EFM32PG22 Gecko MCU Family Data
Sheet
The EFM32PG22 Gecko family of microcontrollers is part of the
Series 2 Gecko portfolio. EFM32PG22 Gecko MCUs are ideal for
enabling energy-friendly embedded applications.
KEY FEATURES
• 32-bit ARM® Cortex®-M33 core with 76.8
MHz maximum operating frequency
The highly efficient solution contains a 76.8 MHz Cortex-M33 with rich analog and communication peripherals to provide an industry-leading, energy efficient MCU for consumer and industrial applications.
• Up to 512 kB of flash and 32 kB of RAM
• Low energy operation
• 26 uA/MHz (EM0)
• 1.10 uA sleep (EM2)
Gecko applications include:
•
•
•
•
• Secure Boot with Root of Trust and
Secure Loader (RTSL)
Personal Hygiene devices
Appliances and whitegoods
Industrial Automation
Consumer electronics
• 16-bit ADC with 16-channel scan
Core / Memory
TM
ARM Cortex M33 processor
with DSP, FPU and TrustZone
ETM
Debug Interface
Clock Management
Flash Program
Memory
RAM Memory
HF Crystal
Oscillator
HF
RC Oscillator
Fast Startup
RC Oscillator
Precision LF
RC Oscillator
LF Crystal
Oscillator
Ultra LF RC
Oscillator
LDMA
Controller
Energy Management
Voltage
Regulator
DC-DC
Converter
Power-On
Reset
Brown-Out
Detector
32-bit bus
Peripheral Reflex System
Serial Interfaces
I/O Ports
USART
External
Interrupts
Timer/Counter
Protocol Timer
ADC
PDM
General
Purpose I/O
Low Energy Timer
Watchdog Timer
Temperature
Sensor
Secure Debug
EUART
Pin Reset
Real Time
Capture Counter
Back-Up Real
Time Counter
True Random Number
Generator
I2C
Pin Wakeup
Security
AES-128, AES-256,
SHA-1, SHA-2,
ECC
Secure Boot RTSL
Timers and Triggers
Analog I/F
Lowest power mode with peripheral operational:
EM0—Active
EM1—Sleep
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EM2—Deep Sleep
EM3—Stop
EM4—Shutoff
Rev. 1.1
EFM32PG22 Gecko MCU Family Data Sheet
Feature List
1. Feature List
The EFM32PG22 highlighted features are listed below.
• Low Power MCU
• High Performance 32-bit 76.8 MHz ARM Cortex®-M33 with
DSP instruction and floating-point unit for efficient signal
processing
• Up to 512 kB flash program memory
• Up to 32 kB RAM data memory
• Low System Energy Consumption
• 26 μA/MHz in Active Mode (EM0) at 38.4 MHz
• 1.10 μA EM2 DeepSleep current (8 kB RAM retention and
RTC running from LFRCO)
• 0.95 μA EM3 DeepSleep current (8 kB RAM retention and
RTC running from ULFRCO)
• 0.17 μA EM4 current
• Security Features
• Secure Boot with Root of Trust and Secure Loader (RTSL)
• Hardware Cryptographic Acceleration for AES128/256,
SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA,
and ECDH
• True Random Number Generator (TRNG) compliant with
NIST SP800-90 and AIS-31
• ARM® TrustZone®
• Secure Debug with lock/unlock
• Packages
• QFN40 5 mm × 5 mm × 0.85 mm
• QFN32 4 mm × 4 mm × 0.85 mm
silabs.com | Building a more connected world.
• Wide selection of MCU peripherals
• Analog to Digital Converter (ADC)
• 12-bit @ 1 Msps
• 16-bit @ 76.9 ksps
• Up to 26 General Purpose I/O pins with output state retention and asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 4 × 16-bit Timer/Counter with 3 Compare/Capture/PWM
channels
• 1 × 32-bit Timer/Counter with 3 Compare/Capture/PWM
channels
• 32-bit Real Time Counter
• 24-bit Low Energy Timer for waveform generation
• 1 × Watchdog Timer
• 2 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
• 1 × Enhanced Universal Asynchronous Receiver/Transmitter (EUART)
• 2 × I2C interface with SMBus support
• Digital microphone interface (PDM)
• Die temperature sensor with +/-1.5 °C accuracy after singlepoint calibration
• Wide Operating Range
• 1.71 V to 3.8 V single power supply
• -40 °C to 125 °C
Rev. 1.1 | 2
EFM32PG22 Gecko MCU Family Data Sheet
Ordering Information
2. Ordering Information
Table 2.1. Ordering Information
Max CPU Speed
Flash
(kB)
RAM
(kB)
GPIO
EFM32PG22C200F64IM40-C
76.8 MHz
64
32
EFM32PG22C200F64IM32-C
76.8 MHz
64
EFM32PG22C200F512IM40-C
76.8 MHz
EFM32PG22C200F512IM32-C
Ordering Code
Package
Temp Range
26
QFN40
-40 to 125 °C
32
18
QFN32
-40 to 125 °C
512
32
26
QFN40
-40 to 125 °C
76.8 MHz
512
32
18
QFN32
-40 to 125 °C
EFM32PG22C200F256IM40-C
76.8 MHz
256
32
26
QFN40
-40 to 125 °C
EFM32PG22C200F256IM32-C
76.8 MHz
256
32
18
QFN32
-40 to 125 °C
EFM32PG22C200F128IM40-C
76.8 MHz
128
32
26
QFN40
-40 to 125 °C
EFM32PG22C200F128IM32-C
76.8 MHz
128
32
18
QFN32
-40 to 125 °C
silabs.com | Building a more connected world.
Rev. 1.1 | 3
Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Introduction .
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. 7
3.2 General Purpose Input/Output (GPIO) .
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. 7
3.3 Clocking . . . . . . . . . .
3.3.1 Clock Management Unit (CMU) .
3.3.2 Internal and External Oscillators.
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3.4 Counters/Timers and PWM . . . . . .
3.4.1 Timer/Counter (TIMER) . . . . .
3.4.2 Low Energy Timer (LETIMER) . . .
3.4.3 Real Time Clock with Capture (RTCC)
3.4.4 Back-Up Real Time Counter (BURTC)
3.4.5 Watchdog Timer (WDOG) . . . . .
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3.5 Communications and Other Digital Peripherals . . . . . . . . . .
3.5.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) .
3.5.2 Enhanced Universal Asynchronous Receiver/Transmitter (EUART) . .
3.5.3 Inter-Integrated Circuit Interface (I2C) . . . . . . . . . . . .
3.5.4 Peripheral Reflex System (PRS) . . . . . . . . . . . . .
3.5.5 Pulse Density Modulation (PDM) Interface . . . . . . . . . .
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3.6 Security Features . . . . . . . . . . . . . . . .
3.6.1 Secure Boot with Root of Trust and Secure Loader (RTSL)
3.6.2 Cryptographic Accelerator. . . . . . . . . . . .
3.6.3 True Random Number Generator . . . . . . . . .
3.6.4 Secure Debug with Lock/Unlock. . . . . . . . . .
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. 9
. 9
.10
.10
.10
3.7 Analog. . . . . . . . . . . .
3.7.1 Analog to Digital Converter (IADC) .
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.10
.10
3.8 Power . . . . . . . . . . .
3.8.1 Energy Management Unit (EMU)
3.8.2 Voltage Scaling . . . . . .
3.8.3 DC-DC Converter . . . . .
3.8.4 Power Domains . . . . . .
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.11
.11
.11
.11
.11
3.9 Reset Management Unit (RMU) .
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.12
3.10 Core and Memory . . . . . . . . . . . .
3.10.1 Processor Core . . . . . . . . . . . .
3.10.2 Memory System Controller (MSC) . . . . .
3.10.3 Linked Direct Memory Access Controller (LDMA)
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.12
.12
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3.11 Memory Map .
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.13
3.12 Configuration Summary
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.14
4. Electrical Specifications
. . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1 Electrical Characteristics
silabs.com | Building a more connected world.
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.15
Rev. 1.1 | 4
4.2 Absolute Maximum Ratings.
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.16
4.3 General Operating Conditions .
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.17
4.4 DC-DC Converter . . . . .
4.4.1 DC-DC Operating Limits .
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.18
.20
4.5 Thermal Characteristics .
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.21
4.6 Current Consumption . . . . . . . . . . . . .
4.6.1 MCU current consumption using DC-DC at 3.0 V input
4.6.2 MCU current consumption at 3.0 V . . . . . . .
4.6.3 MCU current consumption at 1.8 V . . . . . . .
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.22
.22
.24
.26
4.7 Flash Characteristics .
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.28
4.8 Wake Up, Entry, and Exit times .
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.29
4.9 Oscillators . . . . . . . . . . .
4.9.1 High Frequency Crystal Oscillator . .
4.9.2 Low Frequency Crystal Oscillator . .
4.9.3 High Frequency RC Oscillator (HFRCO)
4.9.4 Fast Start_Up RC Oscillator (FSRCO).
4.9.5 Low Frequency RC Oscillator (LFRCO)
4.9.6 Ultra Low Frequency RC Oscillator . .
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.30
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.31
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4.10 GPIO Pins (3V GPIO pins)
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.35
4.11 Analog to Digital Converter (IADC) .
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.37
4.12 Temperature Sense .
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.39
4.13 Brown Out Detectors . . .
4.13.1 DVDD BOD . . . . .
4.13.2 LE DVDD BOD . . . .
4.13.3 AVDD and IOVDD BODs
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.40
.40
.40
.41
4.14 PDM Timing Specifications . . . . . . . . .
4.14.1 Pulse Density Modulator (PDM), Common DBUS
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.42
.42
4.15 USART SPI Main Timing . . . . . . . . . .
4.15.1 SPI Main Timing, Voltage Scaling = VSCALE2 .
4.15.2 SPI Main Timing, Voltage Scaling = VSCALE1 .
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.43
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4.16 USART SPI Secondary Timing . . . . . . . . . .
4.16.1 SPI Secondary Timing, Voltage Scaling = VSCALE2 .
4.16.2 SPI Secondary Timing, Voltage Scaling = VSCALE1 .
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.45
.45
.46
4.17 I2C Electrical Specifications .
4.17.1 I2C Standard-mode (Sm)
4.17.2 I2C Fast-mode (Fm) . .
4.17.3 I2C Fast-mode Plus (Fm+)
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.47
.47
.48
.49
4.18 Typical Performance Curves
4.18.1 Supply Current . . .
4.18.2 DC-DC Converter . .
4.18.3 IADC . . . . . .
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.49
.50
.51
.52
5.1 Power .
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5. Typical Connections
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. . . . . . . . . . . . . . . . . . . . . . . . . . .53
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silabs.com | Building a more connected world.
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.53
Rev. 1.1 | 5
5.2 Other Connections.
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6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6.1 QFN32 Device Pinout
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6.2 QFN40 Device Pinout
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6.3 Alternate Function Table.
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6.4 Analog Peripheral Connectivity
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6.5 Digital Peripheral Connectivity .
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7. QFN32 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . .
63
7.1 QFN32 Package Dimensions .
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8. QFN40 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . .
68
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9. Revision History
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silabs.com | Building a more connected world.
Rev. 1.1 | 6
EFM32PG22 Gecko MCU Family Data Sheet
System Overview
3. System Overview
3.1 Introduction
The EFM32PG22 Gecko product family is well suited for any battery operated application as well as other systems requiring high performance and low energy consumption. This section gives a short introduction to the MCU system. The detailed functional description
can be found in the EFM32PG22 Reference Manual.
A block diagram of the EFM32PG22 family is shown in Figure 3.1 Detailed EFM32PG22 Block Diagram on page 7. The diagram
shows a superset of features available on the family, which vary by OPN. For more information about specific device features, consult
Ordering Information.
