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SI8640BB-B-IU

SI8640BB-B-IU

  • 厂商:

    SILABS(芯科科技)

  • 封装:

    -

  • 描述:

    SI8640BB-B-IU

  • 数据手册
  • 价格&库存
SI8640BB-B-IU 数据手册
Si864x Data Sheet Low-Power Quad-Channel Digital Isolators KEY FEATURES Skyworks' family of ultra-low-power digital isolators are CMOS devices offering substantial data rate, propagation delay, power, size, reliability, and external BOM advantages over legacy isolation technologies. The operating parameters of these products remain stable across wide temperature ranges and throughout device service life for ease of design and highly uniform performance. All device versions have Schmitt trigger inputs for high noise immunity and only require VDD bypass capacitors. Data rates up to 150 Mbps are supported, and all devices achieve propagation delays of less than 10 ns. Enable inputs provide a single point control for enabling and disabling output drive. Ordering options include a choice of isolation ratings (1.0, 2.5, 3.75 and 5 kV) and a selectable fail-safe operating mode to control the default output state during power loss. All products >1 kV are safety certified by UL, CSA, VDE, and CQC, and products in wide-body packages support reinforced insulation withstanding up to 5 kVRMS. Automotive Grade is available for certain part numbers. These products are built using automotive-specific flows at all steps in the manufacturing process to ensure the robustness and low defectivity required for automotive applications. Industrial Applications • Industrial automation systems • Medical electronics • Isolated switch mode supplies • Isolated ADC, DAC • Motor control • Power inverters • Communications systems Safety Regulatory Approvals • UL 1577 recognized • Up to 5000 VRMS for 1 minute • CSA component notice 5A approval • IEC 60950-1, 62368-1, 60601-1 (reinforced insulation) • VDE certification conformity • Si864xxT options certified to reinforced VDE 0884-10 • All other options certified to basic VDE 0884-10 and reinforced 60950-1 • CQC certification approval • GB4943.1 Automotive Applications • On-board chargers • Battery management systems • Charging stations • Traction inverters • Hybrid Electric Vehicles • Battery Electric Vehicles • High-speed operation • DC to 150 Mbps • No start-up initialization required • Wide Operating Supply Voltage • 2.5–5.5 V • Up to 5000 VRMS isolation • Reinforced VDE 0884-10, 10 kV surgecapable (Si864xxT) • 60-year life at rated working voltage • High electromagnetic immunity • Ultra low power (typical) 5 V Operation • 1.6 mA per channel at 1 Mbps • 5.5 mA per channel at 100 Mbps 2.5 V Operation • 1.5 mA per channel at 1 Mbps • 3.5 mA per channel at 100 Mbps • Tri-state outputs with ENABLE • Schmitt trigger inputs • Selectable fail-safe mode • Default high or low output (ordering option) • Precise timing (typical) • 10 ns propagation delay • 1.5 ns pulse width distortion • 0.5 ns channel-channel skew • 2 ns propagation delay skew • 5 ns minimum pulse width • Transient Immunity 50 kV/µs • AEC-Q100 qualification • Wide temperature range • –40 to 125 °C • RoHS-compliant packages • SOIC-16 wide body • SOIC-16 narrow body • QSOP-16 • Automotive-grade OPNs available • AIAG compliant PPAP documentation support • IMDS and CAMDS listing support 1 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 1 Si864x Data Sheet • Ordering Guide 1. Ordering Guide Industrial and Automotive Grade OPNs Industrial-grade devices (part numbers having an “-I” in their suffix) are built using well-controlled, high-quality manufacturing flows to ensure robustness and reliability. Qualifications are compliant with JEDEC, and defect reduction methodologies are used throughout definition, design, evaluation, qualification, and mass production steps. Automotive-grade devices (part numbers having an “-A” in their suffix) are built using automotive-specific flows at all steps in the manufacturing process to ensure robustness and low defectivity. These devices are supported with AIAG-compliant Production Part Approval Process (PPAP) documentation, and feature International Material Data System (IMDS) and China Automotive Material Data System (CAMDS) listing. Qualifications are compliant with AEC-Q100, and a zero-defect methodology is maintained throughout definition, design, evaluation, qualification, and mass production steps. Table 1.1. Ordering Guide for Valid OPNs1, 2, 5 Ordering Part Number (OPN) Automotive OPNs6, 7 Number Number of Inputs of Inputs Max