 11 To PCA Modules N ot R ECI Snapshot Register 00 ec SYSCLK/12 To SFR Bus Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 20.3. Register Descriptions for PCA Figure 20.8. PCA0CN: PCA Control Register R/W R/W R/W R/W R/W R/W CF CR - CCF4 CCF3 CCF2 CCF1 R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Reset Value CCF0 00000000 Bit0 SFR Address: (bit addressable) 0xD8 D R/W es ig ns The system device may implement one or more Programmable Counter Arrays. Following are detailed descriptions of the special function registers related to the operation of the PCA. The CIP-51 System Controller section of the datasheet provides additional information on the SFRs and their use. CF: PCA Counter/Timer Overflow Flag. Set by hardware when the PCA Counter/Timer overflows from 0xFFFF to 0x0000. When the Counter/Timer Overflow (CF) interrupt is enabled, setting this bit causes the CPU to vector to the CF interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. Bit6: CR: PCA Counter/Timer Run Control. This bit enables/disables the PCA Counter/Timer. 0: PCA Counter/Timer disabled. 1: PCA Counter/Timer enabled. Bit5: UNUSED. Read = 0, Write = don’t care. Bit4: CCF4: PCA Module 4 Capture/Compare Flag. This bit is set by hardware when a match or capture occurs. When the CCF interrupt is enabled, setting this bit causes the CPU to vector to the CCF interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. Bit3: CCF3: PCA Module 3 Capture/Compare Flag. This bit is set by hardware when a match or capture occurs. When the CCF interrupt is enabled, setting this bit causes the CPU to vector to the CCF interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. Bit2: CCF2: PCA Module 2 Capture/Compare Flag. This bit is set by hardware when a match or capture occurs. When the CCF interrupt is enabled, setting this bit causes the CPU to vector to the CCF interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. ec om m en de d fo r N ew Bit7: R Bit1: N ot Bit0: CCF1: PCA Module 1 Capture/Compare Flag. This bit is set by hardware when a match or capture occurs. When the CCF interrupt is enabled, setting this bit causes the CPU to vector to the CCF interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. CCF0: PCA Module 0 Capture/Compare Flag. This bit is set by hardware when a match or capture occurs. When the CCF interrupt is enabled, setting this bit causes the CPU to vector to the CCF interrupt service routine. This bit is not automatically cleared by hardware and must be cleared by software. Rev. 1.7 160 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 20.9. PCA0MD: PCA Mode Register R/W R/W R/W R/W R/W R/W R/W - - - - CPS1 CPS0 ECF Reset Value 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns R/W CIDL 0xD9 CIDL: PCA Counter/Timer Idle Control. Specifies PCA behavior when CPU is in Idle Mode. 0: PCA continues to function normally while the system controller is in Idle Mode. 1: PCA operation is suspended while the system controller is in Idle Mode. Bits6-3: UNUSED. Read = 0000b, Write = don’t care. CPS0 0 1 0 1 Timebase System clock divided by 12 System clock divided by 4 Timer 0 overflow High-to-low transitions on ECI (max rate = system clock divided by 4) fo r CPS1 0 0 1 1 N ew Bits2-1: CPS1-CPS0: PCA Counter/Timer Pulse Select. These bits select the timebase source for the PCA counter. ECF: PCA Counter/Timer Overflow Interrupt Enable. This bit sets the masking of the PCA Counter/Timer Overflow (CF) interrupt. 0: Disable the CF interrupt. 1: Enable a PCA Counter/Timer Overflow interrupt request when CF (PCA0CN.7) is set. N ot R ec om m en de d Bit0: 161 D Bit7: Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 20.10. PCA0CPMn: PCA Capture/Compare Registers R/W R/W R/W R/W R/W R/W R/W - ECOMn CAPPn CAPNn MATn TOGn PWMn ECCFn 00000000 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 0xDA-0xDE UNUSED. Read = 0, Write = don’t care. ECOMn: Comparator Function Enable. This bit enables/disables the comparator function for PCA module n. 0: Disabled. 1: Enabled. CAPPn: Capture Positive Function Enable. This bit enables/disables the positive edge capture for PCA module n. 0: Disabled. 1: Enabled. CAPNn: Capture Negative Function Enable. This bit enables/disables the negative edge capture for PCA module n. 0: Disabled. 