Si7013
I 2 C H UMIDITY A N D TW O - Z ONE TEMPERATURE S ENSOR
Features
Precision Relative Humidity Sensor
± 3% RH (max), 0–80% RH
High Accuracy Temperature Sensor
±0.4 °C (max), –10 to 85 °C
0 to 100% RH operating range
Up to –40 to +125 °C operating
range
Low Voltage Operation (1.9 to 3.6 V)
Low Power Consumption
150 µA active current
60 nA standby current
Factory-calibrated
I2C Interface
Integrated on-chip heater
Auxiliary Sensor input
Direct readout of remote
thermistor temperature in °C
Package: 3x3 mm DFN
Excellent long term stability
Optional factory-installed cover
Low-profile
Protection during reflow
Excludes liquids and particulates
Si7013
Ordering Information:
See page 35.
Applications
HVAC/R
Thermostats/humidistats
Instrumentation
White goods
Micro-environments/data centers
Industrial Controls
Indoor weather stations
Pin Assignments
Top View
Description
The Si7013 I2C Humidity and 2-Zone Temperature Sensor is a monolithic CMOS
IC integrating humidity and temperature sensor elements, an analog-to-digital
converter, signal processing, calibration data, and an I2C Interface. The patented
use of industry-standard, low-K polymeric dielectrics for sensing humidity enables
the construction of low-power, monolithic CMOS Sensor ICs with low drift and
hysteresis, and excellent long term stability.
The humidity and temperature sensors are factory-calibrated and the calibration
data is stored in the on-chip non-volatile memory. This ensures that the sensors
are fully interchangeable, with no recalibration or software changes required.
SDA
1
10
AD0/VOUT
2
9 VDDD
SCL
GNDD
3
8 VDDA
GNDA
4
7
VINN
VSNS
5
6
VINP
Patent Protected. Patents pending
An auxiliary sensor input with power management can be tied directly to an
external thermistor network or other voltage-output sensor. On-board logic
performs calibration/linearization of the external input using user-programmable
coefficients. The least-significant bit of the Si7013's I2C address is programmable,
allowing two devices to share the same bus.
The Si7013 is available in a 3x3 mm DFN package and is reflow solderable. The
optional factory-installed cover offers a low profile, convenient means of protecting
the sensor during assembly (e.g., reflow soldering) and throughout the life of the
product, excluding liquids (hydrophobic/oleophobic) and particulates.
The Si7013 offers an accurate, low-power, factory-calibrated digital solution ideal
for measuring humidity, dew-point, and temperature, in applications ranging from
HVAC/R and asset tracking to industrial and consumer platforms.
Rev. 0.95 11/13
Copyright © 2013 by Silicon Laboratories
Si7013
This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Si7013
Functional Block Diagram
VSNS
Vdd
1.25V
Ref
Calibration
Memory
Si7013
Humidity
Sensor
AD0/VOUT
Temp
Sensor
VINP
VINN
Control Logic
ADC
Analog
Input
I2C Interface
GND
2
Rev. 0.95
SDA
SCL
Si7013
TABLE O F C ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1. Relative Humidity Sensor Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.2. Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.3. Prolonged Exposure to High Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
4.4. PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.5. Protecting the Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.6. Bake/Hydrate Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.7. Long Term Drift/Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.1. Issuing a Measurement Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.2. Reading and Writing User Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.3. Measuring Analog Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.4. Nonlinear Correction of Voltage Inputs: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.5. Firmware Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.6. Heater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.7. Electronic Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
6. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
6.1. Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7. Pin Descriptions: Si7013 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
9.1. Package Outline: 3x3 10-pin DFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
9.2. Package Outline: 3x3 10-pin DFN with Protective Cover . . . . . . . . . . . . . . . . . . . . . 38
10. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
11. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
11.1. Si7013 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
12. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Rev. 0.95
3
Si7013
1. Electrical Specifications
Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.
