SC51D01Fxx
REMOTE CONTROL WITH BUILT-IN FLASH AND CODE SAMPLING FUNCTION
DESCRIPTIONS
SC51D01Fxx series is mainly used in remote controls with learning function. It is based on Silan’s S51 8-bit MCU compliance with standard MCS-51 instructions and has built-in large FLASH program memory, infrared signal amplifier, and code sampling/transmitting modules. Under the support of few periphery components, these ICs can be easily used to make a remote control with on-chip self-learning function, which will enable one remote control to control all the devices related to TV sets.
FEATURES
* Compliance with standard MCS-51 instructions. * Built-in 16K/32K/64K bytes FLASH program memory(can also used as data memory). * Built-in 4K bytes XRAM. * Integrate infrared signal amplifier. * Integrate code sampling circuit which support code sampling with carrier, and has 256 bytes receive buffer. * Integrate code transmitting circuit whose carrier frequency and duty can be set flexibly and has 32 bytes send buffer. * 8 keyboard input pins. * Support in system program (ISP). * Adopt CMOS technology, operating voltage is 2.2V-3.6V, and quiescent current is less than 1μA.
APPLICATIONS
* Remote control with learning function * Preset universal remote control
ORDERING INFORMATION
Device SC51D01F16A SC51D01F32A SC51D01F64A SC51D01F16B SC51D01F32B SC51D01F64B General I/O ports 10 10 10 13 13 13 On-chip FLASH (Bytes) 16K 32K 64K 16K 32K 64K Package SOP28-375-1.27 SOP28-375-1.27 SOP28-375-1.27 SOP32-375-1.27 SOP32-375-1.27 SOP32-375-1.27
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SC51D01Fxx
BLOCK DIAGRAM
Note: The blue mark in the diagram is powered directly by VDD.
ABSOLUTE MAXIMUM RATING
Characteristics Power Supply Port Tolerance Voltage Storage Temperature Operating Temperature Symbol VDD VIN TSTG TOPR Ratings -0.3 ~ +4.0 -0.3 ~ VDD+0.3 -65 ~ +150 -40 ~ +85 Unit V V °C °C
ELECTRICAL CHARACTERISTICS(Unless otherwise specified,VDD=3V,Tamb=25°C)
Characteristics Operating Voltage Operating Current Quiescent Current Operating Clock High Input Voltage Low Input Voltage High Output Voltage Low Output Voltage High Output Current Low Output Current Port Pull-Up Resistor FLASH Erase/Write Life Symbol VDD IDD Iq fosc VIH VIL VOH VOL IOH IOL Rpu --VDD=3V;No load code transmitting Core power is off VDD=3V --No load No load VDD=3V;VOH=2.7V VDD=3V;VOL=0.3V --Test conditions Min. 2.2 --12 0.7VDD 0 0.9VDD ----20K Typ. -12 -12 ----3 4 50 100K Max. 3.6 -1 12 VDD 0.3VDD -0.1VDD ----Unit V mA μA MHz V V V V mA mA kΩ Time
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SC51D01Fxx
PIN CONFIGURATION
SC51D01FxxA
SC51D01FxxB
PIN DESCRIPTIONS
