SIM3C156-B-GM

SiM3C1xx High-Performance, Low-Power, 32-Bit Precision32™ MCU Family with up to 256 kB of Flash 32-bit ARM® Cortex™-M3 CPU - 80 MHz maximum frequency - Single-cycle multiplication, hardware division support - Nested vectored interrupt control (NVIC) with 16 priority levels Analog Peripherals - 2 x 12-Bit Analog-to-Digital Converters: Up to 250 ksps 12-bit Memory - 32–256 kB Flash, in-system programmable - 8–32 kB SRAM (including 4 kB retention SRAM) - 16-channel DMA controller - External bus interface supports up to 16 MB of external mem- - mode or 1 Msps 10-bit mode, internal or external reference 2 x 10-Bit Current-mode Digital-to-Analog Converters, fourword buffer enables 12-bit operation 2 x Low-current comparators es ig ns - 16-Channel Capacitance-to-Digital: Fast, 20 MHz) or LPOSC0 (20 MHz) or LPOSC0 (20 MHz) or LPOSC0 (20 MHz) or LPOSC0 (20 MHz) or LPOSC0 ( 1.8 V 10 — 3000 μs Reset Delay from POR tPOR Relative to VDD > VPOR 3 — 100 ms Reset Delay from non-POR source tRST Time between release of reset source and code execution — 10 — μs RESET Low Time to Generate Reset tRSTL 50 — — ns Missing Clock Detector Response Time (final rising edge to reset) tMCD — 0.4 1 ms Missing Clock Detector Trigger Frequency FMCD — 7.5 13 kHz VDD Supply Monitor Turn-On Time tMON — 2 — μs fo r N ew VDD Ramp Time D Parameter N ot R ec om m en de d FAHB > 1 MHz 12 Rev.1.1 SiM3 C 1xx Table 3.5. On-Chip Regulators Parameter Symbol Test Condition Min Typ Max Unit 4 < VREGIN < 5.5 BGDIS = 0, SUSEN = 0 3.15 3.3 3.4 V 4 < VREGIN < 5.5 BGDIS = 0, SUSEN = 1 3.15 3.3 3.4 V 4 < VREGIN < 5.5 BGDIS = 1, SUSEN = X IDDOUT = 500 μA 2.3 2.8 3.6 V 4 < VREGIN < 5.5 BGDIS = 1, SUSEN = X IDDOUT = 5 mA 2.1 3.3 V 4 < VREGIN < 5.5 BGDIS = 0, SUSEN = X — — 150 mA 4 < VREGIN < 5.5 BGDIS = 1, SUSEN = X — — 5 mA — 0.1 1 mV/mA 1 — 10 μF IDDOUT Output Load Regulation VDDLR Output Capacitance CVDD D 2.65 N ew Output Current (at VDD pin)* VDDOUT fo r Output Voltage (at VDD pin) es ig ns 3.3 V Regulator Characteristics (VREG0, Supplied from VREGIN Pin) BGDIS = 0 N ot R ec om m en de d *Note: Total current VREG0 is capable of providing. Any current consumed by the SiM3C1xx reduces the current available to external devices powered from VDD. Rev.1.1 13 SiM3C1xx Table 3.6. External Regulator Symbol Input Voltage Range (at VREGIN) Test Condition VREGIN Min Typ Max Unit 3.0 — 3.6 V Output Voltage (at EXREGOUT) VEXREGOUT Programmable in 100 mV steps 1.8 — NPN Current Drive INPN 400 mV Dropout 12 — PNP Current Drive IPNP VEXREGBD > VREGIN1.5 V –6 — VEXREGBD VREGIN >= 3.5 V VREGIN – 2.0 — VREGIN < 3.5 V 1.5 V — mA — mA — V — — V — — 11.5 mA 4.7 — — μF — 1 — mV/mA 47 — — nF 10 — 720 mA — — 10 % — — 20 % RSENSE — — 1  RPD — 5 — k RPU — 10 — k IEXTREGBD External Capacitance with External BJT CBJT Standalone Mode Load Regulation LRSTAND- Standalone Mode External Capacitance CSTAND- Current Limit Accuracy ALONE m en de d Current Limit Range ALONE 400 mV Dropout ILIMIT 1  Sense Resistor Foldback Limit Accuracy Current Sense Resistor Internal Pull-Down Internal Pull-Up om Current Sensor ec Sensing Pin Voltage VEXTREGSP VEXTREGSN Measured at EXTREGSP or EXTREGSN pin 2.2 — VREGIN V VDIFF (VEXTREGSP – VEXTREGSN) 10 — 1600 mV Current at EXTREGSN Pin IEXTREGSN — 8 — A Current at EXTREGSP Pin IEXTREGSP — VDIFF x 200 + 12 — A N ot R Differential Sensing Voltage N ew Standalone Mode Output Current D 3.6 fo r EXREGBD Voltage (PNP Mode) es ig ns Parameter 14 Rev.1.1 SiM3 C 1xx Table 3.7. Flash Memory Parameter Test Condition Min Typ Max Unit tWRITE One 16-bit Half Word 20 21 22 μs Erase Time1 tERASE One Page 20 21 22 ms tERALL Full Device 20 21 22 ms VPROG 1.8 — 3.6 V Endurance (Write/Erase Cycles) NWE 20k 100k — Cycles Retention2 tRET 10 100 — Years Write TA = 25 °C, 1k Cycles D VDD Voltage During Programming es ig ns Symbol Time1 N ew Notes: 1. Does not include sequencing time before and after the write/erase operation, which may take up to 35 μs. During a sequential write operation, this extra time is only taken prior to the first write and after the last write. 2. Additional Data Retention Information is published in the Quarterly Quality and Reliability Report. Table 3.8. Internal Oscillators Symbol Test Condition Min Typ Max Unit fPLL0OSC Full Temperature and Supply Range 77 79 80 MHz Power Supply Sensitivity* PSSPLL0OSC TA = 25 °C, Fout = 79 MHz — 430 — ppm/V Temperature Sensitivity* TSPLL0OSC VDD = 3.3 V, Fout = 79 MHz — 95 — ppm/°C 23 — 80 MHz fREF = 20 MHz, fPLL0OSC = 80 MHz, M=24, N=99, LOCKTH = 0 — 1.7 — μs fREF = 32 kHz, fPLL0OSC = 80 MHz, M=0, N=2440, LOCKTH = 0 — 91 — μs Phase-Locked Loop (PLL0OSC) m en de d Calibrated Output Frequency* fo r Parameter fPLL0OSC Lock Time tPLL0LOCK R ec om Adjustable Output Frequency Range N ot *Note: PLL0OSC in free-running oscillator mode. Rev.1.1 15 SiM3C1xx Table 3.8. Internal Oscillators (Continued) Parameter Symbol Test Condition Min Typ Max Unit fLPOSC Full Temperature and Supply Range 19 20 21 MHz TA = 25 °C, VDD = 3.3 V 19.5 20 20.5 MHz fLPOSCD Full Temperature and Supply Range 2.375 2.5 2.625 MHz Power Supply Sensitivity PSSLPOSC TA = 25 °C — 0.5 — %/V Temperature Sensitivity TSLPOSC VDD = 3.3 V — 55 — ppm/°C Divided Oscillator Frequency fLFOSC Power Supply Sensitivity PSSLFOSC Temperature Sensitivity TSLFOSC Full Temperature and Supply Range 13.4 16.4 19.7 kHz TA = 25 °C, VDD = 3.3 V 15.8 16.4 17.3 kHz TA = 25 °C — 2.4 — %/V VDD = 3.3 V — 0.2 — %/°C fo r Oscillator Frequency N ew Low Frequency Oscillator (LFOSC0) D Oscillator Frequency es ig ns Low Power Oscillator (LPOSC0) m en de d RTC0 Oscillator (RTC0OSC) Missing Clock Detector Trigger Frequency fRTCMCD — 8 15 kHz RTC Robust Duty Cycle Range DCRTC 25 — 55 % Min Typ Max Unit *Note: PLL0OSC in free-running oscillator mode. Table 3.9. External Oscillator om Parameter Symbol Test Condition fCMOS 0 — 50 MHz External Input CMOS Clock High Time tCMOSH 9 — — ns External Input CMOS Clock Low Time tCMOSL 9 — — ns fXTAL 0.01 — 30 MHz ec External Input CMOS Clock Frequency* R External Crystal Clock Frequency N ot *Note: Minimum of 10 kHz during debug operations. 16 Rev.1.1 SiM3 C 1xx Table 3.10. SAR ADC Resolution Symbol Test Condition Nbits 12 Bit Mode Min Throughput Rate (Low Power Mode) fS Tracking Time tTRK SAR Clock Frequency fSAR Sample/Hold Capacitor Input Pin Capacitance Input Mux Impedance tCNV 1.8 12 Bit Mode — 10 Bit Mode — 12 Bit Mode — 10 Bit Mode — om Voltage Reference Range ec Input Voltage Range1 Power Supply Rejection Ratio CSAR CIN RMUX 3.6 V — 3.6 V — 250 ksps — 1 Msps — 62.5 ksps — 250 ksps 230 — — ns Low Power Mode 450 — — ns High Speed Mode — — 16.24 MHz Low Power Mode — — 4 MHz 10-Bit Conversion, SAR Clock = 16 MHz, APB Clock = 40 MHz 762.5 ns Gain = 1 — 5 — pF Gain = 0.5 — 2.5 — pF High Quality Inputs — 18 — pF Normal Inputs — 20 — pF High Quality Inputs — 300 —  Normal Inputs — 550 —  1 — VDD V Gain = 1 0 — VREF V Gain = 0.5 0 — 2xVREF V — 70 — dB 12 Bit Mode2 — ±1 ±1.9 LSB 10 Bit Mode — ±0.2 ±0.5 LSB VREF VIN — High Speed Mode m en de d Conversion Time Low Power Mode Bits D fS 2.2 N ew Throughput Rate (High Speed Mode) High Speed Mode Unit Bits 10 fo r VADC Max 12 10 Bit Mode Supply Voltage Requirements (VDD) Typ es ig ns Parameter PSRRADC R DC Performance N ot Integral Nonlinearity INL Notes: 1. Absolute input pin voltage is limited by the lower of the supply at VDD and VIO. 2. INL and DNL specifications for 12-bit mode do not include the first or last four ADC codes. 3. The maximum code in 12-bit mode is 0xFFFC. The Slope Error is referenced from the maximum code. Rev.1.1 17 SiM3C1xx Table 3.10. SAR ADC (Continued) Symbol Test Condition Min Typ Max Unit Differential Nonlinearity (Guaranteed Monotonic) DNL 12 Bit Mode2 –1 ±0.7 1.8 LSB 10 Bit Mode — ±0.2 ±0.5 LSB Offset Error (using VREFGND) EOFF 12 Bit Mode, VREF =2.4 V –2 0 2 LSB 10 Bit Mode, VREF =2.4 V –1 0 1 LSB — 0.004 — LSB/°C –0.07 –0.02 0.02 % Offset Temperatue Coefficient Slope Error3 TCOFF EM 12 Bit Mode es ig ns Parameter Signal-to-Noise Plus Distortion Total Harmonic Distortion (Up to 5th Harmonic) THD SFDR 62 66 — dB 10 Bit Mode 58 60 — dB 12 Bit Mode 62 66 — dB 10 Bit Mode 58 60 — dB 12 Bit Mode — 78 — dB 10 Bit Mode — 77 — dB 12 Bit Mode — –79 — dB 10 Bit Mode — –74 — dB m en de d Spurious-Free Dynamic Range SNDR 12 Bit Mode N ew SNR fo r Signal-to-Noise D Dynamic Performance with 10 kHz Sine Wave Input 1 dB below full scale, Max throughput N ot R ec om Notes: 1. Absolute input pin voltage is limited by the lower of the supply at VDD and VIO. 2. INL and DNL specifications for 12-bit mode do not include the first or last four ADC codes. 3. The maximum code in 12-bit mode is 0xFFFC. The Slope Error is referenced from the maximum code. 18 Rev.1.1 SiM3 C 1xx Table 3.11. IDAC Parameter Symbol Test Condition Min Typ Max Unit Integral Nonlinearity INL — ±0.5 ±2 LSB Differential Nonlinearity (Guaranteed Monotonic) DNL — ±0.5 ±1 LSB Output Compliance Range VOCR — — VDD – 1.0 V Full Scale Output Current IOUT 2 mA Range 2.0 2.046 2.10 mA 1 mA Range 0.99 1.023 1.05 mA 0.5 mA Range 493 511.5 525 μA — 250 — nA 2 mA Range — 100 — ppm/°C 2 mA Range — -220 — ppm/V — 1 — k — 1.2 — μs — 3 — μs Offset Error EOFF Full Scale Error Tempco TCFS VDD Power Supply Rejection Ratio Test Load Impedance (to VSS) Dynamic Performance min output to max output m en de d Output Settling Time to 1/2 LSB RTEST 10 N ot R ec om Startup Time Bits D Nbits fo r Resolution N ew es ig ns Static Performance Rev.1.1 19 SiM3C1xx Table 3.12. Capacitive Sense Maximum External Series Impedance Min Typ Max Unit tsingle 12-bit Mode — 25 — μs 13-bit Mode — 27 — μs 14-bit Mode — 29 — μs 16-bit Mode — 33 — μs Highest Gain Setting (default) — 45 — pF Lowest Gain Setting — 500 — pF Highest Gain Setting (default) — 50 — k CL CL Table 3.13. Current-to-Voltage Converter (IVC) Supply Voltage (VDD) Symbol Min Typ Max Unit 2.2 — 3.6 V 2.2 — VDD V 100 — — μA INLIVC –0.6 — 0.6 % VIVCOUT — 1.65 — V Input Range 1 mA (INxRANGE = 101) 1.55 1.65 1.75 V/mA Input Range 2 mA (INxRANGE = 100) 795 830 860 mV/mA Input Range 3 mA (INxRANGE = 011) 525 550 570 mV/mA Input Range 4 mA (INxRANGE = 010) 390 415 430 mV/mA Input Range 5 mA (INxRANGE = 001) 315 330 340 mV/mA Input Range 6 mA (INxRANGE = 000) 260 275 285 mV/mA — — 500 ns VDDIVC VIN Minimum Input Current (source) IIN Integral Nonlinearity Full Scale Output MIVC R ec om Slope m en de d Input Pin Voltage N ot Settling Time to 0.1% 20 Test Condition fo r Parameter es ig ns Maximum External Capacitive Load Test Condition D Single Conversion Time (Default Configuration) Symbol N ew Parameter VIVCOUT Rev.1.1 SiM3 C 1xx Table 3.14. Voltage Reference Electrical Characteristics VDD = 1.8 to 3.6 V, –40 to +85 °C unless otherwise specified. Symbol Test Condition Min VREFFS –40 to +85 °C, VDD = 1.8–3.6 V 1.62 Internal Fast Settling Reference Temperature Coefficient Turn-on Time Power Supply Rejection TCREFFS — tREFFS — PSRRREFFS — VDD Output Voltage μs 400 — ppm/V 2.7 — 3.6 V 25 °C ambient, VREF2X = 0 1.195 1.2 1.205 V 25 °C ambient, VREF2X = 1 2.39 2.4 2.41 V — — 10 mA — 25 — ppm/°C Load = 0 to 200 μA to VREFGND — 4.5 — ppm/μA CVREFP Load = 0 to 200 μA to VREFGND 0.1 — — μF tVREFPON 4.7 μF tantalum, 0.1 μF ceramic bypass — 3.8 — ms 0.1 μF ceramic bypass — 200 — μs VREF2X = 0 — 320 — ppm/V VREF2X = 1 — 560 — ppm/V Sample Rate = 250 ksps; VREF = 3.0 V — 5.25 — μA m en de d PSRRVREFP IEXTREF N ot R ec om 1.5 VREF2X = 1 LRVREFP Input Current — V Load Regulation External Reference ppm/°C 3.6 ISC Power Supply Rejection — — TCVREFP Turn-on Time 50 1.8 Temperature Coefficient Load Capacitor V VREF2X = 0 VREFP Short-Circuit Current 1.68 N ew Valid Supply Range Unit fo r On-Chip Precision Reference (VREF0) Max 1.65 D Output Voltage Typ es ig ns Parameter Rev.1.1 21 SiM3C1xx Table 3.15. Temperature Sensor Symbol Test Condition Min Typ Max Unit Offset VOFF TA = 0 °C — 760 — mV Offset Error* EOFF TA = 0 °C — ±14 — mV es ig ns Parameter M — 2.8 — mV/°C Slope Error* EM — ±120 — μV/°C Linearity — 1 — °C Turn-on Time — 1.8 — μs D Slope N ot R ec om m en de d fo r N ew *Note: Represents one standard deviation from the mean. 22 Rev.1.1 SiM3 C 1xx Table 3.16. Comparator Test Condition Min Typ Max Unit Response Time, CMPMD = 00 (Highest Speed) tRESP0 +100 mV Differential — 100 — ns –100 mV Differential — 150 — ns Response Time, CMPMD = 11 (Lowest Power) tRESP3 +100 mV Differential — 1.4 — μs –100 mV Differential — 3.5 — μs CMPHYP = 00 — 0.4 — mV CMPHYP = 01 — 8 — mV CMPHYP = 10 — CMPHYP = 11 — Negative Hysteresis Mode 0 (CPMD = 00) HYSCP- Negative Hysteresis Mode 1 (CPMD = 01) HYSCP- HYSCP+ ec om Positive Hysteresis Mode 2 (CPMD = 10) HYSCP+ N ot R Negative Hysteresis Mode 2 (CPMD = 10) HYSCP- 16 — mV 33 — mV CMPHYN = 00 — 0.4 — mV CMPHYN = 01 — –8 — mV CMPHYN = 10 — –16 — mV CMPHYN = 11 — –33 — mV CMPHYP = 00 — 0.5 — mV CMPHYP = 01 — 6 — mV CMPHYP = 10 — 12 — mV CMPHYP = 11 — 24 — mV CMPHYN = 00 — 0.5 — mV CMPHYN = 01 — –6.0 — mV CMPHYN = 10 — –12 — mV CMPHYN = 11 — –24 — mV CMPHYP = 00 — 0.6 — mV CMPHYP = 01 — 4.5 — mV CMPHYP = 10 — 9.5 — mV CMPHYP = 11 — 19 — mV CMPHYN = 00 — 0.6 — mV CMPHYN = 01 — –4.5 — mV CMPHYN = 10 — –9.5 — mV CMPHYN = 11 — –19 — mV m en de d Positive Hysteresis Mode 1 (CPMD = 01) D HYSCP+ N ew Positive Hysteresis Mode 0 (CPMD = 00) es ig ns Symbol fo r Parameter Rev.1.1 23 SiM3C1xx Table 3.16. Comparator (Continued) Typ Max Unit HYSCP+ CMPHYP = 00 — 1.4 — mV CMPHYP = 01 — 4 — mV CMPHYP = 10 — 8 — mV CMPHYP = 11 — 16 — mV CMPHYN = 00 — 1.4 — mV CMPHYN = 01 — –4 — mV CMPHYN = 10 — –8 — mV CMPHYN = 11 — –16 — mV –0.25 — VDD+0.25 V PB2 Pins — 7.5 — pF PB3 Pins — 10.5 — pF — 75 — dB — 72 — dB –10 0 10 mV — 3.5 — μV/°C HYSCP- Input Range (CP+ or CP–) VIN Input Pin Capacitance CCP Common-Mode Rejection Ratio CMRRCP Power Supply Rejection Ratio PSRRCP VOFF Input Offset Tempco TCOFF m en de d Input Offset Voltage NBits N ot R ec om Reference DAC Resolution 24 es ig ns Min D Negative Hysteresis Mode 3 (CPMD = 11) Test Condition N ew Positive Hysteresis Mode 3 (CPMD = 11) Symbol fo r Parameter Rev.1.1 6 bits SiM3 C 1xx Table 3.17. Port I/O Parameter Symbol Test Condition Min Typ Max Unit Low Drive, IOH = –2 mA VIO – 0.7 — — V High Drive, IOH = –5 mA VIO – 0.7 — — V Low Drive, IOL = 3 mA — — 0.6 V High Drive, IOL = 12.5 mA — — 0.6 V 1.8 < VIO < 2.0 0.7 x VIO — — V 2.0 < VIO < 3.6 VIO – 0.6 — — V Output Low Voltage* VOL Input High Voltage VIH Input Low Voltage VIL Pin Capacitance CIO — D VOH — 0.6 V PB0, PB1 and PB2 Pins — 4 — pF PB3 Pins — 7 — pF –6 –3.5 –2 μA –30 –20 –10 μA –1 — 1 μA 0 5 150 μA VIO < VIN < VREGIN (pins with EXREG functions) 0 5 150 μA Standard Mode, Low Drive, IOH = –3 mA VIOHD – 0.7 — — V Standard Mode, High Drive, IOH = –10 mA VIOHD – 0.7 — — V Standard Mode, Low Drive, IOH = 3 mA — — 0.6 V Standard Mode, High Drive, IOH = 12.5 mA — — 0.6 V Slew Rate Mode 0, VIOHD = 5 V — 50 — ns Slew Rate Mode 1, VIOHD = 5 V — 300 — ns Slew Rate Mode 2, VIOHD = 5 V — 1 — μs Slew Rate Mode 3, VIOHD = 5 V — 3 — μs VIO = 1.8 N ew Output High Voltage* Weak Pull-Up Current (Input Voltage = 0 V) IPU Input Leakage (Pullups off or Analog) ILK 0 < VIN < VIO Input Leakage Current of Port Bank 3 I/O, VIN above VIO IL VIO < VIN < VIO+2.0 V (pins without EXREG functions) Output High Voltage ec om Output Low Voltage N ot R Output Rise Time fo r VIO = 3.6 m en de d High Drive I/O (PB4) VOH VOL tR es ig ns Standard I/O (PB0, PB1, and PB2), 5 V Tolerant I/O (PB3), and RESET *Note: RESET does not drive to logic high. Specifications for RESET VOL adhere to the low drive setting. Rev.1.1 25 SiM3C1xx Table 3.17. Port I/O (Continued) Min Typ Max Unit tF Slew Rate Mode 0, VIOHD = 5 V — 50 — ns Slew Rate Mode 1, VIOHD = 5 V — Slew Rate Mode 2, VIOHD = 5 V — Slew Rate Mode 3, VIOHD = 5 V — 1.8 V< VIOHD < 2.0 V 0.7 x VIOHD 2.0 V< VIOHD < 6 V VIH Input Low Voltage VIL ISINKL Mode 0 300 — ns 1 — μs 3 — μs — — V VIOHD – 0.6 — — V — — 0.6 V mA — 1.75 — — 2.5 — — 3.5 — — 4.75 — Mode 4 — 7 — Mode 5 — 9.5 — Mode 6 — 14 — Mode 7 — 18.75 — Mode 8 — 28.25 — Mode 9 — 37.5 — Mode 10 — 56.25 — Mode 11 — 75 — Mode 12 — 112.5 — Mode 13 — 150 — Mode 14 — 225 — Mode 15 — 300 — — — 400 Mode 1 Mode 2 Mode 3 om m en de d fo r N-Channel Sink Current Limit (2.7 V < VIOHD < 6 V, VOL = 0.8 V) See Figure 3.1 Total N-Channel Sink Current on P4.0-P4.5 (DC) es ig ns Input High Voltage Test Condition D Output Fall Time Symbol N ew Parameter ISINKLT N ot R ec *Note: RESET does not drive to logic high. Specifications for RESET VOL adhere to the low drive setting. 26 Rev.1.1 mA SiM3 C 1xx Table 3.17. Port I/O (Continued) Min Typ Max Unit ISRCL Mode 0 — 0.8 — mA Mode 1 — 1.25 — Mode 2 — 1.75 — Mode 3 — 2.5 — Mode 4 — 3.5 — Mode 5 — 4.75 — Mode 6 — 7 — Mode 7 — 9.5 — Mode 8 — 14 — Mode 9 — 18.75 — Mode 10 — 28.25 — — 37.5 — — 56.25 — — 75 — Mode 14 — 112.5 — Mode 15 — 150 — — — 400 mA — 30 — pF VIOHD = 1.8 V –6 –3.5 –2 μA VIOHD = 3.6 V –30 –20 –10 μA VIOHD = 2.7 V –15 –10 –5 μA VIOHD = 6 V –30 –20 –10 μA –1 — 1 μA Mode 11 Mode 12 m en de d Pin Capacitance ISRCLT fo r Mode 13 Total P-Channel Source Current on P4.0-P4.5 (DC) Weak Pull-Up Current in Low Voltage Mode om Weak Pull-Up Current in High Voltage Mode Input Leakage (Pullups off) CIO IPU IPU es ig ns Test Condition D P-Channel Source Current Limit (2.7 V < VIOHD < 6 V, VOH = VIOHD – 0.8 V) See Figure 3.2 Symbol N ew Parameter ILK N ot R ec *Note: RESET does not drive to logic high. Specifications for RESET VOL adhere to the low drive setting. Rev.1.1 27 fo r N ew D es ig ns SiM3C1xx N ot R ec om m en de d Figure 3.1. Maximum Sink Current vs. PB4.x Pin Voltage Figure 3.2. Maximum Source Current vs. PB4.x Pin Voltage 28 Rev.1.1 SiM3 C 1xx 3.2. Thermal Conditions Table 3.18. Thermal Conditions Thermal Resistance* Symbol Test Condition Min JA LGA-92 Packages — TQFP-80 Packages — QFN-64 Packages — TQFP-64 Packages — QFN-40 Packages — Typ Max Unit es ig ns Parameter 35 — °C/W 40 — °C/W 25 — °C/W 30 — °C/W 30 — °C/W D *Note: Thermal resistance assumes a multi-layer PCB with any exposed pad soldered to a PCB pad. N ew 3.3. Absolute Maximum Ratings Stresses above those listed under Table 3.19 may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Parameter Symbol fo r Table 3.19. Absolute Maximum Ratings Test Condition Min Max Unit –55 125 °C TBIAS Storage Temperature TSTG –65 150 °C VDD VSS–0.3 4.2 V EXTVREG0 Not Used VSS–0.3 6.0 V EXTVREG0 Used VSS–0.3 3.6 V VIO VSS–0.3 4.2 V VIOHD VSS–0.3 6.5 V RESET, VIO > 3.3 V VSS–0.3 5.8 V RESET, VIO < 3.3 V VSS–0.3 VIO+2.5 V Port Bank 0, 1, and 2 I/O VSS–0.3 VIO+0.3 V Port Bank 4 I/O VSSHD–0.3 VIOHD+0.3 V Voltage on VDD Voltage on VREGIN Voltage on VIO om Voltage on VIOHD m en de d Ambient Temperature Under Bias VIN R ec Voltage on I/O pins, non Port Bank 3 I/O VREGIN N ot *Note: VSS and VSSHD provide separate return current paths for device supplies, but are not isolated. They must always be connected to the same potential on board. Rev.1.1 29 SiM3C1xx Table 3.19. Absolute Maximum Ratings (Continued) Min Max Unit VIN SiM3C1x7, PB3.0– PB3.7, VIO > 3.3 V VSS–0.3 5.8 V SiM3C1x7, PB3.0– PB3.7, VIO < 3.3 V VSS–0.3 SiM3C1x7, PB3.8 PB3.11 VSS–0.3 SiM3C1x6, PB3.0– PB3.5, VIO > 3.3 V VSS–0.3 5.8 V SiM3C1x6, PB3.0– PB3.5, VIO < 3.3 V VSS–0.3 VIO+2.5 V SiM3C1x6, PB3.6– PB3.9 VSS–0.3 Lowest of VIO+2.5, VREGIN+0.3, or 5.8 V VSS–0.3 Lowest of VIO+2.5, VREGIN+0.3, or 5.8 V es ig ns Test Condition fo r N ew Voltage on I/O pins, Port Bank 3 I/O Symbol m en de d SiM3C1x4, PB3.0– PB3.3 VIO+2.5 V Lowest of VIO+2.5, VREGIN+0.3, or 5.8 V D Parameter ISUPP VDD, VREGIN, VIO, VIOHD — 400 mA Total Current Sourced out of Ground Pins IVSS VSS, VSSHD 400 — mA Current Sourced or Sunk by Any I/O Pin IPIO PB0, PB1, PB2, PB3, and RESET –100 100 mA PB4 –300 300 mA PB0, PB1, PB2, PB3, and RESET –100 100 mA PB4 –300 300 mA Sum of all I/O and RESET –400 400 mA om Total Current Sunk into Supply Pins ec Current Injected on Any I/O Pin R Total Injected Current on I/O Pins IINJ IINJ N ot *Note: VSS and VSSHD provide separate return current paths for device supplies, but are not isolated. They must always be connected to the same potential on board. 30 Rev.1.1 SiM3 C 1xx Table 3.19. Absolute Maximum Ratings (Continued) Test Condition Min Max Unit PD LGA-92 Package — 570 mW TQFP-80 Package — QFN-64 Package — TQFP-64 Package — QFN-40 Package — 500 mW 800 mW 650 mW 650 mW D Power Dissipation at TA = 85 °C Symbol es ig ns Parameter N ot R ec om m en de d fo r N ew *Note: VSS and VSSHD provide separate return current paths for device supplies, but are not isolated. They must always be connected to the same potential on board. Rev.1.1 31 SiM3C1xx 4. Precision32™ SiM3C1xx System Overview 32-bit ARM Cortex-M3 CPU. MHz maximum operating frequency. Branch target cache and prefetch buffers to minimize wait states. 80 Memory: es ig ns The SiM3C1xx Precision32™ devices are fully integrated, mixed-signal system-on-a-chip MCUs. Highlighted features are listed below. Refer to Table 5.1 for specific product feature selection and part ordering numbers. Core: 32–256 kB Flash; in-system programmable, 8–32 kB SRAM (including 4 kB retention SRAM, which preserves state in PM9 mode). Power: Low drop-out (LDO) regulator for CPU core voltage. reset circuit and brownout detectors. 3.3 V output LDO for direct power from 5 V supplies. External transistor regulator. Power Management Unit (PMU). Up to 65 total multifunction I/O pins: N ew I/O: D Power-on Up to six programmable high-power capable (5–300 mA with programmable current limiting, 1.8–5 V). to twelve 5 V tolerant general purpose pins. Two flexible peripheral crossbars for peripheral routing. Up Clock Sources: oscillator with PLL: 23–80 MHz with ± 1.5% accuracy in free-running mode. internal oscillator: 20 MHz and 2.5 MHz modes. Low-frequency internal oscillator: 16.4 kHz. External RTC crystal oscillator: 32.768 kHz. External oscillator: Crystal, RC, C, CMOS clock modes. Programmable clock divider allows any oscillator source to be divided by binary factor from 1-128. Internal m en de d Data fo r Low-power Peripherals: 16-Channel DMA Controller. Hardware AES Encryption. 