SI8660EB-B-IUR

Si8660/61/62/63 Data Sheet Low Power Six-Channel Digital Isolator KEY FEATURES Skyworks' family of ultra-low-power digital isolators are CMOS devices offering substantial data rate, propagation delay, power, size, reliability, and external BOM advantages over legacy isolation technologies. The operating parameters of these products remain stable across wide temperature ranges and throughout device service life for ease of design and highly uniform performance. All device versions have Schmitt trigger inputs for high noise immunity and only require VDD bypass capacitors. Data rates up to 150 Mbps are supported, and all devices achieve propagation delays of less than 10 ns. Ordering options include a choice of isolation ratings (1.0, 2.5, 3.75 and 5 kV) and a selectable fail-safe operating mode to control the default output state during power loss. All products >1 kVRMS are safety certified by UL, CSA, VDE, and CQC, and products in wide-body packages support reinforced insulation withstanding up to 5 kVRMS. Automotive Grade is available for certain part numbers. These products are built using automotive-specific flows at all steps in the manufacturing process to ensure the robustness and low defectivity required for automotive applications. Industrial Applications • Industrial automation systems • Medical electronics • Isolated switch mode supplies • Isolated ADC, DAC • Motor control • Power inverters • Communication systems Safety Regulatory Approvals • UL 1577 recognized • Up to 5000 VRMS for 1 minute • CSA component notice 5A approval • IEC 60950-1, 62368-1, 60601-1 (reinforced insulation) • VDE certification conformity • VDE 0884-10 • EN60950-1 (reinforced insulation) • CQC certification approval • GB4943.1 1 Automotive Applications • On-board chargers • Battery management systems • Charging stations • Traction inverters • Hybrid Electric Vehicles • Battery Electric Vehicles • High-speed operation • DC to 150 Mbps • No start-up initialization required • Wide Operating Supply Voltage • 2.5–5.5 V • Up to 5000 VRMS isolation • 60-year life at rated working voltage • High electromagnetic immunity • Ultra low power (typical) • 5 V Operation • 1.6 mA per channel at 1 Mbps • 5.5 mA per channel at 100 Mbps • 2.5 V Operation • 1.5 mA per channel at 1 Mbps • 3.5 mA per channel at 100 Mbps • Schmitt trigger inputs • Selectable fail-safe mode • Default high or low output (ordering option) • Precise timing (typical) • 10 ns propagation delay • 1.5 ns pulse width distortion • 0.5 ns channel-channel skew • 2 ns propagation delay skew • 5 ns minimum pulse width • Transient Immunity 50 kV/µs • AEC-Q100 qualification • Wide temperature range • –40 to 125 °C • RoHS-compliant packages • SOIC-16 wide body • SOIC-16 narrow body • QSOP-16 • Automotive-grade OPNs available • AIAG compliant PPAP documentation support • IMDS and CAMDS listing support Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 1 Si8660/61/62/63 Data Sheet • Ordering Guide 1. Ordering Guide Industrial and Automotive Grade OPNs Industrial-grade devices (part numbers having an “-I” in their suffix) are built using well-controlled, high-quality manufacturing flows to ensure robustness and reliability. Qualifications are compliant with JEDEC, and defect reduction methodologies are used throughout definition, design, evaluation, qualification, and mass production steps. Automotive-grade devices (part numbers having an “-A” in their suffix) are built using automotive-specific flows at all steps in the