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SI5350C-B06145-GT

SI5350C-B06145-GT

  • 厂商:

    SILABS(芯科科技)

  • 封装:

    TFSOP-10

  • 描述:

    IC ANY FREQ ANY OUT REF C 10MSOP

  • 数据手册
  • 价格&库存
SI5350C-B06145-GT 数据手册
S i 5 3 5 0 C -B F ACTORY - P R O G R A M M A B L E A NY - F R E Q U E N C Y C M O S C L O C K G EN ER ATOR + P L L Features          https://www.skyworksinc.com/Products/Ti ming/CMOS-Clock-Generators Generates up to 8 non-integer-related  frequencies from 2.5 kHz to 200 MHz Exact frequency synthesis at each output (0 ppm error) Glitchless frequency changes  Low output period jitter: < 70 ps pp, typ Configurable Spread Spectrum  selectable at each output User-configurable control pins:  Output Enable (OEB_0/1/2) Power Down (PDN) Frequency Select (FS_0/1) Spread Spectrum Enable (SSEN)  Loss of Lock Status (LOLB)  Supports static phase offset Rise/fall time control 10-MSOP Operates from a low-cost, fixed frequency crystal: 25 or 27 MHz Separate voltage supply pins provide level translation: Core VDD: 1.8V, 2.5 V or 3.3 V Output VDDO: 1.8 V, 2.5 V, or 3.3 V Excellent PSRR eliminates external power supply filtering Very low power consumption (25 mA core, typ) Available in three packages types: 10-MSOP: 3 outputs 16-QFN (3x3 mm): 4 output 20-QFN (4x4 mm): 8 output PCIE Gen 1 compliant Supports HCSL compatible swing 16-QFN Applications HDTV, DVD/Blu-ray, set-top box Audio/video equipment, gaming  Printers, scanners, projectors  Handheld instrumentation Residential gateways Networking/communication  Servers, storage  XO replacement     20-QFN Description The Si5350C generates free-running and/or synchronized clocks selectable on each of its outputs. A dual PLL + high resolution MultiSynthTM fractional divider architecture enables this user-definable custom timing device to generate any of the specified output frequencies at any of its outputs. This allows the Si5350C to replace a combination of crystals, crystal oscillators, and synchronized clocks (PLL). Custom Si5350C configurations can be created using ClockBuilder Pro. Ordering Information: See page 22 Functional Block Diagram Si5350C (20-QFN) Si5350C (10-MSOP) Si5350C (16-QFN) VDDO XA XA OSC PLL A MultiSynth 0 CLK0 P0 OSC PLL A XB XB PLL B CLKIN Control Logic MultiSynth 1 MultiSynth 2 XA CLK1 CLK2 CLKIN P0 P1 P2 PLL B Control Logic OSC VDDOA CLK0 XB R1 VDDOB CLK1 CLKIN R2 VDDOC CLK2 R3 VDDOD CLK3 MultiSynth 0 R0 MultiSynth 1 MultiSynth 2 MultiSynth 3 PLL B P2 P3 MultiSynth 0 VDDOA MultiSynth 1 CLK1 Control Logic CLK0 MultiSynth 2 VDDOB MultiSynth 3 CLK3 MultiSynth 4 P0 P1 PLL A MultiSynth 5 MultiSynth 6 MultiSynth 7 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 CLK2 VDDOC CLK4 CLK5 VDDOD CLK6 CLK7 Si5350C-B 1. Ordering Guide Table 1. Complete Si5350/51 Clock Generator Family Part Number I2C or Pin Frequency Reference Programmed? Outputs Data Sheet Si5351A-B-GT I2C XTAL only Blank 3 Si5351A/B/C-B Si5351A-B-GM1 I2C XTAL only Blank 4 Si5351A/B/C-B Si5351B-B-GM1 2 I C XTAL and/or Voltage Blank 4 Si5351A/B/C-B Si5351C-B-GM1 I2C XTAL and/or CLKIN Blank 4 Si5351A/B/C-B Si5351A-B-GM I2C XTAL only Blank 8 Si5351A/B/C-B Si5351B-B-GM I2C XTAL and/or Voltage Blank 8 Si5351A/B/C-B Si5351C-B-GM I2C XTAL and/or CLKIN Blank 8 Si5351A/B/C-B Si5351A-Bxxxxx-GT I2C XTAL only Factory Preprogrammed 3 Si5351A/B/C-B Si5351A-Bxxxxx-GM1 I2C XTAL only Factory Preprogrammed 4 Si5351A/B/C-B Si5351B-Bxxxxx-GM1 I2C XTAL and/or Voltage Factory Preprogrammed 4 Si5351A/B/C-B Si5351C-Bxxxxx-GM1 I2C XTAL and/or CLKIN Factory Preprogrammed 4 Si5351A/B/C-B Si5351A-Bxxxxx-GM I2C XTAL only Factory Preprogrammed 8 Si5351A/B/C-B Si5351B-Bxxxxx-GM I2C XTAL and/or Voltage Factory Preprogrammed 8 Si5351A/B/C-B Si5351C-Bxxxxx-GM I2C XTAL and/or CLKIN Factory Preprogrammed 8 Si5351A/B/C-B Si5350A-Bxxxxx-GT Pin XTAL only Factory Preprogrammed 3 Si5350A-B Si5350A-Bxxxxx-GM1 Pin XTAL only Factory Preprogrammed 4 Si5350A-B Si5350A-Bxxxxx-GM Pin XTAL only Factory Preprogrammed 8 Si5350A-B Si5350B-Bxxxxx-GT Pin XTAL and/or Voltage Factory Preprogrammed 3 Si5350B-B Si5350B-Bxxxxx-GM1 Pin XTAL and/or Voltage Factory Preprogrammed 4 Si5350B-B Si5350B-Bxxxxx-GM Pin XTAL and/or Voltage Factory Preprogrammed 8 Si5350B-B Si5350C-Bxxxxx-GT Pin XTAL and/or CLKIN Factory Preprogrammed 3 Si5350C-B Si5350C-Bxxxxx-GM1 Pin XTAL and/or CLKIN Factory Preprogrammed 4 Si5350C-B Si5350C-Bxxxxx-GM Pin XTAL and/or CLKIN Factory Preprogrammed 8 Si5350C-B 2 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 2. Technical Support Resources Table 2. Technical Support Resources Resource Si5350/51 Frequently Asked Questions ClockBuilder Pro (CBPro) Software Si535x Development Kits URL https://www.skyworksinc.com/en/Products/Timing https://www.skyworksinc.com/en/Application-Pages/ClockbuilderPro-Software https://www.skyworksinc.com/en/Products/Timing/EvaluationKits/si535x-b20qfn-evb-evaluation-kit Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 3 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B TABLE O F C ONTENTS Section Page 1. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2. Technical Support Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 3. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 4. Typical Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1. Si5350C Replaces Multiple Clocks and XOs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.2. Applying a Reference Clock at XTAL Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.3. HCSL Compatible Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6. Configuring the Si5350C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 6.1. Crystal Inputs (XA, XB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.2. External Clock Input Pin (CLKIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.3. Output Clocks (CLK0–CLK7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.4. Programmable Control Pins (P0–P3) Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.5. Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.1. 20-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 7.2. 16-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 7.3. 10-Pin MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 9. Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 9.1. 20-Pin QFN Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 9.2. Land Pattern: 20-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 9.3. 16-Pin QFN Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 9.4. Land Pattern: 16-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 9.5. 10-Pin MSOP Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 9.6. Land Pattern: 10-Pin MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 10. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 10.1. 20-Pin QFN Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 10.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 10.3. 16-Pin QFN Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 10.4. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 10.5. 10-Pin MSOP Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 10.6. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 4 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 3. Electrical Specifications Table 3. Recommended Operating Conditions Parameter Symbol Ambient Temperature TA Core Supply Voltage Output Buffer Voltage Test Condition VDD VDDOx Min Typ Max Unit –40 25 85 °C 1.71 1.8 1.89 V 2.25 2.5 2.75 V 3.0 3.3 3.60 V 1.71 1.8 1.89 V 2.25 2.5 2.75 V 3.0 3.3 3.60 V Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted. VDD and VDDOx can be operated at independent voltages. Power supply sequencing for VDD and VDDOx requires that all VDDOx be powered up either before or at the same time as VDD. Table 4. DC Characteristics (VDD = 1.8 V ±5%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C) Parameter Core Supply Current* Output Buffer Supply Current (Per Output)* Input Current Output Impedance Symbol Test Condition Min Typ Max Unit Enabled 3 outputs — 20 35 mA Enabled 4 outputs — 21 38 mA Enabled 8 outputs — 25 45 mA Power Down (PDN = VDD) — — 50 µA IDDOx CL = 5 pF — 2.2 5.6 IP1-P3 Pins P1, P2, P3 VP1-P3 < 3.6 V — — 10 µA IP0 Pin P0 — — 30 µA ZOI 3.3 V VDDO, default high drive. — 50 —  IDD mA *Note: Output clocks less than or equal to 100 MHz. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 5 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 5. AC Characteristics (VDD = 1.8 V ±5%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C) Parameter Symbol Test Condition Min Typ Max Unit Power-Up Time TRDY From VDD = VDDmin to valid output clock, CL = 5 pF, fCLKn > 1 MHz — 2 10 ms Powerup Time, PLL Bypass Mode TBYP From VDD = VDDmin to valid output clock, CL = 5 pF, fCLKn > 1 MHz — 0.5 1 ms Output Enable Time TOE From OEB assertion to valid clock output, CL = 5 pF, fCLKn > 1 MHz — — 10 µs TFREQ fCLKn > 1 MHz — — 10 µs Down spread. Selectable in 0.1% steps. –0.1 — –2.5 % Center spread. Selectable in 0.1% steps. ±0.1 — ±1.5 % 30 31.5 33 kHz Output Frequency Transition Time Spread Spectrum Frequency Deviation SSDEV Spread Spectrum Modulation Rate SSMOD_C Table 6. Input Characteristics (VDD = 1.8 V ±5%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C) Parameter Min Typ Max Units fXTAL 25 — 27 MHz P0-P3 Input Low Voltage VIL_P0-3 –0.1 — 0.3 x VDD V P0-P3 Input High Voltage VIH_P0-3 VDD = 2.5 V or 3.3 V 0.7 x VDD — 3.60 V VDD = 1.8 V 0.8 x VDD — 3.60 V CLKIN Frequency Range fCLKIN 10 — 100 MHz CLKIN Input Low Voltage VIL_CLKIN –0.1 — 0.3 x VDD V CLKIN Input High Voltage VIH_CLKIN 0.7 x VDD — 3.60 V Crystal Frequency 6 Symbol Test Condition Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 7. Output Characteristics VDD = 1.8 V ±5%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C) Parameter Frequency Range Symbol 1 Test Condition Min Typ Max Units 0.0025 — 200 MHz FCLK < 100 MHz — — 15 pF FCLK < 160 MHz, Measured at VDD/2 45 50 55 % FCLK > 160 MHz, Measured at VDD/2 40 50 60 % 20%–80%, CL = 5 pF — 1 1.5 ns VDD – 0.6 — — V — — 0.6 V 16, 20-QFN, 4 outputs running, 1 per VDDO - 40 95 ps, pk-pk 10-MSOP or 20-QFN, all outputs running - 70 155 ps, pk-pk 16, 20-QFN, 4 outputs running, 1 per VDDO — 50 90 ps, pk 10-MSOP or 20-QFN, all outputs running — 70 150 ps, pk FCLK Load Capacitance CL Duty Cycle DC Rise/Fall Time tr/tf Output High Voltage VOH Output Low Voltage VOL Period Jitter2,3 JPER Cycle-to-cycle Jitter 2,3 JCC CL = 5 pF Notes: 1. Only two unique frequencies above 112.5 MHz can be simultaneously output. 2. Measured over 10k cycles. Jitter is only specified at the default high drive strength (50  output impedance). 3. Jitter is highly dependent on device frequency configuration. Specifications represent a “worst case, real world” frequency plan; actual performance may be substantially better. Three-output 10MSOP package measured with clock outputs of 74.25, 24.576, and 48 MHz. Eight-output 20QFN package measured with clock outputs of 33.33, 74.25, 27, 24.576, 22.5792, 28.322, 125, and 48 MHz. Four-output, 16-QFN package measured with clock outputs of 33.333, 27, 28.322, and 48 MHz. Table 8. 25 MHz Crystal Requirements1,2 Parameter Symbol Min Typ Max Unit Crystal Frequency fXTAL — 25 — MHz Load Capacitance CL 6 — 12 pF rESR — — 150  dL 100 — — µW Equivalent Series Resistance Crystal Max Drive Level Notes: 1. Crystals which require load capacitances of 6, 8, or 10 pF should use the device’s internal load capacitance for optimum performance. A crystal with a 12 pF load capacitance requirement should use a combination of the internal 10 pF load capacitance in addition to external 2 pF load capacitance (e.g., by using 4 pF capacitors on XA and XB). ClockBuilder Pro can be used to configure the internal load capacitors. 