SI3050-E1-FT

S i 3 0 5 0 + S i 3 0 11 / 1 8 / 1 9 P R O G R A M M A B L E VO I C E D A A S O L U T I O N S Features             PCM highway data interface µ-law/A-law companding SPI control interface GCI interface 80 dB dynamic range TX/RX Line voltage monitor Loop current monitor +6 dBm or +3.2 dBm TX/RX level mode Parallel handset detection 3 µA on-hook line monitor current Overload detection Programmable line interface AC termination DC termination Ring detect threshold Ringer impedance               TIP/RING polarity detection Integrated codec and 2- to 4-wire analog hybrid Programmable digital hybrid for near-end echo reduction Polarity reversal detection Programmable digital gain in 0.1 dB increments Integrated ring detector Type I and II caller ID support Pulse dialing support 3.3 V power supply Daisy-chaining for up to 16 devices Greater than 5000 V isolation Patented isolation technology Ground start and loop start support Available in Pb-free RoHS-compliant packages Ordering Information See page 106. Applications Voice mail systems DECT base stations Package Options FSYNC RGDT RG TGD TGDE RESET AOUT/INT Rev. 1.5 10/11 Ring Detect Control Logic Off-Hook RNG1 RNG2 QB QE QE2 NC SDITHR SCLK 19 16 VA DTX 4 15 C1A DRX 5 14 C2A RGDT 6 13 RESET Si3050 Top View 11 TGD 12 10 NC TGDE 9 NC 8 GND IB 3 C1B 4 C2B 5 NC 2 IGND 1 RX DCT2 NC QE Si3011/18/19 20 19 18 17 16 15 DCT3 14 QB IGND PAD 13 QE2 12 SC 6 7 8 9 10 VREG2 Line Data Interface Isolation Interface 20 3 RNG2 DTX DRX Isolation Interface IB SC DCT VREG VREG2 DCT2 DCT3 NC VDD PCKLK IGND PCLK Hybrid, AC and DC Terminations 21 GND 17 RNG1 SDI SDO SDI THRU RX Control Data Interface SDO 18 2 VREG CS SCLK Si3018/19 22 1 Functional Block Diagram Si3050 SDI CS FSYNC 7 The Si3050+Si3011/18/19 Voice DAA chipset provides a highly-programmable and globally-compliant foreign exchange office (FXO) analog interface. The solution implements Silicon Laboratories' patented isolation capacitor technology, which eliminates the need for costly isolation transformers, relays, or opto-isolators, while providing superior surge immunity for robust field performance. The Voice DAA is available as a chipset, a system-side device (Si3050) paired with a line-side device (Si3011/18/19). The Si3050 is available in a 20-pin TSSOP or a 24-pin QFN. The Si3011/18/19 is available in a 16-pin TSSOP, a 16-pin SOIC, or a 20-pin QFN and requires minimal external components. The Si3050 interfaces directly to standard telephony PCM interfaces. 23 Description 24 Si3050 RG   AOUT/INT DSL IADs VoIP gateways PBX and IP-PBX systems DCT    11 NC US Patent# 5,870,046 US Patent# 6,061,009 Copyright © 2011 by Silicon Laboratories Si3050 + Si3011/18/19 Si3050 + Si3011/18/19 2 Rev. 1.5 Si3050 + Si3011/18/19 TABLE O F C ONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4. AOUT PWM Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.1. Line-Side Device Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.2. Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.3. Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 5.4. Isolation Barrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.5. Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.6. Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.7. In-Circuit Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 5.8. Exception Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.9. Revision Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.10. Transmit/Receive Full-Scale Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.11. Parallel Handset Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.12. Line Voltage/Loop Current Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.13. Off-Hook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.14. Ground Start Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.15. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.16. DC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.17. AC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.18. Ring Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.19. Ring Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 5.20. Ringer Impedance and Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 5.21. Pulse Dialing and Spark Quenching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 5.22. Receive Overload Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 5.23. Billing Tone Filter (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5.24. On-Hook Line Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 5.25. Caller ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 5.26. Overload Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 5.27. Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 5.28. Transhybrid Balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 5.29. Filter Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 5.30. Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.31. Communication Interface Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 5.32. PCM Highway . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 5.33. Companding in PCM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 5.34. 16 kHz Sampling Operation in PCM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 5.35. SPI Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 5.36. GCI Highway . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Rev. 1.5 3 Si3050 + Si3011/18/19 5.37. Companding in GCI Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 5.38. 16 kHz Sampling Operation in GCI Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 5.39. Monitor Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 5.40. Summary of Monitor Channel Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 5.41. Device Address Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 5.42. Command Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 5.43. Register Address Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 5.44. SC Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 5.45. Receive SC Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 5.46. Transmit SC Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 6. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 7. Pin Descriptions: Si3011/18/19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 9. Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107 10. Package Outline: 20-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 10.1. PCB Land Pattern: Si3050 TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 11. Package Outline: 24-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 12. PCB Land Pattern: Si3050 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 13. Package Outline: 16-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 13.1. PCB Land Pattern: Si3011/18/19 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 14. Package Outline: 16-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 14.1. PCB Land Pattern: Si3011/18/19 TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 15. Package Outline: 20-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .121 16. PCB Land Pattern: Si3011/18/19 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 Silicon Labs Si3050 Support Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .125 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .128 4 Rev. 1.5 Si3050 + Si3011/18/19 1. Electrical Specifications Table 1. Recommended Operating Conditions and Thermal Information Parameter1 Symbol Ambient Temperature TA Si3050 Supply Voltage, Digital VD JA Thermal Resistance (Si3011/18/19)3 Thermal Resistance (Si3050)3 JA Test Condition Min2 Typ Max2 F-Grade 0 25 70 G-Grade –40 25 85 3.0 3.3 3.6 SOIC-16 — 77 — TSSOP-16 — 89 — QFN-20 — 120 — TSSOP-20 — 84 — QFN-24 — 67 — Unit °C V °C/W °C/W Notes: 1. The Si3050 specifications are guaranteed when the typical application circuit (including component tolerance) and any Si3050 and any Si3011/18/19 are used. See "2. Typical Application Schematic" on page 17 for the typical application circuit. 2. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise stated. 3. Operation above 125 °C junction temperature may degrade device reliability. Rev. 1.5 5 Si3050 + Si3011/18/19 Table 2. Loop Characteristics (VD = 3.0 to 3.6 V, TA = 0 to 70 °C, see Figure 1 on page 6) Parameter Symbol Test Condition Min Typ Max Unit DC Termination Voltage VTR IL =20 mA, ILIM =0 DCV = 00, MINI = 11, DCR = 0 — — 6.0 V DC Termination Voltage VTR IL = 120 mA, ILIM = 0 DCV = 00, MINI = 11, DCR = 0 9 — — V DC Termination Voltage VTR IL =20 mA, ILIM =0 DCV = 11, MINI = 00, DCR = 0 — — 7.5 V DC Termination Voltage VTR IL = 120 mA, ILIM = 0 DCV = 11, MINI = 00, DCR = 0 9 — — V DC Termination Voltage VTR IL =20 mA, ILIM =1 DCV = 11, MINI = 00, DCR = 0 — — 7.5 V DC Termination Voltage VTR IL =60 mA, ILIM =1 DCV = 11, MINI = 00, DCR = 0 40 — — V DC Termination Voltage VTR IL =50 mA, ILIM =1 DCV = 11, MINI = 00, DCR = 0 — — 40 V On-Hook Leakage Current ILK VTR = –48 V — — 5 µA MINI = 00, ILIM = 0 10 — 120 mA Operating Loop Current ILP Operating Loop Current ILP MINI = 00, ILIM = 1 10 — 60 mA dc current flowing through ring detection circuitry — 1.5 3 µA VRD RT2 = 0, RT = 0 13.5 15 16.5 RT2 = 0, RT = 1 19.35 21.5 23.65 Vrms VRD RT2 = 1, RT = 1 40.5 45 49.5 DC Ring Current Ring Detect Voltage* Ring Detect Voltage Ring Detect Voltage * VRD * Ring Frequency Ringer Equivalence Number FR REN 13 — 68 — — 0.2 Vrms Vrms Hz *Note: The ring signal is guaranteed to not be detected below the minimum. The ring signal is guaranteed to be detected above the maximum. TIP + 600  IL Si3011/18/19 VTR 10F RING – Figure 1. Test Circuit for Loop Characteristics 6 Rev. 1.5 Si3050 + Si3011/18/19 Table 3. DC Characteristics, VD = 3.0 to 3.6 V (VD = 3.0 to 3.6 V, TA = 0 to 70 °C) Parameter Symbol Test Condition Min Typ Max Unit High Level Input Voltage1 VIH 2.0 — — V 1 Low Level Input Voltage VIL — — 0.8 V High Level Output Voltage VOH = IO –2 mA 2.4 — — V Low Level Output Voltage VOL IO = 2 mA — — 0.35 V AOUT High Level Voltage VAH IO = 10 mA 2.4 — — V AOUT Low Level Voltage VAL IO = 10 mA — — 0.35 V –10 — 10 µA Input Leakage Current Power Supply Current, Digital IL 2 Total Supply Current, Sleep Mode2 Total Supply Current, Deep Sleep 2,3 ID VD pin — 8.5 10 mA ID PDN = 1, PDL = 0 — 5.0 6.0 mA ID PDN = 1, PDL = 1 — 1.3 1.5 mA Notes: 1. VIH/VIL do not apply to C1A/C2A. 2. All inputs at 0.4 or VD – 0.4 (CMOS levels). All inputs are held static except clock and all outputs unloaded (Static IOUT = 0 mA). 3. RGDT is not functional in this state. Rev. 1.5 7 Si3050 + Si3011/18/19 Table 4. AC Characteristics (VD = 3.0 to 3.6 V, TA = 0 to 70 °C, Fs = 8000 Hz, see "2. Typical Application Schematic" on page 17) Parameter Symbol Sample Rate PCLK Input Frequency Test Condition Min Typ Max Unit Fs 8 — 16 kHz PCLK 256 — 8192 kHz Receive Frequency Response Low –3 dBFS Corner, FILT = 0 — 5 — Hz Receive Frequency Response Low –3 dBFS Corner, FILT = 1 — 200 — Hz FULL = 0 (0 dBm) — 1.1 — VPEAK FULL = 1 (+3.2 dBm)2 — 1.58 — VPEAK dBm)2 — 2.16 — VPEAK VFS Transmit Full-Scale Level1 FULL2 = 1 (+6.0 VFS Receive Full-Scale Level1,3 FULL = 0 (0 dBm) — 1.1 — VPEAK dBm)2 — 1.58 — VPEAK FULL2 = 1 (+6.0 dBm)2 — 2.16 — VPEAK FULL = 1 (+3.2 Dynamic Range4,5,6 DR ILIM = 0, DCV = 11, MINI=00 DCR = 0, IL = 100 mA — 80 — dB Dynamic Range4,5,6 DR ILIM = 0, DCV = 00, MINI=11 DCR = 0, IL = 20 mA — 80 — dB Dynamic Range4,5,6 DR ILIM = 1, DCV = 11, MINI=00 DCR = 0, IL = 50 mA — 80 — dB Transmit Total Harmonic Distortion6,7 THD ILIM = 0, DCV = 11, MINI=00 DCR = 0, IL = 100 mA — –72 — dB Transmit Total Harmonic Distortion6,7 THD ILIM = 0, DCV = 00, MINI=11 DCR = 0, IL = 20 mA — –78 — dB Receive Total Harmonic Distortion6,7 THD ILIM = 0, DCV = 00, MINI=11 DCR = 0, IL = 20 mA — –78 — dB Receive Total Harmonic Distortion6,7 THD ILIM = 1,DCV = 11, MINI=00 DCR = 0, IL = 50 mA — –78 — dB Notes: 1. Measured at TIP and RING with 600 termination at 1 kHz, as shown in Figure 1 on page 6. 2. With FULL = 1, the transmit and receive full-scale level of +3.2 dBm can be achieved with a 600  ac termination. While the transmit and receive level in dBm varies with reference impedance, the DAA will transmit and receive 1 dBV into all reference impedances. With FULL2 = 1, the transmit and receive full-scale level of +6.0 dBm can be achieved with a 600  termination. In this mode, the DAA will transmit and receive +1.5 dBV into all reference impedances. 3. Receive full-scale level produces –0.9 dBFS at DTX. 4. DR = 20 x log (RMS VFS/RMS Vin) + 20 x log (RMS Vin/RMS noise). The RMS noise measurement excludes harmonics. Here, VFS is the 0 dBm full-scale level per Note 1 above. 5. Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths. 6. Vin =1 kHz, –3 dBFS. 7. THD = 20 x log (RMS distortion/RMS signal). 8. DRCID = 20 x log (RMS VCID/RMS VIN) + 20 x log (RMS VIN/RMS noise). VCID is the 1.5 V full-scale level with the enhanced caller ID circuit. With the typical CID circuit, the VCID full-scale level is 6 V peak, and the DRCID decreases to 50 dB. 9. Refer to Tables 10–11 for relative gain accuracy characteristics (passband ripple). 10. Analog hybrid only. ZACIM controlled by ACIM in Register 30. 8 Rev. 1.5 Si3050 + Si3011/18/19 Table 4. AC Characteristics (Continued) (VD = 3.0 to 3.6 V, TA = 0 to 70 °C, Fs = 8000 Hz, see "2. Typical Application Schematic" on page 17) Parameter Symbol Test Condition Min Typ Max Unit DRCID VIN =1 kHz, –13 dBFS — 62 — dB — 1.5 — VPEAK 2-W to DTX, TXG2, RXG2, TXG3, and RXG3 = 0000 –0.5 0 0.5 dB 300–3.4 kHz, ZACIM = ZLINE 20 — — dB 1 kHz, ZACIM = ZLINE — 30 — dB Two-Wire Return Loss 300–3.4 kHz, all ac terminations 25 — — dB Two-Wire Return Loss 1 kHz, all ac terminations — 32 — dB Dynamic Range (Caller ID mode) 8 Caller ID Full-Scale Level 8 VCID Gain Accuracy6,9 Transhybrid Balance10 Transhybrid Balance 10 Notes: 1. Measured at TIP and RING with 600 termination at 1 kHz, as shown in Figure 1 on page 6. 2. With FULL = 1, the transmit and receive full-scale level of +3.2 dBm can be achieved with a 600  ac termination. While the transmit and receive level in dBm varies with reference impedance, the DAA will transmit and receive 1 dBV into all reference impedances. With FULL2 = 1, the transmit and receive full-scale level of +6.0 dBm can be achieved with a 600  termination. In this mode, the DAA will transmit and receive +1.5 dBV into all reference impedances. 3. Receive full-scale level produces –0.9 dBFS at DTX. 4. DR = 20 x log (RMS VFS/RMS Vin) + 20 x log (RMS Vin/RMS noise). The RMS noise measurement excludes harmonics. Here, VFS is the 0 dBm full-scale level per Note 1 above. 5. Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths. 6. Vin =1 kHz, –3 dBFS. 7. THD = 20 x log (RMS distortion/RMS signal). 8. DRCID = 20 x log (RMS VCID/RMS VIN) + 20 x log (RMS VIN/RMS noise). VCID is the 1.5 V full-scale level with the enhanced caller ID circuit. With the typical CID circuit, the VCID full-scale level is 6 V peak, and the DRCID decreases to 50 dB. 9. Refer to Tables 10–11 for relative gain accuracy characteristics (passband ripple). 10. Analog hybrid only. ZACIM controlled by ACIM in Register 30. Table 5. Absolute Maximum Ratings Parameter Symbol Value Unit DC Supply Voltage VD –0.5 to 3.6 V Input Current, Si3050 Digital Input Pins IIN ±10 mA VIND –0.3 to (VD + 0.3) V TA –40 to 100 °C TSTG –65 to 150 °C Digital Input Voltage Ambient Operating Temperature Range Storage Temperature Range Note: Permanent device damage can occur if the above Absolute Maximum Ratings are exceeded. Functional operation should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods might affect device reliability. Rev. 1.5 9 Si3050 + Si3011/18/19 Table 6. Switching Characteristics—General Inputs (VD = 3.0 to 3.6 V, TA = 0 to 70 °C, CL = 20 pF) Parameter1 Symbol Min Typ Max Unit Cycle Time, PCLK tp 0.12207 — 3.90625 s PCLK Duty Cycle tdty 40 50 60 % PCLK Jitter Tolerance tjitter — — 2 ns tr — — 25 ns tf — — 25 ns tmr 10 — — cycles trl 250 — — ns tmxr 20 — — ns tr — — 25 ns Rise Time, PCLK Fall Time, PCLK 2 PCLK Before RESET  RESET Pulse Width3 CS, SCLK Before RESET Rise Time, Reset Notes: 1. All timing (except Rise and Fall time) is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V. Rise and Fall times are referenced to the 20% and 80% levels of the waveform. 