Serial Wire and ETM
Debug / Programming
with Debug Challenge I/F
Core and Memory
Port I/O Configuration
ARM Cortex-M33 Core
with Floating Point Unit
Digital Peripherals
Up to 512 KB ISP Flash
Program Memory
USART
EUART
32 KB RAM
Energy Management
DC-DC
Converter
Voltage
Regulator
Clock Management
ULFRCO
DECOUPLE
FSRCO
LFRCO
LFXTAL_I
DBUS
Port
Mappers
TIMER
RTCC
Watchdog
Timer
bypass
VREGSW
LETIMER
Voltage
Monitor
AVDD
DVDD
VREGVDD
I2C
Trust Zone
LDMA Controller
IOVDD
IOVDD
A A
H P
B B
Port A
Drivers
PAn
Port B
Drivers
PBn
Port C
Drivers
PCn
Port D
Drivers
PDn
PDM
TRNG
CRYPTOACC
CRC
LFXO
LFXTAL_O
HFXTAL_I
HFRCO
HFXO
HFXTAL_O
Analog Peripherals
Internal
Reference
Temperature
Sensor
12-16-bit
ADC
VDD
ABUS Multiplexers
Debug Signals
(shared w/GPIO)
Reset Management Unit,
Brown Out and POR
Input Mux
RESETn
Figure 3.1. Detailed EFM32PG22 Block Diagram
3.2 General Purpose Input/Output (GPIO)
EFM32PG22 has up to 26 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or
input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO
pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to
several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals. The GPIO subsystem supports asynchronous external pin interrupts.
All of the pins on ports A and port B are EM2 capable. These pins may be used by Low-Energy peripherals in EM2/3 and may also be
used as EM2/3 pin wake-ups. Pins on ports C and D are latched/retained in their current state when entering EM2 until EM2 exit upon
which internal peripherals could once again drive those pads.
A few GPIOs also have EM4 wake functionality. These pins are listed in the Alternate Function Table.
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Rev. 1.1 | 7
EFM32PG22 Gecko MCU Family Data Sheet
System Overview
3.3 Clocking
3.3.1 Clock Management Unit (CMU)
The Clock Management Unit controls oscillators and clocks in the EFM32PG22. Individual enabling and disabling of clocks to all peripheral modules is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility
allows software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and
oscillators.
3.3.2 Internal and External Oscillators
The EFM32PG22 supports two crystal oscillators and fully integrates four RC oscillators, listed below.
• A high frequency crystal oscillator (HFXO) with integrated load capacitors, tunable in small steps, provides a precise timing reference for the MCU. The HFXO can also support an external clock source such as a TCXO for applications that require an extremely
accurate clock frequency over temperature.
• A 32.768 kHz crystal oscillator (LFXO) provides an accurate timing reference for low energy modes.
• An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The
HFRCO employs fast start-up at minimal energy consumption combined with a wide frequency range, from 1 MHz to 76.8 MHz.
• An integrated fast start-up RC oscillator (FSRCO) that runs at a fixed 20 MHz
• An integrated low frequency 32.768 kHz RC oscillator (LFRCO) for low power operation without an external crystal. Precision mode
enables periodic recalibration against the 38.4 MHz HFXO crystal to improve accuracy to +/- 500 ppm.
• An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy consumption in low energy modes.
3.4 Counters/Timers and PWM
3.4.1 Timer/Counter (TIMER)
TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the
Peripheral Reflex System (PRS). The core of each TIMER is a 16-bit or 32-bit counter with up to 3 compare/capture channels. Each
channel is configurable in one of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In
compare mode, the channel output reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER
supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the
compare registers. In addition some timers offer dead-time insertion.
See 3.12 Configuration Summary for information on the feature set of each timer.
3.4.2 Low Energy Timer (LETIMER)
The unique LETIMER is a 24-bit timer that is available in energy mode EM0 Active, EM1 Sleep, EM2 Deep Sleep, and EM3 Stop. This
allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed
while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of waveforms with minimal software intervention. The LETIMER is connected to the Peripheral Reflex System (PRS), and can be configured to
start counting on compare matches from other peripherals such as the Real Time Clock.
3.4.3 Real Time Clock with Capture (RTCC)
The Real Time Clock with Capture (RTCC) is a 32-bit counter providing timekeeping down to EM3. The RTCC can be clocked by any of
the on-board low-frequency oscillators, and it is capable of providing system wake-up at user defined intervals.
3.4.4 Back-Up Real Time Counter (BURTC)
The Back-Up Real Time Counter (BURTC) is a 32-bit counter providing timekeeping in all energy modes, including EM4. The BURTC
can be clocked by any of the on-board low-frequency oscillators, and it is capable of providing system wake-up at user-defined intervals.
3.4.5 Watchdog Timer (WDOG)
The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed
monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can
also monitor autonomous systems driven by the Peripheral Reflex System (PRS).
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Rev. 1.1 | 8
EFM32PG22 Gecko MCU Family Data Sheet
System Overview
3.5 Communications and Other Digital Peripherals
3.5.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O module. It supports full duplex asynchronous
UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices supporting:
• ISO7816 SmartCards
• IrDA
• I2S
3.5.2 Enhanced Universal Asynchronous Receiver/Transmitter (EUART)
The Enhanced Universal Asynchronous Receiver/Transmitter supports full duplex asynchronous UART communication with hardware
flow control, RS-485 and IrDA support. In EM0 and EM1 the EUART provides a high-speed, buffered communication interface.
When routed to GPIO ports A or B, the EUART may also be used in a low-energy mode and operate in EM2. A 32.768 kHz clock
source allows full duplex UART communication up to 9600 baud.
3.5.3 Inter-Integrated Circuit Interface (I2C)
The I2C module provides an interface between the MCU and a serial I2C bus. It is capable of acting as a main or secondary interface
and supports multi-drop buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates from
10 kbit/s up to 1 Mbit/s. Bus arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system. The
interface provided to software by the I2C module allows precise timing control of the transmission process and highly automated transfers. Automatic recognition of addresses is provided in active and low energy modes. Note that not all instances of I2C are available in
all energy modes.
3.5.4 Peripheral Reflex System (PRS)
The Peripheral Reflex System provides a communication network between different peripheral modules without software involvement.
Peripheral modules producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer peripherals which in turn perform actions in response. Edge triggers and other functionality such as simple logic operations (AND, OR, NOT)
can be applied by the PRS to the signals. The PRS allows peripherals to act autonomously without waking the MCU core, saving power.
3.5.5 Pulse Density Modulation (PDM) Interface
The PDM module provides a serial interface and decimation filter for Pulse Density Modulation (PDM) microphones, isolated Sigmadelta ADCs, digital sensors and other PDM or sigma delta bit stream peripherals. A programmable Cascaded Integrator Comb (CIC)
filter is used to decimate the incoming bit streams. PDM supports stereo or mono input data and DMA transfer.
3.6 Security Features
The following security features are available on the EFM32PG22:
• Secure Boot with Root of Trust and Secure Loader (RTSL)
• Cryptographic Accelerator
• True Random Number Generator (TRNG)
• Secure Debug with Lock/Unlock
3.6.1 Secure Boot with Root of Trust and Secure Loader (RTSL)
The Secure Boot with RTSL authenticates a chain of trusted firmware that begins from an immutable memory (ROM).
It prevents malware injection, prevents rollback, ensures that only authentic firmware is executed.
More information on this feature can be found in the Application Note AN1218: Series 2 Secure Boot with RTSL.
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Rev. 1.1 | 9
EFM32PG22 Gecko MCU Family Data Sheet
System Overview
3.6.2 Cryptographic Accelerator
The Cryptographic Accelerator is an autonomous hardware accelerator which supports AES encryption and decryption with
128/192/256-bit keys, Elliptic Curve Cryptography (ECC) to support public key operations and hashes.
Supported block cipher modes of operation for AES include:
• ECB (Electronic Code Book)
• CTR (Counter Mode)
• CBC (Cipher Block Chaining)
• CFB (Cipher Feedback)
• GCM (Galois Counter Mode)
• CBC-MAC (Cipher Block Chaining Message Authentication Code)
• GMAC (Galois Message Authentication Code)
• CCM (Counter with CBC-MAC)
The Cryptographic Accelerator accelerates Elliptical Curve Cryptography and supports the NIST (National Institute of Standards and
Technology) recommended curves including P-192 and P-256 for ECDH(Elliptic Curve Diffie-Hellman) key derivation and ECDSA (Elliptic Curve Digital Signature Algorithm) sign and verify operations.
Supported hashes include SHA-1, SHA2/224, and SHA-2/256.
This implementation provides a fast and energy efficient solution to state of the art cryptographic needs.
3.6.3 True Random Number Generator
The True Random Number Generator module is a non-deterministic random number generator that harvests entropy from a thermal
energy source. It includes start-up health tests for the entropy source as required by NIST SP800-90B and AIS-31 as well as online
health tests required for NIST SP800-90C.
The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator.
3.6.4 Secure Debug with Lock/Unlock
For obvious security reasons, it is critical for a product to have its debug interface locked before being released in the field.
In addition, the EFM32PG22 also provides a secure debug unlock function that allows authenticated access based on public key cryptography. This functionality is particularly useful for supporting failure analysis while maintaining confidentiality of IP and sensitive enduser data.
More information on this feature can be found in the Application Note AN1190.
3.7 Analog
3.7.1 Analog to Digital Converter (IADC)
The IADC is a hybrid architecture combining techniques from both SAR and Delta-Sigma style converters. It has a resolution of 12 bits
at 1 Msps and 16 bits at up to 76.9 ksps. Hardware oversampling reduces system-level noise over multiple front-end samples. The
IADC includes integrated voltage reference options. Inputs are selectable from a wide range of sources, including pins configurable as
either single-ended or differential.
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Rev. 1.1 | 10
EFM32PG22 Gecko MCU Family Data Sheet
System Overview
3.8 Power
The EFM32PG22 has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only
a single external supply voltage is required, from which all internal voltages are created. An optional integrated DC-DC buck regulator
can be utilized to further reduce the current consumption. The DC-DC regulator requires one external inductor and one external capacitor.
The EFM32PG22 device family includes support for internal supply voltage scaling, as well as two different power domains groups for
peripherals. These enhancements allow for further supply current reductions and lower overall power consumption.
3.8.1 Energy Management Unit (EMU)
The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and
features are available and the amount of current the device consumes. The EMU can also be used to implement system-wide voltage
scaling and turn off the power to unused RAM blocks to optimize the energy consumption in the target application. The DC-DC regulator operation is tightly integrated with the EMU.
3.8.2 Voltage Scaling
The EFM32PG22 supports supply voltage scaling for the LDO powering DECOUPLE, with independent selections for EM0 / EM1 and
EM2 / EM3. Voltage scaling helps to optimize the energy efficiency of the system by operating at lower voltages when possible. The
EM0 / EM1 voltage scaling level defaults to VSCALE2, which allows the core to operate in active mode at full speed. The intermediate
level, VSCALE1, allows operation in EM0 and EM1 at up to 40 MHz. The lowest level, VSCALE0, can be used to conserve power further in EM2 and EM3. The EMU will automatically switch the target voltage scaling level when transitioning between energy modes.
3.8.3 DC-DC Converter
The DC-DC buck converter covers a wide range of load currents, provides high efficiency in energy modes EM0, EM1, EM2 and EM3,
and can supply up to 60 mA for device operation. An on-chip supply-monitor signals when the supply voltage is low to allow bypass of
the regulator via programmable software interrupt. It employs soft switching at boot and DCDC regulating-to-bypass transitions to limit
the max supply slew-rate and mitigate inrush current.
3.8.4 Power Domains
The EFM32PG22 has three peripheral power domains for operation in EM2 and EM3, as well as the ability to selectively retain configurations for EM0/EM1 peripherals. A small set of peripherals always remain powered on in EM2 and EM3, including all peripherals which
are available in EM4. If all of the peripherals in PD0B or PD0C are configured as unused, that power domain will be powered off in EM2
or EM3, reducing the overall current consumption of the device. Likewise, if the application can tolerate the setup time to re-configure
used EM0/EM1 peripherals on wake, register retention for these peripherals can be disabled to further reduce the EM2 or EM3 current.
