MxL7213
Data Sheet
Dual 13A or Single 26A Power Module
General Description
Features
The MxL7213 is a dual channel, 13A step-down power
module. It includes a wide 4.5V to 16V input voltage range
and supports two outputs each with an output voltage range
of 0.6V to 5.3V, set by a single external resistor. The
MxL7213 requires just a few input and output capacitors,
which simplifies design and shortens time-to-market. The
module supplies either two 13A outputs, a single 26A or up to
100A when paralleled with additional MxL7213 modules.
Attention to thermal design, component selection and internal
construction results in higher efficiency and extended
operating range relative to devices with the same industry
standard pinout.
■
■
■
■
Dual 13A or single 26A output
■
■
Frequency synchronization
The complete switch mode DC/DC power supply integrates
the control, drivers, bootstrap diodes, bootstrap capacitors,
inductors, MOSFETs and HF bypass capacitors in a single
package for point-of-load conversions.
Input voltage range: 4.5V to 16V
Output voltage range: 0.6V to 5.3V
Multiphase current sharing with multiple MxL7213s for up
to 100A output
Higher efficiency than competitive devices with the same
industry standard pinout
■
■
Differential remote sense amplifier
Peak current mode architecture for fast transient
response
■
■
■
■
The MxL7213 includes a temperature diode that enables
device temperature monitoring. It also has an adjustable
switching frequency and utilizes a peak current mode
architecture which allows fast line and load transient
response.
A host of protection features, including overcurrent, overtemperature, short-circuit and UVLO, help this module
achieve safe operation under abnormal operating conditions.
The MxL7213 is available in two space saving, RoHS
compliant and thermally enhanced packages: a 15mm x
15mm x 4.41mm LGA package and a 15mm x 15mm x
5.01mm BGA package.
Adjustable switching frequency (250kHz to 780kHz)
Overcurrent protection
Output overvoltage protection
Internal temperature monitor and thermal shutdown
protection
■
Thermally enhanced packages:
15mm x 15mm x 4.41mm LGA package
15mm x 15mm x 5.01mm BGA package
Applications
■
■
■
Typical Application
Telecom and Networking Equipment
Industrial Equipment
Test Equipment
Ordering Information - page 34
INTVCC
CVCC
4.7μF
VOUT
VIN
7V to 16V
D1
5.1V Zener
Optional
95
PGOOD
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VIN
VOUT1
CIN
CSS
0.1μF
TEMP
RUN1
RUN2
RTEMP
INTVCC
VOUTS1
DIFFOUT
SW1
TRACK1
TRACK2
FSET
PHASMD
SGND
GND
DIFFP
COUT1
CFF
VFB1
VFB2
COMP1
MxL7213
RFB
8.25k
COMP2
VOUTS2
VOUT2
SW2
DIFFN
PGOOD2
Efficiency (%)
R1
10k
Optional
100
RPGOOD
5k
90
85
80
MxL7213, 12V to 5V (750kHz)
Competitor A, 12V to 5V (750kHz)
VOUT
5V 26A
PGOOD
COUT2
75
MxL7213, 12V to 1V (400kHz)
Competitor A, 12V to 1V (400kHz)
70
1
Figure 1: Typical Application: 26A, 5V Output DC/DC Power Module
• www.maxlinear.com• 074DSR03
3
5
7
9
IOUT (A)
11
Figure 2: Efficiency Advantage
vs. Competition
13
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Revision History
Revision History
Document No.
Release Date
Change Description
074DSR01
4/1/19
Initial release.
074DSR02
5/16/19
Remove stray line from Recommended PCB Layout. Correct number of phases sentence
under Multiphase Operation and current source and external lock sentences under Frequency
Selection and Phase-Lock Loop. Correct SGND to GND in INTVCC pin description. Changed
TCVTEMP to -2.2mV/°C.
074DSR03
9/19/19
Update efficiency, power loss, and de-rating graphs. Removed output voltage noise graph.
Update compensation section, thermal resistances, and capacitor table. VOUT maximum
changed to 16V. Update ordering information.
9/19/19
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Table of Contents
Table of Contents
General Description............................................................................................................................................. i
Features............................................................................................................................................................... i
Applications ......................................................................................................................................................... i
Specifications ..................................................................................................................................................... 1
Absolute Maximum Ratings...........................................................................................................................................1
ESD Ratings ..................................................................................................................................................................1
Operating Conditions.....................................................................................................................................................2
Electrical Characteristics ...............................................................................................................................................3
Pin Information ................................................................................................................................................... 6
Pin Configuration ...........................................................................................................................................................6
Pin Description ..............................................................................................................................................................6
Typical Performance Characteristics................................................................................................................ 9
Functional Block Diagram ............................................................................................................................... 13
Operation........................................................................................................................................................... 14
Power Module Description ......................................................................................................................................... 14
Applications Information ................................................................................................................................ 14
Typical Application Circuit .......................................................................................................................................... 14
VIN to VOUT Step-Down Ratios................................................................................................................................... 14
Output Voltage Programming ...................................................................................................................................... 15
Input Capacitors ......................................................................................................................................................... 15
Output Capacitors ...................................................................................................................................................... 16
Pulse-Skipping Mode Operation................................................................................................................................. 16
Forced Continuous Operation .................................................................................................................................... 16
Multiphase Operation ................................................................................................................................................. 16
Input RMS Ripple Current Cancellation.......................................................................................................................18
Frequency Selection and Phase-Lock Loop............................................................................................................... 18
Minimum On-Time ...................................................................................................................................................... 19
Soft Start and Output Voltage Tracking...................................................................................................................... 19
Power Good ............................................................................................................................................................... 20
Stability and Compensation........................................................................................................................................ 21
Additional Compensation Information ................................................................................................................21
Enabling the Channels ............................................................................................................................................... 21
INTVCC and EXTVCC.................................................................................................................................................. 22
Differential Remote Sense Amplifier........................................................................................................................... 22
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Table of Contents
SW Pins...................................................................................................................................................................... 22
Temperature Monitoring (TEMP)................................................................................................................................ 22
Fault Protection .......................................................................................................................................................... 23
Thermal Considerations and Output Current Derating ............................................................................................... 23
Power Derating........................................................................................................................................................... 24
Layout Guidelines and Example..................................................................................................................................28
Mechanical Dimensions ................................................................................................................................... 29
15mm x 15mm x 4.41mm LGA.................................................................................................................................... 29
Recommended Land Pattern and Stencil....................................................................................................... 30
15mm x 15mm x 4.41mm LGA.................................................................................................................................... 30
Mechanical Dimensions ................................................................................................................................... 31
15mm x 15mm x 5.01mm BGA ...................................................................................................................................31
Recommended Land Pattern and Stencil....................................................................................................... 32
15mm x 15mm x 5.01mm BGA ...................................................................................................................................32
MxL7213 Component Pinout ........................................................................................................................... 33
Ordering Information........................................................................................................................................ 34
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
List of Figures
List of Figures
Figure 1: Typical Application: 26A, 5V Output DC/DC Power Module................................................................... i
Figure 2: Efficiency Advantage vs. Competition .................................................................................................... i
Figure 3: Pin Configuration ................................................................................................................................... 6
Figure 4: Efficiency: Single Phase, VIN = 5V ........................................................................................................ 9
Figure 5: Efficiency: Single Phase, VIN = 12V ...................................................................................................... 9
Figure 6: Efficiency: Dual Phase, VIN = 12V......................................................................................................... 9
Figure 7: Output Current Sharing ......................................................................................................................... 9
Figure 8: 12V to 1V Load Step Response .......................................................................................................... 10
Figure 9: 12V to 1.2V Load Step Response ....................................................................................................... 10
Figure 10: 12V to 1.5V Load Step Response ..................................................................................................... 10
Figure 11: 12V to 1.8V Load Step Response ..................................................................................................... 10
Figure 12: 12V to 2.5V Load Step Response ..................................................................................................... 11
Figure 13: 12V to 3.3V Load Step Response ..................................................................................................... 11
Figure 14: 12V to 5V Load Step Response ........................................................................................................ 11
Figure 15: Single Phase Start-Up, 12V to 1.5V, No Load................................................................................... 12
Figure 16: Single Phase Start-Up, 12V to 1.5V, 13A Load................................................................................. 12
Figure 17: Short-Circuit, 12V to 1.5V, 0A Load .................................................................................................. 12
Figure 18: Short-Circuit, 12V to 1.5V, 13A Load ................................................................................................ 12
Figure 19: Functional Block Diagram.................................................................................................................. 13
Figure 20: Typical 5VIN to 16VIN, 1.5V and 1.2V Outputs .................................................................................. 15
Figure 21: 4-Phase Parallel Configuration.......................................................................................................... 16
Figure 22: Examples of 2-Phase, 4-Phase and 6-Phase Operation with PHASMD Table ................................. 17
Figure 23: Normalized Input RMS Ripple Current vs. Duty Cycle, One to Six Phases ...................................... 18
Figure 24: Operating Frequency vs. FSET Pin Voltage...................................................................................... 18
Figure 25: VOUT and VTRACK versus Time ......................................................................................................... 19
Figure 26: Example of Output Tracking Application Circuit ................................................................................ 20
Figure 27: Output Coincident Tracking Waveform.............................................................................................. 20
Figure 28: CFF Phase Boost vs. Frequency Fzero Normalized to 1 ................................................................... 21
Figure 29: Diode Voltage vs. Temperature......................................................................................................... 22
Figure 30: 2-Phase, 5V at 26A with Temperature Monitoring............................................................................. 22
Figure 31: Graphical Representation of Thermal Coefficients............................................................................ 24
Figure 32: Power Loss, VOUT = 1.0V.................................................................................................................. 25
Figure 33: Current Derating, VIN = 5V, VOUT = 1.0V .......................................................................................... 25
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
List of Figures
Figure 34: Current Derating, VIN = 12V, VOUT = 1.0V ........................................................................................ 25
Figure 35: Power Loss, VOUT = 2.5V.................................................................................................................. 25
Figure 36: Current Derating, VIN = 5V, VOUT = 2.5V .......................................................................................... 25
Figure 37: Current Derating, VIN = 12V, VOUT = 2.5V ........................................................................................ 25
Figure 38: Power Loss, VOUT = 5V..................................................................................................................... 26
Figure 39: Current Derating, VIN = 12V, VOUT = 5V ........................................................................................... 26
Figure 40: Recommended PCB Layout .............................................................................................................. 28
Figure 41: Mechanical Dimensions, LGA ........................................................................................................... 29
Figure 42: Recommended Land Pattern and Stencil, LGA................................................................................. 30
Figure 43: Mechanical Dimensions, BGA ........................................................................................................... 31
Figure 44: Recommended Land Pattern and Stencil, BGA ................................................................................ 32
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
List of Tables
List of Tables
Table 1: Absolute Maximum Ratings .................................................................................................................... 1
Table 2: ESD Ratings ........................................................................................................................................... 1
Table 3: Operating Conditions .............................................................................................................................. 2
Table 4: Electrical Characteristics ....................................................................................................................... 3
Table 5: Pin Description........................................................................................................................................ 6
Table 6: VFB Resistor Table vs. Various Output Voltages ................................................................................. 15
Table 7: ѲJA and Derating Curves Corresponding to 1.0V Output..................................................................... 24
Table 8: ѲJA and Derating Curves Corresponding to 2.5V Output..................................................................... 24
Table 9: ѲJA and Derating Curves Corresponding to 5V Output........................................................................ 24
Table 10: Capacitors Used for Output Voltage Response Matrix ....................................................................... 27
Table 11: Output Voltage Response vs. Component Matrix............................................................................... 27
Table 12: MxL7213 Component Pinout .............................................................................................................. 33
Table 13: Ordering Information........................................................................................................................... 34
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Specifications
Specifications
Absolute Maximum Ratings
Important: The stresses above what is listed under Table 1 may cause permanent damage to the device. This is a stress
rating only—functional operation of the device above what is listed under Table 1 or any other conditions beyond what
MaxLinear recommends is not implied. Exposure to conditions above what is listed under Table 3 for extended periods of
time may affect device reliability. Solder reflow profile is specified in the IPC/JEDEC J-STD-020C standard.
