Si826x
5 K V L E D E M U L ATO R I N PU T, 4 . 0 A I SO LATED G AT E D R I V E R S
Features
Pin-compatible, drop-in upgrades for
popular high speed opto-coupled gate
drivers
Low power diode emulator simplifies
design-in process
0.6 and 4.0 Amp peak output drive
current
Rail-to-rail output voltage
Performance and reliability advantages
vs. opto-drivers
Resistant to temperature and age
10x lower FIT rate for longer service
life
14x tighter part-to-part matching
Higher common-mode transient
immunity: >50 kV/µs typical
Robust protection features
Multiple UVLO ordering options
(5, 8, and 12 V) with hysteresis
60 ns propagation delay, independent of
input drive current
Wide VDD range: 6.5 to 30 V
Up to 5000 VRMS isolation
10 kV surge withstand capability
AEC-Q100 qualified
Wide operating temperature range
–40 to +125 °C
RoHS-compliant packages
SOIC-8 (Narrow body)
DIP8 (Gull-wing)
SDIP6 (Stretched SO-6)
Automotive-grade OPNs available
AIAG compliant PPAP documentation
support
IMDS and CAMDS listing support
8
VDD
7
VO
UVLO
ANODE
2
e
CATHODE
3
6
VO
NC
4
5
GND
SOIC-8, DIP8
Industry Standard Pinout
6 VDD
UVLO
IGBT/ MOSFET gate drives
Variable speed motor control in
consumer white goods
Industrial, HEV and renewable energy
inverters
Isolated switch mode and UPS power
supplies
AC, Brushless, and DC motor controls
and drives
NC 2
e
CATHODE 3
5 VO
4 GND
SDIP6
Industry Standard Pinout
Safety Regulatory Approvals
UL 1577 recognized
Up to 5000 Vrms for 1 minute
CSA component notice 5A approval
IEC 60950-1, 60601-1
(reinforced insulation)
1
ANODE 1
Applications
Pin Assignments:
See page 23
VDE certification conformity
VDE0884-10
(basic/reinforced insulation)
CQC certification approval
GB4943.1
Patent pending
Description
The Si826x isolators are pin-compatible, drop-in upgrades for popular opto-coupled
gate drivers, such as 0.6 A ACPL-0302/3020, 2.5 A HCPL-3120/ACPL-3130,
HCNW3120/3130, and similar opto-drivers. The devices are ideal for driving power
MOSFETs and IGBTs used in a wide variety of inverter and motor control applications.
The Si826x isolated gate drivers utilize Skyworks Solutions' proprietary silicon isolation
technology, supporting up to 5.0 kVRMS withstand voltage per UL1577 and 10kV surge
protection per VDE 0884-10. This technology enables higher-performance, reduced
variation with temperature and age, tighter part-to-part matching, and superior
common-mode rejection compared to opto-coupled gate drivers. While the input circuit
mimics the characteristics of an LED, less drive current is required, resulting in higher
efficiency. Propagation delay time is independent of input drive current, resulting in
consistently short propagation times, tighter unit-to-unit variation, and greater input
circuit design flexibility. As a result, the Si826x series offers longer service life and
dramatically higher reliability compared to opto-coupled gate drivers.
Automotive Grade is available for certain part numbers. These products are built using
automotive-specific flows at all steps in the manufacturing process to ensure the
robustness and low defectivity required for automotive applications.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
Rev 1.51 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 26, 2021
Si826x
Functional Block Diagram
Diode
Emulator
VDD
A1
XMIT
REC
Output Driver
OUT
IF
C1
GND
2
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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Si826x
TABLE O F C ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4. Technical Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.1. Device Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.2. Device Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.3. Under Voltage Lockout (UVLO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.1. Input Circuit Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.2. Output Circuit Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.3. Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.4. Power Dissipation Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
6. Pin Descriptions (SOIC-8, DIP8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7. Pin Descriptions (SDIP6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
8.1. Automotive Grade OPNs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
9. Package Outline: 8-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
10. Land Pattern: 8-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
11. Package Outline: DIP8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
12. Land Pattern: DIP8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
13. Package Outline: SDIP6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
14. Land Pattern: SDIP6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
15. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
15.1. Si826x Top Marking (Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
15.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
15.3. Si826x Top Marking (DIP8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
15.4. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
15.5. Si826x Top Marking (SDIP6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
15.6. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
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Si826x
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
Supply Voltage
Input Current
Operating Temperature (Ambient)
Symbol
Min
Typ
Max
Unit
VDD
6.5
—
30
V
IF(ON)
(see Figure 1)
6
—
30
mA
TA
–40
—
125
°C
Table 2. Electrical Characteristics 1
VDD = 15 V or 30 V, GND = 0 V, IF = 6 mA, TA = –40 to +125 °C; typical specs at 25 °C; TJ = –40 to +140 °C
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Supply Voltage2
VDD
(VDD – GND)
6.5
—
30
V
Supply Current (Output High)
IDD
IF = 10 mA
VDD = 15 V
VDD = 30 V
—
—
1.8
2.0
2.4
2.7
mA
mA
IDD
VF = 0 V; IF = 0 mA
VDD = 15 V
VDD = 30 V
—
—
1.5
1.7
2.1
2.4
mA
mA
DC Parameters
Supply Current (Output Low)
Input Current Threshold
IF(TH)
—
—
3.6
mA
Input Current Hysteresis
IHYS
—
0.34
—
mA
Input Forward Voltage (OFF)
VF(OFF)
Measured at ANODE with
respect to CATHODE.
—
—
1
V
Input Forward Voltage (ON)
VF(ON)
Measured at ANODE with
respect to CATHODE.
