Si4021 Universal ISM
Band FSK Transmitter
Si4021
PIN ASSIGNMENT
DESCRIPTION
Silicon Labs’ Si4021 is a single chip, low power, multi-channel FSK
transmitter designed for use in applications requiring FCC or ETSI
conformance for unlicensed use in the 433, 868, and 915 MHz bands.
Used in conjunction with Si4020, Silicon Labs’ FSK receiver, the Si4021
transmitter features EZRadioTM technology, which produces a flexible, low
cost, and highly integrated solution that does not require production
alignments. All required RF functions are integrated. Only an external
crystal and bypass filtering are needed for operation. The Si4021 builds on
the features presented by the Si4020 by offering a higher output power
and an improved phase noise characteristic. The Si4021 shares the same
pinout and control command set as the Si4020. The Si4021 offers all of
the frequencies as the Si4020, with the exception of the 315 MHz band.
The Si4021 features a completely integrated PLL for easy RF design, and
its rapid settling time allows for fast frequency hopping, bypassing
multipath fading and interference to achieve robust wireless links. In
addition, highly stable and accurate FSK modulation is accomplished by
direct closed-loop modulation with bit rates up to 115.2 kbps. The PLL’s
high resolution allows the use of multiple channels in any of the bands.
The integrated power amplifier of the transmitter has an open-collector
differential output that directly drive a loop antenna with programmable
output level. No additional matching network is required. An automatic
antenna tuning circuit is built in to avoid costly trimming procedures and
de-tuning due to the “hand effect”.
For low-power applications, the device supports automatic activation from
sleep mode. Active mode can be initiated by several wake-up events (onchip timer timeout, low supply voltage detection, or activation of any of the
four push-button inputs).
The Si4021’s on-chip digital interface supports both a microcontroller
mode and an EEPROM mode. The latter allows complete data transmitter
operation without a microcontroller (both control commands and data are
read from the EEPROM). Any wake-up event can start a transmission of the
corresponding data stored in the EEPROM.
FUNCTIONAL BLOCK DIAGRAM
XTL
CRYSTAL
OSCILLATOR
REFERENCE
RFP
SYNTHESIZER
RFN
CLOCK
FREQUENCY
LOAD CAP
OOK
nIRQ/nLBD
LOW
BATTERY
DETECT
LOW BAT
CLK/SDO
TRESHOLD
CONTROLLER
SDI
SCK
VDD
VSS
TIMEOUT
WAKE-UP
TIMER
nSEL
PERIOD
FSK
PB1 PB2 PB3 PB4
1
16
FSK
SDI
1
16
FSK
2
15
VDD
SCK
2
15
VDD
nSEL
3
14
nIRQ
nSEL
3
14
nLBD
PB1
4
13
RFP
PB1
4
13
RFP
PB2
5
12
RFN
PB2
5
12
RFN
PB3
6
11
MOD
PB3
6
11
MOD
PB4
7
10
VSS
PB4
7
10
VSS
CLK
8
9
XTL
SDO
8
9
XTL
Microcontroller Mode
EEPROM Mode
This document refers to Si4021-IC Rev A1.
See www.silabs.com/integration for any applicable
errata. See back page for ordering information.
FEATURES
Fully integrated (low BOM, easy design-in)
No alignment required in production
Fast settling, programmable, high-resolution PLL
Fast frequency hopping capability
Stable and accurate FSK modulation with programmable
deviation
Programmable PLL loop bandwidth
Direct loop antenna drive
Automatic antenna tuning circuit
Programmable output power level
Alternative OOK support
EEPROM mode supported
SPI bus for applications with microcontroller
Clock output for microcontroller
Integrated programmable crystal load capacitor
Multiple event handling options for wake-up activation
Push-button event handling with switch de-bounce
Wake-up timer
Low battery detection
2.2 to 5.4 V supply voltage
Low power consumption
Low standby current (0.3 µA)
Compact 16-pin TSSOP package
Transmit bit synchronization
TYPICAL APPLICATIONS
LEVEL
MOD
SDI
SCK
Remote control
Home security and alarm
Wireless keyboard/mouse and other PC peripherals
Toy control
Remote keyless entry
Tire pressure monitoring
Telemetry
Personal/patient data logging
Remote automatic meter reading
1
Si4021-DS Rev 2.3r 0408
www.silabs.com/integration
Si4021
DETAILED DESCRIPTION
The Si4021 FSK transmitter is designed to cover the unlicensed
frequency bands at 433, 868, and 915 MHz. The device
facilitates compliance with FCC and ETSI requirements.
PLL
The programmable PLL synthesizer determines the operating
frequency, while preserving accuracy based on the on-chip
crystal-controlled reference oscillator. The PLL’s high resolution
allows the usage of multiple channels in any of the bands. The
FSK deviation is selectable (from 30 to 210 kHz with 30 kHz
increments) to accommodate various bandwidth, data rate and
crystal tolerance requirements, and it is also highly accurate due
to the direct closed-loop modulation of the PLL. The transmitted
digital data can be sent asynchronously through the FSK pin or
over the control interface using the appropriate command.
The RF VCO in the PLL performs automatic calibration, which
requires only a few microseconds. To ensure proper operation in
the programmed frequency band, the RF VCO is automatically
calibrated upon activation of the synthesizer. If temperature or
supply voltage change significantly or operational band has
changed, VCO recalibration is recommended.. Recalibration can
be initiated at any time by switching the synthesizer off and back
on again.
Wake-Up Timer
The wake-up timer has very low current consumption (1.5 μA
typical) and can be programmed from 1 ms to several days with
an accuracy of ±5%.
It calibrates itself to the crystal oscillator at every startup, and
then every 30 seconds. When the oscillator is switched off, the
calibration circuit switches on the crystal oscillator only long
enough for a quick calibration (a few milliseconds) to facilitate
accurate wake-up timing. The auto calibration feature can be
disabled by setting the a bit in the Low Battery Detector
Command.
Event Handling
In order to minimize current consumption, the device supports
sleep mode. Active mode can be initiated by several wake-up
events: timeout of wake-up timer, detection of low supply
voltage, pressing any of the four push-button inputs, or through
the serial interface. The push-button inputs can be driven by a
logic signal from a microcontroller or controlled directly by
normally open switches. Pull-up resistors are integrated.
If any wake-up event occurs, the wake-up logic generates an
interrupt, which can be used to wake up the microcontroller,
effectively reducing the period the microcontroller has to be
active. The cause of the interrupt can be read out from the
transmitters by the microcontroller through the nIRQ pin.
RF Power Amplifier (PA)
Interface
The power amplifier has an open-collector differential output and
can directly drive a loop antenna with a programmable output
power level. An automatic antenna tuning circuit is built in to
avoid costly trimming procedures and the so-called “hand effect.”
The transmitters can operate in On-Off Keying (OOK) mode by
switching the power amplifier on and off. When the appropriate
control bit is set using the Power Setting Command, the FSK pin
becomes an enable input (active high) for the power amplifier.
