SI5330J-B00223-GM

S i53 3 0 1 . 8 / 2 . 5 / 3.3 V L O W -J I T T E R, L O W -S K E W C L O C K B U F F E R/L E V E L T R A N S L A T O R Features      Supports single-ended or differential input clock signals Generates four differential (LVPECL, LVDS, HCSL) or eight single-ended (CMOS, SSTL, HSTL) outputs Provides signal level translation Differential to single-ended Single-ended to differential Differential to differential Single-ended to single-ended Wide frequency range LVPECL, LVDS: 5 to 710 MHz HCSL: 5 to 250 MHz SSTL, HSTL: 5 to 350 MHz CMOS: 5 to 200 MHz Additive jitter: 150 fs RMS typ          Output-output skew: 100 ps Propagation delay: 2.5 ns typ Single core supply with excellent PSRR: 1.8, 2.5, or 3.3 V Output driver supply voltage independent of core supply: 1.5, 1.8, 2.5, or 3.3 V Loss of Signal (LOS) indicator allows system clock monitoring Output Enable (OEB) pin allows glitchless control of output clocks Low power: 10 mA typical core current Industrial temperature range: –40 to +85 °C Small size: 24-lead, 4 x 4 mm QFN Ordering Information: See page 14. Pin Assignments Applications    High Speed Clock Distribution Ethernet Switch/Router SONET / SDH     PCI Express 2.0/3.0 Fibre Channel MSAN/DSLAM/PON Telecom Line Cards Functional Block Diagram Rev. 1.2 4/17 Copyright © 2017 by Silicon Laboratories Si5330 Si5 330 Functional Block Diagrams Based on Orderable Part Number* Figure 1. Si5330 Functional Block Diagrams *Note: See Table 11 for detailed ordering information. 2 Rev. 1.2 Si5330 TA B L E O F C O N T E N T S Section Page 1. Functional Block Diagrams Based on Orderable Part Number* . . . . . . . . . . . . . . . . . . .2 2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.1. VDD and VDDO Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.2. Loss Of Signal Indicator (LOS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.3. Output Enable (OEB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.4. Input Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.5. Output Driver Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.6. Input and Output Terminations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 4. Ordering the Si5330 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 6. Orderable Part Numbers and Device Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 7. Package Outline: 24-Lead QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 8. Recommended PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 9. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 9.1. Si5330 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 9.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Rev. 1.2 3 Si5 330 1. Electrical Specifications Table 1. Recommended Operating Conditions (VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85°C) Parameter Symbol Ambient Temperature Core Supply Voltage Output Buffer Supply Voltage Test Condition TA VDD VDDOn Min Typ Max Unit –40 25 85 °C 2.97 3.3 3.63 V 2.25 2.5 2.75 V 1.71 1.8 1.98 V 1.4 — 3.63 V Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted. Table 2. DC Characteristics (VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85°C) Parameter Core Supply Current Output Buffer Supply Current 4 Symbol Test Condition Min Typ Max Unit IDD 50 MHz refclk — 10 — mA LVPECL, 710 MHz — — 30 mA LVDS, 710 MHz — — 8 mA HCSL, 250 MHz 2 pF load capacitance — — 20 mA SSTL, 350 MHz — — 19 mA CMOS, 50 MHz 15 pF load capacitance — — 28 mA CMOS, 200 MHz 2 pF load capacitance — — 28 mA HSTL, 350 MHz — — 19 mA IDDOx Rev. 1.2 Si5330 Table 3. Performance Characteristics (VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85°C) Parameter Symbol CLKIN