Data Rate VDD1 VDD2 (Mbps) Side Side Default Output State Isolation Rating (kV) Package QSOP-16 Packages Si8640BA-B-IU Si8640BA-AU 4 0 150 Low 1.0 QSOP-16 Si8640BB-B-IU Si8640BB-AU 4 0 150 Low 2.5 QSOP-16 Si8640EB-B-IU Si8640EB-AU 4 0 150 High 2.5 QSOP-16 Si8641BA-B-IU Si8641BA-AU 3 1 150 Low 1.0 QSOP-16 Si8641BA-C-IU Si8641BA-AU 3 1 150 Low 1.0 QSOP-16 Si8641BB-B-IU Si8641BB-AU 3 1 150 Low 2.5 QSOP-16 Si8641EB-B-IU Si8641EB-AU 3 1 150 High 2.5 QSOP-16 Si8642BA-B-IU Si8642BA-AU 2 2 150 Low 1.0 QSOP-16 Si8642BA-C-IU Si8642BA-AU 2 2 150 Low 1.0 QSOP-16 Si8642BB-B-IU Si8642BB-AU 2 2 150 Low 2.5 QSOP-16 Si8642EA-B-IU Si8642EA-AU 2 2 150 High 1.0 QSOP-16 Si8642EB-B-IU Si8642EB-AU 2 2 150 High 2.5 QSOP-16 Si8645BA-B-IU Si8645BA-AU 4 0 150 Low 1.0 QSOP-16 Si8645BA-C-IU Si8645BA-AU 4 0 150 Low 1.0 QSOP-16 Si8645BB-B-IU Si8645BB-AU 4 0 150 Low 2.5 QSOP-16 Si8640BB-B-IS1 Si8640BB-AS1 4 0 150 Low 2.5 NB SOIC-16 Si8640BB-B-IS Si8640BB-AS 4 0 150 Low 2.5 WB SOIC-16 Si8640BC-B-IS1 Si8640BC-AS1 4 0 150 Low 3.75 NB SOIC-16 Si8640BD-B-IS2 Si8640BD-AS2 4 0 150 Low 5.0 WB SOIC-16 (8 mm creepage)4 Si8640BD-B-IS Si8640BD-AS 4 0 150 Low 5.0 WB SOIC-16 Si8640EC-B-IS1 Si8640EC-AS1 4 0 150 High 3.75 NB SOIC-16 Si8640ED-B-IS2 Si8640ED-AS2 4 0 150 High 5.0 WB SOIC-16 (8 mm creepage)4 SOIC-16 Packages 2 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 2 Si864x Data Sheet • Ordering Guide Number Number of Inputs of Inputs Max Data Rate VDD1 VDD2 (Mbps) Side Side Default Output State Isolation Rating (kV) Package 150 High 5.0 WB SOIC-16 1 150 Low 2.5 NB SOIC-16 3 1 150 Low 2.5 WB SOIC-16 Si8641BC-AS1 3 1 150 Low 3.75 NB SOIC-16 Si8641BD-B-IS2 Si8641BD-AS2 3 1 150 Low 5.0 WB SOIC-16 (8 mm creepage)4 Si8641BD-B-IS Si8641BD-AS 3 1 150 Low 5.0 WB SOIC-16 Si8641EC-B-IS1 Si8641EC-AS1 3 1 150 High 3.75 NB SOIC-16 Si8641ED-B-IS2 Si8641ED-AS2 3 1 150 High 5.0 WB SOIC-16 (8 mm creepage)4 Si8641ED-B-IS Si8641ED-AS 3 1 150 High 5.0 WB SOIC-16 Si8642BB-B-IS1 Si8642BB-AS1 2 2 150 Low 2.5 NB SOIC-16 Si8642BB-B-IS Si8642BB-AS 2 2 150 Low 2.5 WB SOIC-16 Si8642BC-B-IS1 Si8642BC-AS1 2 2 150 Low 3.75 NB SOIC-16 Si8642BD-B-IS2 Si8642BD-AS2 2 2 150 Low 5.0 WB SOIC-16 (8 mm creepage)4 Si8642BD-B-IS Si8642BD-AS 2 2 150 Low 5.0 WB SOIC-16 Si8642EC-B-IS1 Si8642EC-AS1 2 2 150 High 3.75 NB SOIC-16 Si8642ED-B-IS2 Si8642ED-AS2 2 2 150 High 5.0 WB SOIC-16 (8 mm creepage)4 Si8642ED-B-IS Si8642ED-AS 2 2 150 High 5.0 WB SOIC-16 Si8645BB-B-IS1 Si8645BB-AS1 4 0 150 Low 2.5 NB SOIC-16 Si8645BB-B-IS Si8645BB-AS 4 0 150 Low 2.5 WB SOIC-16 Si8645BC-B-IS1 Si8645BC-AS1 4 0 150 Low 3.75 NB SOIC-16 Si8645BD-B-IS Si8645BD-AS 4 0 150 Low 5.0 WB SOIC-16 Ordering Part Number (OPN) Automotive OPNs6, 7 Si8640ED-B-IS Si8640ED-AS 4 0 Si8641BB-B-IS1 Si8641BB-AS1 3 Si8641BB-B-IS Si8641BB-AS Si8641BC-B-IS1 Product Options with Reinforced VDE 0884-10 Rating with 10 kV Surge Capability 3 Si8640BT-IS Si8640BT-AS 4 0 150 Low 5.0 WB SOIC-16 Si8640ET-IS Si8640ET-AS 4 0 150 High 5.0 WB SOIC-16 Si8641BT-IS Si8641BT-AS 3 1 150 Low 5.0 WB SOIC-16 Si8641ET-IS Si8641ET-AS 3 1 150 High 5.0 WB SOIC-16 Si8642BT-IS Si8642BT-AS 2 2 150 Low 5.0 WB SOIC-16 Si8642ET-IS Si8642ET-AS 2 2 150 High 5.0 WB SOIC-16 Si8645BT-IS Si8645BT-AS 4 0 150 Low 5.0 WB SOIC-16 Si8645ET-IS Si8645ET-AS 4 0 150 High 5.0 WB SOIC-16 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 3 Si864x Data Sheet • Ordering Guide Ordering Part Number (OPN) Automotive OPNs6, 7 Number Number of Inputs of Inputs Max Data Rate VDD1 VDD2 (Mbps) Side Side Default Output State Isolation Rating (kV) Package Note: 1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifications and peak solder temperatures. 2. “Si” and “SI” are used interchangeably. 3. An "R" at the end of the part number denotes tape and reel packaging option. 4. The package designated IS2 has a design that eliminates tie bars, thus allowing for extra creepage distance while maintaining standard WB SOIC-16 package dimensions and land pattern. 5. Temperature range is –40 to 125 °C. 6. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical parameters to their Industrial-Grade (with an "–I" suffix) version counterparts. Automotive-Grade products are produced utilizing full automotive process flows and additional statistical process controls throughout the manufacturing flow. The Automotive-Grade part number is included on shipping labels. 7. In the top markings of each device, the Manufacturing Code represented by either “RTTTTT” or “TTTTTT” contains as its first character a letter in the range N through Z to indicate Automotive-Grade. 