WT11U-E-HCI21001

WT11u DATA SHEET Monday, 12 December 2016 Version 0.9.6 VERSION HISTORY Version Comment 0.8 Initial versions 0.81 Ordering information updated 0.9 Reformatted tables, many WT11i->WT11u updates 0.9.1 Rest of tables reformatted 0.9.2 Updated dimension drawings 0.9.3 Certification information, RF parameters 0.9.4 Added sensitivity and current consumption measurements 0.9.5 Changed Transmit power variation over supply voltage range to 0.5 and typical transmit power to 16.5dBm 0.9.6 Small edits to specifications Silicon Laboratories Finland Oy TABLE OF CONTENTS 1 Ordering Information......................................................................................................................................6 2 Pinout and Terminal Description ...................................................................................................................7 3 Electrical Characteristics ............................................................................................................................ 10 4 3.1 Absolute Maximum Ratings ................................................................................................................ 10 3.2 Recommended Operating Conditions ................................................................................................. 10 3.3 Input / Output Terminal Characteristics .............................................................................................. 11 3.3.1 Input/Output Terminal Characteristics (Digital) ............................................................................ 11 3.3.2 Input/Output Terminal Characteristics (USB) .............................................................................. 12 3.4 PIO Current Sink and Source Capability ............................................................................................. 13 3.5 Transmitter Performance For BDR ..................................................................................................... 13 3.6 Receiver Performance ........................................................................................................................ 14 3.7 Current Consumption .......................................................................................................................... 14 3.8 WT11u-A Antenna Specification ......................................................................................................... 15 Physical Dimensions .................................................................................................................................. 18 4.1 Package Drawings .............................................................................................................................. 20 5 Layout Guidelines ....................................................................................................................................... 22 6 UART Interface ........................................................................................................................................... 25 7 6.1 UART Bypass ...................................................................................................................................... 27 6.2 UART Configuration While Reset is Active ......................................................................................... 27 6.3 UART Bypass Mode ............................................................................................................................ 27 USB Interface ............................................................................................................................................. 28 7.1 USB Data Connections ....................................................................................................................... 28 7.2 USB Pull-Up resistor ........................................................................................................................... 28 7.3 USB Power Supply .............................................................................................................................. 28 7.4 Self-Powered Mode ............................................................................................................................. 28 7.5 Bus-Powered Mode ............................................................................................................................. 29 7.6 USB Suspend Current ......................................................................................................................... 30 7.7 USB Detach and Wake-Up Signaling.................................................................................................. 30 7.8 USB Driver .......................................................................................................................................... 31 7.9 USB v2.0 Compliance and Compatibility ............................................................................................ 