SC91710B

SC91710A/B T/P SWITCHABLE DIALER WITH REDIAL HANDFREE FUNCTION DESCRIPTION The SC91710A/B are Tone/Pulse switchable dialer which are fabricated in COMS technology with wide operating voltage for both tone and pulse mode, and consumes very low memory retention current in ON-HOOK state. FEATURES * Tone/Pulse switchable dialer * One 32-digit last number redial memory * Pulse-to-tone (P→T) is provided for PBX operation * Flash key is available * Minimum tone duration is 98ms or 83ms * Minimum intertone pause is 98ms or 83ms * Redial Pause time (0ms) * Uses 3.579549MHz crystal or ceramic resonator * Many options can be selected Mode (10PPS; 20PPS; Tone) M/B ratio (40:60;33:66) Pause time (3.6s) * Flash function (RESET) (P→T) pause time (3.6s) Flash time (600ms; 300ms; 100ms; or 80ms) * Power on reset circuit is provided * Handfree function is provided for speaker phone application * Packaged in 16-DIP or 18-DIP ORDERING INFORMATION Device SC91710A Package DIP-16-300-2.54 SC91710AS SOP-16-225-1.27 SC91710B DIP-18-300-2.54 HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 1 of 18 SC91710A/B BLOCK DIAGRAM Kernel Control CKT. KEYBOARD ASSIGNMENT C1 R1 R2 R3 R4 1 4 7 * C2 2 5 8 0 C3 3 6 9 # C4 P→T F P RD 1) P→T: In pulse mode, execute P→T function. 2) P: Pause key. 3) F: Flash key 4) RD: Redial key DIALING SIGNAL OPTION A: Flash time Row3 Row4 B: Flash time(ms) 600 300 100 80 Row1 Row2 LNB memory MODE TONE TONE PULSE PULSE PULSE PULSE PULSE RATE --20PPS 20PPS 10PPS 10PPS M/B --40:60 33:66 40:60 33:66 NR NR R R NR R NR R R R NR NR UR UR NR R NR R NR R C: Tone function Col1 Tone Duration 98ms 83ms Inter-Tone Pause 98ms 83ms NR R Note: NR: no resistance R: A resistance connect to VSS (820kΩ typically) UR: A resistance connect to VDD HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 2 of 18 SC91710A/B ABSOLUTE MAXIMUM RATING(Tamb=25°C, All voltage referenced to VSS, unless otherwise specified) Characteristics Power Supply Voltage Input Voltage Power Dissipation Operating Temperature Storage Temperature Symbol VDD VIN PD Topr Tstg Ratings 6.0 -0.3~VDD+0.3 500 -25~+70 -55~+150 Unit V V mW °C °C ELECTRICAL CHARACTERISTICS(Tamb=25°C, VDD=2.5V, fosc=3.579545MHz, unless otherwise specified) Characteristics DC Characteristics Tone Operating Voltage VDD Pulse Memory retention Operating Current Standby Current Memory Retention Current Control Pin Input Low Voltage Control Pin Input High Voltage XMUTE Pin Leakage Current Symbol Conditions Min. 2.5 2.0 1.0 ----VSS 0.7VDD -0.2 -4 200 --0.5 0.5 0.1 0.5 ----- Typ. --0.6 0.2 0.1 0.1 Max. 5.5 5.5 5.5 2 0.5 1 0.2 0.3VDD VDD Unit V IOP IS Imr Vil Vih Imth Imtl Ihks Ikbd Ikbs tDB Rhfi Ihdoh Ihdol Ipoh Ipol fpr tM tB Tone Pulse entry OFF-HOOK, Keypad entry mA µA µA V µA mA µA µA ms kΩ mA mA µA mA pps % ms ON-HOOK No keypad ON-HOOK VDD=1.0V --V XMUTE =6.0V V XMUTE =0.5V Vhks=2.5V Vn=0V note1 Vn=2.5 note1 -VDD=2.5 Vhfo=2.0V Vhfo=2.5V Vpo=2.5V Vpo=0.5V -0.5 -10 400 20 200 ----10 20 40:60 33:66 40 33 1 -0.1 30 800 ------------- XMUTE Pin Sink Current HKS Pin Input Current Keyboard Scanning Pin Drive Current Sink Current Key-in Debounce Time HFI pin input resistor HFO pin drive current HFO pin sink current Pulse Mode Pulse Output Pin Leakage Current Pulse Output Pin Sink Current Pulse Rate Make/Break Ratio Pre-digit Pause tPDP M/B ratio=40:60 M/B ratio=33:66 --- (To be continued) HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 3 of 18 SC91710A/B (Continued) Characteristics Inter-digit Pause Tone Mode DC Level Tone Sink Current Load Resistor DTMF Signal Pre-emphasis Distortion(note 2) Output Pin AC level Symbol tIDP Conditions Pulse rate=10pps Pulse rate=20pps VDD=2.0V~5.5V Vdtmf=0.5V Row group RL=10KΩ Dist.