SI7060-B-02-IV

• Better than ± 1 °C accuracy • Better than ± 0.1 °C repeatability • Wide operating voltage: 1.7 to 5.5 V N ew The output works as a comparator, that is, the output pin will go high or low with each new temperature sample. The output is setup to be open drain to support wire-OR with multiple sensors or components. FEATURES D The Si7060 family of I2C temperature sensors features high conversion speed (143 μsec typical), programmable over or under temperature interrupt, and interrupt polarity with 200 msec (typical) sampling time. es ig ns Si7060 Data Sheet • Low power consumption: 500 nA • Ultra-low power sleep mode: 50 nA The operation of the Si7060 is similar to industry standard parts, but offers lower power and in many cases higher accuracy. It is also capable of operating in autonomous sampling mode. • Configurable alert output fo r The Si7060 powers up with a nominal temperature threshold of 79.8°C and reset threshold of 75°C, but these values are programmable. HVAC/R Thermostats White Goods Computer Equipment • Package Options: • SOT23-5 • Asset Tracking • Battery Protection • Industrial Controls N ot R ec om • • • • • 4 factory configurable I2C addresses m en de d Applications: • I2C interface silabs.com | Building a more connected world. This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Preliminary Rev. 0.1 Si7060 Data Sheet Functional Description 1. Functional Description The Si7060 family of I2C temperature sensors measure and digitize the local temperature at the device. 4 modes of operation are possible: Sleep Mode: es ig ns This ultra-low power mode of operation is useful when temperature measurements are made infrequently and the lowest possible power is desired. In this mode, the part will remain in sleep mode until it receives a command over I2C to wake up and make a measurement. After this measurement, the part will go back to sleep. The sleep bit is the ‘master’ bit. Once this bit is set, the sensor enters its sleep mode regardless of the other register configurations. Once the part is woken up by I2C, all registers are loaded to their default value, except for 0xC6 and 0xC7, which can be saved by the usestore bit. How to Configure: D sleep = 1 stop = X N ew sltimeena = X Autonomous Sampling Mode: In this mode of operation, the device will make measurements at a factory set rate of 5 Hz (every 200 ms). By default the part enters the Autonomous Sampling Mode upon powerup. The sensor wakes up, performs a temperature conversion, updates the output accordingly, and then goes back to sleep. fo r How to Configure: sleep = 0 m en de d stop = 0 sltimeena = 1 (default state after wake-up) Active Mode: In this mode of operation, measurements can be commanded, and the numerical value of the temperature can be read. How to Configure: sleep = 0 sltimeena = X oneburst = 1 om stop = 0 R ec The stop bit will be set to 1 once the measurement is complete. Sleep Stop Sltimeena Sleep 1 x x Autonomous 0 0 1 N ot Mode Table 1.1. Summary of Different States The output pin is designed to be an open drain output, which allows you to connect multiple devices in parallel to trigger an alert. The output is driven low once the temperature crosses the operate point, and released once it goes below the release point. The temperature operate and release points are factory set to 80 °C and 75 °C but these values can be adjusted by setting the bit usestore to 1 and adjusting the data in registers 0xC6 and 0xC7 as will be described later. It is possible to adjust the output pin polarity so it goes high or low as temperature increases. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 2 Si7060 Data Sheet I2C Interface 2. I2C Interface The Si7060 complies with “fast” mode I2C operation and 7-bit addressing at speeds up to 400 kHz. The I2C address is factory programmed to one of 4 values 0x30, 0x31, 0x32, or 0x33 (0110000b through 0110011b). At power-up the registers are initialized, as will be described in the register definitions, and then they can be read or written in standard fashion for I2C devices. es ig ns The host command for writing an I2C register is: START Address W ACK register ACK data ACK STOP The host command for reading an I2C register is: START Address W ACK register ACK Sr Address R Data NACK* STOP *NACK by host D Where: N ew START is SDA going low with SCL high Sr is a repeated START Address is 0x30 up to 0x33. 