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UPMU-F390-A-EK

UPMU-F390-A-EK

  • 厂商:

    SILABS(芯科科技)

  • 封装:

    -

  • 描述:

    CARD MCU C8051F390 UDP

  • 数据手册
  • 价格&库存
UPMU-F390-A-EK 数据手册
C8051F39x/F37x es ig ns UDP C8051F390/F370 MCU C A R D U SER ’ S G UIDE 1. Introduction The Unified Development Platform (UDP) provides a development and demonstration platform for Silicon Laboratories microcontrollers and the Silicon Laboratories software tools, including the Silicon Laboratories Integrated Development Environment (IDE). R ec om m en de d fo r N ew D Note: The C8051F39x/F37x family has two MCU cards, one for the C8051F39x devices and one for the C8051F37x devices. The information in this document applies to both sets of hardware, and the examples (with the exception of the EEPROM) will run on both. Figure 1. Unified Development Platform N ot 2. Relevant Documents This document provides a hardware overview for the Unified Development Platform (UDP) system UDP C8051F390/F370 MCU Card. Additional information on the UDP system can be found in the documents listed in this section. Motherboard User’s Guide: The UDP Motherboard User’s Guide contains information on the motherboard features and can be found at www.silabs.com. Card User’s Guides: The UDP MCU Card and Radio Card User’s Guides can be found at www.silabs.com. Rev. 0.2 2/14 Copyright © 2014 by Silicon Laboratories C8051F39x C8051F39x/F37x 3. Hardware Setup 3.1. Using the MCU Card Alone Refer to Figure 2 for a diagram of the hardware configuration when using the MCU card without a UDP motherboard. es ig ns 1. Connect the USB Debug Adapter to the 2x5 debug connector on the MCU card with the 10-pin ribbon cable. 2. Connect one end of the USB cable to the USB connector on the USB Debug Adapter. 3. Connect the other end of the USB cable to a USB Port on the PC. 4. Move the SW1 switch to the VREG position. 5. Connect the 9 V DC adapter to P1. Notes: Use USB Debug Adapter m en de d fo r Power Adapter (P1) N ew D the Reset button in the IDE to reset the target when connected using a USB Debug Adapter. Remove power from the MCU card and the USB Debug Adapter before connecting or disconnecting the ribbon cable from the MCU card. Connecting or disconnecting the cable when the devices have power can damage the device and/or the USB Debug Adapter. USB Connectivity Figure 2. Hardware Setup Using the MCU Card Alone N ot R ec om VDD Selection Switch 2 Rev. 0.2 C8051F39x/F37x 3.2. Using the MCU Card with the UDP Motherboard Refer to Figure 3 for a diagram of the hardware configuration when using the MCU card with a UDP motherboard. 1. Connect the MCU card to the UDP motherboard slot. 3. (Optional) Connect a radio card to the radio card slot in the UDP motherboard. es ig ns 2. (Optional) Connect the I/O card to the UDP motherboard slot. 4. (Optional) Connect an EZLink card to the EZLink card slot in the UDP motherboard. 5. Connect the USB Debug Adapter to the 2x5 debug connector on the MCU card with the 10-pin ribbon cable. 6. Connect one end of the USB cable to the USB connector on the USB Debug Adapter. 7. Connect the other end of the USB cable to a USB Port on the PC. D 8. Connect the ac/dc power adapter to power jack J20 on the UDP motherboard. The board can also be powered from the J16 USB or J1 mini USB connectors. 9. Move the SW1 switch on the MCU card to the UDP MB position. N ew 10. Move the S3 power switch on the UDP motherboard to the ON position. Notes: Use the Reset button in the IDE to reset the target when connected using a USB Debug Adapter. power from the target board and the USB Debug Adapter before connecting or disconnecting the ribbon cable from the target board. Connecting or disconnecting the cable when the devices have power can damage the device and/or the USB Debug Adapter. The MCU card can be used alone without the motherboard. However, the motherboard must be powered if an MCU card is connected. m en de d fo r Remove USB Connector (J16) Power Adapter (J20) N ot R ec VDD Selection Switch om USB Debug Adapter Figure 3. Hardware Setup Using the Unified Development Platform Rev. 0.2 3 C8051F39x/F37x 4. Software Setup es ig ns Simplicity Studio greatly reduces development time and complexity with Silicon Labs EFM32 and 8051 MCU products by providing a high-powered IDE, tools for hardware configuration, and links to helpful resources, all in one place. m en de d fo r N ew D Once Simplicity Studio is installed, the application itself can be used to install additional software and documentation components to aid in the development and evaluation process. om Figure 4. Simplicity Studio The following Simplicity Studio components are