2. FSYNC/PCLK relationship must be fixed after RESET 3. The minimum RESET pulse width is the greater of 250 ns or 10 PCLK cycle times. tr tp PC LK V IH V IL tm r RESET t rl C S, SC LK tm xr Figure 2. General Inputs Timing Diagram 10 tf Rev. 1.5 Si3050 + Si3011/18/19 Table 7. Switching Characteristics—Serial Peripheral Interface (VIO = 3.0 to 3.6 V, TA = 0 to 70 °C, CL = 20 pF) Parameter* Symbol Test Conditions Min Typ Max Unit Cycle Time SCLK tc 61.03 — — ns Rise Time, SCLK tr — — 25 ns Fall Time, SCLK tf — — 25 ns Delay Time, SCLK Fall to SDO Active td1 — — 20 ns Delay Time, SCLK Fall to SDO Transition td2 — — 20 ns Delay Time, CS Rise to SDO Tri-state td3 — — 20 ns Setup Time, CS to SCLK Fall tsu1 25 — — ns Hold Time, SCLK to CS Rise th1 20 — — ns Setup Time, SDI to SCLK Rise tsu2 25 — — ns Hold Time, SCLK Rise to SDI Transition th2 20 — — ns Delay time between chip selects tcs 220 — — ns — 6 — ns Propagation Delay, SDI to SDITHRU *Note: All timing (except Rise and Fall time) is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V. Rise and Fall times are referenced to the 20% and 80% levels of the waveform. tr SCLK tf tc tsu1 CS tsu2 th2 th1 tcs SDI SDO td1 td2 td3 Figure 3. SPI Timing Diagram Rev. 1.5 11 Si3050 + Si3011/18/19 Table 8. Switching Characteristics—PCM Highway Serial Interface (VD = 3.0 to 3.6 V, TA = 0 to 70 °C, CL = 20 pF) Parameter1 Test Conditions Symbol Min Typ Max Units 122 — 3906 ns — — — — — — — — 256 512 768 1.024 1.536 2.048 4.096 8.192 — — — — — — — — kHz kHz kHz MHz MHz MHz MHz MHz tfp — 125 — s PCLK Duty Cycle tdty 40 50 60 % PCLK Jitter-Tolerance tjitter — — 2 ns FSYNC Jitter Tolerance tjitter — — ±120 ns tr — — 25 ns Cycle Time PCLK tp Valid PCLK Inputs FSYNC Period2 Rise Time, PCLK tf — — 25 ns td1 — — 20 ns td2 — — 20 ns Delay Time, PCLK Rise to DTX Tri-State td3 — — 20 ns Fall Time, PCLK Delay Time, PCLK Rise to DTX Active Delay Time, PCLK Rise to DTX Transition 3 Setup Time, FSYNC Rise to PCLK Fall tsu1 25 — — ns Hold Time, PCLK Fall to FSYNC Fall th1 20 — — ns Setup Time, DRX Transition to PCLK Fall tsu2 25 — — ns Hold Time, PCLK Falling to DRX Transition th2 20 — — ns Notes: 1. All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VO – 0.4 V, VIL = 0.4 V, rise and fall times are referenced to the 20% and 80% levels of the waveform. 2. FSYNC must be 8 kHz under all operating conditions. 3. Specification applies to PCLK fall to DTX tri-state when that mode is selected. tp PCLK th1 tsu1 t fp FSYNC tsu2 th2 DRX td1 td2 td3 DTX Figure 4. PCM Highway Interface Timing Diagram (RXS = TXS = 1) 12 Rev. 1.5 Si3050 + Si3011/18/19 Table 9. Switching Characteristics—GCI Highway Serial Interface (VD = 3.0 to 3.6 V, TA = 0 to 70 °C, CL = 20 pF) Parameter1 Symbol Test Conditions Min Typ Max Units Cycle Time PCLK (Single Clocking Mode) tp — 488 — ns Cycle Time PCLK (Double Clocking Mode) tp — 244 — ns — — 2.048 4.096 — — MHz MHz Valid PCLK Inputs FSYNC Period2 tfp — 125 — µs PCLK Duty Cycle tdty 40 50 60 % PCLK Jitter Tolerance tjitter — — 2 ns FSYNC Jitter Tolerance tjitter — — ±120 ns Rise Time, PCLK tr — — 25 ns Fall Time, PCLK tf — — 25 ns td1 — — 20 ns td2 — — 20 ns td3 — — 20 ns Setup Time, FSYNC Rise to PCLK Fall tsu1 25 — — ns Hold Time, PCLK Fall to FSYNC Fall th1 20 — — ns Setup Time, DRX Transition to PCLK Fall tsu2 25 — — ns Hold Time, PCLK Falling to DRX Transition th2 20 — — ns Delay Time, PCLK Rise to DTX Active Delay Time, PCLK Rise to DTX Transition Delay Time, PCLK Rise to DTX Tri-State 3 Notes: 1. All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VO – 0.4 V, VIL = 0.4 V, rise and fall times are referenced to the 20% and 80% levels of the waveform. 2. FSYNC must be 8 kHz under all operating conditions. 3. Specification applies to PCLK fall to DTX tri-state when that mode is selected. tr tp tf PCLK th1 t su1 tfp FSYNC t su2 t h2 DRX t d1 t d2 t d3 DTX Figure 5. GCI Highway Interface Timing Diagram (1x PCLK Mode) Rev. 1.5 13 Si3050 + Si3011/18/19 tr tf PCLK tfp th1 tsu2 FSYNC tsu2 th2 DRX td2 td1 td3 DTX Figure 6. GCI Highway Interface Timing Diagram (2x PCLK Mode) Table 10. Digital FIR Filter Characteristics—Transmit and Receive (VD = 3.0 to 3.6 V, Sample Rate = 8 kHz, TA = 0 to 70 °C) Parameter Symbol Min Typ Max Unit Passband (0.1 dB) F(0.1 dB) 0 — 3.3 kHz F(3 dB) 0 — 3.6 kHz –0.1 — 0.1 dB — 4.4 — kHz –74 — — dB — 12/Fs — s Passband (3 dB) Passband Ripple Peak-to-Peak Stopband Stopband Attenuation Group Delay tgd Note: Typical FIR filter characteristics for Fs = 8000 Hz are shown in Figures 7, 8, 9, and 10. Table 11. Digital IIR Filter Characteristics—Transmit and Receive (VD = 3.0 to 3.6 V, Sample Rate = 8 kHz, TA = 0 to 70 °C) Parameter Passband (3 dB) Symbol Min Typ Max Unit F(3 dB) 0 — 3.6 kHz –0.2 — 0.2 dB — 4.4 — kHz –40 — — dB — 1.6/Fs — s Passband Ripple Peak-to-Peak Stopband Stopband Attenuation Group Delay tgd Note: Typical IIR filter characteristics for Fs = 8000 Hz are shown in Figures 11, 12, 13, and 14. Figures 15 and 16 show group delay versus input frequency. 14 Rev. 1.5 Si3050 + Si3011/18/19 Figure 7. FIR Receive Filter Response Figure 9. FIR Transmit Filter Response Figure 8. FIR Receive Filter Passband Ripple Figure 10. FIR Transmit Filter Passband Ripple For Figures 7–10, all filter plots apply to a sample rate of Fs = 8 kHz. For Figures 11–14, all filter plots apply to a sample rate of Fs = 8 kHz. Rev. 1.5 15 Si3050 + Si3011/18/19 Figure 11. IIR Receive Filter Response Figure 14. IIR Transmit Filter Passband Ripple Figure 12. IIR Receive Filter Passband Ripple Figure 15. IIR Receive Group Delay Figure 13. IIR Transmit Filter Response Figure 16. IIR Transmit Group Delay 16 Rev. 1.5 Ground Start PCM Highway SPI Control Rev. 1.5 R53 1 2 3 4 5 6 7 8 9 10 U1 C50 Si3050 SDO SDI_THRU SDI SCLK CS GND FSYNC VDD PCLK VA DTX C1A DRX C2A RGDT RST AOUT/INT TGDE RG TGD R302 20 19 18 17 16 15 14 13 12 11 C51 R13 R12 C2 C1 R9 C4 C5 + R1 ISOLATION Barrier 1 2 3 4 5 6 7 8 Si3019 QE DCT2 DCT IGND RX DCT3 IB QB C1B QE2 C2B SC VREG VREG2 RNG1 RNG2 U2 16 15 14 13 12 11 10 9 R32 IGND C31 R11 R31 R7 R30 C30 Optional CID Population R8 C6 R2 R33 R3 R10 Q5 - Q4 C3 R4 D1 + C7 R5 No Ground Plane In DAA Section FB1 FB2 Z1 Q1 C9 Q3 Q2 C8 R6 C10 Figure 17. Typical Application Circuit for the Si3050 (TSSOP) and Si3011/18/19 (SOIC/TSSOP) (Refer to “AN67: Si3050/52/54/56 Layout Guidelines” for Recommended Layout Guidelines) /RG /TGD /TGDE /RGDT /INT /RESET FSYNC PCLK DTX DRX SDO SDI /CS SCLK SDITHRU R52 VDD FB204 FB203 RV1 TIP RING Si3050 + Si3011/18/19 2. Typical Application Schematic 17 Ground Start PCM Highway SPI Control /RG /TGD /TGDE /RGDT /INT /RESET FSYNC PCLK DTX DRX SDO SDI /CS SCLK SDITHRU NI Rev. 1.5 22 23 24 1 2 3 4 5 6 7 8 9 U203 Si3050FM 21 20 19 18 17 16 15 14 13 12 11 10 C50 0.1uF NC NC SDO SDI_THRU SDI SCLK CS GND FSYNC VDD PCLK VA DTX C1A DRX C2A RGDT RST AOUT/INT TGDE RG TGD NC NC 0 2A C51 0.1uF 16V R13 R12 56.2 1/16W 56.2 1/16W C2 C1 33pF Y2 33pF Y2 C5 1M 1/16W 0.1uF 16V 1/2W 50V R9 1.07K R1 C4 1uF ISOLATION Barrier 19 20 1 2 3 4 5 6 7 8 47K U2 Si3019FM 18 17 16 15 14 13 12 11 10 9 R32 NI 120pF C31 20M R8 1/4W 250V 15M 150V IGND MMBTA06LT1 1/16W 536 5.1M 150V R31 NI 250V 150V 15M R30 120pF C30 20M R7 Optional CID Population 5.1M 150V R33 0.1uF 16V C6 150 R2 1/2W 3.65K R3 R10 No Ground Plane In DAA Area QE DCT2 DCT IGND NC NC RX DCT3 IB QB C1B QE2 C2B SC VREG NC RNG1 VREG2 IGND RNG2 EPAD 47K Q5 1/2W 73.2 R11 D1 HD04 400V - Q4 C3 R4 + 3.9nF 250V 2.49K 1/2W MMBTA06LT1 1/16W 100K 680pF Y2 680pF Y2 600 Ohm FB204 600 Ohm FB203 Q3 MMBTA42LT1 R6 0.01uF MMBTA92LT1 C10 C8 43V Z1 Q2 MMBTA42LT1 C9 600 Ohm FB1 600 Ohm FB2 2.7nF 50V C7 1/16W 100K R5 Q1 Figure 18. Typical Application Circuit for the Si3050 (QFN) and Si3011/18/19 (QFN) (Refer to “AN67: Si3050/52/54/56 Layout Guidelines” for Recommended Layout Guidelines) R52 NI R53 R302 EPAD EPAD 18 IGND VDD RV1 TIP P3100SB RING Si3050 + Si3011/18/19 Si3050 + Si3011/18/19 3. Bill of Materials Component Value Supplier(s) C1, C2 33 pF, Y2, X7R, ±20% Panasonic, Murata, Vishay 3.9 nF, 250 V, X7R, ±20% Venkel, SMEC C4 1.0 µF, 50 V, Elec/Tant, ±20% Panasonic C5, C6, C50, C51 0.1 µF, 16 V, X7R, ±20% Venkel, SMEC C7 2.7 nF, 50 V, X7R, ±20% Venkel, SMEC C8, C9 680 pF, Y2, X7R, ±10% Panasonic, Murata, Vishay 0.01 µF, 16 V, X7R, ±20% Venkel, SMEC 120 pF, 250 V, X7R, ±10% Venkel, SMEC Dual Diode, 225 mA, 300 V, (MMBD3004S) Diodes Inc. FB1, FB2, FB203, FB204 Ferrite Bead, BLM18AG601SN1 Murata Q1, Q3 NPN, 300 V, MMBTA42 OnSemi, Fairchild, Diodes Inc. Q2 PNP, 300 V, MMBTA92 OnSemi, Fairchild, Diodes Inc. Q4, Q5 NPN, 80 V, 330 mW, MMBTA06 Central OnSemi, Fairchild RV1 Sidactor, 275 V, 100 A Teccor, Diodes Inc., Shindengen R1 1.07 k, 1/2 W, 1% Venkel, SMEC, Panasonic R2 150 , 1/16 W, 5% Venkel, SMEC, Panasonic R3 3.65 k, 1/2 W, 1% Venkel, SMEC, Panasonic R4 2.49 k, 1/2 W, 1% Venkel, SMEC, Panasonic R5, R6 100 k, 1/16 W, 5% Venkel, SMEC, Panasonic Not Installed, 20 M, 1/8 W, 5% Venkel, SMEC, Panasonic R9 1 M, 1/16 W, 1% Venkel, SMEC, Panasonic R10 536 , 1/4 W, 1% Venkel, SMEC, Panasonic R11 73.2 , 1/2 W, 1% Venkel, SMEC, Panasonic C3 1 C10 1 C30, C31 D1, R7, D22 R81 R12, R13 56.2 , 1/16 W, 1% Venkel, SMEC, Panasonic 1 15 M, 1/8 W, 5% Venkel, SMEC, Panasonic R331 5.1 M, 1/8 W, 5% Venkel, SMEC, Panasonic R52, R53 4.7 k, 1/16 W, 5% Venkel, SMEC, Panasonic U1 Si3050 Silicon Labs U2 Si3011/8/19 Silicon Labs Z1 Zener Diode, 43 V, 1/2 W General Semi, On Semi, Diodes Inc. R30, R32 R31, Notes: 1. R7–R8 may be substituted for R30–R33 and C30–C31 for lower cost, but reduced CID performance. 2. Several diode bridge configurations are acceptable. Parts, such as a single HD04, a DF-04S, or four 1N4004 diodes, may be used (suppliers include General Semiconductor, Diodes Inc., etc.). Rev. 1.5 19 Si3050 + Si3011/18/19 4. AOUT PWM Output Table 12. Component Values—AOUT PWM Figure 19 illustrates an optional circuit to support the pulse width modulation (PWM) output capability of the Si3050 for call progress monitoring purposes. To enable this mode, the INTE bit (Register 2) should be set to 0, the PWME bit (Register 1) set to 1, and the PWMM bits (Register 2) set to 00. Component Value Supplier LS1 Speaker BRT1209PF-06 Intervox Q6 NPN KSP13 Fairchild C41 R41 +5VA LS1 R41 150 1/10 W, ±5% Venkel, SMEC, Panasonic Registers 20 and 21 allow the receive and transmit paths to be attenuated linearly. When these registers are set to all 0s, the transmit and receive paths are muted. These registers affect the call progress output only and do not affect transmit and receive operations on the telephone line. Q6 AOUT C41 Figure 19. AOUT PWM Circuit for Call Progress 20 0.1 µF, 16 V, X7R, ±20% Venkel, SMEC The PWMM[1:0] bits (Register 1, bits 5:4) select one of three different PWM output modes for the AOUT signal, including a delta-sigma data stream, a 32 kHz return to 0 PWM output, and a balanced 32 kHz PWM output. Rev. 1.5 Si3050 + Si3011/18/19 5. Functional Description Si3050 CS SCLK SDI SDO SDI THRU PCLK DTX DRX Si3018/19 RX Control Data Interface Line Data Interface Hybrid, AC and DC Terminations Isolation Interface Isolation Interface FSYNC RGDT RG TGD TGDE RESET AOUT/INT Ring Detect Off-Hook Control Logic IB SC DCT VREG VREG2 DCT2 DCT3 RNG1 RNG2 QB QE QE2 Figure 20. Si3050 + Si3011/18/19 Functional Block Diagram The Si3050 is an integrated direct access arrangement (DAA) providing a programmable line interface that meets global telephone line requirements. The Si3050 implements Silicon Laboratories’ patented isolation capacitor technology, which offers the highest level of integration by replacing an analog front end (AFE), an isolation transformer, relays, opto-isolators, and a 2- to 4-wire hybrid with two highly-integrated ICs. The Si3050 DAA is fully software programmable to meet global requirements and is compliant with FCC, TBR21, JATE, and other country-specific PTT specifications as shown in Table 13. In addition, the Si3050 meets the most stringent global requirements for out-of-band energy, emissions, immunity, high-voltage surges, and safety, including FCC Parts 15 and 68, EN55022, EN55024, and many other standards. 5.1. Line-Side Device Support 5.1.1. Si3011  TBR-21 and FCC-compliant line-side device. Selectable dc terminations. selectable ac terminations to increase return loss and trans-hybrid loss performance. +6 dBm TX/RX level mode (600 ) Two 5.1.2. Si3018  Globally-compliant line-side device—targets global DAA requirements for voice applications. This line-side device supports both FCC-compliant countries and non-FCC-compliant countries. Selectable dc terminations. selectable ac terminations to increase return loss and trans-hybrid loss performance. +6 dBm TX/RX level mode (600 ) Four 5.1.3. Si3019  Three different line-side devices are available for use with the Si3050 system-side device. The Si3011 line-side device only supports DC terminations compliant with TBR21 and FCC-compliant countries. The Si3018 and Si3019 line-side devices are globally compliant, have a selectable 5 Hz or 200 Hz RX high-pass filter pole, and offer a –16.5 to 13.5 dB digital gain/attenuation adjustment in 0.1dB increments for the transmit and receive paths. Rev. 1.5 Globally-compliant, enhanced features line-side device—targets global DAA requirements for voice applications. Selectable dc terminations selectable ac terminations to further increase return loss and trans-hybrid loss performance. Line voltage monitoring in on- and off-hook modes to enable line in-use/parallel handset detection. Programmable line current / voltage threshold interrupt. Polarity reversal interrupt. +3.2 dBm TX/RX level mode (600 ) +6 dBm TX/RX level mode (600 ) Higher resolution (1.1 mA/bit) loop current measurement. Sixteen 21 Si3050 + Si3011/18/19 Table 13. Country-specific Register Settings Register 16 31 16 16 26 26 26 Country OHS OHS2 RZ RT ILIM Argentina 0 0 0 0 0 11 00 0000 Australia1 1 0 0 0 0 01 01 0011 Austria 0 1 0 0 1 11 00 0010 Bahrain 0 1 0 0 1 11 00 0010 Belgium 0 1 0 0 1 11 00 0010 Brazil 0 0 0 0 0 11 00 0001 Bulgaria 0 1 0 0 1 11 00 0011 Canada 0 0 0 0 0 11 00 0000 Chile 0 0 0 0 0 11 00 0000 China 0 0 0 0 0 11 00 1010 Colombia 0 0 0 0 0 11 00 0000 Croatia 0 1 0 0 1 11 00 0010 Cyprus 0 1 0 0 1 11 00 0010 Czech Republic 0 1 0 0 1 11 00 0010 Denmark 0 1 0 0 1 11 00 0010 Ecuador 0 0 0 0 0 11 00 0000 Egypt 0 1 0 0 1 11 00 0010 El Salvador 0 0 0 0 0 11 00 0000 Finland 0 1 0 0 1 11 00 0010 France 0 1 0 0 1 11 00 0010 Germany 0 1 0 0 1 11 00 0010 Greece 0 1 0 0 1 11 00 0010 Guam 0 0 0 0 0 11 00 0000 Hong Kong 0 0 0 0 0 11 00 0000 Hungary 0 1 0 0 1 11 00 0010 Iceland 0 1 0 0 1 11 00 0010 India 0 0 0 0 0 11 00 0000 Indonesia 0 0 0 0 0 11 00 0000 DCV[1:0] MINI[1:0] 30 ACIM[3:0] Note: 1. See "5.16. DC Termination" on page 31 for DCV and MINI settings. 2. Supported for loop current  20 mA. 3. TBR21 includes the following countries: Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland, and the United Kingdom. 22 Rev. 1.5 Si3050 + Si3011/18/19 Table 13. Country-specific Register Settings (Continued) Register 16 31 16 16 26 Country OHS OHS2 RZ RT ILIM Ireland 0 1 0 0 1 11 00 0010 Israel 0 1 0 0 1 11 00 0010 Italy 0 1 0 0 1 11 00 0010 Japan 0 0 0 0 0 10 01 0000 Jordan 0 0 0 0 0 01 01 0000 Kazakhstan 0 0 0 0 0 11 00 0000 Kuwait 0 0 0 0 0 11 00 0000 Latvia 0 1 0 0 1 11 00 0010 Lebanon 0 1 0 0 1 11 00 0010 Luxembourg 0 1 0 0 1 11 00 0010 Macao 0 0 0 0 0 11 00 0000 0 0 0 0 0 01 01 0000 Malta 0 1 0 0 1 11 00 0010 Mexico 0 0 0 0 0 11 00 0000 Morocco 0 1 0 0 1 11 00 0010 Netherlands 0 1 0 0 1 11 00 0010 New Zealand 0 0 0 0 0 11 00 0100 Nigeria 0 1 0 0 1 11 00 0010 Norway 0 1 0 0 1 11 00 0010 Oman 0 0 0 0 0 01 01 0000 Pakistan 0 0 0 0 0 01 01 0000 Peru 0 0 0 0 0 11 00 0000 Philippines 0 0 0 0 0 01 01 0000 Poland 0 1 0 0 1 11 00 0010 Portugal 0 1 0 0 1 11 00 0010 Romania 0 1 0 0 1 11 00 0010 Russia 0 0 0 0 0 11 00 0000 Saudi Arabia 0 0 0 0 0 11 00 0000 Singapore 0 0 0 0 0 11 00 0000 Malaysia 2 26 26 DCV[1:0] MINI[1:0] 30 ACIM[3:0] Note: 1. See "5.16. DC Termination" on page 31 for DCV and MINI settings. 