2. Refer to “AN551: Crystal Selection Guide” for more details. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 7 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 9. 27 MHz Crystal Requirements1,2 Parameter Symbol Min Typ Max Unit Crystal Frequency fXTAL — 27 — MHz Load Capacitance CL 6 — 12 pF rESR — — 150  dL 100 — — µW Equivalent Series Resistance Crystal Max Drive Level Notes: 1. Crystals which require load capacitances of 6, 8, or 10 pF should use the device’s internal load capacitance for optimum performance. A crystal with a 12 pF load capacitance requirement should use a combination of the internal 10 pF load capacitance in addition to external 2 pF load capacitance (e.g., by using 4 pF capacitors on XA and XB). ClockBuilder Pro can be used to configure the internal load capacitors. 2. Refer to “AN551: Crystal Selection Guide” for more details. Table 10. Thermal Characteristics (2-Layer Board) Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Board Thermal Resistance Junction to Top Center Symbol JA ΨJB ΨJT Test Condition Still Air1 Still Air1 Still Air1 Package Value Unit 10-MSOP 150 °C/W 16-QFN 103 °C/W 20-QFN 74.9 °C/W 10-MSOP 82 °C/W 16-QFN 37 °C/W 20-QFN 9.94 °C/W 10-MSOP 0.84 °C/W 16-QFN 4.26 °C/W 20-QFN 1.3 °C/W Notes: 1. Based on environment and board designed per JESD51-2A and JESD51-3. 8 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 11. Thermal Characteristics (4-Layer Board) Parameter Thermal Resistance Junction to Ambient Symbol JA JB Test Condition Still Air1 Junction to Board2 Thermal Resistance Junction to Board ΨJB Thermal Resistance Junction to Top Center ΨJT Still Air1 Still Air1 Package Value Unit 10-MSOP 126 °C/W 16-QFN 65 °C/W 20-QFN 41 °C/W 10-MSOP 84 °C/W 16-QFN 48 °C/W 20-QFN 16 °C/W 10-MSOP 83 °C/W 16-QFN 31 °C/W 20-QFN 8.1 °C/W 10-MSOP 0.74 °C/W 16-QFN 3.8 °C/W 20-QFN 0.98 °C/W Package Value Unit 10-MSOP 36 °C/W 16-QFN 82 °C/W 20-QFN 51 °C/W Notes: 1. Based on environment and board designed per JESD51-2A, JESD51-5, and JESD51-7. 2. Based on conditions set in JESD51-8. Table 12. Thermal Characteristics (Junction-to-Case) Parameter Thermal Resistance Junction to Case1 Symbol JC Test Condition Still Air Notes: 1. Based on board designed per JESD51-1 (Top center of packages used). Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 9 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 13. Absolute Maximum Ratings1 Parameter DC Supply Voltage Input Voltage Symbol Test Condition VDD_max Value Unit –0.5 to 3.8 V VIN_CLKIN CLKIN –0.5 to 3.8 V VIN_P1-3 Pins P1, P2, P3 –0.5 to 3.8 V VIN_P0 P0 –0.5 to (VDD + 0.3) V VIN_XA/B Pins XA, XB –0.5 to 1.3 V V Junction Temperature TJ –55 to 150 °C Soldering Temperature (Pb-free profile)2 TPEAK 260 °C TP 20–40 Sec Soldering Temperature Time at TPEAK (Pb-free profile)2 Notes: 1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The device is compliant with JEDEC J-STD-020. 10 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 4. Typical Application 4.1. Si5350C Replaces Multiple Clocks and XOs The Si5350C is a clock generation device that provides both synchronous and free-running clocks for applications where power, board size, and cost are critical. An example application is shown in Figure 1. Any other combination is possible. Free-running Clocks XA 27 MHz OSC XB PLL Multi Synth 0 Multi Synth 1 Multi Synth 2 CLKIN PLL 54 MHz Multi Synth 3 Multi Synth 4 Multi Synth 5 Si5350C CLK0 125 MHz CLK1 48 MHz CLK2 28.322 MHz Ethernet PHY USB Controller HDMI Port CLK3 74.25 MHz CLK4 74.25/1.001 MHz CLK5 24.576 MHz Video/Audio Processor Synchronous Clocks Figure 1. Replacing multiple XTAL/XOs and PLLs with one Si5350C 4.2. Applying a Reference Clock at XTAL Input The Si5350C can be driven with a clock signal through the XA input pin. This is especially useful when in need of generating clock outputs in two synchronization domains; one reference clock can be provided at the CLKIN pin and at XA. VIN = 1 VPP 25/27 MHz XA 0.1 µF XB PLLA Multi Synth 0 Multi Synth 1 OSC PLLB Note: Float the XB input while driving the XA input with a clock Multi Synth N Figure 2. Si5350C Driven by a Clock Signal Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 11 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 4.3. HCSL Compatible Outputs The Si5350C can be configured to support HCSL compatible swing when the VDDO of the output pair of interest is set to 2.5 V (i.e., VDDOA must be 2.5 V when using CLK0/1; VDDOB must be 2.5 V for CLK2/3 and so on). The circuit in the figure below must be applied to each of the two clocks used, and one of the clocks in the pair must also be inverted to generate a differential pair. This functionality is only supported for the Si5350C in 10MSOP or 20-QFN packages. PLLA Multi Synth 0 ZO = 50  0 R1 511  240  OSC PLLB Multi Synth 1 ZO = 50  0 HCSL CLKIN R1 511  240  Multi Synth N R2 R2 Note: The complementary -180 degree out of phase output clock is generated using the INV function Figure 3. Si5350C Output is HCSL Compatible 12 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 5. Functional Description The architecture of the Si5350C generates up to eight non-integer-related frequencies in any combination of freerunning and/or synchronous clocks. A block diagram of the 3-, 4-, and 8-output versions shown in Figure 4. Freerunning clocks are generated using the on-chip oscillator + PLL, and the clock input pin (CLKIN) provides an external input reference for the synchronous clocks. Each MultiSynthTM is configurable with two frequencies (F1_x, F2_x). This allows a pin controlled glitchless frequency change at each output (CLK0 to CLK2). 