manufacturing process to ensure robustness and low defectivity. These devices are supported with AIAG-compliant Production Part Approval Process (PPAP) documentation, and feature International Material Data System (IMDS) and China Automotive Material Data System (CAMDS) listing. Qualifications are compliant with AEC-Q100, and a zero-defect methodology is maintained throughout definition, design, evaluation, qualification, and mass production steps. Table 1.1. Ordering Guide for Valid OPNs 1, 2, 4 Ordering Part Number (OPN) Automotive OPNs5, 6 Number Number of Inputs of Inputs Max Data Rate VDD1 VDD2 (Mbps) Side Side Default Output State Isolation Rating (kV) Package QSOP-16 Packages Si8660BB-B-IU Si8660BB-AU 6 0 150 Low 2.5 QSOP-16 Si8660EB-B-IU Si8660EB-AU 6 0 150 High 2.5 QSOP-16 Si8661BB-B-IU Si8661BB-AU 5 1 150 Low 2.5 QSOP-16 Si8661EB-B-IU Si8661EB-AU 5 1 150 High 2.5 QSOP-16 Si8662BB-B-IU Si8662BB-AU 4 2 150 Low 2.5 QSOP-16 Si8662EB-B-IU Si8662EB-AU 4 2 150 High 2.5 QSOP-16 Si8663BB-B-IU Si8663BB-AU 3 3 150 Low 2.5 QSOP-16 Si8663EB-B-IU Si8663EB-AU 3 3 150 High 2.5 QSOP-16 Si8660BA-B-IS1 Si8660BA-AS1 6 0 150 Low 1.0 NB SOIC-16 Si8660BB-B-IS1 Si8660BB-AS1 6 0 150 Low 2.5 NB SOIC-16 Si8660BC-B-IS1 Si8660BC-AS1 6 0 150 Low 3.75 NB SOIC-16 Si8660EC-B-IS1 Si8660EC-AS1 6 0 150 High 3.75 NB SOIC-16 Si8660BD-B-IS Si8660BD-AS 6 0 150 Low 5.0 WB SOIC-16 Si8660ED-B-IS Si8660ED-AS 6 0 150 High 5.0 WB SOIC-16 Si8661BB-B-IS1 Si8661BB-AS1 5 1 150 Low 2.5 NB SOIC-16 Si8661BC-B-IS1 Si8661BC-AS1 5 1 150 Low 3.75 NB SOIC-16 Si8661EC-B-IS1 Si8661EC-AS1 5 1 150 High 3.75 NB SOIC-16 Si8661BD-B-IS Si8661BD-AS 5 1 150 Low 5.0 WB SOIC-16 Si8661ED-B-IS Si8661ED-AS 5 1 150 High 5.0 WB SOIC-16 Si8661BD-B-IS2 Si8661BD-AS2 5 1 150 Low 5.0 WB SOIC-16 (8 mm creepage)7 Si8662BB-B-IS1 Si8662BB-AS1 4 2 150 Low 2.5 NB SOIC-16 Si8662BC-B-IS1 Si8662BC-AS1 4 2 150 Low 3.75 NB SOIC-16 SOIC-16 Packages 2 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 2 Si8660/61/62/63 Data Sheet • Ordering Guide Number Number of Inputs of Inputs Max Data Rate VDD1 VDD2 (Mbps) Side Side Default Output State Isolation Rating (kV) Package 150 High 3.75 NB SOIC-16 2 150 Low 5.0 WB SOIC-16 4 2 150 High 5.0 WB SOIC-16 Si8663BB-AS1 3 3 150 Low 2.5 NB SOIC-16 Si8663BC-B-IS1 Si8663BC-AS1 3 3 150 Low 3.75 NB SOIC-16 Si8663EC-B-IS1 Si8663EC-AS1 3 3 150 High 3.75 NB SOIC-16 Si8663BD-B-IS Si8663BD-AS 3 3 150 Low 5.0 WB SOIC-16 Si8663ED-B-IS Si8663ED-AS 3 3 150 High 5.0 WB SOIC-16 Ordering Part Number (OPN) Automotive OPNs5, 6 Si8662EC-B-IS1 Si8662EC-AS1 4 2 Si8662BD-B-IS Si8662BD-AS 4 Si8662ED-B-IS Si8662ED-AS Si8663BB-B-IS1 Notes: 1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifications and peak solder temperatures. 2. “Si” and “SI” are used interchangeably. 3. An "R" at the end of the part number denotes tape and reel packaging option. 4. Temperature range is –40 to 125 °C. 5. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical parameters to their Industrial-Grade (with an "–I" suffix) version counterparts. Automotive-Grade products are produced utilizing full automotive process flows and additional statistical process controls throughout the manufacturing flow. The Automotive-Grade part number is included on shipping labels. 6. In the top markings of each device, the Manufacturing Code represented by either “RTTTTT” or “TTTTTT” contains as its first character a letter in the range N through Z to indicate Automotive-Grade. 