C8051F383-GM

C8051F380/1/2/3/4/5/6/7/C Full Speed USB Flash MCU Family Analog Peripherals - 10-Bit ADC (C8051F380/1/2/3/C only) • Up to 500 ksps • Built-in analog multiplexer with single-ended and instructions in 1 or 2 system clocks differential mode VREF from external pin, internal reference, or VDD Built-in temperature sensor External conversion start input option - Two comparators - Internal voltage reference (C8051F380/1/2/3/C only) - Brown-out detector and POR Circuitry USB Function Controller - USB specification 2.0 compliant - Full speed (12 Mbps) or low speed (1.5 Mbps) operation - Integrated clock recovery; no external crystal required for full speed or low speed - Supports eight flexible endpoints - 1 kB USB buffer memory - Integrated transceiver; no external resistors required On-Chip Debug - On-chip debug circuitry facilitates full speed, non-intru- - ANALOG PERIPHERALS TEMP SENSOR + - enhanced UART serial ports Six general purpose 16-bit counter/timers 16-bit programmable counter array (PCA) with five capture/compare modules External Memory Interface (EMIF) Clock Sources - Internal Oscillator: ±0.25% accuracy with clock recovery enabled. Supports all USB and UART modes External Oscillator: Crystal, RC, C, or clock (1 or 2 Pin modes) Low Frequency (80 kHz) Internal Oscillator Can switch between clock sources on-the-fly Packages - 48-pin TQFP (C8051F380/2/4/6) - 32-pin LQFP (C8051F381/3/5/7/C) - 5x5 mm 32-pin QFN (C8051F381/3/5/7/C) Temperature Range: –40 to +85 °C Voltage Regulators 10-bit 500 ksps ADC - - Voltage Supply Input: 2.7 to 5.25 V - Voltages from 2.7 to 5.25 V supported using On-Chip A M U X 512-byte sectors Digital Peripherals - 40/25 Port I/O; All 5 V tolerant with high sink current - Hardware enhanced SPI™, two I2C/SMBus™, and two + - VREG VREF DIGITAL I/O UART0 UART1 SPI SMBus0 SMBus1 PCA 6 Timers Port 0 CROSSBAR - sive in-system debug (No emulator required) Provides breakpoints, single stepping, inspect/modify memory and registers Superior performance to emulation systems using ICE-chips, target pods, and sockets - Up to 48 MIPS operation - Expanded interrupt handler Memory - 4352 or 2304 Bytes RAM - 64, 32, or 16 kB Flash; In-system programmable in 48 Pin Only Ext. Memory I/F • • • High Speed 8051 µC Core - Pipelined instruction architecture; executes 70% of Port 1 Port 2 Port 3 Port 4 C8051F380/1/2/3 Only PRECISION INTERNAL OSCILLATORS USB Controller / Transceiver HIGH-SPEED CONTROLLER CORE 64/32 kB ISP FLASH FLEXIBLE INTERRUPTS Rev. 1.5 3/19 8051 CPU 48 MIPS DEBUG CIRCUITRY 4/2 kB RAM POR Copyright © 2019 by Silicon Laboratories WDT C8051F380/1/2/3/4/5/6/7/C C8051F380/1/2/3/4/5/6/7/C 2 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Table of Contents 1. System Overview ..................................................................................................... 16 2. C8051F34x Compatibility ........................................................................................ 20 2.1. Hardware Incompatibilities ................................................................................ 21 3. Pinout and Package Definitions ............................................................................. 22 4. Typical Connection Diagrams ................................................................................ 34 4.1. Power ............................................................................................................ 34 4.2. USB ............................................................................................................ 36 4.3. Voltage Reference (VREF)................................................................................ 36 5. Electrical Characteristics ........................................................................................ 37 5.1. Absolute Maximum Specifications..................................................................... 37 5.2. Electrical Characteristics ................................................................................... 38 6. 10-Bit ADC (ADC0, C8051F380/1/2/3/C only) ......................................................... 46 6.1. Output Code Formatting .................................................................................... 47 6.3. Modes of Operation ........................................................................................... 50 6.3.1. Starting a Conversion................................................................................ 50 6.3.2. Tracking Modes......................................................................................... 51 6.3.3. Settling Time Requirements...................................................................... 52 6.4. Programmable Window Detector....................................................................... 56 6.4.1. Window Detector Example........................................................................ 58 6.5. ADC0 Analog Multiplexer (C8051F380/1/2/3/C only) ........................................ 59 7. Voltage Reference Options ..................................................................................... 62 8. Comparator0 and Comparator1.............................................................................. 64 8.1. Comparator Multiplexers ................................................................................... 71 9. Voltage Regulators (REG0 and REG1)................................................................... 74 9.1. Voltage Regulator (REG0)................................................................................. 74 9.1.1. Regulator Mode Selection......................................................................... 74 9.1.2. VBUS Detection ........................................................................................ 74 9.2. Voltage Regulator (REG1)................................................................................. 74 10. Power Management Modes................................................................................... 76 10.1. Idle Mode......................................................................................................... 76 10.2. Stop Mode ....................................................................................................... 77 10.3. Suspend Mode ................................................................................................ 77 11. CIP-51 Microcontroller........................................................................................... 79 11.1. Instruction Set.................................................................................................. 80 11.1.1. Instruction and CPU Timing .................................................................... 80 11.2. CIP-51 Register Descriptions .......................................................................... 85 12. Prefetch Engine...................................................................................................... 88 13. Memory Organization ............................................................................................ 89 13.1. Program Memory............................................................................................. 91 13.2. Data Memory ................................................................................................... 91 13.3. General Purpose Registers ............................................................................. 92 13.4. Bit Addressable Locations ............................................................................... 92 13.5. Stack ............................................................................................................ 92 Rev. 1.5 3 C8051F380/1/2/3/4/5/6/7/C 14. External Data Memory Interface and On-Chip XRAM ......................................... 93 14.1. Accessing XRAM............................................................................................. 93 14.1.1. 16-Bit MOVX Example ............................................................................ 93 14.1.2. 8-Bit MOVX Example .............................................................................. 93 14.2. Accessing USB FIFO Space ........................................................................... 94 14.3. Configuring the External Memory Interface ..................................................... 95 14.4. Port Configuration............................................................................................ 95 14.5. Multiplexed and Non-multiplexed Selection..................................................... 98 14.5.1. Multiplexed Configuration........................................................................ 98 14.5.2. Non-multiplexed Configuration................................................................ 98 14.6. Memory Mode Selection................................................................................ 100 14.6.1. Internal XRAM Only .............................................................................. 100 14.6.2. Split Mode without Bank Select............................................................. 100 14.6.3. Split Mode with Bank Select.................................................................. 101 14.6.4. External Only......................................................................................... 101 14.7. Timing .......................................................................................................... 102 14.7.1. Non-multiplexed Mode .......................................................................... 104 14.7.1.1. 16-bit MOVX: EMI0CF[4:2] = 101, 110, or 111............................. 104 14.7.1.2. 8-bit MOVX without Bank Select: EMI0CF[4:2] = 101 or 111 ....... 105 14.7.1.3. 8-bit MOVX with Bank Select: EMI0CF[4:2] = 110 ....................... 106 14.7.2. Multiplexed Mode .................................................................................. 107 14.7.2.1. 16-bit MOVX: EMI0CF[4:2] = 001, 010, or 011............................. 107 14.7.2.2. 8-bit MOVX without Bank Select: EMI0CF[4:2] = 001 or 011 ....... 108 14.7.2.3. 8-bit MOVX with Bank Select: EMI0CF[4:2] = 010 ....................... 109 15. Special Function Registers................................................................................. 111 15.1. 13.1. SFR Paging .......................................................................................... 111 16. Interrupts .............................................................................................................. 118 16.1. MCU Interrupt Sources and Vectors.............................................................. 119 16.1.1. Interrupt Priorities.................................................................................. 119 16.1.2. Interrupt Latency ................................................................................... 119 16.2. Interrupt Register Descriptions ...................................................................... 119 16.3. INT0 and INT1 External Interrupt Sources .................................................... 127 17. Reset Sources ...................................................................................................... 129 17.1. Power-On Reset ............................................................................................ 130 17.2. Power-Fail Reset / VDD Monitor ................................................................... 131 17.3. External Reset ............................................................................................... 132 17.4. Missing Clock Detector Reset ....................................................................... 132 17.5. Comparator0 Reset ....................................................................................... 132 17.6. PCA Watchdog Timer Reset ......................................................................... 133 17.7. Flash Error Reset .......................................................................................... 133 17.8. Software Reset .............................................................................................. 133 17.9. USB Reset..................................................................................................... 133 18. Flash Memory....................................................................................................... 135 18.1. Programming The Flash Memory .................................................................. 135 18.1.1. Flash Lock and Key Functions .............................................................. 135 4 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 18.1.2. Flash Erase Procedure ......................................................................... 135 18.1.3. Flash Write Procedure .......................................................................... 136 18.2. Non-Volatile Data Storage............................................................................. 137 18.3. Security Options ............................................................................................ 137 19. Oscillators and Clock Selection ......................................................................... 142 19.1. System Clock Selection................................................................................. 143 19.2. USB Clock Selection ..................................................................................... 143 19.3. Programmable Internal High-Frequency (H-F) Oscillator .............................. 145 19.3.1. Internal Oscillator Suspend Mode ......................................................... 145 19.4. Clock Multiplier .............................................................................................. 147 19.5. Programmable Internal Low-Frequency (L-F) Oscillator ............................... 148 19.5.1. Calibrating the Internal L-F Oscillator.................................................... 148 19.6. External Oscillator Drive Circuit..................................................................... 149 19.6.1. External Crystal Mode........................................................................... 149 19.6.2. External RC Example............................................................................ 151 19.6.3. External Capacitor Example.................................................................. 151 20. Port Input/Output ................................................................................................. 153 20.1. Priority Crossbar Decoder ............................................................................. 154 20.2. Port I/O Initialization ...................................................................................... 158 20.3. General Purpose Port I/O .............................................................................. 161 21. Universal Serial Bus Controller (USB0) ............................................................. 172 21.1. Endpoint Addressing ..................................................................................... 172 21.2. USB Transceiver ........................................................................................... 173 21.3. USB Register Access .................................................................................... 175 21.4. USB Clock Configuration............................................................................... 179 21.5. FIFO Management ........................................................................................ 181 21.5.1. FIFO Split Mode .................................................................................... 181 21.5.2. FIFO Double Buffering .......................................................................... 182 21.5.1. FIFO Access ......................................................................................... 182 21.6. Function Addressing...................................................................................... 183 21.7. Function Configuration and Control............................................................... 183 21.8. Interrupts ....................................................................................................... 186 21.9. The Serial Interface Engine ........................................................................... 193 21.10. Endpoint0 .................................................................................................... 193 21.10.1. Endpoint0 SETUP Transactions ......................................................... 193 21.10.2. Endpoint0 IN Transactions.................................................................. 193 21.10.3. Endpoint0 OUT Transactions.............................................................. 194 21.11. Configuring Endpoints1-3 ............................................................................ 196 21.12. Controlling Endpoints1-3 IN......................................................................... 197 21.12.1. Endpoints1-3 IN Interrupt or Bulk Mode.............................................. 197 21.12.2. Endpoints1-3 IN Isochronous Mode.................................................... 198 21.13. Controlling Endpoints1-3 OUT..................................................................... 201 21.13.1. Endpoints1-3 OUT Interrupt or Bulk Mode.......................................... 201 21.13.2. Endpoints1-3 OUT Isochronous Mode................................................ 201 22. SMBus0 and SMBus1 (I2C Compatible)............................................................. 205 Rev. 1.5 5 C8051F380/1/2/3/4/5/6/7/C 22.1. Supporting Documents .................................................................................. 206 22.2. SMBus Configuration..................................................................................... 206 22.3. SMBus Operation .......................................................................................... 206 22.3.1. Transmitter Vs. Receiver....................................................................... 207 22.3.2. Arbitration.............................................................................................. 207 22.3.3. Clock Low Extension............................................................................. 207 22.3.4. SCL Low Timeout.................................................................................. 207 22.3.5. SCL High (SMBus Free) Timeout ......................................................... 208 22.4. Using the SMBus........................................................................................... 208 22.4.1. SMBus Configuration Register.............................................................. 208 22.4.2. SMBus Timing Control Register............................................................ 210 22.4.3. SMBnCN Control Register .................................................................... 214 22.4.3.1. Software ACK Generation ............................................................ 214 22.4.3.2. Hardware ACK Generation ........................................................... 214 22.4.4. Hardware Slave Address Recognition .................................................. 217 22.4.5. Data Register ........................................................................................ 221 22.5. SMBus Transfer Modes................................................................................. 223 22.5.1. Write Sequence (Master) ...................................................................... 223 22.5.2. Read Sequence (Master) ...................................................................... 224 22.5.3. Write Sequence (Slave) ........................................................................ 225 22.5.4. Read Sequence (Slave) ........................................................................ 226 22.6. SMBus Status Decoding................................................................................ 226 23. UART0 ................................................................................................................... 232 23.1. Enhanced Baud Rate Generation.................................................................. 233 23.2. Operational Modes ........................................................................................ 234 23.2.1. 8-Bit UART ............................................................................................ 234 23.2.2. 9-Bit UART ............................................................................................ 235 23.3. Multiprocessor Communications ................................................................... 236 24. UART1 ................................................................................................................... 240 24.1. Baud Rate Generator .................................................................................... 241 24.2. Data Format................................................................................................... 242 24.3. Configuration and Operation ......................................................................... 243 24.3.1. Data Transmission ................................................................................ 243 24.3.2. Data Reception ..................................................................................... 243 24.3.3. Multiprocessor Communications ........................................................... 244 25. Enhanced Serial Peripheral Interface (SPI0) ..................................................... 250 25.1. Signal Descriptions........................................................................................ 251 25.1.1. Master Out, Slave In (MOSI)................................................................. 251 25.1.2. Master In, Slave Out (MISO)................................................................. 251 25.1.3. Serial Clock (SCK) ................................................................................ 251 25.1.4. Slave Select (NSS) ............................................................................... 251 25.2. SPI0 Master Mode Operation ........................................................................ 251 25.3. SPI0 Slave Mode Operation .......................................................................... 253 25.4. SPI0 Interrupt Sources .................................................................................. 254 25.5. Serial Clock Phase and Polarity .................................................................... 254 6 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 25.6. SPI Special Function Registers ..................................................................... 256 26. Timers ................................................................................................................... 263 26.1. Timer 0 and Timer 1 ...................................................................................... 266 26.1.1. Mode 0: 13-bit Counter/Timer ............................................................... 266 26.1.2. Mode 1: 16-bit Counter/Timer ............................................................... 267 26.1.3. Mode 2: 8-bit Counter/Timer with Auto-Reload..................................... 267 26.1.4. Mode 3: Two 8-bit Counter/Timers (Timer 0 Only)................................ 268 26.2. Timer 2 .......................................................................................................... 274 26.2.1. 16-bit Timer with Auto-Reload............................................................... 274 26.2.2. 8-bit Timers with Auto-Reload............................................................... 275 26.2.3. Timer 2 Capture Modes: USB Start-of-Frame or LFO Falling Edge ..... 275 26.3. Timer 3 .......................................................................................................... 281 26.3.1. 16-bit Timer with Auto-Reload............................................................... 281 26.3.2. 8-bit Timers with Auto-Reload............................................................... 282 26.3.3. Timer 3 Capture Modes: USB Start-of-Frame or LFO Falling Edge ..... 282 26.4. Timer 4 .......................................................................................................... 288 26.4.1. 16-bit Timer with Auto-Reload............................................................... 288 26.4.2. 8-bit Timers with Auto-Reload............................................................... 289 26.5. Timer 5 .......................................................................................................... 293 26.5.1. 16-bit Timer with Auto-Reload............................................................... 293 26.5.2. 8-bit Timers with Auto-Reload............................................................... 294 27. Programmable Counter Array............................................................................. 298 27.1. PCA Counter/Timer ....................................................................................... 299 27.2. PCA0 Interrupt Sources................................................................................. 300 27.3. Capture/Compare Modules ........................................................................... 301 27.3.1. Edge-triggered Capture Mode............................................................... 302 27.3.2. Software Timer (Compare) Mode.......................................................... 303 27.3.3. High-Speed Output Mode ..................................................................... 304 27.3.4. Frequency Output Mode ....................................................................... 305 27.3.5. 8-bit Pulse Width Modulator Mode ....................................................... 306 27.3.6. 16-Bit Pulse Width Modulator Mode..................................................... 307 27.4. Watchdog Timer Mode .................................................................................. 308 27.4.1. Watchdog Timer Operation ................................................................... 308 27.4.2. Watchdog Timer Usage ........................................................................ 309 27.5. Register Descriptions for PCA0..................................................................... 311 28. C2 Interface .......................................................................................................... 316 28.1. C2 Interface Registers................................................................................... 316 28.2. C2 Pin Sharing .............................................................................................. 319 Document Change List.............................................................................................. 320 Contact Information................................................................................................... 321 Rev. 1.5 7 C8051F380/1/2/3/4/5/6/7/C List of Figures Figure 1.1. C8051F380/2/4/6 Block Diagram .......................................................... 18 Figure 1.2. C8051F381/3/5/7/C Block Diagram ....................................................... 19 Figure 3.1. TQFP-48 Pinout Diagram (Top View) ................................................... 25 Figure 3.2. TQFP-48 Package Diagram .................................................................. 26 Figure 3.3. TQFP-48 Recommended PCB Land Pattern ........................................ 27 Figure 3.4. LQFP-32 Pinout Diagram (Top View) .................................................... 28 Figure 3.5. LQFP-32 Package Diagram .................................................................. 29 Figure 3.6. LQFP-32 Recommended PCB Land Pattern ........................................ 30 Figure 3.7. QFN-32 Pinout Diagram (Top View) ..................................................... 31 Figure 3.8. QFN-32 Package Drawing .................................................................... 32 Figure 3.9. QFN-32 Recommended PCB Land Pattern .......................................... 33 Figure 4.1. Connection Diagram with Voltage Regulator Used and No USB .......... 34 Figure 4.2. Connection Diagram with Voltage Regulator Not Used and No USB ... 