10-MSOP XA OSC XB VDDO VDD MultiSynth 0 F1_0 PLL A F2_0 VDD R0 MultiSynth 0 F1_0 FS PLL B CLKIN MultiSynth 1 F1_1 F2_1 R1 CLK1 MultiSynth 2 F1_2 Control Logic F2_2 XA F2_0 OSC XB FS P0 20-QFN CLK0 R2 CLK2 PLL A PLL PLL vcxo B B CLKIN FS MultiSynth 1 F1_1 F2_1 MultiSynth 2 F1_2 F2_2 MultiSynth 3 VDD 16-QFN MultiSynth 0 F1_0 F2_0 OSC MultiSynth 1 F1_1 PLL B CLKIN F2_1 R0 R1 FS P1 F1_2 R2 VDDOC P0 VDDOB P1 CLK1 P2 R4 MultiSynth 5 F1_5 CLK5 R5 Control Logic VDDOD MultiSynth 6 F1_6 CLK4 R6 MultiSynth 7 CLK6 F1_7 CLK2 CLK7 R7 VDDOD MultiSynth 3 F1_3 MultiSynth 4 CLK3 VDDOC Control Logic P2 CLK0 P3 MultiSynth 2 P0 F1_4 CLK2 R3 MultiSynth 4 VDDOA FS PLL A VDDOB R2 MultiSynth 3 F1_3 XB CLK1 R1 FS GND CLK0 FS FS XA VDDOA R0 R3 GND CLK3 GND Figure 4. Block Diagrams of 3-Output, 4-Output, and 8-Output Si5350C Devices Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 13 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 6. Configuring the Si5350C The Si5350C is a factory-programmed custom clock generator that is user-definable with ClockBuilder Pro, which provides a simple graphical interface that allows users to enter input and output frequencies along with other custom features, as described in the following sections. All synthesis calculations are automatically performed by ClockBuilder Pro to ensure an optimum configuration. A unique part number is assigned to each custom configuration. 6.1. Crystal Inputs (XA, XB) The Si5350C uses an optional fixed-frequency non-pullable standard AT-cut crystal as a reference to generate free-running output clocks. Note that a XTAL is not required for generating synchronous clocks that are locked to CLKIN. 6.1.1. Crystal Frequency The Si5350C can operate using either a 25 MHz or a 27 MHz crystal. 6.1.2. Internal XTAL Load Capacitors Internal load capacitors are provided to eliminate the need for external components when connecting a XTAL to the Si5350C. The total internal XTAL load capacitance (CL) can be selected to be 0, 6, 8 or 10 pF. XTALs with alternate load capacitance requirements are supported using additional external load capacitance  2 pF (e.g., by using  4 pF capacitors on XA and XB) as shown in Figure 5. XA XB Optional additional external load capacitance (< 2 pF) Optional internal load capacitance 0, 6, 8,10 pF Figure 5. External XTAL with Optional Load Capacitors 6.2. External Clock Input Pin (CLKIN) The external clock input is used as a reference for generating synchronous clocks. The input frequency can be specified from 10 to 100 MHz including fractional frequencies (e.g., 74.25 MHz x 1000/1001). The ClockBuilder utility automatically determines the exact synthesis ratio to guarantee an output frequency with 0 ppm error with respect to its reference. 6.3. Output Clocks (CLK0–CLK7) The Si5350C is orderable as a 3-output (10-MSOP), 4-output (16-QFN), or 8-output (20-QFN) clock generator. Output clocks CLK0 to CLK2 can be ordered with two clock frequencies (F1_x, F2_x) which are selectable with the optional frequency select pins (FS0/1). See “6.4.3. Frequency Select (FS_0, FS_1)” for more details on the operation of the frequency select pins. Each output clock can select its reference for either of the PLLs. 6.3.1. Output Clock Frequency Outputs can be configured at any frequency from 2.5 kHz up to 200 MHz. However, only two unique frequencies above 112.5 MHz can be simultaneously output. For example, 125 MHz (CLK0), 130 MHz (CLK1), and 150 MHz (CLKx) is not allowed. Note that multiple copies of frequencies above 112.5 MHz can be provided, for example, 125 MHz could be provided on four outputs (CLKS0-3) simultaneously with 130 MHz on four different outputs (CLKS4-7). 14 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 6.3.2. Spread Spectrum Spread spectrum can be enabled on any of the clock outputs that use PLLA as its reference. Spread spectrum is useful for reducing electromagnetic interference (EMI). Enabling spread spectrum on an output clock modulates its frequency, which effectively reduces the overall amplitude of its radiated energy. Note that spread spectrum is not available on clocks synchronized to PLLB. The Si5350C supports several levels of spread spectrum allowing the designer to choose an ideal compromise between system performance and EMI compliance. If the CLKIN pin already has spread spectrum applied to it, it will get passed through to the outputs that are referenced to it. In this case, do not configure the synchronous outputs for spread spectrum as the device will erroneously try to add additional spread to them. An optional spread spectrum enable pin (SSEN) is configurable to enable or disable the spread spectrum feature. See “6.4.1. Spread Spectrum Enable (SSEN)” for details. Reduced Amplitude and EMI Reduced Amplitude and EMI Center Frequency Amplitude fc fc fc No Spread Spectrum Center Spread Down Spread Figure 6. Available Spread Spectrum Profiles 6.3.3. Invert/Non-Invert By default, each of the output clocks are generated in phase (non-inverted) with respect to each other. An option to invert any of the clock outputs is also available. 6.3.4. Output State When Disabled There are up to three output enable pins configurable on the Si5350C as described in “6.4.4. Output Enable (OEB_0, OEB_1, OEB_2)” . The output state when disabled for each of the outputs is configurable as output high, output low, or high-impedance. 6.3.5. Powering Down Unused Outputs Unused clock outputs can be completely powered down to conserve power. 