SI34061-A-GM

Si3406x Family Data Sheet Fully-Integrated IEEE 802.3-Compliant POE+ PD Interface and High-Efficiency Switching Regulators with Sleep, Wake, and LED Drive The Si3406x family integrates all power management and control functions required in a Power-over-Ethernet Plus (PoE+) powered device (PD) application. These devices convert the high voltage supplied over the 10/100/1000BASE-T Ethernet connection to a regulated, low-voltage output supply. The optimized architecture of this device family minimizes the solution footprint and external BOM cost and enables the use of low-cost external components while maintaining high performance. The Si3406x family integrates the required diode bridges and transient surge suppressor, thus enabling direct connection of the IC to the Ethernet RJ-45 connector. The switching power FET and all associated functions are also integrated. The integrated, current mode controlled switching regulator supports isolated or non-isolated flyback and buck converter topologies. The switching frequency for the regulator is tunable with a simple external resistor value to help avoid unwanted harmonics for better emissions control. A synchronous driver is provided to optionally drive a secondary side FET to improve efficiency of power conversion. Connection to the PSE switch is maintained during sleep by an optional automated maintain-power-signature (MPS) signal. These devices fully support the IEEE 802.3at specification for the cases of single or two event classification. Standard external resistors provide the proper IEEE 802.3 signatures for the detection function and programming of the classification mode, and internal startup circuits ensure well-controlled soft-start initial operation of both the hotswap switch and the voltage regulator. The Si34061 and Si34062 add main transformer bias winding support for ultra-high-efficiency operation. The Si34062 includes support for sleep modes with wake function, as well as LED drive capability. These features can be utilized to minimize standby current, control sleep and wake states, and provide application status information using an LED. KEY FEATURES • Type 1 (PoE) or Type 2 (PoE+) power • Full IEEE 802.3at compliance • Synchronous secondary FET driver • Current mode dc-dc converter • Tunable switching frequency • Auxiliary transformer winding support • Auxiliary wall adapter support (12 V to 57 V) • Internal hotswap and switching FET bypass support • Automated maintain-power-signature (MPS) support • Sleep mode augmented with wake pin, mode control, and LED driver • 120 V Absolute Max voltage performance • Extended –40 to +85 °C temperature • Compact ROHS-compliant 5 mm x 5 mm QFN Package APPLICATIONS • Voice over IP telephones • Wireless access points • Security and surveillance IP cameras • Lighting luminaires • Point-of-sale terminals • Internet appliances • Network devices The Si3406 is available in a low-profile, 20-pin, 5 x 5 mm QFN package, and the Si34061 and Si34062 are available in low-profile, 24-pin, 5 x 5 mm QFN packages. 1 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 1 Si3406x Family Data Sheet • Ordering Guide 1. Ordering Guide Table 1.1. Si3406x Ordering Guide Ordering Part Number Si3406-A-GM Si34061-A-GM Si34062-A-GM 2 Package 5 x 5 mm 20-QFN Pb-free, RoHS-compliant 5 x 5 mm 24-QFN Pb-free, RoHS-compliant 5 x 5 mm 24-QFN Pb-free, RoHS-compliant Temperature Range (Ambient) Applications –40 to 85 °C Extended All Purposes –40 to 85 °C Extended Any high-power, high-efficiency uses, such as Wireless Access Points and IP Cameras –40 to 85 °C Extended IP Phones with manual sleep mode Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 2 Table of Contents 1. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Block Diagrams. . . . . . . . . . . . . . . . . . . . . 4 2.2 Power over Ethernet (PoE) Line-Side Interface 2.2.1 Surge Protection . . . . . . . . . 2.2.2 Telephony Protection . . . . . . . 2.2.3 Detection and Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 Hotswap Switch . . . . . . . . . . 5 5 5 6 . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 HSSW State Machine . . . . 2.4.1 External HSSW FET Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 . 