An SPI compatible serial interface lets the user select the
operating frequency band and center frequency of the
synthesizer, polarity and deviation of FSK modulation, and output
power level. Division ratio for the microcontroller clock, wake-up
timer period, and low battery detector threshold are also
programmable. Any of these auxiliary functions can be disabled
when not needed. All parameters are set to default after poweron; the programmed values are retained during sleep mode.
Crystal Oscillator
EEPROM Mode
The chip has a single-pin crystal oscillator circuit, which provides
a 10 MHz reference signal for the PLL. To reduce external parts
and simplify design, the crystal load capacitor is internal and
programmable. Guidelines for selecting the appropriate crystal
can be found later in this datasheet.
In simple applications, the on-chip digital controller provides the
transmitters with direct interface to a serial (SPI) EEPROM. In this
case, no external microcontroller is necessary. Wake-up events
initiate automatic readout of the assigned command sequence
from EEPROM memory. For every event, there is a dedicated
starting address available in the EEPROM.
The transmitters can supply the clock signal for the
microcontroller, so accurate timing is possible without the need
for a second crystal. When the chip receives a Sleep Command
from the microcontroller and turns itself off, it provides several
further clock pulses (“clock tail”) for the microcontroller to be
able to go to idle or sleep mode. The length of the clock tail is
programmable.
Low Battery Voltage Detector
The low battery voltage detector circuit monitors the supply
voltage and generates an interrupt if it falls below a
programmable threshold level. The detector circuit has 50 mV
hysteresis.
Programming the EEPROM is very simple. Any control command
can be programmed in the EEPROM sequentially (same as in
microcontroller mode).
The internal power-on reset (POR) is a dedicated event, which
can be used to program the basic settings of the transmitters. In
this case the chip starts to read out the preprogrammed data
from the 00h address in EEPROM. Data can be transmitted with
the help of the Data Transmit Command, which tells the
transmitters how many bytes must be transmitted. The whole
process finishes with a Sleep Command.
2
Si4021
PACKAGE PIN DEFINITIONS, MICROCONTROLLER MODE
Pin type key: D=digital, A=analog, S=supply, I=input, O=output, IO=input/output
Microcontroller Mode Pin Assignment
SDI
1
16
FSK
SCK
2
15
VDD
nSEL
3
14
nIRQ
PB1
4
13
RFP
PB2
5
12
RFN
PB3
6
11
MOD
PB4
7
10
VSS
CLK
8
9
XTL
Pin
Name
Type
1
SDI
DI
Function
Data input of serial control interface
2
SCK
DI
Clock input of serial control interface
3
nSEL
DI
Chip select input of serial control interface (active low)
4
PB1
DI
Push-button input #1 (active low with internal pull-up resistor)
5
PB2
DI
Push-button input #2 (active low with internal pull-up resistor)
6
PB3
DI
Push-button input #3 (active low with internal pull-up resistor)
7
PB4
DI
Push-button input #4 (active low with internal pull-up resistor)
8
CLK
DO
Microcontroller clock (1 MHz-10 MHz)
9
XTL
AIO
Crystal connection (other terminal of crystal to VSS)
10
VSS
S
Ground reference
11
MOD
DI
Connect to logic high (microcontroller mode)
12
RFN
AO
Power amplifier output (open collector)
13
RFP
AO
Power amplifier output (open collector)
14
nIRQ
DO
Interrupt request output for microcontroller (active low) and status read output
15
VDD
S
Positive supply voltage
16
FSK
DI
Serial data input for FSK modulation
3
Si4021
Typical Application, Microcontroller Mode
VDD
C1
1u
C2
100p
C3
10p
D1
LED
RED
R1
470
GND
OPTIONAL
GP3
GP4
GP6
To other GP7
circuits GP8
MICRO
CONTROLLER
GP9
GP5
Antenna
GP2
SDI
1
16
FSK
GP1
SCK
2
15
VDD
GP0
nSEL
3
14
nIRQ
PB1
4
13
RFP
PB2
5
12
RFN
PB3
6
11
MOD
PB4
7
10
VSS
CLK
8
9
XTL
CLKin
(EC osc. mode)
X1
10MHz
S4
S3
S2
S1
GND
IA4221
GND
GND
OPTIONAL
GND
4
Si4021
PACKAGE PIN DEFINITIONS, EEPROM MODE
Pin type key: D=digital, A=analog, S=supply, I=input, O=output, IO=input/output
EEPROM Mode Pin Assignment
Pin
Name
Type
SDI
1
16
FSK
SCK
2
15
VDD
nSEL
3
14
nLBD
PB1
4
13
RFP
PB2
5
12
RFN
PB3
6
11
MOD
PB4
7
10
VSS
SDO
8
9
XTL
Function
1
SDI
DI
Data input of serial control interface
2
SCK
DO
Clock output of serial control interface
3
nSEL
DO
Chip select output of serial control interface (active low)
4
PB1
DI
Push-button input #1 (active low with internal pull-up resistor)
5
PB2
DI
Push-button input #2 (active low with internal pull-up resistor)
6
PB3
DI
Push-button input #3 (active low with internal pull-up resistor)
7
PB4
DI
Push-button input #4 (active low with internal pull-up resistor)
8
SDO
DO
Data output of serial control interface
9
XTL
AIO
Crystal connection (other terminal of crystal to VSS)
10
VSS
S
Ground reference
11
MOD
DI
Connect to logic low (EEPROM mode)
12
RFN
AO
Power amplifier output (open collector)
13
RFP
AO
Power amplifier output (open collector)
14
nLBD
DO
Low battery voltage detector output (active low)
15
VDD
S
Positive supply voltage
16
FSK
DI
Not used, connect to VDD or VSS
5
Si4021
Typical Application, EEPROM Mode
VDD
C1
1u
C2
100p
C3
10p
nCS
SO
nWP
GND
D1
LED
RED
R1
470
GND
1
2
3
4
8
7
6
5
EEPROM
25AA 080
VCC
HOLD
SCK
SI
GND
OPTIONAL
SDI
SCK
nSEL
PB1
PB2
PB3
PB4
SD0
1
2
3
4
5
6
7
8
IA 4221
16
15
14
13
12
11
10
9
FSK
VDD
nLBD
RFP
RFN
MOD
VSS
XTL
A ntenna
x
S4
S3
S2
S1
X1
10MHz
GND
GND
GND
6
Si4021
GENERAL DEVICE SPECIFICATIONS
All voltages are referenced to Vss, the potential on the ground reference pin VSS.