4 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 4 Table of Contents 1. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Eye Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 . . . 3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 Device Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.2 Undervoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.3 Layout Recommendations . 3.3.1 Supply Bypass . . . 3.3.2 Output Pin Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 .10 .10 3.4 Fail-Safe Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.5 Typical Performance Characteristics. . . . . . . . . . . . . . . . . . . . . . .11 4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 6. Package Outline (16-Pin Wide Body SOIC, -IS and -IS2 Package Option) . . . . . . . . 30 7. Land Pattern (16-Pin Wide Body SOIC, -IS Package Options) . . . . . . . . . . . . 32 8. Land Pattern (16-Pin Wide Body SOIC, -IS2 Package Options) . . . . . . . . . . . . 33 9. Package Outline (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . 34 10. Land Pattern (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . 36 11. Package Outline (16-Pin QSOP) . . . . . . . . . . . . . . . . . . . . . . . 37 12. Land Pattern (16-Pin QSOP) . . . . . . . . . . . . . . . . . . . . . . . . 39 13. Top Marking (16-Pin Wide Body SOIC, -IS and -IS2 Package Options) . . . . . . . . . 40 14. Top Marking (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . 41 . . . . . . . . . . . . . . . . . . . . . . . . 42 16. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 15. Top Marking (16-Pin QSOP) 5 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 5 Si864x Data Sheet • Functional Description 2. Functional Description 2.1 Theory of Operation The operation of an Si864x channel is analogous to that of an opto coupler, except an RF carrier is modulated instead of light. This simple architecture provides a robust isolated data path and requires no special considerations or initialization at start-up. A simplified block diagram for a single Si864x channel is shown in the figure below. Figure 2.1. Simplified Channel Diagram A channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier. Referring to the transmitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The Receiver contains a demodulator that decodes the input state according to its RF energy content and applies the result to output B via the output driver. This RF on/off keying scheme is superior to pulse code schemes as it provides best-in-class noise immunity, low power consumption, and improved immunity to magnetic fields. See the following figure for more details. Figure 2.2. Modulation Scheme 6 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 6 Si864x Data Sheet • Functional Description 2.2 Eye Diagram The figure below illustrates an eye diagram taken on an Si8640. For the data source, the test used an Anritsu (MP1763C) Pulse Pattern Generator. The output of the generator's clock and data from an Si8640 were captured on an oscilloscope set to 1.0 ns/div. The results illustrate that data integrity was maintained even at the high data rate of 150 Mbps. The results also show that 2 ns pulse width distortion and 350 ps peak jitter were exhibited. Figure 2.3. Eye Diagram 7 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 7 Si864x Data Sheet • Device Operation 3. Device Operation Device behavior during start-up, normal operation, and shutdown is shown in Figure 3.1 Device Behavior during Normal Operation on page 10, where UVLO+ and UVLO– are the respective positive-going and negative-going thresholds. Refer to the following tables to determine outputs when power supply (VDD) is not present and for logic conditions when enable pins are used. Table 3.1. Si86xx Logic Operation VI Input1, 2 EN Input1, 2, 3, 4 VDDI State1, 5, 6 VDDO State1, 5, 6 VO Output1, 2 Comments H H or NC P P H L H or NC P P L X7 L P P Hi-Z8 NC H or NC P P L9 Output L for default low product options. H9 Output H for default high product options. L9 Upon transition of VDDI from unpowered to powered, VO returns to the same state as VI in less than 1 µs. X7 H or NC UP P H9 X7 L UP P X7 X7 P UP Hi-Z8 Enabled, normal operation. Disabled. Disabled. Undetermined Upon transition of VDDO from unpowered to powered, VO returns to the same state as VI within 1 µs, if EN is in either the H or NC state. Upon transition of VDDO from unpowered to powered, VO returns to Hi-Z within 1 µs if EN is L. Note: 1. VDDI and VDDO are the input and output power supplies. VI and VO are the respective input and output terminals. EN is the enable control input located on the same output side. 2. X = not applicable; H = Logic High; L = Logic Low; Hi-Z = High Impedance. 