7 2.5 DC to DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5.1 Average Current Sensing, Overcurrent, Low-Current Detection, and Output Short Protection . 2.5.2 Sync FET Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 . 9 . 9 2.6 Tunable Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 2.8 Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 2.9 Special Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 2.10 External Wall Adapter Support . . . . . . . . . . . . . . . . . . . . . . . .11 3. Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6. Packaging . . . . 5.1 Detailed Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . .21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 6.1 Package Outline: Si3406 . . . . . . . . . . . . . . . . . . . . . . . . . .26 6.2 Land Pattern: Si3406 . . . . . . . . . . . . . . . . . . . . . . . . . . .28 6.3 Package Outline: Si34061/62 . . . . . . . . . . . . . . . . . . . . . . . . .29 6.4 Land Pattern: Si34061/62 . . . . . . . . . . . . . . . . . . . . . . . . .31 7. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 . . 7.1 Si3406 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 7.2 Si34061 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 7.3 Si34062 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 8. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 3 Si3406x Family Data Sheet • System Overview 2. System Overview The following Block Diagrams will give the designer a sense for the internal arrangement of functional blocks, plus their relationships to external pins. The Block Diagrams are followed by a description of the features of these integrated circuits. 2.1 Block Diagrams RFREQ RDET V11 VPOS 11V REGULATOR IBIAS CT1 CT2 DETECTION SP1 THERMAL PROTECTION FBH VSS+1.32V FBL EROUT DC/DC SW CURRENT MODE PWM CONTROLLER THERMAL PROTECTION HOT-SWAP CONTROLLER 100V VPOS-1.32V Start 250kHz TVS 5V REGULATOR 250kHz OSCs fixed: 250kHz adjustable: 100...500kHz PoE CONTROLLER CLASS & MPS SP2 VDD SWO VSS VNEG HSSW ISNS IAVG HSO V11 SYNCL DRV RCL nSLEEP nT2P Figure 2.1. Si3406 Block Diagram RFREQ RDET VT15 AUX WINDING SUPPORT VPOS IBIAS CT1 V11 VDD 11V REGULATOR 5V REGULATOR 250kHz OSCs fixed: 250kHz adjustable: 100...500kHz THERMAL PROTECTION VSS+1.32V CT2 DETECTION SP1 PoE CONTROLLER CURRENT MODE PWM CONTROLLER THERMAL PROTECTION HOT-SWAP CONTROLLER TVS 100V DC/DC SW HSSW V11 IPK VEHSSW DRV IAVG EXTGD SWISNS ISNS HSO V11 DRV EXTHSW SWO VSS DRV VNEG RCL FBL EROUT 250kHz CLASS & MPS SP2 Start ASUP nT2P SYNCL nSLEEP Figure 2.2. Si34061 Block Diagram 4 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 4 Si3406x Family Data Sheet • System Overview RFREQ RDET VT15 AUX WINDING SUPPORT VPOS IBIAS CT1 V11 VDD 11V REGULATOR 5V REGULATOR 250kHz OSCs fixed: 250kHz adjustable: 100...500kHz THERMAL PROTECTION FBH VPOS-1.32V FBL VSS+1.32V CT2 DETECTION SP1 PoE CONTROLLER EROUT 250kHz CLASS & MPS SP2 Start CURRENT MODE PWM CONTROLLER THERMAL PROTECTION HOT-SWAP CONTROLLER TVS 100V DC/DC SW SWO VSS VNEG HSSW IAVG ISNS HSO V11 DRV RCL WAKE MODE LED nT2P SYNCL nSLEEP Figure 2.3. Si34062 Block Diagram 2.2 Power over Ethernet (PoE) Line-Side Interface The PoE line interface consists of diode bridges, internal surge protection, and the protocol interface support for detection and classification. Internal diode bridge maximum current is given by the specification, IRECT. For Class 1 and Class 2 applications, the internal diode bridge can be used. For Class 3 and Class 4, an external diode bridge needs to be installed. The external bridge should be connected in parallel to the internal bridge and the designer must ensure that the internal bridge will not conduct significant current by using low-voltage-drop external diodes. For higher efficiency, Schottky diodes are recommended. Instead of a diode bridge, a Mosfet based bridge can be used as well to further improve the overall efficiency. The chip features active protection against surge transients and accidentally applied telephony voltages. 2.2.1 Surge Protection The surge protection circuit is activated if the VPOS-VNEG voltage exceeds VPROT and the hotswap switch is off (dc-dc is not powered). If the hotswap switch is on, the surge power is sunk in the dc-dc input capacitance. The internal surge protection can be overridden with an external TVS if higher than specified surge conditions need be tolerated. The external surge device must be connected between VPOS an VNEG in parallel to the internal one; therefore, the designer must ensure that the external surge protection will activate prior to the internal surge protection. 