SI53156-A01AGMR

S i531 5 6 PCI-E X P R E S S G E N 1, G E N 2, G E N 3, A N D G E N 4 FANOUT BUFFER Features       PCI-Express Gen 1, Gen 2, Gen 3,  and Gen 4 common clock compliant Supports Serial ATA (SATA) at  100 MHz  100–210 MHz operation  Low power, push pull, differential output buffers  Internal termination for maximum integration  Dedicated output enable pin for each  output Six PCI-Express buffered clock outputs Clock input spread tolerable Supports LVDS outputs I2C support with readback capabilities Extended temperature: –40 to 85 oC 3.3 V power supply 32-pin QFN package Ordering Information: See page 17. Applications   Network attached storage Multi-function printers   Wireless access point Routers Pin Assignments Description The Si53156 is a spread spectrum tolerant PCIe clock buffer that can source six PCIe clocks simultaneously. The device has six hardware output enable control inputs for enabling the respective differential outputs on the fly. The device also features output enable control through I2C communication. I2C programmability is also available to dynamically control skew, edge rate and amplitude on the true, compliment, or both differential signals on the clock outputs. This control feature enables optimal signal integrity as well as optimal EMI signature on the clock outputs. Measuring PCIe clock jitter is quick and easy with the Silicon Labs PCIe Clock Jitter Tool. Download it for free at www.silabs.com/pcie-learningcenter. Functional Block Diagram Patents pending Rev. 1.3 11/17 Copyright © 2017 by Silicon Laboratories Si53156 Si5 3156 2 Rev. 1.3 S i5 3 156 TA B L E O F C O N T E N T S Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2.1. OE Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2.2. OE Assertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2.3. OE Deassertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3. Test and Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 4. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4.1. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4.2. Data Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 5. Pin Descriptions: 32-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 7. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 8. Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Rev. 1.3 3 Si5 3156 1. Electrical Specifications Table 1. DC Electrical Specifications Parameter Symbol Test Condition Min Typ Max Unit 3.3 V Operating Voltage VDD core 3.3 ± 5% 3.135 — 3.465 V 3.3 V Input High Voltage VIH Control input pins 2.0 — VDD + 0.3 V 3.3 V Input Low Voltage VIL Control input pins VSS – 0.3 — 0.8 V Input High Voltage VIHI2C SDATA, SCLK 2.2 — — V Input Low Voltage VILI2C SDATA, SCLK — — 1.0 V IIH Except internal pull-down resistors, 0 < VIN < VDD — — 5 A IIL Except internal pull-up resistors, 0 < VIN < VDD –5 — — A 3.3 V Output High Voltage (Single-Ended Outputs) VOH IOH = –1 mA 2.4 — — V 3.3 V Output Low Voltage (Single-Ended Outputs) VOL IOL = 1 mA — — 0.4 V High-impedance Output Current IOZ –10 — 10 A Input Pin Capacitance CIN 1.5 — 5 pF COUT — — 6 pF LIN — — 7 nH Power Down Current IDD_PD — — 1 mA Dynamic Supply Current in Fanout Mode IDD_3.3V — — 45 mA Input High Leakage Current Input Low Leakage Current Output Pin Capacitance Pin Inductance 4 Differential clocks with 5” traces and 2 pF load, frequency at 100 MHz Rev. 1.3 S i5 3 156 Table 2. AC Electrical Specifications Parameter Symbol Condition Min Typ Max