0 indicates a write and 1 indicates a read. Data is the Read or Write data. NACK is SDA high. m en de d STOP is SDA going high with SCL high. fo r ACK is SDA low. Writing or Reading of sequential registers can be supported by setting the arautoinc bit of register 0xC5 (see register description). In the case of a read sequence where the arautoinc bit has been set, the data can be ACK’d to allow reading of sequential registers. For example, a two byte read of the conversion data in registers 0xC1 and 0XC2 would be: START Address W ACK 0xC1 ACK Sr Address ACK data ACK* data NACK* STOP *ACK/NACK by host To wake a part from sleep mode or to interrupt a measurement loop from idle mode, send the sequence: om START Address W ACK STOP In this case, if the host continued with a register write, the Si7060 would NACK which would be unexpected. Additionally, the following sequence can be used to wake the part up or to interrupt a measurement loop: ec START Address R ACK data NACK* STOP *NACK by host R In this case, the Si7060 will produce 0xFF for the data. Allow for 10 μsec between the ACK of the address and the next START for the Si7060 to wake from sleep. In most cases, this will happen automatically, due to the 400 KHz maximum speed of the I2C bus. The sequence will put the part in idle mode with the stop bit set. N ot To make a single conversion, having woken the part, set the oneburst bit of register 0xC4 to 1 and the stop bit to 0. The stop bit resets to 1 by the time the measurement is complete. To put the part back to sleep after reading the data, set the stop bit to 0. Putting the part to sleep with the sleep bit = 0 will result in the mode of operation where the temperature is sampled every 200 msec, and the output pin will toggle at the temperature threshold points as defined by registers 0xC6 and 0xC7 (assuming the usestore bit is also set)—that is, write 0x08 to 0xC4. If ultra-low power sleep with no sampling is desired, set the stop bit to 0 and the sleep bit to 1—that is, write 0x00 or 0x09 (to retain the settings of 0xC6 and 0xC7) to 0xC4. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 3 Si7060 Data Sheet I2C Interface 2.1 Operation at Very Slow I2C Bus Speeds If the Si7060 is put to sleep with the sleep timer enabled, there will be one measurement done prior to sleep with the settings as configured in the wake period (i.e., operate and release points). This measurement starts at the falling edge of SCL prior to the ACK of the write that puts the part to sleep (i.e., writing 0x80 to register 0xC4). When the measurement concludes, the output pin will be set high or low depending on the measurement results, and the part will enter the sleep timer state. es ig ns In the sleep timer state, SDA will hold state until the next wake (either by host or due to the sleep timer, which is typically 200 msec). Thus, it is important that the ACK concludes prior to entering the sleep state, or SDA will hold low until the next wake. SDA is released at the falling edge of SCL, at the completion of the ACK time. This takes 140 μsec, and, therefore, the I2C clock speed must be fast enough that the time from SCL falling prior to ACK to SCL falling after ACK must be less than 140 μsec. Depending on the host timing for this portion of the I2C sequence, this corresponds to an I2C speed of greater than 7 KHz. For very low I2C speeds, < 7KHz where this could be an issue, if the sleep timer function is not needed, write the sleep bit of register 0xC4 to put the part to sleep. If the sleep timer is not running, there is no measurement prior to sleep. SDA is released at the completion of