Table 1: Absolute Maximum Ratings
Parameter
Minimum
Maximum
Units
–0.3
18
V
–1
23
V
PGOOD1, PGOOD2, COMP1, COMP2
–0.3
6
V
INTVCC, EXTVCC
VIN
VSW1, VSW2
–0.3
6
V
MODE/PLLIN, fSET, TRACK1, TRACK2
–0.3
INTVCC
V
DIFFOUT
–0.3
INTVCC - 1.1V
V
PHASMD
–0.3
INTVCC
V
VOUT1, VOUT2, VOUTS1, VOUTS2
–0.3
6
V
DIFFP, DIFFN
–0.3
INTVCC
V
RUN1, RUN2, VFB1, VFB2
–0.3
INTVCC
V
100
mA
150
°C
245
°C
Maximum
Units
2k
V
500
V
INTVCC Peak Output Current
Storage Temperature Range
–65
Peak Package Body Temperature
ESD Ratings
Table 2: ESD Ratings
Parameter
Minimum
HBM (Human Body Model)
CDM (Charged Device Model)
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Operating Conditions
Operating Conditions
Table 3: Operating Conditions
Parameter
Minimum
Typical
Maximum
Units
VIN
4.5
16
V
INTVCC
4.5
5.5
V
EXTVCC
4.7
6
V
PGOOD
0
INTVCC
V
Switching Frequency
250
780
kHz
Junction Temperature Range (TJ)
–40
125
°C
Thermal Resistance from Junction to Ambient (ѲJA)
7
°C/W
Thermal Resistance from Junction to Bottom of Module Case (ѲJCbottom)
1.5
°C/W
Thermal Resistance from Junction to Top of Module Case (ѲJCtop)
3.86
°C/W
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074DSR03
2
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Electrical Characteristics
Electrical Characteristics
Specifications are for Operating Junction Temperature of TJ = 25°C only; limits applying over the full Operating Junction
Temperature range are denoted by a "•". Typical values represent the most likely parametric norm at TJ = 25°C and are
provided for reference purposes only. Unless otherwise indicated, VIN = 12V and VRUN1, VRUN2 = 5V. Per Figure 20.
Table 4:
Electrical Characteristics
Symbol
Parameter
Conditions
•
Min
•
Typ
Max
Units
4.5
16
V
•
0.6
5.3
V
•
1.477
1.5
1.523
V
1.1
1.25
1.40
V
DC Specifications
VIN(DC)
VOUT1(RANGE)
VOUT2(RANGE)
Input DC voltage
Output DC range
VIN = 5.5V to 16.0V
CIN = 22 µF x 3
VOUT1 (DC)
VOUT2 (DC)
VOUT total variation
with line and load
COUT = 100µF x 1 Ceramic, 220µF
POSCAP,
MODE_PLLIN = GND
VIN = 12V, VOUT = 1.5V
Input Specifications
VRUN1, VRUN2
RUN pin on/off
threshold
VRUN1HYS, VRUN2HYS
RUN pin ON
hysteresis
IINRUSH(VIN)
Input inrush current at
start-up
IQ(VIN)
IS(VIN)
Input supply bias
current
Input supply current
RUN rising
IOUT = 0A, CIN = 3 x 22µF, CSS = 0.01µF,
COUT = 3 x 100µF, VOUT1 = 1.5V,
170
mV
0.5
A
VOUT2 = 1.5V, VIN = 12V
VIN = 12V, VOUT = 1.5V,
pulse-skipping mode
5
VIN = 12V, VOUT = 1.5V, switching CCM
85
Shutdown, RUN = 0, VIN = 12V
50
VIN = 5V, VOUT = 1.5V, IOUT = 13A
4.34
VIN = 12V, VOUT = 1.5V, IOUT = 13A
1.82
mA
µA
A
Output Specifications
IOUT1(DC), IOUT2(DC)
Output continuous
current range(1)
VIN = 12V, VOUT = 1.5V
∆VOUT1(LINE)/VOUT1
∆VOUT2(LINE)/VOUT2
Line regulation
accuracy
VOUT = 1.5V, VIN from 4.75V to 16V
IOUT = 0A for each output
•
∆VOUT1(LOAD)/VOUT1
∆VOUT2(LOAD)/VOUT2
Load regulation
accuracy(1)
VOUT = 1.5V, 0A to 13A, VIN = 12V
•
VOUT1(AC), VOUT2(AC)
Output ripple voltage
For each output; IOUT = 0A,
COUT = 100µF x 3 / X7R / ceramic,
470µF POSCAP, VIN = 12V, VOUT = 1.5V,
frequency = 400kHz
26
mVPP
fS (each channel)
Output ripple voltage
frequency(2)
VIN = 12V, VOUT = 1.5V, fSET = 1.25V
500
kHz
fSYNC (each channel)
SYNC capture range
9/19/19
0
400
074DSR03
13
A
0.016
0.025
%/V
0.35
0.5
±%
780
kHz
3
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Electrical Characteristics
Table 4: (Continued) Electrical Characteristics
Symbol
•
Parameter
Conditions
Turn-on overshoot
COUT = 100µF / X5R / ceramic, 470µF
POSCAP, VOUT = 1.5V, IOUT = 0A,
VIN = 12V
Each channel
10
mV
tSTART1, tSTART2
Turn-on time
COUT = 100µF / X5R / ceramic,
470µF POSCAP, No load,
TRACK/SS with 0.01µF to GND, VIN = 12V
Each channel
4.8
ms
∆VOUT1(LS)
∆VOUT2(LS)
Peak deviation for
dynamic load
Load: 0% to 50% to 0% of full load
COUT = 22µF x 3 / X5R / ceramic,
470µF POSCAP, VIN = 12V, VOUT = 1.5V
Each channel
30
mV
tSETTLE1, tSETTLE2
Settling time for
dynamic load step
Load: 0% to 50% to 0% of full load,
VIN = 12V, COUT = 100µF, 470µF POSCAP
Each channel
20
µs
Output current limit
VIN = 12V, VOUT = 1.5V
Each channel
20
A
VFB1, VFB2
Voltage at VFB pins
IOUT = 0A, VOUT = 1.5V
IFB
Current at VFB pins
VOVL
Feedback overvoltage
lockout
TRACK1 (I),
TRACK2 (I)
Track pin soft-start
pull-up current
UVLO
Undervoltage lockout
∆VOUT1START
∆VOUT2START
IOUT1(PK)
IOUT2(PK)
Min
Typ
Max
Units
Control Section
•
•
TRACK1 (I), TRACK2 (I) start at 0V
0.594
0.600
0.606
V
–5
–20
nA
0.64
0.66
0.68
V
1.1
1.25
1.4
µA
VIN falling
3.66
V
VIN rising
4.25
V
600
mV
90
ns
UVLO Hysteresis
tON(MIN)
Minimum on-time
RFBHI1, RFBHI2
Resistor between
VOUTS1, VOUTS2 and
VFB1, VFB2
Each output
VPGOOD1 LOW,
VPGOOD2 LOW
PGOOD voltage low
IPGOOD = 2mA
IPGOOD
PGOOD leakage
current
VPGOOD = 5V
VPGOOD
PGOOD trip level
60.05
60.4
60.75
kΩ
35
50
mV
±5
µA
VFB with respect to set output voltage
VFB ramping negative
–10
VFB with respect to set output voltage
VFB ramping positive
10
%
INTVCC Linear Regulator
VINTVCC
Internal VCC voltage
6V < VIN < 16V
VINTVCC
INTVCC load
regulation
ICC = 0mA to 50mA
Load Regulation
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074DSR03
4.8
5
5.2
V
1
2
%
4
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Electrical Characteristics
Table 4: (Continued) Electrical Characteristics
Symbol
Parameter
Conditions
•
Min
Typ
VEXTVCC
EXTVCC switchover
voltage
EXTVCC ramping positive
•
4.5
4.7
VEXTVCC(DROP)
EXTVCC dropout
ICC = 20mA, VEXTVCC = 5V
VEXTVCC(HYST)
EXTVCC hysteresis
19
Max
Units
V
50
156
mV
mV
Oscillator and Phase-Locked Loop
Frequency Nominal
Nominal frequency
FSET = 1.2V
450
500
550
kHz
Frequency Low
Lowest frequency
FSET = 0V
210
250
290
kHz
Frequency High
Highest frequency
FSET > 2.4V, up to INTVCC
700
780
860
kHz
IFSET
Frequency set current
9
10
11
µA
fSYNC
SYNC capture range
780
kHz
RMODE_PLLIN
MODE_PLLIN input
resistance
CLKOUT
Phase (relative to
VOUT1)
CLK High
Clock High output
voltage
CLK Low
Clock Low output
voltage
Each channel
250
250
kΩ
PHASMD = GND
60
Deg
PHASMD = float
90
Deg
PHASMD = INTVCC
120
Deg
2
V
0.2
V
Differential Amplifier
AV
Gain
RIN
Input resistance
Measured at DIFFP Input
VOS
Input offset voltage
VDIFFP = VDIFFOUT = 1.5V, IDIFFOUT =
100µA
PSRR
Power Supply
Rejection Ratio
5V < VIN < 16V
ICL
Maximum Output
current
