MxL7225 / MxL7225-1
Data Sheet
Dual 25A or Single 50A Power Module
General Description
Features
The MxL7225 is a dual channel, 25A step-down power
module. It includes a wide 4.5V to 15V input voltage range
and supports two outputs each with an output voltage range
of 0.6V to 1.8V, set by a single external resistor. The
MxL7225 requires only a few input and output capacitors,
which simplifies design and shortens time-to-market. The
module supplies either two 25A outputs, a single 50A output
or up to 300A when paralleled with additional MxL7225
modules. A unique package design where inductors are
mounted externally provides improved thermal performance
and lower cost relative to devices with the same industry
standard pinout.
■
■
■
■
Dual 25A or single 50A output
■
■
■
Frequency synchronization
The complete switch mode DC/DC power supply integrates
the control, drivers, bootstrap diodes, bootstrap capacitors,
inductors, MOSFETs and HF bypass capacitors in a single
package for point-of-load conversions.
■
■
■
■
Adjustable switching frequency (400kHz to 780kHz)
■
Thermally enhanced 16mm x 16mm x 5.01mm BGA
package
The MxL7225 includes a temperature diode that enables
device temperature monitoring. It also has an adjustable
switching frequency and utilizes a peak current mode
architecture which allows fast line and load transient
response.
■
■
■
The MxL7225 is available in a space saving 16mm x 16mm x
5.01mm RoHS compliant BGA package.
The MxL7225-1 is identical to the MxL7225 except that there
are no internal feedback loop compensation components.
When more flexibility is desired in dealing with loop
characteristics, the MxL7225-1 allows the system designer to
use an external compensation network entirely different from
that embedded in the MxL7225.
INTVCC
Output voltage range: 0.6V to 1.8V
Multiphase current sharing with multiple MxL7225s
for up to 300A output
Differential remote sense amplifier
Peak current mode architecture for fast transient
response
Overcurrent protection
Output overvoltage protection
Internal temperature monitor and thermal shutdown
protection
Applications
A host of protection features, including overcurrent, overtemperature, output overvoltage and UVLO, help this module
achieve safe operation under abnormal operating conditions.
Typical Application
Input voltage range: 4.5V to 15V
Telecom and Networking Equipment
Industrial Equipment
Test Equipment
Ordering Information - page 35
95
INTVCC
CVCC
4.7μF
RPGOOD
10k
90
VIN
4.5V to 15V
CIN
RTEMP
CSS
0.1μF
121k
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VOUT1
VIN
VOUTS1
TEMP
RUN1
DIFFOUT
RUN2
SW1
TRACK1
VFB1
TRACK2
VFB2
COMP1
fSET
MxL7225
COMP2
PHASMD
MxL7225-1
VOUTS2
VOUT2
SW2
PGOOD2
SGND
GND
DIFFP DIFFN
Efficiency (%)
PGOOD
COUT1
CFF
RFB
60.4k
VOUT
1.2V 50A
PGOOD
COUT2
TBD
80
75
fSW = 500kHz
70
MxL7225-1
ONLY
RC
CC
Figure 1: Typical Application: 50A, 1.2V Output DC/DC Power Module
• www.maxlinear.com• 201DSR04
85
VIN = 5V
VIN = 12V
65
0
10
20
30
40
Load Current (A)
Figure 2: 1.2VOUT Efficiency vs IOUT
50
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Revision History
Revision History
Document No.
Release Date
Change Description
201DSR04
June 9, 2021
Updated:
■ "Mechanical Dimensions, BGA" figure.
■ "Recommended Land Pattern and Stencil, BGA" figure.
■ Disclaimer text.
201DSR03
June 9, 2021
9/29/20
■ Initial release.