16/32-bit CRC. 128/192/256-bit Timers/Counters and PWM: Enhanced Programmable Counter Array (EPCAn) supporting advanced PWM and capture/compare. 2 x 2-channel Standard Programmable Counter Array (PCAn) supporting PWM and capture/compare. 2 x 32-bit Timers - can be split into 4 x 16-bit Timers, support PWM and capture/compare. Real Time Clock (RTCn). Low Power Timer. Watchdog Timer. om 6-channel Communications Peripherals: Memory Interface. 2 x USARTs and 2 x UARTs with IrDA and ISO7816 SmartCard support. 3 x SPIs. 2 x I2C. R ec External 2S I (receive and transmit). Analog: x 12-Bit Analog-to-Digital Converters (SARADC). x 10-Bit Digital-to-Analog Converter (IDAC). 16-Channel Capacitance-to-Digital Converter (CAPSENSE). 2 x Low-Current Comparators (CMP). 1 x Current-to-Voltage Converter (IVC) module with two channels. N ot 2 2 On-Chip Debugging With on-chip power-on reset, voltage supply monitor, watchdog timer, and clock oscillator, the SiM3C1xx devices are truly standalone system-on-a-chip solutions. The Flash memory is reprogrammable in-circuit, providing non32 Rev.1.1 SiM3 C 1xx N ot R ec om m en de d fo r N ew D es ig ns volatile data storage and allowing field upgrades of the firmware. User firmware has complete control of all peripherals and may individually shut down and gate the clocks of any or all peripherals for power savings. The on-chip debugging interface (SWJ-DP) allows non-intrusive (uses no on-chip resources), full speed, in-circuit debugging using the production MCU installed in the final application. This debug logic supports inspection and modification of memory and registers, setting breakpoints, single stepping, and run and halt commands. All analog and digital peripherals are fully functional while debugging. Each device is specified for 1.8 to 3.6 V operation over the industrial temperature range (–40 to +85 °C). The Port I/O and RESET pins are powered from the IO supply voltage. The SiM3C1xx devices are available in 40-pin or 64pin QFN, 64-pin or 80-pin TQFP, or 92-pin LGA packages. All package options are lead-free and RoHS compliant. See Table 5.1 for ordering information. A block diagram is included in Figure 4.1. Figure 4.1. Precision32™ SiM3C1xx Family Block Diagram Rev.1.1 33 SiM3C1xx 4.1. Power N ot R ec om m en de d fo r N ew D es ig ns 4.1.1. LDO and Voltage Regulator (VREG0) The SiM3C1xx devices include two internal regulators: the core LDO Regulator and the Voltage Regulator (VREG0). The LDO Regulator converts a 1.8–3.6 V supply to the core operating voltage of 1.8 V. This LDO consumes little power and provides flexibility in choosing a power supply for the system. The Voltage Regulator regulates from 5.5 to 2.7 V and can serve as an input to the LDO. This allows the device to be powered from up to a 5.5 V supply without any external components other than bypass capacitors. 4.1.2. Voltage Supply Monitor (VMON0) The SiM3C1xx devices include a voltage supply monitor which allows devices to function in known, safe operating condition without the need for external hardware. The supply monitor includes additional circuitry that can monitor the main supply voltage and the VREGIN input voltage divided by 4 (VREGIN / 4). The supply monitor module includes the following features: Main supply “VDD Low” (VDD below the early warning threshold) notification. Holds the device in reset if the main VDD supply drops below the VDD Reset threshold. VREGIN divided by 4 (VREGIN / 4) supply “VREGIN Low” notification. 4.1.3. External Regulator (EXTVREG0) The External Regulator provides all the circuitry needed for a high-power regulator except the power transistor (NPN or PNP) and current sensing resistor (if current limiting is enabled). The External Regulator module has the following features: Interfaces with either an NPN or PNP external transistor that serves as the pass device for the high current regulator. Automatic current limiting. Automatic foldback limiting. Sources up to 1 A for use by external circuitry. Variable output voltage from 1.8–3.6 V in 100 mV steps. 4.1.4. Power Management Unit (PMU) The Power Management Unit on the SiM3C1xx manages the power systems of the device. On power-up, the PMU ensures the core voltages are a proper value before core instruction execution begins. It also recognizes and manages the various wake sources for low-power modes of the device. The PMU module includes the following features: Up to 16 pin wake inputs can wake the device from Power Mode 9. The Low Power Timer, RTC0 (alarms and oscillator fail), Comparator 0, and the RESET pin can also serve as wake sources for Power Mode 9. All PM9 wake sources (except for the RESET pin) can also reset the Low Power Timer or RTC0 modules. Disables the level shifters to pins and peripherals to further reduce power usage in PM9. These level shifters must be re-enabed by firmware after exiting PM9. Provides a PMU_Asleep signal to a pin as an indicator that the device is in PM9. 34 Rev.1.1 SiM3 C 1xx N ot R ec om m en de d fo r N ew D es ig ns 4.1.5. Device Power Modes The SiM3C1xx devices feature four low power modes in addition to normal operating mode. Several peripherals provide wake up sources for these low power modes, including the Low-Power Timer (LPT0), RTC0 (alarms and oscillator failure notification), Comparator 0, and PMU Pin Wake. In addition, all peripherals can have their clocks disabled to reduce power consumption whenever a peripheral is not being used using the clock control (CLKCTRL) registers. 4.1.5.1. Normal Mode (Power Mode 0) Normal Mode is the default mode of the device. The core and peripherals are fully operational, and instructions are executed from flash memory. 4.1.5.2. Power Mode 1 In Power Mode 1 the core and peripherals are fully operational, with instructions executing from RAM. Compared with Normal Mode, the active power consumption of the device in PM1 is reduced. Additionally, at higher speeds in PM1, the core throughput can also be increased because RAM does not require additional wait states that reduce the instruction fetch speed. 4.1.5.3. Power Mode 2 In Power Mode 2 the core halts and any enabled peripherals continue to run at the selected clock speed. The power consumption in PM2 corresponds to the AHB and APB clocks left enabled, thus the power can be tuned to the optimal level for the needs of the application. To place the device in PM2, the core should execute a wait-forinterrupt (WFI) or wait-for-event (WFE) instruction. If the WFI instruction is called from an interrupt service routine, the interrupt that wakes the device from PM2 must be of a sufficient priority to be recognized by the core. It is recommended to perform both a DSB (Data Synchronization Barrier) and an ISB (Instruction Syncronization Barrier) operation prior to the WFI to ensure all bus accesses complete. When operating from the LFOSC0 with the DMACTRL0 AHB clock disabled, PM2 can achieve similar power consumption to PM3, but with the ability to wake on APB-clocked interrupts. For example, enabling only the APB clock to the Ports will allow the firmware to wake on a PMATCH0, PBEXT0 or PBEXT1 interrupt with minimal impact on the supply current. 4.1.5.4. Power Mode 3 In Power Mode 3, the AHB and APB clocks are halted. The device may only wake from enabled interrupt sources which do not require the APB clock (RTC0ALRM, RTC0FAIL, LPTIMER0, VDDLOW and VREGLOW). A special fast wake option allows the device to operate at a very low level from the RTC0TCLK or LFOSC0 oscillator while in PM3, but quickly switch to the faster LPOSC0 when the wake event occurs. Because the current consumption of these blocks is minimal, it is recommended to use the fast wake option. The device will enter PM3 on a WFI or WFE instruction. Because all AHB master clocks are disabled, the LPOSC will automatically halt and go into a low-power suspended state. If the WFI instruction is called from an interrupt service routine, the interrupt that wakes the device from PM3 must be of a sufficient priority to be recognized by the core. It is recommended to perform both a DSB (Data Synchronization Barrier) and an ISB (Instruction Synchronization Barrier) operation prior to the WFI to ensure all bus access is complete. 4.1.5.5. Power Mode 9 In Power Mode 9, the core and all peripherals are halted, all clocks are stopped, and the pins and peripherals are set to a lower power mode. In addition, standard RAM contents are not preserved, though retention RAM contents are still available after exiting the power mode. This mode provides the lowest power consumption for the device, but requires an appropriate reset to exit. The available reset sources to wake from PM9 are controlled by the Power Management Unit (PMU). Before entering PM9, the desired reset source(s) should be configured in the PMU. The SLEEPDEEP bit in the ARM System Control Register should be set, and the PMSEL bit in the RSTSRC0_CONFIG register must be set to indicate that PM9 is the desired power mode. The device will enter PM9 on a WFI or WFE instruction, and remain in PM9 until a reset configured by the PMU occurs. It is recommended to perform both a DSB (Data Synchronization Barrier) and an ISB (Instruction Synchronization Barrier) operation prior to the WFI to ensure all bus access is complete. Rev.1.1 35 SiM3C1xx 4.2. I/O N ot R ec om m en de d fo r N ew D es ig ns 4.2.1. General Features The SiM3C1xx ports have the following features: Push-pull or open-drain output modes and analog or digital modes. Option for high or low output drive strength. Port Match allows the device to recognize a change on a port pin value. Internal pull-up resistors are enabled or disabled on a port-by-port basis. Two external interrupts with up to 16 inputs provide monitoring capability for external signals. Internal Pulse Generator Timer (PB2 only) to generate simple square waves. A subset of pins can also serve as inputs to the Port Mapped Level Shifters available on the High Drive Pins. 4.2.2. High Drive Pins (PB4) The High Drive pins have the following additional features: Programmable safe state: high, low, or high impedance. Programmable drive strength and slew rates. Programmable hardware current limiting. Powered from a separate source (VIOHD, which can be up to 6 V) from the rest of the device. Supports various functions, including GPIO, UART1 pins, EPCA0 pins, or Port Mapped Level Shifting. 4.2.3. 5 V Tolerant Pins (PB3) The 5 V tolerant pins can be connected to external circuitry operating at voltages above the device supply without needing extra components to shift the voltage level. 