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WT12-A-AI

WT12-A-AI

  • 厂商:

    SILABS(芯科科技)

  • 封装:

    模块

  • 描述:

    CLASS 2 BLTOOTH 2.1+EDR MODULE

  • 数据手册
  • 价格&库存
WT12-A-AI 数据手册
WT12 D a t a S h e e t V e r s i o n F r i d a y , 2 . 8 M a y 2 2 , 2 0 0 9 Copyright © 2000-2009 Bluegiga Technologies All rights reserved. Bluegiga Technologies assumes no responsibility for any errors, which may appear in this manual. Furthermore, Bluegiga Technologies reserves the right to alter the hardware, software, and/or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. Bluegiga Technologies’ products are not authorized for use as critical components in life support devices or systems. The WRAP is a registered trademark of Bluegiga Technologies The Bluetooth trademark is owned by the Bluetooth SIG Inc., USA, and is licensed to Bluegiga Technologies. All other trademarks listed herein are owned by their respective owners. Contents: 1. Block Diagram and Descriptions ...................................................................6 2. Electrical Characteristics ..............................................................................8 2.1 Radio Characteristics – Basic Data Rate ........................................................ 11 2.2 Radio Characteristics – Enhanced Data Rate .................................................. 14 3. WT12 Pin Description .................................................................................16 4. Physical Interfaces .....................................................................................19 4.1 UART Interface.......................................................................................... 19 4.1.1 UART Configuration While RESET is Active ............................................... 20 4.1.2 UART Bypass Mode............................................................................... 20 4.2 USB Interface ........................................................................................... 22 4.2.1 USB Pull-Up Resistor ............................................................................ 22 4.2.2 Self Powered Mode ............................................................................... 22 4.2.3 Bus Powered Mode ............................................................................... 23 4.2.4 Suspend Current .................................................................................. 24 4.2.5 Detach and Wake-Up Signaling .............................................................. 24 4.2.6 USB Driver .......................................................................................... 25 4.2.7 USB 1.1 Compliance ............................................................................. 25 4.2.8 USB 2.0 Compatibility ........................................................................... 25 4.3 SPI Interface ............................................................................................ 26 4.4 PCM Interface ........................................................................................... 27 4.4.1 PCM Interface Master/Slave ................................................................... 27 4.4.2 Long Frame Sync ................................................................................. 28 4.4.3 Short Frame Sync ................................................................................ 28 4.4.4 Multi Slot Operation.............................................................................. 29 4.4.5 GCI Interface ...................................................................................... 29 4.4.6 Slots and Sample Formats ..................................................................... 30 4.4.7 Additional Features .............................................................................. 31 4.4.8 PCM Configuration ................................................................................ 31 2 5. I/O Parallel Ports .......................................................................................33 6. Software Stacks .........................................................................................34 6.1 iWRAP Stack ............................................................................................. 34 6.2 HCI Stack ................................................................................................. 35 6.3 RFCOMM Stack .......................................................................................... 38 6.4 VM Stack .................................................................................................. 39 6.5 HID Stack ................................................................................................ 40 7. Enhanced Data Rate ...................................................................................42 7.1 Enhanced Data Rate Baseband .................................................................... 42 7.2 Enhanced Data Rate /4 DQPSK .................................................................. 42 7.3 8DQPSK ................................................................................................... 42 8. Layout and Soldering Considerations .........................................................44 8.1 Soldering recommendations ........................................................................ 44 8.2 Layout guidelines ...................................................................................... 