201DSR04
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Table of Contents
Table of Contents
General Description ..............................................................................................................................................................i
Features..................................................................................................................................................................................i
Applications ...........................................................................................................................................................................i
Typical Application ................................................................................................................................................................i
Specifications .......................................................................................................................................................................1
Absolute Maximum Ratings...........................................................................................................................................1
ESD Ratings ..................................................................................................................................................................1
Operating Conditions.....................................................................................................................................................2
Electrical Characteristics ...............................................................................................................................................3
Pin Information .....................................................................................................................................................................6
Pin Configuration ...........................................................................................................................................................6
Pin Description ..............................................................................................................................................................6
Typical Performance Characteristics .................................................................................................................................9
Efficiency .......................................................................................................................................................................9
Load Transient Response, Dual Phase, Single Output ...............................................................................................10
Start-Up, Single Phase ................................................................................................................................................11
Short Circuit Protection, Single Phase ........................................................................................................................11
Functional Block Diagrams ...............................................................................................................................................12
Operation.............................................................................................................................................................................14
Power Module Description ..........................................................................................................................................14
Applications Information ...................................................................................................................................................14
Typical Application Circuit ...........................................................................................................................................14
VIN to VOUT Step-Down Ratios....................................................................................................................................14
Output Voltage Programming ......................................................................................................................................16
Input Capacitors ..........................................................................................................................................................16
Output Capacitors .......................................................................................................................................................16
Pulse-Skipping Mode Operation..................................................................................................................................16
Forced Continuous Operation .....................................................................................................................................16
Multiphase Operation ..................................................................................................................................................16
Input Ripple Current Cancellation ...............................................................................................................................19
Frequency Selection and Phase-Locked Loop............................................................................................................19
Minimum On-Time .......................................................................................................................................................20
Soft-Start and Output Voltage Tracking ......................................................................................................................20
Power Good ................................................................................................................................................................21
Stability and Compensation.........................................................................................................................................21
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Table of Contents
Enabling Channels ......................................................................................................................................................22
INTVCC and EXTVCC...................................................................................................................................................23
Differential Remote Sense Amplifier............................................................................................................................23
SW Pins.......................................................................................................................................................................23
Temperature Monitoring (TEMP).................................................................................................................................23
Fault Protection ...........................................................................................................................................................25
Thermal Considerations and Output Current Derating ................................................................................................25
Power Derating............................................................................................................................................................26
Layout Guidelines and Example..................................................................................................................................30
Mechanical Dimensions.....................................................................................................................................................32
16mm x 16mm x 5.01mm BGA ...................................................................................................................................32
Recommended Land Pattern and Stencil.........................................................................................................................33
16mm x 16mm x 5.01mm BGA ...................................................................................................................................33
Module Pinout.....................................................................................................................................................................34
Ordering Information..........................................................................................................................................................35
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
List of Figures
List of Figures
Figure 1: Typical Application: 50A, 1.2V Output DC/DC Power Module ................................................................................. i
Figure 2: 1.2VOUT Efficiency vs IOUT ....................................................................................................................................... i
Figure 3: Pin Configuration.....................................................................................................................................................6
Figure 4: Efficiency: Single Phase, VIN = 5V ..........................................................................................................................9
Figure 5: Efficiency: Single Phase, VIN = 12V ........................................................................................................................9
Figure 6: Efficiency: Dual Phase, VIN = 12V...........................................................................................................................9
Figure 7: Efficiency: Pulse-Skipping Mode, VIN = 12V, VOUT = 1.2V, 500kHz .......................................................................9