7. The package designated IS2 has a design that eliminates tie bars, thus allowing for extra creepage distance while maintaining standard WB SOIC-16 package dimensions and land pattern. 3 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 3 Table of Contents 1. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Eye Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 . . . 3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 Device Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 Undervoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.3 Layout Recommendations . 3.3.1 Supply Bypass . . . 3.3.2 Output Pin Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 . 8 . 8 3.4 Fail-Safe Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.5 Typical Performance Characteristics. . . . . . . . . . . . . . . . . . . . . . . 9 4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .11 5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 6. Package Outline (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . 28 7. Land Pattern (16-Pin Wide-Body SOIC). . . . . . . . . . . . . . . . . . . . . 30 8. Package Outline (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . 31 9. Land Pattern (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . 33 10. Package Outline (16-Pin QSOP) . . . . . . . . . . . . . . . . . . . . . . . 34 11. Land Pattern (16-Pin QSOP) . . . . . . . . . . . . . . . . . . . . . . . . 36 12. Top Marking (16-Pin Wide Body SOIC) 37 . . . . . . . . . . . . . . . . . . . . 13. Top Marking (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . 38 . . . . . . . . . . . . . . . . . . . . . . . . 39 15. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 14. Top Marking (16-Pin QSOP) 4 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 4 Si8660/61/62/63 Data Sheet • Functional Description 2. Functional Description 2.1 Theory of Operation The operation of an Si866x channel is analogous to that of an opto coupler, except an RF carrier is modulated instead of light. This simple architecture provides a robust isolated data path and requires no special considerations or initialization at start-up. A simplified block diagram for a single Si866x channel is shown in the figure below. Transmitter Receiver RF OSCILLATOR A MODULATOR SemiconductorBased Isolation Barrier DEMODULATOR B Figure 2.1. Simplified Channel Diagram A channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier. Referring to the Transmitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The Receiver contains a demodulator that decodes the input state according to its RF energy content and applies the result to output B via the output driver. This RF on/off keying scheme is superior to pulse code schemes as it provides best-in-class noise immunity, low power consumption, and better immunity to magnetic fields. See the figure below for more details. Input Signal Modulation Signal Output Signal Figure 2.2. Modulation Scheme 5 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 5 Si8660/61/62/63 Data Sheet • Functional Description 2.2 Eye Diagram The figure below illustrates an eye-diagram taken on an Si8660. For the data source, the test used an Anritsu (MP1763C) Pulse Pattern Generator set to 1000 ns/div. The output of the generator's clock and data from an Si8660 were captured on an oscilloscope. The results illustrate that data integrity was maintained even at the high data rate of 150 Mbps. The results also show that 2 ns pulse width distortion and 350 ps peak jitter were exhibited. Figure 2.3. Eye Diagram 6 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 