Si4740/41/42/43/44/45-C10
A U TO M O T I V E A M / F M R ADIO R E C E IV E R
Features
Digital audio output (I2S)
(Si4741/43/45 only)
24-pin 4 x 4 mm QFN package
Pb-free/RoHS compliant
Pin Assignments
Si4740/41/42/43/44/45-C10-GM
(Top View)
24
23
22
21
20
19
FMI 1
18 DFS
17 DOUT
RFGND 2
AGC1 3
Applications
Ordering Information:
See page 39.
GPO3/DCLK
GPO2/INT
GPO1/AGC2
AM and FM programmable
channel bandwidth filters
Digital FM stereo decoder
Advanced patented RDS/RBDS
processor (Si4741/43/45 only)
Automatic gain control (AGC)
Integrated AM and FM low-noise
amplifier (LNA)
Image-rejection mixer
Frequency synthesizer with
integrated voltage controlled
oscillator (VCO)
Low-IF conversion with no
external ceramic filters
3.0 to 3.6 V supply voltage
Programmable reference clock
AECQ-100 qualified
–40 to 85 ºC operation
NC
NC
Worldwide FM band support
(64–108 MHz)
Worldwide AM band support
(520–1710 kHz)
LW band support (153–288 kHz)
(Si4742/43/44/45 only)
MW (520–1710 kHz) and
SW (2.3–30 MHz) support
(Si4742/43/44/45 only)
NOAA weather band support
(162.4–162.55 MHz) (Si4742/43 only)
FM multipath detection and mitigation
AM/FM noise blanker
(Si4742/43/44/45 only)
Received signal quality indicators (RSSI,
SNR, frequency offset, multi-path
interference)
AM and FM programmable seek tuning
AM and FM programmable soft mute
control
FM Hi-cut control (Si4742/43/44/45 only)
Power line noise rejection/AM lo-cut filter
FM programmable stereo-mono blend
NC
NC 4
OEM car audio systems
After-market car audio systems
16 LOUT
GND
PAD
15 ROUT
GND 5
14 GND
Functional Block Diagram
RDS
LNA
WEAK
SIGNAL
CONDITION
AGC
ADC
AMI
LNA
GND
AGC
10
11
12
SDIO
RCLK
VIO
Patents pending
Si474x
FMI
9
SEN
The Si474x AM/FM receiver family is the most highly integrated automotive grade
and performance solution available.
8
SCLK
Description
13 VDD
7
RST
AMI 6
DOUT
DIGITAL
AUDIO
DFS
DCLK
DAC
ROUT
DAC
LOUT
Note: To ensure proper operation and
receiver performance, follow the
guidelines in “AN400: Si474x
AM/FM Receiver Layout Guide.”
Skyworks
will
evaluate
schematics and layouts for
qualified customers.
DSP
ADC
AGC
VDD
AFC
QUALITY
DETECTOR
CNTRL
GPO1-3
VIO
RST
RCLK
GND
LDO
SEN
SCLK
SDIO
3.0–3.6 V
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Si4740/41/42/43/44/45-C10
NOTES:
2
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Si4740/41/42/43/44/45-C10
TABLE O F C ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4. Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
4.2. Block Diagram and Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.3. FM Receiver Front-end . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.4. AM Receiver Front-end . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.5. Received Signal Qualifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.6. Digital Audio Interface (Si4741/43/45 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.7. Stereo Audio Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.8. De-emphasis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.9. Stereo DACs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.10. Soft Mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.11. Seek and Valid Station Qualification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.12. FM Hi-Cut Control (Si4742/43/44/45 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
4.13. AM/FM Noise Blanker (Si4742/43/44/45 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.14. Programming Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.15. Reset, Powerup, and Powerdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.16. GPO 1–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
4.17. RDS/RBDS Advanced Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.18. Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
4.19. Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5. Commands and Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6. Pin Descriptions: Si4740/41/42/43/44/45-C10-GM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
8. Package Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.1. Si4740/41/42/43/44/45-C10 Top Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.2. Top Mark Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9. Package Outline: Si4740/41/42/43/44/45-C10 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
10. PCB Land Pattern: Si4740/41/42/43/44/45-C10 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
11. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
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1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Supply Voltage
VDD
3.0
—
3.6
V
Interface Supply Voltage
VIO
2.7
—
3.6
V
Power Supply Powerup Rise Time
VDDRISE
10
—
—
µs
Interface Power Supply Powerup
Rise Time
VIORISE
10
—
—
µs
TA
–40
25
85
C
Ambient Temperature
Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at VDD = 3.3 V and 25 C unless otherwise stated. Parameters are tested in production unless
otherwise stated.
Table 2. Absolute Maximum Ratings1,2
Parameter
Symbol
Value
Unit
Supply Voltage
VDD
–0.5 to 5.8
V
Interface Supply Voltage
VIO
–0.5 to 3.9
V
3
Input Current
IIN
10
mA
Input Voltage3
VIN
–0.3 to (VIO + 0.3)
V
Operating Temperature
TOP
–45 to 95
C
Storage Temperature
TSTG
–55 to 150
C
0.4
VpK
RF Input
Level4
Notes:
1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond
recommended operating conditions for extended periods may affect device reliability.
2. The Si4740/41/42/43/44/45-C10 devices are high-performance RF integrated circuits with certain pins having an ESD
rating of < 2 kV HBM. Handling and assembly of these devices should only be done at ESD-protected workstations.
3. For input pins SCLK, SEN, SDIO, RST, RCLK, DCLK, DFS, GPO1, GPO2, and GPO3.
4. At RF input pins, FMI and AMI.
4
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Table 3. DC Characteristics
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
IFM
—
26
28.6
mA
IFM
—
20
23
mA
IAM
—
19
23
mA
Interface Supply Current
IIO
—
300
400
µA
Powerdown Current1,2
IPD
—
6
12
µA
Interface Powerdown Current1
IIO
—
6
12
µA
High Level Input Voltage3
VIH
0.7 x VIO
—
—
V
Low Level Input Voltage3
VIL
—
—
0.3 x VIO
V
3
IIH
VIN = VIO = 3.6 V
–10
—
10
µA
Low Level Input Current3
IIL
VIN = 0 V,
VIO = 3.6 V
–10
—
10
µA
High Level Output Voltage4
VOH
IOUT = 500 µA
0.8 x VIO
—
—
V
Low Level Output Voltage4
VOL
IOUT = –500 µA
—
—
0.2 x VIO
V
FM Mode
Supply Current
WB Mode (Si4742/43 only)
Supply Current
AM Mode
Supply Current
Supplies and Interface
High Level Input Current
SCLK, DFS, DCLK,
RCLK inactive
Notes:
1. Specifications are guaranteed by characterization.
2. Refer to Section "4.19. Control Interface" on page 35.
3. For input pins SCLK, SEN, SDIO, RST, and RCLK.
4. For output pins SDIO, DFS, GPO1, GPO2, and GPO3.
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Table 4. Reset Timing Characteristics1,2,3
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = –40 to 85 °C)
Symbol
Min
Typ
Max
Unit
RST Pulse Width and GPO1, GPO2/INT Setup to RST
tSRST
100
—
—
µs
GPO1, GPO2/INT Hold from RST
tHRST
30
—
—
ns
Parameter
Notes:
1. When selecting 2-wire mode, the user must ensure that a 2-wire start condition (falling edge of SDIO while SCLK is
high) does not occur within 300 ns before the rising edge of RST.
2. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high until
after the first start condition.
3. When selecting 3-wire or SPI modes, the user must ensure that a rising edge of SCLK does not occur within 300 ns
before the rising edge of RST.
4. If GPO1 and GPO2 are actively driven by the user, then minimum tSRST is only 30 ns. If GPO1 or GPO2 is hi-Z, then
minimum tSRST is 100 µs, to provide time for on-chip 1 M devices (active while RST is low) to pull GPO1 high and
GPO2 low.
tSRST
RST
70%
GPO1
70%
GPO2
70%
tHRST
30%
30%
30%
Figure 1. Reset Timing Parameters for Busmode Select Method
6
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Table 5. 2-Wire Control Interface Characteristics1,2,3
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
SCLK Frequency
fSCL
0
—
400
kHz
SCLK Low Time
tLOW
1.3
—
—
µs
SCLK High Time
tHIGH
0.6
—
—
µs
SCLK Input to SDIO Setup
(START)
tSU:STA
0.6
—
—
µs
SCLK Input to SDIO Hold
(START)
tHD:STA
0.6
—
—
µs
SDIO Input to SCLK Setup
tSU:DAT
100
—
—
ns
SDIO Input to SCLK Hold4,5
tHD:DAT
0
—
900
ns
SCLK input to SDIO Setup
(STOP)
tSU:STO
0.6
—
—
µs
STOP to START Time
tBUF
1.3
—
—
µs
SDIO Output Fall Time
tf:OUT
—
250
ns
—
300
ns
Cb
20 + 0.1 ----------1pF
SDIO Input, SCLK Rise/Fall Time
tf:IN
tr:IN
Cb
20 + 0.1 ----------1pF
SCLK, SDIO Capacitive Loading
Cb
—
—
50
pF
Input Filter Pulse Suppression
tSP
—
—
50
ns
Notes:
1. When VIO = 0 V, SCLK and SDIO are low impedance.
2. When selecting 2-wire mode, the user must ensure that a 2-wire start condition (falling edge of SDIO while SCLK is
high) does not occur within 300 ns before the rising edge of RST.
3. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high
until after the first start condition.
4. The Si474x delays SDIO by a minimum of 300 ns from the VIH threshold of SCLK to comply with the minimum tHD:DAT
specification.
5. The maximum tHD:DAT has only to be met when fSCL = 400 kHz. At frequencies below 400 kHz, tHD:DAT may be violated
as long as all other timing parameters are met.
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SCLK
70%
SDIO
70%
tSU:STA tHD:STA
tLOW
START
tr:IN
tHIGH
tr:IN
tf:IN
tSP
tSU:STO
tBUF
30%
30%
tf:IN,
tf:OUT
tHD:DAT tSU:DAT
STOP
START
Figure 2. 2-Wire Control Interface Read and Write Timing Parameters
SCLK
A6-A0,
R/W
SDIO
START
ADDRESS + R/W
D7-D0
ACK
DATA
D7-D0
ACK
DATA
ACK
STOP
Figure 3. 2-Wire Control Interface Read and Write Timing Diagram
8
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Table 6. 3-Wire Control Interface Characteristics
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
SCLK Frequency
fCLK
0
—
2.5
MHz
SCLK High Time
tHIGH
25
—
—
ns
SCLK Low Time
tLOW
25
—
—
ns
tS
20
—
—
ns
SDIO Input to SCLKHold
tHSDIO
10
—
—
ns
SEN Input to SCLKHold
tHSEN
10
—
—
ns
SCLKto SDIO Output Valid
tCDV
Read
2
—
25
ns
SCLKto SDIO Output High Z
tCDZ
Read
2
—
25
ns
SCLK, SEN, SDIO, Rise/Fall Time
tR, tF
—
—
10
ns
SDIO Input, SEN to SCLKSetup
Note: When selecting 3-wire mode, the user must ensure that a rising edge of SCLK does not occur within 300 ns before the
rising edge of RST.
SCLK
70%
30%
tR
tF
tHSDIO
tS
SEN
70%
SDIO
70%
tHIGH
tLOW
t HSEN
tS
30%
A7
30%
A6-A5,
R/W,
A4-A1
A0
D15
D14-D1
Address In
D0
Data In
Figure 4. 3-Wire Control Interface Write Timing Parameters
SCLK
70%
SEN
70%
30%
tHSDIO
tS
tCDV
tHSEN
tCDZ
tS
30%
70%
SDIO
A7
30%
A6-A5,
R/W,
A4-A1
Address In
A0
D15
½ Cycle Bus
Turnaround
D14-D1
D0
Data Out
Figure 5. 3-Wire Control Interface Read Timing Parameters
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Table 7. SPI Control Interface Characteristics
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
SCLK Frequency
fCLK
0
—
2.5
MHz
SCLK High Time
tHIGH
25
—
—
ns
SCLK Low Time
tLOW
25
—
—
ns
tS
15
—
—
ns
SDIO Input to SCLKHold
tHSDIO
10
—
—
ns
SEN Input to SCLKHold
tHSEN
5
—
—
ns
SCLKto SDIO Output Valid
tCDV
Read
2
—
25
ns
SCLKto SDIO Output High Z
tCDZ
Read
2
—
25
ns
SCLK, SEN, SDIO, Rise/Fall Time
tR, tF
—
—
10
ns
SDIO Input, SEN to SCLKSetup
Note: When selecting SPI mode, the user must ensure that a rising edge of SCLK does not occur within 300 ns before the
rising edge of RST.
SCLK
70%
30%
tR
tHIGH
SEN
70%
SDIO
70%
tS
tLOW
tF
tHSDIO
tHSEN
tS
30%
C7
C6–C1
C0
D7
D6–D1
D0
30%
Control Byte In
8 Data Bytes In
Figure 6. SPI Control Interface Write Timing Parameters
SCLK
70%
30%
tCDV
tS
SEN
70%
tHSEN
tHSDIO
tS
30%
tCDZ
SDIO
70%
C7
C6–C1
C0
D7
D6–D1
D0
30%
Control Byte In
Bus
Turnaround
16 Data Bytes Out
(SDIO or GPO1)
Figure 7. SPI Control Interface Read Timing Parameters
10
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Table 8. Digital Audio Interface Characteristics
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
DCLK Cycle Time
tDCT
26
—
1000
ns
DCLK Pulse Width High
tDCH
10
—
—
ns
DCLK Pulse Width Low
tDCL
10
—
—
ns
DFS Set-up Time to DCLK Rising Edge
tSU:DFS
5
—
—
ns
DFS Hold Time from DCLK Rising Edge
tHD:DFS
5
—
—
ns
tPD:DOUT
0
—
12
ns
DOUT Propagation Delay from DCLK Falling
Edge
tDCH
tDCL
DCLK
tDCT
DFS
tHD:DFS
tSU:DFS
DOUT
tPD:OUT
Figure 8. Digital Audio Interface Timing Parameters, I2S Mode
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Table 9. FM Receiver Characteristics1,2
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = 25 °C)
Parameter
Test Condition
Min
Typ
Max
Unit
FM Receiver
Specifications Referred to Si4740/41/42/43/44/45-C10 Application Circuit Input
Input Frequency
64
—
108
MHz
FM Frequency Steps
10
—
200
kHz
(S+N)/N = 26 dB
—
2
3
µV EMF
f = 2 kHz, RDS BLER < 5%
—
6
9
µV EMF
f = 2 kHz
RDSSYNC = 1 10 sec
—
3.8/60
—
µV EMF/
RDS
BLER%
RDS Synchronization Stability8
f = 2 kHz
RDSSYNC = 1 10 sec
—
5.9/10
—
µV EMF/
RDS
BLER%
RDS Synchronization Time8
f = 2 kHz
RF input = 60 dBµV EMF
—
90
—
ms
RDS PI Lock Time8
f = 2 kHz
RF input = 60 dBµV EMF
—
105
—
ms
3
4
—
k
4
5
6
pF
400 and 800 kHz blockers
100
105
—
dBµV EMF
m = 0.3
40
55
—
dB
f = 22.5 kHz
37
55
—
dB
Adjacent Channel Selectivity
±200 kHz
38
50
—
dB
Alternate Channel Selectivity
±400 kHz
60
70
—
dB
RF Level 120 dBµV EMF
53
58
—
dB SINAD
72
80
90
mVRMS
–1
—
1
dB
Sensitivity3,4,5,6,7
RDS Sensitivity
8
RDS Synchronization
Persistence8
LNA Input Resistance6,8,9
6,8,9
LNA Input Capacitance
Input IP3
3,4,7
AM Suppression
Image
3,4,6,8,9
Rejection8
Strong Signal
Distortion3,4,5,6,8
Audio Output Voltage
3,4,6,9
Audio Output L/R Imbalance
3,6,9,10
Audio Frequency Response
Low8
–3 dB
—
—
30
Hz
8
–3 dB
15
—
—
kHz
Audio Frequency Response High
Notes:
1. Additional testing information is available in application note, “AN388:Si470X/1X/2X/3X/4X Evaluation Board Test
Procedure.” Volume = maximum for all tests. Tested at FRF = 98 MHz.
2. To ensure proper operation and receiver performance, follow the guidelines in “AN400: Si474x AM/FM Receiver Layout
Guide.” Skyworks will evaluate schematics and layouts for qualified customers.
3. FMOD = 1 kHz, 75 µs de-emphasis, MONO = enabled unless noted otherwise.
4. f = 22.5 kHz.
5. BAF = 300 Hz to 15 kHz.
6. fRF = 76 to 108 MHz.
7. AGC is disabled.
8. Guaranteed by characterization.
9. Measured at VEMF = 60 dBµVEMF.
10. f = 75 kHz.
11. L = 1, R = 0.
12. At LOUT and ROUT pins.
12
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Table 9. FM Receiver Characteristics1,2 (Continued)
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = 25 °C)
Parameter
Min
Typ
Max
Unit
35
45
—
dB
56
63
—
dB
—
0.1
0.5
%
FM_DEEMPHASIS = 2
70
75
80
µs
FM_DEEMPHASIS = 1
45
50
54
µs
0.7
0.8
0.9
V
High-Z mode
—
0.5 x VIO
—
V
Audio Output Load Resistance8,10,12
Single-ended
10
—
—
k
Audio Output Load Capacitance8,10,12
Single-ended
—
—
50
pF
RCLK tolerance = 100 ppm
—
40
60
ms/
channel
Powerup Time8
From powerdown
—
—
110
ms
FM RSSI Offset
Input levels of 8 and 60 dBµV
EMF
–3
—
3
dB
Audio Stereo
Test Condition
Separation3,6,9,10,11
3,4,5,6,9
Audio SNR
Audio THD
3,4,5,6,9
De-emphasis Time
Constant8
Audio Common Mode Voltage
Audio Common Mode
Seek/Tune Time8,12
12
Voltage8
Notes:
1. Additional testing information is available in application note, “AN388:Si470X/1X/2X/3X/4X Evaluation Board Test
Procedure.” Volume = maximum for all tests. Tested at FRF = 98 MHz.