Absolute Maximum Ratings (non-operating)
Symbol
Parameter
Min
Max
Units
Vdd
Positive supply voltage
Vin
Voltage on any pin except open collector outputs
-0.5
6.0
V
-0.5
Vdd+0.5
Voc
V
Voltage on open collector outputs
-0.5
6.0
V
Iin
Input current into any pin except VDD and VSS
-25
25
mA
ESD
Electrostatic discharge with human body model
Tst
Storage temperature
Tld
Lead temperature (soldering, max 10 s)
-55
1000
V
125
ºC
260
ºC
Recommended Operating Range
Symbol
Parameter
Min
Max
Units
Vdd
Positive supply voltage
2.2
5.4
V
Voc
Voltage on open collector outputs (Max 6.0 V)
Vdd - 1
Vdd + 1
V
Top
Ambient operating temperature
-40
85
ºC
ELECTRICAL SPECIFICATION
(Min/max values are valid over the whole recommended operating range, typical conditions: Top = 27 oC; Vdd = Voc = 2.7 V)
DC Characteristics
Symbol
Idd_TX_0
Idd_TX_PMAX
Parameter
Supply current
(TX mode, Pout = 0 dBm)
Supply current
(TX mode, Pout = Pmax)
Conditions/Notes
Min
Typ
Max
Units
433 MHz band
12
868 MHz band
14
915 MHz band
15
433 MHz band
21
868 MHz band
23
915 MHz band
24
All blocks disabled
0.3
µA
mA
mA
Ipd
Standby current in sleep mode
(Note 1)
Iwt
Wake-up timer current consumption
1.5
µA
Ilb
Low battery detector current
consumption
0.5
µA
Ix
Idle current
1.5
mA
Vlba
Low battery detection accuracy
+/-3
%
Vlb
Low battery detector threshold
Vil
Digital input low level
Vih
Digital input high level
Iil
Digital input current
Vil = 0 V
-1
Iih
Digital input current
Vih = Vdd, Vdd = 5.4 V
-1
Vol
Digital output low level
Iol = 2 mA
Voh
Digital output high level
Ioh = -2 mA
Only crystal oscillator is on
Programmable in 0.1 V steps
2.25
5.35
V
0.3*Vdd
V
1
µA
1
µA
0.4
V
0.7*Vdd
Vdd-0.4
V
V
Note for table above is on page 7.
7
Si4021
AC Characteristics
Symbol
Parameter
Conditions/Notes
fref
PLL reference frequency
Crystal operation mode is parallel (Note
2)
fo
Transmitter frequency
Min
Typ
Max
Units
8
10
12
MHz
433 MHz band, 2.5 kHz resolution
430.24
439.75
868 MHz band, 5.0 kHz resolution
860.48
879.51
915 MHz band, 7.5 kHz resolution
900.72
929.27
tlock
PLL lock time
Frequency error < 10 kHz after 10 MHz
step, POR default PLL setting (Note 7)
tsp
PLL startup time
After turning on from idle mode, with
crystal oscillator already stable, POR
default PLL setting (Note 7)
IOUT
Open collector output current (Note
3)
At all bands
PmaxL
Available output power
(433 MHz band)
With opt. antenna impedance (Note 4)
8
dBm
PmaxH
Available output power
(868 and 915 MHz band)
With opt. antenna impedance (Note 4)
6
dBm
Pout
Typical output power
Selectable in 3 dB steps (Note 3)
Psp
Spurious emission
At max power with loop antenna
(Note 5)
Co
Output capacitance (set by the
automatic antenna tuning circuit)
Qo
Quality factor of the output
capacitance
Lout
Output phase noise
BRFSK
FSK bit rate
BROOK
OOK bit rate
dffsk
FSK frequency deviation
Programmable in 30 kHz steps
Crystal load capacitance
Programmable in 0.5 pF steps, tolerance
+/- 10%
Cxl
See Crystal Selection Guidelines
20
0.5
Pmax21
µs
250
µs
6
mA
Pmax
dBm
-50
dBc
At low bands
1.5
2.3
3.1
At high bands
1.6
2.2
2.8
16
18
22
100 kHz from carrier
-85
1 MHz from carrier (Note 7)
-105
(Note 7)
tPOR
Internal POR timeout
(Note 6)
After Vdd has reached 90% of final value
tsx
Crystal oscillator startup time
Crystal ESR < 100 Ohms (Note 8)
tPBt
Wake-up timer accuracy
Crystal oscillator must be enabled to
ensure proper calibration at startup
(Note 8)
twake-up
Programmable wake-up time
Cin, D
Digital input capacitance
tr, f
Digital output rise/fall time
dBc/Hz
115.2
kbps
512
kbps
30
210
kHz
8.5
16
pF
150
ms
5
ms
1.5
+/-10
1
15 pF pure capacitive load
pF
%
5·
1011
ms
2
pF
10
ns
All notes for table above are on page 7.
8
Si4021
Note 1: Using a CR2032 battery (225 mAh capacity), the expected battery life is greater than 2 years using a 60-second wake-up period
for sending 100 byte packets in length at 19.2 kbps with +3 dBm output power in the 915 MHz band.
Note 2:
Using anything but a 10 MHz crystal is allowed but not recommended because all crystal-referred timing and frequency
parameters will change accordingly.
Note 3:
Adjustable in 8 steps.
Note 4:
Optimal antenna admittance/impedance for the Si4021:
Yantenna [S]
Zantenna [Ohm]
Lantenna [nH]
434 MHz
1.3E-3 - j6.3E-3
31 + j152
58.00
868 MHz
1.35E-3 - j1.2E-2
9 + j82
15.20
915 MHz
1.45E-3 - j1.3E-2
8.7 + j77
13.60
Note 5:
With selective resonant antennas (see: Application Notes available from http://www.silabs.com/integration).
Note 6:
During this period, no commands are accepted by the chip. For detailed information see the Reset modes section.
Note 7:
The maximum FSK bitrate and the Output phase noise are dependent on the on the actual setting of the PLL Setting Command.
Note 8:
The crystal oscillator start-up time strongly depends on the capacitance seen by the oscillator. Using low capacitance and low ESR
crystal is recommended. When designing the PCB layout keep the trace connecting to the crystal short to minimize stray
capacitance.
9
Si4021
TYPICAL PERFORMANCE DATA
Phase noise measurements in the 868 MHz ISM band
50% Charge pump current setting
(Ref. level: -60 dBc/Hz, 10 dB/div)
11:52:47 May 5, 2005
Carrier Power
-11.11 dBm
Ref -60.00dBc/Hz
10.00
1
dB/
Atten
100, 50, 33% Charge pump current settings
(Ref. level: -70 dBc/Hz, 5 dB/div)
L
Phase Noise
Mkr 4
0.00 dB
13:30:49 May 5, 2005
5.00800 MHz
-115.65 dBc/Hz
Carrier Power
-11.03 dBm
Ref -70.00dBc/Hz
5.00
dB/
Atten
L
Phase Noise
Mkr 1
0.00 dB
1.00000 MHz
-101.95 dBc/Hz
2
3
4
1
2
3
10 kHz
Frequency Of f set
Marker
Trace
Ty pe
1
2
3
4
2
2
2
2
Spot
Spot
Spot
Spot
Freq
Freq
Freq
Freq
10 kHz
10 MHz
X Axis
10
151
1
5.008
kHz
kHz
MHz
MHz
Value
-76.65
-86.95
-107.11
-115.65
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Frequency Of f set
Marker
Trace
Ty pe
1
2
3
1
2
3
Spot
Spot
Spot
10 MHz
X Axis
Freq
Freq
Freq
1
1
1
MHz
MHz
MHz
Value
-101.95
-107.05
-109.98
dBc/Hz
dBc/Hz
dBc/Hz
Unmodulated RF Spectrum
The output spectrum is measured at different frequencies. The output is loaded with 50 Ohms through a matching network.