34 Figure 4.3. Connection Diagram with Voltage Regulator Used and USB Connected (Bus-Powered) ................................................................................................... 35 Figure 4.4. Connection Diagram with Voltage Regulator Used and USB Connected (Self-Powered) ................................................................................................... 35 Figure 4.5. Connection Diagram for USB Pins ........................................................ 36 Figure 4.6. Connection Diagram for Internal Voltage Reference ............................. 36 Figure 6.1. ADC0 Functional Block Diagram ........................................................... 46 Figure 6.2. Typical Temperature Sensor Transfer Function .................................... 48 Figure 6.3. Temperature Sensor Error with 1-Point Calibration .............................. 49 Figure 6.4. 10-Bit ADC Track and Conversion Example Timing ............................. 51 Figure 6.5. ADC0 Equivalent Input Circuits ............................................................. 52 Figure 6.6. ADC Window Compare Example: Right-Justified Data ......................... 58 Figure 6.7. ADC Window Compare Example: Left-Justified Data ........................... 58 Figure 7.1. Voltage Reference Functional Block Diagram ....................................... 62 Figure 8.1. Comparator0 Functional Block Diagram ............................................... 64 Figure 8.2. Comparator1 Functional Block Diagram ............................................... 65 Figure 8.3. Comparator Hysteresis Plot .................................................................. 66 Figure 8.4. Comparator Input Multiplexer Block Diagram ........................................ 71 Figure 11.1. CIP-51 Block Diagram ......................................................................... 79 Figure 13.1. On-Chip Memory Map for 64 kB Devices (C8051F380/1/4/5) ............. 89 Figure 13.2. On-Chip Memory Map for 32 kB Devices (C8051F382/3/6/7) ............. 90 Figure 13.3. On-Chip Memory Map for 16 kB Devices (C8051F38C) ..................... 91 Figure 14.1. USB FIFO Space and XRAM Memory Map with USBFAE set to ‘1’ ... 94 Figure 14.2. Multiplexed Configuration Example ..................................................... 98 Figure 14.3. Non-multiplexed Configuration Example ............................................. 99 Figure 14.4. EMIF Operating Modes ..................................................................... 100 Figure 14.5. Non-Multiplexed 16-bit MOVX Timing ............................................... 104 Figure 14.6. Non-multiplexed 8-bit MOVX without Bank Select Timing ................ 105 Figure 14.7. Non-multiplexed 8-bit MOVX with Bank Select Timing ..................... 106 Figure 14.8. Multiplexed 16-bit MOVX Timing ....................................................... 107 Rev. 1.5 8 C8051F380/1/2/3/4/5/6/7/C Figure 14.9. Multiplexed 8-bit MOVX without Bank Select Timing ........................ 108 Figure 14.10. Multiplexed 8-bit MOVX with Bank Select Timing ........................... 109 Figure 17.1. Reset Sources ................................................................................... 129 Figure 17.2. Power-On and VDD Monitor Reset Timing ....................................... 130 Figure 18.1. Flash Program Memory Map and Security Byte ................................ 137 Figure 19.1. Oscillator Options .............................................................................. 142 Figure 19.2. External Crystal Example .................................................................. 150 Figure 20.1. Port I/O Functional Block Diagram (Port 0 through Port 3) ............... 153 Figure 20.2. Port I/O Cell Block Diagram .............................................................. 154 Figure 20.3. Peripheral Availability on Port I/O Pins .............................................. 155 Figure 20.4. Crossbar Priority Decoder in Example Configuration (No Pins Skipped) ............................................................................................ 156 Figure 20.5. Crossbar Priority Decoder in Example Configuration (3 Pins Skipped) ............................................................................................................. 157 Figure 21.1. USB0 Block Diagram ......................................................................... 172 Figure 21.2. USB0 Register Access Scheme ........................................................ 175 Figure 21.3. USB FIFO Allocation ......................................................................... 181 Figure 22.1. SMBus Block Diagram ...................................................................... 205 Figure 22.2. Typical SMBus Configuration ............................................................ 206 Figure 22.3. SMBus Transaction ........................................................................... 207 Figure 22.4. Typical SMBus SCL Generation ........................................................ 209 Figure 22.5. Typical Master Write Sequence ........................................................ 223 Figure 22.6. Typical Master Read Sequence ........................................................ 224 Figure 22.7. Typical Slave Write Sequence .......................................................... 225 Figure 22.8. Typical Slave Read Sequence .......................................................... 226 Figure 23.1. UART0 Block Diagram ...................................................................... 232 Figure 23.2. UART0 Baud Rate Logic ................................................................... 233 Figure 23.3. UART Interconnect Diagram ............................................................. 234 Figure 23.4. 8-Bit UART Timing Diagram .............................................................. 234 Figure 23.5. 9-Bit UART Timing Diagram .............................................................. 235 Figure 23.6. UART Multi-Processor Mode Interconnect Diagram ......................... 236 Figure 24.1. UART1 Block Diagram ...................................................................... 240 Figure 24.2. UART1 Timing Without Parity or Extra Bit ......................................... 242 Figure 24.3. UART1 Timing With Parity ................................................................ 242 Figure 24.4. UART1 Timing With Extra Bit ............................................................ 242 Figure 24.5. Typical UART Interconnect Diagram ................................................. 243 Figure 24.6. UART Multi-Processor Mode Interconnect Diagram ......................... 244 Figure 25.1. SPI Block Diagram ............................................................................ 250 Figure 25.2. Multiple-Master Mode Connection Diagram ...................................... 252 Figure 25.3. 3-Wire Single Master and 3-Wire Single Slave Mode Connection Diagram ............................................................................................................. 252 Figure 25.4. 4-Wire Single Master Mode and 4-Wire Slave Mode Connection Diagram ............................................................................................................. 253 Figure 25.5. Master Mode Data/Clock Timing ....................................................... 255 Figure 25.6. Slave Mode Data/Clock Timing (CKPHA = 0) ................................... 255 9 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Figure 25.7. Slave Mode Data/Clock Timing (CKPHA = 1) ................................... 256 Figure 25.8. SPI Master Timing (CKPHA = 0) ....................................................... 260 Figure 25.9. SPI Master Timing (CKPHA = 1) ....................................................... 260 Figure 25.10. SPI Slave Timing (CKPHA = 0) ....................................................... 261 Figure 25.11. SPI Slave Timing (CKPHA = 1) ....................................................... 261 Figure 26.1. T0 Mode 0 Block Diagram ................................................................. 267 Figure 26.2. T0 Mode 2 Block Diagram ................................................................. 268 Figure 26.3. T0 Mode 3 Block Diagram ................................................................. 269 Figure 26.4. Timer 2 16-Bit Mode Block Diagram ................................................. 274 Figure 26.5. Timer 2 8-Bit Mode Block Diagram ................................................... 275 Figure 26.6. Timer 2 Capture Mode (T2SPLIT = 0) ............................................... 276 Figure 26.7. Timer 2 Capture Mode (T2SPLIT = 0) ............................................... 277 Figure 26.8. Timer 3 16-Bit Mode Block Diagram ................................................. 281 Figure 26.9. Timer 3 8-Bit Mode Block Diagram ................................................... 282 Figure 26.10. Timer 3 Capture Mode (T3SPLIT = 0) ............................................. 283 Figure 26.11. Timer 3 Capture Mode (T3SPLIT = 0) ............................................. 284 Figure 26.12. Timer 4 16-Bit Mode Block Diagram ............................................... 288 Figure 26.13. Timer 4 8-Bit Mode Block Diagram ................................................. 289 Figure 26.14. Timer 5 16-Bit Mode Block Diagram ............................................... 293 Figure 26.15. Timer 5 8-Bit Mode Block Diagram ................................................. 294 Figure 27.1. PCA Block Diagram ........................................................................... 298 Figure 27.2. PCA Counter/Timer Block Diagram ................................................... 299 Figure 27.3. PCA Interrupt Block Diagram ............................................................ 300 Figure 27.4. PCA Capture Mode Diagram ............................................................. 302 Figure 27.5. PCA Software Timer Mode Diagram ................................................. 303 Figure 27.6. PCA High-Speed Output Mode Diagram ........................................... 304 Figure 27.7. PCA Frequency Output Mode ........................................................... 305 Figure 27.8. PCA 8-Bit PWM Mode Diagram ........................................................ 306 Figure 27.9. PCA 16-Bit PWM Mode ..................................................................... 307 Figure 27.10. PCA Module 4 with Watchdog Timer Enabled ................................ 308 Figure 28.1. Typical C2 Pin Sharing ...................................................................... 319 Rev. 1.5 10 C8051F380/1/2/3/4/5/6/7/C List of Tables Table 1.1. Product Selection Guide ......................................................................... 17 Table 2.1. C8051F38x Replacement Part Numbers ................................................ 20 Table 3.1. Pin Definitions for the C8051F380/1/2/3/4/5/6/7/C ................................. 22 Table 3.2. TQFP-48 Package Dimensions .............................................................. 26 Table 3.3. TQFP-48 PCB Land Pattern Dimensions ............................................... 27 Table 3.4. LQFP-32 Package Dimensions .............................................................. 29 Table 3.5. LQFP-32 PCB Land Pattern Dimensions ............................................... 30 Table 3.6. QFN-32 Package Dimensions ................................................................ 32 Table 3.7. QFN-32 PCB Land Pattern Dimensions ................................................. 33 Table 5.1. Absolute Maximum Ratings .................................................................... 37 Table 5.2. Global Electrical Characteristics ............................................................. 38 Table 5.3. Port I/O DC Electrical Characteristics ..................................................... 39 Table 5.4. Reset Electrical Characteristics .............................................................. 39 Table 5.5. Internal Voltage Regulator Electrical Characteristics ............................. 40 Table 5.6. Flash Electrical Characteristics .............................................................. 40 Table 5.7. Internal High-Frequency Oscillator Electrical Characteristics ................. 41 Table 5.8. Internal Low-Frequency Oscillator Electrical Characteristics ................. 41 Table 5.9. External Oscillator Electrical Characteristics .......................................... 41 Table 5.10. ADC0 Electrical Characteristics ............................................................ 42 Table 5.11. Temperature Sensor Electrical Characteristics .................................... 43 Table 5.12. Voltage Reference Electrical Characteristics ....................................... 43 Table 5.13. Comparator Electrical Characteristics .................................................. 44 Table 5.14. USB Transceiver Electrical Characteristics .......................................... 45 Table 11.1. CIP-51 Instruction Set Summary .......................................................... 81 Table 14.1. AC Parameters for External Memory Interface ................................... 110 Table 15.1. Special Function Register (SFR) Memory Map .................................. 112 Table 15.2. Special Function Registers ................................................................. 113 Table 16.1. Interrupt Summary .............................................................................. 120 Table 21.1. Endpoint Addressing Scheme ............................................................ 173 Table 21.2. USB0 Controller Registers ................................................................. 178 Table 21.3. FIFO Configurations ........................................................................... 182 Table 22.1. SMBus Clock Source Selection .......................................................... 209 Table 22.2. Minimum SDA Setup and Hold Times ................................................ 210 Table 22.3. Sources for Hardware Changes to SMBnCN ..................................... 217 Table 22.4. Hardware Address Recognition Examples (EHACK = 1) ................... 218 Table 22.5. SMBus Status Decoding: Hardware ACK Disabled (EHACK = 0) ...... 227 Table 22.6. SMBus Status Decoding: Hardware ACK Enabled (EHACK = 1) ...... 229 Table 23.1. Timer Settings for Standard Baud Rates Using Internal Oscillator ..... 238 Table 24.1. Baud Rate Generator Settings for Standard Baud Rates ................... 241 Table 25.1. SPI Slave Timing Parameters ............................................................ 262 Table 27.1. PCA Timebase Input Options ............................................................. 299 Table 27.2. PCA0CPM Bit Settings for PCA Capture/Compare Modules ............. 301 Table 27.3. Watchdog Timer Timeout Intervals1 ................................................... 310 Rev. 1.5 11 C8051F380/1/2/3/4/5/6/7/C List of Registers SFR Definition 6.1. ADC0CF: ADC0 Configuration ...................................................... 53 SFR Definition 6.2. ADC0H: ADC0 Data Word MSB .................................................... 54 SFR Definition 6.3. ADC0L: ADC0 Data Word LSB ...................................................... 54 SFR Definition 6.4. ADC0CN: ADC0 Control ................................................................ 55 SFR Definition 6.5. ADC0GTH: ADC0 Greater-Than Data High Byte .......................... 56 SFR Definition 6.6. ADC0GTL: ADC0 Greater-Than Data Low Byte ............................ 56 SFR Definition 6.7. ADC0LTH: ADC0 Less-Than Data High Byte ................................ 57 SFR Definition 6.8. ADC0LTL: ADC0 Less-Than Data Low Byte ................................. 57 SFR Definition 6.9. AMX0P: AMUX0 Positive Channel Select ..................................... 60 SFR Definition 6.10. AMX0N: AMUX0 Negative Channel Select ................................. 61 SFR Definition 7.1. REF0CN: Reference Control ......................................................... 63 SFR Definition 8.1. CPT0CN: Comparator0 Control ..................................................... 67 SFR Definition 8.2. CPT0MD: Comparator0 Mode Selection ....................................... 68 SFR Definition 8.3. CPT1CN: Comparator1 Control ..................................................... 69 SFR Definition 8.4. CPT1MD: Comparator1 Mode Selection ....................................... 70 SFR Definition 8.5. CPT0MX: Comparator0 MUX Selection ........................................ 72 SFR Definition 8.6. CPT1MX: Comparator1 MUX Selection ........................................ 73 SFR Definition 9.1. REG01CN: Voltage Regulator Control .......................................... 75 SFR Definition 10.1. PCON: Power Control .................................................................. 78 SFR Definition 11.1. DPL: Data Pointer Low Byte ........................................................ 85 SFR Definition 11.2. DPH: Data Pointer High Byte ....................................................... 85 SFR Definition 11.3. SP: Stack Pointer ......................................................................... 86 SFR Definition 11.4. ACC: Accumulator ....................................................................... 86 SFR Definition 11.5. B: B Register ................................................................................ 86 SFR Definition 11.6. PSW: Program Status Word ........................................................ 87 SFR Definition 12.1. PFE0CN: Prefetch Engine Control .............................................. 88 SFR Definition 14.1. EMI0CN: External Memory Interface Control .............................. 96 SFR Definition 14.2. EMI0CF: External Memory Interface Configuration ..................... 97 SFR Definition 14.3. EMI0TC: External Memory TIming Control ................................ 103 SFR Definition 15.1. SFRPAGE: SFR Page ............................................................... 111 SFR Definition 16.1. IE: Interrupt Enable .................................................................... 121 SFR Definition 16.2. IP: Interrupt Priority .................................................................... 122 SFR Definition 16.3. EIE1: Extended Interrupt Enable 1 ............................................ 123 SFR Definition 16.4. EIP1: Extended Interrupt Priority 1 ............................................ 124 SFR Definition 16.5. EIE2: Extended Interrupt Enable 2 ............................................ 125 SFR Definition 16.6. EIP2: Extended Interrupt Priority 2 ............................................ 126 SFR Definition 16.7. IT01CF: INT0/INT1 ConfigurationO ........................................... 128 SFR Definition 17.1. VDM0CN: VDD Monitor Control ................................................ 132 SFR Definition 17.2. RSTSRC: Reset Source ............................................................ 134 SFR Definition 18.1. PSCTL: Program Store R/W Control ......................................... 139 SFR Definition 18.2. FLKEY: Flash Lock and Key ...................................................... 140 SFR Definition 18.3. FLSCL: Flash Scale ................................................................... 141 SFR Definition 19.1. CLKSEL: Clock Select ............................................................... 144 Rev. 1.5 12 C8051F380/1/2/3/4/5/6/7/C SFR Definition 19.2. OSCICL: Internal H-F Oscillator Calibration .............................. 145 SFR Definition 19.3. OSCICN: Internal H-F Oscillator Control ................................... 146 SFR Definition 19.4. CLKMUL: Clock Multiplier Control ............................................. 147 SFR Definition 19.5. OSCLCN: Internal L-F Oscillator Control ................................... 148 SFR Definition 19.6. OSCXCN: External Oscillator Control ........................................ 152 SFR Definition 20.1. XBR0: Port I/O Crossbar Register 0 .......................................... 159 SFR Definition 20.2. XBR1: Port I/O Crossbar Register 1 .......................................... 160 SFR Definition 20.3. XBR2: Port I/O Crossbar Register 2 .......................................... 161 SFR Definition 20.4. P0: Port 0 ................................................................................... 162 SFR Definition 20.5. P0MDIN: Port 0 Input Mode ....................................................... 162 SFR Definition 20.6. P0MDOUT: Port 0 Output Mode ................................................ 163 SFR Definition 20.7. P0SKIP: Port 0 Skip ................................................................... 163 SFR Definition 20.8. P1: Port 1 ................................................................................... 164 SFR Definition 20.9. P1MDIN: Port 1 Input Mode ....................................................... 164 SFR Definition 20.10. P1MDOUT: Port 1 Output Mode .............................................. 165 SFR Definition 20.11. P1SKIP: Port 1 Skip ................................................................. 165 SFR Definition 20.12. P2: Port 2 ................................................................................. 166 SFR Definition 20.13. P2MDIN: Port 2 Input Mode ..................................................... 166 SFR Definition 20.14. P2MDOUT: Port 2 Output Mode .............................................. 167 SFR Definition 20.15. P2SKIP: Port 2 Skip ................................................................. 167 SFR Definition 20.16. P3: Port 3 ................................................................................. 168 SFR Definition 20.17. P3MDIN: Port 3 Input Mode ..................................................... 168 SFR Definition 20.18. P3MDOUT: Port 3 Output Mode .............................................. 169 SFR Definition 20.19. P3SKIP: Port 3 Skip ................................................................. 169 SFR Definition 20.20. P4: Port 4 ................................................................................. 170 SFR Definition 20.21. P4MDIN: Port 4 Input Mode ..................................................... 170 SFR Definition 20.22. P4MDOUT: Port 4 Output Mode .............................................. 171 SFR Definition 21.1. USB0XCN: USB0 Transceiver Control ...................................... 174 SFR Definition 21.2. USB0ADR: USB0 Indirect Address ........................................... 176 SFR Definition 21.3. USB0DAT: USB0 Data .............................................................. 177 USB Register Definition 21.4. INDEX: USB0 Endpoint Index ..................................... 179 USB Register Definition 21.5. CLKREC: Clock Recovery Control .............................. 180 USB Register Definition 21.6. FIFOn: USB0 Endpoint FIFO Access .......................... 182 USB Register Definition 21.7. FADDR: USB0 Function Address ............................... 183 USB Register Definition 21.8. POWER: USB0 Power ................................................ 185 USB Register Definition 21.9. FRAMEL: USB0 Frame Number Low ......................... 186 USB Register Definition 21.10. FRAMEH: USB0 Frame Number High ...................... 186 USB Register Definition 21.11. IN1INT: USB0 IN Endpoint Interrupt ......................... 187 USB Register Definition 21.12. OUT1INT: USB0 OUT Endpoint Interrupt ................. 188 USB Register Definition 21.13. CMINT: USB0 Common Interrupt ............................. 189 USB Register Definition 21.14. IN1IE: USB0 IN Endpoint Interrupt Enable ............... 190 USB Register Definition 21.15. OUT1IE: USB0 OUT Endpoint Interrupt Enable ....... 191 USB Register Definition 21.16. CMIE: USB0 Common Interrupt Enable .................... 192 USB Register Definition 21.17. E0CSR: USB0 Endpoint0 Control ............................. 195 USB Register Definition 21.18. E0CNT: USB0 Endpoint0 Data Count ....................... 196 13 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C USB Register Definition 21.19. EENABLE: USB0 Endpoint Enable ........................... 197 USB Register Definition 21.20. EINCSRL: USB0 IN Endpoint Control Low ............... 199 USB Register Definition 21.21. EINCSRH: USB0 IN Endpoint Control High .............. 200 USB Register Definition 21.22. EOUTCSRL: USB0 OUT Endpoint Control Low Byte 202 USB Register Definition 21.23. EOUTCSRH: USB0 OUT Endpoint Control High Byte .... 203 USB Register Definition 21.24. EOUTCNTL: USB0 OUT Endpoint Count Low ......... 203 USB Register Definition 21.25. EOUTCNTH: USB0 OUT Endpoint Count High ........ 204 SFR Definition 22.1. SMB0CF: SMBus Clock/Configuration ...................................... 211 SFR Definition 22.2. SMB1CF: SMBus Clock/Configuration ...................................... 212 SFR Definition 22.3. SMBTC: SMBus Timing Control ................................................ 213 SFR Definition 22.4. SMB0CN: SMBus Control .......................................................... 215 SFR Definition 22.5. SMB1CN: SMBus Control .......................................................... 216 SFR Definition 22.6. SMB0ADR: SMBus0 Slave Address .......................................... 218 SFR Definition 22.7. SMB0ADM: SMBus0 Slave Address Mask ................................ 219 SFR Definition 22.8. SMB1ADR: SMBus1 Slave Address .......................................... 219 SFR Definition 22.9. SMB1ADM: SMBus1 Slave Address Mask ................................ 220 SFR Definition 22.10. SMB0DAT: SMBus Data .......................................................... 221 SFR Definition 22.11. SMB1DAT: SMBus Data .......................................................... 222 SFR Definition 23.1. SCON0: Serial Port 0 Control .................................................... 237 SFR Definition 23.2. SBUF0: Serial (UART0) Port Data Buffer .................................. 238 SFR Definition 24.1. SCON1: UART1 Control ............................................................ 245 SFR Definition 24.2. SMOD1: UART1 Mode .............................................................. 246 SFR Definition 24.3. SBUF1: UART1 Data Buffer ...................................................... 247 SFR Definition 24.4. SBCON1: UART1 Baud Rate Generator Control ...................... 248 SFR Definition 24.5. SBRLH1: UART1 Baud Rate Generator High Byte ................... 248 SFR Definition 24.6. SBRLL1: UART1 Baud Rate Generator Low Byte ..................... 249 SFR Definition 25.1. SPI0CFG: SPI0 Configuration ................................................... 257 SFR Definition 25.2. SPI0CN: SPI0 Control ............................................................... 258 SFR Definition 25.3. SPI0CKR: SPI0 Clock Rate ....................................................... 259 SFR Definition 25.4. SPI0DAT: SPI0 Data ................................................................. 259 SFR Definition 26.1. CKCON: Clock Control .............................................................. 264 SFR Definition 26.2. CKCON1: Clock Control 1 ......................................................... 265 SFR Definition 26.3. TCON: Timer Control ................................................................. 270 SFR Definition 26.4. TMOD: Timer Mode ................................................................... 271 SFR Definition 26.5. TL0: Timer 0 Low Byte ............................................................... 272 SFR Definition 26.6. TL1: Timer 1 Low Byte ............................................................... 272 SFR Definition 26.7. TH0: Timer 0 High Byte ............................................................. 273 SFR Definition 26.8. TH1: Timer 1 High Byte ............................................................. 273 SFR Definition 26.9. TMR2CN: Timer 2 Control ......................................................... 278 SFR Definition 26.10. TMR2RLL: Timer 2 Reload Register Low Byte ........................ 279 SFR Definition 26.11. TMR2RLH: Timer 2 Reload Register High Byte ...................... 