required for the C8051F390 Development Kit: 8051 R ec Products Part Support Simplicity Developer Platform Download and install Simplicity Studio from www.silabs.com/8bit-software or www.silabs.com/simplicity-studio. Once installed, run Simplicity Studio by selecting StartSilicon LabsSimplicity StudioSimplicity Studio from the start menu or clicking the Simplicity Studio shortcut on the desktop. Follow the instructions to install the software and click Simplicity IDE to launch the IDE. N ot The first time the project creation wizard runs, the Setup Environment wizard will guide the user through the process of configuring the build tools and SDK selection. In the Part Selection step of the wizard, select from the list of installed parts only the parts to use during development. Choosing parts and families in this step affects the displayed or filtered parts in the later device selection menus. Choose the C8051F39x family by checking the C8051F39x/37x check box. Modify the part selection at any time by accessing the Part Management dialog from the WindowPreferencesSimplicity StudioPart Management menu item. Simplicity Studio can detect if certain toolchains are not activated. If the Licensing Helper is displayed after completing the Setup Environment wizard, follow the instructions to activate the toolchain. 4 Rev. 0.2 C8051F39x/F37x 4.1. Running Blinky es ig ns Each project has its own source files, target configuration, SDK configuration, and build configurations such as the Debug and Release build configurations. The IDE can be used to manage multiple projects in a collection called a workspace. Workspace settings are applied globally to all projects within the workspace. This can include settings such as key bindings, window preferences, and code style and formatting options. Project actions, such as build and debug are context sensitive. For example, the user must select a project in the Project Explorer view in order to build that project. To create a project based on the Blinky example: 1. Click the Simplicity IDE tile from the Simplicity Studio home screen. 2. Click the Create new project link from the welcome screen or go to FileNewSilicon Labs MCU Project. D 3. In the Kit drop-down, select C8051F390 Development Kit, in the Part drop-down, select C8051F390, and in the SDK drop-down, select the desired SDK. Click Next. 4. Select Example and click Next. N ew 5. Under C8051F390 Development Kit in the Blinky folder, select F39x-37x Blinky and click Finish. 6. Click on the project in the Project Explorer and click Build, the hammer icon in the top bar. Alternatively, go to ProjectBuild Project. 7. Click Debug to download the project to the hardware and start a debug session. m en de d 9. Press the Suspend button to stop the code. fo r 8. Press the Resume button to start the code running. The LED should blink. 10. Press the Reset the device button to reset the target MCU. 11. Press the Disconnect button to return to the development perspective. om 4.2. Simplicity Studio Help ec Simplicity Studio includes detailed help information and device documentation within the tool. The help contains descriptions for each dialog window. To view the documentation for a dialog, click the question mark icon in the window: R This will open a pane specific to the dialog with additional details. N ot The documentation within the tool can also be viewed by going to HelpHelp Contents or HelpSearch. Rev. 0.2 5 C8051F39x/F37x 4.3. Legacy 8-bit IDE Note: Using the Simplicity Studio tools with the C8051F390 Development Kit is recommended. See section 4. "Software Setup‚" on page 4 for more information. es ig ns Download the 8-bit software from the website (www.silabs.com/8bit-software) or use the provided installer on the CD-ROM to install the software tools for the C8051F39x devices. After installation, examples can be found in ...\Examples\C8051F39x_37x in the installation directory. At a minimum, the C8051F390 DK requires: Silicon Labs IDE—Software enabling initial evaluation, development, and debugging. Wizard 2—Initialization code generation software for the C8051F39x devices. Keil C51 Tools—Keil 8051 Compiler/Assembler/Linker toolchain. CP210x Drivers—Virtual COM Port (VCP) drivers for the CP210x COM interface. More information on this installation process can be found in Section 4.4. Other software available includes: D Configuration Keil To register the Keil toolset: fo r N ew µVision Driver—Driver for the Keil µVision IDE that enables development and debugging on C8051Fxxx MCUs. Flash Programming Utilities and MCU Production Programmer—Programming utilities for the production line. More information on the available programming