3. It is recommended that the enable inputs be connected to an external logic high or low level when the Si86xx is operating in noisy environments. 4. No Connect (NC) replaces EN1 on Si86x0/x5. No Connect replaces EN2 on the Si86x5. No Connects are not internally connected and can be left floating, tied to VDD, or tied to GND. . 5. “Powered” state (P) is defined as 2.5 V < VDD < 5.5 V. 6. “Unpowered” state (UP) is defined as VDD = 0 V. 7. Note that an I/O can power the die for a given side through an internal diode if its source has adequate current. 8. When using the enable pin (EN) function, the output pin state is driven into a high-impedance state when the EN pin is disabled (EN = 0). 9. See Section 1. Ordering Guide for details. This is the selectable fail-safe operating mode (ordering option). Some devices have default output state = H, and some have default output state = L, depending on the ordering part number (OPN). For default high devices, the data channels have 2 μA (Si86xxxA/B/C/D) or 10 μA (Si86xxxT) pull-ups on inputs/outputs. For default low devices, the data channels have 2 μA (Si86xxxA/B/C/D) or 10 μA (Si86xxxT) pull-downs on inputs/outputs. 8 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 8 Si864x Data Sheet • Device Operation Table 3.2. Enable Input Truth Part Number EN11, 2 EN21, 2 Si8640 — H Outputs B1, B2, B3, B4 are enabled and follow the input state. — L Outputs B1, B2, B3, B4 are disabled and in high impedance state.3 H X Output A4 enabled and follows the input state. L X Output A4 disabled and in high impedance state.3 X H Outputs B1, B2, B3 are enabled and follow the input state. X L Outputs B1, B2, B3 are disabled and in high impedance state.3 H X Outputs A3 and A4 are enabled and follow the input state. L X Outputs A3 and A4 are disabled and in high impedance state.3 X H Outputs B1 and B2 are enabled and follow the input state. X L Outputs B1 and B2 are disabled and in high impedance state.3 — — Outputs B1, B2, B3, B4 are enabled and follow the input state. Si8641 Si8642 Si8645 Operation Note: 1. Enable inputs EN1 and EN2 can be used for multiplexing, for clock sync, or other output control. EN1, EN2 logic operation is summarized for each isolator product in Table 2. These inputs are internally pulled-up to local VDD allowing them to be connected to an external logic level (high or low) or left floating. To minimize noise coupling, do not connect circuit traces to EN1 or EN2 if they are left floating. If EN1, EN2 are unused, it is recommended they be connected to an external logic level, especially if the Si86xx is operating in a noisy environment. 2. X = not applicable; H = Logic High; L = Logic Low. 3. When using the enable pin (EN) function, the output pin state is driven into a high-impedance state when the EN pin is disabled (EN = 0). 9 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 9 Si864x Data Sheet • Device Operation 3.1 Device Startup Outputs are held low during powerup until VDD is above the UVLO threshold for time period tSTART. Following this, the outputs follow the states of inputs. 3.2 Undervoltage Lockout Undervoltage Lockout (UVLO) is provided to prevent erroneous operation during device startup and shutdown or when VDD is below its specified operating circuits range. Both Side A and Side B each have their own undervoltage lockout monitors. Each side can enter or exit UVLO independently. For example, Side A unconditionally enters UVLO when VDD1 falls below VDD1(UVLO–) and exits UVLO when VDD1 rises above VDD1(UVLO+). Side B operates the same as Side A with respect to its VDD2 supply. Figure 3.1. Device Behavior during Normal Operation 3.3 Layout Recommendations To ensure safety in the end-user application, high-voltage circuits (i.e., circuits with >30 VAC) must be physically separated from the safety extra-low-voltage circuits (SELV is a circuit with 109 >109 >109 VIORM Method b1 Input to Output Test Voltage (VIORM x 1.875 = VPR, 100% VPR Production Test, tm = 1 sec, Partial Discharge < 5 pC) Transient Overvoltage (Si86xxxA/B/C/D) Transient Overvoltage (Si86xxxT) VIOTM t = 60 sec Vpeak Tested per IEC 60065 with surge voltage of 1.2 µs/50 µs Surge Voltage VIOSM Pollution Degree (DIN VDE 0110, Table 1) Insulation Resistance at TS, VIO = 500 V RS Vpeak Ω Note: 1. Maintenance of the safety data is ensured by protective circuits. The Si86xx provides a climate classification of 40/125/21. Table 4.9. VDE 0884-10 Safety Limiting Values 1 Parameter Case Temperature Symbol Test Condition TS Max WB SOIC-16 NB SOIC-16 QSOP-16 Unit 150 150 150 °C 220 210 210 mA 275 275 275 mW θJA = 100 °C/W (WB SOIC-16) Safety Input, Output, or Supply Current IS 105 °C/W (NB SOIC-16, QSOP-16) VI = 5.5 V, TJ = 150 °C, TA = 25 °C Device Power Dissipation 2 PD Note: 1. Maximum value allowed in the event of a failure; also see the thermal derating curve in Figure 4.4 (WB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per VDE 0884-10 on page 27 and Figure 4.5 (NB SOIC-16, QSOP-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per VDE 0884-10 on page 27. 2. The Si86xx is tested with VDD1 = VDD2 = 5.5 V; TJ = 150 ºC; CL = 15 pF, input a 150 Mbps 50% duty cycle square wave. 26 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 26 Si864x Data Sheet • Electrical Specifications Table 4.10. Thermal Characteristics Parameter IC Junction-to-Air Thermal Resistance Symbol WB SOIC-16 NB SOIC-16/QSOP-16 Unit θJA 100 105 °C/W Figure 4.4. (WB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per VDE 0884-10 Figure 4.5. (NB SOIC-16, QSOP-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per VDE 0884-10 27 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 27 Si864x Data Sheet • Electrical Specifications Table 4.11. Absolute Maximum Ratings 1 Parameter Symbol Min Max Unit Storage Temperature 2 TSTG –65 150 °C Operating Temperature TA –40 125 °C Junction Temperature TJ — 150 °C VDD1, VDD2 –0.5 7.0 V Input Voltage VI –0.5 VDD + 0.5 V Output Voltage VO –0.5 VDD + 0.5 V Output Current Drive Channel IO — 10 mA Lead Solder Temperature (10 s) — 260 °C Maximum Isolation (Input to Output) (1 sec) — 4500 VRMS — 6500 VRMS Supply Voltage NB SOIC-16, QSOP-16 Maximum Isolation (Input to Output) (1 sec) WB SOIC-16 Note: 1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum ratings for exteneded periods may degrade performance. 2. VDE certifies storage temperature from –40 to 150 °C. 28 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 28 Si864x Data Sheet • Pin Descriptions 5. Pin Descriptions VDD1 VDD2 GND2 GND1 A1 RF XMITR A2 RF XMITR A3 RF XMITR A4 RF XMITR I s o l a t i o n RF RCVR B1 RF RCVR B2 RF RCVR B3 RF RCVR B4 VDD1 GND2 GND1 A1 RF XMITR A2 RF XMITR A3 RF XMITR A4 RF RCVR EN2/NC NC VDD2 I s o l a t i o n RF RCVR B1 RF RCVR B2 RF RCVR B3 RF XMITR B4 EN2 EN1 GND1 Si8640/45 GND2 VDD1 VDD2 GND2 GND1 A1 RF XMITR A2 RF XMITR A3 RF RCVR A4 RF RCVR Si8641 RF RCVR B1 RF RCVR B2 RF RF XMITR RCVR B3 RF XMITR B4 EN2 EN1 GND1 GND1 I s o l a t i o n Si8642 GND2 Name SOIC-16 Pin# Type VDD1 1 Supply Side 1 power supply. GND1 21 Ground Side 1 ground. A1 3 Digital Input Side 1 digital input. A2 4 Digital Input Side 1 digital input. A3 5 Digital I/O Side 1 digital input or output. A4 6 Digital I/O Side 1 digital input or output. EN1/NC2 7 Digital Input GND1 81 Ground Side 1 ground. GND2 91 Ground Side 2 ground. EN2/NC2 10 Digital Input B4 11 Digital I/O Side 2 digital input or output. B3 12 Digital I/O Side 2 digital input or output. B2 13 Digital Output Side 2 digital output. B1 14 Digital Output Side 2 digital output. GND2 151 Ground Side 2 ground. VDD2 16 Supply Side 2 power supply. GND2 Description Side 1 active high enable. NC on Si8640/45. Side 2 active high enable. NC on Si8645. Note: 1. For narrow-body devices, Pin 2 and Pin 8 GND must be externally connected to respective ground. Pin 9 and Pin 15 must also be connected to external ground. 2. No Connect. These pins are not internally connected. They can be left floating, tied to VDD or tied to GND. 29 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 29 Si864x Data Sheet • Package Outline (16-Pin Wide Body SOIC, -IS and -IS2 Package Option) 6. Package Outline (16-Pin Wide Body SOIC, -IS and -IS2 Package Option) The figure below illustrates the package details for the the Si86xx digital isolator in a 16-pin wide-body SOIC package. The table lists the values for the dimensions shown in the illustration. Figure 6.1. 16-Pin Wide Body SOIC 30 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 30 Si864x Data Sheet • Package Outline (16-Pin Wide Body SOIC, -IS and -IS2 Package Option) Table 6.1. 