279 SFR Definition 26.12. TMR2L: Timer 2 Low Byte ....................................................... 279 SFR Definition 26.13. TMR2H Timer 2 High Byte ....................................................... 280 SFR Definition 26.14. TMR3CN: Timer 3 Control ....................................................... 285 Rev. 1.5 14 C8051F380/1/2/3/4/5/6/7/C SFR Definition 26.15. TMR3RLL: Timer 3 Reload Register Low Byte ........................ 286 SFR Definition 26.16. TMR3RLH: Timer 3 Reload Register High Byte ...................... 286 SFR Definition 26.17. TMR3L: Timer 3 Low Byte ....................................................... 286 SFR Definition 26.18. TMR3H Timer 3 High Byte ....................................................... 287 SFR Definition 26.19. TMR4CN: Timer 4 Control ....................................................... 290 SFR Definition 26.20. TMR4RLL: Timer 4 Reload Register Low Byte ........................ 291 SFR Definition 26.21. TMR4RLH: Timer 4 Reload Register High Byte ...................... 291 SFR Definition 26.22. TMR4L: Timer 4 Low Byte ....................................................... 291 SFR Definition 26.23. TMR4H Timer 4 High Byte ....................................................... 292 SFR Definition 26.24. TMR5CN: Timer 5 Control ....................................................... 295 SFR Definition 26.25. TMR5RLL: Timer 5 Reload Register Low Byte ........................ 296 SFR Definition 26.26. TMR5RLH: Timer 5 Reload Register High Byte ...................... 296 SFR Definition 26.27. TMR5L: Timer 5 Low Byte ....................................................... 296 SFR Definition 26.28. TMR5H Timer 5 High Byte ....................................................... 297 SFR Definition 27.1. PCA0CN: PCA Control .............................................................. 311 SFR Definition 27.2. PCA0MD: PCA Mode ................................................................ 312 SFR Definition 27.3. PCA0CPMn: PCA Capture/Compare Mode .............................. 313 SFR Definition 27.4. PCA0L: PCA Counter/Timer Low Byte ...................................... 314 SFR Definition 27.5. PCA0H: PCA Counter/Timer High Byte ..................................... 314 SFR Definition 27.6. PCA0CPLn: PCA Capture Module Low Byte ............................. 315 SFR Definition 27.7. PCA0CPHn: PCA Capture Module High Byte ........................... 315 C2 Register Definition 28.1. C2ADD: C2 Address ...................................................... 316 C2 Register Definition 28.2. DEVICEID: C2 Device ID ............................................... 317 C2 Register Definition 28.3. REVID: C2 Revision ID .................................................. 317 C2 Register Definition 28.4. FPCTL: C2 Flash Programming Control ........................ 318 C2 Register Definition 28.5. FPDAT: C2 Flash Programming Data ............................ 318 15 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 1. System Overview C8051F380/1/2/3/4/5/6/7/C devices are fully integrated mixed-signal System-on-a-Chip MCUs. Highlighted features are listed below. Refer to Table 1.1 for specific product feature selection.             High-speed pipelined 8051-compatible microcontroller core (up to 48 MIPS) In-system, full-speed, non-intrusive debug interface (on-chip) Universal Serial Bus (USB) Function Controller with eight flexible endpoint pipes, integrated transceiver, and 1 kB FIFO RAM Supply Voltage Regulator True 10-bit 500 ksps differential / single-ended ADC with analog multiplexer On-chip Voltage Reference and Temperature Sensor On-chip Voltage Comparators (2) Precision internal calibrated 48 MHz internal oscillator Internal low-frequency oscillator for additional power savings Up to 64 kB of on-chip Flash memory Up to 4352 Bytes of on-chip RAM (256 + 4 kB) External Memory Interface (EMIF) available on 48-pin versions. 2 I2C/SMBus, 2 UARTs, and Enhanced SPI serial interfaces implemented in hardware  Four general-purpose 16-bit timers  Programmable Counter/Timer Array (PCA) with five capture/compare modules and Watchdog Timer function  On-chip Power-On Reset, VDD Monitor, and Missing Clock Detector   Up to 40 Port I/O (5 V tolerant) With on-chip Power-On Reset, VDD monitor, Voltage Regulator, Watchdog Timer, and clock oscillator, C8051F380/1/2/3/4/5/6/7/C devices are truly stand-alone System-on-a-Chip solutions. The Flash memory can be reprogrammed in-circuit, providing non-volatile data storage, and also allowing field upgrades of the 8051 firmware. User software has complete control of all peripherals, and may individually shut down any or all peripherals for power savings. The on-chip Silicon Labs 2-Wire (C2) Development Interface allows non-intrusive (uses no on-chip resources), full speed, in-circuit debugging using the production MCU installed in the final application. This debug logic supports inspection and modification of memory and registers, setting breakpoints, single stepping, run and halt commands. All analog and digital peripherals are fully functional while debugging using C2. The two C2 interface pins can be shared with user functions, allowing in-system debugging without occupying package pins. Each device is specified for 2.7–5.25 V operation over the industrial temperature range (–40 to +85 °C). For voltages above 3.6 V, the on-chip Voltage Regulator must be used. A minimum of 3.0 V is required for USB communication. The Port I/O and RST pins are tolerant of input signals up to 5 V. C8051F380/1/2/3/ 4/5/6/7/C devices are available in 48-pin TQFP, 32-pin LQFP, or 32-pin QFN packages. See Table 1.1, “Product Selection Guide,” on page 20 for feature and package choices. Rev. 1.5 19 C8051F380/1/2/3/4/5/6/7/C 64k 4352     2  2 6  25 —    2 LQFP32 C8051F381-GM 48 64k 4352     2  2 6  25 —    2 QFN32 C8051F382-GQ 48 32k 2304     2  2 6  40     2 TQFP48 C8051F383-GQ 48 32k 2304     2  2 6  25 —    2 LQFP32 C8051F383-GM 48 32k 2304     2  2 6  25 —    2 QFN32 C8051F384-GQ 48 64k 4352     2  2 6  40  — — — 2 TQFP48 C8051F385-GQ 48 64k 4352     2  2 6  25 — — — — 2 LQFP32 C8051F385-GM 48 64k 4352     2  2 6  25 — — — — 2 QFN32 C8051F386-GQ 48 32k 2304     2  2 6  40  — — — 2 TQFP48 C8051F387-GQ 48 32k 2304     2  2 6  25 — — — — 2 LQFP32 C8051F387-GM 48 32k 2304     2  2 6  25 — — — — 2 QFN32 C8051F38C-GQ 48 16k 2304     2  2 6  25 —    2 LQFP32 C8051F38C-GM 48 16k 2304     2  2 6  25 —    2 QFN32 20 Rev. 1.5 Package 48 Analog Comparators C8051F381-GQ Voltage Reference TQFP48 Temperature Sensor     2 10-bit 500ksps ADC Programmable Counter Array  40 Digital Port I/O Timers (16-bit) 6 UARTs  2 Enhanced SPI     2 SMBus/I2C 4352 Supply Voltage Regulator RAM 64k USB with 1k Endpoint RAM Flash Memory (Bytes) 48 Low Frequency Oscillator MIPS (Peak) C8051F380-GQ Calibrated Internal Oscillator Ordering Part Number External Memory Interface (EMIF) Table 1.1. Product Selection Guide C8051F380/1/2/3/4/5/6/7/C C2D Port I/O Configuration Debug / Programming Hardware C2CK/RST UART0 Reset Power-On Reset Supply Monitor VDD Power Net VREG Voltage Regulators Port 0 Drivers P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6/XTAL1 P0.7/XTAL2 Port 1 Drivers P1.0 P1.1 P1.2 P1.3 P1.4/CNVSTR P1.5/VREF P1.6 P1.7 Port 2 Drivers P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 Port 3 Drivers P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 Port 4 Drivers P4.0 P4.1 P4.2 P4.3 P4.4 P4.5 P4.6 P4.7 Digital Peripherals CIP-51 8051 Controller Core UART1 Timers 0, 1, 2, 3, 4, 5 64/32k Byte ISP FLASH Program Memory Priority Crossbar Decoder PCA/WDT SMBus0 256 Byte RAM SMBus1 SPI 4/2k Byte XRAM Crossbar Control GND System Clock Setup XTAL1 XTAL2 SFR Bus External Memory Interface External Oscillator P1 Control P2 / P3 Address Internal Oscillator P4 Data Clock Recovery Low Freq. Oscillator Analog Peripherals CP0 VREF USB Peripheral D+ D- VBUS Full / Low Speed Transceiver VDD VREF + + - 2 Comparators Controller 1k Byte RAM CP1 10-bit 500ksps ADC A M U X VDD AIN0 - AIN19 Temp Sensor Figure 1.1. C8051F380/2/4/6 Block Diagram Rev. 1.5 21 C8051F380/1/2/3/4/5/6/7/C C2D Port I/O Configuration Debug / Programming Hardware C2CK/RST UART0 Reset Power-On Reset Supply Monitor VDD Power Net VREG Voltage Regulators CIP-51 8051 Controller Core Port 1 Drivers P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 Port 2 Drivers P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 UART1 Timers 0, 1, 2, 3, 4, 5 64/32/16 kB ISP FLASH Program Memory Priority Crossbar Decoder PCA/WDT 256 Byte RAM SMBus0 SMBus1 4/2 kB XRAM SPI GND System Clock Setup XTAL1 XTAL2 Port 0 Drivers P0.0 P0.1 P0.2/XTAL1 P0.3/XTAL2 P0.4 P0.5 P0.6/CNVSTR P0.7/VREF Digital Peripherals SFR Bus Crossbar Control P3.0/C2D Port 3 Drivers External Oscillator Internal Oscillator Clock Recovery Low Freq. Oscillator Analog Peripherals CP0 VREF USB Peripheral D+ D- VBUS Full / Low Speed Transceiver VDD VREF + + - 2 Comparators Controller 1 kB RAM CP1 10-bit 500 ksps ADC A M U X VDD AIN0 - AIN20 Temp Sensor Figure 1.2. C8051F381/3/5/7/C Block Diagram 22 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 2. C8051F34x Compatibility The C8051F38x family is designed to be a pin and code compatible replacement for the C8051F34x device family, with an enhanced feature set. The C8051F38x device should function as a drop-in replacement for the C8051F34x devices in most applications. Table 2.1 lists recommended replacement part numbers for C8051F34x devices. See “2.1. Hardware Incompatibilities” to determine if any changes are necessary when upgrading an existing C8051F34x design to the C8051F38x. Table 2.1. C8051F38x Replacement Part Numbers C8051F34x Part Number C8051F38x Part Number C8051F340-GQ C8051F380-GQ C8051F341-GQ C8051F382-GQ C8051F342-GQ C8051F381-GQ C8051F342-GM C8051F381-GM C8051F343-GQ C8051F383-GQ C8051F343-GM C8051F383-GM C8051F344-GQ C8051F380-GQ C8051F345-GQ C8051F382-GQ C8051F346-GQ C8051F381-GQ C8051F346-GM C8051F381-GM C8051F347-GQ C8051F383-GQ C8051F347-GM C8051F383-GM C8051F348-GQ C8051F386-GQ C8051F349-GQ C8051F387-GQ C8051F349-GM C8051F387-GM C8051F34A-GQ C8051F381-GQ C8051F34A-GM C8051F381-GM C8051F34B-GQ C8051F383-GQ C8051F34B-GM C8051F383-GM C8051F34C-GQ C8051F384-GQ C8051F34D-GQ C8051F385-GQ Rev. 1.5 23 C8051F380/1/2/3/4/5/6/7/C 2.1. Hardware Incompatibilities While the C8051F38x family includes a number of new features not found on the C8051F34x family, there are some differences that should be considered for any design port.  Clock Multiplier: The C8051F38x does not include the 4x clock multiplier from the C8051F34x device families. This change only impacts systems which use the clock multiplier in conjunction with an external oscillator source.  External Oscillator C and RC Modes: The C and RC modes of the oscillator have a divide-by-2 stage on the C8051F38x to aid in noise immunity. This was not present on the C8051F34x device family, and any clock generated with C or RC mode will change accordingly.  Fab Technology: The C8051F38x is manufactured using a different technology process than the C8051F34x. As a result, many of the electrical performance parameters will have subtle differences. These differences should not affect most systems but it is nonetheless important to review the electrical parameters for any blocks that are used in the design, and ensure they are compatible with the existing hardware. 24 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 3. Pinout and Package Definitions Table 3.1. Pin Definitions for the C8051F380/1/2/3/4/5/6/7/C Name Pin Numbers Type Description 48-pin 32-pin VDD 10 6 Power In 2.7–3.6 V Power Supply Voltage Input. Power Out GND 7 3 RST/ 13 9 C2CK 3.3 V Voltage Regulator Output. Ground. D I/O Device Reset. Open-drain output of internal POR or VDD monitor. An external source can initiate a system reset by driving this pin low for at least 15 µs. D I/O Clock signal for the C2 Debug Interface. C2D 14 — D I/O Bi-directional data signal for the C2 Debug Interface. P3.0 / — 10 D I/O Port 3.0. See Section 20 for a complete description of Port 3. D I/O Bi-directional data signal for the C2 Debug Interface. C2D REGIN 11 7 Power In 5 V Regulator Input. This pin is the input to the on-chip voltage regulator. VBUS 12 8 D In VBUS Sense Input. This pin should be connected to the VBUS signal of a USB network. A 5 V signal on this pin indicates a USB network connection. D+ 8 4 D I/O USB D+. D– 9 5 D I/O USB D–. P0.0 6 2 D I/O or Port 0.0. See Section 20 for a complete description of Port 0. A In P0.1 5 1 D I/O or Port 0.1. A In P0.2 4 32 D I/O or Port 0.2. A In P0.3 3 31 D I/O or Port 0.3. A In P0.4 2 30 D I/O or Port 0.4. A In P0.5 1 29 D I/O or Port 0.5. A In P0.6 48 28 D I/O or Port 0.6. A In Rev. 1.5 25 C8051F380/1/2/3/4/5/6/7/C Table 3.1. Pin Definitions for the C8051F380/1/2/3/4/5/6/7/C (Continued) Name Pin Numbers Type Description 48-pin 32-pin P0.7 47 27 D I/O or Port 0.7. A In P1.0 46 26 D I/O or Port 1.0. See Section 20 for a complete description of Port 1. A In P1.1 45 25 D I/O or Port 1.1. A In P1.2 44 24 D I/O or Port 1.2. A In P1.3 43 23 D I/O or Port 1.3. A In P1.4 42 22 D I/O or Port 1.4. A In P1.5 41 21 D I/O or Port 1.5. A In P1.6 40 20 D I/O or Port 1.6. A In P1.7 39 19 D I/O or Port 1.7. A In P2.0 38 18 D I/O or Port 2.0. See Section 20 for a complete description of Port 2. A In P2.1 37 17 D I/O or Port 2.1. A In P2.2 36 16 D I/O or Port 2.2. A In P2.3 35 15 D I/O or Port 2.3. A In P2.4 34 14 D I/O or Port 2.4. A In P2.5 33 13 D I/O or Port 2.5. A In P2.6 32 12 D I/O or Port 2.6. A In P2.7 31 11 D I/O or Port 2.7. A In P3.0 30 — D I/O or Port 3.0. See Section 20 for a complete description of Port 3. A In 26 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Table 3.1. Pin Definitions for the C8051F380/1/2/3/4/5/6/7/C (Continued) Name Pin Numbers Type Description 48-pin 32-pin P3.1 29 — D I/O or Port 3.1. A In P3.2 28 — D I/O or Port 3.2. A In P3.3 27 — D I/O or Port 3.3. A In P3.4 26 — D I/O or Port 3.4. A In P3.5 25 — D I/O or Port 3.5. A In P3.6 24 — D I/O or Port 3.6. A In P3.7 23 — D I/O or Port 3.7. A In P4.0 22 — D I/O or Port 4.0. See Section 20 for a complete description of Port 4. A In P4.1 21 — D I/O or Port 4.1. A In P4.2 20 — D I/O or Port 4.2. A In P4.3 19 — D I/O or Port 4.3. A In P4.4 18 — D I/O or Port 4.4. A In P4.5 17 — D I/O or Port 4.5. A In P4.6 16 — D I/O or Port 4.6. A In P4.7 15 — D I/O or Port 4.7. A In Rev. 1.5 27 P0.6 P0.7 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P2.0 P2.1 48 47 46 45 44 43 42 41 40 39 38 37 C8051F380/1/2/3/4/5/6/7/C P0.5 1 36 P2.2 P0.4 2 35 P2.3 P0.3 3 34 P2.4 P0.2 4 33 P2.5 P0.1 5 32 P2.6 P0.0 6 31 P2.7 GND 7 30 P3.0 D+ 8 29 P3.1 D- 9 28 P3.2 VDD 10 27 P3.3 REGIN 11 26 P3.4 VBUS 12 25 P3.5 20 21 22 23 24 P4.2 P4.1 P4.0 P3.7 P3.6 17 P4.5 19 16 P4.6 P4.3 15 P4.7 18 14 C2D P4.4 13 RST / C2CK C8051F380/2/4/6-GQ Top View Figure 3.1. TQFP-48 Pinout Diagram (Top View) 28 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Figure 3.2. TQFP-48 Package Diagram Table 3.2. TQFP-48 Package Dimensions Dimension Min Nom Max Dimension A A1 A2 b c D D1 e — 0.05 0.95 0.17 0.09 — — 1.00 0.22 — 9.00 BSC 7.00 BSC 0.50 BSC 1.20 0.15 1.05 0.27 0.20 E E1 L aaa bbb ccc ddd q Min 0.45 0° Nom 9.00 BSC 7.00 BSC 0.60 0.20 0.20 0.08 0.08 3.5° Max 0.75 7° Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to JEDEC outline MS-026, variation ABC. 4. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev. 1.5 29 C8051F380/1/2/3/4/5/6/7/C Figure 3.3. TQFP-48 Recommended PCB Land Pattern Table 3.3. TQFP-48 PCB Land Pattern Dimensions Dimension Min Max C1 C2 E X1 Y1 8.30 8.30 8.40 8.40 0.50 BSC 0.20 1.40 0.30 1.50 Notes: General: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. Solder Mask Design: 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design: 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.125 mm (5 mils). 6. The ratio of stencil aperture to land pad size should be 1:1 for all pads. Card Assembly: 7. A No-Clean, Type-3 solder paste is recommended. 8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 30 Rev. 1.5 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 P1.1 32 31 30 29 28 27 26 25 C8051F380/1/2/3/4/5/6/7/C P0.1 1 24 P1.2 P0.0 2 23 P1.3 GND 3 22 P1.4 D+ 4 21 P1.5 D– 5 20 P1.6 VDD 6 19 P1.7 REGIN 7 18 P2.0 VBUS 8 17 P2.1 14 15 16 P2.3 P2.2 12 P2.6 P2.4 11 P2.7 13 10 P3.0 / C2D P2.5 9 RST / C2CK C8051F381/3/5/7/C-GQ Top View Figure 3.4. LQFP-32 Pinout Diagram (Top View) Rev. 1.5 31 C8051F380/1/2/3/4/5/6/7/C Figure 3.5. LQFP-32 Package Diagram Table 3.4. LQFP-32 Package Dimensions Dimension Min Nom Max Dimension A A1 A2 b c D D1 e — 0.05 1.35 0.30 0.09 — — 1.40 0.37 — 9.00 BSC 7.00 BSC 0.80 BSC 1.60 0.15 1.45 0.45 0.20 E E1 L aaa bbb ccc ddd q Min 0.45 0° Nom 9.00 BSC 7.00 BSC 0.60 0.20 0.20 0.10 0.20 3.5° Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to JEDEC outline MS-026, variation BBA. 4. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 32 Rev. 1.5 Max 0.75 7° C8051F380/1/2/3/4/5/6/7/C Figure 3.6. LQFP-32 Recommended PCB Land Pattern Table 3.5. LQFP-32 PCB Land Pattern Dimensions Dimension Min Max C1 C2 E X1 Y1 8.40 8.40 8.50 8.50 0.80 BSC 0.40 1.25 0.50 1.35 Notes: General: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. Solder Mask Design: 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design: 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.125 mm (5 mils). 6. The ratio of stencil aperture to land pad size should be 1:1 for all pads. Card Assembly: 7. A No-Clean, Type-3 solder paste is recommended. 8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev. 1.5 33 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P1.0 P1.1 32 31 30 29 28 27 26 25 C8051F380/1/2/3/4/5/6/7/C P0.1 1 24 P1.2 P0.0 2 23 P1.3 GND 3 22 P1.4 D+ 4 21 P1.5 D– 5 20 P1.6 VDD 6 19 P1.7 REGIN 7 18 P2.0 VBUS 8 17 P2.1 C8051F381/3/5/7/C-GM Top View 13 14 15 16 P2.5 P2.4 P2.3 P2.2 11 P2.7 12 10 P3.0 / C2D P2.6 9 RST / C2CK GND (optional) Figure 3.7. QFN-32 Pinout Diagram (Top View) 34 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C     Figure 3.8. QFN-32 Package Drawing Table 3.6. QFN-32 Package Dimensions Dimension Min Typ Max Dimension Min Typ Max A A1 b D D2 e E 0.80 0.00 0.18 0.85 0.02 0.25 5.00 BSC 3.30 0.50 BSC 5.00 BSC 0.90 0.05 0.30 E2 L aaa bbb ddd eee 3.20 0.35 — — — — 3.30 0.40 — — — — 3.40 0.45 0.10 0.10 0.05 0.08 3.20 3.40 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220, variation VHHD except for custom features D2, E2, and L which are toleranced per supplier designation. 4. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev. 1.5 35 C8051F380/1/2/3/4/5/6/7/C Figure 3.9. QFN-32 Recommended PCB Land Pattern Table 3.7. QFN-32 PCB Land Pattern Dimensions Dimension Min Max Dimension Min Max C1 C2 E X1 4.80 4.80 4.90 4.90 X2 Y1 Y2 3.20 0.75 3.20 3.40 0.85 3.40 0.50 BSC 0.20 0.30 Notes: General: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. Solder Mask Design: 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. Stencil Design: 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.125 mm (5 mils). 6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins. 7. A 3x3 array of 1.0 mm openings on a 1.2mm pitch should be used for the center pad to assure the proper paste volume. Card Assembly: 8. A No-Clean, Type-3 solder paste is recommended. 9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 36 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 4. Typical Connection Diagrams This section provides typical connection diagrams for C8051F38x devices. 4.1. Power Figure 4.1 shows a typical connection diagram for the power pins of the C8051F38x devices when the internal regulator is in use and USB is not used. C8051F38x Device 3.6-5.25 V (in) REGIN 3.3 V (out) 1 µF and 0.1 µF bypass capacitors required for each power pin placed as close to the pins as possible. Voltage Regulator VDD VBUS GND Figure 4.1. Connection Diagram with Voltage Regulator Used and No USB Figure 4.2 shows a typical connection diagram for the power pins of the C8051F38x devices when the internal regulator and USB are not used. C8051F38x Device 2.7-3.6 V (in) REGIN 1 µF and 0.1 µF bypass capacitors required for each power pin placed as close to the pins as possible. Voltage Regulator VDD VBUS GND Figure 4.2. Connection Diagram with Voltage Regulator Not Used and No USB Figure 4.3 shows a typical connection diagram for the power pins of the C8051F38x devices when the internal regulator used and USB is connected (bus-powered). The VBUS signal is used to detect when Rev. 1.5 38 C8051F380/1/2/3/4/5/6/7/C USB is connected to a host device and is shown with a 100 Ω current-limiting resistor. This current-limiting resistor is recommended for systems that may experience electrostatic discharge (ESD), latch-up, and have a greater opportunity to share signals with systems that do not have the same ground potential. This is not a required component for most applications. Recommended, not required USB 5 V (in) C8051F38x Device 100 ȍ VBUS REGIN 3.3 V (out) 1 μF and 0.1 μF bypass capacitors required for each power pin placed as close to the pins as possible. Voltage Regulator VDD GND Figure 4.3. Connection Diagram with Voltage Regulator Used and USB Connected (Bus-Powered) Figure 4.4 shows a typical connection diagram for the power pins of the C8051F38x devices when the internal regulator used and USB is connected (self-powered). The VBUS signal is used to detect when USB is connected to a host device and is shown with a 100 Ω current-limiting resistor. This current-limiting resistor is recommended for systems that may experience electrostatic discharge (ESD), latch-up, and have a greater opportunity to share signals with systems that do not have the same ground potential. This is not a required component for most applications. USB 5 V (sense) Recommended, not required 3.6-5.25 V (in) 1 μF and 0.1 μF bypass capacitors required for each power pin placed as close to the pins as possible. C8051F38x Device 100 ȍ VBUS 3.3 V (out) REGIN Voltage Regulator VDD GND Figure 4.4. Connection Diagram with Voltage Regulator Used and USB Connected (Self-Powered) 39 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 4.2. USB Figure 4.5 shows a typical connection diagram for the USB pins of the C8051F38x devices including a 100 Ω current-limiting resistor on the VBUS sense pin and ESD protection diodes on the USB pins. This current-limiting resistor is recommended for systems that may experience electrostatic discharge (ESD), latch-up, and have a greater opportunity to share signals with systems that do not have the same ground potential. This is not a required component for most applications. Recommended, not required USB Connector C8051F38x Device 100 ȍ VBUS VBUS D+ USB D+ D- D- Signal GND SP0503BAHT or equivalent USB ESD protection diodes GND Figure 4.5. Connection Diagram for USB Pins 4.3. Voltage Reference (VREF) Figure 4.6 shows a typical connection diagram for the voltage reference (VREF) pin of the C8051F38x devices when using the internal voltage reference. When using an external voltage reference, consult the appropriate device’s data sheet for connection recommendations. C8051F38x Device 2.42 V (out) 4.7 µF and 0.1 µF capacitors recommended for internal voltage reference. VREF Voltage Reference GND Figure 4.6. Connection Diagram for Internal Voltage Reference Rev. 1.5 40 C8051F380/1/2/3/4/5/6/7/C 5. Electrical Characteristics 5.1. Absolute Maximum Specifications Table 5.1. Absolute Maximum Ratings Parameter Min Typ Max Units Junction Temperature Under Bias –55 — 125 °C Storage Temperature –65 — 150 °C VDD > 2.2 V VDD < 2.2 V –0.3 –0.3 — — 5.8 VDD + 3.6 V V Regulator1 in Normal Mode Regulator1 in Bypass Mode –0.3 –0.3 — — 4.2 1.98 V V Maximum Total Current through VDD or GND — — 500 mA Maximum Output Current sunk by RST or any Port Pin — — 100 mA Voltage on RST, VBUS, or any Port I/O Pin with Respect to GND Voltage on VDD with Respect to GND Conditions Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 41 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 5.2. Electrical Characteristics Table 5.2. Global Electrical Characteristics –40 to +85 °C, 25 MHz system clock unless otherwise specified. Parameter Digital Supply Test Condition Voltage1 Digital Supply RAM Data Retention Voltage SYSCLK (System Clock)2 Specified Operating Temperature Range Min Typ Max Unit VRST1 3.3 3.6 V — 1.5 — V 0 — 48 MHz –40 — +85 °C 14 mA Digital Supply Current—CPU Active (Normal Mode, fetching instructions from Flash) IDD3 SYSCLK = 48 MHz, VDD = 3.3 V — 12 SYSCLK = 24 MHz, VDD = 3.3 V — 7 8 mA SYSCLK = 1 MHz, VDD = 3.3 V — 0.45 0.85 mA SYSCLK = 80 kHz, VDD = 3.3 V — 280 — µA Digital Supply Current—CPU Inactive (Idle Mode, not fetching instructions from Flash) Idle IDD3 Digital Supply Current (Stop or Suspend Mode, shutdown) Digital Supply Current for USB Module (USB Active Mode4) SYSCLK = 48 MHz, VDD = 3.3 V — 6.5 8 mA SYSCLK = 24 MHz, VDD = 3.3 V — 3.5 5 mA SYSCLK = 1 MHz, VDD = 3.3 V — 0.35 — mA SYSCLK = 80 kHz, VDD = 3.3 V — 220 — µA Oscillator not running (STOP mode), Internal Regulators OFF, VDD = 3.3 V — 1 — µA Oscillator not running (STOP or SUSPEND mode), REG0 and REG1 both in low power mode, VDD = 3.3 V. — 100 — µA Oscillator not running (STOP or SUSPEND mode), REG0 OFF, VDD = 3.3 V. — 150 — µA USB Clock = 48 MHz, VDD = 3.3 V — 8 — mA Notes: 1. USB Requires 3.0 V Minimum Supply Voltage. 2. SYSCLK must be at least 32 kHz to enable debugging. 3. Includes normal mode bias current for REG0 and REG1. Does not include current from internal oscillators, USB, or other analog peripherals. 4. An additional 220uA is sourced by the D+ or D- pull-up to the USB bus when the USB pull-up is active. Rev. 1.5 42 C8051F380/1/2/3/4/5/6/7/C Table 5.3. Port I/O DC Electrical Characteristics VDD = 2.7 to 3.6 V, –40 to +85 °C unless otherwise specified. Parameter Test Condition Min Typ Max Unit Output High Voltage IOH = –3 mA, Port I/O push-pull IOH = –10 µA, Port I/O push-pull IOH = –10 mA, Port I/O push-pull VDD – 0.7 VDD – 0.1 — — — VDD – 0.8 — — — V Output Low Voltage IOL = 8.5 mA IOL = 10 µA IOL = 25 mA — — — — — 1.0 0.6 0.1 — V Input High Voltage 2.0 — — V Input Low Voltage — — 0.8 V — — — 15 ±1 50 µA Input Leakage Current Weak Pullup Off Weak Pullup On, VIN = 0 V Table 5.4. Reset Electrical Characteristics –40 to +85 °C unless otherwise specified. Parameter Test Condition Min Typ Max Unit IOL = 8.5 mA, VDD = 2.7 V to 3.6 V — — 0.6 V RST Input High Voltage 0.7 x VDD — — V RST Input Low Voltage — — 0.3 x VDD V — 15 40 µA 2.60 2.65 2.70 V Time from last system clock rising edge to reset initiation 80 580 800 µs Delay between release of any reset source and code execution at location 0x0000 — — 250 µs Minimum RST Low Time to Generate a System Reset 15 — — µs VDD Monitor Turn-on Time — — 100 µs VDD Monitor Supply Current — 15 50 µA RST Output Low Voltage RST Input Pullup Current RST = 0.0 V VDD Monitor Threshold (VRST) Missing Clock Detector Timeout Reset Time Delay 43 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Table 5.5. Internal Voltage Regulator Electrical Characteristics –40 to +85 °C unless otherwise specified. Parameter Test Condition Min Typ Max Unit 2.7 — 5.25 V 3.0 3.3 3.6 V — — 100 mA — 1 — mV/mA 1.8 — 3.6 V Voltage Regulator (REG0) Input Voltage Range1 Output Voltage (VDD) 2 Output Current = 1 to 100 mA 2 Output Current Dropout Voltage (VDO )3 Voltage Regulator (REG1) Input Voltage Range Notes: 1. Input range specified for regulation. When an external regulator is used, should be tied to VDD. 2. Output current is total regulator output, including any current required by the C8051F380/1/2/3/4/5/6/7/C. 3. The minimum input voltage is 2.70 V or VDD + VDO (max load), whichever is greater. Table 5.6. Flash Electrical Characteristics Parameter Flash Size Test Condition Min Typ Max Unit C8051F380/1/4/5* C8051F382/3/6/7 65536* 32768 — — Bytes Bytes 10k 100k — Erase/Write Endurance Erase Cycle Time 25 MHz System Clock 10 15 22.5 ms Write Cycle Time 25 MHz System Clock 10 15 20 µs Notes: 1. 1024 bytes at location 0xFC00 to 0xFFFF are not available for program storage. 