Figure 8: 12V to 1V, 500kHz, 12.5A Load Step, 10A/µs Step-Up and Step-Down ..............................................................10
Figure 9: 12V to 1.2V, 500 kHz, 12.5A Load Step,10A/µs Step-Up and Step-Down ...........................................................10
Figure 10: 12V to 1.5V, 600kHz, 12.5A Load Step,10A/µs Step-Up and Step-Down ..........................................................10
Figure 11: 12V to 1.8V, 600kHz, 12.5A Load Step, 10A/µs Step-Up and Step-Down .........................................................10
Figure 12: No Load, 12V to 1.2V, 500kHz............................................................................................................................11
Figure 13: 25 A, 12V to 1.2V, 500kHz ..................................................................................................................................11
Figure 14: No Load, 12V to 1.2V, 500kHz............................................................................................................................11
Figure 15: 25 A, 12V to 1.2V, 500kHz ..................................................................................................................................11
Figure 16: MxL7225 Functional Block Diagram....................................................................................................................12
Figure 17: MxL7225-1 Functional Block Diagram ................................................................................................................13
Figure 18: Typical 4.5VIN to 15VIN, 1.5V and 1.2V at 25A Outputs, MxL7225.....................................................................15
Figure 19: Typical 4.5VIN to 15VIN, 1.5V and 1.2V at 25A Outputs, MxL7225-1..................................................................15
Figure 20: MxL7225 2-Module, 4-Phase, 1.2V, 100A Regulator..........................................................................................17
Figure 21: 4-Phase Parallel Configuration............................................................................................................................18
Figure 22: Examples of 2-Phase, 4-Phase and 6-Phase Operation with PHASMD Table...................................................18
Figure 23: Input RMS Current to DC Load Current Ratio as a Function of Duty Cycle........................................................19
Figure 24: Operating Frequency vs. fSET Pin Voltage ..........................................................................................................20
Figure 25: VOUT and VTRACK versus Time ...........................................................................................................................20
Figure 26: Example of Output Tracking Application Circuit ..................................................................................................21
Figure 27: Output Coincident Tracking Waveform ...............................................................................................................21
Figure 28: RUNx Pin Driven by a Logic Signal.....................................................................................................................22
Figure 29: Self-Start for VIN Range of 5.5V to 15V ..............................................................................................................22
Figure 30: Self-Start for VIN Range of 4.5V to 5.5V .............................................................................................................22
Figure 31: Diode Voltage vs. Temperature...........................................................................................................................23
Figure 32: 2-Phase, 1V at 50A with Temperature Monitoring ..............................................................................................24
Figure 33: Thermal Image 12V to 1V, 50A with No Air Flow ................................................................................................25
Figure 34: Current Derating Curves Measurement Setup ....................................................................................................26
Figure 35: Two-Phase Single Output Configuration .............................................................................................................27
Figure 36: Recommended PCB Layout................................................................................................................................30
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
List of Figures
Figure 37: 0.9V Output Power Loss .....................................................................................................................................31
Figure 38: 1.5V Output Power Loss .....................................................................................................................................31
Figure 39: 12V to 1.5V Current Derating ..............................................................................................................................31
Figure 40: 12V to 0.9V Current Derating ..............................................................................................................................31
Figure 41: 5V to 1.5V Current Derating ................................................................................................................................31
Figure 42: 5V to 0.9V Current Derating ................................................................................................................................31
Figure 43: Mechanical Dimensions, BGA.............................................................................................................................32
Figure 44: Recommended Land Pattern and Stencil, BGA ..................................................................................................33
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
List of Tables
List of Tables
Table 1: Absolute Maximum Ratings......................................................................................................................................1
Table 2: ESD Ratings .............................................................................................................................................................1
Table 3: Operating Conditions................................................................................................................................................2
Table 4: Electrical Characteristics ..........................................................................................................................................3
Table 5: Pin Description .........................................................................................................................................................6
Table 6: VFB Resistor Table vs. Various Output Voltages....................................................................................................16
Table 7: MxL7225 Load Step Response vs. Components, 2-Phase, 1 Output ...................................................................28
Table 8: MxL7225-1 Load Step Response vs. Components, 2-Phase, 1 Output ................................................................29
Table 9: Module Pinout.........................................................................................................................................................34
Table 10: Ordering Information.............................................................................................................................................35
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Specifications
Specifications
Absolute Maximum Ratings
Important: Stress above what is listed in Table 1 may cause permanent damage to the device. This is a stress rating
only—functional operation of the device above what is listed in Table 1 or any other conditions beyond what MaxLinear
recommends is not implied. Exposure to conditions above what is listed in Table 3 for extended periods of time may affect
device reliability. Solder reflow profile is specified in the IPC/JEDEC J-STD-020C standard.
Table 1: Absolute Maximum Ratings
Parameter
Minimum
Maximum
Units
-0.3
18
V
-1
25
V
PGOOD1, PGOOD2, COMP1, COMP2
-0.3
6
V
INTVCC, EXTVCC
VIN
VSW1, VSW2
-0.3
6
V
MODE/PLLIN, fSET, TRACK1, TRACK2
-0.3
INTVCC
V
DIFFOUT
-0.3
INTVCC - 1.1V
V
PHASMD
-0.3
INTVCC
V
VOUT1, VOUT2, VOUTS1, VOUTS2
-0.3
6
V
DIFFP, DIFFN
-0.3
INTVCC
V
RUN1, RUN2, VFB1, VFB2
-0.3
INTVCC
V
100
mA
150
°C
245
°C
INTVCC Peak Output Current
Storage Temperature Range
-65
Peak Package Body Temperature
ESD Ratings
Table 2: ESD Ratings
Parameter
Limit
HBM (Human Body Model)
CDM (Charged Device Model)
June 9, 2021
201DSR04
Units
2k
V
500
V
1
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Operating Conditions
Operating Conditions
Table 3: Operating Conditions
Parameter
Minimum
Maximum
Units
VIN
4.5
15
V
INTVCC
4.5
5.5
V
EXTVCC
4.7
5.5
V
PGOOD
0
5.5
V
Switching Frequency
400
780
kHz
Junction Temperature Range (TJ)
-40
125
°C
7
°C/W
Thermal Resistance from Junction to PCB (ѲJB)
1.5
°C/W
Thermal Resistance from Junction to Top of Module Case (ѲJCtop)
3.86
°C/W
Thermal Resistance from Junction to Ambient (ѲJA)
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Electrical Characteristics
Electrical Characteristics
Specifications are for Operating Junction Temperature of TJ = 25°C only; limits applying over the full Operating Junction
Temperature range are denoted by a "•". Typical values represent the most likely parametric norm at TJ = 25°C and are
provided for reference purposes only. Unless otherwise indicated, VIN = 12V and VRUN1, VRUN2 = 5V. Per Figure 18 and
Figure 19.