4.2.4. Crossbars The SiM3C1xx devices have two Crossbars with the following features: Flexible peripheral assignment to port pins. Pins can be individually skipped to move peripherals as needed for design or layout considerations. The Crossbars have a fixed priority for each I/O function and assign these functions to the port pins. When a digital resource is selected, the least-significant unassigned port pin is assigned to that resource. If a port pin is assigned, the Crossbars skip that pin when assigning the next selected resource. Additionally, the Crossbars will skip port pins whose associated bits in the PBSKIPEN registers are set. This provides some flexibility when designing a system: pins involved with sensitive analog measurements can be moved away from digital I/O and peripherals can be moved around the chip as needed to ease layout constraints. 36 Rev.1.1 SiM3 C 1xx 4.3. Clocking N ot R ec om m en de d fo r N ew D es ig ns The SiM3C1xx devices have two system clocks: AHB and APB. The AHB clock services memory peripherals and is derived from one of seven sources: the RTC0 timer clock (RTC0TCLK), the Low Frequency Oscillator, the Low Power Oscillator, the divided Low Power Oscillator, the External Oscillator, and the PLL0 Oscillator. In addition, a divider for the AHB clock provides flexible clock options for the device. The APB clock services data peripherals and is synchronized with the AHB clock. The APB clock can be equal to the AHB clock (if AHB is less than or equal to 50 MHz) or set to the AHB clock divided by two. Clock Control allows the AHB and APB clocks to be turned off to unused peripherals to save system power. Any registers in a peripheral with disabled clocks will be unable to be accessed until the clocks are enabled. Most peripherals have clocks off by default after a power-on reset. Rev.1.1 37 SiM3C1xx N ot R ec om m en de d fo r N ew D es ig ns 4.3.1. PLL (PLL0) The PLL module consists of a dedicated Digitally-Controlled Oscillator (DCO) that can be used in Free-Running mode without a reference frequency, Frequency-Locked to a reference frequency, or Phase-Locked to a reference frequency. The reference frequency for Frequency-Lock and Phase-Lock modes can use one of multiple sources (including the external oscillator) to provide maximum flexibility for different application needs. Because the PLL module generates its own clock, the DCO can be locked to a particular reference frequency and then moved to Free-Running mode to reduce system power and noise. The PLL module includes the following features: Five output ranges with output frequencies ranging from 23 to 80 MHz. Multiple reference frequency inputs. Three output modes: free-running DCO, frequency-locked, and phase-locked. Ability to sense the rising edge or falling edge of the reference source. DCO frequency LSB dithering to provide finer average output frequencies. Spectrum spreading to reduce generated system noise. Low jitter and fast lock times. Ability to suspend all output frequency updates (including dithering and spectrum spreading) using the STALL bit during jitter-sensitive operations. 4.3.2. Low Power Oscillator (LPOSC0) The Low Power Oscillator is the default AHB oscillator on SiM3C1xx devices and enables or disables automatically, as needed. The Low Power Oscillator has the following features: 20 MHz and divided 2.5 MHz frequencies available for the AHB clock. Automatically starts and stops as needed. 4.3.3. Low Frequency Oscillator (LFOSC0) The low frequency oscillator (LFOSC0) provides a low power internal clock source running at approximately 16.4 kHz for the RTC0 timer and other peripherals on the device. No external components are required to use the low frequency oscillator 4.3.4. External Oscillators (EXTOSC0) The EXTOSC0 external oscillator circuit may drive an external crystal, ceramic resonator, capacitor, or RC network. A CMOS clock may also provide a clock input. The external oscillator output may be selected as the AHB clock or used to clock other modules independent of the AHB clock selection. The External Oscillator control has the following features: Support for external crystal, RC, C, or CMOS oscillators. Support external CMOS frequencies from 10 kHz to 50 MHz and external crystal frequencies from 10 kHz to 30 MHz. Various drive strengths for flexible crystal oscillator support. Internal frequency divide-by-two option available. 38 Rev.1.1 SiM3 C 1xx 4.4. Data Peripherals N ot R ec om m en de d fo r N ew D es ig ns 4.4.1. 16-Channel DMA Controller The DMA facilitates autonomous peripheral operation, allowing the core to finish tasks more quickly without spending time polling or waiting for peripherals to interrupt. This helps reduce the overall power consumption of the system, as the device can spend more time in low-power modes. The DMA controller has the following features: Utilizes ARM PrimeCell uDMA architecture. Implements 16 channels. DMA crossbar supports SARADC0, SARADC1, IDAC0, IDAC1, I2C0, I2S0, SPI0, SPI1, USART0, USART1, AES0, EPCA0, external pin triggers, and timers. Supports primary, alternate, and scatter-gather data structures to implement various types of transfers. Access allowed to all AHB and APB memory space. 4.4.2. 128/192/256-bit Hardware AES Encryption (AES0) The basic AES block cipher is implemented in hardware. The integrated hardware support for Cipher Block Chaining (CBC) and Counter (CTR) algorithms results in identical performance, memory bandwidth, and memory footprint between the most basic Electronic Codebook (ECB) algorithm and these more complex algorithms. This hardware accelerator translates to more core bandwidth available for other functions or a power savings for lowpower applications. The AES module includes the following features: Operates on 4-word (16-byte) blocks. Supports key sizes of 128, 192, and 256 bits for both encryption and decryption. Generates the round key for decryption operations. All cipher operations can be performed without any firmware intervention for a set of 4-word blocks (up to 32 kB). Support for various chained and stream-ciphering configurations with XOR paths on both the input and output. Internal 4-word FIFOs to facilitate DMA operations. Integrated key storage. Hardware acceleration for Cipher-Block Chaining (CBC) and Counter (CTR) algorithms utilizing integrated counterblock generation and previous-block caching. 4.4.3. 16/32-bit CRC (CRC0) The CRC module is designed to provide hardware calculations for Flash memory verification and communications protocols. The CRC module supports four common polynomials. The supported 32-bit polynomial is 0x04C11DB7 (IEEE 802.3). The three supported 16-bit polynomials are 0x1021 (CCITT-16), 0x3D65 (IEC16-MBus), and 0x8005 (ZigBee, 802.15.4, and USB). The CRC module includes the following features: Support for four common polynomials (one 32-bit and three 16-bit options). Byte-level bit reversal for the CRC input. Byte-order reorientation of words for the CRC input. Word or half-word bit reversal of the CRC result. Ability to configure and seed an operation in a single register write. Support for single-cycle parallel (unrolled) CRC computation for 32- or 8-bit blocks. Capability to CRC 32 bits of data per peripheral bus (APB) clock. Support for DMA writes using firmware request mode. Rev.1.1 39 SiM3C1xx 4.5. Counters/Timers and PWM N ot R ec om m en de d fo r N ew D es ig ns 4.5.1. Programmable Counter Array (EPCA0, PCA0, PCA1) The SiM3C1xx devices include two types of PCA module: Enhanced and Standard. The Enhanced Programmable Counter Array (EPCA0) and Standard Programmable Counter Array (PCA0, PCA1) modules are timer/counter systems allowing for complex timing or waveform generation. Multiple modules run from the same main counter, allowing for synchronous output waveforms. The Enhanced PCA module is multi-purpose, but is optimized for motor control applications. The EPCA module includes the following features: Three sets of channel pairs (six channels total) capable of generating complementary waveforms. Center- and edge-aligned waveform generation. Programmable dead times that ensure channel pairs are never both active at the same time. Programmable clock divisor and multiple options for clock source selection. Waveform update scheduling. Option to function while the core is inactive. Multiple synchronization triggers and outputs. Pulse-Width Modulation (PWM) waveform generation. High-speed square wave generation. Input capture mode. DMA capability for both input capture and waveform generation. PWM generation halt input. The Standard PCA module (PCA) includes the following features: Two independent channels. Center- and edge-aligned waveform generation. Programmable clock divisor and multiple options for clock source selection. Pulse-Width Modulation waveform generation. 4.5.2. 32-bit Timer (TIMER0, TIMER1) Each timer module is independent, and includes the following features: Operation as a single 32-bit or two independent 16-bit timers. Clocking options include the APB clock, the APB clock scaled using an 8-bit prescaler, the external oscillator, or falling edges on an external input pin (synchronized to the APB clock). Auto-reload functionality in both 32-bit and 16-bit modes. Up/Down count capability, controlled by an external input pin. Rising and falling edge capture modes. Low or high pulse capture modes. Duty cycle capture mode. Square wave output mode, which is capable of toggling an external pin at a given rate with 50% duty cycle. 32- or 16-bit pulse-width modulation mode. 40 Rev.1.1 SiM3 C 1xx es ig ns 4.5.3. Real-Time Clock (RTC0) The RTC0 module includes a 32-bit timer that allows up to 36 hours of independent time-keeping when used with a 32.768 kHz watch crystal. The RTC0 provides three alarm events in addition to a missing clock event, which can also function as interrupt, reset, or wakeup sources on SiM3C1xx devices. The RTC0 module includes internal loading capacitors that are programmable to 16 discrete levels, allowing compatibility with a wide range of crystals. The RTC0 output can be buffered and routed to a port bank pin to provide an accurate, low frequency clock to other devices while the core is in its lowest power down mode. The module also includes a low power internal low frequency oscillator that reduces low power mode current and is available for other modules to use as a clock source. The RTC module includes the following features: timer (supports up to 36 hours) with three separate alarms. for one alarm to automatically reset the RTC timer. Missing clock detector. Can be used with the internal low frequency oscillator (LFOSC0), an external 32.768 kHz crystal (no additional resistors or capacitors necessary), or with an external CMOS clock. Programmable internal loading capacitors support a wide range of external 32.768 kHz crystals. Operates directly from VDD and remains operational even when the device goes into its lowest power down mode. The RTC timer clock (RTC0TCLK) can be buffered and routed to an I/O pin to provide an accurate, low frequency clock to other devices while the core is in its lowest power down mode. 4.5.4. Low Power Timer (LPTIMER0) The Low Power Timer (LPTIMER0) module runs from the clock selected by the RTC0 module, allowing the LPTIMER0 to operate even if the AHB and APB clocks are disabled. The LPTIMER0 counter can increment using one of two clock sources: the clock selected by the RTC0 module, or rising or falling edges of an external signal. The Low Power Timer includes the following features: Runs on a low-frequency clock (RTC0TCLK) The LPTIMER counter can increment using one of two clock sources: the RTC0TCLK or rising or falling edges of an external signal. Overflow and threshold-match detection, which can generate an interrupt, reset the timer, or wake some devices from low power modes. Timer reset on threshold-match allows square-wave generation at a variable output frequency. 