1.6
—
2.8
V
CI
f = 100 kHz,
VF = 0 V,
VF = 2 V
—
—
15
15
—
—
pF
Si826xAxx devices
—
15
—
Si826xBxx devices (IOH = -1 A)
—
2.6
5.1
Si826xAxx devices
—
5
—
Si826xBxx devices (IOL = 2 A)
—
0.8
2.0
Input Capacitance
Output Resistance High
(Source)3
Output Resistance Low (Sink)3
ROH
ROL
Notes:
1. See "8.Ordering Guide" on page 24 for more information.
2. Minimum value of (VDD - GND) decoupling capacitor is 1 µF.
3. Both VO pins are required to be shorted together for 4.0 A compliance.
4. When performing this test, it is recommended that the DUT be soldered down to the PCB to reduce parasitic
inductances, which may cause over-stress conditions due to excessive ringing.
5. Guaranteed by characterization.
4
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Table 2. Electrical Characteristics (Continued)1
VDD = 15 V or 30 V, GND = 0 V, IF = 6 mA, TA = –40 to +125 °C; typical specs at 25 °C; TJ = –40 to +140 °C
Parameter
Output High Current (Source)3,4
Symbol
IOH
Test Condition
Min
Typ
Max
Si826xAxx devices (IF = 0),
(tPW_IOH < 250 ns)
(see Figure 3)
—
0.4
—
Si826xBxx devices (IF = 0),
(tPW_IOH < 250 ns),
(VDD – VO = 7.5 V)
(see Figure 3)
Si826xAxx devices
(IF = 10 mA),
(tPW_IOL < 250 ns)
(see Figure 2)
Output Low Current (Sink)3,4
High-Level Output Voltage
Low-Level Output Voltage
IOL
VOH
VOL
Si826xBxx devices
(IF = 10 mA),
(tPW_IOL < 250 ns),
(VO - GND = 4.2 V)
(see Figure 2)
Unit
A
0.5
1.8
—
—
0.6
—
A
1.2
4.0
—
Si826xAxx devices
(I OUT = –100 mA)
—
VDD–
0.4
—
Si826xBxx devices
(I OUT = –100 mA)
VDD–
0.5
VDD–
0.25
—
Si826xBxx devices
(I OUT = 0 mA),
(IF = 0 mA)
—
VDD
—
Si826xAxx devices
(I OUT = 100 mA),
(IF = 10 mA)
—
320
—
Si826xBxx devices
(I OUT = 100 mA),
(IF = 10 mA)
—
80
200
V
mV
UVLO Threshold +
(Si826xxAx mode)
VDDUV+
See Figure 10 on page 17.
VDD rising
5
5.6
6.3
V
UVLO Threshold –
(Si826xxAx mode)
VDDUV–
See Figure 10 on page 17.
VDD falling
4.7
5.3
6.0
V
Notes:
1. See "8.Ordering Guide" on page 24 for more information.
2. Minimum value of (VDD - GND) decoupling capacitor is 1 µF.
3. Both VO pins are required to be shorted together for 4.0 A compliance.
4. When performing this test, it is recommended that the DUT be soldered down to the PCB to reduce parasitic
inductances, which may cause over-stress conditions due to excessive ringing.
5. Guaranteed by characterization.
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Table 2. Electrical Characteristics (Continued)1
VDD = 15 V or 30 V, GND = 0 V, IF = 6 mA, TA = –40 to +125 °C; typical specs at 25 °C; TJ = –40 to +140 °C
Parameter
UVLO lockout hysteresis
(Si826xxAx mode)
Symbol
Test Condition
VDDHYS
Min
Typ
Max
Unit
—
300
—
mV
UVLO Threshold +
(Si826xxBx mode)
VDDUV+
See Figure 11 on page 17.
VDD rising
7.5
8.4
9.4
V
UVLO Threshold –
(Si826xxBx mode)
VDDUV–
See Figure 11 on page 17.
VDD falling
6.9
7.9
8.9
V
—
500
—
mV
UVLO lockout hysteresis
(Si826xxBx mode)
VDDHYS
UVLO Threshold +
(Si826xxCx mode)
VDDUV+
See Figure 12 on page 17.
VDD rising
10.5
12
13.5
V
UVLO Threshold –
(Si826xxCx mode)
VDDUV–
See Figure 12 on page 17.
VDD falling
9.4
10.7
12.2
V
UVLO lockout hysteresis
(Si826xxCx mode)
VDDHYS
—
1.3
—
V
AC Switching Parameters
Input noise filter cut-off pulse
width
tNFC
—
—
15
ns
Minimum pulse width
tPMIN
—
30
—
ns
Propagation delay (Low-to-High)
tPLH
CL = 200 pF
20
40
60
ns
Propagation delay (High-to-Low)
tPHL
CL = 200 pF
10
30
50
ns
Pulse Width Distortion
PWD
|tPLH – tPHL|
—
17
28
ns
PDD
tPHLMAX – tPLHMIN
-1
—
25
ns
Rise time
tR
CL = 200 pF
—
5.5
15
ns
Fall time
tF
CL = 200 pF
—
8.5
20
ns
—
16
30
µs
35
50
—
kV/µs
Propagation Delay
Difference5
Device Startup Time
tSTART
Common Mode
Transient Immunity
CMTI
Output = low or high
(VCM = 1500 V), (IF > 6 mA)
(See Figure 4)
Notes:
1. See "8.Ordering Guide" on page 24 for more information.
2. Minimum value of (VDD - GND) decoupling capacitor is 1 µF.
3. Both VO pins are required to be shorted together for 4.0 A compliance.
4. When performing this test, it is recommended that the DUT be soldered down to the PCB to reduce parasitic
inductances, which may cause over-stress conditions due to excessive ringing.