2.2.2 Telephony Protection The Si3406x provides protection against telephony ringing voltage. The telephony ringing is much longer than the surge pulse but it has less energy, therefore, the Si3406x has a switch parallel with the supply (between VPOS and VNEG). When the protection circuit is activated, it turns ON the protection switch; the ringing energy then dissipates on this switch and ringing generator resistance (> 400 Ω). 5 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 5 Si3406x Family Data Sheet • System Overview 2.2.3 Detection and Classification When the Si3406x is connected via Ethernet cable to a PSE-enabled Ethernet switch, it must provide a characteristic resistance (~25 kΩ) to the PSE in a given voltage range (2.7–10.1 V). This is called detection. After the PSE detects the PD, the PSE increases the voltage above the classification threshold 14.5 V. Then, the PD provides the classification current to inform the PSE about its required power class (Class 1, 2, 3, or 4). Type 1 PSEs will recognize the Class 4 PD as Class 0, providing 15.4 W to the PD. Therefore, the optimal Class 4 PD application is designed with two power modes: Low-Power mode (for Type 1 PSE) and High-Power mode (for Type 2 PSE). Type 2 PSEs have additional voltage steps before switching on the PD. After an initial classification voltage pulse, the Type 2 PSE reduces the voltage below the mark threshold level (10 V). At that point, the PD should provide a non-valid detection resistance. Then, the PSE raises a voltage up again to the Class event range (Class 2). Last, before turning ON the dc-dc, the PSE reduces the voltage again (Mark2). This sequence is recognized by the si3406x, and it pulls down its nT2P pin to inform the application about the higher available power; otherwise, the application will need to operate in a reduced power consumption state (Type 1) if the PSE is incapable of delivering Class 4 power. Voltage 57 V IEEE 802.3afstartup 42 V 37 V 42.5 V – 57 V (at) 37 V - 57 V (af) 20.5 V Class2 Class1 IEEE 802.3atstartup 14.5 V 10.1 V Mark1 6.9 V Mark2 2.7 V Time Reset Detection Classification/Mark PD turned ON Figure 2.4. Powered Device Voltages 2.3 Hotswap Switch The hotswap switch is a high-voltage device that separates the PoE inerface from the dc-dc converter domain. The internal hotswap switch (HSSW) is turned on (conducting) when the PoE interface voltage goes above VUVLO_R. It provides limited inrush current until the dc-dc side capacitor is charged. The hotswap switch turns off (open) if voltage on the HSSW switch (HSO-VNEG) is greater than VHSSW_OFF. In overload, the hotswap switch goes into current-limiting mode with a current limit of IOVL. It will turn back ON after TWAITHSSW elapses and the dc-dc input capacitor is recharged, meaning the HSO-VNEG voltage is less than VHSSW_ON. The hotswap switch (if it is in the on state and conducting) can detect if the current is lower than IMPSth. If automatic sleep mode is enabled, the chip turns on MPS pulse generation, which ensures that the PSE will not disconnect. With the Si34061, an external hotswap switch can be used to improve efficiency and reduce thermal stress in high current applications. For Class 3 applications, using an external hotswap switch is recommended; for Class 4, it is mandatory because the internal hotswap switch otherwise generates significant heat. When an external hotswap switch is used, intelligent switch control ensures that inrush current limiting and automatic MPS request of the internal switch are still supported. 