options can be found on the website: http://www.silabs.com/products/mcu/Pages/ProgrammingOptions.aspx. ToolStick Development Tools—Software and examples for the ToolStick development platform. More information on this platform can be found at www.silabs.com/toolstick. The development kit includes the latest version of the C51 Keil 8051 toolset. This toolset is initially limited to a code size of 2 kB and programs start at code address 0x0800. After registration, the code size limit is removed entirely and programs will start at code address 0x0000. m en de d 1. Find the Product Serial Number printed on the CD-ROM. If you no longer have this serial number, register on the Silicon Labs website (www.silabs.com/8bit-software) to obtain the serial number. 2. Open the Keil µVision4 IDE from the installation directory with administrative privileges. N ot R ec om 3. Select FileLicense Management to open the License Management window. Figure 5. Keil µVision4 IDE License Management Window 4. Click on the Get LIC via Internet... button to open the Obtaining a License IDE Code (LIC) window. 5. Press OK to open a browser window to the Keil website. If the window doesn’t open, navigate to 6 Rev. 0.2 C8051F39x/F37x www.keil.com/license/install.htm. 6. Enter the Silicon Labs Product Serial Number printed on the CD-ROM, along with any additional required information. es ig ns 7. Once the form is complete, click the Submit button. An email will be sent to the provided email address with the license activation code. 8. Copy the License ID Code (LIC) from the email. 9. Paste the LIC into the New License ID Code (LIC) text box at the bottom of the License Management window in µVision4. 10. Press the Add LIC button. The window should now list the PK51 Prof. Developers Kit for Silabs as a licensed product. 11. Click the Close button. D 4.4. CP210x USB to UART VCP Driver Installation N ew The MCU Card includes a Silicon Labs CP210x USB-to-UART Bridge Controller. Device drivers for the CP210x need to be installed before the PC software can communicate with the MCU through the UART interface. Use the drivers included CD-ROM or download the latest drivers from the website (www.silabs.com/interface-software). 1. If using the CD-ROM, the CP210x Drivers option will launch the appropriate driver installer. If downloading the driver package from the website, unzip the files to a location and run the appropriate installer for the system (x86 or x64). fo r 2. Accept the license agreement and follow the steps to install the driver on the system. The installer will let you know when your system is up to date. The driver files included in this installation have been certified by Microsoft. m en de d 3. To complete the installation process, connect the included USB cable between the host computer and the COM PORT USB connector (J5) on the MCU Card. Windows will automatically finish the driver installation. Information windows will pop up from the taskbar to show the installation progress. N ot R ec om 4. If needed, the driver files can be uninstalled by selecting Windows Driver Package—Silicon Laboratories... option in the Programs and Features window. Rev. 0.2 7 C8051F39x/F37x 5. UDP C8051F390/F370 MCU Card Overview es ig ns The C8051F39x/F37x MCU cards enable application development on the C8051F390 or C8051F370 MCU. The card connects to the MCU Card expansion slot on the UDP motherboard and provides complete access to the MCU resources. Each expansion board has a unique ID that can be read out of an EEPROM or MCU on the board, which enables software tools to recognize the connected hardware and automatically select the appropriate firmware image. The target MCU card can also be detached from the UDP and used alone as a development or demonstration tool. R ec om m en de d fo r N ew D Figure 6 shows the C8051F390 MCU card. Figure 6. C8051F39x UDP MCU Card N ot Figure 7 highlights some of the features of the UDP C8051F390/F370 MCU Card. 8 Rev. 0.2 C8051F39x/F37x USB Connector es ig ns 9 V Wall Adapter Connector Debug Connector D VDD Selection Switch N ew Reset Push-Button Push-Button m en de d fo r LED Potentiometer Terminal Block N ot R ec om Figure 7. UDP C8051F390/F370 MCU Card Rev. 0.2 9 C8051F39x/F37x 5.1. VDD Selection Switch (SW1) The UDP C8051F390/F370 MCU Card has two power options. The VDD selector switch (SW1) selects the power source for the C8051F39x/F37x VDD supply pin and the supply for the external peripheral circuits, VDD2. The power sources for the on-board regulator (U1) are as follows: 9 es ig ns The left VREG position selects the output of the on-board 3.3 V regulator (U5) for VDD and VDD2. This is the primary supply option for development. The on-board regulator has multiple 5 V and 9 V power sources connected via Schottky diodes to the regulator input. The highest voltage power source will supply power to the regulator. V DC Wall Adapter power receptacle (P1). receptacle (P2). 