2. To ensure proper operation and receiver performance, follow the guidelines in “AN400: Si474x AM/FM Receiver Layout
Guide.” Skyworks will evaluate schematics and layouts for qualified customers.
3. FMOD = 1 kHz, 75 µs de-emphasis, MONO = enabled unless noted otherwise.
4. f = 22.5 kHz.
5. BAF = 300 Hz to 15 kHz.
6. fRF = 76 to 108 MHz.
7. AGC is disabled.
8. Guaranteed by characterization.
9. Measured at VEMF = 60 dBµVEMF.
10. f = 75 kHz.
11. L = 1, R = 0.
12. At LOUT and ROUT pins.
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Table 10. WB Receiver Characteristics1 (Si4742/43 only)
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = 25 °C)
Symbol
Parameter
Test Condition
Min
Typ
Max
Unit
162.4
—
162.55
MHz
SINAD = 12 dB
—
0.65
—
µV EMF
±25 kHz
40
55
—
dB
FRF
Input Frequency
Sensitivity2,3,4,5
Adjacent Channel Selectivity
Audio S/N2,3,4,5,6
Mono
35
45
—
dB
7
–3 dB
—
—
300
Hz
Audio Frequency Response High7
–3 dB
15
—
—
kHz
Audio Frequency Response Low
Notes:
1. To ensure proper operation and receiver performance, follow the guidelines in "AN400: Si474x AM/FM receiver Layout
Guide." Skyworks will evaluate schematics and layouts for qualified customers.
2. FMOD = 1 kHz.
3. f = 3 kHz.
4. BAF = 300 Hz to 15 kHz, A-weighted.
5. FRF = 162.5 MHz.
6. Measured at VEMF = 60 dBµV EMF.
7. Guaranteed by characterization.
14
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Table 11. AM Receiver Characteristics1
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = 25 °C)
Parameter
Test Condition
Min
Typ
Max
Unit
AM Receiver
Specifications referred to Si4740/41/42/43/44/45 application circuit with 15pF/62pF antenna dummy,
voltages at antenna dummy input.
AM/MW
520
—
1710
kHz
AM/LW
144
—
288
kHz
AM/SW2
2.3
—
30
MHz
1
—
10
kHz
(S+N)/N=26 dB
—
25
34
dBuV
40 and 80 kHz Offset
—
99
—
dBuV
Audio SNR 3,4,7,8
50
53
—
dB
Audio THD 3,4,6,7,8
—
0.1
0.5
%
Input Frequency
Frequency Steps
Sensitivity 3,5
IP36
Strong Signal THD 6,7,8
RF input level 120 dBµV EMF
—
0.2
1
%
Strong Signal SINAD 6,7,8
RF input level 120 dBµV EMF
53
55
—
dB
Power Supply Rejection Ratio6
ΔVDD = 100 mVRMS, 100 Hz
—
40
—
dB
54
60
67
mVRMS
—
—
110
ms
Audio Output Voltage 3,4
Powerup Time6
From powerdown
Notes:
1. To ensure proper operation and receiver performance, follow the guidelines in "AN400: Si474x AM/FM receiver Layout
Guide." Skyworks will evaluate schematics and layouts for qualified customers.
2. Contact Skyworks for additional details on shortwave operation and performance.
3. FMOD = 1 kHz, 30% modulation, 2 kHz channel filter.
4. Measured at V = 74 dBµV.
5. fRF = 520 to 1710 kHz.
6. Guaranteed by characterization.
7. BAF = 300 Hz to 15 kHz.
8. fRF = 520 kHz.
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AM Antenna Dummy
15 pF
50
Ant+
Signal
Generator
50
62 pF
Ant–
Figure 9. AM Test Circuit
Table 12. Reference Clock
(VDD = 3.0 to 3.6 V, VIO = 2.7 to 3.6 V, TA = –40 to 85 °C)
Parameter
RCLK Supported Frequencies
RCLK Frequency Tolerance
Symbol
Test Condition
Min
Typ
Max
Unit
31.130
32.768
40,000
kHz
–100
—
100
ppm
16
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2. Typical Application Schematic
C2
L2
Optional: Si4742/43
WBRX Optimization
L5
Optional: Additional ESD Protection
VDD
GPO1/AGC2
GPO2/INTb
GPO3/DCLK
U2
L1
R3
24
23
22
21
20
19
C12
NC
NC
NC
GPO1/AGC2
GPO2/INTb
GPO3/DCLK
C8
Optional:
Si4742/43
LW Support
Q5
1
2
3
4
5
6
L9
VDD
Antenna+
Antenna-
R10
R6
C9
FMI
RFGND
AGC1
NC
GND1
AMI
VDD
NC/DFS
NC/DOUT
LOUT
ROUT
GND
VDD
18
17
16
15
14
13
GND PAD
PAD
NC/DFS
NC/DOUT
LOUT
ROUT
L3
AMb
RSTb
SENb
SCLK
SDIO
RCLK
VIO
C5
R7
L6
7
8
9
10
11
12
Q2
C1
VIO
L10
C3
L7
U1
Si4740/41/42/43/44/45
RCLK
SDIO
SCLK
SENb
RSTb
Q1
C10
VIO
R1
L8
C4
U4
Optional: FM
Intrusion Filter
2
C7
R11
U3 14
L4
1
Optional: Additional
ESD Protection
Q3
3
5
4
6
8
R4
Optional:
Mains Trap
VIO Optional:
Passive Only
U5 5 Antenna Attn
4
2
1
3
VIO
R5
GPO1/AGC2
10
Optional:
Software Selectible
Active/Passive
Antenna Attn
R8
9
11
ACTIVE/PASSIVE ATTN
13
12
7
Q4
R9
Notes:
1. Place C1 close to VDD pin.
2. All grounds connect directly to GND plane on PCB.
3. To ensure proper operation and receiver performance, follow the guidelines in “AN400: Si474x AM/FM Receiver Layout
Guide.” Skyworks will evaluate schematics and layouts for qualified customers.
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3. Bill of Materials
Table 13. Si4740/41/42/43/44/45-C10 Bill of Materials
Reference
Description
Manufacturer
Part Number
C1
CAP,22 nF, ±5%, 0402,X7R
Venkel
C0402X7R250-223JNE
C2
CAP,18 pF, ±5%, 0402,COG
Venkel
C0402C0G500-180JNE
C3
CAP,270 pF, ±5%, 0402,COG
Venkel
C0402C0G500-271JNE
C4
CAP,18 nF, ±5%, 0402,X7R
Venkel
C0402X7R160-183JNE
C5,C8,C9
CAP,0.47 µF, ±5%, 0603,X7R
Venkel
C0603X7R160-474JNE
C7
CAP,1200 pF, ±5%, 0402,X7R
Venkel
C0402X7R500-122JNE
C12
CAP, 100 µF, ±20%, 1206, X5R
Venkel
C1206X5R063-107MNE
L1
IND, 120 nH, ±5%, 0603
Pulse
PE-0603CD121JTT
L3
IND,220 µH, ±10%, 1008
Coilcraft
1008PS-224KL
L4
IND,1 mH, ±20%, LPS4018
Coilcraft
LPS4018-105ML
L10
IND,33 µH, ±10%, 0805
Coilcraft
0805PS-333KL
Q1,Q2
FET,SM,SOT-23
NXP
BF862
Q3
NPN,SM,SOT-23
Fairchild Semi
MMBTH10
R1
RES,10 MΩ, ±5%, 0603
Venkel
CR0603-16W-106JT
R3
RES,10 Ω, ±1%, 0402
Venkel
CR0402-16W-10R0FT
R4,R6,R7
RES,249 Ω, ±1%, 0402
Venkel
CR0402-16W-2490FT
R5
RES,4.7 kΩ, ±5%, 0402
Venkel
CR0402-16W-472JT
U1
QFN-24, SM
Skyworks
Si4740/41/42/43/44/45-C10
California Micro Device
CM1213
Optional: Additional ESD Protection
U2,U4
ESD DIODE ARRAY, SM
Optional: Without WBRX Optimization
L2
IND, 33 nH, ±5%, 0603
Pulse
PE-0603CD330JTT
L5
RES, 0 , 0603
Venkel
CR0603-16W-000T
Optional: Si4742/43 WBRX Optimization
L2
IND, 100 nH, ±5%, 0603
Pulse
PE-0603CD101JTT
L5
IND, 150 nH, ±5%, 0603
Pulse
PE-0603CD151JTT
TI
SN74LVC1G17DBV
Optional: Passive Only Antenna Attenuation
U5
BUFFER, SOT-23
Optional: FM Intrusion on AM
C10
CAP,3.9 pF, ±0.25 pF, 0402,COG
Venkel
C0402C0G500-3R9CNE
L6,L7
IND, 6.8 µH, ±10%, 0805
Coilcraft
0805PS-682KL
Note: Specific part numbers are provided as a reference to the Si4743-C EVB. Other suppliers may be substituted.