5. Guaranteed by characterization.
6
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Si826x
10
Anode
Anode
2.2 V
ESD
e
700
Cathode
Cathode
AnodetoCathodeVoltage[V]
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
5
10
15
20
25
30
DiodeEmulatorInputCurrent[mA]
Figure 1. Diode Emulator Model and I-V Curve
VDD = 15 V
VDD
IN
Si826x
10
OUT
SCHOTTKY
GND
1 µF
100 µF
9V
+
_
INPUT
1 µF
CER
Measure
10 µF
EL
RSNS
0.1
50 ns
IF
GND
200 ns
INPUT WAVEFORM
Figure 2. IOL Sink Current Test Circuit
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Si826x
VDD = 15 V
VDD
IN
Si826x
10
OUT
SCHOTTKY
VSS
1 µF
100 µF
5.5 V
+
_
INPUT
1 µF
CER
Measure
10 µF
EL
RSNS
0.1
50 ns
IF
GND
200 ns
INPUT WAVEFORM
Figure 3. IOH Source Current Test Circuit
15 V
Supply
Si826x
267
Input Signal
Switch
Anode
VDD
5V
Isolated
Supply
VO
Oscilloscope
Cathode
GND
Isolated
Ground
Input
High Voltage
Differential
Probe
Output
Vcm Surge
Output
High Voltage
Surge Generator
Figure 4. Common Mode Transient Immunity Characterization Circuit
8
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Si826x
2. Regulatory Information
Table 3. Regulatory Information*
CSA
The Si826x is certified under CSA Component Acceptance Notice 5A. For more details, see Master Contract
Number 232873.
60950-1: Up to 1000 VRMS reinforced insulation working voltage; up to 1000 VRMS basic insulation working
voltage.
60601-1: Up to 250 VRMS working voltage and 2 MOPP (Means of Patient Protection).
VDE
The Si826x is certified according to VDE0884-10. For more details, see certificate 40037519.
VDE0884 Part 10: Up to 1414 Vpeak for reinforced insulation working voltage.
UL
The Si826x is certified under UL1577 component recognition program. For more details, see File E257455.
Rated up to 5000 VRMS isolation voltage for basic protection.
CQC
The Si826x is certified under GB4943.1-2011. For more details, see certificates CQC15001121282 and
CQC15001121283.
Rated up to 1000 VRMS reinforced insulation working voltage; up to 1000 VRMS basic insulation working voltage.
*Note: Regulatory Certifications apply to 3.75 kVRMS rated devices which are production tested to 4.5 kVRMS for 1 sec.
Regulatory Certifications apply to 5.0 kVRMS rated devices which are production tested to 6.0 kVRMS for 1 sec.
For more information, see "8.Ordering Guide" on page 24.
Table 4. Insulation and Safety-Related Specifications
Parameter
Symbol
Test Condition
Value
SOIC-8
DIP8
SDIP6
Unit
Nominal External Air Gap
(Clearance)
CLR
4.7 min
7.2 min
9.6 min
mm
Nominal External Tracking
(Creepage)
CPG
3.9 min
7.0 min
8.3 min
mm
Minimum Internal Gap
(Internal Clearance)
DTI
0.016
0.016
0.016
mm
600
600
600
V
Tracking Resistance
CTI or
PTI
IEC60112
Erosion Depth
ED
0.031
0.031
0.057
mm
Resistance (Input-Output)*
RIO
1012
1012
1012
Capacitance (Input-Output)*
CIO
1
1
1
pF
f = 1 MHz
*Note: To determine resistance and capacitance, the Si826x is converted into a 2-terminal device. Pins 1–4 (1–3, SDIP6) are
shorted together to form the first terminal, and pins 5–8 (4–6, SDIP6) are shorted together to form the second terminal.
The parameters are then measured between these two terminals.
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Table 5. IEC 60664-1 Ratings
Parameter
Basic Isolation Group
Installation
Classification
Test Conditions
Specification
SOIC-8
Material Group
DIP8
SDIP6
I
I
I
Rated Mains Voltages <
150 VRMS
I-IV
I-IV
I-IV
Rated Mains Voltages <
300 VRMS
I-IV
I-IV
I-IV
Rated Mains Voltages <
450 VRMS
I-III
I-III
I-IV
Rated Mains Voltages <
600 VRMS
I-III
I-III
I-IV
Rated Mains Voltages <
1000 VRMS
I-II
I-II
I-III
Table 6. VDE 0884-10 Insulation Characteristics*
Parameter
Maximum Working
Insulation Voltage
Input to Output Test
Voltage
Transient Overvoltage
Surge Voltage
Symbol
Characteristic
Unit
SOIC-8
DIP8
SDIP6
630
891
1140
V peak
1181
1671
2138
V peak
VPR
Method b1
(VIORM x 1.875 = VPR, 100%
Production Test, tm = 1 sec,
Partial Discharge < 5 pC)
VIOTM
t = 60 sec
6000
6000
8000
V peak
6250
6250
6250
V peak
VIOSM
Tested per IEC 60065 with
surge voltage of 1.2 μs/50 μs
Si826x tested with magnitude
6250 V x 1.6 = 10 kV
2
2
2
>109
>109
>109
VIORM
Pollution Degree
(DIN VDE 0110, Table 1)
Insulation Resistance at
TS, VIO = 500 V
Test Condition
RS
*Note: This isolator is suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety
data is ensured by protective circuits. The Si826x provides a climate classification of 40/125/21.