10-pin Debug connector (J2). The UDP MB position on the VDD selector selects the UDP motherboard programmable supply (PWR_VDD_OUT) as the power source. Use this position when using the programmable power supply under software control. The UDP motherboard bulk 3.3 V supply (UDP_PWR_3.3V_BULK) supplies VDD2. D USB N ew The VDD voltage is available on the J1 header. Ground is accessible at various test points on the MCU card, such as header J3, J4, and J5. Use these test points to power the board from an external lab power supply. When using a lab supply, the VDD selector switch should be in the UDP MB position with the MCU card disconnected from the UDP motherboard. The MCU card facilitates measurement of the MCU supply current by removing the R1 0  resistor and placing a current meter in series with the two terminals of the J1 header. fo r 5.2. Push-Button Switches and LEDs (SW3, D7) The UDP C8051F390/F370 MCU Card has one push-button switch. Connect to switch to port pin P1.0 by placing a shorting block on J8: SW - P1.0. The switch is normally open and pulls the pin voltage to ground when pressed. m en de d Port pin P1.1 connects to one LED: D7 when a shorting block is placed on J8: LED - P1.1. The LEDs connect to VDD2 through a current limiting resistor. 5.3. Debug Header (J2) The standard 10-pin debug header supports the Silicon Labs USB Debug Adapter. This connector provides a C2 debug connection to C8051F39x/F37x. The USB Debug Adapter supports two types of debug connections: C2 and JTAG. When using this MCU card with the Silicon Labs IDE, select C2 in the connection options dialog before connecting. om The USB Debug Adapter also provides a 5 V power source that can power the regulator. When powering the MCU from the debug connector, the SW1 switch must be in the VREG position. Additionally, select the Power Target after Disconnect check box in the Silicon Labs IDE connections options dialog to ensure the MCU always has power. 5.4. Reset Button (SW2) N ot R ec The reset push-button switch is in the lower-right corner. Pushing this button will always reset the MCU. Note that pushing this button while the IDE is connected to the MCU will result in the IDE disconnecting from the target. 10 Rev. 0.2 C8051F39x/F37x 5.5. UART VCP Connection Options The MCU card features a USB virtual COM port (VCP) UART connection via the USB connector (P2). The VCP connection uses the CP2102 USB-to-UART bridge chip. es ig ns The UART pins on the target MCU either connect to the CP2102 USB-to-UART bridge chip or to the UDP motherboard. The MCU card has level translators with enable pins that normally route the UART connections to the on-board USB-to-UART bridge chip. However, the UDP motherboard can drive the enable pins to route the UART connections to the UDP motherboard instead of the on-board USB-to-UART bridge chip. There are two enable signals: one with a default pull-down (UART_VCP_EN) and one with a default pull-up (UART_SYS_EN). When using the UART with either the on-board USB-to-UART bridge or the UDP motherboard, install shorting blocks on header J14 to connect P0.4 to MCU_TX and P0.5 to MCU_RX. D If desired, install shorting blocks for hardware handshaking on P0.6 and P0.7 on the J14 header. Hardware handshaking is not required for most applications. Firmware must implement hardware handshaking on the target MCU using P0.6 and P0.7. N ew 5.6. Potentiometer (R36) The potentiometer is available on P0.7 when a shorting block is placed on J13. To enable the potentiometer, place a shorting block on J12 to connect the top terminal of the potentiometer to VDD2. 5.7. Screw Terminal (TB1) fo r The MCU card includes a 5-position screw terminal connection capable of accepting large wires in the field. P0.6, P0.1/IDAC0, P0.2/IDAC1, ground, and P0.0/VREF are available. Before the VREF output can be observed on TB1, place a shorting block on J9 which connects P0.0/VREF to 4.7 µF and 0.1 µF decoupling capacitors. m en de d Before the IDAC0 output can be observed on TB1 with an oscilliscope, place a shorting block on J10 which connects P0.1/IDAC0 to a 1 k resistor to ground. Before the IDAC1 output can be observed on TB1 with an oscilliscope, place a shorting block on J11 which connects P1.2/IDAC1 to a 1 kresistor to ground. 