VDIFFOUT(MAX)
Maximum output
voltage
GBW
Gain Bandwidth
Product
VTEMP
Diode Connected PNP I = 100µA
TCVTEMP
Temperature
Coefficient
OT
Thermal shutdown
threshold
80
kΩ
mV
90
dB
3
mA
INTVCC
- 1.4
•
Thermal hysteresis
V/V
2
IDIFFOUT = 300µA
Rising temperature
1
V
3
MHz
0.636
V
–2.2
mV/°C
145
°C
15
°C
1. See output current derating curves for different VIN, VOUT and TA.
2. The switching frequency is programmable from 250kHz to 780kHz.
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Pin Information
Pin Information
Pin Configuration
TEMP
TEMP
EXTVCC
M
M
L
L
VIN
K
J
CLKOUT H
SW1
G
PHASMD
F
MODE_PLLIN
VOUTS1
VIN
K
J
TRACK1
VFB1
EXTVCC
SGND
RUN1
COMP1 COMP2
GND
E
INTVCC
SW2
PGOOD1
PGOOD2
RUN2
DIFFOUT
DIFFP
DIFFN
GND
SGND VFB2 TRACK2
D
CLKOUT
SW1
PHASMD
MODE_PLLIN
TRACK1
VFB1
FSET SGND VOUTS2
C
VOUTS1
B
VOUT1
A
1
2
3
GND
4
5
6
8
9
10
G
RUN1
F
DIFFOUT
DIFFP
DIFFN
GND
FSET SGND VOUTS2
C
VOUT1
1
12
SGND
SGND VFB2 TRACK2
D
A
11
INTVCC
SW2
PGOOD1
PGOOD2
RUN2
COMP1 COMP2
GND
E
B
VOUT2
7
H
LGA, Top View
144-Lead 15mm x 15mm x 4.41mm
2
3
GND
4
5
6
7
VOUT2
8
9
10
11
12
BGA, Top View
144-Lead 15mm x 15mm x 5.01mm
Figure 3: Pin Configuration
Pin Description
Table 5: Pin Description
Pin Number
Pin Name
Description
A1, A2, A3, A4, A5,
B1, B2, B3, B4, B5,
C1, C2, C3, C4
VOUT1
Output of the channel 1 power stage. Connect the corresponding output load from the
VOUT1 pins to the PGND pins. Direct output decoupling capacitance from VOUT1 to PGND
is recommended.
A6, A7, B6, B7,
D1, D2, D3, D4,
D9, D10, D11, D12,
E1, E2, E3, E4,
E10, E11, E12,
F1, F2, F3,
F10, F11, F12,
G1, G3, G10, G12,
H1, H2, H3, H4, H5, H6,
H7, H9, H10, H11, H12,
J1, J5, J8, J12,
K1, K5, K6, K7, K8, K12,
L1, L12, M1, M12
GND
Ground for the power stage. Connect to the application’s power ground plane.
A8, A9, A10, A11, A12,
B8, B9, B10, B11, B12,
C9, C10, C11, C12
VOUT2
Output of the channel 2 power stage. Connect the corresponding output load from the
VOUT2 pins to the PGND pins. Direct output decoupling capacitance from VOUT2 to PGND
is recommended.
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Pin Description
Table 5: Pin Description (Continued)
Pin Number
Pin Name
Description
VOUTS1,
VOUTS2
These pins are connected internally to the top of the feedback resistor for each output.
Connect this pin directly to its specific output or to DIFFOUT when using the remote sense
amplifier. When paralleling modules, connect one of the VOUTS pins to DIFFOUT when
remote sensing or directly to VOUT when not remote sensing. These pins must be
connected to either DIFFOUT or VOUT. This connection provides the feedback path and
cannot be left open.
C6
FSET
This pin is used to set the operating frequency via two methods:
Connect a resistor from this pin to ground
Drive this pin with a DC voltage
This pin sources a 10µA current. See Figure 24 for frequency of operation vs. FSET voltage.
C7, D6, G6, G7, F6, F7
SGND
Ground pin for all analog signals and low power circuits. Connect to GND in one place. See
layout guidelines in Figure 40.
VFB1, VFB2
Feedback input to the negative side of the error amplifier for each channel. These pins are
each internally connected to VOUTS1 and VOUTS2 via a precision 60.4kΩ resistor. Vary
each output voltage by adding a feedback resistor from VFB to SGND. Tie VFB1 and VFB2
together for parallel operation.
TRACK1,
TRACK2
Soft-Start and Output Voltage Tracking pins. Each channel has a 1.25μA pull-up current
source. When one channel is configured as a master, adding a capacitor from this pin to
ground sets a soft-start ramp rate. The other channel can be set up as the slave and have
the master output applied through a voltage divider to the slave’s output TRACK pin. For
coincidental tracking, this voltage divider is equal to the slave’s output feedback divider.
COMP1,
COMP2
Current control threshold and error amplifier compensation point for each channel. The
current comparator threshold increases with this control voltage. The MxL7213 is internally
compensated, however a feed-forward CFF is frequently required (see Table 11). RCOMP
and CCOMP may be required for certain operating conditions (see Figure 20). When
paralleling both channels, connect the COMP1 and COMP2 pins together.
C5, C8
D5, D7
E5, D8
E6, E7
E8
DIFFP
This pin is the remote sense amplifier’s positive input and is connected to the output
voltage’s remote sense point. If the remote sense amplifier is not used, connect this pin to
SGND.
Important: The differential amplifier cannot be used for outputs > 3.3V.
E9
DIFFN
This pin is the remote sense amplifier’s negative input and is connected to the remote
sense point GND. If the remote sense amplifier is not used, connect this pin to SGND.
Important: The differential amplifier cannot be used for outputs >3.3V.
F4
F5, F9
F8
Selects between Forced Continuous Mode or Pulse-Skipping Mode and provides the
external synchronization input to the Phase Detector Pin. There are three connection
options:
MODE_PLLIN 1. Connect this pin to SGND to force both channels into Forced Continuous Mode.
2. Connect this pin to INTVCC or leave it floating to enable Pulse-Skipping Mode.
3. Connect this pin to an external clock to force both channels into Forced Continuous
Mode that are synchronized to the external clock.
RUN1, RUN2
DIFFOUT
The RUN1 and RUN2 pins enable and disable the module’s two channels:
A voltage above 1.4V will turn on the related channel.
A voltage below 1.1V will turn off the related channel.
Each RUN pin has a 1μA pull-up current; once the RUN pin reaches ~1.25V, an additional
4.5μA pull-up current is added to the RUN pin.
Output of the internal remote sense amplifier. If remote sensing on channel 1, connect to
VOUTS1. If remote sensing on channel 2, connect to VOUTS2. When paralleling modules,
connect one of the VOUTS pins to DIFFOUT when remote sensing.
Important: The differential amplifier cannot be used for outputs >3.3V.
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Pin Description
Table 5: Pin Description (Continued)
Pin Number
Pin Name
Description
G2, G11
SW1, SW2
Use these pins to access the switching node of each channel. An RC snubber can be
connected to reduce switch node ringing. Otherwise, leave these pins floating.