10
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Si826x
Table 7. IEC Safety Limiting Values*
Parameter
Case Temperature
Symbol
Test Condition
TS
Input Current
IS
Output Power
PS
JA = 110 °C/W (SOIC-8),
110 °C/W (DIP8),
105 °C/W (SDIP6),
VF = 2.8 V, TJ = 140 °C,
TA = 25 °C
SOIC-8
140
Max
DIP8
140
SDIP6
140
370
370
390
mA
1
1
1
W
Unit
°C
*Note: Maximum value allowed in the event of a failure; also see the thermal derating curve in Figures 5, 6, 7, and 8.
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Table 8. Thermal Characteristics
Parameter
Symbol
SOIC-8
DIP8
SDIP6
110
110
105
JA
IC Junction-to-Air Thermal
Resistance
OutputPo
owerͲ Ps,InputCurrentͲ Is
Typ
Unit
ºC/W
1200
1000
Ps(mW)
800
600
Is(mA)
400
200
0
0
20
40
60
80
100
120
140
TsͲ CaseTemperature(°C)
OutputPo
owerͲ Ps,InputCurrentͲ Is
Figure 5. (SOIC-8) Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per VDE0884-10
1200
1000
Ps(mW)
800
600
Is(mA)
400
200
0
0
20
40
60
80
100
120
140
TsͲ CaseTemperature(°C)
Figure 6. (DIP8) Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per VDE0884-10
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OutputPo
owerͲ Ps,InputCurrentͲ Is
Si826x
1200
1000
Ps(mW)
800
600
Is(mA)
400
200
0
0
20
40
60
80
100
120
140
TsͲ CaseTemperature(°C)
Figure 7. (SDIP6) Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per VDE0884-10
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Table 9. Absolute Maximum Ratings*
Parameter
Symbol
Min
Max
Unit
TSTG
–65
+150
°C
Operating Temperature
TA
–40
+125
°C
Junction Temperature
TJ
—
+140
°C
IF(AVG)
—
30
mA
IFTR
—
1
A
VR
—
0.3
V
Supply Voltage
VDD
–0.5
36
V
Output Voltage
VOUT
–0.5
36
V
Peak Output Current (tPW = 10 µs, duty cycle = 0.2%)
(0.6 Amp versions)
IOPK
—
0.6
A
Peak Output Current (tPW = 10 µs, duty cycle = 0.2%)
(4.0 Amp versions)
IOPK
—
4.0
A
Input Power Dissipation
PI
—
75
mW
Output Power Dissipation
PO
—
225
mW
Total Power Dissipation
(all packages limited by thermal derating curve)
PT
—
300
mW
Lead Solder Temperature (10 s)
—
260
°C
HBM Rating ESD
4
—
kV
Machine Model ESD
300
—
V
CDM
2000
—
V
Maximum Isolation Voltage (1 s) SOIC-8
—
4500
VRMS
Maximum Isolation Voltage (1 s) DIP8
—
6500
VRMS
Maximum Isolation Voltage (1 s) SDIP6
—
6500
VRMS
Storage Temperature
Average Forward Input Current
Peak Transient Input Current
(< 1 µs pulse width, 300 ps)
Reverse Input Voltage
*Note: Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions specified in the operational sections of this data sheet.
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3. Functional Description
3.1. Theory of Operation
The Si826x is a functional upgrade for popular opto-isolated drivers, such as the Avago HPCL-3120, HPCL-0302,
Toshiba TLP350, and others. The operation of an Si826x channel is analogous to that of an opto coupler, except an
RF carrier is modulated instead of light. This simple architecture provides a robust isolated data path and requires
no special considerations or initialization at start-up. The Si826x also includes a noise filter that suppresses
propagation of any pulse narrower than 15 ns. A simplified block diagram for the Si826x is shown in Figure 8.
Transmitter
Receiver
RF
OSCILLATOR
VDD
A
LED
Emulator
MODULATOR
SemiconductorBased Isolation
Barrier
DEMODULATOR
+
NOISE FILTER
B
0.6 to 4.0 A
peak
Gnd
Figure 8. Simplified Channel Diagram
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4. Technical Description
4.1. Device Behavior
Truth tables for the Si826x are summarized in Table 10.
Table 10. Si826x Truth Table Summary*
Input
VDD
VO
OFF
> UVLO
LOW
OFF
< UVLO
LOW
ON
> UVLO
HIGH
ON
< UVLO
LOW
*Note: This truth table assumes VDD is powered. If VDD is below UVLO, see "4.3.Under Voltage
Lockout (UVLO)" on page 17 for more information.
4.2. Device Startup
Output VO is held low during power-up until VDD rises above the UVLO+ threshold for a minimum time period of
tSTART. Following this, the output is high when the current flowing from anode to cathode is > IF(ON). Device startup,
normal operation, and shutdown behavior is shown in Figure 9.
UVLO+
UVLO-
VDDHYS
VDD
IF(ON)
IHYS
IF
tSTART
tPHL
tPLH
tSTART
VO
Figure 9. Si826x Operating Behavior (IF > IF(MIN) when VF > VF(MIN))
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4.3. Under Voltage Lockout (UVLO)
The UVLO circuit unconditionally drives VO low when VDD is below the lockout threshold. Referring to Figures 10
through 12, upon power up, the Si826x is maintained in UVLO until VDD rises above VDDUV+. During power down,
the Si826x enters UVLO when VDD falls below the UVLO threshold plus hysteresis (i.e., VDD < VDDUV+ –
VDDHYS).
