SI52112-B3-GTR

S i 5 2 11 2 - B 3 / B 4 PCI-E XPRESS G EN 2 DUAL O UTPUT C LOCK G ENERATOR Features       PCI-Express Gen 1 and Gen 2  compliant Low power HCSL differential  output buffers  Supports Serial-ATA (SATA) at 100 MHz  No termination resistors required 25 MHz Crystal Input or Clock  input Triangular spread spectrum  profile for maximum EMI reduction (Si52112-B4) Extended Temperature: –40 to 85 °C 3.3 V Power supply Small package 10-pin TDFN (3x3 mm) Si52112-B3 does not support spread spectrum outputs Si52112-B4 supports 0.5% down spread outputs For PCIe Gen3 applications, see Si52112-B5/B6 Ordering Information: See page 13 Pin Assignments Applications Network Attached Storage  Multi-function Printer Wireless Access Point  Routers   VDD VDD 1 10 XOUT 2 9 DIFF2 XIN/CLKIN 3 8 DIFF2 VSS 4 7 DIFF1 VSS 5 6 DIFF1 Description Si52112-B3/B4 is a high-performance, PCIe clock generator that can source two PCIe clocks from a 25 MHz crystal or clock input. The clock outputs are compliant to PCIe Gen 1 and Gen 2 specifications. The ultrasmall footprint (3x3 mm) and industry leading low power consumption make Si52112-B3/B4 the ideal clock solution for consumer and embedded applications. Patents pending VDD DIFF1 XIN/CLKIN PLL Divider DIFF2 XOUT VSS Rev 1.2 Copyright © 2014 by Silicon Laboratories Si52112-B3/B4 Si52112-B3/B4 2 Rev 1.2 Si52112-B3/B4 TABLE O F C ONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. Crystal Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2.1. Crystal Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2.2. Calculating Load Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3. Test and Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 4. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1. 10-Pin TDFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.2. 8-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6. Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 6.1. TDFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.2. TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7. Recommended Design Guideline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Rev 1.2 3 Si52112-B3/B4 1. Electrical Specifications Table 1. Recommended Operating Conditions Parameter Symbol Test Condition Min Typ Max Unit VDD(extended) 3.3 V ± 5% 3.13 3.3 3.46 V VDD(commercial) 3.3 V ± 10% 2.97 3.3 3.63 V Symbol Test Condition Min Typ Max Unit Operating Voltage VDD 3.3 V ±10% 2.97 3.30 3.63 V Operating Supply Current IDD Full Active — — 17 mA Input Pin Capacitance CIN Input Pin Capacitance — 3 5 pF COUT Output Pin Capacitance — — 5 pF Supply Voltage (extended) Supply Voltage (commercial) Table 2. DC Electrical Specifications Parameter Output Pin Capacitance 4 Rev 1.2 Si52112-B3/B4 Table 3. AC Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit LACC Measured at VDD/2 differential — — 250 ppm TDC Measured at VDD/2 45 — 55 % CLKIN Rise and Fall Times TR/TF Measured between 0.2 VDD and 0.8 VDD 0.5 — 4.0 V/ns CLKIN Cycle-to-Cycle Jitter TCCJ Measured at VDD/2 — — 250 ps CLKIN Long Term Jitter TLTJ Measured at VDD/2 — — 350 ps Input High Voltage VIH XIN/CLKIN pin 2 — VDD+0.3 V Input Low Voltage VIL XIN/CLKIN pin — — 0.8 V Input High Current IIH XIN/CLKIN pin, VIN = VDD — — 35 µA Input Low Current IIL XIN/CLKIN pin, 0 < VIN