At 868 MHz
L
10:26:50 May 5, 2005
Ref 0 dBm
Samp
Log
10
dB/
At 915 MHz
Atten 10 dB
1
VAv g
100
W1 S2
S3 FC
AA
Center 868 MHz
Res BW 10 kHz
L
10:34:57 May 5, 2005
Mkr1 868.0010 MHz
-12.2 dBm
Ref 0 dBm
Samp
Log
10
dB/
Mkr1 915.0020 MHz
-14.09 dBm
Atten 10 dB
1
VAv g
100
W1 S2
S3 FC
AA
VBW 10 kHz
Span 2 MHz
Sw eep 40.74 ms (2001 pts)
Center 915 MHz
Res BW 10 kHz
VBW 10 kHz
Span 2 MHz
Sw eep 40.74 ms (2001 pts)
10
Si4021
Modulated RF Spectrum
At 433 MHz with
180 kHz Deviation at 64 kbps
At 868 MHz with
180 kHz Deviation at 64 kbps
17:11:41 Dec 7, 2005
Ref 10 dBm
#Samp
Log
10
dB/
17:26:17 Dec 7, 2005
Atten 20 dB
Ref 10 dBm
#Samp
Log
10
dB/
VAv g
24
W1 S2
S3 FC
AA
Atten 20 dB
VAv g
50
W1 S2
S3 FC
AA
Center 434 MHz
#Res BW 1 kHz
#VBW 1 kHz
Span 2 MHz
Sw eep 4.074 s (2000 pts)
Spurious RF Spectrum
With 10 MHz CLK Output Enabled at 433 MHz
Center 868 MHz
#Res BW 1 kHz
#VBW 1 kHz
Span 2 MHz
Sw eep 4.074 s (2000 pts)
Antenna Tuning Characteristics
750–970 MHz
17:18:23 Dec 7, 2005
Ref 10 dBm
#Peak
Log
10
dB/
Mkr1 19.98 MHz
-44.23 dB
Atten 20 dB
1R
1
VAv g
3
W1 S2
S3 FC
AA
Center 434 MHz
#Res BW 3 kHz
#VBW 300 Hz
Span 50 MHz
Sw eep 45.47 s (2000 pts)
The antenna tuning characteristics was recorded in “max-hold” state of the spectrum analyzer. During the measurement, the transmitters
were forced to change frequencies by forcing an external reference signal to the XTL pin. While the carrier was changing the antenna tuning
circuit switched trough all the available states of the tuning circuit. The graph clearly demonstrates that while the complete output circuit
had about a 40 MHz bandwidth, the tuning allows operating in a 220 MHz band. In other words, the tuning circuit can compensate for 25%
variation in the resonant frequency due to any process or manufacturing spread.
11
Si4021
CONTROL INTERFACE
Commands to the transmitters are sent serially. Data bits on pin SDI are shifted into the device upon the rising edge of the clock on pin SCK
whenever the chip select pin nSEL is low. When the nSEL signal is high, it initializes the serial interface. The number of bits sent is an integer
multiple of 8. All commands consist of a command code, followed by a varying number of parameter or data bits. All data are sent MSB first
(e.g. bit 15 for a 16-bit command). Bits having no influence (don’t care) are indicated with X. The Power On Reset (POR) circuit sets default
values in all control and command registers.
The status information or received data can be read serially over the IRQ pin. Bits are shifted out upon the falling edge of CLK signal
Timing Specification
Symbol
Parameter
Minimum value [ns]
tCH
Clock high time
25
tCL
Clock low time
25
tSS
Select setup time (nSEL falling edge to SCK rising edge)
10
tSH
Select hold time (SCK falling edge to nSEL rising edge)
10
tSHI
Select high time
25
tDS
Data setup time (SDI transition to SCK rising edge)
5
tDH
Data hold time (SCK rising edge to SDI transition)
5
tOD
Data delay time
10
tBL
Push-button input low time
25
Timing Diagram
12
Si4021
Control Commands
Control Command
Related Parameters/Functions
Related control bits
1
Configuration Setting Command
Frequency band, microcontroller clock output, crystal
load capacitance, frequency deviation
b1 to b0, d2 to d0, x3
to x0, ms, m2 to m0
2
Power Management Command
Crystal oscillator, synthesizer, power amplifier, low
battery detector, wake-up timer, clock output buffer
a1 a0, ex, es, ea, eb,
et, dc
3
Frequency Setting Command
Carrier frequency
f11 to f0
4
Data Rate Command
Bit rate
r7 to r0
5
Power Setting Command
Nominal output power, OOK mode
ook, p2 to p0
6
Low Battery Detector Command
Low battery threshold limit, transmit bit synchronizer,
wake-up timer calibration
dwc, ebs, t4 to t0
7
Sleep Command
Length of the clock tail after power down
s7 to s0
8
Push-Button Command
Push-button related functions
9
Wake-Up Timer Command
Wake-up time period
10
Data Transmit Command
Data transmission
11
Status Register Command
Transmitter status read
12
PLL Setting and Reset Mode Command
PLL bandwidth, reset mode
p4, d1 to d0, b4 to b1,
bc
r4 to r0, m7 to m0
bw1 to bw0, dr
Note: In the following tables the POR column shows the default values of the command registers after power-on.
1. Configuration Setting Command
bit
b1
0
0
1
1
15
1
b0
0
1
0
1
14
0
13
0
12
b1
11
b0
10
d2
Frequency Band {MHz]
315
433
868
915
9
d1
8
d0
7
x3
6
x2
5
x1
4
x0
3
ms
x3
0
0
0
0
x2
0
0
0
0
x1
0
0
1
1
2
m2
x0
0
1
0
1
1
m1
0
m0
POR
8080h
Crystal Load Capacitance [pF]
8.5
9.0
9.5
10.0
…
d2
d1
d0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Clock Output
Frequency [MHz]
1
1.25
1.66
2
2.5
3.33
5
10
1
1
1
1
1
1
0
1
15.5
16.0
The resulting output frequency can be calculated as:
fout = f0 – (-1)SIGN * (M + 1) * (30 kHz)
where:
f0 is the channel center frequency (see the next command)
M is the three bit binary number
SIGN = (ms) XOR (FSK input)
Note:
Use M in a range from 0 to 6.
13
Si4021
2. Power Management Command
bit
15
1
14
1
13
0
12
0
11
0
10
0
9
0
8
0
7
a1
6
a0
5
ex
4
es
3
ea
2
eb
1
et
0
dc
POR
C000h
Bits 5-0, enable the corresponding block of the transmitters, i.e. the crystal oscillator is enabled by the ex bit, the synthesizer by es, the
power amplifier by ea and the low battery detector by eb, while the wake-up timer by et. The bit dc disables the clock output buffer.
When receiving the Data Transmit Command, the chip supports automatic on/off control over the crystal oscillator, the PLL and the PA.
If bit a1 is set, the crystal oscillator and the synthesizer are controlled automatically. Data Transmit Command starts up the crystal oscillator
and as soon as a stable reference frequency is available the synthesizer starts. After a subsequent delay to allow locking of the PLL, if a0 is
set the power amplifier is turned on as well.