6.4. Programmable Control Pins (P0–P3) Options Up to four programmable control pins (P0-P3) are configurable allowing direct pin control of the following features: 6.4.1. Spread Spectrum Enable (SSEN) An optional control pin allows disabling the spread spectrum feature for all outputs that were configured with spread spectrum enabled. Hold SSEN low to disable spread spectrum. The SSEN pin provides a convenient method of evaluating the effect of using spread spectrum clocks during EMI compliance testing. 6.4.2. Power Down (PDN) An optional power down control pin allows a full shutdown of the Si5350C to minimize power consumption when its output clocks are not being used. The Si5350C is in normal operation when the PDN pin is held low and is in power down mode when held high. Power consumption when the device is in power down mode is indicated in Table 4 on page 5. 6.4.3. Frequency Select (FS_0, FS_1) The Si5350C offers the option of configuring up to two frequencies per clock output (CLK0–CLK2) for either freerunning or synchronous clocks. This is a useful feature for applications that need to support more than one freerunning or synchronous clock rate on the same output. An example of this is shown in Figure 7. The FS pins select which frequency is generated from the clock output. In this example, FS0 selects the output frequency on CLK0 and FS1 selects the frequency on CLK1. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 15 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 27 MHz FS0 Bit Level F1_0: 74.25 MHz 1 F2_0: 74.25 MHz 1.001 FS1 Bit Level XA Free-running Frequency 0 FS0 FS1 Synchronous Frequency 0 F1_1: 24.576 MHz 1 F2_1: 22.5792 MHz XB CLK0 Si5350C Synchronous Clock CLK1 54MHz Free-running Clock 74.25 MHz 1.001 74.25 MHz or 24.576 MHz or 22.5792 MHz Video/Audio Processor CLKIN Figure 7. Example of Generating Two Clock Frequencies from the Same Clock Output Up to two frequency select pins are available on the Si5350C. Each of the frequency select pins can be linked to CLK0, 1, and 2 for 20-QFN and 10-MSOP devices. 16-QFN devices allow frequency select on CLK0 and CLK1. See Figure 8 for an example of a potential 20-QFN frequency select configuration. In this example, FS_0 is linked to control clock frequency selection on CLK0; FS_1 can be used to control clock frequency selection on CLK1 and CLK2. Any other combination is also possible. The frequency select feature is not available for CLK3/4/5/6/7 in 20QFN devices or for CLK2/3 in 16-QFN devices. The Si5350C uses control circuitry to ensure that frequency changes are glitchless. This ensures that the clock always completes its last cycle before starting a new clock cycle of a different frequency. Customizable FS Control FS FS FS_0 Output Frequency 0 F1_0 1 F2_0 FS_0 FS Glitchless Frequency Changes MultiSynth 0 CLK0 MultiSynth 1 CLK1 MultiSynth 2 CLK2 New frequency starts at its leading edge Frequency _A CLK3 FS_1 Output Frequency 0 F1_1, F1_2 1 F2_1, F2_2 CLK4 FS_1 Cannot be controlled by FS pins Frequency _B Frequency_A CLKx CLK5 CLK6 Full cycle completes before changing to a new frequency CLK7 Figure 8. Example Configuration of a Pin-Controlled Frequency Select (FS) 16 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 6.4.4. Output Enable (OEB_0, OEB_1, OEB_2) Up to three output enable pins (OEB_0/1/2) are available on the Si5350C. Each OEB pin can be linked to any of the output clocks. In the example shown in Figure 9, OEB_0 is linked to control CLK0, CLK3, and CLK5; OEB_1 is linked to control CLK6 and CLK7, and OEB_2 is linked to control CLK1, CLK2, CLK4, and CLK5. Any other combination is also possible. If more than one OEB pin is linked to the same CLK output, the pin forcing a disable state will be dominant. Clock outputs are enabled when the OEB pin is held low. The output enable control circuitry ensures glitchless operation by starting the output clock cycle on the first leading edge after OEB is asserted (OEB = low). When OEB is released (OEB = high), the clock is allowed to complete its full clock cycle before going into a disabled state. This is shown in Figure 9. When disabled, the output state is configurable as disabled high, disabled low, or disabled in high-impedance. Customizable OEB Control Glitchless Output Enable CLK0 OEB_0 0 1 Output State CLK Enabled CLK Disabled OEB OEB_0 CLK1 OEB Clock starts on the first leading edge CLK2 OEB OEB_1 0 1 Output State CLK Enabled CLK Disabled Clock continues until cycle is complete CLK3 OEB_1 CLKx OEB CLK4 OEB OEBx CLK5 OEB OEB_2 0 1 Output State CLK Enabled CLK Disabled OEB_2 CLK6 OEB CLK7 OEB Figure 9. Example Configuration of a Pin-Controlled Output Enable 6.4.5. Loss Of Lock (LOLB) A loss of lock pin (LOLB) is available to indicate the status of the synchronous clock outputs. The LOLB pin is set to a high state when the synchronous clock outputs are locked to the clock input (CLKIN). This is the normal operating state for the synchronous clocks. The LOLB pin will go low when the reference clock at the CLKIN input is removed or if its frequency deviates by more than 2000 ppm from its defined center frequency. In this case, the synchronous clocks will continue to free-run. An option to disable the synchronous output clocks during an LOLB condition (LOLB pin = low) is available. This only affects the clock outputs that were designated as synchronous clock outputs. An external pull up resistor (recommended 10 kohms) is needed on LOLB as it is an open-drain signal, not a push-pull output. 6.5. Design Considerations The Si5350C is a self-contained clock generator that requires very few external components. The following general guidelines are recommended to ensure optimum performance. 