≤ -23dB VDD=2.0~5.5 V, Column-Row group RL=10KΩ Auto redial Auto redial Min. --0.5VDD 0.2 130 10 1 ---- Typ. 800 500 --155 -2 -30 98/83 98/83 Max. --0.7VDD -170 -3 -23 --- Unit ms Vdc Itl Vdtmf RI twist Dist. tTD tITP V mA mVrms KΩ dB dB ms ms Minimum tone duration Time Minimum Intertone Pause Time Note: 1. Vn: Input voltage of any keyboard scanning pin (Row group, Column group) 2 Distortion (dB) = 20log{[V12+V22+V32+… Vn2)1/2]/[(VL2+VH2)1/2]} VL,VH: Row group and Column group signal , V1 V2… Vn: Harmonic signal (BW = 300Hz~3500Hz) ACTUAL FREQUENCY OUTPUT (fosc=3.579545MHz) Keyboard Scanning Pin R1 R2 R3 R4 C1 C2 C3 f1 f2 f3 f4 f5 f6 f7 Standard(Hz) 697 770 852 941 1209 1336 1477 Output 699 766 848 948 1216 1332 1472 Deviation(%) +0.28 -0.52 -0.47 +0.74 +0.57 -0.30 -0.34 PIN CONFIGURATION HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 4 of 18 SC91710A/B PIN DESCRIPTION Pin No. SC91710A/AS 4 SC91710B 4 Pin Name Description * Provides keyboard scanning. C1 HIGH”state and * HKS pin is LOW, the column group stays in “ row group stays in “ LOW”state. * The keypad is compatible with the standard dual contact matrix 1 1 C2 keyboard (as figure1b), the inexpensive single contact keyboard (as figure 1a), and electronic input (as figure 1c). * When HKS is “ LOW” a valid key entry is defined by related Row , & Column connection or by electronic input (as shown in figure 1c). * Activation of two or more keys will result in no response, except for single key. * To avoid keyboard-bouncing error, this chip provides built-in 2 2 C3 3 3 C4 14 16 R1 debounce circuit. (The debounce time = 20ms) Row Column Row Column Figure1a: Single contact form keyboard configuration Figure1b: Dual contact form keyboard configuration VDD VSS Column VDD VSS Figure1c: Electronic signal input keyboard configuration 15 17 R2 16 18 R3 Row 13 15 R4 * Oscillator input & output pins. 5 5 OSCI * The 3.579545MHz oscillator is formed by a built-in inverter inside of this chip and by connecting a 3.579545MHz crystal or a ceramic resonator across the OSCI and OSCO pins. (built-in 6 6 OSCO feedback resistor and capacitor) * When HKS is “ LOW” a valid key-in may turn on this oscillator , and generates a 3.579545 MHz clock. * Mute output pins. * NMOS open drain output structure. 7 7 XMUTE * The output is in “ LOW”state during dialing sequence (both Pulse and Tone mode) otherwise this pin is “ high-impedance” . * Long (continue) Mute. 8 9 8 11 VSS VDD * Negative power supply pin. * Positive power supply pin. (To be continued) HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 5 of 18 SC91710A/B (Continued) Pin No. SC91710A SC91710B Pin Name * Hook switch input pin. Description * When the handset is in ON-HOOK state, this pin must be pulled 10 12 HKS “ high”in order to disable the dialing operation and decrease the power consumption. * When in OFF-HOOK state, the HKS pin must be pulled “ low”state for all function operation. * Pulse output signal pin. * NMOS open drain output structure. * The output is “ LOW”during pulse dialing and Flash operation, otherwise this output is “ floating” . * Dual Tone Multi-frequency output pin. * In TONE mode, when an entry of digit key (include *, # key), this pin will send out a corresponding DTMF signal. 