Table 1. Recommended Operating Conditions
Parameter
Symbol
Power Supply
Test Condition
Min
Typ
Max
Unit
1.9
—
3.6
V
VDD
Operating Temperature
TA
I and Y grade
–40
—
+125
°C
Operating Temperature
TA
G grade
–40
—
+85
°C
Table 2. General Specifications
1.9 < VDD < 3.6 V; TA = –40 to 85 °C (G grade) or –40 to 125 °C (I/Y grade); default conversion time unless otherwise noted.
Symbol
Test Condition
Min
Typ
Max
Unit
Input Voltage High
VIH
AD0, SCL, SDA, VSNS pins
0.7xVDD
—
—
V
Input Voltage Low
VIL
AD0, SCL, SDA, VSNS pins
—
—
0.3xVDD
V
Input Voltage Range
VIN
SCL, SDA, RSTb pins with respect to
GND
0.0
—
VDD
V
Input Leakage
IIL
SCL, SDA pins; VIN = GND
—
—
1
μA
Parameter
VSNS pin (200K nominal pull up);
Vin = GND
Output Voltage Low
Output Voltage High
VOL
VOH
IDD
—
—
0.6
V
SDA pin; IOL = 1.2 mA;
VDD = 1.9 V
—
—
0.4
V
—
—
V
VDD– 0.1
—
—
V
VOUT pin, IOH = –1.7 mA, VDD = 3.0 V VDD – 0.4
RH conversion in progress
—
—
—
V
150
180
μA
—
90
120
μA
—
0.06
0.62
μA
—
0.06
3.8
μA
—
3.5
4.0
mA
—
3.5
4.0
mA
—
3.1 to 94.2
—
mA
VOUT pin, IOH = –0.5 mA, VDD = 2.0 V VDD – 0.2
Temperature conversion in progress
Standby, –40 to +85
°C2
Standby, –40 to +125 °C
2
Peak IDD during powerup
3
Peak IDD during I2C operations4
Heater Current
5
μA
SDA pin; IOL = 2.5 mA; VDD = 3.3 V
VOUT pin, IOH = –10 μA
Current Consumption
5xVDD
IHEAT
Notes:
1. Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will
be tCONV(RH) + tCONV(T).
2. No conversion or I2C transaction in progress. Typical values measured at 25 °C.
3. Occurs once during powerup. Duration is in6, out = out5+slope5*(in-in5)/256
Else if in >in7, out = out6+slope6*(in-in6)/256
Else if in >in8, out = out7+slope7*(in-in7)/256
Else if in >in9, out = out8+slope8*(in-in8)/256
Else out = out9+slope9*(in-in9)
Rev. 0.95
25
Si7013
5.4.2. Entering Lookup Table Values into OTP Memory:
The table is entered into memory addresses 0x82 – 0xB7 one byte at a time. Until the OTP has been programmed,
all memory addresses default to a value of 0xFF. The table below indicates where the values are written:
Table 16. Lookup Table Memory Map
Name
Memory
Location
Name
Memory
Location
Name
Memory
Location
Input1 (MSB)
0x82
Output1 (MSB)
0x94
Slope1 (MSB)
0xA6
Input1 (LSB)
0x83
Output1 (LSB)
0x95
Slope1 (LSB)
0xA7
Input2 (MSB)
0x84
Output2 (MSB)
0x96
Slope2 (MSB)
0xA8
Input2 (LSB)
0x85
Output2 (LSB)
0x97
Slope2 (LSB)
0xA9
Input3 (MSB)
0x86
Output3 (MSB)
0x98
Slope3 (MSB)
0xAA
Input3 (LSB)
0x87
Output3 (LSB)
0x99
Slope3 (LSB)
0xAB
Input4 (MSB)
0x88
Output4 (MSB)
0x9A
Slope4 (MSB)
0xAC
Input4 (LSB)
0x89
Output4 (LSB)
0x9B
Slope4 (LSB)
0xAD
Input5 (MSB)
0x8A
Output5 (MSB)
0x9C
Slope5 (MSB)
0xAE
Input5 (LSB)
0x8B
Output5 (LSB)
0x9D
Slope5 (LSB)
0xAF
Input6 (MSB)
0x8C
Output6 (MSB)
0x9E
Slope6 (MSB)
0xB0
Input6 (LSB)
0x8D
Output6 (LSB)
0x9F
Slope6 (LSB)
0xB1
Input7 (MSB)
0x8E
Output7 (MSB)
0xA0
Slope7 (MSB)
0xB2
Input7 (LSB)
0x8F
Output7 (LSB)
0xA1
Slope7 (LSB)
0xB3
Input8 (MSB)
0x90
Output8 (MSB)
0xA2
Slope8 (MSB)
0xB4
Input8 (LSB)
0x91
Output8 (LSB)
0xA3
Slope8 (LSB)
0xB5
Input9 (MSB)
0x92
Output9 (MSB)
0xA4
Slope9 (MSB)
0xB6
Input9 (LSB)
0x93
Output9 (LSB)
0xA5
Slope9 (LSB)
0xB7
The command code 0xC5 is used for programming, so for example, to program a Si7013 at slave address 0x40