18
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Table 13. Si4740/41/42/43/44/45-C10 Bill of Materials (Continued)
Reference
Description
Manufacturer
Part Number
#388BN-1211Z
Optional: Mains Trap on AM
L8
IND,47 mH, ±6%, L7PD
Toko
R11
RES,10 kΩ,±5%,0402
Venkel
CR0402-16W-103JT
Optional: Software Selectable Active/Passive Antenna Attenuation
R8
RES,1 Ω, ±1%, 0402
Venkel
CR0402-16W-1R00FT
R9
RES,249 Ω, ±1%, 0402
Venkel
CR0402-16W-2490FT
Q4
NPN,SM,SOT-23
Fairchild Semi
MMBTH10
U3
QUAD GATE, 14TSSOP
TI
SN74LVC02APW
Optional: Si4742/43/44/45 LW Support
L9
IND, 2.7 mH, ±10%, 0807
Coilcraft
RFB0807-272L
R10
RES,249 Ω, ±1%, 0402
Venkel
CR0402-16W-2490FT
Q5
PNP, SM, SOT-23
Fairchild Semi
MMBTH81
Note: Specific part numbers are provided as a reference to the Si4743-C EVB. Other suppliers may be substituted.
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4. Description
4.1. Introduction
The Si474x AM/LW/SW/FM/WB receiver family offers
100% CMOS receiver integrated circuits (IC), providing
the full receive functionality from antenna to audio for
use in the automotive market. The family includes a
portfolio of highly integrated receivers for primary
AM/FM receivers that support worldwide broadcast
audio bands and corresponding attributes including
AM/FM and "college bands" down to 64 MHz, long
wave, NOAA weather band, and dedicated companion
RDS background receivers. The entire portfolio is layout
compatible and is offered in a very small
4 x 4 x 0.85 mm 24-pin QFN package. Refer to "7.
Ordering Guide" on page 39 for the corresponding part
numbers.
The Si474x family implements Skyworks' proven and
internationally patented digital low intermediate
frequency (low-IF) receiver architecture. Skyworks has
shipped over 100 million broadcast audio receivers
worldwide using this architecture. The low-IF
architecture delivers superior performance while
integrating the great majority of external components
required by competing solutions.
The Si474x products are feature-rich solutions,
providing both highly automated performance,
according to Skyworks' recommended settings, and
extensive flexibility for customized audio and system
performance. Programmable algorithms include
advanced seek with multiple signal qualifiers and
thresholds in all supported bands, FM stereo blend
rates and thresholds, soft mute characteristics, multipath detection and mitigation, AM/FM noise blankers,
and selectable FM Hi-cut filters. The part accepts
programmable reference clock values. The IC provides
audio output in standard line-level analog audio using
high fidelity stereo DACs or digital audio format.
The Si4741, Si4743, Si4745, and all other family parts
ending with an odd number, offer a fully-integrated
preprocessor for the European Radio Data System
(RDS) and the North American Radio Broadcast Data
System (RBDS). The RDS preprocessor includes all
symbol decoding, advanced error-correction, detailed
visibility to block-error rates (BLER), synchronization
status and times, and complete, decoded and errorcorrected RDS group presentation. The Si474x RDSenabled parts also offer several modes of operation for
various applications which require more or less visibility
to the RDS status and group data.
Table 14. Si4740/41/42/43/44/45 Product Family
Feature
FM band coverage
Si4740
Si4741
Si4742
Si4743
Si4744
Si4745
FM RDS reception
LW band coverage
SW band coverage
WB (w/o SAME) band coverage
AM band coverage
FM multi-path detection and
stereo/mono blend mitigation
Advanced stereo-mono blend
Advanced soft mute
Hi-cut
FM noise blanker
AM noise blanker
2
Digital audio I S
20
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4.2. Block Diagram and Functional Description
Si474x
FMI
RDS
LNA
WEAK
SIGNAL
CONDITION
AGC
ADC
AMI
LNA
GND
AGC
DOUT
DIGITAL
AUDIO
DFS
DCLK
DAC
ROUT
DAC
LOUT
DSP
ADC
AGC
VDD
LDO
AFC
QUALITY
DETECTOR
CNTRL
GPO1-3
VIO
RST
RCLK
GND
SEN
SCLK
SDIO
3.0–3.6 V
Figure 10. Functional Block Diagram
The Si474x IC family integrates the voltage controlled
oscillator (VCO) and frequency synthesizer and accepts
a wide range of programmable reference clocks
(RCLK). The frequency synthesizer generates the
quadrature local oscillator signal used to downconvert
the RF input to a low intermediate frequency. The VCO
frequency is locked to the RCLK and adjusted with an
automatic frequency control (AFC) servo loop during
reception. The VCO frequency is modified according to
the programmed target frequency.
The Si474x family uses a digital low-IF architecture that
integrates the entire receive chain for AM MW, AM LW,
AM SW, FM, and weather band, and eliminates the
requirement for expensive external ceramic filters found
in competing solutions. The IC also integrates the
majority of external components and performs all
processing in an on-chip digital signal processor (DSP)
and 8051 microcontroller (MCU) core.
The analog chains for AM and FM include dedicated
low-noise amplifiers (LNA), automatic gain control
(AGC), image-reject quadrature mixers, programmable
gain amplifiers (PGA), and a set of delta-sigma analogto-digital converters (ADCs).
The FM and AM LNA blocks receive wide-band
frequency inputs at the FMI and AMI input pins
respectively. For AM, an on-chip varactor and resistor
array control the gain of the external AM antenna
network. For FM, the external network is designed to
provide a small boost to the FM band.
The LNA gain is dynamically controlled by the AGC
loop, contingent on the RF peak detectors and signal
strength. Each receive path continues to dedicated
quadrature mixers which downconvert the received
signal from RF to low-IF, filter for out-of-band interferers,
and perform a transfer function to shift the tuned
frequency to dc. A pair of PGAs filters the mixer output
from interferers and amplifies the signal again before
delivering it to two high resolution ADCs. The ADCs
generate high dynamic range signals and deliver them
to the digital core for additional processing.
The digital core consists of a DSP, 8051 MCU core,
memory access controller, control interface circuitry,
and general programming interface functionality.
The MCU works in conjunction with the DSP to provide
access to signal quality indicators and system behavior,
as well as managing the IC control interface and
communication with the host processor.
The Si474x digital core performs channel selection and
filtering for all supported worldwide bands. The digital
core calibrates tuning and performs AM/FM
demodulation and FM stereo MPX audio processing.
The digital core also performs signal quality processing
including received signal strength indicators, impulse
detection, SNR calculations, volume control, mute, and
additional digital filtering. The Si4740 supports FM deemphasis of 50 or 75 µs.
The stereo digital audio signal is then converted back to
Left (L) and Right (R) analog with a pair of high
resolution, digital-to-analog converters (DACs) and is
available as line-level audio on the LOUT and ROUT
pins. Additionally, the stereo digital audio is also
provided via an I2S interface (Si4741/43/45 only). The
device supports I2C-compatible 2-wire control interface
and SPI 3-wire control interface.
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4.3. FM Receiver Front-end
4.6. Digital Audio Interface
(Si4741/43/45 only)
The Si474x family integrates the entire FM receive
chain from antenna to audio out. The FM band is
received on the FMI pin via an input coupling network
with the recommended application circuit. This input
coupling network isolates the FM band for best
performance. The LNA supports US, Europe, Japan,
OIRT, and Rest of World FM broadcast bands (64 to
108 MHz). The AGC circuit automatically controls the
LNA gain to optimize sensitivity and rejection of strong
interferers. For testing purposes, the AGC can be
disabled. Refer to “AN388: Si470X/1X/2X/3X/4X
Evaluation Board Test Procedure” for Si474x testing
procedures.
4.4. AM Receiver Front-end
The Si474x family provides an integrated LNA, which
works in conjunction with an external cascode amplifier
to provide an AM receive chain from antenna to audio
out. There are very few external components and no
manual alignment required. The AM signal is received
on the AMI pin via a cascode amplifier external circuit.
The cascode circuit degeneration is automatically
adjusted via the AGC pin as shown in Section "2.
Typical Application Schematic" on page 17. The amount
of degeneration depends on the signal strength. An
additional GPO1 signal is used to attenuate the signal
via a shunt for very strong signal handling when the
signal exceeds the AGC pin degenerative control of the
cascode amplifier stage.
4.5. Received Signal Qualifiers
A tuned signal's quality can vary with the environmental
conditions, time of day, and position of the antenna
among many other factors. To adequately manage the
audio output and avoid unpleasant audible effects to the
end-user, the Si474x monitors and provides indicators
of the signal quality, allowing the host processor to
perform additional processing if required by the
customer. The Si474x monitors and reports a set of
standard industry signal quality metrics including RSSI,
SNR, and multi-path interference on FM signals.
The digital audio interface operates in slave mode and
supports three different audio data formats:
I2S
Left-Justified
DSP Mode
4.6.1. Audio Data Formats
In I2S mode, by default the MSB is captured on the
second rising edge of DCLK following each DFS
transition. The remaining bits of the word are sent in
order, down to the LSB. The left channel is transferred
first when the DFS is low, and the right channel is
transferred when the DFS is high.
In Left-Justified mode, by default the MSB is captured
on the first rising edge of DCLK following each DFS
transition. The remaining bits of the word are sent in
order, down to the LSB. The left channel is transferred
first when the DFS is high, and the right channel is
transferred when the DFS is low.