V DDUV+ (Typ)
3.5
Output Voltage (VO)
Output Voltage (VO)
V DDUV+ (Typ)
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
Supply Voltage (V DD - GND) (V)
Figure 10. Si826xxAx UVLO Response (5 V)
9.5
10.0
10.5 11.0 11.5
12.0
12.5 13.0
Supply Voltage (V DD - GND) (V)
Figure 12. Si826xxCx UVLO Response (12 V)
Output Voltage (VO)
V DDUV+ (Typ)
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5 10.0
Supply Voltage (V DD - GND) (V)
Figure 11. Si826xxBX UVLO Response (8 V)
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5. Applications
The following sections detail the input and output circuits necessary for proper operation. Power dissipation and
layout considerations are also discussed.
5.1. Input Circuit Design
Opto driver manufacturers typically recommend the circuits shown in Figures 13 and 14. These circuits are
specifically designed to improve opto-coupler input common-mode rejection and increase noise immunity.
Si826x
Vext
1 N/C
R1
2 ANODE
3 CATHODE
Control
Input
Open Drain or
Collector
4 N/C
Figure 13. Si826x Input Circuit
Vext
Si826x
1 N/C
2 ANODE
Control
Input
Q1
3 CATHODE
R1
4 N/C
Figure 14. High CMR Si826x Input Circuit
The optically-coupled driver circuit of Figure 13 turns the LED on when the control input is high. However, internal
capacitive coupling from the LED to the power and ground conductors can momentarily force the LED into its off
state when the anode and cathode inputs are subjected to a high common-mode transient. The circuit shown in
Figure 14 addresses this issue by using a value of R1 sufficiently low to overdrive the LED, ensuring it remains on
during an input common-mode transient. Q1 shorts the LED off in the low output state, again increasing commonmode transient immunity.
Some opto driver applications recommend reverse-biasing the LED when the control input is off to prevent coupled
noise from energizing the LED. The Si826x input circuit requires less current and has twice the off-state noise
margin compared to opto couplers. However, high CMR opto coupler designs that overdrive the LED (see
Figure 14) may require increasing the value of R1 to limit input current IF to its maximum rating when using the
Si826x. In addition, there is no benefit in driving the Si826x input diode into reverse bias when in the off state.
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Consequently, opto coupler circuits using this technique should either leave the negative bias circuitry unpopulated
or modify the circuitry (e.g., add a clamp diode or current limiting resistor) to ensure that the anode pin of the
Si826x is no more than –0.3 V with respect to the cathode when reverse-biased.
New designs should consider the input circuit configurations of Figure 15, which are more efficient than those of
Figures 13 and 14. As shown, S1 and S2 represent any suitable switch, such as a BJT or MOSFET, analog
transmission gate, processor I/O, etc. Also, note that the Si826x input can be driven from the I/O port of any MCU
or FPGA capable of sourcing a minimum of 6 mA (see Figure 15C). Additionally, note that the Si826x propagation
delay and output drive do not significantly change for values of IF between IF(MIN) and IF(MAX).
Si826x
Vext
1
N/C
2
ANODE
Control
Input
R1
3
CATHODE
4
N/C
Control
Input
S1
See Text
S1
R1
1
N/C
2
ANODE
S2
3
4
A
Si826x
Si826x
Vext
1
N/C
2
ANODE
CATHODE
3
CATHODE
N/C
4
N/C
MCU I/O
Port pin
B
R1
C
Figure 15. Si826x Other Input Circuit Configurations
5.2. Output Circuit Design
GND can be biased at, above, or below ground as long as the voltage on VDD with respect to GND is a maximum
of 30 V. VDD decoupling capacitors should be placed as close to the package pins as possible. The optimum
values for these capacitors depend on load current and the distance between the chip and its power source. It is
recommended that 0.1 and 10 µF bypass capacitors be used to reduce high-frequency noise and maximize
performance.
5.3. Layout Considerations
It is most important to minimize ringing in the drive path and noise on the VDD lines. Care must be taken to
minimize parasitic inductance in these paths by locating the Si826x as close as possible to the device it is driving.
In addition, the VDD supply and ground trace paths must be kept short. For this reason, the use of power and
ground planes is highly recommended. A split ground plane system having separate ground and VDD planes for
power devices and small signal components provides the best overall noise performance.
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5.4. Power Dissipation Considerations
Proper system design must assure that the Si826x operates within safe thermal limits across the entire load range.
The Si826x total power dissipation is the sum of the power dissipated by bias supply current, internal switching
losses, and power delivered to the load, as shown in Equation 1.
P D = I F V F DC + V DD I DDQ + Q d + C L V DD f
where: P D is the total device power dissipation (W)
I F is the diode current (30 mA max)
VF is the diode anode to cathode voltage (2.8 V max)
DC is duty cycle (0.5 typical)
VDD is the driver-side supply voltage (30 V max)
I DDQ is the driver maximum bias current (2.5 mA)
Q d is 3 nC
C L is the load capacitance
f is the switching frequency (Hz)
Equation 1.
The maximum allowable power dissipation for the Si826x is a function of the package thermal resistance, ambient
temperature, and maximum allowable junction temperature, as shown in Equation 2.
T jmax – T A
P Dmax -------------------------- ja
where:
P Dmax is the maximum allowable power dissipation (W)
T jmax is the maximum junction temperature (140 °C)
T A is the ambient temperature (°C)
ja is the package junction-to-air thermal resistance (110 °C/W)
Equation 2.
Substituting values for PDmax Tjmax, TA, and ja into Equation 2 results in a maximum allowable total power
dissipation of 1.0 W. Note that the maximum allowable load is found by substituting this limit and the appropriate
datasheet values from Table 2 on page 4 into Equation 1 and simplifying. Graphs are shown in Figures 16 and 18.