with the 16-bit value 0x4C2F, starting at memory location 0x82, you would write:
0x40 W ACK 0xC5 ACK 0x82 ACK 0x4C ACK
0x40 W ACK 0xC5 ACK 0x83 ACK 0x2F ACK
The internal memory is one-time-programmable, so it is not possible to change the values once written. However,
to verify the values were written properly use command 0x84. For example, to verify that 0x4C was written to
location 0x82 use
0x40 W ACK 0x84 ACK 0x82 ACK 0x40R ACK 0x4C NACK where 0x4C is the expected return value of the read transaction.
26
Rev. 0.95
Si7013
5.4.3. Example Thermistor Calculations
For the Si7013 evaluation board with a 10 K ohm thermistor and two 24.3 K ohm bias resistors and assuming the
A/D conversion is done using VDD as a reference with buffered inputs, the ideal input voltage versus temperature
is:
Vin = VDD *Rthemistor/(Rthermisor+46.4 K)
Since VDD is also the reference then the expected A/D conversion result is:
A/D counts = 32768* Rthemistor/(Rthermisor+46.4 K)
If it is desired to linearize this result for the same temperature representation as the on board temperature sensor:
Temperature °C = (Output_Code*175.72/65536 – 46.85), then the desired output code is:
Output_Code = 65536*(Temperature+46.85)/175.72
Using thermistor data sheet values of resistance versus temperature and choosing to linearize at the points –15C,
–5C, 5C, 15C, 25C, 35C, 45C, 55C, 65C and 75C results in the following. The values in gray are the table entries
for Si7013:
Table 17. Example Non-Linear Correction to Thermistor Voltage Measurements
Temperature
(Degrees C)
Thermistor
Resistance
Vin/VDD
A/D
Codes
Desired
Code
Slope
Table Entry
–15
71746
0.596164
19535
11879
–218
1
–5
41813
0.462467
15154
15608
–241
2
5
25194
0.34141
11187
19338
–298
3
15
15651
0.243592
7982
23067
–400
4
25
10000
0.170648
5592
26797
–563
5
35
6556
0.118863
3895
30527
–813
6
45
4401
0.83036
2721
34256
–1186
7
55
3019
0.058486
1916
37986
–1739
8
65
2115
0.041704
1367
41715
–2513
9
75
1509
0.030114
75
45445
Rev. 0.95
27
Si7013
Once the table entry values are calculated, they should be programmed to the Si7013 memory locations as shown
below:
Table 18. Example Non-Linear Thermistor Correction Entries into Si7013 Memory
Memory
Location
A/D
Codes
Value
Memory
Location
Desired
Codes
Value
Memory
Location
Slope
Value
82
19535
4C
94
11879
2E
A6
–218
FF
4F
95
67
A7
3B
96
3C
A8
32
97
F8
A9
2B
98
4B
AA
B3
99
8A
AB
1F
9A
5A
AC
2E
9B
1B
AD
15
9C
68
AE
D8
9D
Ad
AF
F
9E
77
B0
37
9F
3F
B1
A
A0
85
B2
A1
A1
D0
B3
7
A2
94
B4
7C
A3
62
B5
5
A4
A2
B6
57
A5
F3
B7
83
84
15154
85
86
11187
87
88
7982
89
8A
5592
8B
8C
3895
8D
8E
2721
8F
90
1916
91
92
93
28
1367
15608
19338
23067
26797
30527
34256
37986
41715
Rev. 0.95
26
–241
FF
0F
–298
FE
D6
–400
FE
70
–563
FD
CD
–813
FC
D3
–1186
FB
5E
–1739
F9
35
–2513
F6
2F
Si7013
5.5. Firmware Revision
The internal firmware revision can be read with the following I2C transaction:
S
Slave
Address
W
A
R
0x84
A
A
FWREV
0xB8
A
NA
A
S
Slave
Address
P
The upper nibble of the FWREV byte corresponds to the major firmware revision number, while the lower nibble of
the FWREV byte corresponds to the minor firmware revision number. Therefore, firmware revision 1.0 would be
encoded as 0x10 in the FWREV byte.