16-Pin Wide Body SOIC (-IS and -IS2 Package Option) Package Diagram Dimensions Dimension Min Max A — 2.65 A1 0.10 0.30 A2 2.05 — b 0.31 0.51 c 0.20 0.33 D 10.30 BSC E 10.30 BSC E1 7.50 BSC e 1.27 BSC L 0.40 1.27 h 0.25 0.75 θ 0° 8° aaa — 0.10 bbb — 0.33 ccc — 0.10 ddd — 0.25 eee — 0.10 fff — 0.20 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to JEDEC Outline MS-013, Variation AA. 4. Recommended reflow profile per JEDEC J-STD-020 specification for small body, lead-free components. 31 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 31 Si864x Data Sheet • Land Pattern (16-Pin Wide Body SOIC, -IS Package Options) 7. Land Pattern (16-Pin Wide Body SOIC, -IS Package Options) The figure below illustrates the recommended land pattern details for the Si86xx in a 16-pin wide-body SOIC package. The table lists the values for the dimensions shown in the illustration. Figure 7.1. 16-Pin Wide Body SOIC PCB Land Pattern Table 7.1. 16-Pin Wide Body SOIC Land Pattern Dimensions Dimension Feature (mm) C1 Pad Column Spacing 9.40 E Pad Row Pitch 1.27 X1 Pad Width 0.60 Y1 Pad Length 1.90 Note: 1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P1032X265-16AN for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 32 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 32 Si864x Data Sheet • Land Pattern (16-Pin Wide Body SOIC, -IS2 Package Options) 8. Land Pattern (16-Pin Wide Body SOIC, -IS2 Package Options) The figure below illustrates the recommended land pattern details for the Si86xx in a 16-pin wide-body SOIC package. The table lists the values for the dimensions shown in the illustration. Figure 8.1. 16-Pin Wide Body SOIC PCB Land Pattern Table 8.1. 16-Pin Wide Body SOIC (-IS2 Package Option) Land Pattern Dimensions Dimension Feature (mm) C1 Pad Column Spacing 9.80 E Pad Row Pitch 1.27 X1 Pad Width 0.60 Y1 Pad Length 1.60 Note: 1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P1032X265-16AN for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 33 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 33 Si864x Data Sheet • Package Outline (16-Pin Narrow Body SOIC) 9. Package Outline (16-Pin Narrow Body SOIC) The figure below illustrates the package details for the Si86xx in a 16-pin narrow-body SOIC package. The table lists the values for the dimensions shown in the illustration. Figure 9.1. 16-Pin Narrow Body SOIC 34 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 34 Si864x Data Sheet • Package Outline (16-Pin Narrow Body SOIC) Table 9.1. 16-Pin Narrow Body SOIC Package Diagram Dimensions Dimension Min Max A — 1.75 A1 0.10 0.25 A2 1.25 — b 0.31 0.51 c 0.17 0.25 D 9.90 BSC E 6.00 BSC E1 3.90 BSC e 1.27 BSC L 0.40 L2 1.27 0.25 BSC h 0.25 0.50 θ 0° 8° aaa 0.10 bbb 0.20 ccc 0.10 ddd 0.25 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MS-012, Variation AC. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 35 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 35 Si864x Data Sheet • Land Pattern (16-Pin Narrow Body SOIC) 10. Land Pattern (16-Pin Narrow Body SOIC) The figure below illustrates the recommended land pattern details for the Si86xx in a 16-pin narrow-body SOIC package. The table lists the values for the dimensions shown in the illustration. Figure 10.1. 16-Pin Narrow Body SOIC PCB Land Pattern Table 10.1. 16-Pin Narrow Body SOIC Land Pattern Dimensions1, 2 Dimension Feature (mm) C1 Pad Column Spacing 5.40 E Pad Row Pitch 1.27 X1 Pad Width 0.60 Y1 Pad Length 1.55 Note: 1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X165-16N for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 36 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 36 Si864x Data Sheet • Package Outline (16-Pin QSOP) 11. Package Outline (16-Pin QSOP) The figure below illustrates the package details for the Si86xx in a 16-pin QSOP package. The table lists the values for the dimensions shown in the illustration. Figure 11.1. 16-Pin QSOP Package 37 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 37 Si864x Data Sheet • Package Outline (16-Pin QSOP) Table 11.1. 16-Pin QSOP Package Diagram Dimensions1, 2, 3, 4 Dimension Min Max A — 1.75 A1 0.10 0.25 A2 1.25 — b 0.20 0.30 c 0.17 0.25 D 4.89 BSC E 6.00 BSC E1 3.90 BSC e 0.635 BSC L 0.40 L2 1.27 0.25 BSC h 0.25 0.50 θ 0° 8° aaa 0.10 bbb 0.20 ccc 0.10 ddd 0.25 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-137, Variation AB. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 38 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 38 Si864x Data Sheet • Land Pattern (16-Pin QSOP) 12. Land Pattern (16-Pin QSOP) The figure below illustrates the recommended land pattern details for the Si86xx in a 16-pin QSOP package. The table lists the values for the dimensions shown in the illustration. Figure 12.1. 