Loss of Signal Assert Time Test Condition tLOS CLKIN Loss of Signal De-Assert Time tLOS_B Input-to-Output Propagation Delay tPROP After initial start-up time has expired Min Typ Max Unit — 2.6 5 μs 0.01 0.2 1 μs — 2.5 4.0 ns Output-Output Skew tDSKEW Outputs at same signal format — — 100 ps POR to Output Clock Valid tSTART Start-up time for output clocks — — 2 ms Table 4. Input and Output Clock Characteristics (VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C) Parameter Symbol Test Condition Min Typ Max Units 5 — 710 MHz Input Clock (AC Coupled Differential Input Clocks on Pin IN1/2) Frequency fIN Differential Voltage Swing VPP 710 MHz input 0.4 — 2.4 VPP Rise/Fall Time tR/tF 20%–80% — — 1.0 ns Duty Cycle DC < 1 ns tr/tf 40 50 60 % Input Impedance RIN 10 — — k Input Capacitance CIN — 3.5 — pF CMOS 5 — 200 MHz HSTL, SSTL 5 — 350 MHz –0.1 — VDD V 200 MHz, Tr/Tf = 1.3 ns 0.8 — — Vpp Input Clock (DC-Coupled Single-Ended Input Clock on Pin IN3) Frequency fIN Input Voltage VI Input Voltage Swing (CMOS Standard) Rise/Fall Time tR/tF 20%–80% — — 4 ns Duty Cycle DC < 2 ns tr/tf 40 50 60 % Input Capacitance CIN — 2 — pF LVPECL, LVDS 5 — 710 MHz HCSL 5 — 250 MHz Output Clocks (Differential) Frequency fOUT Rev. 1.2 5 Si5 330 Table 4. Input and Output Clock Characteristics (Continued) (VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C) Parameter Symbol Test Condition Min Typ Max Units VOC common mode — VDDO – 1.45 V — V VSEPP peak-to-peak singleended swing 0.55 0.8 0.96 VPP VOC common mode 1.125 1.2 1.275 V VSEPP peak-to-peak singleended swing 0.25 0.35 0.45 VPP VOC common mode 0.8 0.875 0.95 V VSEPP peak-to-peak singleended swing 0.25 0.35 0.45 VPP VOC common mode 0.35 0.375 0.400 V VSEPP peak-to-peak singleended swing 0.575 0.725 0.85 VPP tR/tF 20%–80% — — 450 ps CKn < 350 MHz 45 — 55 % 350 MHz < CLKn < 710 MHz 40 — 60 % CMOS 5 — 200 MHz SSTL, HSTL 5 — 350 MHz LVPECL Output Voltage LVDS Output Voltage (2.5/3.3 V) LVDS Output Voltage (1.8 V) HCSL Output Voltage Rise/Fall Time Duty Cycle* DC Output Clocks (Single-Ended) Frequency fOUT CMOS 20%-80% Rise/Fall Time tR/tF 2 pF load — 0.45 0.85 ns CMOS 20%-80% Rise/Fall Time tR/tF 15 pF load — — 2.0 ns CMOS Output Resistance — 50 —  SSTL Output Resistance — 50 —  HSTL Output Resistance — 50 —  VDDO–0.3 — CMOS Output Voltage VOH 4 mA load VOL 4 mA load VOH VOL VOH SSTL Output Voltage VOL VOH VOL 6 SSTL-3 VDDOx = 2.97 to 3.63 V SSTL-2 VDDOx = 2.25 to 2.75 V SSTL-18 VDDOx = 1.71 to 1.98 V Rev. 1.2 V — 0.3 V 0.45xVDDO+0.41 — — V — — 0.45xVDDO –0.41 V 0.5xVDDO+0.41 — — V — — 0.5xVDDO– 0.41 V 0.5xVDDO+0.34 — — — V 0.5xVDDO– 0.34 V Si5330 Table 4. Input and Output Clock Characteristics (Continued) (VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C) Parameter Symbol Test Condition VOH HSTL Output Voltage Duty Cycle* Min Typ Max Units 0.5xVDDO +0.3 — — V — — 0.5xVDDO –0.3 V 45 — 55 % VDDO = 1.4 to 1.6 V VOL DC *Note: Input clock has a 50% duty cycle. Table 5. OEB Input Specifications Parameter Symbol Test Condition Min Typ Max Unit Input Voltage Low VIL — — 0.3 x VDD V Input Voltage High VIH 0.7 x VDD — — V Input Resistance RIN 20 — — k Table 6. Output Control Pins (LOS) (VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C) Parameter Symbol Condition Min Typ Max Unit Output Voltage Low VOL ISINK = 3 mA 0 — 0.4 V Rise/Fall Time 20–80% tR/tF CL < 10 pf, pull up 1 k — — 10 ns Table 7. Jitter Specifications (VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85°C) Parameter Symbol Test Condition Min Typ Max Unit Additive Phase Jitter (12 kHz–20 MHz) tRPHASE 0.7 V pk-pk differential input clock at 622.08 MHz with 70 ps rise/fall time — 0.150 — ps RMS Additive