Pin No. Pin Name VDD VDDCORE GND XIN XOUT nRST CYOUT CYIN KI0~KI7 SDA / PT10 PT11~PT17 PT30 nPROG / PT40 SCL / PT41 PT42~PT43 SC51D01F SC51D01F xxA 5,7,9 3 6 10 11 8 2 4 21~14 22 23~28,1 12 13 xxB 2,6,8,10 4 7 11 12 9 3 5 24~17 25 26~32 1 13 14 15~16 PWR Power supply. PWR Core power output(Connect 1~10μF capacitor to the ground). PWR Ground. I O I O I I I/O I/O I/O I/O I/O I/O External oscillator input (Connect 1MΩ resistor between XIN and XOUT). External oscillator output. External reset pin (low active). Infrared signal control output. Infrared signal input. Keyboard input. I/O pin (also used as FLASH program data port). I/O pin. I/O pin. I/O pin(also used as FLASH program ‘enable’ singal, low active). I/O pin(also used as FLASH program ‘clock’ signal input). I/O pin. I/O Function Descriptions
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SC51D01Fxx
FUNCTION DESCRIPTIONS Summary Table Of Registers
Name S51 MCU ACC B PSW SP DPH DPL TCON IE IP AUXR1 CS_IntDM_ CTRL ModeCtrl Accumulator B register Program status word Stack pointer High byte of data pointer Low byte of data pointer Timer control register Interrupt enable control register Interrupt PRI control register DPTR selection register Internal extended RAM selection control register Working mode control register Low voltage detect control/status register WDT prescaler setting register Watchdog clear register 0 Watchdog clear register1 Keyboard input register PT1 register Description PT1 output mode control register PT1 internal weak pull-up control register PT1 open-drain output register PT3 register PT3 output mode control register PT3 internal weak pull-up control register √ √ √ × × × √ √ √ × × × R/W R/W R/W R/W R/W R/W R/W R/W R/W W W W 00H 00H 00H 07H 00H 00H 00H 00H 00H 00H 96H 03H E0H F0H D0H 81H 83H 82H 88H A8H B8H A2H 9EH 94H Description Bit Read/write Reset value Byte address accessable permission
Low voltage detecting LVDCtrl Watchdog timer Wdt_Ctrl Wdt_Clr0 Wdt_Clr1 Keybord input ports KEYIN PT1Reg Name PT1Ctrl PT1PUCtrl PT1ODCtrl PT3Reg PT3Ctrl PT3PUCtrl × × Bit accessable × × × × × × R R/W Read/write permission R/W R/W R/W R/W R/W R/W -FFH Reset value 00H 00H FFH FFH 00H 00H F7H F8H Byte address F9H FAH FBH E1H E2H E3H
(To be continued)
×
R/W
XXX10001B
97H
× × ×
R/W W W
XXXXXX00B ---
F3H F4H F5H
General purpose I/O
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SC51D01Fxx
(Continued)
Name PT3ODCtrl PT4Reg PT4Ctrl PT4PUCtrl PT4ODCtrl Timer TH0 TL0 TH1 TL1 TIMER_PRESCAL ER TMOD CARCount
Description PT3 open-drain ouitput register PT4 register PT4 output mode control register PT4 internal weak pull-up control register PT4 open-drain output register High byte of timer 0 Low byte of timer 0 High byte of timer 1 Low byte of timer 1 Timer prescaler control register Timer working mode control register Carrier period register
Bit × × × × × × × × × × × ×
Read/write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R
Reset value FFH FFH 00H 00H FFH 00H 00H 00H 00H X111X111B 00H 00H
Byte address E4H E5H E6H E7H E8H 8CH 8AH 8DH 8BH 8EH 89H C1H
accessable permission
Code sampling module
ADDRESS SPACE ASSIGNMENT
Internal Data Space Fig. 1 shows that the internal data space of SC51D01Fxx series is divided into direct addressing space and indirect addressing space.
