2SB083060ML
2SB083060ML SCHOTTKY BARRIER DIODE CHIPS
DESCRIPTION
Ø Ø Ø Ø Ø Ø 2SB083060ML is a schottky barrier diode chips
Lb
Low power losses, high efficiency; Guard ring construction for transient protection; High ESD capability; High surge capability; Packaged products are widely used in switching power suppliers, polarity protection circuits and other electronic circuits.;
Chip Topography and Dimensions La: Chip Size: 830µm; Lb: Pad Size: 670µm;
Ø
Chip Size:830µm X 830µm; Chip Thickness: 280±20µm;
Ø
ORDERING SPECIFICATIONS
Product Name 2SB083060MLYY Specification For axial leads package
ABSOLUTE MAXIMUM RATINGS
Parameters Maximum Repetitive Peak Reverse Voltage Average Forward Rectified Current Peak Forward Surge Current@8.3ms Maximum Operation Junction Temperature Storage Temperature Range Symbol VRRM IFAV IFSM TJ TSTG Ratings 60 1 30 125 -40~125 Unit V A A °C °C
ELECTRICAL CHARACTERISTICS (Tamb=25°C)
Parameters Reverse Voltage Forward Voltage Reverse Current Symbol VBR VF IR Test Conditions IR=1mA IF=1A VR=60V Min. 60 --Max. -0.70 1 Unit V V mA
HANGZHOU SILAN MICROELECTRONICS CO.,LTD
Http: www.silan.com.cn
REV:1.0
2007.04.27 Page 1 of 1
La
fabricated in silicon epitaxial planar technology;
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