SI7051-A20-IM

S i7050/1/3/4/5-A 20 / 1 I 2 C TE M P E R A T U R E S E N S O R S Features  High Accuracy Temperature Sensors ±0.1 °C (max) ±0.3 °C (max) Si7054: ±0.4 °C (max) Si7055: ±0.5 °C (max) Si7050: ±1.0 °C (max)  Si7051: Si7053:   Wide operating voltage (1.9 to 3.6 V) –40 to +125 °C operating range  Accuracy maintained over the entire operating temperature and voltage range Low Power Consumption 195 nA average current @ 1 Hz sample rate     14-bit resolution Factory calibrated I2C interface 3x3 mm DFN package Ordering Information: See page 19. Applications      HVAC/R Thermostats White goods Computer equipment Portable consumer devices      Asset tracking Cold chain storage Battery protection Industrial controls Medical equipment Pin Assignments Top View Description The Si705x Digital Temperature Sensors offer industry-leading low power consumption and high accuracy across the entire operating voltage and temperature range. These monolithic CMOS ICs feature a band-gap temperature sensor element, an analog-to-digital converter with up to 14bit resolution, signal processing, calibration data, and an I2C interface. The patented use of novel signal processing and analog design enables the sensors to maintain their accuracy over a wide temperature and voltage range, while consuming very little current. The temperature sensors are factory-calibrated and the calibration data is stored in the on-chip non-volatile memory. This ensures that the sensors are fully interchangeable, with no recalibration or software changes required. Patent Protected. Patents pending The Si705x devices are available in a 3x3 mm DFN package, and the industry-standard I2C interface can operate at up to 400 kHz. Requiring just 195 nA of average current when sampled once per second, the Si705x can operate for several years with just a single coin cell battery. The Si705x devices offer an accurate, low-power, factory-calibrated digital solution ideal for measuring temperature in applications ranging from HVAC/R and asset tracking to industrial and consumer platforms. Rev. 1.2 11/21 Copyright © 2021 by Silicon Laboratories Si7050/1/3/4/5-A20/1 Si7 050/1/ 3/ 4/ 5- A20/ 1 Functional Block Diagram 2 Rev. 1.2 Si7 0 5 0 /1 /3 /4 /5 -A 20/1 TA B L E OF CONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 5. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 5.1. Issuing a Measurement Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 5.2. Reading and Writing User Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 5.3. Electronic Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 5.4. Firmware Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 6. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 6.1. Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 7. Pin Descriptions: Si705x (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 9. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 9.1. Package Outline: 3x3 6-Pin DFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 10. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 11. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 11.1. Si705x Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 11.3. Si7055-A20-ZM (Matte Tin Finish Lead Frame) Top Marking . . . . . . . . . . . . . . . . .23 11.4. Si7055-A20-ZM (Matte Tin Finish Lead Frame) Top Marking Explanation . . . . . . .23 12. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Rev. 1.2 3 Si7 050/1/ 3/ 4/ 5- A20/ 1 1. Electrical Specifications Unless otherwise specified, all min/max specifications apply over the recommended operating conditions. Table 1. Recommended Operating Conditions Symbol Parameter Power Supply Operating Temperature Test Condition Min Typ Max Unit VDD 1.9 — 3.6 V TA –40 — +125 °C Table 2. General Specifications 1.9 < VDD < 3.6 V; TA = –40 to 125 °C default conversion time unless otherwise noted. Parameter Symbol Test Condition Min Typ Max Unit Input Voltage High VIH SCL, SDA pins 0.7 x VDD — — V Input Voltage Low VIL SCL, SDA pins — — 0.3 x VDD V Input Voltage Range VIN SCL, SDA pins with respect to GND 0.0 — VDD V Input Leakage IIL SCL, SDA pins — — 1 μA VOL SDA pin; IOL = 2.5 mA; VDD = 3.3 V — — 0.6 V SDA pin; IOL = 1.2 mA; VDD = 1.9 V — — 0.4 V Temperature conversion in progress — 90 120 μA — 0.06 0.62 μA — 0.06 3.8 μA — 3.5 4.0 mA Peak IDD during I2C operations3 — 3.5 4.0 mA 14-bit temperature — 7 10.8 ms 13-bit temperature — 4 6.2 ms 12-bit temperature — 2.4 3.8 ms 11-bit temperature — 1.5 2.4 ms From VDD ≥ 1.9 V to ready for a conversion, 25 °C — 18 25 From VDD ≥ 1.9 V to ready for a conversion, full temperature range — — 80 After issuing a software reset command — 5 15 Output Voltage Low Current Consumption IDD Standby, –40 to +85 °C 1 Standby, –40 to +125 °C 1 Peak IDD during powerup Conversion Time Powerup Time tCONV tPU 2 ms Notes: 1. No conversion or I2C transaction in progress. Typical values measured at 25 °C. 2. Occurs once during powerup. Duration is 200 kHz for 2-byte commands). 4 Rev. 1.2 Si7 0 5 0 /1 /3 /4 /5 -A 20/1 Table 3. I2C Interface Specifications1 1.9  VDD  3.6 V; TA = –40 to +125 °C unless otherwise noted. Parameter Symbol Test Condition Min Typ Max Unit Hysteresis VHYS High-to-low versus low-tohigh transition 0.05 x VDD — — V SCLK Frequency2 fSCL — — 400 kHz SCL High Time tSKH 0.6 — — μs SCL Low Time tSKL 1.3 — — μs Start Hold Time tSTH 0.6 — — μs Start Setup Time tSTS 0.6 — — μs Stop Setup Time tSPS 0.6 — — μs Bus Free Time tBUF 1.3 — — μs SDA Setup Time tDS 100 — — ns SDA Hold Time tDH 100 — — ns SDA Valid Time tVD;DAT From SCL low to data valid — — 0.9 μs tVD;ACK From SCL low to data valid — — 0.9 μs 50 — — ns SDA Acknowledge Valid Time Suppressed Pulse Width3 Between Stop and Start tSPS Notes: 1. All values are referenced to VIL and/or VIH. 2. Depending on the conversion command, the Si705x may hold the master during the conversion (clock stretch). At above 100 kHz SCL, the Si705x may also hold the master briefly for user register and device ID transactions. At the highest I2C speed of 400 kHz the stretching will be