Fig. 1 – Internal data space assignment
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Direct addressing space includes 128 bytes RAM and special function register area (SFR). 00H~1FH of direct addressing 128 bytes RAM are working register area(including four groups of user RAM area, the details refer to Fig. 2. The address range of SFR is 80H~FFH, including the special function registers of MCU and peripheral equipment. Indirect addressing space includes two extended RAM: the extended RAM1 is 128 bytes, and the address range is 80H~FFH; the extended RAM2 is 64 bytes, and the address range is C0H~FFH. Access only one extended RAM at the same time: set the value of special function register CS_IntDM_CTRL as 96H, then it can access extended RAM1; Set CS_IntDM_CTRL as 69H, then it can access extended RAM2. The difference between two extended RAM is different power supply. Extended RAM1 and S51 core share the same power supply, when enter the standby mode, the core power is off, so the data in extended RAM1 can not be held. The extended RAM2 is powered directly by VDD, so the data can be reserved in standby mode. Attention should be paid that, because two extended RAM share the address space of C0H~FFH, the stack is better to set within 08H~BFH. working registers),20H~2FH are bit addressing area(Corresponding address range is 00H~7FH),The 30H~7FH are
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Bit Byte address 7FH … 30H 2FH 2EH 2DH 2CH 2BH Bit addressing space General registers 2AH 29H 28H 27H 26H 25H 24H 23H 22H 21H 20H 1FH … 18H 17H … 10H 0FH … 08H 07H … 00H 7FH 77H 6FH 67H 5FH 57H 4FH 47H 3FH 37H 2FH 27H 1FH 17H 0FH 07H 7EH 76H 6EH 66H 5EH 56H 4EH 46H 3EH 36H 2EH 26H 1EH 16H 0EH 06H 7DH 75H 6DH 65H 5DH 55H 4DH 45H 3DH 35H 2DH 25H 1DH 15H 0DH 05H User RAM Bit7 Bit6 Bit5
Bit address Bit4 Bit3 Bit2 Bit1 Bit0
(Only byte addressing, can used as stack and data buffer)
7CH 74H 6CH 64H 5CH 54H 4CH 44H 3CH 34H 2CH 24H 1CH 14H 0CH 04H …
7BH 73H 6BH 63H 5BH 53H 4BH 43H 3BH 33H 2BH 23H 1BH 13H 0BH 03H
7AH 72H 6AH 62H 5AH 52H 4AH 42H 3AH 32H 2AH 22H 1AH 12H 0AH 02H
79H 71H 69H 61H 59H 51H 49H 41H 39H 31H 29H 21H 19H 11H 09H 01H
78H 70H 68H 60H 58H 50H 48H 40H 38H 30H 28H 20H 18H 10H 08H 00H
R7 of the third group working register R0 of the third group working register R7 of the second group working register … R0 of the second group working register R7 of the first group working register … R0 of the first group working register R7 of the zero group working register … R0 of the zero group working register Fig. 2 –128 bytes RAM of direct addressing
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SC51D01Fxx
Program and External Data Space SC51D01Fxx series support maximum 64K bytes program and external data space. The program memory and external data memory of SC51D01Fxx series are all embedded without extended. The space assignment refers to Fig. 3. Program memory includes 4K bytes ROM(address range: 0000H~0FFFH) and maximum 60K bytes FLASH(address range: 1000H~FFFFH). By calling the system function in ROM, FLASH can be erased/written. External data space includes 4K bytes XRAM. Special attention should be pait that: 0100H~01EDH of XRAM has been occupied by the system, and can not be changed by user; 0D00H~0DFFH is receiving buffer of code sampling module(Code sampling buffer for short).
Fig. 3 – Program and external data space
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SC51D01Fxx
S51 MCU
SC51D01Fxx series use S51 MCU compatible with MCS-51 instructions. Users can develop the software using standard 805x assembler and compiler. The difference between S51 MCU and standard 8051 lies in: S51 MCU supports dual DPTR. In the condition of the same external oscillator frequency, the instruction period of S51 MCU is shorter than that of 8051. S51 MCU supports two extended RAM. S51 MCU’s MOVX A,@Ri and MOVX @Ri, A commands can only access 00H~FFH of on-chip XRAM. S51 MCU only supports 2 interrupt sources: the overflow interrupt of timer 0 and timer 1. The interrupt vector is different from that of standard 8051. S51 MCU only supports 2 working modes: normal working and standby modes. The working mode control is also different from that of standard 8051.