All points along the load lines in these graphs represent the package dissipation-limited value of CL for the
corresponding switching frequency.
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Si826x
10000.0
1000.0
7V
12V
18V
100.0
MaxLoad(nF)
30V
10.0
1.0
0.1
10
100
1000
Frequency(kHz)
Figure 16. (SOIC-8, DIP8, SDIP6) Maximum Load vs. Switching Frequency (25 °C)
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6. Pin Descriptions (SOIC-8, DIP8)
NC
1
8
VDD
7
VO
UVLO
ANODE
2
e
CATHODE
3
6
VO
NC
4
5
GND
SOIC-8, DIP8
Industry Standard Pinout
Figure 17. Pin Configuration
Table 11. Pin Descriptions (SOIC-8, DIP8)
Pin
Name
1
NC*
2
ANODE
3
Description
No connect.
Anode of LED emulator. VO follows the signal applied to this input with respect to the
CATHODE input.
CATHODE Cathode of LED emulator. VO follows the signal applied to ANODE with respect to this input.
4
NC*
No connect.
5
GND
External MOSFET source connection and ground reference for VDD. This terminal is typically
connected to ground but may be tied to a negative or positive voltage.
6
VO
Output signal. Both VO pins are required to be shorted together for 4.0 A compliance.
7
VO
Output signal. Both VO pins are required to be shorted together for 4.0 A compliance.
8
VDD
Output-side power supply input referenced to GND (30 V max).
*Note: No Connect. These pins are not internally connected. To maximize CMTI performance, these pins should be
connected to the ground plane.
22
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7. Pin Descriptions (SDIP6)
ANODE 1
6
VDD
5
VO
4
GND
UVLO
NC 2
CATHODE 3
e
SDIP6
Industry Standard Pinout
Figure 18. Pin Configuration
Table 12. Pin Descriptions (SDIP6)
Pin
Name
1
ANODE
2
NC*
3
Description
Anode of LED emulator. VO follows the signal applied to this input with respect to the
CATHODE input.
No connect.
CATHODE Cathode of LED emulator. VO follows the signal applied to ANODE with respect to this input.
External MOSFET source connection and ground reference for VDD. This terminal is typically
connected to ground but may be tied to a negative or positive voltage.
4
GND
5
VO
Output signal.
6
VDD
Output-side power supply input referenced to GND (30 V max).
*Note: No Connect. These pins are not internally connected. To maximize CMTI performance, these pins should be
connected to the ground plane.
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8. Ordering Guide
Table 13. Si826x Ordering Guide1,2,3
Ordering Options
New Ordering
Part Number
(OPN)
Output
Configuration
Cross
Reference
UVLO
Voltage
Insulation
Rating
Temp Range
Pkg Type
Si8261AAC-C-IS
0.6 A driver
HCPL-0314
5V
3.75 kVrms
–40 to +125 °C
SOIC-8
Si8261BAC-C-IS
4.0 A driver
—
5V
3.75 kVrms
–40 to +125 °C
SOIC-8
Si8261AAC-C-IP
0.6 A driver
HCPL-3140
5V
3.75 kVrms
–40 to +125 °C
DIP8/GW
Si8261BAC-C-IP
4.0 A driver
TLP 350
HCPL-3120
5V
3.75 kVrms
–40 to +125 °C
DIP8/GW
Si8261AAD-C-IS
0.6 A driver
ACPL-W314
5V
5.0 kVrms
–40 to +125 °C
SDIP6
Si8261BAD-C-IS
4.0 A driver
TLP 700F
5V
5.0 kVrms
–40 to +125 °C
SDIP6
Notes:
1. All packages are RoHS-compliant with peak solder reflow temperatures of 260 °C according to the JEDEC industry
standard classifications.
2. “Si” and “SI” are used interchangeably.
3. AEC-Q100 qualified.
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Table 13. Si826x Ordering Guide1,2,3
Ordering Options
New Ordering
Part Number
(OPN)
Output
Configuration
Cross
Reference
UVLO
Voltage
Insulation
Rating
Temp Range
Pkg Type
Si8261ABC-C-IS
0.6 A driver
HCPL-0314
8V
3.75 kVrms
–40 to +125 °C
SOIC-8
Si8261BBC-C-IS
4.0 A driver
—
8V
3.75 kVrms
–40 to +125 °C
SOIC-8
Si8261ABC-C-IP
0.6 A driver
HCPL-3140
8V
3.75 kVrms
–40 to +125 °C
DIP8/GW
Si8261BBC-C-IP
4.0 A driver
TLP 350
HCPL-3120
8V
3.75 kVrms
–40 to +125 °C
DIP8/GW
Si8261ABD-C-IS
0.6 A driver
ACPL-W314
8V
5.0 kVrms
–40 to +125 °C
SDIP6
Si8261BBD-C-IS
4.0 A driver
TLP 700F
8V
5.0 kVrms
–40 to +125 °C
SDIP6
Notes:
1. All packages are RoHS-compliant with peak solder reflow temperatures of 260 °C according to the JEDEC industry
standard classifications.
2. “Si” and “SI” are used interchangeably.