1: Enabled. MATn: Match Function Enable. This bit enables/disables the match function for PCA module n. When enabled, matches of the PCA counter with a module’s capture/compare register cause the CCFn bit in PCA0MD register to be set. 0: Disabled. 1: Enabled. TOGn: Toggle Function Enable. This bit enables/disables the toggle function for PCA module n. When enabled, matches of the PCA counter with a module’s capture/compare register cause the logic level on the CEXn pin to toggle. 0: Disabled. 1: Enabled. PWMn: Pulse Width Modulation Mode Enable. This bit enables/disables the comparator function for PCA module n. When enabled, a pulse width modulated signal is output on the CEXn pin. 0: Disabled. 1: Enabled. ECCFn: Capture/Compare Flag Interrupt Enable. This bit sets the masking of the Capture/Compare Flag (CCFn) interrupt. 0: Disable CCFn interrupts. 1: Enable a Capture/Compare Flag interrupt request when CCFn is set. N ew Bit7: Bit6: Bit5: fo r Bit4: m en de d Bit3: ec om Bit2: Bit1: PCA0CPM0 = 0xDA (n = 0) PCA0CPM1 = 0xDB (n = 1) PCA0CPM2 = 0xDC (n = 2) PCA0CPM3 = 0xDD (n = 3) PCA0CPM4 = 0xDE (n = 4) D PCA0CPMn Address: Reset Value es ig ns R/W N ot R Bit0: Rev. 1.7 162 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 20.11. PCA0L: PCA Counter/Timer Low Byte R/W R/W R/W R/W R/W R/W R/W R/W Reset Value Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: es ig ns 00000000 0xE9 Bits 7-0: PCA0L: PCA Counter/Timer Low Byte. The PCA0L register holds the low byte (LSB) of the 16-bit PCA Counter/Timer. R/W R/W R/W R/W R/W R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 N ew R/W D Figure 20.12. PCA0H: PCA Counter/Timer High Byte R/W Reset Value Bit0 SFR Address: 00000000 0xF9 fo r Bits 7-0: PCA0H: PCA Counter/Timer High Byte. The PCA0H register holds the high byte (MSB) of the 16-bit PCA Counter/Timer. Note the value read is actually from the snapshot register in order to synchronize it with PCA0L. Figure 20.13. PCA0CPLn: PCA Capture Module Low Byte R/W Bit7 Bit6 R/W R/W R/W m en de d R/W PCA0CPLn Address: Bit5 Bit4 Bit3 R/W R/W R/W Reset Value Bit2 Bit1 Bit0 SFR Address: 0xEA-0xEE 00000000 PCA0CPL0 = 0xEA (n = 0) PCA0CPL1 = 0xEB (n = 1) PCA0CPL2 = 0xEC (n = 2) PCA0CPL3 = 0xED (n = 3) PCA0CPL4 = 0xEE (n = 4) om Bits7-6: PCA0CPLn: PCA Capture Module Low Byte. The PCA0CPLn register holds the low byte (LSB) of the 16-bit capture module n. ec Figure 20.14. PCA0CPHn: PCA Capture Module High Byte R R/W R/W R/W R/W R/W R/W R/W Reset Value Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SFR Address: 0xFA-0xFE 00000000 N ot Bit7 R/W PCA0CPHn Address: PCA0CPH0 = 0xFA (n = 0) PCA0CPH1 = 0xFB (n = 1) PCA0CPH2 = 0xFC (n = 2) PCA0CPH3 = 0xFD (n = 3) PCA0CPH4 = 0xFE (n = 4) Bits7-0: PCA0CPHn: PCA Capture Module High Byte. The PCA0CPHn register holds the high byte (MSB) of the 16-bit capture module n. 163 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 21. JTAG (IEEE 1149.1) es ig ns Each MCU has an on-chip JTAG interface and logic to support boundary scan for production and in-system testing, Flash read and write operations, and non-intrusive in-circuit debug. The JTAG interface is fully compliant with the IEEE 1149.1 specification. Refer to this specification for detailed descriptions of the Test Interface and BoundaryScan Architecture. Access of the JTAG Instruction Register (IR) and Data Registers (DR) are as described in the Test Access Port and Operation of the IEEE 1149.1 specification. The JTAG interface is via four dedicated pins on the MCU, which are TCK, TMS, TDI, and TDO. These pins are all 5V tolerant. N ew Figure 21.1. IR: JTAG Instruction Register D Through the 16-bit JTAG Instruction Register (IR), any of the eight instructions shown in Figure 21.1 can be commanded. There are three Data Registers (DR’s) associated with JTAG Boundary-Scan, and four associated with Flash read/write operations on the MCU. Instruction EXTEST 0x0002 0x0004 0xFFFF 0x0082 SAMPLE/ PRELOAD IDCODE BYPASS Flash Control 0x0083 0x0084 Flash Data Flash Address 0x0085 Flash Scale Description Selects the Boundary Data Register for control and observability of all device pins Selects the Boundary Data Register for observability and presetting the scan-path latches Selects device ID Register Selects Bypass Data Register Selects FLASHCON Register to control how the interface logic responds to reads and writes to the FLASHDAT Register Selects FLASHDAT Register for reads and