2. Data Retention Information is published in the Quarterly Quality and Reliability Report. Rev. 1.5 44 C8051F380/1/2/3/4/5/6/7/C Table 5.7. Internal High-Frequency Oscillator Electrical Characteristics VDD = 2.7 to 3.6 V; TA = –40 to +85 °C unless otherwise specified; Using factory-calibrated settings. Parameter Test Condition Min Typ Max Unit IFCN = 11b 47.3 48 48.7 MHz Oscillator Supply Current (from VDD) 25 °C, VDD = 3.0 V, OSCICN.7 = 1, OCSICN.5 = 0 — 900 — µA Power Supply Sensitivity Constant Temperature — 110 — ppm/V Temperature Sensitivity Constant Supply — 25 — ppm/°C Oscillator Frequency Table 5.8. Internal Low-Frequency Oscillator Electrical Characteristics VDD = 2.7 to 3.6 V; TA = –40 to +85 °C unless otherwise specified; Using factory-calibrated settings. Parameter Test Condition Min Typ Max Unit OSCLD = 11b 75 80 85 kHz Oscillator Supply Current (from VDD) 25 °C, VDD = 3.0 V, OSCLCN.7 = 1 — 4 — µA Power Supply Sensitivity Constant Temperature — 0.05 — %/V Temperature Sensitivity Constant Supply — 65 — ppm/°C Min Typ Max Unit 0.02 — 30 MHz 0 — 48 MHz Oscillator Frequency Table 5.9. External Oscillator Electrical Characteristics VDD = 2.7 to 3.6 V; TA = –40 to +85 °C unless otherwise specified. Parameter Test Condition External Crystal Frequency External CMOS Oscillator Frequency 45 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Table 5.10. ADC0 Electrical Characteristics VDD = 3.0 V, VREF = 2.40 V (REFSL=0), PGA Gain = 1, –40 to +85 °C unless otherwise specified. Parameter Test Condition Min Typ Max Unit DC Accuracy Resolution 10 Integral Nonlinearity bits — ±0.5 ±1 LSB — ±0.5 ±1 LSB Offset Error –2 0 2 LSB Full Scale Error –5 –2 0 LSB Offset Temperature Coefficient — 0.005 — LSB/°C Differential Nonlinearity Guaranteed Monotonic Dynamic performance (10 kHz sine-wave single-ended input, 1 dB below Full Scale, 500 ksps) Signal-to-Noise Plus Distortion 55 58 — dB — –73 — dB — 78 — dB — — 8.33 MHz 13 11 — — — — clocks clocks 300 — — ns — — 500 ksps Single Ended (AIN+ – GND) 0 — VREF V Differential (AIN+ – AIN–) –VREF — VREF V Single Ended or Differential 0 — VDD V Sampling Capacitance — 30 — pF Input Multiplexer Impedance — 5 — k — 750 1000 µA — 1 — mV/V Total Harmonic Distortion Up to the 5th harmonic Spurious-Free Dynamic Range Conversion Rate SAR Conversion Clock Conversion Time in SAR Clocks 10-bit Mode 8-bit Mode Track/Hold Acquisition Time Throughput Rate Analog Inputs ADC Input Voltage Range Absolute Pin Voltage with respect to GND Power Specifications Power Supply Current (VDD supplied to ADC0) Operating Mode, 500 ksps Power Supply Rejection Note: Represents one standard deviation from the mean. Rev. 1.5 46 C8051F380/1/2/3/4/5/6/7/C Table 5.11. Temperature Sensor Electrical Characteristics VDD = 3.0 V, –40 to +85 °C unless otherwise specified. Parameter Test Condition Min Typ Max Unit Linearity — ± 0.5 — °C Slope — 2.87 — mV/°C Slope Error* — ±120 — µV/°C Offset Temp = 0 °C — 764 — mV Offset Error* Temp = 0 °C — ±15 — mV Note: Represents one standard deviation from the mean. Table 5.12. Voltage Reference Electrical Characteristics VDD = 3.0 V; –40 to +85 °C unless otherwise specified. Parameter Test Condition Min Typ Max Unit 25 °C ambient 2.38 2.42 2.46 V VREF Short-Circuit Current — — 8 mA VREF Temperature Coefficient — 35 — ppm/°C Load = 0 to 200 µA to GND — 1.5 — ppm/µA VREF Turn-on Time 1 4.7 µF tantalum, 0.1 µF ceramic bypass — 3 — ms VREF Turn-on Time 2 0.1 µF ceramic bypass — 100 — µs — 140 — ppm/V 1 — VDD V — 9 — µA — 75 — µA Internal Reference (REFBE = 1) Output Voltage Load Regulation Power Supply Rejection External Reference (REFBE = 0) Input Voltage Range Input Current Sample Rate = 500 ksps; VREF = 3.0 V Power Specifications Supply Current 47 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Table 5.13. Comparator Electrical Characteristics VDD = 3.0 V, –40 to +85 °C unless otherwise noted. Parameter Response Time: Mode 0, Vcm* = 1.5 V Response Time: Mode 1, Vcm* = 1.5 V Response Time: Mode 2, Vcm* = 1.5 V Response Time: Mode 3, Vcm* = 1.5 V Test Condition Min Typ Max Unit CP0+ – CP0– = 100 mV — 100 — ns CP0+ – CP0– = –100 mV — 250 — ns CP0+ – CP0– = 100 mV — 175 — ns CP0+ – CP0– = –100 mV — 500 — ns CP0+ – CP0– = 100 mV — 320 — ns CP0+ – CP0– = –100 mV — 1100 — ns CP0+ – CP0– = 100 mV — 1050 — ns CP0+ – CP0– = –100 mV — 5200 — ns — 1.5 4 mV/V Common-Mode Rejection Ratio Positive Hysteresis 1 CP0HYP1–0 = 00 — 0 1 mV Positive Hysteresis 2 CP0HYP1–0 = 01 2 5 10 mV Positive Hysteresis 3 CP0HYP1–0 = 10 7 10 20 mV Positive Hysteresis 4 CP0HYP1–0 = 11 15 20 30 mV Negative Hysteresis 1 CP0HYN1–0 = 00 — 0 1 mV Negative Hysteresis 2 CP0HYN1–0 = 01 2 5 10 mV Negative Hysteresis 3 CP0HYN1–0 = 10 7 10 20 mV Negative Hysteresis 4 CP0HYN1–0 = 11 15 20 30 mV –0.25 — VDD + 0.25 V Input Capacitance — 4 — pF Input Bias Current — 0.001 — nA –10 — +10 mV Power Supply Rejection — 0.1 — mV/V Power-up Time — 10 — µs Mode 0 — 20 — µA Mode 1 — 10 — µA Mode 2 — 4 — µA Mode 3 — 1 — µA Inverting or Non-Inverting Input Voltage Range Input Offset Voltage Power Supply Supply Current at DC Note: Vcm is the common-mode voltage on CP0+ and CP0–. Rev. 1.5 48 C8051F380/1/2/3/4/5/6/7/C Table 5.14. USB Transceiver Electrical Characteristics VDD = 3.0 V to 3.6 V, –40 to +85 °C unless otherwise specified. Parameter Test Condition Min Typ Max Unit Output High Voltage (VOH) 2.8 — — V Output Low Voltage (VOL) — — 0.8 V VBUS Detection Input Low Voltage — — 1.0 VBUS Detection Input High Voltage 3.0 — — 1.3 — 2.0 V Transmitter Output Crossover Point (VCRS) V V Output Impedance (ZDRV) Driving High Driving Low — — 38 38 — — W Pull-up Resistance (RPU) Full Speed (D+ Pull-up) Low Speed (D– Pull-up) 1.425 1.5 1.575 k Output Rise Time (TR) Low Speed Full Speed 75 4 — — 300 20 ns Output Fall Time (TF) Low Speed Full Speed 75 4 — — 300 20 ns | (D+) – (D–) | 0.2 — — V 0.8 — 2.5 V — 0x0080). Figure 6.7 shows an example using left-justified data with the same comparison values. ADC0H:ADC0L ADC0H:ADC0L Input Voltage (AIN - GND) VREF x (1023/ 1024) Input Voltage (AIN - GND) VREF x (1023/ 1024) 0x03FF 0x03FF AD0WINT not affected AD0WINT=1 0x0081 VREF x (128/1024) 0x0080 0x0081 ADC0LTH:ADC0LTL VREF x (128/1024) 0x007F 0x0080 0x007F AD0WINT=1 VREF x (64/1024) 0x0041 0x0040 ADC0GTH:ADC0GTL VREF x (64/1024) 0x003F 0x0041 0x0040 ADC0GTH:ADC0GTL AD0WINT not affected ADC0LTH:ADC0LTL 0x003F AD0WINT=1 AD0WINT not affected 0 0x0000 0 0x0000 Figure 6.6. ADC Window Compare Example: Right-Justified Data ADC0H:ADC0L ADC0H:ADC0L Input Voltage (AIN - GND) VREF x (1023/ 1024) Input Voltage (AIN - GND) 0xFFC0 VREF x (1023/ 1024) 0xFFC0 AD0WINT not affected AD0WINT=1 0x2040 VREF x (128/1024) 0x2000 0x2040 ADC0LTH:ADC0LTL VREF x (128/1024) 0x1FC0 0x2000 0x1FC0 AD0WINT=1 0x1040 VREF x (64/1024) 0x1000 0x1040 ADC0GTH:ADC0GTL VREF x (64/1024) 0x0FC0 0x1000 ADC0GTH:ADC0GTL AD0WINT not affected ADC0LTH:ADC0LTL 0x0FC0 AD0WINT=1 AD0WINT not affected 0 0x0000 0 0x0000 Figure 6.7. ADC Window Compare Example: Left-Justified Data Rev. 1.5 62 C8051F380/1/2/3/4/5/6/7/C 6.5. ADC0 Analog Multiplexer (C8051F380/1/2/3/C only) AMUX0 selects the positive and negative inputs to the ADC. The positive input (AIN+) can be connected to individual Port pins, the on-chip temperature sensor, or the positive power supply (VDD). The negative input (AIN-) can be connected to individual Port pins, VREF, or GND. When GND is selected as the negative input, ADC0 operates in Single-ended Mode; at all other times, ADC0 operates in Differential Mode. The ADC0 input channels are selected in the AMX0P and AMX0N registers as described in SFR Definition 6.9 and SFR Definition 6.10. Important Note About ADC0 Input Configuration: Port pins selected as ADC0 inputs should be configured as analog inputs, and should be skipped by the Digital Crossbar. To configure a Port pin for analog input, set to 0 the corresponding bit in register PnMDIN. To force the Crossbar to skip a Port pin, set to 1 the corresponding bit in register PnSKIP. See Section “20. Port Input/Output” on page 153 for more Port I/O configuration details. 63 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 6.9. AMX0P: AMUX0 Positive Channel Select Bit 7 6 5 4 3 Name 1 0 0 0 AMX0P[5:0] Type R R Reset 0 0 R/W 0 0 0 SFR Address = 0xBB; SFR Page = All Pages Bit Name 7:6 2 Unused 0 Function Read = 00b; Write = don’t care. 5:0 AMX0P[5:0] AMUX0 Positive Input Selection. AMX0P 32-pin Packages 48-pin Packages AMX0P 000000: P1.0 P2.0 010010: P0.1 P0.4 000001: P1.1 P2.1 010011: P0.4 P1.1 000010: P1.2 P2.2 010100: P0.5 P1.2 000011: P1.3 P2.3 010101: Reserved P1.0 000100: P1.4 P2.5 010110: Reserved P1.3 000101: P1.5 P2.6 010111: Reserved P1.6 000110: P1.6 P3.0 011000: Reserved P1.7 000111: P1.7 P3.1 011001: Reserved P2.4 001000: P2.0 P3.4 011010: Reserved P2.7 001001: P2.1 P3.5 011011: Reserved P3.2 001010: P2.2 P3.7 011100: Reserved P3.3 001011: P2.3 P4.0 011101: Reserved P3.6 001100: P2.4 P4.3 011110: Temp Sensor Temp Sensor 001101: P2.5 P4.4 011111: VDD VDD 001110: P2.6 P4.5 100000: Reserved P4.1 001111: P2.7 P4.6 100001: Reserved P4.2 010000: P3.0 Reserved 100010: Reserved P4.7 010001: P0.0 P0.3 100011 - Reserved 111111: Reserved Rev. 1.5 32-pin Packages 48-pin Packages 64 C8051F380/1/2/3/4/5/6/7/C SFR Definition 6.10. AMX0N: AMUX0 Negative Channel Select Bit 7 6 5 4 Name 2 1 0 0 0 AMX0N[5:0] Type R R Reset 0 0 R/W 0 0 SFR Address = 0xBA; SFR Page = All Pages Bit Name 7:6 3 Unused 0 0 Function Read = 00b; Write = don’t care. 5:0 AMX0N[5:0] AMUX0 Negative Input Selection. AMX0N 65 32-pin Packages 48-pin Packages AMX0N 000000: P1.0 P2.0 010010: P0.1 P0.4 000001: P1.1 P2.1 010011: P0.4 P1.1 000010: P1.2 P2.2 010100: P0.5 P1.2 000011: P1.3 P2.3 010101: Reserved P1.0 000100: P1.4 P2.5 010110: Reserved P1.3 000101: P1.5 P2.6 010111: Reserved P1.6 000110: P1.6 P3.0 011000: Reserved P1.7 000111: P1.7 P3.1 011001: Reserved P2.4 001000: P2.0 P3.4 011010: Reserved P2.7 001001: P2.1 P3.5 011011: Reserved P3.2 001010: P2.2 P3.7 011100: Reserved P3.3 001011: P2.3 P4.0 011101: Reserved P3.6 001100: P2.4 P4.3 011110: VREF VREF 001101: P2.5 P4.4 011111: GND GND (Single-Ended (Single-Ended Measurement) Measurement) 001110: P2.6 P4.5 100000: Reserved P4.1 001111: P2.7 P4.6 100001: Reserved P4.2 010000: P3.0 Reserved 100010: Reserved P4.7 010001: P0.0 P0.3 100011 - Reserved 111111: Reserved Rev. 1.5 32-pin Packages 48-pin Packages C8051F380/1/2/3/4/5/6/7/C 7. Voltage Reference Options The Voltage reference multiplexer for the ADC is configurable to use an externally connected voltage reference, the on-chip reference voltage generator routed to the VREF pin, the unregulated power supply voltage (VDD), or the regulated 1.8 V internal supply (see Figure 7.1). The REFSL bit in the Reference Control register (REF0CN, SFR Definition 7.1) selects the reference source for the ADC. For an external source or the on-chip reference, REFSL should be set to 0 to select the VREF pin. To use VDD as the reference source, REFSL should be set to 1. To override this selection and use the internal regulator as the reference source, the REGOVR bit can be set to 1. The BIASE bit enables the internal voltage bias generator, which is used by many of the analog peripherals on the device. This bias is automatically enabled when any peripheral which requires it is enabled, and it does not need to be enabled manually. The bias generator may be enabled manually by writing a 1 to the BIASE bit in register REF0CN. The electrical specifications for the voltage reference circuit are given in Table 5.12. The C8051F380/1/2/3/C devices also include an on-chip voltage reference circuit which consists of a 1.2 V, temperature stable bandgap voltage reference generator and a selectable-gain output buffer amplifier. The buffer is configured for 1x or 2x gain using the REFBGS bit in register REF0CN. On the 1x gain setting the output voltage is nominally 1.2 V, and on the 2x gain setting the output voltage is nominally 2.4 V. The on-chip voltage reference can be driven on the VREF pin by setting the REFBE bit in register REF0CN to a 1. The maximum load seen by the VREF pin must be less than 200 µA to GND. Bypass capacitors of 0.1 µF and 4.7 µF are recommended from the VREF pin to GND, and a minimum of 0.1uF is required. If the on-chip reference is not used, the REFBE bit should be cleared to 0. Electrical specifications for the on-chip voltage reference are given in Table 5.12. Important Note about the VREF Pin: When using either an external voltage reference or the on-chip reference circuitry, the VREF pin should be configured as an analog pin and skipped by the Digital Crossbar. Refer to Section “20. Port Input/Output” on page 153 for the location of the VREF pin, as well as details of how to configure the pin in analog mode and to be skipped by the crossbar. REGOVR REFSL TEMPE BIASE REFBE REFBGS REF0CN EN To ADC, IDAC, Internal Oscillators, Reference, TempSensor Bias Generator IOSCEN VDD EN External Voltage Reference Circuit R1 VREF 1x/2x Temp Sensor 1.2V Reference To Analog Mux EN REFBE REFBGS GND 0 0 4.7F + 0.1F Recommended Bypass Capacitors VDD VREF (to ADC) 1 Internal Regulator 1 REGOVR Figure 7.1. Voltage Reference Functional Block Diagram Rev. 1.5 66 C8051F380/1/2/3/4/5/6/7/C SFR Definition 7.1. REF0CN: Reference Control Bit 7 6 Name REFBGS Type R/W R Reset 0 0 5 4 3 2 1 0 REGOVR REFSL TEMPE BIASE REFBE R R/W R/W R/W R/W R/W 0 0 0 0 0 0 SFR Address = 0xD1; SFR Page = All Pages Bit Name 7 Function REFBGS Reference Buffer Gain Select. This bit selects between 1x and 2x gain for the on-chip voltage reference buffer. 0: 2x Gain 1: 1x Gain 6:5 4 Unused Read = 00b; Write = don’t care. REGOVR Regulator Reference Override. This bit “overrides” the REFSL bit, and allows the internal regulator to be used as a reference source. 0: The voltage reference source is selected by the REFSL bit. 1: The internal regulator is used as the voltage reference. 3 REFSL Voltage Reference Select. This bit selects the ADCs voltage reference. 0: VREF pin used as voltage reference. 1: VDD used as voltage reference. 2 TEMPE Temperature Sensor Enable Bit. 0: Internal Temperature Sensor off. 1: Internal Temperature Sensor on. 1 BIASE Internal Analog Bias Generator Enable Bit. 0: Internal Bias Generator off. 1: Internal Bias Generator on. 0 REFBE On-chip Reference Buffer Enable Bit. 0: On-chip Reference Buffer off. 1: On-chip Reference Buffer on. Internal voltage reference driven on the VREF pin. 67 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 8. Comparator0 and Comparator1 C8051F380/1/2/3/4/5/6/7/C devices include two on-chip programmable voltage comparators: Comparator0 is shown in Figure 8.1, Comparator1 is shown in Figure 8.2. The two comparators operate identically with the following exceptions: (1) Their input selections differ as described in Section “8.1. Comparator Multiplexers” on page 71; (2) Comparator0 can be used as a reset source. The Comparators offer programmable response time and hysteresis, an analog input multiplexer, and two outputs that are optionally available at the Port pins: a synchronous “latched” output (CP0 or CP1), or an asynchronous “raw” output (CP0A or CP1A). The asynchronous signals are available even when the system clock is not active. This allows the Comparators to operate and generate an output with the device in STOP mode. When assigned to a Port pin, the Comparator outputs may be configured as open drain or push-pull (see Section “20.2. Port I/O Initialization” on page 158). Comparator0 may also be used as a reset source (see Section “17.5. Comparator0 Reset” on page 132). The Comparator inputs are selected by the comparator input multiplexers, as detailed in Section “8.1. Comparator Multiplexers” on page 71. CPT0CN CP0EN CP0OUT CP0RIF CP0FIF CP0HYP1 CP0HYP0 CP0HYN1 CP0HYN0 VDD CP0 + + Comparator Input Mux CP0 - CP0 D - SET CLR D Q Q SET CLR Q Q Crossbar (SYNCHRONIZER) CP0A GND CPT0MD CP0FIE CP0RIE CP0MD1 CP0MD0 Reset Decision Tree CP0RIF CP0FIF 0 CP0EN EA 1 0 0 0 1 1 CP0 Interrupt 1 Figure 8.1. Comparator0 Functional Block Diagram Rev. 1.5 68 C8051F380/1/2/3/4/5/6/7/C CPT1CN CP1EN CP1FIF CP1OUT CP1RIF CP1HYP1 CP1HYP0 CP1HYN1 CP1HYN0 VDD CP1 + + Comparator Input Mux CP1 - CP1 D - SET CLR Q D Q SET CLR Q Q Crossbar (SYNCHRONIZER) CP1A GND CPT1MD CP1FIE CP1RIE CP1MD1 CP1MD0 CP1RIF CP1FIF 0 CP1EN EA 1 0 0 0 1 1 CP1 Interrupt 1 Figure 8.2. Comparator1 Functional Block Diagram The Comparator output can be polled in software, used as an interrupt source, and/or routed to a Port pin. When routed to a Port pin, the Comparator output is available asynchronous or synchronous to the system clock; the asynchronous output is available even in STOP mode (with no system clock active). When disabled, the Comparator output (if assigned to a Port I/O pin via the Crossbar) defaults to the logic low state, and the power supply to the comparator is turned off. See Section “20.1. Priority Crossbar Decoder” on page 154 for details on configuring Comparator outputs via the digital Crossbar. Comparator inputs can be externally driven from –0.25 V to (VDD) + 0.25 V without damage or upset. The complete Comparator electrical specifications are given in Section “5. Electrical Characteristics” on page 41. The Comparator response time may be configured in software via the CPTnMD registers (see SFR Definition 8.2 and SFR Definition 8.4). Selecting a longer response time reduces the Comparator supply current. 69 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C VIN+ VIN- CPn+ CPn- + CPn _ OUT CIRCUIT CONFIGURATION Positive Hysteresis Voltage (Programmed with CPnHYP Bits) VIN- INPUTS Negative Hysteresis Voltage (Programmed by CPnHYN Bits) VIN+ VOH OUTPUT VOL Negative Hysteresis Disabled Positive Hysteresis Disabled Maximum Negative Hysteresis Maximum Positive Hysteresis Figure 8.3. Comparator Hysteresis Plot The Comparator hysteresis is software-programmable via its Comparator Control register CPTnCN (for n = 0 or 1). The user can program both the amount of hysteresis voltage (referred to the input voltage) and the positive and negative-going symmetry of this hysteresis around the threshold voltage. The Comparator hysteresis is programmed using Bits 3–0 in the Comparator Control Register CPTnCN (shown in SFR Definition 8.1). The amount of negative hysteresis voltage is determined by the settings of the CPnHYN bits. Settings of 20, 10 or 5 mV of nominal negative hysteresis can be programmed, or negative hysteresis can be disabled. In a similar way, the amount of positive hysteresis is determined by the setting the CPnHYP bits. Comparator interrupts can be generated on both rising-edge and falling-edge output transitions. (For Interrupt enable and priority control, see Section “16.1. MCU Interrupt Sources and Vectors” on page 119). The CPnFIF flag is set to logic 1 upon a Comparator falling-edge occurrence, and the CPnRIF flag is set to logic 1 upon the Comparator rising-edge occurrence. Once set, these bits remain set until cleared by software. The Comparator rising-edge interrupt mask is enabled by setting CPnRIE to a logic 1. The Comparator falling-edge interrupt mask is enabled by setting CPnFIE to a logic 1. The output state of the Comparator can be obtained at any time by reading the CPnOUT bit. The Comparator is enabled by setting the CPnEN bit to logic 1, and is disabled by clearing this bit to logic 0. Note that false rising edges and falling edges can be detected when the comparator is first powered on or if changes are made to the hysteresis or response time control bits. Therefore, it is recommended that the rising-edge and falling-edge flags be explicitly cleared to logic 0 a short time after the comparator is enabled or its mode bits have been changed. Rev. 1.5 70 C8051F380/1/2/3/4/5/6/7/C SFR Definition 8.1. CPT0CN: Comparator0 Control Bit 7 6 5 4 Name CP0EN CP0OUT CP0RIF CP0FIF CP0HYP[1:0] CP0HYN[1:0] Type R/W R R/W R/W R/W R/W Reset 0 0 0 0 SFR Address = 0x9B; SFR Page = All Pages Bit Name 7 CP0EN 3 2 0 0 1 0 0 0 Function Comparator0 Enable Bit. 0: Comparator0 Disabled. 1: Comparator0 Enabled. 6 CP0OUT Comparator0 Output State Flag. 0: Voltage on CP0+ < CP0–. 1: Voltage on CP0+ > CP0–. 5 CP0RIF Comparator0 Rising-Edge Flag. Must be cleared by software. 0: No Comparator0 Rising Edge has occurred since this flag was last cleared. 1: Comparator0 Rising Edge has occurred. 4 CP0FIF Comparator0 Falling-Edge Flag. Must be cleared by software. 0: No Comparator0 Falling-Edge has occurred since this flag was last cleared. 1: Comparator0 Falling-Edge has occurred. 3:2 CP0HYP[1:0] Comparator0 Positive Hysteresis Control Bits. 00: Positive Hysteresis Disabled. 01: Positive Hysteresis = 5 mV. 10: Positive Hysteresis = 10 mV. 11: Positive Hysteresis = 20 mV. 1:0 CP0HYN[1:0] Comparator0 Negative Hysteresis Control Bits. 00: Negative Hysteresis Disabled. 01: Negative Hysteresis = 5 mV. 10: Negative Hysteresis = 10 mV. 11: Negative Hysteresis = 20 mV. 71 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 8.2. CPT0MD: Comparator0 Mode Selection Bit 7 6 Name 5 4 3 CP0RIE CP0FIE 2 R R R/W R/W R R Reset 0 0 0 0 0 0 R/W 1 0 Function 7:6 Unused Read = 00b, Write = don’t care. 5 CP0RIE Comparator0 Rising-Edge Interrupt Enable. 0: Comparator0 Rising-edge interrupt disabled. 1: Comparator0 Rising-edge interrupt enabled. 4 CP0FIE Comparator0 Falling-Edge Interrupt Enable. 0: Comparator0 Falling-edge interrupt disabled. 1: Comparator0 Falling-edge interrupt enabled. 3:2 Unused Read = 00b, Write = don’t care. 1:0 0 CP0MD[1:0] Type SFR Address = 0x9D; SFR Page = All Pages Bit Name 1 CP0MD[1:0] Comparator0 Mode Select. These bits affect the response time and power consumption for Comparator0. 00: Mode 0 (Fastest Response Time, Highest Power Consumption) 01: Mode 1 10: Mode 2 11: Mode 3 (Slowest Response Time, Lowest Power Consumption) Rev. 1.5 72 C8051F380/1/2/3/4/5/6/7/C SFR Definition 8.3. CPT1CN: Comparator1 Control Bit 7 6 5 4 Name CP1EN CP1OUT CP1RIF CP1FIF CP1HYP[1:0] CP1HYN[1:0] Type R/W R R/W R/W R/W R/W Reset 0 0 0 0 SFR Address = 0x9A; SFR Page = All Pages Bit Name 7 CP1EN 3 2 0 0 1 0 0 0 Function Comparator1 Enable Bit. 0: Comparator1 Disabled. 1: Comparator1 Enabled. 6 CP1OUT Comparator1 Output State Flag. 0: Voltage on CP1+ < CP1–. 1: Voltage on CP1+ > CP1–. 5 CP1RIF Comparator1 Rising-Edge Flag. Must be cleared by software. 0: No Comparator1 Rising Edge has occurred since this flag was last cleared. 1: Comparator1 Rising Edge has occurred. 4 CP1FIF Comparator1 Falling-Edge Flag. Must be cleared by software. 0: No Comparator1 Falling-Edge has occurred since this flag was last cleared. 1: Comparator1 Falling-Edge has occurred. 3:2 CP1HYP[1:0] Comparator1 Positive Hysteresis Control Bits. 00: Positive Hysteresis Disabled. 01: Positive Hysteresis = 5 mV. 10: Positive Hysteresis = 10 mV. 11: Positive Hysteresis = 20 mV. 1:0 CP1HYN[1:0] Comparator1 Negative Hysteresis Control Bits. 00: Negative Hysteresis Disabled. 01: Negative Hysteresis = 5 mV. 10: Negative Hysteresis = 10 mV. 11: Negative Hysteresis = 20 mV. 73 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 8.4. CPT1MD: Comparator1 Mode Selection Bit 7 6 Name 5 4 3 CP1RIE CP1FIE 2 R R R/W R/W R R Reset 0 0 0 0 0 0 R/W 1 0 Function 7:6 Unused Read = 00b, Write = don’t care. 5 CP1RIE Comparator1 Rising-Edge Interrupt Enable. 0: Comparator1 Rising-edge interrupt disabled. 1: Comparator1 Rising-edge interrupt enabled. 4 CP1FIE Comparator1 Falling-Edge Interrupt Enable. 0: Comparator1 Falling-edge interrupt disabled. 1: Comparator1 Falling-edge interrupt enabled. 3:2 Unused Read = 00b, Write = don’t care. 1:0 0 CP1MD[1:0] Type SFR Address = 0x9C; SFR Page = All Pages Bit Name 1 CP1MD[1:0] Comparator1 Mode Select. These bits affect the response time and power consumption for Comparator1. 00: Mode 0 (Fastest Response Time, Highest Power Consumption) 01: Mode 1 10: Mode 2 11: Mode 3 (Slowest Response Time, Lowest Power Consumption) Rev. 1.5 74 C8051F380/1/2/3/4/5/6/7/C 8.1. Comparator Multiplexers C8051F380/1/2/3/4/5/6/7/C devices include an analog input multiplexer to connect Port I/O pins to the comparator inputs. The Comparator inputs are selected in the CPTnMX registers (SFR Definition 8.5 and SFR Definition 8.6). The CMXnP2–CMXnP0 bits select the Comparator positive input; the CMXnN2–CMXnN0 bits select the Comparator negative input. Important Note About Comparator Inputs: The Port pins selected as comparator inputs should be configured as analog inputs in their associated Port configuration register, and configured to be skipped by the Crossbar (for details on Port configuration, see Section “20.3. General Purpose Port I/O” on page 161). VDD VDD CP0 + CP1 + + CP0 - + CP1 - - CPT0MX CMX1P2 CMX1P1 CMX1P0 CMX1N2 CMX1N1 CMX1N0 GND CMX0P2 CMX0P1 CMX0P0 CMX0N2 CMX0N1 CMX0N0 GND CPT1MX Figure 8.4. Comparator Input Multiplexer Block Diagram 75 - Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 8.5. CPT0MX: Comparator0 MUX Selection Bit 7 6 Name 5 4 3 CMX0N[2:0] Type R Reset 0 R/W 0 6:4 3 2:0 Unused 1 R 0 0 CMX0P[2:0] 0 0 SFR Address = 0x9F; SFR Page = All Pages Bit Name 7 2 R/W 0 0 0 Function Read = 0b; Write = don’t care. CMX0N[2:0] Comparator0 Negative Input MUX Selection. Unused Selection 32-pin Package 48-pin Package 000: P1.1 P2.1 001: P1.5 P2.6 010: P2.1 P3.5 011: P2.5 P4.4 100: P0.1 P0.4 101-111: Reserved Reserved Read = 0b; Write = don’t care. CMX0P[2:0] Comparator0 Positive Input MUX Selection. Selection 32-pin Package 48-pin Package 000: P1.0 P2.0 001: P1.4 P2.5 010: P2.0 P3.4 011: P2.4 P4.3 100: P0.0 P0.3 101-111: Reserved Reserved Rev. 1.5 76 C8051F380/1/2/3/4/5/6/7/C SFR Definition 8.6. CPT1MX: Comparator1 MUX Selection Bit 7 6 Name 5 4 R Reset 0 R/W 0 3 2:0 77 Unused 1 R 0 0 0 R/W 0 0 Function Read = 0b; Write = don’t care. CMX1N[2:0] Comparator1 Negative Input MUX Selection. Unused 0 CMX1P[2:0] SFR Address = 0x9E; SFR Page = All Pages Bit Name 6:4 2 CMX1N[2:0] Type 7 3 Selection 32-pin Package 48-pin Package 000: P1.3 P2.3 001: P1.7 P3.1 010: P2.3 P4.0 011: Reserved P4.6 100: P0.5 P1.2 101-111: Reserved Reserved Read = 0b; Write = don’t care. CMX1P[2:0] Comparator1 Positive Input MUX Selection. Selection 32-pin Package 48-pin Package 000: P1.2 P2.2 001: P1.6 P3.0 010: P2.2 P3.7 011: Reserved P4.5 100: P0.4 P1.1 101-111: Reserved Reserved Rev. 1.5 0 C8051F380/1/2/3/4/5/6/7/C 9. Voltage Regulators (REG0 and REG1) C8051F380/1/2/3/4/5/6/7/C devices include two internal voltage regulators: one regulates a voltage source on REGIN to 3.3 V (REG0), and the other regulates the internal core supply to 1.8 V from a VDD supply of 1.8 to 3.6 V (REG1). When enabled, the REG0 output appears on the VDD pin and can be used to power external devices. REG0 can be enabled/disabled by software using bit REG0DIS in register REG01CN (SFR Definition 9.1). REG1 has two power-saving modes built into the regulator to help reduce current consumption in low-power applications. These modes are accessed through the REG01CN register. Electrical characteristics for the on-chip regulators are specified in Table 5.5 on page 44. Note that the VBUS signal must be connected to the VBUS pin when using the device in a USB network. The VBUS signal should only be connected to the REGIN pin when operating the device as a bus-powered function. REG0 configuration options are shown in “4. Typical Connection Diagrams” Figure 4.1– Figure 4.4. 9.1. Voltage Regulator (REG0) See “4. Typical Connection Diagrams” for typical connection diagrams using the REG0 voltage regulator. 9.1.1. Regulator Mode Selection REG0 offers a low power mode intended for use when the device is in suspend mode. In this low power mode, the REG0 output remains as specified; however the REG0 dynamic performance (response time) is degraded. See Table 5.5 for normal and low power mode supply current specifications. The REG0 mode selection is controlled via the REG0MD bit in register REG01CN. 9.1.2. VBUS Detection When the USB Function Controller is used (see section Section “21. Universal Serial Bus Controller (USB0)” on page 172), the VBUS signal should be connected to the VBUS pin. The VBSTAT bit (register REG01CN) indicates the current logic level of the VBUS signal. If enabled, a VBUS interrupt will be generated when the VBUS signal has either a falling or rising edge. The VBUS interrupt is edge-sensitive, and has no associated interrupt pending flag. See Table 5.5 for VBUS input parameters. Important Note: When USB is selected as a reset source, a system reset will be generated when a falling or rising edge occurs on the VBUS pin. See Section “17. Reset Sources” on page 129 for details on selecting USB as a reset source. 