5.8. Port Pin Headers (J3-J5) All of the MCU port pins are available on the 0.100 inch headers. N ot R ec om Shorting blocks are placed on J6 and J7, connecting pins P0.2 and P0.3 to the P0.2 and P0.3 headers on J3. Pin P0.2 and P0.3 can also connect to an external oscillator circuit. When using an external oscillator driver circuit, remove the shorting block on J6 and J7. Rev. 0.2 11 C8051F39x/F37x 5.9. C8051F39x Board Default and Optional Connections es ig ns The C8051F39x MCU card has many default and optional connections for use with the UDP motherboard. The default connections have shorting jumpers consisting of a 402 resistor footprint with solder connecting the two pads. To disconnect a default connection, remove the solder between the pads. To reconnect, install a 0  402 resistor or connect the two pads with solder. The optional connections are non-populated (no-pop) resistor footprints. To connect, install a 0  402 resistor or connect the two pads with solder. Table 1 shows a summary of the default and optional connections for each pin. Further explanation of the UDP motherboard signals can be found in Section 6.2. Table 1. MCU Pin Functions Default P0.0/VREF VREF P0.1/IDAC0 IDAC0 UDP Motherboard Signal (via 402 resistor footprint) Optional P0.2/XTAL1 TX P0.5/RX RX P0.6 CTS P0.7 Potentiometer P1.1 P1.2/IDAC1 P1.3 P1.4 PCA_CEX0, SPI_SLCK_A SPI_MISO_A, PCA_CEX1 PCA_CEX2, SPI_MOSI_A SPI_NSS0_A, PCA SMBUS0_SDA, T0 ec SMBUS0_SCL, T1, ADC_IN0 CP_OUT_A, ADC_IN3 R P2.1 CP_OUT_A_A, ADC_IN2 N ot P2.2 P2.3 ADC_IN1 P2.4 12 CLKOUT0/SYSCLK IDAC1 om P1.5 RTS m en de d P1.0 P2.0 fo r EXT_INT1 P0.4/TX P1.7 Optional EXT_INT0 P0.3/XTAL2 P1.6 Default D MCU Card Function (via shorting blocks) N ew MCU Pin SMBUS_SDA_EZR SMBUS_SCL_EZR Rev. 0.2 C8051F39x/F37x 5.9.1. P0.2 and P0.3 By default, pins P0.2 and P0.3 connect to the EXT_INT0 and EXT_INT1 signals respectively on the UDP motherboard. To disconnect these signals, remove the solder on the R13 and R14 footprint resistors. es ig ns 5.9.2. P1.1 By default, pin P1.1 connects to the CLKOUT0/SYSCLK signal on the UDP motherboard. To disconnect this signal, remove the solder on the R15 foot resistor. 5.9.3. P1.7 and 2.0 By default, pins P1.7 and P2.0 connect to the SMBUS0_SDA and SMBUS0_SCL signals respectively on the UDP motherboard. To disconnect these signals, remove the solder on the R24 and R26 footprint resistors. By default, pins P1.7 and P2.0 also connect to the T0 and T1 signals respectively on the UDP motherboard. To disconnect these signals, remove the solder on the R25 and R27 footprint resistors. D By default, P2.0 also connects to the ADC_IN0 signal on the UDP motherboard. To disconnect this signal, remove the solder on the R28 foot resistor. N ew 5.9.4. P2.1 and R2.2 By default, pins P2.1 and P2.2 connect to the CP_OUT_A and CP_OUT_A_A signals respectively on the UDP motherboard. To disconnect these signals, remove the solder on the R29 and R31 footprint resistors. By default, pins P2.1 and P2.2 also connect to the ADC_IN3 and ADC_IN2 signals respectively on the UDP motherboard. To disconnect these signals, remove the solder on the R30 and R32 footprint resistors. fo r 5.9.5. P2.3 and R2.4 By default, pins P2.2 and P2.4 do not connect to the SMBUS_SDA_EZR and SMBUS_SCL_EZR signals respectively on the UDP motherboard. To connect these signals, solder the R33 and R35 footprint resistors. N ot R ec om m en de d By default, pin P1.0 connects to the ADC_IN1 signal on the UDP motherboard. To disconnect this signal, remove the solder on the R34 foot resistor. Rev. 0.2 13 C8051F39x/F37x 6. Using the C8051F39x with the UDP Motherboard 6.1. VBAT Selector Switch es ig ns When used with the UDP motherboard, the motherboard can power the C8051F39x MCU card. With the VBAT selector switch in the VREG position, the motherboard powers the regulator on the card. With the VBAT selector switch in the UDP position, the UDP motherboard powers VBAT directly. This position supports software control of the variable voltage power supply and current measurements. The S1 switch on the UDP motherboard selects between the fixed or programmable voltage. The variable supply is controlled by the C8051F384 board control MCU through the U1 digital potentiometer. Use the fixed supply when the variable supply is not under software control. 6.2. MCU Card Header Connections D The C8051F39x MCU card has four connectors with 100 pins each. These 400 pins are directly tied to the UDP motherboard and I/O cards. These signals are named and designed to support a wide variety of features and applications, and the UDP C8051F390/F370 MCU Card card implements a subset of these connections. The MCU card slot includes the following components: N ew The MCU cards and I/O cards are designed so that a maximum number of functions are shared between each card. This allows a particular type of I/O card to be shared amongst all MCU cards that connect to the same signals. N ot R ec om m en de d fo r J1 MCU card connector H1 J2 MCU card connector H2 J3 MCU card connector H3 J4 MCU card connector H4 The C8051F39x MCU card implements the signals described in Table 3, Table 4, Table 5, and Table 6 in the Appendix. 