44 9. WT12 physical dimensions .........................................................................47 10. Package ......................................................................................................49 11. Certifications ..............................................................................................51 11.1 Bluetooth ............................................................................................ 51 11.2 FCC.................................................................................................... 52 11.3 CE ..................................................................................................... 52 11.4 Industry Canada (IC)............................................................................ 53 12. RoHS Statement with a List of Banned Materials ........................................54 13. Contact Information ...................................................................................55 3 TERMS & ABBREVIATIONS Term or Abbreviation: Explanation: Bluetooth Set of technologies providing audio and data transfer over short-range radio connections CE Conformité Européene DFU Device Firmware Upgrade EDR Enhanced Data Rate FCC Federal Communications Commission HCI Host Controller Interface HID Human Interface Device iWRAP Interface for WRAP PCB Printed Circuit Board PCM Pulse Code Modulation RoHS The Restriction of Hazardous Substances in Electrical and Electronic Equipment Directive (2002/95/EC) SPI Serial Peripheral Interface UART Universal Asynchronous Transmitter Receiver USB Universal Serial Bus VM Virtual Machine WRAP Wireless Remote Access Platform 4 WT12 Bluetooth  module DESCRIPTION FEATURES: WT12 is a next-generation, class 2, Bluetooth® 2.0+EDR (Enhanced Data Rates) module. It introduces three times faster data rates compared to existing Bluetooth® 1.2 modules even with lower power consumption! WT12 is a highly integrated and sophisticated Bluetooth® module, containing all the necessary elements from Bluetooth® radio to antenna and a fully implemented protocol stack. Therefore WT12 provides an ideal solution for developers who want to integrate Bluetooth® wireless technology into their design with limited knowledge of Bluetooth® and RF technologies.            By default WT12 module is equipped with powerful and easy-to-use iWRAP firmware. iWRAP enables users to access Bluetooth® functionality with simple ASCII commands delivered to the module over serial interface it's just like a Bluetooth® modem. Fully Qualified Bluetooth system v2.0 + EDR, CE and FCC Integrated chip antenna Industrial temperature range from -40oC to +85oC Enhanced Data Rate (EDR) compliant with v2.0.E.2 of specification for both 2Mbps and 3Mbps modulation modes RoHS Compliant Full Speed Bluetooth Operation with Full Piconet Scatternet Support USB version 2.0 compatible UART with bypass mode Support for 802.11 Coexistence 8Mbits of Flash Memory APPLICATIONS:         Hand held terminals Industrial devices Point-of-Sale systems PCs Personal Digital Assistants (PDAs) Computer Accessories Access Points Automotive Diagnostics Units Figure 1: Physical outlook of WT12 ORDERING INFORMATION: Internal chip antenna W T12-A-AI3 W T12-A-AI W T12-A-HCI21 W T12-A-HCI W T12-A-C (* iW RAP 3.0 firmware iW RAP 2.2.0 firmware HCI firm ware, BT2.1 + EDR HCI firm ware, BT2.0 + EDR Custom firmware Table 1: Ordering information *) Custom firmware means any standard firmware with custom parameters (like UART baud rate), custom firmware developer by customer or custom firmware developed by Bluegiga for the customer. To order custom firmware you must have a properly filled Custom Firmware Order From and unique ordering code issued by Bluegiga. Contact support@bluegiga.com for more information. 5 1. BLOCK DIAGRAM AND DESCRIPTIONS Figure 2: Block Diagram of WT12 BlueCore04 BlueCore4 is a single chip Bluetooth solution which implements the Bluetooth radio transceiver and also an on chip microcontroller. BlueCore4 implements Bluetooth® 2.0+EDR (Enhanced Data Rate) and it can deliver data rates up to 3 Mbps. The microcontroller (MCU) on BlueCore04 acts as interrupt controller and event timer run the Bluetooth software stack and control the radio and host interfaces. A 16-bit reduced instruction set computer (RISC) microcontroller is used for low power consumption and efficient use of memory. BlueCore04 has 48Kbytes of on-chip RAM is provided to support the RISC MCU and is shared between the ring buffers used to hold voice/data for each active connection and the general purpose memory required by the Bluetooth stack. Crystal The crystal oscillates at 26MHz. 6 Flash Flash memory is used for storing the Bluetooth protocol stack and Virtual Machine applications. It can also be used as an optional external RAM for memory intensive applications. Balun / filter Combined balun and filter changes the balanced input/output signal of the module to unbalanced signal of the monopole antenna. The filter is a band pass filter (ISM band). Matching Antenna matching components match the antenna to 50 Ohms. Antenna The antenna is ACX AT3216 chip antenna. USB This is a full speed Universal Serial Bus (USB) interface for communicating with other compatible digital devices. WT12 acts as a USB peripheral, responding to requests from a Master host controller such as a PC. Synchronous Serial Interface This is a synchronous serial port interface (SPI) for interfacing with other digital devices. The SPI port can be used for system debugging. It can also be used for programming the Flash memory. UART This is a standard Universal Asynchronous Receiver Transmitter (UART) interface for communicating with other serial devices. Audio PCM Interface The audio pulse code modulation (PCM) Interface supports continuous transmission and reception of PCM encoded audio data over Bluetooth. Programmable I/O WT12 has a total of 6 digital programmable I/O terminals. These are controlled by firmware running on the device. Reset This can be used to reset WT12. 