9.2. Voltage Regulator (REG1) Under default conditions, the internal REG1 regulator will remain on when the device enters STOP mode. This allows any enabled reset source to generate a reset for the device and bring the device out of STOP mode. For additional power savings, the STOPCF bit can be used to shut down the regulator and the internal power network of the device when the part enters STOP mode. When STOPCF is set to 1, the RST pin and a full power cycle of the device are the only methods of generating a reset. REG1 offers an additional low power mode intended for use when the device is in suspend mode. This low power mode should not be used during normal operation or if the REG0 Voltage Regulator is disabled. See Table 5.5 for normal and low power mode supply current specifications. The REG1 mode selection is controlled via the REG1MD bit in register REG01CN. Important Note: At least 12 clock instructions must occur after placing REG1 in low power mode before the Internal High Frequency Oscillator is Suspended (OSCICN.5 = 1b). Rev. 1.5 78 C8051F380/1/2/3/4/5/6/7/C SFR Definition 9.1. REG01CN: Voltage Regulator Control Bit 7 Name REG0DIS 6 5 4 3 2 1 0 VBSTAT Reserved REG0MD STOPCF Reserved REG1MD Reserved Type R/W R R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 SFR Address = 0xC9; SFR Page = All Pages Bit Name 7 Function REG0DIS Voltage Regulator (REG0) Disable. This bit enables or disables the REG0 Voltage Regulator. 0: Voltage Regulator Enabled. 1: Voltage Regulator Disabled. 6 VBSTAT VBUS Signal Status. This bit indicates whether the device is connected to a USB network. 0: VBUS signal currently absent (device not attached to USB network). 1: VBUS signal currently present (device attached to USB network). 5 Reserved Must Write 0b. 4 REG0MD Voltage Regulator (REG0) Mode Select. This bit selects the Voltage Regulator mode for REG0. When REG0MD is set to 1, the REG0 voltage regulator operates in lower power (suspend) mode. 0: REG0 Voltage Regulator in normal mode. 1: REG0 Voltage Regulator in low power mode. 3 STOPCF Stop Mode Configuration (REG1). This bit configures the REG1 regulator’s behavior when the device enters STOP mode. 0: REG1 Regulator is still active in STOP mode. Any enabled reset source will reset the device. 1: REG1 Regulator is shut down in STOP mode. Only the RST pin or power cycle can reset the device. 2 Reserved Must Write 0b. 1 REG1MD Voltage Regulator (REG1) Mode. This bit selects the Voltage Regulator mode for REG1. When REG1MD is set to 1, the REG1 voltage regulator operates in lower power mode. 0: REG1 Voltage Regulator in normal mode. 1: REG1 Voltage Regulator in low power mode. This bit should not be set to '1' if the REG0 Voltage Regulator is disabled. 0 79 Reserved Must Write 0b. Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 10. Power Management Modes The C8051F380/1/2/3/4/5/6/7/C devices have three software programmable power management modes: Idle, Stop, and Suspend. Idle mode and stop mode are part of the standard 8051 architecture, while suspend mode is an enhanced power-saving mode implemented by the high-speed oscillator peripheral. Idle mode halts the CPU while leaving the peripherals and clocks active. In stop mode, the CPU is halted, all interrupts and timers (except the Missing Clock Detector) are inactive, and the internal oscillator is stopped (analog peripherals remain in their selected states; the external oscillator is not affected). Suspend mode is similar to stop mode in that the internal oscillator is halted, but the device can wake on activity with the USB transceiver. The CPU is not halted in suspend mode, so it can run on another oscillator, if desired. Since clocks are running in Idle mode, power consumption is dependent upon the system clock frequency and the number of peripherals left in active mode before entering Idle. Stop mode and suspend mode consume the least power because the majority of the device is shut down with no clocks active. SFR Definition 10.1 describes the Power Control Register (PCON) used to control the C8051F380/1/2/3/4/5/6/ 7/C's Stop and Idle power management modes. Suspend mode is controlled by the SUSPEND bit in the OSCICN register (SFR Definition 19.3). Although the C8051F380/1/2/3/4/5/6/7/C has Idle, Stop, and suspend modes available, more control over the device power can be achieved by enabling/disabling individual peripherals as needed. Each analog peripheral can be disabled when not in use and placed in low power mode. Digital peripherals, such as timers or serial buses, draw little power when they are not in use. Turning off oscillators lowers power consumption considerably, at the expense of reduced functionality. 10.1. Idle Mode Setting the Idle Mode Select bit (PCON.0) causes the hardware to halt the CPU and enter Idle mode as soon as the instruction that sets the bit completes execution. All internal registers and memory maintain their original data. All analog and digital peripherals can remain active during idle mode. Idle mode is terminated when an enabled interrupt is asserted or a reset occurs. The assertion of an enabled interrupt will cause the Idle Mode Selection bit (PCON.0) to be cleared and the CPU to resume operation. The pending interrupt will be serviced and the next instruction to be executed after the return from interrupt (RETI) will be the instruction immediately following the one that set the Idle Mode Select bit. If Idle mode is terminated by an internal or external reset, the CIP-51 performs a normal reset sequence and begins program execution at address 0x0000. Note: If the instruction following the write of the IDLE bit is a single-byte instruction and an interrupt occurs during the execution phase of the instruction that sets the IDLE bit, the CPU may not wake from Idle mode when a future interrupt occurs. Therefore, instructions that set the IDLE bit should be followed by an instruction that has two or more opcode bytes, for example: // in ‘C’: PCON |= 0x01; PCON = PCON; // set IDLE bit // ... followed by a 3-cycle dummy instruction ; in assembly: ORL PCON, #01h MOV PCON, PCON ; set IDLE bit ; ... followed by a 3-cycle dummy instruction If enabled, the Watchdog Timer (WDT) will eventually cause an internal watchdog reset and thereby terminate the Idle mode. This feature protects the system from an unintended permanent shutdown in the event of an inadvertent write to the PCON register. If this behavior is not desired, the WDT may be disabled by software prior to entering the Idle mode if the WDT was initially configured to allow this operation. This provides the opportunity for additional power savings, allowing the system to remain in the Idle mode indefinitely, waiting for an external stimulus to wake up the system. Refer to Section “17.6. PCA Watchdog Timer Rev. 1.5 80 C8051F380/1/2/3/4/5/6/7/C Reset” on page 133 for more information on the use and configuration of the WDT. 10.2. Stop Mode Setting the stop mode Select bit (PCON.1) causes the controller core to enter stop mode as soon as the instruction that sets the bit completes execution. In stop mode the internal oscillator, CPU, and all digital peripherals are stopped; the state of the external oscillator circuit is not affected. Each analog peripheral (including the external oscillator circuit) may be shut down individually prior to entering stop mode. Stop mode can only be terminated by an internal or external reset. On reset, the device performs the normal reset sequence and begins program execution at address 0x0000. If enabled, the Missing Clock Detector will cause an internal reset and thereby terminate the stop mode. The Missing Clock Detector should be disabled if the CPU is to be put to in STOP mode for longer than the MCD timeout. By default, when in stop mode the internal regulator is still active. However, the regulator can be configured to shut down while in stop mode to save power. To shut down the regulator in stop mode, the STOPCF bit in register REG01CN should be set to 1 prior to setting the STOP bit (see SFR Definition 9.1). If the regulator is shut down using the STOPCF bit, only the RST pin or a full power cycle are capable of resetting the device. 10.3. Suspend Mode Setting the SUSPEND bit (OSCICN.5) causes the hardware to halt the high-frequency internal oscillator and go into suspend mode as soon as the instruction that sets the bit completes execution. All internal registers and memory maintain their original data. The CPU is not halted in Suspend, so code can still be executed using an oscillator other than the internal high-frequency oscillator. Suspend mode can be terminated by resume signalling on the USB data pins, or a device reset event. When suspend mode is terminated, if the oscillator source is the internal high-frequency oscillator, the device will continue execution on the instruction following the one that set the SUSPEND bit. If the wake event was configured to generate an interrupt, the interrupt will be serviced upon waking the device. If suspend mode is terminated by an internal or external reset, the CIP-51 performs a normal reset sequence and begins program execution at address 0x0000. 81 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 10.1. PCON: Power Control Bit 7 6 5 4 3 2 1 0 Name GF[5:0] STOP IDLE Type R/W R/W R/W 0 0 Reset 0 0 0 SFR Address = 0x87; SFR Page = All Pages Bit Name 7:2 GF[5:0] 0 0 0 Function General Purpose Flags 5–0. These are general purpose flags for use under software control. 1 STOP Stop Mode Select. Setting this bit will place the CIP-51 in stop mode. This bit will always be read as 0. 1: CPU goes into stop mode (internal oscillator stopped). 0 IDLE IDLE: Idle Mode Select. Setting this bit will place the CIP-51 in Idle mode. This bit will always be read as 0. 1: CPU goes into Idle mode. (Shuts off clock to CPU, but clock to Timers, Interrupts, Serial Ports, and Analog Peripherals are still active.) Rev. 1.5 82 C8051F380/1/2/3/4/5/6/7/C 11. CIP-51 Microcontroller The MCU system controller core is the CIP-51 microcontroller. The CIP-51 is fully compatible with the MCS-51™ instruction set; standard 803x/805x assemblers and compilers can be used to develop software. The MCU family has a superset of all the peripherals included with a standard 8051. The CIP-51 also includes on-chip debug hardware (see description in Section 28), and interfaces directly with the analog and digital subsystems providing a complete data acquisition or control-system solution in a single integrated circuit. The CIP-51 Microcontroller core implements the standard 8051 organization and peripherals as well as additional custom peripherals and functions to extend its capability (see Figure 11.1 for a block diagram). The CIP-51 includes the following features:     Fully Compatible with MCS-51 Instruction Set 48 MIPS Peak Throughput with 48 MHz Clock  0 to 48 MHz Clock Frequency  Extended Interrupt Handler Reset Input Power Management Modes  On-chip Debug Logic  Program and Data Memory Security Performance The CIP-51 employs a pipelined architecture that greatly increases its instruction throughput over the standard 8051 architecture. In a standard 8051, all instructions except for MUL and DIV take 12 or 24 system clock cycles to execute, and usually have a maximum system clock of 12 MHz. By contrast, the CIP-51 core executes 70% of its instructions in one or two system clock cycles, with no instructions taking more than eight system clock cycles. D8 D8 ACCUMULATOR STACK POINTER TMP1 TMP2 SRAM ADDRESS REGISTER PSW D8 D8 D8 ALU SRAM D8 DATA BUS B REGISTER D8 D8 D8 DATA BUS DATA BUS SFR_ADDRESS BUFFER D8 D8 DATA POINTER D8 SFR BUS INTERFACE SFR_CONTROL SFR_WRITE_DATA SFR_READ_DATA DATA BUS PC INCREMENTER PROGRAM COUNTER (PC) PRGM. ADDRESS REG. MEM_ADDRESS D8 MEM_CONTROL A16 MEMORY INTERFACE MEM_WRITE_DATA MEM_READ_DATA PIPELINE RESET D8 CONTROL LOGIC SYSTEM_IRQs CLOCK D8 STOP IDLE POWER CONTROL REGISTER INTERRUPT INTERFACE EMULATION_IRQ D8 Figure 11.1. CIP-51 Block Diagram 83 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C With the CIP-51's maximum system clock at 48 MHz, it has a peak throughput of 48 MIPS. The CIP-51 has a total of 109 instructions. The table below shows the total number of instructions that require each execution time. Clocks to Execute 1 2 2/4 3 3/5 4 5 4/6 6 8 Number of Instructions 26 50 5 10 6 5 2 2 2 1 Programming and Debugging Support In-system programming of the Flash program memory and communication with on-chip debug support logic is accomplished via the Silicon Labs 2-Wire Development Interface (C2). The on-chip debug support logic facilitates full speed in-circuit debugging, allowing the setting of hardware breakpoints, starting, stopping and single stepping through program execution (including interrupt service routines), examination of the program's call stack, and reading/writing the contents of registers and memory. This method of on-chip debugging is completely non-intrusive, requiring no RAM, Stack, timers, or other on-chip resources. C2 details can be found in Section “28. C2 Interface” on page 316. The CIP-51 is supported by development tools from Silicon Labs and third party vendors. Silicon Labs provides an integrated development environment (IDE) including editor, debugger and programmer. The IDE's debugger and programmer interface to the CIP-51 via the C2 interface to provide fast and efficient in-system device programming and debugging. Third party macro assemblers and C compilers are also available. 11.1. Instruction Set The instruction set of the CIP-51 System Controller is fully compatible with the standard MCS-51™ instruction set. Standard 8051 development tools can be used to develop software for the CIP-51. All CIP-51 instructions are the binary and functional equivalent of their MCS-51™ counterparts, including opcodes, addressing modes and effect on PSW flags. However, instruction timing is different than that of the standard 8051. 11.1.1. Instruction and CPU Timing In many 8051 implementations, a distinction is made between machine cycles and clock cycles, with machine cycles varying from 2 to 12 clock cycles in length. However, the CIP-51 implementation is based solely on clock cycle timing. All instruction timings are specified in terms of clock cycles. Due to the pipelined architecture of the CIP-51, most instructions execute in the same number of clock cycles as there are program bytes in the instruction. Conditional branch instructions take one less clock cycle to complete when the branch is not taken as opposed to when the branch is taken. Table 11.1 is the CIP-51 Instruction Set Summary, which includes the mnemonic, number of bytes, and number of clock cycles for each instruction. Rev. 1.5 84 C8051F380/1/2/3/4/5/6/7/C Table 11.1. CIP-51 Instruction Set Summary Mnemonic Description Bytes Clock Cycles Add register to A Add direct byte to A Add indirect RAM to A Add immediate to A Add register to A with carry Add direct byte to A with carry Add indirect RAM to A with carry Add immediate to A with carry Subtract register from A with borrow Subtract direct byte from A with borrow Subtract indirect RAM from A with borrow Subtract immediate from A with borrow Increment A Increment register Increment direct byte Increment indirect RAM Decrement A Decrement register Decrement direct byte Decrement indirect RAM Increment Data Pointer Multiply A and B Divide A by B Decimal adjust A 1 2 1 2 1 2 1 2 1 2 1 2 1 1 2 1 1 1 2 1 1 1 1 1 1 2 2 2 1 2 2 2 1 2 2 2 1 1 2 2 1 1 2 2 1 4 8 1 AND Register to A AND direct byte to A AND indirect RAM to A AND immediate to A AND A to direct byte AND immediate to direct byte OR Register to A OR direct byte to A OR indirect RAM to A OR immediate to A OR A to direct byte OR immediate to direct byte Exclusive-OR Register to A Exclusive-OR direct byte to A Exclusive-OR indirect RAM to A Exclusive-OR immediate to A Exclusive-OR A to direct byte 1 2 1 2 2 3 1 2 1 2 2 3 1 2 1 2 2 1 2 2 2 2 3 1 2 2 2 2 3 1 2 2 2 2 Arithmetic Operations ADD A, Rn ADD A, direct ADD A, @Ri ADD A, #data ADDC A, Rn ADDC A, direct ADDC A, @Ri ADDC A, #data SUBB A, Rn SUBB A, direct SUBB A, @Ri SUBB A, #data INC A INC Rn INC direct INC @Ri DEC A DEC Rn DEC direct DEC @Ri INC DPTR MUL AB DIV AB DA A Logical Operations ANL A, Rn ANL A, direct ANL A, @Ri ANL A, #data ANL direct, A ANL direct, #data ORL A, Rn ORL A, direct ORL A, @Ri ORL A, #data ORL direct, A ORL direct, #data XRL A, Rn XRL A, direct XRL A, @Ri XRL A, #data XRL direct, A 85 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Table 11.1. CIP-51 Instruction Set Summary (Continued) Mnemonic XRL direct, #data CLR A CPL A RL A RLC A RR A RRC A SWAP A Description Bytes Clock Cycles Exclusive-OR immediate to direct byte Clear A Complement A Rotate A left Rotate A left through Carry Rotate A right Rotate A right through Carry Swap nibbles of A 3 1 1 1 1 1 1 1 3 1 1 1 1 1 1 1 Move Register to A Move direct byte to A Move indirect RAM to A Move immediate to A Move A to Register Move direct byte to Register Move immediate to Register Move A to direct byte Move Register to direct byte Move direct byte to direct byte Move indirect RAM to direct byte Move immediate to direct byte Move A to indirect RAM Move direct byte to indirect RAM Move immediate to indirect RAM Load DPTR with 16-bit constant Move code byte relative DPTR to A Move code byte relative PC to A Move external data (8-bit address) to A Move A to external data (8-bit address) Move external data (16-bit address) to A Move A to external data (16-bit address) Push direct byte onto stack Pop direct byte from stack Exchange Register with A Exchange direct byte with A Exchange indirect RAM with A Exchange low nibble of indirect RAM with A 1 2 1 2 1 2 2 2 2 3 2 3 1 2 2 3 1 1 1 1 1 1 2 2 1 2 1 1 1 2 2 2 1 2 2 2 2 3 2 3 2 2 2 3 3 3 3 3 3 3 2 2 1 2 2 2 Clear Carry Clear direct bit Set Carry Set direct bit Complement Carry Complement direct bit 1 2 1 2 1 2 1 2 1 2 1 2 Data Transfer MOV A, Rn MOV A, direct MOV A, @Ri MOV A, #data MOV Rn, A MOV Rn, direct MOV Rn, #data MOV direct, A MOV direct, Rn MOV direct, direct MOV direct, @Ri MOV direct, #data MOV @Ri, A MOV @Ri, direct MOV @Ri, #data MOV DPTR, #data16 MOVC A, @A+DPTR MOVC A, @A+PC MOVX A, @Ri MOVX @Ri, A MOVX A, @DPTR MOVX @DPTR, A PUSH direct POP direct XCH A, Rn XCH A, direct XCH A, @Ri XCHD A, @Ri Boolean Manipulation CLR C CLR bit SETB C SETB bit CPL C CPL bit Rev. 1.5 86 C8051F380/1/2/3/4/5/6/7/C Table 11.1. CIP-51 Instruction Set Summary (Continued) Mnemonic ANL C, bit ANL C, /bit ORL C, bit ORL C, /bit MOV C, bit MOV bit, C Description AND direct bit to Carry AND complement of direct bit to Carry OR direct bit to carry OR complement of direct bit to Carry Move direct bit to Carry Move Carry to direct bit Bytes Clock Cycles 2 2 2 2 2 2 2 2 2 2 2 2 Program Flow Timings are listed with the PFE on and FLRT = 0. Extra cycles are required for branches if FLRT = 1. JC rel JNC rel JB bit, rel JNB bit, rel JBC bit, rel ACALL addr11 LCALL addr16 RET RETI AJMP addr11 LJMP addr16 SJMP rel JMP @A+DPTR JZ rel JNZ rel CJNE A, direct, rel CJNE A, #data, rel CJNE Rn, #data, rel CJNE @Ri, #data, rel DJNZ Rn, rel DJNZ direct, rel NOP 87 Jump if Carry is set Jump if Carry is not set Jump if direct bit is set Jump if direct bit is not set Jump if direct bit is set and clear bit Absolute subroutine call Long subroutine call Return from subroutine Return from interrupt Absolute jump Long jump Short jump (relative address) Jump indirect relative to DPTR Jump if A equals zero Jump if A does not equal zero Compare direct byte to A and jump if not equal Compare immediate to A and jump if not equal Compare immediate to Register and jump if not equal Compare immediate to indirect and jump if not equal Decrement Register and jump if not zero Decrement direct byte and jump if not zero No operation Rev. 1.5 2 2 3 3 3 2 3 1 1 2 3 2 1 2 2 3 3 3 2/4 2/4 3/5 3/5 3/5 4 5 6 6 4 5 4 4 2/4 2/4 4/6 3/5 3/5 3 4/6 2 3 1 2/4 3/5 1 C8051F380/1/2/3/4/5/6/7/C Notes on Registers, Operands and Addressing Modes: Rn - Register R0–R7 of the currently selected register bank. @Ri - Data RAM location addressed indirectly through R0 or R1. rel - 8-bit, signed (two’s complement) offset relative to the first byte of the following instruction. Used by SJMP and all conditional jumps. direct - 8-bit internal data location’s address. This could be a direct-access Data RAM location (0x00– 0x7F) or an SFR (0x80–0xFF). #data - 8-bit constant #data16 - 16-bit constant bit - Direct-accessed bit in Data RAM or SFR addr11 - 11-bit destination address used by ACALL and AJMP. The destination must be within the same 2 kB page of program memory as the first byte of the following instruction. addr16 - 16-bit destination address used by LCALL and LJMP. The destination may be anywhere within the 8 kB program memory space. There is one unused opcode (0xA5) that performs the same function as NOP. All mnemonics copyrighted © Intel Corporation 1980. Rev. 1.5 88 C8051F380/1/2/3/4/5/6/7/C 11.2. CIP-51 Register Descriptions Following are descriptions of SFRs related to the operation of the CIP-51 System Controller. Reserved bits should always be written to the value indicated in the SFR description. Future product versions may use these bits to implement new features in which case the reset value of the bit will be the indicated value, selecting the feature's default state. Detailed descriptions of the remaining SFRs are included in the sections of the datasheet associated with their corresponding system function. SFR Definition 11.1. DPL: Data Pointer Low Byte Bit 7 6 5 4 Name DPL[7:0] Type R/W Reset 0 0 0 0 SFR Address = 0x82; SFR Page = All Pages Bit Name 7:0 DPL[7:0] 3 2 1 0 0 0 0 0 3 2 1 0 0 0 0 0 Function Data Pointer Low. The DPL register is the low byte of the 16-bit DPTR. SFR Definition 11.2. DPH: Data Pointer High Byte Bit 7 6 5 4 Name DPH[7:0] Type R/W Reset 0 0 0 0 SFR Address = 0x83; SFR Page = All Pages Bit Name 7:0 DPH[7:0] Function Data Pointer High. The DPH register is the high byte of the 16-bit DPTR. 89 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 11.3. SP: Stack Pointer Bit 7 6 5 4 Name SP[7:0] Type R/W Reset 0 0 0 0 SFR Address = 0x81; SFR Page = All Pages Bit Name 7:0 SP[7:0] 3 2 1 0 0 1 1 1 Function Stack Pointer. The Stack Pointer holds the location of the top of the stack. The stack pointer is incremented before every PUSH operation. The SP register defaults to 0x07 after reset. SFR Definition 11.4. ACC: Accumulator Bit 7 6 5 4 Name ACC[7:0] Type R/W Reset 0 0 0 0 3 2 1 0 0 0 0 0 SFR Address = 0xE0; SFR Page = All Pages; Bit-Addressable Bit Name Function 7:0 ACC[7:0] Accumulator. This register is the accumulator for arithmetic operations. SFR Definition 11.5. B: B Register Bit 7 6 5 4 Name B[7:0] Type R/W Reset 0 0 0 0 3 2 1 0 0 0 0 0 SFR Address = 0xF0; SFR Page = All Pages; Bit-Addressable Bit Name Function 7:0 B[7:0] B Register. This register serves as a second accumulator for certain arithmetic operations. Rev. 1.5 90 C8051F380/1/2/3/4/5/6/7/C SFR Definition 11.6. PSW: Program Status Word Bit 7 6 5 Name CY AC F0 Type R/W R/W R/W Reset 0 0 0 4 3 2 1 0 RS[1:0] OV F1 PARITY R/W R/W R/W R 0 0 0 0 0 SFR Address = 0xD0; SFR Page = All Pages; Bit-Addressable Bit Name Function 7 CY Carry Flag. This bit is set when the last arithmetic operation resulted in a carry (addition) or a borrow (subtraction). It is cleared to logic 0 by all other arithmetic operations. 6 AC Auxiliary Carry Flag. This bit is set when the last arithmetic operation resulted in a carry into (addition) or a borrow from (subtraction) the high order nibble. It is cleared to logic 0 by all other arithmetic operations. 5 F0 User Flag 0. This is a bit-addressable, general purpose flag for use under software control. 4:3 RS[1:0] Register Bank Select. These bits select which register bank is used during register accesses. 00: Bank 0, Addresses 0x00-0x07 01: Bank 1, Addresses 0x08-0x0F 10: Bank 2, Addresses 0x10-0x17 11: Bank 3, Addresses 0x18-0x1F 2 OV Overflow Flag. This bit is set to 1 under the following circumstances: An ADD, ADDC, or SUBB instruction causes a sign-change overflow. MUL instruction results in an overflow (result is greater than 255). A DIV instruction causes a divide-by-zero condition. A The OV bit is cleared to 0 by the ADD, ADDC, SUBB, MUL, and DIV instructions in all other cases. 1 F1 User Flag 1. This is a bit-addressable, general purpose flag for use under software control. 0 PARITY Parity Flag. This bit is set to logic 1 if the sum of the eight bits in the accumulator is odd and cleared if the sum is even. 91 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 12. Prefetch Engine The C8051F380/1/2/3/4/5/6/7/C family of devices incorporate a 2-byte prefetch engine. Because the access time of the Flash memory is 40 ns, and the minimum instruction time is roughly 20 ns, the prefetch engine is necessary for code execution above 25 MHz. When operating at speeds greater than 25 MHz, the prefetch engine must be enabled by setting PFE0CN.PFEN and FLSCL.FLRT to 1. Instructions are read from Flash memory two bytes at a time by the prefetch engine and given to the CIP-51 processor core to execute. When running linear code (code without any jumps or branches), the prefetch engine allows instructions to be executed at full speed. When a code branch occurs, the processor may be stalled for up to two clock cycles while the next set of code bytes is retrieved from Flash memory. It is recommended that the prefetch be used for optimal code execution timing. Note: The prefetch engine can be disabled when the device is in suspend mode to save power. SFR Definition 12.1. PFE0CN: Prefetch Engine Control Bit 7 6 Name 5 4 3 2 1 PFEN 0 FLBWE Type R R R/W R R R R R/W Reset 0 0 1 0 0 0 0 0 SFR Address = 0xAF; SFR Page = All Pages Bit Name 7:6 Unused 5 PFEN Function Read = 00b, Write = don’t care. Prefetch Enable. This bit enables the prefetch engine. 0: Prefetch engine is disabled. 1: Prefetch engine is enabled. 4:1 Unused Read = 0000b. Write = don’t care. 0 FLBWE Flash Block Write Enable. This bit allows block writes to Flash memory from software. 0: Each byte of a software Flash write is written individually. 1: Flash bytes are written in groups of two. Rev. 1.5 92 C8051F380/1/2/3/4/5/6/7/C 13. Memory Organization The memory organization of the CIP-51 System Controller is similar to that of a standard 8051. There are two separate memory spaces: program memory and data memory. Program and data memory share the same address space but are accessed via different instruction types. The CIP-51 memory organization is shown in Figure 13.1 and Figure 13.2. DATA MEMORY (RAM) INTERNAL DATA ADDRESS SPACE PROGRAM/DATA MEMORY (FLASH) 0xFFFF 0xFC00 0xFBFF 0xFF RESERVED 0x80 0x7F Upper 128 RAM (Indirect Addressing Only) (Direct and Indirect Addressing) FLASH (In-System Programmable in 512 Byte Sectors) 0x30 0x2F 0x20 0x1F 0x00 Bit Addressable Special Function Register's (Direct Addressing Only) Lower 128 RAM (Direct and Indirect Addressing) General Purpose Registers EXTERNAL DATA ADDRESS SPACE 0x0000 0xFFFF Off-Chip XRAM (Available only on devices with EMIF) 0x1000 0x0FFF XRAM - 4096 Bytes (Accessable using MOVX instruction) USB FIFOs 1024 Bytes 0x0000 Figure 13.1. On-Chip Memory Map for 64 kB Devices (C8051F380/1/4/5) 93 Rev. 1.5 0x07FF 0x0400 C8051F380/1/2/3/4/5/6/7/C DATA MEMORY (RAM) INTERNAL DATA ADDRESS SPACE PROGRAM/DATA MEMORY (FLASH) 0x7FFF 0xFF FLASH (In-System Programmable in 512 Byte Sectors) 0x0000 0x80 0x7F Upper 128 RAM (Indirect Addressing Only) (Direct and Indirect Addressing) 0x30 0x2F 0x20 0x1F 0x00 Bit Addressable Special Function Register's (Direct Addressing Only) Lower 128 RAM (Direct and Indirect Addressing) General Purpose Registers EXTERNAL DATA ADDRESS SPACE 0xFFFF Off-Chip XRAM (Available only on devices with EMIF) 0x0800 0x07FF XRAM - 2048 Bytes (Accessable using MOVX instruction) USB FIFOs 1024 Bytes 0x07FF 0x0400 0x0000 Figure 13.2. On-Chip Memory Map for 32 kB Devices (C8051F382/3/6/7) Rev. 1.5 94 C8051F380/1/2/3/4/5/6/7/C DATA MEMORY (RAM) INTERNAL DATA ADDRESS SPACE PROGRAM/DATA MEMORY (FLASH) 0xFF 0x3FFF FLASH (In-System Programmable in 512 Byte Sectors) 0x80 0x7F (Direct and Indirect Addressing) 0x30 0x2F 0x20 0x1F 0x00 0x0000 Upper 128 RAM (Indirect Addressing Only) Bit Addressable Special Function Register's (Direct Addressing Only) Lower 128 RAM (Direct and Indirect Addressing) General Purpose Registers EXTERNAL DATA ADDRESS SPACE 0xFFFF Off-Chip XRAM (Available only on devices with EMIF) 0x0800 0x07FF XRAM - 2048 Bytes (Accessable using MOVX instruction) USB FIFOs 1024 Bytes 0x07FF 0x0400 0x0000 Figure 13.3. On-Chip Memory Map for 16 kB Devices (C8051F38C) 13.1. Program Memory The CIP-51 core has a 64k-byte program memory space. The C8051F380/1/2/3/4/5/6/7/C implements 64 kB, 32 kB, or 16 kB of this program memory space as in-system, re-programmable Flash memory. Note that on the C8051F380/1/4/5 (64 kB version), addresses above 0xFBFF are reserved. Program memory is normally assumed to be read-only. However, the CIP-51 can write to program memory by setting the Program Store Write Enable bit (PSCTL.0) and using the MOVX instruction. This feature provides a mechanism for the CIP-51 to update program code and use the program memory space for non-volatile data storage. Refer to Section “18. Flash Memory” on page 135 for further details. 