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WT41U-A-AI55

WT41U-A-AI55

  • 厂商:

    SILABS(芯科科技)

  • 封装:

    Module

  • 描述:

    BLUETOOTH 2.1+EDR MODULE, CLASS

  • 数据手册
  • 价格&库存
WT41U-A-AI55 数据手册
WT41u DATA SHEET Monday, 12 December 2016 Version 0.8.7 VERSION HISTORY Version Comment 0.8 First version 0.8.1 Table reformatting, value updates etc 0.8.2 Replaced “Bluecore4” with “chipset”, added ordering codes 0.8.3 Rest of table reformatting, added antenna & connector dimension drawings 0.8.4 Added current consumption, RF characteristics 0.8.5 Added certification texts 0.8.6 Added current consumption results, edit TX power variation over VDD range. 0.8.7 Slight edits to specifications Silicon Laboratories Finland Oy TABLE OF CONTENTS 1 Ordering Information......................................................................................................................................6 2 Pinout and Terminal Description ...................................................................................................................7 3 Electrical Characteristics ............................................................................................................................ 11 3.1 Absolute Maximum Ratings ................................................................................................................ 11 3.2 Recommended Operating Conditions ................................................................................................. 11 3.3 Input / Output Terminal Characteristics .............................................................................................. 12 3.3.1 Input/Output Terminal Characteristics (Digital) ............................................................................ 12 3.3.2 Input/Output Terminal Characteristics (USB) .............................................................................. 13 3.4 PIO Current Sink and Source Capability ............................................................................................. 13 3.5 Transmitter Performance For BDR ..................................................................................................... 14 3.6 Receiver Performance ........................................................................................................................ 15 3.7 Current Consumption .......................................................................................................................... 15 4 Physical Dimensions .................................................................................................................................. 16 5 Layout Guidelines ....................................................................................................................................... 19 6 UART Interface ........................................................................................................................................... 20 7 6.1 UART Bypass ...................................................................................................................................... 22 6.2 UART Configuration While Reset is Active ......................................................................................... 22 6.3 UART Bypass Mode ............................................................................................................................ 22 USB Interface ............................................................................................................................................. 23 7.1 USB Data Connections ....................................................................................................................... 23 7.2 USB Pull-Up resistor ........................................................................................................................... 23 7.3 USB Power Supply .............................................................................................................................. 23 7.4 Self-Powered Mode ............................................................................................................................. 23 7.5 Bus-Powered Mode ............................................................................................................................. 24 7.6 USB Suspend Current ......................................................................................................................... 25 7.7 USB Detach and Wake-Up Signaling.................................................................................................. 25 7.8 USB Driver .......................................................................................................................................... 26 7.9 USB v2.0 Compliance and Compatibility ............................................................................................ 26 8 Serial Peripheral Interface (SPI) ................................................................................................................. 27 9 PCM Codec Interface ................................................................................................................................. 