6 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 6 Si3406x Family Data Sheet • System Overview 2.4 HSSW State Machine The HSSW operates as simple 4-state state machine: 2 S3 S2 ON 3 INRUSH 1 170 mA S4 S1 5 5 4 OVERLOAD OFF 10 mA 5 Figure 2.5. Hotswap Switch 4-State Machine OFF State HSSW turn-on is controlled by UVLO, the undervoltage lockout feature. When UVLO is engaged, the HSSW is OFF. In this state, the HSSW is in idle mode, VNEG and HSO pins are disconnected. In normal operation, a complete detect/classification procedure precedes the HSSW turn-on, and the control of this sequence is implemented in the state machine logic of the chip. INRUSH State After the controller enables the HSSW, the block starts operation in the INRUSH state. In this state the switch itself is not directly turned on, but operating in a closed-loop current limit mode to avoid high current peaks during the charging of the input capacitor of the dc-dc converter. If the VHSSW voltage drops below 380 mV (meaning the bypass cap is 99% charged), the HSSW will change state to ON either in Type1 classification immediately, or in Type2 classification if the HSSW has been in the INRUSH state for at least 80 ms. ON State In ON state, the HSSW switch is completely turned on. The HSSW circuit continuously monitors VHSSW. HSSW will change to OVERLOAD state if VHSSW voltage increases over 3.5 V for at least 140 µs. OVERLOAD State In OVERLOAD state the HSSW operates in closed-loop low current limit mode. If the VHSSW voltage drops below 380 mV again, and the HSSW has been in the OVERLOAD state for at least 80 ms, the HSSW will change back to the ON state. 2.4.1 External HSSW FET Driver An external HSSW FET may be used to improve thermal operation of an Si34061 at very high power loading levels (the top end of Class 4). With the Si34061, the chip automatically detects if the EXTHSW pin is connected to VNEG or to a FET gate at startup. If the external hotswap FET driver will not be used, the EXTHSW pin must be tied to VNEG. For further information on using an external HSSW FET, please refer to "AN1130: Using the Si3406/Si34061/Si34062 PoE+ and Si3404 PoE PD Controller In Isolated and Non-Isolated Designs". 7 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 7 Si3406x Family Data Sheet • System Overview 2.5 DC to DC Converter The dc-dc converter is current-controlled for easier compensation and more robust protection of circuit magnetics. The controller has the following features: • High- and low-side error amplifier (supports Buck and Flyback topologies). • 681 Ω) 0 — 4 mA Class 1 (RCLASS = 140 Ω @ 1%) 9 — 12 mA Class 2 (RCLASS = 75 Ω @ 1%) 17 — 20 mA Class 3 (RCLASS = 48.7 Ω @ 1%) 26 — 30 mA Class 4 (RCLASS = 33.2 Ω @ 1 %) 36 — 44 mA VMARK Mark event voltage (at VPORT) 6.9 — 10.1 V IMARK Mark event current 0.25 — 4 mA VUVLO_R Hotswap closed and converter on 34 37 40 V VUVLO_F Hotswap open and converter off 30 32 34 V 3.5 4.5 6 V PoE PROTOCOL Detection VDET Classification VRESET VCLASS IPortCLASS Type 2 Classification Power On and UVLO VUVLO_HYST Thermal Characteristics TSHD Thermal shutdown — 160 — °C THYST Thermal shutdown hysteresis — 20 — °C TVS protection activation voltage (VPOSVNEG) 100 — — V Iinrush Inrush current 100 170 200 mA IMAXHSSW Maximum continuous operating current — — 600 mA VHSSW_ON Switch ON voltage — 380 — mV VHSSW_OFF Switch OFF voltage, HSSW goes to overload cycle — 3.5 — V On-Chip Transient Voltage Suppression/Protection VPROT Hotswap Switch 16 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 16 Si3406x Family Data Sheet • Electrical Specifications Symbol Parameter (Condition) Min Typ Max Unit IOVL Switch current limit in OVERLOAD State — 10.5 — mA IMPSth MPS signal request current level threshold 14 20 26 mA IEXT_DRV External hotswap driver peak current on EXTHSW pin — — 10 mA VEXT_DRV External hotswap driver voltage on EXTHSW pin 9 11 13 V TWAITHSSW Wait time in OVERLOAD and type 2 inrush 80 96 116 ms RONHSSW Internal hotswap drain-source resistance while ON 0.65 1.5 2.9 Ω ISWOPEAK Peak current limit of internal FET (SWO pin) 2.1 — 2.7 A VEXTGD External FET driver voltage (EXTGD pin) 9 11 13 V IEXTGD External FET driver peak current (EXTGD pin) — — 500 mA FOSCINT Using internal Oscillator 215 250 290 kHz Using external Oscillator, RFREQ = 215 kΩ 75 95 115 kHz Using external Oscillator, RFREQ = 39 kΩ 420 470 520 kHz DUC Output duty cycle of PWM — — 75 % VDCDCUVLO DCDC UVLO level (Minimum adapter voltageASUP mode) 10.75 11.3 11.85 V VFBREF FBH (referenced to VPOS) and FBL (referenced to VSS) reference voltage 1.28 1.32 1.36 V VEROUT Operating voltage range of error input 1 — 4 V THICCUP Output short protection if EROUT is max — 1 — ms VISNS_OVC Overcurrent limit voltage on ISNS (ref. to