16-Pin QSOP PCB Land Pattern Table 12.1. 16-Pin QSOP Land Pattern Dimensions1, 2 Dimension Feature (mm) C1 Pad Column Spacing 5.40 E Pad Row Pitch 0.635 X1 Pad Width 0.40 Y1 Pad Length 1.55 Note: 1. This Land Pattern Design is based on IPC-7351 pattern SOP63P602X173-16N for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 39 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 39 Si864x Data Sheet • Top Marking (16-Pin Wide Body SOIC, -IS and -IS2 Package Options) 13. Top Marking (16-Pin Wide Body SOIC, -IS and -IS2 Package Options) Si86XYSV YYWWRTTTTT e4 TW Figure 13.1. 16-Pin Wide Body SOIC Top Marking Table 13.1. 16-Pin Wide Body SOIC Top Marking Explanation Si86 = Isolator product series XY = Channel Configuration X = # of data channels (4) Base Part Number Line 1 Marking: Ordering Options (See 1. Ordering Guide for more information). Y = # of reverse channels (5, 2, 1, 0)1 S = Speed Grade (max data rate) and operating mode: B = 150 Mbps (default output = low) E = 150 Mbps (default output = high) V = Insulation rating A = 1 kV; B = 2.5 kV; C = 3.75 kV; D = 5.0 kV; T = 5.0 kV with 10 kV surge capability. YY = Year Line 2 Marking: WW = Workweek RTTTTT = Mfg Code Circle = 1.7 mm Diameter Line 3Marking: (Center-Justified) Country of Origin ISO Code Abbreviation Assigned by assembly subcontractor. Corresponds to the year and workweek of the mold date. Manufacturing code from assembly house. “R” indicates revision. “e4” Pb-Free Symbol. TW = Taiwan as shown, TH = Thailand Note: 1. Si8645 has 0 reverse channels. 40 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 40 Si864x Data Sheet • Top Marking (16-Pin Narrow Body SOIC) 14. Top Marking (16-Pin Narrow Body SOIC) e3 Si86XYSV YYWWRTTTTT Figure 14.1. 16-Pin Narrow Body SOIC Top Marking Table 14.1. 16-Pin Narrow Body SOIC Top Marking Explanation Si86 = Isolator product series XY = Channel Configuration X = # of data channels (4) Base Part Number Line 1 Marking: Ordering Options (See 1. Ordering Guide for more information). Y = # of reverse channels (5, 2, 1, 0)1 S = Speed Grade (max data rate) and operating mode: B = 150 Mbps (default output = low) E = 150 Mbps (default output = high) V = Insulation rating A = 1 kV; B = 2.5 kV; C = 3.75 kV Circle = 1.2 mm Diameter “e3” Pb-Free Symbol YY = Year Assigned by the assembly subcontractor. Corresponds to the year and work week of the mold date. Line 2 Marking: WW = Work Week RTTTTT = Mfg Code Manufacturing code from assembly house. “R” indicates revision. Note: 1. Si8645 has 0 reverse channels. 41 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 41 Si864x Data Sheet • Top Marking (16-Pin QSOP) 15. Top Marking (16-Pin QSOP) Figure 15.1. 16-Pin QSOP Top Marking Table 15.1. 16-Pin QSOP Top Marking Explanation 86 = Isolator product series XY = Channel Configuration X = # of data channels (4) Base Part Number Line 1 Marking: Ordering Options (See 1. Ordering Guide for more information.) Y = # of reverse channels (5, 2, 1, 0)1 S = Speed Grade (max data rate) and operating mode: B = 150 Mbps (default output = low) E = 150 Mbps (default output = high) V = Insulation rating. A = 1 kV; B = 2.5 kV; C = 3.75 kV Line 2 Marking: RTTTTT = Mfg Code Line 3 Marking: YY = Year WW = Work Week Manufacturing code from assembly house. “R” indicates revision. Assigned by the Assembly House. Corresponds to the year and work week of the mold date. Note: 1. Si8645 has 0 reverse channels. 42 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 42 Si864x Data Sheet • Revision History 16. Revision History Revision 2.16 June, 2021 • Changed Si8641Bx, Ex VDD1 Max specification from 7.8 to 7.4 in Table 4.2 Electrical Characteristics on page 12, Table 4.3 Electrical Characteristics on page 17, and Table 4.4 Electrical Characteristics on page 21 • Corrected land pattern diagram of IS2 package • Increased IDD1 max spec from 5 mA to 6 mA for > 10 Mbps operation, based on production data. • Uniformity: Si86xx and Si86xxx were both used to designate the product family, this edition only uses Si86xx. • A row was added to the Truth Table 3.1 to define the condition when both VDDs are powered up but input is left not connected. • Corrected typos in section 2.2 "Eye Diagram” – units for oscilloscope x-axis were added. • Specified that 2 µA pull-ups/downs are integrated to enable the default high/low functions in Note 9, Truth Table 3.1. • A separate row was added to the VIOTM spec in Table 4.8 for all Si86xxxT