5.6. Heater
The Si7013 contains an integrated resistive heating element that may be used to raise the temperature of the
sensor. This element can be used to test the sensor, to drive off condensation, or to implement dew-point
measurement when the Si7013 is used in conjunction with a separate temperature sensor such as another Si7013
(the heater will raise the temperature of the internal temperature sensor).
The heater can be activated using HEATER[2:0], the three least-significant bits in User Register 3. Turning on the
heater will reduce the tendency of the humidity sensor to accumulate an offset due to "memory" of sustained high
humidity conditions. Five different power levels are available. The various settings are described in Table 18.
Table 19. Heater Control Settings
HEATER[3:0] Typical Current
Draw* (mA)
0000
3.09
0001
9.18
0010
15.24
...
...
0100
27.39
...
...
1000
51.69
...
...
1111
94.20
*Note: Assumes VDD = 3.3 V.
Rev. 0.95
29
Si7013
5.7. Electronic Serial Number
The Si7013 provides a serial number individualized for each device that can be read via the I2C serial interface.
Two I2C commands are required to access the device memory and retrieve the complete serial number. The
command sequence, and format of the serial number response is described in the figure below:
Master
Slave
First access:
S
Slave Address
W
ACK
0x3A
ACK
0X0F
ACK
S
Slave Address
R
ACK
SNA_3
ACK
CRC
ACK
SNA_2
ACK
CRC
ACK
SNA_1
ACK
CRC
ACK
SNA_0
ACK
CRC
NACK
S
Slave Address
W
ACK
0x3C
ACK
0X09
ACK
S
Slave Address
R
ACK
SNB_3
ACK
SNB_2
ACK
CRC
ACK
SNB_1
ACK
SNB_0
ACK
CRC
NACK
P
2nd access:
P
The format of the complete serial number is 64-bits in length, divided into 8 data bytes. The complete serial number
sequence is shown below:
SNA_3
SNA_2
SNA_1
SNA_0
SNB_3
SNB_2
SNB_1
SNB_0
The SNB3 field contains the device identification to distinguish between the different Silicon Labs relative humidity
and temperature devices. The value of this field maps to the following devices according to this table:
0x00 or 0xFF engineering samples
0x0D=13=Si7013
0x14=20=Si7020
0x15=21=Si7021
30
Rev. 0.95
Si7013
6. Control Registers
Table 20. Register Summary
Register
Bit 7
Bit 6
User Register 1
RES1
VDDS
User Register 2
User Register 3
Bit 5
Bit 4
Bit 3
RSVD
MEASURE
_MODE1
MEASURE_
MODE0
CONV_
TIME
RSVD
RSVD
Bit 2
Bit 1
Bit 0
HTRE
RSVD
RES0
VIN_BUF
VREFP
VOUT
HEATER[3:0]
Notes:
1. Any register not listed here is reserved and must not be written.The result of a read operation on these registers is
undefined.
2. Except where noted, reserved register bits must always be written as zero; the result of a read operation on these bits
is undefined.
