EFR32MG22C224F512IM40-C

EFR32MG22 Wireless Gecko SoC Family Data Sheet The EFR32MG22 Wireless Gecko multiprotocol family of SoCs is part of the Wireless Gecko portfolio. EFR32MG22 Wireless Gecko SoCs are ideal for enabling energy-friendly multiprotocol networking for IoT devices. KEY FEATURES • 32-bit ARM® Cortex®-M33 core with 76.8 MHz maximum operating frequency • Up to 512 kB of flash and 32 kB of RAM The single-die solution combines a 76.8 MHz MHz ARM Cortex-M33 with a high performance 2.4 GHz radio to provide an industry-leading, energy efficient, wireless SoC for IoT connected applications. • 12-channel Peripheral Reflex System enabling autonomous interaction of MCU peripherals Wireless Gecko applications include: • Integrated PA with up to 6 dBm (2.4 GHz) TX power • • • • • • Secure Boot with Root of Trust and Secure Loader (RTSL) Zigbee Green Power Zigbee End Devices Home Automation Lighting Controls Building Controls Industrial Sensors Core / Memory ARM CortexTM M33 processor with DSP extensions, FPU and TrustZone ETM Debug Interface Clock Management Flash Program Memory LDMA Controller RAM Memory HF Crystal Oscillator HF RC Oscillator Fast Startup RC Oscillator Precision LF RC Oscillator LF Crystal Oscillator Ultra LF RC Oscillator Energy Management Security Voltage Regulator DC-DC Converter Crypto Acceleration Power-On Reset Brown-Out Detector True Random Number Generator 32-bit bus Peripheral Reflex System Radio Subsystem RFSENSE w/ OOK Detect RX/TX Frontend with Integrated PA DEMOD IFADC Serial Interfaces ARM Cortex M0+ Radio Controller Timers and Triggers Analog I/F USART External Interrupts Timer/Counter Protocol Timer ADC BUFC RAM PDM General Purpose I/O Low Energy Timer Watchdog Timer Temperature Sensor FRC EUART Pin Reset Real Time Capture Counter Back-Up Real Time Counter CRC I2C Pin Wakeup AGC Frequency Synthesizer I/O Ports TM MOD Lowest power mode with peripheral operational: EM0—Active EM1—Sleep EM2—Deep Sleep silabs.com | Building a more connected world. This information applies to a product under development. Its characteristics and specifications are subject to change without notice. EM3—Stop EM4—Shutoff Preliminary Rev. 0.5 EFR32MG22 Wireless Gecko SoC Family Data Sheet Feature List 1. Feature List The EFR32MG22 highlighted features are listed below. • Low Power Wireless System-on-Chip • High Performance 32-bit 76.8 MHz MHz ARM Cortex®-M33 with DSP instruction and floating-point unit for efficient signal processing • Up to 512 kB flash program memory • Up to 32 kB RAM data memory • 2.4 GHz radio operation • Radio Performance • -102.3 dBm sensitivity @ 250 kbps O-QPSK DSSS • -106.7 dBm sensitivity @ 125 kbps GFSK • -98.9 dBm sensitivity @ 1 Mbit/s GFSK • -96.2 dBm sensitivity @ 2 Mbit/s GFSK • TX power up to 6 dBm • 2.5 mA radio receive current • 3.4 mA radio transmit current @ 0 dBm output power • 7.5 mA radio transmit current @ 6 dBm output power • Low System Energy Consumption • 3.6 mA RX current (1 Mbps GFSK) • 3.9 mA RX current (250 kbps O-QPSK DSSS) • 4.1 mA TX current @ 0 dBm output power • 8.2 mA TX current @ 6 dBm output power • 26 μA/MHz in Active Mode (EM0) at 38.4 MHz • 1.40 μA EM2 DeepSleep current (32 kB RAM retention and RTC running from LFRCO) • 0.17 μA EM4 current • Supported Modulation Format • 2 (G)FSK with fully configurable shaping • OQPSK DSSS • (G)MSK • Protocol Support • Bluetooth Low Energy (Bluetooth 5.2) • Direction finding using Angle-of-Arrival (AoA) and Angle-ofDeparture (AoD) • Zigbee • Proprietary silabs.com | Building a more connected world. • Wide selection of MCU peripherals • 12-bit 1 Msps SAR Analog to Digital Converter (ADC) • Up to 26 General Purpose I/O pins with output state retention and asynchronous interrupts • 8 Channel DMA Controller • 12 Channel Peripheral Reflex System (PRS) • 4 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels • 1 × 32-bit Timer/Counter with 3 Compare/Capture/PWM channels • 32-bit Real Time Counter • 24-bit Low Energy Timer for waveform generation • 1 × Watchdog Timer • 2 × Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S) • 1 × Enhanced Universal Asynchronous Receiver/Transmitter (EUART) • 2 × I2C interface with SMBus support • Digital microphone interface (PDM) • Precision Low-Frequency RC Oscillator to replace 32 kHz sleep crystal • RFSENSE with selective OOK mode • Die temperature sensor with +/-1.5 degree C accuracy after single-point calibration • Wide Operating Range • 1.71 V to 3.8 V single power supply • -40 °C to 125 °C • Security Features • Secure Boot with Root of Trust and Secure Loader (RTSL) • Hardware Cryptographic Acceleration for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH • True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31 • ARM® TrustZone® • Secure Debug with lock/unlock • Packages • QFN40 5 mm × 5 mm × 0.85 mm • QFN32 4 mm × 4 mm × 0.85 mm • TQFN32 4 mm × 4 mm × 0.30 mm Preliminary Rev. 0.5 | 2 EFR32MG22 Wireless Gecko SoC Family Data Sheet Ordering Information 2. Ordering Information Table 2.1. Ordering Information Ordering Code Protocol Stack Max TX Power Max CPU Speed LFRCO Flash RAM (kB) (kB) GPIO Package Temp Range EFR32MG22C224F512GN32-C • Zigbee • Bluetooth 5.2 • Direction finding • Proprietary 6 dBm 76.8 MHz Precision 512 32 18 TQFN32 -40 to 85 °C EFR32MG22C224F512IM32-C • Zigbee • Bluetooth 5.2 • Direction finding • Proprietary 6 dBm 76.8 MHz Precision 512 32 18 QFN32 -40 to 125 °C EFR32MG22C224F512IM40-C • Zigbee • Bluetooth 5.2 • Direction finding • Proprietary 6 dBm 76.8 MHz Precision 512 32 26 QFN40 -40 to 125 °C LE Long Range (125 kbps and 500 kbps) PHYs are only supported on part numbers which include AoA/AoD direction-finding capability. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 3 Table of Contents 1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 Radio . . . . . . . . . . . . 3.2.1 Antenna Interface . . . . . . 3.2.2 Fractional-N Frequency Synthesizer 3.2.3 Receiver Architecture . . . . . 3.2.4 Transmitter Architecture . . . . 3.2.5 Packet and State Trace . . . . 3.2.6 Data Buffering . . . . . . . . 3.2.7 Radio Controller (RAC). . . . . 3.2.8 RFSENSE Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . . 9 3.4 Clocking . . . . . . . . . . 3.4.1 Clock Management Unit (CMU) . 3.4.2 Internal and External Oscillators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 . 9 . 9 3.5 Counters/Timers and PWM . . . . . . 3.5.1 Timer/Counter (TIMER) . . . . . 3.5.2 Low Energy Timer (LETIMER) . . . 3.5.3 Real Time Clock with Capture (RTCC) 3.5.4 Back-Up Real Time Counter . . . . 3.5.5 Watchdog Timer (WDOG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 . 9 .10 .10 .10 .10 3.6 Communications and Other Digital Peripherals . . . . . . . . . . 3.6.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) . 3.6.2 Enhanced Universal Asynchronous Receiver/Transmitter (EUART) . . 3.6.3 Inter-Integrated Circuit Interface (I2C) . . . . . . . . . . . . 3.6.4 Peripheral Reflex System (PRS) . . . . . . . . . . . . . 3.6.5 Pulse Density Modulation (PDM) Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 .10 .10 .10 .11 .11 3.7 Security Features . . . . . . . . . . . . . . . . 3.7.1 Secure Boot with Root of Trust and Secure Loader (RTSL) 3.7.2 Cryptographic Accelerator. . . . . . . . . . . . 3.7.3 True Random Number Generator . . . . . . . . . 3.7.4 Secure Debug with Lock/Unlock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 .11 .11 .11 .12 3.8 Analog. . . . . . . . . . . . 3.8.1 Analog to Digital Converter (IADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 .12 3.9 Power . . . . . . . . . . . 3.9.1 Energy Management Unit (EMU) 3.9.2 Voltage Scaling . . . . . . 3.9.3 DC-DC Converter . . . . . 3.9.4 Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 .13 .13 .13 .13 3.10 Reset Management Unit (RMU) . . . . . . . . . . . . . . . . . . . . . . .14 silabs.com | Building a more connected world. . . . . . . . . 7 7 8 8 8 8 8 8 9 Preliminary Rev. 0.5 | 4 3.11 Core and Memory . . . . . . . . . . . . 3.11.1 Processor Core . . . . . . . . . . . . 3.11.2 Memory System Controller (MSC) . . . . . 3.11.3 Linked Direct Memory Access Controller (LDMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 .14 .14 .14 3.12 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 3.13 Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . .16 4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .17 4.2 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . .18 4.3 General Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . .19 4.4 DC-DC Converter . . . . . 4.4.1 DC-DC Operating Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 .23 4.5 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .24 4.6 Current Consumption . . . . . . . . . . . . . 4.6.1 MCU current consumption using DC-DC at 3.0 V input 4.6.2 MCU current consumption at 3.0 V . . . . . . . 4.6.3 MCU current consumption at 1.8 V . . . . . . . 4.6.4 Radio current consumption at 3.0V using DCDC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 .25 .27 .29 .31 4.7 Flash Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 4.8 Wake Up, Entry, and Exit times . . . . . . . . . . . . . . . . . . . . . . . .34 4.9 RFSENSE Low-energy Wake-on-RF . . . . . . . . . . . . . . . . . . . . . .35 4.10 2.4 GHz RF Transceiver Characteristics . 4.10.1 RF Transmitter Characteristics . . . 4.10.2 RF Receiver Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 .36 .43 4.11 Oscillators . . . . . . . . . . . . . . . 4.11.1 High Frequency Crystal Oscillator. . . . . . 4.11.2 Low Frequency Crystal Oscillator . . . . . . 4.11.3 High Frequency RC Oscillator (HFRCO) . . . 4.11.4 Fast Start_Up RC Oscillator (FSRCO) . . . . 4.11.5 Precision Low Frequency RC Oscillator (LFRCO) 4.11.6 Ultra Low Frequency RC Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 .49 .50 .51 .52 .53 .53 4.12 GPIO Pins (3V GPIO pins) . . . . . . . . . . . . . . . . . . . . . . .54 4.13 Analog to Digital Converter (IADC) . . . . . . . . . . . . . . . . . . . . . . .56 4.14 Temperature Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 4.15 Brown Out Detectors . . . 4.15.1 DVDD BOD . . . . . 4.15.2 LE DVDD BOD . . . . 4.15.3 AVDD and IOVDD BODs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 .59 .59 .60 4.16 PDM Timing Specifications . . . . . . . . . 4.16.1 Pulse Density Modulator (PDM), Common DBUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 .61 4.17 USART SPI Master Timing . . . . . . . . . 4.17.1 SPI Master Timing, Voltage Scaling = VSCALE2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 .63 silabs.com | Building a more connected world. . . Preliminary Rev. 0.5 | 5 4.17.2 SPI Master Timing, Voltage Scaling = VSCALE1. . . . . . . . . . . . . . . . .63 4.18 USART SPI Slave Timing . . . . . . . . . . 4.18.1 SPI Slave Timing, Voltage Scaling = VSCALE2 . 4.18.2 SPI Slave Timing, Voltage Scaling = VSCALE1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 .64 .65 4.19 I2C Electrical Specifications . 4.19.1 I2C Standard-mode (Sm) 4.19.2 I2C Fast-mode (Fm) . . 4.19.3 I2C Fast-mode Plus (Fm+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66 .66 .67 .68 4.20 Typical Performance Curves 4.20.1 Supply Current . . . 4.20.2 RF Characteristics . . 4.20.3 DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 .69 .71 .72 5. Typical Connections 5.1 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73 . . . . . . . . . . . . . . . . . . . . . . . . .73 5.2 RF Matching Networks . . . . 5.2.1 2.4 GHz Matching Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74 .74 5.3 Other Connections. . . . . . . . . . . . . . . . . . . . . . . .74 . . . . . . . . 6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 6.1 QFN40 Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . .75 6.2 TQFN32 Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . .77 6.3 QFN32 Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . .79 6.4 Alternate Function Table. . . . . . . . . . . . . . . . . . . . . . . . . . .80 6.5 Analog Peripheral Connectivity . . . . . . . . . . . . . . . . . . . . . . . .81 6.6 Digital Peripheral Connectivity . . . . . . . . . . . . . . . . . . . . . . . . .82 7. QFN32 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . . 85 7.1 QFN32 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . .85 7.2 QFN32 PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . .87 7.3 QFN32 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . .89 . 8. TQFN32 Package Specifications . . . . . . . . . . . . . . . . . . . . . . . 90 8.1 TQFN32 Package Dimensions. . . . . . . . . . . . . . . . . . . . . . . . .90 8.2 TQFN32 PCB Land Pattern. . . . . . . . . . . . . . . . . . . . . . . . . .92 8.3 TQFN32 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . .94 9. QFN40 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . . 95 9.1 QFN40 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . .95 9.2 QFN40 PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . .97 9.3 QFN40 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . .98 10. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 silabs.com | Building a more connected world. . Preliminary Rev. 0.5 | 6 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3. System Overview 3.1 Introduction The EFR32 product family combines an energy-friendly MCU with a high performance radio transceiver. The devices are well suited for secure connected IoT multi-protocol devices requiring high performance and low energy consumption. This section gives a short introduction to the full radio and MCU system. The detailed functional description can be found in the EFR32xG22 Reference Manual. A block diagram of the EFR32MG22 family is shown in Figure 3.1 Detailed EFR32MG22 Block Diagram on page 7. The diagram shows a superset of features available on the family, which vary by OPN. For more information about specific device features, consult Ordering Information. Radio Subsystem RF2G4_IO RFSENSE w/ OOK Detect DEMOD RX/TX Frontend with Integrated PA IFADC Port I/O Configuration TM ARM Cortex M0+ Radio Controller Frequency Synthesizer Digital Peripherals USART BUFC RAM AGC IOVDD EUART FRC I2C MOD CRC LETIMER Serial Wire and ETM Debug / Programming with Debug Challenge I/F Up to 512 KB ISP Flash Program Memory 32 KB RAM PAVDD Energy Management Trust Zone RFVDD Voltage Monitor AVDD DVDD bypass VREGSW Port B Drivers PBn Port C Drivers PCn Port D Drivers PDn PDM TRNG A A H P B B CRYPTOACC CRC LDMA Controller IOVDD VREGVDD RTCC ARM Cortex-M33 Core with Floating Point Unit PAn DC-DC Converter Voltage Regulator DECOUPLE LFXTAL_I LFXTAL_O HFXTAL_I HFXTAL_O Analog Peripherals Watchdog Timer Internal Reference Temperature Sensor 12-bit ADC Clock Management ULFRCO FSRCO LFRCO VDD ABUS Multiplexers Debug Signals (shared w/GPIO) DBUS Port Mappers TIMER Core and Memory Reset Management Unit, Brown Out and POR Input Mux RESETn Port A Drivers LFXO HFRCO HFXO Figure 3.1. Detailed EFR32MG22 Block Diagram 3.2 Radio The EFR32MG22 Wireless Gecko features a highly configurable radio transceiver supporting Zigbee and Bluetooth Low Energy wireless protocols. 3.2.1 Antenna Interface The 2.4 GHz antenna interface consists of a single-ended pin (RF2G4_IO). The external components for the antenna interface in typical applications are shown in the RF Matching Networks section. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 7 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3.2.2 Fractional-N Frequency Synthesizer The EFR32MG22 contains a high performance, low phase noise, fully integrated fractional-N frequency synthesizer. The synthesizer is used in receive mode to generate the LO frequency for the down-conversion mixer. It is also used in transmit mode to directly generate the modulated RF carrier. The fractional-N architecture provides excellent phase noise performance, frequency resolution better than 100 Hz, and low energy consumption. The synthesizer’s fast frequency settling allows for very short receiver and transmitter wake up times to reduce system energy consumption. 3.2.3 Receiver Architecture The EFR32MG22 uses a low-IF receiver architecture, consisting of a Low-Noise Amplifier (LNA) followed by an I/Q down-conversion mixer. The I/Q signals are further filtered and amplified before being sampled by the IF analog-to-digital converter (IFADC). The IF frequency is configurable from 150 kHz to 1371 kHz. The IF can further be configured for high-side or low-side injection, providing flexibility with respect to known interferers at the image frequency. The Automatic Gain Control (AGC) module adjusts the receiver gain to optimize performance and avoid saturation for excellent selectivity and blocking performance. The 2.4 GHz radio is calibrated at production to improve image rejection performance. Demodulation is performed in the digital domain. The demodulator performs configurable decimation and channel filtering to allow receive bandwidths ranging from 0.1 to 2530 kHz. High carrier frequency and baud rate offsets are tolerated by active estimation and compensation. Advanced features supporting high quality communication under adverse conditions include forward error correction by block and convolutional coding as well as Direct Sequence Spread Spectrum (DSSS). A Received Signal Strength Indicator (RSSI) is available for signal quality metrics, for level-based proximity detection, and for RF channel access by Collision Avoidance (CA) or Listen Before Talk (LBT) algorithms. An RSSI capture value is associated with each received frame and the dynamic RSSI measurement can be monitored throughout reception. 3.2.4 Transmitter Architecture The EFR32MG22 uses a direct-conversion transmitter architecture. For constant envelope modulation formats, the modulator controls phase and frequency modulation in the frequency synthesizer. Transmit symbols or chips are optionally shaped by a digital shaping filter. The shaping filter is fully configurable, including the BT product, and can be used to implement Gaussian or Raised Cosine shaping. Carrier Sense Multiple Access - Collision Avoidance (CSMA-CA) or Listen Before Talk (LBT) algorithms can be automatically timed by the EFR32MG22. These algorithms are typically defined by regulatory standards to improve inter-operability in a given bandwidth between devices that otherwise lack synchronized RF channel access. 3.2.5 Packet and State Trace The EFR32MG22 Frame Controller has a packet and state trace unit that provides valuable information during the development phase. It features: • Non-intrusive trace of transmit data, receive data and state information • Data observability on a single-pin UART data output, or on a two-pin SPI data output • Configurable data output bitrate / baudrate • Multiplexed transmitted data, received data and state / meta information in a single serial data stream 3.2.6 Data Buffering The EFR32MG22 features an advanced Radio Buffer Controller (BUFC) capable of handling up to 4 buffers of adjustable size from 64 bytes to 4096 bytes. Each buffer can be used for RX, TX or both. The buffer data is located in RAM, enabling zero-copy operations. 3.2.7 Radio Controller (RAC) The Radio Controller controls the top level state of the radio subsystem in the EFR32MG22. It performs the following tasks: • Precisely-timed control of enabling and disabling of the receiver and transmitter circuitry • Run-time calibration of receiver, transmitter and frequency synthesizer • Detailed frame transmission timing, including optional LBT or CSMA-CA silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 8 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3.2.8 RFSENSE Interface The RFSENSE block allows the device to remain in EM2, EM3 or EM4 and wake when RF energy above a specified threshold is detected. When operated in selective mode, the RFSENSE block performs OOK preamble and sync word detection, preventing false wakeup events. 3.3 General Purpose Input/Output (GPIO) EFR32MG22 has up to 26 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals. The GPIO subsystem supports asynchronous external pin interrupts. All of the pins on ports A and port B are EM2 capable. These pins may be used by Low-Energy peripherals in EM2/3 and may also be used as EM2/3 pin wake-ups. Pins on ports C and D are latched/retained in their current state when entering EM2 until EM2 exit upon which internal peripherals could once again drive those pads. A few GPIOs also have EM4 wake functionality. These pins are listed in the Alternate Function Table. 3.4 Clocking 3.4.1 Clock Management Unit (CMU) The Clock Management Unit controls oscillators and clocks in the EFR32MG22. Individual enabling and disabling of clocks to all peripheral modules is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscillators. 3.4.2 Internal and External Oscillators The EFR32MG22 supports two crystal oscillators and fully integrates four RC oscillators, listed below. • A high frequency crystal oscillator (HFXO) with integrated load capacitors, tunable in small steps, provides a precise timing reference for the MCU. The HFXO provides excellent RF clocking performance using a 38.4 MHz crystal. The HFXO can also support an external clock source such as a TCXO for applications that require an extremely accurate clock frequency over temperature. • A 32.768 kHz crystal oscillator (LFXO) provides an accurate timing reference for low energy modes. • An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The HFRCO employs fast start-up at minimal energy consumption combined with a wide frequency range, from 1 MHz to 76.8 MHz. • An integrated fast start-up RC oscillator (FSRCO) that runs at a fixed 20 MHz • An integrated low frequency 32.768 kHz RC oscillator (LFRCO) for low power operation without an external crystal. Precision mode enables periodic recalibration against the 38.4 MHz HFXO crystal to improve accuracy to +/- 500 ppm, suitable for BLE sleep interval timing. • An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy consumption in low energy modes. 3.5 Counters/Timers and PWM 3.5.1 Timer/Counter (TIMER) TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the Peripheral Reflex System (PRS). The core of each TIMER is a 16-bit or 32-bit counter with up to 3 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers. In addition some timers offer dead-time insertion. See 3.13 Configuration Summary for information on the feature set of each timer. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 9 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3.5.2 Low Energy Timer (LETIMER) The unique LETIMER is a 24-bit timer that is available in energy mode EM0 Active, EM1 Sleep, EM2 Deep Sleep, and EM3 Stop. This allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of waveforms with minimal software intervention. The LETIMER is connected to the Peripheral Reflex System (PRS), and can be configured to start counting on compare matches from other peripherals such as the RTCC. 3.5.3 Real Time Clock with Capture (RTCC) The Real Time Clock with Capture (RTCC) is a 32-bit counter providing timekeeping down to EM3. The RTCC can be clocked by any of the on-board low-frequency oscillators, and it is capable of providing system wake-up at user defined intervals. A secondary RTC is used by the RF protocol stack for event scheduling, leaving the primary RTCC block available exclusively for application software. 3.5.4 Back-Up Real Time Counter The Back-Up Real Time Counter (BURTC) is a 32-bit counter providing timekeeping in all energy modes, including EM4. The BURTC can be clocked by any of the on-board low-frequency oscillators, and it is capable of providing system wake-up at user defined invervals. 3.5.5 Watchdog Timer (WDOG) The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can also monitor autonomous systems driven by the Peripheral Reflex System (PRS). 3.6 Communications and Other Digital Peripherals 3.6.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O module. It supports full duplex asynchronous UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices supporting: • ISO7816 SmartCards • IrDA • I2S 3.6.2 Enhanced Universal Asynchronous Receiver/Transmitter (EUART) The Enhanced Universal Asynchronous Receiver/Transmitter supports full duplex asynchronous UART communication with hardware flow control, RS-485 and IrDA support. In EM0 and EM1 the EUART provides a high-speed, buffered communication interface. When routed to GPIO ports A or B, the EUART may also be used in a low-energy mode and operate in EM2. A 32.768 kHz clock source allows full duplex UART communication up to 9600 baud. 3.6.3 Inter-Integrated Circuit Interface (I2C) The I2C module provides an interface between the MCU and a serial I2C bus. It is capable of acting as both a master and a slave and supports multi-master buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates from 10 kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system. The interface provided to software by the I2C module allows precise timing control of the transmission process and highly automated transfers. Automatic recognition of slave addresses is provided in active and low energy modes. Note that not all instances of I2C are avaliable in all energy modes. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 10 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3.6.4 Peripheral Reflex System (PRS) The Peripheral Reflex System provides a communication network between different peripheral modules without software involvement. Peripheral modules producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer peripherals which in turn perform actions in response. Edge triggers and other functionality such as simple logic operations (AND, OR, NOT) can be applied by the PRS to the signals. The PRS allows peripherals to act autonomously without waking the MCU core, saving power. 3.6.5 Pulse Density Modulation (PDM) Interface The PDM module provides a serial interface and decimation filter for Pulse Density Modulation (PDM) microphones, isolated Sigmadelta ADCs, digital sensors and other PDM or sigma delta bit stream peripherals. A programmable Cascaded Integrator Comb (CIC) filter is used to decimate the incoming bit streams. PDM supports stereo or mono input data and DMA transfer. 3.7 Security Features The following security features are available on the EFR32MG22: • Secure Boot with Root of Trust and Secure Loader (RTSL) • Cryptographic Accelerator • True Random Number Generator (TRNG) • Secure Debug with Lock/Unlock 3.7.1 Secure Boot with Root of Trust and Secure Loader (RTSL) The Secure Boot with RTSL authenticates a chain of trusted firmware that begins from an immutable memory (ROM). It prevents malware injection, prevents rollback, ensures that only authentic firmware is executed and protects Over The Air updates. More information on this feature can be found in the Application Note AN1218: Series 2 Secure Boot with RTSL. 3.7.2 Cryptographic Accelerator The Cryptographic Accelerator is an autonomous hardware accelerator with Differential Power Analysis (DPA) countermeasures to protect keys. It supports AES encryption and decryption with 128/192/256-bit keys, Elliptic Curve Cryptography(ECC) to support public key operations and hashes. Supported block cipher modes of operation for AES include: • ECB (Electronic Code Book) • CTR (Counter Mode) • CBC (Cipher Block Chaining) • CFB (Cipher Feedback) • GCM (Galois Counter Mode) • CBC-MAC (Cipher Block Chaining Message Authentication Code) • GMAC (Galois Message Authentication Code) • CCM (Counter with CBC-MAC) The Cryptographic Accelerator accelerates Elliptical Curve Cryptography and supports the NIST (National Institute of Standards and Technology) recommended curves including P-192 and P-256 for ECDH(Elliptic Curve Diffie-Hellman) key derivation and ECDSA (Elliptic Curve Digital Signature Algorithm) sign and verify operations. Supported hashes include SHA-1, SHA2/224, and SHA-2/256. This implementation provides a fast and energy efficient solution to state of the art cryptographic needs. 3.7.3 True Random Number Generator The True Random Number Generator module is a non-deterministic random number generator that harvests entropy from a thermal energy source. It includes start-up health tests for the entropy source as required by NIST SP800-90B and AIS-31 as well as online health tests required for NIST SP800-90C. The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 11 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3.7.4 Secure Debug with Lock/Unlock For obvious security reasons, it is critical for a product to have its debug interface locked before being released in the field. In addition, the Secure Element also provides a secure debug unlock function that allows authenticated access based on public key cryptography. This functionality is particularly useful for supporting failure analysis while maintaining confidentiality of IP and sensitive end-user data. More information on this feature can be found in the Application Note AN1190: EFR32xG2x Secure Debug. 3.8 Analog 3.8.1 Analog to Digital Converter (IADC) The IADC is a hybrid architecture combining techniques from both SAR and Delta-Sigma style converters. It has a resolution of up to 12 bits at up to 1 Msps. Hardware oversampling reduces system-level noise over multiple front-end samples. The IADC includes integrated voltage references. Inputs are selectable from a wide range of sources, including pins configurable as either single-ended or differential. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 12 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3.9 Power The EFR32MG22 has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only a single external supply voltage is required, from which all internal voltages are created. An optional integrated DC-DC buck regulator can be utilized to further reduce the current consumption. The DC-DC regulator requires one external inductor and one external capacitor. The EFR32MG22 device family includes support for internal supply voltage scaling, as well as two different power domains groups for peripherals. These enhancements allow for further supply current reductions and lower overall power consumption. 