RESET
SC51D01Fxx series has external reset, keying reset, power down reset and watchdog reset 4 reset sources. Where, the external reset, keying reset and power down reset can make the chip awake from standby mode. External rset External reset is adding a no less than 10ms low level on pin nRST to make MCU reset. Connect tandem resistor and capacitor to pin nRST to implement the power on reset of MCU, shown in Fig. 4:
Fig. 4– External reset and power on reset circuit Keying reset Keying reset means that when MCU is in standby mode, apply effective time of low level to any one or more keyboard input ports among KI0~KI7 to make MCU reset. This is often used to awake the MCU by keying. In normal working mode, applying low level to KI0~KI7 will not make the MCU reset. Power down reset When power down or VDD is dropped to less than 1.85V caused by power fluctuation, the low voltage detector (LVD) will generate a reset signal to make MCU reset.If VDD returns to more than 1.95V, MCU will exit the reset state, and enter normal working state. Watchdog reset The watchdog reset make MCU reset when the internal 20-bit counter (watchdog timer WDT) overflows. The
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SC51D01Fxx
program should always clear the WDT to avoid that WDT overflows. When the program enters dead loop, maybe WDT is not clear in time. WDT will overflow to make MCU reset to avoid the system is in abnormal state for a long time.
OSCILLATION CIRCUIT
SC51D01Fxx series contain an inverting amplifier with high gain. The amplifier’s input is XIN, output is XOUT. A quartz crystal, a feedback resistor, and two capacitors are connected between XIN and XOUT to form a stable selfoscillator, shown in Fig. 5. The waveform generated by the oscillation circuit produced the system clock MClk which provides clock to S51 MCU and some periphery modules after it is shaped by the inverter.
Fig. 5 – Oscillation circuit Where: Rf is the feedback resistor, 1MΩ. Rd is the dirve resistor , 300~600Ω C1 and C2 are load capacitors, capacitance is the same and the range is 10pF~30pF. XTAL is crystal oscillator, and the fixed frequency is 12MHz.
PERIPHERY MODULES
Keyboard Input Ports [Brief] SC51D01Fxx series has 8 input ports KI0~KI7 used to connect with the keyboard. Every port has pull-up resistor and Schmitt trigger. [Structure Diagram]
Figure 6 – Keyboard input structure
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[Function Description] In standby mode, low level applied to any keyboard input port will make the chip reset and enter the normal working mode; however, in normal working mode, input low level will not reset the chip. General Purpose I/O Ports [Brief] SC51D01FxxA has PT1 and PT4 two groups of 10 general purpose I/O ports (GPIO); SC51D01FxxB has PT1, PT3 and PT4 three groups of 14 GPIO. The structure and the manipulation of SC51D01Fxx series’ GPIO are different from those of standard 8051. [Structure Diagram]
Fig. 7– PT1 structure Note: The structure of PT3 and PT4 is the same as that of PT1. [Function Description] Related with Fig. , the following takes PT1 for example to introduce the function of general purpose I/O ports. The function of PT3 and PT4 is the same as that of PT1. Configure the output mode of GPIO pins The output mode of every GPIO pin can be configured as open-drain or pull-push mode, default is opendrain. When PT1Ctrl[n]=0, no matter PT1Reg[n] output 1 or 0,P1 and N1 misfits are both off, and the output mode corresponding to PT1n pin is open-drain; when PT1Ctrl[n]=1, the off/on of P1 and N1 is decided by the output status of PT1Reg[n], and the output mode corresponding to PT1n pin is pull-push. In pull-push mode, PT1Reg[n]=0 will turn P1 off, N1 on, and PT1n pin will connect to GND; PT1Reg[n]=1 will turn P1 on, N1 off, and PT1n pin will connect to VDD. In open-drain mode, PTODCtrl[n]=0 of open-drain output register will turn N2 on, PT1n pin will connect to GND;PTODCtrl[n]=1 will turn N2 off, PT1n pin is in high impedance. When the application system needs many output ports connected to one physical wire (e.g. the scanning output wire of keyboard), those ports must be in open-drain mode! In open-drain mode, the port needs to connect pull-up resistor to VDD or using internal pull-up resistor(PT1PUCtrl[n]=0,P2 is on, PT1n is pulled-up to VDD via Rpu).