802.11 Coexistence Interface Dedicated hardware is provided to implement a variety of coexistence schemes. Channel skipping AFH (Adaptive Frequency Hopping), priority signaling, channel signaling and host passing of channel instructions are all supported. The features are configured in firmware. Since the details of some methods are proprietary (e.g. Intel WCS) please contact Bluegiga Technologies for details. 7 2. ELECTRICAL CHARACTERISTICS Absolute maximum ratings Min -40 -40 -0,3 -0,4 Storage temperature Operating temperature Supply voltage Terminal voltages Output current from PIOS Max 85 85 3,6 Vdd + 0,4 35 Unit °C °C V V mA The module should not continuously run under these conditions. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. Table 2: Absolute maximum ratings Recommended operating conditions Min -40 (1) 3,1 0 Operating temperature Supply voltage Terminal voltages Max 85 3,6 Vdd Unit °C V V Table 3: Recommended operating conditions 1) WT12 operates as low as 2,7 V supply voltage. However, to safely meet the USB specification for minimum voltage for USB data lines, minimum of 3,1 V supply is required. Terminal characteristics Min Typ Max Unit I/O voltage levels V IL input logic level low -0,4 - 0,8 V V IH input logic level high 0,7Vdd - Vdd + 0,4 V V OL output logic level low - - 0,2 V V OH output logic level high Reset terminal V TH,res threshold voltage Vdd - 0,2 - - V 0,64 0,85 1,5 R IRES input resistance 220 V k C IRES input capacitance Input and tri-state current with Strong pull-up Strong pull-down W eak pull-up W eak pull-down I/O pad leakage current Vdd supply current TX mode RX mode 220 nF -100 10 -5 0,2 -1 -40 40 -1 1 0 -10 100 -0,2 5 1      - - 70 70 mA mA Table 4: Terminal characteristics 8 Current consumption Test conditions: Room temperature, Vdd = 3,3 V, iWRAP firmware OPERATION MODE AVG Peak supply supply Unit current current Notes Peak current at TX mode 70 - mA - Peak current at RX mode IDLE IDLE, Deep Sleep ON IDLE, Deep Sleep ON NOT visible, NOT connectable INQUIRY NAME CALL CONNECT Master CONNECT Slave CONNECT + Sniff, Master CONNECT + Sniff, Slave 70 - 3 1,2 mA mA mA Module is idle Default settings Module is idle - 0,4 mA Module is idle (Minimum consumption), SET BT PAGEMODE 0 2000 1 - 44,7 44,7 44,7 mA mA mA Device discovery with INQUIRY command Name resolution CALL [ADDR] 1101 RFCOMM - 6,2 mA No data was transmitted, Default settings - 22,4 mA No data was transmitted, Default settings - 4,7 4,6 mA mA CONNECT + sniff, Master - 2,3 mA CONNECT + sniff, Slave - 2,3 mA CONNECT + park, Master CONNECT + park, Slave DATA, Master DATA, Slave - 3,1 2,3 31,5 29,2 mA mA mA mA DATA + Sniff, Master - 19,6 mA DATA + Sniff, Slave - 22,6 mA DATA + Sniff, Master - 3,9 mA Connected (SET BT SNIFF 40 20 1 8) Connected (SET BT SNIFF 40 20 1 8) No data transmitted (SET BT SNIFF 1000 20 1 8) No data transmitted (SET BT SNIFF 1000 20 1 8) No data transmittedPark parameter 1000 No data transmittedPark parameter 1000 Data transmitted @ 115200bps Data transmitted @ 115200bps Data transmitted @ 115200bps (SET BT SNIFF 40 20 1 8) Data transmitted @ 115200bps (SET BT SNIFF 40 20 1 8) Data transmitted (SET BT SNIFF 1000 20 1 8) Table 5: Current consumption 9 Radio characteristics and general specifications Operating frequency range Lower quard band Upper quard band Maximum data rate Receiving signal range Receiver IF frequency Transmission power RF input impedance Compliance USB specification Note (2400 ... 2483,5) MHz ISM Band 2 MHz 3,5 MHz 2402 MHz ... 2480 MHz Carrier frequency Modulation method Hopping Specification GFSK (1 Mbps) P/4 DQPSK (2Mbps) 1600 hops/s, 1 MHz channel space Asynchronous, 723.2 kbps / 57.6 kbps GFSK: Synchronous: 433.9 kbps / 433.9 kbps P/4 Asynchronous, 1448.5 kbps / 115.2 kbps DQPSK: Synchronous: 869.7 kbps / 869.7 kbps Asynchronous, 2178.1 kbps / 177.2 kbps 8DQPSK: Synchronous: 1306.9 kbps / 1306.9 kbps -82 to -20 dBm 1.5 MHz Min Max -11 ... -9 dBm +1 ... +3 dBm 50  Bluetooth specification, version 2.0 + EDR USB specification, version 1.1 (USB 2.0 compliant) Table 6: Radio characteristics and general specifications 10 f = 2402 + k, k = 0...78 Typical condition Center frequency 2.1 Radio Characteristics – Basic Data Rate Transmitter radio characteristics WT12 meets the Bluetooth v2.0+EDR specification between -40°C and +85°C. TX output is guaranteed to be unconditionally stable over the guaranteed temperature range. Measurement conditions: T = 20C, Vdd = 3,3V Item Typical value 1,2 Maximum output power Variation in RF power over temperature range with 4 compensation enabled Variation in RF power over temperature range with 4 compensation disabled RF power control range RF power range control 5 resolution 20dB bandwidth for modulated carrier Adjacent channel transmit power 6,7 F = F0 ± 2MHz Adjacent channel transmit power 6,7 F = F0 ± 3MHz Adjacent channel transmit power 6,7 F = F0 ± > 3MHz f1avg Maximum Modulation +2.5 Bluetooth specification -6 to 4 Unit 3 dBm 1.5 - dB 2.0 - dB 35 16 dB 0.5 - dB 780  1000 kHz -40  20 dBm -45  -40 dBm -50  -40 dBm 165 140
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