G4
PHASMD
This pin selects the CLKOUT phase as follows:
Connect to SGND for 60 degrees
Connect to INTVCC for 120 degrees
Leave floating for 90 degrees
G5
CLKOUT
This is the clock output. Its phase is set with the PHASMD pin. It is also used during
Multiphase Operation. Refer to the Application Section on Multiphase Operation for more
details.
G9, G8
PGOOD1,
PGOOD2
Power Good outputs. This open-drain output is pulled low when the VOUT of its respective
channel is more than ±10% outside regulation.
H8
INTVCC
Internal 5V Regulator Output. This voltage powers the control circuits and internal gate
driver. Decouple to GND with a 4.7μF ceramic capacitor. INTVCC is activated when either
RUN1 or RUN2 is activated.
J6
TEMP
The internal temperature sensing diode monitors the temperature change with voltage
change on VBE. Connect to VIN through a resistor to limit the current to 100µA.
R = (VIN - 0.6V) / 100μA
EXTVCC
External power input that is enabled through a switch to INTVCC whenever EXTVCC is
>4.7V. Do not exceed 6V on this input. Connect this pin to VIN when operating VIN on 5V.
An efficiency increase that is a function of (VIN - INTVCC) multiplied by the power MOSFET
driver current occurs when the feature is used. VIN must be applied before EXTVCC, and
EXTVCC must be removed before VIN. To increase efficiency, a 5V output can be tied to this
pin.
J7
M2, M3, M4, M5, M6, M7,
M8, M9, M10, M11,
L2, L3, L4, L5, L6, L7, L8,
VIN
L9, L10, L11,
J2, J3, J4, J9, J10, J11,
K2, K3, K4, K9, K10, K11
Power input pins. Connect input voltage from these pins to GND. Direct input decoupling
capacitance from VIN to GND is recommended.
1. Use test points to monitor signal pin connections.
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Typical Performance Characteristics
Typical Performance Characteristics
See Figure 20 for typical application schematic.
95
95
Efficiency (%)
100
Efficiency (%)
100
90
85
5V to 3.3V (700kHz)
5V to 2.5V (650kHz)
5V to 1.8V (600kHz)
5V to 1.5V (500kHz)
5V to 1.2V (400kHz)
5V to 1V (400kHz)
80
75
70
0
1
2
3
4
5
6
7
8
9
10
11
12
90
12V to 5V (750kHz),
tie 5VOUT to EXTVCC
12V to 3.3V (700kHz)
12V to 2.5V (650kHz)
12V to 1.8V (600kHz)
12V to 1.5V (500kHz)
12V to 1.2V (400kHz)
12V to 1V (400kHz)
85
80
75
70
13
0
1
2
3
4
IOUT (A)
Each Channel Current (A)
Efficiency (%)
95
90
12V to 3.3V (700kHz)
12V to 2.5V (650kHz)
12V to 1.8V (600kHz)
12V to 1.5V (500kHz)
12V to 1.2V (400kHz)
12V to 1V (400kHz)
75
70
0
2
4
6
8
10
12
14
16
18
20
22
24
8
9
10
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
11
12
13
IOUT1
IOUT2
0
26
IOUT (A)
2
4
6
8
10 12 14 16 18 20 22 24 26 28
Total Output Current (A)
12VIN, 1.5VOUT,
COUT = 2 x 470µF / 10mΩ each POSCAP, 100µF ceramic
Figure 6: Efficiency: Dual Phase, VIN = 12V
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Figure 5: Efficiency: Single Phase, VIN = 12V
100
80
6
IOUT (A)
Figure 4: Efficiency: Single Phase, VIN = 5V
85
5
Figure 7: Output Current Sharing
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Typical Performance Characteristics
See Figure 20 for typical application schematic.
20mV / div(1)
20mV / div(1)
5A / div, 6A / µs step
5A / div, 6A / µs step
40µs / div
40µs / div
COUT: 2 x 470µF / 10mΩ each POSCAP, 100µF ceramic;
COUT: 2 x 470µF / 10mΩ each POSCAP, 100µF ceramic;
CFF = 180pF
CFF = 180pF
Figure 9: 12V to 1.2V Load Step Response
Figure 8: 12V to 1V Load Step Response
50mV / div(1)
50mV / div(1)
5A / div, 6A / µs step
5A / div, 6A / µs step
40us / div
COUT: 220µF / 9mΩ POSCAP, 100µF ceramic; CFF = 100pF,
40us / div
COUT: 220µF / 9mΩ POSCAP, 100µF ceramic; CFF = 47pF
Figure 10: 12V to 1.5V Load Step Response
Figure 11: 12V to 1.8V Load Step Response
1. Waveform averaged to remove high frequency ripple.
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Typical Performance Characteristics
See Figure 20 for typical application schematic.
50mV / div(1)
100mV / div(1)
5A / div, 6A / µs step
5A / div, 6A / µs step
40µs / div
40µs / div
COUT: 100µF / 18mΩ POSCAP, 100µF ceramic; CFF = 47pF
COUT: 220µF / 9mΩ POSCAP, 100µF ceramic
Figure 13: 12V to 3.3V Load Step Response
Figure 12: 12V to 2.5V Load Step Response
200mV / div(1)
5A / div, 6A / µs step
40µs / div
COUT: 100µF ceramic; CFF = 22pF
Figure 14: 12V to 5V Load Step Response
1. Waveform averaged to remove high frequency ripple.
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Typical Performance Characteristics
See Figure 20 for typical application schematic.
VOUT, 500mV / div
VOUT, 500mV / div
IOUT, 5A / div
IOUT, 2A / div
2ms / div
2ms / div
12VIN, 1.5VOUT, soft-start capacitor = 0.01µF,
COUT = 2 x 470µF / 10mΩ each POSCAP, 100µF ceramic,
use RUN pin to control start-up
12VIN, 1.5VOUT, soft-start capacitor = 0.01µF,
COUT = 2 x 470µF / 10mΩ each POSCAP, 100µF ceramic,
use RUN pin to control start-up
Figure 16: Single Phase Start-Up,
12V to 1.5V, 13A Load
Figure 15: Single Phase Start-Up,
12V to 1.5V, No Load
VOUT, 500mV / div
VOUT, 500mV / div
IOUT, 10A / div
IOUT, 10A / div
10ms / div
12VIN, 1.5VOUT, soft-start capacitor = 0.01µF,
COUT = 2 x 470µF / 10mΩ each POSCAP, 100µF ceramic
10ms / div
12VIN, 1.5VOUT, soft-start capacitor = 0.01µF,
COUT = 2 x 470µF / 10mΩ each POSCAP, 100µF ceramic
Figure 17: Short-Circuit, 12V to 1.5V, 0A Load
9/19/19
Figure 18: Short-Circuit, 12V to 1.5V, 13A Load
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Functional Block Diagram
Functional Block Diagram
VIN
TRACK1
CSS
RTEMP
= 100μA VIN
GND
RTEMP TEMP
Q TOP
SW1
CLKOUT
0.56μH
RUN1
Q BOTTOM
MODE_PLLIN
GND
PHASMD
VOUT1
COUT1
VOUTS1
60.4k
COMP1
VFB1
INTERNAL
COMP
SGND
PGOOD1
POWER
CONTROL
RFB1
PGOOD2
VIN
TRACK2
INTVCC
CSS
VOUT1
CVCC
4.7μF
1μF
GND
CIN
Q TOP
EXTVCC
0.56μH
SW2
VOUT2
Q BOTTOM
RUN2
GND
VOUT2
COUT2
LOAD
VIN - 0.6V
CIN
1μF
VOUTS2
60.4k
COMP2
Optional
External Control
FSET
RfSET
SGND
+ –
VFB2
RFB2
INTERNAL
COMP
MxL7213
INTERNAL
FILTER
DIFFOUT
DIFFN
DIFFP
Figure 19: Functional Block Diagram
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Operation
Operation
Power Module Description
light loads. This light load feature extends battery life.
The MxL7213 is a dual-channel, standalone, synchronous
step-down power module that provides two 13A outputs or
one 26A output. This power module has a continuous input
voltage range of 4.5V to 16V and has been optimized for
12V conversions. It provides precisely regulated output
voltages from 0.6V to 5.3V that are set by a single external
resistor. See typical application schematic in Figure 20.
The module employs a constant frequency, peak current
mode control loop architecture. It also has an internal
feedback loop compensation. These features ensure the
MxL7213 has sufficient stability margins as well as good
transient performance over a wide range of output
capacitors, including low ESR ceramic capacitors.
The peak current mode control supports cycle-by-cycle fast
current limit and current limit hiccup in overcurrent or output
short circuit conditions. The open-drain PGOOD outputs
are pulled low when the output voltage exceeds ±10% of its
set point. Once the output voltage exceeds +10%, the high
side MOSFET is kept off while the low side MOSFET turns
on, clamping the output voltage. The overvoltage and
undervoltage detection are referenced to the feedback pin.
The RUN1 and RUN2 pins enable and disable the
module’s two channels. Pulling a RUN pin below 1.1V
forces the respective regulator into shutdown mode and
turns off both the high side and low side MOSFETs. The
TRACK pins are used for either programming the output
voltage ramp and voltage tracking during start-up, or for
soft-starting the channels.
The EXTVCC pin allows an external 5V supply to power
the module and reduce the power dissipation in the internal
5V LDO. EXTVCC has a threshold of 4.7V for activation
and a max rating of 6V. It must sequence on after VIN and
sequence off before VIN.
Monitor the internal die temperature by using the TEMP
pin. Pull the anode up to VIN through an external resistor to
set the bias current in the diode. Thermal simulation has
shown that the thermal monitor on the controller die is
within 5°C of the MOSFETs.