4.5.5. Watchdog Timer (WDTIMER0) The WDTIMER0 module includes a 16-bit timer, a programmable early warning interrupt, and a programmable reset period. The timer registers are protected from inadvertent access by an independent lock and key interface. The watchdog timer runs from the low frequency oscillator (LFOSC0). The Watchdog Timer has the following features: D 32-bit ec om m en de d fo r N ew Option Programmable timeout interval. interrupt to warn when the Watchdog Timer is nearing the reset trip value. Lock-out feature to prevent any modification until a system reset. N ot R Optional Rev.1.1 41 SiM3C1xx 4.6. Communications Peripherals N ot R ec om m en de d fo r N ew D es ig ns 4.6.1. External Memory Interface (EMIF0) The External Memory Interface (EMIF0) allows external parallel asynchronous devices, like SRAMs and LCD controllers, to appear as part of the system memory map. The EMIF0 module includes the following features: Provides a memory mapped view of multiple external devices. Support for byte, half-word and word accesses regardless of external device data-width. Error indicator for certain invalid transfers. Minimum external timing allows for 3 clocks per write or 4 clocks per read. Output bus can be shared between non-muxed and muxed devices. Available extended address output allows for up to 24-bit address with 8-bit parallel devices. Support for 8-bit and 16-bit (muxed-mode only) devices with up to two chip-select signals. Support for internally muxed devices with dynamic address shifting. Fully programmable control signal waveforms. 4.6.2. USART (USART0, USART1) The USART uses two signals (TX and RX) and a predetermined fixed baud rate to communicate with a single device. In addition to these signals, the USART0 module can optionally use a clock (UCLK) or hardware handshaking (RTS and CTS). The USART module provides the following features: Independent transmitter and receiver configurations with separate 16-bit baud rate generators. Synchronous or asynchronous transmissions and receptions. Clock master or slave operation with programmable polarity and edge controls. Up to 5 Mbaud (synchronous or asynchronous, TX or RX, and master or slave) or 1 Mbaud Smartcard (TX or RX). Individual enables for generated clocks during start, stop, and idle states. Internal transmit and receive FIFOs with flush capability and support for byte, half-word, and word reads and writes. Data bit lengths from 5 to 9 bits. Programmable inter-packet transmit delays. Auto-baud detection with support for the LIN SYNC byte. Automatic parity generation (with enable). Automatic start and stop generation (with separate enables). Transmit and receive hardware flow-control. Independent inversion correction for TX, RX, RTS, and CTS signals. IrDA modulation and demodulation with programmable pulse widths. Smartcard ACK/NACK support. Parity error, frame error, overrun, and underrun detection. Multi-master and half-duplex support. Multiple loop-back modes supported. Multi-processor communications support. 4.6.3. UART (UART0, UART1) The USART uses two signals (TX and RX) and a predetermined fixed baud rate to communicate with a single device. The UART module provides the following features: Independent transmitter and receiver configurations with separate 16-bit baud-rate generators. Asynchronous transmissions and receptions. Up to 5 Mbaud (TX or RX) or 1 Mbaud Smartcard (TX or RX). 42 Rev.1.1 SiM3 C 1xx transmit and receive FIFOs with flush capability and support for byte, half-word, and word reads and writes. Data bit lengths from 5 to 9 bits. Programmable inter-packet transmit delays. Auto-baud detection with support for the LIN SYNC byte. Automatic parity generation (with enable). Automatic start and stop generation. Transmit and receive hardware flow-control. Independent inversion correction for TX, RX, RTS, and CTS signals. IrDA modulation and demodulation with programmable pulse widths. Smartcard ACK/NACK support. Parity error, frame error, overrun, and underrun detection. Multi-master and half-duplex support. Multiple loop-back modes supported. 4.6.4. SPI (SPI0, SPI1) SPI is a 3- or 4-wire communication interface that includes a clock, input data, output data, and an optional select signal. The SPI module includes the following features: Supports 3- or 4-wire master or slave modes. Supports up to 10 MHz clock in master mode and 5 MHz clock in slave mode. Support for all clock phase and slave select (NSS) polarity modes. 16-bit programmable clock rate. Programmable MSB-first or LSB-first shifting. 8-byte FIFO buffers for both transmit and receive data paths to support high speed transfers. Programmable FIFO threshold level to request data service for DMA transfers. Support for multiple masters on the same data lines. 4.6.5. I2C (I2C0, I2C1) The I2C interface is a two-wire, bi-directional serial bus. The two clock and data signals operate in open-drain mode with external pull-ups to support automatic bus arbitration. Reads and writes to the interface are byte oriented with the I2C interface autonomously controlling the serial transfer of the data. Data can be transferred at up to 1/8th of the APB clock as a master or slave, which can be faster than allowed by the I2C specification, depending on the clock source used. A method of extending the clocklow duration is available to accommodate devices with different speed capabilities on the same bus. The I2C interface may operate as a master and/or slave, and may function on a bus with multiple masters. The I2C provides control of SDA (serial data), SCL (serial clock) generation and synchronization, arbitration logic, and start/ stop control and generation. The I2C module includes the following features: Standard (up to 100 kbps) and Fast (400 kbps) transfer speeds. Can operate down to APB clock divided by 32768 or up to APB clock divided by 8. Support for master, slave, and multi-master modes. Hardware synchronization and arbitration for multi-master mode. Clock low extending (clock stretching) to interface with faster masters. Hardware support for 7-bit slave and general call address recognition. Firmware support for 10-bit slave address decoding. Ability to disable all slave states. Programmable clock high and low period. Programmable data setup/hold times. N ot R ec om m en de d fo r N ew D es ig ns Internal Rev.1.1 43 SiM3C1xx Spike suppression up to 2 times the APB period. N ot R ec om m en de d fo r N ew D es ig ns 4.6.6. I2S (I2S0) The I2S module receives digital data from an external source over a data line in the standard I2S, left-justified, rightjustified, or time domain multiplexing format, de-serializes the data, and generates requests to transfer the data using the DMA. The module also reads stereo audio samples from the DMA, serializes the data, and sends it out of the chip on a data line in the same standard serial format for digital audio. The I2S receive interface consists of 3 signals: SCK (bit clock), WS (word select or frame sync), and SD (data input). The block’s transmit interface consists of 3 signals: SCK (bit clock), WS (word select or frame sync) and SD (data output). The I2S module includes the following features: Master or slave capability. Flexible 10-bit clock divider with 8-bit fractional clock divider provides support for various common sampling frequencies (16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, and 48 kHz) for up to two 32-bit channels. Support for DMA data transfers. Support for various data formats. Time Division Multiplexing 44 Rev.1.1 SiM3 C 1xx 4.7. Analog N ot R ec om m en de d fo r N ew D es ig ns 4.7.1. 12-Bit Analog-to-Digital Converters (SARADC0, SARADC1) The SARADC0 and SARADC1 modules on SiM3C1xx devices are Successive Approximation Register (SAR) Analog to Digital Converters (ADCs). The key features of the SARADC module are: Single-ended 12-bit and 10-bit modes. Supports an output update rate of 250 k samples per second in 12-bit mode or 1 M samples per second in 10-bit mode. Operation in low power modes at lower conversion speeds. Selectable asynchronous hardware conversion trigger with hardware channel select. Output data window comparator allows automatic range checking. Support for Burst Mode, which produces one set of accumulated data per conversion-start trigger with programmable power-on settling and tracking time. Conversion complete, multiple conversion complete, and FIFO overflow and underflow flags and interrupts supported. Flexible output data formatting. Sequencer allows up to 8 sources to be automatically scanned using one of four channel characteristic profiles without software intervention. Eight-word conversion data FIFO for DMA operations. Multiple SARADC modules can work together synchronously or by interleaving samples. Includes two internal references (1.65 V fast-settling, 1.2/2.4 V precision), support for an external reference, and support for an external signal ground. 4.7.2. Sample Sync Generator (SSG0) The SSG module includes a phase counter and a pulse generator. The phase counter is a 4-bit free-running counter clocked from the SARADC module clock. Counting-up from zero, the phase counter marks sixteen equallyspaced events for any number of SARADC modules. The ADCs can use this phase counter to start a conversion. The programmable pulse generator creates a 50% duty cycle pulse with a period of 16 phase counter ticks. Up to four programmable outputs available to external devices can be driven by the pulse generator with programmable polarity and a defined output setting when the pulse generator is stopped. The Sample Sync Generator module has the following features: Connects multiple modules together to perform synchronized actions. Outputs a clock synchronized to the internal sampling clock used by any number of SARADC modules to pins for use by external devices. Includes a phase counter, pulse generator, and up to four programmable outputs. 4.7.3. 10-Bit Digital-to-Analog Converter (IDAC0, IDAC1) The IDAC takes a digital value as an input and outputs a proportional constant current on a pin. The IDAC module includes the following features: 10-bit current DAC with support for four timer, up to seven external I/O, on demand, and SSG0 output update triggers. Ability to update on rising, falling, or both edges for any of the external I/O trigger sources (DACnTx). Supports an output update rate greater than 600 k samples per second. Support for three full-scale output modes: 0.5 mA, 1.0 mA and 2.0 mA. Four-word FIFO to aid with high-speed waveform generation or DMA interactions. Individual FIFO overrun, underrun, and went-empty interrupt status sources. Support for multiple data packing formats, including: single 10-bit sample per word, dual 10-bit samples per word, or four 8-bit samples per word. Support for left- and right-justified data. Rev.1.1 45 SiM3C1xx N ot R ec om m en de d fo r N ew D es ig ns 4.7.4. 