13.2. Data Memory The CIP-51 includes 256 of internal RAM mapped into the data memory space from 0x00 through 0xFF. The lower 128 bytes of data memory are used for general purpose registers and scratch pad memory. Either direct or indirect addressing may be used to access the lower 128 bytes of data memory. Locations 0x00 through 0x1F are addressable as four banks of general purpose registers, each bank consisting of eight byte-wide registers. The next 16 bytes, locations 0x20 through 0x2F, may either be addressed as bytes or as 128 bit locations accessible with the direct addressing mode. 95 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C The upper 128 bytes of data memory are accessible only by indirect addressing. This region occupies the same address space as the Special Function Registers (SFR) but is physically separate from the SFR space. The addressing mode used by an instruction when accessing locations above 0x7F determines whether the CPU accesses the upper 128 bytes of data memory space or the SFRs. Instructions that use direct addressing will access the SFR space. Instructions using indirect addressing above 0x7F access the upper 128 bytes of data memory. Figure 13.1 illustrates the data memory organization of the CIP-51. 13.3. General Purpose Registers The lower 32 bytes of data memory, locations 0x00 through 0x1F, may be addressed as four banks of general-purpose registers. Each bank consists of eight byte-wide registers designated R0 through R7. Only one of these banks may be enabled at a time. Two bits in the program status word, RS0 (PSW.3) and RS1 (PSW.4), select the active register bank (see description of the PSW in SFR Definition 11.6). This allows fast context switching when entering subroutines and interrupt service routines. Indirect addressing modes use registers R0 and R1 as index registers. 13.4. Bit Addressable Locations In addition to direct access to data memory organized as bytes, the sixteen data memory locations at 0x20 through 0x2F are also accessible as 128 individually addressable bits. Each bit has a bit address from 0x00 to 0x7F. Bit 0 of the byte at 0x20 has bit address 0x00 while bit7 of the byte at 0x20 has bit address 0x07. Bit 7 of the byte at 0x2F has bit address 0x7F. A bit access is distinguished from a full byte access by the type of instruction used (bit source or destination operands as opposed to a byte source or destination). The MCS-51™ assembly language allows an alternate notation for bit addressing of the form XX.B where XX is the byte address and B is the bit position within the byte. For example, the instruction: MOV C, 22h.3 moves the Boolean value at 0x13 (bit 3 of the byte at location 0x22) into the Carry flag. 13.5. Stack A programmer's stack can be located anywhere in the 256-byte data memory. The stack area is designated using the Stack Pointer (SP, 0x81) SFR. The SP will point to the last location used. The next value pushed on the stack is placed at SP+1 and then SP is incremented. A reset initializes the stack pointer to location 0x07. Therefore, the first value pushed on the stack is placed at location 0x08, which is also the first register (R0) of register bank 1. Thus, if more than one register bank is to be used, the SP should be initialized to a location in the data memory not being used for data storage. The stack depth can extend up to 256 bytes. Rev. 1.5 96 C8051F380/1/2/3/4/5/6/7/C 14. External Data Memory Interface and On-Chip XRAM 4 kB (C8051F380/1/4/5) or 2 kB (C8051F382/3/6/7/C) of RAM are included on-chip, and mapped into the external data memory space (XRAM). The 1 kB of USB FIFO space can also be mapped into XRAM address space for additional general-purpose data storage. Additionally, an External Memory Interface (EMIF) is available on the C8051F380/2/4/6 devices, which can be used to access off-chip data memories and memory-mapped devices connected to the GPIO ports. The external memory space may be accessed using the external move instruction (MOVX) and the data pointer (DPTR), or using the MOVX indirect addressing mode using R0 or R1. If the MOVX instruction is used with an 8-bit address operand (such as @R1), then the high byte of the 16-bit address is provided by the External Memory Interface Control Register (EMI0CN, shown in SFR Definition 14.1). Note: the MOVX instruction can also be used for writing to the FLASH memory. See Section “18. Flash Memory” on page 135 for details. The MOVX instruction accesses XRAM by default. 14.1. Accessing XRAM The XRAM memory space is accessed using the MOVX instruction. The MOVX instruction has two forms, both of which use an indirect addressing method. The first method uses the Data Pointer, DPTR, a 16-bit register which contains the effective address of the XRAM location to be read from or written to. The second method uses R0 or R1 in combination with the EMI0CN register to generate the effective XRAM address. Examples of both of these methods are given below. 14.1.1. 16-Bit MOVX Example The 16-bit form of the MOVX instruction accesses the memory location pointed to by the contents of the DPTR register. The following series of instructions reads the value of the byte at address 0x1234 into the accumulator A: MOV MOVX DPTR, #1234h A, @DPTR ; load DPTR with 16-bit address to read (0x1234) ; load contents of 0x1234 into accumulator A The above example uses the 16-bit immediate MOV instruction to set the contents of DPTR. Alternately, the DPTR can be accessed through the SFR registers DPH, which contains the upper 8-bits of DPTR, and DPL, which contains the lower 8-bits of DPTR. 14.1.2. 8-Bit MOVX Example The 8-bit form of the MOVX instruction uses the contents of the EMI0CN SFR to determine the upper 8-bits of the effective address to be accessed and the contents of R0 or R1 to determine the lower 8-bits of the effective address to be accessed. The following series of instructions read the contents of the byte at address 0x1234 into the accumulator A. MOV MOV MOVX 97 EMI0CN, #12h R0, #34h a, @R0 ; load high byte of address into EMI0CN ; load low byte of address into R0 (or R1) ; load contents of 0x1234 into accumulator A Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 14.2. Accessing USB FIFO Space The C8051F380/1/2/3/4/5/6/7/C include 1k of RAM which functions as USB FIFO space. Figure 14.1 shows an expanded view of the FIFO space and user XRAM. FIFO space is normally accessed via USB FIFO registers; see Section “21.5. FIFO Management” on page 181 for more information on accessing these FIFOs. The MOVX instruction should not be used to load or modify USB data in the FIFO space. Unused areas of the USB FIFO space may be used as general purpose XRAM if necessary. The FIFO block operates on the USB clock domain; thus the USB clock must be active when accessing FIFO space. Note that the number of SYSCLK cycles required by the MOVX instruction is increased when accessing USB FIFO space. To access the FIFO RAM directly using MOVX instructions, the following conditions must be met: (1) the USBFAE bit in register EMI0CF must be set to 1, and (2) the USB clock must be greater than or equal to twice the SYSCLK (USBCLK > 2 x SYSCLK). When this bit is set, the USB FIFO space is mapped into XRAM space at addresses 0x0400 to 0x07FF. The normal XRAM (on-chip or external) at the same addresses cannot be accessed when the USBFAE bit is set to 1. Important Note: The USB clock must be active when accessing FIFO space. 0xFFFF On/Off-Chip XRAM 0x0800 0x07FF Endpoint0 (64 bytes) 0x07C0 0x07BF Endpoint1 (128 bytes) 0x0740 0x073F Endpoint2 (256 bytes) USB FIFO Space 0x0640 0x063F (USB Clock Domain) Endpoint3 (512 bytes) 0x0440 0x043F Free (64 bytes) 0x0400 0x03FF On/Off-Chip XRAM 0x0000 Figure 14.1. USB FIFO Space and XRAM Memory Map with USBFAE set to ‘1’ Rev. 1.5 98 C8051F380/1/2/3/4/5/6/7/C 14.3. Configuring the External Memory Interface Configuring the External Memory Interface consists of five steps: 1. Configure the Output Modes of the associated port pins as either push-pull or open-drain (push-pull is most common), and skip the associated pins in the crossbar. 2. Configure Port latches to “park” the EMIF pins in a dormant state (usually by setting them to logic 1). 3. Select Multiplexed mode or Non-multiplexed mode. 4. Select the memory mode (on-chip only, split mode without bank select, split mode with bank select, or off-chip only). 5. Set up timing to interface with off-chip memory or peripherals. Each of these five steps is explained in detail in the following sections. The Port selection, Multiplexed mode selection, and Mode bits are located in the EMI0CF register shown in SFR Definition 14.5. 14.4. Port Configuration The External Memory Interface appears on Ports 4, 3, 2, and 1 when it is used for off-chip memory access. When the EMIF is used, the Crossbar should be configured to skip over the control lines P1.7 (WR), P1.6 (RD), and if multiplexed mode is selected P1.3 (ALE) using the P1SKIP register. For more information about configuring the Crossbar, see Section “Figure 20.1. Port I/O Functional Block Diagram (Port 0 through Port 3)” on page 153. The External Memory Interface claims the associated Port pins for memory operations ONLY during the execution of an off-chip MOVX instruction. Once the MOVX instruction has completed, control of the Port pins reverts to the Port latches or to the Crossbar settings for those pins. See Section “20. Port Input/Output” on page 153 for more information about the Crossbar and Port operation and configuration. The Port latches should be explicitly configured to ‘park’ the External Memory Interface pins in a dormant state, most commonly by setting them to a logic 1. During the execution of the MOVX instruction, the External Memory Interface will explicitly disable the drivers on all Port pins that are acting as Inputs (Data[7:0] during a READ operation, for example). The Output mode of the Port pins (whether the pin is configured as Open-Drain or Push-Pull) is unaffected by the External Memory Interface operation, and remains controlled by the PnMDOUT registers. In most cases, the output modes of all EMIF pins should be configured for push-pull mode. 99 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 14.1. EMI0CN: External Memory Interface Control Bit 7 6 5 4 3 Name PGSEL[7:0] Type R/W Reset 0 0 0 SFR Address = 0xAA; SFR Page = All Pages Bit Name 7:0 PGSEL[7:0] 0 0 2 1 0 0 0 0 Function XRAM Page Select Bits. The XRAM Page Select Bits provide the high byte of the 16-bit external data memory address when using an 8-bit MOVX command, effectively selecting a 256-byte page of RAM. 0x00: 0x0000 to 0x00FF 0x01: 0x0100 to 0x01FF ... 0xFE: 0xFE00 to 0xFEFF 0xFF: 0xFF00 to 0xFFFF Rev. 1.5 100 C8051F380/1/2/3/4/5/6/7/C SFR Definition 14.2. EMI0CF: External Memory Interface Configuration Bit 7 Name 6 5 USBFAE 4 3 2 1 0 EMD2 EMD[1:0] EALE[1:0] R/W R/W Type R R/W R R/W Reset 0 0 0 0 SFR Address = 0x85; SFR Page = All Pages Bit Name 0 0 1 1 Function 7 Unused Read = 0b; Write = don’t care. 6 USBFAE USB FIFO Access Enable. 0: USB FIFO RAM not available through MOVX instructions. 1: USB FIFO RAM available using MOVX instructions. The 1k of USB RAM will be mapped in XRAM space at addresses 0x0400 to 0x07FF. The USB clock must be active and greater than or equal to twice the SYSCLK (USBCLK > 2 x SYSCLK) to access this area with MOVX instructions. 5 Unused Read = 0b; Write = don’t care. 4 EMD2 EMIF Multiplex Mode Select. 0: EMIF operates in multiplexed address/data mode. 1: EMIF operates in non-multiplexed mode (separate address and data pins). 3:2 EMD[1:0] EMIF Operating Mode Select. These bits control the operating mode of the External Memory Interface. 00: Internal Only: MOVX accesses on-chip XRAM only. All effective addresses alias to on-chip memory space. 01: Split Mode without Bank Select: Accesses below the on-chip XRAM boundary are directed on-chip. Accesses above the on-chip XRAM boundary are directed off-chip. 8-bit off-chip MOVX operations use the current contents of the Address High port latches to resolve upper address byte. Note that in order to access off-chip space, EMI0CN must be set to a page that is not contained in the on-chip address space. 10: Split Mode with Bank Select: Accesses below the on-chip XRAM boundary are directed on-chip. Accesses above the on-chip XRAM boundary are directed off-chip. 8-bit off-chip MOVX operations use the contents of EMI0CN to determine the high-byte of the address. 11: External Only: MOVX accesses off-chip XRAM only. On-chip XRAM is not visible to the CPU. 1:0 EALE[1:0] ALE Pulse-Width Select Bits (only has effect when EMD2 = 0). 00: ALE high and ALE low pulse width = 1 SYSCLK cycle. 01: ALE high and ALE low pulse width = 2 SYSCLK cycles. 10: ALE high and ALE low pulse width = 3 SYSCLK cycles. 11: ALE high and ALE low pulse width = 4 SYSCLK cycles. 101 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 14.5. Multiplexed and Non-multiplexed Selection The External Memory Interface is capable of acting in a Multiplexed mode or a Non-multiplexed mode, depending on the state of the EMD2 (EMI0CF.4) bit. 14.5.1. Multiplexed Configuration In Multiplexed mode, the Data Bus and the lower 8-bits of the Address Bus share the same Port pins: AD[7:0]. In this mode, an external latch (74HC373 or equivalent logic gate) is used to hold the lower 8-bits of the RAM address. The external latch is controlled by the ALE (Address Latch Enable) signal, which is driven by the External Memory Interface logic. An example of a Multiplexed Configuration is shown in Figure 14.2. In Multiplexed mode, the external MOVX operation can be broken into two phases delineated by the state of the ALE signal. During the first phase, ALE is high and the lower 8-bits of the Address Bus are presented to AD[7:0]. During this phase, the address latch is configured such that the ‘Q’ outputs reflect the states of the ‘D’ inputs. When ALE falls, signaling the beginning of the second phase, the address latch outputs remain fixed and are no longer dependent on the latch inputs. Later in the second phase, the Data Bus controls the state of the AD[7:0] port at the time RD or WR is asserted. See Section “14.7.2. Multiplexed Mode” on page 111 for more information. A[15:8] A[15:8] ADDRESS BUS 74HC373 E M I F ALE AD[7:0] G ADDRESS/DATA BUS D Q A[7:0] VDD 64K X 8 SRAM (Optional) 8 I/O[7:0] CE WE OE WR RD Figure 14.2. Multiplexed Configuration Example 14.5.2. Non-multiplexed Configuration In Non-multiplexed mode, the Data Bus and the Address Bus pins are not shared. An example of a Non-multiplexed Configuration is shown in Figure 14.3. See Section “14.7.1. Non-multiplexed Mode” on page 108 for more information about Non-multiplexed operation. Rev. 1.5 102 C8051F380/1/2/3/4/5/6/7/C E M I F A[15:0] A[15:0] ADDRESS BUS VDD (Optional) 8 D[7:0] DATA BUS 64K X 8 SRAM I/O[7:0] CE WE OE WR RD Figure 14.3. Non-multiplexed Configuration Example 103 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 14.6. Memory Mode Selection The external data memory space can be configured in one of four modes, shown in Figure 14.4, based on the EMIF Mode bits in the EMI0CF register (SFR Definition 14.5). These modes are summarized below. More information about the different modes can be found in Section “14.7. Timing” on page 106. EMI0CF[3:2] = 00 EMI0CF[3:2] = 01 0xFFFF EMI0CF[3:2] = 11 EMI0CF[3:2] = 10 0xFFFF 0xFFFF 0xFFFF On-Chip XRAM On-Chip XRAM Off-Chip Memory (No Bank Select) Off-Chip Memory (Bank Select) On-Chip XRAM Off-Chip Memory On-Chip XRAM On-Chip XRAM On-Chip XRAM On-Chip XRAM On-Chip XRAM 0x0000 0x0000 0x0000 0x0000 Figure 14.4. EMIF Operating Modes 14.6.1. Internal XRAM Only When EMI0CF.[3:2] are set to 00, all MOVX instructions will target the internal XRAM space on the device. Memory accesses to addresses beyond the populated space will wrap on 2k or 4k boundaries (depending on the RAM available on the device). As an example, the addresses 0x1000 and 0x2000 both evaluate to address 0x0000 in on-chip XRAM space.  8-bit MOVX operations use the contents of EMI0CN to determine the high-byte of the effective address and R0 or R1 to determine the low-byte of the effective address.  16-bit MOVX operations use the contents of the 16-bit DPTR to determine the effective address. 14.6.2. Split Mode without Bank Select When EMI0CF.[3:2] are set to 01, the XRAM memory map is split into two areas, on-chip space and off-chip space.  Effective addresses below the internal XRAM size boundary will access on-chip XRAM space.  Effective addresses above the internal XRAM size boundary will access off-chip space.  8-bit MOVX operations use the contents of EMI0CN to determine whether the memory access is on-chip or off-chip. However, in the “No Bank Select” mode, an 8-bit MOVX operation will not drive the upper 8-bits A[15:8] of the Address Bus during an off-chip access. This allows the user to manipulate the upper address bits at will by setting the Port state directly via the port latches. This behavior is in contrast with “Split Mode with Bank Select” described below. The lower 8-bits of the Address Bus A[7:0] are driven, determined by R0 or R1.  16-bit MOVX operations use the contents of DPTR to determine whether the memory access is on-chip or off-chip, and unlike 8-bit MOVX operations, the full 16-bits of the Address Bus A[15:0] are driven during the off-chip transaction. Rev. 1.5 104 C8051F380/1/2/3/4/5/6/7/C 14.6.3. Split Mode with Bank Select When EMI0CF.[3:2] are set to 10, the XRAM memory map is split into two areas, on-chip space and off-chip space.  Effective addresses below the internal XRAM size boundary will access on-chip XRAM space. Effective addresses above the internal XRAM size boundary will access off-chip space.  8-bit MOVX operations use the contents of EMI0CN to determine whether the memory access is on-chip or off-chip. The upper 8-bits of the Address Bus A[15:8] are determined by EMI0CN, and the lower 8-bits of the Address Bus A[7:0] are determined by R0 or R1. All 16-bits of the Address Bus A[15:0] are driven in “Bank Select” mode.  16-bit MOVX operations use the contents of DPTR to determine whether the memory access is on-chip or off-chip, and the full 16-bits of the Address Bus A[15:0] are driven during the off-chip transaction.  14.6.4. External Only When EMI0CF[3:2] are set to 11, all MOVX operations are directed to off-chip space. On-chip XRAM is not visible to the CPU. This mode is useful for accessing off-chip memory located between 0x0000 and the internal XRAM size boundary.  8-bit MOVX operations ignore the contents of EMI0CN. The upper Address bits A[15:8] are not driven (identical behavior to an off-chip access in “Split Mode without Bank Select” described above). This allows the user to manipulate the upper address bits at will by setting the Port state directly. The lower 8-bits of the effective address A[7:0] are determined by the contents of R0 or R1.  16-bit MOVX operations use the contents of DPTR to determine the effective address A[15:0]. The full 16-bits of the Address Bus A[15:0] are driven during the off-chip transaction. 105 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 14.7. Timing The timing parameters of the External Memory Interface can be configured to enable connection to devices having different setup and hold time requirements. The Address Setup time, Address Hold time, RD and WR strobe widths, and in multiplexed mode, the width of the ALE pulse are all programmable in units of SYSCLK periods through EMI0TC, shown in SFR Definition 14.3, and EMI0CF[1:0]. The timing for an off-chip MOVX instruction can be calculated by adding 4 SYSCLK cycles to the timing parameters defined by the EMI0TC register. Assuming non-multiplexed operation, the minimum execution time for an off-chip XRAM operation is 5 SYSCLK cycles (1 SYSCLK for RD or WR pulse + 4 SYSCLKs). For multiplexed operations, the Address Latch Enable signal will require a minimum of 2 additional SYSCLK cycles. Therefore, the minimum execution time for an off-chip XRAM operation in multiplexed mode is 7 SYSCLK cycles (2 for ALE + 1 for RD or WR + 4). The programmable setup and hold times default to the maximum delay settings after a reset. Table 14.1 lists the AC parameters for the External Memory Interface, and Figure 14.5 through Figure 14.10 show the timing diagrams for the different External Memory Interface modes and MOVX operations. Rev. 1.5 106 C8051F380/1/2/3/4/5/6/7/C SFR Definition 14.3. EMI0TC: External Memory TIming Control Bit 7 6 5 4 3 2 1 0 Name EAS[1:0] EWR[3:0] EAH[1:0] Type R/W R/W R/W Reset 1 1 1 1 SFR Address = 0x84; SFR Page = All Pages Bit Name 7:6 EAS[1:0] 1 1 Function EMIF Address Setup Time Bits. 00: Address setup time = 0 SYSCLK cycles. 01: Address setup time = 1 SYSCLK cycle. 10: Address setup time = 2 SYSCLK cycles. 11: Address setup time = 3 SYSCLK cycles. 5:2 EWR[3:0] EMIF WR and RD Pulse-Width Control Bits. 0000: WR and RD pulse width = 1 SYSCLK cycle. 0001: WR and RD pulse width = 2 SYSCLK cycles. 0010: WR and RD pulse width = 3 SYSCLK cycles. 0011: WR and RD pulse width = 4 SYSCLK cycles. 0100: WR and RD pulse width = 5 SYSCLK cycles. 0101: WR and RD pulse width = 6 SYSCLK cycles. 0110: WR and RD pulse width = 7 SYSCLK cycles. 0111: WR and RD pulse width = 8 SYSCLK cycles. 1000: WR and RD pulse width = 9 SYSCLK cycles. 1001: WR and RD pulse width = 10 SYSCLK cycles. 1010: WR and RD pulse width = 11 SYSCLK cycles. 1011: WR and RD pulse width = 12 SYSCLK cycles. 1100: WR and RD pulse width = 13 SYSCLK cycles. 1101: WR and RD pulse width = 14 SYSCLK cycles. 1110: WR and RD pulse width = 15 SYSCLK cycles. 1111: WR and RD pulse width = 16 SYSCLK cycles. 1:0 EAH[1:0] EMIF Address Hold Time Bits. 00: Address hold time = 0 SYSCLK cycles. 01: Address hold time = 1 SYSCLK cycle. 10: Address hold time = 2 SYSCLK cycles. 11: Address hold time = 3 SYSCLK cycles. 107 Rev. 1.5 1 1 C8051F380/1/2/3/4/5/6/7/C 14.7.1. Non-multiplexed Mode 14.7.1.1. 16-bit MOVX: EMI0CF[4:2] = 101, 110, or 111 Nonmuxed 16-bit WRITE ADDR[15:8] P2 EMIF ADDRESS (8 MSBs) from DPH P2 ADDR[7:0] P3 EMIF ADDRESS (8 LSBs) from DPL P3 DATA[7:0] P4 EMIF WRITE DATA P4 T T WDS T ACS WDH T T ACW ACH WR P1.7 P1.7 RD P1.6 P1.6 Nonmuxed 16-bit READ ADDR[15:8] P2 EMIF ADDRESS (8 MSBs) from DPH P2 ADDR[7:0] P3 EMIF ADDRESS (8 LSBs) from DPL P3 DATA[7:0] P4 EMIF READ DATA P4 T RDS T ACS T ACW T RDH T ACH RD P1.6 P1.6 WR P1.7 P1.7 Figure 14.5. Non-Multiplexed 16-bit MOVX Timing Rev. 1.5 108 C8051F380/1/2/3/4/5/6/7/C 14.7.1.2. 8-bit MOVX without Bank Select: EMI0CF[4:2] = 101 or 111 Nonmuxed 8-bit WRITE without Bank Select ADDR[15:8] P2 ADDR[7:0] P3 EMIF ADDRESS (8 LSBs) from R0 or R1 P3 DATA[7:0] P4 EMIF WRITE DATA P4 T T WDS T WDH T ACS T ACW ACH WR P1.7 P1.7 RD P1.6 P1.6 Nonmuxed 8-bit READ without Bank Select ADDR[15:8] P2 ADDR[7:0] P3 DATA[7:0] P4 EMIF ADDRESS (8 LSBs) from R0 or R1 EMIF READ DATA T RDS T T ACS ACW P4 T RDH T ACH RD P1.6 P1.6 WR P1.7 P1.7 Figure 14.6. Non-multiplexed 8-bit MOVX without Bank Select Timing 109 P3 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 14.7.1.3. 8-bit MOVX with Bank Select: EMI0CF[4:2] = 110 Muxed 8-bit WRITE with Bank Select ADDR[15:8] P3 AD[7:0] P4 EMIF ADDRESS (8 MSBs) from EMI0CN EMIF ADDRESS (8 LSBs) from R0 or R1 T ALEH ALE P3 EMIF WRITE DATA P4 T ALEL P1.3 P1.3 T T WDS T ACS WDH T T ACW ACH WR P1.7 P1.7 RD P1.6 P1.6 Muxed 8-bit READ with Bank Select ADDR[15:8] P3 AD[7:0] P4 EMIF ADDRESS (8 MSBs) from EMI0CN EMIF ADDRESS (8 LSBs) from R0 or R1 T ALEH ALE P3 EMIF READ DATA T T ALEL RDS P4 T RDH P1.3 P1.3 T ACS T ACW T ACH RD P1.6 P1.6 WR P1.7 P1.7 Figure 14.7. Non-multiplexed 8-bit MOVX with Bank Select Timing Rev. 1.5 110 C8051F380/1/2/3/4/5/6/7/C 14.7.2. Multiplexed Mode 14.7.2.1. 16-bit MOVX: EMI0CF[4:2] = 001, 010, or 011 Muxed 16-bit WRITE ADDR[15:8] P3 AD[7:0] P4 EMIF ADDRESS (8 MSBs) from DPH EMIF ADDRESS (8 LSBs) from DPL T ALEH ALE P3 EMIF WRITE DATA P4 T ALEL P1.3 P1.3 T T WDS T ACS WDH T T ACW ACH WR P1.7 P1.7 RD P1.6 P1.6 Muxed 16-bit READ ADDR[15:8] P3 AD[7:0] P4 EMIF ADDRESS (8 MSBs) from DPH EMIF ADDRESS (8 LSBs) from DPL T ALEH ALE P3 EMIF READ DATA T T ALEL RDS T RDH P1.3 P1.3 T ACS T ACW T ACH RD P1.6 P1.6 WR P1.7 P1.7 Figure 14.8. Multiplexed 16-bit MOVX Timing 111 P4 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 14.7.2.2. 8-bit MOVX without Bank Select: EMI0CF[4:2] = 001 or 011 Muxed 8-bit WRITE Without Bank Select ADDR[15:8] AD[7:0] P3 P4 EMIF ADDRESS (8 LSBs) from R0 or R1 T ALEH ALE EMIF WRITE DATA P4 T ALEL P1.3 P1.3 T T WDS T ACS WDH T T ACW ACH WR P1.7 P1.7 RD P1.6 P1.6 Muxed 8-bit READ Without Bank Select ADDR[15:8] AD[7:0] P3 P4 EMIF ADDRESS (8 LSBs) from R0 or R1 T ALEH ALE EMIF READ DATA T T ALEL RDS P4 T RDH P1.3 P1.3 T ACS T ACW T ACH RD P1.6 P1.6 WR P1.7 P1.7 Figure 14.9. Multiplexed 8-bit MOVX without Bank Select Timing Rev. 1.5 112 C8051F380/1/2/3/4/5/6/7/C 14.7.2.3. 8-bit MOVX with Bank Select: EMI0CF[4:2] = 010 Muxed 8-bit WRITE with Bank Select ADDR[15:8] P3 AD[7:0] P4 EMIF ADDRESS (8 MSBs) from EMI0CN EMIF ADDRESS (8 LSBs) from R0 or R1 T ALEH ALE P3 EMIF WRITE DATA P4 T ALEL P1.3 P1.3 T T WDS T ACS WDH T T ACW ACH WR P1.7 P1.7 RD P1.6 P1.6 Muxed 8-bit READ with Bank Select ADDR[15:8] P3 AD[7:0] P4 EMIF ADDRESS (8 MSBs) from EMI0CN EMIF ADDRESS (8 LSBs) from R0 or R1 T ALEH ALE P3 EMIF READ DATA T T ALEL RDS T RDH P1.3 P1.3 T ACS T ACW T ACH RD P1.6 P1.6 WR P1.7 P1.7 Figure 14.10. Multiplexed 8-bit MOVX with Bank Select Timing 113 P4 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Table 14.1. AC Parameters for External Memory Interface Parameter Description Min* Max* Units TACS Address/Control Setup Time 0 3 x TSYSCLK ns TACW Address/Control Pulse Width 1 x TSYSCLK 16 x TSYSCLK ns TACH Address/Control Hold Time 0 3 x TSYSCLK ns TALEH Address Latch Enable High Time 1 x TSYSCLK 4 x TSYSCLK ns TALEL Address Latch Enable Low Time 1 x TSYSCLK 4 x TSYSCLK ns TWDS Write Data Setup Time 1 x TSYSCLK 19 x TSYSCLK ns TWDH Write Data Hold Time 0 3 x TSYSCLK ns TRDS Read Data Setup Time 20 ns TRDH Read Data Hold Time 0 ns Note: TSYSCLK is equal to one period of the device system clock (SYSCLK). Rev. 1.5 114 C8051F380/1/2/3/4/5/6/7/C 15. Special Function Registers The direct-access data memory locations from 0x80 to 0xFF constitute the special function registers (SFRs). The SFRs provide control and data exchange with the C8051F380/1/2/3/4/5/6/7/C's resources and peripherals. The CIP-51 controller core duplicates the SFRs found in a typical 8051 implementation as well as implementing additional SFRs used to configure and access the sub-systems unique to the C8051F380/1/2/3/4/5/6/7/C. This allows the addition of new functionality while retaining compatibility with the MCS-51™ instruction set. Table 15.1 lists the SFRs implemented in the C8051F380/1/2/3/4/5/6/7/C device family. The SFR registers are accessed anytime the direct addressing mode is used to access memory locations from 0x80 to 0xFF. SFRs with addresses ending in 0x0 or 0x8 (e.g. P0, TCON, SCON0, IE, etc.) are bitaddressable as well as byte-addressable. All other SFRs are byte-addressable only. Unoccupied addresses in the SFR space are reserved for future use. Accessing these areas will have an indeterminate effect and should be avoided. Refer to the corresponding pages of the data sheet, as indicated in Table 15.2, for a detailed description of each register. 