14 Rev. 0.2 C8051F39x/F37x 6.3. Shorting Blocks: Factory Defaults m en de d fo r N ew D es ig ns The UDP C8051F390/F370 MCU Card comes from the factory with pre-installed shorting blocks on several headers. Figure 8 shows the positions of the factory default shorting blocks. Figure 8. Shorting Blocks: Factory Defaults N ot R ec om Shorting blocks are installed on J14 to connect P0.4 to MCU_TX and P0.5 to MCU_RX. Rev. 0.2 15 N ot 16 Rev. 0.2 fo r N ew Figure 9. C8051F39x UDP MCU Card Schematic (1 of 6) m en de d om ec R es ig ns D C8051F39x/F37x 7. Schematics N ot Rev. 0.2 fo r N ew Figure 10. C8051F39x UDP MCU Card Schematic (2 of 6) m en de d om ec R es ig ns D C8051F39x/F37x 17 N ot 18 Rev. 0.2 fo r N ew Figure 11. C8051F39x UDP MCU Card Schematic (3 of 6) m en de d om ec R es ig ns D C8051F39x/F37x N ot Rev. 0.2 fo r N ew Figure 12. C8051F39x UDP MCU Card Schematic (4 of 6) m en de d om ec R es ig ns D C8051F39x/F37x 19 N ot 20 Rev. 0.2 fo r N ew Figure 13. C8051F39x UDP MCU Card Schematic (5 of 6) m en de d om ec R es ig ns D C8051F39x/F37x N ot Rev. 0.2 fo r N ew Figure 14. C8051F39x UDP MCU Card Schematic (6 of 6) m en de d om ec R es ig ns D C8051F39x/F37x 21 C8051F39x/F37x 8. Bill of Materials Table 2. UPMU-F390-A/UPMU-F370-A Bill of Materials Part Number Source Description U1 C8051F390-A-GM or C8501F370-A-GM Silicon Labs Mixed-Signal MCU, 50 MIPS 16 kB Flash, 512B EEPROM, RoHS. U3 CP2102-GM Silicon Labs SINGLE-CHIP USB TO UART BRIDGE, QFN28, RoHS. U2 24AA64FT-I/MNY Microchip 64KBIT I2C SERIAL FLASH, 400 kHZ, 8TDFN, RoHS. U4 U6 SN74AVC4T245PWR Texas Instruments Quad Dual-Supply Level Shifter, TSSOP C1 06035C103KAT2A AVX Corporation C3 C5 C7-8 C10 C12 C16 C18 C21-24 C0603C104J3RACTU Kemet C6 C11 GRM188R71A105KA61D Murata CAP CERAMIC, 1.0 µF, X5R, 0603, 10 V, ±10%, RoHS. C4 TCA1A156M8R Rohm CAP TANT, 15 µF, A-CASE, 10 V, ±20%, OR EQ, RoHS. C9 C15 C17 GRM188F51A475ZE20D Murata CAP, 4.7 µF, Y5V, CERAMIC, 0603, 10 V, –20%, +80%, OR EQ, RoHS. C2 TAJC476K016RNJ AVX Corporation CAP, 47 µF, TANT, 6032-28, 16 V, ±10%, OR EQ, RoHS. C13-14 C1920 NO POP NO POP CAP, NO POP, 0603, OR EQ, RoHS. RAPC722X Switchcraft Inc. CONN, POWERJACK MINI.08" RA PC MNT, RoHS. FX8-100P-SV1(91) ec H1 H2 H3 H4 R D1-2 D4 N ot D8 22 1N5819HW-7-F BAT54C-G D N ew CAP, 0.01 µF (10000PF), X7R, CERAMIC, 0603, 50 V, ±10%, OR EQ, RoHS. CAP, 0.1 µF, X7R, CERAMIC, 0603, 25 V, ±5%, OR EQ, RoHS. fo r m en de d om P1 es ig ns Reference Hirose Electronic Co CONN, HDR, 100POS, .6 mm, GOLD, SMD, Ltd RoHS Diodes Inc DIODE SCHOTTKY, 40 V, 1A, SOD123, RoHS. Comchip Technology DIODE, Schottkey DUAL CC, 200 mA, 30 V, SOT23,RoHS. ZD6 MBR0520LT1G ON Semiconductor DIODE SCHOTTKY 0.5A 20 V, SOD123, RoHS. ZD1 MMSZ5245B-7-F Diodes Inc DIODE, ZENER, 15 V, 500MW, SMT, SOD123, RoHS. Rev. 0.2 C8051F39x/F37x Table 2. UPMU-F390-A/UPMU-F370-A Bill of Materials (Continued) Part Number Source Description D5 SP0503BAHTG Littelfuse Inc TVS AVAL DIODE ARRAY, 3 CH, SOT143, RoHS. J1 J6-7 J9-13 PBC02SAAN Sullens Connector Solutions STAKE HEADER, 1X2, 0.1"CTR, GOLD, OR EQ, RoHS. J8 PBC02DAAN Sullens Connector Solutions STAKE HEADER, 2x2, 0.1"CTR, GOLD, OR EQ, RoHS. J14 PBC04DAAN Sullens Connector Solutions STAKE HEADER, 2x4, 0.1"CTR, OR EQ, RoHS. J3-5 PBC05DAAN Sullens Connector Solutions STAKE HEADER, 2x5, 0.1"CTR, GOLD, OR EQ, RoHS. J2 N2510-6002-RB 3M D7 SML-LX0603GW-TR Lumex Opto/Components Inc LED, 565NM, GREEN DIFF, SMT0603, OR EQ, RoHS. D3 D6 SML-LX0603IW-TR Lumex Opto/Components Inc LED, RED DIFF, 635NM, SMT0603, OR EQ, RoHS. U5 LM2937IMP-3.3/NOPB National Semiconductor VOLTAGE REG, 3.3 V, LDO, 500MA, SOT223, RoHS. R36 RV100F-30-4K1B-B10KB301 Alpha (Taiwan) POT, 10K, THUMBWHEEL LINEAR, 0.03W, ±20%, OR EQ, RoHS. R1 RC0603JR-070RL Yageo RES, 0.0, SMT, 0603, 1/10W, ±5%, OR EQ, RoHS. R41-42 ERJ-3EKF1002V Panasonic Electronic RES, EQ. 10.0 k, SMT, 0603, 1/10W, ±1%, Components OR EQ, RoHS. R2-4 R11 R37-38 ERJ-3EKF1001V Panasonic Electronic RES, 1 k, SMT, 0603, 1/10W, ±1%, OR EQ, Components RoHS. R7 R12 ERJ-3EKF4751V N ew D es ig ns Reference fo r m en de d om HEADER, SHROUDED, 2x5, OR EQ, RoHS. RES, 4.75 k, SMT, 0603, 1/10W, ±1%, OR EQ, RoHS. MCR03EZPJ471 Rohm Semiconductor RES, 470 , SMT, 0603, 1/10W, ±5%, OR EQ, RoHS. R8-9 NO POP NO POP RES, NO POP, SMT, 0603, OR EQ, RoHS. R13-32 R34 R39 R43-46 N/A N/A SOLDER BUMP