CYW255OXCT

W255 200 MHz 24-Output Buffer for 4 DDR or 3 SDRAM DIMMS Features Functional Description • One input to 24 output buffer/driver • Supports up to 4 DDR DIMMs or 3 SDRAM DIMMS • One additional output for feedback • SMBus interface for individual output control • Low skew outputs (< 100 ps) • Supports 266-, 333-, and 400 MHz DDR SDRAM • Dedicated pin for power management support • Space-saving 48-pin SSOP package The W255 is a 3.3V/2.5V buffer designed to distribute high-speed clocks in PC applications. The part has 24 outputs. Designers can configure these outputs to support four unbuffered DDR DIMMS or to support three unbuffered standard SDRAM DIMMs and two DDR DIMMS. The W255 can be used in conjunction with the W250 or similar clock synthesizer for the VIA Pro 266 chipset. The W255 also includes an SMBus interface which can enable or disable each output clock. On power-up, all output clocks are enabled (internal pull up). Pin Configuration[1] Block Diagram FBOUT BUF_IN DDR0T_SDRAM10 DDR0C_SDRAM11 DDR1T_SDRAM0 DDR1C_SDRAM1 SDATA SMBus Decoding SCLOCK DDR2T_SDRAM2 DDR2C_SDRAM3 DDR3T_SDRAM4 DDR3C_SDRAM5 DDR4T_SDRAM6 DDR4C_SDRAM7 DDR5T_SDRAM8 DDR5C_SDRAM9 DDR6T DDR6C DDR7T DDR7C DDR8T DDR8C DDR9T DDR9C DDR10T PWR_DWN# Power Down Control DDR10C DDR11T DDR11C SEL_DDR .......................... Document #: 38-07255 Rev. *D Page 1 of 9 400 West Cesar Chavez, Austin, TX 78701 1+(512) 416-8500 SSOP Top View FBOUT VDD3.3_2.5 GND DDR0T_SDRAM10 DDR0C_SDRAM11 DRR1T_SDRAM0 DDR1C_SDRAM1 VDD3.3_2.5 GND DDR2T_SDRAM2 DDR2C_SDRAM3 VDD3.3_2.5 BUF_IN GND DDR3T_SDRAM4 DDR3C_SDRAM5 VDD3.3_2.5 GND DDR4T_SDRAM6 DDR4C_SDRAM7 DDR5T_SDRAM8 DDR5C_SDRAM9 VDD3.3_2.5 SDATA 1 2 48 47 3 46 4 45 5 44 6 43 7 42 8 9 41 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 21 29 28 22 27 23 26 24 25 SEL_DDR* VDD2.5 GND DDR11T DDR11C DDR10T DDR10C VDD2.5 GND DDR9T DDR9C VDD2.5 PWR_DWN#* GND DDR8T DDR8C VDD2.5 GND DDR7T DDR7C DDR6T DDR6C GND SCLK Note: 1. Internal 100K pull-up resistors present on inputs marked with *. Design should not rely solely on internal pull-up resistor to set I/O pins HIGH. 1+(512) 416-9669 www.silabs.com W255 Pin Summary Pin Name SEL_DDR Pins 48 Pin Description Input to configure for DDR-ONLY mode or STANDARD SDRAM mode. 1 = DDR-ONLY mode. 0 = STANDARD SDRAM mode. When SEL_DDR is pulled HIGH or configured for DDR-ONLY mode, pin 4, 5, 6, 7, 10, 11,15, 16, 19, 20, 21, 22, 27, 28, 29, 30, 33, 34, 38, 39, 42, 43, 44 and 45 will be configured as DDR outputs. Connect VDD3.3_2.5 to a 2.5V power supply in DDR-ONLY mode. When SEL_DDR is pulled LOW or configured for STANDARD SDRAM output, pin 4, 5, 6, 7, 10, 11, 15, 16, 19 and 20, 21, 22 will be configured as STANDARD SDRAM outputs.Pin 27, 28, 29, 30, 33, 34, 38, 39, 42, 43, 44 and 45 will be configured as DDR outputs. Connect VDD3.3_2.5 to a 3.3V power supply in STANDARD SDRAM mode. SCLK 25 SMBus clock input SDATA 24 SMBus data input BUF_IN 13 Reference input from chipset. 