devices, value = 8000 V. Revision 2.15 September 2019 • Updated Ordering Guide. Revision 2.14 February 2019 • Updated Ordering Guide. Revision 2.13 September 2018 • Added SI8640BB-AS, SI8641BC-AS1, and SI8642ED-AS to Ordering Guide for Automotive-Grade OPN options Revision 2.12 February 2018 • Added SI8641BD-AS to Ordering Guide for Automotive-Grade OPN options Revision 2.11 November 2017 • Added new table to Ordering Guide for Automotive-Grade OPN options Revision 2.1 October 18, 2017 • Added new OPNs in Ordering Guide for IU (QSOP) and IS2 (8 mm creepage WB SOIC) package options. • Added 62368-1 references throughout. • Removed 61010-1 references throughout. Revision 2.0 November 30, 2016 • Added note to Table 1.1 Ordering Guide for Valid OPNs1, 2, 5 on page 2 for denoting tape and reel marking. Revision 1.9 November 18, 2015 • Deleted duplicate Si8641BB-B-IU OPN listing and corrected Si8645BB-B-IU listing in 1. Ordering Guide. • Added QSOP-16 information to Table 4.7 IEC 60664-1 Ratings on page 25. • Added QSOP-16 information to Table 4.8 VDE 0884-10 Insulation Characteristics for Si86xx 1 on page 26. • Added QSOP-16 information to Table 4.9 VDE 0884-10 Safety Limiting Values 1 on page 26. • Added QSOP-16 reference to Figure 4.5 (NB SOIC-16, QSOP-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per VDE 0884-10 on page 27. 43 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 43 Si864x Data Sheet • Revision History Revision 1.8 October 29, 2015 • Added product options Si8641BB-B-IU, Si8645BB-B-IU and Si864xxT in 1. Ordering Guide. • Added spec line items for Input and Enable Leakage Currents pertaining to Si864xxT in Electrical Specifications. • Added new spec for tSD in 4. Electrical Specifications. • Updated IEC 60747-5-2 to IEC 60747-5-5 throughout document. Revision 1.7 June 18, 2015 • Updated Table 5 on page 14. • Added CQC certificate numbers. • Updated "4. Ordering Guide" on page 10. • Added Si8640BA OPN. • Removed references to moisture sensitivity levels. • Removed Note 2. Revision 1.6 September 25, 2013 • Added Figure 3, “Common Mode Transient Immunity Test Circuit,” on page 7. • Added references to CQC throughout. • Added references to 2.5 kVRMS devices throughout. • Updated "4. Ordering Guide" on page 10. • Updated "11.1. Top Marking (16-Pin Wide Body SOIC)" on page 20. Revision 1.5 October 3, 2012 • Updated "4. Ordering Guide" on page 10. • Updated "11.5. Top Marking (16-Pin QSOP)" on page 22. Revision 1.4 June 26, 2012 • Updated Table 11 on page 18. • Added junction temperature spec. • Updated "2.3.1. Supply Bypass" on page 7. • Removed “3.3.2 Pin Connections” on page 23. • Updated "3. Pin Descriptions" on page 9. • Updated table notes. • Updated "4. Ordering Guide" on page 10. • Removed Rev A devices. • Updated "5. Package Outline: 16-Pin Wide Body SOIC" on page 12. • Updated Top Marks. • Added revision description. Revision 1.3 March 21, 2012 • Updated "4. Ordering Guide" on page 10 to include MSL2A. Revision 1.2 February 15, 2012 • Updated Table 3, “Ordering Guide for Valid OPNs” on page 10. • Updated Note 1 with MSL2A. • Updated Current Revision Devices. 44 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 44 Si864x Data Sheet • Revision History Revision 1.1 September 14, 2011 • Updated High Level Output Voltage VOH to 3.1 V in Table 3, “Electrical Characteristics,” on page 8. • Updated High Level Output Voltage VOH to 2.3 V in Table 4, “Electrical Characteristics,” on page 11. Revision 1.0 July 14, 2011 • Reordered spec tables to conform to new convention. • Removed “pending” throughout document. Revision 0.2 March 31, 2011 • Added chip graphics on page 1. • Moved Tables 1 and 11 to page 18. • Updated Table 6, “Insulation and Safety-Related Specifications,” on page 15. • Updated Table 8, “IEC 60747-5-5 Insulation Characteristics for Si86xx,” on page 16. • Moved Table 1 to page 4. • Moved Table 2 to page 5. • Moved “Typical Performance Characteristics” to page 8. • Updated "3. Pin Descriptions" on page 9. • Updated "4. Ordering Guide" on page 10. Revision 0.1 September 15, 2010 • Initial release. 45 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com Rev. 2.16 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 3, 2021 45 Connecting Everyone and Everything, All the Time Portfolio Quality Support & Resources www.skyworksinc.com www.skyworksinc.com/quality www.skyworksinc.com/support Copyright © 2021 Skyworks Solutions, Inc. All Rights Reserved. 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