Rev. 0.95
31
Si7013
6.1. Register Descriptions
Register 1. User Register 1
Bit
D7
D6
Name
RES1
VDDS
Type
R/W
R
D5
D4
D3
D2
D1
D0
RSVD
HTRE
RSVD
RES0
R/W
R/W
R/W
R/W
Reset Settings = 0011_1010
Bit
Name
D7; D0
RES[1:0]
D6
Function
Measurement Resolution:
RH
00:
12 bit
01:
8 bit
10:
10 bit
11:
11 bit
VDDS
VDD Status:
0:
1:
Temp
14 bit
12 bit
13 bit
11 bit
VDD OK
VDD Low
The minimum recommended operating voltage is 1.9 V. A transition of the VDD status bit from 0 to 1 indicates that VDD is
between 1.8 V and 1.9 V. If the VDD drops below 1.8 V, the
device will no longer operate correctly.
D5, D4, D3
RSVD
Reserved
D2
HTRE
1=On-chip Heater Enable
0=On-chip Heater Disable
D1
RSVD
Reserved
Register 2. User Register 2
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Name
RSVD
MEASURE_
MODE1
MEASURE_
MODE0
CONV_
TIME
RSVD
VIN_BUF
VREFP
VOUT
Type
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset Settings = 0000_100x
32
Rev. 0.95
Si7013
Bit
Name
D7
RSVD
D6:D5
MEASURE_MODE
[1:0]
Function
Reserved
Measurement Mode. Selects the mode of the voltage measurement
function.
D6
D5
Function
0
0
Voltage measurement hold master mode without
thermistor correction. This is the recommended
mode when temperature or humidity measurements are done.
0
1
Voltage measurement hold master mode with
thermistor correction. No humidity or internal temperature measurements are allowed in this mode.
1
0
Voltage measurement no hold master mode with no
thermistor correction.
1
1
Voltage measurement no hold master mode with
thermistor correction. No humidity or internal temperature measurements are allowed in this mode.
Note: If no hold master mode is selected, ALL commands are no hold.
D4
CONV_TIME
Conversion Time. Selects conversion time and noise floor of the
voltage ADC.
0
Conversion time 7 ms max noise floor 25 µV typical with
VREF = 1.25 V.
1
Conversion time 3.1 ms max noise floor 50 µV typical
with VREF = 1.25 V.
D3
RSVD
Reserved
D2
VIN_BUF
0: VINN and VINP inputs are unbuffered
1: VINN and VINP inputs are buffered
D1
VREFP
0: A/D reference source is internal 1.25V
1: A/D reference source is VDDA
D0
VOUT*
0: VOUT pin is set to GNDD
1: VOUT pin is set to VDDD
Note: Default is powerup state of VOUT pin
*Note: VOUT is generally used for driving an external thermistor interface. Default setting is the same as the power up
setting.
Rev. 0.95
33
Si7013
Register 3. User Register 3
Bit
D7
D6
D5
D4
D3
D2
Name
RSVD
Heater [3:0]
Type
R/W
R/W
Reset Settings = 0000_0000
Bit
D3:D0
Name
HEATER[3:0]
Function
Heater Current
D3
D2
D1
D0
0
0
0
0
3.09 mA
0
0
0
1
9.18 mA
0
0
1
0
15.24 mA
0
27.39 mA
0
51.69 mA
1
94.20 mA
...
0
1
0
...
1
0
0
...
1
D7,D6,
D5,D4
34
D1
RSVD
1
1
Reserved
Rev. 0.95
D0
Si7013
7. Pin Descriptions: Si7013 (Top View)
SDA
1
10
AD0/VOUT
2
9 VDDD
GNDD
3
8 VDDA
GNDA
4
7
VINN
VSNS
5
6
VINP
SCL
Pin Name
Pin #
Pin Description
SDA
1
I2C data.
AD0/VOUT
2
Dual function pin.
This pin can be switched high or low and is generally used to drive an external
thermistor interface.
On powerup, this pin acts as a device address select pin. Tie high or low to set device
address LSB.
See Figure 5 and Figure 6.
GNDD
3
Digital ground. This pin is connected to ground on the circuit board.
GNDA
4
Analog ground. This pin is connected to ground on the circuit board.
VSNS
5
Voltage Sense Input. Tie to VDD.*
VINP
6
Analog to digital converter positive input.