15.1. SFR Paging The CIP-51 features SFR paging, allowing the device to map many SFRs into the 0x80 to 0xFF memory address space. The SFR memory space has 256 pages. In this way, each memory location from 0x80 to 0xFF can access up to 256 SFRs. The C8051F380/1/2/3/4/5/6/7/C devices utilize two SFR pages: 0x0, and 0xF. Most SFRs are available on both pages. SFR pages are selected using the Special Function Register Page Selection register, SFRPAGE. The procedure for reading and writing an SFR is as follows: 1. Select the appropriate SFR page number using the SFRPAGE register. 2. Use direct accessing mode to read or write the special function register (MOV instruction). Important Note: When reading or writing SFRs that are not available on all pages within an ISR, it is recommended to save the state of the SFRPAGE register on ISR entry, and restore state on exit. SFR Definition 15.1. SFRPAGE: SFR Page Bit 7 6 5 4 3 Name SFRPAGE[7:0] Type R/W Reset 0 0 0 0 SFR Address = 0xBF; SFR Page = All Pages Bit Name 7:0 SFRPAGE[7:0] 0 2 1 0 0 0 0 Function SFR Page Bits. Represents the SFR Page the C8051 core uses when reading or modifying SFRs. Write: Sets the SFR Page. Read: Byte is the SFR page the C8051 core is using. 115 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Page Address Table 15.1. Special Function Register (SFR) Memory Map F8 F0 E8 E0 0 F D8 D0 0 F 0 C0 F 0 B8 F B0 A8 A0 98 0 90 F 88 80 C8 0(8) 1(9) 2(A) 3(B) 4(C) 5(D) 6(E) SPI0CN PCA0L PCA0H PCA0CPL0 PCA0CPH0 PCA0CPL4 PCA0CPH4 B P0MDIN P1MDIN P2MDIN P3MDIN P4MDIN EIP1 ADC0CN PCA0CPL1 PCA0CPH1 PCA0CPL2 PCA0CPH2 PCA0CPL3 PCA0CPH3 IT01CF ACC XBR0 XBR1 XBR2 SMOD1 EIE1 CKCON1 PCA0CN PCA0MD PCA0CPM0 PCA0CPM1 PCA0CPM2 PCA0CPM3 PCA0CPM4 PSW REF0CN SCON1 SBUF1 P0SKIP P1SKIP P2SKIP TMR2CN TMR2RLL TMR2RLH TMR2L TMR2H SMB0ADM REG01CN TMR5CN TMR5RLL TMR5RLH TMR5L TMR5H SMB1ADM SMB0CN SMB0CF SMB0DAT ADC0GTL ADC0GTH ADC0LTL ADC0LTH SMB1CN SMB1CF SMB1DAT CLKMUL ADC0CF IP AMX0N AMX0P ADC0L ADC0H SMBTC P3 OSCXCN OSCICN OSCICL SBRLL1 SBRLH1 FLSCL IE CLKSEL EMI0CN SBCON1 P4MDOUT P2 SPI0CFG SPI0CKR SPI0DAT P0MDOUT P1MDOUT P2MDOUT SCON0 SBUF0 CPT1CN CPT0CN CPT1MD CPT0MD CPT1MX TMR3CN TMR3RLL TMR3RLH TMR3L TMR3H P1 USB0ADR TMR4CN TMR4RLL TMR4RLH TMR4L TMR4H TCON TMOD TL0 TL1 TH0 TH1 CKCON P0 SP DPL DPH EMI0TC EMI0CF OSCLCN 0(8) 1(9) 2(A) 3(B) 4(C) 5(D) 6(E) 7(F) VDM0CN EIP2 RSTSRC EIE2 P3SKIP USB0XCN SMB0ADR SMB1ADR P4 SFRPAGE FLKEY PFE0CN P3MDOUT CPT0MX USB0DAT PSCTL PCON 7(F) Notes: 1. SFR Addresses ending in 0x0 or 0x8 are bit-addressable locations and can be used with bitwise instructions. 2. Unless indicated otherwise, SFRs are available on both page 0 and page F. Rev. 1.5 116 C8051F380/1/2/3/4/5/6/7/C Table 15.2. Special Function Registers SFRs are listed in alphabetical order. All undefined SFR locations are reserved Register Address Page Description Page ACC 0xE0 All Pages Accumulator 90 ADC0CF 0xBC All Pages ADC0 Configuration 57 ADC0CN 0xE8 All Pages ADC0 Control 59 ADC0GTH 0xC4 All Pages ADC0 Greater-Than Compare High 60 ADC0GTL 0xC3 All Pages ADC0 Greater-Than Compare Low 60 ADC0H 0xBE All Pages ADC0 High 58 ADC0L 0xBD All Pages ADC0 Low 58 ADC0LTH 0xC6 All Pages ADC0 Less-Than Compare Word High 61 ADC0LTL 0xC5 All Pages ADC0 Less-Than Compare Word Low 61 AMX0N 0xBA All Pages AMUX0 Negative Channel Select 65 AMX0P 0xBB All Pages AMUX0 Positive Channel Select 64 B 0xF0 All Pages B Register 90 CKCON 0x8E All Pages Clock Control 264 CKCON1 0xE4 F Clock Control 1 265 CLKMUL 0xB9 0 Clock Multiplier 147 CLKSEL 0xA9 All Pages Clock Select 144 CPT0CN 0x9B All Pages Comparator0 Control 71 CPT0MD 0x9D All Pages Comparator0 Mode Selection 72 CPT0MX 0x9F All Pages Comparator0 MUX Selection 76 CPT1CN 0x9A All Pages Comparator1 Control 73 CPT1MD 0x9C All Pages Comparator1 Mode Selection 74 CPT1MX 0x9E All Pages Comparator1 MUX Selection 77 DPH 0x83 All Pages Data Pointer High 89 DPL 0x82 All Pages Data Pointer Low 89 EIE1 0xE6 All Pages Extended Interrupt Enable 1 123 EIE2 0xE7 All Pages Extended Interrupt Enable 2 125 EIP1 0xF6 All Pages Extended Interrupt Priority 1 124 EIP2 0xF7 All Pages Extended Interrupt Priority 2 126 EMI0CF 0x85 All Pages External Memory Interface Configuration 101 EMI0CN 0xAA All Pages External Memory Interface Control 100 EMI0TC 0x84 All Pages External Memory Interface Timing 107 FLKEY 0xB7 All Pages Flash Lock and Key 140 FLSCL 0xB6 All Pages Flash Scale 141 117 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Table 15.2. Special Function Registers (Continued) SFRs are listed in alphabetical order. All undefined SFR locations are reserved Register Address Page Description Page IE 0xA8 All Pages Interrupt Enable 121 IP 0xB8 All Pages Interrupt Priority 122 IT01CF 0xE4 OSCICL 0xB3 All Pages Internal Oscillator Calibration 145 OSCICN 0xB2 All Pages Internal Oscillator Control 146 OSCLCN 0x86 All Pages Internal Low-Frequency Oscillator Control 148 OSCXCN 0xB1 All Pages External Oscillator Control 152 P0 0x80 All Pages Port 0 Latch 162 P0MDIN 0xF1 All Pages Port 0 Input Mode Configuration 162 P0MDOUT 0xA4 All Pages Port 0 Output Mode Configuration 163 P0SKIP 0xD4 All Pages Port 0 Skip 163 P1 0x90 All Pages Port 1 Latch 164 P1MDIN 0xF2 All Pages Port 1 Input Mode Configuration 164 P1MDOUT 0xA5 All Pages Port 1 Output Mode Configuration 165 P1SKIP 0xD5 All Pages Port 1 Skip 165 P2 0xA0 All Pages Port 2 Latch 166 P2MDIN 0xF3 All Pages Port 2 Input Mode Configuration 166 P2MDOUT 0xA6 All Pages Port 2 Output Mode Configuration 167 P2SKIP 0xD6 All Pages Port 2 Skip 167 P3 0xB0 All Pages Port 3 Latch 168 P3MDIN 0xF4 All Pages Port 3 Input Mode Configuration 168 P3MDOUT 0xA7 All Pages Port 3 Output Mode Configuration 169 P3SKIP 0xDF All Pages Port 3Skip 169 P4 0xC7 All Pages Port 4 Latch 170 P4MDIN 0xF5 All Pages Port 4 Input Mode Configuration 170 P4MDOUT 0xAE All Pages Port 4 Output Mode Configuration 171 PCA0CN 0xD8 All Pages PCA Control 311 PCA0CPH0 0xFC All Pages PCA Capture 0 High 315 PCA0CPH1 0xEA All Pages PCA Capture 1 High 315 PCA0CPH2 0xEC All Pages PCA Capture 2 High 315 PCA0CPH3 0xEE All Pages PCA Capture 3High 315 PCA0CPH4 0xFE All Pages PCA Capture 4 High 315 PCA0CPL0 0xFB All Pages PCA Capture 0 Low 315 PCA0CPL1 0xE9 All Pages PCA Capture 1 Low 315 0 INT0/INT1 Configuration Rev. 1.5 128 118 C8051F380/1/2/3/4/5/6/7/C Table 15.2. Special Function Registers (Continued) SFRs are listed in alphabetical order. All undefined SFR locations are reserved Register Address PCA0CPL2 0xEB All Pages PCA Capture 2 Low 315 PCA0CPL3 0xED All Pages PCA Capture 3 Low 315 PCA0CPL4 0xFD All Pages PCA Capture 4 Low 315 PCA0CPM0 0xDA All Pages PCA Module 0 Mode Register 313 PCA0CPM1 0xDB All Pages PCA Module 1 Mode Register 313 PCA0CPM2 0xDC All Pages PCA Module 2 Mode Register 313 PCA0CPM3 0xDD All Pages PCA Module 3 Mode Register 313 PCA0CPM4 0xDE All Pages PCA Module 4 Mode Register 313 PCA0H 0xFA All Pages PCA Counter High 314 PCA0L 0xF9 All Pages PCA Counter Low 314 PCA0MD 0xD9 All Pages PCA Mode 312 PCON 0x87 All Pages Power Control 82 PFE0CN 0xAF All Pages Prefetch Engine Control 92 PSCTL 0x8F All Pages Program Store R/W Control 139 PSW 0xD0 All Pages Program Status Word 91 REF0CN 0xD1 All Pages Voltage Reference Control 67 REG01CN 0xC9 All Pages Voltage Regulator 0 and 1 Control 79 RSTSRC 0xEF All Pages Reset Source Configuration/Status 134 SBCON1 0xAC All Pages UART1 Baud Rate Generator Control 248 SBRLH1 0xB5 All Pages UART1 Baud Rate Generator High 248 SBRLL1 0xB4 All Pages UART1 Baud Rate Generator Low 249 SBUF0 0x99 All Pages UART0 Data Buffer 238 SBUF1 0xD3 All Pages UART1 Data Buffer 247 SCON0 0x98 All Pages UART0 Control 237 SCON1 0xD2 All Pages UART1 Control 245 SFRPAGE 0xBF All Pages SFR Page Select 115 SMB0ADM 0xCE 0 SMBus0 Address Mask 219 SMB0ADR 0xCF 0 SMBus0 Address 218 SMB0CF 0xC1 0 SMBus0 Configuration 211 SMB0CN 0xC0 0 SMBus0 Control 215 SMB0DAT 0xC2 0 SMBus0 Data 221 SMB1ADM 0xCE F SMBus1 Address Mask 220 SMB1ADR 0xCF F SMBus1 Address 219 SMB1CF 0xC1 F SMBus1 Configuration 211 119 Page Description Rev. 1.5 Page C8051F380/1/2/3/4/5/6/7/C Table 15.2. Special Function Registers (Continued) SFRs are listed in alphabetical order. All undefined SFR locations are reserved Register Address Page Description SMB1CN 0xC0 F SMBus1 Control 216 SMB1DAT 0xC2 F SMBus1 Data 222 SMBTC 0xB9 F SMBus0/1 Timing Control 213 SMOD1 0xE5 All Pages UART1 Mode 246 SP 0x81 All Pages Stack Pointer 90 SPI0CFG 0xA1 All Pages SPI Configuration 257 SPI0CKR 0xA2 All Pages SPI Clock Rate Control 259 SPI0CN 0xF8 All Pages SPI Control 258 SPI0DAT 0xA3 All Pages SPI Data 259 TCON 0x88 All Pages Timer/Counter Control 270 TH0 0x8C All Pages Timer/Counter 0 High 273 TH1 0x8D All Pages Timer/Counter 1 High 273 TL0 0x8A All Pages Timer/Counter 0 Low 272 TL1 0x8B All Pages Timer/Counter 1 Low 272 TMOD 0x89 All Pages Timer/Counter Mode 271 TMR2CN 0xC8 0 Timer/Counter 2 Control 278 TMR2H 0xCD 0 Timer/Counter 2 High 280 TMR2L 0xCC 0 Timer/Counter 2 Low 279 TMR2RLH 0xCB 0 Timer/Counter 2 Reload High 279 TMR2RLL 0xCA 0 Timer/Counter 2 Reload Low 279 TMR3CN 0x91 0 Timer/Counter 3 Control 285 TMR3H 0x95 0 Timer/Counter 3 High 287 TMR3L 0x94 0 Timer/Counter 3 Low 286 TMR3RLH 0x93 0 Timer/Counter 3 Reload High 286 TMR3RLL 0x92 0 Timer/Counter 3 Reload Low 286 TMR4CN 0x91 F Timer/Counter 4 Control 290 TMR4H 0x95 F Timer/Counter 4 High 292 TMR4L 0x94 F Timer/Counter 4 Low 291 TMR4RLH 0x93 F Timer/Counter 4 Reload High 291 TMR4RLL 0x92 F Timer/Counter 4 Reload Low 291 TMR5CN 0xC8 F Timer/Counter 5 Control 295 TMR5H 0xCD F Timer/Counter 5 High 297 TMR5L 0xCC F Timer/Counter 5 Low 296 TMR5RLH 0xCB F Timer/Counter 5 Reload High 296 Rev. 1.5 Page 120 C8051F380/1/2/3/4/5/6/7/C Table 15.2. Special Function Registers (Continued) SFRs are listed in alphabetical order. All undefined SFR locations are reserved Register Address Page TMR5RLL 0xCA F USB0ADR 0x96 All Pages USB0 Indirect Address Register 176 USB0DAT 0x97 All Pages USB0 Data Register 177 USB0XCN 0xD7 All Pages USB0 Transceiver Control 174 VDM0CN 0xFF 132 XBR0 0xE1 All Pages VDD Monitor Control All Pages Port I/O Crossbar Control 0 XBR1 0xE2 All Pages Port I/O Crossbar Control 1 160 XBR2 0xE3 All Pages Port I/O Crossbar Control 2 161 121 Description Timer/Counter 5 Reload Low Rev. 1.5 Page 296 159 C8051F380/1/2/3/4/5/6/7/C 16. Interrupts The C8051F380/1/2/3/4/5/6/7/C include an extended interrupt system supporting multiple interrupt sources with two priority levels. The allocation of interrupt sources between on-chip peripherals and external inputs pins varies according to the specific version of the device. Each interrupt source has one or more associated interrupt-pending flag(s) located in an SFR. When a peripheral or external source meets a valid interrupt condition, the associated interrupt-pending flag is set to logic 1. If interrupts are enabled for the source, an interrupt request is generated when the interrupt-pending flag is set. As soon as execution of the current instruction is complete, the CPU generates an LCALL to a predetermined address to begin execution of an interrupt service routine (ISR). Each ISR must end with an RETI instruction, which returns program execution to the next instruction that would have been executed if the interrupt request had not occurred. If interrupts are not enabled, the interrupt-pending flag is ignored by the hardware and program execution continues as normal. (The interrupt-pending flag is set to logic 1 regardless of the interrupt's enable/disable state.) Each interrupt source can be individually enabled or disabled through the use of an associated interrupt enable bit in an SFR (IE, EIE1, or EIE2). However, interrupts must first be globally enabled by setting the EA bit (IE.7) to logic 1 before the individual interrupt enables are recognized. Setting the EA bit to logic 0 disables all interrupt sources regardless of the individual interrupt-enable settings. Note: Any instruction that clears a bit to disable an interrupt should be immediately followed by an instruction that has two or more opcode bytes. Using EA (global interrupt enable) as an example: // in 'C': EA = 0; // clear EA bit. EA = 0; // this is a dummy instruction with two-byte opcode. ; in assembly: CLR EA ; clear EA bit. CLR EA ; this is a dummy instruction with two-byte opcode. For example, if an interrupt is posted during the execution phase of a "CLR EA" opcode (or any instruction which clears a bit to disable an interrupt source), and the instruction is followed by a single-cycle instruction, the interrupt may be taken. However, a read of the enable bit will return a 0 inside the interrupt service routine. When the bit-clearing opcode is followed by a multi-cycle instruction, the interrupt will not be taken. Some interrupt-pending flags are automatically cleared by the hardware when the CPU vectors to the ISR. However, most are not cleared by the hardware and must be cleared by software before returning from the ISR. If an interrupt-pending flag remains set after the CPU completes the return-from-interrupt (RETI) instruction, a new interrupt request will be generated immediately and the CPU will re-enter the ISR after the completion of the next instruction. Rev. 1.5 122 C8051F380/1/2/3/4/5/6/7/C 16.1. MCU Interrupt Sources and Vectors The C8051F380/1/2/3/4/5/6/7/C MCUs support several interrupt sources. Software can simulate an interrupt by setting any interrupt-pending flag to logic 1. If interrupts are enabled for the flag, an interrupt request will be generated and the CPU will vector to the ISR address associated with the interrupt-pending flag. MCU interrupt sources, associated vector addresses, priority order and control bits are summarized in Table 16.1. Refer to the datasheet section associated with a particular on-chip peripheral for information regarding valid interrupt conditions for the peripheral and the behavior of its interrupt-pending flag(s). 16.1.1. Interrupt Priorities Each interrupt source can be individually programmed to one of two priority levels: low or high. A low priority interrupt service routine can be preempted by a high priority interrupt. A high priority interrupt cannot be preempted. Each interrupt has an associated interrupt priority bit in an SFR (IP, EIP1, or EIP2) used to configure its priority level. Low priority is the default. If two interrupts are recognized simultaneously, the interrupt with the higher priority is serviced first. If both interrupts have the same priority level, a fixed priority order is used to arbitrate, given in Table 16.1. 16.1.2. Interrupt Latency Interrupt response time depends on the state of the CPU when the interrupt occurs. Pending interrupts are sampled and priority decoded each system clock cycle. Therefore, the fastest possible response time is 6 system clock cycles: 1 clock cycle to detect the interrupt and 5 clock cycles to complete the LCALL to the ISR. If an interrupt is pending when a RETI is executed, a single instruction is executed before an LCALL is made to service the pending interrupt. Therefore, the maximum response time for an interrupt (when no other interrupt is currently being serviced or the new interrupt is of greater priority) occurs when the CPU is performing an RETI instruction followed by a DIV as the next instruction. In this case, the response time is 20 system clock cycles: 1 clock cycle to detect the interrupt, 6 clock cycles to execute the RETI, 8 clock cycles to complete the DIV instruction and 5 clock cycles to execute the LCALL to the ISR. If the CPU is executing an ISR for an interrupt with equal or higher priority, the new interrupt will not be serviced until the current ISR completes, including the RETI and following instruction. Note that the CPU is stalled during Flash write operations and USB FIFO MOVX accesses. Interrupt service latency will be increased for interrupts occurring while the CPU is stalled. The latency for these situations will be determined by the standard interrupt service procedure (as described above) and the amount of time the CPU is stalled. 16.2. Interrupt Register Descriptions The SFRs used to enable the interrupt sources and set their priority level are described in this section. Refer to the data sheet section associated with a particular on-chip peripheral for information regarding valid interrupt conditions for the peripheral and the behavior of its interrupt-pending flag(s). 123 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Priority Order Reset 0x0000 Top External Interrupt 0 (INT0) Timer 0 Overflow External Interrupt 1 (INT1) Timer 1 Overflow UART0 0x0003 0 0x000B 0x0013 Pending Flag None by HW? Interrupt Vector Bit Interrupt Source Address? Cleared Table 16.1. Interrupt Summary Enable Flag Priority Control N/A N/A IE0 (TCON.1) Y Y Always Always Enabled Highest EX0 (IE.0) PX0 (IP.0) 1 2 TF0 (TCON.5) IE1 (TCON.3) Y Y Y Y ET0 (IE.1) PT0 (IP.1) EX1 (IE.2) PX1 (IP.2) 0x001B 0x0023 3 4 Y Y Y N ET1 (IE.3) PT1 (IP.3) ES0 (IE.4) PS0 (IP.4) Timer 2 Overflow 0x002B 5 Y N ET2 (IE.5) PT2 (IP.5) SPI0 0x0033 6 Y N ESPI0 (IE.6) PSPI0 (IP.6) SMB0 0x003B 7 TF1 (TCON.7) RI0 (SCON0.0) TI0 (SCON0.1) TF2H (TMR2CN.7) TF2L (TMR2CN.6) SPIF (SPI0CN.7) WCOL (SPI0CN.6) MODF (SPI0CN.5) RXOVRN (SPI0CN.4) SI (SMB0CN.0) Y N USB0 0x0043 8 Special N N ADC0 Window Compare ADC0 Conversion Complete Programmable Counter Array Comparator0 0x004B 9 Y N 0x0053 10 AD0WINT (ADC0CN.3) AD0INT (ADC0CN.5) Y N 0x005B 11 Y N 0x0063 12 N N Comparator1 0x006B 13 N N Timer 3 Overflow 0x0073 14 N N VBUS Level 0x007B 15 CF (PCA0CN.7) CCFn (PCA0CN.n) CP0FIF (CPT0CN.4) CP0RIF (CPT0CN.5) CP1FIF (CPT1CN.4) CP1RIF (CPT1CN.5) TF3H (TMR3CN.7) TF3L (TMR3CN.6) N/A N/A N/A UART1 0x0083 16 N N Reserved SMB1 0x008B 0x0093 17 18 N/A Y N/A N Timer 4 Overflow 0x009B 19 N N Timer 5 Overflow 0x00A3 20 Y N ESMB0 (EIE1.0) EUSB0 (EIE1.1) EWADC0 (EIE1.2) EADC0 (EIE1.3) EPCA0 (EIE1.4) ECP0 (EIE1.5) ECP1 (EIE1.6) ET3 (EIE1.7) EVBUS (EIE2.0) ES1 (EIE2.1) N/A ESMB1 (EIE2.3) ET4 (EIE2.4) ET5 (EIE2.5) PSMB0 (EIP1.0) PUSB0 (EIP1.1) PWADC0 (EIP1.2) PADC0 (EIP1.3) PPCA0 (EIP1.4) PCP0 (EIP1.5) PCP1 (EIP1.6) PT3 (EIP1.7) PVBUS (EIP2.0) PS1 (EIP2.1) N/A PSMB1 (EIP2.3) PT4 (E!P2.4) PT5 (E!P2.5) RI1 (SCON1.0) TI1 (SCON1.1) N/A SI (SMB1CN.0) TF4H (TMR4CN.7) TF4L (TMR4CN.6) TF5H (TMR5CN.7) TF5L (TMR5CN.6) Rev. 1.5 124 C8051F380/1/2/3/4/5/6/7/C SFR Definition 16.1. IE: Interrupt Enable Bit 7 6 5 4 3 2 1 0 Name EA ESPI0 ET2 ES0 ET1 EX1 ET0 EX0 Type R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 SFR Address = 0xA8; SFR Page = All Pages; Bit-Addressable Bit Name Function 7 EA 6 ESPI0 5 ET2 Enable Timer 2 Interrupt. This bit sets the masking of the Timer 2 interrupt. 0: Disable Timer 2 interrupt. 1: Enable interrupt requests generated by the TF2L or TF2H flags. 4 ES0 Enable UART0 Interrupt. This bit sets the masking of the UART0 interrupt. 0: Disable UART0 interrupt. 1: Enable UART0 interrupt. 3 ET1 Enable Timer 1 Interrupt. This bit sets the masking of the Timer 1 interrupt. 0: Disable all Timer 1 interrupt. 1: Enable interrupt requests generated by the TF1 flag. 2 EX1 Enable External Interrupt 1. This bit sets the masking of External Interrupt 1. 0: Disable external interrupt 1. 1: Enable interrupt requests generated by the INT1 input. 1 ET0 Enable Timer 0 Interrupt. This bit sets the masking of the Timer 0 interrupt. 0: Disable all Timer 0 interrupt. 1: Enable interrupt requests generated by the TF0 flag. 0 EX0 Enable External Interrupt 0. This bit sets the masking of External Interrupt 0. 0: Disable external interrupt 0. 1: Enable interrupt requests generated by the INT0 input. 125 Enable All Interrupts. Globally enables/disables all interrupts. It overrides individual interrupt mask settings. 0: Disable all interrupt sources. 1: Enable each interrupt according to its individual mask setting. Enable Serial Peripheral Interface (SPI0) Interrupt. This bit sets the masking of the SPI0 interrupts. 0: Disable all SPI0 interrupts. 1: Enable interrupt requests generated by SPI0. Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 16.2. IP: Interrupt Priority Bit 7 Name 6 5 4 3 2 1 0 PSPI0 PT2 PS0 PT1 PX1 PT0 PX0 Type R R/W R/W R/W R/W R/W R/W R/W Reset 1 0 0 0 0 0 0 0 SFR Address = 0xB8; SFR Page = All Pages; Bit-Addressable Bit Name Function 7 Unused Read = 1b, Write = Don't Care. 6 PSPI0 5 PT2 Timer 2 Interrupt Priority Control. This bit sets the priority of the Timer 2 interrupt. 0: Timer 2 interrupt set to low priority level. 1: Timer 2 interrupt set to high priority level. 4 PS0 UART0 Interrupt Priority Control. This bit sets the priority of the UART0 interrupt. 0: UART0 interrupt set to low priority level. 1: UART0 interrupt set to high priority level. 3 PT1 Timer 1 Interrupt Priority Control. This bit sets the priority of the Timer 1 interrupt. 0: Timer 1 interrupt set to low priority level. 1: Timer 1 interrupt set to high priority level. 2 PX1 External Interrupt 1 Priority Control. This bit sets the priority of the External Interrupt 1 interrupt. 0: External Interrupt 1 set to low priority level. 1: External Interrupt 1 set to high priority level. 1 PT0 Timer 0 Interrupt Priority Control. This bit sets the priority of the Timer 0 interrupt. 0: Timer 0 interrupt set to low priority level. 1: Timer 0 interrupt set to high priority level. 0 PX0 External Interrupt 0 Priority Control. This bit sets the priority of the External Interrupt 0 interrupt. 0: External Interrupt 0 set to low priority level. 1: External Interrupt 0 set to high priority level. Serial Peripheral Interface (SPI0) Interrupt Priority Control. This bit sets the priority of the SPI0 interrupt. 0: SPI0 interrupt set to low priority level. 1: SPI0 interrupt set to high priority level. Rev. 1.5 126 C8051F380/1/2/3/4/5/6/7/C SFR Definition 16.3. EIE1: Extended Interrupt Enable 1 Bit 7 6 5 4 3 2 1 0 Name ET3 ECP1 ECP0 EPCA0 EADC0 EWADC0 EUSB0 ESMB0 Type R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 SFR Address = 0xE6; SFR Page = All Pages Bit Name Function 7 ET3 6 ECP1 Enable Comparator1 (CP1) Interrupt. This bit sets the masking of the CP1 interrupt. 0: Disable CP1 interrupts. 1: Enable interrupt requests generated by the CP1RIF or CP1FIF flags. 5 ECP0 Enable Comparator0 (CP0) Interrupt. This bit sets the masking of the CP0 interrupt. 0: Disable CP0 interrupts. 1: Enable interrupt requests generated by the CP0RIF or CP0FIF flags. 4 EPCA0 Enable Programmable Counter Array (PCA0) Interrupt. This bit sets the masking of the PCA0 interrupts. 0: Disable all PCA0 interrupts. 1: Enable interrupt requests generated by PCA0. 3 EADC0 Enable ADC0 Conversion Complete Interrupt. This bit sets the masking of the ADC0 Conversion Complete interrupt. 0: Disable ADC0 Conversion Complete interrupt. 1: Enable interrupt requests generated by the AD0INT flag. 2 Enable Timer 3 Interrupt. This bit sets the masking of the Timer 3 interrupt. 0: Disable Timer 3 interrupts. 1: Enable interrupt requests generated by the TF3L or TF3H flags. EWADC0 Enable Window Comparison ADC0 Interrupt. This bit sets the masking of ADC0 Window Comparison interrupt. 0: Disable ADC0 Window Comparison interrupt. 1: Enable interrupt requests generated by ADC0 Window Compare flag (AD0WINT). 1 EUSB0 Enable USB (USB0) Interrupt. This bit sets the masking of the USB0 interrupt. 0: Disable all USB0 interrupts. 1: Enable interrupt requests generated by USB0. 0 ESMB0 Enable SMBus0 Interrupt. This bit sets the masking of the SMB0 interrupt. 0: Disable all SMB0 interrupts. 1: Enable interrupt requests generated by SMB0. 127 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 16.4. EIP1: Extended Interrupt Priority 1 Bit 7 6 5 4 3 2 1 0 Name PT3 PCP1 PCP0 PPCA0 PADC0 PWADC0 PUSB0 PSMB0 Type R/W R/W R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 SFR Address = 0xF6; SFR Page = All Pages Bit Name Function 7 PT3 Timer 3 Interrupt Priority Control. This bit sets the priority of the Timer 3 interrupt. 0: Timer 3 interrupts set to low priority level. 1: Timer 3 interrupts set to high priority level. 6 PCP1 Comparator1 (CP1) Interrupt Priority Control. This bit sets the priority of the CP1 interrupt. 0: CP1 interrupt set to low priority level. 1: CP1 interrupt set to high priority level. 5 PCP0 Comparator0 (CP0) Interrupt Priority Control. This bit sets the priority of the CP0 interrupt. 0: CP0 interrupt set to low priority level. 1: CP0 interrupt set to high priority level. 4 PPCA0 Programmable Counter Array (PCA0) Interrupt Priority Control. This bit sets the priority of the PCA0 interrupt. 0: PCA0 interrupt set to low priority level. 1: PCA0 interrupt set to high priority level. 3 PADC0 ADC0 Conversion Complete Interrupt Priority Control. This bit sets the priority of the ADC0 Conversion Complete interrupt. 0: ADC0 Conversion Complete interrupt set to low priority level. 1: ADC0 Conversion Complete interrupt set to high priority level. 2 PWADC0 ADC0 Window Comparator Interrupt Priority Control. This bit sets the priority of the ADC0 Window interrupt. 0: ADC0 Window interrupt set to low priority level. 1: ADC0 Window interrupt set to high priority level. 1 PUSB0 USB (USB0) Interrupt Priority Control. This bit sets the priority of the USB0 interrupt. 0: USB0 interrupt set to low priority level. 1: USB0 interrupt set to high priority level. 0 PSMB0 SMBus0 Interrupt Priority Control. This bit sets the priority of the SMB0 interrupt. 0: SMB0 interrupt set to low priority level. 1: SMB0 interrupt set to high priority level. Rev. 1.5 128 C8051F380/1/2/3/4/5/6/7/C SFR Definition 16.5. EIE2: Extended Interrupt Enable 2 Bit 7 6 Name 5 4 3 ET5 ET4 ESMB1 2 1 0 ES1 EVBUS Type R R R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 SFR Address = 0xE7; SFR Page = All Pages Bit Name 7:6 Unused 5 ET5 Function Read = 00b, Write = Don't Care. Enable Timer 5 Interrupt. This bit sets the masking of the Timer 5 interrupt. 0: Disable Timer 5 interrupts. 1: Enable interrupt requests generated by the TF5L or TF5H flags. 4 ET4 Enable Timer 4 Interrupt. This bit sets the masking of the Timer 4 interrupt. 0: Disable Timer 4interrupts. 1: Enable interrupt requests generated by the TF4L or TF4H flags. 3 2 ESMB1 Reserved Must Write 0b. 1 ES1 0 EVBUS 129 Enable SMBus1 Interrupt. This bit sets the masking of the SMB1 interrupt. 0: Disable all SMB1 interrupts. 1: Enable interrupt requests generated by SMB1. Enable UART1 Interrupt. This bit sets the masking of the UART1 interrupt. 0: Disable UART1 interrupt. 1: Enable UART1 interrupt. Enable VBUS Level Interrupt. This bit sets the masking of the VBUS interrupt. 0: Disable all VBUS interrupts. 1: Enable interrupt requests generated by VBUS level sense. Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 16.6. EIP2: Extended Interrupt Priority 2 Bit 7 6 Name 5 4 3 PT5 PT4 PSMB1 2 1 0 PS1 PVBUS Type R R R/W R/W R/W R/W R/W R/W Reset 0 0 0 0 0 0 0 0 SFR Address = 0xF7; SFR Page = All Pages Bit Name Function :6 Unused 5 PT5 Timer 5 Interrupt Priority Control. This bit sets the priority of the Timer 5 interrupt. 0: Timer 5 interrupt set to low priority level. 1: Timer 5 interrupt set to high priority level. 4 PT4 Timer 4 Interrupt Priority Control. This bit sets the priority of the Timer 4 interrupt. 0: Timer 4 interrupt set to low priority level. 1: Timer 4 interrupt set to high priority level. 3 PSMB1 2 Read = 00b, Write = Don't Care. SMBus1 Interrupt Priority Control. This bit sets the priority of the SMB1 interrupt. 0: SMB1 interrupt set to low priority level. 1: SMB1 interrupt set to high priority level. Reserved Must Write 0b. 1 PS1 UART1 Interrupt Priority Control. This bit sets the priority of the UART1 interrupt. 0: UART1 interrupt set to low priority level. 1: UART1 interrupt set to high priority level. 0 PVBUS VBUS Level Interrupt Priority Control. This bit sets the priority of the VBUS interrupt. 0: VBUS interrupt set to low priority level. 