28 9.1 PCM Interface Master/Slave ............................................................................................................... 28 9.2 Long Frame Sync ................................................................................................................................ 29 9.3 Short Frame Sync ............................................................................................................................... 29 9.4 Multi-slot Operation ............................................................................................................................. 30 9.5 GCI Interface ....................................................................................................................................... 30 9.6 Slots and Sample Formats .................................................................................................................. 31 9.7 Additional Features ............................................................................................................................. 32 Silicon Laboratories Finland Oy 9.8 PCM_CLK and PCM_SYNC Generation ............................................................................................ 32 9.9 PCM Configuration .............................................................................................................................. 33 10 I/O Parallel Ports ..................................................................................................................................... 36 10.1 11 PIO Defaults ................................................................................................................................. 36 Reset ....................................................................................................................................................... 37 11.1 12 Pin States on Reset ..................................................................................................................... 38 Certifications ........................................................................................................................................... 39 12.1 Bluetooth ...................................................................................................................................... 39 12.2 FCC .............................................................................................................................................. 39 12.3 ISEDC .......................................................................................................................................... 40 12.3.1 ISEDC (Français) ......................................................................................................................... 40 12.4 CE ................................................................................................................................................ 41 12.5 MIC Japan .................................................................................................................................... 42 12.6 Qualified Antenna Types for WT41u-E and WT41u-N ................................................................ 43 12.7 Moisture Sensitivity Level (MSL).................................................................................................. 43 Silicon Laboratories Finland Oy WT41u Bluetooth® Module DESCRIPTION WT41u is a long range class 1, Bluetooth® 2.1 + EDR module. WT41u is a highly integrated and sophisticated Bluetooth® module, containing all the necessary elements from Bluetooth® radio and a fully implemented protocol stack. Therefore WT41u provides an ideal solution for developers who want to integrate Bluetooth® wireless technology into their design with limited knowledge of Bluetooth® and RF technologies. WT41u is optimized for long range applications is available with an integrated chip antenna, an RF pin for a custom on-board antenna or a U.FL connector for an external 2dBi dipole antenna. By default WT41u module is equipped with powerful and easy-to-use iWRAP firmware. iWRAP enables users to access Bluetooth® functionality with simple ASCII commands delivered to the module over serial interface - it's just like a Bluetooth® modem. APPLICATIONS:         Hand held terminals Industrial devices Point-of-Sale systems PCs Personal Digital Assistants (PDAs) Computer Accessories Access Points Automotive Diagnostics Units FEATURES:                Fully Qualified Bluetooth v2.1 + EDR end product CE qualified Full modular certification for FCC and IC MIC Japan compatibility fully tested with ARIB STD-T66 TX power : 17 dBm RX sensitivity : -94 dBm Integrated chip antenna, RF pin or U.FL antenna connector Class 1, range up to 650 meters with chip antenna or up to 1km with an external dipole Industrial temperature range from -40oC to +85oC RoHS Compliant USB interface (USB 2.0 compatible) UART with bypass mode 6 x GPIO 1 x 8-bit AIO Integrated iWRAPTM Bluetooth stack or HCI firmware Silicon Laboratories Finland Oy 1 Ordering Information Firmware U.FL Connector Internal chip antenna iWRAP 5.6 firmware WT41u-E-AI56 WT41u-A-AI56 iWRAP 5.5 firmware WT41u-E-AI55 