Table 4: Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DC Specifications
VIN(DC)
VOUT1(RANGE)
VOUT2(RANGE)
Input DC voltage
Output DC range
VIN = 4.5V to 15V
•
4.5
15
V
•
0.6
1.8
V
•
1.182
1.2
1.218
V
1.10
1.25
1.40
V
CIN = 22 µF x 3
VOUT1 (DC)
VOUT2 (DC)
VOUT total variation
with line and load
COUT = 100µF x 2 Ceramic, 470µF
POSCAP,
MODE_PLLIN = GND
VIN = 12V, VOUT = 1.2V, IOUT = 0A to 25A
Input Specifications
VRUN1, VRUN2
RUN pin on/off
threshold
VRUN1HYS, VRUN2HYS
RUN pin ON
hysteresis
IINRUSH(VIN)
Input inrush current at
start-up
IQ(VIN)
IS(VIN)
Input supply bias
current
Input supply current
RUN rising
168
mV
1
A
VIN = 12V, VOUT1 = VOUT2 = 1.2V,
pulse-skipping mode
4.95
mA
VIN = 12V, VOUT1 = VOUT2 = 1.2V,
500kHz CCM
160
mA
Shutdown, RUN = 0, VIN = 12V
56
µA
VIN = 4.5V, VOUT = 1.2V, IOUT = 25A
7.9
A
VIN = 12V, VOUT = 1.2V, IOUT = 25A
2.9
A
IOUT = 0A, CIN = 3 x 22µF, CSS = 0.01µF,
COUT = 3 x 100µF, VOUT1 = 1.5V,
VOUT2 = 1.5V, VIN = 12V
Output Specifications
IOUT1(DC), IOUT2(DC)
Output continuous
current range(1)
VIN = 12V, VOUT = 1.2V
∆VOUT1(LINE)/VOUT1
∆VOUT2(LINE)/VOUT2
Line regulation
accuracy
VOUT = 1.2V, VIN from 4.5V to 15V
IOUT = 0A for each output
•
∆VOUT1(LOAD)/VOUT1
∆VOUT2(LOAD)/VOUT2
Load regulation
accuracy(1)
Each output; VOUT = 1.2V, 0A to 25A, VIN =
12V
•
VOUT1(AC), VOUT2(AC)
Output ripple voltage
For each output; IOUT = 0A,
COUT = 100µF x 3 / X7R / ceramic,
470µF POSCAP, VIN = 12V, VOUT = 1.2V,
frequency = 500kHz
22
mVPP
fS (each channel)
Output ripple voltage
frequency(2)
VIN = 12V, VOUT = 1.2V, fSET = 1.2V
500
kHz
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201DSR04
0
25
A
0.01
0.1
%/V
0.5
0.75
%
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Electrical Characteristics
Table 4: Electrical Characteristics (Continued)
Symbol
Parameter
fSYNC (each channel)
SYNC capture range
Conditions
Min
Typ
400
Max
Units
780
kHz
Turn-on overshoot
COUT = 100µF / X5R / ceramic, 470µF
POSCAP, VOUT = 1.2V, IOUT = 0A,
VIN = 12V
Each channel
0
mV
tSTART1, tSTART2
Turn-on time
COUT = 100µF / X5R / ceramic,
470µF POSCAP, No load,
TRACK/SS with 0.01µF to GND, VIN = 12V
Each channel
5
ms
∆VOUT(LS)
(Each channel)
Peak deviation for
dynamic load
Load: 0% to 50% to 0% of full load,
COUT = 22µF x3 Ceramic, 470µF POSCAP
VIN = 12V, VOUT = 1.5V
30
mV
tSETTLE
(Each channel)
Settling time for
dynamic load step
Load: 0% to 50% to 0% of full load,
VIN = 12V, COUT = 100µF, 470µF POSCAP
20
µs
Output current limit
VIN = 12V, VOUT = 1.2V
Each channel
35
A
VFB1, VFB2
Voltage at VFB pins
IOUT = 0A, VOUT = 1.2V
IFB
Current at VFB pins
VOVL
Feedback overvoltage
lockout
TRACK1 (I),
TRACK2 (I)
Track pin soft-start
pull-up current
UVLO
Undervoltage lockout
∆VOUT1START
∆VOUT2START
IOUT1(PK)
IOUT2(PK)
Control Section
•
•
TRACK1 (I), TRACK2 (I) start at 0V
0.594
0.600
0.606
V
–5
–20
nA
0.64
0.66
0.68
V
1
1.25
1.5
µA
VIN falling
3.6
V
VIN rising
4.2
V
UVLO hysteresis
tON(MIN)
Minimum on-time
RFBHI1, RFBHI2
Resistance between
VOUTS1, VOUTS2 and
VFB1, VFB2
Each output
VPGOOD1 LOW,
VPGOOD2 LOW
PGOOD voltage low
IPGOOD = 2mA
IPGOOD
PGOOD leakage
current
VPGOOD = 5V
VPGOOD
June 9, 2021
PGOOD trip level
60.05
0.6
V
90
ns
60.4
60.75
kΩ
34
300
mV
5
µA
VFB with respect to its steady state value
VFB ramping negative
–10
VFB with respect to its steady state value
VFB ramping positive
10
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Electrical Characteristics
Table 4: Electrical Characteristics (Continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VINTVCC
Internal VCC voltage
6V < VIN < 15V
4.8
5.0
5.2
V
VINTVCC
INTVCC load
regulation
ICC = 0mA to 50mA
1.05
2.00
%
VEXTVCC
EXTVCC switchover
voltage
EXTVCC ramping positive
VEXTVCC(DROP)
EXTVCC dropout
ICC = 20mA, VEXTVCC = 5V
VEXTVCC(HYST)
EXTVCC hysteresis
INTVCC Linear Regulator