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SC51D01Fxx
Configure GPIO pin as input ports Set the port output mode to open-drain mode(P1 and N1 are both off), and write 1 to the corresponding bits of open-drain output register PT1ODCtrl to make N2 off, after that this port is configured as input port. For example, set PT1Ctrl[7] =0, PT1ODCtrl[7] =1 to configure PT17 as input port. Configrue ports’ weak pull-up Every GPIO pin of SC51D01Fxx series has an internal weak pull-up(about 50 kΩ). Set PT1PUCtrl[n]=1 to make P2 off, and the weak pull-up is disabled; set PT1PUCtrl[n]=0 to make P2 on, and the weak pull-up is enable. Timer [Brief] SC51D01Fxx contains two timers(timer 0 and timer 1),which only have timing function but not external counting function. Its timing function is compatible with standard 8051, the difference is that the timer of SC51D01Fxx should be turned off when loading the initial value every time, open the timer after that. Timer 0 and timer 1 are almost the same, which both have four working modes(where, timer 1 cannot work in mode 3). [Function Description] Timer 0 and timer 1 are both 16-bit registers, presented in two bytes when they are accessed. The low byte of timer 0 is TL0, the high byte is TH0;the low byte of timer 1 is TL1, the high byte is TH1. Timer 0 and timer 1 have independent clock sources which are derived from the frequency dividing of the system clock by setting timer clock prescaler control register TIMER_PRESCALER. Timer control register TCON is used to enable timer 0 and timer 1 and show their status. Set ET0 of the IE register to enable the timer 0 interrupt, and set ET1 to enable the timer 1 interrupt. You can select the two timers’ working mode by setting the mode selection bits T0M1 and T0M0(or T1M1 and T1M0) of TMOD register, each bit can be configured independently. Next we will take timer 0 for example to introduce these four working modes. FLASH Memory [Brief] SC51D01Fxx series has 16/32/64K bytes FLASH memory used to store the program code and nonvolatile data. You can manipulate the erase/write operation to FLASH memory by system function, one byte or one block (512 bytes) each time. Once write ‘0’ to a FLASH bit, it returns ‘1’ until it is erased. In general, data bytes should be erased (set as FFH) before reprogramming. The erase manipulation to FLASH of SC51D01Fxx series can only adopt block as unit, the mapping of each block is shown in Fig.8.
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SC51D01Fxx
SC51D01F64 FFFFH FE00H FDFFH FC00H FBFFH
SC51D01F32
SC51D01F16
Block 512 Bytes Block 512 Bytes
Block 512 Bytes Block 512 Bytes
Block 512 Bytes Block 512 Bytes
FFFFH FE00H FDFFH FC00H FBFFH
Block 512 Bytes Block 512 Bytes
C400H C3FFH C200H C1FFH C000H
Block 512 Bytes Block 512 Bytes
8400H 83FFH 8200H 81FFH 8000H
1400H 13FFH 1200H 11FFH 1000H
Block 512 Bytes Block 512 Bytes
1400H 13FFH 1200H 11FFH 1000H
Fig. 8– Mapping address of FLASH blocks FLASH erase/write operation is manipulated by calling system function. The system function is pre-stored in the ROM of 0000H~0FFFH. In order to make sure the correct of FLASH’s content, we recommend user to check 2.2V low voltage detecting flag LVDCtrl[2] before manipulate write or erase operation to FLASH. If LVDCtrl[2]=1, it means that VDD is lower than 2.2V, you’d better not manipulate write or erase operation. XRAM SC51D01Fxx series integrates 4K bytes RAM as external data memory XRAM, the address space is 0000H~0FFFH. XRAM can be accessed by external movement instructions “MOVX A, @DPTR”.“MOVX @DPTR, A”.“MOVX A, @Ri” and “MOVX @Ri, A” . If using the latter two instructions, only can access the address space 0000H~00FFH. Special attention should be paid that: 0100H~01EDH of XRAM is occupied by the system, can not be changed by the system; 0D00H~0DFFH is receiving buffer of code sampling module(code sampling buffer for short). Code Sampling Module [Brief] Code sampling module is used to collect the infrared signal from other remote control which can implement the self-learning function. When select inner infrared amplifier function, you only connect an infrared receiving diode and 1nF capacitor between CYIN pin and GND(refer to typical application circuit) to realize the sampling of the infrared signal.