Table 3.1. Peripheral Power Subdomains
Always available in EM2/EM3
Power Domain PD0B
Power Domain PD0C
RTCC
LETIMER0
LFRCO (Precision Mode)
LFRCO (Non-precision mode)1
IADC0
LFXO1
I2C0
BURTC1
WDOG0
ULFRCO1
EUART0
FSRCO
PRS
DEBUG
Note:
1. Peripheral also available in EM4.
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Rev. 1.1 | 11
EFM32PG22 Gecko MCU Family Data Sheet
System Overview
3.9 Reset Management Unit (RMU)
The RMU is responsible for handling reset of the EFM32PG22. A wide range of reset sources are available, including several power
supply monitors, pin reset, software controlled reset, core lockup reset, and watchdog reset.
3.10 Core and Memory
3.10.1 Processor Core
The ARM Cortex-M processor includes a 32-bit RISC processor integrating the following features and tasks in the system:
• ARM Cortex-M33 RISC processor achieving 1.50 Dhrystone MIPS/MHz
• ARM TrustZone security technology
• Embedded Trace Macrocell (ETM) for real-time trace and debug
• Up to 512 kB flash program memory
• Up to 32 kB RAM data memory
• Configuration and event handling of all modules
• 2-pin Serial-Wire debug interface
3.10.2 Memory System Controller (MSC)
The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable
from both the Cortex-M and DMA. In addition to the main flash array where Program code is normally written the MSC also provides an
Information block where additional information such as special user information or flash-lock bits are stored. There is also a read-only
page in the information block containing system and device calibration data. Read and write operations are supported in energy modes
EM0 Active and EM1 Sleep.
3.10.3 Linked Direct Memory Access Controller (LDMA)
The Linked Direct Memory Access (LDMA) controller allows the system to perform memory operations independently of software. This
reduces both energy consumption and software workload. The LDMA allows operations to be linked together and staged, enabling sophisticated operations to be implemented.
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Rev. 1.1 | 12
EFM32PG22 Gecko MCU Family Data Sheet
System Overview
3.11 Memory Map
The EFM32PG22 memory map is shown in the figures below. RAM and flash sizes are for the largest memory configuration.
Figure 3.2. EFM32PG22 Memory Map — Core Peripherals and Code Space
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Rev. 1.1 | 13
EFM32PG22 Gecko MCU Family Data Sheet
System Overview
3.12 Configuration Summary
The features of the EFM32PG22 are a subset of the feature set described in the device reference manual. The table below describes
device specific implementation of the features. Remaining modules support full configuration.
Table 3.2. Configuration Summary
Module
Lowest Energy Mode
Configuration
I2C0
EM31
I2C1
EM1
IADC0
EM3
LETIMER0
EM21
PDM
EM1
2-channel
TIMER0
EM1
32-bit, 3-channels, +DTI
TIMER1
EM1
16-bit, 3-channels, +DTI
TIMER2
EM1
16-bit, 3-channels, +DTI
TIMER3
EM1
16-bit, 3-channels, +DTI
TIMER4
EM1
16-bit, 3-channels, +DTI
EUART0
EM1 - Full high-speed operation
EM31 - Low-energy operation, 9600 Baud
USART0
EM1
+IrDA, +I2S, +SmartCard
USART1
EM1
+IrDA, +I2S, +SmartCard
Note:
1. EM2 and EM3 operation is only supported for digital peripheral I/O on Port A and Port B. All GPIO ports support digital peripheral
operation in EM0 and EM1.
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Rev. 1.1 | 14
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4. Electrical Specifications
4.1 Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on TA=25 °C and all supplies at 3.0 V, by production test and/or technology characterization.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
Power Supply Pin Dependencies
Due to on-chip circuitry (e.g., diodes), some EFM32 power supply pins have a dependent relationship with one or more other power
supply pins. These internal relationships between the external voltages applied to the various EFM32 supply pins are defined below.
Exceeding the below constraints can result in damage to the device and/or increased current draw.
• VREGVDD & DVDD
• In systems using the DCDC converter, DVDD (the buck converter output) should be connected to the recommended LDCDC and
CDCDC, and should not be driven by an off-chip regulator.
• In systems not using the DCDC converter, DVDD must be shorted to VREGVDD on the PCB (VREGVDD=DVDD)
• DVDD ≥ DECOUPLE
• AVDD, IOVDD: No dependency with each other or any other supply pin
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Rev. 1.1 | 15
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.2 Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter
Symbol
Storage temperature range
Test Condition
Min
Typ
Max
Unit
TSTG
-50
—
+150
°C
Voltage on any supply pin1
VDDMAX
-0.3
—
3.8
V
Junction temperature
TJMAX
—
—
+125
°C
Voltage ramp rate on any
supply pin
VDDRAMPMAX
—
—
1.0
V / µs
Voltage on HFXO pins
VHFXOPIN
-0.3
—
1.4
V
DC voltage on any GPIO pin
VDIGPIN
-0.3
—
VIOVDD +
0.3
V
DC voltage on RESETn pin2
VRESETn
-0.3
—
3.8
V
-I grade
Total current into VDD power IVDDMAX
lines
Source
—
—
200
mA
Total current into VSS
ground lines
IVSSMAX
Sink
—
—
200
mA
Current per I/O pin
IIOMAX
Sink
—
—
50
mA
Source
—
—
50
mA
Sink
—
—
200
mA
Source
—
—
200
mA
Current for all I/O pins
IIOALLMAX
Note:
1. The maximum supply voltage on VREGVDD is limited under certain conditions when using the DC-DC. See the DC-DC specifications for more details.
2. The RESETn pin has a pull-up device to the DVDD supply. For minimum leakage, RESETn should not exceed the voltage at
DVDD.
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Rev. 1.1 | 16
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.3 General Operating Conditions
Table 4.2. General Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Operating ambient temperature range
TA
-I temperature grade 1
-40
—
+125
°C
DVDD supply voltage
VDVDD
EM0/1
1.71
3.0
3.8
V
EM2/3/42
1.71
3.0
3.8
V
AVDD supply voltage
VAVDD
1.71
3.0
3.8
V
IOVDDx operating supply
voltage (All IOVDD pins)
VIOVDDx
1.71
3.0
3.8
V
VREGVDD operating supply
voltage
VVREGVDD
DC-DC in regulation3
2.2
3.0
3.8
V
DC-DC in bypass 60 mA load
1.8
3.0
3.8
V
DC-DC not in use. DVDD externally shorted to VREGVDD
1.71
3.0
3.8
V
1.0 µF ± 10% X8L capacitor used
for performance characterization.
1.0
—
2.75
µF
HCLK and SYSCLK frequen- fHCLK
cy
VSCALE2, MODE = WS1
—
—
76.8
MHz
VSCALE2, MODE = WS0
—
—
40
MHz
PCLK frequency
VSCALE2
—
—
50
MHz
VSCALE1
—
—
40
MHz
VSCALE2
—
—
76.8
MHz
VSCALE1
—
—
40
MHz
VSCALE2
—
—
76.8
MHz
VSCALE1
—
—
40
MHz
DECOUPLE output capacitor4
CDECOUPLE
fPCLK
EM01 Group A clock frequency
fEM01GRPACLK
EM01 Group B clock frequency
fEM01GRPBCLK
Note:
1. The device may operate continuously at the maximum allowable ambient TA rating as long as the absolute maximum TJMAX is not
exceeded. For an application with significant power dissipation, the allowable TA may be lower than the maximum TA rating. TA =
TJMAX - (THETAJA x PowerDissipation). Refer to the Absolute Maximum Ratings table and the Thermal Characteristics table for
TJMAX and THETAJA.
2. The DVDD supply is monitored by the DVDD BOD in EM0/1 and the LE DVDD BOD in EM2/3/4.
3. The maximum supply voltage on VREGVDD is limited under certain conditions when using the DC-DC. See the DC-DC specifications for more details.
4. Murata GCM21BL81C105KA58L used for performance characterization. Actual capacitor values can be significantly de-rated
from their specified nominal value by the rated tolerance, as well as the application's AC voltage, DC bias, and temperature. The
minimum capacitance counting all error sources should be no less than 0.6 µF.
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Rev. 1.1 | 17
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.4 DC-DC Converter
Test conditions: LDCDC = 2.2 µH (Samsung CIG22H2R2MNE), CDCDC = 4.7 µF (Samsung CL10B475KQ8NQNC), VVREGVDD = 3.0 V,
VOUT = 1.8 V, IPKVAL in EM0/1 modes is set to 150 mA, and in EM2/3 modes is set to 90 mA, unless otherwise indicated.
Table 4.3. DC-DC Converter
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Input voltage range at
VREGVDD pin1
VVREGVDD
DCDC in regulation, ILOAD = 60
mA, EM0/EM1 mode
2.2
3.0
3.8*
V
DCDC in regulation, ILOAD = 5
mA, EM0/EM1 or EM2/EM3 mode
1.8
3.0
3.8*
V
Bypass mode
1.8
3.0
3.8
V
—
1.8
—
V
-2.5
—
3.3
%
Regulated output voltage
VOUT
Regulation DC accuracy
ACCDC
VVREGVDD ≥ 2.2 V, Steady state in
EM0/EM1 mode or EM2/EM3
mode
Regulation total accuracy
ACCTOT
With mode transitions between
EM0/EM1 and EM2/EM3 modes
-5
—
7
%
Steady-state output ripple
VR
ILOAD = 20 mA in EM0/EM1 mode
—
14.3
—
mVpp
DC line regulation
VREG
ILOAD = 60 mA in EM0/EM1
mode, VVREGVDD ≥ 2.2 V
—
5.5
—
mV/V
DC load regulation
IREG
Load current between 100 µA and
60 mA in EM0/EM1 mode
—
0.27
—
mV/mA
Efficiency
EFF
Load current between 100 µA and
60 mA in EM0/EM1 mode, or between 10 µA and 5 mA in
EM2/EM3 mode
—
91
—
%
Output load current
ILOAD
EM0/EM1 mode, DCDC in regulation
—
—
60
mA
EM2/EM3 mode, DCDC in regulation
—
—
5
mA
Bypass mode
—
—
60
mA
Nominal output capacitor
CDCDC
4.7 µF ± 10% X7R capacitor used
for performance characterization2
4.7
—
10
µF
Nominal inductor
LDCDC
± 20% tolerance
—
2.2
—
µH
Nominal input capacitor
CIN
CDCDC
—
—
µF
Resistance in bypass mode
RBYP
Bypass switch from VREGVDD to
DVDD, VVREGVDD = 1.8 V
—
1.75
3
Ω
Powertrain PFET switch from
VREGVDD to VREGSW,
VVREGVDD = 1.8 V
—
0.86
1.5
Ω
Programmable in 0.1 V steps
2.0
—
2.3
V
Supply falling edge trip point
-5
—
5
%
Supply monitor threshold
programming range
VCMP_RNG
Supply monitor threshold ac- VCMP_ACC
curacy
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Rev. 1.1 | 18
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Supply monitor threshold
hysteresis
VCMP_HYST
Positive hysteresis on the supply
rising edge referred to the falling
edge trip point
—
4
—
%
Supply monitor response
time
tCMP_DELAY
Supply falling edge at -100 mV /
µs
—
0.6
—
µs
Note:
1. The supported maximum VVREGVDD in regulation mode is a function of temperature and 10-year lifetime average load current.
See more details in 4.4.1 DC-DC Operating Limits.
2. Samsung CL10B475KQ8NQNC used for performance characterization. Actual capacitor values can be significantly de-rated from
their specified nominal value by the rated tolerance, as well as the application's AC voltage, DC bias, and temperature. The minimum capacitance counting all error sources should be no less than 2.4 µF.
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Rev. 1.1 | 19
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.4.1 DC-DC Operating Limits
The maximum supported voltage on the VREGVDD supply pin is limited under certain conditions. Maximum input voltage is a function
of temperature and the average load current over a 10-year lifetime. Figure 4.1 Lifetime average load current limit vs. Maximum input
voltage on page 20 shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the
reliability and performance of the DC-DC converter.
Average Lifetime ILOAD (mA)
The average load current for an application can typically be determined by examining the current profile during the time the device is
powered. For example, an application that is continuously powered which spends 99% of the time asleep consuming 2 µA and 1% of
the time active and consuming 10 mA has an average lifetime load current of about 102 µA.