2. Supported for loop current  20 mA. 3. TBR21 includes the following countries: Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland, and the United Kingdom. Rev. 1.5 23 Si3050 + Si3011/18/19 Table 13. Country-specific Register Settings (Continued) Register 16 31 16 16 26 26 26 Country OHS OHS2 RZ RT ILIM Slovakia 0 1 0 0 1 11 00 0010 Slovenia 0 1 0 0 1 11 00 0010 South Africa 0 0 1 0 0 11 00 0011 South Korea 0 0 1 0 0 11 00 0000 Spain 0 1 0 0 1 11 00 0010 Sweden 0 1 0 0 1 11 00 0010 Switzerland 0 1 0 0 1 11 00 0010 Taiwan 0 0 0 0 0 11 00 0000 TBR213 0 0 0 0 1 11 00 0010 Thailand 0 0 0 0 0 01 01 0000 UAE 0 0 0 0 0 11 00 0000 United Kingdom 0 1 0 0 1 11 00 0101 USA 0 0 0 0 0 11 00 0000 Yemen 0 0 0 0 0 11 00 0000 DCV[1:0] MINI[1:0] 30 ACIM[3:0] Note: 1. See "5.16. DC Termination" on page 31 for DCV and MINI settings. 2. Supported for loop current  20 mA. 3. TBR21 includes the following countries: Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland, and the United Kingdom. 24 Rev. 1.5 Si3050 + Si3011/18/19 5.2. Power Supplies The Si3050 operates from a 3.3 V power supply. The Si3050 input pins require 3.3 V CMOS signal levels. If support of 5 V signal levels is necessary, a level shifter is required. The Si3011/18/19 derives its power from two sources: the Si3050 and the telephone line. The Si3050 supplies power over the patented isolation capacitor link between the two devices, allowing the line-side device to communicate with the Si3050 while on-hook, and perform other on-hook functions such as line voltage monitoring. When off-hook, the line-side device also derives power from the line current supplied from the telephone line. This feature is exclusive to DAAs from Silicon Labs and allows the most cost-effective implementation for a DAA while still maintaining robust performance over all line conditions. 5.3. Initialization Each time the Si3050 is powered up, assert the RESET pin. When the RESET pin is deasserted, the registers have default values to guarantee the line-side device (Si3011/18/19) is powered down without the possibility of loading the line (i.e., off-hook). An example initialization procedure follows: 1. Power up and de-assert RESET. 2. Wait until the PLL is locked. This time is less than 1 ms from the application of PCLK. 3. Enable PCM (Register 33) or GCI (Register 42) mode. 4. Set the desired line interface parameters (i.e., DCV[1:0], MINI[1:0], ILIM, DCR, ACIM[3:0], OHS, RT, RZ, TGA2, and TXG2[3:0]) shown in Table 13 on page 22. 5. Set the FULL (or FULL2) + IIRE bits as required. 6. Write a 0x00 into Register 6 to power up the line-side device (Si3011/18/19). The communications link is disabled by default. To enable it, the PDL bit (Register 6, bit 4) must be cleared. No communication between the Si3050 and Si3018/19 can occur until this bit is cleared. Allow the PLL to lock to the PCLK and FSYNC input signals before clearing the PDL bit. 5.5. Power Management The Si3050 supports four basic power management operation modes. The modes are normal operation, reset operation, sleep mode, and full powerdown mode. The power management modes are controlled by the PDN and PDL bits (Register 6). On powerup, or following a reset, the Si3050 is in reset operation. The PDL bit is set, and the PDN bit is cleared. The Si3050 is operational, except for the communications link. No communication between the Si3050 and line-side device (Si3011/18/19) can occur during reset operation. Bits associated with the line-side device are invalid in this mode. In typical applications, the DAA will predominantly be operated in normal mode. In normal mode, the PDL and PDN bits are cleared. The DAA is operational and the communications link passes information between the Si3050 and the Si3011/18/19. The Si3050 supports a low-power sleep mode that supports ring validation and wake-up-on-ring features. To enable the sleep mode, the PDN bit must be set. When the Si3050 is in sleep mode, the PCLK signal must remain active. In low-power sleep mode, the Si3050 is non-functional except for the communications link and the RGDT signal. To take the Si3050 out of sleep mode, pulse the reset pin (RESET) low. In summary, the powerdown/up sequence for sleep mode is as follows: 1. Ensure the PDL bit (Register 6, bit 4) is cleared. When this procedure is complete, the Si3011/18/19 is ready for ring detection and off-hook operation. 5.4. Isolation Barrier The Si3050 achieves an isolation barrier through low-cost, high-voltage capacitors in conjunction with Silicon Laboratories’ patented signal processing techniques. Differential capacitive communication eliminates signal degradation from capacitor mismatches, common mode interference, or noise coupling. As shown in the "2. Typical Application Schematic" on page 17, the C1, C2, C8, and C9 capacitors isolate the Si3050 (system-side) from the Si3011/18/19 (line-side). Transmit, receive, control, ring detect, and caller ID data are passed across this barrier. 2. Set the PDN bit (Register 6, bit 3). 3. The device is now in sleep mode. PCLK must remain active. 4. To exit sleep mode, reset the Si3050 by pulsing the RESET pin. 5. Program registers to desired settings. The Si3050 also supports an additional Powerdown mode. When both the PDN (Register 6, bit 3) and PDL (Register 6, bit 4) bits are set, the chipset enters a complete powerdown mode and draws negligible current (deep sleep mode). In this mode, the Si3050 is non-functional. The RGDT pin does not function and the Si3050 will not detect a ring. Normal operation can be restored using the same process for taking the Si3050 out of sleep mode. Rev. 1.5 25 Si3050 + Si3011/18/19 5.6. Calibration The Si3050 initiates two auto-calibrations by default when the device goes off-hook or experiences a loss of line power. A 17 ms resistor calibration is performed to allow circuitry internal to the DAA to adjust to the exact line conditions present at the time of going off-hook. This resistor calibration can be disabled by setting the RCALD bit (Register 25, bit 5). A 256 ms ADC calibration is also performed to remove offsets that might be present in the on-chip A/D converter, which could affect the A/D dynamic range. The ADC auto-calibration is initiated after the DAA dc termination stabilizes and the resistor calibration completes. Due to the large variation in line conditions and line card behavior presented to the DAA, it might be beneficial to use manual ADC calibration instead of auto-calibration. Manual ADC calibration should be executed as close as possible to 256 ms before valid transmit/receive data is expected. The following steps should be taken to implement manual ADC calibration: 1. The CALD bit (auto-calibration disable—Register 17) must be set to 1. 2. The MCAL bit (manual calibration) must be toggled to one and then 0 to begin and complete the calibration. 3. The calibration is completed in 256 ms. 5.7. In-Circuit Testing The Si3050’s advanced design provides the designer with an increased ability to determine system functionality during production line tests and support for end-user diagnostics. Six loopback modes allow increased coverage of system components. For four of the test modes, a line-side power source is needed. While a standard phone line can be used, the test circuit in Figure 1 on page 6 is adequate. In addition, an off-hook sequence must be performed to connect the power source to the line-side device. For the start-up loopback test mode, no line-side power is necessary, and no off-hook sequence is required. The start-up test mode is enabled by default. When the PDL bit (Register 6, bit 4) is set (the default case), the line side is in a powerdown mode, and the system-side is in a digital loopback mode. In this mode, data received on DRX passes through the internal filters and is transmitted on DTX. This path introduces approximately 0.9 dB of attenuation on the DRX signal received. The group delay of both transmit and receive filters exists between DRX and DTX. Clearing the PDL bit disables this mode, and the DTX data switches to the receive data from the line side. When the PDL bit is cleared, the 26 FDT bit (Register 12, bit 6) becomes active to indicate that successful communication between the line side and system side is established. This provides verification that the communications link is operational. The digital data loop-back mode offers a way to input data on the DRX pin and have the identical data output on the DTX pin through bypassing the transmit and receive filters. Setting the DDL bit (Register 10, bit 0) enables this mode, which provides an easy way to verify communication between the host processor/DSP and the DAA. No line-side power or off-hook sequence is required for this mode. The remaining test modes require an off-hook sequence to operate. The following sequence lists the off-hook requirements: 1. Powerup or reset. 2. Allow the internal PLL to lock on PCLK and FSYNC. 3. Enable line-side by clearing PDL bit. 4. Issue an off-hook command. 5. Delay 402.75 ms for calibration to occur. 6. Set desired test mode. The communications link digital loopback mode allows the host processor to provide a digital input test pattern on DRX and receive that digital test pattern back on DTX. To enable this mode, set the IDL bit (Register 1, bit 1). The communications link is tested in this mode. The digital stream is delivered across the isolation capacitors, C1 and C2, of the "2. Typical Application Schematic" on page 17, to the line-side device and returned across the same path. In this digital loopback mode, the 0.9 dB attenuation and filter group delays also exist. The PCM analog loopback mode extends the signal path of the analog loopback mode. In this mode, an analog signal is driven from the line into the line-side device. This analog signal is converted to digital data and then passed across the communications link to the system-side device. The data passes through the receive filter, through the transmit filter, and is then passed across the communications link and sent back out onto the line as an analog signal. Set the PCML bit (Register 33, bit 7) to enable this mode. With the final testing mode, internal analog loopback, the system can test the operation of the transmit and receive paths on the line-side device and the external components in the "2. Typical Application Schematic" on page 17. The host provides a digital test waveform on DRX. Data passes across the isolation barrier, is transmitted to and received from the line, passes back across the isolation barrier, and is presented to the host on DTX. Clear the HBE bit (Register 2, bit 1) to enable this mode. Rev. 1.5 Si3050 + Si3011/18/19 When the HBE bit is cleared, it produces a dc offset that affects the signal swing of the transmit signal. Silicon Laboratories recommends that the transmit signal be 12 dB lower than normal transmit levels. A lower level eliminates clipping from the dc offset that results from disabling the hybrid. It is assumed in this test that the line ac impedance is nominally 600  Note: All test modes are mutually exclusive. If more than one test mode is enabled concurrently, the results are unpredictable. mode (or 2x full scale) is enabled by setting the FULL2 bit in Register 30. With FULL2 = 1, the full-scale signal level increases to +6.0 dBm into a 600  load or 1.5 dBV into all reference impedances. The full-scale and enhanced full-scale modes provide the ability to trade off TX power and TX distortion for a peak signal. By using the programmable digital gain registers in conjunction with the enhanced full-scale signal level mode, a specific power level (+3.2 dBm for example) can be achieved across all ACT settings. 5.8. Exception Handling 5.11. Parallel Handset Detection The Si3050 can determine if an error occurs during operation. Through the secondary frames of the serial link, the controlling DSP can read several status bits. The bit of highest importance is the frame detect bit (FDT, Register 12, bit 6) which indicates that the system-side (Si3050) and line-side (Si3011, 3018 or Si3019) devices are communicating. During normal operation, the FDT bit can be checked before reading the bits that indicate information about the line side. If FDT is not set, the following bits related to the line side are invalid—RDT, RDTN, RDTP, LCS[4:0], LSID[1:0], REVB[3:0], LVS[7:0], LCS2[7:0], ROV, BTD, DOD, and OVL; the RGDT operation is also non-functional. The Si3050 can detect a parallel handset going off-hook. When the Si3050 is off-hook, the loop current can be monitored with the LCS or LCS2 bits. A significant drop in loop current signals a parallel handset going off-hook. If a parallel handset going off-hook causes the loop current to drop to 0, the LCS and LCS2 bits will read all 0s. Additionally, the Drop-Out Detect (DOD) bit will fire (and generate an interrupt if the DODM bit is set) indicating that the line-derived power supply has collapsed. Following powerup and reset, the FDT bit is not set because the PDL bit (Register 6 bit 4) defaults to 1. In this state, the ISOcap is not operating and no information about the line side can be determined. The user must provide a valid PCLK and FSYNC to the system and clear the PDL bit to activate the ISOcap link. Communication with the line-side device takes less than 10 ms to establish. 5.9. Revision Identification The Si3050 provides information to determine the revision of the Si3050 and/or the Si3011/18/19. The REVA[3:0] bits (Register 11) identify the revision of the Si3050, where 0101b denotes revision E. The REVB[3:0] bits (Register 13) identify the revision of the line-side device, where 0110b denotes revision F. 5.10. Transmit/Receive Full-Scale Level The Si3050 supports programmable maximum transmit and receive levels. The default signal level supported by the Si3050 is 0 dBm into a 600  load. Two additional modes of operation offer increased transmit and receive level capability to enable use of the DAA in applications that require higher signal levels. The full-scale mode is enabled by setting the FULL bit in Register 31. With FULL = 1 (Si3019 only), the full-scale signal level increases to +3.2 dBm into a 600  load or 1 dBV into all reference impedances. The enhanced full-scale With the Si3019 line side, the LVS bits also can be read when on- or off-hook to determine the line voltage. Significant drops in line voltage can signal a parallel handset. For the Si3050 to operate in parallel with another handset, the parallel handset must have a sufficiently high dc termination to support two off-hook DAAs on the same line. Improved parallel handset operation can be achieved by changing the dc impedance from 50  to 800  and reducing the DCT pin voltage with the DCV[1:0] bits. 5.12. Line Voltage/Loop Current Sensing The Si3050 can measure loop current with either the Si3011, Si3018 or the Si3019 line-side device. The 5-bit LCS[4:0] register reports loop current measurements when off-hook. The Si3011 and Si3019 offer an additional register to report loop current to a finer resolution (LCS2[7:0]). The Si3050 can only measure line voltage when used with the Si3011 and Si3019 line-side devices. The LVS[7:0] register is available with the Si3011 or Si3019, and monitors voltage both on and off-hook. These registers can be used to help determine the following line conditions: When on-hook, detect if a line is connected. When on-hook, detect if a parallel phone is off-hook.  When off-hook, detect if a parallel phone goes on or off-hook.  Detect if enough loop current is available to operate.  