writes to the Flash memory Selects FLASHADR Register which holds the address of all Flash read, write, and erase operations Selects FLASHSCL Register which controls the prescaler used to generate timing signals for Flash operations N ot R ec om m en de d IR value 0x0000 0x0004 Bit0 fo r Bit15 Reset Value Rev. 1.7 164 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 21.1. Boundary Scan Table 21.1. Boundary Data Register Bit Definitions es ig ns The Data Register in the Boundary Scan path is an 87-bit shift register. The Boundary DR provides control and observability of all the device pins as well as the SFR bus and Weak Pullup feature via the EXTEST and SAMPLE commands. EXTEST provides access to both capture and update actions, while Sample only performs a capture. 2 3 4-11 12-19 20 21 22 24,26,28,30, 32,34,36,38 D ec 39,41,43,45, 47,49,51,53 Reset Enable from MCU Reset Enable to /RST pin Reset input from /RST pin Reset output to /RST pin External Clock from XTAL1 pin Not used Weak pullup enable from MCU Weak pullup enable to Port Pins SFR Address Bus bit from CIP-51 (e.g. Bit4=SFRA0, Bit5=SFRA1…) SFR Address Bus bit to SFR Address Bus (e.g. Bit4=XSFRA0, Bit5=XSFRA1) SFR Data Bus bit read from SFR (e.g. Bit12=SFRD0, Bit13=SFRD1…) SFR Data Bus bit written to SFR (e.g. Bit12=SFRD0, Bit13=SFRD1…) SFR Write Strobe from CIP-51 SFR Write Strobe to SFR Bus SFR Read Strobe from CIP-51 SFR Read Strobe to SFR Bus SFR Read/Modify/Write Strobe from CIP-51 SFR Read/Modify/Write Strobe to SFR Bus P0.n output enable from MCU (e.g. Bit23=P0.0, Bit25=P0.1, etc.) P0.n output enable to pin (e.g. Bit23=P0.0oe, Bit25=P0.1oe, etc.) P0.n input from pin (e.g. Bit24=P0.0, Bit26=P0.1, etc.) P0.n output to pin (e.g. Bit24=P0.0, Bit26=P0.1, etc.) P1.n output enable from MCU (e.g. Bit39=P1.0, Bit41=P1.1, etc.) P1.n output enable to pin (e.g. Bit39=P1.0oe, Bit41=P1.1oe, etc.) P1.n input from pin (e.g. Bit40=P1.0, Bit42=P1.1, etc.) P1.n output to pin (e.g. Bit40=P1.0, Bit42=P1.1, etc.) P2.n output enable from MCU (e.g. Bit55=P2.0, Bit57=P2.1, etc.) P2.n output enable to pin (e.g. Bit55=P2.0oe, Bit57=P2.1oe, etc.) P2.n input from pin (e.g. Bit56=P2.0, Bit58=P2.1, etc.) P2.n output to pin (e.g. Bit56=P2.0, Bit58=P2.1, etc.) P3.n output enable from MCU (e.g. Bit71=P3.0, Bit73=P3.1, etc.) P3.n output enable to pin (e.g. Bit71=P3.0oe, Bit73=P3.1oe, etc.) P3.n input from pin (e.g. Bit72=P3.0, Bit74=P3.1, etc.) P3.n output to pin (e.g. Bit72=P3.0, Bit74=P3.1, etc.) om 23,25,27,29, 31,33,35,37 Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update Capture Update N ew 1 Target fo r 0 Action m en de d Bit R 40,42,44,46, 48,50,52,54 55,57,59,61, 63,65,67,69 N ot 56,58,60,62, 64,66,68,70 71,73,75,77, 79,81,83,85 72,74,76,78, 80,82,84,86 165 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 21.1.1. EXTEST Instruction The EXTEST instruction is accessed via the IR. The Boundary DR provides control and observability of all the device pins as well as the SFR bus and Weak Pullup feature. All inputs to on-chip logic are set to one. es ig ns 21.1.2. SAMPLE Instruction The SAMPLE instruction is accessed via the IR. The Boundary DR provides observability and presetting of the scan-path latches. 21.1.3. BYPASS Instruction The BYPASS instruction is accessed via the IR. It provides access to the standard 1-bit JTAG Bypass data register. D 21.1.4. IDCODE Instruction N ew The IDCODE instruction is accessed via the IR. It provides access to the 32-bit Device ID register. Figure 21.2. DEVICEID: JTAG Device ID Register Bit31 Part Number Bit28 Bit27 Bit12 Bit11 Bit1 1 Reset Value (Varies) Bit0 m en de d Version = 0000b (Revision A) or = 0001b (Revision B) Manufacturer ID fo r Version Part Number = 0000 0000 0000 0000b or = 0000 0000 0000 0010b N ot R ec om Manufacturer ID = 0010 0100 001b (Silicon Laboratories) Rev. 1.7 166 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 21.2. Flash Programming Commands 17:0 WriteData IndOpCode: These bit set the operation to perform according to the following table: Operation Poll Read Write N ew IndOpCode 0x 10 11 D 19:18 IndOpCode es ig ns The Flash memory can be programmed directly over the JTAG interface using the Flash Control, Flash Data, Flash Address, and Flash Scale registers. These Indirect Data Registers are accessed via the JTAG Instruction Register. Read and write operations on indirect