60
Tj ≤ 125 °C
5
3.3
Maximum VVREGVDD (V)
3.8
Figure 4.1. Lifetime average load current limit vs. Maximum input voltage
Maximum ILOAD (mA)
The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting.
Figure 4.2 Transient maximum load current vs. Minimum input voltage on page 20 shows the max load current vs. input voltage for
different DC-DC peak inductor current settings.
60
36
IPEAK = 150 mA
IPEAK = 90 mA
5
1.8
2.2
Minimum VVREGVDD (V)
Figure 4.2. Transient maximum load current vs. Minimum input voltage
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Rev. 1.1 | 20
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.5 Thermal Characteristics
Table 4.4. Thermal Characteristics
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Thermal Resistance Junction THEto Ambient QFN32 (4x4mm) TAJA_QFN32_4X4
Package
4-Layer PCB, Natural Convection1
—
35.4
—
°C/W
Thermal Resistance, Junction to Ambient, QFN40
(5x5mm) Package
4-Layer PCB, Natural Convection1
—
32.6
—
°C/W
THETAJA_QFN40_5X5
Note:
1. Measured according to JEDEC standard JESD51-2A. Integrated Circuit Thermal Test Method Environmental Conditions - Natural
Convection (Still Air).
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Rev. 1.1 | 21
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.6 Current Consumption
4.6.1 MCU current consumption using DC-DC at 3.0 V input
Unless otherwise indicated, typical conditions are: VREGVDD = 3.0 V. AVDD = DVDD = IOVDD = 1.8 V from DC-DC. Voltage scaling
level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA
= 25 °C.
Table 4.5. MCU current consumption using DC-DC at 3.0 V input
Parameter
Symbol
Current consumption in EM0 IACTIVE
mode with all peripherals disabled
Current consumption in EM1 IEM1
mode with all peripherals disabled
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Test Condition
Min
Typ
Max
Unit
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running Prime from flash,
VSCALE2
—
28
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running while loop from flash,
VSCALE2
—
27
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running CoreMark loop from flash,
VSCALE2
—
37
—
µA/MHz
38.4 MHz crystal, CPU running
Prime from flash
—
28
—
µA/MHz
38.4 MHz crystal, CPU running
while loop from flash
—
26
—
µA/MHz
38.4 MHz crystal, CPU running
CoreMark loop from flash
—
38
—
µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
—
22
—
µA/MHz
26 MHz HFRCO, CPU running
while loop from flash
—
24
—
µA/MHz
16 MHz HFRCO, CPU running
while loop from flash
—
27
—
µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
—
159
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal,
VSCALE2
—
17
—
µA/MHz
38.4 MHz crystal
—
17
—
µA/MHz
38 MHz HFRCO
—
13
—
µA/MHz
26 MHz HFRCO
—
15
—
µA/MHz
16 MHz HFRCO
—
18
—
µA/MHz
1 MHz HFRCO
—
150
—
µA/MHz
Rev. 1.1 | 22
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
Parameter
Symbol
Current consumption in EM2 IEM2_VS
mode, VSCALE0
Current consumption in EM3 IEM3_VS
mode, VSCALE0
Additional current in EM2 or
EM3 when any peripheral in
PD0B is enabled1
IPD0B_VS
Test Condition
Min
Typ
Max
Unit
Full RAM retention and RTC running from LFXO
—
1.30
—
µA
Full RAM retention and RTC running from LFRCO
—
1.30
—
µA
Full RAM retention and RTC running from LFRCO in precision
mode
—
1.65
—
µA
24 kB RAM retention and RTC
running from LFXO
—
1.22
—
µA
24 kB RAM retention and RTC
running from LFRCO in precision
mode
—
1.56
—
µA
8 kB RAM retention and RTC running from LFXO
—
1.11
—
µA
8 kB RAM retention and RTC running from LFRCO
—
1.10
—
µA
8 kB RAM retention and RTC running from LFXO, CPU cache not
retained
—
1.03
—
µA
8 kB RAM retention and RTC running from ULFRCO
—
0.95
—
µA
—
0.37
—
µA
Note:
1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the
peripherals in each power domain.
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Rev. 1.1 | 23
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.6.2 MCU current consumption at 3.0 V
Unless otherwise indicated, typical conditions are: AVDD = DVDD = IOVDD = VREGVDD = 3.0 V. DC-DC not used. Voltage scaling
level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA
= 25 °C.
Table 4.6. MCU current consumption at 3.0 V
Parameter
Symbol
Current consumption in EM0 IACTIVE
mode with all peripherals disabled
Current consumption in EM1 IEM1
mode with all peripherals disabled
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Test Condition
Min
Typ
Max
Unit
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running Prime from flash,
VSCALE2
—
42
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running while loop from flash,
VSCALE2
—
39
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running CoreMark loop from flash,
VSCALE2
—
54
—
µA/MHz
38.4 MHz crystal, CPU running
Prime from flash
—
40
—
µA/MHz
38.4 MHz crystal, CPU running
while loop from flash
—
39
—
µA/MHz
38.4 MHz crystal, CPU running
CoreMark loop from flash
—
55
—
µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
—
33
50
µA/MHz
26 MHz HFRCO, CPU running
while loop from flash
—
35
—
µA/MHz
16 MHz HFRCO, CPU running
while loop from flash
—
40
—
µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
—
228
830
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal,
VSCALE2
—
24
—
µA/MHz
38.4 MHz crystal
—
25
—
µA/MHz
38 MHz HFRCO
—
19
35
µA/MHz
26 MHz HFRCO
—
21
—
µA/MHz
16 MHz HFRCO
—
27
—
µA/MHz
1 MHz HFRCO
—
215
770
µA/MHz
Rev. 1.1 | 24
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
Parameter
Symbol
Min
Typ
Max
Unit
Full RAM retention and RTC running from LFXO
—
1.74
—
µA
Full RAM retention and RTC running from LFRCO
—
1.75
4.9
µA
24 kB RAM retention and RTC
running from LFXO
—
1.61
—
µA
24 kB RAM retention and RTC
running from LFRCO in precision
mode
—
2.14
—
µA
8 kB RAM retention and RTC running from LFXO
—
1.44
—
µA
8 kB RAM retention and RTC running from LFRCO
—
1.45
—
µA
8 kB RAM retention and RTC running from LFXO, CPU cache not
retained
—
1.39
—
µA
Current consumption in EM3 IEM3_VS
mode, VSCALE0
8 kB RAM retention and RTC running from ULFRCO
—
1.21
3.7
µA
Current consumption in EM4 IEM4
mode
No BURTC, no LF oscillator
—
0.17
0.43
µA
BURTC with LFXO
—
0.50
—
µA
Current consumption during
reset
IRST
Hard pin reset held
—
234
—
µA
Additional current in EM2 or
EM3 when any peripheral in
PD0B is enabled1
IPD0B_VS
—
0.56
—
µA
Current consumption in EM2 IEM2_VS
mode, VSCALE0
Test Condition
Note:
1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the
peripherals in each power domain.
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Rev. 1.1 | 25
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.6.3 MCU current consumption at 1.8 V
Unless otherwise indicated, typical conditions are: AVDD = DVDD = IOVDD = VREGVDD = 1.8 V. DC-DC not used. Voltage scaling
level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA
= 25 °C.
Table 4.7. MCU current consumption at 1.8 V
Parameter
Symbol
Current consumption in EM0 IACTIVE
mode with all peripherals disabled
Current consumption in EM1 IEM1
mode with all peripherals disabled
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Test Condition
Min
Typ
Max
Unit
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running Prime from flash,
VSCALE2
—
42
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running while loop from flash,
VSCALE2
—
39
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU
running CoreMark loop from flash,
VSCALE2
—
54
—
µA/MHz
38.4 MHz crystal, CPU running
Prime from flash
—
41
—
µA/MHz
38.4 MHz crystal, CPU running
while loop from flash
—
39
—
µA/MHz
38.4 MHz crystal, CPU running
CoreMark loop from flash
—
55
—
µA/MHz
38 MHz HFRCO, CPU running
while loop from flash
—
33
—
µA/MHz
26 MHz HFRCO, CPU running
while loop from flash
—
35
—
µA/MHz
16 MHz HFRCO, CPU running
while loop from flash
—
40
—
µA/MHz
1 MHz HFRCO, CPU running
while loop from flash
—
227
—
µA/MHz
76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal,
VSCALE2
—
24
—
µA/MHz
38.4 MHz crystal
—
25
—
µA/MHz
38 MHz HFRCO
—
19
—
µA/MHz
26 MHz HFRCO
—
21
—
µA/MHz
16 MHz HFRCO
—
27
—
µA/MHz
1 MHz HFRCO
—
213
—
µA/MHz
Rev. 1.1 | 26
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
Parameter
Symbol
Min
Typ
Max
Unit
Full RAM retention and RTC running from LFXO
—
1.67
—
µA
Full RAM retention and RTC running from LFRCO
—
1.66
—
µA
24 kB RAM retention and RTC
running from LFXO
—
1.53
—
µA
24 kB RAM retention and RTC
running from LFRCO in precision
mode
—
2.06
—
µA
8 kB RAM retention and RTC running from LFXO
—
1.37
—
µA
8 kB RAM retention and RTC running from LFRCO
—
1.36
—
µA
8 kB RAM retention and RTC running from LFXO, CPU cache not
retained
—
1.32
—
µA
Current consumption in EM3 IEM3_VS
mode, VSCALE0
8 kB RAM retention and RTC running from ULFRCO
—
1.14
—
µA
Current consumption in EM4 IEM4
mode
No BURTC, no LF oscillator
—
0.13
—
µA
BURTC with LFXO
—
0.44
—
µA
Current consumption during
reset
IRST
Hard pin reset held
—
190
—
µA
Additional current in EM2 or
EM3 when any peripheral in
PD0B is enabled1
IPD0B_VS
—
0.54
—
µA
Current consumption in EM2 IEM2_VS
mode, VSCALE0
Test Condition
Note:
1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the
peripherals in each power domain.
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Rev. 1.1 | 27
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.7 Flash Characteristics
Table 4.8. Flash Characteristics
Parameter
Symbol
Flash Supply voltage during
write or erase
VFLASH
Flash erase cycles before
failure1
ECFLASH
Flash data retention1
RETFLASH
Program Time
tPROG
Test Condition
Min
Typ
Max
Unit
1.71
—
3.8
V
10,000
—
—
cycles
10
—
—
years
one word (32-bits)
42.1
44
45.6
uSec
average per word over 128 words
10.3
10.9
11.3
uSec
11.4
12.9
14.4
ms
11.7
13
14.3
ms
—
—
1.45
mA
Page Erase Time
tPERASE
Mass Erase Time
tMERASE
Program Current
IPROG
Page Erase Current
IPERASE
Page Erase
—
—
1.34
mA
Mass Erase Current
IMERASE
Mass Erase
—
—
1.28
mA
Erases all of User Code area
Note:
1. Flash data retention information is published in the Quarterly Quality and Reliability Report.
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Rev. 1.1 | 28
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.8 Wake Up, Entry, and Exit times
Unless otherwise specified, these times are measured using the HFRCO at 19 MHz.