Phase Jitter (50 kHz–80 MHz) tRPHASEWB 0.7 V pk-pk differential input clock at 622.08 MHz with 70 ps rise/fall time — 0.225 — ps RMS Table 8. Thermal Characteristics Parameter Symbol Test Condition Value Unit Thermal Resistance Junction to Ambient JA Still Air 37 °C/W Thermal Resistance Junction to Case JC Still Air 25 °C/W Rev. 1.2 7 Si5 330 Table 9. Absolute Maximum Ratings1,2,3,4 Parameter Symbol Test Condition Value Unit DC Supply Voltage VDD –0.5 to 3.8 V Storage Temperature Range TSTG –55 to 150 °C ESD Tolerance HBM (100 pF, 1.5 k) 2.5 kV ESD Tolerance CDM 550 V ESD Tolerance MM 175 V JESD78 Compliant Latch-up Tolerance Junction Temperature TJ 150 °C Soldering Temperature (Pb-free profile)4 TPEAK 260 °C TP 20–40 sec Soldering Temperature Time at TPEAK (Pb-free profile)4 Notes: 1. Permanent device damage may occur if the Absolute Maximum Ratings are exceeded. Functional operation should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to maximum rating conditions for extended periods may affect device reliability. 2. 24-QFN package is RoHS compliant. 3. For more packaging information, go to www.silabs.com/support/quality/pages/RoHSInformation.aspx. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 8 Rev. 1.2 Si5330 2. Functional Description 2.3. Output Enable (OEB) The Si5330 is a low-jitter, low-skew fanout buffer optimized for high-performance PCB clock distribution applications. The device produces four differential or eight single-ended, low-jitter output clocks from a single input clock. The input can accept either a single-ended or a differential clock allowing the device to function as a clock level translator. The output enable (OEB) pin allows disabling or enabling of the outputs clocks (CLK0-CLK3). The output enable is logically controlled to ensure that no glitches or runt pulses are generated at the output as shown in Figure 3. 2.1. VDD and VDDO Supplies The core VDD and output VDDO supplies have separate and independent supply pins allowing the core supply to operate at a different voltage than the I/O voltage levels. The VDD supply powers the core functions of the device, which operates from 1.8, 2.5, or 3.3 V. Using a lower supply voltage helps minimize the device’s power consumption. The VDDO supply pins are used to set the output signal levels and must be set at a voltage level compatible with the output signal format. All outputs are enabled when the OEB pin is connected to ground or below the VIL voltage for this pin. Connecting the OEB pin to VDD or above the VIH level will disable the outputs. Both VIL and VIH are specified in Table 5. All outputs are forced to a logic “low” when disabled. The OEB pin is 3.3 V tolerant. 2.2. Loss Of Signal Indicator (LOS) 2.4. Input Signals The input is monitored for a valid clock signal using an LOS circuit that monitors input clock edges and declares an LOS condition when signal edges are not detected over a 1 to 5 μs observation period. The LOS pin is asserted “low” when activity on the input clock pin is present. A “high” level on the LOS pin indicates a loss of signal (LOS). The LOS pin must be pulled to VDD as shown in Figure 2. The Si5330 can accept single-ended and differential input clocks. See “AN408: Termination Options for AnyFrequency, Any-Output Clock Generators and Clock Buffers—Si5338, Si5334, Si5330” for details on connecting a wide variety of signals to the Si5330 inputs. Figure 3. OEB Glitchless Operation 2.5. Output Driver Formats The Si5330 supports single-ended output formats of CMOS, SSTL, and HSTL and differential formats of LVDS, LVPECL, and HCSL. It is normally required that the LVDS driver be dc-coupled to the 100  termination at the receiver end. If your application requires an accoupled 100  load, contact the applications team for advice. See AN408 for additional information on the terminations for these driver types. 