3.9.1 Energy Management Unit (EMU) The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and features are available and the amount of current the device consumes. The EMU can also be used to implement system-wide voltage scaling and turn off the power to unused RAM blocks to optimize the energy consumption in the target application. The DC-DC regulator operation is tightly integrated with the EMU. 3.9.2 Voltage Scaling The EFR32MG22 supports supply voltage scaling for the LDO powering DECOUPLE, with independent selections for EM0 / EM1 and EM2 / EM3. Voltage scaling helps to optimize the energy efficiency of the system by operating at lower voltages when possible. The default EM0 / EM1 voltage scaling level is VSCALE2, which allows the core to operate in active mode at full speed. The intermediate level, VSCALE1, allows operation in EM0 and EM1 at up to 40 MHz. The lowest level, VSCALE0, can be used to conserve power in EM2 and EM3. The EMU will automatically switch the target voltage scaling level when transitioning between energy modes. 3.9.3 DC-DC Converter The DC-DC buck converter covers a wide range of load currents, provides high efficiency in energy modes EM0, EM1, EM2 and EM3, and can supply up to 60 mA for device and radio operation. RF noise mitigation allows operation of the DC-DC converter without significantly degrading sensitivity of radio components. An on-chip supply-monitor signals when the supply voltage is low to allow bypass of the regulator via programmable software interrupt. It employs soft switching at boot and DCDC regulating-to-bypass transitions to limit the max supply slew-rate and mitigate inrush current. 3.9.4 Power Domains The EFR32MG22 has three peripheral power domains for operation in EM2 and EM3, as well as the ability to selectively retain configurations for EM0/EM1 peripherals. A small set of peripherals always remain powered on in EM2 and EM3, including all peripherals which are available in EM4. If all of the peripherals in PD0B or PD0C are configured as unused, that power domain will be powered off in EM2 or EM3, reducing the overall current consumption of the device. Likewise, if the application can tolerate the setup time to re-configure used EM0/EM1 peripherals on wake, register retention for these peripherals can be disabled to further reduce the EM2 or EM3 current. Table 3.1. Peripheral Power Subdomains Always available in EM2/EM3 Power Domain PD0B Power Domain PD0C RTCC LETIMER0 LFRCO (Precision Mode) LFRCO (Non-precision mode)1 IADC0 LFXO1 I2C0 BURTC1 WDOG0 RFSENSE1 EUART0 ULFRCO1 PRS FSRCO DEBUG Note: 1. Peripheral also available in EM4. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 13 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3.10 Reset Management Unit (RMU) The RMU is responsible for handling reset of the EFR32MG22. A wide range of reset sources are available, including several power supply monitors, pin reset, software controlled reset, core lockup reset, and watchdog reset. 3.11 Core and Memory 3.11.1 Processor Core The ARM Cortex-M processor includes a 32-bit RISC processor integrating the following features and tasks in the system: • ARM Cortex-M33 RISC processor achieving 1.50 Dhrystone MIPS/MHz • ARM TrustZone security technology • Embedded Trace Macrocell (ETM) for real-time trace and debug • Up to 512 kB flash program memory • Up to 32 kB RAM data memory • Configuration and event handling of all modules • 2-pin Serial-Wire debug interface 3.11.2 Memory System Controller (MSC) The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable from both the Cortex-M and DMA. In addition to the main flash array where Program code is normally written the MSC also provides an Information block where additional information such as special user information or flash-lock bits are stored. There is also a read-only page in the information block containing system and device calibration data. Read and write operations are supported in energy modes EM0 Active and EM1 Sleep. 3.11.3 Linked Direct Memory Access Controller (LDMA) The Linked Direct Memory Access (LDMA) controller allows the system to perform memory operations independently of software. This reduces both energy consumption and software workload. The LDMA allows operations to be linked together and staged, enabling sophisticated operations to be implemented. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 14 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3.12 Memory Map The EFR32MG22 memory map is shown in the figures below. RAM and flash sizes are for the largest memory configuration. Figure 3.2. EFR32MG22 Memory Map — Core Peripherals and Code Space silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 15 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview 3.13 Configuration Summary The features of the EFR32MG22 are a subset of the feature set described in the device reference manual. The table below describes device specific implementation of the features. Remaining modules support full configuration. Table 3.2. Configuration Summary Module Lowest Energy Mode Configuration I2C0 EM21 I2C1 EM1 IADC0 EM2 LETIMER0 EM21 PDM EM1 2-channel TIMER0 EM1 32-bit, 3-channels, +DTI TIMER1 EM1 16-bit, 3-channels, +DTI TIMER2 EM1 16-bit, 3-channels, +DTI TIMER3 EM1 16-bit, 3-channels, +DTI TIMER4 EM1 16-bit, 3-channels, +DTI EUART0 EM1 - Full high-speed operation EM21 - Low-energy operation, 9600 Baud USART0 EM1 +IrDA, +I2S, +SmartCard USART1 EM1 +IrDA, +I2S, +SmartCard Note: 1. EM2 and EM3 operation is only supported for digital peripheral I/O on Port A and Port B. All GPIO ports support digital peripheral operation in EM0 and EM1. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 16 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4. Electrical Specifications 4.1 Electrical Characteristics All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: • Typical values are based on TA=25 °C and all supplies at 3.0 V, by production test and/or technology characterization. • Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna. • Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. When assigning supply sources, the following requirements must be observed: • VREGVDD ≥ DVDD • In systems not using the DCDC converter, DVDD should be shorted to VREGVDD • PAVDD ≥ RFVDD • AVDD and IOVDD: No dependency with each other or any other supply pin silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 17 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.2 Absolute Maximum Ratings Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. Table 4.1. Absolute Maximum Ratings Parameter Symbol Storage temperature range Test Condition Min Typ Max Unit TSTG -50 — +150 °C Voltage on any supply pin1 VDDMAX -0.3 — 3.8 V Junction temperature TJMAX -G grade — — +105 °C -I grade — — +125 °C — — 1.0 V / µs Voltage ramp rate on any supply pin VDDRAMPMAX Voltage on HFXO pins VHFXOPIN -0.3 — 1.4 V DC voltage on any GPIO pin VDIGPIN -0.3 — VIOVDD + 0.3 V DC voltage on RESETn pin VRESETn -0.3 — 3.8 V Absolute voltage on RF pin RF2G4_IO VMAX2G4 -0.3 — VPAVDD + 0.3 V Total current into VDD power IVDDMAX lines Source — — 200 mA Total current into VSS ground lines IVSSMAX Sink — — 200 mA Current per I/O pin IIOMAX Sink — — 50 mA Source — — 50 mA Sink — — 200 mA Source — — 200 mA Current for all I/O pins IIOALLMAX Note: 1. The maximum supply voltage on VREGVDD is limited under certain conditions when using the DC-DC. See the DC-DC specifications for more details. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 18 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.3 General Operating Conditions Table 4.2. General Operating Conditions Parameter Symbol Test Condition Min Typ Max Unit Operating ambient temperature range TA -G temperature grade 1 -40 — +85 °C -I temperature grade 1 -40 — +125 °C DVDD supply voltage VDVDD EM0/1 1.71 3.0 3.8 V EM2/3/42 1.71 3.0 3.8 V AVDD supply voltage VAVDD 1.71 3.0 3.8 V IOVDDx operating supply voltage (All IOVDD pins) VIOVDDx 1.71 3.0 3.8 V PAVDD operating supply voltage VPAVDD 1.71 3.0 3.8 V VREGVDD operating supply voltage VVREGVDD DC-DC in regulation3 2.2 3.0 3.8 V DC-DC in bypass 60 mA load 1.8 3.0 3.8 V DC-DC not in use. DVDD externally shorted to VREGVDD 1.71 3.0 3.8 V 1.71 3.0 VPAVDD V 1.0 µF ± 10% X8L capacitor used for performance characterization. 1.0 — 2.75 µF VSCALE2, MODE = WS1 — — 76.8 MHz VSCALE2, MODE = WS0 — — 40 MHz VSCALE1, MODE = WS0 — — 40 MHz VSCALE2 — — 50 MHz VSCALE1 — — 40 MHz VSCALE2 — — 76.8 MHz VSCALE1 — — 40 MHz VSCALE2 — — 76.8 MHz VSCALE1 — — 40 MHz VSCALE2 or VSCALE1 — 38.4 — MHz RFVDD operating supply voltage VRFVDD DECOUPLE output capacitor4 CDECOUPLE HCLK and SYSCLK frequen- fHCLK cy PCLK frequency fPCLK EM01 Group A clock frequency fEM01GRPACLK EM01 Group B clock frequency fEM01GRPBCLK Radio HCLK frequency5 fRHCLK silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 19 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit Note: 1. The device may operate continuously at the maximum allowable ambient TA rating as long as the absolute maximum TJMAX is not exceeded. For an application with significant power dissipation, the allowable TA may be lower than the maximum TA rating. TA = TJMAX - (THETAJA x PowerDissipation). Refer to the Absolute Maximum Ratings table and the Thermal Characteristics table for TJMAX and THETAJA. 2. The DVDD supply is monitored by the DVDD BOD in EM0/1 and the LE DVDD BOD in EM2/3/4. 3. The maximum supply voltage on VREGVDD is limited under certain conditions when using the DC-DC. See the DC-DC specifications for more details. 4. Murata GCM21BL81C105KA58L used for performance charaacterization. Actual capacitor values can be significantly de-rated from their specified nominal value by the rated tolerance, as well as the application's AC voltage, DC bias, and temperature. The minimum capacitance counting all error sources should be no less than 0.6 µF. 5. The recommended radio crystal frequency is 38.4 MHz. Any crystal frequency other than 38.4 is expressly not supported. See HFXO specifications for more detail on crystal tolerance. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 20 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.4 DC-DC Converter Test conditions: LDCDC = 2.2 µH (Samsung CIG22H2R2MNE), CDCDC = 4.7 µF (Samsung CL10B475KQ8NQNC), VVREGVDD = 3.0 V, VOUT = 1.8 V, IPKVAL in EM0/1 modes is set to 150 mA, and in EM2/3 modes is set to 90 mA, unless otherwise indicated. Table 4.3. DC-DC Converter Parameter Symbol Test Condition Min Typ Max Unit Input voltage range at VREGVDD pin1 VVREGVDD DCDC in regulation, ILOAD = 60 mA, EM0/EM1 mode 2.2 3.0 3.8* V DCDC in regulation, ILOAD = 5 mA, EM0/EM1 or EM2/EM3 mode 1.8 3.0 3.8* V Bypass mode 1.8 3.0 3.8 V — 1.8 — V -2.5 — 3.3 % Regulated output voltage VOUT Regulation DC accuracy ACCDC VVREGVDD ≥ 2.2 V, Steady state in EM0/EM1 mode or EM2/EM3 mode Regulation total accuracy ACCTOT With mode transitions between EM0/EM1 and EM2/EM3 modes -5 — 7 % Steady-state output ripple VR ILOAD = 20 mA in EM0/EM1 mode — 14.3 — mVpp DC line regulation VREG ILOAD = 60 mA in EM0/EM1 mode, VVREGVDD ≥ 2.2 V — 5.5 — mV/V DC load regulation IREG Load current between 100 µA and 60 mA in EM0/EM1 mode — 0.27 — mV/mA Efficiency EFF Load current between 100 µA and 60 mA in EM0/EM1 mode, or between 10 µA and 5 mA in EM2/EM3 mode — 91 — % Output load current ILOAD EM0/EM1 mode, DCDC in regulation — — 60 mA EM2/EM3 mode, DCDC in regulation — — 5 mA Bypass mode — — 60 mA Nominal output capacitor CDCDC 4.7 µF ± 10% X7R capacitor used for performance characterization2 4.7 — 10 µF Nominal inductor LDCDC ± 20% tolerance — 2.2 — µH Nominal input capacitor CIN CDCDC — — µF Resistance in bypass mode RBYP Bypass switch from VREGVDD to DVDD, VVREGVDD = 1.8 V — 1.75 3 Ω Powertrain PFET switch from VREGVDD to VREGSW, VVREGVDD = 1.8 V — 0.86 1.5 Ω Programmable in 0.1 V steps 2.0 — 2.3 V Supply falling edge trip point TBD — TBD % Supply monitor threshold programming range VCMP_RNG Supply monitor threshold ac- VCMP_ACC curacy silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 21 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit Supply monitor threshold hysteresis VCMP_HYST Positive hysteresis on the supply rising edge referred to the falling edge trip point — 4 — % Supply monitor response time tCMP_DELAY Supply falling edge at -100 mV / µs — 0.6 — µs Note: 1. The supported maximum VVREGVDD in regulation mode is a function of temperature and 10-year lifetime average load current. See more details in 4.4.1 DC-DC Operating Limits. 2. Samsung CL10B475KQ8NQNC used for performance charaacterization. Actual capacitor values can be significantly de-rated from their specified nominal value by the rated tolerance, as well as the application's AC voltage, DC bias, and temperature. The minimum capacitance counting all error sources should be no less than 2.4 µF. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 22 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.4.1 DC-DC Operating Limits Average Lifetime ILOAD (mA) The maximum supported voltage on the VREGVDD supply pin is limited under certain conditions. Maximum input voltage is a function of temperature and the average load current over a 10-year lifetime. Figure 4.1 Lifetime average load current limit vs. Maximum input voltage on page 23 shows the safe operating region under specific conditions. Exceeding this safe operating range may impact the reliability and performance of the DC-DC converter. 60 Tj ≤ 85 °C Tj ≤ 105 °C Tj ≤ 125 °C 5 3.3 3.55 Maximum VVREGVDD (V) 3.8 Figure 4.1. Lifetime average load current limit vs. Maximum input voltage Maximum ILOAD (mA) The minimum input voltage for the DC-DC in EM0/EM1 mode is a function of the maximum load current, and the peak current setting. Figure 4.2 Transient maximum load current vs. Minimum input voltage on page 23 shows the max load current vs. input voltage for different DC-DC peak inductor current settings. 60 36 IPEAK = 150 mA IPEAK = 90 mA 5 1.8 2.2 Minimum VVREGVDD (V) Figure 4.2. Transient maximum load current vs. Minimum input voltage silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 23 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.5 Thermal Characteristics Table 4.4. Thermal Characteristics Parameter Symbol Test Condition Min Typ Max Unit Thermal Resistance Junction THEto Ambient QFN32 (4x4mm) TAJA_QFN32_4X4 Package 4-Layer PCB, Natural Convection1 — 35.4 — °C/W Thermal Resistance Junction THEto Ambient TQFN32 TAJA_TQFN32_4X (4x4mm) Package 4 4-Layer PCB, Natural Convection1 — 40.2 — °C/W Thermal Resistance, Junction to Ambient, QFN40 (5x5mm) Package 4-Layer PCB, Natural Convection1 — 32.6 — °C/W THETAJA_QFN40_5X5 Note: 1. Measured according to JEDEC standard JESD51-2A. Integrated Circuit Thermal Test Method Environmental Conditions - Natural Convection (Still Air). silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 24 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.6 Current Consumption 4.6.1 MCU current consumption using DC-DC at 3.0 V input Unless otherwise indicated, typical conditions are: VREGVDD = 3.0 V. AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V from DCDC. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. Table 4.5. MCU current consumption using DC-DC at 3.0 V input Parameter Symbol Current consumption in EM0 IACTIVE mode with all peripherals disabled Current consumption in EM1 IEM1 mode with all peripherals disabled silabs.com | Building a more connected world. Test Condition Min Typ Max Unit 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU running Prime from flash, VSCALE2 — 28 — µA/MHz 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU running while loop from flash, VSCALE2 — 27 — µA/MHz 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU running CoreMark loop from flash, VSCALE2 — 37 — µA/MHz 38.4 MHz crystal, CPU running Prime from flash — 28 — µA/MHz 38.4 MHz crystal, CPU running while loop from flash — 26 — µA/MHz 38.4 MHz crystal, CPU running CoreMark loop from flash — 38 — µA/MHz 38 MHz HFRCO, CPU running while loop from flash — 22 — µA/MHz 26 MHz HFRCO, CPU running while loop from flash — 24 — µA/MHz 16 MHz HFRCO, CPU running while loop from flash — 27 — µA/MHz 1 MHz HFRCO, CPU running while loop from flash — 159 — µA/MHz 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, VSCALE2 — 17 — µA/MHz 38.4 MHz crystal — 17 — µA/MHz 38 MHz HFRCO — 13 — µA/MHz 26 MHz HFRCO — 15 — µA/MHz 16 MHz HFRCO — 18 — µA/MHz 1 MHz HFRCO — 150 — µA/MHz Preliminary Rev. 0.5 | 25 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Current consumption in EM2 IEM2_VS mode, VSCALE0 Current consumption in EM3 IEM3_VS mode, VSCALE0 Additional current in EM2 or EM3 when any peripheral in PD0B is enabled1 IPD0B_VS Test Condition Min Typ Max Unit Full RAM retention and RTC running from LFXO — 1.40 — µA Full RAM retention and RTC running from LFRCO — 1.40 — µA Full RAM retention and RTC running from LFRCO in precision mode — 1.75 — µA 24 kB RAM retention and RTC running from LFXO — 1.32 — µA 24 kB RAM retention and RTC running from LFRCO in precision mode — 1.66 — µA 8 kB RAM retention and RTC running from LFXO — 1.21 — µA 8 kB RAM retention and RTC running from LFRCO — 1.20 — µA 8 kB RAM retention and RTC running from LFXO, Radio RAM and CPU cache not retained — 1.03 — µA 8 kB RAM retention and RTC running from ULFRCO — 1.05 — µA — 0.37 — µA Note: 1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the peripherals in each power domain. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 26 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.6.2 MCU current consumption at 3.0 V Unless otherwise indicated, typical conditions are: AVDD = DVDD = RFVDD = PAVDD = VREGVDD = 3.0 V. DC-DC not used. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. Table 4.6. MCU current consumption at 3.0 V Parameter Symbol Current consumption in EM0 IACTIVE mode with all peripherals disabled Current consumption in EM1 IEM1 mode with all peripherals disabled silabs.com | Building a more connected world. Test Condition Min Typ Max Unit 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU running Prime from flash, VSCALE2 — 42 — µA/MHz 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU running while loop from flash, VSCALE2 — 39 — µA/MHz 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU running CoreMark loop from flash, VSCALE2 — 54 — µA/MHz 38.4 MHz crystal, CPU running Prime from flash — 40 — µA/MHz 38.4 MHz crystal, CPU running while loop from flash — 39 — µA/MHz 38.4 MHz crystal, CPU running CoreMark loop from flash — 55 — µA/MHz 38 MHz HFRCO, CPU running while loop from flash — 33 TBD µA/MHz 26 MHz HFRCO, CPU running while loop from flash — 35 — µA/MHz 16 MHz HFRCO, CPU running while loop from flash — 40 — µA/MHz 1 MHz HFRCO, CPU running while loop from flash — 228 TBD µA/MHz 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, VSCALE2 — 24 — µA/MHz 38.4 MHz crystal — 25 — µA/MHz 38 MHz HFRCO — 19 TBD µA/MHz 26 MHz HFRCO — 21 — µA/MHz 16 MHz HFRCO — 27 — µA/MHz 1 MHz HFRCO — 215 TBD µA/MHz Preliminary Rev. 0.5 | 27 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Min Typ Max Unit Full RAM retention and RTC running from LFXO — 1.94 — µA Full RAM retention and RTC running from LFRCO — 1.95 — µA 24 kB RAM retention and RTC running from LFXO — 1.81 — µA 24 kB RAM retention and RTC running from LFRCO in precision mode — 2.34 — µA 8 kB RAM retention and RTC running from LFXO — 1.64 — µA 8 kB RAM retention and RTC running from LFRCO — 1.65 TBD µA 8 kB RAM retention and RTC running from LFXO, Radio RAM and CPU cache not retained — 1.39 — µA Current consumption in EM3 IEM3_VS mode, VSCALE0 8 kB RAM retention and RTC running from ULFRCO — 1.41 TBD µA Current consumption in EM4 IEM4 mode No BURTC, no LF oscillator — 0.17 TBD µA BURTC with LFXO — 0.50 — µA Current consumption during reset IRST Hard pin reset held — 234 — µA Additional current in EM2 or EM3 when any peripheral in PD0B is enabled1 IPD0B_VS — 0.56 — µA Current consumption in EM2 IEM2_VS mode, VSCALE0 Test Condition Note: 1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the peripherals in each power domain. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 28 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.6.3 MCU current consumption at 1.8 V Unless otherwise indicated, typical conditions are: AVDD = DVDD = RFVDD = PAVDD = VREGVDD = 1.8 V. DC-DC not used. Voltage scaling level = VSCALE1. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. Table 4.7. MCU current consumption at 1.8 V Parameter Symbol Current consumption in EM0 IACTIVE mode with all peripherals disabled Current consumption in EM1 IEM1 mode with all peripherals disabled silabs.com | Building a more connected world. Test Condition Min Typ Max Unit 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU running Prime from flash, VSCALE2 — 42 — µA/MHz 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU running while loop from flash, VSCALE2 — 39 — µA/MHz 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, CPU running CoreMark loop from flash, VSCALE2 — 54 — µA/MHz 38.4 MHz crystal, CPU running Prime from flash — 41 — µA/MHz 38.4 MHz crystal, CPU running while loop from flash — 39 — µA/MHz 38.4 MHz crystal, CPU running CoreMark loop from flash — 55 — µA/MHz 38 MHz HFRCO, CPU running while loop from flash — 33 — µA/MHz 26 MHz HFRCO, CPU running while loop from flash — 35 — µA/MHz 16 MHz HFRCO, CPU running while loop from flash — 40 — µA/MHz 1 MHz HFRCO, CPU running while loop from flash — 227 — µA/MHz 76.8 MHz HFRCO w/ DPLL referenced to 38.4 MHz crystal, VSCALE2 — 24 — µA/MHz 38.4 MHz crystal — 25 — µA/MHz 38 MHz HFRCO — 19 — µA/MHz 26 MHz HFRCO — 21 — µA/MHz 16 MHz HFRCO — 27 — µA/MHz 1 MHz HFRCO — 213 — µA/MHz Preliminary Rev. 0.5 | 29 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Min Typ Max Unit Full RAM retention and RTC running from LFXO — 1.87 — µA Full RAM retention and RTC running from LFRCO — 1.86 — µA 24 kB RAM retention and RTC running from LFXO — 1.73 — µA 24 kB RAM retention and RTC running from LFRCO in precision mode — 2.26 — µA 8 kB RAM retention and RTC running from LFXO — 1.57 — µA 8 kB RAM retention and RTC running from LFRCO — 1.56 — µA 8 kB RAM retention and RTC running from LFXO, Radio RAM and CPU cache not retained — 1.32 — µA Current consumption in EM3 IEM3_VS mode, VSCALE0 8 kB RAM retention and RTC running from ULFRCO — 1.34 — µA Current consumption in EM4 IEM4 mode No BURTC, no LF oscillator — 0.13 — µA BURTC with LFXO — 0.44 — µA Current consumption during reset IRST Hard pin reset held — 190 — µA Additional current in EM2 or EM3 when any peripheral in PD0B is enabled1 IPD0B_VS — 0.54 — µA Current consumption in EM2 IEM2_VS mode, VSCALE0 Test Condition Note: 1. Extra current consumed by power domain. Does not include current associated with the enabled peripherals. See for a list of the peripherals in each power domain. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 30 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.6.4 Radio current consumption at 3.0V using DCDC RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VREGVDD = 3.0V. AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. Table 4.8. Radio current consumption at 3.0V using DCDC Parameter Symbol System current consumption IRX_ACTIVE in receive mode, active packet reception silabs.com | Building a more connected world. Test Condition Min Typ Max Unit 125 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only) — 3.7 — mA 125 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE1 — 4.0 — mA 125 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE2 — 4.1 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only) — 3.8 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE1 — 4.0 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE2 — 4.2 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only)1 — 3.6 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE1 1 — 3.8 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE2 1 — 3.9 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only) — 4.0 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE1 — 4.2 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE2 — 4.4 — mA 802.15.4 receiving frame, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only) — 3.9 — mA 802.15.4 receiving frame, f = 2.4 GHz, VSCALE1 — 4.1 — mA 802.15.4 receiving frame, f = 2.4 GHz, VSCALE2 — 4.3 — mA Preliminary Rev. 0.5 | 31 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol System current consumption IRX_LISTEN in receive mode, listening for packet System current consumption ITX in transmit mode silabs.com | Building a more connected world. Test Condition Min Typ Max Unit 125 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only) — 3.8 — mA 125 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE1 — 4.0 — mA 125 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE2 — 4.1 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only) — 3.8 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE1 — 4.0 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz, VSCALE2 — 4.1 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only)1 — 3.6 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE1 1 — 3.8 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE2 1 — 4.0 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only) — 4.1 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE1 — 4.3 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz, VSCALE2 — 4.5 — mA 802.15.4, f = 2.4 GHz, VSCALE1, EM1P (Radio clocks only) — 4.2 — mA 802.15.4, f = 2.4 GHz, VSCALE1 — 4.4 — mA 802.15.4, f = 2.4 GHz, VSCALE2 — 4.6 — mA f = 2.4 GHz, CW, 0 dBm PA, 0 dBm output power, VSCALE1, EM1P (Radio clocks only) — 4.1 — mA f = 2.4 GHz, CW, 6 dBm PA, 6 dBm output power, VSCALE1, EM1P (Radio clocks only) — 8.2 — mA f = 2.4 GHz, CW, 0 dBm PA, 0 dBm output power, VSCALE1 — 4.3 — mA f = 2.4 GHz, CW, 6 dBm PA, 6 dBm output power, VSCALE1 — 8.4 — mA f = 2.4 GHz, CW, 0 dBm PA, 0 dBm output power, VSCALE2 — 4.4 — mA f = 2.4 GHz, CW, 6 dBm PA, 6 dBm output power, VSCALE2 — 8.5 — mA Preliminary Rev. 0.5 | 32 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit Min Typ Max Unit 1.71 — 3.8 V Note: 1. Direction-finding phy adds approximately 150 µA to the receive current. 4.7 Flash Characteristics Table 4.9. Flash Characteristics Parameter Symbol Test Condition Flash Supply voltage during write or erase VFLASH Flash erase cycles before failure1 ECFLASH TA ≤ 125 °C 10,000 — — cycles Flash data retention1 RETFLASH TA ≤ 125 °C 10 — — years Program Time tPROG one word (32-bits) 42.1 44 45.6 uSec average per word over 128 words 10.3 10.9 11.3 uSec 11.4 12.9 14.4 ms 11.7 13 14.3 ms — — 1.45 mA Page Erase Time tPERASE Mass Erase Time tMERASE Program Current IPROG Page Erase Current IPERASE Page Erase — — 1.34 mA Mass Erase Current IMERASE Mass Erase — — 1.28 mA Erases all of User Code area Note: 1. Flash data retention information is published in the Quarterly Quality and Reliability Report. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 33 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.8 Wake Up, Entry, and Exit times Unless otherwise specified, these times are measured using the HFRCO at 19 MHz. Table 4.10. Wake Up, Entry, and Exit times Parameter Symbol Test Condition WakeupTime from EM1 tEM1_WU WakeupTime from EM2 WakupTime from EM3 tEM2_WU tEM3_WU Min Typ Max Unit Code execution from flash — 3 — AHB Clocks Code execution from RAM — 1.42 — µs Code execution from flash, No Voltage Scaling — 13.22 — µs Code execution from RAM, No Voltage Scaling — 5.15 — µs Voltage scaling up one level1 — 37.89 — µs Voltage scaling up two levels2 — 50.56 — µs Code execution from flash, No Voltage Scaling — 13.21 — µs Code execution from RAM, No Voltage Scaling — 5.15 — µs Voltage scaling up one level1 — 37.90 — µs Voltage scaling up two levels2 — 50.55 — µs WakeupTime from EM4 tEM4_WU Code execution from flash — 8.81 — ms Entry time to EM1 tEM1_ENT Code execution from flash — 1.29 — µs Entry time to EM2 tEM2_ENT Code execution from flash — 5.23 — µs Entry time to EM3 tEM3_ENT Code execution from flash — 5.23 — µs Entry time to EM4 tEM4_ENT Code execution from flash — 9.96 — µs Voltage scaling in time in EM03 tSCALE Up from VSCALE1 to VSCALE2 — 32 — µs Down from VSCALE2 to VSCALE1 — 172 — µs Note: 1. Voltage scaling one level is between VSCALE0 and VSCALE1 or between VSCALE1 and VSCALE2. 2. Voltage scaling two levels is between VSCALE0 and VSCALE2. 3. During voltage scaling in EM0, RAM is inaccessible and processor will be halted until complete. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 34 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.9 RFSENSE Low-energy Wake-on-RF Table 4.11. RFSENSE Low-energy Wake-on-RF Parameter Symbol Test Condition Min Typ Max Unit Average current IRFSENSE RF energy below wake threshold — 138 — nA Selective mode, RF energy above threshold but no OOK sync detected — 131 — nA RF level above which THRESTRIG RFSENSE will detect signal1 Threshold set to -34 dBm -28 — — dBm Threshold set to -22 dBm -19 — — dBm RF level below which THRESNOTRIG RFSENSE will not detect signal1 Threshold set to -34 dBm — — -40 dBm Threshold set to -22 dBm — — -26 dBm Sensitivity in selective OOK mode1 Sensitivity for > 90% probability of OOK detection2, threshold set to -34 dBm -28 — — dBm Sensitivity for > 90% probability of OOK detection2, threshold set to -22 dBm -19 — — dBm SENSOOK Note: 1. Values collected with conducted measurements performed at the end of the matching network. 2. Selective wake signal is 1 kHz OOK Manchester-coded, 8 bits of preamble, 32-bit sync word. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 35 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10 2.4 GHz RF Transceiver Characteristics 4.10.1 RF Transmitter Characteristics 4.10.1.1 RF Transmitter General Characteristics for the 2.4 GHz Band Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Table 4.12. RF Transmitter General Characteristics for the 2.4 GHz Band Parameter Symbol RF tuning frequency range FRANGE Min Typ Max Unit 2400 — 2483.5 MHz f = 2.4 GHz, CW, 0 dBm PA, 0 dBm output power — 3.4 — mA f = 2.4 GHz, CW, 6 dBm PA, 6 dBm output power — 7.5 — mA 6 dBm PA3 — 6 — dBm 0 dBm PA — 0 — dBm 6 dBm PA — -27 — dBm 0 dBm PA — -28 — dBm 6 dBm PA output power, using DCDC with VREGVDD swept from 1.8 to 3.0 V — 0.04 — dB 0 dBm PA output power, using DCDC with VREGVDD swept from 1.8 to 3.0 V — 0.03 — dB 6 dBm PA at 6 dBm, (-40 to +125 °C) — 0.18 — dB 0 dBm PA at 0 dBm, (-40 to +125 °C) — 1.4 — dB 6 dBm PA at 6 dBm, (-40 to +85 °C) — 0.17 — dB 0 dBm PA at 0 dBm, (-40 to +85 °C) — 1.0 — dB Output power variation vs RF POUTVAR_F frequency 6 dBm PA, 6 dBm — 0.20 — dB 0 dBm PA, 0 dBm — 0.19 — dB Spurious emissions of harmonics in restricted bands per FCC Part 15.205/15.209 Continuous transmission of CW carrier, Pout = POUTMAX, Test Frequency = 2450 MHz. — -47 — dBm Radio-only current consump- ITX_RADIO tion while transmitting1 Maximum TX power2 Minimum active TX power Output power variation vs supply voltage variation, frequency = 2450 MHz Output power variation vs temperature, Frequency = 2450 MHz POUTMAX POUTMIN POUTVAR_V POUTVAR_T SPURHRM_FCC_ R silabs.com | Building a more connected world. Test Condition Preliminary Rev. 0.5 | 36 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit Spurious emissions out-ofband (above 2.483 GHz or below 2.4 GHz) in restricted bands, per FCC part 15.205/15.209 SPUROOB_FCC_ Restricted bands 30-88 MHz, Continuous transmission of CW carrier, Pout = POUTMAX, Test Frequency = 2450 MHz — -47 — dBm Restricted bands 88 - 216 MHz, Continuous transmission of CW carrier, Pout = POUTMAX, Test Frequency = 2450 MHz — -47 — dBm Restricted bands 216 - 960 MHz, Continuous transmission of CW carrier, Pout = POUTMAX, Test Frequency = 2450 MHz — -47 — dBm Restricted bands > 960 MHz, Continuous transmission of CW carrier, Pout = POUTMAX, Test Frequency = 2450 MHz — -47 — dBm Spurious emissions out-ofSPUROOB_FCC_ band in non-restricted bands NR per FCC Part 15.247 Frequencies above 2.483 GHz or below 2.4 GHz, continuous transmission CW carrier, Pout = POUTMAX, Test Frequency = 2450 MHz — -26 — dBc Spurious emissions per ETSI SPURETSI440 EN300.440 47-74 MHz,87.5-108 MHz, 174-230 MHz, 470-862 MHz, Pout = POUTMAX, Test Frequency = 2450 MHz — -60 — dBm 25-1000 MHz, excluding above frequencies. Pout = POUTMAX, Test Frequency = 2450 MHz — -42 — dBm 1G-14G, Pout = POUTMAX, Test Frequency = 2450 MHz — -36 — dBm [2400-2BW to 2400-BW], [2483.5+BW to 2483.5+2BW], Pout = POUTMAX, Test Frequency = 2450 MHz — -26 — dBm 47-74 MHz, 87.5-118 MHz, 174-230 MHz, 470-862 MHz, Pout = POUTMAX, Test Frequency = 2450 MHz — -60 — dBm 30-47 MHz, 74-87.5 MHz, 118-174 MHz, 230-470 MHz, 862-1000 MHz , Pout = POUTMAX, Test Frequency = 2450 MHz — -42 — dBm 1G-12.75 GHz, excluding bands listed above, Pout = POUTMAX, Test Frequency = 2450 MHz — -36 — dBm [2400-BW to 2400], [2483.5 to 2483.5+BW] Pout = POUTMAX, Test Frequency = 2450 MHz — -16 — dBm Spurious emissions out-ofband, per ETSI 300.328 R SPURETSI328 silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 37 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit Note: 1. Supply current to radio, supplied by DC-DC with 3.0 V, measured at VREGVDD. 2. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices covered in this data sheet can be found in the Max TX Power column of the Ordering Information Table. 3. The PA is capable of delivering higher than 6 dBm output power (see Figure 4.9 Transmitter Output Power on page 71. However, all transmitter characteristics and recommended application circuits are specified at 6 dBm output. If used with the recommended application circuits above 6 dBm, harmonics may be higher than regulatory limits. 4.10.1.2 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Table 4.13. RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Parameter Symbol Test Condition Error vector magnitude per 802.15.4-2011 EVM Power spectral density limit PSDLIMIT Occupied channel bandwidth OCPETSI328 per ETSI EN300.328 silabs.com | Building a more connected world. Min Typ Max Unit Average across frequency, signal is DSSS-OQPSK reference packet, Pout = 6 dBm — 3.0 — % rms Average across frequency, signal is DSSS-OQPSK reference packet, Pout = 0 dBm — 3.0 — % rms Relative, at carrier ± 3.5 MHz, Pout = 6 dBm — -50.7 — dBc/ 100kHz Relative, at carrier ± 3.5 MHz, Pout = 0 dBm — -50.8 — dBc/ 100kHz Absolute, at carrier ± 3.5 MHz, Pout = 6 dBm — -52.5 — dBm/ 100kHz Absolute, at carrier ± 3.5 MHz, Pout = 0 dBm — -58.3 — dBm/ 100kHz Per FCC part 15.247, Pout = 6 dBm — -1.4 — dBm/ 3kHz Per FCC part 15.247, Pout = 0 dBm — -7.4 — dBm/ 3kHz ETSI 300.328 Pout = 6 dBm — 5.6 — dBm ETSI 300.328 Pout = 0 dbm — -1.0 — dBm 99% BW at highest and lowest channels in band, Pout = 6 dBm — 2.2 — MHz 99% BW at highest and lowest channels in band, Pout = 0 dBm — 2.2 — MHz Preliminary Rev. 0.5 | 38 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.1.3 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Table 4.14. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate Parameter Symbol Test Condition Transmit 6 dB bandwidth TXBW Power spectral density limit PSDLIMIT Occupied channel bandwidth OCPETSI328 per ETSI EN300.328 In-band spurious emissions, with allowed exceptions1 SPURINB Min Typ Max Unit Pout = 6 dBm — 630 — kHz Pout = 0 dBm — 640 — kHz Pout = 6 dBm, Per FCC part 15.247 at 6 dBm — 2.9 — dBm/ 3kHz Pout = 0 dBm, Per FCC part 15.247 at 0 dBm — -3.2 — dBm/ 3kHz Per ETSI 300.328 at 10 dBm/1 MHz — 7.1 — dBm Pout = 6 dBm 99% BW at highest and lowest channels in band — 1.1 — MHz Pout = 0 dBm 99% BW at highest and lowest channels in band — 1.1 — MHz Pout = 6 dbm, Inband spurs at ± 2 MHz — -41 — dBm Pout = 0 dbm, Inband spurs at ± 2 MHz — -48 — dBm Pout = 6 dBm Inband spurs at ± 3 MHz — -47 — dBm Pout = 0dbm Inband spurs at ± 3 MHz — -54 — dBm Note: 1. Per Bluetooth Core_5.1, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 39 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.1.4 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Table 4.15. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate Parameter Symbol Test Condition Transmit 6 dB bandwidth TXBW Power spectral density limit PSDLIMIT Occupied channel bandwidth OCPETSI328 per ETSI EN300.328 In-band spurious emissions, with allowed exceptions1 SPURINB Min Typ Max Unit Pout = 6 dBm — 1250 — kHz Pout = 0 dBm — 1220 — kHz Pout = 6 dBm, Per FCC part 15.247 at 6 dBm — 0.5 — dBm/ 3kHz Pout = 0 dBm, Per FCC part 15.247 at 0 dBm — -5.7 — dBm/ 3kHz Per ETSI 300.328 at 10 dBm/1 MHz — 6.3 — dBm Pout = 6 dBm 99% BW at highest and lowest channels in band — 2.1 — MHz Pout = 0 dBm 99% BW at highest and lowest channels in band — 2.1 — MHz Pout = 6 dbm, Inband spurs at ± 4 MHz — -41 — dBm Pout = 0 dBm, Inband spurs at ± 4 MHz — -47 — dBm Pout = 6 dBm Inband spurs at ± 6 MHz — -46 — dBm Pout = 0 dbm Inband spurs at ± 6 MHz — -53 — dBm Note: 1. Per Bluetooth Core_5.1, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 40 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.1.5 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Table 4.16. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate Parameter Symbol Test Condition Transmit 6 dB bandwidth TXBW Power spectral density limit PSDLIMIT Occupied channel bandwidth OCPETSI328 per ETSI EN300.328 In-band spurious emissions, with allowed exceptions1 SPURINB Min Typ Max Unit Pout = 6 dBm — 640 — kHz Pout = 0 dBm — 650 — kHz Pout = 6 dBm, Per FCC part 15.247 at 6 dBm — 2.8 — dBm/ 3kHz Pout = 0 dBm, Per FCC part 15.247 at 0 dBm — -3.5 — dBm/ 3kHz Per ETSI 300.328 at 10 dBm/1 MHz — 7.1 — dBm Pout = 6 dBm 99% BW at highest and lowest channels in band — 1.1 — MHz Pout = 0 dBm 99% BW at highest and lowest channels in band — 1.1 — MHz Pout = 6 dbm, Inband spurs at ± 2 MHz — -41 — dBm Pout = 0 dbm, Inband spurs at ± 2 MHz — -48 — dBm Pout = 6 dBm Inband spurs at ± 3 MHz — -47 — dBm Pout = 0dbm Inband spurs at ± 3 MHz — -54 — dBm Note: 1. Per Bluetooth Core_5.1, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 41 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.1.6 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Table 4.17. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate Parameter Symbol Test Condition Transmit 6 dB bandwidth TXBW Power spectral density limit PSDLIMIT Occupied channel bandwidth OCPETSI328 per ETSI EN300.328 In-band spurious emissions, with allowed exceptions1 SPURINB Min Typ Max Unit Pout = 6 dBm — 600 — kHz Pout = 0 dBm — 600 — kHz Pout = 6 dBm, Per FCC part 15.247 at 6 dBm — 2.0 — dBm/ 3kHz Pout = 0 dBm, Per FCC part 15.247 at 0 dBm — -4.2 — dBm/ 3kHz Per ETSI 300.328 at 10 dBm/1 MHz — 7.1 — dBm Pout = 6 dBm 99% BW at highest and lowest channels in band — 1.1 — MHz Pout = 0 dBm 99% BW at highest and lowest channels in band — 1.1 — MHz Pout = 6 dbm, Inband spurs at ± 2 MHz — -41 — dBm Pout = 0 dbm, Inband spurs at ± 2 MHz — -47 — dBm Pout = 6 dBm Inband spurs at ± 3 MHz — -47 — dBm Pout = 0dbm Inband spurs at ± 3 MHz — -54 — dBm Note: 1. Per Bluetooth Core_5.1, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 42 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.2 RF Receiver Characteristics 4.10.2.1 RF Receiver General Characteristics for the 2.4 GHz Band Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Table 4.18. RF Receiver General Characteristics for the 2.4 GHz Band Parameter Symbol RF tuning frequency range FRANGE Test Condition Min Typ Max Unit 2400 — 2483.5 MHz — 2.5 — mA 30 MHz to 1 GHz — -63 — dBm 1 GHz to 12 GHz — -53 — dBm Max spurious emissions dur- SPURRX_FCC ing active receive mode, per FCC Part 15.109(a) 216 MHz to 960 MHz, conducted measurement — -47 — dBm Above 960 MHz, conducted measurement. — -47 — dBm 2GFSK Sensitivity 2 Mbps 2GFSK signal, 1% PER — -93 — dBm 250 kbps 2GFSK signal, 0.1% BER — -104 — dBm Radio-only current consump- IRX_RADIO tion in receive mode1 Receive mode maximum spurious emission SPURRX SENS2GFSK Note: 1. Supply current to radio, supplied by DC-DC with 3.0 V, measured at VREGVDD. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 43 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.2.2 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Table 4.19. RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level, 1% PER SAT Signal is reference signal1. Packet length is 20 octets — 10 — dBm Sensitivity, 1% PER SENS Signal is reference signal. Packet length is 20 octets — -102.3 — dBm Co-channel interferer rejection, 1% PER CCR Desired signal 3 dB above sensitivity limit — -1.7 — dB High-side adjacent channel rejection, 1% PER. Desired is reference signal at 3 dB above reference sensitivity level2 ACRP1 Interferer is reference signal at +1 channel-spacing — 34.9 — dB Low-side adjacent channel rejection, 1% PER. Desired is reference signal at 3 dB above reference sensitivity level2 ACRM1 Interferer is reference signal at -1 channel-spacing — 34.8 — dB Alternate channel rejection, 1% PER. Desired is reference signal at 3 dB above reference sensitivity level2 ACR2 Interferer is reference signal at ± 2 channel-spacing — 47.1 — dB Image rejection , 1% PER. IR Desired is reference signal at 3 dB above reference sensitivity level2 Interferer is CW in image band3 — 34.1 — dB Blocking rejection of all other BLOCK channels, 1% PER. Desired is reference signal at 3 dB above reference sensitivity level2. Interferer is reference signal Interferer frequency < Desired frequency - 3 channel-spacing — 53.2 — dB Interferer frequency > Desired frequency + 3 channel-spacing — 53.1 — dB RSSI resolution RSSIRES -100 dBm to +5 dBm — 0.25 — dB RSSI accuracy in the linear region as defined by 802.15.4-2003 RSSILIN — +/-6 — dB Note: 1. Reference signal is defined as O-QPSK DSSS per 802.15.4, Frequency range = 2400-2483.5 MHz, Symbol rate = 62.5 ksymbols/s. 2. Reference sensitivity level is -85 dBm. 3. Due to low-IF frequency, there is some overlap of adjacent channel and image channel bands. Adjacent channel CW blocker tests place the Interferer center frequency at the Desired frequency ± 5 MHz on the channel raster, whereas the image rejection test places the CW interferer near the image frequency of the Desired signal carrier, regardless of the channel raster. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 44 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.2.3 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz, Packet length is 255 bytes. Table 4.20. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -98.9 — dBm Signal is reference signal, 255 byte payload1 — -97.4 — dBm With non-ideal signals2 1 — -96.9 — dBm Signal to co-channel interfer- C/ICC er (see notes)1 3 — 8.7 — dB N ± 1 Adjacent channel selectivity Interferer is reference signal at +1 MHz offset1 4 3 5 — -6.6 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -6.5 — dB Interferer is reference signal at +2 MHz offset1 4 3 5 — -40.9 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -39.9 — dB Interferer is reference signal at +3 MHz offset1 4 3 5 — -45.9 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -46.2 — dB N ± 2 Alternate channel selectivity N ± 3 Alternate channel selectivity C/I1 C/I2 C/I3 Selectivity to image frequency C/IIM Interferer is reference signal at image frequency with 1 MHz precision1 5 — -23.5 — dB Selectivity to image frequency ± 1 MHz C/IIM_1 Interferer is reference signal at image frequency +1 MHz with 1 MHz precision1 5 — -40.9 — dB Interferer is reference signal at image frequency -1 MHz with 1 MHz precision1 5 — -6.6 — dB n = 3 (see note6) — -17.1 — dBm Intermodulation performance IM Note: 1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -67 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 45 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.2.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz, Packet length is 255 bytes. Table 4.21. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -96.2 — dBm Signal is reference signal, 255 byte payload1 — -94.6 — dBm With non-ideal signals2 1 — -94.4 — dBm Signal to co-channel interfer- C/ICC er (see notes)1 3 — 8.8 — dB N ± 1 Adjacent channel selectivity Interferer is reference signal at +2 MHz offset1 4 3 5 — -9.2 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -6.6 — dB Interferer is reference signal at +4 MHz offset1 4 3 5 — -43.3 — dB Interferer is reference signal at -4 MHz offset1 4 3 5 — -44.0 — dB Interferer is reference signal at +6 MHz offset1 4 3 5 — -48.6 — dB Interferer is reference signal at -6 MHz offset1 4 3 5 — -50.7 — dB N ± 2 Alternate channel selectivity N ± 3 Alternate channel selectivity C/I1 C/I2 C/I3 Selectivity to image frequency C/IIM Interferer is reference signal at image frequency with 1 MHz precision1 5 — -23.8 — dB Selectivity to image frequency ± 2 MHz C/IIM_1 Interferer is reference signal at image frequency +2 MHz with 1 MHz precision1 5 — -43.3 — dB Interferer is reference signal at image frequency -2 MHz with 1 MHz precision1 5 — -9.2 — dB n = 3 (see note6) — -18.8 — dBm Intermodulation performance IM Note: 1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -64 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 46 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.2.5 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz, Packet length is 255 bytes. Table 4.22. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -102.5 — dBm Signal is reference signal, 255 byte payload1 — -101.2 — dBm With non-ideal signals2 1 — -100.2 — dBm Signal to co-channel interfer- C/ICC er (see notes)1 3 — 2.7 — dB N ± 1 Adjacent channel selectivity Interferer is reference signal at +1 MHz offset1 4 3 5 — -8.0 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -7.9 — dB Interferer is reference signal at +2 MHz offset1 4 3 5 — -46.5 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -49.9 — dB Interferer is reference signal at +3 MHz offset1 4 3 5 — -48.9 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -53.8 — dB N ± 2 Alternate channel selectivity N ± 3 Alternate channel selectivity C/I1 C/I2 C/I3 Selectivity to image frequency C/IIM Interferer is reference signal at image frequency with 1 MHz precision1 5 — -48.3 — dB Selectivity to image frequency ± 1 MHz C/IIM_1 Interferer is reference signal at image frequency +1 MHz with 1 MHz precision1 5 — -49.9 — dB Interferer is reference signal at image frequency -1 MHz with 1 MHz precision1 5 — -46.5 — dB Note: 1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -72 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 47 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.10.2.