31 8 Serial Peripheral Interface (SPI) ................................................................................................................. 32 9 PCM Codec Interface ................................................................................................................................. 33 9.1 PCM Interface Master/Slave ............................................................................................................... 33 9.2 Long Frame Sync ................................................................................................................................ 34 9.3 Short Frame Sync ............................................................................................................................... 34 9.4 Multi-slot Operation ............................................................................................................................. 35 9.5 GCI Interface ....................................................................................................................................... 35 Silicon Laboratories Finland Oy 9.6 Slots and Sample Formats .................................................................................................................. 36 9.7 Additional Features ............................................................................................................................. 37 9.8 PCM_CLK and PCM_SYNC Generation ............................................................................................ 37 9.9 PCM Configuration .............................................................................................................................. 38 10 I/O Parallel Ports ..................................................................................................................................... 41 10.1 11 PIO Defaults ................................................................................................................................. 41 Reset ....................................................................................................................................................... 42 11.1 12 Pin States on Reset ..................................................................................................................... 43 Certifications ........................................................................................................................................... 44 12.1 Bluetooth ...................................................................................................................................... 44 12.2 FCC .............................................................................................................................................. 44 12.3 ISEDC .......................................................................................................................................... 45 12.3.1 ISEDC (Français) ......................................................................................................................... 45 12.4 CE ................................................................................................................................................ 47 12.5 MIC Japan .................................................................................................................................... 47 12.6 Qualified Antenna Types for WT11u-E ........................................................................................ 48 12.7 Moisture Sensitivity Level (MSL).................................................................................................. 48 Silicon Laboratories Finland Oy WT11u Bluetooth® Module DESCRIPTION WT11u is a fully integrated Bluetooth 2.1 + EDR, class 1 module combining antenna, Bluetooth radio and an on-board iWRAP Bluetooth stack. Silicon Labs WT11u provides an ideal solution for developers that want to quickly integrate long range and high performance Bluetooth wireless technology to their design without investing several months into Bluetooth radio and stack development. WT11u provides a 100dB link budget ensuring long rage and robust Bluetooth connectivity. WT11u uses Silicon Labs’ iWRAP Bluetooth stack, which is an embedded Bluetooth stack implementing 13 different Bluetooth profiles and Apple iAP connectivity. By using WT11u combined with iWRAP Bluetooth stack and Silicon Labs’ excellent technical support designers ensure quick time to market, low development costs and risk. APPLICATIONS:  Industrial and M2M  Point-of-Sale devices  Computer Accessories KEY FEATURES: Radio features:  Bluetooth v.2.1 + EDR  Bluetooth class 1 radio  Transmit power: +17 dBm  Receiver sensitivity: -84 dBm (DH5)  Range: 350 meters line-of-sight  Integrated connector chip antenna or U.FL Hardware features:  UART and USB host interfaces  802.11 co-existence