2.6. Input and Output Terminations See AN408 for detailed information. 3. Ordering the Si5330 Figure 2. LOS Indicator with External Pull-Up The Si5330 can be ordered to meet the requirements of the most commonly-used input and output signal types, such as CMOS, SSTL, HSTL, LVPECL, LVDS, and HSCL. See Figure 1, “Si5330 Functional Block Diagrams,” on page 2 and Table 11, “Order Numbers and Device Functionality,” on page 14 for specific ordering information. Rev. 1.2 9 Si5 330 4. Pin Descriptions Note: Center pad must be tied to GND for normal operation. Table 10. Si5330 Pin Descriptions Pin # Pin Name I/O Signal Type Description 1 IN1 I Multi IN2 I Multi Si5330A/B/C/G/H/J Differential Input Devices. These pins are used as the differential clock input. IN1 is the positive input; IN2 is the negative input. Refer to “AN408: Termination Options for Any-Frequency, AnyOutput Clock Generators and Clock Buffers—Si5338, Si5334, Si5330” for interfacing and termination details. Si5330F/K/L/M Single-Ended Input Devices. These pins are not used. Leave IN1 unconnected and IN2 connected to ground. 2 10 I Multi Si5330F/K/L/M Single-Ended Devices. This is the single-ended clock input. Refer to AN408 for interfacing and termination details. Si5330A/B/C/G/H/J Differential Input Devices. This pin is not used. Connect to ground. 3 IN3 4 RSVD_GND Ground. Must be connected to system ground. 5 RSVD_GND Ground. Must be connected to system ground. 6 RSVD_GND Ground. Must be connected to system ground. Rev. 1.2 Si5330 Table 10. Si5330 Pin Descriptions (Continued) Pin # 7 8 9 10 Pin Name VDD LOS CLK3B CLK3A 11 VDDO3 12 RSVD_GND 13 CLK2B I/O VDD O O O VDD Signal Type Description Supply Core Supply Voltage. The device operates from a 1.8, 2.5, or 3.3 V supply. A 0.1 μF bypass capacitor should be located very close to this pin. Open Drain Loss of Signal Indicator. 0 = CLKIN present. 1 = Loss of signal (LOS). This pin requires an external 1kpull-up resistor. Multi Si5330A/B/C/K/L/M Differential Output Devices. This is the negative side of the differential CLK3 output. Refer to AN408 for interfacing and termination details. Leave unconnected when not in use. Si5330F/G/H/J Single-Ended Output Devices. This is one of the single-ended CLK3 outputs. Both CLK3A and CLK3B single-ended outputs are in phase. Refer to AN408 for interfacing and termination details. Leave unconnected when not is use. Multi Si5330A/B/C/K/L/M Differential Devices. This is the positive side of the differential CLK3 output. Refer to AN408 for interfacing and termination details. Leave unconnected when not in use. Si5330F/G/H/J Single-Ended Devices. This is one of the single-ended CLK3 outputs. Both CLK3A and CLK3B single-ended outputs are in phase. Refer to AN408 for interfacing and termination details. Leave unconnected when not is use. Supply Output Clock Supply Voltage. Supply voltage for CLK3A/B. Use a 0.1 μF bypass cap as close as possible to this pin. If CLK3 is not used, this pin must be tied to VDD (pin 7 and/or pin 24). Ground. Must be connected to system ground. O Multi Si5330A/B/C/K/L/M Differential Output Devices. This is the negative side of the differential CLK2 output. Refer to AN408 for interfacing and termination details. Leave unconnected when not in use. Si5330F/G/H/J Single-Ended Output Devices. This is one of the single-ended CLK2 outputs. Both CLK2A and CLK2B single-ended outputs are in phase. Refer to AN408 for interfacing and termination