SI51219-A14BFTR

Si51219 T HREE O UTPUTS F ACTORY P R O GRA MM A B LE C LOCK G ENERATOR Features Generates up to 3 CMOS clock  Separate voltage supply pins outputs from 3 to 200 MHz VDD = 2.5 to 3.3 V  Accepts crystal or reference VDDO= 1.8 to 3.3 V (VDDO ≤ VDD) clock input  0.25% to 1.0% Spread Spectrum 3 to 166 MHz reference clock input (Center Spread) 8 to 48 MHz crystal input  Low cycle-cycle jitter  Programmable FSEL, SSEL,  Programmable output rise and SSON, PD, and OE input fall times functions  8-pin TSSOP package  Low power dissipation  Applications Crystal/XO replacement  EMI reduction  Portable devices Digital still camera  IP phone  Home gateway  Ordering Information: See page 9.  Pin Assignments Description The factory programmable Si51219 is a low power, small footprint and frequency flexible programmable clock generator targeting low power, low cost and high volume consumer and embedded applications. The device operates from a single crystal or an external clock source and generates 1 to 3 outputs up to 200 MHz. They are factory programmed to provide customized output frequencies, control inputs and ac parameter tuning like output drive strength that are optimized for customer board condition and application requirements. A separate VDDO supply pin supports clock output at a different voltage level. VDD 1 XOUT 2 XIN/CLKIN 3 SSCLK1/REFCLK FSEL/SSEL/SSON/ OE2 4 8 VDDO 7 SSCLK3 Si51219 SSCLK2/REFCLK_D 6 FSEL/SSEL/SSON/ PD/OE1 5 VSS Patents pending Functional Block Diagram XOUT 2 VDD0 8 VDD 1 4 PLL with Modulation Control XIN/ 3 CLKIN To Pin 7 V-REG To Core Programmable Configuration Register To Pin 4 and Pin 6 VSS 5 Preliminary Rev. 0.7 1/12 Buffers, Dividers, and Switch Matrix 6 SSCLK1/ REFCLK/ 0E2/FSEL/ SSEL/SS0N SSCLK2/ REFCLK_D 0E1/FSEL/ SSEL/SS0N/PD 7 SSCLK3 (VDD0) Copyright © 2012 by Silicon Laboratories Si51219 This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Si51219 2 Preliminary Rev. 0.7 Si51219 TABLE O F C ONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 2.1. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 3. Functional Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.1. Input Frequency Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.2. Output Frequency Range and Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.3. Programmable Modulation Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.4. Programmable Spread Percent (%) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.5. SSON or Frequency Select (FSEL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.6. Power Down (PD) or Output Enable (OE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 4. Pin Descriptions: 8-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 5. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 6. Package Outline: 8-pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Preliminary Rev. 0.7 3 Si51219 1. Electrical Specifications Table 1. DC Electrical Specifications (VDD = 2.5 V ± 5%, or VDD = 3.3 V ± 10%, TA = 0 to 70 oC) Parameter Symbol Test Condition Min Typ Max Unit VDD VDD=3.3 V ±10% 2.97 3.3 3.63 V VDD=2.5 V ±5% 2.375 2.5 2.625 V VDDO VDDO ≤ VDD 1.71 — 3.6 V Output High Voltage VOH IOH= –4 mA, VDDX=VDD or VDDO VDDX-0.5 — — V Output Low Voltage VOL IOL= 4mA, — — 0.3 V Input High Voltage VIH CMOS level 0.7 VDD — — V Input Low Voltage VIL CMOS level — — 0.3 VDD V Operating Supply Current IDD FIN=12 MHz, CLKOUT1 =12 MHz, CLKOUT2/3 =24 MHz, CL=0, VDD=3.3 V — 6 — mA Nominal Output Impedance ZO — 30 —  Operating Voltage RPUP/RPD Pin 6 — 150k —  Input Pin Capacitance CIN Input Pin Capacitance — 3 5 pF Load Capacitance CL Clock outputs < 166 MHz — — 15 pF Clock outputs > 166 MHz — — 10 pF Internal Pull-up/Pull-down Resistor 4 Preliminary Rev. 0.7 Si51219 Table 2. AC Electrical Specifications (VDD = 2.5 V ± 5%, or VDD = 3.3 V ± 10%, TA = 0 to 70 oC) Parameter Symbol Condition Min Typ Max Unit Input Frequency Range FIN1 Crystal input 8 — 48 MHz Input Frequency Range FIN2 Reference clock Input 3 — 166 MHz Output Frequency Range FOUT SSCLK1/2/3 3 — 200 MHz Frequency Accuracy FACC Configuration dependent — 0 — ppm DCOUT Measured at VDD/2 45 50 55 % Input Duty Cycle DCIN CLKIN, CLKOUT through PLL 30 50 70 % Output Rise Time tr CL=15 pF, 20 to 80% — 1 3.0 ns Output Fall Time tf CL=15 pF, 20 to 80% — 1 Output Duty Cycle Period Jitter 3.0 ns * PJ1 