VINN
7
Analog to digital converter negative input.
VDDA
8
Analog power. This pin is connected to power on the circuit board.
VDDD
9
Digital power. This pin is connected to power on the circuit board.
SCL
10
I2C clock
TGND
Paddle
This pad is connected to GND internally. This pad is the main thermal input to the onchip temperature sensor. The paddle should be soldered to a floating pad.
*Note: VSNS must be high at power up or device will be held in reset.
Rev. 0.95
35
Si7013
8. Ordering Guide
Table 21. Device Ordering Guide
P/N
Description
Max. Accuracy
Temp
RH
Pkg
Operating
Range (°C)
Protective
Cover
Packing
Format
Si7013-A10-GM
Digital temperature/ humidity sensor
±0.4 °C
± 3%
DFN 6
–40 to +85 °C
N
Tube
Si7013-A10-GMR
Digital temperature/ humidity sensor
±0.4 °C
± 3%
DFN 6
–40 to +85 °C
N
Tape
& Reel
Si7013-A10-GM1
Digital temperature/ humidity sensor
±0.4 °C
± 3%
DFN 6
–40 to +85 °C
Y
Cut Tape
Si7013-A10-GM1R
Digital temperature/ humidity sensor
±0.4 °C
± 3%
DFN 6
–40 to +85 °C
Y
Tape &
Reel
Si7013-A10-IM
Digital temperature/ humidity sensor—
industrial temp range
±0.4 °C
± 3%
DFN 6
–40 to +125 °C
N
Tube
Si7013-A10-IMR
Digital temperature/ humidity sensor—
industrial temp range
±0.4 °C
± 3%
DFN 6
–40 to +125 °C
N
Tape &
Reel
Si7013-A10-IM1
Digital temperature/ humidity sensor—
industrial temp range
±0.4 °C
± 3%
DFN 6
–40 to +125 °C
Y
Cut Tape
Si7013-A10-IM1R
Digital temperature/ humidity sensor—
industrial temp range
±0.4 °C
± 3%
DFN 6
–40 to +125 °C
Y
Tape &
Reel
Si7013-A10-YM
Digital temperature/ humidity sensor—
automotive
±0.4 °C
± 3%
DFN 6
–40 to +125 °C
N
Tube
Si7013-A10-YMR
Digital temperature/ humidity sensor—
automotive
±0.4 °C
± 3%
DFN 6
–40 to +125 °C
N
Tape &
Reel
Si7013-A10-YM1
Digital temperature/ humidity sensor—
automotive
±0.4 °C
± 3%
DFN 6
–40 to +125 °C
Y
Cut Tape
Si7013-A10-YM1R
Digital temperature/ humidity sensor—
automotive
±0.4 °C
± 3%
DFN 6
–40 to +125 °C
Y
Tape
& Reel
36
Rev. 0.95
Si7013
9. Package Outline
9.1. Package Outline: 3x3 10-pin DFN
Figure 11 illustrates the package details for the Si7013. Table 21 lists the values for the dimensions shown in the
illustration.
Figure 11. 10-pin DFN Package Drawing
Table 22. 10-Pin DFN Package Dimensions
Dimension
Min
Nom
Max
Dimension
Min
Nom
Max
A
0.70
0.75
0.80
H2
1.39
1.44
1.49
A1
0.00
0.02
0.05
L
0.50
0.55
0.60
b
0.18
0.25
0.30
aaa
0.10
bbb
0.10
ccc
0.05
D
D2
3.00 BSC.
1.20
1.30
1.40
e
0.50 BSC.
ddd
0.10
E
3.00 BSC.
eee
0.05
fff
0.05
E2
2.40
2.50
2.60
H1
0.85
0.90
0.95
Notes:
1. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
2. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Rev. 0.95
37
Si7013
9.2. Package Outline: 3x3 10-pin DFN with Protective Cover
Figure 12 illustrates the package details for the Si7013 with the optional protective cover. Table 22 lists the values
for the dimensions shown in the illustration.