Note:
To enable the automatic internal control of the crystal oscillator, the synthesizer and the power amplifier, the corresponding bits
(ex, es, ea) must be zero in the Power Management Command.
In microcontroller mode, the ex bit should be set in the Power Management Command for the correct control of es and ea. The
oscillator can be switched off by clearing the ex bit after the transmission.
In EEPROM operation mode after an identified Data Transmit Command the internal logic switches on the synthesizer and PA. At
the end of Data Transmit Command header if necessary the current clock cycle is automatically extended to ensure the PLL
stabilization and RF power ramp-up.
In EEPROM operation mode the internal logic switches off the PA when the given number of bytes is transmitted. (See: Data
Transmit Command in EEPROM operation.)
When the chip is controlled by a microcontroller, the Sleep Command can be used to indicate the end of the data transmission
process, because in microcontroller mode the Data Transmit Command does not contain the length of the TX data.
For processing the events caused by the peripheral blocks (POR, LBD, wake-up timer, push-buttons) the chip requires operation of
the crystal oscillator. This operation is fully controlled internally, independently from the status of the ex bit, but if the dc bit is zero,
the oscillator remains active until Sleep Command is issued. (This command can be considered as an event controller reset.)
Oscillator control logic
ex
CLK request from
peripheral bloks
(POR, Wake-up timer, LBD, PBs)
Data transmit command
enable
oscillator
Wake-up timer int.cal.
Sleep command
dc
uC MODE
14
Si4021
3. Frequency Setting Command
bit
15
1
14
0
13
1
12
0
11
f11
10
f10
9
f9
8
f8
7
f7
6
f6
5
f5
The 12-bit parameter of the Frequency Setting Command has the value F. The value F should be in the range of 96 and
3903. When F is out of range, the previous value is kept. The
synthesizer center frequency f0 can be calculated as:
4
f4
3
f3
2
f2
1
f1
0
f0
POR
A7D0h
The constants C1 and C2 are determined by
the selected band as:
f0 = 10 MHz * C1 * (C2 + F/4000)
Band [MHz]
433
C1
1
C2
43
868
2
43
915
3
30
Note:
For correct operation of the frequency synthesizer, the frequency and band of operation need to be programmed before the
synthesizer is started. Directly after activation of the synthesizer, the RF VCO is calibrated to ensure proper operation in the
programmed frequency band.
4. Data Rate Command
bit
15
1
14
1
13
0
12
0
11
1
10
0
9
0
8
0
7
r7
6
r6
5
r5
4
r4
3
r3
2
r2
1
r1
0
r0
POR
C800h
In EEPROM mode the transmitted bit rate is determined by the 8-bit value R (bits ) as:
BR = 10 MHz / 29 / (R+1)
Apart from setting custom values, the standard bit rates from 2.4 to 115.2 kbps can be approximated with minimal error.
The commands are read out with a different fixed bit rate:
Fsck = 10 MHz / 29 / 3 [~115.2 kHz]
Note:
PLL bandwidth should be set according the data rate. Please see the PLL Setting Command.
5. Power Setting Command
bit
7
1
6
0
5
1
4
1
3
ook
2
p2
1
p1
0
p0
POR
B0h
The bit ook enables the OOK mode for the PA, in this case the data to be transmitted are received through the FSK pin.
p2
p1
p0
Relative Output Pow er [dB]
0
0
0
0
0
1
0
-3
0
0
1
1
0
1
-6
-9
1
1
1
1
0
0
1
1
0
1
0
1
-12
-15
-18
-21
The output power is given in the table as relative to the
maximum available power, which depends on the actual
antenna impedance. (See: Antenna Application Note
available from www.silabs.com/integration).
15
Si4021
6. Low Battery Detector Command
bit
15
1
14
1
13
0
12
0
11
0
10
0
9
1
8
0
7
dwc
6
0
5
ebs
4
t4
3
t3
2
t2
1
t1
0
t0
POR
C200h
Bit 7 Disables the Wake-up timer periodical (every 30 second) calibration if this bit is set.
Bit 5 Enables the TX bit synchronization circuit. The data rate must be set by the Data Rate Command.
SPI commands
Data Rate
LBD&Bsync
Power Man
ebs=1
ea=1
Power Man
//
(nSEL, SCK, SDI)
Set the DR
nIRQ
ea=0
nIRQ
nIRQ
//
Bit time
1.6us
//
FSK or SDI
TX bit1
TX bit2
TX bitN
//
//
TX Data
TX bit1
TX bitN-1
TX bitN
//
(RF modulator input)
The 5-bit value T of determines the threshold voltage Vlb of the detector:
Vlb = 2.25 V + T * 0.1 V
7. Sleep Command
bit
15
1
14
1
13
0
12
0
11
0
10
1
9
0
8
0
7
s7
6
s6
5
s5
4
s4
3
s3
2
s2
1
s1
0
s0
POR
C410h
The effect of this command depends on the Power Management Command. It immediately disables the power amplifier (if a0=1 and ea=0)
and the synthesizer (if a1=1 and es=0). Stops the crystal oscillator after S periods of the microcontroller clock (if a1=1 and ex=0) to enable
the microcontroller to execute all necessary commands before entering sleep mode itself. The 8-bit value S is determined by bits .
16
Si4021
8. Push-Button Command
bit
15
1
14
1
13
0
12
0
11
1
10
0
9
1
8
0
7
p4
6
d1
5
d0
4
b4
3
b3
2
b2
1
b1
0
bc
POR
CA00h
If the corresponding bit was set (b1-b4) the event remains active while the button is pressed. In EEPROM mode, the chip is continuously
performing the routine assigned to the push-button while it is pressed. In microcontroller mode, the chip continuously generates interrupts
on nIRQ until the push-button is released. Weak pull-up currents are switched off when bc is high.
The d0, d1 bits set the de-bouncing time period:
d1
d0
De-bouncing Time [ms]
0
0
160
0
1
40
1
0
10
1
1
0 (Bypassed)
Note:
Until the de-bouncing time has expired, the crystal oscillator remains switched on, independent of the status of the ex bit in the
Power Management Command. (Because the circuit uses the crystal oscillator signal for timing.)
If the p4 bit is set, the controller performs the routine assigned to the fourth button when PB1 and PB2 are pressed down
simultaneously. With the addition of this feature, there is a way to build a device that uses 3 buttons, but performs 4 functions.
It is possible to detect multiple pressed push-buttons, in both modes. In EEPROM mode the controller executes sequentially all the
routines belonging to the pressed buttons.
17
Si4021
Simultaneously Pressed Push-Button Detect by Microcontroller
Microcontroller mode
Vdd
POR
(internal)
Push button
input 1
Push button
input 2
nIRQ
POR
PB1
PB1
PB2
PB1
PB2
PB1
PB_nIRQdly*
SPI
Status rd
Status rd
Status rd
Status rd
Status rd
Status rd
Status rd
Note:
*PB_nIRQdly is equal with the
debounce time
Simplified Block Diagram of Push-Button 1–4 Inputs
POR, LBD, WAKE UP TIMER,
P. BUTTONS EVENT FLAGS
Notice:
Only one EVENT is
serviced simultaneously
the others are pending.