RESISTOR, CLOSED, 0402, RoHS. R33 R35 N/A N/A SOLDER BUMP RESISTOR, OPEN, 0402, RoHS. SJ1-6 SPC02SYAN Sullins Connector Solutions CONN, JUMPER SHORTING, TIN, OR EQ, RoHS. ec Panasonic Electronic Components N ot R R5-6 R10 Rev. 0.2 23 C8051F39x/F37x Table 2. UPMU-F390-A/UPMU-F370-A Bill of Materials (Continued) Reference Part Number Source Description SW2-3 EVQ-PAD04M SW1 SSSS820201 Alps SWITCH SLIDE, SMT, RoHS. TP1-12 TP42-43 NO POP NO POP TEST POINT, PC COMPACT, NO POP, OR EQ, RoHS. TB1 1729157 Phoenix Contact TERM. BLOCK, 5.08 mm CTRS, 5 POS, RoHS. P2 61729-0010BLF FCI CONN, USB RECEPT, TYPE B, RoHS. Y1 NO POP NO POP CRYSTAL, NO POP, OR EQ, RoHS. N ot R ec om m en de d fo r N ew D es ig ns Panasonic Electronic SWITCH, LIGHT TOUCH, 130GF, 6 mm SQ, Components RoHS. 24 Rev. 0.2 C8051F39x/F37x APPENDIX—MCU CARD HEADER PIN DESCRIPTIONS Table 3. UDP C8051F390/F370 MCU Card H1 Pin Descriptions Signal Name Usage es ig ns MCU Card Pin GND USART_TX_A 3 USART_RX_A 4 USART_RTS_A 5 USART_CTS_A 6 USART_UCLK_A 7 CAN_TX_B 8 CAN_RX_B 9 SPI_SCK_A 10 SPI_MISO_A SPI0 master-in, slave-out 11 SPI_MOSI_A SPI0 master-out, slave-in 12 SPI_NSS0_A SPI0 slave select 13 SPI_NSS1_A 14 SPI_NSS2_A 15 SPI_NSS3_A 16 USART_TX_B 18 19 20 21 22 N ew fo r USART_RX_B USART_RTS_B USART_CTS_B USART_UCLK_B EPCA_ECI_A EPCA_CH0_A EPCA_CH1_A EPCA_CH2_A 25 EPCA_CH3_A 26 EPCA_CH4_A 27 EPCA_CH5_A 28 LIN_TX_A 29 LIN_RX_A 30 PCA_ECI_A PCA0 external clock input 31 PCA_CH0_A PCA0 channel 0 32 PCA_CH1_A PCA0 channel 1 33 PCA_ECI_B 34 PCA_CH0_B 35 PCA_CH1_B 36 I2SOUT_DFS_A N ot R 24 ec om 23 SPI0 clock m en de d 17 D 1 2 PCA0 channel 2 Rev. 0.2 25 C8051F39x/F37x Table 3. UDP C8051F390/F370 MCU Card H1 Pin Descriptions (Continued) MCU Card Pin Signal Name 37 I2SOUT_CLK_A 38 I2SOUT_DOUT_A 39 I2C_SDA_EZR EZRadioPro I2C data 40 I2C_SCL_EZR EZRadioPro I2C clock 41 TIMER_CT_A Timer0 input 42 TIMER_EX_A 43 TIMER_CT_B 44 TIMER_EX_B 45 UART_TX_A 46 UART_RX_A 47 UART_RTS_A UART A hardware handshaking 48 UART_CTS_A UART A hardware handshaking 49 UART_TX_SYS System UART transmit 52 UART_RTS_SYS 53 UART_CTS_SYS 54 55 56 57 58 59 60 System UART receive System UART hardware handshaking System UART hardware handshaking SPI_SCK_EZR SPI_MISO_EZR SPI_MOSI_EZR SPI_NSS0_EZR SPI_NSS1_EZR SPI_NSS2_EZR SPI_NSS3_EZR SMBUS0 data 62 I2C_SCL_B SMBUS0 clock 63 I2SIN_DFS_A 64 I2SIN_CLK_A 65 I2SIN_DOUT_A 66 CLKOUT0 67 GPIO00 68 GPIO01 69 GPIO02 70 GPIO03 71 GPIO04 72 GPIO05 73 GPIO06 R om I2C_SDA_B N ot 26 es ig ns D UART A receive ec 61 N ew UART_RX_SYS UART A transmit fo r GND 51 Timer1 input m en de d 50 Usage MCU system clock Rev. 0.2 C8051F39x/F37x Table 3. UDP C8051F390/F370 MCU Card H1 Pin Descriptions (Continued) GPIO08 76 GPIO09 77 GPIO10 78 GPIO11 79 GPIO12 80 GPIO13 81 GPIO14 82 GPIO15 83 PORT_MATCH0 84 PORT_MATCH1 85 WAKEUP0 86 WAKEUP1 87 EXT_INT0 88 EXT_INT1 89 EXT_ADC_TRIG0 90 EXT_ADC_TRIG1 91 92 93 94 95 96 97 External interrupt 0 External interrupt 1 EXT_DAC_TRIG0 EXT_DAC_TRIG1 EXT_DMA_TRIG0 EXT_DMA_TRIG1 CAN_TX_A CAN_RX_A LIN_TX_B LIN_RX_B om 98 es ig ns 75 D GPIO07 N ew 74 Usage fo r Signal Name m en de d MCU Card Pin LPTIMER_IN_A 100 LPTIMER_OUT_A N ot R ec 99 Rev. 0.2 27 C8051F39x/F37x Table 4. UDP C8051F390/F370 MCU Card H2 Pin Descriptions MCU Card Pin Signal Name 1 GND 2 UDPBUS_SDA_A Electronic Board ID I2C data 3 UDPBUS_SCL_A Electronic Board ID I2C clock 4 EPCA_ECI_MOTOR 5 EPCA_CH0_MOTOR 6 EPCA_CH1_MOTOR 7 EPCA_CH2_MOTOR 8 EPCA_CH3_MOTOR 9 EPCA_CH4_MOTOR 10 EPCA_CH5_MOTOR 11 HVGPIO0 12 HVGPIO1 13 HVGPIO2 14 HVGPIO3 15 HVGPIO4 16 HVGPIO5 17 HVGPIO6 19 20 21 22 23 24 es ig ns D N ew fo r HVGPIO7 EMIF_A23 EMIF_A22 EMIF_A21 EMIF_A20 EMIF_A19 EMIF_A18 EMIF_A17 EMIF_A16 27 EMIF_A15 28 EMIF_A14 29 EMIF_A13 30 EMIF_A12 31 EMIF_A11 32 EMIF_A10 33 EMIF_A9 34 EMIF_A8 35 EMIF_A7 36 EMIF_A6 37 EMIF_A5 N ot R 26 ec om 25 m en de d 18 Description 28 Rev. 0.2 C8051F39x/F37x Table 4. UDP C8051F390/F370 MCU Card H2 Pin Descriptions (Continued) 39 EMIF_A3 40 EMIF_A2 41 EMIF_A1 42 EMIF_A0 43 EMIF_WRB 44 EMIF_OEB 45 EMIF_ALE 46 EMIF_CS0B 47 EMIF_BE1B 48 EMIF_CS1B 49 EMIF_BE0B GND 51 LCD_SEG00_A 52 LCD_SEG01_A 53 LCD_SEG02_A 54 LCD_SEG03_A 55 56 57 58 59 60 61 LCD_SEG04_A LCD_SEG05_A LCD_SEG06_A LCD_SEG07_A LCD_SEG08_A LCD_SEG09_A LCD_SEG10_A LCD_SEG11_A LCD_SEG12_A 64 LCD_SEG13_A 65 LCD_SEG14_A 66 LCD_SEG15_A 67 LCD_SEG16_A 68 LCD_SEG17_A 69 LCD_SEG18_A 70 LCD_SEG19_A 71 LCD_SEG20_A 72 LCD_SEG21_A 73 LCD_SEG22_A 74 LCD_SEG23_A N ot R 63 ec om 62 m en de d 50 es ig ns EMIF_A4 D 38 Description N ew Signal Name fo r MCU Card Pin Rev. 0.2 29 C8051F39x/F37x Table 4. UDP C8051F390/F370 MCU Card H2 Pin Descriptions (Continued) 77 LCD_SEG26_A 78 LCD_SEG27_A 79 LCD_SEG28_A 80 LCD_SEG29_A 81 LCD_SEG30_A 