details. Leave unconnected when not is use. Rev. 1.2 11 Si5 330 Table 10. Si5330 Pin Descriptions (Continued) Pin # 14 15 16 17 18 19 20 12 Pin Name CLK2A VDDO2 VDDO1 CLK1B CLK1A OEB VDDO0 I/O O VDD VDD O O I VDD Signal Type Description Multi Si5330A/B/C/K/L/M Differential Devices. This is the positive side of the differential CLK2 output. Refer to AN408 for interfacing and termination details. Leave unconnected when not in use. Si5330F/G/H/J Single-Ended Devices. This is one of the single-ended CLK2 outputs. Both CLK2A and CLK2B single-ended outputs are in phase. Refer to AN408 for interfacing and termination details. Leave unconnected when not is use. Supply Output Clock Supply Voltage. Supply voltage for CLK2A/B. Use a 0.1 μF bypass cap as close as possible to this pin. If CLK2 is not used, this pin must be tied to VDD (pin 7 and/or pin 24). Supply Output Clock Supply Voltage. Supply voltage for CLK1A,B. Use a 0.1 μF bypass cap as close as possible to this pin. If CLK1 is not used, this pin must be tied to VDD (pin 7 and/or pin 24). Multi Si5330A/B/C/K/L/M Differential Output Devices. This is the negative side of the differential CLK1 output. Refer to AN408 for interfacing and termination details. Leave unconnected when not in use. Si5330F/G/H/J Single-Ended Output Devices. This is one of the single-ended CLK1 outputs. Both CLK1A and CLK1B single-ended outputs are in phase. Refer to AN408 for interfacing and termination details. Leave unconnected when not is use. Multi Si5330A/B/C/K/L/M Differential Devices. This is the positive side of the differential CLK1 output. Refer to AN408 for interfacing and termination details. Leave unconnected when not in use. Si5330F/G/H/J Single-Ended Devices. This is one of the single-ended CLK1 outputs. Both CLK1A and CLK1B single-ended outputs are in phase. Refer to AN408 for interfacing and termination details. Leave unconnected when not is use. CMOS Output Enable. All outputs are enabled when the OEB pin is connected to ground or below the VIL voltage for this pin. Connecting the OEB pin to VDD or above the VIH level will disable the outputs. Both VIL and VIH are specified in Table 5. All outputs are forced to a logic “low” when disabled. This pin is 3.3 V tolerant. Supply Output Clock Supply Voltage. Supply voltage for CLK0A,B. Use a 0.1 μF bypass cap as close as possible to this pin. If CLK2 is not used, this pin must be tied to VDD (pin 7 and/or pin 24). Rev. 1.2 Si5330 Table 10. Si5330 Pin Descriptions (Continued) Pin # 21 Pin Name CLK0B 22 CLK0A 23 RSVD_GND 24 GND PAD VDD GND I/O O O Signal Type Description Multi Si5330A/B/C/K/L/M Differential Output Devices. This is the negative side of the differential CLK0 output. Refer to AN408 for interfacing and termination details. Leave unconnected when not in use. Si5330F/G/H/J Single-ended Output Devices. This is one of the single-ended CLK0 outputs. Both CLK0A and CLK0B single-ended outputs are in phase. Refer to AN408 for interfacing and termination details. Leave unconnected when not is use. Multi Si5330A/B/C/K/L/M Differential Devices. This is the positive side of the differential CLK0 output. Refer to AN408 for interfacing and termination details. Leave unconnected when not in use. Si5330F/G/H/J Single-ended Devices. This is one of the single-ended CLK0 outputs. Both CLK0A and CLK0B single-ended outputs are in phase. Refer to AN408 for interfacing and termination details. Leave unconnected when not is use. Ground. Must be connected to system ground. VDD GND Supply Core Supply Voltage. The device operates from a 1.8, 2.5, or 3.3 V supply. A 0.1 μF bypass capacitor should be located very close to this pin. Supply Ground