VDD
VDD
WEAK PULL-UP
ENABLE/DISABLE
Push-button1,2,3
CLK
EVENT FLAG
bc
D
Digital glitch
filter
CLR for P.B1,2
Q
CLR
SLEEP Command *
STAT. REG. READ Command **
COUNT/SINGLE
Internal
blocker signal
to
Push-button1
and
Push-button2
p4
Push-button1
Push-button2
With internal weak pull-up
To Digital glitch filter for
Push-button4
b1, b2, b3
Note:
* In EEprom mode
** In uC controlled mode
Push-button4
18
Si4021
9. Wake-Up Timer Command
bit
15
1
14
1
13
1
12
r4
11
r3
10
r2
9
r1
8
r0
7
m7
6
m6
5
m5
4
m4
3
m3
2
m2
1
m1
0
m0
POR
E000h
The wake-up time period can be calculated as:
Twake-up = M * 2R [ms] ,
where M is defined by the digital value and R is defined by the digital value.
The value of R should be in the range of 0 and 23. The maximum achievable wake-up time period can be up to 24 days.
Note:
For continual operation the et bit should be cleared and set at the end of every cycle.
Software reset: Sending FE00h command to the chip triggers software reset. For more details see the Reset modes section.
10. Data Transmit Command
In EEPROM operation mode:
bit
15
1
14
1
13
0
12
0
11
0
10
1
9
1
8
0
3
0
2
1
1
1
0
0
7
n7
6
n6
5
n5
4
n4
3
n3
2
n2
1
n1
0
n0
POR
--
In microcontroller slave mode:
bit
7
1
6
1
5
0
4
0
This command indicates that the following bitstream coming in via the serial interface is to be transmitted. In EEPROM mode, the 8-bit value
N of bits contains the number of data bytes to follow.
Note:
This command is not needed if the transmitters’ power management bits (ex, es, ea) are fully controlled by the microcontroller and
TX data comes through the FSK pin.
If the crystal oscillator was formerly switched off (ex=0), the internal oscillator needs tsx time, to switch on. The actual value
depends on the type of quartz crystal used.
If the synthesizer was formerly switched off (es=0), the internal PLL needs tsp startup time. Valid data can be transmitted only when
the internal locking process is finished.
In EEPROM mode, before issuing the Data Transmit Command, the power amplifier must be enabled, with the ea or a0 bit in the
Power Management Command.
In EEPROM mode, when N bytes have been read and transmitted the controller continues reading the EEPROM and processing the
data as control commands. This process stops after Sleep Command has been read from the EEPROM.
19
Si4021
Data Transmit Sequence Through the FSK Pin
nSEL
Power Management Command
C0h
38h
SCK
instruction
SDI
tsx *
Internal operations
a0, a1 = 0
ex, es, ea = 1
xtal osc. stable
Xtal osc staus
tsp *
synthesizer / PLL /
PA status
FSK
synthesizer on, PLL locked, PA ready to transmit
don't care
TX DATA
NOTE:
* See page 6 for the timing values
Data Transmit Sequence Through the SDI Pin
nSEL
Data Transmit Command
C6h
SCK
instruction
transmit data
SDI
TX DATA
tsx+tsp *
NOTE:
* See page 6 for the timing values
Note:
Do not send CLK pulses with the TX data bits, otherwise they will be interpreted as commands.
This mode is not SPI compatible, therefore it is not recommended in microcontroller mode.
If the crystal oscillator and the PLL are running, the tsx+tsp delay is not needed.
20
Si4021
11. Status Register Read Command
bit
15
1
14
1
13
0
12
0
11
1
10
1
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
POR
--
With this command, it is possible to read the chip’s status register through the nIRQ pin. This command clears the last serviced interrupt and
processing the next pending one will start (if there is any).
Status Register Read Sequence
nSEL
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
instruction
SDI
status out
nIRQ
POR
PB1
PB2
PB3
PB4
LBD
WK-UP
nIRQ
12. PLL Setting and Reset Mode Command
bit
15
1
14
1
13
0
12
1
11
0
10
0
9
1
8
0
7
bw1
6
bw0
5
0
4
0
3
0
2
0
1
dr
0
0
POR
D200h
Bits 7-6 select the PLL bandwidth:
bw1 bw0
Max datarate
[kbps]
Phase Noise at 1MHz offset
[dBc/Hz] (typical)
Charge pump current
0
1
19.2
-112
25%
1
1
38.4
-110
33%
0
0
68.9
-107
50%
1
0
115.2
-102
100%
Bit 1 (dr): Disables the highly sensitive RESET mode. If this bit is cleared, a 600 mV glitch in the power supply may cause a system reset. For
more detailed description see the Reset modes section.
21
Si4021
EEPROM MODE
In this mode, the transmitters can operate with a standard at least 1 kbyte serial EEPROM with an SPI interface, and no microcontroller is
necessary. The following events cause wake-up of the device:
Event Number N
EEPROM entry point
0
0000h
Description
power-on
1
0080h
low level on input PB1
2
0100h
low level on input PB2
3
0180h
low level on input PB3
4
0200h
low level on input PB4
5
0280h
low supply voltage level
6
0300h
wake-up timer timeout
After any of these events, the crystal oscillator turns on and the device starts to read bytes from the EEPROM continuously (block read)
starting from address N * 128 (decimal) and executes them as commands as described in the previous section.
Note:
Zero bytes can be put in the EEPROM for timing purposes. Never put more than 31 consecutive zero bytes into the EEPROM’s
active region (between the actual entry point and the closing Sleep Command).
Example EEPROM Hexa Content
Power-On Reset:
00000000
C0
C4
CA
1E
C8
23
C4
00
00
00
00
00
00
00
00
00
00000010
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00000020
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00000030
00000040
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00000050
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00000060
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00000070
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
Short Explanation:
Data in Address, Command, and Parameter fields are hexadecimal values.
For the detailed description of the control command bits, see previous section.
Address
Command
Parameter
Related Control Command
Remarks
00–01
C0
C4
Power Management
Crystal– Synthesizer – Power Amplifier auto
on/off mode enable
02–03
04–05
CA
1E
Push Button
Continuous execution for all push buttons
C8
23
Bit Rate
BR=10M/29/(35+1)~9600 bps
06-07
C4
00
Sleep
Power down
22
Si4021
Push-button 1:
00000080
88
72
A6
10
C6
60
55
55
55
55
55
55
55
55
55
55
00000090
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
000000A0
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
000000B0
000000C0
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
000000D0
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
000000E0
55
55
55
55
55
55
C4
00
00
00
00
00
00
00
00
00
000000F0
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
Short Explanation:
Address
Command
Parameter
80–81
8
82–83
A
84–85
C6
86–E5
E6–E7
Note:
Related Control Command
Remarks
872
Configuration Control
433MHz band, Xtal CL=12pF
fdev=90kHz
610
Frequency
fc=(43+1552/4000)*10MHz
60
Data Transmit
Transmit the next 96 bytes
60x55
C4
00
Data
Sleep
Power down, go to address 80
This routine is repeatedly executed while PB1 is pressed, because continuous execution was selected at POR (CA1E code issued in
the power-on reset section before).