1: VBUS interrupt set to high priority level. Rev. 1.5 130 C8051F380/1/2/3/4/5/6/7/C 16.3. INT0 and INT1 External Interrupt Sources The INT0 and INT1 external interrupt sources are configurable as active high or low, edge or level sensitive. The IN0PL (INT0 Polarity) and IN1PL (INT1 Polarity) bits in the IT01CF register select active high or active low; the IT0 and IT1 bits in TCON (Section “26.1. Timer 0 and Timer 1” on page 266) select level or edge sensitive. The table below lists the possible configurations. IT0 IN0PL 1 0 1 INT0 Interrupt IT1 IN1PL INT1 Interrupt Active low, edge sensitive 1 0 Active low, edge sensitive 1 Active high, edge sensitive 1 1 Active high, edge sensitive 0 0 Active low, level sensitive 0 0 Active low, level sensitive 0 1 Active high, level sensitive 0 1 Active high, level sensitive INT0 and INT1 are assigned to Port pins as defined in the IT01CF register (see SFR Definition 16.7). Note that INT0 and INT0 Port pin assignments are independent of any Crossbar assignments. INT0 and INT1 will monitor their assigned Port pins without disturbing the peripheral that was assigned the Port pin via the Crossbar. To assign a Port pin only to INT0 and/or INT1, configure the Crossbar to skip the selected pin(s). This is accomplished by setting the associated bit in register PnSKIP (see Section “20.1. Priority Crossbar Decoder” on page 154 for complete details on configuring the Crossbar). IE0 (TCON.1) and IE1 (TCON.3) serve as the interrupt-pending flags for the INT0 and INT1 external interrupts, respectively. If an INT0 or INT1 external interrupt is configured as edge-sensitive, the corresponding interrupt-pending flag is automatically cleared by the hardware when the CPU vectors to the ISR. When configured as level sensitive, the interrupt-pending flag remains logic 1 while the input is active as defined by the corresponding polarity bit (IN0PL or IN1PL); the flag remains logic 0 while the input is inactive. The external interrupt source must hold the input active until the interrupt request is recognized. It must then deactivate the interrupt request before execution of the ISR completes or another interrupt request will be generated. 131 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 16.7. IT01CF: INT0/INT1 ConfigurationO Bit 7 6 5 Name IN1PL IN1SL[2:0] IN0PL IN0SL[2:0] Type R/W R/W R/W R/W Reset 0 0 0 SFR Address = 0xE4; SFR Page = 0 Bit Name 7 6:4 3 2:0 IN1PL 4 3 0 0 2 0 1 0 0 1 Function INT1 Polarity. 0: INT1 input is active low. 1: INT1 input is active high. IN1SL[2:0] INT1 Port Pin Selection Bits. These bits select which Port pin is assigned to INT1. Note that this pin assignment is independent of the Crossbar; INT1 will monitor the assigned Port pin without disturbing the peripheral that has been assigned the Port pin via the Crossbar. The Crossbar will not assign the Port pin to a peripheral if it is configured to skip the selected pin. 000: Select P0.0 001: Select P0.1 010: Select P0.2 011: Select P0.3 100: Select P0.4 101: Select P0.5 110: Select P0.6 111: Select P0.7 IN0PL INT0 Polarity. 0: INT0 input is active low. 1: INT0 input is active high. IN0SL[2:0] INT0 Port Pin Selection Bits. These bits select which Port pin is assigned to INT0. Note that this pin assignment is independent of the Crossbar; INT0 will monitor the assigned Port pin without disturbing the peripheral that has been assigned the Port pin via the Crossbar. The Crossbar will not assign the Port pin to a peripheral if it is configured to skip the selected pin. 000: Select P0.0 001: Select P0.1 010: Select P0.2 011: Select P0.3 100: Select P0.4 101: Select P0.5 110: Select P0.6 111: Select P0.7 Rev. 1.5 132 C8051F380/1/2/3/4/5/6/7/C 17. Reset Sources Reset circuitry allows the controller to be easily placed in a predefined default condition. On entry to this reset state, the following occur:     CIP-51 halts program execution Special Function Registers (SFRs) are initialized to their defined reset values External Port pins are forced to a known state Interrupts and timers are disabled. All SFRs are reset to the predefined values noted in the SFR detailed descriptions. The contents of internal data memory are unaffected during a reset; any previously stored data is preserved. However, since the stack pointer SFR is reset, the stack is effectively lost, even though the data on the stack is not altered. The Port I/O latches are reset to 0xFF (all logic ones) in open-drain mode. Weak pullups are enabled during and after the reset. For VDD Monitor and power-on resets, the RST pin is driven low until the device exits the reset state. On exit from the reset state, the program counter (PC) is reset, and the system clock defaults to the internal oscillator. The Watchdog Timer is enabled with the system clock divided by 12 as its clock source. Program execution begins at location 0x0000. VDD Power On Reset Supply Monitor Px.x Px.x + - Comparator 0 0 Enable (wired-OR) + C0RSEF Missing Clock Detector (oneshot) EN Reset Funnel PCA WDT (Software Reset) SWRSF Internal Oscillator XTAL1 XTAL2 External Oscillator Drive System Clock Clock Select Errant Flash Operation WDT Enable MCD Enable EN Low Frequency Oscillator CIP-51 Microcontroller Core System Reset Extended Interrupt Handler Figure 17.1. Reset Sources 133 Rev. 1.5 RST C8051F380/1/2/3/4/5/6/7/C 17.1. Power-On Reset During power-up, the device is held in a reset state and the RST pin is driven low until VDD settles above VRST. A delay occurs before the device is released from reset; the delay decreases as the VDD ramp time increases (VDD ramp time is defined as how fast VDD ramps from 0 V to VRST). Figure 17.2. plots the power-on and VDD monitor event timing. The maximum VDD ramp time is 1 ms; slower ramp times may cause the device to be released from reset before VDD reaches the VRST level. For ramp times less than 1 ms, the power-on reset delay (TPORDelay) is typically less than 0.3 ms. Supply Voltage On exit from a power-on or VDD monitor reset, the PORSF flag (RSTSRC.1) is set by hardware to logic 1. When PORSF is set, all of the other reset flags in the RSTSRC Register are indeterminate (PORSF is cleared by all other resets). Since all resets cause program execution to begin at the same location (0x0000) software can read the PORSF flag to determine if a power-up was the cause of reset. The content of internal data memory should be assumed to be undefined after a power-on reset. The VDD monitor is enabled following a power-on reset. VDD VD D VRST t Logic HIGH RST TPORDelay Logic LOW VDD Monitor Reset Power-On Reset Figure 17.2. Power-On and VDD Monitor Reset Timing Rev. 1.5 134 C8051F380/1/2/3/4/5/6/7/C 17.2. Power-Fail Reset / VDD Monitor When a power-down transition or power irregularity causes VDD to drop below VRST, the power supply monitor will drive the RST pin low and hold the CIP-51 in a reset state (see Figure 17.2). When VDD returns to a level above VRST, the CIP-51 will be released from the reset state. Note that even though internal data memory contents are not altered by the power-fail reset, it is impossible to determine if VDD dropped below the level required for data retention. If the PORSF flag reads 1, the data may no longer be valid. The VDD monitor is enabled after power-on resets. Its defined state (enabled/disabled) is not altered by any other reset source. For example, if the VDD monitor is disabled by code and a software reset is performed, the VDD monitor will still be disabled after the reset. Important Note: If the VDD monitor is being turned on from a disabled state, it should be enabled before it is selected as a reset source. Selecting the VDD monitor as a reset source before it is enabled and stabilized may cause a system reset. In some applications, this reset may be undesirable. If this is not desirable in the application, a delay should be introduced between enabling the monitor and selecting it as a reset source. The procedure for enabling the VDD monitor and configuring it as a reset source from a disabled state is shown below: 1. Enable the VDD monitor (VDMEN bit in VDM0CN = 1). 2. If necessary, wait for the VDD monitor to stabilize (see Table 5.4 for the VDD Monitor turn-on time). 3. Select the VDD monitor as a reset source (PORSF bit in RSTSRC = 1). See Figure 17.2 for VDD monitor timing; note that the power-on-reset delay is not incurred after a VDD monitor reset. See Table 5.4 for complete electrical characteristics of the VDD monitor. 135 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 17.1. VDM0CN: VDD Monitor Control Bit 7 6 5 4 3 2 1 0 Name VDMEN VDDSTAT Type R/W R R R R R R R Reset Varies Varies Varies Varies Varies Varies Varies Varies SFR Address = 0xFF; SFR Page = All Pages Bit Name 7 VDMEN Function VDD Monitor Enable. This bit turns the VDD monitor circuit on/off. The VDD Monitor cannot generate system resets until it is also selected as a reset source in register RSTSRC (SFR Definition 17.2). Selecting the VDD monitor as a reset source before it has stabilized may generate a system reset. In systems where this reset would be undesirable, a delay should be introduced between enabling the VDD Monitor and selecting it as a reset source. See Table 5.4 for the minimum VDD Monitor turn-on time. 0: VDD Monitor Disabled. 1: VDD Monitor Enabled. 6 VDDSTAT VDD Status. This bit indicates the current power supply status (VDD Monitor output). 0: VDD is at or below the VDD monitor threshold. 1: VDD is above the VDD monitor threshold. 5:0 Unused Read = 000000b; Write = Don’t care. 17.3. External Reset The external RST pin provides a means for external circuitry to force the device into a reset state. Asserting an active-low signal on the RST pin generates a reset; an external pullup and/or decoupling of the RST pin may be necessary to avoid erroneous noise-induced resets. See Table 5.4 for complete RST pin specifications. The PINRSF flag (RSTSRC.0) is set on exit from an external reset. 17.4. Missing Clock Detector Reset The Missing Clock Detector (MCD) is a one-shot circuit that is triggered by the system clock. If the system clock remains high or low for more than the MCD time-out, a reset will be generated. After a MCD reset, the MCDRSF flag (RSTSRC.2) will read 1, signifying the MCD as the reset source; otherwise, this bit reads 0. Writing a 1 to the MCDRSF bit enables the Missing Clock Detector; writing a 0 disables it. The state of the RST pin is unaffected by this reset. 17.5. Comparator0 Reset Comparator0 can be configured as a reset source by writing a 1 to the C0RSEF flag (RSTSRC.5). Comparator0 should be enabled and allowed to settle prior to writing to C0RSEF to prevent any turn-on chatter on the output from generating an unwanted reset. The Comparator0 reset is active-low: if the non-inverting input voltage (on CP0+) is less than the inverting input voltage (on CP0-), the device is put into the reset state. After a Comparator0 reset, the C0RSEF flag (RSTSRC.5) will read 1 signifying Comparator0 as the reset source; otherwise, this bit reads 0. The state of the RST pin is unaffected by this reset. Rev. 1.5 136 C8051F380/1/2/3/4/5/6/7/C 17.6. PCA Watchdog Timer Reset The programmable Watchdog Timer (WDT) function of the Programmable Counter Array (PCA) can be used to prevent software from running out of control during a system malfunction. The PCA WDT function can be enabled or disabled by software as described in Section “27.4. Watchdog Timer Mode” on page 308; the WDT is enabled and clocked by SYSCLK / 12 following any reset. If a system malfunction prevents user software from updating the WDT, a reset is generated and the WDTRSF bit (RSTSRC.5) is set to 1. The state of the RST pin is unaffected by this reset. 17.7. Flash Error Reset If a Flash program read, write, or erase operation targets an illegal address, a system reset is generated. This may occur due to any of the following:      Programming hardware attempts to write or erase a Flash location which is above the user code space address limit. A Flash read from firmware is attempted above user code space. This occurs when a MOVC operation is attempted above the user code space address limit. A Program read is attempted above user code space. This occurs when user code attempts to branch to an address above the user code space address limit. A Flash read, write, or erase attempt is restricted due to a Flash security setting. A Flash write or erase is attempted when the VDD monitor is not enabled. The FERROR bit (RSTSRC.6) is set following a Flash error reset. The state of the RST pin is unaffected by this reset. 17.8. Software Reset Software may force a reset by writing a 1 to the SWRSF bit (RSTSRC.4). The SWRSF bit will read 1 following a software forced reset. The state of the RST pin is unaffected by this reset. 17.9. USB Reset Writing 1 to the USBRSF bit in register RSTSRC selects USB0 as a reset source. With USB0 selected as a reset source, a system reset will be generated when either of the following occur: 1. RESET signaling is detected on the USB network. The USB Function Controller (USB0) must be enabled for RESET signaling to be detected. See Section “21. Universal Serial Bus Controller (USB0)” on page 172 for information on the USB Function Controller. 2. A falling or rising voltage on the VBUS pin. The USBRSF bit will read 1 following a USB reset. The state of the RST pin is unaffected by this reset. 137 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 17.2. RSTSRC: Reset Source Bit 7 6 5 4 3 2 1 0 Name USBRSF FERROR C0RSEF SWRSF WDTRSF MCDRSF PORSF PINRSF Type R/W R R/W R/W R R/W R/W R Reset Varies Varies Varies Varies Varies Varies Varies Varies SFR Address = 0xEF; SFR Page = All Pages Bit Name Description Write Read 7 USBRSF USB Reset Flag Writing a 1 enables USB as a reset source. Set to 1 if USB caused the last reset. 6 FERROR Flash Error Reset Flag. N/A Set to 1 if Flash read/write/erase error caused the last reset. 5 C0RSEF Comparator0 Reset Enable and Flag. Writing a 1 enables Com- Set to 1 if Comparator0 parator0 as a reset source caused the last reset. (active-low). 4 SWRSF Writing a 1 forces a system reset. Software Reset Force and Flag. 3 WDTRSF Watchdog Timer Reset Flag. N/A 2 MCDRSF Missing Clock Detector Enable and Flag. Set to 1 if last reset was caused by a write to SWRSF. Set to 1 if Watchdog Timer overflow caused the last reset. Writing a 1 enables the Set to 1 if Missing Clock Missing Clock Detector. Detector timeout caused The MCD triggers a reset the last reset. if a missing clock condition is detected. 1 PORSF Power-On / VDD Monitor Writing a 1 enables the Reset Flag, and VDD monitor VDD monitor as a reset source. Reset Enable. Writing 1 to this bit before the VDD monitor is enabled and stabilized may cause a system reset. 0 PINRSF HW Pin Reset Flag. N/A Set to 1 anytime a poweron or VDD monitor reset occurs. When set to 1 all other RSTSRC flags are indeterminate. Set to 1 if RST pin caused the last reset. Note: Do not use read-modify-write operations on this register Rev. 1.5 138 C8051F380/1/2/3/4/5/6/7/C 18. Flash Memory On-chip, re-programmable Flash memory is included for program code and non-volatile data storage. The Flash memory can be programmed in-system through the C2 interface or by software using the MOVX instruction. Once cleared to logic 0, a Flash bit must be erased to set it back to logic 1. Flash bytes would typically be erased (set to 0xFF) before being reprogrammed. The write and erase operations are automatically timed by hardware for proper execution; data polling to determine the end of the write/erase operation is not required. Code execution is stalled during a Flash write/erase operation. 18.1. Programming The Flash Memory The simplest means of programming the Flash memory is through the C2 interface using programming tools provided by Silicon Labs or a third party vendor. This is the only means for programming a non-initialized device. For details on the C2 commands to program Flash memory, see Section “28. C2 Interface” on page 316. To ensure the integrity of Flash contents, it is strongly recommended that the VDD monitor be left enabled in any system which writes or erases Flash memory from code. It is also crucial to ensure that the FLRT bit in register FLSCL be set to '1' if a clock speed higher than 25 MHz is being used for the device. 18.1.1. Flash Lock and Key Functions Flash writes and erases by user software are protected with a lock and key function. The Flash Lock and Key Register (FLKEY) must be written with the correct key codes, in sequence, before Flash operations may be performed. The key codes are: 0xA5, 0xF1. The timing does not matter, but the codes must be written in order. If the key codes are written out of order, or the wrong codes are written, Flash writes and erases will be disabled until the next system reset. Flash writes and erases will also be disabled if a Flash write or erase is attempted before the key codes have been written properly. The Flash lock resets after each write or erase; the key codes must be written again before a following Flash operation can be performed. The FLKEY register is detailed in SFR Definition 18.2. 18.1.2. Flash Erase Procedure The Flash memory can be programmed by software using the MOVX write instruction with the address and data byte to be programmed provided as normal operands. Before writing to Flash memory using MOVX, Flash write operations must be enabled by: (1) Writing the Flash key codes in sequence to the Flash Lock register (FLKEY); and (2) Setting the PSWE Program Store Write Enable bit (PSCTL.0) to logic 1 (this directs the MOVX writes to target Flash memory). The PSWE bit remains set until cleared by software. A write to Flash memory can clear bits to logic 0 but cannot set them; only an erase operation can set bits to logic 1 in Flash. A byte location to be programmed must be erased before a new value is written. The Flash memory is organized in 512-byte pages. The erase operation applies to an entire page (setting all bytes in the page to 0xFF). To erase an entire 512-byte page, perform the following steps: 1. Disable interrupts (recommended). 2. Write the first key code to FLKEY: 0xA5. 3. Write the second key code to FLKEY: 0xF1. 4. Set the PSEE bit (register PSCTL). 5. Set the PSWE bit (register PSCTL). 6. Using the MOVX instruction, write a data byte to any location within the 512-byte page to be erased. 7. Clear the PSWE bit (register PSCTL). 8. Clear the PSEE bit (register PSCTI). 139 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C 18.1.3. Flash Write Procedure Bytes in Flash memory can be written one byte at a time, or in groups of two. The FLBWE bit in register PFE0CN (SFR Definition ) controls whether a single byte or a block of two bytes is written to Flash during a write operation. When FLBWE is cleared to 0, the Flash will be written one byte at a time. When FLBWE is set to 1, the Flash will be written in two-byte blocks. Block writes are performed in the same amount of time as single-byte writes, which can save time when storing large amounts of data to Flash memory.During a single-byte write to Flash, bytes are written individually, and a Flash write will be performed after each MOVX write instruction. The recommended procedure for writing Flash in single bytes is: 1. Disable interrupts. 2. Clear the FLBWE bit (register PFE0CN) to select single-byte write mode. 3. Set the PSWE bit (register PSCTL). 4. Clear the PSEE bit (register PSCTL). 5. Write the first key code to FLKEY: 0xA5. 6. Write the second key code to FLKEY: 0xF1. 7. Using the MOVX instruction, write a single data byte to the desired location within the 512-byte sector. 8. Clear the PSWE bit. 9. Re-enable interrupts. Steps 5-7 must be repeated for each byte to be written. For block Flash writes, the Flash write procedure is only performed after the last byte of each block is written with the MOVX write instruction. A Flash write block is two bytes long, from even addresses to odd addresses. Writes must be performed sequentially (i.e. addresses ending in 0b and 1b must be written in order). The Flash write will be performed following the MOVX write that targets the address ending in 1b. If a byte in the block does not need to be updated in Flash, it should be written to 0xFF. The recommended procedure for writing Flash in blocks is: 1. Disable interrupts. 2. Set the FLBWE bit (register PFE0CN) to select block write mode. 3. Set the PSWE bit (register PSCTL). 4. Clear the PSEE bit (register PSCTL). 5. Write the first key code to FLKEY: 0xA5. 6. Write the second key code to FLKEY: 0xF1. 7. Using the MOVX instruction, write the first data byte to the even block location (ending in 0b). 8. Write the first key code to FLKEY: 0xA5. 9. Write the second key code to FLKEY: 0xF1. 10.Using the MOVX instruction, write the second data byte to the odd block location (ending in 1b). 11. Clear the PSWE bit. 12.Re-enable interrupts. Steps 5–10 must be repeated for each block to be written. Rev. 1.5 140 C8051F380/1/2/3/4/5/6/7/C 18.2. Non-Volatile Data Storage The Flash memory can be used for non-volatile data storage as well as program code. This allows data such as calibration coefficients to be calculated and stored at run time. Data is written using the MOVX write instruction and read using the MOVC instruction. Note: MOVX read instructions always target XRAM. 18.3. Security Options The CIP-51 provides security options to protect the Flash memory from inadvertent modification by software as well as to prevent the viewing of proprietary program code and constants. The Program Store Write Enable (bit PSWE in register PSCTL) and the Program Store Erase Enable (bit PSEE in register PSCTL) bits protect the Flash memory from accidental modification by software. PSWE must be explicitly set to 1 before software can modify the Flash memory; both PSWE and PSEE must be set to 1 before software can erase Flash memory. Additional security features prevent proprietary program code and data constants from being read or altered across the C2 interface. A Security Lock Byte located at the last byte of Flash user space offers protection of the Flash program memory from access (reads, writes, or erases) by unprotected code or the C2 interface. The Flash security mechanism allows the user to lock n 512-byte Flash pages, starting at page 0 (addresses 0x0000 to 0x01FF), where n is the 1s complement number represented by the Security Lock Byte. Note that the page containing the Flash Security Lock Byte is also locked when any other Flash pages are locked. See example below. Security Lock Byte: 1s Complement: Flash pages locked: Addresses locked: 11111101b 00000010b 3 (2 + Flash Lock Byte Page) First two pages of Flash: 0x0000 to 0x03FF Flash Lock Byte Page: (0xFA00 to 0xFBFF for 64k devices; 0x7E00 to 0x7FFF for 32k devices, 0x3E00 to 0x3FFF for 16k devices) C8051F380/2/4/6 Locked when any other FLASH pages are locked Reserved 0xFC00 Lock Byte 0xFBFF 0xFBFE 0xFA00 FLASH memory organized in 512-byte pages C8051F381/3/5/7 Lock Byte Unlocked FLASH Pages 0x7FFF C8051F38C 0x7FFE 0x7E00 Lock Byte Unlocked FLASH Pages 0x3FFE 0x3E00 Unlocked FLASH Pages 0x0000 0x0000 0x3FFF 0x0000 Access limit set according to the FLASH security lock byte Figure 18.1. Flash Program Memory Map and Security Byte The level of FLASH security depends on the FLASH access method. The three FLASH access methods that can be restricted are reads, writes, and erases from the C2 debug interface, user firmware executing on unlocked pages, and user firmware executing on locked pages. 141 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C Accessing FLASH from the C2 debug interface: 1. Any unlocked page may be read, written, or erased. 2. Locked pages cannot be read, written, or erased. 3. The page containing the Lock Byte may be read, written, or erased if it is unlocked. 4. Reading the contents of the Lock Byte is always permitted. 5. Locking additional pages (changing 1s to 0s in the Lock Byte) is not permitted. 6. Unlocking FLASH pages (changing 0s to 1s in the Lock Byte) requires the C2 Device Erase command, which erases all FLASH pages including the page containing the Lock Byte and the Lock Byte itself. 7. The Reserved Area cannot be read, written, or erased. Accessing FLASH from user firmware executing on an unlocked page: 1. Any unlocked page except the page containing the Lock Byte may be read, written, or erased. 2. Locked pages cannot be read, written, or erased. 3. The page containing the Lock Byte cannot be erased. It may be read or written only if it is unlocked. 4. Reading the contents of the Lock Byte is always permitted. 5. Locking additional pages (changing 1s to 0s in the Lock Byte) is not permitted. 6. Unlocking FLASH pages (changing 0s to 1s in the Lock Byte) is not permitted. 7. The Reserved Area cannot be read, written, or erased. Any attempt to access the reserved area, or any other locked page, will result in a FLASH Error device reset. Accessing FLASH from user firmware executing on a locked page: 1. Any unlocked page except the page containing the Lock Byte may be read, written, or erased. 2. Any locked page except the page containing the Lock Byte may be read, written, or erased. 3. The page containing the Lock Byte cannot be erased. It may only be read or written. 4. Reading the contents of the Lock Byte is always permitted. 5. Locking additional pages (changing 1s to 0s in the Lock Byte) is not permitted. 6. Unlocking FLASH pages (changing 0s to 1s in the Lock Byte) is not permitted. 7. The Reserved Area cannot be read, written, or erased. Any attempt to access the reserved area, or any other locked page, will result in a FLASH Error device reset. Rev. 1.5 142 C8051F380/1/2/3/4/5/6/7/C SFR Definition 18.1. PSCTL: Program Store R/W Control Bit 7 6 5 4 3 2 Name 1 0 PSEE PSWE Type R R R R R R R/W R/W Reset 0 0 0 0 0 0 0 0 SFR Address =0x8F; SFR Page = All Pages Bit Name 7:2 1 Function Reserved Must write 000000b. PSEE Program Store Erase Enable. Setting this bit (in combination with PSWE) allows an entire page of Flash program memory to be erased. If this bit is logic 1 and Flash writes are enabled (PSWE is logic 1), a write to Flash memory using the MOVX instruction will erase the entire page that contains the location addressed by the MOVX instruction. The value of the data byte written does not matter. 0: Flash program memory erasure disabled. 1: Flash program memory erasure enabled. 0 PSWE Program Store Write Enable. Setting this bit allows writing a byte of data to the Flash program memory using the MOVX write instruction. The Flash location should be erased before writing data. 0: Writes to Flash program memory disabled. 1: Writes to Flash program memory enabled; the MOVX write instruction targets Flash memory. 143 Rev. 1.5 C8051F380/1/2/3/4/5/6/7/C SFR Definition 18.2. FLKEY: Flash Lock and Key Bit 7 6 5 4 3 Name FLKEY[7:0] Type R/W Reset 0 0 0 0 SFR Address = 0xB7; SFR Page = All Pages Bit Name 7:0 0 2 1 0 0 0 0 Function FLKEY[7:0] Flash Lock and Key Register. Write: This register provides a lock and key function for Flash erasures and writes. Flash writes and erases are enabled by writing 0xA5 followed by 0xF1 to the FLKEY register. Flash writes and erases are automatically disabled after the next write or erase is complete. If any writes to FLKEY are performed incorrectly, or if a Flash write or erase operation is attempted while these operations are disabled, the Flash will be permanently locked from writes or erasures until the next device reset. If an application never writes to Flash, it can intentionally lock the Flash by writing a non-0xA5 value to FLKEY from software. Read: When read, bits 1–0 indicate the current Flash lock state. 00: Flash is write/erase locked. 01: The first key code has been written (0xA5). 10: Flash is unlocked (writes/erases allowed). 11: Flash writes/erases disabled until the next reset. Rev. 1.5 144 C8051F380/1/2/3/4/5/6/7/C SFR Definition 18.3. FLSCL: Flash Scale Bit 7 6 5 Name FOSE Reserved FLRT Reserved Type R/W R/W R/W R/W Reset 1 0 0 4 0 SFR Address = 0xB6; SFR Page = All Pages Bit Name 7 FOSE 3 0 2 0 1 0 0 0 Function Flash One-shot Enable. This bit enables the Flash read one-shot. When the Flash one-shot disabled, the Flash sense amps are enabled for a full clock cycle during Flash reads. At system clock frequencies below 10 MHz, disabling the Flash one-shot will increase system power consumption. 0: Flash one-shot disabled. 1: Flash one-shot enabled. 6:5 Reserved 4 FLRT Must write 00b. FLASH Read Time. This bit should be programmed to the smallest allowed value, according to the system clock speed. 0: SYSCLK