SSCLK1/2/3, three clocks running, VDD=3.3 V, CL=15 pF — 150 — ps CCJ1 SSCLK1/2/3, three clocks running, VDD=3.3 V, CL=15 pF — 100* — ps Power-up Time tPU Time from 0.9 VDD to valid frequencies at all clock outputs — 1.2 5.0 ms Output Enable Time tOE Time from OE raising edge to active at output SSCLK1/2 (asynchronous) — 15 — ns Output Disable Time tOD Time from OE falling edge to active at output SSCLK1/2 (asynchronous) — 15 — ns Min Typ Max Unit –0.5 — 4.2 V Cycle-to-Cycle Jitter *Note: Jitter performance depends on configuration and programming parameters. Table 3. Absolute Maximum Conditions Parameter Symbol Condition Main Supply Voltage VDD Input Voltage VIN Relative to VSS –0.5 — VDD+0.5 V Temperature, Storage TS Non-functional –65 — 150 °C Temperature, Operating Ambient TA Functional, C-Grade 0 — 70 °C Temperature, Junction TJ Functional, power is applied — — 125 °C Temperature, Soldering TSol Non-functional — — 260 °C Dissipation, Junction to Case ØJC Independent of air flow — — 36 °C/W Dissipation, Junction to Ambient ØJA Still air — 181 — °C/W ØJA 1m/s air flow — 100 — °C/W ØJA 3m/s air flow — 80 — °C/W ESD Protection (Human Body Model) ESDHBM JEDEC (JESD 22-A114) –4000 — 4000 V ESD Protection (Charge Device Model) ESDCDM JEDEC (JESD 22-C101) –1500 — 1500 V ESD Protection (Machine Model) ESDMM JEDEC (JESD 22-A115) –200 — 200 V MSL JEDEC (J-STD-020) Moisture Sensitivity Level 1 Note: While using multiple power supplies, the Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is not required. Preliminary Rev. 0.7 5 Si51219 2. Design Considerations 2.1. Typical Application Schematic VDD 10µF 0.1µF 0.1µF VDD VDDO CL1 XOUT SSCLK3 Si51219 XIN SSCLK2 CL2 VDD FSEL VSS 5K 5K Comments and Recommendations Decoupling Capacitor: A decoupling capacitor of 0.1 μF must be used between VDD and VSS on the pins 1 and 8. Place the capacitor on the component side of the PCB as close to the VDD pin as possible. The PCB trace to the VDD pin and to the GND via should be kept as short as possible Do not use vias between the decoupling capacitor and the VDD pin. In addition, a 10 µF capacitor should be placed between VDD and VSS. Series Termination Resistor: A series termination resistor is recommended if the distance between the outputs (SSCLK or REFCLK pins) and the load is over 1 ½ inch. The nominal impedance of the SSCLK output is about 30 Ω. Use 20 Ω resistor in series with the output to terminate 50 Ω trace impedance and place 20 Ω resistor as close to the SSCLK output as possible. Crystal and Crystal Load: Only use a parallel resonant fundamental AT cut crystal. Do not use higher overtone crystals. To meet the crystal initial accuracy specification (in ppm) make sure that external crystal load capacitor is matched to crystal load specification. To determine the value of CL1 and CL2, use the following formula; C1 = C2 = 2CL – (Cpin + Cp) Where: CL is load capacitance stated by crystal manufacturer Cpin is the Si51219 pin capacitance (4 pF) Cp is the parasitic capacitance of the PCB traces. Example: If a crystal with CL=12 pF specification is used and Cp=1 pF (parasitic PCB capacitance on PCB), 19 or 20 pF external capacitors from pins XIN (pin 2) and XOUT (Pin 3) to VSS are required. Users must verify Cp value. 6 Preliminary Rev. 0.7 Si51219 3. Functional Descriptions 3.1. Input Frequency Range The input frequency range is from 8.0 to 48.0 MHz for crystals and ceramic resonators. If an external clock is used, the input frequency range is from 8.0 to 166.0 MHz. 3.2. Output Frequency Range and Outputs Up to three outputs can be programmed as SSCLK or REFCLK. SSCLK output can be synthesized to any value from 3 to 200 MHz with spread based on valid input frequency. The spread at SSCLK pins can be stopped by the SSON input control pin. If SSON pin is high (VDD), the frequency at SSCLK pin is synthesized to the nominal value of the input frequency and there is no spread. REFCLK is the buffered output of the oscillator and is the same frequency as the input frequency without spread. However, REFCLK_D output is divided by output dividers from 2 to 32. By using only low cost, fundamental mode crystals, the Si51219 can synthesize output frequency up to 200 MHz, eliminating the need for higher order crystals (Xtals) and crystal oscillators (XOs). This reduces the cost while improving the system clock accuracy, performance, and reliability. 