Table 4.9. Wake Up, Entry, and Exit times
Parameter
Symbol
Test Condition
WakeupTime from EM1
tEM1_WU
WakeupTime from EM2
WakupTime from EM3
tEM2_WU
tEM3_WU
Min
Typ
Max
Unit
Code execution from flash
—
3
—
AHB
Clocks
Code execution from RAM
—
1.42
—
µs
Code execution from flash, No
Voltage Scaling
—
13.22
—
µs
Code execution from RAM, No
Voltage Scaling
—
5.15
—
µs
Voltage scaling up one level1
—
37.89
—
µs
Voltage scaling up two levels2
—
50.56
—
µs
Code execution from flash, No
Voltage Scaling
—
13.21
—
µs
Code execution from RAM, No
Voltage Scaling
—
5.15
—
µs
Voltage scaling up one level1
—
37.90
—
µs
Voltage scaling up two levels2
—
50.55
—
µs
WakeupTime from EM4
tEM4_WU
Code execution from flash
—
8.81
—
ms
Entry time to EM1
tEM1_ENT
Code execution from flash
—
1.29
—
µs
Entry time to EM2
tEM2_ENT
Code execution from flash
—
5.23
—
µs
Entry time to EM3
tEM3_ENT
Code execution from flash
—
5.23
—
µs
Entry time to EM4
tEM4_ENT
Code execution from flash
—
9.96
—
µs
Voltage scaling in time in
EM03
tSCALE
Up from VSCALE1 to VSCALE2
—
32
—
µs
Down from VSCALE2 to
VSCALE1
—
172
—
µs
Note:
1. Voltage scaling one level is between VSCALE0 and VSCALE1 or between VSCALE1 and VSCALE2.
2. Voltage scaling two levels is between VSCALE0 and VSCALE2.
3. During voltage scaling in EM0, RAM is inaccessible and processor will be halted until complete.
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Rev. 1.1 | 29
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.9 Oscillators
4.9.1 High Frequency Crystal Oscillator
Unless otherwise indicated, typical conditions are: AVDD = DVDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table
represent the worst conditions across process variation, operating supply voltage range, and operating temperature range.
Table 4.10. High Frequency Crystal Oscillator
Parameter
Symbol
Crystal Frequency
FHFXO
Supported crystal equivalent
series resistance (ESR)
ESRHFXO_38M4
Supported range of crystal
load capacitance2
CHFXO_LC
Supply Current
IHFXO
Startup Time
TSTARTUP
On-chip tuning cap step
size3
SSHFXO
Test Condition
Min
Typ
Max
Unit
—
38.4
—
MHz
38.4 MHz, CL = 10 pF1
—
40
60
Ω
38.4 MHz, ESR = 40 Ω
—
10
—
pF
—
415
—
µA
—
160
—
µs
—
0.04
—
pF
38.4 MHz, ESR = 40 Ohm, CL =
10 pF
Note:
1. The crystal should have a maximum ESR less than or equal to this maximum rating.
2. Total load capacitance as seen by the crystal.
3. The tuning step size is the effective step size when incrementing one of the tuning capacitors by one count. The step size for the
each of the indivdual tuning capacitors is twice this value.
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Rev. 1.1 | 30
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.9.2 Low Frequency Crystal Oscillator
Table 4.11. Low Frequency Crystal Oscillator
Parameter
Symbol
Crystal Frequency
FLFXO
Test Condition
Min
Typ
Max
Unit
—
32.768
—
kHz
Supported Crystal equivalent ESRLFXO
series resistance (ESR)
GAIN = 0
—
—
80
kΩ
GAIN = 1 to 3
—
—
100
kΩ
Supported range of crystal
load capacitance 1
GAIN = 0
4
—
6
pF
GAIN = 1
6
—
10
pF
GAIN = 2 (see note2)
10
—
12.5
pF
GAIN = 3 (see note2)
12.5
—
18
pF
CLFXO_CL
Current consumption
ICL12p5
ESR = 70 kOhm, CL = 12.5 pF,
GAIN3 = 2, AGC4 = 1
—
357
—
nA
Startup Time
TSTARTUP
ESR = 70 kOhm, CL = 7 pF,
GAIN3 = 1, AGC4 = 1
—
63
—
ms
On-chip tuning cap step size
SSLFXO
—
0.26
—
pF
On-chip tuning capacitor val- CLFXO_MIN
ue at minimum setting5
CAPTUNE = 0
—
4
—
pF
On-chip tuning capacitor val- CLFXO_MAX
ue at maximum setting5
CAPTUNE = 0x4F
—
24.5
—
pF
Note:
1. Total load capacitance seen by the crystal
2. Crystals with a load capacitance of greater than 12 pF require external load capacitors.
3. In LFXO_CAL Register
4. In LFXO_CFG Register
5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two
caps will be seen in series by the crystal
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Rev. 1.1 | 31
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.9.3 High Frequency RC Oscillator (HFRCO)
Unless otherwise indicated, typical conditions are: AVDD = DVDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table
represent the worst conditions across process variation, operating supply voltage range, and operating temperature range.
Table 4.12. High Frequency RC Oscillator (HFRCO)
Parameter
Symbol
Test Condition
Frequency Accuracy
FHFRCO_ACC
Current consumption on all
supplies 1
IHFRCO
Clock out current for
HFRCODPLL2
Startup Time3
Min
Typ
Max
Unit
For all production calibrated frequencies
-3
—
3
%
FHFRCO = 1 MHz
—
28
—
µA
FHFRCO = 2 MHz
—
28
—
µA
FHFRCO = 4 MHz
—
28
—
µA
FHFRCO = 5 MHz
—
30
—
µA
FHFRCO = 7 MHz
—
60
—
µA
FHFRCO = 10 MHz
—
66
—
µA
FHFRCO = 13 MHz
—
79
—
µA
FHFRCO = 16 MHz
—
88
—
µA
FHFRCO = 19 MHz
—
92
—
µA
FHFRCO = 20 MHz
—
105
—
µA
FHFRCO = 26 MHz
—
118
—
µA
FHFRCO = 32 MHz
—
141
—
µA
FHFRCO = 38 MHz
—
172
—
µA
FHFRCO = 80 MHz
—
289
—
µA
ICLKOUT_HFRCOD FORECEEN bit of CTRL = 1 and
the CLKOUTDIS0 bit of TEST = 1.
PLL
—
2.72
—
µA/MHz
FORECEEN bit of CTRL i= 1 and
the CLKOUTDIS1 bit of TEST = 1.
—
0.36
—
µA/MHz
FREQRANGE = 0 to 7
—
1.2
—
µs
FREQRANGE = 8 to 15
—
0.6
—
µs
TSTARTUP
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Band Frequency Limits4
fHFRCO_BAND
FREQRANGE = 0
3.71
—
5.24
MHz
FREQRANGE = 1
4.39
—
6.26
MHz
FREQRANGE = 2
5.25
—
7.55
MHz
FREQRANGE = 3
6.22
—
9.01
MHz
FREQRANGE = 4
7.88
—
11.6
MHz
FREQRANGE = 5
9.9
—
14.6
MHz
FREQRANGE = 6
11.5
—
17.0
MHz
FREQRANGE = 7
14.1
—
20.9
MHz
FREQRANGE = 8
16.4
—
24.7
MHz
FREQRANGE = 9
19.8
—
30.4
MHz
FREQRANGE = 10
22.7
—
34.9
MHz
FREQRANGE = 11
28.6
—
44.4
MHz
FREQRANGE = 12
33.0
—
51.0
MHz
FREQRANGE = 13
42.2
—
64.6
MHz
FREQRANGE = 14
48.8
—
74.8
MHz
FREQRANGE = 15
57.6
—
87.4
MHz
Note:
1. Does not include additional clock tree current. See specifications for additional current when selected as a clock source for a particular clock multiplexer.
2. When the HFRCO is enabled for characterization using the FORCEEN bit, the total current will be the HFRCO core current plus
the specified CLKOUT current. When the HFRCO is enabled on demand, the clock current may be different.
3. Hardware delay ensures settling to within ± 0.5%. Hardware also enforces this delay on a band change.
4. The frequency band limits represent the lowest and highest freqeuncy which each band can achieve over the operating range.
4.9.4 Fast Start_Up RC Oscillator (FSRCO)
Table 4.13. Fast Start_Up RC Oscillator (FSRCO)
Parameter
Symbol
FSRCO frequency
FFSRCO
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Test Condition
Min
Typ
Max
Unit
17.2
20
21.2
MHz
Rev. 1.1 | 33
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.9.5 Low Frequency RC Oscillator (LFRCO)
Table 4.14. Low Frequency RC Oscillator (LFRCO)
Parameter
Symbol
Nominal oscillation frequency
Test Condition
Min
Typ
Max
Unit
FLFRCO
—
32.768
—
kHz
Frequency accuracy
FLFRCO_ACC
-3
—
3
%
Startup time
tSTARTUP
—
204
—
µs
Current consumption
ILFRCO
—
175
—
nA
Min
Typ
Max
Unit
0.944
1.0
1.095
kHz
4.9.6 Ultra Low Frequency RC Oscillator
Table 4.15. Ultra Low Frequency RC Oscillator
Parameter
Symbol
Oscillation Frequency
FULFRCO
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Test Condition
Rev. 1.1 | 34
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.10 GPIO Pins (3V GPIO pins)
Table 4.16. GPIO Pins (3V GPIO pins)
Parameter
Symbol
Test Condition
Leakage current
ILEAK_IO
Input low voltage1
Input high voltage1
Hysteresis of input voltage
Output high voltage
Output low voltage
GPIO rise time
GPIO fall time
Pull up/down resistance2
VIL
VIH
VHYS
VOH
VOL
TGPIO_RISE
TGPIO_FALL
RPULL
Maximum filtered glitch width TGF
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Min
Typ
Max
Unit
MODEx = DISABLED, IOVDD =
1.71 V
—
1.9
—
nA
MODEx = DISABLED, IOVDD =
3.0 V
—
2.5
—
nA
Pins other than PA00, PA03,
PB00, PC03, PC04 and PD00;
MODEx = DISABLED, IOVDD =
3.8 V TA = 125 °C
—
—
200
nA
Pins PA00, PA03, PB00, PC03,
PC04 and PD00; MODEx = DISABLED, IOVDD = 3.8 V TA = 125
°C
—
—
550
nA
Any GPIO pin
—
—
0.3*IOVDD
V
RESETn
—
—
0.3*DVDD
V
Any GPIO pin
0.7*IOVDD
—
—
V
RESETn
0.7*DVDD
—
—
V
Any GPIO pin
0.05*IOVD
D
—
—
V
RESETn
0.05*DVDD
—
—
V
Sourcing 20mA, IOVDD = 3.0 V
0.8 *
IOVDD
—
—
V
Sourcing 8mA, IOVDD = 1.71 V
0.6 *
IOVDD
—
—
V
Sinking 20mA, IOVDD = 3.0 V
—
—
0.2 *
IOVDD
V
Sinking 8mA, IOVDD = 1.71 V
—
—
0.4 *
IOVDD
V
IOVDD = 3.0 V, Cload = 50pF,
SLEWRATE = 4, 10% to 90%
—
8.4
—
ns
IOVDD = 1.71 V, Cload = 50pF,
SLEWRATE = 4, 10% to 90%
—
13
—
ns
IOVDD = 3.0 V, Cload = 50pF,
SLEWRATE = 4, 90% to 10%
—
7.1
—
ns
IOVDD = 1.71 V, Cload = 50pF,
SLEWRATE = 4, 90% to 10%
—
11.9
—
ns
Any GPIO pin. Pull-up to IOVDD:
MODEn = DISABLE DOUT=1.
Pull-down to VSS: MODEn =
WIREDORPULLDOWN DOUT =
0.
35
44
55
kΩ
RESETn pin. Pull-up to DVDD
35
44
55
kΩ
MODE = INPUT, DOUT = 1
—
27
—
ns
Rev. 1.1 | 35
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
Parameter
Symbol
RESETn low time to ensure
pin reset
TRESET
Test Condition
Min
Typ
Max
Unit
100
—
—
ns
Note:
1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to DVDD.
2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to DVDD.
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.11 Analog to Digital Converter (IADC)
Specified at 1 Msps, ADCCLK = 10 MHz, OSR=2, unless otherwise indicated.
Table 4.17. Analog to Digital Converter (IADC)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Main analog supply
VAVDD
Normal Mode
1.71
—
3.8
V
Maximum Input Range1
VIN_MAX
Maximum allowable input voltage
0
—
AVDD
V
Full-Scale Voltage
VFS
Voltage required for Full-Scale
measurement
—
VREF / Gain
—
Input Measurement Range
VIN
Differential Mode - Plus and Minus inputs
-VFS
—
+VFS
V
Single Ended Mode - One input
tied to ground
0
—
VFS
V
Analog Gain = 1x
—
1.8
—
pF
Analog Gain = 2x
—
3.6
—
pF
Analog Gain = 4x
—
7.2
—
pF
Analog Gain = 0.5x
—
0.9
—
pF
Input Sampling Capacitance
Cs
ADC clock frequency
fCLK
Normal Mode
—
—
10
MHz
Throughput rate
fSAMPLE
fCLK = 10 MHz, OSR = 2
—
—
1
Msps
fCLK = 10 MHz, OSR = 32
—
—
76.9
ksps
Normal Mode, 1 Msps, OSR = 2,
fCLK = 10 MHz
—
290
385
µA
Current in Standby mode.