In DSP mode, the DFS becomes a pulse with a width of
one DCLK period. The left channel is transferred first,
followed right away by the right channel. There are two
options in transferring the digital audio data in DSP
mode: the MSB of the left channel can be transferred on
the first rising edge of DCLK following the DFS pulse or
on the second rising edge.
In all audio formats, depending on the word size, DCLK
frequency and sample rates, there may be unused
DCLK cycles after the LSB of each word before the next
DFS transition and MSB of the next word. In addition, if
preferred, the user can configure the MSB to be
captured on the falling edge of DCLK via properties.
The number of audio bits can be configured for 8, 16,
20, or 24 bits.
4.6.2. Audio Sample Rates
The device supports a number of industry-standard
sampling rates including 32, 40, 44.1, and 48 kHz.
As with other Si474x features, how these variables are
used to improve audio performance can be left to the
Skyworks on-chip algorithms (recommended), or they
can be brought out for host-processor instructions.
22
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(OFALL = 1)
INVERTED
DCLK
(OFALL = 0)
DCLK
LEFT CHANNEL
DFS
I2S
(OMODE = 0000)
RIGHT CHANNEL
1 DCLK
DOUT
1 DCLK
1
2
n-2
3
n-1
MSB
n
1
LSB
MSB
2
n-2
3
n-1
n
LSB
Figure 11. I2S Digital Audio Format
(OFALL = 1)
INVERTED
DCLK
(OFALL = 0)
DCLK
DFS
LEFT CHANNEL
RIGHT CHANNEL
Left-Justified
(OMODE = 0110)
1
DOUT
2
3
n-2
n-1
MSB
n
1
LSB
MSB
2
n-2
3
n-1
n
LSB
Figure 12. Left-Justified Digital Audio Format
(OFALL = 0)
DCLK
DFS
RIGHT CHANNEL
LEFT CHANNEL
(OMODE = 1100)
DOUT
(MSB at 1st rising edge)
1
2
3
n-2
n-1
MSB
DOUT
(MSB at 2nd rising edge)
1
LSB
MSB
n-1
n
1
LSB
MSB
2
3
n-2
1
MSB
2
3
n-2
n-1
n
LSB
LEFT CHANNEL
1 DCLK
(OMODE = 1000)
n
RIGHT CHANNEL
2
3
n-2
n-1
n
LSB
Figure 13. DSP Digital Audio Format
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4.7.2. Stereo-Mono Blending
The output of the FM demodulator is a stereo
multiplexed (MPX) signal. The MPX standard was
developed in 1961, and is used worldwide. Today's
MPX signal format consists of left + right (L+R) audio,
left – right (L–R) audio, a 19 kHz pilot tone, and
RDS/RBDS data as shown in Figure 14 below.
Adaptive noise suppression is employed to gradually
combine the stereo (L–R) audio signal to a mono (L+R)
audio signal as the signal quality degrades to maintain
optimum sound fidelity under varying reception
conditions. Three metrics, received signal strength
indicator (RSSI), signal-to-noise ratio (SNR), and multipath interference, are monitored simultaneously in
forcing a blend from stereo to mono. The metric which
reflects the minimum signal quality takes precedence
and the signal is blended appropriately.
Modulation Level
4.7. Stereo Audio Processing
Mono Audio
Left + Right
0
Stereo
Pilot
15 19 23
Stereo Audio
Left - Right
38
RDS/
RBDS
53
57
Frequency (kHz)
Figure 14. MPX Signal Spectrum
4.7.1. Stereo Decoder
The Si4740/41/42/43/44/45-C10's integrated stereo
decoder automatically decodes the MPX signal using
DSP techniques. The 0 to 15 kHz (L+R) signal is the
mono output of the FM tuner. Stereo is generated from
the (L+R), (L–R), and a 19 kHz pilot tone. The pilot tone
is used as a reference to recover the (L–R) signal. The
left and right channels are obtained by adding and
subtracting the (L+R) and (L–R) signals, respectively.
All three metrics have programmable stereo/mono
thresholds and attack/release rates as shown in the
Table 15 and Table 16.
If a metric falls below its mono threshold, the signal is
blended from stereo to full mono. If all metrics are
above their respective stereo thresholds, then no action
is taken to blend the signal. If a metric falls between its
mono and stereo thresholds, then the signal is blended
to the level proportional to the metric’s value between its
mono and stereo thresholds, with an associated attack
and release rate. Figure 15, “Stereo-Mono Blend Based
on Active Monitoring of RSSI, SNR, and Multi-Path
Interference,” on page 25 illustrates the stereo-mono
blend. Stereo/mono status can be monitored with the
FM_RSQ_STATUS command.
Table 15. Blend Threshold Properties
RSSI
FM_BLEND_RSSI_STEREO_THRESHOLD
FM_BLEND_RSSI_MONO_THRESHOLD
SNR
FM_BLEND_SNR_STEREO_THRESHOLD
FM_BLEND_SNR_MONO_THRESHOLD
Multi-path interference
FM_BLEND_MULTIPATH_STEREO_THRESHOLD FM_BLEND_MULTIPATH_MONO_THRESHOLD
Table 16. Blend Attack/Release Rate Properties
RSSI
FM_BLEND_RSSI_ATTACK_RATE
FM_BLEND_RSSI_RELEASE_RATE
SNR
FM_BLEND_SNR_ATTACK_RATE
FM_BLEND_SNR_RELEASE_RATE
Multi-path interference
FM_BLEND_MULTIPATH_ATTACK_RATE
FM_BLEND_MULTIPATH_RELEASE_RATE
24
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100%
Stereo level
RSSI
RSSI
Stereo level RSSI
Blend attack rate/
Blend release rate
0%
Mono Stereo RSSI
Thld
Thld
SNR
Stereo level
100%
SNR
Stereo level SNR
Blend attack rate/
Blend release rate
0%
Mono
Thld
SNR
100%
MP
Stereo level MP
Blend attack rate/
Blend release rate
Stereo level
Multi-path
Interference
(MP)
Stereo
Thld
Min gain level
with
associated
attack or
release rate
0%
Stereo Mono
Thld Thld
MP
L-R gain = F
L-R
-
+
(1+F )R + (1-F )L
+
(1+F )L + (1-F )R
+
+
L+R
+
Figure 15. Stereo-Mono Blend Based on Active Monitoring of RSSI, SNR, and Multi-Path
Interference
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4.8. De-emphasis
4.9. Stereo DACs
De-emphasis is a technique used by FM broadcasters
to improve the signal-to-noise ratio of FM receivers by
reducing the effects of high-frequency interference and
noise. When the FM signal is transmitted, a preemphasis filter is applied to accentuate the high audio
frequencies. The Si474x incorporates a de-emphasis
filter which attenuates high frequencies to restore a flat
frequency response. Two time constants are used in
various regions. The de-emphasis time constant is
programmable to 50 or 75 µs and is set by the
FM_DEEMPHASIS property.
High-fidelity stereo digital-to-analog converters (DACs)
drive analog audio signals onto the LOUT and ROUT
pins. The audio output may be muted. Volume is
adjusted digitally with the RX_VOLUME property. It is
necessary that the volume be maintained at maximum
levels to ensure the highest dynamic range audio
outputs to the external audio processing stage in a car
radio.
4.10. Soft Mute
Attenuation level
The soft mute feature is available to attenuate the audio
outputs and minimize audible noise in very weak signal
conditions. This process is shown conceptually in
Figure 16. The Si474x triggers soft mute feature by
monitoring the SNR metric. The SNR threshold for
activating soft mute is programmable, as are soft mute
attenuation levels and attack and release rates. The
Si474x provides the soft mute feature in FM and AM
bands.
Maximum
Attenuation
Soft mute
threshold
SNR
Figure 16. Soft Mute Based on Active Monitoring of SNR
26
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4.11. Seek and Valid Station Qualification
4.12. FM Hi-Cut Control
(Si4742/43/44/45 only)
The seek function will search up or down the selected
frequency band for a valid channel. A valid channel is
qualified according to a series of programmable signal
indicators and thresholds. The seek function can be
made to stop at the band edge and provide an interrupt,
or wrap the band and continue seeking until arriving at
the original departure frequency. The device sets
interrupts with found valid stations, or if the seek results
in zero found valid stations, the device indicates failure
and again sets an interrupt.
The Si474x seek functionality is performed completely
on-chip or can be brought out to a companion
processor. The Si474x can provide base values for
signal quality variables to a companion processor for
qualification or can further process the base values to
qualify valid or invalid stations.
Hi-cut control is employed on audio outputs with
degradation of the signal due to low SNR and/or multipath interference. Two metrics, SNR and multi-path
interference, are monitored concurrently in forcing hi-cut
of the audio outputs. Programmable minimum and
maximum thresholds are available for both metrics. The
transition frequency for hi-cut is also programmable with
up to seven hi-cut filter settings. A single set of attack
and release rates for hi-cut are programmable for both
metrics from a range of 2 ms to 64 s. Figure 17, “FM HiCut Based on Active Monitoring of SNR and Multi-Path
Interference,” illustrates hi-cut. The level of hi-cut
applied can be monitored with the FM_RSQ_STATUS
command. Hi-cut can be disabled by setting the hi-cut
filter setting to the default audio bandwidth of 15 kHz.