VSS) –305 –270 –255 mV VISNS_LC Low current limit voltage on ISNS (ref. to VSS) –45 –30 –15 mV VSWISNSMAX External FET peak current sense — 240 — mV TSOFTSTART Startup time1 — 15 — ms RONDCDC Internal DCDC switching FET drain-source resistance while ON — 0.9 1.2 Ω DC-DC FOSCEXT Regulators 17 VT15 Override internal regulator with transformer winding 12.5 — 16.5 V VDD 5 V regulated output 4.9 5.2 5.5 V VDDILIM DC current limit of VDD 9.7 11.2 — mA CREG Filter capacitor on VDD and V11 82 100 220 nF IMAXLED LED pin max current, reduces VDDILIM — 5 — mA IMAXDO Digital output max current (NT2P), reduces VDDILIM 2 2.5 — mA Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 17 Si3406x Family Data Sheet • Electrical Specifications Symbol Parameter (Condition) Min Typ Max Unit PINTMAX DC-DC max power internal FET — 0.2 0.9 W PMAX Total chip power — 0.5 — W IPortOP Operating current (VPORT 57 V; 250 kHz) — 3 5 mA Power Dissipation2 Package Thermal Characteristics2 θJA QFN20 — 44 — C°/W θJA QFN24 — 38.5 — C°/W Note: 1. Depends on output load. 2. Assumes 4-Layer PCB with adequate layout. 18 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 18 Si3406x Family Data Sheet • Pin Descriptions 5. Pin Descriptions SYNCL 19 VDD 4 14 VPOS LED 5 15 CT2 14 VPOS 13 SP1 7 8 9 10 11 12 SP2 WAKE 6 RCL 12 16 CT1 RFREQ SP2 20 VNEG (ePad) HSO RFREQ 11 SP2 RCL 10 RFREQ HSO 9 RCL RDET 8 HSO nSLEEP 7 RDET 10 15 CT2 13 SP1 nSLEEP 9 FBL 3 RDET VDD 4 EXTHSW 5 16 CT1 nSLEEP VNEG (ePad) ASUP 6 8 21 17 nT2P 12 VPOS 7 22 EROUT 2 FBL 3 6 23 17 nT2P EROUT 2 5 24 18 VT15 13 CT2 11 SP1 19 FBH 1 14 CT1 FBL 3 20 18 VT15 EROUT 2 VDD 4 21 ISNS 1 FBH 1 VNEG (ePad) 22 MODE 23 V11 24 SWO VSS 15 ISNS SWISNS 16 VSS nT2P 17 V11 SYNCL 18 Si34062 Pinout (Top View) SYNCL V11 19 SWO SWO 20 EXTGD VSS Si34061 Pinout (Top View) ISNS Si3406 Pinout (Top View) Table 5.1. Pin Descriptions '06 Pins '061 Pins '062 Pins Name Ref Dir. Vrange SWISNS VSS I 0–1 External FET peak current sense resistor voltage input 24 ISNS VSS I -1–0 Chip average current sense resistor input 1 FBH VPOS I 0–5.5 High side (VPOS referred) dc-dc feedback (Buck converter) 24 20 1 1 2 2 2 EROUT VSS IO 0–5.5 Error amplifier current output, compensation impedance input 3 3 3 FBL VSS I 0–5.5 Low side (VSS referenced) dc-dc feedback (Flyback converter) 4 4 4 VDD VSS O 0–5.5 5 V regulator output 5 LED VSS O 0–5.5 Output to drive sleep LED EXTHSW VNEG O 0–11 External hotswap switch drive WAKE VSS I 0–5.5 Wakeup from sleep mode ASUP VSS I 0–5.5 AUX auxiliary adapter present 5 6 6 19 Description 5 7 7 nSLEEP VSS I 0–5.5 Sleep, with pull-up, driven by open drain 6 8 8 RDET VPOS IO 0–100 Detection resistor 7 9 9 HSO VNEG IO 0–100 Hotswap switch output 8 10 10 RCL VNEG IO 0–5.5 Classification resistor 9 11 11 RFREQ VPOS IO 0–5.5 Oscillator frequency tuning resistor, tie to VPOS to select default frequency 10 12 12 SP2 SP1 I 0 - 100 High-voltage supply input from spare pair; polarity-insensitive 11 13 13 SP1 SP2 I 0–100 High-voltage supply input from spare pair; polarity-insensitive 12 14 14 VPOS — IO 0–100 Rectified high-voltage supply positive rail 13 15 15 CT2 CT1 I 0–100 High-voltage supply input from main pair; polarity-insensitive 14 16 16 CT1 CT2 I 0 - 100 High-voltage supply input from main pair; polarity-insensitive Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 19 Si3406x Family Data Sheet • Pin Descriptions '06 Pins '061 Pins '062 Pins Name Ref Dir. Vrange 15 17 17 nT2P VSS O 0–5.5 18 18 VT15 VSS I 0–16.5 dc-dc transformer bias winding input 16 19 19 SYNCL VSS O 0–11 Gate driver for synchronous rectification FET 17 20 20 V11 VSS IO 0–11 11 V regulator output for filter cap. EXTGD VSS O 0–11 External FET gate drive. When internal switching FET is in use, tie to VSS. 21 MODE VSS I 0–5.5 Controls MPS and LED switch behavior Internal dc-dc switch output (NMOS drain) 21 Description Type II classification was successful 18 22 22 SWO VSS O 0–120 19 23 23 VSS — IO 0 dc-dc converter primary ground ePad ePad ePad VNEG — IO 0 Rectified high voltage supply ground 20 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 20 Si3406x Family Data Sheet • Pin Descriptions 5.1 Detailed Pin Descriptions Table 5.2. Circuit Equivalent and Description of Die Pads Pin Name Detailed Description Circuit Detail VDD SWISNS External