2.5V input for DDR-ONLY mode; 3.3V input for STANDARD SDRAM mode. FBOUT 1 Feedback clock for chipset. Output voltage depends on VDD3.3_2.5V. PWR_DWN# 36 Active LOW input to enable power-down mode; all outputs will be pulled LOW. DDR[6:11]T 28, 30, 34, 39, 43, 45 Clock outputs. These outputs provide copies of BUF_IN. DDR[6:11]C 27, 29, 33, 38, 42, 44 Clock outputs. These outputs provide complementary copies of BUF_IN. DDR[0:5]T_SDRAM [10,0,2,4,6,8] 4, 6, 10, 15, 19, 21 Clock outputs. These outputs provide copies of BUF_IN. Voltage swing depends on VDD3.3_2.5 power supply. DDR[0:5]C_SDRAM 5, 7, 11, 16, 20, 22 [11,1,3,5,7,9] Clock outputs. These outputs provide complementary copies of BUF_IN when SEL_DDR is active. These outputs provide copies of BUF_IN when SEL_DDR is inactive. Voltage swing depends on VDD3.3_2.5 power supply. VDD3.3_2.5 2, 8, 12, 17, 23 Connect to 2.5V power supply when W255 is configured for DDR-ONLY mode. Connect to 3.3V power supply, when W255 is configured for standard SDRAM mode. VDD2.5 32, 37, 41, 47 2.5V voltage supply GND 3, 9, 14, 18, 26, 31, 35, 40, 46 Ground ..........................Document #: 38-07255 Rev. *D Page 2 of 9 W255 Serial Configuration Map • The serial bits will be read by the clock driver in the following order: Byte 0 - Bits 7, 6, 5, 4, 3, 2, 1, 0 Byte 1 - Bits 7, 6, 5, 4, 3, 2, 1, 0 . . Byte N - Bits 7, 6, 5, 4, 3, 2, 1, 0 • Reserved and unused bits should be programmed to “0.” • SMBus Address for the W255 is: Table 1. A6 A5 A4 A3 A2 A1 A0 R/W 1 1 0 1 0 0 1 ---- Byte 6: Outputs Active/Inactive Register (1 = Active, 0 = Inactive), Default = Active Bit Pin # Description Default Bit 7 – Reserved, drive to 0 0 Bit 6 – Reserved, drive to 0 0 Bit 5 – Reserved, drive to 0 0 Bit 4 1 FBOUT 1 Bit 3 45,44 DDR11T, DDR11C 1 Bit 2 43, 42 DDR10T, DDR10C 1 Bit 1 39, 38 DDR9T, DDR9C 1 Bit 0 34, 33 DDR8T, DDR8C 1 ..........................Document #: 38-07255 Rev. *D Page 3 of 9 Byte 7: Outputs Active/Inactive Register (1 = Active, 0 = Inactive), Default = Active Bit Pin # Description Default Bit 7 30, 29 DDR7T, DDR7C 1 Bit 6 28, 27 DDR6T, DDR6C 1 Bit 5 21, 22 DDR5T_SDRAM8, DDR5C_SDRAM9 1 Bit 4 19, 20 DDR4T_SDRAM6, DDR4C_SDRAM7 1 Bit 3 15,16 DDR3T_SDRAM4, DDR3C_SDRAM5 1 Bit 2 10, 11 DDR2T_SDRAM2, DDR2C_SDRAM3 1 Bit 1 6, 7 DDR1T_SDRAM0, DDR1C_SDRAM1 1 Bit 0 4, 5 DDR0T_SDRAM10, DDR0C_SDRAM11 1 W255 Maximum Ratings Storage Temperature...................................–65°C to +150°C Supply Voltage to Ground Potential..................–0.5 to +7.0V Static Discharge Voltage .......................................... > 2000V (per MIL-STD-883, Method 3015) DC Input Voltage (except BUF_IN)............ –0.5V to VDD+0.5 Operating Conditions[2] Parameter Description Min. Typ. Max. Unit VDD3.3 Supply Voltage 3.135 3.465 V VDD2.5 Supply Voltage 2.375 2.625 V TA Operating Temperature (Ambient Temperature) COUT Output Capacitance 0 6 70 pF °C CIN Input Capacitance 5 pF Electrical Characteristics Over the Operating Range Parameter Description VIL Input LOW Voltage VIH Input HIGH Voltage Test Conditions Min. Typ. For all pins except SMBus Max. Unit 0.8 V 2.0 V IIL Input LOW Current VIN = 0V 50 A IIH Input HIGH Current VIN = VDD 50 A IOH Output HIGH Current VDD = 2.375V VOUT = 1V –18 –32 mA IOL Output LOW Current VDD = 2.375V VOUT = 1.2V 26 35 mA VOL Output LOW Voltage[3] IOL = 12 mA, VDD = 2.375V VOH Output HIGH Voltage[3] IOH = –12 mA, VDD = 2.375V Current[3] 0.6 V 1.7 V IDD Supply (DDR-only mode) Unloaded outputs, 133 MHz 400 mA IDD Supply Current (DDR-only mode) Loaded outputs, 133 MHz 500 mA IDDS Supply Current PWR_DWN# = 0 VOUT Output Voltage Swing See test circuity (refer to Figure 1) VOC Output Crossing Voltage INDC Input Clock Duty Cycle Switching Characteristics Parameter 0.7 (VDD/2) – 0.1 VDD/2 100 A VDD +0.6 V (VDD/2) + 0.1 V 52 % 48 [4] Name Test Conditions Min. Typ. Max. Unit 66 200 MHz INDC – 5% INDC + 5% % – Operating Frequency – Duty Cycle[3, 5] = t2 t1 Measured at 1.4V for 3.3V outputs Measured at VDD/2 for 2.5V outputs t3 SDRAM Rising Edge Rate[3] Measured between 0.4V and 2.4V 1.0 2.75 V/ns t4 SDRAM Falling Edge Rate[3] Measured between 2.4V and 0.4V 1.0 2.75 V/ns Measured between 20% to 80% of output (refer to Figure 1) 0.5 1.50 V/ns t3d DDR Rising Edge Rate[3] Notes: 2. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required. 3. Parameter is guaranteed by design and characterization. Not 100% tested in production. 4. All parameters specified with loaded outputs. 5. Duty cycle of input clock is 50%. Rising and falling edge rate is greater than 1 V/ns. ..........................Document #: 38-07255 Rev. *D Page 4 of 9 W255 Switching Characteristics (continued)[4] Parameter Name Test Conditions Rate[3] Max. Unit 1.50 V/ns DDR Falling Edge t5 Output to Output Skew for DDR[3] All outputs equally loaded 100 ps t6 Output to Output Skew for SDRAM[3] All outputs equally loaded 150 ps t7 SDRAM Buffer LH Prop. Delay[3] Input edge greater than 1 V/ns 5 10 ns t8 Delay[3] Input edge greater than 1 V/ns 5 10 ns Switching Waveforms Duty Cycle Timing t1 t2 All Outputs Rise/Fall Time OUTPUT 2.4V 0.4V 3.3V 2.4V 0.4V 0V t4 t3 Output-Output Skew OUTPUT OUTPUT t5 SDRAM Buffer HH and LL Propagation Delay 1.5V INPUT 1.5V OUTPUT t6 t7 ..........................Document #: 38-07255 Rev. *D Page 5 of 9 0.5 Typ. t4d SDRAM Buffer HL Prop. Measured between 20% to 80% of output (refer to Figure 1) Min. W255 Figure 1 shows the differential clock directly terminated by a 120resistor. VCC Device Under Test Out VCC ) 60W VTR RT =120 Out ) 60W Receiver VCP Figure 1. Differential Signal Using Direct Termination Resistor ..........................Document #: 38-07255 Rev. *D Page 6 of 9 W255 Layout Example for DDR 2.5V Only +2.5V Supply FB VDDQ2 0.005 mF 10 mF C4 G G G G G G 1 G 2 V 3 G 4 5 6 7 G 8 V 9 G 10 11 G 12 V G 13 14 15 16 G 17 V 18 G 19 20 21 22 G 23 V 24 G 48 47 G 46 45 44 43 G 42 V 41 G 40 39 G 38 V 37 G 36 G 35 34 G 33 V 32 G 31 30 29 28 27 G 26 25 V W255 G C3 G FB = Dale ILB1206 - 300 (300@ 100 MHz) or TDK ACB 2012L-120 C4 = 0.005 F Ceramic Caps C3 = 10–22 F G = VIA to GND plane layer V = VIA to respective supply plane layer Note: Each supply plane or strip should have a ferrite bead and capacitors All bypass caps = 0.1F ceramic ..........................Document #: 38-07255 Rev. *D Page 7 of 9 G G G G W255 Layout Example SDRAM (Mixed Voltage) +2.5V Supply +3.3V Supply FB FB VDDQ2 VDDQ3 C4 0.005 mF G G G G G C1 C3 10 mF 1 2 V G 3 4 5 6 7 G 8 V 9 10 11 G 12V G 13 14 G 15 16 G 17V 18 G 19 20 21 22 23V 24 G 0.005 mf C2 G G G 48 47 46 45 44 43 G 42 V 41 G 40 39 G 38 V 37 G 36 G 35 34 G 33 V 32 G 31 30 29 28 27 G 26 25 G V W255 G 10 mF G FB = Dale ILB1206 - 300 (300@ 100 MHz) or TDK ACB 2012L-120 Ceramic Caps C1 and C3 = 10–22 FC2 & C4 = 0.005 F C6 = 0.1F G = VIA to GND plane layer V = VIA to respective supply plane layer Note: Each supply plane or strip should have a ferrite bead and capacitors All bypass caps = 0.1F ceramic ..........................Document #: 38-07255 Rev. *D Page 8 of 9 G G G G W255 Ordering Information Ordering Code Package Type Operating Range W255H 48-pin SSOP Commercial W255HT 48-pin SSOP–Tape and Reel Option Commercial CYW255OXC 48-pin SSOP Commercial CYW255OXCT 48-pin SSOP–Tape and Reel Option Commercial Lead-free Package Drawing and Dimensions 48-lead Shrunk Small Outline Package O48 51 85061 *C The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages. ..........................Document #: 38-07255 Rev. *D Page 9 of 9