load regulation
4.5
4.7
50
V
100
150
mV
mV
Oscillator and Phase-Locked Loop
Frequency nominal
Nominal frequency
fSET = 1.2V
Frequency low
Lowest frequency
fSET = 0.93V
400
kHz
Frequency high
Highest frequency
fSET > 2.4V, up to INTVCC
780
kHz
IFSET
Frequency set current
RMODE_PLLIN
MODE_PLLIN input
resistance
CLKOUT
Phase (relative to
SW1)
CLK high
Clock High output
voltage
CLK low
Clock Low output
voltage
450
9
500
10
550
11
kHz
µA
250
kΩ
PHASMD = GND
60
Deg
PHASMD = float
90
Deg
PHASMD = INTVCC
120
Deg
2
V
0.2
V
Differential Amplifier
AV
Gain
RIN
Input resistance
Measured at DIFFP Input
VOS
Input offset voltage
VDIFFP = VDIFFOUT = 1.5V, IDIFFOUT =
100µA
PSRR
Power Supply
Rejection Ratio
5V < VIN < 15V
ICL
Maximum Output
current
VDIFFOUT(MAX)
Maximum output
voltage
GBW
Gain Bandwidth
Product
2.7
MHz
VTEMP
Diode Connected PNP I = 100µA
0.6
V
TCVTEMP
Temperature
Coefficient
I = 25µA
–2.1
mV/°C
OT
Thermal shutdown
threshold
Rising temperature
145
°C
15
°C
V/V
82
kΩ
3
•
mV
90
dB
3
mA
INTVCC
- 1.4
IDIFFOUT = 300µA
Thermal hysteresis
1
V
1. See output current derating curves for different VIN, VOUT and TA.
2. The MxL7225 module is designed to operate from 400kHz to 780kHz.
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Pin Information
Pin Information
Pin Configuration
TEMP
EXTVCC
M
L
VIN
K
J
CLKOUT
SW1
H
INTVCC
SW2
PGOOD1
PGOOD2
RUN2
G
RUN1
PHASMD
MODE_PLLIN
TRACK1
VFB1
VOUTS1
SGND
F
DIFFOUT
DIFFP
DIFFN
COMP1 COMP2
GND
E
SGND VFB2 TRACK2
D
GND
fSET SGND VOUTS2
C
B
VOUT1
VOUT2
GND
A
1
2
3
4
5
6
7
8
9
10
11
12
BGA, Top View
144-Lead 16mm x 16mm x 5.01mm
Figure 3: Pin Configuration
Pin Description
Table 5: Pin Description
Pin Number
Pin Name
Description
A1, A2, A3, A4, A5,
B1, B2, B3, B4, B5,
C1, C2, C3, C4
VOUT1
Output of the channel 1 power stage. Connect the corresponding output load from the
VOUT1 pins to the PGND pins. Direct output decoupling capacitance from VOUT1 to PGND is
recommended.
A6, A7, B6, B7,
D1, D2, D3, D4,
D9, D10, D11, D12,
E1, E2, E3, E4,
E10, E11, E12,
F1, F2, F3,
F10, F11, F12,
G1, G3, G10, G12,
H1, H2, H3, H4, H5, H6,
H7, H9, H10, H11, H12,
J1, J5, J8, J12,
K1, K5, K6, K7, K8, K12,
L1, L12, M1, M12
GND
Ground for the power stage. Connect to the application’s power ground plane.
A8, A9, A10, A11, A12,
B8, B9, B10, B11, B12,
C9, C10, C11, C12
VOUT2
Output of the channel 2 power stage. Connect the corresponding output load from the
VOUT2 pins to the PGND pins. Direct output decoupling capacitance from VOUT2 to PGND is
recommended.
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Pin Description
Table 5: Pin Description (Continued)
Pin Number
Pin Name
Description
VOUTS1,
VOUTS2
These pins are connected internally to the top of the feedback resistor for each output.
Connect this pin directly to its specific output or to DIFFOUT when using the remote sense
amplifier. When paralleling modules, connect one of the VOUTS pins to DIFFOUT when
remote sensing or directly to VOUT when not remote sensing. These pins must be
connected to either DIFFOUT or VOUT. This connection provides the feedback path and
cannot be left open.
C6
fSET
This pin is used to set the operating frequency via one of two methods:
Connect a resistor from this pin to ground
Drive this pin with a DC voltage
This pin sources a 10µA current. See Figure 24 for frequency of operation vs. fSET voltage.
C7, D6, G6, G7, F6, F7
SGND
Ground pin for all analog signals and low power circuits. Connect to GND in one place. See
layout guidelines in Figure 36.
VFB1, VFB2
Feedback input to the negative side of the error amplifier for each channel. These pins are
each internally connected to VOUTS1 and VOUTS2 via a precision 60.4kΩ resistor. Vary each
output voltage by adding a feedback resistor from VFB to SGND. Tie VFB1 and VFB2
together for parallel operation.