3. AEC-Q100 qualified.
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Table 13. Si826x Ordering Guide1,2,3
Ordering Options
New Ordering
Part Number
(OPN)
Output
Configuration
Cross
Reference
UVLO
Voltage
Insulation
Rating
Temp Range
Pkg Type
Si8261ACC-C-IS
0.6 A driver
HCPL-0314
12 V
3.75 kVrms
–40 to +125 °C
SOIC-8
Si8261BCC-C-IS
4.0 A driver
—
12 V
3.75 kVrms
–40 to +125 °C
SOIC-8
Si8261ACC-C-IP
0.6 A driver
HCPL-3140
12 V
3.75 kVrms
–40 to +125 °C
DIP8/GW
Si8261BCC-C-IP
4.0 A driver
TLP 350
HCPL-3120
12 V
3.75 kVrms
–40 to +125 °C
DIP8/GW
Si8261ACD-C-IS
0.6 A driver
ACPL-W314
12 V
5.0 kVrms
–40 to +125 °C
SDIP6
Si8261BCD-C-IS
4.0 A driver
TLP 700F
12 V
5.0 kVrms
–40 to +125 °C
SDIP6
Notes:
1. All packages are RoHS-compliant with peak solder reflow temperatures of 260 °C according to the JEDEC industry
standard classifications.
2. “Si” and “SI” are used interchangeably.
3. AEC-Q100 qualified.
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8.1. Automotive Grade OPNs
Automotive-grade devices are built using automotive-specific flows at all steps in the manufacturing process to
ensure robustness and low defectivity. These devices are supported with AIAG-compliant Production Part Approval
Process (PPAP) documentation, and feature International Material Data System (IMDS) and China Automotive
Material Data System (CAMDS) listing. Qualifications are compliant with AEC-Q100, and a zero-defect
methodology is maintained throughout definition, design, evaluation, qualification, and mass production steps.
Table 14. Si826x Ordering Guide1,2,3
Ordering Options
New Ordering
Part Number
(OPN)
Output
Configuration
Cross
Reference
UVLO
Voltage
Insulation
Rating
Temp Range
Pkg Type
Si8261BBC-AP
4.0 A driver
TLP 350
HCPL-3120
8V
3.75 kVrms
–40 to +125 °C
DIP8/GW
Si8261BBC-AS
4.0 A driver
—
8V
3.75 kVrms
–40 to +125 °C
SOIC-8
Si8261BCC-AS
4.0 A driver
—
12 V
3.75 kVrms
–40 to +125 °C
SOIC-8
Si8261BCD-AS
4.0 A driver
TLP 700F
12 V
5.0 kVrms
–40 to +125 °C
SDIP6
Notes:
1. All packages are RoHS-compliant with peak solder reflow temperatures of 260 °C according to the JEDEC industry
standard classifications.
2. “Si” and “SI” are used interchangeably.
3. AEC-Q100 qualified
4. An "R" at the end of the part number denotes tape and reel packaging option.
5. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical
parameters to their Industrial-Grade (with a "–I" suffix) version counterparts. Automotive-Grade products are produced
utilizing full automotive process flows and additional statistical process controls throughout the manufacturing flow.
The Automotive-Grade part number is included on shipping labels.
6. Additional Ordering Part Numbers may be available in Automotive-Grade. Please contact your local Skyworks
Solutions sales representative for further information.
7. In Chapter 15.Top Markings on page 35, the Manufacturing Code represented by either “RTTTTT” or “TTTTTT”
contains as its first character a letter in the range N through Z to indicate Automotive-Grade.
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9. Package Outline: 8-Pin Narrow Body SOIC
Figure 19 illustrates the package details for the Si826x in an 8-pin narrow-body SOIC package. Table 15 lists the
values for the dimensions shown in the illustration.
Figure 19. 8-Pin Narrow Body SOIC Package
Table 15. 8-Pin Narrow Body SOIC Package Diagram Dimensions
Symbol
Millimeters
Min
Max
A
1.35
1.75
A1
0.10
0.25
A2
1.40 REF
1.55 REF
B
0.33
0.51
C
0.19
0.25
D
4.80
5.00
E
3.80
4.00
e
1.27 BSC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
0
8
28
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10. Land Pattern: 8-Pin Narrow Body SOIC
Figure 20 illustrates the recommended land pattern details for the Si826x in an 8-pin narrow-body SOIC. Table 16
lists the values for the dimensions shown in the illustration.
Figure 20. 8-Pin Narrow Body SOIC Land Pattern
Table 16. 8-Pin Narrow Body SOIC Land Pattern Dimensions
Dimension
Feature
(mm)
C1
Pad Column Spacing
5.40
E
Pad Row Pitch
1.27
X1
Pad Width
0.60
Y1
Pad Length
1.55
Notes:
1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X173-8N for
Density Level B (Median Land Protrusion).
2. All feature sizes shown are at Maximum Material Condition (MMC) and a card
fabrication tolerance of 0.05 mm is assumed.
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Si826x
11. Package Outline: DIP8
Figure 21 illustrates the package details for the Si826x in a DIP8 package. Table 17 lists the values for the
dimensions shown in the illustration.
Figure 21. DIP8 Package
Table 17. DIP8 Package Diagram Dimensions
Dimension
Min
Max
A
—
4.19
A1
0.55
0.75
A2
3.17
3.43
b
0.35
0.55
b2
1.14
1.78
b3
0.76
1.14
c
0.20
0.33
D
9.40
9.90
E
7.37
7.87
E1
6.10
6.60
E2
9.40
9.90
e
2.54 BSC.
L
0.38
0.89
aaa
—
0.25
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
30
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Si826x
12. Land Pattern: DIP8
Figure 22 illustrates the recommended land pattern details for the Si826x in a DIP8 package. Table 18 lists the
values for the dimensions shown in the illustration.
Figure 22. DIP8 Land Pattern
Table 18. DIP8 Land Pattern Dimensions*
Dimension
Min
Max
C
8.85
8.90
E
2.54 BSC
X
0.60
0.65
Y
1.65
1.70
*Note: This Land Pattern Design is based on the IPC-7351 specification.