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz, Packet length is 255 bytes. Table 4.23. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -106.7 — dBm Signal is reference signal, 255 byte payload1 — -106.4 — dBm With non-ideal signals2 1 — -105.8 — dBm Signal to co-channel interfer- C/ICC er (see notes)1 3 — 0.9 — dB N ± 1 Adjacent channel selectivity Interferer is reference signal at +1 MHz offset1 4 3 5 — -13.6 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -13.4 — dB Interferer is reference signal at +2 MHz offset1 4 3 5 — -52.6 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -55.8 — dB Interferer is reference signal at +3 MHz offset1 4 3 5 — -53.7 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -59.0 — dB N ± 2 Alternate channel selectivity N ± 3 Alternate channel selectivity C/I1 C/I2 C/I3 Selectivity to image frequency C/IIM Interferer is reference signal at image frequency with 1 MHz precision1 5 — -52.7 — dB Selectivity to image frequency ± 1 MHz C/IIM_1 Interferer is reference signal at image frequency +1 MHz with 1 MHz precision1 5 — -53.7 — dB Interferer is reference signal at image frequency -1 MHz with 1 MHz precision1 5 — -52.6 — dB Note: 1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -79 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 48 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.11 Oscillators 4.11.1 High Frequency Crystal Oscillator Unless otherwise indicated, typical conditions are: AVDD = DVDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation, operating supply voltage range, and operating temperature range. Table 4.24. High Frequency Crystal Oscillator Parameter Symbol Test Condition Min Typ Max Unit Crystal Frequency FHFXO see note1 2 — 38.4 — MHz Supported crystal equivalent series resistance (ESR) ESRHFXO_38M4 38.4 MHz, CL = 10 pF3 4 — 40 TBD Ω Supported range of crystal load capacitance5 CHFXO_LC 38.4 MHz, ESR = 40 Ohm4 — 10 — pF Supply Current IHFXO — 415 — µA Startup Time TSTARTUP — 160 — µs On-chip tuning cap step size6 SSHFXO — 0.04 — pF 38.4 MHz, ESR = 40 Ohm, CL = 10 pF Note: 1. The BLE radio requires a 38.4 MHz crystal with a tolerance of ± 50 ppm over temperature and aging. Please use the recommended crystal. 2. The ZigBee radio requires a 38.4 MHz crystal with a tolerance of ± 40 ppm over temperature and aging. Please use the recommended crystal. 3. The crystal should have a maximum ESR less than or equal to this maximum rating. 4. RF performance characteristics have been determined using crystals with an ESR of 40 Ω and CL of 10 pF. 5. Total load capacitance as seen by the crystal. 6. The tuning step size is the effective step size when incrementing one of the tuning capacitors by one count. The step size for the each of the indivdual tuning capacitors is twice this value. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 49 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.11.2 Low Frequency Crystal Oscillator Table 4.25. Low Frequency Crystal Oscillator Parameter Symbol Crystal Frequency FLFXO Test Condition Min Typ Max Unit — 32.768 — kHz Supported Crystal equivalent ESRLFXO series resistance (ESR) GAIN = 0 — — 80 kΩ GAIN = 1 to 3 — — 100 kΩ Supported range of crystal load capacitance 1 GAIN = 0 4 — 6 pF GAIN = 1 6 — 10 pF GAIN = 2 10 — 12.5 pF 12.5 — 18 pF CLFXO_CL GAIN = 3 (see note2) Current consumption ICL12p5 ESR = 70 kOhm, CL = 12.5 pF, GAIN3 = 2, AGC4 = 1 — 357 — nA Startup Time TSTARTUP ESR = 70 kOhm, CL = 7 pF, GAIN3 = 1, AGC4 = 1 — 63 — ms On-chip tuning cap step size SSLFXO — 0.26 — pF On-chip tuning capacitor val- CLFXO_MIN ue at minimum setting5 CAPTUNE = 0 — 4 — pF On-chip tuning capacitor val- CLFXO_MAX ue at maximum setting5 CAPTUNE = 0x4F — 24.5 — pF Note: 1. Total load capacitance seen by the crystal 2. Crystals with a load capacitance of greater than 12 pF require external load capacitors. 3. In LFXO_CAL Register 4. In LFXO_CFG Register 5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two caps will be seen in series by the crystal silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 50 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.11.3 High Frequency RC Oscillator (HFRCO) Unless otherwise indicated, typical conditions are: AVDD = DVDD = 3.0 V. TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation, operating supply voltage range, and operating temperature range. Table 4.26. High Frequency RC Oscillator (HFRCO) Parameter Symbol Test Condition Frequency Accuracy FHFRCO_ACC Current consumption on all supplies 1 IHFRCO Clock out current for HFRCODPLL2 Startup Time3 Min Typ Max Unit For all production calibrated frequencies -3 — 3 % FHFRCO = 1 MHz — 28 — µA FHFRCO = 2 MHz — 28 — µA FHFRCO = 4 MHz — 28 — µA FHFRCO = 5 MHz — 30 — µA FHFRCO = 7 MHz — 60 — µA FHFRCO = 10 MHz — 66 — µA FHFRCO = 13 MHz — 79 — µA FHFRCO = 16 MHz — 88 — µA FHFRCO = 19 MHz — 92 — µA FHFRCO = 20 MHz — 105 — µA FHFRCO = 26 MHz — 118 — µA FHFRCO = 32 MHz — 141 — µA FHFRCO = 38 MHz — 172 — µA FHFRCO = 80 MHz — 289 — µA ICLKOUT_HFRCOD FORECEEN bit of CTRL = 1 and the CLKOUTDIS0 bit of TEST = 1. PLL — 2.72 — µA/MHz FORECEEN bit of CTRL i= 1 and the CLKOUTDIS1 bit of TEST = 1. — 0.36 — µA/MHz FREQRANGE = 0 to 7 — 1.2 — µs FREQRANGE = 8 to 15 — 0.6 — µs TSTARTUP silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 51 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit Band Frequency Limits4 fHFRCO_BAND FREQRANGE = 0 3.71 — 5.24 MHz FREQRANGE = 1 4.39 — 6.26 MHz FREQRANGE = 2 5.25 — 7.55 MHz FREQRANGE = 3 6.22 — 9.01 MHz FREQRANGE = 4 7.88 — 11.6 MHz FREQRANGE = 5 9.9 — 14.6 MHz FREQRANGE = 6 11.5 — 17.0 MHz FREQRANGE = 7 14.1 — 20.9 MHz FREQRANGE = 8 16.4 — 24.7 MHz FREQRANGE = 9 19.8 — 30.4 MHz FREQRANGE = 10 22.7 — 34.9 MHz FREQRANGE = 11 28.6 — 44.4 MHz FREQRANGE = 12 33.0 — 51.0 MHz FREQRANGE = 13 42.2 — 64.6 MHz FREQRANGE = 14 48.8 — 74.8 MHz FREQRANGE = 15 57.6 — 87.4 MHz Note: 1. Does not include additional clock tree current. See specifications for additional current when selected as a clock source for a particular clock multiplexer. 2. When the HFRCO is enabled for characterization using the FORCEEN bit, the total current will be the HFRCO core current plus the specified CLKOUT current. When the HFRCO is enabled on demand, the clock current may be different. 3. Hardware delay ensures settling to within ± 0.5%. Hardware also enforces this delay on a band change. 4. The frequency band limits represent the lowest and highest freqeuncy which each band can achieve over the operating range. 4.11.4 Fast Start_Up RC Oscillator (FSRCO) Table 4.27. Fast Start_Up RC Oscillator (FSRCO) Parameter Symbol FSRCO frequency FFSRCO silabs.com | Building a more connected world. Test Condition Min Typ Max Unit 17.2 20 21.2 MHz Preliminary Rev. 0.5 | 52 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.11.5 Precision Low Frequency RC Oscillator (LFRCO) Table 4.28. Precision Low Frequency RC Oscillator (LFRCO) Parameter Symbol Test Condition Nominal oscillation frequency FLFRCO Frequency accuracy FLFRCO_ACC Min Typ Max Unit — 32.768 — kHz -3 — 3 % -500 — 500 ppm Normal mode — 204 — µs Precision mode1 — 11.7 — ms Normal mode — 175 — nA Precision mode1, T = stable at 25 °C 3 — 655 — nA Normal mode Precision mode1, across operating temperature range2 Startup time Current consumption tSTARTUP ILFRCO Note: 1. The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4. 2. Includes ± 40 ppm frequency tolerance of the HFXO crystal. 3. Includes periodic re-calibration against HFXO crystal oscillator. 4.11.6 Ultra Low Frequency RC Oscillator Table 4.29. Ultra Low Frequency RC Oscillator Parameter Symbol Oscillation Frequency FULFRCO silabs.com | Building a more connected world. Test Condition Min Typ Max Unit 0.944 1.0 1.095 kHz Preliminary Rev. 0.5 | 53 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.12 GPIO Pins (3V GPIO pins) Table 4.30. GPIO Pins (3V GPIO pins) Parameter Symbol Test Condition Leakage current ILEAK_IO Input low voltage1 Input high voltage1 Output high voltage Output low voltage GPIO rise time GPIO fall time Pull up/down resistance2 VIL VIH VOH VOL TGPIO_RISE TGPIO_FALL RPULL Maximum filtered glitch width TGF silabs.com | Building a more connected world. Min Typ Max Unit MODEx = DISABLED, IOVDD = 1.71 V — 1.9 — nA MODEx = DISABLED, IOVDD = 3.0 V — 2.5 — nA MODEx = DISABLED, IOVDD = 3.8 V TA = 85 °C — — TBD nA Pins other than PA00, PA03, PB00, PC03, PC04 and PD00; MODEx = DISABLED, IOVDD = 3.8 V TA = 125 °C — — 200 nA Pins PA00, PA03, PB00, PC03, PC04 and PD00; MODEx = DISABLED, IOVDD = 3.8 V TA = 125 °C — — 400 nA Any GPIO pin — — 0.3*IOVDD V RESETn — — 0.3*DVDD V Any GPIO pin 0.7*IOVDD — — V RESETn 0.7*DVDD — — V Sourcing 20mA, IOVDD = 3.0 V 0.8 * IOVDD — — V Sourcing 8mA, IOVDD = 1.71 V 0.6 * IOVDD — — V Sinking 20mA, IOVDD = 3.0 V — — 0.2 * IOVDD V Sinking 8mA, IOVDD = 1.71 V — — 0.4 * IOVDD V IOVDD = 3.0 V, Cload = 50pF, SLEWRATE = 4, 10% to 90% — 8.4 — ns IOVDD = 1.71 V, Cload = 50pF, SLEWRATE = 4, 10% to 90% — 13 — ns IOVDD = 3.0 V, Cload = 50pF, SLEWRATE = 4, 90% to 10% — 7.1 — ns IOVDD = 1.71 V, Cload = 50pF, SLEWRATE = 4, 90% to 10% — 11.9 — ns Any GPIO pin. Pull-up to IOVDD: MODEn = DISABLE DOUT=1. Pull-down to VSS: MODEn = WIREDORPULLDOWN DOUT = 0. 35 44 55 kΩ RESETn pin. Pull-up to DVDD 35 44 55 kΩ MODE = INPUT, DOUT = 1 — 27 — ns Preliminary Rev. 0.5 | 54 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit Note: 1. GPIO input thresholds are proportional to the IOVDD pin. RESETn input thresholds are proportional to DVDD. 2. GPIO pull-ups connect to IOVDD supply, pull-downs connect to VSS. RESETn pull-up connects to DVDD. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 55 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.13 Analog to Digital Converter (IADC) Specified at 1 Msps, ADCCLK = 10 MHz, OSR=2, unless otherwise indicated. Table 4.31. Analog to Digital Converter (IADC) Parameter Symbol Test Condition Min Typ Max Unit Main analog supply VAVDD Normal Mode 1.71 — 3.8 V Maximum Input Range VIN_MAX Maximum allowable input voltage 0 — AVDD V Full-Scale Voltage VFS Voltage required for Full-Scale measurement — VREF / Gain — Input Measurement Range VIN Differential Mode - Plus and Minus inputs -VFS — +VFS V Single Ended Mode - One input tied to ground 0 — VFS V Analog Gain = 1x — 1.8 — pF Analog Gain = 2x — 3.6 — pF Analog Gain = 4x — 7.2 — pF Analog Gain = 0.5x — 0.9 — pF Input Sampling Capacitance Cs ADC clock frequency fCLK Normal Mode — — 10 MHz Throughput rate fSAMPLE fCLK = 10 MHz — — 1 Msps Current from all supplies, Continuous operation IADC_CONT Normal Mode, 1 Msps, OSR=2, fCLK = 10 MHz — 290 385 µA Current in Standby mode. ISTBY ADC is not functional but can wake up in 1us. Normal Mode — 16 — µA ADC Startup Time From power down state — 5 — µs From Standby state — 1 — µs — 12 — bits -1 +/- 0.25 1.5 LSB12 tstartup ADC Resolution Resolution Differential Nonlinearity DNL Differential Input. (No missing codes OSR =2 Integral Nonlinearity INL Normal Mode. Differential Input. -2.5 +/- 0.65 2.5 LSB12 Effective number of bits ENOB Differential Input. Gain=1x, fIN = 10 kHz, Internal VREF=1.21V. OSR=2 10.5 11.18 — bits Signal to Noise + Distortion Ratio Normal Mode SNDR Differential Input. Gain=1x, fIN = 10 kHz, Internal VREF=1.21V 65 69.1 — dB Differential Input. Gain=2x, fIN = 10 kHz, Internal VREF=1.21V — 68.8 — dB Differential Input. Gain=4x, fIN = 10 kHz, Internal VREF=1.21V — 66.9 — dB Differential Input. Gain=0.5x, fIN = 10 kHz, Internal VREF=1.21V — 69.2 — dB Differential Input. Gain=1x, fIN = 10 kHz, Internal VREF=1.21V — -80.3 -70 dB Total Harmonic Distortion THD silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 56 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Parameter Symbol Test Condition Spurious-Free Dynamic Range SFDR Common Mode Rejection Ratio CMRR Power Supply Rejection Ratio PSRR Gain Error Offset GE OFFSET Min Typ Max Unit Differential Input. Gain=1x, fIN = 10 kHz, Internal VREF=1.21V 72 86.5 — dB Normal Mode. DC to 100 Hz — 87.0 — dB Normal Mode. AC high frequency — 68.6 — dB Normal mode. DC to 100 Hz — 80.4 — dB Normal mode. AC high frequency, using VREF pad. — 33.4 — dB Normal mode. AC high frequency, using internal VBGR. — 65.2 — dB GAIN=1 and 0.5, using external VREF, direct mode. -0.3 0.069 0.3 % GAIN=2, using external VREF, direct mode. -0.4 0.151 0.4 % GAIN=3, using external VREF, direct mode. -0.7 0.186 0.7 % GAIN=4, using external VREF, direct mode. -1.1 0.227 1.1 % Internal VREF, Gain = 1 — 0.023 — % GAIN=1 and 0.5, Differential Input -3 0.27 3 LSB GAIN=2, Differential Input -4 0.27 4 LSB GAIN=3, Differential Input -4 0.25 4 LSB GAIN=4, Differential Input -4 0.29 4 LSB External reference voltage range VEVREF 1.0 — AVDD V Internal Reference voltage VIVREF — 1.21 — V silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 57 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.14 Temperature Sense Table 4.32. Temperature Sense Parameter Symbol Temperature sensor range1 Test Condition Min Typ Max Unit TRANGE -40 — 125 °C Temperature sensor resolution TRESOLUTION — 0.25 — °C Measurement noise (RMS) TNOISE Single measurement — 0.6 — °C 16-sample average (TEMPAVGNUM = 0) — 0.17 — °C 64-sample average (TEMPAVGNUM = 1) — 0.12 — °C Temperature offset TOFF Mean error of uncorrected output across full temperature range — 3.14 — °C Temperature sensor accuracy2 3 TACC Direct output accuracy after mean error (TOFF) removed TBD +/-3 TBD °C After linearization in software, no calibration TBD +/-2.2 TBD °C After linearization in software, with single-temperature calibration at 25 °C4 TBD +/-1.5 TBD °C — 250 — ms Measurement interval tMEAS Note: 1. The sensor reports absolute die temperature in °K. All specifications are in °C to match the units of the specified product temperaure range. 2. Error is measured as the deviation of the mean temperature reading from the expected die temperature. Accuracy numbers represent statistical minimum and maximum using ± 4 standard deviations of measured error. 3. The raw output of the temperature sensor is a predictable curve. It can be linearized with a polynomial function for additional accuracy. 4. Assuming calibration accuracy of ± 0.25 °C. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 58 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.15 Brown Out Detectors 4.15.1 DVDD BOD BOD Thresholds on DVDD in EM0 and EM1 only, unless otherwise noted. Typical conditions are at TA = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation, operating supply voltage range, and operating temperature range. Table 4.33. DVDD BOD Parameter Symbol Test Condition BOD threshold VDVVD_BOD BOD response time tDVDD_BOD_DELAY BOD hysteresis Min Typ Max Unit Supply Rising — 1.64 1.71 V Supply Falling 1.62 1.65 — V — 0.95 — µs — 20 — mV Supply dropping at 100mV/µs slew rate1 VDVDD_BOD_HYS T Note: 1. If the supply slew rate exceeds the specified slew rate, the BOD may trip later than expected (at a threshold below the minimum specified threshold), or the BOD may not trip at all (e.g., if the supply ramps down and then back up at a very fast rate) 4.15.2 LE DVDD BOD BOD thresholds on DVDD pin for low energy modes EM2 to EM4, unless otherwise noted. Table 4.34. LE DVDD BOD Parameter Symbol Test Condition Min Typ Max Unit BOD threshold VDVDD_LE_BOD Supply Falling 1.5 — 1.71 V tDVDD_LE_BOD_D Supply dropping at 2mV/µs slew rate1 — 50 — µs — 20 — mV BOD response time ELAY BOD hysteresis VDVDD_LE_BOD_ HYST Note: 1. If the supply slew rate exceeds the specified slew rate, the BOD may trip later than expected (at a threshold below the minimum specified threshold), or the BOD may not trip at all (e.g., if the supply ramps down and then back up at a very fast rate) silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 59 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.15.3 AVDD and IOVDD BODs BOD thresholds for AVDD BOD and IOVDD BOD. Available in all energy modes. Table 4.35. AVDD and IOVDD BODs Parameter Symbol Test Condition Min Typ Max Unit BOD threshold VBOD Supply falling 1.45 — 1.71 V BOD response time tBOD_DELAY Supply dropping at 2mV/µs slew rate1 — 50 — µs BOD hysteresis VBOD_HYST — 20 — mV Note: 1. If the supply slew rate exceeds the specified slew rate, the BOD may trip later than expected (at a threshold below the minimum specified threshold), or the BOD may not trip at all (e.g., if the supply ramps down and then back up at a very fast rate) silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 60 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.16 PDM Timing Specifications PDM Microphone Mode PDM_CLK tISU PDM_DAT0-3 L tIH tISU R tIH L R L PDM Sensor Mode PDM_CLK tISU tIH PDM_DAT0-3 Figure 4.3. PDM Timing Diagrams 4.16.1 Pulse Density Modulator (PDM), Common DBUS Timing specifications are for all PDM signals routed to the same DBUS (DBUSAB or DBUSCD), though routing to the same GPIO port is the optimal configuration. CLOAD < 20 pF. System voltage scaling = VSCALE1 or VSCALE2. All GPIO set to slew rate = 6. Data delay (PDM_CFG1_DLYMUXSEL) = 0. Table 4.36. Pulse Density Modulator (PDM), Common DBUS Parameter Symbol Test Condition Min Typ Max Unit PDM_CLK frequency during data transfer FPDM_CLK Microphone mode — — 5 MHz Sensor mode — — 20 MHz PDM_CLK duty cycle DCPDM_CLK 47.5 — 52.5 % PDM_CLK rise time tR — — 5.5 ns PDM_CLK fall time tF — — 5.5 ns Input setup time tISU Microphone mode 30 — — ns Sensor mode 20 — — ns 3 — — ns Input hold time tIH silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 61 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.17 USART SPI Master Timing CS tCS_MO tSCLK_MO SCLK CLKPOL = 0 tSCLK SCLK CLKPOL = 1 MOSI tSU_MI tH_MI MISO Figure 4.4. SPI Master Timing (SMSDELAY = 0) CS tCS_MO tSCLK_MO SCLK CLKPOL = 0 SCLK tSCLK CLKPOL = 1 MOSI tSU_MI tH_MI MISO Figure 4.5. SPI Master Timing (SMSDELAY = 1) silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 62 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.17.1 SPI Master Timing, Voltage Scaling = VSCALE2 Table 4.37. SPI Master Timing, Voltage Scaling = VSCALE2 Parameter Symbol SCLK period 1 2 3 tSCLK Test Condition Min Typ Max Unit 2*tHFPERCL — — ns -22 — 22.5 ns -14.5 — 14.5 ns IOVDD = 1.62 V 38.5 — — ns IOVDD = 3.0 V 28.5 — — ns -8.5 — — ns Min Typ Max Unit 2*tHFPERCL — — ns K CS to MOSI 1 2 tCS_MO SCLK to MOSI 1 2 tSCLK_MO MISO setup time 1 2 tSU_MI MISO hold time 1 2 tH_MI Note: 1. Applies for both CLKPHA = 0 and CLKPHA = 1 2. Measurement done with 8 pF output loading at 10% and 90% of VDD. 3. tHFPERCLK is one period of the selected HFPERCLK. 4.17.2 SPI Master Timing, Voltage Scaling = VSCALE1 Table 4.38. SPI Master Timing, Voltage Scaling = VSCALE1 Parameter Symbol SCLK period 1 2 3 tSCLK Test Condition K CS to MOSI 1 2 tCS_MO -33 — 34.5 ns SCLK to MOSI 1 2 tSCLK_MO -15 — 26 ns MISO setup time 1 2 tSU_MI IOVDD = 1.62 V 47 — — ns IOVDD = 3.0 V 39 — — ns -9.5 — — ns MISO hold time 1 2 tH_MI Note: 1. Applies for both CLKPHA = 0 and CLKPHA = 1 2. Measurement done with 8 pF output loading at 10% and 90% of VDD. 3. tHFPERCLK is one period of the selected HFPERCLK. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 63 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.18 USART SPI Slave Timing tCS_ACT_MI CS tCS_DIS_MI SCLK CLKPOL = 0 tSCLK_HI SCLK tSU_MO CLKPOL = 1 tSCLK_LO tSCLK tH_MO MOSI tSCLK_MI MISO Figure 4.6. SPI Slave Timing 4.18.1 SPI Slave Timing, Voltage Scaling = VSCALE2 Table 4.39. SPI Slave Timing, Voltage Scaling = VSCALE2 Parameter Symbol SCLK period 1 2 3 tSCLK Test Condition Min Typ Max Unit 6*tHFPERCL — — ns — — ns — — ns K SCLK high time1 2 3 tSCLK_HI 2.5*tHFPER CLK SCLK low time1 2 3 tSCLK_LO 2.5*tHFPER CLK CS active to MISO 1 2 tCS_ACT_MI 25 — 47.5 ns CS disable to MISO 1 2 tCS_DIS_MI 19.5 — 38.5 ns MOSI setup time 1 2 tSU_MO 4.5 — — ns MOSI hold time 1 2 3 tH_MO 5 — — ns SCLK to MISO 1 2 3 tSCLK_MI 22 + 1.5*tHFPER — 33.5 + 2.5*tHFPER ns CLK CLK Note: 1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0). 2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD). 3. tHFPERCLK is one period of the selected HFPERCLK. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 64 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.18.2 SPI Slave Timing, Voltage Scaling = VSCALE1 Table 4.40. SPI Slave Timing, Voltage Scaling = VSCALE1 Parameter Symbol SCLK period 1 2 3 tSCLK Test Condition Min Typ Max Unit 6*tHFPERCL — — ns — — ns — — ns K SCLK high time1 2 3 tSCLK_HI 2.5*tHFPER CLK SCLK low time1 2 3 tSCLK_LO 2.5*tHFPER CLK CS active to MISO 1 2 tCS_ACT_MI 30.5 — 57.5 ns CS disable to MISO 1 2 tCS_DIS_MI 25 — 55 ns MOSI setup time 1 2 tSU_MO 7.5 — — ns MOSI hold time 1 2 3 tH_MO 8.5 — — ns SCLK to MISO 1 2 3 tSCLK_MI 24.5 + 1.5*tHFPER — 45.5 + 2.5*tHFPER ns CLK CLK Note: 1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0). 2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD). 3. tHFPERCLK is one period of the selected HFPERCLK. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 65 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.19 I2C Electrical Specifications 4.19.1 I2C Standard-mode (Sm) CLHR set to 0 in the I2Cn_CTRL register. Table 4.41. I2C Standard-mode (Sm) Parameter Symbol SCL clock frequency1 Test Condition Min Typ Max Unit fSCL 0 — 100 kHz SCL clock low time tLOW 4.7 — — µs SCL clock high time tHIGH 4 — — µs SDA set-up time tSU_DAT 250 — — ns SDA hold time tHD_DAT 0 — — ns Repeated START condition set-up time tSU_STA 4.7 — — µs Repeated START condition hold time tHD_STA 4.0 — — µs STOP condition set-up time tSU_STO 4.0 — — µs Bus free time between a STOP and START condition tBUF 4.7 — — µs Note: 1. The maximum SCL clock frequency listed is assuming that an arbitrary clock frequency is available. The maximum attainable SCL clock frequency may be slightly less using the HFXO or HFRCO due to the limited frequencies available. The CLKDIV should be set to a value that keeps the SCL clock frequency below the max value listed. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 66 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.19.2 I2C Fast-mode (Fm) CLHR set to 1 in the I2Cn_CTRL register. Table 4.42. I2C Fast-mode (Fm) Parameter Symbol SCL clock frequency1 Test Condition Min Typ Max Unit fSCL 0 — 400 kHz SCL clock low time tLOW 1.3 — — µs SCL clock high time tHIGH 0.6 — — µs SDA set-up time tSU_DAT 100 — — ns SDA hold time tHD_DAT 0 — — ns Repeated START condition set-up time tSU_STA 0.6 — — µs Repeated START condition hold time tHD_STA 0.6 — — µs STOP condition set-up time tSU_STO 0.6 — — µs Bus free time between a STOP and START condition tBUF 1.3 — — µs Note: 1. The maximum SCL clock frequency listed is assuming that an arbitrary clock frequency is available. The maximum attainable SCL clock frequency may be slightly less using the HFXO or HFRCO due to the limited frequencies available. The CLKDIV should be set to a value that keeps the SCL clock frequency below the max value listed. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 67 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.19.3 I2C Fast-mode Plus (Fm+) CLHR set to 1 in the I2Cn_CTRL register. Table 4.43. I2C Fast-mode Plus (Fm+) Parameter Symbol SCL clock frequency1 Test Condition Min Typ Max Unit fSCL 0 — 1000 kHz SCL clock low time tLOW 0.5 — — µs SCL clock high time tHIGH 0.26 — — µs SDA set-up time tSU_DAT 50 — — ns SDA hold time tHD_DAT 0 — — ns Repeated START condition set-up time tSU_STA 0.26 — — µs Repeated START condition hold time tHD_STA 0.26 — — µs STOP condition set-up time tSU_STO 0.26 — — µs Bus free time between a STOP and START condition tBUF 0.5 — — µs Note: 1. The maximum SCL clock frequency listed is assuming that an arbitrary clock frequency is available. The maximum attainable SCL clock frequency may be slightly less using the HFXO or HFRCO due to the limited frequencies available. The CLKDIV should be set to a value that keeps the SCL clock frequency below the max value listed. 4.20 Typical Performance Curves Typical performance curves indicate typical characterized performance under the stated conditions. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 68 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.20.1 Supply Current Figure 4.7. EM0 and EM1 Typical Supply Current vs. Temperature silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 69 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications Figure 4.8. EM2 and EM4 Typical Supply Current vs. Temperature silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 70 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.20.2 RF Characteristics Figure 4.9. Transmitter Output Power silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 71 EFR32MG22 Wireless Gecko SoC Family Data Sheet Electrical Specifications 4.20.3 DC-DC Converter Performance characterized with Samsung CIG22H2R2MNE (LDCDC = 2.2 uH ) and Samsung CL10B475KQ8NQNC (CDCDC = 4.7 uF) Figure 4.10. DC-DC Efficiency silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 72 EFR32MG22 Wireless Gecko SoC Family Data Sheet Typical Connections 5. Typical Connections 5.1 Power Typical power supply connections are shown in the following figures. VDD Main Supply + – VREGVDD AVDD VREGSW IOVDD HFXTAL_I VREGVSS HFXTAL_O DVDD LFXTAL_I LFXTAL_O DECOUPLE RFVDD CDECOUPLE PAVDD 38.4 MHz 32.768 kHz (optional) VDD Figure 5.1. EFR32MG22 Typical Application Circuit: Direct Supply Configuration without DCDC VDD Main Supply + – CIN VREGVDD AVDD IOVDD LDCDC VDCDC VREGSW CDCDC HFXTAL_I VREGVSS HFXTAL_O DVDD LFXTAL_I LFXTAL_O 38.4 MHz 32.768 kHz (optional) DECOUPLE CDECOUPLE RFVDD PAVDD Figure 5.2. EFR32MG22 Typical Application Circuit: DCDC Configuration silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 73 EFR32MG22 Wireless Gecko SoC Family Data Sheet Typical Connections 5.2 RF Matching Networks 5.2.1 2.4 GHz Matching Network The recommended RF matching network circuit diagram is shown in Figure 5.3 Typical RF impedance-matching network circuit on page 74. Typical component values are shown in Table 5.1 Component Values on page 74. Please refer to the development board Bill of Materials for specific part recommendation including tolerance, component size, recommended manufacturer, and recommended part number. L1 C3 2G4RF_IO 50Ω C1 C2 Figure 5.3. Typical RF impedance-matching network circuit Table 5.1. Component Values Designator Value C1 1.2 pF C2 1.3 pF L1 2.6 nH C3 18 pF 5.3 Other Connections Other components or connections may be required to meet the system-level requirements. Application Note AN0002.2: "EFR32 Wireless Gecko Series 2 Hardware Design Considerations" contains detailed information on these connections. Application Notes can be accessed on the Silicon Labs website (www.silabs.com/32bit-appnotes). silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 74 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions 6. Pin Definitions 6.1 QFN40 Device Pinout Figure 6.1. QFN40 Device Pinout The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.4 Alternate Function Table, 6.5 Analog Peripheral Connectivity, and 6.6 Digital Peripheral Connectivity. Table 6.1. QFN40 Device Pinout Pin Name Pin(s) Description Pin Name Pin(s) Description PC00 1 GPIO PC01 2 GPIO PC02 3 GPIO PC03 4 GPIO PC04 5 GPIO PC05 6 GPIO PC06 7 GPIO PC07 8 GPIO HFXTAL_I 9 High Frequency Crystal Input HFXTAL_O 10 High Frequency Crystal Output silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 75 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions Pin Name Pin(s) Description RESETn 11 Reset Pin. The RESETn pin is internally pulled up to DVDD. RFVSS 13 Radio Ground PAVDD 15 PB03 Pin Name Pin(s) Description RFVDD 12 Radio power supply RF2G4_IO 14 2.4 GHz Single-ended RF input/output Power Amplifier (PA) power supply PB04 16 GPIO 17 GPIO PB02 18 GPIO PB01 19 GPIO PB00 20 GPIO PA00 21 GPIO PA01 22 GPIO PA02 23 GPIO PA03 24 GPIO PA04 25 GPIO PA05 26 GPIO PA06 27 GPIO PA07 28 GPIO PA08 29 GPIO DECOUPLE 30 Decouple outputput for on-chip voltage regulator. An external decoupling capacitor is required at this pin. VREGSW 31 DCDC regulator switching node VREGVDD 32 DCDC regulator input supply VREGVSS 33 DCDC ground DVDD 34 Digital power supply AVDD 35 Analog power supply IOVDD 36 I/O power supply PD03 37 GPIO PD02 38 GPIO PD01 39 GPIO PD00 40 GPIO silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 76 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions 6.2 TQFN32 Device Pinout Figure 6.2. TQFN32 Device Pinout The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.4 Alternate Function Table, 6.5 Analog Peripheral Connectivity, and 6.6 Digital Peripheral Connectivity. Table 6.2. TQFN32 Device Pinout Pin Name Pin(s) Description Pin Name Pin(s) Description PC00 1 GPIO PC01 2 GPIO PC02 3 GPIO PC03 4 GPIO PC04 5 GPIO PC05 6 GPIO HFXTAL_I 7 High Frequency Crystal Input HFXTAL_O 8 High Frequency Crystal Output RESETn 9 Reset Pin. The RESETn pin is internally pulled up to DVDD. RFVDD 10 Radio power supply RFVSS 11 Radio Ground RF2G4_IO 12 2.4 GHz Single-ended RF input/output silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 77 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions Pin Name Pin(s) Description Pin Name Pin(s) Description PAVDD 13 Power Amplifier (PA) power supply PB02 14 GPIO PB01 15 GPIO PB00 16 GPIO PA00 17 GPIO PA01 18 GPIO PA02 19 GPIO PA03 20 GPIO PA04 21 GPIO PA05 22 GPIO PA06 23 GPIO DECOUPLE 24 Decouple outputput for on-chip voltage regulator. An external decoupling capacitor is required at this pin. VREGSW 25 DCDC regulator switching node VREGVDD 26 DCDC regulator input supply VREGVSS 27 DCDC ground DVDD 28 Digital power supply AVDD 29 Analog power supply IOVDD 30 I/O power supply PD01 31 GPIO PD00 32 GPIO silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 78 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions 6.3 QFN32 Device Pinout Figure 6.3. QFN32 Device Pinout The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see 6.4 Alternate Function Table, 6.5 Analog Peripheral Connectivity, and 6.6 Digital Peripheral Connectivity. Table 6.3. QFN32 Device Pinout Pin Name Pin(s) Description Pin Name Pin(s) Description PC00 1 GPIO PC01 2 GPIO PC02 3 GPIO PC03 4 GPIO PC04 5 GPIO PC05 6 GPIO HFXTAL_I 7 High Frequency Crystal Input HFXTAL_O 8 High Frequency Crystal Output RESETn 9 Reset Pin. The RESETn pin is internally pulled up to DVDD. RFVDD 10 Radio power supply RFVSS 11 Radio Ground RF2G4_IO 12 2.4 GHz Single-ended RF input/output silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 79 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions Pin Name Pin(s) Description Pin Name Pin(s) Description PAVDD 13 Power Amplifier (PA) power supply PB02 14 GPIO PB01 15 GPIO PB00 16 GPIO PA00 17 GPIO PA01 18 GPIO PA02 19 GPIO PA03 20 GPIO PA04 21 GPIO PA05 22 GPIO PA06 23 GPIO DECOUPLE 24 Decouple outputput for on-chip voltage regulator. An external decoupling capacitor is required at this pin. VREGSW 25 DCDC regulator switching node VREGVDD 26 DCDC regulator input supply VREGVSS 27 DCDC ground DVDD 28 Digital power supply AVDD 29 Analog power supply IOVDD 30 I/O power supply PD01 31 GPIO PD00 32 GPIO 6.4 Alternate Function Table A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows what functions are available on each device pin. Table 6.4. GPIO Alternate Function Table GPIO Alternate Function GPIO.THMSW_EN GPIO.THMSW_HAL FSWITCH GPIO.SWV GPIO.TDO GPIO.TRACEDATA0 PA04 GPIO.TDI GPIO.TRACECLK PA05 GPIO.EM4WU0 PD02 GPIO.EM4WU9 PD01 LFXO.LFXTAL_I PD00 LFXO.LFXTAL_O PC00 GPIO.EM4WU6 PC05 GPIO.EM4WU7 PC07 GPIO.EM4WU8 PB03 GPIO.EM4WU4 PB01 GPIO.EM4WU3 PB00 IADC0.VREFN PA00 IADC0.VREFP PA01 GPIO.SWCLK PA02 GPIO.SWDIO PA03 silabs.com | Building a more connected world. LFXO.LF_EXTCLK Preliminary Rev. 0.5 | 80 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions 6.5 Analog Peripheral Connectivity Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the device Reference Manual for more details on the ABUS and analog peripherals. Table 6.5. ABUS Routing Table Peripheral IADC0 Signal PA PB PC PD EVEN ODD EVEN ODD EVEN ODD EVEN ODD ana_neg Yes Yes Yes Yes Yes Yes Yes Yes ana_pos Yes Yes Yes Yes Yes Yes Yes Yes silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 81 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions 6.6 Digital Peripheral Connectivity Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avaliable on each GPIO port. Table 6.6. DBUS Routing Table Peripheral.Resource PORT PA PB PC PD CMU.CLKIN0 Available Available CMU.CLKOUT0 Available Available CMU.CLKOUT1 Available Available CMU.CLKOUT2 Available Available EUART0.CTS Available Available Available Available EUART0.RTS Available Available Available Available EUART0.RX Available Available Available Available EUART0.TX Available Available Available Available FRC.DCLK Available Available FRC.DFRAME Available Available FRC.DOUT Available Available I2C0.SCL Available Available Available Available I2C0.SDA Available Available Available Available I2C1.SCL Available Available I2C1.SDA Available Available LETIMER0.OUT0 Available Available LETIMER0.OUT1 Available Available MODEM.ANT0 Available Available Available Available MODEM.ANT1 Available Available Available Available MODEM.ANT_ROLL_OVER Available Available MODEM.ANT_RR0 Available Available MODEM.ANT_RR1 Available Available MODEM.ANT_RR2 Available Available MODEM.ANT_RR3 Available Available MODEM.ANT_RR4 Available Available MODEM.ANT_RR5 Available Available MODEM.ANT_SW_EN Available Available MODEM.ANT_SW_US Available Available MODEM.ANT_TRIG Available Available MODEM.ANT_TRIG_STOP Available Available MODEM.DCLK silabs.com | Building a more connected world. Available Available Preliminary Rev. 0.5 | 82 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions Peripheral.Resource PORT PA PB PC PD MODEM.DIN Available Available MODEM.DOUT Available Available PDM.CLK Available Available Available Available PDM.DAT0 Available Available Available Available PDM.DAT1 Available Available Available Available PRS.ASYNCH0 Available Available PRS.ASYNCH1 Available Available PRS.ASYNCH10 Available Available PRS.ASYNCH11 Available Available PRS.ASYNCH6 Available Available PRS.ASYNCH7 Available Available PRS.ASYNCH8 Available Available PRS.ASYNCH9 Available Available PRS.ASYNCH2 Available Available PRS.ASYNCH3 Available Available PRS.ASYNCH4 Available Available PRS.ASYNCH5 Available Available PRS.SYNCH0 Available Available Available Available PRS.SYNCH1 Available Available Available Available PRS.SYNCH2 Available Available Available Available PRS.SYNCH3 Available Available Available Available TIMER0.CC0 Available Available Available Available TIMER0.CC1 Available Available Available Available TIMER0.CC2 Available Available Available Available TIMER0.CDTI0 Available Available Available Available TIMER0.CDTI1 Available Available Available Available TIMER0.CDTI2 Available Available Available Available TIMER1.CC0 Available Available Available Available TIMER1.CC1 Available Available Available Available TIMER1.CC2 Available Available Available Available TIMER1.CDTI0 Available Available Available Available TIMER1.CDTI1 Available Available Available Available TIMER1.CDTI2 Available Available Available Available TIMER2.CC0 Available Available TIMER2.CC1 Available Available TIMER2.CC2 Available Available silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 83 EFR32MG22 Wireless Gecko SoC Family Data Sheet Pin Definitions Peripheral.Resource PORT PA PB PC PD TIMER2.CDTI0 Available Available TIMER2.CDTI1 Available Available TIMER2.CDTI2 Available Available TIMER3.CC0 Available Available TIMER3.CC1 Available Available TIMER3.CC2 Available Available TIMER3.CDTI0 Available Available TIMER3.CDTI1 Available Available TIMER3.CDTI2 Available Available TIMER4.CC0 Available Available TIMER4.CC1 Available Available TIMER4.CC2 Available Available TIMER4.CDTI0 Available Available TIMER4.CDTI1 Available Available TIMER4.CDTI2 Available Available USART0.CLK Available Available Available Available USART0.CS Available Available Available Available USART0.CTS Available Available Available Available USART0.RTS Available Available Available Available USART0.RX Available Available Available Available USART0.TX Available Available Available Available USART1.CLK Available Available USART1.CS Available Available USART1.CTS Available Available USART1.RTS Available Available USART1.RX Available Available USART1.TX Available Available silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 84 EFR32MG22 Wireless Gecko SoC Family Data Sheet QFN32 Package Specifications 7. QFN32 Package Specifications 7.1 QFN32 Package Dimensions Figure 7.1. QFN32 Package Drawing silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 85 EFR32MG22 Wireless Gecko SoC Family Data Sheet QFN32 Package Specifications Table 7.1. QFN32 Package Dimensions Dimension Min Typ Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 A3 0.20 REF b 0.15 0.20 0.25 D 3.90 4.00 4.10 E 3.90 4.00 4.10 D2 2.60 2.70 2.80 E2 2.60 2.70 2.80 e 0.40 BSC L 0.20 0.30 0.40 K 0.20 — — R 0.075 — 0.125 aaa 0.10 bbb 0.07 ccc 0.10 ddd 0.05 eee 0.08 fff 0.10 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 86 EFR32MG22 Wireless Gecko SoC Family Data Sheet QFN32 Package Specifications 7.2 QFN32 PCB Land Pattern Figure 7.2. QFN32 PCB Land Pattern Drawing silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 87 EFR32MG22 Wireless Gecko SoC Family Data Sheet QFN32 Package Specifications Table 7.2. QFN32 PCB Land Pattern Dimensions Dimension Typ L 0.76 W 0.22 e 0.40 S 3.21 S1 3.21 L1 2.80 W1 2.80 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.101 mm (4 mils). 6. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads. 7. A 2x2 array of 1.10 mm x 1.10 mm openings on a 1.30 mm pitch can be used for the center ground pad. 8. A No-Clean, Type-3 solder paste is recommended. 9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 10. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 88 EFR32MG22 Wireless Gecko SoC Family Data Sheet QFN32 Package Specifications 7.3 QFN32 Package Marking FFFF PPPPPP TTTTTT YYWW Figure 7.3. QFN32 Package Marking The package marking consists of: • FFFF – The product family codes. 1. Family Code ( B | M | F ) 2. G (Gecko) 3. Series (2) 4. Device Configuration (1, 2, 3, ...) • PPPPPP – The product option codes. • 1-2. MCU Feature Codes • 3-4. Radio Feature Codes • 5. Flash (J = 1024k | I = 768k | H = 512k | W= 352k | G = 256k | F = 128k) • 6. Temperature grade (G = -40 to 85 °C | I = -40 to 125 °C ) • TTTTTT – A trace or manufacturing code. The first letter is the device revision. • YY – The last 2 digits of the assembly year. • WW – The 2-digit workweek when the device was assembled. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 89 EFR32MG22 Wireless Gecko SoC Family Data Sheet TQFN32 Package Specifications 8. TQFN32 Package Specifications 8.1 TQFN32 Package Dimensions Figure 8.1. TQFN32 Package Drawing silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 90 EFR32MG22 Wireless Gecko SoC Family Data Sheet TQFN32 Package Specifications Table 8.1. TQFN32 Package Dimensions Dimension Min Typ Max A 0.27 0.30 0.33 A1 0.20 REF A2 0.10 REF b 0.15 0.20 0.25 D 3.90 4.00 4.10 E 3.90 4.00 4.10 D2 2.60 2.70 2.80 E2 2.60 2.70 2.80 e L 0.40 BSC 0.31 K R 0.32 0.33 0.33 REF 0.075 — aaa 0.10 bbb 0.07 ccc 0.10 ddd 0.05 eee 0.08 fff 0.10 0.125 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 91 EFR32MG22 Wireless Gecko SoC Family Data Sheet TQFN32 Package Specifications 8.2 TQFN32 PCB Land Pattern Figure 8.2. TQFN32 PCB Land Pattern Drawing silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 92 EFR32MG22 Wireless Gecko SoC Family Data Sheet TQFN32 Package Specifications Table 8.2. TQFN32 PCB Land Pattern Dimensions Dimension Typ L 0.76 W 0.22 e 0.40 S 3.21 S1 3.21 L1 2.80 W1 2.80 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.101 mm (4 mils). 6. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads. 7. A 2x2 array of 1.10 mm x 1.10 mm openings on a 1.30 mm pitch can be used for the center ground pad. 8. A No-Clean, Type-3 solder paste is recommended. 9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 10. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 93 EFR32MG22 Wireless Gecko SoC Family Data Sheet TQFN32 Package Specifications 8.3 TQFN32 Package Marking FFFF PPPPPP TTTTTT YYWW Figure 8.3. TQFN32 Package Marking The package marking consists of: • FFFF – The product family codes. 1. Family Code ( B | M | F ) 2. G (Gecko) 3. Series (2) 4. Device Configuration (1, 2, 3, ...) • PPPPPP – The product option codes. • 1-2. MCU Feature Codes • 3-4. Radio Feature Codes • 5. Flash (J = 1024k | I = 768k | H = 512k | W= 352k | G = 256k | F = 128k) • 6. Temperature grade (G = -40 to 85 °C | I = -40 to 125 °C ) • TTTTTT – A trace or manufacturing code. The first letter is the device revision. • YY – The last 2 digits of the assembly year. • WW – The 2-digit workweek when the device was assembled. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 94 EFR32MG22 Wireless Gecko SoC Family Data Sheet QFN40 Package Specifications 9. QFN40 Package Specifications 9.1 QFN40 Package Dimensions Figure 9.1. QFN40 Package Drawing silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 95 EFR32MG22 Wireless Gecko SoC Family Data Sheet QFN40 Package Specifications Table 9.1. QFN40 Package Dimensions Dimension Min Typ Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 A3 0.20 REF b 0.15 0.20 0.25 D 4.90 5.00 5.10 E 4.90 5.00 5.10 D2 3.55 3.70 3.85 E2 3.55 3.70 3.85 e 0.40 BSC L 0.30 0.40 0.50 K 0.20 — — R 0.075 — — aaa 0.10 bbb 0.07 ccc 0.10 ddd 0.05 eee 0.08 fff 0.10 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 96 EFR32MG22 Wireless Gecko SoC Family Data Sheet QFN40 Package Specifications 9.2 QFN40 PCB Land Pattern Figure 9.2. QFN40 PCB Land Pattern Drawing Table 9.2. QFN40 PCB Land Pattern Dimensions Dimension Typ S1 4.25 S 4.25 L1 3.85 W1 3.85 e 0.40 W 0.22 L 0.74 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 4. The stencil thickness should be 0.101 mm (4 mils). 5. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads. 6. A 3x3 array of 0.90 mm square openings on a 1.20 mm pitch can be used for the center ground pad. 7. A No-Clean, Type-3 solder paste is recommended. 8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 9. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 97 EFR32MG22 Wireless Gecko SoC Family Data Sheet QFN40 Package Specifications 9.3 QFN40 Package Marking FFFF PPPPPP TTTTTT YYWW Figure 9.3. QFN40 Package Marking The package marking consists of: • FFFF – The product family codes. 1. Family Code ( B | M | F ) 2. G (Gecko) 3. Series (2) 4. Device Configuration (1, 2, 3, ...) • PPPPPP – The product option codes. • 1-2. MCU Feature Codes • 3-4. Radio Feature Codes • 5. Flash (J = 1024k | I = 768k | H = 512k | W= 352k | G = 256k | F = 128k) • 6. Temperature grade (G = -40 to 85 °C | I = -40 to 125 °C ) • TTTTTT – A trace or manufacturing code. The first letter is the device revision. • YY – The last 2 digits of the assembly year. • WW – The 2-digit workweek when the device was assembled. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 98 EFR32MG22 Wireless Gecko SoC Family Data Sheet Revision History 10. Revision History Revision 0.5 February, 2020 • • • • 1. Feature List: Updated list slightly to highlight different features. Expanded 3.7 Security Features section and corrected security details. Added 3.9.2 Voltage Scaling section. 4.1 Electrical Characteristics: • Additional characterization results and test limits added where available. • Removed thermistor driver specification table until full software support becomes available. • Updated 5.2 RF Matching Networks section with recommended match values. • Updated 9.3 QFN40 Package Marking with mark details. Revision 0.4 December, 2019 • 2. Ordering Information: • Available OPNs updated. • 4.1 Electrical Characteristics: • Added detailed lifetime information to DC-DC specifications section. • Additional characterization results and preliminary test limits added where available. • Added DC-DC efficiency plots and updated supply current plots to 4.20 Typical Performance Curves. Revision 0.3 October, 2019 • • • • In the front page block diagram, updated the lowest energy mode for LETIMER. Updated 3.5.2 Low Energy Timer (LETIMER) lowest energy mode. 1. Feature List updated with additional modulation formats, protocol stack, and security details. 2. Ordering Information: • OPN numbering changes for security grade differentiator. • Supported protocol stack details updated. • 4.1 Electrical Characteristics: • Additional characterization results and preliminary test limits added where available. • Corrected maximum clock speed details in General Operating Conditions Table. • Removed specification lines with 3 dBm output power conditions from RF transmit tables. • Removed DECOUPLE BOD table. • Added timing diagrams and specifications for PDM and USART SPI. • Added 4.20 Typical Performance Curves. Revision 0.2 July, 2019 • • • • • • Updated radio details in block diagrams on front page and in system overview. 2. Ordering Information: Updated part numbers to revision C. 4.1 Electrical Characteristics: Added early silicon characterization data to several tables, and refined specification conditions. 4.1 Electrical Characteristics: Added flash electrical characteristics table. Minor wording edits for System Overview sections. Removed references to internal product name. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 99 EFR32MG22 Wireless Gecko SoC Family Data Sheet Revision History Revision 0.1 March, 2019 Initial release. silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 100 Simplicity Studio One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! 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