TRACK1,
TRACK2
Soft-Start and Output Voltage Tracking pins. Each channel has a 1.25μA pull-up current
source. When one channel is configured as a master, adding a capacitor from this pin to
ground sets a soft-start ramp rate. The other channel can be set up as the slave and have
the master output applied through a voltage divider to the slave’s output TRACK pin. For
coincidental tracking, this voltage divider is equal to the slave’s output feedback divider.
E6, E7
COMP1,
COMP2
Current control threshold and error amplifier compensation point for each channel. The
current comparator threshold increases with this control voltage. The MxL7225 is internally
compensated, however a feed-forward CFF is frequently required. RC and CC are required
for MxL7225-1 (not MxL7225). Refer to Figure 18, Table 7 and Stability and Compensation
in the Applications Information section. When paralleling both channels, connect the
COMP1 and COMP2 pins together.
E8
DIFFP
This pin is the remote sense amplifier’s positive input and is connected to the output
voltage’s remote sense point. If the remote sense amplifier is not used, connect this pin to
SGND.
E9
DIFFN
This pin is the remote sense amplifier’s negative input and is connected to the remote
sense point GND. If the remote sense amplifier is not used, connect this pin to SGND.
C5, C8
D5, D7
E5, D8
F4
Selects between Forced Continuous Mode or Pulse-Skipping Mode, or connects to an
external clock for frequency synchronization. There are three connection options:
1. Connect this pin to SGND to force both channels into Forced Continuous Mode.
MODE_PLLIN
2. Connect this pin to INTVCC or leave it floating to enable Pulse-Skipping Mode.
3.
Connect this pin to an external clock. Both channels will be synchronized to the clock
and operate in Forced Continuous Mode.
F5, F9
RUN1, RUN2
The RUN1 and RUN2 pins each enable and disable their corresponding channel. A voltage
above 1.27V on the RUN pin will turn on the corresponding channel. The RUN pin has a
hysteresis of about 170mV.
There are two supported methods to drive the RUN pin. Either drive it with a logic signal or
connect it to a voltage divider whose upper resistor is connected to VIN and lower resistor to
ground. See Applications Information for important details.
F8
DIFFOUT
Output of the internal remote sense amplifier. If remote sensing on channel 1, connect to
VOUTS1. If remote sensing on channel 2, connect to VOUTS2. When paralleling modules,
connect one of the VOUTS pins to DIFFOUT when remote sensing.
G2, G11
SW1, SW2
Use these pins to access the switching node of each channel. An RC snubber can be
connected to reduce switch node ringing. Otherwise, leave these pins floating.
June 9, 2021
201DSR04
7
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Pin Description
Table 5: Pin Description (Continued)
Pin Number
G4
Pin Name
PHASMD
Description
This pin selects the CLKOUT phase as follows:
Connect to SGND for 60 degrees
Connect to INTVCC for 120 degrees
Leave floating for 90 degrees
G5
CLKOUT
This is the clock output. Its phase is set with the PHASMD pin. It is used to synchronize
multiple modules so that all channels evenly share load current and operate in a multiphase
manner. Refer to the Application Section on Multiphase Operation for more details.
G9, G8
PGOOD1,
PGOOD2
Power Good outputs. This open-drain output is pulled low when the VOUT of its respective
channel is more than ±10% outside regulation.
H8
INTVCC
Internal 5V Regulator Output. This voltage powers the control circuits and internal gate
driver. Decouple to GND with a 4.7μF ceramic capacitor. INTVCC is activated when either
RUN1 or RUN2 is activated.
TEMP
The internal temperature sensing diode monitors the temperature change with voltage
change on VBE. Connect to VIN through a resistor (RTEMP) to limit the current to 100µA.
RTEMP = (VIN - 0.6V) / 100μA
EXTVCC
External power input that is connected through an internal switch to INTVCC whenever
EXTVCC is > 4.7V. Do not exceed 6V on this input. Connect this pin to VIN when operating
VIN on 5V. An efficiency increase that is a function of (VIN - INTVCC) multiplied by the power
MOSFET driver current occurs when the feature is used. VIN must be applied before
EXTVCC, and EXTVCC must be removed before VIN.
J6
J7
M2, M3, M4, M5, M6, M7,
M8, M9, M10, M11,
L2, L3, L4, L5, L6, L7, L8,
VIN
L9, L10, L11,
J2, J3, J4, J9, J10, J11,
K2, K3, K4, K9, K10, K11
Power input pins. Connect input voltage between these pins and GND. Direct input
decoupling capacitance from VIN to GND is recommended.
1. Use test points to monitor signal pin connections.
June 9, 2021
201DSR04
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Typical Performance Characteristics
Typical Performance Characteristics
Efficiency
95
95
90
90
Efficiency (%)
Efficiency (%)
See Figure 18 for typical application schematic.