ISTBY
ADC is not functional but can
wake up in 1us.
Normal Mode
—
16
—
µA
ADC Startup Time
From power down state
—
5
—
µs
From Standby state
—
1
—
µs
—
12
—
bits
Current from all supplies,
Continuous operation
IADC_CONT
tstartup
ADC Resolution2
Resolution
Differential Nonlinearity
DNL
Differential Input, OSR = 2, (No
missing codes) .
-1
+/- 0.25
1.5
LSB12
Integral Nonlinearity
INL
Normal Mode, Differential Input,
OSR = 2.
-2.5
+/- 0.65
2.5
LSB12
Effective number of bits3
ENOB
Differential Input. Gain = 1x, OSR
= 2, fIN = 10 kHz, Internal
VREF=1.21V. OSR=2
10.5
11.7
—
bits
Differential Input. Gain = 1x, OSR
= 32, fIN = 2.5 kHz, Internal VREF
= 1.21 V.
—
13.5
—
bits
Differential Input. Gain = 1x, OSR
= 32, fIN = 2.5 kHz, External
VREF = 1.25 V.
—
14.3
—
bits
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Signal to Noise + Distortion
Ratio3
SNDR
Differential Input. Gain=1x, OSR =
2, fIN = 10 kHz, Internal
VREF=1.21V
65
72.3
—
dB
Differential Input. Gain=2x, OSR =
2, fIN = 10 kHz, Internal
VREF=1.21V
—
72.3
—
dB
Differential Input. Gain=4x, OSR =
2, fIN = 10 kHz, Internal
VREF=1.21V
—
68.8
—
dB
Differential Input. Gain=0.5x, OSR
= 2, fIN = 10 kHz, Internal
VREF=1.21V
—
72.5
—
dB
Total Harmonic Distortion
THD
Differential Input. Gain=1x, OSR =
2, fIN = 10 kHz, Internal
VREF=1.21V
—
-80.8
-70
dB
Spurious-Free Dynamic
Range
SFDR
Differential Input. Gain=1x, OSR =
2, fIN = 10 kHz, Internal
VREF=1.21V
72
86.5
—
dB
Common Mode Rejection
Ratio
CMRR
Normal Mode. DC to 100 Hz
—
87.0
—
dB
Normal Mode. AC high frequency
—
68.6
—
dB
Power Supply Rejection Ratio
PSRR
Normal mode. DC to 100 Hz
—
80.4
—
dB
Normal mode. AC high frequency,
using VREF pad.
—
33.4
—
dB
Normal mode. AC high frequency,
using internal VBGR.
—
65.2
—
dB
GAIN=1 and 0.5, using external
VREF, direct mode.
-0.3
0.069
0.3
%
GAIN=2, using external VREF, direct mode.
-0.4
0.151
0.4
%
GAIN=3, using external VREF, direct mode.
-0.7
0.186
0.7
%
GAIN=4, using external VREF, direct mode.
-1.1
0.227
1.1
%
Internal VREF4, all GAIN settings
-1.5
0.023
1.5
%
GAIN=1 and 0.5, Differential Input
-3
0.27
3
LSB
GAIN=2, Differential Input
-4
0.27
4
LSB
GAIN=3, Differential Input
-4
0.25
4
LSB
GAIN=4, Differential Input
-4
0.29
4
LSB
Gain Error
Offset
GE
OFFSET
External reference voltage
range1
VEVREF
1.0
—
AVDD
V
Internal Reference voltage
VIVREF
—
1.21
—
V
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Note:
1. When inputs are routed to external GPIO pins, the maximum pin voltage is limited to the lower of the IOVDD and AVDD supplies.
2. ADC output resolution depends on the OSR and digital averaging settings. With no digital averaging, ADC output resolution is 12
bits at OSR=2, 13 bits at OSR = 4, 14 bits at OSR = 8, 15 bits at OSR = 16, 16 bits at OSR = 32 and 17 bits at OSR = 64. Digital
averaging has a similar impact on ADC output resolution. See the product reference manual for additional details.
3. The relationship between ENOB and SNDR is specified according to the equation: ENOB = (SNDR - 1.76) / 6.02.
4. Includes error from internal VREF drift.
4.12 Temperature Sense
Table 4.18. Temperature Sense
Parameter
Symbol
Temperature sensor range1
Test Condition
Min
Typ
Max
Unit
TRANGE
-40
—
125
°C
Temperature sensor resolution
TRESOLUTION
—
0.25
—
°C
Measurement noise (RMS)
TNOISE
Single measurement
—
0.6
—
°C
16-sample average (TEMPAVGNUM = 0)
—
0.17
—
°C
64-sample average (TEMPAVGNUM = 1)
—
0.12
—
°C
Temperature offset
TOFF
Mean error of uncorrected output
across full temperature range
—
3.14
—
°C
Temperature sensor accuracy2 3
TACC
Direct output accuracy after mean
error (TOFF) removed
-3
—
3
°C
After linearization in software, no
calibration
-2
—
2
°C
-1.5
—
1.5
°C
—
250
—
ms
After linearization in software, with
single-temperature calibration at
25 °C4
Measurement interval
tMEAS
Note:
1. The sensor reports absolute die temperature in °K. All specifications are in °C to match the units of the specified product temperaure range.
2. Error is measured as the deviation of the mean temperature reading from the expected die temperature. Accuracy numbers represent statistical minimum and maximum using ± 4 standard deviations of measured error.
3. The raw output of the temperature sensor is a predictable curve. It can be linearized with a polynomial function for additional accuracy.
4. Assuming calibration accuracy of ± 0.25 °C.
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.13 Brown Out Detectors
4.13.1 DVDD BOD
BOD Thresholds on DVDD in EM0 and EM1 only, unless otherwise noted. Typical conditions are at TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation, operating supply voltage range, and operating temperature range.
Table 4.19. DVDD BOD
Parameter
Symbol
Test Condition
BOD threshold
VDVDD_BOD
BOD response time
tDVDD_BOD_DELAY
BOD hysteresis
Min
Typ
Max
Unit
Supply Rising
—
1.64
1.71
V
Supply Falling
1.62
1.65
—
V
—
0.95
—
µs
—
20
—
mV
Supply dropping at 100mV/µs
slew rate1
VDVDD_BOD_HYS
T
Note:
1. If the supply slew rate exceeds the specified slew rate, the BOD may trip later than expected (at a threshold below the minimum
specified threshold), or the BOD may not trip at all (e.g., if the supply ramps down and then back up at a very fast rate)
4.13.2 LE DVDD BOD
BOD thresholds on DVDD pin for low energy modes EM2 to EM4, unless otherwise noted.
Table 4.20. LE DVDD BOD
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
BOD threshold
VDVDD_LE_BOD
Supply Falling
1.5
—
1.71
V
tDVDD_LE_BOD_D
Supply dropping at 2mV/µs slew
rate1
—
50
—
µs
—
20
—
mV
BOD response time
ELAY
BOD hysteresis
VDVDD_LE_BOD_
HYST
Note:
1. If the supply slew rate exceeds the specified slew rate, the BOD may trip later than expected (at a threshold below the minimum
specified threshold), or the BOD may not trip at all (e.g., if the supply ramps down and then back up at a very fast rate)
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.13.3 AVDD and IOVDD BODs
BOD thresholds for AVDD BOD and IOVDD BOD. Available in all energy modes.
Table 4.21. AVDD and IOVDD BODs
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
BOD threshold
VBOD
Supply falling
1.45
—
1.71
V
BOD response time
tBOD_DELAY
Supply dropping at 2mV/µs slew
rate1
—
50
—
µs
BOD hysteresis
VBOD_HYST
—
20
—
mV
Note:
1. If the supply slew rate exceeds the specified slew rate, the BOD may trip later than expected (at a threshold below the minimum
specified threshold), or the BOD may not trip at all (e.g., if the supply ramps down and then back up at a very fast rate)
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Rev. 1.1 | 41
EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.14 PDM Timing Specifications
PDM Microphone Mode
PDM_CLK
tISU
PDM_DAT0-3
L
tIH
tISU
R
tIH
L
R
L
PDM Sensor Mode
PDM_CLK
tISU
tIH
PDM_DAT0-3
Figure 4.3. PDM Timing Diagrams
4.14.1 Pulse Density Modulator (PDM), Common DBUS
Timing specifications are for all PDM signals routed to the same DBUS (DBUSAB or DBUSCD), though routing to the same GPIO port
is the optimal configuration. CLOAD < 20 pF. System voltage scaling = VSCALE1 or VSCALE2. All GPIO set to slew rate = 6. Data delay
(PDM_CFG1_DLYMUXSEL) = 0.
Table 4.22. Pulse Density Modulator (PDM), Common DBUS
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
PDM_CLK frequency during
data transfer
FPDM_CLK
Microphone mode
—
—
5
MHz
Sensor mode
—
—
20
MHz
PDM_CLK duty cycle
DCPDM_CLK
47.5
—
52.5
%
PDM_CLK rise time
tR
—
—
5.5
ns
PDM_CLK fall time
tF
—
—
5.5
ns
Input setup time
tISU
Microphone mode
30
—
—
ns
Sensor mode
20
—
—
ns
3
—
—
ns
Input hold time
tIH
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.15 USART SPI Main Timing
CS
tCS_MO
tSCLK_MO
SCLK
CLKPOL = 0
tSCLK
SCLK
CLKPOL = 1
MOSI
tSU_MI
tH_MI
MISO
Figure 4.4. SPI Main Timing (SMSDELAY = 0)
CS
tCS_MO
tSCLK_MO
SCLK
CLKPOL = 0
SCLK
tSCLK
CLKPOL = 1
MOSI
tSU_MI
tH_MI
MISO
Figure 4.5. SPI Main Timing (SMSDELAY = 1)
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.15.1 SPI Main Timing, Voltage Scaling = VSCALE2
Timing specifications are for all SPI signals routed to the same DBUS (DBUSAB or DBUSCD). All GPIO set to slew rate = 6.
Table 4.23. SPI Main Timing, Voltage Scaling = VSCALE2
Parameter
Symbol
SCLK period 1 2 3
tSCLK
CS to MOSI 1 2
tCS_MO
SCLK to MOSI 1 2
tSCLK_MO
MISO setup time 1 2
tSU_MI
MISO hold time 1 2
Test Condition
Min
Typ
Max
Unit
2*tPCLK
—
—
ns
-22
—
22.5
ns
-14.5
—
14.5
ns
IOVDD = 1.62 V
38.5
—
—
ns
IOVDD = 3.0 V
28.5
—
—
ns
-8.5
—
—
ns
tH_MI
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1
2. Measurement done with 8 pF output loading at 10% and 90% of VDD.
3. tPCLK is one period of the selected PCLK.
4.15.2 SPI Main Timing, Voltage Scaling = VSCALE1
Timing specifications are for all SPI signals routed to the same DBUS (DBUSAB or DBUSCD). All GPIO set to slew rate = 6.
Table 4.24. SPI Main Timing, Voltage Scaling = VSCALE1
Parameter
Symbol
SCLK period 1 2 3
tSCLK
CS to MOSI 1 2
Min
Typ
Max
Unit
2*tPCLK
—
—
ns
tCS_MO
-33
—
34.5
ns
SCLK to MOSI 1 2
tSCLK_MO
-15
—
26
ns
MISO setup time 1 2
tSU_MI
IOVDD = 1.62 V
47
—
—
ns
IOVDD = 3.0 V
39
—
—
ns
-9.5
—
—
ns
MISO hold time 1 2
Test Condition
tH_MI
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1
2. Measurement done with 8 pF output loading at 10% and 90% of VDD.
3. tPCLK is one period of the selected PCLK.