16-Channel Capacitance-to-Digital Converter (CAPSENSE0) The Capacitance Sensing module measures capacitance on external pins and converts it to a digital value. The CAPSENSE module has the following features: Multiple start-of-conversion sources (CSnTx). Option to convert to 12, 13, 14, or 16 bits. Automatic threshold comparison with programmable polarity (“less than or equal” or “greater than”). Four operation modes: single conversion, single scan, continuous single conversion, and continuous scan. Auto-accumulate mode that will take and average multiple samples together from a single start of conversion signal. Single bit retry options available to reduce the effect of noise during a conversion. Supports channel bonding to monitor multiple channels connected together with a single conversion. Scanning option allows the module to convert a single or series of channels and compare against the threshold while the AHB clock is stopped and the core is in a low power mode. 4.7.5. Low Current Comparators (CMP0, CMP1) The Comparators take two analog input voltages and output the relationship between these voltages (less than or greater than) as a digital signal. The Low Power Comparator module includes the following features: Multiple sources for the positive and negative poles, including VDD, VREF, and 8 I/O pins. Two outputs are available: a digital synchronous latched output and a digital asynchronous raw output. Programmable hysteresis and response time. Falling or rising edge interrupt options on the comparator output. 4.7.6. Current-to-Voltage Converter (IVC0) The IVC module provides inputs to the SARADCn modules so the input current can be measured. The IVC module has the following features: Two independent channels. Programmable input ranges (1–6 mA full-scale). 46 Rev.1.1 SiM3 C 1xx 4.8. Reset Sources N ot R ec om m en de d fo r N ew D es ig ns Reset circuitry allows the controller to be easily placed in a predefined default condition. On entry to this reset state, the following occur: The core halts program execution. Module registers are initialized to their defined reset values unless the bits reset only with a power-on reset. External port pins are forced to a known state. Interrupts and timers are disabled. Clocks to all AHB peripherals are enabled. Clocks to all APB peripherals other than Watchdog Timer, EMIF0, and DMAXBAR are disabled. All registers are reset to the predefined values noted in the register descriptions unless the bits only reset with a power-on reset. The contents of RAM are unaffected during a reset; any previously stored data is preserved as long as power is not lost. The Port I/O latches are reset to 1 in open-drain mode. Weak pullups are enabled during and after the reset. For VDD Supply Monitor and power-on resets, the RESET pin is driven low until the device exits the reset state. On exit from the reset state, the program counter (PC) is reset, and the system clock defaults to an internal oscillator. The Watchdog Timer is enabled with the Low Frequency Oscillator (LFO0) as its clock source. Program execution begins at location 0x00000000. Rev.1.1 47 SiM3C1xx 4.9. Security om m en de d fo r N ew D es ig ns The peripherals on the SiM3C1xx devices have a register lock and key mechanism that prevents any undesired accesses of the peripherals from firmware. Each bit in the PERIPHLOCKx registers controls a set of peripherals. A key sequence must be written in order to the KEY register to modify any of the bits in PERIPHLOCKx. Any subsequent write to KEY will then inhibit any accesses of PERIPHLOCKx until it is unlocked again through KEY. Reading the KEY register indicates the current status of the PERIPHLOCKx lock state. If a peripheral’s registers are locked, all writes will be ignored. The registers can always be read, regardless of the peripheral’s lock state. ec 4.10. On-Chip Debugging N ot R The SiM3C1xx devices include JTAG and Serial Wire programming and debugging interfaces and ETM for instruction trace. The JTAG interface is supported on SiM3C1x7 and SiM3C1x6 devices only, and does not include boundary scan capabiites. The ETM interface is supported on SiM3C1x7 devices. The JTAG and ETM interfaces can be optionally enabled to provide more visibility while debugging at the cost of using several Port I/O pins. Additionally, if the core is configured for Serial Wire (SW) mode and not JTAG, then the Serial Wire Viewer (SWV) is available to provide a single pin to send out TPIU messages on SiM3C1x7 and SiM3C1x6 devices. Most peripherals have the option to halt or continue functioning when the core halts in debug mode. 48 Rev.1.1 SiM3 C 1xx N ew D es ig ns 5. Ordering Information fo r Figure 5.1. SiM3C1xx Part Numbering N ot R ec om m en de d All devices in the SiM3C1xx family have the following features: Core: ARM Cortex-M3 with maximum operating frequency of 80 MHz. Flash Program Memory: 32-256 kB, in-system programmable. RAM: 8–32 kB SRAM, with 4 kB retention SRAM I/O: Up to 65 multifunction I/O pins, including high-drive and 5 V-tolerant pins. Clock Sources: Internal and external oscillator options. 16-Channel DMA Controller. 128/192/256-bit AES. 16/32-bit CRC. Timers: 2 x 32-bit (4 x 16-bit). Real-Time Clock. Low-Power Timer. PCA: 1 x 6 channels (Enhanced), 2 x 2 channels (Standard). PWM, capture, and clock generation capabilites. ADC: 2 x 12-bit 250 ksps (10-bit 1 Msps) SAR. DAC: 2 x 10-bit IDAC. Temperature Sensor. Internal VREF. 16-channel Capacitive Sensing (CAPSENSE). Comparator: 2 x low current. Current to Voltage Converter (IVC). Buses: 2 x USART, 2 x UART, 3 x SPI, 2 x I2C, 1 x I2S. The inclusion of some features varies across different members of the device family. The differences are detailed in Table 5.1. Serial Rev.1.1 49 SiM3C1xx 65 6 SiM3C166-B-GM 256 32  16 50 4 SiM3C166-B-GQ* 256 32  16 50 SiM3C164-B-GM 256 32 SiM3C157-B-GM 128 32  SiM3C157-B-GQ* 128 32 SiM3C156-B-GM Flash Memory (kB) Package 24 es ig ns  Lead-free (RoHS Compliant) 256 32 16 8/8 16     LGA-92 D SiM3C167-B-GQ* Serial Wire Debugging Interface 16 ETM Debugging Interface 16 JTAG Debugging Interface Number of SARADC1 Channels 6 Number of PMU Pin Wake Sources Number of SARADC0 Channels 65 N ew Digital Port I/Os with High Drive Capability 24 Number of Comparator 0/1 Inputs (+/-) Digital Port I/Os (Total)  Number of CAPSENSE0 Channels Maximum Number of EMIF Address/Data Pins 256 32 fo r External Memory Interface (EMIF) SiM3C167-B-GM Ordering Part Number RAM (kB) Table 5.1. Product Selection Guide 16 16 8/8 16  13 15 15 6/6 15    QFN-64 4 13 15 15 6/6 15    TQFP-64 28 4 7 11 12 3/3 10   QFN-40 24 65 6 16 16 16 8/8 16     LGA-92  24 65 6 16 16 16 8/8 16     TQFP-80 128 32  16 50 4 13 15 15 6/6 15    QFN-64 SiM3C156-B-GQ* 128 32  16 50 4 13 15 15 6/6 15    TQFP-64 SiM3C154-B-GM 128 32 28 4 7 11 12 3/3 10   QFN-40 SiM3C146-B-GM 64 16  16 50 4 13 15 15 6/6 15    QFN-64 SiM3C146-B-GQ* 64 16  16 50 4 13 15 15 6/6 15    TQFP-64 28 4 7 11 12 3/3 10   QFN-40 ec om m en de d 16    TQFP-80 64 16 SiM3C136-B-GM 32 8  16 50 4 13 15 15 6/6 15    QFN-64 SiM3C136-B-GQ* 32 8  16 50 4 13 15 15 6/6 15    TQFP-64 SiM3C134-B-GM 32 8 28 4 7 11 12 3/3 10   QFN-40 N ot R SiM3C144-B-GM *Note: End of life. 50 Rev.1.1 SiM3 C 1xx 6. Pin Definitions and Packaging Information Figure 6.1. SiM3C1x7-GQ Pinout N ot R ec om m en de d fo r N ew D es ig ns 6.1. SiM3C1x7 Pin Definitions Rev.1.1 51 Figure 6.2. SiM3C1x7-GM Pinout N ot R ec om m en de d fo r N ew D es ig ns SiM3C1xx 52 Rev.1.1 SiM3 C 1xx es ig ns Analog or Additional Functions External Trigger Inputs Output Toggle Logic Port-Mapped Level Shifter External Memory Interface (m = muxed mode) Port Match Crossbar Capability (see Port Config Section) Pin Numbers LGA-92 Type VSS Ground 33 B15 75 B34 VDD Power (Core) 74 A44 VIO Power (I/O) 32 A19 49 A29 73 A43 VREGIN Power (Regulator) 76 A45 VSSHD Ground (High Drive) 4 B2 VIOHD Power (High Drive) 5 A3 RESET Active-low Reset 80 A48 SWCLK/TCK Serial Wire/JTAG 45 B20 SWDIO/TMS Serial Wire/JTAG 44 A27 PB0.0 Standard I/O 72 B33 XBR0  ADC0.0 PB0.1 Standard I/O 71 B32 XBR0  ADC0.1 CS0.0 PB0.2 Standard I/O 70 A42 XBR0  ADC0.2 CS0.1 Standard I/O 69 B31 XBR0  ADC0.3 CS0.2 Standard I/O 68 A41 XBR0  ADC0.4 CS0.3 Standard I/O 67 B30 XBR0  ADC0.5 CS0.4 PB0.6 Standard I/O 66 A40 XBR0  CS0.5 PB0.7 Standard I/O 65 B29 XBR0  ADC0.6 CS0.6 IVC0.0 R PB0.4 N ot PB0.5 N ew fo r m en de d ec PB0.3 D Pin Name om Pin Numbers TQFP-80 Table 6.1. Pin Definitions and alternate functions for SiM3C1x7 Rev.1.1 53 SiM3C1xx Port-Mapped Level Shifter  PB0.9 Standard I/O 63 A38 XBR0  PB0.10 Standard I/O 62 A37 XBR0  PB0.11 Standard I/O 61  PB0.12 Standard I/O 60 A36 XBR0  ADC0.10 VREF PB0.13 Standard I/O 59 A35 XBR0  IDAC0 PB0.14 Standard I/O 58 B27 XBR0  IDAC1 PB0.15 Standard I/O 57 A34 XBR0  XTAL1 PB1.0 Standard I/O 56 A33 XBR0  XTAL2 PB1.1 Standard I/O 55 B25 XBR0  ADC0.11 PB1.2/TRST Standard I/O /JTAG 54 A32 XBR0  PB1.3/TDO/ SWV Standard I/O /JTAG/ Serial Wire Viewer 53 B24 XBR0  ADC0.12 ADC1.12 Standard I/O /JTAG 52 A31 XBR0  ADC0.13 ADC1.13 es ig ns D N ew fo r m en de d om ADC0.7 CS0.7 IVC0.1 ADC0.8 RTC1 RTC2 ADC0.9 VREFGND PB1.5/ETM0 Standard I/O /ETM 51 B23 XBR0  ADC0.14 ADC1.14 R ec PB1.4/TDI D4 XBR0 Analog or Additional Functions 64 A39 XBR0 External Trigger Inputs Standard I/O Output Toggle Logic Port Match PB0.8 Pin Numbers LGA-92 Type Pin Numbers TQFP-80 Pin Name Crossbar Capability (see Port Config Section) External Memory Interface (m = muxed mode) Table 6.1. Pin Definitions and alternate functions for SiM3C1x7 (Continued) Standard I/O /ETM 50 A30 XBR0  ADC0.15 ADC1.15 PB1.7/ETM2 Standard I/O /ETM 48 B22 XBR0  ADC1.11 CS0.8 PB1.8/ETM3 Standard I/O /ETM 47 B21 XBR0  ADC1.10 CS0.9 N ot PB1.6/ETM1 54 Rev.1.1 SiM3 C 1xx  PB1.10 Standard I/O 43 A26 XBR0  A23m/ A15 DMA0T1 ADC1.8 PB1.11 Standard I/O 42 A25 XBR0  A22m/ A14 DMA0T0 ADC1.7 PB1.12 Standard I/O 41  A21m/ A13 PB1.13 Standard I/O 40 A24 XBR0  A20m/ A12 ADC0T15 WAKE.0 ADC1.5 CS0.10 PB1.14 Standard I/O 39 A23 XBR0  A19m/ A11 ADC1T15 WAKE.1 ADC1.4 CS0.11 PB1.15 Standard I/O 38 A22 XBR0  A18m/ A10 WAKE.2 ADC1.3 CS0.12 PB2.0 Standard I/O 37 B17 XBR1  A17m/ A9 LSI0 Yes INT0.0 INT1.0 WAKE.3 ADC1.2 CS0.13 PB2.1 Standard I/O 36 A21 XBR1  A16m/ A8 LSI1 Yes INT0.1 INT1.1 WAKE.4 ADC1.1 CS0.14 PB2.2 35 B16 XBR1  AD15m/ A7 LSI2 Yes INT0.2 INT1.2 WAKE.5 ADC1.0 CS0.15 PMU_Asleep Standard I/O 34 A20 XBR1  AD14m/ A6 LSI3 Yes INT0.3 INT1.3 WAKE.6 PB2.4 Standard I/O 31 B14 XBR1  AD13m/ A5 LSI4 Yes INT0.4 INT1.4 WAKE.7 PB2.5 Standard I/O 30 A18 XBR1  AD12m / LSI5 Yes A4 ec Standard I/O R PB2.3 N ot Rev.1.1 es ig ns D N ew m en de d fo r D3 XBR0 Analog or