The Si474x uses RSSI, SNR, and AFC to qualify
stations. Most of these metrics have programmable
thresholds to tailor the seek function to the subjective
tastes of customers.
RSSI is employed first to screen all possible candidate
stations. SNR and AFC are subsequently used in
screening the RSSI qualified stations. The more
thresholds the system engages, the higher the
confidence that any found stations will indeed be valid
broadcast stations; however, the more challenging
levels the thresholds are set to, the longer the overall
seek time as more stations and more qualifiers will be
assessed. It is recommended that RSSI be set to a midlevel threshold in conjunction with an SNR threshold set
to a level delivering acceptable audio performance. This
trade-off will eliminate very low RSSI stations whilst
keeping the seek time to acceptable levels. Generally,
the time to auto-scan and store valid channels for an
entire AM or FM band with all thresholds engaged is
very short depending on the band content.
Seek is initiated using the FM_SEEK_START or
AM_SEEK_START commands. The RSSI and SNR
threshold settings are adjustable using properties.
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SNR
Cutoff
frequency
level
15 kHz
SNR
Prog.
cutoff
SNR
Lo
Thld
High SNR
Thld
20 kHz
Attack & Release rate
Multi-path
Cutoff
frequency
level
Multi-path 15 kHz
Interference
(MP)
Prog.
cutoff
Trigger
Thld
High
Thld
Min cutoff freq
level with
associated
attack or
release rate
Multi-path
interference
MP
L+R
L-R
Figure 17. FM Hi-Cut Based on Active Monitoring of SNR and Multi-Path Interference
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4.13. AM/FM Noise Blanker
(Si4742/43/44/45 only)
4.13.1. FM Noise Blanker Property Settings
In an automotive environment, noise spikes from engine
ignition and/or various other electrical sources can
significantly impair and disrupt the audio output. The
Si4742/43/44/45 includes a noise blanker to mitigate or
eliminate these noise spikes and audible artifacts.
Figure 18 shows a conceptual flow chart for the
Si4742/43/44/45 noise blanking function. The
Si4742/43/44/45 offers five properties for configuring
the AM and FM noise blankers including detection
threshold, blanking interval, trigger rate, noise-floor
bandwidth, and delay. Each property is configurable for
adopting customers to refine and apply unique noiseblank behavior.
The FM noise blanker detection threshold property sets
the level threshold for detection of the noise
impulses/spikes in dB from a range of 1 dB to 90 dB
above the noise floor. The FM noise blank rate property
sets the maximum rate in Hz at which the noise blanker
is triggered from a range of 100 Hz to 6400 Hz. The FM
noise blank interval property sets the noise blanking
interval in microseconds at which the original samples
are replaced by interpolated "clean" samples from a
range of 8 µs to 48 µs. The FM noise blanker IIR filter
property sets the noise floor bandwidth from a range of
390 Hz to 2480 Hz. This property sets the rms noise
floor above which the noise impulse level detect
threshold is set for noise impulse detection. The FM
noise blank delay property sets the delay in
microseconds in applying impulse blanking to the
original samples, which allows for insertion and
alignment of the blanked samples with the original
sampled signal. The range of values for FM noise
blanker delay is 125 µs to 219 µs.
Multi-path
Inteference
Detection
FM
Demod
Pilot PLL
HPF
Ultrasonic
noise
Pilot notch
filter
Noise
impulse
blanker
Audio
Filter
&
Hi-cut
L
Stereo
Decode
R
Figure 18. Illustration of Noise Blanker in FM Signal Path
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FM MPX waveform with
noise impulses
FM MPX waveform after
noise blanker
FM noise
blanker delay is
set to calibrate
the delay from
the noise
blanker for
proper time
alignment and
insertion of
blanked
samples into
original signal.
Noise impulse threshold
Noise floor threshold
MPX waveform after HPF stage
Figure 19. Illustration of FM Noise Blanker Property Settings for Proper Detection of Noise
Impulses (FM MPX waveforms are offset vertically for illustration purposes)
30
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4.13.2. AM Noise Blanker Property Settings
The AM noise blanker detection threshold property sets
the level threshold for detection of the noise
impulses/spikes in dB from a range of 1 dB to 90 dB
above the noise floor. The AM noise blank rate property
sets the maximum rate in Hz at which the noise blanker
is triggered from a range of 100 Hz to 6400 Hz. The AM
noise blank interval property sets the blanking interval in
microseconds at which the original samples are
replaced by previous samples using a "sample and
hold" scheme from a range of 15 µs to 110 µs. The AM
noise blanker IIR filter property sets the noise floor
bandwidth from a range of 300 Hz to 2480 Hz. This
property sets the rms noise floor above which the noise
impulse level detect threshold is set for noise impulse
detection. The AM noise blank delay property sets the
delay in microseconds in applying impulse blanking to
the original samples, which allows for insertion and
alignment of the blanked samples with the original
sampled signal. The range of values for the AM noise
blanker delay is 125 µs to 219 µs.
HPF/Impulse
Noise
Detector
I/Q
Noise
Blanker
Channel
Filter
AM
Demod
Audio
Figure 20. Illustration of Noise Blanker in AM Signal Path.
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AM waveform
with noise impulses
AM waveform
after noise blanker
AM noise blank
delay is set to
calibrate the
delay from the
noise blanker
for proper time
alignment and
insertion of
blanked
samples into
original signal.
Noise impulse threshold
Noise floor threshold
AM waveform after HPF
Figure 21. Illustration of AM Noise Blanker Property Settings for Proper Detection of Noise
Impulses (AM Waveforms are Offset Vertically for Illustration Purposes)
32
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4.14. Programming Section
To ease development time and offer maximum
customization, the Si474x provides a simple and
powerful software interface to program the receiver. The
device is programmed using commands, arguments,
properties, and responses.
To perform an action, the user writes a command byte
and associated arguments causing the chip to execute
the given command. Commands control actions such as
powerup, powerdown, or tune to a station. Arguments
are specific to a given command and are used to modify
the command.
Properties are a special command + argument used to
modify the default chip operation and are generally
configured immediately after powerup. Examples of
properties are de-emphasis, RSSI seek threshold, and
soft mute attenuation.
Responses provide information and are echoed after a
command + arguments are issued and processed. All
commands provide a one-byte status update indicating
interrupt and clear-to-send status information.
For a detailed description of the commands and properties
for the Si474x, see "AN332: Si47xx Programming Guide"
and “AN344: Si4706/07/4x Programming Guide.”
4.15. Reset, Powerup, and Powerdown
Setting the RST pin low will disable analog and digital
circuitry, reset the registers to their default settings, and
disable the bus. Setting the RST pin high will bring the
device out of reset. The powerup mode powers up the
device and provides mode selection. Mode selections
include AM, FM, or WB receiver and analog or digital
audio output. A powerdown mode is available to reduce
power consumption when the part is idle. Putting the
device in powerdown mode will disable analog and
digital circuitry while keeping the bus active.
4.16. GPO 1–3
The GPO 1–3 pins can be set to output a constant low
or high output, or optionally be set to provide a
hardware interrupt to the controller such as scan
complete, stereo/mono indicator, and RDS/RBDS. After
reset and POWER_UP into AM receiver mode, GPO1 is
reserved for AM AGC external attenuator control.
4.17. RDS/RBDS Advanced Processor
The Si4741/43/45 implements an advanced, patented,
high-performance RDS processor for demodulation,
symbol decoding, block synchronization, error
detection, and error correction. The RDS decoder
applies advanced decoding and statistical decision
techniques
to
provide
very
high-performance
synchronization at very noisy signal levels, and
excellent sensitivity at industry-standard block error rate
(BLER) levels (5%).
The Si4741/43/45’s strong synchronization performance
in very noisy/low SNR environments minimizes the
number of instances of lost synchronization. Other less
robust tuners must attempt to resynchronize in low SNR
environments, resulting in lost data and lengthy delays
in reestablishing data reception. The Si4741/43/45
maintains synchronization to the RDS transmission,
despite high BLER. This results in fewer dropped
connections, minimal resynchronization time, and
greater data reliability in low SNR environments.
Figure 22 illustrates the benefits of the Si4741/43/45
robust synchronization persistence.
The Si4741/43/45 decoder additionally provides more
reliable data decoding performance in low carrier to
noise (CNR) environments. This results in very low
decoder implementation loss figures and substantial
improvements
over
other
RDS
standard
implementations.
Figure 23 illustrates the Si4741/43/45 RDS decoder
performance. The decoder failure probability drops
significantly when compared to a standard RDS
decision-based decoder for given energy per bit/noise
density (Eb/No).
The Si4741/43/45 report RDS decoder synchronization
status and detailed bit errors for each RDS block. The
range of reportable bit errors detected and corrected are
0, 1-2, 3-5, and “not correctable.” More than five errors
indicates that the corresponding block information word
is non-correctable.
The Si4741/43/45 also provides highly configurable
interrupts based on RDS-driven events and conditions.