When used in conjunction with the OPD bit, detect if an overload condition exists. (See "5.26. Overload Detection" on page 37.)   Rev. 1.5 27 Si3050 + Si3011/18/19 5.12.1. Line Voltage Measurement (Si3011 and Si3019 Line Side Devices Only) The Si3050 reports line voltage with the LVS[7:0] bits (Register 29) in both on- and off-hook states with a resolution of 1 V per bit. The accuracy of these bits is approximately ±10%. Bits 0 through 7 of this 8-bit signed number indicate the value of the line voltage in 2s complement format. Bit 7 indicates the polarity of the TIP/RING voltage. If the INTE bit (Register 2, bit 7) and the POLM bit (Register 3, bit 0) are set, a hardware interrupt is generated on the AOUT/INT pin when Bit 7 of the LVS register changes state. The edge-triggered interrupt is cleared by writing 0 to the POLI bit (Register 4, bit 0). The POLI bit is set each time bit 7 of the LVS register changes state, and must be written to 0 to clear it. The default state of the LVS register forces the LVS[7:0] bits to 0 when the line voltage is 3 V or less. The LVFD bit (Register 31, bit 0) disables this force-to-zero function and allows the LVS register to display non-zero values of 3 V and below. This register may display unpredictable values at line voltages between 0 to 2 V. At 0 V, the LVS register displays all 0s. Possible Overload 30 25 20 LCS BITS 15 10 5 0 0 3.3 6.6 9.9 13.2 16.5 19.8 23.1 26.4 29.7 33 36.3 39.6 42.9 46.2 49.5 52.8 56.1 59.1 62.7 66 Loop Current (mA) 69.3 72.6 75.9 79.2 82.5 85.8 89.1 92.4 95.7 99 102.3 Figure 21. Typical Loop Current LCS Transfer Function (ILIM = 0) 28 Rev. 1.5 127 Si3050 + Si3011/18/19 5.12.2. Loop Current Measurement When the Si3050 is off-hook, the LCS[4:0] bits measure loop current in 3.3 mA/bit resolution. With the LCS[4:0] bits, a user can detect another phone going off-hook by monitoring the dc loop current. The line current sense transfer function is shown in Figure 21 and is detailed in Table 14. The LCS and LCS2 bits report loop current down to the minimum operating loop current for the DAA. Below this threshold, the reported value of loop current is unpredictable. The minimum operating loop current of the DAA is set by the MINI[1:0] bits in Register 26. When the LCS bits reach max value, the Loop Current Sense Overload Interrupt bit (Register 4) fires. LCSOI firing however, does not necessarily imply that an overcurrent situation has occurred. An overcurrent situation in the DAA is determined by the status of the OPD bit (Register 19). After the LCSOI interrupt fires, the OPD bit should be checked to determine if an overcurrent situation exists. The OPD bit indicates an overcurrent situation when loop current exceeds either 160 mA (ILIM = 0) or 60 mA (ILIM = 1), depending on the setting of the ILIM bit (Register 26). Table 14. Loop Current Transfer Function LCS[4:0] Condition 00000 Insufficient line current for normal operation. Use the DOD bit (Register 19, bit 1) to determine if a line is still connected. 00100 Minimum line current for normal operation. (MINI[1:0] = 01) 11111 Loop current may be excessive. Use the OPD bit to determine if an overload condition exists. The LCS2 register also reports loop current in the off-hook state. This register has a resolution of 1.1 mA per bit. 5.13. Off-Hook The communication system generates an off-hook command by setting the OH bit (Register 5, bit 0). This off-hook state seizes the line for incoming/outgoing calls. It also can be used for pulse dialing. With the OH bit at logic 0, negligible dc current flows through the hookswitch. When a logic 1 is written to the OH bit, the hookswitch transistor pair, Q1 and Q2, turn on. A termination impedance across TIP and RING is applied and causes dc loop current to flow. The termination impedance has both an ac and a dc component. Several events occur in the DAA when the OH bit is set. There is a 250 µs latency for the off-hook command to be communicated to the line-side device. When the line-side device goes off-hook, an off-hook counter forces a delay to allow line transients to settle before transmission or reception can occur. The off-hook counter time is controlled by the FOH[1:0] bits (Register 31, bits 6:5). The default setting for the off-hook counter time is 128 ms, but can be adjusted up to 512 ms or down to 64 or 8 ms. After the off-hook counter expires, a resistor calibration is performed for 17 ms to allow the DAA internal circuitry to adjust to the exact conditions present at the time of going off-hook. This resistor calibration can be disabled by setting the RCALD bit (Register 25, bit 5). After the resistor calibration is performed, an ADC calibration is performed for 256 ms. This calibration helps to remove offset in the A/D sampling the telephone line. ADC calibration can be disabled by setting the CALD bit (Register 17, bit 5). See "5.6. Calibration" on page 26 for more information on automatic and manual calibration. Silicon Laboratories recommends that the resistor and the ADC calibrations not be disabled except when a fast response is needed after going off-hook, such as when responding to a Type II Caller-ID signal. See "5.25. Caller ID" on page 36 for detailed information. To calculate the total time required to go off-hook and start transmission or reception, include the digital filter delay (typically 1.5 ms with the FIR filter) in the calculation. 5.14. Ground Start Support The Si3050 DAA supports loop-start applications by default. It can also support ground-start applications with the RG, TGD, and TGDE pins and the schematic shown in Figure 22. The component values are listed in Table 15. Rev. 1.5 29 Si3050 + Si3011/18/19 on RING and grounds TIP. This sets the TGD bit (Register 32, bit 2). The DAA may then be taken off-hook and the relay in series with RING opened (clear the RG bit). The call continues as in loop-start mode. VD R106 TGDb 5.14.3. CO Requests Line Seizure -24V R105 In a normal on-hook state, the relay in series with TIP should be closed, connecting the –24 V isolated supply. The CO grounds TIP to request line seizure, causing current to flow. The opto-isolator U3 (see Figure 22 on page 30) detects this current and sets the TGD bit (Register 32, bit 2). This bit remains high as long as current is detected. The TGDI bit (Register 4, bit 1) is a sticky bit, and remains high until cleared. A hardware interrupt on the AOUT/INT can be made to occur when TIP current begins to flow by enabling the TGDM bit (Register 3, bit 1). Clear the interrupt by writing 0 to the TGDI bit (Register 4 bit 1). The DAA may then be taken off-hook and the call continued as in loop-start mode. U3 1 1 4 4 2 2 3 3 Opto-Isolator VD R104 R102 R103 RL1 TGDEb RGb 1 1 8 8 2 2 7 7 TIP 3 3 6 6 RING 4 4 5 5 Opto-Relay R101 5.15. Interrupts Figure 22. Typical Application Circuit for Ground Start Support on the SI3050 Table 15. Component Values for the Ground Start Support Schematic Symbol Value Supplier(s) R101 200 , 2 W, ±5% Venkel, SMEC, Panasonic R102, R103, R106 1 k, 1/10 W, ±5% Venkel, SMEC, Panasonic R104 1.5 k, 1/10 W, ±5% Venkel, SMEC, Panasonic R105 10 k, 1/2 W, ±5% Venkel, SMEC, Panasonic RL1 AQW210S Aromat, NEC U3 PS2501L-1 NEC, Fairchild 5.14.1. Ground Start Idle Ensure the relay in series with TIP is closed by clearing the TGOE bit (Register 32, bit 1). This enables the DAA to sense if the CO grounds TIP. Set RG to 1 (Register 32, bit 0) so that no current flows through the relay connecting RING to ground. 5.14.2. DAA Requests Line Seizure With TGOE set to zero, seize the line by closing the relay in series with RING (clear the RG bit, Register 32, bit 0). The CO detects this current flowing 30 The AOUT/INT pin can be used as a hardware interrupt pin by setting the INTE bit (Register 2, bit 7). When this bit is set, the analog output used for call progress monitoring is not available. The default state of this interrupt output pin is active low, but active high operation can be enabled by setting the INTP bit (Register 2, bit 6). This pin is an open-drain output when the INTE bit is set and requires a 4.7 k pullup or pulldown for correct operation. If multiple INT pins are connected to a single input, the combined pullup or pulldown resistance should equal 4.7 k Bits 7–0 in Register 3 and bit 1 in Register 44 can be set to enable hardware interrupt sources (bit 0 is available with the Si3011 and Si3019 line-side devices only). When one or more of these bits is set, the AOUT/INT pin goes into an active state and stays active until the interrupts are serviced. If more than one hardware interrupt is enabled in Register 3, use software polling to determine the cause of the interrupts. Register 4 and bit 3 of Register 44 contain sticky interrupt flag bits. Clear these bits after servicing the interrupt. Registers 43 and 44 contain the line current/voltage threshold interrupt. These line current/voltage registers and interrupt are only available with the Si3011 and Si3019 line-side devices. This interrupt is triggered when the measured line voltage or current in the LVS or LCS2 registers, as selected by the CVS bit (Register 44, bit 2), crosses the threshold programmed into the CVT[7:0] bits. With the CVP bit, the interrupt can be programmed to occur when the measured value rises above or falls below the threshold. Only the magnitude of the measured value is used for comparison to the threshold programmed into the Rev. 1.5 Si3050 + Si3011/18/19 CVT[7:0] bits. Therefore, only positive numbers should be used as a threshold. 5.16. DC Termination The DAA has programmable settings for the dc impedance, current limiting, minimum operational loop current and TIP/RING voltage. The dc impedance of the DAA is normally represented with a 50  slope as shown in Figure 23, but can be changed to an 800  slope by setting the DCR bit. This higher dc termination presents a higher resistance to the line as loop current increases. Voltage Across DAA (V) 12 Finally, Australia has separate dc termination requirements for line seizure versus line hold. Japan mode (only available with the Si3018 or Si3019) may be used to satisfy both requirements. However, if a higher transmit level for modem operation is desired, switch to FCC mode 500 ms after the initial off-hook. This satisfies the Australian dc termination requirements. FCC DCT Mode 11 10 9 5.17. AC Termination 8 7 6 .01 .02 .03 .04 .05 .06 .07 .08 .09 .1 .11 Loop Current (A) Figure 23. FCC Mode I/V Characteristics, DCV[1:0] = 11, MINI[1:0] = 00, ILIM = 0 For applications requiring current limiting per the TBR21 standard, the ILIM bit may be set to select this mode. In this mode, the dc I/V curve is changed to a 2000  slope above 40 mA, as shown in Figure 24. This allows the DAA to operate with a 50 V, 230  feed, which is the maximum linefeed specified in the TBR21 standard. Voltage Across DAA (V) 45 The MINI[1:0] bits select the minimum operational loop current for the DAA, and the DCV[1:0] bits adjust the DCT pin voltage, which affects the TIP/RING voltage of the DAA. These bits allow important trade-offs to be made between signal headroom and minimum operational loop current. Increasing TIP/RING voltage increases signal headroom, whereas decreasing the TIP/RING voltage allows compliance to PTT standards in low-voltage countries, such as Japan. Increasing the minimum operational loop current above 10 mA also increases signal headroom and prevents degradation of the signal level in low-voltage countries. TBR21 DCT Mode 40 35 30 The Si3050 + Si3011 chipset provides two ac termination impedances. The Si3050 + Si3018 chipset provides four ac termination impedances. The ACIM[3:0] bits in Register 30 are used to select the ac impedance setting. The two available settings for the Si3050 + Si3011 chipset are listed in Table 16. The four available settings for the Si3018 are listed in Table 17. If an ACIM[3:0] setting other than the four listed in Table 16 or Table 17 is selected, the ac termination is forced to 600  (ACIM[3:0] = 0000). The programmable digital hybrid can be used to further reduce near-end echo for each of the four listed ac termination settings. See "5.28. Transhybrid Balance" on page 38 for details. Table 16. AC Termination Settings for the Si3011 Line-Side Device ACIM[3:0] AC Termination 0000 600  0001 210  + (750  || 150 nF) and 275  + (780  || 150 nF) 25 20 15 10 5 .015 .02 .025 .03 .035 .04 .045 .05 .055 .06 Loop Current (A) Figure 24. TBR21 Mode I/V Characteristics, DCV[1:0] = 11, MINI[1:0] = 00, ILIM = 1 Rev. 1.5 31 Si3050 + Si3011/18/19 Table 17. AC Termination Settings for the Si3018 Line-Side Device Table 18. AC Termination Settings for the Si3019 Line-Side Device ACIM[3:0] AC Termination 0000 600  0011 220  + (820  || 120 nF) and 220  + (820  || 115 nF) 0100 370  + (620  || 310 nF) 1111 Global complex impedance ACIM[3:0] The Si3019 provides sixteen ac termination impedances when used with the Si3050. The ACIM[3:0] bits in Register 30 are used to select the ac impedance setting on the Si3019. The sixteen available settings for the Si3019 are listed in Table 18. The most widely used ac terminations are available as register options to satisfy various global PTT requirements. The real 600  impedance satisfies the requirements of FCC Part 68, JATE, and other country requirements. The 270  + (750  || 150 nF) satisfies the requirements of TBR21. There are two selections useful for satisfying non-standard ac termination requirements. The 350  + (1000  || 210 nF) impedance selection in Register 30 is the ANSI/EIA/TIA 464 compromise impedance network for trunks. The last ac termination selection, ACIM[3:0] = 1111, is designed to satisfy minimum return loss requirements for every country that requires a complex termination. By selecting this setting, the system is ensured to meet minimum PTT requirements. For each of the sixteen ac termination settings, the programmable digital hybrid can be used to further reduce near-end echo. See "5.28. Transhybrid Balance" on page 38 for details. 