RX-TX ALIGNMENT PROCEDURES
RX-TX frequency offset can be caused only by the differences in the actual reference frequency. To minimize these errors it is suggested to
use the same crystal type and the same PCB layout for the crystal placement on the RX and TX PCBs.
To verify the possible RX-TX offset it is suggested to measure the CLK output of both chips with a high level of accuracy. Do not measure the
output at the XTL pin since the measurement process itself will change the reference frequency. Since the carrier frequencies are derived
from the reference frequency, having identical reference frequencies and nominal frequency settings at the TX and RX side there should be
no offset if the CLK signals have identical frequencies.
It is possible to monitor the actual RX-TX offset using the AFC status report included in the status byte of the receiver. By reading out the
status byte from the receiver the actual measured offset frequency will be reported. In order to get accurate values the AFC has to be
disabled during the read by clearing the "en" bit in the AFC Control Command (bit 0).
23
Si4021
CRYSTAL SELECTION GUIDELINES
The crystal oscillator of the Si4021 requires a 10 MHz parallel mode crystal. The circuit contains an integrated load capacitor in order to
minimize the external component count. The internal load capacitance value is programmable from 8.5 pF to 16 pF in 0.5 pF steps. With
appropriate PCB layout, the total load capacitance value can be 10 pF to 20 pF so a variety of crystal types can be used.
When the total load capacitance is not more than 20 pF and a worst case 7 pF shunt capacitance (C 0) value is expected for the crystal, the
oscillator is able to start up with any crystal having less than 100 ohms ESR (equivalent series loss resistance). However, lower C0 and ESR
values guarantee faster oscillator startup. It is recommended to keep the PCB parasitic capacitances on the XTL pin as low as possible.
The crystal frequency is used as the reference of the PLL, which generates the RF carrier frequency (fc). Therefore fc is directly proportional to
the crystal frequency. The accuracy requirements for production tolerance, temperature drift and aging can thus be determined from the
maximum allowable carrier frequency error.
Maximum XTAL Tolerances Including Temperature and Aging [ppm]
Bit Rate:
433 MHz
868 MHz
915 MHz
Bit Rate:
Transmitter Deviation [+/- kHz]
90
120
150
75
100
100
40
60
75
40
50
75
180
100
100
75
210
100
100
100
30
15
8
8
60
50
25
25
Transmitter Deviation [+/- kHz]
90
120
150
75
100
100
40
60
75
40
50
70
180
100
75
75
210
100
100
100
30
don't use
don't use
don't use
60
20
10
10
Transmitter Deviation [+/- kHz]
90
120
150
50
75
100
30
40
60
25
40
60
180
100
75
75
210
100
100
75
30
don't use
don't use
don't use
60
don't use
don't use
don't use
Transmitter Deviation [+/- kHz]
90
120
150
don't use
don't use
30
don't use
don't use
20
don't use
don't use
15
180
50
30
30
210
100
50
50
38.4 kbps
433 MHz
868 MHz
915 MHz
Bit Rate:
60
50
25
25
9.6 kbps
433 MHz
868 MHz
915 MHz
Bit Rate:
30
20
10
10
2.4 kbps
115.2 kbps
433 MHz
868 MHz
915 MHz
Whenever a low frequency error is essential for the application, it is possible to “pull” the crystal to the accurate frequency by changing the
load capacitor value. The widest pulling range can be achieved if the nominal required load capacitance of the crystal is in the “midrange”,
for example 16 pF. The “pull-ability” of the crystal is defined by its motional capacitance and C0.
Note:
There may be other requirements for the TX carrier accuracy with regards to the requirements as defined by standards and/or
channel separations.
24
Si4021
RESET MODES
The chip will enter into reset mode if any of the following conditions are met:
Power-on reset: During a power up sequence until the Vdd has reached the correct level and stabilized
Power glitch reset: Transients present on the Vdd line
Software reset: Special control command received by the chip
Power-on reset
After power up the supply voltage starts to rise from 0V. The reset block has an internal ramping voltage reference (reset-ramp signal), which
is rising at 100mV/ms (typical) rate. The chip remains in reset state while the voltage difference between the actual V dd and the internal
reset-ramp signal is higher than the reset threshold voltage, which is 600 mV (typical). As long as the Vdd voltage is less than 1.6V (typical)
the chip stays in reset mode regardless the voltage difference between the Vdd and the internal ramp signal.
The reset event can last up to 150ms supposing that the Vdd reaches 90% its final value within 1ms. During this period the chip does not
accept control commands via the serial control interface.
Power-on reset example:
Vdd
Reset threshold voltage
(600mV)
1.6V
Reset ramp line
(100mV/ms)
time
nRes
output
H
L
It stays in reset because the Vdd < 1.6V (even if the voltage
difference is smaller than the reset threshold)
Power glitch reset
The internal reset block has two basic mode of operation: normal and sensitive reset. The default mode is sensitive, which can be changed
by the appropriate control command (see Related control commands at the end of this section). In normal mode the power glitch detection
circuit is disabled.
There can be spikes or glitches on the Vdd line if the supply filtering is not satisfactory or the internal resistance of the power supply is too
high. In such cases if the sensitive reset is enabled an (unwanted) reset will be generated if the positive going edge of the Vdd has a rising
rate greater than 100mV/ms and the voltage difference between the internal ramp signal and the V dd reaches the reset threshold voltage
(600 mV). Typical case when the battery is weak and due to its increased internal resistance a sudden decrease of the current consumption
(for example turning off the power amplifier) might lead to an increase in supply voltage. If for some reason the sensitive reset cannot be
disabled step-by-step decrease of the current consumption (by turning off the different stages one by one) can help to avoid this problem.
Any negative change in the supply voltage will not cause reset event unless the V dd level reaches the reset threshold voltage (250mV in
normal mode, 1.6V in sensitive reset mode).
If the sensitive mode is disabled and the power supply turned off the Vdd must drop below 250mV in order to trigger a power-on reset event
when the supply voltage is turned back on. If the decoupling capacitors keep their charges for a long time it could happen that no reset will
be generated upon power-up because the power glitch detector circuit is disabled.
Note that the reset event reinitializes the internal registers, so the sensitive mode will be enabled again.
25
Si4021
Sensitive Reset Enabled, Ripple on Vdd:
Vdd
Reset threshold voltage
(600mV)
Reset ramp line
(100mV/ms)
1.6V
time
nRes
output
H
L
Sensitive reset disabled:
Vdd
Reset threshold voltage
(600mV)
Reset ramp line
(100mV/ms)
250mV
time
nRes
output
H
L
Software reset
Software reset can be issued by sending the appropriate control command (described at the end of the section) to the chip. The result of the
command is the same as if power-on reset was occurred.