the ACK, and the part will enter the sleep state without the sleep timer running. D 2.2 Measuring Temperature Over I2C N ew The actual temperature of the device can be calculated by reading the Dspsigm and Dspsigl registers over I2C, which correspond to the most significant and least significant bytes of the temperature measurements respectively. The complete 15b unsigned result is 256 *Dspsigm[6:0]+Dspsigl[7:0]. A result of 16384 means the temperature is 55°C. More negative results mean lower temperature, and more positive results mean higher temperature. Temperature is calculated from the formula: N ot R ec om m en de d Read the register interface section for more details. fo r T (°C) = 55+ (256*Dspsigm[6:0]+Dspsigl[7:0] -16384)/160 silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 4 Si7060 Data Sheet Register Interface 3. Register Interface The Si7060 has 9 registers. 0xC0 through 0xC9 not including 0xC3. 6 0xC0 5 4 3 chipid (RO) Dspsigm 0xC2 Dspsigl 0xC3 Do not use meas(RO) usestore oneburst 0 stop sleep arautoinc sw_low4temp 0xC7 sw_op 0x3 sw_hyst 0xC8 N ew 0xC9 D 0xC5 0xC6 1 revid (RO) 0xC1 0xC4 2 es ig ns 7 0xE1 otp_addr 0xE2 otp_data 0xE3 slTimeena otp_read otp_busy chipid (RO) – This ID 0x1 for all Si7060 parts. m en de d revid (RO) – This ID 0x4 for revision B. fo r Registers 0xC0 through 0xC2 are read only registers. 0xC0 has the chip and revid information 0xC1 and 0xC2 store the result of a temperature conversion. Dspsigm – Bits [6:0] are the most significant byte of the last conversion result. The most significant bit is a “fresh” bit, indicating the register has been updated since last read. Reading the Dspsigm register causes the register Dspsigl to be loaded with the least significant byte of the last conversion result. Dspsigl – The least significant byte of the last conversion result. Read Dspsigm first to align the bytes. The complete 15b unsigned result is 256*Dspsigm[6:0]+Dspsigl[7:0]. om A result of 16384 means the temperature is 55°C. More negative results mean lower temperature, and more positive results mean higher temperature. Temperature is calculated from the formula: T (°C) = 55+ (256*Dspsigm[6:0]+Dspsigl[7:0] -16384)/160 ec This result can go from -47.4 to +157.39 °C. The recommended operating temperatures is -40°C to +125°C; so, the result should never be out of range, but if operated beyond the ratings of the part, the result will clamp at -47.4 to +157.39 °C (i.e., no underflow or overflow). R Oneburst – Setting this bit initiates a single conversion. Set stop = 0 when setting oneburst = 1. The stop bit will be set to 1 when the conversion completes. N ot stop - Setting this bit causes the control state machine measurement loop to pause after the current measurement burst completes. Once set, clearing this bit restarts the measurement loop. sleep - Setting this bit causes the part to enter sleep mode after the current measurement burst completes. Once set, clearing this bit restarts the measurement loop. arautoinc – enables auto increment of the I2C register address pointer. This bit is not retained in sleep mode. sw_low4temp - determines the polarity of the output pin. The default setting of sw_low4temp = 1 means the pin will go low at high temperature, e.g. sw_op + hysteresis. sw_low4temp = 0 means the pin will go high at low temperature, e.g., sw_op - hysteresis . silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 5 Si7060 Data Sheet Register Interface Usestore – Setting this bit causes the current state of OTP registers for the sw_op, sw_hyst, sw_low4field, and sw_fieldpolsel bits to be saved and restored during the next sleep and wakeup sequence instead of using the factory programmed default settings corresponding to 80°C set point and 75°C release point. sw_op – this 9 bit number sets the center point of the decision point for temperature high or low. The actual decision point is the center point plus or minus the hysteresis. sw_op of 256 corresponds to a decision point of 55°C. The decision point