Applications Information
Typical Application Circuit
The typical MxL7213 application circuit is shown in Figure
20. External component selection is primarily determined
by the maximum load current and output voltage. Refer to
Table 11 for a selection of various design solutions.
Additional information about selecting external
compensation components can be found in the Stability
and Compensation section.
VIN to VOUT Step-Down Ratios
The MxL7213 includes a differential remote sense amplifier
(with a gain of +1). This amplifier can be used to accurately
sense the voltage at the load point on one of the module’s
two outputs or on a single parallel output.
The switching frequency is programmed from 250kHz to
780kHz using an external resistor on the FSET pin. For
noise sensitive applications, the module can be
synchronized to an external clock.
The MxL7213 module can be configured to current share
between channels. It can also be set to current share
between modules (multiphase or ganged operation). Using
the MODE_PLLIN, PHASMD and CLKOUT pins,
multiphase operation of up to 8 phases is possible with
multiple MxL7213s running in parallel.
For a given input voltage, there are limitations to the
maximum possible VIN and VOUT stepdown ratios.
The MxL7213 has a maximum duty cycle of 90% at
500kHz, meaning the maximum output voltage will be
approximately 0.9 x VIN. When running at high duty cycle,
output current can be limited by the power dissipation in the
high-side MOSFET. The minimum output voltage from a
given input is controlled by the minimum on-time which is
90ns. The minimum output voltage is VIN x fSW(MHz) x
0.09µs. To get a lower output voltage, reduce the switching
frequency.
Using the the MODE_PLLIN pin to operate in pulseskipping mode results in high efficiency performance at
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Output Voltage Programming
INTVCC
INTVCC
CVCC
4.7μF
RPGOOD1
10kΩ
PGOOD1
R1
10kΩ
Optional
D1
5.1V Zener
Optional
MODE_PLLIN
VIN
C1-C4
22μF
25V
CSS1
0.1μF
RTEMP
100kΩ
CLKOUT INTVCC EXTVCC PGOOD1
VOUT1
VOUTS1
TEMP
RUN1
SW1
RUN2
VFB1
TRACK1
VFB2
TRACK2
COMP1
MxL7213
FSET
CSS2
0.1μF
COMP2
VOUTS2
PHASMD
VOUT2
SW2
RSET
121kΩ
SGND
GND
DIFFP
PGOOD2
DIFFN DIFFOUT
COUT1
100μF
6.3V
CFF1(1)
180pF
RCOMP1(2) CCOMP1(2)
RFB2
60.4kΩ
COUT2
470μF
6.3V
x2
RFB1
40.2kΩ
RCOMP2(2) CCOMP2(2)
COUT3
INTVCC
100μF
RPGOOD2
6.3V
10kΩ
PGOOD2
VOUT1
1.5V 13A
CFF2(1)
180pF
VOUT2
1.2V 13A
COUT4
470μF
6.3V
x2
LOAD
VIN
1. See Table 11.
2. May be necessary for certain operating conditions.
Figure 20: Typical 5VIN to 16VIN, 1.5V and 1.2V Outputs
Output Voltage Programming
The PWM controller has an internal 0.6V reference. A
resistor RFB between the VFB and SGND pins programs
the output voltage. A 60.4kΩ internal feedback resistor is
connected from VOUTS1 to VFB1 and from VOUTS2 to
VFB2, as illustrated in the functional block diagram.
RFB values for corresponding standard VOUT values are
shown in Table 6. Use the following equation to determine
the RFB value for other VOUT levels:
V OUT
0.6 60.4 + R FB
= --------------------------------------------R FB
When paralleling multiple channels and devices:
Tie all COMP pins together for current sharing between
the phases.
9/19/19
■
Tie the TRACK pins together and use a single soft-start
capacitor to soft-start the regulator.
Increase the soft-start current parameter by the
number of paralleled channels when solving the softstart equation. (Refer to the Soft Start and Output
Voltage Tracking section).
Table 6: VFB Resistor Table vs. Various Output Voltages
VOUT 0.6V
RFB
When paralleling multiple channels and devices, a common
RFB resistor may be used. Select the RFB as explained
above. Note that VFB pins have an IFB max of 20nA per
channel. To reduce VOUT error due to IFB, use an additional
RFB and connect corresponding VOUTS to VOUT as
shown in Figure 21.
■
■
1.0V
1.2V
1.5V
1.8V
2.5V
3.3V
5V
Open 90.9k 60.4k 40.2k 30.2k 19.1k 13.3k 8.25k
Input Capacitors
Connect the MxL7213 to a low impedance DC source. Use
four 22µF ceramic input capacitors to reduce RMS ripple
current on the regulator input.
A bulk input capacitor is required if the source impedance is
high or the source capacitance is low. For additional bulk
input capacitance, use a surface mount 47µF to 100µF
aluminum electrolytic bulk capacitor.
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Output Capacitors
The bulk output capacitors, denoted as COUT, need to have
low enough effective series resistance (ESR) to meet
output voltage ripple and transient requirements. The
MxL7213 can use low ESR tantalum capacitors, low ESR
polymer capacitors, ceramic capacitors or a combination
for COUT. Refer to Table 11 for COUT recommendations that
optimize performance for different output voltages.
Output Voltage Programming
shows an example of parallel operation and Figure 22
shows examples of 2-phase, 4-phase and 6-phase
designs.
COMP1
VOUT1
COMP2
VOUT2
4 Paralleled Outputs
for 1.2V at 50A
60.4k VOUTS1
VOUTS2
Optional Connection
VFB1
Pulse-Skipping Mode Operation
60.4k
TRACK1
VFB2
TRACK2
Pulse-skipping mode enables the module to skip cycles at
light loads which reduces switching losses and increases
efficiency at low to intermediate currents. To enable this
mode, connect the MODE_PLLIN pin to the INTVCC pin.
COMP1
VOUT1
COMP2
VOUT2
Optional
RFB
60.4k
60.4k VOUTS1
VOUTS2
Forced Continuous Operation
Forced continuous operation is recommended when fixed
frequency is more important than light load efficiency, and
when the lowest output ripple is desired. To enable this
mode, connect the MODE_PLLIN pin to GND.
Multiphase Operation
Multiphase operation is used to achieve output currents
greater than 13A. It can be used with both MxL7213
channels to achieve one 26A output. It can also be used by
paralleling multiple MxL7213s and running them out of
phase to attain one single high current output, up to 100A.
Ripple current in both the input and output capacitors is
substantially lower using a multiphase design when the
number of phases multiplied by the output voltage is less
than the input voltage. Input RMS ripple current and output
ripple amplitude is reduced by the number of phases used
while the effective ripple frequency is multiplied by the
number of phases used. The MxL7213 is a peak current
mode controlled device which results in very good current
sharing between parallel modules and balances the
thermal loading.
Use to lower
total equivalent
resistance to lower
IFB voltage error
VFB1
60.4k
TRACK1
VFB2
TRACK2
CSS
0.1μF
RFB
60.4k
Figure 21: 4-Phase Parallel Configuration
Up to 8 phases can be paralleled by using each MxL7213
channel’s PHASMD, MODE_PLLIN and CLKOUT pins.
When the CLKOUT pin is connected to the following
stage’s MODE_PLLIN pin, the frequency and the phase of
both devices are locked. Phase difference can be obtained
between MODE_PLLIN and CLKOUT of 120 degrees, 60
degrees or 90 degrees respectively by connecting the
PHASMD pin to INTVCC, SGND or left floating. Figure 21
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Output Voltage Programming
2-PHASE DESIGN
PHASMD SGND FLOAT INTVCC
0
0
0
CONTROLLER1
FLOAT
CLKOUT
MODE_PLLIN
0 PHASE
180 PHASE
VOUT1
VOUT2
PHASMD
CONTROLLER2
180
180
240
CLOCKOUT
60
90
120
4-PHASE DESIGN
90 DEGREE
CLKOUT
MODE_PLLIN
0 PHASE
180 PHASE
VOUT1
VOUT2
FLOAT
PHASMD
CLKOUT
MODE_PLLIN
90 PHASE
270 PHASE
VOUT1
VOUT2
FLOAT
PHASMD
6-PHASE DESIGN
60 DEGREE
60 DEGREE
CLKOUT
MODE_PLLIN
0 PHASE
180 PHASE
VOUT1
VOUT2
SGND
PHASMD
CLKOUT
MODE_PLLIN
60 PHASE
240 PHASE
VOUT1
VOUT2
SGND
PHASMD
CLKOUT
MODE_PLLIN
120 PHASE
300 PHASE
VOUT1
VOUT2
FLOAT
PHASMD
Figure 22: Examples of 2-Phase, 4-Phase and 6-Phase Operation with PHASMD Table
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Input RMS Ripple Current
Cancellation
Figure 23 illustrates the RMS ripple current reduction that is
expected as a function of the number of interleaved
phases.
Input RMS Ripple Current Cancellation
An external clock with a frequency range of 250kHz to
780kHz and a voltage range of 0V to INTVCC can be
connected to the MODE_PLLIN pin. The high level
threshold of the clock input is 1.6V and the low level
threshold of the clock input is 1V.
The MxL7213 integrates the PLL loop filter components.
Ensure that the initial switching frequency is set with an
external resistor before locking to an external clock. Both
regulators will operate in continuous mode while being
synchronized to an external clock signal.
The PLL phase detector output charges and discharges the
internal filter network with a pair of complementary current
sources. When an external clock is connected, an internal
switch disconnects the external FSET frequency resistor.