6.5.1. Power Supply Decoupling/Filtering The Si5350C has built-in power supply filtering circuitry to help keep the number of external components to a minimum. All that is recommended is one 0.1 to 1.0 µF decoupling capacitor per power supply pin. This capacitor should be mounted as close to the VDD and VDDO pins as possible without using vias. 6.5.2. Power Supply Sequencing The VDD and VDDOx (i.e., VDDO0, VDDO1, VDDO2, VDDO3) power supply pins have been separated to allow flexibility in output signal levels. Power supply sequencing for VDD and VDDOx requires that all VDDOx be powered up either before or at the same time as VDD. Unused VDDOx pins should be tied to VDD. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 17 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 6.5.3. External Crystal The external crystal should be mounted as close to the pins as possible using short PCB traces. The XA and XB traces should be kept away from other high-speed signal traces. See “AN551: Crystal Selection Guide” for more details. 6.5.4. External Crystal Load Capacitors The Si5350C provides the option of using internal and external crystal load capacitors. If external load capacitors are used, they should be placed as close to the XA/XB pads as possible. See “AN551: Crystal Selection Guide” for more details. 6.5.5. Unused Pins Unused control pins (P0–P3) should be tied to GND. Unused CLKIN pin should be tied to GND. Unused XA/XB pins should be left floating. Refer to "4.2. Applying a Reference Clock at XTAL Input" on page 11 when using XA as a clock input pin. Unused output pins (CLK0–CLK7) should be left unconnected. Unused VDDOx pins should be tied to VDD. 6.5.6. Trace Characteristics The Si5350C features various output drive strength settings. It is recommended to configure the trace characteristics as shown in Figure 10 when the default high output drive setting is used. ZO = 50 ohms R = 0 ohms CLK (Optional resistor for EMI management) Figure 10. Recommended Trace Characteristics with Default Drive Strength Setting 18 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 7. Pin Descriptions XA 1 XB 2 16 CLK6 17 CLK5 18 VDDOC 19 CLK4 20 VDD 7.1. 20-Pin QFN GND PAD 15 CLK7 14 VDDOD 13 CLK0 VDDOA VDDOB 10 11 9 5 CLK2 P2 8 CLK1 CLK3 12 7 4 P3 P1 6 3 CLKIN P0 Figure 11. Si5350C 20-QFN Top View Table 14. Si5350C 20-QFN Pin Descriptions Pin Name Pin Number Pin Type Function XA 1 I Input pin for external XTAL. XB 2 I Input pin for external XTAL. CLKIN 6 I External reference clock input. CLK0 13 O Output Clock 0. CLK1 12 O Output Clock 1. CLK2 9 O Output Clock 2. CLK3 8 O Output Clock 3. CLK4 19 O Output Clock 4. CLK5 17 O Output Clock 5. CLK6 16 O Output Clock 6. CLK7 15 O Output Clock 7. P0 3 I User configurable pin 0. See Section 6.4. P1 4 I User configurable pin 1. See Section 6.4. P2 5 I User configurable pin 2. See Section 6.4. P3 7 I User configurable pin 3. See Section 6.4. VDD 20 P Core voltage supply pin. See Section 6.5.2. VDDOA 11 P Output voltage supply pin for CLK0 and CLK1. See Section 6.5.2. VDDOB 10 P Output voltage supply pin for CLK2 and CLK3. See Section 6.5.2. VDDOC 18 P Output voltage supply pin for CLK4 and CLK5. See Section 6.5.2. VDDOD 14 P Output voltage supply pin for CLK6 and CLK7. See Section 6.5.2. GND Center Pad P Ground. Note: Pin Types: I = Input, O = Output, P = Power Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 19 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 13 CLK2 14 VDDOC 15 GND 16 VDD 7.2. 16-Pin QFN XA 1 12 CLK3 XB 2 11 VDDOD GND PAD P0 3 10 CLK0 5 6 7 8 CLKIN CLK1 VDDOB 9 VDDOA P2 P1 4 Figure 12. Si5350C 16-Pin QFN Top View Table 15. Si5350C 16-QFN Pin Descriptions Pin Name Pin Number Pin Type* Function XA 1 I Input pin for external crystal. XB 2 I Input pin for external crystal. P0 3 I User configurable input P0. See Section 6.4. P1 4 I User configurable input P1. See Section 6.4. P2 5 I User configurable input P2. See Section 6.4. CLKIN 6 I External reference clock input. CLK1 7 O Output Clock 1. VDDOB 8 P Output voltage supply pin for CLK1. See Section 6.5.2. VDDOA 9 P Output voltage supply pin for CLK0. See Section 6.5.2. CLK0 10 O Output Clock 0. VDDOD 11 P Output voltage supply pin for CLK3. See Section 6.5.2. CLK3 12 O Output Clock 3. CLK2 13 O Output Clock 2. VDDOC 14 P Output voltage supply pin for CLK2. See Section 6.5.2. GND 15 GND VDD 16 P GND PAD Center Pad GND Ground. Core voltage supply pin. See Section 6.5.2. Ground pad. Use multiple vias to ensure a solid path to Ground. *Note: I = Input, O = Output, P = Power; GND = Ground. Input pins are not internally pulled up. 20 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 7.3. 10-Pin MSOP VDD 1 10 CLK0 XA 2 9 CLK1 XB 3 8 GND P0 4 7 VDDO CLKIN 5 6 CLK2 Figure 13. Si5350C 10-MSOP Top View Table 16. Si5350C 10-MSOP Pin Descriptions Pin Name Pin Number Pin Type Function XA 2 I Input pin for external XTAL. XB 3 I Input pin for external XTAL. CLKIN 5 I External reference clock input. CLK0 10 O Output clock 0. CLK1 9 O Output clock 1. CLK2 6 O Output clock 2. P0 4 I User configurable pin 0. See Section 6.4. VDD 1 P Core voltage supply pin. See Section 6.5.2. VDDO 7 P Output voltage supply pin for CLK0, CLK1, and CLK2. See Section 6.5.2. GND 8 P Ground. Note: Pin Types: I = Input, O = Output, P = Power Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 21 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 8. Ordering Information Factory programmed Si5350B devices can be requested through ClockBuilder Pro. A unique part number is assigned to each custom configuration as indicated in Figure 14. Use ClockBuilder Pro to create custom part numbers or consult a Skyworks Solutions sales representative for other custom NVM configurations. The Si5351x-B20QFN-EVB evaluation kit, along with ClockBuilder Pro, enables easy testing of any Si5350B frequency plan. ClockBuilder Pro makes it simple to emulate all three Si5350B packages, including the 10-MSOP, 20-QFN, and 16-QFN, on the same evaluation board. Si5350C BXXXXX XXX Blank = Coil Tape R = Tape and Reel GT = 10-MSOP GM1 = 16-QFN GM = 20-QFN B = Product Revision B XXXXX = Unique Custom Code . A five character code will be as signed for each unique custom configuration Evaluation Boards Si535x-B20QFN-EVB For evaluation of: Si5350C-Bxxxxx-GM (20-QFN) Si5350C-Bxxxxx-GM1 (16-QFN) Si5350C-Bxxxxx-GT (10-MSOP) Figure 14. Custom Clock Part Numbers 22 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 9. Packaging 9.1. 