will go up or down by 0.4°C as sw_op increases or decreases threshold = 55C + 0.4°C *(sw_op -256) sw_hyst - The formula for hysteresis is: hysteresis = 0.025°C*(8 + sw_hyst[2:0]) × 2sw_hyst[5:3] When sw_hyst = 63, the hysteresis is set to zero. These numbers can range from 0.2°C to 44.8°C es ig ns from this value. D The operate point is threshold plus the hysteresis, and the release point is the threshold minus the hysteresis. The factory default settings are sw_op = 312 corresponding to a nominal decision point of 77.4°C and sw_hyst = 28 corresponding to a nominal hysteresis of 2.4°C (operate at 79.8°C and release at 75°C). N ew slTimeena - Enables the sleep timer. 0 means the part goes into complete sleep once the sleep bit is set. 1 means the parts will wake a factory set interval between 1 and 200 msec, make a measurement, set the output pin value, and return to sleep. The meas bit of 0xC4 indicates a measurement is in progress. 0x14 fo r Table 3.1. Si7060 OTP Memory Map 0x15 Part Number Variant ADDR 7 6 5 4 3 2 1 0 m en de d Base Part Number 0x18 Serial ID [31:24] 0x19 Serial ID [23:16] 0x1A Serial ID [15:8] 0x1B Serial ID [7:0] otp_addr: This is the OTP memory address to read. om otp_data: This is the data contents of the OTP memory once it is read. otp_read_en: This must be set to 1 to initiate an OTP Memory read sequence. The bit auto clears. ec otp_busy: This bit indicates if the OTP is busy. For normal I2C reads, the data will be available by the time the read enable bit is set and the data is read, so in most cases this bit is not needed. R Base part number: For the Si7060, the register value is 60. N ot Part number variant: The variant for the part number Si7060-B00 is 00. For the part number Si7060-B01, the part number variant is 01. The register value equals the part number variant. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 6 Si7060 Data Sheet Electrical Specifications 4. Electrical Specifications Unless otherwise specified, all min/max specifications apply over the recommended operating conditions Table 4.1. Recommended Operating Conditons Symbol Test Condition Min Typ Power Supply VDD — 1.71 — Temperature TA — -40 — 5.5 V 125 °C Max Units 5.5 125 VDD V 1 µs 0.4 V 0.2 V 0.6 V 1.5 µA Symbol Test Condition Min Typ VDD — 1.71 — V Operating Ambient Temperature TA — -40 — °C Input Voltage Range VIN Input Leakage IIL Operating Supply Voltage on VDD VOL 0 2 V SCL, SDA IOL = 2mA m en de d VDD> 1.7 V SCL, SDA IOL = 6mA VDD> 2 V Current consumption IDD Sleep timer enabled average IDD at VDD= 3.3V for sample rate = 200ms 0.5 Sleep mode (typ. 25°C) 50 ec om Sleep mode 125°C R Conversion Time VDD = 3.3V 1000 nA - - µA 600 800 700 1000 143 160 µs 200 240 µs 1 ms VDD = 5.5V TCONV Sleep Time TSLEEP Wake Up Time TWAKE N ot Conversion in progress/ Active Mode nA silabs.com | Building a more connected world. 160 Time from VDD> 1.7V to first measurement Preliminary Rev. 0.1 | 7 Si7060 Data Sheet Electrical Specifications Table 4.3. Output Pin Specifications Output Voltage Low Symbol Test Condition VOL Min Typ Max Units IOL = 3mA; VDD> 2V 0.4 V IOL = 2mA; VDD> 1.7V 0.2 V IOL = 6mA; VDD> 2 V Leakage ILEAK Output High Slew Rate TSLEW Digital Output Mode 5 SCL Clock Frequency fSCL Start Condition Hold Time tSDH LOW Period of SCL tSKL HIGH Period of Clock tSKH Set Up Time for a Repeated Start Data Setup Time tDS Bus Free Time between STOP and START Data Valid Time (SCL Low to Data Valid) Hysteresis Typ Max Units 400 kHz 0.6 µs 1.3 µs 0.6 µs 0.6 µs 100 µs tSPS 0.6 µs tBUF 1.3 µs tVD;DAT 0.9 µs tVD;ACK 0.9 µs 17 %VDD tHYST Digital input hysteresis SDA and SCL 7 tSP Pulses up to and including this limit will be suppressed 50 ns N ot R ec Suppressed Pulse Width %VDD/ns µs om Data Valid Acknowledge Time (time from SCL Low to SDA Low) µA 0 m en de d tDH Min 0 tSU:STA Data Hold Time Set Up Time for a STOP Condition Test Condition 1 N ew Symbol V fo r Parameter 0.6 D Table 4.4. I2C Interface Specifications es ig ns Parameter silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 