6 Si8660/61/62/63 Data Sheet • Device Operation 3. Device Operation Device behavior during start-up, normal operation, and shutdown is shown in Figure 3.1 Device Behavior during Normal Operation on page 8, where UVLO+ and UVLO- are the positive-going and negative-going thresholds respectively. Refer to the table below to determine outputs when power supply (VDD) is not present. Table 3.1. Si866x Logic Operation VI Input 1,2 VDDI State1,3,4 VDDO State1,3,4 VO Output1,2 H P P H L P P L X5 UP P L6 H6 X5 P UP Undetermined Comments Normal operation. Upon transition of VDDI from unpowered to powered, VO returns to the same state as VI in less than 1 µs. Upon transition of VDDO from unpowered to powered, VO returns to the same state as VI within 1 µs. Notes: 1. VDDI and VDDO are the input and output power supplies. VI and VO are the respective input and output terminals. 2. X = not applicable; H = Logic High; L = Logic Low; Hi-Z = High Impedance. 3. “Powered” state (P) is defined as 2.5 V < VDD < 5.5 V. 4. “Unpowered” state (UP) is defined as VDD = 0 V. 5. Note that an I/O can power the die for a given side through an internal diode if its source has adequate current. 6. See 1. Ordering Guide for details. This is the selectable fail-safe operating mode (ordering option). Some devices have default output state = H, and some have default output state = L, depending on the ordering part number (OPN). For default high devices, the data channels have pull-ups on inputs/outputs. For default low devices, the data channels have pull-downs on inputs/outputs. 3.1 Device Startup Outputs are held low during powerup until VDD is above the UVLO threshold for time period tSTART. Following this, the outputs follow the states of inputs. 7 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 7 Si8660/61/62/63 Data Sheet • Device Operation 3.2 Undervoltage Lockout Undervoltage Lockout (UVLO) is provided to prevent erroneous operation during device startup and shutdown or when VDD is below its specified operating circuits range. Both Side A and Side B each have their own undervoltage lockout monitors. Each side can enter or exit UVLO independently. For example, Side A unconditionally enters UVLO when VDD1 falls below VDD1(UVLO–) and exits UVLO when VDD1 rises above VDD1(UVLO+). Side B operates the same as Side A with respect to its VDD2 supply. UVLO+ UVLO- VDD1 UVLO+ UVLO- VDD2 INPUT tSTART tSD tSTART tSTART tPHL tPLH OUTPUT Figure 3.1. Device Behavior during Normal Operation 3.3 Layout Recommendations To ensure safety in the end user application, high voltage circuits (i.e., circuits with >30 VAC) must be physically separated from the safety extra-low voltage circuits (SELV is a circuit with 109 >109 >109 Ω Note: 1. Maintenance of the safety data is ensured by protective circuits. The Si86xxxx provides a climate classification of 40/125/21. Table 4.9. VDE 0884-10 Safety Limiting Values1 Parameter Case Temperature Symbol Max Test Condition WB SOIC-16 NB SOIC-16 TS Unit QSOP-16 150 150 150 °C 220 215 215 mA 415 415 415 mW θJA = 100 °C/W (WB SOIC-16) Safety Input, Output, or Supply Current IS 105 °C/W (NB SOIC-16, QSOP-16) VI = 5.5 V, TJ = 150 °C, TA = 25 °C Device Power Dissipation2 PD Note: 1. Maximum value allowed in the event of a failure; also see the thermal derating curve in Figure 4.3 (WB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per VDE 0884-10 on page 25 and Figure 4.4 (NB SOIC-16, QSOP-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per VDE 0884-10 on page 25. 