Vdd line filtering
During the reset event (caused by power-on, fast positive spike on the supply line or software reset command) it is very important to keep
the Vdd line as smooth as possible. Noise or periodic disturbing signal superimposed the supply voltage may prevent the part getting out from
reset state. To avoid this phenomenon use adequate filtering on the power supply line to keep the level of the disturbing signal below
10mVp-p in the DC – 50kHz range for 200ms from Vdd ramp start.. Typical example when a switch-mode regulator is used to supply the radio,
switching noise may be present on the Vdd line. Follow the manufacturer’s recommendations how to decrease the ripple of the regulator IC
and/or how to shift the switching frequency.
Related control commands
“PLL setting and Reset Mode Command”
Setting bit to high will change the reset mode to normal from the default sensitive.
“SW Reset Command”
Issuing FE00h command will trigger software reset. See the Wake-up Timer Command.
26
Si4021
SIMPLIFIED INTERNAL CONTROL AND TIMING
The internal controller uses the clock generated by the crystal oscillator to sequentially process the various events and to de-bounce the
push-button (PB) inputs. If the oscillator is not running, internal logic automatically turns it on temporarily and then off again. Such events
are: any wake-up event (POR, PB press, wake-up timer timeout and low supply voltage detection), PB release and status read request by the
microcontroller.
If two wake-up events occur in succession, the crystal oscillator stays on until the next status read (acknowledgment of the first event).
Simplified Internal Control and Timing Diagrams
Microcontroller mode (ec=0, ex=0)
Vdd
POR
(inte rna l)
Push-button
inpu t x
Debouncing Time + T
s x*
Osc_On
(In terna l)
SP I
Status rd cmd
nIRQ
Status rd cmd
Stat. b its
(PO R)
Stat. b its
(PB x)
Tsx*
Tsx*
Microcontroller mode with multiple event read (ec=0, ex=0)
Vdd
POR
(inte rna l)
Push-button
inpu t x
Osc_On
(In terna l)
SP I
Status rd cmd
nIRQ
Status rd cmd
Stat. b its
Stat. b its
(PO R)
(PB x)
1us
Tsx*
Microcontroller mode (ec=1, ex=0)
Vdd
POR
(inte rna l)
Push-button
inpu t x
Osc_On
(In terna l)
SP I
Status rd
Slee p cmd
Status rd
Slee p cmd
Tclk_tail**
Tclk_tail**
No te:
* Tsx : Crystal oscillator st
artup t im e
** Length of Tclk_tail is determined by the parameter in the Sleep comm
a nd
27
Si4021
MATCHING NETWORK FOR A 50 OHM SINGLE ENDED OUTPUT
Matching Network Schematic
Si4021
L4 [nH]
C1 [pF]
(Note 1)
C1 [pF]
(Note 2)
C2 [pF]
C3 [pF]
C4 [pF]
(Note 3)
390
16
3.3
3.3
6.0
2.7
220
100
5.1
2
1.5
2.2
1.2
47
100
4.3
2
1.8
2.2
1.2
33
L1 [nH]
L2 [nH]
L3 [nH]
433 MHz
16
47
868 MHz
5.1
24
915 MHz
4.3
24
Note 1:
1 mm thick board
Note 2:
1.5 mm thick board
Note 3: C4 must be connected parallel to the supply decoupling capacitors (10nF + 2.2µF recommended) as close as possible to the VDD
and VSS pins
28
Si4021
EXAMPLE APPLICATIONS: DATA PACKET TRANSMISSION
Data packet structure
An example data packet structure using the IA422x – IA4320 pair for data transmission. This packet structure is an example of how to use
the high efficiency FIFO mode at the receiver side:
AA AA AA 2D D4 D0 D1 D2
Preamble
...
DN
Databytes (received in the
FIFO of the receiver)
Synchron pattern
The first 3 bytes compose a 24 bit length ‘01’ pattern to let enough time for the clock recovery of the receiver to lock. The next two bytes
compose a 16 bit synchron pattern which is essential for the receiver’s FIFO to find the byte synchron in the received bit stream. The
synchron patters is followed by the payload. The first byte transmitted after the synchron pattern (D0 in the picture above) will be the first
received byte in the FIFO.
Important: The bytes of the data stream should follow each other continuously, otherwise the clock recovery circuit of the receiver side will
be unable to track.
Further details of packet structures can be found in the IA ISM-UGSB1 software development kit manual.
29
Si4021
EXAMPLE APPLICATIONS
For Microcontroller Mode
Schematic
IA4221
PCB Layout of Keyboard Transmitter Demo Circuit Using Microcontroller Mode (operating in the 915 MHz band)
Top Layer
Bottom Layer
30
Si4021
For EEPROM Mode
Schematic
PCB Layout of Push-Button Transmitter Demo Circuit Using EEPROM Mode (operating in the 434 MHz band)
Top Layer
Bottom Layer
31
Si4021
PACKAGE INFORMATION
16-pin TSSOP
See Detail “A”
Section B-B
Gauge Plane
0.25
Detail “A”
Symbol
A
A1
A2
b
b1
c
c1
D
e
E
E1
L
L1
R
R1
1
2
3
Min.
0, 05
0,80
0, 19
0,19
0, 09
0, 09
4,90
4,30
0,50
Dimensions in mm
Nom.
Max.
1, 20
0, 15
0,90
1,05
0, 30
0,22
0,25
0, 20
0, 16
5,00
5,10
0. 65 B S C .
6.40 BSC.
4,40
4,50
0,60
0,75
1.00 REF.
0, 09
0 , 09
0
8
12 REF.
12 REF.
Dimensions in Inches
Nom.
Max.
0, 047
0, 002
0, 006
0,031
0,035
0,041
0, 007
0, 012
0,007
0,009
0,010
0, 004
0, 008
0, 004
0 , 0 06
0,193
0,197
0,201
0 . 0 2 6 B S C.
0.252 BSC.
0,169
0,173
0,177
0,020
0,024
0,030
0.39 REF.
0, 004
0 , 0 04
0
8
12 REF.
12 REF.
Min.
32
Si4021
This page has been intentionally left blank.
33
Si4021
RELATED PRODUCTS AND DOCUMENTS
Si4021 Universal ISM Band FSK Transmitter
DESCRIPTION
ORDERING NUMBER
Si4021 16-pin TSSOP
Si4021-IC CC16
die
see Silicon Labs
Rev A1
Demo Boards and Development Kits
DESCRIPTION
ORDERING NUMBER
Development Kit
IA ISM – DK
Remote Temp. Monitoring Station
IA ISM – DATD
Related Resources
DESCRIPTION
ORDERING NUMBER
Antenna Selection Guide
IA ISM – AN1
Antenna Development Guide
IA ISM – AN2
IA4320 Universal ISM Band FSK Receiver
See www.silabs.com/integration for details
Note: Volume orders must include chip revision to be accepted.
Silicon Labs, Inc.
400 West Cesar Chavez
Austin, Texas 78701
Tel: 512.416.8500
Fax: 512.416.9669
Toll Free: 877.444.3032
www.silabs.com/integration
wireless@silabs.com
The specifications and descriptions in this document are based on
information available at the time of publication and are subject to change
without notice. Silicon Laboratories assumes no responsibility for errors or
omissions, and disclaims responsibility for any consequences resulting from
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assumes no responsibility for the functioning of undescribed features or
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