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Si826x
13. Package Outline: SDIP6
Figure 23 illustrates the package details for the Si826x in an SDIP6 package. Table 19 lists the values for the
dimensions shown in the illustration.
Figure 23. SDIP6 Package
Table 19. SDIP6 Package Diagram Dimensions
Dimension
Min
Max
A
—
2.65
A1
0.10
0.30
A2
2.05
—
b
0.31
0.51
c
0.20
0.33
D
4.58 BSC
E
11.50 BSC
E1
7.50 BSC
e
1.27 BSC
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
32
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Si826x
Table 19. SDIP6 Package Diagram Dimensions (Continued)
Dimension
Min
Max
L
0.40
1.27
h
0.25
0.75
θ
0°
8°
aaa
—
0.10
bbb
—
0.33
ccc
—
0.10
ddd
—
0.25
eee
—
0.10
fff
—
0.20
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
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Si826x
14. Land Pattern: SDIP6
Figure 24 illustrates the recommended land pattern details for the Si826x in an SDIP6 package. Table 20 lists the
values for the dimensions shown in the illustration.
Figure 24. SDIP6 Land Pattern
Table 20. SDIP6 Land Pattern Dimensions*
Dimension
Min
Max
C
10.45
10.50
E
1.27 BSC
X
0.55
0.60
Y
2.00
2.05
*Note: This Land Pattern Design is based on the IPC-7351 specification.
34
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Si826x
15. Top Markings
15.1. Si826x Top Marking (Narrow Body SOIC)
15.2. Top Marking Explanation
Customer Part Number
826 = ISOdriver product series
C = Input configuration
1 = Opto input type
I = Peak output current
A = 0.6 A; B = 4.0 A
U = UVLO level
A = 5 V; B = 8 V; C = 12 V
V = Isolation rating
C = 3.75 kV; D = 5.0 kV
RTTTTT = Mfg Code
Manufacturing Code from the Assembly Purchase
Order form.
“R” indicates revision.
Circle = 43 mils Diameter
Left-Justified
“e4” Pb-Free Symbol
YY = Year
WW = Work Week
Assigned by the Assembly House. Corresponds to
the year and work week of the mold date.
Line 1 Marking:
Line 2 Marking:
Line 3 Marking:
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Si826x
15.3. Si826x Top Marking (DIP8)
15.4. Top Marking Explanation
Customer Part Number
Si826 = ISOdriver product series
C = Input configuration
1 = Opto input type
I = Peak output current
A = 0.6 A; B = 4.0 A
U = UVLO level
A = 5 V; B = 8 V; C = 12 V
V = Isolation rating
C = 3.75 kV; D = 5.0 kV
YY = Year
WW = Work Week
Assigned by the Assembly House. Corresponds to
the year and work week of the mold date.
RTTTTT = Mfg Code
Manufacturing Code from the Assembly Purchase
Order form.
“R” indicates revision.
Circle = 51 mils Diameter
Center-Justified
“e4” Pb-Free Symbol
CO = Country of Origin
Country of Origin
ISO Code Abbreviation
Line 1 Marking:
Line 2 Marking:
Line 3 Marking:
36
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Si826x
15.5. Si826x Top Marking (SDIP6)
15.6. Top Marking Explanation
Device
Si826 = ISOdriver product series
C = Input configuration
1 = Opto input type
Device Rating
I = Peak output current
A = 0.6 A; B = 4.0 A
U = UVLO level
A = 5 V; B = 8 V; C = 12 V
V = Isolation rating
C = 3.75 kV; D = 5.0 kV
RTTTTT = Mfg Code
Manufacturing Code from the Assembly Purchase
Order form.
“R” indicates revision.
YY = Year
WW = Work Week
Assigned by the Assembly House. Corresponds to the
year and work week of the mold date.
Line 1 Marking:
Line 2 Marking:
Line 3 Marking:
Line 4 Marking:
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Si826x
DOCUMENT CHANGE LIST
Revision 0.9 to Revision 1.0
Updated Table 2 on page 4.
Added Figure 1 on page 7.
Updated "3.1.Theory of Operation" on page 15.
Updated Figures 10, 11, and 12 on page 17.
Removed “5.5. Parametric Differences between Si826x and HCPL-0302 and HCPL-3120 Opto Drivers”.
Revision 1.0 to Revision 1.1
Updated Figure 1 on page 7.
Updated Ordering Guide Table 13 on page 24.
Removed
references to moisture sensitivity levels from table note.
Revision 1.1 to Revision 1.2
Removed “Sampling” from Ordering Guide Table 13 on page 24.
Revision 1.2 to Revision 1.3
Updated Table 3 on page 9.
Added
CQC certificate numbers.
Updated Table 5 on page 10.
Updated
Rated Mains Voltage for 1000 VRMS ratings.
Updated Table 6 on page 10.
Removed
VIOSM specification.
Updated Table 9 on page 14.
Replaced
IO with Peak Output Current IOPK.
Updated Figure 13 on page 18.
Updated Figure 14 on page 18.
Updated Figure 15 on page 19.
Changed VDD minimum throughout document to reflect 6.5 V, not 5 V, as normal operation.
Revision 1.3 to Revision 1.4
Removed references to LGA8 throughout.
Deleted all IEC 60747-5 and IEC 61010 references throughout and added VDE 0884-10 references throughout.
Updated all certification body’s certificate and file reference numbers throughout.
Revision 1.4 to Revision 1.5
Added Automotive-grade Ordering Guide and other introductory information.
Revision 1.5 to Revision 1.51
Added Automotive-grade Ordering Guide
Si8261BBC-AP
Si8261BCC-AS
Si8261BCD-AS
38
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