WT41u-A-AI55 iWRAP 5.0.1 firmware WT41u-E-AI5 WT41u-A-AI5 HCI firmware, BT2.1 + EDR WT41u-E-HCI21 WT41u-A-HCI21 Table 1: Ordering information Silicon Laboratories Finland Oy Page 6 of 44 GND GND GND GND GND GND GND 59 58 57 56 55 54 53 2 Pinout and Terminal Description 51 RF RFGND 50 GND GND GND GND GND GND AIO UART_TX PIO5 SPI_MOSI SPI_MISO SPI_CLK SPI_CSB GND PIO7 PIO6 RESET VDD GND 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 GND PCM_OUT GND GND GND PIO4 GND GND GND GND GND GND GND GND GND GND VDD_PA PIO2 PIO3 UART_RTS UART_RX GND USB+ USBUART_CTS PCM_IN PCM_CLK PCM_SYNC GND 24 25 26 27 28 29 30 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Pins 1 and 52 (GND) are not connected and have been removed Figure 1: WT41u pin out Silicon Laboratories Finland Oy Page 7 of 44 Pad name Pad number Pad type Description NC 1, 52 Not connected RESET 33 Digital input GND 2-10, 16, 23, 24, 26-28, 30, 31, 36, 44-49, 5359 Ground RF 51 Not connected RFGND 50 Ground VDD_PA 11 Supply voltage Supply voltage for the RF power amplifier and low noise amplifier VDD 32 Supply voltage Supply voltage for the Bluetooth chipset Pins 1 and 52 are not present on the footprint Active low reset with weak internal pull-up. Keep low for >5ms to reset module Ground pads should all be connected to a ground plane with minimum trace length, especially on the antenna end of the module No internal connection Connect to ground plane Table 2: Supply and RF Terminal Descriptions PIO signal Pad number Description PIO[2] 12 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[3] 13 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[4] 29 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[5] 41 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[6] 34 Bi-directional digital in/out with programmable strength and pull-up/pulldown PIO[7] 35 Bi-directional digital in/out with programmable strength and pull-up/pulldown AIO[1] 43 Bi-directional analog in/out Table 3: GPIO Terminal Descriptions Silicon Laboratories Finland Oy Page 8 of 44 PCM signal Pad number Pad type Description PCM_OUT 25 Output, weak internal pull-down PCM_IN 20 Input, weak internal pull-down Synchronous data input PCM_SYNC 22 Bi-directional, weak internal pull-down Synchronous data sync PCM_CLK 21 Bi-directional, weak internal pull-down Synchronous data clock Synchronous data output Table 4: PCM Terminal Descriptions UART signal Pad number Pad type Description UART_TX 42 Output, pull-up weak internal UART data output, active high UART_RTS# 14 Output, pull-up weak internal UART request to send, active low UART_RX 15 Input, weak internal pulldown UART data input, active high UART_CTS# 19 Input, weak internal pulldown UART clear active low to send, Table 5: UART Terminal Descriptions USB signal Pad number Pad type Description USB+ 17 Bidirectional USB data line with internal 1.5kohm pull-up USB- 18 Bidirectional USB data line Table 6: USB Terminal Descriptions Silicon Laboratories Finland Oy Page 9 of 44 SPI signal Pad number Pad type SPI_MOSI 40 Input, weak internal pull-down SPI_CS# 37 Input, weak internal pull-up SPI_CLK 38 Input, weak internal pull-down SPI_MISO 39 Output, weak internal pull-down Description SPI data input Chip select, active low SPI clock SPI data output Table 7: Terminal Descriptions Silicon Laboratories Finland Oy Page 10 of 44 3 Electrical Characteristics 3.1 Absolute Maximum Ratings Specification Min Max Unit Storage temperature -40 85 °C VDD_PA, VDD -0.4 3.7 V VSS-0.4 VDD+0.4 V Specification Min Max Unit Operating temperature -40 85 °C VDD_PA, VDD 3.0 3.6 V Other terminal voltages Table 8: Absolute Maximum Ratings 3.2 Recommended Operating Conditions Table 9: Recommended Operating Conditions Silicon Laboratories Finland Oy Page 11 of 44 3.3 Input / Output Terminal Characteristics 3.3.1 Input/Output Terminal Characteristics (Digital) Digital Terminals Min Typ Max Unit 2.7 V ≤ VDD ≤ 3.0 V -0.4 - 0.8 V 1.7 V ≤ VDD ≤ 1.9 V -0.4 - 0.4 V 0.7 VDD - VDD + 0.4 V - - 0.2 V - - 0.4 V VOL output logic level high (IO = 4.0 mA) 2.7V ≤ VDD ≤ 3.0 VDD - 0.2 - V VOL output logic level high (IO = 4.0 mA) 1.7V ≤ VDD ≤ 1.9 VDD - 0.4 - V -100 -40 -10 µA 10 40 100 µA Weak pull-up -5.0 -1.0 -0.2 µA Weak pull-down 0.2 1.0 5.0 µA I/O pad leakage current -1 0 1 µA CI input capacitance 1.0 - 5.0 pF Input Voltage Levels VIL input logic level low VIH input logic level high Output Voltage Levels VOL output logic level low (IO = 4.0 mA) 2.7V ≤ VDD ≤ 3.0 V VOL output logic level low (IO = 4.0 mA) 1.7V ≤ VDD ≤ 1.9 Input and Tristate Current with Strong pull-up Strong pull-down Silicon Laboratories Finland Oy Page 12 of 44 3.3.2 Input/Output Terminal Characteristics (USB) USB Terminals Min VDD_USB for correct USB operation 3.1 Typ Max Unit 3.6 V Input Threshold VIL input logic level log VIH input logic level high - - 0.3VDD_USB V 0.7VDD_USB - - V 3.4 PIO Current Sink and Source Capability Figure 2: WT41u PIO Current Drive Capability Silicon Laboratories Finland Oy Page 13 of 44 3.5 Transmitter Performance For BDR RF characteristic Min Typ Max Bluetooth specification Unit Max transmit power 16 17 18
WT41U-A-AI55 价格&库存

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