32 Rev. 1.5 AC Termination 0000 600  0001 900  0010 270  + (750  || 150 nF) and 275  + (780  || 150 nF) 0011 220  + (820  || 120 nF) and 220  + (820  || 115 nF) 0100 370  + (620  || 310 nF) 0101 320  + (1050  || 230 nF) 0110 370  + (820  || 110 nF) 0111 275  + (780  || 115 nF) 1000 120  + (820  || 110 nF) 1001 350  + (1000  || 210 nF) 1010 200  + (680  || 100 nF) 1011 600  + 2.16 µF 1100 900  + 1 µF 1101 900  + 2.16 µF 1110 600  + 1 µF 1111 Global complex impedance Si3050 + Si3011/18/19 5.18. Ring Detection The ring signal is resistively coupled from TIP and RING to the RNG1 and RNG2 pins. The Si3050 supports either full- or half-wave ring detection. With full-wave ring detection, the designer can detect a polarity reversal of the ring signal. See “5.25.Caller ID” on page 36. The ring detection threshold is programmable with the RT bit (Register 16, bit 0) and RT2 bit (Register 17, bit 4). The ring detector output can be monitored in three ways. The first method uses the RGDT pin. The second method uses the register bits, RDTP, RDTN, and RDT (Register 5). The final method uses the DTX output. The ring detector mode is controlled by the RFWE bit (Register 18, bit 1). When the RFWE bit is 0 (default mode), the ring detector operates in half-wave rectifier mode. In this mode, only positive ring signals are detected. A positive ring signal is defined as a voltage greater than the ring threshold across RNG1-RNG2. Conversely, a negative ring signal is defined as a voltage less than the negative ring threshold across RNG1-RNG2. When the RFWE bit is 1, the ring detector operates in full-wave rectifier mode. In this mode, both positive and negative ring signals are detected. The first method to monitor ring detection output uses the RGDT pin. When the RGDT pin is used, it defaults to active low, but can be changed to active high by setting the RPOL bit (Register 14, bit 1). This pin is an open-drain output, and requires a 4.7 k pullup or pulldown for correct operation. If multiple RGDT pins are connected to a single input, the combined pullup or pulldown resistance should equal 4.7 k When the RFWE bit is 0, the RGDT pin is asserted when the ring signal is positive, which results in an output signal frequency equal to the actual ring frequency. When the RFWE bit is 1, the RGDT pin is asserted when the ring signal is positive or negative. The output then appears to be twice the frequency of the ring waveform. The second method to monitor ring detection uses the ring detect bits (RDTP, RDTN, and RDT). The RDTP and RDTN behavior is based on the RNG1-RNG2 voltage. When the signal on RNG1-RNG2 is above the positive ring threshold, the RDTP bit is set. When the signal on RNG1-RNG2 is below the negative ring threshold, the RDTN bit is set. When the signal on RNG1-RNG2 is between these thresholds, neither bit is set. The RDT behavior is also based on the RNG1-RNG2 voltage. When the RFWE bit is 0, a positive ring signal sets the RDT bit for a period of time. When the RFWE bit is 1, a positive or negative ring signal sets the RDT bit. The RDT bit acts like a one shot. When a new ring signal is detected, the one shot is reset. If no new ring signals are detected prior to the one shot counter reaching 0, then the RDT bit clears. The length of this count is approximately 5 seconds. The RDT bit is reset to 0 by an off-hook event. If the RDTM bit (Register 3, bit 7) is set, a hardware interrupt occurs on the AOUT/INT pin when RDT is triggered. This interrupt can be cleared by writing to the RDTI bit (Register 4, bit 7). When the RDI bit (Register 2, bit 2) is set, an interrupt occurs on both the beginning and end of the ring pulse as defined by the RTO bits (Register 23, bits 6:3). Ring validation may be enabled when using the RDI bit. The third method to monitor detection uses the DTX data samples to transmit ring data. If the ISOcap is active (PDL= 0) and the device is not off-hook or in on-hook line monitor mode, the ring data is presented on DTX. The waveform on DTX depends on the state of the RFWE bit. When RFWE is 0, DTX is –32768 (0x8000) while the RNG1-RNG2 voltage is between the thresholds. When a ring is detected, DTX transitions to +32767 when the ring signal is positive, then goes back to –32768 when the ring is near 0 and negative. Thus a near square wave is presented on DTX that swings from –32768 to +32767 in cadence with the ring signal. When RFWE is 1, DTX sits at approximately +1228 while the RNG1-RNG2 voltage is between the thresholds. When the ring becomes positive, DTX transitions to +32767. When the ring signal goes near 0, DTX remains near 1228. As the ring becomes negative, the DTX transitions to –32768. This repeats in cadence with the ring signal. To observe the ring signal on DTX, watch the MSB of the data. The MSB toggles at the same frequency as the ring signal independent of the ring detector mode. This method is adequate for determining the ring frequency. Rev. 1.5 33 Si3050 + Si3011/18/19 5.19. Ring Validation Ring validation prevents false triggering of a ring detection by validating the ring parameters. Invalid signals, such as a line-voltage change when a parallel handset goes off-hook, pulse dialing, or a high-voltage line test are ignored. Ring validation can be enabled during normal operation and in low-power sleep mode when a valid external PCLK signal is supplied. The ring validation circuit operates by calculating the time between alternating crossings of positive and negative ring thresholds to validate that the ring frequency is within tolerance. High and low frequency tolerances are programmable in the RAS[5:0] and RMX[5:0] fields. The RCC[2:0] bits define how long the ring signal must be within tolerance. Once the duration of the ring frequency is validated by the RCC bits, the circuitry stops checking for frequency tolerance and begins checking for the end of the ring signal, which is defined by a lack of additional threshold crossings for a period of time configured by the RTO[3:0] bits. When the ring frequency is first validated, a timer defined by the RDLY[2:0] bits is started. If the RDLY[2:0] timer expires before the ring timeout, then the ring is validated and a valid ring is indicated. If the ring timeout expires before the RDLY[2:0] timer, a valid ring is not indicated. Ring validation requires the following five parameters:  Timeout parameter to place a lower limit on the frequency of the ring signal (the RAS[5:0] bits in Register 24). The frequency is measured by calculating the time between crossings of positive and negative ring thresholds.  Minimum count to place an upper limit on the frequency (the RMX[5:0] bits in Register 22).  Time interval over which the ring signal must be the correct frequency (the RCC[2:0] bits in Register 23).  Timeout period that defines when the ring pulse has ended based on the most recent ring threshold crossing.  Delay period between when the ring signal is validated and when a valid ring signal is indicated to accommodate distinctive ringing. The RNGV bit (Register 24, bit 7) enables or disables the ring validation feature in both normal operating mode and low-power sleep mode. Ring validation affects the behavior of the RDT status bit, the RDTI interrupt, the INT pin, and the RGDT pin. 1. When ring validation is enabled, the status bit seen in the RDT read-only bit (r5.2), represents the detected envelope of the ring. The ring validation parameters are configurable so that this envelope 34 may remain high throughout a distinctive-ring sequence. 2. The RDTI interrupt fires when a validated ring occurs. If RDI is zero (default), the interrupt occurs on the rising edge of RDT. If RDI is set, the interrupt occurs on both rising and falling edges of RDT. 3. The INT pin follows the RDTI bit with configurable polarity. 4. The RGDT pin can be configured to follow the ringing signal envelope detected by the ring validation circuit by setting RFWE to 0. If RFWE is set to 1, the RGDT pin follows an unqualified ring detect one-shot signal initiated by a ring-threshold crossing and terminated by a fixed counter timeout of approximately 5 seconds. (This information is shown in Register 18). 5.20. Ringer Impedance and Threshold The ring detector in a typical DAA is ac coupled to the line with a large 1 F, 250 V decoupling capacitor. The ring detector on the Si3011/18/19 is resistively coupled to the line. This coupling produces a high ringer impedance to the line of approximately 20 M to meet the majority of country PTT specifications including FCC and TBR21. Several countries including Poland, South Africa, and Slovenia require a maximum ringer impedance that can be met with an internally-synthesized impedance by setting the RZ bit (Register 16). Certain countries also specify ringer thresholds differently. The RT and RT2 bits (Register 16 and Register 17, respectively) select between three different ringer thresholds: 15 V ±10%, 21 V ±10%, and 45 V ±10%. These three settings enable satisfaction of global ringer threshold requirements. Thresholds are set so that a ring signal is guaranteed to not be detected below the minimum, and a ring signal is guaranteed to be detected above the maximum. 5.21. Pulse Dialing and Spark Quenching Pulse dialing is accomplished by going off- and on-hook to generate make and break pulses. The nominal rate is 10 pulses per second. Some countries have strict specifications for pulse fidelity including make and break times, make resistance, and rise and fall times. In a traditional, solid-state dc holding circuit, there are a number of issues in meeting these requirements. The Si3050 dc holding circuit has active control of the on- and off-hook transients to maintain pulse dialing fidelity. Spark quenching requirements in countries, such as Italy, the Netherlands, South Africa, and Australia, deal Rev. 1.5 Si3050 + Si3011/18/19 with the on-hook transition during pulse dialing. These tests provide an inductive dc feed resulting in a large voltage spike. This spike is caused by the line inductance and the sudden decrease in current through the loop when going on-hook. The traditional way of dealing with this problem is to put a parallel RC shunt across the hookswitch relay. The capacitor is large (~1 µF, 250 V) and relatively expensive. In the Si3050, loop current can be controlled to achieve three distinct on-hook speeds to pass spark quenching tests without additional BOM components. Through the settings of four bits in three registers, OHS (Register 16), OHS2 (Register 31), SQ0, and SQ1 (Register 59), a slow ramp down of loop current can be achieved which induces a delay between the time the OH bit is cleared and the time the DAA actually goes on-hook. To ensure proper operation of the DAA during pulse dialing, disable the automatic resistor calibration that is performed each time the DAA enters the off-hook state by setting the RCALD bit (Register 25, bit 5). bits will be set. An external interrupt can optionally be triggered by the DODI bit by setting the DODM and INTE bits. 5.23. Billing Tone Filter (Optional) Optionally, a billing tone filter may be inserted between the line and the voice DAA to minimize disruptions caused by large billing tones. The notch filter design requires two notches, one at 12 kHz and one at 16 kHz. Because these components are expensive and few countries utilize billing tones, this filter is typically placed in an external dongle or added as a population option. Figure 25 shows a billing tone filter example. Table 19 gives the component values. L1 must carry the entire loop current. The series resistance of the inductors is important to achieve a narrow and deep notch. This design has more than 25 dB of attenuation at both 12 kHz and 16 kHz. C1 5.22. Receive Overload Detection C2 The Voice DAA chipset is capable of monitoring and reporting receive overload conditions on the line. Billing tones, parallel phone off-hook events, polarity reversals and other disturbances on the line may trigger multiple levels of overload detection as described below. Transient events less than 1.1 VPK on the line are filtered out by the low-pass digital filter on the Si3050 + Si3011 and Si3050+Si3019. The ROV and ROVI bits are set when the received signal is greater than 1.1 VPK. Both bits will continue to indicate an overload condition until a zero is written to clear. The OVL mirrors the function of the ROV and ROVI bits but it automatically clears after the overload condition has been removed. When the OVL bit returns to 0, the DAA initiates an auto-calibration sequence that must complete before data can be transmitted. An external interrupt can optionally be triggered by the ROVI bit by setting the ROVM and INTE bits. Certain events such as billing tones can be sufficiently large to disrupt the line-derived power supply of the Voice DAA line side device (Si3011, Si3018 or Si3019.) To ensure that the device maintains the off-hook line state during these events, the BTE bit should be set. If such an event occurs while the BTE bit is set, the BTD and BTDI bits will be asserted. A zero must be written to the BTE bit to clear the BTD and BTDI bits. An external interrupt can optionally be triggered by the BTDI bit by setting the BTDM and INTE bits. In the event that a line disturbance causes the loop current to collapse below the minimum required operating current of the Voice DAA, the DOD and DODI L1 TIP From Line L2 C3 To DAA RING Figure 25. Billing Tone Filter Table 19. Component Values—Optional Billing Tone Filters Component Value C1,C2 0.027 µF, 50 V, ±10% C3 0.01 µF, 250 V, ±10% L1 3.3 mH, >120 mA, 40 mA, 127 mA, and an overload condition may exist. Read returns zero. Frame Detect. 0 = Indicates ISOcap link has not established frame lock. 1 = Indicates ISOcap link frame lock is established. Rev. 1.5 71 Si3050 + Si3011/18/19 Register 13. Line-Side Device Revision Bit D7 D6 D5 D4 D3 Name 1 REVB[3:0] Type R R D2 D1 D0 D2 D1 D0 Reset settings = xxxx_xxxx Bit Name Function 7 Reserved Read returns zero. 6 Reserved This bit always reads a one. 5:2 REVB[3:0] Line-Side Device Revision. Four-bit value indicating the revision of the line-side device. 1:0 Reserved Read returns zero. Register 14. DAA Control 4 Bit D7 D6 D5 D4 D3 Name RPOL Type R/W Reset settings = 0000_0000 Bit Name 7:2 Reserved 1 RPOL Function Read returns zero. Ring Detect Polarity. 0 = The RGDT pin is active low. 1 = The RGDT pin is active high. 0 72 Reserved Read returns zero. Rev. 1.5 Si3050 + Si3011/18/19 Register 15. TX/RX Gain Control 1 Bit D7 D6 D5 D4 D3 Name TXM RXM Type R/W R/W D2 D1 D0 Reset settings = 0000_0000 Bit Name 7 TXM 6:4 Reserved 3 RXM 2:0 Reserved Function Transmit Mute. 0 = Transmit signal is not muted. 1 = Mutes the transmit signal. Read returns zero. Receive Mute. 0 = Receive signal is not muted. 1 = Mutes the receive signal. Read returns zero. Rev. 1.5 73 Si3050 + Si3011/18/19 Register 16. International Control 1 Bit D7 D6 D5 D4 D3 D2 D1 D0 Name OHS IIRE RZ RT Type R/W R/W R/W R/W Reset settings = 0000_0000 Bit 7 6 5 Name Function Reserved These bits may be written to a zero or one. OHS On-Hook Speed. Si3018 and Si3019 line-side only. This bit, in combination with the OHS2 bit (Register 31) and the SQ[1:0] bits (Register 59), sets the amount of time for the line-side device to go on-hook. The on-hook speeds specified are measured from the time the OH bit is cleared until loop current equals zero. OHS OHS2 SQ[1:0] Mean On-Hook Speed 0 0 00 Less than 0.5 ms 0 1 00 3 ms ±10% (meets ETSI standard) 1 X 11 26 ms ±10% (meets Australia spark quenching spec) For Si3011 line-side device, this bit may be written to a zero or one. Reserved These bits may be written to a zero or one. IIR Filter Enable. 0 = FIR filter enabled for transmit and receive filters. (See Figures 7–10 on page 15.) 1 = IIR filter enabled for transmit and receive filters. (See Figures 11–16 on page 16.) 4 IIRE 3:2 Reserved 1 RZ Ringer Impedance. Si3018 and Si3019 line-side only. 0 = Maximum (high) ringer impedance. 1 = Synthesized ringer impedance used to satisfy a maximum ringer impedance specification in countries, such as Poland, South Africa, and Slovenia. For Si3011 line-side device, this bit may be written to a zero or one. 0 RT Ringer Threshold Select. Si3018 and Si3019 line-side only. This bit, in combination with the RT2 bit, is used to satisfy country requirements on ring detection. Signals below the lower level do not generate a ring detection; signals above the upper level are guaranteed to generate a ring detection. RT RT2 RT Lower level RT Upper level 0 0 13.5 Vrms 16.5 Vrms 0 1 Reserved, do not use this setting. 23.65 VRMS 1 0 19.35 Vrms 1 1 40.5 Vrms 49.5 VRMS For Si3011 line-side device, this bit may be written to a zero or one. 74 Read returns zero. Rev. 1.5 Si3050 + Si3011/18/19 Register 17. International Control 2 Bit D7 D6 D5 D4 D3 D2 D1 D0 Name CALZ MCAL CALD RT2 OPE BTE ROV BTD Type R/W R/W R/W R/W R/W R/W R/W R Reset settings = 0000_0000 Bit 7 Name CALZ 6 MCAL 5 CALD 4 RT2 3 OPE 2 BTE Function Clear ADC Calibration. 0 = Normal operation. 1 = Clears the existing ADC calibration data. This bit must be written back to 0 after being set. Manual ADC Calibration. 0 = No calibration. 1 = Initiate manual ADC calibration. Auto-Calibration Disable. 0 = Enable auto-calibration. 1 = Disable auto-calibration. Ringer Threshold Select 2. Si3018 and Si3019 line-side only. This bit, in combination with the RT bit, is used to satisfy country requirements on ring detection. Signals below the lower level do not generate a ring detection; signals above the upper level are guaranteed to generate a ring detection. RT RT2 RT Lower level RT Upper level 0 0 13.5 Vrms 16.5 Vrms 0 1 Reserved, do not use this setting. 23.65 VRMS 1 0 19.35 Vrms 1 1 40.5 Vrms 49.5 VRMS For Si3011 line-side device, always write this bit to zero. Overload Protect Enable. 0 = Disabled. 