data registers are performed by first setting the appropriate DR address in the IR register. Each read or write is then initiated by writing the appropriate Indirect Operation Code (IndOpCode) to the selected data register. Incoming commands to this register have the following format: The Poll operation is used to check the Busy bit as described below. Although a Capture-DR is performed, no Update-DR is allowed for the Poll operation. Since updates are disabled, polling can be accomplished by shifting in/out a single bit. fo r The Read operation initiates a read from the register addressed by the IR. Reads can be initiated by shifting only 2 bits into the indirect register. After the read operation is initiated, polling of the Busy bit must be performed to determine when the operation is complete. m en de d The write operation initiates a write of WriteData to the register addressed by the IR. Registers of any width up to 18 bits can be written. If the register to be written contains fewer than 18 bits, the data in WriteData should be leftjustified, i.e. its MSB should occupy bit 17 above. This allows shorter registers to be written in fewer JTAG clock cycles. For example, an 8-bit register could be written by shifting only 10 bits. After a Write is initiated, the Busy bit should be polled to determine when the next operation can be initiated. The contents of the Instruction Register should not be altered while either a read or write operation is in progress. Outgoing data from the indirect Data Register has the following format: 18:1 ReadData om 19 0 0 Busy N ot R ec The Busy bit indicates that the current operation is not complete. It goes high when an operation is initiated and returns low when complete. Read and Write commands are ignored while Busy is high. In fact, if polling for Busy to be low will be followed by another read or write operation, JTAG writes of the next operation can be made while checking for Busy to be low. They will be ignored until Busy is read low, at which time the new operation will initiate. This bit is placed at bit 0 to allow polling by single-bit shifts. When waiting for a Read to complete and Busy is 0, the following 18 bits can be shifted out to obtain the resulting data. ReadData is always right-justified. This allows registers shorter than 18 bits to be read using a reduced number of shifts. For example, the result from a byte-read requires 9 bit shifts (Busy + 8 bits). 167 Rev. 1.7 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 21.3. FLASHCON: JTAG Flash Control Register Reset Value WRMD2 WRMD1 WRMD0 RDMD3 RDMD2 RDMD1 RDMD0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 00000000 es ig ns WRMD3 This register determines how the Flash interface logic will respond to reads and writes to the FLASHDAT Register. fo r N ew D Bits7-4: WRMD3-0: Write Mode Select Bits. The Write Mode Select Bits control how the interface logic responds to writes to the FLASHDAT Register per the following values: 0000: A FLASHDAT write replaces the data in the FLASHDAT register, but is otherwise ignored. 0001: A FLASHDAT write initiates a write of FLASHDAT into the memory location addressed by the FLASHADR register. FLASHADR is incremented by one when complete. 0010: A FLASHDAT write initiates an erasure (sets all bytes to 0xFF) of the Flash page containing the address in FLASHADR. FLASHDAT must be 0xA5 for the erase to occur. FLASHADR is not affected. If FLASHADR = 0x7DFE – 0x7DFF, the entire user space will be erased (i.e. entire Flash memory except for Reserved area 0x7E00 – 0x7FFF). (All other values for WRMD3-0 are reserved.) om m en de d Bits3-0: RDMD3-0: Read Mode Select Bits. The Read Mode Select Bits control how the interface logic responds to reads to the FLASHDAT Register per the following values: 0000: A FLASHDAT read provides the data in the FASHDAT register, but is otherwise ignored. 0001: A FLASHDAT read initiates a read of the byte addressed by the FLASHADR register if no operation is currently active. This mode is used for block reads. 