Additional Functions 46 A28 XBR0 External Trigger Inputs Standard I/O /ETM Output Toggle Logic Port Match Port-Mapped Level Shifter Crossbar Capability (see Port Config Section) PB1.9/ TRACECLK Pin Numbers LGA-92 Type Pin Numbers TQFP-80 Pin Name om External Memory Interface (m = muxed mode) Table 6.1. Pin Definitions and alternate functions for SiM3C1x7 (Continued) ADC1.9 ADC1.6 INT0.5 INT1.5 55 SiM3C1xx Port-Mapped Level Shifter  AD11m/ A3 Yes PB2.7 Standard I/O 28 A17 XBR1  AD10m/ A2 Yes PB2.8 Standard I/O 27 B12 XBR1  AD9m/ A1 Yes PB2.9 Standard I/O 26 A16 XBR1  AD8m/ A0 Yes PB2.10 Standard I/O 25 B11 XBR1  AD7m/ D7 Yes PB2.11 Standard I/O 24 A15 XBR1  AD6m/ D6 Yes CMP0P.0 CMP1P.0 PB2.12 Standard I/O 23 A14 XBR1  AD5m/ D5 Yes CMP0N.0 CMP1N.0 RTC0TCLK_OUT PB2.13 Standard I/O 22 A13 XBR1  AD4m/ D4 Yes CMP0P.1 CMP1P.1 PB2.14 Standard I/O 21 D2 XBR1  AD3m/ D3 Yes CMP0N.1 CMP1N.1 5 V Tolerant I/O 20 A12 XBR1  AD2m/ D2 CMP0P.2 CMP1P.2 5 V Tolerant I/O 19 A11 XBR1  AD1m/ D1 CMP0N.2 CMP1N.2 5 V Tolerant I/O 18 A10 XBR1  AD0m/ D0 DAC0T0 DAC1T0 LPT0T0 CMP0P.3 CMP1P.3 5 V Tolerant I/O 17  WR DAC0T1 DAC1T1 INT0.8 INT1.8 CMP0N.3 CMP1N.3 N ot R PB3.2 PB3.3 56 B8 XBR1 Rev.1.1 es ig ns D INT0.6 INT1.6 INT0.7 INT1.7 N ew fo r m en de d ec PB3.1 om PB3.0 Analog or Additional Functions 29 B13 XBR1 External Trigger Inputs Standard I/O Output Toggle Logic Port Match PB2.6 Pin Numbers LGA-92 Type Pin Numbers TQFP-80 Pin Name Crossbar Capability (see Port Config Section) External Memory Interface (m = muxed mode) Table 6.1. Pin Definitions and alternate functions for SiM3C1x7 (Continued) SiM3 C 1xx Port Match External Memory Interface (m = muxed mode) 16 A9 XBR1  OE PB3.5 5 V Tolerant I/O 15 B7 XBR1  ALEm DAC0T2 DAC1T2 INT0.10 INT1.10 WAKE.9 CMP0N.4 CMP1N.4 PB3.6 5 V Tolerant I/O 14 A8  CS0 DAC0T3 DAC1T3 INT0.11 INT1.11 WAKE.10 CMP0P.5 CMP1P.5 PB3.7 5 V Tolerant I/O 13 B6 XBR1  BE1 DAC0T4 DAC1T4 LPT0T1 INT0.12 INT1.12 WAKE.11 CMP0N.5 CMP1N.5 PB3.8 5 V Tolerant I/O 12 A7 XBR1  CS1 DAC0T5 DAC1T5 LPT0T2 INT0.13 INT1.13 WAKE.12 CMP0P.6 CMP1P.6 EXREGSP 5 V Tolerant I/O 11 B5 XBR1  BE0 DAC0T6 DAC1T6 INT0.14 INT1.14 WAKE.13 CMP0N.6 CMP1N.6 EXREGSN PB3.10 5 V Tolerant I/O 10 B4 XBR1  INT0.15 INT1.15 WAKE.14 CMP0P.7 CMP1P.7 EXREGOUT PB3.11 5 V Tolerant I/O 9 B3 XBR1  WAKE.15 CMP0N.7 CMP1N.7 EXREGBD ec N ot R PB3.9 Rev.1.1 es ig ns D INT0.9 INT1.9 WAKE.8 N ew om m en de d fo r XBR1 Analog or Additional Functions Crossbar Capability (see Port Config Section) 5 V Tolerant I/O External Trigger Inputs Pin Numbers LGA-92 PB3.4 Output Toggle Logic Type Port-Mapped Level Shifter Pin Name Pin Numbers TQFP-80 Table 6.1. Pin Definitions and alternate functions for SiM3C1x7 (Continued) CMP0P.4 CMP1P.4 57 SiM3C1xx LSO0 PB4.1 High Drive I/O 7 A5 LSO1 PB4.2 High Drive I/O 6 A4 LSO2 PB4.3 High Drive I/O 3 A2 PB4.4 High Drive I/O 2 A1 PB4.5 High Drive I/O 1 D1 Analog or Additional Functions A6 es ig ns 8 N ew D High Drive I/O External Trigger Inputs PB4.0 Output Toggle Logic Port-Mapped Level Shifter Pin Numbers LGA-92 External Memory Interface (m = muxed mode) Type Port Match Pin Name Pin Numbers TQFP-80 Crossbar Capability (see Port Config Section) Table 6.1. Pin Definitions and alternate functions for SiM3C1x7 (Continued) LSO3 LSO4 fo r LSO5 N ot R ec om m en de d Note: All unnamed pins on the LGA-92 package are no-connect pins. They should be soldered to the PCB for mechanical stability, but have no internal connections to the device. 58 Rev.1.1 SiM3 C 1xx m en de d fo r N ew D es ig ns 6.2. SiM3C1x6 Pin Definitions N ot R ec om Figure 6.3. SiM3C1x6-GQ Pinout Rev.1.1 59 Figure 6.4. SiM3C1x6-GM Pinout N ot R ec om m en de d fo r N ew D es ig ns SiM3C1xx 60 Rev.1.1 SiM3 C 1xx es ig ns Analog or Additional Functions External Trigger Inputs Output Toggle Logic Port-Mapped Level Shifter External Memory Interface (m = muxed mode) Port Match Crossbar Capability (see Port Config Section) Type VSS Ground 25 59 VDD Power (Core) 58 VIO Power (I/O) 24 39 VREGIN Power (Regulator) 60 VSSHD Ground (High Drive) 2 VIOHD Power (High Drive) 3 RESET Active-low Reset 64 SWCLK/TCK Serial Wire / JTAG 36 SWDIO/TMS Serial Wire / JTAG 35 PB0.0 Standard I/O 57 XBR0  ADC0.2 CS0.1 PB0.1 Standard I/O 56 XBR0  ADC0.3 CS0.2 PB0.2 Standard I/O 55 XBR0  ADC0.4 CS0.3 Standard I/O 54 XBR0  ADC0.5 CS0.4 Standard I/O 53 XBR0  ADC0.6 CS0.5 IVC0.0 Standard I/O 52 XBR0  ADC0.7 CS0.6 IVC0.1 Standard I/O 51 XBR0  ADC0.8 CS0.7 RTC1 R PB0.4 N ot PB0.5 PB0.6 N ew fo r m en de d ec PB0.3 D Pin Name om Pin Numbers Table 6.2. Pin Definitions and alternate functions for SiM3C1x6 Rev.1.1 61 SiM3C1xx 50 XBR0  PB0.8 Standard I/O 49 XBR0  PB0.9 Standard I/O 48 XBR0  PB0.10 Standard I/O 47 XBR0  PB0.11 Standard I/O 46 XBR0  IDAC1 PB0.12 Standard I/O 45 XBR0  XTAL1 PB0.13 Standard I/O 44 XBR0  XTAL2 43 XBR0  ADC0.12 ADC1.12 es ig ns D N ew fo r m en de d RTC2 ADC0.9 VREFGND ADC0.10 VREF PB0.15/TDI Standard I/O / JTAG 42 XBR0  ADC0.13 ADC1.13 PB1.0 Standard I/O 41 XBR0  ADC0.14 ADC1.14 PB1.1 Standard I/O 40 XBR0  ADC0.15 ADC1.15 PB1.2 om ADC1.6 IDAC0 Standard I/O 38 XBR0  ADC1.11 CS0.8 Standard I/O 37 XBR0  ADC1.10 CS0.9 PB1.4 Standard I/O 34 XBR0  ADC1.8 PB1.5 Standard I/O 33 XBR0  ADC1.7 N ot PB0.14/TDO/ Standard I/O / JTAG SWV / Serial Wire Viewer Analog or Additional Functions Standard I/O External Trigger Inputs PB0.7 Output Toggle Logic Port Match Port-Mapped Level Shifter Type Pin Numbers Pin Name Crossbar Capability (see Port Config Section) External Memory Interface (m = muxed mode) Table 6.2. Pin Definitions and alternate functions for SiM3C1x6 (Continued) PB1.6 Standard I/O 32 XBR0  PB1.7 Standard I/O 31 XBR0  R ec PB1.3 62 AD15m/ A7 Rev.1.1 ADC0T15 WAKE.0 ADC1.5 CS0.10 ADC1T15 WAKE.1 ADC1.4 CS0.11 SiM3 C 1xx 30 XBR0  AD14m/ A6 PB1.9 Standard I/O 29 XBR0  PB1.10 Standard I/O 28 XBR0 PB1.11 Standard I/O 27 XBR0 PB1.12 Standard I/O 26 XBR0 PB1.13 Standard I/O 23 XBR0  AD9m/ A1 PB1.14 Standard I/O 22 XBR0  AD8m/ A0 PB1.15 Standard I/O 21 XBR0  AD7m/ D7 PB2.0 Standard I/O 20 XBR1  AD6m/ D6 LSI0 Yes INT0.0 INT1.0 Standard I/O 19 XBR1  AD5m/ D5 LSI1 Yes INT0.1 INT1.1 Standard I/O 18 XBR1  AD4m/ D4 LSI2 Yes INT0.2 INT1.2 CMP0N.0 CMP1N.0 RTC0TCLK_OUT Standard I/O 17 XBR1  AD3m/ D3 LSI3 Yes INT0.3 INT1.3 CMP0P.0 CMP1P.0 PB3.0 5 V Tolerant I/O 16 XBR1  AD2m/ D2 CMP0P.1 CMP1P.1 PB3.1 5 V Tolerant I/O 15 XBR1  AD1m/ D1 CMP0N.1 CMP1N.1 N ot PB2.3 es ig ns ADC1.3 CS0.12 AD13m/ A5 WAKE.3 ADC1.2 CS0.13  AD12m/ A4 DMA0T1 WAKE.4 ADC1.1 CS0.14  AD11m/ A3 DMA0T0 WAKE.5 ADC1.0 CS0.15 PMU_Asleep AD10m/ A2 WAKE.6 fo r N ew D WAKE.2  m en de d R ec PB2.2 om PB2.1 Analog or Additional Functions Standard I/O External Trigger Inputs PB1.8 Output Toggle Logic Port Match Port-Mapped Level Shifter Type Pin Numbers Pin Name Crossbar Capability (see Port Config Section) External Memory Interface (m = muxed mode) Table 6.2. Pin Definitions and alternate functions for SiM3C1x6 (Continued) Rev.1.1 63 SiM3C1xx  AD0m/ D0 PB3.3 5 V Tolerant I/O 13 XBR1  WR PB3.4 5 V Tolerant I/O 12 XBR1 PB3.5 5 V Tolerant I/O 11 XBR1  PB3.6 5 V Tolerant I/O 10 XBR1 9 8 DAC0T1 DAC1T1 INT0.4 INT1.4 WAKE.9 CMP0N.2 CMP1N.2 INT0.5 INT1.5 WAKE.10 CMP0P.3 CMP1P.3 ALEm DAC0T2 DAC1T2 INT0.6 INT1.6 WAKE.11 CMP0N.3 CMP1N.3  CS0 DAC0T3 DAC1T3 INT0.7 INT1.7 WAKE.12 CMP0P.4 CMP1P.4 EXREGSP XBR1  BE1 DAC0T4 DAC1T4 INT0.8 INT1.8 WAKE.13 CMP0N.4 CMP1N.4 EXREGSN XBR1  CS1 DAC0T5 DAC1T5 LPT0T1 INT0.9 INT1.9 WAKE.14 CMP0P.5 CMP1P.5 EXREGOUT 64 N ew fo r  5 V Tolerant I/O Rev.1.1 D CMP0P.2 CMP1P.2 N ot R PB3.8 DAC0T0 DAC1T0 LPT0T0 WAKE.8 OE m en de d om 5 V Tolerant I/O ec PB3.7 Analog or Additional Functions XBR1 es ig ns 14 External Trigger Inputs 5 V Tolerant I/O Output Toggle Logic Port Match PB3.2 Port-Mapped Level Shifter Type Pin Numbers Pin Name Crossbar Capability (see Port Config Section) External Memory Interface (m = muxed mode) Table 6.2. Pin Definitions and alternate functions for SiM3C1x6 (Continued) SiM3 C 1xx PB4.2 High Drive I/O 4 PB4.3 High Drive I/O 1 Analog or Additional Functions 5 es ig ns High Drive I/O DAC0T6 DAC1T6 LPT0T2 INT0.10 INT1.10 WAKE.15 D PB4.1 External Trigger Inputs 6 BE0 Output Toggle Logic High Drive I/O  CMP0N.5 CMP1N.5 EXREGBD N ew PB4.0 XBR1 Port-Mapped Level Shifter 7 External Memory Interface (m = muxed mode) 5 V Tolerant I/O LSO0 LSO1 fo r PB3.9 Port Match Type LSO2 LSO3 N ot R ec om m en de d Pin Name Crossbar Capability (see Port Config Section) Pin Numbers Table 6.2. Pin Definitions and alternate functions for SiM3C1x6 (Continued) Rev.1.1 65 SiM3C1xx Figure 6.5. SiM3C1x4-GM Pinout N ot R ec om m en de d fo r N ew D es ig ns 6.3. SiM3C1x4 Pin Definitions 66 Rev.1.1 SiM3 C 1xx es ig ns Analog or Additional Functions External Trigger Inputs Output Toggle Logic Port Match VSS Ground 14 VDD Power (Core) 35 VIO Power (I/O) 13 VREGIN Power (Regulator) 36 VSSHD Ground (High Drive) 2 VIOHD Power (High Drive) 3 RESET Active-low Reset 40 SWCLK Serial Wire 24 SWDIO Serial Wire 23 Standard I/O 34 XBR0  ADC0.8 CS0.7 RTC1 Standard I/O 33 XBR0  RTC2 Standard I/O 32 XBR0  ADC0.9 CS0.0 VREFGND Standard I/O 31 XBR0  ADC0.10 CS0.1 VREF PB0.4 Standard I/O 30 XBR0  ADC1.6 CS0.2 IDAC0 PB0.5 Standard I/O 29 PB0.6 Standard I/O 28 XBR0  ADC0.0 CS0.3 XTAL1 PB0.7 Standard I/O 27 XBR0  ADC0.1 CS0.4 XTAL2 PB0.2 ec PB0.3 R N ew fo r m en de d PB0.1 D Type om Crossbar Capability (see Port Config Section) Pin Name PB0.0 N ot Pin Numbers Table 6.3. Pin Definitions and Alternate Functions for SiM3C1x4 IDAC1 Rev.1.1 67 SiM3C1xx Standard I/O 26 XBR0  PB0.9 Standard I/O 25 XBR0  PB0.10 Standard I/O 22 XBR0  DMA0T1 ADC1.8 PB0.11 Standard I/O 21 XBR0  DMA0T0 ADC1.7 PB0.12 Standard I/O 20 XBR0  ADC0T15 WAKE.0 ADC1.5 CS0.10 PB0.13 Standard I/O 19 PB0.14 Standard I/O 18 es ig ns Analog or Additional Functions D N ew fo r ADC0.15 ADC1.15  ADC1T15 WAKE.1 ADC1.4 CS0.11 XBR0  WAKE.2 ADC1.3 CS0.12 Standard I/O 17 XBR0  WAKE.3 ADC1.2 CS0.13 Standard I/O 16 XBR0  WAKE.4 ADC1.1 CS0.14 Standard I/O 15 XBR0  WAKE.5 ADC1.0 CS0.15 PMU_Asleep Standard I/O 12 XBR0  CMP0N.0 CMP1N.0 RTC0TCLK_OUT PB1.3 Standard I/O 11 XBR0  CMP0P.0 CMP1P.0 PB3.0 5 V Tolerant I/O 10 XBR1  PB1.0 om PB1.1 N ot R ec PB1.2 68 ADC0.14 ADC1.14 XBR0 m en de d PB0.15 External Trigger Inputs Port Match PB0.8 Output Toggle Logic Type Pin Numbers Pin Name Crossbar Capability (see Port Config Section) Table 6.3. Pin Definitions and Alternate Functions for SiM3C1x4 (Continued) Rev.1.1 DAC0T0 DAC1T0 LPT0T0 INT0.0 INT1.0 WAKE.12 CMP0P.1 CMP1P.1 EXREGSP SiM3 C 1xx XBR1  PB3.2 5 V Tolerant I/O 8 XBR1  PB3.3 5 V Tolerant I/O 7 CMP0N.1 CMP1N.1 EXREGSN PB4.1 PB4.2 High Drive I/O 6 High Drive I/O 5 High Drive I/O 4 High Drive I/O 1 CMP0P.2 CMP1P.2 EXREGOUT DAC0T3 DAC1T3 INT0.3 INT1.3 WAKE.15 CMP0N.2 CMP1N.2 EXREGBD fo r DAC0T2 DAC1T2 LPT0T2 INT0.2 INT1.3 WAKE.14  N ot R ec om PB4.3 XBR1 m en de d PB4.0 N ew D DAC0T1 DAC1T1 LPT0T1 INT0.1 INT1.1 WAKE.13 es ig ns 9 Analog or Additional Functions 5 V Tolerant I/O External Trigger Inputs Port Match PB3.1 Output Toggle Logic Type Pin Numbers Pin Name Crossbar Capability (see Port Config Section) Table 6.3. Pin Definitions and Alternate Functions for SiM3C1x4 (Continued) Rev.1.1 69 SiM3C1xx fo r N ew D es ig ns 6.4. LGA-92 Package Specifications m en de d Figure 6.6. LGA-92 Package Drawing Table 6.4. LGA-92 Package Dimensions Min 0.74 0.25 3.15 Nominal 0.84 0.30 3.20 7.00 BSC 6.50 BSC 4.00 BSC 0.50 BSC 7.00 BSC 6.50 BSC 4.00 BSC — — — — — N ot R ec om Dimension A b c D D1 D2 e E E1 E2 aaa bbb ccc ddd eee 70 — — — — — Max 0.94 0.35 3.25 0.10 0.10 0.08 0.10 0.10 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev.1.1 fo r N ew D es ig ns SiM3 C 1xx m en de d Figure 6.7. LGA-92 Landing Diagram Table 6.5. LGA-92 Landing Diagram Dimensions Typical Max C1 6.50 — C2 6.50 — e 0.50 — f — 0.35 P1 — 3.20 P2 — 3.20 N ot R ec om Dimension Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed. 3. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 4. This land pattern design is based on the IPC-7351 guidelines. Rev.1.1 71 SiM3C1xx N ot R ec om m en de d fo r N ew D es ig ns 6.4.1. LGA-92 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. 6.4.2. LGA-92 Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins. 4. A 2 x 2 array of 1.25 mm square openings on 1.60 mm pitch should be used for the center ground pad. 6.4.3. LGA-92 Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 72 Rev.1.1 SiM3 C 1xx m en de d fo r N ew D es ig ns 6.5. TQFP-80 Package Specifications Figure 6.8. TQFP-80 Package Drawing Dimension Min Nominal Max A — — 1.20 A1 0.05 — 0.15 A2 0.95 1.00 1.05 b 0.17 0.20 0.27 c 0.09 — 0.20 N ot R ec om Table 6.6. TQFP-80 Package Dimensions D 14.00 BSC D1 12.00 BSC e 0.50 BSC E 14.00 BSC E1 12.00 BSC Rev.1.1 73 SiM3C1xx Dimension Min Nominal Max L 0.45 0.60 0.75  1.00 Ref 0° 3.5° aaa 0.20 bbb 0.20 ccc 0.08 ddd 0.08 eee 0.05 7° D L1 es ig ns Table 6.6. TQFP-80 Package Dimensions (Continued) N ot R ec om m en de d fo r N ew Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This package outline conforms to JEDEC MS-026, variant ADD. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components. 74 Rev.1.1 m en de d fo r N ew D es ig ns SiM3 C 1xx Figure 6.9. TQFP-80 Landing Diagram Table 6.7. TQFP-80 Landing Diagram Dimensions Min Max C1 13.30 13.40 C2 13.30 13.40 N ot R ec om Dimension E 0.50 BSC X 0.20 0.30 Y 1.40 1.50 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This land pattern design is based on the IPC-7351 guidelines. Rev.1.1 75 SiM3C1xx N ot R ec om m en de d fo r N ew D es ig ns 6.5.1. TQFP-80 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. 6.5.2. TQFP-80 Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all pads. 6.5.3. TQFP-80 Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 76 Rev.1.1 SiM3 C 1xx N ew D es ig ns 6.6. QFN-64 Package Specifications Figure 6.10. QFN-64 Package Drawing Min Nominal Max A 0.80 0.85 0.90 A1 0.00 0.02 0.05 b 0.18 0.25 0.30 m en de d Dimension fo r Table 6.8. QFN-64 Package Dimensions D D2 3.95 4.10 e 0.50 BSC E 9.00 BSC 4.25 E2 3.95 4.10 4.25 L 0.30 0.40 0.50 om ec R N ot 9.00 BSC aaa 0.10 bbb 0.10 ccc 0.08 ddd 0.10 eee 0.05 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This package outline conforms to JEDEC MO-220. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev.1.1 77 m en de d fo r N ew D es ig ns SiM3C1xx Figure 6.11. QFN-64 Landing Diagram N ot R ec om Table 6.9. QFN-64 Landing Diagram Dimensions 78 Dimension mm C1 8.90 C2 8.90 E 0.50 X1 0.30 Y1 0.85 X2 4.25 Y2 4.25 Notes: 1. All dimensions shown are in millimeters (mm). 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Rev.1.1 SiM3 C 1xx N ot R ec om m en de d fo r N ew D es ig ns 6.6.1. QFN-64 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. 6.6.2. QFN-64 Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all pads. 4. A 3x3 array of 1.0 mm square openings on a 1.5 mm pitch should be used for the center ground pad. 6.6.3. QFN-64 Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev.1.1 79 SiM3C1xx m en de d fo r N ew D es ig ns 6.7. TQFP-64 Package Specifications Figure 6.12. TQFP-64 Package Drawing Table 6.10. TQFP-64 Package Dimensions Min Nominal Max A — — 1.20 A1 0.05 — 0.15 A2 0.95 1.00 1.05 b 0.17 0.22 0.27 c 0.09 — 0.20 N ot R ec om Dimension 80 D 12.00 BSC D1 10.00 BSC e 0.50 BSC E 12.00 BSC E1 10.00 BSC L 0.45 0.60 0.75  0° 3.5° 7° Rev.1.1 SiM3 C 1xx Dimension Min Nominal Max aaa — — 0.20 bbb — — 0.20 ccc — — 0.08 ddd — — 0.08 es ig ns Table 6.10. TQFP-64 Package Dimensions (Continued) N ot R ec om m en de d fo r N ew D Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This package outline conforms to JEDEC MS-026, variant ACD. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev.1.1 81 m en de d fo r N ew D es ig ns SiM3C1xx Figure 6.13. TQFP-64 Landing Diagram Table 6.11. TQFP-64 Landing Diagram Dimensions Min Max C1 11.30 11.40 C2 11.30 11.40 N ot R ec om Dimension 82 E 0.50 BSC X 0.20 0.30 Y 1.40 1.50 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This land pattern design is based on the IPC-7351 guidelines. Rev.1.1 SiM3 C 1xx N ot R ec om m en de d fo r N ew D es ig ns 6.7.1. TQFP-64 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. 6.7.2. TQFP-64 Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all pads. 6.7.3. TQFP-64 Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev.1.1 83 SiM3C1xx N ew D es ig ns 6.8. QFN-40 Package Specifications fo r Figure 6.14. QFN-40 Package Drawing Table 6.12. QFN-40 Package Dimensions Min m en de d Dimension 0.80 0.85 0.90 A1 0.00 0.02 0.05 b 0.18 0.25 0.30 D2 6.00 BSC 4.35 4.50 e 0.50 BSC E 6.00 BSC om ec R N ot Max A D 84 Nominal 4.65 E2 4.35 4.5 4.65 L 0.30 0.40 0.50 aaa 0.10 bbb 0.10 ccc 0.08 ddd 0.10 eee 0.05 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This package outline conforms to JEDEC MO-220. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Rev.1.1 m en de d fo r N ew D es ig ns SiM3 C 1xx Figure 6.15. QFN-40 Landing Diagram N ot R ec om Table 6.13. QFN-40 Landing Diagram Dimensions Dimension mm C1 5.90 C2 5.90 E 0.50 X1 0.30 Y1 0.85 X2 4.65 Y2 4.65 Notes: 1. All dimensions shown are in millimeters (mm). 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Rev.1.1 85 SiM3C1xx N ot R ec om m en de d fo r N ew D es ig ns 6.8.1. QFN-40 Solder Mask Design All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm minimum, all the way around the pad. 6.8.2. QFN-40 Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all pads. 4. A 3x3 array of 1.1 mm square openings on a 1.6 mm pitch should be used for the center ground pad. 6.8.3. QFN-40 Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 86 Rev.1.1 SiM3 C 1xx 7. Revision Specific Behavior es ig ns This chapter details any known differences from behavior as stated in the device datasheet and reference manual. All known errata for the current silicon revision are rolled into this section at the time of publication. Any errata found after publication of this document will initially be detailed in a separate errata document until this datasheet is revised. 7.1. Revision Identification m en de d fo r N ew D The Lot ID Code on the top side of the device package can be used for decoding device revision information. Figures 7.1, 7.2, 7.3, and 7.4 show how to find the Lot ID Code on the top side of the device package. In addition, firmware can determine the revision of the device by checking the DEVICEID registers. N ot R ec om Figure 7.1. LGA-92 SiM3C1x7 Revision Information Figure 7.2. TQFP-80 SiM3C1x7 Revision Information Rev.1.1 87 N ew D es ig ns SiM3C1xx m en de d fo r Figure 7.3. SiM3C1x6 Revision Information om Figure 7.4. SiM3C1x4 Revision Information 7.2. Comparator Rising/Falling Edge Flags in Debug Mode (CMP0, CMP1) N ot R ec 7.2.1. Problem On Revision A and Revision B devices, if the comparator output is high, the comparator rising and falling edge flags will both be set to 1 upon single-step or exit from debug mode. 7.2.2. Impacts Firmware using the rising and falling edge flags to make decisions may see a false trigger of the comparator if the output of the comparator is high during a debug session. This does not impact the non-debug operation of the device. 7.2.3. Workaround There is not a system-agnostic workaround for this issue. 7.2.4. Resolution This issue exists on Revision A and Revision B devices. It may be corrected in a future device revision. 88 Rev.1.1 SiM3 C 1xx DOCUMENT CHANGE LIST Revision 1.0 to Revision 1.1 Added end of life note to Table 5.1, “Product Selection Guide,” on page 50.   ig ns Revision 0.8 to Revision 1.0 Added block diagram to front page; updated feature bullet lists. Electrical Specifications Tables Additions: Regulator Current Sense Supply Current, Typ = 3 μA (Table 3.2) Mode 2 Wake Time, Min = 4 clocks, Max = 5 clocks (Table 3.3) External Crystal Clock Frequency, Min = 0.01 MHz, Max = 30 MHz (Table 3.9) Added /RESET pin characteristics (Table 3.17) Power Electrical Specifications Tables Removals: Power  Mode 3 Wake Time (Table 3.3) Electrical Specifications Tables Corretions/Adjustments: N ew  D es Voltage IVC Supply Current, Max = 2.5 μA (Table 3.2) Output Voltage Normal Mode, Min = 3.15 V (Table 3.5) VREG0 Output Voltage Suspend Mode, Min = 3.15 V (Table 3.5) External Regulator Internal Pull-Down, Typ = 5 k (Table 3.6) External Regulator Internal Pull-Up, Typ = 10 k (Table 3.6) Flash Memory Endurance, Typ = 100k write/erase cycles (Table 3.7) Flash Memory Retention, Min = 10 Years, Typ = 100 Years (Table 3.7) Low Power Oscillator Frequency, Min = 19.5 MHz, Max = 20.5 MHz (Table 3.8) SAR Dynamic Performance : consolidated all specs. (Table 3.10) IDAC Full Scale Output Current 1 mA Range, Min = 0.99 mA (Table 3.11) IDAC Full Scale Output Current 0.5 mA Range, Min = 493 μA (Table 3.11) IVC Slope @ 1 mA, Min = 1.55 V/mA, Max = 1.75 V/mA (Table 3.13) IVC Slope @ 2 mA, Min = 795 mV/mA, Max = 860 mV/mA (Table 3.13) IVC Slope @ 3 mA, Min = 525 mV/mA, Max = 570 mV/mA (Table 3.13) IVC Slope @ 4 mA, Min = 390 mV/mA, Max = 430 mV/mA (Table 3.13) IVC Slope @ 5 mA, Min = 315 mV/mA (Table 3.13) IVC Slope @ 6 mA, Min = 260 mV/mA (Table 3.13) Temperature Sensor Slope Error, Type = ±120 μV/C (Table 3.15) Comparator Input Offset Voltage, Min = –10 mV, Max = 10 mV (Table 3.16) “4. Precision32™ SiM3C1xx System Overview” : Updated Refined  N ot R  Updated and clarified RTC timer clock output. The RTC output is now referred to as "RTC0TCLK". “6. Pin Definitions and Packaging Information” : Renamed RTC0OSC_OUT function to RTC0TCLK_OUT for consistency. “7. Revision Specific Behavior” : Updated revision identification drawings to better match physical appearance of packages. ec  Power Modes discussion. and updated feature bullet lists. om  m en de d fo r VREG0 Rev.1.1 89 es ig ns D N ew fo r om Products m en de d Smart. Connected. Energy-Friendly. www.silabs.com/products Quality Support and Community www.silabs.com/quality community.silabs.com N ot R ec Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required, or Life Support Systems without the specific written consent of Silicon Labs. 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