1 = Enabled. The OPE bit should always be cleared before going off-hook. Billing Tone Detect Enable. The DAA can detect events, such as billing tones, that can cause a disruption in the line-side power supply. When this bit is set, the device will maintain off-hook during such events. If a billing tone is detected, the BTD bit (Register 17, bit 0) is set to indicate the event. Writing this bit to zero clears the BTD bit. 0 = Billing tone detection disabled. The BTD bit is not functional. 1 = Billing tone detection enabled. The BTD bit is not functional. Rev. 1.5 75 Si3050 + Si3011/18/19 Bit 1 Name ROV 0 BTD Function Receive Overload. This bit is set when the receive input has an excessive input level (i.e., receive pin goes below ground). Writing a 0 to this location clears this bit and the ROVI bit (Register 4, bit 6). 0 = Normal receive input level. 1 = Excessive receive input level. Billing Tone Detected. This bit is set if an event, such as a billing tone, causes a disruption in the line-side power supply. Writing a zero to BTE clears this bit. 0 = No billing tone detected. 1 = Billing tone detected. Register 18. International Control 3 Bit D7 D6 D5 D4 D3 D2 D1 Name RFWE Type R/W D0 Reset settings = 0000_0000 Bit 7:3 2 1 0 76 Name Function Reserved Read returns zero. Reserved This bit may be written to a zero or one. RFWE Ring Detector Full-Wave Rectifier Enable. When RNGV (Register 24) is disabled, this bit controls the ring detector mode and the assertion of the RGDT pin. When RNGV is enabled, this bit configures the RGDT pin to either follow the ringing signal detected by the ring validation circuit, or to follow an unqualified ring detect one-shot signal initiated by a ring-threshold crossing and terminated by a fixed counter timeout of approximately 5 seconds. RNGV RFWE RGDT 0 0 Half-Wave 0 1 Full-Wave 1 0 Validated Ring Envelope 1 1 Ring Threshold Crossing One-Shot Reserved Read returns zero. Rev. 1.5 Si3050 + Si3011/18/19 Register 19. International Control 4 Bit D7 D6 D5 D4 D3 D2 D1 D0 Name OVL DOD OPD Type R R R Reset settings = 0000_0000 Bit Name Function 7:3 Reserved 2 OVL Receive Overload Detect. This bit has the same function as ROV (Register 17), but clears itself after the overload is removed. See “5.22.Receive Overload Detection” on page 35. This bit is only masked by the off-hook counter and is not affected by the BTE bit. 0 = Normal receive input level. 1 = Excessive receive input level. 1 DOD Recal/Dropout Detect. When the line-side device is off-hook, it is powered from the line itself. This bit will read 1 when loop current is not flowing. For example, if this line-derived power supply collapses, such as when the line is disconnected, this bit is set to 1. Additionally, when on-hook, and the line-side device is enabled, this bit is set to 1. 0 = Normal operation. 1 = Line supply dropout detected when off-hook. 0 OPD Overload Protect Detect. This bit is used to indicate that the DAA has detected a loop current overload. The detector firing threshold depends on the setting of the ILIM bit (Register 26). OPD ILIM Overcurrent Threshold Overcurrent Status 0 0 160 mA No overcurrent condition exists 0 1 60 mA No overcurrent condition exists 1 0 160 mA Overcurrent condition has been detected 1 1 60 mA Overcurrent condition has been detected Read returns zero. Rev. 1.5 77 Si3050 + Si3011/18/19 Register 20. Call Progress RX Attenuation Bit D7 D6 D5 D4 D3 Name ARM[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit Name Function 7:0 ARM[7:0] AOUT Receive Path Attenuation. When decremented from the default setting, these bits linearly attenuate the AOUT receive path signal used for call progress monitoring. Setting the bits to all 0s mutes the AOUT receive path. Attenuation = 20 log(ARM[7:0]/64) 1111_1111 = +12 dB (gain) 0111_1111 = +6 dB (gain) 0100_0000 = 0 dB 0010_0000 = –6 dB (attenuation) 0001_0000 = –12 dB ... 0000_0000 = Mute Register 21. Call Progress TX Attenuation Bit D7 D6 D5 D4 D3 Name ATM[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit Name 7:0 ATM[7:0] Function AOUT Transmit Path Attenuation. When decremented from the default settings, these bits linearly attenuate the AOUT transmit path signal used for call progress monitoring. Setting the bits to all 0s mutes the AOUT transmit path. Attenuation = 20 log(ATM[7:0]/64) 1111_1111 = +12 dB (gain) 0111_1111 = +6 dB (gain) 0100_0000 = 0 dB 0010_0000 = –6 dB (attenuation) 0001_0000 = –12 dB ... 0000_0000 = Mute 78 Rev. 1.5 Si3050 + Si3011/18/19 Register 22. Ring Validation Control 1 Bit D7 D6 D5 D4 D3 D2 Name RDLY[1:0] RMX[5:0] Type R/W R/W D1 D0 Reset settings = 1001_0110 Bit Name Function 7:6 RDLY[1:0] Ring Delay Bits 1 and 0. These bits, in combination with the RDLY[2] bit (Register 23), set the amount of time between when a ring signal is validated and when a valid ring signal is indicated. RDLY[2] RDLY[1:0] Delay 0 00 0 ms 0 01 256 ms 0 10 512 ms ... 1 11 1792 ms 5:0 RMX[5:0] Ring Assertion Maximum Count. These bits set the maximum ring frequency for a valid ring signal within a 10% margin of error. During ring qualification, a timer is loaded with the RAS[5:0] field upon a TIP/RING event and decrements at a regular rate. When a subsequent TIP/RING event occurs, the timer value is compared to the RMX[5:0] field and if it exceeds the value in RMX[5:0] then the frequency of the ring is too high and the ring is invalidated. The difference between RAS[5:0] and RMX[5:0] identifies the minimum duration between TIP/RING events to qualify as a ring, in binary-coded increments of 2.0 ms (nominal). A TIP/RING event typically occurs twice per ring tone period. At 20 Hz, TIP/RING events would occur every 1/ (2 x 20 Hz) = 25 ms. To calculate the correct RMX[5:0] value for a frequency range [f_min, f_max], the following equation should be used: 1 RMX  5:0   RAS  5:0  – --------------------------------------------- RMX  RAS 2  f_max  2 ms To compensate for error margin and ensure a sufficient ring detection window, it is recommended that the calculated value of RMX[5:0] be incremented by 1. Rev. 1.5 79 Si3050 + Si3011/18/19 Register 23. Ring Validation Control 2 Bit D7 D6 D5 D4 D3 D2 D1 Name RDLY[2] RTO[3:0] RCC[2:0] Type R/W R/W R/W D0 Reset settings = 0010_1101 Bit Name 7 RDLY[2] Ring Delay Bit 2. This bit, in combination with the RDLY[1:0] bits (Register 22), sets the amount of time between when a ring signal is validated and when a valid ring signal is indicated. RDLY[2] RDLY[1:0] Delay 0 00 0 ms 0 01 256 ms 0 10 512 ms ... 1 11 1792 ms 6:3 RTO[3:0] Ring Timeout. These bits set when a ring signal is determined to be over after the most recent ring threshold crossing. RTO[3:0] Ring Timeout 0000 DO NOT USE THIS SETTING 0001 128 ms 0010 256 ms ... 1111 1920 ms 2:0 RCC[2:0] Ring Confirmation Count. These bits set the amount of time that the ring frequency must be within the tolerances set by the RAS[5:0] bits and the RMX[5:0] bits to be classified as a valid ring signal. RCC[2:0] Ring Confirmation Count Time 000 100 ms 001 150 ms 010 200 ms 011 256 ms 100 384 ms 101 512 ms 110 640 ms 111 1024 ms 80 Function Rev. 1.5 Si3050 + Si3011/18/19 Register 24. Ring Validation Control 3 Bit D7 D6 D5 D4 D3 D2 Name RNGV RAS[5:0] Type R/W R/W D1 D0 Reset settings = 0001_1001 Bit Name 7 RNGV Function Ring Validation Enable. 0 = Ring validation feature is disabled. 1 = Ring validation feature is enabled in both normal operating mode and low-power mode. 6 Reserved This bit must always be written to 0. 5:0 RAS[5:0] Ring Assertion Time. These bits set the minimum ring frequency for a valid ring signal. During ring qualification, a timer is loaded with the RAS[5:0] field upon a TIP/RING event and decrements at a regular rate. If a second or subsequent TIP/RING event occurs after the timer has timed out then the frequency of the ring is too low and the ring is invalidated. The difference between RAS[5:0] and RMX[5:0] identifies the minimum duration between TIP/RING events to qualify as a ring, in binary-coded increments of 2.0 ms (nominal). A TIP/RING event typically occurs twice per ring tone period. At 20 Hz, TIP/RING events would occur every 1/(2 x 20 Hz) = 25 ms. To calculate the correct RAS[5:0] value for a frequency range [f_min, f_max], the following equation should be used: 1 RAS  5:0   ------------------------------------------2  f_min  2 ms Register 25. Resistor Calibration Bit D7 D6 D5 Name RCALS RCALM RCALD Type R R/W R/W D4 D3 D2 D1 D0 RCAL[3:0] R/W Reset settings = xx0x_xxxx Bit Name 7 RCALS Resistor Auto Calibration. 0 = Resistor calibration is not in progress. 1 = Resistor calibration is in progress. 6 RCALM Manual Resistor Calibration. 0 = No calibration. 1 = Initiate manual resistor calibration. (After a manual calibration has been initiated, this bit must be cleared within 1 ms.) 5 RCALD Resistor Calibration Disable. 0 = Internal resistor calibration enabled. 1 = Internal resistor calibration disabled. 4 Reserved 3:0 Function This bit can be written to a 0 or 1. RCAL[3:0] Always write back the value read. Result of resistor calibration. Do not modify this value. Rev. 1.5 81 Si3050 + Si3011/18/19 Register 26. DC Termination Control Bit D7 D6 D5 D4 Name DCV[1:0] MINI[1:0] Type R/W R/W D3 D2 D1 D0 0 0 ILIM DCR R/W R/W Reset settings = 0000_0000 Bit Name Function 7:6 DCV[1:0] TIP/RING Voltage Adjust. Si3018 and Si3019 line-side only. These bits adjust the voltage on the DCT pin of the line-side device, which affects the TIP/ RING voltage on the line. Low-voltage countries should use a lower TIP/RING voltage. Raising the TIP/RING voltage can improve signal headroom. DCV[1:0] DCT Pin Voltage 00 3.1 V 01 3.2 V 10 3.35 V 11 3.5 V For Si3011 line-side device, the only valid setting for DCV[1:0] is 10. 5:4 MINI[1:0] Minimum Operational Loop Current. Si3018 and Si3019 line-side only. Adjusts the minimum loop current at which the DAA can operate. Increasing the minimum operational loop current can improve signal headroom at a lower TIP/RING voltage. MINI[1:0] Min Loop Current 00 10 mA 01 12 mA 10 14 mA 11 16 mA For Si3011 line-side device, the only valid setting for MINI[1:0] is 00. 3:2 Reserved These bits must always be written to 0. 1 ILIM Current Limiting Enable. 0 = Current limiting mode disabled. 1 = Current limiting mode enabled. This mode limits loop current to a maximum of 60 mA per the TBR21 standard. 0 DCR DC Impedance Selection. 0 = 50  dc termination is selected. This mode should be used for all standard applications. 1 = 800  dc termination is selected. 82 Rev. 1.5 Si3050 + Si3011/18/19 Register 27. Reserved Bit D7 D6 D5 D4 D3 D2 D1 D0 D2 D1 D0 Name Type Reset settings = xxxx_xxxx Bit Name 7:0 Reserved Function Do not write to these register bits. Register 28. Loop Current Status Bit D7 D6 D5 D4 D3 Name LCS2[7:0] Type R Reset settings = 0000_0000 Bit 7:0 Name Function LCS2[7:0] Loop Current Status. Eight-bit value returning the loop current. Each bit represents 1.1 mA of loop current. 0000_0000 = Loop current is less than required for normal operation. Register 29. Line Voltage Status Bit D7 D6 D5 D4 D3 Name LVS[7:0] Type R D2 D1 D0 Reset settings = 0000_0000 Bit Name 7:0 LVS[7:0] Function Line Voltage Status. Eight-bit value returning the loop voltage. Each bit represents 1 V of loop voltage. This register operates in on- and off-hook modes. Bit seven of this register indicates the polarity of the TIP/RING voltage. When this bit changes state, it indicates that a polarity reversal has occurred. The value returned is represented in 2s complement format. 0000_0000 = No line is connected. Rev. 1.5 83 Si3050 + Si3011/18/19 Register 30. AC Termination Control Bit D7 D6 D5 D4 D3 D2 D1 Name FULL2 ACIM[3:0] Type R/W R/W D0 Reset settings = 0000_0000 Bit Name 7:6 Reserved Read returns zero. 5 Reserved This bit may be written to a zero or one. 4 FULL2 3:0 Function Enhanced Full Scale (2x) Transmit and Receive Mode. 0 = Default 1 = Transmit/Receive 2x Full Scale This bit changes the full scale of the ADC and DAC from 0 min to +6 dBm into 600  load (or 1.5 dBV into all reference impedances). When this bit is set, the DCV[1:0] bits (Register 26) should be set to all 1s to avoid distortion at low loop currents. ACIM[3:0] AC Impedance Selection. The off-hook ac termination is selected from the following: 0000 = 600  0001 = 900  0010 = 270  + (750 || 150 nF) and 275 + (780 || 150 nF) 0011 = 220  + (820 || 120 nF) and 220  + (820 || 115 nF) 0100 = 370  + (620  || 310 nF) 0101 = 320  + (1050  || 230 nF) 0110 = 370  + (820  || 110 nF) 0111 = 275  + (780  || 115 nF) 1000 = 120  + (820  || 110 nF) 1001 = 350  + (1000  || 210 nF) 1010 = 200  + (680  || 100 nF) 1011 = 600  + 2.16 µF 1100 = 900  + 1 µF 1101 = 900  + 2.16 µF 1110 = 600  + 1 µF 1111 = Global impedance For si3011 line-side device, always write bits 3:2 and bit 0 to zero. 84 Rev. 1.5 Si3050 + Si3011/18/19 Register 31. DAA Control 5 Bit D7 D6 D5 Name FULL FOH[1:0] Type R/W RW D4 D3 D2 D1 D0 0 OHS2 0 FILT LVFD R/W R/W R/W Reset settings = 0010_0000 Bit Name Function 7 FULL Full Scale Transmit and Receive Mode. Si3018 and Si3019 line-side only. 0 = Default. 1 = Transmit/receive full scale. This bit changes the full scale of the ADC and DAC from 0 dBm min to +3.2 dBm into a 600  load (or 1 dBV into all reference impedances). When this bit is set, the DCV[1:0] bits (Register 26) should be set to all 1s. The MINI[1:0] bits also should be set to all 0s. This ensures correct operation of the full scale mode. For Si3011 line-side device, always write this bit to zero. 6:5 4 3 2 FOH[1:0] Fast Off-Hook Selection. These bits determine the length of the off-hook counter. The default setting is 128 ms. 00 = 512 ms 01 = 128 ms 10 = 64 ms 11 = 8 ms Reserved Always write these bits to zero. OHS2 On-Hook Speed 2. This bit, in combination with the OHS bit (Register 16) and the SQ[1:0] bits on-hook speeds specified are measured from the time the OH bit is cleared until loop current equals zero. OHS OHS2 SQ[1:0] Mean On-Hook Speed 0 0 00 Less than 0.5 ms 0 1 00 3 ms ±10% (meets ETSI standard) 1 X 11 26 ms ±10% (meets Australia spark quenching spec) Reserved Always write these bits to zero. 1 FILT Filter Pole Selection. 0 = The receive path has a low –3 dBFS corner at 5 Hz. 1 = The receive path has a low –3 dBFS corner at 200 Hz. 0 LVFD Line Voltage Force Disable (Si3011 and Si3019 line-side only). 0 = Normal operation. 1 = The circuitry that forces the LVS register (Register 29) to all 0s at 3 V or less is disabled. The LVS register may display unpredictable values at voltages between 0 to 2 V. All 0s are displayed if the line voltage is 0 V. Rev. 1.5 85 Si3050 + Si3011/18/19 Register 32. Ground Start Control Bit D7 D6 D5 D4 D3 D2 D1 D0 Name TGD TGDE RG Type R W W Reset settings = 0000_0x11 Bit Name Function 7:3 Reserved Read returns zero. 2 TGD TIP Ground Detect. 0 = The CO has grounded TIP, causing current to flow. When current ceases to flow, this bit returns to a one. 1 = The CO has not grounded TIP causing current to flow. 1 TGDE TIP Ground Detect Enable. 0 = The external relay connecting TIP to an isolated supply is closed, enabling current to flow in TIP if the CO grounds TIP. 1 = The external relay connecting TIP to an isolated supply is open. In this state, the DAA is unable to determine if the CO has grounded TIP. 0 RG Ring Ground. 0 = The external relay connecting RING to ground is closed, causing current to flow in RING. 1 = The external relay connecting RING to ground is open, not allowing current to flow in RING. 86 Rev. 1.5 Si3050 + Si3011/18/19 Register 33. PCM/SPI Mode Select Bit D7 Name PCML Type R/W D6 R/W D5 D4 D3 D2 D1 D0 PCME PCMF[1:0] 0 PHCF TRI R/W R/W R/W R/W R/W Reset settings = 0000_0000 Bit Name Function 7 PCML PCM Analog Loopback. 0 = Normal operation. 1 = Enables analog data to be received from the line, converted to digital data and transmitted across the ISOcap link. The data passes through the RX filter and is looped back through the TX filter and is transmitted back out to the line. 5 PCME PCM Enable (Registers 34–37 should be set before PCM transfers are enabled). 0 = Disable PCM transfers. 1 = Enable PCM transfers. 