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[Structure Diagram]
Fig. 9– The structure diagram of code sampling module [Function Description] The code sampling module of SC51D01Fxx series can realize the code sampling with carrier. It can recognize if the received wave has the carrier by setting detecting register CheckCount, and the carrier information is stored in carrier period register CARCount(For the wave without carrier, the value of CARCount is 0). This module can also automatically save the envelope information filtered carrier in the code sampling buffer (0D00H~0DFFH of XRAM). The code sampling buffer is a 128 levels rotate queue and each level is two bytes (even address is the high 8-bit of the envelope data, odd address is the low 8bit). The envelope data pointer points at the high byte of the lately sampled data. Add 2 to the pointer every time sampled an envelope data, when the pointer is 0DFEH, it will return to 0D00H after sampled a data again. Wave sampling circuit includes a detecting counter (counting clock is the code sampling clock SClk). When the wave sampling circuit is enable, the detecting counter counts the time interval and low level width of adjoin two rising edges. As shown in Fig.10, T1 is the time interval between the first rising edge and the second rising edge, and T2 is the first low level width. If T2 is more than the detecting time, no carrier is considered, and CARCount=0; if T1 is less than the detecting time, carrier is considered, and CARCount=T3(T3 is the time interval between the third rising edge and the fourth rising edge).
Fig. 10– Detecting principle
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Wave sampling circuit has one 15-bit envelope counter (counting clock is the code sampling clock SClk). When the wave sampling circuit is enable and detect the first rising edge, the envelope counter begins to count until the low level time is over the detecting time, then store the envelope type(the most significant bit of 16-bit envelope data, 1:high level; 0:low level) and counting value(low 15-bit of envelope data) in the code sampling buffer, after that, the envelope counter restarts to count. As shown in Fig.11(a), T4 is the envelope high level width stored in the buffer, T5 is the low level width stored in the buffer, T6 is the detecting time. That is, the data stored in the code sampling buffer needs to be compensated to be the real envelope level width. Of course, if T4 or T5 beyond the range of 15 binary bits, it will be divided into many segments to be stored in the buffer, as shown in Fig.11(b).
(a)
(b) Fig. 11– Envelope sampling principle The compensation arithmetic of envelope high level width is: total width of successive high levels T4 – detecting time T6; the compensation arithmetic of envelope low level width is: total width of successive high levels T5 + detecting time T6. Code Transmitting Module [Brief] The code transmitting module is used to generate the high and low levels which control the infrared diode. It contains carrier generator and 32 bytes code transmitting buffer, which can transmit the code accurately.
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SC51D01Fxx
[Structure Diagram]
Fig. 12– The structure diagram of code transmitting module [Function Description] The transmitting module of SC51D01Fxx series defines an universal wave format (as shown in Fig.13), code transmitting should abide by this format.
0
1
Fig. 13– Code transmitting format The counting clock of carrier generator comes from the system clock MClk, and generated carrier shown in Fig.14. Where, H, L1 and L2 are separately from the three characteristics CARRIERH, CARRIERL1 and CARRIERL2 set by the user. In general, L1 is only 1 MClk clock different from L2, thus the average period of carrier is more accurate.
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Fig. 14– Carrier generator principle The code transmitting of SC51D01Fxx series supports two modes: 8-bit mode, 16-bit mode. The code transmitting principle of 8-bit mode is shown in Fig.15. The system clock MClk generated TClk (the period is T) via code transmitting reference clock generator. TClk produces high level Base unit (Base 1) time TH and low level Base unit (Base 0) time TL via Base 0/1 generator. TH and TL are decided by setting BASETIMEH and BASETIMEL, and unit T. TH is the Base unit time of high level envelope time, and TL is the Base unit time of low level envelope time.