85
80
1.8VOUT, 600kHz
1.5VOUT, 600kHz
1.2VOUT, 500kHz
1.0VOUT, 500kHz
0.8VOUT, 400kHz
75
70
65
0
5
10
15
20
85
80
1.8VOUT, 600kHz
1.5VOUT, 600kHz
1.2VOUT, 500kHz
1.0VOUT, 500kHz
0.8VOUT, 400kHz
75
70
65
25
0
5
10
Load Current (A)
20
25
Load Current (A)
Figure 5: Efficiency: Single Phase, VIN = 12V
Figure 4: Efficiency: Single Phase, VIN = 5V
95
100
90
90
80
Efficiency (%)
Efficiency (%)
15
85
80
1.8VOUT, 600kHz
1.5VOUT, 600kHz
1.2VOUT, 500kHz
1.0VOUT, 500kHz
0.8VOUT, 400kHz
75
70
65
0
10
20
30
40
June 9, 2021
60
50
40
30
CCM
20
Pulse-Skip Mode
10
50
0.01
Load Current (A)
Figure 6: Efficiency: Dual Phase, VIN = 12V
70
0.1
1
10
Load Current (A)
Figure 7: Efficiency: Pulse-Skipping Mode, VIN = 12V,
VOUT = 1.2V, 500kHz
201DSR04
9
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Load Transient Response, Dual Phase, Single Output
See Figure 18 for typical application schematic.
VOUT(AC), 20mV/div
VOUT(AC), 20mV/div
IOUT, 10A/div
IOUT, 10A/div
COUT = 8 x 220µF Ceramic
COUT = 8 x 220µF Ceramic
CFF = 470pF
CFF = 470pF
Figure 8: 12V to 1V, 500kHz, 12.5A Load Step,
10A/µs Step-Up and Step-Down
Figure 9: 12V to 1.2V, 500 kHz, 12.5A Load Step,
10A/µs Step-Up and Step-Down
VOUT(AC), 20mV/div
VOUT(AC), 20mV/div
IOUT, 10A/div
IOUT, 10A/div
COUT = 8 x 220µF Ceramic
CFF = 470pF
COUT = 8 x 220µF Ceramic
CFF = 470pF
Figure 10: 12V to 1.5V, 600kHz, 12.5A Load Step,
10A/µs Step-Up and Step-Down
June 9, 2021
Figure 11: 12V to 1.8V, 600kHz, 12.5A Load Step,
10A/µs Step-Up and Step-Down
201DSR04
10
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Start-Up, Single Phase
Start-Up, Single Phase
See Figure 18 for typical application schematic.
VSW, 10V/div
VSW, 10V/div
VOUT, 0.5V/div
VOUT, 0.5V/div
I_IN, 1A/div
I_IN, 0.2A/div
COUT = 1 x 470µF POSCAP + 2 x 100µF Ceramic
COUT = 1 x 470µF POSCAP + 2 x 100µF Ceramic
CSS = 0.1µF
CSS = 0.1µF
Figure 12: No Load, 12V to 1.2V, 500kHz
Figure 13: 25 A, 12V to 1.2V, 500kHz
Short Circuit Protection, Single Phase
See Figure 18 for typical application schematic.
VSW, 10V/div
VSW, 10V/div
VOUT, 0.5V/div
VOUT, 0.5V/div
I_IN, 1A/div
I_IN, 2.5A/div
COUT = 1 x 470µF POSCAP + 2 x 100µF Ceramic
COUT = 1 x 470µF POSCAP + 2 x 100µF Ceramic
CSS = 0.1µF
CSS = 0.1µF
Figure 15: 25 A, 12V to 1.2V, 500kHz
Figure 14: No Load, 12V to 1.2V, 500kHz
June 9, 2021
201DSR04
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Functional Block Diagrams
Functional Block Diagrams
VIN
TRACK1
CSS
RTEMP
= 100μA VIN
RTEMP
GND
TEMP
Q TOP
CLKOUT
RUN1
0.12μH
Q BOTTOM
MODE_PLLIN
GND
PHASMD
60.4k
COUT1
VFB1
INTERNAL
COMP
SGND
PGOOD1
POWER
CONTROL
RFB1
PGOOD2
VIN
TRACK2
CVCC
4.7μF
VOUT1
VOUTS1
COMP1
CSS
SW1
VOUT1
INTVCC
1μF
CIN
GND
Q TOP
EXTVCC
0.12μH
RUN2
SW2
VOUT2
Q BOTTOM
GND
VOUT2
COUT2
LOAD
VIN - 0.6V
CIN
1μF
VOUTS2
60.4k
COMP2
Optional
External Control
fSET
RFSET
SGND
+ –
INTERNAL
COMP
VFB2
RFB2
INTERNAL
FILTER
MxL7225
DIFFOUT
DIFFN
DIFFP
Figure 16: MxL7225 Functional Block Diagram
June 9, 2021
201DSR04
12
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Functional Block Diagrams
VIN
TRACK1
CSS
VIN - 0.6V
RTEMP
= 100μA
VIN
CIN
1ȝF
RTEMP
GND
TEMP
Q TOP
CLKOUT
0.12ȝH
RUN1
SW1
VOUT1
Q BOTTOM
MODE_PLLIN
GND
PHASMD
VOUT1
COUT1
VOUTS1
COMP1
60.4k
VFB1
RC1
10pF
SGND
PGOOD1
POWER
CONTROL
PGOOD2
VIN
TRACK2
INTVCC
CSS
CVCC
4.7μF
1ȝF
CIN
GND
Q TOP
EXTVCC
0.12ȝH
RUN2
SW2
VOUT2
Q BOTTOM
GND
COMP2
60.4k
10pF
CC2
VOUT2
COUT2
VOUTS2
RC2
Optional
External Control
RFSET
RFB1
+ –
LOAD
CC1
VFB2
RFB2
fSET
INTERNAL
FILTER
MxL7225-1
SGND
DIFFOUT
DIFFN
DIFFP
Figure 17: MxL7225-1 Functional Block Diagram
June 9, 2021
201DSR04
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Operation
Operation
Power Module Description
The MxL7225 is a dual-channel, standalone, synchronous
step-down power module that provides two 25A outputs or
one 50A output. This power module has a continuous input
voltage range of 4.5V to 15V and has been optimized for
12V conversions. It provides precisely regulated output
voltages from 0.6V to 1.8V that are set by a single external
resistor. See the typical application schematic in Figure 18.