0010: A FLASHDAT read initiates a read of the byte addressed by FLASHADR only if no operation is active and any data from a previous read has already been read from FLASHDAT. This mode allows single bytes to be read (or the last byte of a block) without initiating an extra read. (All other values for RDMD3-0 are reserved.) ec Figure 21.4. FLASHADR: JTAG Flash Address Register Reset Value 0x0000 Bit15 R Bit0 N ot This register holds the address for all JTAG Flash read, write, and erase operations. This register autoincrements after each read or write, regardless of whether the operation succeeded or failed. Bits15-0: Flash Operation 16-bit Address. Rev. 1.7 168 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 Figure 21.5. FLASHDAT: JTAG Flash Data Register Reset Value DATA6 DATA5 DATA4 DATA3 DATA2 DATA1 DATA0 FAIL FBUSY Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 This register is used to read or write data to the Flash memory across the JTAG interface. Bits9-2: DATA7-0: Flash Data Byte. 0000000000 es ig ns DATA7 FAIL: Flash Fail Bit. 0: Previous Flash memory operation was successful. 1: Previous Flash memory operation failed. Usually indicates the associated memory location was locked. Bit0: FBUSY: Flash Busy Bit. 0: Flash interface logic is not busy. 1: Flash interface logic is processing a request. Reads or writes while FBUSY = 1 will not initiate another operation N ew D Bit1: fo r Figure 21.6. FLASHSCL: JTAG Flash Scale Register Reset Value FRAE - - FLSCL3 FLSCL2 FLSCL1 FLSCL0 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 m en de d FOSE This register controls the Flash read timing circuit and the prescaler required to generate the correct timing for Flash operations. FOSE: Flash One-Shot Enable Bit. 0: Flash read strobe is a full clock-cycle wide. 1: Flash read strobe is 50nsec. Bit6: FRAE: Flash Read Always Bit. 0: The Flash output enable and sense amplifier enable are on only when needed to read the Flash memory. 1: The Flash output enable and sense amplifier enable are always on. This can be used to limit the variations in digital supply current due to switching the sense amplifiers, thereby reducing digitally induced noise. ec om Bit7: R Bits5-4: UNUSED. Read = 00b, Write = don’t care. N ot Bits3-0: FLSCL3-0: Flash Prescaler Control Bits. The FLSCL3-0 bits control the prescaler used to generate timing signals for Flash operations. Its value should be written before any Flash operations are initiated. The value written should be the smallest integer for which: 169 FLSCL[3:0] > log2(fSYSCLK / 50kHz) Where fSYSCLK is the system clock frequency. All Flash read/write/erase operations are disallowed when FLSCL[3:0] = 1111b. Rev. 1.7 00000000 C8051F000/1/2/5/6/7 C8051F010/1/2/5/6/7 21.3. Debug Support es ig ns Each MCU has on-chip JTAG and debug circuitry that provide non-intrusive, full speed, in-circuit debug using the production part installed in the end application using the four pin JTAG I/F. Silicon Labs’ debug system supports inspection and modification of memory and registers, setting breakpoints, watchpoints, single stepping, and run and halt commands. No additional target RAM, program memory, or communications channels are required. All the digital and analog peripherals are functional and work correctly (remain in sync) while debugging. The WDT is disabled when the MCU is halted during single stepping or at a breakpoint. N ot R ec om m en de d fo r N ew D The C8051F000DK, C8051F005DK, C8051F010DK, and C8051F015DK are development kits with all the hardware and software necessary to develop application code and perform in-circuit debugging with each MCU in the C8051F000 family. Each kit includes an Integrated Development Environment (IDE) which has a debugger and integrated 8051 assembler. It has an RS-232 to JTAG protocol translator module referred to as the EC. There is also a target application board with a C8051F000, F005, F010, or F015 installed and with a large prototyping area. The kit also includes RS-232 and JTAG cables, and wall-mount power supply. Rev. 1.7 170 es ig ns D N ew fo r One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! SW/HW Quality Support and Community www.silabs.com/simplicity www.silabs.com/quality community.silabs.com om IoT Portfolio www.silabs.com/IoT m en de d Simplicity Studio N ot R ec Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are not designed or authorized for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Trademark Information Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders. Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 USA http://www.silabs.com
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