2. The Si86xx is tested with VDD1 = VDD2 = 5.5 V; TJ = 150 ºC; CL = 15 pF, input a 150 Mbps 50% duty cycle square wave. Table 4.10. Thermal Characteristics Parameter IC Junction-to-Air Thermal Resistance 24 Symbol WB SOIC-16 NB SOIC-16/QSOP-16 Unit θJA 100 105 °C/W Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 24 Si8660/61/62/63 Data Sheet • Electrical Specifications Safety-Limiting Current (mA) 500 450 VDD1, VDD2 = 2.70 V 400 370 VDD1, VDD2 = 3.6 V 300 220 200 VDD1, VDD2 = 5.5 V 100 0 0 50 100 Temperature (ºC) 150 200 Figure 4.3. (WB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per VDE 0884-10 Safety-Limiting Current (mA) 500 430 VDD1, VDD2 = 2.70 V 400 360 VDD1, VDD2 = 3.6 V 300 215 200 VDD1, VDD2 = 5.5 V 100 0 0 50 100 Temperature (ºC) 150 200 Figure 4.4. (NB SOIC-16, QSOP-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per VDE 0884-10 25 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 25 Si8660/61/62/63 Data Sheet • Electrical Specifications Table 4.11. Absolute Maximum Ratings 1 Parameter Symbol Min Max Unit TSTG –65 150 °C Ambient Temperature Under Bias TA –40 125 °C Junction Temperature TJ — 150 °C VDD1, VDD2 –0.5 7.0 V Input Voltage VI –0.5 VDD + 0.5 V Output Voltage VO –0.5 VDD + 0.5 V Output Current Drive Channel IO — 10 mA Lead Solder Temperature (10 s) — 260 °C Maximum Isolation (Input to Output) (1 sec) NB SOIC-16, QSOP-16 — 4500 VRMS Maximum Isolation (Input to Output) (1 sec) WB SOIC-16 — 6500 VRMS Storage Temperature 2 Supply Voltage Notes: 1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to conditions as specified in the operational sections of this data sheet. 2. VDE certifies storage temperature from –40 to 150 °C. 26 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 26 Si8660/61/62/63 Data Sheet • Pin Descriptions 5. Pin Descriptions VDD1 VDD2 RF XMITR A1 A2 RF XMITR A3 RF XMITR A4 RF XMITR A5 RF XMITR A6 RF XMITR GND1 I s o l a t i o n B1 RF RCVR B2 A2 RF XMITR RF RCVR B3 A3 RF XMITR RF RCVR B4 A4 RF XMITR A5 RF XMITR A6 RF RCVR RF RCVR B5 RF RCVR B6 GND2 VDD1 VDD2 A1 A2 RF XMITR A3 RF XMITR A4 RF XMITR A5 RF RCVR A6 RF RCVR GND1 I s o l a t i o n VDD2 RF RCVR Si8660 RF XMITR VDD1 RF RCVR A1 RF XMITR GND1 B2 A2 RF RCVR B3 A3 RF XMITR RF RCVR B4 A4 RF RCVR RF XMITR B5 A5 RF RCVR RF RF XMITR RCVR B6 A6 RF RCVR GND2 RF RCVR B2 RF RCVR B3 RF RCVR B4 RF RCVR B5 RF XMITR B6 GND2 VDD2 RF XMITR Si8662 B1 VDD1 A1 B1 RF RCVR Si8661 RF XMITR RF RCVR I s o l a t i o n GND1 I s o l a t i o n RF RCVR B1 RF RCVR B2 RF RCVR B3 RF XMITR B4 RF XMITR B5 RF RF XMITR RCVR B6 GND2 Si8663 Figure 5.1. Si866x Pinout Table 5.1. Si866x Pin Descriptions 27 Name SOIC-16 Pin# Type Description VDD1 1 Supply A1 2 Digital Input Side 1 digital input. A2 3 Digital Input Side 1 digital input. A3 4 Digital Input Side 1 digital input. A4 5 Digital I/O Side 1 digital input or output. A5 6 Digital I/O Side 1 digital input or output. A6 7 Digital I/O Side 1 digital input or output. GND1 8 Ground Side 1 ground. GND2 9 Ground Side 2 ground. B6 10 Digital I/O Side 2 digital input or output. B5 11 Digital I/O Side 2 digital input or output. B4 12 Digital I/O Side 2 digital input or output. B3 13 Digital Output Side 2 digital output. B2 14 Digital Output Side 2 digital output. B1 15 Digital Output Side 2 digital output. VDD2 16 Supply Side 2 power supply. Side 1 power supply. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 27 Si8660/61/62/63 Data Sheet • Package Outline (16-Pin Wide Body SOIC) 6. Package Outline (16-Pin Wide Body SOIC) The figure below illustrates the package details for the Si86xx digital isolator in a 16-pin wide-body SOIC package. The table below lists the values for the dimensions shown in the illustration. Figure 6.1. 16-Pin Wide Body SOIC 28 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 28 Si8660/61/62/63 Data Sheet • Package Outline (16-Pin Wide Body SOIC) Table 6.1. 16-Pin Wide Body SOIC Package Diagram Dimensions Dimension Min Max A — 2.65 A1 0.10 0.30 A2 2.05 — b 0.31 0.51 c 0.20 0.33 D 10.30 BSC E 10.30 BSC E1 7.50 BSC e 1.27 BSC L 0.40 1.27 h 0.25 0.75 θ 0° 8° ααα — 0.10 bbb — 0.33 ccc — 0.10 ddd — 0.25 eee — 0.10 fff — 0.20 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to JEDEC Outline MS-013, Variation AA. 4. Recommended reflow profile per JEDEC J-STD-020 specification for small body, lead-free components. 29 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 29 Si8660/61/62/63 Data Sheet • Land Pattern (16-Pin Wide-Body SOIC) 7. Land Pattern (16-Pin Wide-Body SOIC) The figure below illustrates the recommended land pattern details for the Si86xx in a 16-pin wide-body SOIC package. The table below lists the values for the dimensions shown in the illustration. Figure 7.1. 16-Pin Wide Body SOIC PCB Land Pattern Table 7.1. 16-Pin Wide Body SOIC Land Pattern Dimensions Dimension Feature (mm) C1 Pad Column Spacing 9.40 E Pad Row Pitch 1.27 X1 Pad Width 0.60 Y1 Pad Length 1.90 Notes: 1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P1032X265-16AN for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 30 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 30 Si8660/61/62/63 Data Sheet • Package Outline (16-Pin Narrow Body SOIC) 8. Package Outline (16-Pin Narrow Body SOIC) The figure below illustrates the package details for the Si86xx in a 16-pin narrow-body SOIC package. The table below lists the values for the dimensions shown in the illustration. Figure 8.1. 16-Pin Narrow Body SOIC 31 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 31 Si8660/61/62/63 Data Sheet • Package Outline (16-Pin Narrow Body SOIC) Table 8.1. 16-Pin Narrow Body SOIC Package Diagram Dimensions Dimension Min Max A — 1.75 A1 0.10 0.25 A2 1.25 — b 0.31 0.51 c 0.17 0.25 D 9.90 BSC E 6.00 BSC E1 3.90 BSC e 1.27 BSC L 0.40 L2 1.27 0.25 BSC h 0.25 0.50 θ 0° 8° aaa 0.10 bbb 0.20 ccc 0.10 ddd 0.25 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MS-012, Variation AC. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 32 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 32 Si8660/61/62/63 Data Sheet • Land Pattern (16-Pin Narrow Body SOIC) 9. Land Pattern (16-Pin Narrow Body SOIC) The figure below illustrates the recommended land pattern details for the Si86xx in a 16-pin narrow-body SOIC package. The table below lists the values for the dimensions shown in the illustration. Figure 9.1. 16-Pin Narrow Body SOIC PCB Land Pattern Table 9.1. 16-Pin Narrow Body SOIC Land Pattern Dimensions Dimension Feature (mm) C1 Pad Column Spacing 5.40 E Pad Row Pitch 1.27 X1 Pad Width 0.60 Y1 Pad Length 1.55 Notes: 1. This Land Pattern Design is based on IPC-7351 pattern SOIC127P600X165-16N for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 33 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 33 Si8660/61/62/63 Data Sheet • Package Outline (16-Pin QSOP) 10. Package Outline (16-Pin QSOP) The figure below illustrates the package details for the Si86xx in a 16-pin QSOP package. The table lists the values for the dimensions shown in the illustration. Figure 10.1. 