4:3 PCMF[1:0] PCM Data Format. 00 = A-Law. Signed magnitude data format (refer to Table 23 on page 46). 01 = µ-Law. Signed magnitude data format (refer to Table 22 on page 45). 10 = 8-bit linear. The top 8-bits of the 16-bit linear signal are transferred, and the bottom 8-bits are discarded (2s complement data format). 11 = 16-bit linear (2s complement data format). 2 Reserved Always write this bit to zero. 1 PHCF 0 TRI PCM Highway Clock Format. 0 = 1 PCLK per data bit. 1 = 2 PCLKs per data bit. Tri-state Bit 0. 0 = Tri-state bit 0 on positive edge of PCLK. 1 = Tri-state bit 0 on negative edge of PCLK. Rev. 1.5 87 Si3050 + Si3011/18/19 Register 34. PCM Transmit Start Count—Low Byte Bit D7 D6 D5 D4 D3 Name TXS[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit Name Function 7:0 TXS[7:0] PCM Transmit Start Count. PCM Transmit Start Count equals the number of PCLKs following FSYNC before data transmission begins. Register 35. PCM Transmit Start Count—High Byte Bit D7 D6 D5 D4 D3 D2 D1 D0 Name TXS[1:0] Type R/W Reset settings = 0000_0000 Bit Name Function 7:2 Reserved Read returns zero. 1:0 TXS[1:0] PCM Transmit Start Count. PCM Transmit Start Count equals the number of PCLKs following FSYNC before data transmission begins. Register 36. PCM Receive Start Count—Low Byte Bit D7 D6 D5 D4 D3 Name RXS[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit Name 7:0 RXS[7:0] 88 Function PCM Receive Start Count. PCM Receive Start Count equals the number of PCLKs following FSYNC before data reception begins. Rev. 1.5 Si3050 + Si3011/18/19 Register 37. PCM Receive Start Count—High Byte Bit D7 D6 D5 D4 D3 D2 D1 D0 Name RXS[1:0] Type R/W Reset settings = 0000_0000 Bit Name Function 7:2 Reserved Read returns zero. 1:0 RXS[1:0] PCM Receive Start Count. PCM Receive Start Count equals the number of PCLKs following FSYNC before data reception begins. Register 38. TX Gain Control 2 Bit D7 D6 D5 D4 D3 D2 D1 Name TGA2 TXG2[3:0] Type R/W R/W D0 Reset settings = 0000_0000 Bit Name 7:5 Reserved 4 TGA2 3:0 Function Read returns zero. Transmit Gain or Attenuation 2. 0 = Incrementing the TXG2[3:0] bits results in gaining up the transmit path. 1 = Incrementing the TXG2[3:0] bits results in attenuating the transmit path. TXG2[3:0] Transmit Gain 2. Each bit increment represents 1 dB of gain or attenuation, up to a maximum of +12 dB and –15 dB respectively. For example: TGA2 TXG2[3:0] Result X 0000 0 dB gain or attenuation is applied to the transmit path. 0 0001 1 dB gain is applied to the transmit path. 0 : 0 11xx 12 dB gain is applied to the transmit path. 1 0001 1 dB attenuation is applied to the transmit path. 1 : 1 1111 15 dB attenuation is applied to the transmit path. Rev. 1.5 89 Si3050 + Si3011/18/19 Register 39. RX Gain Control 2 Bit D7 D6 D5 D4 D3 D2 D1 Name RGA2 RXG2[3:0] Type R/W R/W D0 Reset settings = 0000_0000 Bit Name 7:5 Reserved 4 RGA2 3:0 90 Function Read returns zero. Receive Gain or Attenuation 2. 0 = Incrementing the RXG2[3:0] bits results in gaining up the receive path. 1 = Incrementing the RXG2[3:0] bits results in attenuating the receive path. RXG2[3:0] Receive Gain 2. Each bit increment represents 1 dB of gain or attenuation, up to a maximum of +12 dB and –15 dB respectively. For example: RGA2 RXG2[3:0] Result X 0000 0 dB gain or attenuation is applied to the receive path. 0 0001 1 dB gain is applied to the receive path. 0 : 0 11xx 12 dB gain is applied to the receive path. 1 0001 1 dB attenuation is applied to the receive path. 1 : 1 1111 15 dB attenuation is applied to the receive path. Rev. 1.5 Si3050 + Si3011/18/19 Register 40. TX Gain Control 3 Bit D7 D6 D5 D4 D3 D2 D1 Name TGA3 TXG3[3:0] Type R/W R/W D0 Reset settings = 0000_0000 Bit Name 7:5 Reserved 4 TGA3 3:0 Function Read returns zero. Transmit Gain or Attenuation 3. 0 = Incrementing the TGA3[3:0] bits results in gaining up the transmit path. 1 = Incrementing the TGA3[3:0] bits results in attenuating the transmit path. TXG3[3:0] Transmit Gain 3. Each bit increment represents 0.1 dB of gain or attenuation, up to a maximum of 1.5 dB. For example: TGA3 TXG3[3:0] Result X 0000 0 dB gain or attenuation is applied to the transmit path. 0 0001 0.1 dB gain is applied to the transmit path. 0 : 0 1111 1.5 dB gain is applied to the transmit path. 1 0001 0.1 dB attenuation is applied to the transmit path. 1 : 1 1111 1.5 dB attenuation is applied to the transmit path. Rev. 1.5 91 Si3050 + Si3011/18/19 Register 41. RX Gain Control 3 Bit D7 D6 D5 D4 D3 D2 D1 Name RGA3 RXG3[3:0] Type R/W R/W D0 Reset settings = 0000_0000 Bit Name 7:5 Reserved 4 RGA3 3:0 92 Function Read returns zero. Receive Gain or Attenuation 2. 0 = Incrementing the RXG3[3:0] bits results in gaining up the receive path. 1 = Incrementing the RXG3[3:0] bits results in attenuating the receive path. RXG3[3:0] Receive Gain 3. Each bit increment represents 0.1 dB of gain or attenuation, up to a maximum of 1.5 dB. For example: RGA3 RXG3[3:0] Result X 0000 0 dB gain or attenuation is applied to the receive path. 0 0001 0.1 dB gain is applied to the receive path. 0 : 0 1111 1.5 dB gain is applied to the receive path. 1 0001 0.1 dB attenuation is applied to the receive path. 1 : 1 1111 1.5 dB attenuation is applied to the receive path. Rev. 1.5 Si3050 + Si3011/18/19 Register 42. GCI Control Bit D7 D6 D5 D4 D3 D2 D1 D0 Name GCIF[1:0] B2D B1D Type R/W R/W R/W Reset settings = 0000_0000 Bit Name Function 7:4 Reserved Read returns zero. 3:2 GCIF[1:0] GCI Data Format. 00 = A-Law. 01 = µ-Law. 10 = 8-bit linear. The top 8-bits of the 16-bit linear signal are transferred, and the bottom 8-bits are discarded. 11 = 16-bit linear. B1 and B2 channels are used for the 16-bits of data. Regardless of whether the DAA is set to transmit and receive in the B1 or B2 channel, both channels are used to send and receive the 16-bit linear data. 1 B2D Channel B2 Enable. 0 = Channel B2 transfers are disabled. 1 = Channel B2 transfers are enabled. If 16-bit linear data format is chosen, disabling the B2 channel results in only the top 8 bits of line data being sent and received in the B1 channel. 0 B1D Channel B1 Enable. 0 = Channel B1 transfers are disabled. 1 = Channel B1 transfers are enabled. If 16-bit linear data format is chosen, disabling the B1 channel results in only the bottom 8 bits of line data being sent and received in the B2 channel. Rev. 1.5 93 Si3050 + Si3011/18/19 Register 43. Line Current/Voltage Threshold Interrupt (Si3011 and Si3019 line-side only) Bit D7 D6 D5 D4 D3 Name CVT[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit Name 7:0 CVT[7:0] Function Current/Voltage Threshold. These bits determine the threshold at which an interrupt is generated from either the LCS or LVS register. This interrupt can be generated to occur when the line current or line voltage rises above or drops below the value in the CVT[7:0] register. Register 44. Line Current/Voltage Threshold Interrupt Control (Si3011 and Si3019 line-side only) Bit D7 D6 D5 D4 D3 D2 D1 D0 Name CVI CVS CVM CVP Type R/W R/W R/W R/W Reset settings = 0000_0000 Bit Name 7:4 Reserved 3 CVI Function Read returns zero. Current/Voltage Interrupt. 0 = The current/voltage threshold has not been crossed. 1 = The current/voltage threshold is crossed. If the CVM and INTE bits are set, a hardware interrupt occurs on the AOUT/INT pin. Once set, this bit must be written to 0 to be cleared. 2 CVS Current/Voltage Select. 0 = The line current shown in the LCS2 register is used to generate an interrupt. 1 = The line voltage shown in the LVS register is used to generate an interrupt. 1 CVM Current/Voltage Interrupt Mask. 0 = The current/voltage threshold being triggered does not cause a hardware interrupt on the AOUT/INT pin. 1 = The current/voltage threshold being triggered causes a hardware interrupt on the AOUT/INT pin. 0 CVP Current/Voltage Interrupt Polarity. 0 = The current/voltage threshold is triggered by the absolute value of the number in either the LCS2 or LVS register falling below the value in the CVT[7:0] register. 1 = The current/voltage threshold is triggered by the absolute value of the number in either the LCS2 or LVS register rising above the value in the CVT[7:0] register. 94 Rev. 1.5 Si3050 + Si3011/18/19 Register 45. Programmable Hybrid Register 1 Bit D7 D6 D5 D4 D3 Name HYB1[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit 7:0 Name Function HYB1[7:0] Programmable Hybrid Register 1. These bits can be programmed with a coefficient value to adjust the hybrid response to reduce near-end echo. This register represents the first tap in the eight-tap filter. When this register is set to all 0s, this filter stage does not have an effect on the hybrid response. See the section entitled "5.28. Transhybrid Balance" on page 38 for more information on selecting coefficients for the programmable hybrid. Register 46. Programmable Hybrid Register 2 Bit D7 D6 D5 D4 D3 Name HYB2[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit 7:0 Name Function HYB2[7:0] Programmable Hybrid Register 2. These bits can be programmed with a coefficient value to adjust the hybrid response to reduce near-end echo. This register represents the second tap in the eight-tap filter. When this register is set to all 0s, this filter stage does not have an effect on the hybrid response. See the section entitled "5.28. Transhybrid Balance" on page 38 for more information on selecting coefficients for the programmable hybrid. Rev. 1.5 95 Si3050 + Si3011/18/19 Register 47. Programmable Hybrid Register 3 Bit D7 D6 D5 D4 D3 Name HYB3[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit 7:0 Name Function HYB3[7:0] Programmable Hybrid Register 3. These bits can be programmed with a coefficient value to adjust the hybrid response to reduce near-end echo. This register represents the third tap in the eight-tap filter. When this register is set to all 0s, this filter stage does not have an effect on the hybrid response. See the section entitled "5.28. Transhybrid Balance" on page 38 for more information on selecting coefficients for the programmable hybrid. Register 48. Programmable Hybrid Register 4 Bit D7 D6 D5 D4 D3 Name HYB4[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit 7:0 Name Function HYB4[7:0] Programmable Hybrid Register 4. These bits can be programmed with a coefficient value to adjust the hybrid response to reduce near-end echo. This register represents the fourth tap in the eight-tap filter. When this register is set to all 0s, this filter stage does not have an effect on the hybrid response. See the section entitled "5.28. Transhybrid Balance" on page 38 for more information on selecting coefficients for the programmable hybrid. 96 Rev. 1.5 Si3050 + Si3011/18/19 Register 49. Programmable Hybrid Register 5 Bit D7 D6 D5 D4 D3 Name HYB5[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit 7:0 Name Function HYB5[7:0] Programmable Hybrid Register 5. These bits can be programmed with a coefficient value to adjust the hybrid response to reduce near-end echo. This register represents the fifth tap in the eight-tap filter. When this register is set to all 0s, this filter stage does not have an effect on the hybrid response. See the section entitled "5.28. Transhybrid Balance" on page 38 for more information on selecting coefficients for the programmable hybrid. Register 50. Programmable Hybrid Register 6 Bit D7 D6 D5 D4 D3 Name HYB6[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit 7:0 Name Function HYB6[7:0] Programmable Hybrid Register 6. These bits can be programmed with a coefficient value to adjust the hybrid response to reduce near-end echo. This register represents the sixth tap in the eight-tap filter. When this register is set to all 0s, this filter stage does not have an effect on the hybrid response. See the section entitled "5.28. Transhybrid Balance" on page 38 for more information on selecting coefficients for the programmable hybrid. Rev. 1.5 97 Si3050 + Si3011/18/19 Register 51. Programmable Hybrid Register 7 Bit D7 D6 D5 D4 D3 Name HYB7[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit Name Function HYB7[7:0] Programmable Hybrid Register 7. 7:0 These bits can be programmed with a coefficient value to adjust the hybrid response to reduce near-end echo. This register represents the seventh tap in the eight-tap filter. When this register is set to all 0s, this filter stage does not have an effect on the hybrid response. See the section entitled "5.28. Transhybrid Balance" on page 38 for more information on selecting coefficients for the programmable hybrid. Register 52. Programmable Hybrid Register 8 Bit D7 D6 D5 D4 D3 Name HYB8[7:0] Type R/W D2 D1 D0 Reset settings = 0000_0000 Bit Name Function HYB8[7:0] Programmable Hybrid Register 8. 7:0 These bits can be programmed with a coefficient value to adjust the hybrid response to reduce near-end echo. This register represents the eighth tap in the eight-tap filter. When this register is set to all 0s, this filter stage does not have an effect on the hybrid response. See the section entitled "5.28. Transhybrid Balance" on page 38 for more information on selecting coefficients for the programmable hybrid. Register 53-58. Reserved Bit D7 D6 D5 D4 D3 Name Type Reset settings = xxxx_xxxx Bit 7:0 98 Name Function Reserved Do not write to these register bits. Rev. 1.5 D2 D1 D0 Si3050 + Si3011/18/19 Register 59. Spark Quenching Control Bit D7 D6 D5 D4 D3 D2 D1 Name SQ1 SQ0 RG1 GCE Type R/W R/W R/W R/W D0 Reset settings = xxxx_xxxx Bit 7 6 Name Function Reserved Always write this bit to zero. SQ1 Spark Quenching. Si3018 and Si3019 line-side only. This bit, in combination with the OHS bit (Register 16), and the OHS2 bit (Register 31), sets the amount of time for the line-side device to go on-hook. The on-hook speeds specified are measured from the time the OH bit is cleared until loop current equals zero. OHS OHS2 SQ[1:0] Mean On-Hook Speed 0 0 00 Less than 0.5 ms 0 1 00 3 ms±10% (meets ETSI standard) 1 X 11 26 ms ±10% (meets Australia spark quenching spec) For Si3011 line-side device, always write this bit to zero. 5 4 3 Reserved Always write this bit to zero. SQ0 Spark Quenching. Si3018 and Si3019 line-side only. This bit, in combination with the OHS bit (Register 16), and the OHS2 bit (Register 31), sets the amount of time for the line-side device to go on-hook. The on-hook speeds specified are measured from the time the OH bit is cleared until loop current equals zero. OHS OHS2 SQ[1:0] Mean On-Hook Speed 0 0 00 Less than 0.5 ms 0 1 00 3 ms±10% (meets ETSI standard) 1 X 11 26 ms ±10% (meets Australia spark quenching spec) For Si3011 line-side device, always write this bit to zero. Reserved Always write this bit to zero. 2 RG1 Receive Gain 1 (Line-side Revision E or later). This bit enables receive path gain adjustment. 0 = No gain applied to hybrid, full scale RX on line = 0 dBm. 1 = 1 dB of gain applied to hybrid, full scale RX on line = –1 dBm. 1 GCE Guarded Clear Enable (Line-side Revision E or later). This bit (in conjunction with the R2 bit set to 1) enables the Si3050 to meet BT’s Guarded Clear Spec (B5 6450, Part 1: 1993, Section 15.4.3.3). With these bits set, the DAA will draw approximately 2.5 mA of current from the line while on-hook. 0 = Default, DAA does not draw loop current. 1 = Guarded Clear enabled, DAA draws 2.5 mA while on-hook to meet Guarded Clear requirement. 0 Reserved Always write this bit to zero. Rev. 1.5 99 SDI SDO NC NC SDITHRU SCLK 24 23 22 21 20 19 Si3050 + Si3011/18/19 CS 1 18 GND FSYNC 2 17 VDD PCKLK 3 16 VA DTX 4 15 C1A DRX 5 14 C2A RGDT 6 13 RESET Si3050 Top View 12 TGDE 10 NC 11 9 NC TGD 8 RG AOUT/INT 7 GND Figure 50. Si3050 QFN SDO SDI CS FSYNC PCLK DTX DRX RGDT AOUT/INT RG 1 2 3 4 5 6 7 8 9 20 19 18 17 16 15 14 13 12 11 10 SDITHRU SCLK GND VDD VA C1A C2A RESET TGDE TGD Figure 51. Si3050 TSSOP 100 Rev. 1.5 Si3050 + Si3011/18/19 Table 26. Si3050 Pin Descriptions QFN Pin # TSSOP Pin # Pin Name 23 1 SDO Serial Port Data Output. Serial port control data output. 