8 Si7060 Data Sheet Electrical Specifications tSKH 1/fSCL tSKL tSP SCL tSTH tDS D6 SDA tDH D5 D4 D0 tSPS R/W es ig ns tBUF ACK Start Bit Stop Bit N ew Figure 4.1. I2C Interface Timing D tVD : ACK tSTS Table 4.5. Temperature Measurement Accuracy Symbol Test Condition Temperature Measurement Accuracy — 0°C to + 70°C Temperature Measurement Repeatability — Min Typ Max Units ±0.5 ±1 °C ±2 °C fo r -40°C to + 125°C RMS Noise ±0.05 m en de d Parameter °C RMS Table 4.6. Thermal Characteristics Symbol Test Condition Value Units Junction to Air Thermal Resistance θJA JEDEC 4 layer board no airflow SOT23-5 212.8 °C/W Junction to Board Thermal Resistance θJB JEDEC 4 layer board no airflow SOT23-5 45 °C/W Parameter om Parameter Symbol ec Ambient Temperature Under Bias Table 4.7. Absolute Maximum Ratings Test Condition Min — R Storage Temperature Typ Max Units -55 125 °C -65 150 °C VIO -0.3 VDD+0.3 V Voltage on VDD with respect to Ground VDD -0.3 6 V N ot Voltage on I/O Pins ESD Tolerance VHBM Human Body Model 2 kV VCDM Charge Discharge Model 500 V Note: Absolute maximum ratings are stress ratings only. Operation at or beyond these conditions is not implied and may shorten the life of the device, and/or alter its performance. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 9 Si7060 Data Sheet Ordering Guide 5. Ordering Guide I2C Address Output Type Si7060-B-00-IV(R) 0x30 Open Drain Si7060-B-01-IV(R) 0x31 Open Drain Si7060-B-02-IV(R) 0x32 Open Drain Si7060-B-03-IV(R) 0x33 es ig ns Part Open Drain N ot R ec om m en de d fo r N ew D Note: The optional (R) is the designator for tape and reel (3000 pieces per reel). Parts not ordered by the full reel will be supplied in cut tape. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 10 Si7060 Data Sheet Pin Description 6. Pin Description 1 es ig ns 5 2 4 D 3 SOT-23, 5-Pin Top View N ew Figure 6.1. Pin Assignments Table 6.1. 5-Pin SOT23-5 Package Pin Number SDA 1 I2C data 2 Ground 3 I2C clock 4 Power +1.7 to +5.5 V 5 Digital ouput fo r Pin Name SCL VDD N ot R ec om ALERT m en de d GND Description silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 11 Si7060 Data Sheet Package Outline 7. Package Outline N ot R ec om m en de d fo r N ew D es ig ns 7.1 SOT23-5 5-Pin Package silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 12 Si7060 Data Sheet Package Outline Table 7.1. SOT23-5 5-Pin Package Dimensions Min Max A -- 1.25 A1 0.00 0.10 A2 0.85 b 0.30 c 0.10 1.15 0.50 E 2.75 BSC E1 1.60 BSC e 0.95 BSC 1.90 BSC L 0.30 L2 0.60 0.25 BSC θ 0° 8° 0.15 fo r aaa bbb 0.20 0.10 m en de d ccc ddd N ew 2.90 BSC D 0.20 D e1 es ig ns Dimension 0.20 N ot R ec om Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-193, Variation AB. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 13 Si7060 Data Sheet Land Patterns 8. Land Patterns N ew D es ig ns 8.1 SOT23-5 5-Pin PCB Land Pattern C E m en de d X fo r Dimension Y Note: (mm) 2.70 0.95 1.05 0.60 om General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. N ot R ec Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 14 Si7060 Data Sheet Top Marking 9. Top Marking fo r N ew D es ig ns 9.1 SOT23-5 5-Pin Top Marking N ot R ec om m en de d Note: TTTT is a manufacturing code. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 15 Si7060 Data Sheet Revision History 10. Revision History Revision 0.1 N ot R ec om m en de d fo r N ew D es ig ns May 2018 • Initial release. silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 16 es ig ns D N ew fo r om Products m en de d Smart. Connected. Energy-Friendly. www.silabs.com/products Quality www.silabs.com/quality Support and Community community.silabs.com N ot R ec Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Trademark Information Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, ISOmodem®, Micrium, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri, Z-Wave and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders. Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 USA http://www.silabs.com