3.3. Programmable Modulation Frequency The spread spectrum clock (SSC) modulation default value is 31.5 kHz. The higher values of up to 62 kHz can also be programmed. Less than 30 kHz modulation frequency is not recommended to stay out of the range audio frequency bandwidth since this frequency could be detected as a noise by the audio receivers within the vicinity. 3.4. Programmable Spread Percent (%) The spread percent (%) value is programmable from ±0.25% to ±1% (center spread) for all SSCLK frequencies. It is possible to program smaller or larger non-standard values of spread percentage. Contact Silicon Labs if these non-standard spread percent values are required in the application. 3.5. SSON or Frequency Select (FSEL) The Si51219 pin 4 and 6 can be programmed as either SSON to enable or disable the programmed spread percent value or as frequency select (FSEL). If SSON is used, when this pin is pulled high (VDD), the spread is stopped and the frequency is the nominal value without spread. If low (GND), the frequency is the nominal value with the spread. If FSEL function is used, the output pins can be programmed for different set of frequencies as selected by FSEL. SSCLK value can be any frequency from 3 to 200 MHz, but the spread % is the same percent value. REFCLK is the same frequency as the input reference clock and the REFCLK_D input clock is divided by 2 to 32 without spread. The set of frequencies in Table 4 is given as an example, using a 48 MHz crystal. Table 4. Example Frequencies FSEL (Pin 6) SSCLK1 (Pin 4) 0 66 MHz, ±1% 1 33 MHz, ±1% 3.6. Power Down (PD) or Output Enable (OE) The Si51219 pin 6 can be programmed as PD input. Pin 4 and pin 6 can be programmed as OE input. PD turns off both PLL and output buffers whereas OE only disables the output buffers to Hi-Z. Preliminary Rev. 0.7 7 Si51219 4. Pin Descriptions: 8-Pin TSSOP VDD 1 8 XOUT 2 7 SSCLK3 XIN/CLKIN 3 SSCLK1/REFCLK FSEL/SSEL/SSON/ OE2 4 Si51219 VDDO 6 SSCLK2/REFCLK_D FSEL/SSEL/ SSON/PD/OE1 5 VSS Table 5. Si51219 Pin Descriptions 8 Pin # Name Type Description 1 VDD 2 XOUT O Crystal output. Leave this pin unconnected (floating) if an external clock input is used. 3 XIN/CLKIN I External crystal and clock input. 4 SSCLK1/REFCLK/ FSEL/SSEL/SSON/ OE2 I/O 5 VSS GND 6 SSCLK2/REFCLK_D/ OE1/FSEL/SSEL/ SSON/PD I/O Programmable SSCLK2 or REFCLK_D output or MultiFunction control input. The frequency at this pin is synthesized by internal PLL if programmed as SSCLK2 with or without spread. If programmed as REFCLK_D, output clock is buffered output of crystal or reference clock input divided by 2 to 32. If programmed as MultiFunction control input, it can be OE, PD, FSEL, SSEL and SSON. 7 SSCLK3 O Programmable SSCLK3 output. The frequency at this pin is synthesized by internal PLL with or without spread. It is power by VDDO pin (pin 8). 8 VDDO PWR 2.5 to 3.3 V power supply. Programmable SSCLK1 or REFCLK output or MultiFunction control input. The frequency at this pin is synthesized by internal PLL if programmed as SSCLK1 with or without spread. If programmed as REFCLK, output clock is buffered output of crystal or reference clock input. If programmed as MultiFunction control input, it can be OE, FSEL, SSEL and SSON. Ground. PWR 1.8 to 3.3 V output power supply to SSCLK3 (pin 7) VDDO ≤ VDD. Preliminary Rev. 0.7 Si51219 5. Ordering Information Part Number Package Type Temperature Si51219-AxxxFT 8-pin TSSOP Commercial, 0 to 70 C Si51219-AxxxFTR 8-pin TSSOP—Tape and Reel Commercial, 0 to 70 C Si 51219 SiSi512xx 51210 programmable Clock Generator Product Family FTR AXXX Operating Temp Range: F = 0 to + 70 ° C T = TSSOP package R = Tape & Reel ( blank) = Tubes A = Product Revision A 2nd Option Code= XXX A threecharacter code will be assigned for each unique configuration . Device starts operation upon powerup . Preliminary Rev. 0.7 9 Si51219 6. Package Outline: 8-pin TSSOP 10 Preliminary Rev. 0.7 Si51219 NOTES: Preliminary Rev. 0.7 11 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. Available for Windows and iOS (CBGo only). www.silabs.com/CBPro Timing Portfolio www.silabs.com/timing SW/HW Quality Support and Community www.silabs.com/CBPro www.silabs.com/quality community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. 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