82 LCD_SEG31_A 83 LCD_SEG32_A 84 LCD_SEG33_A 85 LCD_SEG34_A 86 LCD_SEG35_A 87 LCD_SEG36_A 88 LCD_SEG37_A 89 LCD_SEG38_A 90 LCD_SEG39_A 91 LCD_COM0_A 92 93 94 95 96 97 98 es ig ns LCD_SEG25_A D LCD_SEG24_A 76 N ew 75 Description fo r Signal Name m en de d MCU Card Pin LCD_COM1_A LCD_COM2_A LCD_COM3_A LCD_COM4_A LCD_COM5_A LCD_COM6_A LCD_COM7_A CMOSCLK_XTAL1_A 100 CMOSCLK_XTAL2_A N ot R ec om 99 30 Rev. 0.2 C8051F39x/F37x Table 5. UDP C8051F390/F370 MCU Card H3 Pin Descriptions PWR_VDD_IN 3 PWR_VDD_IN 4 PWR_VDD_OUT 5 PWR_VDD_OUT 6 PWR_RADIO_IN 7 PWR_RADIO_IN 8 PWR_RADIO_OUT 9 PWR_RADIO_OUT 10 PWR_IO_IN 11 PWR_IO_IN 12 PWR_IO_OUT 13 PWR_IO_OUT 14 PWR_IO_BUS 15 PWR_IO_BUS 16 PWR_AUX_BUS 17 PWR_AUX_BUS 18 19 20 21 22 23 24 Programmable Supply from UDP to VDD (when VDD select switch is set to UDP) PWR_HV1_BUS PWR_HV1_BUS PWR_HV2_BUS PWR_HV2_BUS PWR_VPP_BULK PWR_VPP_BULK PWR_5.0_BULK PWR_5.0_BULK PWR_5.0_BULK 27 PWR_5.0_BULK 28 PWR_3.3_BULK 29 PWR_3.3_BULK 30 PWR_3.3_BULK 31 PWR_3.3_BULK 32 PWR_SYS_BULK 33 PWR_SYS_BULK 34 GND 35 EBID_SCK 36 EBID_MOSI 37 EBID_MISO N ot R 26 ec om 25 es ig ns 2 D GND N ew 1 Description fo r Description m en de d MCU Card Pin 3.3 V power from the UDP mother (Powers VDD2 when VDD select switch is set to UDP) 3.3 V power supply for EBID EEPROM Rev. 0.2 31 C8051F39x/F37x Table 5. UDP C8051F390/F370 MCU Card H3 Pin Descriptions (Continued) Description 38 EBID_NSS 39 C2_CLK_A Reset/C2 interface clock 40 C2_DAT_A P2.4/C2 interface data 41 C2_CLK_B 42 C2_DAT_B 43 C2_CLK_C 44 C2_DAT_C 45 C2_CLK_D 46 C2_DAT_D 47 C2_CLK_E 48 C2_DAT_E 49 nc 50 GND 51 JTAG_TDO_A 52 JTAG_TDI_A 53 VCP_EN Active-low enable for MCU Card VCP Bridge (default) 54 UART_SYS_EN Active-low enable for MCU to UDP UART path 56 57 58 59 60 61 D N ew fo r H3_55 H3_56 H3_57 H3_58 H3_59 H3_60 H3_61 H3_62 om 62 m en de d 55 Description H3_63 64 H3_64 65 H3_65 66 H3_66 67 H3_67 N ot R ec 63 32 68 H3_68 69 H3_69 70 H3_70 71 H3_71 72 H3_72 73 H3_73 74 H3_74 es ig ns MCU Card Pin Rev. 0.2 C8051F39x/F37x Table 5. UDP C8051F390/F370 MCU Card H3 Pin Descriptions (Continued) H3_76 77 H3_77 78 H3_78 79 H3_79 80 H3_80 81 H3_81 82 H3_82 83 H3_83 84 H3_84 85 H3_85 86 H3_86 87 H3_87 88 H3_88 89 H3_89 90 H3_90 91 H3_91 92 93 94 95 96 97 98 H3_92 H3_93 H3_94 H3_95 H3_96 H3_97 H3_98 H3_99 om 99 es ig ns 76 D H3_75 N ew 75 Description fo r Description m en de d MCU Card Pin H3_100 N ot R ec 100 Rev. 0.2 33 C8051F39x/F37x Table 6. UDP C8051F390/F370 MCU Card H4 Pin Descriptions C2D_TX00_A 3 C2D_TX01_A 4 C2D_TX02_A 5 C2D_TX03_A 6 C2D_TX04_A 7 C2D_TX05_A 8 C2D_TX06_A 9 C2D_TX07_A 10 C2D_TX08_A 11 C2D_TX09_A 12 C2D_TX10_A 13 C2D_TX11_A 14 C2D_TX12_A 15 C2D_TX13_A 16 C2D_TX14_A 17 C2D_TX15_A 18 19 20 21 22 23 24 C2D_RX00_A C2D_RX01_A C2D_RX02_A C2D_RX03_A C2D_RX04_A C2D_RX05_A C2D_RX06_A C2D_RX07_A C2D_RX08_A 27 C2D_RX09_A 28 C2D_RX10_A 29 C2D_RX11_A 30 C2D_RX12_A 31 C2D_RX13_A 32 C2D_RX14_A 33 C2D_RX15_A 34 GND 35 ADC_VREF 36 ADC_VREFGND 37 ADC_IN0 N ot R 26 ec om 25 es ig ns 2 D GND N ew 1 Description fo r Description m en de d MCU Card Pin 34 ADC0 input 0 Rev. 0.2 C8051F39x/F37x Description Description 38 ADC_IN1 ADC0 input 1 39 ADC_IN2 ADC0 input 2 40 ADC_IN3 ADC0 input 3 41 GND 42 DAC_VREF 43 DAC_VREFGND 44 DAC_OUT0 45 DAC_OUT1 46 DAC_OUT2 47 DAC_OUT3 48 GND 49 IDAC_A 50 IDAC_B 51 CP_OUT_A 52 CP_OUTA_A 53 CP_POS_A 54 CP_NEG_A 56 57 58 59 60 61 N ew IDAC1 output fo r Comparator0 synchronous output Comparator0 asynchronous output CP_POS_B CP_NEG_B GND HVDA_INP_A HVDA_INN_A HVDA_INP_B HVDA_INN_B GND om 62 IDAC0 output m en de d 55 D MCU Card Pin es ig ns Table 6. UDP C8051F390/F370 MCU Card H4 Pin Descriptions (Continued) I2V_INP_A 64 I2V_INN_A 65 EXTREG_SP_A 66 EXTREG_SN_A 67 EXTREG_OUT_A 68 EXTREG_BD_A 69 GND 70 EZRP_CLK_IN 71 GND 72 EZRP_TX_DATA_IN 73 EZRO_RX_CLK_OUT 74 EZRP_RX_DATA_OUT N ot R ec 63 Rev. 0.2 35 C8051F39x/F37x Table 6. UDP C8051F390/F370 MCU Card H4 Pin Descriptions (Continued) EZRP_SDN 77 EZRP_NIRQ 78 EZR_NFFS 79 EZR_SI100X_TX 80 EZR_DTO 81 EZR_FFIT 82 EZR_SI100X_RX 83 EZR_RESET 84 EZR_ARSSI 85 EZR_VDI 86 EZR_GPIO0 87 EZR_GPIO1 88 EZR_GPIO2 89 EZR_GPIO3 90 EZR_GPIO4 91 H4_91 92 93 94 95 96 97 98 ITM_DAT0 ITM_DAT1 ITM_DAT2 ITM_DAT3 ITM_CLK H4_97 H4_98 H4_99 om 99 es ig ns 76 D GND N ew 75 Description fo r Description m en de d MCU Card Pin GND N ot R ec 100 36 Rev. 0.2 es ig ns D N ew fo r One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! SW/HW Quality Support and Community www.silabs.com/simplicity www.silabs.com/quality community.silabs.com om IoT Portfolio www.silabs.com/IoT m en de d Simplicity Studio N ot R ec Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. 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