Unit 100 — 210 MHz 0.6 — 4 V/ns DIFFIN at 0.7 V Input Frequency Range Rising and Falling Slew Rates for Each Clock Output Signal in a Given Differential Pair fin TR/TF Single ended measurement: VOL = 0.175 to VOH = 0.525 V (Averaged) Differential Input High Voltage VIH 150 — — mV Differential Input Low Voltage VIL — — –150 mV Crossing Point Voltage at 0.7 V Swing VOX Single-ended measurement 250 — 550 mV Vcross Variation over all edges VOX Single-ended measurement — — 140 mV Differential Ringback Voltage VRB –100 — 100 mV Time before ringback allowed TSTABLE 500 — — ps Absolute maximum input voltage VMAX — — 1.15 V Absolute minimum input voltage VMIN –0.3 — — V Duty Cycle for Each Clock Output Signal in a Given Differential Pair TDC Measured at crossing point VOX 45 — 55 % Rise/Fall Matching TRFM Determined as a fraction of 2 x (TR – TF)/(TR + TF) — — 20 % Duty Cycle TDC Measured at 0 V differential 45 — 55 % Clock Skew TSKEW Measured at 0 V differential — — 50 ps Additive Peak Jitter Pk-Pk 0 — 10 ps 10 kHz < F < 1.5 MHz 0 — 0.5 ps 1.5 MHz< F < Nyquist Rate 0 — 0.5 ps DIFF at 0.7 V Additive PCIe Gen 2 Phase Jitter RMSGEN2 Additive PCIe Gen 3 Phase Jitter RMSGEN3 Includes PLL BW 2–4 MHz (CDR = 10 MHz) 0 — 0.10 ps Additive PCIe Gen 4 Phase Jitter RMSGEN4 PCIe Gen 4 — — 0.10 ps Additive Cycle to Cycle Jitter TCCJ Measured at 0 V differential — — 50 ps Long-term Accuracy LACC Measured at 0 V differential — — 100 ppm TR / TF Measured differentially from ±150 mV 2.5 — 8 V/ns 300 — 550 mV Rising/Falling Slew rate Crossing Point Voltage at 0.7 V Swing VOX Notes: 1. Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5. 2. Download the Silicon Labs PCIe Clock Jitter Tool at www.silabs.com/pcie-learningcenter. Rev. 1.3 5 Si5 3156 Table 2. AC Electrical Specifications (Continued) Parameter Symbol Condition Min Typ Max Unit TSTABLE Measured from the point when both VDD and clock input are valid – — 5 ms 10.0 — — ns Enable/Disable and Setup Clock Stabilization from Power-Up Stopclock Set-up Time TSS Notes: 1. Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5. 2. Download the Silicon Labs PCIe Clock Jitter Tool at www.silabs.com/pcie-learningcenter. Table 3. Absolute Maximum Conditions Parameter Symbol Condition Min Typ Max Unit VDD_3.3V Functional — — 4.6 V Input Voltage VIN Relative to VSS –0.5 — 4.6 VDC Temperature, Storage TS Non-functional –65 — 150 °C Industrial Temperature, Operating Ambient TA Functional –40 — 85 °C Commercial Temperature, Operating Ambient TA Functional 0 — 85 °C Temperature, Junction TJ Functional — — 150 °C Dissipation, Junction to Case ØJC JEDEC (JESD 51) — — 17 °C/W Dissipation, Junction to Ambient ØJA JEDEC (JESD 51) — — 35 °C/W ESDHBM JEDEC (JESD 22 - A114) 2000 — — V UL-94 UL (Class) Main Supply Voltage ESD Protection (Human Body Model) Flammability Rating V–0 Note: Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is not required. 6 Rev. 1.3 S i5 3 156 2. Functional Description 2.1. OE Pin Definition The OE pins are active high inputs used to enable and disable the output clocks. To enable the output clock, the OE pin needs to be logic high and the I2C output enable bit needs to be logic high. There are two methods to disable the output clocks: the OE is pulled to a logic low, or the I2C enable bit is set to a logic low. The OE pins are required to be driven at all times even though they have an internal 100 k resistor. 