dc-dc switching FET peak current sense resistor input. The maximum current of the switching FET should correspond to voltage VSWISNSMAX. SWISNS RSWISNS VSS VSS ISNS Average current sense resistor input. The resistor value will set the maximum allowed average current for the application. The overcurrent threshold voltage VISNS_OVC. Note that this pin voltage goes below VSS. ISNS VPOS FBH High side dc-dc feedback input. Need to be tied to VPOS when not used. See VFBREF. FBH VDD dc-dc converter error output; current out, voltage sense. Loop compensating impedance should be connected here. EROUT EROUT IEROUT = (VFBH – VFBREF) x 50 μA or IEROUT = (VFBL – VFBREF) x 50 μA VSS VDD FBL Low side dc-dc feedback input. Need to be tied to VSS when not used. See VFBREF FBL VSS 21 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 21 Si3406x Family Data Sheet • Pin Descriptions Pin Name Detailed Description Circuit Detail VDD VDD Regulated 5 V relative to VSS. There is no foldback characteristic, reaching VDDILIM the output voltage decreases. The regulator needs CREG external capacitance. VSS VDD LED LED LED driver output Max current is IMAXLED VSS VDD WAKE Wake-up input pin for sleep mode, used only in Si34062. WAKE VSS VDD ASUP Auxiliary supply adapter is present. Enables the operation of the dc-dc controller without PoE supply being present (used only in Si34061). ASUP VSS VDD nSLEEP Sleep function input, see description in Sleep mode section. nSLEEP VSS 22 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 22 Si3406x Family Data Sheet • Pin Descriptions Pin Name Detailed Description Circuit Detail ICLASS RCL Classification resistor input. For class 0 this pin can be left floating. Pin is active only at time of classification. RCL + - REXT VNEG VPOS Used for adjusting the oscillator frequency. RFREQ The frequency is inversely proportional to the value of the connected resistor. REXT + - RFREQ IFREQ VPOS SP1, SP2 CT1, CT2 Main power inputs, goes to diode bridge producing VPOS and VNEG. Can be used up to Class 1 and Class 2. For higher power classes, external bridge is required. CT1,CT2 SP1,SP2 VNEG VPOS VPOS, VNEG Main chip power output generated by the diode bridge. Note that VNEG (the ePad on the bottom of the chip) also provides thermal relief. CT1,CT2 SP1,SP2 VNEG VDD nT2P 23 Pin main function is digital output; it is low if Type 2 classification was successful and the application is allowed to draw class 4 current. nT2P Output current is IMAXDO, but the load (e.g. an LED) should connected to VDD not VSS; otherwise, it can cause false operation. VSS Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 23 Si3406x Family Data Sheet • Pin Descriptions Pin Name Detailed Description Circuit Detail HSO HSO Hotswap Switch Output. The switch shorts the VNEG and HSO pins, and includes several other functions. See hotswap switch section for details. 100V VNEG V11 6V EXTGD, SYNCL EXTGD: Optional external switch driver of the dc-dc converter. When the internal switch is used this pin should be tied to VSS. This driver controls the external switch with 10 V logic level, relative to VSS. VCASP SYNCL: Optional synchronous rectifier switch driver of the dc-dc converter. When not used the pin must be left floating. This driver controls the external synchronous switch with 10 V logic level, relative to VSS. VCASN 6V EXTGD/ SYNCL 6V 6V VSS 11V internal supply 6V EXTHSW Optional external hotswap switch driver output. The maximum current of the internal hotswap switch is IMAXHSSW, for higher currents an external NMOS FET should be used in parallel with the internal HSSW (VNEG-HSO). When VCAS EXTGD is not used the pin should be tied to VNEG. This driver controls the external switch with 10 V logic level, relative to VNEG. 6V EXTHSW 6V 6V VNEG VPOS RDET 24 The user has to tie the RDET resistor between this pin and VPOS. During detection, a high voltage switch pulls down RDET to VNEG. After detection, the reference block uses RDET as absolute chip current reference, forcing –750 mV relative to VPOS, creating 30 µA for the internal blocks. 