16-Pin QSOP Package 34 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 34 Si8660/61/62/63 Data Sheet • Package Outline (16-Pin QSOP) Table 10.1. 16-Pin QSOP Package Diagram Dimensions1, 2, 3, 4 Dimension Min Max A — 1.75 A1 0.10 0.25 A2 1.25 — b 0.20 0.30 c 0.17 0.25 D 4.89 BSC E 6.00 BSC E1 3.90 BSC e 0.635 BSC L 0.40 L2 1.27 0.25 BSC h 0.25 0.50 θ 0° 8° aaa 0.10 bbb 0.20 ccc 0.10 ddd 0.25 Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-137, Variation AB. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 35 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 35 Si8660/61/62/63 Data Sheet • Land Pattern (16-Pin QSOP) 11. Land Pattern (16-Pin QSOP) The figure below illustrates the recommended land pattern details for the Si86xx in a 16-pin QSOP package. The table lists the values for the dimensions shown in the illustration. Figure 11.1. 16-Pin QSOP PCB Land Pattern Table 11.1. 16-Pin QSOP Land Pattern Dimensions1, 2 Dimension Feature (mm) C1 Pad Column Spacing 5.40 E Pad Row Pitch 0.635 X1 Pad Width 0.40 Y1 Pad Length 1.55 Note: 1. This Land Pattern Design is based on IPC-7351 pattern SOP63P602X173-16N for Density Level B (Median Land Protrusion). 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 36 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 36 Si8660/61/62/63 Data Sheet • Top Marking (16-Pin Wide Body SOIC) 12. Top Marking (16-Pin Wide Body SOIC) Si86XYSV YYWWRTTTTT TW e4 Figure 12.1. 16-Pin Wide Body SOIC Top Marking Table 12.1. 16-Pin Wide Body SOIC Top Marking Explanation Si86 = Isolator product series XY = Channel Configuration X = # of data channels (6) Base Part Number Line 1 Marking: Ordering Options Y = # of reverse channels (3, 2, 1, 0) S = Speed Grade A = 1 Mbps (See 1. Ordering Guide for more information.) B = 150 Mbps (default output = low) E = 150 Mbps (default output = high) V = Insulation rating A = 1 kV; B = 2.5 kV; C = 3.75 kV; D = 5.0 kV YY = Year Line 2 Marking: WW = Workweek RTTTTT = Mfg Code Circle = 1.7 mm Diameter Line 3 Marking: (Center-Justified) Country of Origin ISO Code Abbreviation 37 Assigned by assembly subcontractor. Corresponds to the year and workweek of the mold date. Manufacturing code from assembly house “R” indicates revision “e4” Pb-Free Symbol TW = Taiwan as shown, TH = Thailand Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 37 Si8660/61/62/63 Data Sheet • Top Marking (16-Pin Narrow Body SOIC) 13. Top Marking (16-Pin Narrow Body SOIC) e3 Si86XYSV YYWWRTTTTT Figure 13.1. 16-Pin Narrow Body SOIC Top Marking Table 13.1. 16-Pin Narrow Body SOIC Top Marking Explanation Si86 = Isolator product series XY = Channel Configuration X = # of data channels (6) Base Part Number Line 1 Marking: Ordering Options Y = # of reverse channels (3, 2, 1, 0) S = Speed Grade A = 1 Mbps (See 1. Ordering Guide for more information.) B = 150 Mbps (default output = low) E = 150 Mbps (default output = high) V = Insulation rating A = 1 kV; B = 2.5 kV; C = 3.75 kV Line 2 Marking: Circle = 1.2 mm Diameter “e3” Pb-Free Symbol YY = Year Assigned by the Assembly House. Corresponds to the year and work week of the mold date. WW = Work Week RTTTTT = Mfg Code Circle = 1.2 mm diameter 38 Manufacturing code from assembly house. “R” indicates revision. “e3” Pb-Free Symbol. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 38 Si8660/61/62/63 Data Sheet • Top Marking (16-Pin QSOP) 14. Top Marking (16-Pin QSOP) Figure 14.1. 16-Pin QSOP Top Marking Table 14.1. 