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.16 USART SPI Secondary Timing
tCS_ACT_MI
CS
tCS_DIS_MI
SCLK
CLKPOL = 0
tSCLK_HI
SCLK
tSU_MO
CLKPOL = 1
tSCLK_LO
tSCLK
tH_MO
MOSI
tSCLK_MI
MISO
Figure 4.6. SPI Secondary Timing
4.16.1 SPI Secondary Timing, Voltage Scaling = VSCALE2
Timing specifications are for all SPI signals routed to the same DBUS (DBUSAB or DBUSCD). All GPIO set to slew rate = 6.
Table 4.25. SPI Secondary Timing, Voltage Scaling = VSCALE2
Parameter
Symbol
SCLK period 1 2 3
tSCLK
SCLK high time1 2 3
Test Condition
Min
Typ
Max
Unit
6*tPCLK
—
—
ns
tSCLK_HI
2.5*tPCLK
—
—
ns
SCLK low time1 2 3
tSCLK_LO
2.5*tPCLK
—
—
ns
CS active to MISO 1 2
tCS_ACT_MI
25
—
47.5
ns
CS disable to MISO 1 2
tCS_DIS_MI
19.5
—
38.5
ns
MOSI setup time 1 2
tSU_MO
4.5
—
—
ns
MOSI hold time 1 2 3
tH_MO
5
—
—
ns
SCLK to MISO 1 2 3
tSCLK_MI
22 +
1.5*tPCLK
—
33.5 +
2.5*tPCLK
ns
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD).
3. tPCLK is one period of the selected PCLK.
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.16.2 SPI Secondary Timing, Voltage Scaling = VSCALE1
Timing specifications are for all SPI signals routed to the same DBUS (DBUSAB or DBUSCD). All GPIO set to slew rate = 6.
Table 4.26. SPI Secondary Timing, Voltage Scaling = VSCALE1
Parameter
Symbol
SCLK period 1 2 3
tSCLK
SCLK high time1 2 3
Test Condition
Min
Typ
Max
Unit
6*tPCLK
—
—
ns
tSCLK_HI
2.5*tPCLK
—
—
ns
SCLK low time1 2 3
tSCLK_LO
2.5*tPCLK
—
—
ns
CS active to MISO 1 2
tCS_ACT_MI
30.5
—
57.5
ns
CS disable to MISO 1 2
tCS_DIS_MI
25
—
55
ns
MOSI setup time 1 2
tSU_MO
7.5
—
—
ns
MOSI hold time 1 2 3
tH_MO
8.5
—
—
ns
SCLK to MISO 1 2 3
tSCLK_MI
24.5 +
1.5*tPCLK
—
45.5 +
2.5*tPCLK
ns
Note:
1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).
2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD).
3. tPCLK is one period of the selected PCLK.
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.17 I2C Electrical Specifications
4.17.1 I2C Standard-mode (Sm)
CLHR set to 0 in the I2Cn_CTRL register.
Table 4.27. I2C Standard-mode (Sm)
Parameter
Symbol
SCL clock frequency1
Test Condition
Min
Typ
Max
Unit
fSCL
0
—
100
kHz
SCL clock low time
tLOW
4.7
—
—
µs
SCL clock high time
tHIGH
4
—
—
µs
SDA set-up time
tSU_DAT
250
—
—
ns
SDA hold time
tHD_DAT
0
—
—
ns
Repeated START condition
set-up time
tSU_STA
4.7
—
—
µs
Repeated START condition
hold time
tHD_STA
4.0
—
—
µs
STOP condition set-up time
tSU_STO
4.0
—
—
µs
Bus free time between a
STOP and START condition
tBUF
4.7
—
—
µs
Note:
1. The maximum SCL clock frequency listed is assuming that an arbitrary clock frequency is available. The maximum attainable
SCL clock frequency may be slightly less using the HFXO or HFRCO due to the limited frequencies available. The CLKDIV
should be set to a value that keeps the SCL clock frequency below the max value listed.
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.17.2 I2C Fast-mode (Fm)
CLHR set to 1 in the I2Cn_CTRL register.
Table 4.28. I2C Fast-mode (Fm)
Parameter
Symbol
SCL clock frequency1
Test Condition
Min
Typ
Max
Unit
fSCL
0
—
400
kHz
SCL clock low time
tLOW
1.3
—
—
µs
SCL clock high time
tHIGH
0.6
—
—
µs
SDA set-up time
tSU_DAT
100
—
—
ns
SDA hold time
tHD_DAT
0
—
—
ns
Repeated START condition
set-up time
tSU_STA
0.6
—
—
µs
Repeated START condition
hold time
tHD_STA
0.6
—
—
µs
STOP condition set-up time
tSU_STO
0.6
—
—
µs
Bus free time between a
STOP and START condition
tBUF
1.3
—
—
µs
Note:
1. The maximum SCL clock frequency listed is assuming that an arbitrary clock frequency is available. The maximum attainable
SCL clock frequency may be slightly less using the HFXO or HFRCO due to the limited frequencies available. The CLKDIV
should be set to a value that keeps the SCL clock frequency below the max value listed.
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.17.3 I2C Fast-mode Plus (Fm+)
CLHR set to 1 in the I2Cn_CTRL register.
Table 4.29. I2C Fast-mode Plus (Fm+)
Parameter
Symbol
SCL clock frequency1
Test Condition
Min
Typ
Max
Unit
fSCL
0
—
1000
kHz
SCL clock low time
tLOW
0.5
—
—
µs
SCL clock high time
tHIGH
0.26
—
—
µs
SDA set-up time
tSU_DAT
50
—
—
ns
SDA hold time
tHD_DAT
0
—
—
ns
Repeated START condition
set-up time
tSU_STA
0.26
—
—
µs
Repeated START condition
hold time
tHD_STA
0.26
—
—
µs
STOP condition set-up time
tSU_STO
0.26
—
—
µs
Bus free time between a
STOP and START condition
tBUF
0.5
—
—
µs
Note:
1. The maximum SCL clock frequency listed is assuming that an arbitrary clock frequency is available. The maximum attainable
SCL clock frequency may be slightly less using the HFXO or HFRCO due to the limited frequencies available. The CLKDIV
should be set to a value that keeps the SCL clock frequency below the max value listed.
4.18 Typical Performance Curves
Typical performance curves indicate typical characterized performance under the stated conditions.
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.18.1 Supply Current
Figure 4.7. EM0 and EM1 Typical Supply Current vs. Temperature
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
Figure 4.8. EM2 and EM4 Typical Supply Current vs. Temperature
4.18.2 DC-DC Converter
Performance characterized with Samsung CIG22H2R2MNE (LDCDC = 2.2 uH ) and Samsung CL10B475KQ8NQNC (CDCDC = 4.7 uF)
Figure 4.9. DC-DC Efficiency
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EFM32PG22 Gecko MCU Family Data Sheet
Electrical Specifications
4.18.3 IADC
Typical performance is shown using 10 MHz ADC clock for fastest sampling speed and adjusting oversampling ratio (OSR).
Figure 4.10. Typical ENOB vs. Oversampling Ratio
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EFM32PG22 Gecko MCU Family Data Sheet
Typical Connections
5. Typical Connections
5.1 Power
Typical power supply connections are shown in the following figures.
Note: AVDD and IOVDD supply connections are flexible. They may be connected in other configurations or to external supplies as long
as the supply limits described in 4.1 Electrical Characteristics are met.
VDD
Main
Supply
+
–
VREGVDD
AVDD
VREGSW
IOVDD
HFXTAL_I
VREGVSS
HFXTAL_O
DVDD (x3)
LFXTAL_I
LFXTAL_O
38.4 MHz
(optional)
32.768 kHz
(optional)
DECOUPLE
CDECOUPLE
Figure 5.1. EFM32PG22 Typical Application Circuit: Direct Supply Configuration without DCDC
VDD
Main
Supply
+
–
CIN
VREGVDD
AVDD
IOVDD
LDCDC
VDCDC
VREGSW
CDCDC
VREGVSS
DVDD (x3)
HFXTAL_I
HFXTAL_O
LFXTAL_I
LFXTAL_O
38.4 MHz
(optional)
32.768 kHz
(optional)
DECOUPLE
CDECOUPLE
Figure 5.2. EFM32PG22 Typical Application Circuit: DCDC Configuration, AVDD and IOVDD from main supply
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EFM32PG22 Gecko MCU Family Data Sheet
Typical Connections
VDD
Main
Supply
VDCDC
+
–
CIN
VREGVDD
AVDD
IOVDD
LDCDC
VDCDC
VREGSW
CDCDC
VREGVSS
DVDD (x3)
HFXTAL_I
HFXTAL_O
LFXTAL_I
LFXTAL_O
38.4 MHz
(optional)
32.768 kHz
(optional)
DECOUPLE
CDECOUPLE
Figure 5.3. EFM32PG22 Typical Application Circuit: DCDC Configuration, AVDD and IOVDD from DCDC output
5.2 Other Connections
Other components or connections may be required to meet the system-level requirements. Application Note AN0002.2 contains detailed information on these connections. Application Notes can be accessed on the Silicon Labs website (www.silabs.com/32bit-appnotes).
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EFM32PG22 Gecko MCU Family Data Sheet
Pin Definitions
6. Pin Definitions
6.1 QFN32 Device Pinout
Figure 6.1. QFN32 Device Pinout
The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.3 Alternate Function Table, 6.4 Analog Peripheral Connectivity, and 6.5 Digital Peripheral
Connectivity.
Table 6.1. QFN32 Device Pinout
Pin Name
Pin(s)
Description
Pin Name
Pin(s)
Description
PC00
1
GPIO
PC01
2
GPIO
PC02
3
GPIO
PC03
4
GPIO
PC04
5
GPIO
PC05
6
GPIO
HFXTAL_I
7
High Frequency Crystal Input
HFXTAL_O
8
High Frequency Crystal Output
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EFM32PG22 Gecko MCU Family Data Sheet
Pin Definitions
Pin Name
Pin(s)
Description
RESETn
9
Reset Pin. The RESETn pin is internally
pulled up to DVDD.
VSS
11
Ground
DVDD
13
PB01
Pin Name
Pin(s)
Description
DVDD
10
Digital power supply
NC
12
No-Connect
Digital power supply
PB02
14
GPIO
15
GPIO
PB00
16
GPIO
PA00
17
GPIO
PA01
18
GPIO
PA02
19
GPIO
PA03
20
GPIO
PA04
21
GPIO
PA05
22
GPIO
PA06
23
GPIO
DECOUPLE
24
Decouple outputput for on-chip voltage
regulator. An external decoupling capacitor is required at this pin.
VREGSW
25
DCDC regulator switching node
VREGVDD
26
DCDC regulator input supply
VREGVSS
27
DCDC ground
DVDD
28
Digital power supply
AVDD
29
Analog power supply
IOVDD
30
I/O power supply
PD01
31
GPIO
PD00
32
GPIO
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EFM32PG22 Gecko MCU Family Data Sheet
Pin Definitions
6.2 QFN40 Device Pinout
Figure 6.2. QFN40 Device Pinout
The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.3 Alternate Function Table, 6.4 Analog Peripheral Connectivity, and 6.5 Digital Peripheral
Connectivity.
Table 6.2. QFN40 Device Pinout
Pin Name
Pin(s)
Description
Pin Name
Pin(s)
Description
PC00
1
GPIO
PC01
2
GPIO
PC02
3
GPIO
PC03
4
GPIO
PC04
5
GPIO
PC05
6
GPIO
PC06
7
GPIO
PC07
8
GPIO
HFXTAL_I
9
High Frequency Crystal Input
HFXTAL_O
10
High Frequency Crystal Output
RESETn
11
Reset Pin. The RESETn pin is internally
pulled up to DVDD.