100V RDET RDET 100V VNEG Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 24 Si3406x Family Data Sheet • Pin Descriptions Pin Name Detailed Description Circuit Detail VPOS VT15, V11 VT15 VT15 is input for an optional 15 V supply generated by an auxiliary transformer bias winding. If the bias winding voltage is lower than VT15_MIN, the internal 15 V coarse regulator will provide the current for the 11 V regulator. 6V The V11 pin is for filtering capacitor for the 11 V regulator. A capacitor of value CREG is required. 6V V11 6V VSS VDD MODE MODE MPS mode control, used in Si34062. VSS SWO SWO dc-dc converter switching transistor drain output, Vmax = 120 V. VSS VPOS VSS dc-dc converter ground. 120V ESD CLAMP VSS 25 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 25 Si3406x Family Data Sheet • Packaging 6. Packaging 6.1 Package Outline: Si3406 The figure below illustrates the package details for the Si3406. The table lists the values for the dimensions shown in the illustration. Figure 6.1. 20-Pin, QFN Package Table 6.1. Package Diagram Dimensions Dimension Min Nom Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 b 0.25 0.30 0.35 D D2 26 5.00 BSC. 2.60 2.70 e 0.80 BSC. E 5.00 BSC. 2.80 E2 2.60 2.70 2.80 L 0.50 0.55 0.60 L1 0.00 — 0.10 aaa — — 0.10 bbb — — 0.10 ccc — — 0.08 ddd — — 0.10 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 26 Si3406x Family Data Sheet • Packaging Dimension Min Nom Max Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VHHB-1. 27 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 27 Si3406x Family Data Sheet • Packaging 6.2 Land Pattern: Si3406 The figure below illustrates the land pattern details for the Si3406. The table lists the values for the dimensions shown in the illustration. Figure 6.2. 20-Pin, QFN Land Pattern Table 6.2. Land Pattern Dimensions Dimension Max C1 4.70 C2 4.70 X1 0.35 X2 2.80 Y1 1.00 Y2 2.80 e 0.80 Note: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This land pattern design is based on the IPC-7351 guidelines. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 28 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 28 Si3406x Family Data Sheet • Packaging 6.3 Package Outline: Si34061/62 The figure below illustrates the package details for the Si34061/62. The table lists the values for the dimensions shown in the illustration. Figure 6.3. 24-Pin, QFN Package Table 6.3. Package Diagram Dimensions 29 Symbol Min Nom Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 b 0.25 0.30 0.35 A3 0.20 REF D 5.00 BSC. e 0.65 BSC. E 5.00 BSC. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 29 Si3406x Family Data Sheet • Packaging Symbol Min Nom Max D2 2.90 3.00 3.10 E2 2.90 3.00 3.10 L 0.35 0.40 0.45 K 0.20 — — aaa 0.15 bbb 0.10 ccc 0.10 ddd 0.05 eee 0.08 fff 0.10 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 30 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 30 Si3406x Family Data Sheet • Packaging 6.4 Land Pattern: Si34061/62 The figure below illustrates the land pattern details for the Si34061/62. The table lists the values for the dimensions shown in the illustration. Figure 6.4. 24-Pin, QFN Land Pattern Table 6.4. Land Pattern Dimensions Dimension mm C1 4.90 C2 4.90 X1 0.35 X2 3.10 Y1 0.85 Y2 3.10 e 0.65 Note: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted 2. This land pattern design is based on the IPC-7351 guidelines Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release 2. The stencil thickness should be 0.125 mm (5 mils) 3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 31 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 31 Si3406x Family Data Sheet • Top Markings 7. Top Markings 7.1 Si3406 Top Marking Figure 7.1. Si3406 Top Marking Table 7.1. Si3406 Top Marking Explanation Mark Method: Laser Pin 1 Mark: Circle = 0.50 mm Diameter (Lower-Left Corner) Font Size: 2.0 Point (28 mils) Line 1 Mark Format: Device Part Number Si3406 Line 2 Mark Format: Device Type A = Device Revision A G = Extended temperature range M = QFN package Line 3 Mark Format: TTTTTT Manufacturing Trace Code (assigned at assembly) Line 4 Mark Format: YY = Year Assembly Year WW = Work Week Assembly Week 32 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 32 Si3406x Family Data Sheet • Top Markings 7.2 Si34061 Top Marking Figure 7.2. Si34061 Top Marking Table 7.2. Si34061 Top Marking Explanation Mark Method: Laser Pin 1 Mark: Circle = 0.50 mm Diameter (Lower-Left Corner) Font Size: 2.0 Point (28 mils) Line 1 Mark Format: Device Part Number