11 13 PO 12 14 TONE * The TONE pin provides minimum tone duration and minimum intertone pause time to support rapid key-in. If key-in time is less than 100ms, DTMF signal will last for 100ms; otherwise the tone duration will last as long as the key is pressed. * Handfree input control pin. * Toggle input structure, falling edge trigger. * It is used to enable and disable Handfree function. * With waveshaped by a built-in Schmit trigger, the bounce of input can be eliminated by external R, C debounce circuit. * A built-in pull down resistor is 200k typical. * Handfree output control pin. * Inverter output structure (normally ‘ , active ‘ low’ high’ ). * When a HFI pin is active, Handfree function will be enabled (HFO=1) 9 HFI 10 HFO or disable (HFO=0). * When the Handfree function is enable (HFO=1), after OFF-HOOK action, it can reset Handfree function and HFO pin return to ‘ low’ state. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 6 of 18 SC91710A/B KEYBOARD OPERATION Symbol definitions: a) b) c) d) e) f) g) h) i) j) k) l) m) D1~Dn Dp1~Dpn Dt1~Dtn tF tP tPT tFP tRP LNB ↑ ↓ : : : : : : : : : : : : : OFF-HOOK or enable Hand Free function. ON-HOOK or disable Hand Free function. Input level from low to high. Input level from high to low. Digit key 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, *, #, (C1~Cn is same as D1~Dn). Pulse digit 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, (Cp1~Cpn is same as Dp1~Dpn). Tone digit 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, *, #, (Ct1~Ctn is same as Dt1~Dtn). Flash time. Pause time. Pulse to Tone wait time. Pause time for flash. Pause time for redial. Last number redial buffer. A Normal Dialing 1. Digit Dialing Procedure Dial out Dial out LNB : : : : ↑ D1, D2… , Dn↓ Dt1, Dt2… , Dtn (in Tone mode) Dp1, Dp2,… , Dpn (in Pulse mode) D1, D2… , Dn 2. Dialing with flash key Procedure Dial out Dial out LNB : : : ↑ F, D1, D2… , Dn ↓ tF, tFP, Dt1, Dt2… , Dtn (in Tone mode) tF, tFP, Dp1, Dp2, … , Dpn (in Pulse mode) D1, D2… , Dn 3. Dialing with P→T key Procedure Dial out LNB : : : ↑ D1, D2 … , P→T , … , Dn ↓ Dp1, Dp2, … , tPT, … , Dpn (in Pulse mode) D1, D2 … , P→T , … , Dn Note: If key in digit over maximum digit stored in LNB, then RD is inhibit even after on/off hook. B Redial LNB Procedure Dial out Dial out : : : : D1, D2… , Dn ↑ RD ↓ tRP, Dt1, Dt2… , Dtn (in Tone mode) tRP, Dp1, Dp2,… , Dpn (in Pulse mode) Note: If key in digit over maximum digit stored in LNB, then RD is inhibit. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 7 of 18 SC91710A/B C Pause Function Procedure Dial out Dial out LNB D Flash Function 1. Reset Procedure Dial out Dial out LNB : : : : ↑ D1, D2… , Dn, F, C1 … , Cn ↓ Dt1, Dt2,… , Dtn , t F, tFP, Ct1 … , Ctn (in Tone mode) Dp1, Dp2,… , Dpn , tF, tFP, Cp1 … , Cpn (in Pulse mode) C1, C2 … , Cn : : : : ↑ D1, D2… , Dn, P, C1 … , Cn ↓ Dt1, Dt2 ,… , Dtn, tP, Ct1, Ctn (in Tone mode) Dp1, Dp2, … Dpn , tP, Cp1 … , Cpn (in Pulse mode) D1, D2… , Dn, P , C1, C2 … , Cn Handfree Function operation: A) To execute Handfree function: When HFO = ’ , HFI pin is active, the Handfree function will be enabled low’ (HFO = ’ high’ ) B) Reset Handfree function: a. OFF-HOOK action. b. When HFO = ’ high’a HFI pin is active again, the Handfree function will be reset (HFO=’ ). , low’ Operating flow chart of Handfree STATE NO. (0) INITIAL STATE (1) ON HKS HF LINE (2) OFF HKS LINE (3) OFF HKS HF LINE PO XMUTE HFO 0 1 0 1 * F: Floating (Hi-impedance) F F F F F F F F HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 8 of 18 SC91710A/B TEST CIRCUIT Note: 1. Dist. (dB)=20log{[V12+V22+V32+… Vn2)1/2]/[(VL2+VH2)1/2]} a. V1… Vn are extraneous frequencies (ie, inter modulation and harmonic), components in the 500Hz to 3400Hz band. b. VL,VH are the individual frequency components of DTMF signal. c. Whether keyboard is pushed refer to the TONE mode time diagram. 2. Sink current Isink=I/(1-Duty Cycle), I is the net DC current measured from ampere meter. 3. R*, C* mean other column and row. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 9 of 18 SC91710A/B TIMING DIAGRAMS HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 10 of 18 SC91710A/B TIMING DIAGRAMS(continued) HKS KEY IN F tDB XMUTE PO TONE OSCO ......High impedance Flash key operating timming tF HKS 3 KEY IN tDB 2 RD XMUTE PO tITP tITP tD tITP tITP TONE OSCO ......High impedance Tone Mode Redial Timming Diagram HKS 3 KEY IN tDB 2 RD XMUTE tRP tIDP tIDP PO tIDP tIDP TONE OSCO ......High impedance Pulse Mode Redial Timming Diagram HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 11 of 18 SC91710A/B TIMING DIAGRAMS(continued) HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 12 of 18 SC91710A/B TYPACAL APPLICATION CIRCUIT HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 13 of 18 SC91710A/B TYPACAL APPLICATION CIRCUIT HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 14 of 18 SC91710A/B CHIP TOPOGRAPHY Size: 1.45 x 1.54 mm2 PAD COORDINATES (Unit: µm) No. 1 2 3 4 5 6 7 8 9 Symbol P1 P2 P3 P4 P5 P6 P7 P8 P9 X -542.6 -542.6 -542.6 -315.0 -134.8 85.5 562.4 562.4 562.4 Y -238.0 -468.1 -602.5 -602.5 -602.5 -602.5 -439.1 -277.6 -93.6 No. 10 11 12 13 14 15 16 17 18 Symbol P10 P11 P12 P13 P14 P15 P16 P17 P18 X 562.4 562.4 562.4 562.4 148.6 -22.4 -251.0 -542.6 -542.6 Y 88.5 252.4 445.8 603.8 603.8 603.8 603.8 124.7 -102.9 Note: The original point of the coordinate is the die center. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 15 of 18 SC91710A/B PACKAGE OUTLINE DIP-16-300-2.54 UNIT: mm SOP-16-225-1.27 UNIT: mm HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 16 of 18 SC91710A/B PACKAGE OUTLINE(Continued) DIP-18-300-2.54 UNIT: mm 2.54 1.52 15 Degree 23.12±0.3 0.5MIN 0.46 1.27MAX HANDLING MOS DEVICES: Electrostatic charges can exist in many things. All of our MOS devices are internally protected against electrostatic discharge but they can be damaged if the following precautions are not taken: • Persons at a work bench should be earthed via a wrist strap. • Equipment cases should be earthed. • All tools used during assembly, including soldering tools and solder baths, must be earthed. • MOS devices should be packed for dispatch in antistatic/conductive containers. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 17 of 18