Fig. 15– 8-bit code transmitting principle 16-bit code transmitting principle is shown in Fig.16. System clock MClk generates TClk (the period is T). T is the Base unit of high and low level envelope time.
Fig. 16– 16-bit code transmitting principle
FLASH PROGRAM INTERFACE
SC51D01Fxx series support in system program (ISP), but you should use Silan’s special programmer. Usually the programmer connects with 6 pins, as shown in Table. FLASH program interface Name nRST nPROG SCL SDA VDD GND Pin No. SC51D01FxxA 8 12 13 22 5(7,9) 6 SC51D01FxxB 9 13 14 25 6(2,8,10) 7 Function Chip reset signal Mode selection signal Program clock signal Program data signal Power supply Ground
nPROG is selection signal of the chip’s boot mode. When the chip is power on or reset , check nPROG pin first, if nPROG pin is low level, enter Flash program mode; if nPROG pin is high level, enter normal working mode. After enter Flash program mode or normal working mode, the nPROG pin’s level is not considered.
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SC51D01Fxx
TYPICAL APPLICATION CIRCUIT
K70 2 2K 10µ PD 1n K60 K71 K61 K51 K41 K31 K21 K11 K01 K72 K62 K52 K42 K32 K22 K12 K02 K73 K63 K53 K43 K33 K23 K13 K03 K74 K64 K54 K44 K34 K24 K14 K04 K75 K65 K55 K45 K35 K25 K15 K05 K76 K66 K56 K46 K36 K26 K16 K06 K77 K67 K57 K47 K37 K27 K17 K07
IRD
1 PT17 2 CYOUT 3 VDDCORE 4 CYIN 5 VDD
PT16 28 PT15 27 PT14 26 PT13 25 PT12 24
K50 K40 K30 K20 K10 K00
SC51D01FxxA
6 GND
3V 10µ 1µ 15p 1M 510 VDD 470 LED VDD 15K
PT11 23
SDA/PT10 22
7 VDD 8 nRST 9 VDD 10 XIN 11 XOUT
KI0 21 KI1 20 KI2 19 KI3 18 KI4 17 KI5 16 KI6 15
12M 15p
12 nPROG / PT40 13 SCL / PT41 14 KI7
nRST 1 SCL 3 GND 5
2 4 6
nPROG SDA VDD
VDD
ISP PORT
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SC51D01Fxx
PACKAGE OUTLINE
SOP-28-375-1.27 Unit: mm
SOP-32-375-1.27
Unit: mm
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ATTACH
System Function Table Periphery module FLASH memory Entry address 002EH 0034H 003AH 0049H Code sampling module 0040H 0046H 0043H 004CH 004FH 0052H Code transmitting modlue 0055H 0058H 005BH 005EH 0061H Block erase Single byte write Block write Set infrared receiving mode Initialize the wave sampling circuit On-off wave sampling circuit Capture envelope data pointer Set carrier parameter Set scaler coeffiecent and base unit time Initialize frame interval timer Set frame interval time 8-bit code transmitting 16-bit code transmitting Wait for the data in the buffer completing Close frame interval timer Function description
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HANDLING MOS DEVICES:
Electrostatic charges can exist in many things. All of our MOS devices are internally protected against electrostatic discharge but they can be damaged if the following precautions are not taken: • Persons at a work bench should be earthed via a wrist strap. • Equipment cases should be earthed. • All tools used during assembly, including soldering tools and solder baths, must be earthed. • MOS devices should be packed for dispatch in antistatic/conductive containers.
Note:Silan reserves the right to make changes without notice in this specification for the improvement of the design and performance. Silan will supply the best possible product for customers
HANGZHOU MICROELECTRONICS CO.,LTD
Http:// www.silan.com.cn
REV:1.0
2007.12.03 Page 21 of 21