Pad. This is main ground connection for this device. It is located at the bottom center of the package. Use as many vias as possible to connect this pad to the main ground plane. The device will not function as specified unless this ground pad is properly connected to ground. Rev. 1.2 13 Si5 330 5. Orderable Part Numbers and Device Functionality Table 11. Order Numbers and Device Functionality Input Signal Format Output Signal Format Number of Outputs Frequency Range Si5330A-B00200-GM Differential 3.3 V LVPECL 4 5 to 710 MHz Si5330A-B00202-GM Differential 2.5 V LVPECL 4 5 to 710 MHz Si5330B-B00204-GM Differential 3.3 V LVDS 4 5 to 710 MHz Si5330B-B00205-GM Differential 2.5 V LVDS 4 5 to 710 MHz Si5330B-B00206-GM Differential 1.8 V LVDS 4 5 to 710 MHz Si5330C-B00207-GM Differential 3.3 V HCSL 4 5 to 250 MHz Si5330C-B00208-GM Differential 2.5 V HCSL 4 5 to 250 MHz Si5330C-B00209-GM Differential 1.8 V HCSL 4 5 to 250 MHz Si5330F-B00214-GM Single-Ended 3.3 V CMOS 8 5 to 200 MHz Si5330F-B00215-GM Single-Ended 2.5 V CMOS 8 5 to 200 MHz Si5330F-B00216-GM Single-Ended 1.8 V CMOS 8 5 to 200 MHz Si5330G-B00217-GM Differential 3.3 V CMOS 8 5 to 200 MHz Si5330G-B00218-GM Differential 2.5 V CMOS 8 5 to 200 MHz Si5330G-B00219-GM Differential 1.8 V CMOS 8 5 to 200 MHz Si5330H-B00220-GM Differential 3.3 V SSTL 8 5 to 350 MHz Si5330H-B00221-GM Differential 2.5 V SSTL 8 5 to 350 MHz Si5330H-B00222-GM Differential 1.8 V SSTL 8 5 to 350 MHz Differential 1.5 V HSTL 8 5 to 350 MHz Si5330K-B00224-GM Single-Ended 3.3 V LVPECL 4 5 to 350 MHz Si5330K-B00226-GM Single-Ended 2.5 V LVPECL 4 5 to 350 MHz Part Number1,2 LVPECL Buffers LVDS Buffers HCSL Buffers CMOS Buffers CMOS Buffers (Differential Input) SSTL Buffers (Differential Input) HSTL Buffers (Differential Input) Si5330J-B00223-GM LVPECL Buffers (Single-Ended Input) Notes: 1. Custom configurations with mixed output types are also available. Please contact the factory for ordering details. 2. Add an “R” to the part number to specify tape and reel shipment media. When specifying non-tape-and-reel shipment media, contact your sales representative for more information. 14 Rev. 1.2 Si5330 Table 11. Order Numbers and Device Functionality (Continued) Input Signal Format Output Signal Format Number of Outputs Frequency Range Si5330L-B00228-GM Single-Ended 3.3 V LVDS 4 5 to 350 MHz Si5330L-B00229-GM Single-Ended 2.5 V LVDS 4 5 to 350 MHz Si5330L-B00230-GM Single-Ended 1.8 V LVDS 4 5 to 350 MHz Si5330M-B00231-GM Single-Ended 3.3 V HCSL 4 5 to 250 MHz Si5330M-B00232-GM Single-Ended 2.5 V HCSL 4 5 to 250 MHz Si5330M-B00233-GM Single-Ended 1.8 V HCSL 4 5 to 250 MHz Part Number1,2 LVDS Buffers (Single-Ended Input) HCSL Buffers (Single-Ended Input) Notes: 1. Custom configurations with mixed output types are also available. Please contact the factory for ordering details. 2. Add an “R” to the part number to specify tape and reel shipment media. When specifying non-tape-and-reel shipment media, contact your sales representative for more information. Rev. 1.2 15 Si5 330 6. Package Outline: 24-Lead QFN Figure 4. 24-Lead Quad Flat No-Lead (QFN) Table 12. Package Dimensions Dimension Min Nom Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 b 0.18 0.25 0.30 D D2 4.00 BSC. 2.35 2.50 e 0.50 BSC. E 4.00 BSC. 2.65 E2 2.35 2.50 2.65 L 0.30 0.40 0.50 aaa 0.10 bbb 0.10 ccc 0.08 ddd 0.10 eee 0.05 Notes: 1. 2. 3. 4. All dimensions shown are in millimeters (mm) unless otherwise noted. Dimensioning and Tolerancing per ANSI Y14.5M-1994. This drawing conforms to the JEDEC Outline MO-220, variation VGGD-8. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 5. Terminal base alloy: Cu. 6. Terminal plating/grid array material: Au/NiPd. 7. For more packaging information, go to www.silabs.com/support/quality/pages/RoHSInformation.aspx. 16 Rev. 1.2 Si5330 7. Recommended PCB Layout Table 13. PCB Land Pattern Dimension Min Nom Max P1 2.50 2.55 2.60 P2 2.50 2.55 2.60 X1 0.20 Y1 0.75 0.25 0.80 0.30 0.85 C1 3.90 C2 3.90 E 0.50 Notes: General 1. 2. 3. 4. All dimensions shown are in millimeters (mm) unless otherwise noted. Dimensioning and Tolerancing per ANSI Y14.5M-1994 specification. This Land Pattern Design is based on the IPC-7351 guidelines. Connect the center ground pad to a ground plane with no less than five vias to a ground plane that is no more than 20 mils below it. Via drill size should be no smaller than 10 mils. A longer distance to the ground plane is allowed if more vias are used to keep the inductance from increasing. Solder Mask Design 5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. Stencil Design 6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 7. The stencil thickness should be 0.125 mm (5 mils). 8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins. 9. A 2x2 array of 1.0 mm square openings on 1.25 mm pitch should be used for the center ground pad. Card Assembly 10. A No-Clean, Type-3 solder paste is recommended. 11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components. Rev. 1.2 17 Si5 330 8. Top Marking 8.1. Si5330 Top Marking 8.2. Top Marking Explanation Mark Method: Laser Line 1 Marking: Device Part Number Line 2 Marking: X = Frequency and configuration code. Xxxxxx xxxxx = Input and output format configuration code. See "5. Orderable Part Numbers and Device Functionality" on page 14 for more information. Line 3 Marking: R = Product revision. TTTTT = Manufacturing trace code. RTTTTT Line 4 Marking: Pin 1 indicator. Circle with 0.5 mm diameter; left-justified YY = Year. WW = Work week. Characters correspond to the year and work week of package assembly. YYWW 18 Rev. 1.2 Si5330 Si5330 DOCUMENT CHANGE LIST Revision 0.1 to Revision 0.2   Clarified documentation to reflect that Pin 19 is OEB (OE Enable Low). Updated Table 4, “Jitter Specifications” on page 7. Revision 0.2 to Revision 0.3      Major editorial updates to improve clarity. Updated “Additive Jitter” Specification Table. Updated “Core Supply Current” Specification in Table 2. Removed the Low-Power LVPECL output options from the ordering table in section 5. Removed D/E ordering options. Revision 0.3 to Revision 0.35     Typo of 150 ps on front page changed to 150 fs. Updated PCB layout notes. Added no ac coupling for LVDS outputs. Changed input rise/fall time spec to 2 ns. Revision 0.35 to Revision 1.0    Added maximum junction temperature specification to Table 9 on page 8. Added minimum and maximum duty cycle specifications to Table 4 on page 5. Updated Table 3, “Performance Characteristics,” on page 5. Added Added maximum propagation delay spec (4 ns). test condition to tLOS_B in Table 3 on page 5. Removed reference to frequency in Output-Output Skew.  Updated Table 4, “Input and Output Clock Characteristics,” on page 5. Input Input    voltage (max) changed “3.63” to “VDD” voltage swing (max) change “3.63” with “—”. Added Table 6, “Output Control Pins (LOS),” on page 7. Added tape and reel ordering information to "5. Orderable Part Numbers and Device Functionality" on page 14. Added "8. Top Marking" on page 18. Revision 1.0 to Revision 1.1   Updated ordering information to refer to revision B silicon. Updated top marking explanation in section 8.2. Revision 1.1 to Revision 1.2  Removed MSL rating. Rev. 1.2 19 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. 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