24 2 SDI Serial Port Data Input. Serial port control data input. 1 3 CS Chip Select Input. An active low input control signal that enables the SPI Serial port. When inactive, SCLK and SDI are ignored and SDO is high impedance. 2 4 FSYNC 3 5 PCLK 4 6 DTX Transmit PCM or GCI Highway Data Output. Outputs data from either the PCM or GCI highway bus. 5 7 DRX Receive PCM or GCI Highway Data Input. Receives data from either the PCM or GCI highway bus. 6 8 RGDT Ring Detect Output. Produces an active low rectified version of the ring signal. 7 9 AOUT/INT Analog Speaker Output/Interrupt Output. Provides an analog output signal for driving a call progress speaker in AOUT mode. Alternatively, this pin can be set to provide a hardware interrupt signal. 8 10 RG Ring Ground Output. Control signal for ring ground relay. Used to support ground start applications. 9 NC No connect. 10 NC No connect. Description Frame Sync Input. Data framing signal that is used to indicate the start and stop of a communication/data frame. Master Clock Input. Master clock input. 11 11 TGD TIP Ground Detect Input. Used to detect current flowing in TIP for supporting ground start applications. 12 12 TGDE TIP Ground Detect Enable Output. Control signal for the ground detect relay. Used to support ground start applications. 13 13 RESET Reset Input. An active low input that is used to reset all control registers to a defined, initialized state. Also used to bring the Si3050 out of sleep mode. Rev. 1.5 101 Si3050 + Si3011/18/19 Table 26. Si3050 Pin Descriptions (Continued) QFN Pin # TSSOP Pin # Pin Name Description 14 14 C2A Isolation Capacitor 2A. Connects to one side of the isolation capacitor C2. Used to communicate with the line-side device. 15 15 C1A Isolation Capacitor 1A. Connects to one side of the isolation capacitor C1. Used to communicate with the line-side device. 16 16 VA Regulator Voltage Reference. This pin connects to an external capacitor and serves as the reference for the internal voltage regulator. 17 17 VDD Digital Supply Voltage. Provides the 3.3 V digital supply voltage to the Si3050. 18 18 GND Ground. Connects to the system digital ground. 19 19 SCLK Serial Port Bit Clock Input. Controls the serial data on SDO and latches the data on SDI. 20 20 SDITHRU SDI Passthrough Output. Cascaded SDI output signal to daisy-chain the SPI interface with additional devices. 21 NC No connect. 22 NC No connect. 102 Rev. 1.5 Si3050 + Si3011/18/19 C2B 5 NC 4 IGND C1B 18 17 16 15 DCT3 14 QB IGND PAD 13 QE2 12 SC VREG 6 7 8 9 10 11 NC VREG2 3 DCT2 IB 19 RNG2 2 QE RX 20 IGND 1 RNG1 NC DCT 7. Pin Descriptions: Si3011/18/19 Figure 52. Si3011/18/19 QFN QE DCT RX IB C1B C2B VREG RNG1 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 DCT2 IGND DCT3 QB QE2 SC VREG2 RNG2 Figure 53. Si3011/18/19 SOIC/TSSOP Rev. 1.5 103 Si3050 + Si3011/18/19 Table 27. Si3011/18/19 Pin Descriptions QFN Pin # SOIC/ TSSOP Pin Name Pin # 1 NC No connect. Transistor Emitter. Connects to the emitter of Q3. 19 1 QE 20 2 DCT 2 3 RX Receive Input. Serves as the receive side input from the telephone network. 3 4 IB Internal Bias. Provides a bias voltage to the device. 4 5 C1B Isolation Capacitor 1B. Connects to one side of isolation capacitor C1. Used to communicate with the system-side device. 5 6 C2B Isolation Capacitor 2B. Connects to one side of isolation capacitor C2. Used to communicate with the system-side device. 6 7 VREG Voltage Regulator. Connects to an external capacitor to provide bypassing for an internal power supply. 7 8 RNG1 Ring 1. Connects through a resistor to the TIP lead of the telephone line. Provides the ring and caller ID signals to the DAA. IGND Isolated Ground. Connects to ground on the line-side interface. 8 DC Termination. Provides dc termination to the telephone network. 9 9 RNG2 Ring 2. Connects through a resistor to the RING lead of the telephone line. Provides the ring and caller ID signals to the DAA. 10 10 VREG2 Voltage Regulator 2. Connects to an external capacitor to provide bypassing for an internal power supply. 11 104 Description NC No connect. SC Connection. Enables external transistor network. Should be tied through a 0  resistor to IGND. 12 11 SC 13 12 QE2 14 13 QB 15 14 DCT3 Transistor Emitter 2. Connects to the emitter of Q4. Transistor Base. Connects to the base of transistor Q4. DC Termination 3. Provides dc termination to the telephone network. Rev. 1.5 Si3050 + Si3011/18/19 Table 27. Si3011/18/19 Pin Descriptions (Continued) QFN Pin # SOIC/ TSSOP Pin Name Pin # 16 NC Description No Connect. 17 15 IGND Isolated Ground. Connects to ground on the line-side interface. 18 16 DCT2 DC Termination 2. Provides dc termination to the telephone network. Rev. 1.5 105 Si3050 + Si3011/18/19 8. Ordering Guide Part Number1 Description AC Terminations Package2 Temperature Range Si3050-E1-FT System-side Voice DAA 2, 4, 16 TSSOP-20 0 to +70 °C Si3050-E1-GT System-side Voice DAA 2, 4, 16 TSSOP-20 –40 to +85 °C Si3050-E1-FM System-side Voice DAA 2, 4, 16 QFN-24 0 to +70 °C Si3050-E1-GM System-side Voice DAA 2, 4, 16 QFN-24 –40 to +85 °C Si3011-F-FS Line-side Voice DAA-FCC/TBR21 only 2 SOIC-16 0 to +70 °C Si3011-F-GS Line-side Voice DAA-FCC/TBR21 only 2 SOIC-16 –40 to +85 °C Si3011-F-FT Line-side Voice DAA-FCC/TBR21 only 2 TSSOP-16 0 to +70 °C Si3011-F-GT Line-side Voice DAA-FCC/TBR21 only 2 TSSOP-16 –40 to +85 °C Si3011-F-FM Line-side Voice DAA-FCC/TBR21 only 2 QFN-20 0 to +70 °C Si3011-F-GM Line-side Voice DAA-FCC/TBR21 only 2 QFN-20 –40 to +85 °C Si3018-F-FS Line-side Voice DAA-Global 4 SOIC-16 0 to +70 °C Si3018-F-GS Line-side Voice DAA-Global 4 SOIC-16 –40 to +85 °C Si3018-F-FT Line-side Voice DAA-Global 4 TSSOP-16 0 to +70 °C Si3018-F-GT Line-side Voice DAA-Global 4 TSSOP-16 –40 to +85 °C Si3018-F-FM Line-side Voice DAA-Global 4 QFN-20 0 to +70 °C Si3018-F-GM Line-side Voice DAA-Global 4 QFN-20 –40 to +85 °C Si3019-F-FS Line-side Voice DAA-Enhanced Global 16 SOIC-16 0 to +70 °C Si3019-F-GS Line-side Voice DAA-Enhanced Global 16 SOIC-16 –40 to +85 °C Si3019-F-FT Line-side Voice DAA-Enhanced Global 16 TSSOP-16 0 to +70 °C Si3019-F-GT Line-side Voice DAA-Enhanced Global 16 TSSOP-16 –40 to +85 °C Si3019-F-FM Line-side Voice DAA-Enhanced Global 16 QFN-20 0 to +70 °C Si3019-F-GM Line-side Voice DAA-Enhanced Global 16 QFN-20 –40 to +85 °C Notes: 1. Adding the suffix “R” to the end of the part number (e.g., Si3050-E1-FTR) denotes tape-and-reel packaging. 2. All packages are RoHS-compliant. 106 Rev. 1.5 Si3050 + Si3011/18/19 9. Product Identification The product identification number is a finished goods part number or is specified by a finished goods part number, such as a special customer part number. Example: Si3050-E1-FSR Product Designator Product Revision Shipping Option Blank = Tubes R = Tape and Reel Package Type S = SOIC T = TSSOP M = QFN Part Type/Lead Finish F = Commercial/Lead-Free G = Industrial Temp/Lead-Free Rev. 1.5 107 Si3050 + Si3011/18/19 10. Package Outline: 20-Pin TSSOP Figure 54 illustrates the package details for the Si3050. Table 28 lists the values for the dimensions shown in the illustration. Figure 54. 20-Pin Thin Shrink Small Outline Package (TSSOP) 108 Rev. 1.5 Si3050 + Si3011/18/19 ‘ Table 28. 20-Pin TSSOP Package Diagram Dimensions Dimension Min Nom Max A — — 1.20 A1 0.05 — 0.15 A2 0.80 1.00 1.05 b 0.19 — 0.30 c 0.09 — 0.20 D 6.40 6.50 6.60 E E1 6.40 BSC 4.40 4.40 e L 0.65 BSC 0.45 0.60 L2 θ 4.50 0.75 0.25 BSC 0° — aaa 0.10 bbb 0.10 ccc 0.20 8° Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-153, Variation AC. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components. Rev. 1.5 109 Si3050 + Si3011/18/19 10.1. PCB Land Pattern: Si3050 TSSOP   Figure 55. 20-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Pattern Table 29. 20-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Pattern Dimensions Dimension C1 Feature (mm) Pad Column Spacing 5.80 E Pad Row Pitch 0.65 X1 Pad Width 0.45 Y1 Pad Length 1.40 Notes: 1. This Land Pattern Design is based on IPC-7351 specifications for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 110 Rev. 1.5 Si3050 + Si3011/18/19 11. Package Outline: 24-Pin QFN Figure 56 illustrates the package details for the Si3050. Table 30 lists the values for the dimensions shown in the illustration. Figure 56. 24-Pin QFN Package Rev. 1.5 111 Si3050 + Si3011/18/19 Table 30. 24-Pin QFN Package Dimensions Dimension MIN NOM MAX A 0.80 — — A1 0.00 — — b 0.18 — — D D2 112 4.00 BSC 2.05 2.20 e 0.50 BSC E 4.00 BSC 2.35 E2 2.35 2.50 2.65 L 0.30 0.40 0.50 aaa 0.10 bbb 0.10 ccc 0.08 ddd 0.10 eee 0.05 Rev. 1.5 Si3050 + Si3011/18/19 12. PCB Land Pattern: Si3050 QFN   Figure 57. 24-Pin Quad Flat No-Lead (QFN) PCB Land Pattern Rev. 1.5 113 Si3050 + Si3011/18/19 Table 31. 24-Pin Quad Flat No-Lead (QFN) PCB Land Pattern Dimensions Symbol MIN NOM MAX P1 2.10 2.20 2.30 P2 2.10 2.20 2.30 X1 0.20 0.25 0.30 Y1 0.75 0.80 0.85 C1 3.90 C2 3.90 E 0.50 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. Solder mask design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 mm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins. 4. A 2 x 2 array of 0.90 mm square openings on 1.20 mm pitch should be used for the center ground pad. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 114 Rev. 1.5 Si3050 + Si3011/18/19 13. Package Outline: 16-Pin SOIC Figure 58 illustrates the package details for the Si3011/18/19. Table 32 lists the values for the dimensions shown in the illustration. Figure 58. 16-Pin Small Outline Integrated Circuit (SOIC) Package Rev. 1.5 115 Si3050 + Si3011/18/19 Table 32. 16-Pin SOIC Package Diagram Dimensions Dimension Min Max A — 1.75 A1 0.10 0.25 A2 1.25 — b 0.31 0.51 c 0.17 0.25 D 9.90 BSC E 6.00 BSC E1 3.90 BSC e 1.27 BSC L 0.40 L2 1.27 0.25 BSC h 0.25 0.50 θ 0° 8° aaa 0.10 bbb 0.20 ccc 0.10 ddd 0.25 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MS-012, Variation AC. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 116 Rev. 1.5 Si3050 + Si3011/18/19 13.1. PCB Land Pattern: Si3011/18/19 SOIC   Figure 59. 16-Pin Small Outline Integrated Circuit (SOIC) PCB Land Pattern Table 33. 16-Pin Small Outline Integrated Circuit (SOIC) PCB Land Pattern Dimensions Dimension Feature (mm) Pad Column Spacing 5.40 E Pad Row Pitch 1.27 X1 Pad Width 0.60 Y1 Pad Length 1.55 C1 Notes: 1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X165-16N for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. Rev. 1.5 117 Si3050 + Si3011/18/19 14. Package Outline: 16-Pin TSSOP Figure 60 illustrates the package details for the Si3011/18/19. Table 34 lists the values for the dimensions shown in the illustration. Figure 60. 16-Pin Thin Shrink Small Outline Package (TSSOP) 118 Rev. 1.5 Si3050 + Si3011/18/19 Table 34. 16-Pin TSSOP Package Diagram Dimensions Dimension Min Nom Max A — — 1.20 A1 0.05 — 0.15 A2 0.80 1.00 1.05 b 0.19 — 0.30 c 0.09 — 0.20 D 4.90 5.00 5.10 E E1 6.40 BSC 4.40 4.40 e L 0.65 BSC 0.45 0.60 L2 θ 4.50 0.75 0.25 BSC 0° — aaa 0.10 bbb 0.10 ccc 0.20 8° Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-153, Variation AB. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev. 1.5 119 Si3050 + Si3011/18/19 14.1. PCB Land Pattern: Si3011/18/19 TSSOP   Figure 61. 16-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Pattern Table 35. 16-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Patten Dimensions Dimension C1 Feature (mm) Pad Column Spacing 5.80 E Pad Row Pitch 0.65 X1 Pad Width 0.45 Y1 Pad Length 1.40 Notes: 1. This Land Pattern Design is based on IPC-7351 specifications for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 120 Rev. 1.5 Si3050 + Si3011/18/19 15. Package Outline: 20-Pin QFN Figure 62 illustrates the package details for the Si3011/18/19. Table 36 lists the values for the dimensions shown in the illustration.   Figure 62. 20-Pin Quad Flat No-Lead (QFN) Package Rev. 1.5 121 Si3050 + Si3011/18/19 Table 36. 20-Pin QFN Package Diagram Dimensions Dimension MIN NOM MAX A 0.80 0.85 — A1 0.00 0.02 — b 0.20 0.25 — c 0.27 0.32 — D D2 3.00 BSC 1.65 1.70 e .50 BSC E 3.00 BSC E2 1.65 f 1.70 1.75 2.53 BSC L 0.35 0.40 0.45 L1 0.00 — 0.10 aaa — — 0.05 bbb — — 0.05 ccc — — 0.08 ddd — — 0.10 eee — — 0.10 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 122 1.75 Rev. 1.5 Si3050 + Si3011/18/19 16. PCB Land Pattern: Si3011/18/19 QFN Figure 63. 20-Pin Quad Flat No-Lead (QFN) PCB Land Pattern Rev. 1.5 123 Si3050 + Si3011/18/19 Table 37. 20-Pin Quad Flat No-Lead (QFN) PCB Land Pattern Dimensions Dimension MIN MAX D D2 2.71 REF 1.60 1.80 e 0.50 BSC E 2.71 REF E2 1.60 1.80 f 2.53 BSC GD 2.10 — GE 2.10 — W — 0.34 X — 0.28 Y 0.61 REF ZE — 3.31 ZD — 3.31 Notes: General 1. All dimensions shown are in milllimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on IPC-SM-782 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads. 4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides approximately 70% solder paste coverage on the pad, which is optimum to assure correct component stand-off. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components. 124 Rev. 1.5 Si3050 + Si3011/18/19 SILICON LABS Si3050 SUPPORT DOCUMENTATION      AN30: Ground Start Implementation with Silicon Laboratories’ DAAs AN67: Layout Guidelines AN72: Ring Detection/Validation with the Si305x DAAs AN84: Digital Hybrid with the Si305x DAAs Si3050PPT-EVB Data Sheet Note: Refer to www.silabs.com for a current list of support documents for this chipset. Rev. 1.5 125 Si3050 + Si3011/18/19 DOCUMENT CHANGE LIST Revision 1.2 to Revision 1.3 Revision 1.01 to Revision 1.1               Added package thermal information in Table 1, “Recommended Operating Conditions and Thermal Information,” on page 5. Added Note 10 to the transhybrid balance parameter in Table 4 on page 8. Updated Table 7, “Switching Characteristics—Serial Peripheral Interface,” on page 11. Removed R54 and R55 from " " on page 18. Changed recommended DCV setting for Japan from 01 to 10 in Table 13 on page 22. Updated initialization procedure in "5.3. Initialization" on page 25. Removed incorrect description of FDT bit in "5.8. Exception Handling" on page 27. Updated Billing Tone and Receive Overload section. Changed to "5.22. Receive Overload Detection" on page 35. Updated text and added description of hybrid coefficient format in "5.28. Transhybrid Balance" on page 38. Removed references to line-side revisions C and E. Updated "8. Ordering Guide" on page 106. Updated package information for 20-Pin TSSOP and 16-Pin SOIC on pages 103 and 104. Added “14.Package Outline: 16-Pin TSSOP”.     Revision 1.1 to Revision 1.31      Si3050 part numbers to reflect the latest product revision level.  delay time between chip selects. Step 6 with standard hexadecimal notation. Updated Figure 27, “Si3011/18/19 Signal Flow Diagram,” on page 38. Corrected  ACIM settings for Brazil. Updated "5.3. Initialization" on page 25. Revised  HPF pole. Updated "8. Ordering Guide" on page 106. 126 Updated "3. Bill of Materials" on page 19. Updated "8. Ordering Guide" on page 106. Updated Updated Table 13, “Country-specific Register Settings,” on page 22. Corrected  Added Si3011 device specifications Added Si3050, Si3011, Si3018, and Si3019 QFN information Revision 1.4 to Revision 1.5 Updated Table 7, “Switching Characteristics—Serial Peripheral Interface,” on page 11. Updated  The internal System-Side Revision value (REVA[3:0] in Register 11) has been incremented by one for Si3050 revision E. Revision 1.31 to Revision 1.4 Revision 1.1 to Revision 1.2  Updated Deep Sleep Total Supply Current from 1.0 to 1.3 mA typical Updated package pictures Removed all SPIM references (SPIM bit is never present in any Si3050 device). Removed SnPb package options Minor typo corrections Rev. 1.5 Corrected Si3011 bit settings for Register 26 [7:6 and 5:4]. Si3050 + Si3011/18/19 NOTES: Rev. 1.5 127 Smart. Connected. Energy-Friendly Products Quality www.silabs.com/products www.silabs.com/quality Support and Community community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. 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