The default settings provide an interrupt when RDS is
synchronized and when RDS group data has been
received. The configurable interrupts can be set to
provide frequent interrupts down to a single received
block with BLER. The configurable interrupts also can
be set to provide very infrequent interrupts, buffering up
to 25 complete RDS groups (100 blocks) with BLER by
block in the on-chip FIFO. The Si4741/43/45 also
provides configurable interrupts on changes or receipt
of the key RDS blocks A and B. This flexibility allows
adopters to either conduct extensive RDS data
processing on the host or reserve the host processor in
power-saving modes with minimal RDS interrupts,
allowing the Si4741/43/45 to perform RDS processing
on-chip. Interrupt configuration and thresholds are
covered in “AN332: Si47xx Programming Guide” and
“AN344: Si4706/07/4x Programming Guide,” offered
under NDA.
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Re-synchronization time in
traditional RDS decoder
Si4741/43/45 advanced RDS decoder
with persistent synchronization
delivers data during “dead time”
SNR
SNR at which traditional RDS decoder
declares block decoding failure and
Sync loss.
time
SNR at which Si4741/43/45 decoder
declares Sync loss.
Figure 22. Illustrative Si4741/43/45 Advanced RDS Synchronization
Decoder Failure Probability
1.E+00
Probability
1.E-01
1.E-02
RDS standard limits
1.E-03
Standard-compliant advanced decoder (Skyworks generation 1)
Si474x advanced decoder
1.E-04
0
1
2
3
4
5
6
Eb/N0
Figure 23. Si4741/43/45 Decoder Performance
34
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4.18. Reference Clock
4.19.1. 2-Wire Control Interface Mode
The Si4740/41/42/43/44/45-C10 reference clock is
programmable, supporting RCLK frequencies in
Table 12. Refer to Table 3, “DC Characteristics,” on
page 5 for switching voltage levels and Table 9, “FM
Receiver Characteristics,” on page 12 for frequency
tolerance information.
When selecting 2-wire mode, the user must ensure that
SCLK is high during the rising edge of RST, and stays
high until after the first start condition. Also, a start
condition must not occur within 300 ns before the rising
edge of RST.
4.19. Control Interface
A serial port slave interface is provided, which allows an
external controller to send commands to the Si474x and
receive responses from the device. The serial port can
operate in three bus modes: 2-wire mode, 3-wire mode,
or SPI mode. The Si474x selects the bus mode by
sampling the state of the GPO1 and GPO2 pins on the
rising edge of RST. The GPO1 pin includes an internal
pull-up resistor, which is connected while RST is low.
The GPO2 pin includes an internal pull-down resistor,
which is connected while RST is low. Therefore, it is
only necessary for the user to actively drive pins which
differ from these states. See Table 17.
Table 17. Bus Mode Select on Rising Edge of
RST
Bus Mode
GPO1
GPO2
2-Wire
1
0
SPI
1
1 (must drive)
3-Wire
0 (must drive)
0
After the rising edge of RST, the pins GPO1 and GPO2
are used as general purpose output (O) pins. After reset
and POWER_UP into AM receiver mode, GPO1 is
reserved for AM AGC external attenuator control. In any
bus mode, commands may only be sent after VIO and
VDD supplies are applied.
In any bus mode, before sending a command or reading
a response, the user must first read the status byte to
ensure that the device is ready (CTS bit is high).
The 2-wire bus mode uses only the SCLK and SDIO
pins for signaling. A transaction begins with the START
condition, which occurs when SDIO falls while SCLK is
high. Next, the user drives an 8-bit control word serially
on SDIO, which is captured by the device on rising
edges of SCLK. The control word consists of a 7-bit
device address, followed by a read/write bit (read = 1,
write = 0). The Si474x acknowledges the control word
by driving SDIO low on the next falling edge of SCLK.
Although the Si474x will respond to only a single device
address, this address can be changed with the SEN pin
(note that the SEN pin is not used for signaling in 2-wire
mode). When SEN = 0, the 7-bit device address is
0010001b. When SEN = 1, the address is 1100011b.
For write operations, the user then sends an 8-bit data
byte on SDIO, which is captured by the device on rising
edges of SCLK. The Si474x acknowledges each data
byte by driving SDIO low for one cycle, on the next
falling edge of SCLK. The user may write up to 8 data
bytes in a single 2-wire transaction. The first byte is a
command, and the next seven bytes are arguments.
For read operations, after the Si474x has acknowledged
the control byte, it will drive an 8-bit data byte on SDIO,
changing the state of SDIO on the falling edge of SCLK.
The user acknowledges each data byte by driving SDIO
low for one cycle, on the next falling edge of SCLK. If a
data byte is not acknowledged, the transaction will end.
The user may read up to 16 data bytes in a single, 2wire transaction. These bytes contain the response data
from the Si474x.
A 2-wire transaction ends with the STOP condition,
which occurs when SDIO rises while SCLK is high.
For details on timing specifications and diagrams, refer
to Table 5, “2-Wire Control Interface Characteristics,” on
page 7; Figure 2, “2-Wire Control Interface Read and
Write Timing Parameters,” on page 8, and Figure 3, “2Wire Control Interface Read and Write Timing Diagram,”
on page 8.
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Si4740/41/42/43/44/45-C10
4.19.2. 3-Wire Control Interface Mode
4.19.3. SPI Control Interface Mode
When selecting 3-wire mode, the user must ensure that
a rising edge of SCLK does not occur within 300 ns
before the rising edge of RST.
When selecting SPI mode, the user must ensure that a
rising edge of SCLK does not occur within 300 ns
before the rising edge of RST.
The 3-wire bus mode uses the SCLK, SDIO and SEN_
pins. A transaction begins when the user drives SEN
low. Next, the user drives a 9-bit control word on SDIO,
which is captured by the device on rising edges of
SCLK. The control word consists of a 3-bit device
address (A7:A5 = 101b), a read/write bit (read = 1, write
= 0), and a 5-bit register address (A4:A0).
SPI bus mode uses the SCLK, SDIO, and SEN pins for
read/write operations. The system controller can
choose to receive read data from the device on either
SDIO or GPO1. In AM Receiver mode, only SIDIO is
available; GPO1 is reserved for AM AGC external
attenuator control. A transaction begins when the
system controller drives SEN = 0. The system controller
then pulses SCLK eight times, while driving an 8-bit
control byte serially on SDIO. The device captures the
data on rising edges of SCLK. The control byte must
have one of five values:
For write operations, the control word is followed by a
16-bit data word, which is captured by the device on
rising edges of SCLK.
For read operations, the control word is followed by a
delay of one-half SCLK cycle for bus turn-around. Next,
the Si474x will drive the 16-bit read data word serially
on SDIO, changing the state of SDIO on each rising
edge of SCLK.
A transaction ends when the user sets SEN high, then
pulses SCLK high and low one final time. SCLK may
either stop or continue to toggle while SEN is high.
In 3-wire mode, commands are sent by first writing each
argument to register(s) 0xA1–0xA3, then writing the
command word to register 0xA0. A response is
retrieved by reading registers 0xA8–0xAF.
For details on timing specifications and diagrams, refer
to Table 6, “3-Wire Control Interface Characteristics,” on
page 9; Figure 4, “3-Wire Control Interface Write Timing
Parameters,” on page 9, and Figure 5, “3-Wire Control
Interface Read Timing Parameters,” on page 9.
0x48 = write a command (controller drives 8
additional bytes on SDIO).
0x80 = read a response (device drives one
additional byte on SDIO).
0xC0 = read a response (device drives 16 additional
bytes on SDIO).
0xA0 = read a response (device drives one
additional byte on GPO1).
0xE0 = read a response device drives 16 additional
bytes on GPO1).
For write operations, the system controller must drive
exactly eight data bytes (a command and seven
arguments) on SDIO after the control byte. The data is
captured by the device on the rising edge of SCLK.
For read operations, the controller must read exactly 1
byte (STATUS) after the control byte or exactly 16 data
bytes (STATUS and RESP1–RESP15) after the control
byte. The device changes the state of SDIO (or GPO1, if
specified) on the falling edge of SCLK. Data must be
captured by the system controller on the rising edge of
SCLK.
Keep SEN low until all bytes have transferred. A
transaction may be aborted at any time by setting SEN
high and toggling SCLK high and then low. Commands
will be ignored by the device if the transaction is
aborted.
For details on timing specifications and diagrams, refer
to Figure 6 and Figure 7 on page 10.
36
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5. Commands and Properties
Refer to "AN332: Si47xx Programming Guide" and “AN344: Si4706/07/4x Programming Guide.”
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Si4740/41/42/43/44/45-C10
NC
NC
NC
GPO1/AGC2
GPO2/INT
GPO3/DCLK
6. Pin Descriptions: Si4740/41/42/43/44/45-C10-GM
24
23
22
21
20
19
FMI 1
18 DFS
17 DOUT
RFGND 2
AGC1 3
16 LOUT
GND
PAD
NC 4
15 ROUT
GND 5
14 GND
8
9
10
11
12
SEN
SCLK
SDIO
RCLK
VIO
13 VDD
7
RST
AMI 6
Table 18. Si4740/41/42/43/44/45-C10-GM Pin Descriptions
Pin Number(s)
Name
Description
1
FMI
2
RFGND
3
AGC1
4, 22–24
NC
5, 14, GND PAD
GND
Ground. Connect to ground plane on PCB.