The switching frequency then locks to the incoming
external clock. If no external clock is connected, then the
internal switch is on, which connects the external FSET
frequency set resistor.
900
Figure 23: Normalized Input RMS Ripple Current vs.
Duty Cycle, One to Six Phases
Frequency (kHz)
800
Frequency Selection and
Phase-Lock Loop
700
600
500
400
300
200
100
0
To increase efficiency, the MxL7213 works over a range of
frequencies. For lower output voltages or duty cycles, lower
frequencies are recommended to lower MOSFET switching
losses and improve efficiency. For higher output voltages or
duty cycles, higher frequencies are recommended to limit
inductor ripple current. Refer to the efficiency graphs and
their operating frequency conditions. When selecting an
operating frequency, keep the highest output voltage in
mind.
0.0
0.5
1.0
1.5
2.0
2.5
Voltage (V)
Figure 24: Operating Frequency vs. FSET Pin Voltage
Use an external resistor between the FSET pin and SGND
to set the switching frequency. An accurate 10µA current
source into the resistor sets a voltage that programs the
frequency. Alternately, a DC voltage can be applied to
FSET to program the frequency. Figure 24 illustrates the
operating frequency versus FSET pin voltage.
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Minimum On-Time
Minimum On-Time tON(MIN) is the shortest time the
controller can turn on the high-side MOSFET of either
channel. Approaching this time may be more of an issue in
low duty cycle applications. Use the following equation to
make sure the on-time is above this minimum:
V OUT
------------------------------t
V IN FREQ ON MIN
If the on-time falls below this minimum, the channel will
start to skip cycles. In this case, the output voltage
continues to regulate, however output ripple increases.
Lowering the switching frequency increases on-time.
Minimum on-time specified in the electrical characteristics
is 90ns.
Input RMS Ripple Current Cancellation
The MODE_PLLIN pin selects between forced continuous
mode or pulse-skipping mode during steady-state
operation. Regardless of the mode selected, the module
channels will always start in pulse-skipping mode up to
TRACK = 0.5V. Between TRACK = 0.5V and 0.54V, it will
operate in forced continuous mode. Once TRACK > 0.54V,
it will follow the selected mode.
The TRACK pins can be used to externally program the
output voltage tracking. The output may be tracked up and
down with another regulator. The master regulator’s output
is divided down with an external resistor divider that is the
same as the slave regulator’s feedback divider to
implement coincident tracking. Note that each MxL7213
channel has an internal accurate 60.4kΩ for the top
feedback resistor. Refer to the equation below, which is
applicable for VTRACK(SLAVE) < 0.8V. An example of
coincident tracking is shown in Figure 26.
60.4k
V OUT SLAVE = 1 + ------------- V TRACK SLAVE
R TA
Soft Start and Output Voltage
Tracking
A capacitor CSS can be connected from the TRACK pin to
ground to implement soft start. The TRACK pin is charged
by a 1.25µA current source up to the reference voltage and
then on to INTVCC. The MxL7213 has a smooth transition
from TRACK to VOUT as shown in Figure 25. If the RUN pin
is below 1.2V, the TRACK pin is pulled low. The following
equation can be used to calculate soft-start time, defined
as when PGOOD asserts:
C SS
t SOFTSTART = ------------------ 0.65V
1.25A
Voltage (mV)
1000
900
VTRACK
800
VOUT = 0.6V
700
600
500
400
300
200
100
0
0
1
2
3
4
5
6
7
8
9
10
time (ms)
Figure 25: VOUT and VTRACK versus Time
9/19/19
074DSR03
19
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Input RMS Ripple Current Cancellation
INTVCC
INTVCC
CVCC
4.7μF
RPGOOD1
10kΩ
PGOOD1
R1
10kΩ
Optional
D1
5.1V Zener
Optional
CIN
CSS
0.1μF
RTEMP
RTB
60.4kΩ
RTA
19.1kΩ
INTVCC
CLKOUT INTVCC EXTVCC PGOOD1
VOUT1
TEMP
VOUTS1
RUN1
SW1
RUN2
VFB1
TRACK1
VFB2
TRACK2
COMP1
MxL7213
FSET
COUT1
100μF
6.3V
CFF1
47pF
RFB2
19.1kΩ
COMP2
VOUT2
VOUT1
3.3V
SW2
GND
DIFFP
PGOOD2
DIFFN DIFFOUT
COUT2
100μF
6.3V
VOUT1
3.3V 13A
RFB1
13.3kΩ
VOUT2
VOUTS2
PHASMD
SGND
MASTER
SLAVE 2.5V 13A
COUT3
100μF
RPGOOD2
6.3V
10kΩ
PGOOD2
INTVCC
COUT4
220μF
6.3V
LOAD
MODE_PLLIN
VIN
VIN
Figure 26: Example of Output Tracking Application Circuit
possible, populate RTA with the same capacitor as the
master’s TRACK capacitor and do not populate RTB.
Capacitors with 10% accuracy are recommended.
MASTER OUTPUT
Power Good
SLAVE OUTPUT
OUTPUT
VOLTAGE
TIME
Figure 27: Output Coincident Tracking Waveform
The ramping voltage is applied to the track pin of the slave.
Since the same resistor values are used to divide down the
output of the master and to set the output of the slave, the
slave tracks with the master coincidentally until its final
value it achieved. The master continues from the slave’s
regulation point to its final value. In Figure 26, RTA is equal
to RFB2 for coincident tracking.
Each channel’s open drain PGOOD pin can be used to
monitor if its respective VOUT is outside ±10% of the set
point. The PGOOD pin is pulled low when the output of
either channel is outside the monitoring window, the RUN
pin is below its threshold (1.25V), or the MxL7213 is in the
soft start or tracking phase. The PGOOD pin will flag power
good immediately when both VFB pins are within the
monitoring window. Note that there is an internal 20µs
delay when VFB voltage goes out of the monitoring
window.
If desired, a pull up resistor can be connected from the
PGOOD pins to a supply voltage with a maximum level of
≤ 6V.
Ratiometric power up can be implemented by tying the
TRACK pins together and connecting a capacitor from
TRACK to ground. For existing designs where this is not
9/19/19
074DSR03
20
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Input RMS Ripple Current Cancellation
Stability and Compensation
The MxL7213 is internally compensated across the range
of all input and output voltages so additional compensation
is not typically required. Table 11 covers most application
requirements.
For low output capacitance or low output voltage
applications, sometimes a reasonable loop bandwidth and
improved phase margin can be obtained by adding a series
R-C circuit between the COMP pin and SGND.
Phase Boost (Degrees)
60
50
40
30
20
10
0
Additional Compensation Information
0.1
When the loop gain crosses 0dB at a slope steeper than
-20dB / decade, the phase margin sometimes can be
inadequate. This is when a small CFF capacitor may offer
some help. This CFF capacitor is connected between the
VOUTS and FB pins and is in parallel with the 60.4kΩ
internal upper feedback resistor. The CFF, together with the
upper and lower feedback resistors, form a lead
compensation network that inserts a "Zero" in the loop at a
frequency followed by a "Pole" at a higher frequency. This
gives the loop a phase boost mainly between the Zero and
Pole frequencies.
CFF, in conjunction with the upper 60.4k feedback resistor
located inside the module, creates a feedback “Zero” (Fz).
1
Fz = -------------------------------------------------2 60400 C FF
1.0
10.0
100.0
Frequency (Hz)
Figure 28: CFF Phase Boost vs.
Frequency Fzero Normalized to 1
As a starting point, calculate CFF from the following
equation, where FCO is the crossover frequency.
1
C FF = -------------------------------------------------2 60400 F CO
Since the addition of a CFF also brings about a gain boost,
the final crossover frequency will increase somewhat. So it
may take several iterations to achieve the highest phase
margin.
Enabling the Channels
This added zero makes it easier for high frequency signals
to pass from the output back to the FB pin which helps
boost the loop’s phase margin.
The "Pole" in the lead compensation network can be
calculated as:
60400 + R FB
Fp = -----------------------------------------------------------2 60400 R FB C FF
For maximum effect, CFF should be selected to place the
peak of the phase boost right at the crossover frequency.
Figure 28 shows the available phase boost normalized to
the Fz frequency of 1.
9/19/19
5.0V, Fp = 8.32Hz
3.3V, Fp = 5.54Hz
2.5V, Fp =4.16Hz
1.8V, Fp = 3.06Hz
1.5V, Fp = 2.5Hz
1.2V, Fp = 2.0Hz
1.0V, Fp = 1.67Hz
The RUN1 and RUN2 pins enable and disable the
module’s two channels. If either channel is activated using
a run pin, then INTVCC is activated. The typical enable
threshold of the RUN pins is 1.25V, with a hysteresis of
150mV and a maximum of 1.4V. For 5V operation, they can
be pulled up to VIN. For higher than 5V operation, a 10kΩ
to 100kΩ resistor and 5V Zener diode can be used to
enable the channels.
Alternately, the RUN pins can be left floating and the
channels will turn on upon application of VIN. For output
voltage sequencing applications, the RUN pins can be
connected to another channel’s or device’s PGOOD pins.
When using paralleled mode, connect the RUN pins
together and use a single control. See Figure 20.
074DSR03
21
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Input RMS Ripple Current Cancellation
INTVCC and EXTVCC
Temperature Monitoring (TEMP)
The VIN input voltage powers an internal 5V low dropout
regulator. The regulator output (INTVCC) provides voltage
to the control circuitry of the module. Alternatively, the
EXTVCC pin allows an external 5V supply to be used to
eliminate the 5V LDO power dissipation in power sensitive
applications.