2.2. OE Assertion The OE signals are active high inputs used for synchronous stopping and starting the DIFF output clocks respectively while the rest of the clock generator continues to function. The assertion of the OE signal by making it logic high causes stopped respective DIFF outputs to resume normal operation. No short or stretched clock pulses are produced when the clock resumes. The maximum latency from the assertion to active outputs is no more than two to six output clock cycles. 2.3. OE Deassertion When the OE pin is deasserted by making it logic low, the corresponding DIFF output is stopped, and the final output state is driven low. Rev. 1.3 7 Si5 3156 3. Test and Measurement Setup This diagram shows the test load configuration for differential clock signals. Figure 1. 0.7 V Differential Load Configuration Figure 2. Differential Measurement for Differential Output Signals (for AC Parameters Measurement) 8 Rev. 1.3 S i5 3 156 Figure 3. Single-Ended Measurement for Differential Output Signals (for AC Parameters Measurement) Rev. 1.3 9 Si5 3156 4. Control Registers 4.1. I2C Interface To enhance the flexibility and function of the clock buffer, an I2C interface is provided. Through the I2C Interface, various device functions are available, such as individual clock output enable. The registers associated with the I2C Interface initialize to their default setting at power-up. The use of this interface is optional. Clock device register changes are normally made at system initialization, if any are required. Power management functions can only be programed in program mode and not in normal operation modes. 4.2. Data Protocol The I2C protocol accepts byte write, byte read, block write, and block read operations from the controller. For block write/read operation, access the bytes in sequential order from lowest to highest (most significant bit first) with the ability to stop after any complete byte is transferred. For byte write and byte read operations, the system controller can access individually indexed bytes. The block write and block read protocol is outlined in Table 4 on page 10 while Table 5 on page 11 outlines byte write and byte read protocol. The slave receiver address is 11010110 (D6h). Table 4. Block Read and Block Write Protocol Block Write Protocol Bit 1 8:2 Description Bit Start 1 Slave address—7 bits 8:2 Description Start Slave address—7 bits 9 Write 9 Write 10 Acknowledge from slave 10 Acknowledge from slave 18:11 Command Code—8 bits 18:11 Command Code–8 bits 19 Acknowledge from slave 19 Acknowledge from slave Byte Count—8 bits 20 Repeat start 27:20 28 36:29 37 45:38 10 Block Read Protocol Acknowledge from slave 27:21 Slave address—7 bits Data byte 1–8 bits 28 Read = 1 Acknowledge from slave 29 Acknowledge from slave Data byte 2–8 bits 46 Acknowledge from slave .... Data Byte/Slave Acknowledges .... Data Byte N–8 bits .... Acknowledge from slave .... Stop 37:30 38 46:39 47 55:48 Rev. 1.3 Byte Count from slave—8 bits Acknowledge Data byte 1 from slave—8 bits Acknowledge Data byte 2 from slave—8 bits 56 Acknowledge .... Data bytes from slave/Acknowledge .... Data Byte N from slave—8 bits .... NOT Acknowledge .... Stop S i5 3 156 Table 5. Byte Read and Byte Write Protocol Byte Write Protocol Bit 1 8:2 Byte Read Protocol Description Bit Start 1 Slave address–7 bits 8:2 Description Start Slave address–7 bits 9 Write 9 Write 10 Acknowledge from slave 10 Acknowledge from slave 18:11 Command Code–8 bits 18:11 Command Code–8 bits 19 Acknowledge from slave 19 Acknowledge