20-Pin QFN Package Outline Seating Plane Figure 15 illustrates the package details for the Si5350C-B in a 20-pin QFN package. Table 17 lists the values for the dimensions shown in the illustration. C D2 B D A D2/2 A1 L E E2 E2/2 A b e Figure 15. 20-pin QFN Package Drawing Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 23 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 17. Package Dimensions Dimension A Min 0.80 Nom 0.85 Max 0.90 A1 0.00 — 0.05 b D D2 e E E2 L 0.20 0.30 2.65 0.35 0.25 4.00 BSC 2.70 0.50 BSC 4.00 BSC 2.70 0.40 2.75 0.45 aaa — — 0.10 bbb — — 0.10 ccc — — 0.08 ddd — — 0.10 2.65 2.75 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to JEDEC Outline MO-220, variation VGGD-5. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 24 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 9.2. Land Pattern: 20-Pin QFN Figure 16 shows the recommended land pattern details for the Si5350 in a 20-Pin QFN package. Table 18 lists the values for the dimensions shown in the illustration. Figure 16. 20-Pin QFN Land Pattern Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 25 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 18. PCB Land Pattern Dimensions Symbol Millimeters C1 4.0 C2 4.0 E 0.50 BSC X1 0.30 X2 2.70 Y1 0.80 Y2 2.70 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This land pattern design is based on IPC-7351 guidelines. Solder Mask Design 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.125 mm (5 mils). 6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 7. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be used for the center ground pad. Card Assembly 8. A No-Clean, Type-3 solder paste is recommended. 9. The recommended card reflow profile is per the JEDEC/IPC J-STD020 specification for Small Body components. 26 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 9.3. 16-Pin QFN Package Outline Figure 17 illustrates the package details for the Si5350C-B in a 16-QFN package. Table 19 lists the values for the dimensions shown in the illustration. Figure 17. 16-Pin QFN Package Drawing Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 27 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 19. Package Dimensions Dimension Min Nom Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 A3 b 0.20 REF. 0.18 D D2 0.25 0.30 3.0 BSC 1.70 1.80 e 0.50 BSC E 3.0 BSC 1.90 E2 1.70 1.80 1.90 L 0.25 0.35 0.45 K 0.20 — — R 0.09 — 0.14 aaa 0.15 bbb 0.10 ccc 0.10 ddd 0.05 eee 0.08 fff 0.10 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 28 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 9.4. Land Pattern: 16-Pin QFN Figure 18 shows the recommended land pattern details for the Si5350 in a 16-QFN package. Table 20 lists the values for the dimensions shown in the illustration. Figure 18. 16-Pin QFN Land Pattern Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 29 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 20. PCB Land Pattern Dimensions Symbol Millimeters C1 3.00 C2 3.00 E 0.50 X1 0.30 Y1 0.75 X2 1.80 Y2 1.80 Notes: General 1. All dimensions shown are in millimeters (mm). 2. This land pattern design is based on IPC-7351 guidelines. 3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 6. The stencil thickness should be 0.125 mm (5 mils). 7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 8. A 2x2 array of 0.65 mm square openings on a 0.90 mm pitch should be used for the center ground pad. Card Assembly 9. A No-Clean, Type-3 solder paste is recommended. 10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body components. 11. The above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine-tune their SMT process as required for their application and tooling. 30 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 9.5. 10-Pin MSOP Package Outline Figure 19 illustrates the package details for the Si5350C-B in a 10-pin MSOP package. Table 21 lists the values for the dimensions shown in the illustration. Figure 19. 10-pin MSOP Package Drawing Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 31 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 21. 10-MSOP Package Dimensions Dimension A A1 A2 b c D E E1 e L L2 q aaa bbb ccc ddd Min — 0.00 0.75 0.17 0.08 0.40 0 — — — — Nom — — 0.85 — — 3.00 BSC 4.90 BSC 3.00 BSC 0.50 BSC 0.60 0.25 BSC — — — — — Max 1.10 0.15 0.95 0.33 0.23 0.80 8 0.20 0.25 0.10 0.08 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-137, Variation C 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 32 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 9.6. Land Pattern: 10-Pin MSOP Figure 20 shows the recommended land pattern details for the Si5350C-B in a 10-Pin MSOP package. Table 22 lists the values for the dimensions shown in the illustration. Figure 20. 10-Pin MSOP Land Pattern Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 33 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Table 22. PCB Land Pattern Dimensions Symbol Millimeters Min Max C1 4.40 REF E 0.50 BSC G1 3.00 — X1 — 0.30 Y1 Z1 1.40 REF — 5.80 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ASME Y14.5M-1994. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05mm. Solder Mask Design 5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 7. The stencil thickness should be 0.125 mm (5 mils). 