6
AMI
AM RF input.
7
RST
Device reset (active low) input.
8
SEN
Serial enable input (active low).
9
SCLK
Serial clock input.
10
SDIO
Serial data input/output.
11
RCLK
External reference oscillator input.
12
VIO
I/O supply voltage.
13
VDD
Supply voltage. May be connected directly to battery.
15
ROUT
Right audio line output.
16
LOUT
Left audio line output.
17
DOUT
Digital output data in digital output audio mode (Si4741/43/45 only). No connect
if not used.
18
DFS
Digital frame synchronization input in digital output mode (Si4741/43/45 only).
No connect if not used.
19
GPO3/DCLK
20
GPO2/INT
21
GPO1/AGC2
FM RF inputs. FMI should be connected to the antenna trace.
RF ground. Connect to ground plane on PCB.
Automatic gain control. See "2. Typical Application Schematic" on page 17.
No connect. Leave floating.
General purpose output/Digital bit synchronous clock input in digital output
mode (Si4741/43/45 only).
General purpose output/interrupt pin.
General purpose output/AM external attenuator control.
38
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Si4740/41/42/43/44/45-C10
7. Ordering Guide
Part Number1,2
Description
Package
Type
Operating
Temperature
Si4740-C10-AM
AM/FM Broadcast Automotive Radio Receiver
4 x 4 x 0.825 24-pin QFN,
AEC-Q100 qualification, IMDS Registration,
PPAP documentation
QFN
Pb-free
–40 to 85 °C
Si4741-C10-AM
AM/FM Broadcast Automotive Radio Receiver
with RDS/RBDS
4 x 4 x 0.825 24-pin QFN,
AEC-Q100 qualification, IMDS Registration,
PPAP documentation
QFN
Pb-free
–40 to 85 °C
Si4742-C10-AM
AM/FM/LW/SW/WB Broadcast
Automotive Radio Receiver
4 x 4 x 0.825 24-pin QFN,
AEC-Q100 qualification, IMDS Registration,
PPAP documentation
QFN
Pb-free
–40 to 85 °C
Si4743-C10-AM
AM/FM/LW/SW/WB Broadcast Automotive Radio Receiver
with RDS/RBDS
4 x 4 x 0.825 24-pin QFN,
AEC-Q100 qualification, IMDS Registration,
PPAP documentation
QFN
Pb-free
–40 to 85 °C
Si4744-C10-AM
AM/FM/SW/LW Broadcast Automotive Radio Receiver
4 x 4 x 0.825 24-pin QFN,
AEC-Q100 qualification, IMDS Registration,
PPAP documentation
QFN
Pb-free
–40 to 85 °C
Si4745-C10-AM
AM/FM/SW/LW Broadcast Automotive Radio Receiver with
RDS/RBDS
4 x 4 x 0.825 24-pin QFN,
AEC-Q100 qualification, IMDS Registration,
PPAP documentation
QFN
Pb-free
–40 to 85 °C
Si4740-C10-GM
AM/FM Broadcast Automotive Radio Receiver
4 x 4 x 0.825 24-pin QFN
QFN
Pb-free
–40 to 85 °C
Si4741-C10-GM
AM/FM Broadcast Automotive Radio Receiver
with RDS/RBDS
4 x 4 x 0.825 24-pin QFN
QFN
Pb-free
–40 to 85 °C
Si4742-C10-GM
AM/FM/LW/SW/WB Broadcast
Automotive Radio Receiver
4 x 4 x 0.825 24-pin QFN
QFN
Pb-free
–40 to 85 °C
Si4743-C10-GM
AM/FM/LW/SW/WB Broadcast Automotive Radio Receiver
with RDS/RBDS
4 x 4 x 0.825 24-pin QFN
QFN
Pb-free
–40 to 85 °C
Si4744-C10-GM
AM/FM/SW/LW Broadcast Automotive Radio Receiver
4 x 4 x 0.825 24-pin QFN
QFN
Pb-free
–40 to 85 °C
Si4745-C10-GM
AM/FM/SW/LW Broadcast Automotive Radio Receiver with
RDS/RBDS
4 x 4 x 0.825 24-pin QFN
QFN
Pb-free
–40 to 85 °C
Notes:
1. Add an “(R)” at the end of the device part number to denote tape and reel option; 2500 quantity per reel.
2. AM numbered devices receive full automotive quality production status, including AEC-Q100 qualification, registration
with International Material Data System (iMDS), and Part Production Approval Process (PPAP) documentation. PPAP
documentation is available at www.skyworksinc.com with a registered and NDA approved user account.
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Si4740/41/42/43/44/45-C10
8. Package Markings
8.1. Si4740/41/42/43/44/45-C10 Top Mark
4740C10
4741C10
4742C10
4743C10
4744C10
4745C10
YYWWRF
YYWWRF
YYWWRF
YYWWRF
YYWWRF
YYWWRF
AIXX
AIXX
AIXX
AIXX
AIXX
AIXX
Figure 24. Si4740/41/42/43/44/45-C10 Top Mark
8.2. Top Mark Explanation
Mark Method:
YAG Laser
Line 1 Marking:
Customer Part Number
(Right-justify)
4740 = Si4740
4741 = Si4741
4742 = Si4742
4743 = Si4743
4744 = Si4744
4745 = Si4745
C = Part revision C
10 = Firmware revision 1.0
Line 2 Marking:
YY = Year
WW = Workweek
Assigned by the Assembly House. Corresponds to the year and
workweek of the mold date.
R = Die Rev
F = Wafer Fab
First two characters of the Manufacturing Code from the
Assembly Purchase Order form.
Line 3 Marking:
Circle = 0.5 mm Diameter Pin 1 Identifier.
(Bottom-Left Justified)
A = Assembly House
I = Internal Code
XX = Serial Lot Number
Last four characters of the Manufacturing Code from the
Assembly Purchase Order form.
40
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Si4740/41/42/43/44/45-C10
9. Package Outline: Si4740/41/42/43/44/45-C10 QFN
Figure 25 illustrates the package details for the Si4740/41/42/43/44/45-C10. Table 19 lists the values for the
dimensions shown in the illustration.
Figure 25. 24-Pin Quad Flat No-Lead (QFN)
Table 19. Package Dimensions
Dimension
Min
Nom
Max
A
0.80
0.85
0.90
A1
0.00
0.02
0.05
b
0.18
0.25
0.30
D
D2
4.00 BSC
2.00
2.10
e
0.50 BSC
E
4.00 BSC
E2
2.00
2.10
2.20
2.20
L
0.30
0.40
0.50
L1
0.03
0.05
0.08
aaa
—
—
0.10
bbb
—
—
0.10
ccc
—
—
0.08
ddd
—
—
0.10
eee
—
—
0.10
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VGGD-8.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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Si4740/41/42/43/44/45-C10
10. PCB Land Pattern: Si4740/41/42/43/44/45-C10 QFN
Figure 26 illustrates the PCB land pattern details for the Si4740/41/42/43/44/45-C10-GM. Table 20 lists the values
for the dimensions shown in the illustration.
Figure 26. PCB Land Pattern
Table 20. Dimensions for PCB Land Pattern
Dimension
Min
Max
Dimension
Min
Max
—
e
0.50 BSC.
GE
2.93
E
3.62 REF.
GD
2.93
—
D
3.62 REF.
X
—
0.28
E2
2.00
2.20
D2
2.00
2.20
Y
0.69 REF
ZE
—
4.31
ZD
—
4.31
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition
(LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Notes:
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Notes:
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to
assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 2 x 2 array of 0.90 mm square openings on 1.15 mm pitch should be used for the center
ground pad.
Notes:
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
Body Components.
42
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Si4740/41/42/43/44/45-C10
11. Additional Reference Resources
Si47xx Customer Support Site: www.skyworksinc.com/en/Support
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Si4740/41/42/43/44/45-C10
DOCUMENT CHANGE LIST
Revision 0.1 to Revision 0.2
Added FM Hi-cut description.
Added AM/FM Noise Blanker description.
Updated “2. Typical Application Schematic”.
Updated “3. Bill of Materials”.
Added Digital Audio Output section.
Removed crystal oscillator support.
Updated block diagram.
Updated pinout diagram.
Updated “7. Ordering Guide”.
Added package marking sections.
Updated package outline section.
Updated PCB land pattern section.
Revision 0.2 to Revision 0.3
Updated Table 1 and updated Figures 3 and 12 to reflect supply voltage change to 3.6 V max.
Updated Table 11.
Updated Section “3. Bill of Materials”.
Updated Section “7. Ordering Guide”
Updated Section “8.1. Si4740/41/42/43/44/45-C10 Top Mark”
Updated Section “8.2. Top Mark Explanation”.
Revision 0.3 to Revision 0.5
Added SW band support to Features list.
Updated Table 1 and all other figures and tables to reflect supply voltage change to 3.6 V max.
Added Si4744/45 details.
Updated Table 14
Updated Table 3, Table 9, and Table 11
Revision 0.5 to Revision 0.8
Updated Table 1 and all figures and tables to reflect. VIO change to 2.7 V min.
Updated Table 9, Table 10, and Table 13.
Revision 0.8 to Revision 1.0
Numerous updates and corrections.
44
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