from slave Data byte–8 bits 20 Repeated start 27:20 28 Acknowledge from slave 29 Stop 27:21 28 Read 29 Acknowledge from slave 37:30 Rev. 1.3 Slave address–7 bits Data from slave–8 bits 38 NOT Acknowledge 39 Stop 11 Si5 3156 Control Register 0. Byte 0 Bit D7 D6 D5 D4 D3 D2 D1 D0 R/W R/W R/W R/W R/W R/W R/W R/W D2 D1 D0 Name Type Reset settings = 00000000 Bit 7:0 Name Reserved Function Control Register 1. Byte 1 Bit D7 D6 D5 Name Type D4 D3 DIFF1_OE DIFF0_OE R/W R/W R/W R/W R/W Reset settings = 00010101 12 Bit 7:5 4 Name Reserved DIFF0_OE 3 2 Reserved DIFF1_OE 1 0 Reserved DIFF2_OE Function Output Enable for DIFF0. 0: Output disabled. 1: Output Enabled. Output Enable for DIFF1. 0: Output disabled. 1: Output enabled. Output Enable for DIFF2. 0: Output disabled. 1: Output enabled. Rev. 1.3 R/W DIFF2_OE R/W R/W S i5 3 156 Control Register 2. Byte 2 Bit D7 D6 D5 Name DIFF3_OE DIFF4_OE DIFF5_OE Type R/W R/W R/W D4 D3 D2 D1 D0 R/W R/W R/W R/W R/W D2 D1 D0 Reset settings = 11100000 Bit Name Function 7 DIFF3_OE Output Enable for DIFF3. 0: Output disabled. 1: Output enabled. 6 DIFF4_OE Output Enable for DIFF4. 0: Output disabled. 1: Output enabled. 5 DIFF5_OE Output Enable for DIFF5. 0: Output disabled. 1: Output enabled. 4:0 Reserved Control Register 3. Byte 3 Bit D7 D6 Name Type D5 D4 D3 Rev Code[3:0] R/W R/W R/W Vendor ID[3:0] R/W R/W R/W R/W R/W Reset settings = 00001000 Bit Name Function 7:4 Rev Code[3:0] Program Revision Code. 3:0 Vendor ID[3:0] Vendor Identification Code. Rev. 1.3 13 Si5 3156 Control Register 4. Byte 4 Bit D7 D6 D5 D4 Name Type D3 D2 D1 D0 R/W R/W R/W R/W BC[7:0] R/W R/W R/W R/W Reset settings = 00000110 Bit Name 7:0 BC[7:0] Function Byte Count Register. Control Register 5. Byte 5 Bit D7 D6 D5 D4 D3 D2 D1 D0 R/W R/W R/W R/W Name DIFF_Amp_Sel DIFF_Amp_Cntl[2] DIFF_Amp_Cntl[1] DIFF_Amp_Cntl[0] Type R/W R/W R/W R/W Reset settings = 11011000 14 Bit Name 7 DIFF_Amp_Sel 6 DIFF_Amp_Cntl[2] 5 DIFF_Amp_Cntl[1] 4 DIFF_Amp_Cntl[0] 3:0 Reserved Function Amplitude Control for DIFF Differential Outputs. 0: Differential outputs with Default amplitude. 1: Differential outputs amplitude is set by Byte 5[6:4]. DIFF Differential Outputs Amplitude Adjustment. 000: 300 mV 001: 400 mV 010: 500 mV 011: 600 mV 100: 700 mV 101: 800 mV 110: 900 mV 111: 1000 mV Rev. 1.3 S i5 3 156 5. Pin Descriptions: 32-Pin QFN Figure 4. 32-Pin QFN Table 6. Si53156 32-Pin QFN Descriptions Pin # Name Type Description 1 VDD PWR 3.3 V power supply. 2 OE2 I,PU 3 VDD PWR 3.3 V Power Supply 4 OE3 I,PU Active high input pin enables DIFF3 (internal 100 k pull-up). Refer to Table 1 on page 4 for OE specifications. 5 OE4 I,PU Active high input pin enables DIFF4 (internal 100 k pull-up). Refer to Table 1 on page 4 for OE specifications. 6 OE5 I,PU Active high input pin enables DIFF5 (internal 100 k pull-up). Refer to Table 1 on page 4 for OE specifications. 7 NC NC No connect. 8 VDD 9 DIFF0 O, DIF 0.7 V, 100 MHz differential clock. 10 DIFF0 O, DIF 0.7 V, 100 MHz differential clock. 11 DIFF1 O, DIF 0.7 V, 100 MHz differential clock. Active high input pin enables DIFF2 (internal 100 k pull-up). Refer to Table 1 on page 4 for OE specifications. PWR 3.3 V power supply. Rev. 1.3 15 Si5 3156 Table 6. Si53156 32-Pin QFN Descriptions Pin # Name 12 DIFF1 13 VDD 14 DIFF2 O, DIF 0.7 V, 100 MHz differential clock. 15 DIFF2 O, DIF 0.7 V, 100 MHz differential clock. 16 VDD 17 DIFF3 O, DIF 0.7 V, 100 MHz differential clock. 18 DIFF3 O, DIF 0.7 V, 100 MHz differential clock. 