Si34061 Line 2 Mark Format: Device Type A = Device Revision A G = Extended temperature range M = QFN package Line 3 Mark Format: TTTTTT Manufacturing Trace Code (assigned at assembly) Line 4 Mark Format: YY = Year Assembly Year WW = Work Week Assembly Week 33 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 33 Si3406x Family Data Sheet • Top Markings 7.3 Si34062 Top Marking Figure 7.3. Si34062 Top Marking Table 7.3. Si34062 Top Marking Explanation Mark Method: Laser Pin 1 Mark: Circle = 0.50 mm Diameter (Lower-Left Corner) Font Size: 2.0 Point (28 mils) Line 1 Mark Format: Device Part Number Si34062 Line 2 Mark Format: Device Type A = Device Revision A G = Extended temperature range M = QFN package Line 3 Mark Format: TTTTTT Manufacturing Trace Code (assigned at assembly) Line 4 Mark Format: YY = Year Assembly Year WW = Work Week Assembly Week 34 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 34 Si3406x Family Data Sheet • Revision History 8. Revision History Revision 1.1 July, 2022 • Updated Table 5.1 Pin Descriptions on page 19. Revision 1.0 December, 2018 • • • • • Renamed and reordered sections 2.6, 2.7, 2.8, 2.9, and 2.10. Removed section V0.5 section 2.6 and merged with 2.4.1. Replaced Figure 2.4 Powered Device Voltages on page 6 with revised version. Replaced Figure 2.5 Hotswap Switch 4-State Machine on page 7 with new version. Replaced Figure 2.6 Si3406x DC-DC Converter Block Diagram on page 8 with new version. Updated 2.10 External Wall Adapter Support with further detail on external wall adapter support. • Updated Figure 2.9 Auxiliary Wall Adapter Connection Example on page 11. • Updated 4. Electrical Specifications, • Added min and max current to Peak Current spec. • Updated Table 4.1 Absolute Maximum Ratings1 on page 14. • Added junction temperature. • Updated Table 4.2 Recommended Operating Conditions on page 15. • Added VPOS-VNEG to VHV_OP spec and updated min voltage based on final characterization data • Added note on transition voltages for digital input pins. • Updated Table 4.3 Electrical Characteristics on page 16. • Reworded and corrected VDET spec. • Reworded and corrected VCLASS spec. • Removed IMARK typ spec. • Added min and max specs to VUVLO_R, VUVLO_F, and VUVLO_HYST based on final characterization data. • Removed IOVL max and min specs. • Added max voltage spec to VEXT_DRV based on final characterization data. • Added min and max frequency to FOSCINT based on final characterization data. • Removed TBD on DUC. • Added min and max spec to VFBREF based on final characterization data. • Added THICCUP spec. • Added min and max specs to VISNS_OVC and VISNS_LC based on final characterization data. • Updated TSOFTSTART based on application data and added note. • Updated all Regulators specs based on final characterization data. • Updated package thermal characteristics based on final characterization data. • Added electrical and junction temperature conditions. • PINTMAX specification typical value corrected to 0.2 W. • Updated Table 5.1 Pin Descriptions on page 19. • Updated Vrange. • Updated Table 5.2 Circuit Equivalent and Description of Die Pads on page 21. • Updated V15 and V11 descriptions. 35 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 35 Si3406x Family Data Sheet • Revision History Revision 0.5 February, 2018 • Updated 2. System Overview and 3. Application Examples. • Added theory of operation and application content. • Updated Table 4.1 Absolute Maximum Ratings1 on page 14, Table 4.2 Recommended Operating Conditions on page 15, and Table 4.3 Electrical Characteristics on page 16. • Clarified multiple parameters. • Added 5.1 Detailed Pin Descriptions. • Added 6. Packaging including outline and land pattern. Revision 0.1 August, 2016 • Initial release. 36 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 18, 2022 36 Connecting Everyone and Everything, All the Time Portfolio Quality Support & Resources skyworksinc.com skyworksinc.com/quality skyworksinc.com/support Copyright © 2022 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. 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Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. | Nasdaq: SWKS | sales@skyworksinc.com | www.skyworksinc.com USA: 781-376-3000 | Asia: 886-2-2735 0399 | Europe: 33 (0)1 43548540