Figure 12. 10-pin DFN with Protective Cover
Table 23. 10-pin DFN with Protective Cover Diagram Dimensions
Dimension
Min
Nom
Max
Dimension
Min
Nom
Max
A
—
—
1.21
F1
2.80
2.85
2.90
A1
0.00
0.02
0.05
F2
2.80
2.85
2.90
A2
0.70
0.75
0.80
h
0.76
0.83
0.90
b
0.18
0.25
0.30
L
0.50
0.55
0.60
R1
0.45
0.50
0.55
D
D2
3.00 BSC.
1.20
1.30
1.40
0.10
e
0.50 BSC.
bbb
0.10
E
3.00 BSC.
ccc
0.05
ddd
0.10
eee
0.05
E2
2.40
2.50
2.60
Notes:
1. All dimensions shown are in millimeters (mm).
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
38
aaa
Rev. 0.95
Si7013
10. PCB Land Pattern and Solder Mask Design
Table 24. PCB Land Pattern Dimensions
Symbol
mm
C1
2.80
E
0.50
P1
1.40
P2
2.60
X1
0.30
Y1
1.00
Notes:
General
1. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Stencil Design
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
be used to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
7. A 2x1 array of 0.95 mm square openings on 1.25 mm pitch should be used for the
center ground pad to achieve a target solder coverage of 50%.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
for Small Body Components.
Rev. 0.95
39
Si7013
11. Top Marking
11.1. Si7013 Top Marking
11.2. Top Marking Explanation
40
Mark Method:
Laser
Pin 1 Indicator:
Circle = 0.30 mm Diameter
Upper-Left Corner
Font Size:
0.30 mm
Line 1 Marking:
TTTT = Mfg Code
Rev. 0.95
Si7013
12. Additional Reference Resources
AN607:
Si70xx Humidity Sensor Designer’s Guide
Rev. 0.95
41
Si7013
Added Section 5.5. Firmware Revision
Updated Section 6. Control Registers
Updated Table 21. Device Ordering Guide
DOCUMENT CHANGE LIST
Revision 0.1 to Revision 0.6
Updates to Section 1. Electrical Specifications.
Updated Table 2. General Specifications.
Updated Figure 1. I2C Interface Timing Diagram.
Updated Table 6. Voltage Converter Specifications.
Updated Table 7. Thermal Characteristics.
Updated Section 2. Typical Applications Circuits.
Updated Figure 5. Typical Application Circuit for
Thermistor Interface with AD0 = 1.
Updated Table 15. I2C Command Table.
Updated Section 4.4 PCB Assembly.
Updated Section 5.3 Measuring Relative Humidity.
Updated Section 5.4 Measuring Temperature.
Updated Section 5.6 Nonlinear Correction of Voltage
Inputs.
Updated Section 5.7 Heater.
Removed Section 5.8 Device Identification and
added device identification information to Section
5.9.
Updated Section 6. Control Registers.
Updated Section 9. Package Outline.
Updated Section 11. Top Marking.
Revision 0.6 to Revision 0.95
Updated Table 1. Recommended Operating
Conditions
Updated Table 2. General Specifications
Updated Table 3. I2C Interface Specifications
Updated Table 4 Humidity Sensor
Updated Table 5. Temperature Sensor
Updated Table 8. Absolute Maximum Ratings
Updated Figure 5. Typical Application Circuit for
Thermistor Interface with AD0 = 1
Updated Figure 6. Typical Application Circuit for
Thermistor Interface with AD0 = 0
Updated Figure 8. Si7013 Block Diagram
Updated Section 4.1. Relative Humidity Sensor
Accuracy
Updated Section 4.4.1. Soldering
Updated Table 15. Analog Input Ranges
Updated Section 5.1. Issuing a Measurement
Command
Updated Section 5.2. Reading and Writing User
Registers
Updated Section 5.4. Nonlinear Correction of
Voltage Inputs
Rev. 0.95
42
Si7013
CONTACT INFORMATION
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Please visit the Silicon Labs Technical Support web page:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx
and register to submit a technical support request.
Patent Notice
Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analogintensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team.
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where
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Rev. 0.95
43
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