8. The ratio of stencil aperture to land pad size should be 1:1. Card Assembly 9. A No-Clean, Type-3 solder paste is recommended. 10. The recommended card reflow profile is per the JEDEC/IPC J-STD020C specification for Small Body components. 34 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 10. Top Marking 10.1. 20-Pin QFN Top Marking Figure 21. 20-Pin QFN Top Marking 10.2. Top Marking Explanation Mark Method: Laser Pin 1 Mark: Filled Circle = 0.50 mm Diameter (Bottom-Left Corner) Font Size: 0.60 mm (24 mils) Line 1 Mark Format Device Part Number Si5350 Line 2 Mark Format: TTTTTT = Mfg Code* Manufacturing Code from the Assembly Purchase Order Form. Line 3 Mark Format: YY = Year WW = Work Week Assigned by the Assembly House. Corresponds to the year and work week of the assembly date. *Note: The code shown in the “TTTTTT” line does not correspond to the orderable part number or frequency plan. It is used for package assembly quality tracking purposes only. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 35 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 10.3. 16-Pin QFN Top Marking Figure 22. 16-Pin QFN Top Marking 10.4. Top Marking Explanation Mark Method: Laser Pin 1 Mark: Circle (Bottom-Left Corner) Font Size: 0.60 mm (24 mils) Line 1 Mark Format Device Part Number 5350 Line 2 Mark Format: TTTT = Mfg Code* Manufacturing Code from the Assembly Purchase Order Form. Line 3 Mark Format: YWW = Date Code Assigned by the Assembly House. Y = Last digit of the current year. WW = Work week of the assembly date. *Note: The code shown in the “TTTT” line does not correspond to the orderable part number or frequency plan. It is used for package assembly quality tracking purposes only. 36 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B 10.5. 10-Pin MSOP Top Marking Figure 23. 10-Pin MSOP Top Marking 10.6. Top Marking Explanation Mark Method: Laser Pin 1 Mark: Mold Dimple (Bottom-Left Corner) Font Size: 0.60 mm (24 mils) Line 1 Mark Format Device Part Number 5350 Line 2 Mark Format: TTTT = Mfg Code* Line 2 from the “Markings” section of the Assembly Purchase Order form. Line 3 Mark Format: YWW = Date Code Assigned by the Assembly House. Y = Last Digit of Current Year (Ex: 2013 = 3) WW = Work Week of Assembly Date. *Note: The code shown in the “TTTT” line does not correspond to the orderable part number or frequency plan. It is used for package assembly quality tracking purposes only. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 37 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B REVISION HISTORY Revision 1.2 March, 2020         Added "1. Ordering Guide" on page 2. Updated "3. Electrical Specifications" on page 5. Updated Tables 5, 7, 12, and 13 to include 16-QFN parameters. Updated thermal characteristics tables to include Table 10 (2-Layer Board), Table 11 (4-Layer Board), and Table 12 (Junction-to-Case). Updated "4. Typical Application" on page 11. Updated "4.3. HCSL Compatible Outputs" on page 12. Updated "5. Functional Description" on page 13. Updated "6. Configuring the Si5350C" on page 14. Updated "6.3. Output Clocks (CLK0–CLK7)" on page 14. Updated "6.4.3. Frequency Select (FS_0, FS_1)" on page 15. Updated "6.5.5. Unused Pins" on page 18. Updated "7. Pin Descriptions" on page 19. Added 16-QFN information. Updated "8. Ordering Information" on page 22. Updated EVB and 16-QFN information. Updated "9. Packaging" on page 23. Added 16-QFN information. Revision 1.1 August, 2018  Updated "8. Ordering Information" on page 22. Changed “Blank = Bulk” to “Blank = Coil Tape” in Figure 14. Revision 1.0 April, 2015            Extended frequency range from 8 MHz-160 MHz to 2.5 kHz-200 MHz. Added 1.8V VDD support. Updated block diagrams for clarity. Added complete Si5350/51 family table, Table 1. Added top mark information. Added landing pattern drawings. Added PowerUp Time, PLL Bypass, Table 5. Clarified Down Spread step sizes in Table 5. Updated max jitter specs (typ unchanged) in Table 7. Clarified power supply sequencing requirement, Section 6.5.2. Updated 4.4.5 Loss of Lock (LOLB) section. Revision 0.76 October, 2013 Updated Table 5 on page 6. Updated spread-spectrum frequency deviation parameter test condition and minimum spec value.  Updated “8. Ordering Information” . Updated Figure 14, “Custom Clock Part Numbers,” on page 22.  38 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 Si5350C-B Revision 0.75 October, 2012  Initial release. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 39 Rev. 1.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 22, 2021 ClockBuilder Pro Customize Skyworks clock generators, jitter attenuators and network synchronizers with a single tool. With CBPro you can control evaluation boards, access documentation, request a custom part number, export for in-system programming and more! www.skyworksinc.com/CBPro Portfolio SW/HW Quality Support & Resources www.skyworksinc.com/ia/timing www.skyworksinc.com/CBPro www.skyworksinc.com/quality www.skyworksinc.com/support Copyright © 2021 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. 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Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of Skyworks’ published specifications or parameters. Skyworks, the Skyworks symbol, Sky5®, SkyOne®, SkyBlue™, Skyworks Green™, Clockbuilder®, DSPLL®, ISOmodem®, ProSLIC®, and SiPHY® are trademarks or registered trademarks of Skyworks Solutions, Inc. or its subsidiaries in the United States and other countries. Third-party brands and names are for identification purposes only and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. | Nasdaq: SWKS | sales@skyworksinc.com | www.skyworksinc.com USA: 781-376-3000 | Asia: 886-2-2735 0399 | Europe: 33 (0)1 43548540 |
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