An internal temperature sensing diode / PNP transistor is
used to monitor its VBE voltage over temperature, thus
serving as a temperature monitor. Its forward voltage and
temperature coefficient are shown in the electrical
characteristics section and plotted in Figure 29. It is
connected to VIN through a pullup resistor RTEMP to limit
the current to 100μA. It is recommended to set a 60µA
minimum current in applications where VIN varies over a
wide range. See Figure 30 for an example on how to use
this feature.
For output voltages ≤3.3V, the MxL7213’s differential
remote sense amplifier can be used to accurately sense
voltages at the load. This is particularly useful in high
current load conditions. The DIFFP and DIFFN pins must
be connected properly to the remote load point, and the
DIFFOUT pin must be connected to the corresponding
VOUTS1 or VOUTS2 pin.
SW Pins
0.80
I = 100μA
0.75
0.70
0.65
V TEMP (V)
Differential Remote Sense Amplifier
0.60
0.55
0.50
0.45
Use the SW pins to monitor the switching node of each
channel. These pins are generally used for testing or
monitoring. During normal operation, these pins should be
unconnected and left floating. However, in conjunction with
an external series R-C snubber circuit, these pins can be
used to dampen ringing on the switch node which may be
caused by LC parasitics in the switched current paths.
0.40
0.35
0.30
-60
-40
0
20
40
60
80
100
120
140
Temperature (ࣙC)
Figure 29: Diode Voltage vs. Temperature
INTVCC
VIN – 0.6V VIN
RTEMP =
100μA
RTEMP
CVCC
4.7μF
INTVCC
RPGOOD
5k
A/D
PGOOD
VIN
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VOUT1
VIN
CIN
R1
10k
Optional
D1
5.1V Zener
Optional
-20
TRACK1
CSS
0.1μF
INTVCC
TEMP
VOUTS1
RUN1
SW1
RUN2
VFB1
TRACK1
VFB2
TRACK2
COMP1
MxL7213
FSET
COUT1
RFB
8.25k
COMP2
VOUTS2
PHASMD
VOUT2
COUT2
SW2
SGND
GND
DIFFP
PGOOD2
DIFFN DIFFOUT
VOUT
5V 26A
PGOOD
Figure 30: 2-Phase, 5V at 26A with Temperature Monitoring
9/19/19
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Fault Protection
Thermal Considerations and Output
Current Derating
The MxL7213 modules support overcurrent, output
overvoltage, and overtemperature protection.
The overcurrent triggers at a nominal load of 20A.
Overcurrent during four consecutive switching cycles
initiates a hiccup mode. During hiccup, the high-side and
low-side MOSFETs are turned off for 100ms. A soft start is
attempted following the hiccup. If the overcurrent persists,
the hiccup will continue.
The overvoltage triggers when the output voltage is 10%
above set-point and the high-side MOSFET is kept off while
the low-side MOSFET turns on, clamping the output
voltage.
The overtemperature triggers at 145°C and turns off the
two MOSFETs. When the temperature cools down below
130°C, the module soft-starts.
A fuse or circuit breaker should be selected to limit the
current to the regulator during overvoltage in case of an
internal top MOSFET fault. If the internal top MOSFET fails,
then turning it off will not resolve the overvoltage, thus the
internal bottom MOSFET will turn on indefinitely trying to
protect the load. Under this fault condition, the input voltage
will source very large currents to ground through the failed
internal top MOSFET and enabled internal bottom
MOSFET. This can cause excessive heat and board
damage depending on how much power the input voltage
can deliver to this system. A fuse or circuit breaker can be
used as a secondary fault protector in this situation.
9/19/19
Input RMS Ripple Current Cancellation
The design of the MxL7213 module removes heat from the
bottom side of the package effectively. Thermal resistance
from the bottom substrate material to the printed circuit
board is very low.
Proper thermal design is critical in controlling device
temperatures and in achieving robust designs. There are
many factors that affect the thermal performance. One key
factor is the temperature rise of the devices in the package,
which is a function of the thermal resistances of the devices
inside the package and the power being dissipated. The
thermal resistances of the MxL7213 are shown in the
“Operating Ratings” section of this datasheet. The JEDEC
ѲJA thermal resistance provided is based on tests that
comply with the JESD51-2A “Integrated Circuit Thermal
Test Method Environmental Conditions – Natural
Convection” standard. JESD51 is a group of standards
whose intent is to provide comparative data based on a
standard test condition which includes a defined board
construction. Since the actual board design in the final
application will be different from the board defined in the
standard, the thermal resistances in the final design may
be different from those shown.
Figure 33, Figure 34, Figure 36, Figure 37 and Figure 39
show output current derating versus ambient temperature
for various VIN and VOUT (VIN / VOUT) ratios with 0, 200,
and 400 LFM of airflow. The total package power
dissipation (PPKG) is dependent on the final application and
is the sum of the losses for the two channels. The power
losses for a channel will depend mainly on the input
voltage, output voltage, and output current. Figure 32,
Figure 35 and Figure 38 show the power losses for input
voltages of 5V and 12V and for VOUT voltages of 1V, 2.5V,
and 5.0V respectively (VIN / VOUT).
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Input RMS Ripple Current Cancellation
Power Derating
JUNCTION-TO-AMBIENT RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION
JUNCTION-TO-CASE CASE (BOTTOM)-TO-BOARD
(BOTTOM) RESISTANCE
RESISTANCE
AMBIENT
BOARD-TO-AMBIENT
RESISTANCE
Figure 31: Graphical Representation of Thermal Coefficients
Table 7: ѲJA and Derating Curves Corresponding to 1.0V Output
Derating Curve
VIN (V)
Power Loss Curve
Airflow (LFM)
LGA θJA (ᵒC/W)
BGA θJA (ᵒC/W)
Figure 33, Figure 34
5, 12
Figure 32
0
7
7
Figure 33, Figure 34
5, 12
Figure 32
200
5.5
5.5
Figure 33, Figure 34
5, 12
Figure 32
400
5
5
Table 8: ѲJA and Derating Curves Corresponding to 2.5V Output
Derating Curve
VIN (V)
Power Loss Curve
Airflow (LFM)
LGA θJA (ᵒC/W)
BGA θJA (ᵒC/W)
Figure 36, Figure 37
5, 12
Figure 35
0
7
7
Figure 36, Figure 37
5, 12
Figure 35
200
6
6
Figure 36, Figure 37
5, 12
Figure 35
400
4.5
4.5
LGA θJA (ᵒC/W)
BGA θJA (ᵒC/W)
Table 9: ѲJA and Derating Curves Corresponding to 5V Output
Derating Curve
VIN (V)
Power Loss Curve
Airflow (LFM)
Figure 39
12
Figure 38
0
7
7
Figure 39
12
Figure 38
200
6
6
Figure 39
12
Figure 38
400
4.5
4.5
9/19/19
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Input RMS Ripple Current Cancellation
7
12V to 1V
5V to 1V
Load Current (A)
Power Loss (W)
6
5
4
3
2
1
0
2
4
6
8
10
12
14
16
18
20
22
24
26
24
22
20
18
16
14
12
10
8
6
4
2
0
26
400 LFM
200 LFM
0 LFM
0
20
Load Current (A)
100
120
Figure 33: Current Derating, VIN = 5V, VOUT = 1.0V
12V to 2.5V
6
5V to 2.5V
Power Loss (W)
Load Current (A)
80
7
26
24
22
20
18
16
14
12
10
8
6
4
2
0
400 LFM
200 LFM
20
5
4
3
2
1
0 LFM
0
40
60
80
100
0
120
2
Ambient Temperature (°C)
6
8
10
12
14
16
18
20
22
24
26
Figure 35: Power Loss, VOUT = 2.5V
30
25
25
Load Current (A)
30
20
15
10
400 LFM
5
4
Load Current (A)
Figure 34: Current Derating, VIN = 12V, VOUT = 1.0V
Load Current (A)
60
Ambient Temperature (°C)
Figure 32: Power Loss, VOUT = 1.0V
200 LFM
20
15
10
400 LFM
200 LFM
5
0 LFM
0 LFM
0
0
0
20
40
60
80
100
120
0
Ambient Temperature (°C)
Figure 36: Current Derating, VIN = 5V, VOUT = 2.5V
9/19/19
40
20
40
60
80
100
120
Ambient Temperature (°C)
Figure 37: Current Derating, VIN = 12V, VOUT = 2.5V
074DSR03
25
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Input RMS Ripple Current Cancellation
6
30
12V to 5V
25
Load Current (A)
Power Loss (W)
5
4
3
2
1
20
15
10
400 LFM
5
200 LFM
0 LFM
0
0
2
4
6
8
10
12
14
16
18
20
22
24
26
20
40
60
80
100
120
Ambient Temperature (°C)
Load Current (A)
Figure 38: Power Loss, VOUT = 5V
9/19/19
0
Figure 39: Current Derating, VIN = 12V, VOUT = 5V
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Input RMS Ripple Current Cancellation
Table 10: Capacitors Used for Output Voltage Response Matrix
Vendor
Value
Part Number
ESR (mΩ)
Murata, COUT1 Ceramic
100µF, 6.3V
GRM32ER60J107ME20L
~2
Taiyo Yuden, COUT1 Ceramic
100µF, 6.3V
JMK325BJ107MY
~2
Panasonic POSCAP, COUT2
470µF, 6.3V
6TPF470MAH
10
Panasonic POSCAP, COUT2
220µF, 6.3V
6TPF220ML
12
Panasonic POSCAP, COUT2
220µF, 2.5V
2R5TPE220M9
9
Panasonic POSCAP, COUT2
100µF, 6.3V
6TPE100MI
18
Nichicon, CIN Bulk
150µF, 25V
UCD1E151MNL1GS
Table 11: Output Voltage Response vs. Component Matrix
VOUT
(V)
CIN
(µF)
1
1
CIN(1)
COUT1
COUT2
P-P
DEVIATION
at 6A
LOAD
STEP
(mV)
Recovery
Time
(µs)
LOAD
STEP
(A/µs)
RFB
(kΩ)
FREQ
(kHz)
27
54
15
6
90.9
400
26
56
15
6
90.9
400
(µF)
(µF)
(BULK)
(µF)
CFF
(pF)
VIN
(V)
DROOP
(mV)
3 x 22
150
100
2 x 470
180
5
3 x 22
150
100
2 x 470
180
12
(CERAMIC)
(BULK)
(CERAMIC)