19 DIFF4 O, DIF 0.7 V, 100 MHz differential clock. 20 DIFF4 O, DIF 0.7 V, 100 MHz differential clock. 21 VDD 22 DIFF5 O, DIF 0.7 V, 100 MHz differential clock. 23 DIFF5 O, DIF 0.7 V, 100 MHz differential clock. 24 VDD 25 SCLK I 26 SDATA I/O 16 Type Description O, DIF 0.7 V, 100 MHz differential clock. PWR 3.3 V power supply. PWR 3.3 V power supply. PWR 3.3 V power supply. PWR 3.3 V power supply. SMBus compatible SCLOCK. SMBus compatible SDATA. 3.3 V LVTTL input. This pin is a level sensitive strobe used to determine when latch inputs are valid and are ready to be sampled. A real-time I, PU active low input for asserting power down (PDB) and disabling all outputs (internal 100 k pull-up). 27 CKPWRGD_PDB 28 VDD 29 DIFFIN I 0.7 V Differential True Input, typically 100 MHz. Input frequency range 100 to 210 MHz. 30 DIFFIN O 0.7 V Differential Complement Input, typically 100 MHz. Input frequency range 100 to 210 MHz. 31 OE0 I,PU Active high input pin enables DIFF0 (internal 100 k pull-up). Refer to Table 1 on page 4 for OE specifications. 32 OE1 I,PU Active high input pin enables DIFF1 (internal 100 k pull-up). Refer to Table 1 on page 4 for OE specifications. 33 GND GND Ground for bottom pad of the IC. PWR 3.3 V power supply. Rev. 1.3 S i5 3 156 6. Ordering Guide Part Number Package Type Temperature Si53156-A01AGM 32-pin QFN Extended, –40 to 85 C Si53156-A01AGMR 32-pin QFN—Tape and Reel Extended, –40 to 85 C Lead-free Rev. 1.3 17 Si5 3156 7. Package Outline Figure 5 illustrates the package details for the Si53156. Table 7 lists the values for the dimensions shown in the illustration. Figure 5. 32-Pin Quad Flat No Lead (QFN) Package Table 7. Package Diagram Dimensions Dimension A A1 b D D2 e E E2 L aaa bbb ccc ddd Min 0.70 0.00 0.18 3.15 3.15 0.30 Nom 0.75 0.02 0.25 5.00 BSC 3.20 0.50 BSC 5.00 BSC 3.20 0.40 0.10 0.10 0.08 0.10 Max 0.80 0.05 0.30 3.25 3.25 0.50 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 4. Coplanarity less than 0.08 mm. 5. Terminal #1 identifier and terminal numbering convention conform to JESD 95-1 SPP-012. 18 Rev. 1.3 S i5 3 156 8. Land Pattern Figure 6 illustrates the recommended land pattern details for the Si53156 in a 32-pin QFN package. Table 8 lists the values for the dimensions shown in the illustration. Figure 6. Land Pattern Rev. 1.3 19 Si5 3156 Table 8. PCB Land Pattern Dimensions Dimension mm S1 4.01 S 4.01 L1 3.20 W1 3.20 e 0.50 W 0.26 L 0.86 Notes: General 1. All dimensions shown are in millimeters (mm). 2. This Land Pattern Design is based on the IPC-7351 guidelines. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125mm (5 mils). 3. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads. 4. A 3x3 array of 0.85mm square openings on a 1.00mm pitch can be used for the center ground pad.. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 20 Rev. 1.3 Si5 3156 DOCUMENT CHANGE LIST Revision 0.1 to Revision 1.0     Updated Features and Description. Updated Table 2. Updated Table 3. Updated Section 4.1. Revision 1.0 to Revision 1.1     Updated Features on page 1. Updated Description on page 1. Updated specs in Table 2, “AC Electrical Specifications,” on page 5. Added Land Pattern Revision 1.1 to Revision 1.2  Added condition for Clock Stabilization from Powerup, TSTABLE, in Table 2. Revision 1.2 to Revision 1.3  21 Updated Package Outline on page 18. Rev. 1.3 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. 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