interface  6 software programmable IO pins  Operating voltage: 2.7V to 3.6V  Temperature range: -40C to +85C  Dimensions: 35.75 x 14.50 x 2.6 mm Qualifications:  Bluetooth  CE  FCC  IC  Japan PHYSICAL OUTLOOK Silicon Laboratories Finland Oy 1 Ordering Information Firmware U.FL Connector Internal chip antenna iWRAP 5.6 firmware WT11u-E-AI56 WT11u-A-AI56 iWRAP 5.5 firmware WT11u-E-AI55 WT11u-A-AI55 iWRAP 5.0.1 firmware WT11u-E-AI5 WT11u-A-AI5 HCI firmware, BT2.1 + EDR WT11u-E-HCI21 WT11u-A-HCI21 Table 1: Ordering information Silicon Laboratories Finland Oy Page 6 of 49 Pinout and Terminal Description 2 WT11i 1 GND 2 VDD_PA GND 28 AIO 3 27 PIO2 UART_TX 26 4 PIO3 PIO5 25 5 UART_RTS# SPI_MOSI 24 6 UART_RX SPI_MISO 23 7 PCM_OUT SPI_CLK 22 8 USB+ SPI_CS# 21 9 USB- PIO4 20 10 UART_CTS# PIO7 19 11 PCM_IN PIO6 18 12 PCM_CLK RESET 17 13 PCM_SYNC VDD 16 14 GND GND 15 Figure 1: WT11u connection diagram Pad name Pad number Pad type Description RESET 17 Input Reset input, active high, internal 220kohm pull-down. Keep high for >5ms for reset GND 1, 14, 15, 28 GND Ground connection, connect all to a ground plane with minimal trace lengths VDD_PA 2 Supply voltage Supply voltage for RF power amplifier VDD 16 Supply voltage Chipset supply voltage Table 2: Supply and RF Terminal Descriptions Silicon Laboratories Finland Oy Page 7 of 49 PIO signal Pad number Description PIO[2] 3 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[3] 4 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[4] 20 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[5] 25 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[6] 18 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[7] 19 Bi-directional digital in/out with programmable strength and pull-up/pulldown AIO[1] 27 Bi-directional analog in/out Table 3: GPIO Terminal Descriptions PCM signal Pad number Pad type Description PCM_OUT 7 Output, weak internal pull-down PCM_IN 11 Input, weak internal pull-down Synchronous data input PCM_SYNC 13 Bi-directional, weak internal pull-down Synchronous data sync PCM_CLK 12 Bi-directional, weak internal pull-down Synchronous data clock Synchronous data output Table 4: PCM Terminal Descriptions Silicon Laboratories Finland Oy Page 8 of 49 UART signal Pad number Pad type Description UART_TX 26 Output, pull-up weak internal UART data output, active high UART_RTS# 5 Output, pull-up weak internal UART request to send, active low UART_RX 6 Input, weak internal pulldown UART data input, active high UART_CTS# 10 Input, weak internal pulldown UART clear to send, active low Table 5: UART Terminal Descriptions USB signal Pad number Pad type Description USB+ 8 Bidirectional USB data line with internal 1.5kohm pull-up USB- 9 Bidirectional USB data line Table 6: USB Terminal Descriptions SPI signal Pad number Pad type SPI_MOSI 24 Input, weak internal pull-down SPI_CS# 21 Input, weak internal pull-up SPI_CLK 22 Input, weak internal pull-down SPI_MISO 23 Output, weak internal pull-down Description SPI data input Chip select, active low SPI clock SPI data output Table 7: Terminal Descriptions Silicon Laboratories Finland Oy Page 9 of 49 3 Electrical Characteristics 3.1 Absolute Maximum Ratings Specification Min Max Unit Storage temperature -40 85 °C VDD_PA, VDD -0.4 3.6 V VSS-0.4 VDD+0.4 V Specification Min Max Unit Operating temperature -40 85 °C VDD_PA*, VDD 3.0 3.6 V Other terminal voltages Table 8: Absolute Maximum Ratings 3.2 Recommended Operating Conditions *) VDD_PA has an effect on the RF output power. Table 9: Recommended Operating Conditions Silicon Laboratories Finland Oy Page 10 of 49 3.3 Input / Output Terminal Characteristics 3.3.1 Input/Output Terminal Characteristics (Digital) Digital Terminals Min Typ Max Unit 2.7 V ≤ VDD ≤ 3.0 V -0.4 - 0.8 V 1.7 V ≤ VDD ≤ 1.9 V -0.4 - 0.4 V 0.7 VDD - VDD + 0.4 V - - 0.2 V - - 0.4 V VOL output logic level high (IO = 4.0 mA) 2.7V ≤ VDD ≤ 3.0 VDD - 0.2 - V VOL output logic level high (IO = 4.0 mA) 1.7V ≤ VDD ≤ 1.9 VDD - 0.4 - V -100 -40 -10 µA 10 40 100 µA Weak pull-up -5.0 -1.0 -0.2 µA Weak pull-down 0.2 1.0 5.0 µA I/O pad leakage current -1 0 1 µA CI input capacitance 1.0 - 5.0 pF Input Voltage Levels VIL input logic level low VIH input logic level high Output Voltage Levels VOL output logic level low (IO = 4.0 mA) 2.7V ≤ VDD ≤ 3.0 V VOL output logic level low (IO = 4.0 mA) 1.7V ≤ VDD ≤ 1.9 Input and Tristate Current with Strong pull-up Strong pull-down Silicon Laboratories Finland Oy Page 11 of 49 3.3.2 Input/Output Terminal Characteristics (USB) USB Terminals Min VDD_USB for correct USB operation 3.1 Typ Max Unit 3.6 V Input Threshold VIL input logic level log VIH input logic level high - - 0.3VDD_USB V 0.7VDD_USB - - V Silicon Laboratories Finland Oy Page 12 of 49 3.4 PIO Current Sink and Source Capability Figure 2: WT11u PIO Current Drive Capability 3.5 Transmitter Performance For BDR RF characteristic Min Max transmit power Typ Max 16.5 Bluetooth specification Unit