1
3 x 22
150
3 x 100
470
180
12
40
81
17
6
90.9
400
1.2
3 x 22
150
3 x 100
470
180
12
39
79
15
6
60.4
500
1.2
3 x 22
150
100
2 x 470
180
5
28
57
16
6
60.4
500
1.2
3 x 22
150
100
2 x 470
180
12
28
56
16
6
60.4
500
1.5
3 x 22
150
100
2 x 470
180
5
26
53
21
6
40.2
550
1.5
3 x 22
150
100
2 x 470
180
12
25
52
21
6
40.2
550
1.5
3 x 22
150
100
220
100
12
51
104
22
6
40.2
550
1.8
3 x 22
150
100
220
47
12
51
106
14
6
30.2
600
47
1.8
3 x 22
150
100
220
2.5
3 x 22
150
100
220
2.5
3 x 22
150
3 x 100
3.3
3 x 22
150
100
100
5
54
110
14
6
30.2
600
12
47
100
20
6
19.1
650
62
12
73
155
25
6
19.1
650
47
12
65
134
20
6
13.3
700
3.3
3 x 22
150
2 x 100
47
12
96
198
25
6
13.3
700
5
3 x 22
150
100
22
12
172
356
25
6
8.25
750
5
3 x 22
150
12
126
260
15
6
8.25
750
100
1. Bulk capacitance is optional if VIN has very low input impedance.
9/19/19
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Layout Guidelines and Example
Layout Guidelines and Example
The MxL7213’s high level of integration simplifies PCB
board design. However, some layout considerations are
still recommended for optimal electrical and thermal
performance.
■
■
■
■
■
■
Use large PCB copper areas for high current paths,
including VIN, VOUT1 and VOUT2 and GND to
minimize conduction loss and thermal stress in the
PCB.
Use a dedicated power ground layer, placed under the
MxL7213.
■
Use a separated SGND ground copper area for
components that are connected to the signal pins. The
SGND to GND should be connected underneath the
module.
Place high frequency ceramic input and output
capacitors next to the VIN, VOUT and PGND pins to
minimize high frequency noise.
When paralleling modules, connect the VFB, VOUT
and COMP pins together closely with an internal layer.
For soft-start mode, the TRACK pins may be tied
together via a common capacitor.
Use multiple vias to interconnect the top layer and
other power layers to minimize via conduction loss and
module thermal stress.
■
Cap or plate over any vias that are directly placed on
the pad.
An example layout for the top PCB layer is recommended
for both LGA and BGA packages in Figure 40.
Test points can be brought out for monitoring the signal
pins.
LGA
BGA
CIN2
CIN1
CIN1
CIN2
VIN
VIN
M
GND
M
L
L
K
K
GND
J
GND
H
H
G
COUT1
GND
J
G
SGND
F
COUT2
E
COUT1
COUT2
E
D
D
C
C
B
B
A
SGND
F
A
1
2
3
4
5
VOUT1
6
7
8
9
GND
CNTRL
10
11
12
1
VOUT2
2
3
4
5
VOUT1
CNTRL
6
7
8
9
GND
CNTRL
10
11
12
VOUT2
CNTRL
Figure 40: Recommended PCB Layout
9/19/19
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Mechanical Dimensions
Mechanical Dimensions
15mm x 15mm x 4.41mm LGA
TOP VIEW
BOTTOM VIEW
SIDE VIEW
PAD LOCATION
TERMINAL DETAILS
Drawing No.: POD-00000083
Revision: B
Figure 41: Mechanical Dimensions, LGA
9/19/19
074DSR03
29
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Recommended Land Pattern and Stencil
Recommended Land Pattern and Stencil
15mm x 15mm x 4.41mm LGA
∅
TYPICAL RECOMMENDED LAND PATTERN
∅
TYPICAL RECOMMENDED STENCIL
Drawing No.: POD-00000083
Revision: B
Figure 42: Recommended Land Pattern and Stencil, LGA
9/19/19
074DSR03
30
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Mechanical Dimensions
Mechanical Dimensions
15mm x 15mm x 5.01mm BGA
TOP VIEW
BOTTOM VIEW
SIDE VIEW
TERMINAL DETAILS
PAD LOCATION
Drawing No.: POD-00000084
Revision: B
Figure 43: Mechanical Dimensions, BGA
9/19/19
074DSR03
31
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Recommended Land Pattern and Stencil
Recommended Land Pattern and Stencil
15mm x 15mm x 5.01mm BGA
∅
TYPICAL RECOMMENDED LAND PATTERN
∅
TYPICAL RECOMMENDED STENCIL
Drawing No.: POD-00000084
Revision: B
Figure 44: Recommended Land Pattern and Stencil, BGA
9/19/19
074DSR03
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MxL7213 Dual 13A or Single 26A Power Module Data Sheet
MxL7213 Component Pinout
MxL7213 Component Pinout
Table 12: MxL7213 Component Pinout
Pin ID
Function
Pin ID
Function
Pin ID
Function
Pin ID
Function
Pin ID
Function
Pin ID
Function
A1
VOUT1
B1
VOUT1
C1
VOUT1
D1
GND
E1
GND
F1
GND
A2
VOUT1
B2
VOUT1
C2
VOUT1
D2
GND
E2
GND
F2
GND
A3
VOUT1
B3
VOUT1
C3
VOUT1
D3
GND
E3
GND
F3
GND
A4
VOUT1
B4
VOUT1
C4
VOUT1
D4
GND
E4
GND
F4
MODE_PLLIN
A5
VOUT1
B5
VOUT1
C5
VOUTS1
D5
VFB1
E5
TRACK1
F5
RUN1
A6
GND
B6
GND
C6
FSET
D6
SGND
E6
COMP1
F6
SGND
A7
GND
B7
GND
C7
SGND
D7
VFB2
E7
COMP2
F7
SGND
A8
VOUT2
B8
VOUT2
C8
VOUTS2
D8
TRACK2
E8
DIFFP
F8
DIFFOUT
A9
VOUT2
B9
VOUT2
C9
VOUT2
D9
GND
E9
DIFFN
F9
RUN2
A10
VOUT2
B10
VOUT2
C10
VOUT2
D10
GND
E10
GND
F10
GND
A11
VOUT2
B11
VOUT2
C11
VOUT2
D11
GND
E11
GND
F11
GND
A12
VOUT2
B12
VOUT2
C12
VOUT2
D12
GND
E12
GND
F12
GND
G1
GND
H1
GND
J1
GND
K1
GND
L1
GND
M1
GND
G2
SW1
H2
GND
J2
VIN
K2
VIN
L2
VIN
M2
VIN
G3
GND
H3
GND
J3
VIN
K3
VIN
L3
VIN
M3
VIN
G4
PHASMD
H4
GND
J4
VIN
K4
VIN
L4
VIN
M4
VIN
G5
CLKOUT
H5
GND
J5
GND
K5
GND
L5
VIN
M5
VIN
G6
SGND
H6
GND
J6
TEMP
K6
GND
L6
VIN
M6
VIN
G7
SGND
H7
GND
J7
EXTVCC
K7
GND
L7
VIN
M7
VIN
G8
PGOOD2
H8
INTVCC
J8
GND
K8
GND
L8
VIN
M8
VIN
G9
PGOOD1
H9
GND
J9
VIN
K9
VIN
L9
VIN
M9
VIN
G10
GND
H10
GND
J10
VIN
K10
VIN
L10
VIN
M10
VIN
G11
SW2
H11
GND
J11
VIN
K11
VIN
L11
VIN
M11
VIN
G12
GND
H12
GND
J12
GND
K12
GND
L12
GND
M12
GND
9/19/19
074DSR03
33
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Ordering Information
Ordering Information
Table 13: Ordering Information(1)
Ordering Part Number
MxL7213-AYA-T
MxL7213-ABA-T
Operating Temperature Range
-40°C ≤ TJ ≤ 125°C
MSL Rating
3
Lead-Free
Yes(2)
Package
LGA144 15x15
BGA144 15x15
MxL7213-EVK-1
MxL7213 LGA Power Module Dual-Phase EVK
MxL7213-EVK-3
MxL7213 BGA Power Module Dual-Phase EVK
Packaging Method
Tray
1. Refer to www.maxlinear.com/MxL7213 for most up-to-date Ordering Information.
2. Visit www.maxlinear.com for additional information on Environmental Rating.
9/19/19
074DSR03
34
MxL7213 Dual 13A or Single 26A Power Module Data Sheet
Disclaimer
MaxLinear, Inc.
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www.maxlinear.com
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