DVDD
12
Digital power supply
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EFM32PG22 Gecko MCU Family Data Sheet
Pin Definitions
Pin Name
Pin(s)
Description
Pin Name
Pin(s)
Description
NC
14
No-Connect
VSS
13
Ground
DVDD
15
Digital power supply
PB04
16
GPIO
PB03
17
GPIO
PB02
18
GPIO
PB01
19
GPIO
PB00
20
GPIO
PA00
21
GPIO
PA01
22
GPIO
PA02
23
GPIO
PA03
24
GPIO
PA04
25
GPIO
PA05
26
GPIO
PA06
27
GPIO
PA07
28
GPIO
PA08
29
GPIO
DECOUPLE
30
Decouple outputput for on-chip voltage
regulator. An external decoupling capacitor is required at this pin.
VREGSW
31
DCDC regulator switching node
VREGVDD
32
DCDC regulator input supply
VREGVSS
33
DCDC ground
DVDD
34
Digital power supply
AVDD
35
Analog power supply
IOVDD
36
I/O power supply
PD03
37
GPIO
PD02
38
GPIO
PD01
39
GPIO
PD00
40
GPIO
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EFM32PG22 Gecko MCU Family Data Sheet
Pin Definitions
6.3 Alternate Function Table
A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows what functions are
available on each device pin.
Table 6.3. GPIO Alternate Function Table
GPIO
Alternate Functions
PC00
GPIO.EM4WU6
PC05
GPIO.EM4WU7
PC07
GPIO.EM4WU8
PB03
GPIO.EM4WU4
PB01
GPIO.EM4WU3
PB00
IADC0.VREFN
PA00
IADC0.VREFP
PA01
GPIO.SWCLK
PA02
GPIO.SWDIO
GPIO.SWV
PA03
GPIO.TDO
GPIO.TRACEDATA0
PA04
GPIO.TDI
GPIO.TRACECLK
PA05
GPIO.EM4WU0
PD02
GPIO.EM4WU9
LFXO.LFXTAL_I
PD01
LFXO.LF_EXTCLK
PD00
LFXO.LFXTAL_O
6.4 Analog Peripheral Connectivity
Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative
inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the
device Reference Manual for more details on the ABUS and analog peripherals.
Table 6.4. ABUS Routing Table
Peripheral
IADC0
Signal
PA
PB
PC
PD
EVEN
ODD
EVEN
ODD
EVEN
ODD
EVEN
ODD
ANA_NEG
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
ANA_POS
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
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EFM32PG22 Gecko MCU Family Data Sheet
Pin Definitions
6.5 Digital Peripheral Connectivity
Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port.
Table 6.5. DBUS Routing Table
Peripheral.Resource
PORT
PA
PB
PC
PD
CMU.CLKIN0
Available
Available
CMU.CLKOUT0
Available
Available
CMU.CLKOUT1
Available
Available
CMU.CLKOUT2
Available
Available
EUART0.CTS
Available
Available
Available
Available
EUART0.RTS
Available
Available
Available
Available
EUART0.RX
Available
Available
Available
Available
EUART0.TX
Available
Available
Available
Available
I2C0.SCL
Available
Available
Available
Available
I2C0.SDA
Available
Available
Available
Available
I2C1.SCL
Available
Available
I2C1.SDA
Available
Available
LETIMER0.OUT0
Available
Available
LETIMER0.OUT1
Available
Available
PDM.CLK
Available
Available
Available
Available
PDM.DAT0
Available
Available
Available
Available
PDM.DAT1
Available
Available
Available
Available
PRS.ASYNCH0
Available
Available
PRS.ASYNCH1
Available
Available
PRS.ASYNCH2
Available
Available
PRS.ASYNCH3
Available
Available
PRS.ASYNCH4
Available
Available
PRS.ASYNCH5
Available
Available
PRS.ASYNCH6
Available
Available
PRS.ASYNCH7
Available
Available
PRS.ASYNCH8
Available
Available
PRS.ASYNCH9
Available
Available
PRS.ASYNCH10
Available
Available
PRS.ASYNCH11
Available
Available
PRS.SYNCH0
Available
Available
Available
Available
PRS.SYNCH1
Available
Available
Available
Available
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EFM32PG22 Gecko MCU Family Data Sheet
Pin Definitions
Peripheral.Resource
PORT
PA
PB
PC
PD
PRS.SYNCH2
Available
Available
Available
Available
PRS.SYNCH3
Available
Available
Available
Available
TIMER0.CC0
Available
Available
Available
Available
TIMER0.CC1
Available
Available
Available
Available
TIMER0.CC2
Available
Available
Available
Available
TIMER0.CDTI0
Available
Available
Available
Available
TIMER0.CDTI1
Available
Available
Available
Available
TIMER0.CDTI2
Available
Available
Available
Available
TIMER1.CC0
Available
Available
Available
Available
TIMER1.CC1
Available
Available
Available
Available
TIMER1.CC2
Available
Available
Available
Available
TIMER1.CDTI0
Available
Available
Available
Available
TIMER1.CDTI1
Available
Available
Available
Available
TIMER1.CDTI2
Available
Available
Available
Available
TIMER2.CC0
Available
Available
TIMER2.CC1
Available
Available
TIMER2.CC2
Available
Available
TIMER2.CDTI0
Available
Available
TIMER2.CDTI1
Available
Available
TIMER2.CDTI2
Available
Available
TIMER3.CC0
Available
Available
TIMER3.CC1
Available
Available
TIMER3.CC2
Available
Available
TIMER3.CDTI0
Available
Available
TIMER3.CDTI1
Available
Available
TIMER3.CDTI2
Available
Available
TIMER4.CC0
Available
Available
TIMER4.CC1
Available
Available
TIMER4.CC2
Available
Available
TIMER4.CDTI0
Available
Available
TIMER4.CDTI1
Available
Available
TIMER4.CDTI2
Available
Available
USART0.CLK
Available
Available
Available
Available
USART0.CS
Available
Available
Available
Available
USART0.CTS
Available
Available
Available
Available
USART0.RTS
Available
Available
Available
Available
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EFM32PG22 Gecko MCU Family Data Sheet
Pin Definitions
Peripheral.Resource
PORT
PA
PB
PC
PD
USART0.RX
Available
Available
Available
Available
USART0.TX
Available
Available
Available
Available
USART1.CLK
Available
Available
USART1.CS
Available
Available
USART1.CTS
Available
Available
USART1.RTS
Available
Available
USART1.RX
Available
Available
USART1.TX
Available
Available
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EFM32PG22 Gecko MCU Family Data Sheet
QFN32 Package Specifications
7. QFN32 Package Specifications
7.1 QFN32 Package Dimensions
Figure 7.1. QFN32 Package Drawing
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EFM32PG22 Gecko MCU Family Data Sheet
QFN32 Package Specifications
Table 7.1. QFN32 Package Dimensions
Dimension
Min
Typ
Max
A
0.80
0.85
0.90
A1
0.00
0.02
0.05
A3
0.20 REF
b
0.15
0.20
0.25
D
3.90
4.00
4.10
E
3.90
4.00
4.10
D2
2.60
2.70
2.80
E2
2.60
2.70
2.80
e
0.40 BSC
L
0.20
0.30
0.40
K
0.20
—
—
R
0.075
—
0.125
aaa
0.10
bbb
0.07
ccc
0.10
ddd
0.05
eee
0.08
fff
0.10
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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EFM32PG22 Gecko MCU Family Data Sheet
QFN32 Package Specifications
7.2 QFN32 PCB Land Pattern
Figure 7.2. QFN32 PCB Land Pattern Drawing
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EFM32PG22 Gecko MCU Family Data Sheet
QFN32 Package Specifications
Table 7.2. QFN32 PCB Land Pattern Dimensions
Dimension
Typ
L
0.76
W
0.22
e
0.40
S
3.21
S1
3.21
L1
2.80
W1
2.80
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
5. The stencil thickness should be 0.101 mm (4 mils).
6. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads.
7. A 2x2 array of 1.10 mm x 1.10 mm openings on a 1.30 mm pitch can be used for the center ground pad.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
10. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use
different parameters and fine tune their SMT process as required for their application and tooling.
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EFM32PG22 Gecko MCU Family Data Sheet
QFN32 Package Specifications
7.3 QFN32 Package Marking
EFM32
PPPPPPPP
TTTTTT
YYWW #
Figure 7.3. QFN32 Package Marking
The package marking consists of:
• PPPPPPPP – The part number designation.
• TTTTTT – A trace or manufacturing code. The first letter is the device revision.
• YY – The last 2 digits of the assembly year.
• WW – The 2-digit workweek when the device was assembled.
• # - The device revision.
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EFM32PG22 Gecko MCU Family Data Sheet
QFN40 Package Specifications
8. QFN40 Package Specifications
8.1 QFN40 Package Dimensions
Figure 8.1. QFN40 Package Drawing
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EFM32PG22 Gecko MCU Family Data Sheet
QFN40 Package Specifications
Table 8.1. QFN40 Package Dimensions
Dimension
Min
Typ
Max
A
0.80
0.85
0.90
A1
0.00
0.02
0.05
A3
0.20 REF
b
0.15
0.20
0.25
D
4.90
5.00
5.10
E
4.90
5.00
5.10
D2
3.55
3.70
3.85
E2
3.55
3.70
3.85
e
0.40 BSC
L
0.30
0.40
0.50
K
0.20
—
—
R
0.075
—
—
aaa
0.10
bbb
0.07
ccc
0.10
ddd
0.05
eee
0.08
fff
0.10
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
5. Package external pad (epad) may have pin one chamfer.
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EFM32PG22 Gecko MCU Family Data Sheet
QFN40 Package Specifications
8.2 QFN40 PCB Land Pattern
Figure 8.2. QFN40 PCB Land Pattern Drawing
Table 8.2. QFN40 PCB Land Pattern Dimensions
Dimension
Typ
S1
4.25
S
4.25
L1
3.85
W1
3.85
e
0.40
W
0.22
L
0.74
R
0.11
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EFM32PG22 Gecko MCU Family Data Sheet
QFN40 Package Specifications
Dimension
Typ
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
4. The stencil thickness should be 0.101 mm (4 mils).
5. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads.
6. A 3x3 array of 0.90 mm square openings on a 1.20 mm pitch can be used for the center ground pad.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
9. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use
different parameters and fine tune their SMT process as required for their application and tooling.
8.3 QFN40 Package Marking
Figure 8.3. QFN40 Package Marking
The package marking consists of:
• Line 1: PPPPPP – The product family codes (TBD)
• Line 2: PPPPPP – The product option codes (TBD)
• TTTTTT – A trace or manufacturing code. The first letter is the device revision.
• YY – The last 2 digits of the assembly year.
• WW – The 2-digit workweek when the device was assembled.
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EFM32PG22 Gecko MCU Family Data Sheet
Revision History
9. Revision History
Revision 1.1
June 2021
•
•
•
•
•
•
•
•
•
Updated lowest energy mode for I2C0, IADC0 and EUART0 to EM3 in 3.12 Configuration Summary.
Added footnote for crystal load capacitance with Gain=2 test condition in 4.9.2 Low Frequency Crystal Oscillator.
Added timing specification for RESETn low time in 4.10 GPIO Pins (3V GPIO pins).
Added IADC 16 bit typical resolution and updated footnote in 4.11 Analog to Digital Converter (IADC).
Corrected clock reference to PCLK in 4.15 USART SPI Main Timing and 4.16 USART SPI Secondary Timing.
Corrected by removal IADC0.VREFN pinout from 6.3 Alternate Function Table; IADC0.VREFN connected internally to ground.
Added documentation of chamfered pin 1 and oval land pattern in 8.1 QFN40 Package Dimensions.
Replaced select terms with inclusive lexicon.
Minor formatting and styling updates, including TOC locations and boilerplate information throughout document.
Revision 1.0
March, 2021
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•
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Updated front page and feature list to reflect device offerings.
Table 2.1 Ordering Information on page 3 updated to show all part numbers.
4.1 Electrical Characteristics updated throughout with full temperature range specifictions.
Document updated throughout with additional information on higher-resolution ADC operation.
5.1 Power
• Connection diagrams corrected to remove nonexistent supply pins, show crystals as optional.
• Added text indicating IOVDD and AVDD are able to connect in other configurations.
• Added third diagram with IOVDD and AVDD connected to DCDC output at DVDD.
• 32-pin QFN pinout information added.
• Package marking details updated.
Revision 0.1
April, 2020
Initial release.
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