16-Pin QSOP Top Marking Explanation 86 = Isolator product series XY = Channel Configuration X = # of data channels (6) Base Part Number Line 1 Marking: Ordering Options (See 1. Ordering Guide for more information). Y = # of reverse channels (3, 2, 1, 0) S = Speed Grade (max data rate) and operating mode: B = 150 Mbps (default output = low) E = 150 Mbps (default output = high) V = Insulation rating A = 1 kV; B = 2.5 kV; C = 3.75 kV Line 2 Marking: RTTTTT = Mfg Code Line 3 Marking: 39 YY = Year WW = Work Week Manufacturing code from assembly house “R” indicates revision Assigned by the Assembly House. Corresponds to the year and work week of the mold date. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 39 Si8660/61/62/63 Data Sheet • Revision History 15. Revision History Revision A July 2022 • Added Agile data sheet revision in footer. Revision 1.73 September 2019 • Updated the Ordering Guide. Revision 1.72 October 2018 • Added new Automotive-Grade OPN options. Revision 1.71 January 2018 • Added new table to Ordering Guide for Automotive-Grade OPN options. Revision 1.7 October 18, 2017 • Added new OPNs in Ordering Guide for IU (QSOP) and IS2 (8 mm creepage WB SOIC) package options. • Added 62368-1 references throughout. • Removed 61010-1 references throughout. • Added QSOP-16 package information. Revision 1.6 June 18, 2015 • Updated Table 4.5 Regulatory Information 1 on page 22. • Added CQC certificate numbers. • Updated 1. Ordering Guide. • Removed references to moisture sensitivity levels. • Removed Note 2. • Added note to Table 1.1 Ordering Guide for Valid OPNs 1, 2, 4 on page 2 for denoting tape and reel marking. Revision 1.5 September 25, 2013 • Added Figure 4.2 Common Mode Transient Immunity Test Circuit on page 15. • Added references to CQC throughout. • Added references to 2.5 kVRMS devices throughout. • Updated 1. Ordering Guide. • Updated 12. Top Marking (16-Pin Wide Body SOIC). Revision 1.4 June 26, 2012 • Updated Table 4.11 Absolute Maximum Ratings 1 on page 26. • Added junction temperature spec. • Updated 3.3.1 Supply Bypass. • Removed “3.3.2. Pin Connections”. • Updated 1. Ordering Guide. • Removed Rev A devices. 40 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 40 Si8660/61/62/63 Data Sheet • Revision History • Updated 6. Package Outline (16-Pin Wide Body SOIC). • Updated Top Marks. • Added revision description. Revision 1.3 March 21, 2012 • Updated 1. Ordering Guide to include MSL2A. Revision 1.2 September 14, 2011 • Reordered spec tables to conform to new convention. • Removed “pending” throughout document. Revision 1.1 July 14, 2011 • Reordered spec tables to conform to new convention. • Removed “pending” throughout document. Revision 1.0 March 31, 2011 • Added chip graphics on front page. • Updated features list on front page. • Moved Table 4.1 Recommended Operating Conditions on page 11 and Table 4.11 Absolute Maximum Ratings 1 on page 26. • • • • • • Updated 4. Electrical Specifications. Moved Table 3.1 Si866x Logic Operation on page 7. Moved and updated 3.5 Typical Performance Characteristics. Updated Table 5.1 Si866x Pin Descriptions on page 27. Updated 1. Ordering Guide. Removed references to QSOP-16 package. Revision 0.1 September 15, 2010 • Initial release. 41 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206330A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2022 41 Connecting Everyone and Everything, All the Time Portfolio Quality Support & Resources skyworksinc.com skyworksinc.com/quality skyworksinc.com/support Copyright © 2022 Skyworks Solutions, Inc. 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