The module employs a constant frequency, peak current
mode control loop architecture. It also has an internal
feedback loop compensation. These features ensure the
MxL7225 has sufficient stability margins as well as good
transient performance over a wide range of output
capacitors, including low ESR ceramic capacitors.
The peak current mode control supports cycle-by-cycle fast
current limit and current limit hiccup in overcurrent or output
short circuit conditions. The open-drain PGOOD outputs
are pulled low when the output voltage exceeds ±10% of its
set point. Once the output voltage exceeds +10%, the high
side MOSFET is kept off while the low side MOSFET turns
on, clamping the output voltage. The overvoltage and
undervoltage detection are referenced to the feedback pin.
The RUN1 and RUN2 pins enable and disable the
module’s two channels. Pulling a RUN pin below 1.1V
forces the respective regulator into shutdown mode and
turns off both the high side and low side MOSFETs. The
TRACK pins are used for either programming the output
voltage ramp and voltage tracking during start-up, or for
soft-starting the channels.
The MxL7225 includes a differential remote sense amplifier
(with a gain of +1). This amplifier can be used to accurately
sense the voltage at the load point on one of the module’s
two outputs or on a single parallel output.
The switching frequency is programmed from 400kHz to
780kHz using an external resistor on the fSET pin. For noise
sensitive applications, the module can be synchronized to
an external clock.
The MxL7225 module can be configured to current share
between channels or can also be set to current share
between modules (multiphase or ganged operation). Using
the MODE_PLLIN, PHASMD and CLKOUT pins,
multiphase operation of up to 12 phases is possible with
multiple MxL7225s running in parallel.
The EXTVCC pin allows an external 5V supply to power the
module and eliminate power dissipation in the internal 5V
LDO. EXTVCC has a threshold of 4.7V for activation and a
max operating rating of 5.5V. It must sequence on after VIN
and sequence off before VIN.
Monitor the internal die temperature by using the TEMP
pin. Pull the anode up to VIN through an external resistor to
set the bias current in the diode. Thermal simulation has
shown that the thermal monitor on the controller die is
within 5°C of the MOSFETs.
The MxL7225-1 is identical to the MxL7225 except that
there are no internal control loop compensation
components. When dealing with an atypical selection of
output capacitors or when further loop optimization is
desired, the MxL7225-1 offers more flexibility.
Applications Information
Typical Application Circuit
The typical MxL7225 application circuit is shown in Figure
18. External component selection is primarily determined
by the maximum load current and output voltage. Refer to
Table 7 for a selection of various design solutions.
Additional information about selecting external
compensation components can be found in the Stability
and Compensation section.
VIN to VOUT Step-Down Ratios
For a given input voltage, there are limitations to the
maximum possible VIN and VOUT step-down ratios.
The MxL7225 has a maximum duty cycle of 90% at
500kHz, meaning that the maximum output voltage will be
approximately 0.9 x VIN. When running at a high duty cycle,
output current can be limited by the power dissipation in the
high-side MOSFET. The minimum output voltage from a
given input is controlled by the minimum on-time, which is
90ns. The minimum output voltage is either VIN x fSW(MHz)
x 0.09µs or 0.6V, whichever is higher. To get a lower output
voltage, reduce the switching frequency.
Using the MODE_PLLIN pin to operate in pulse-skipping
mode results in high efficiency performance at light loads.
This light load feature extends battery life.
June 9, 2021
201DSR04
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
INTVCC
VIN to VOUT Step-Down Ratios
INTVCC
CVCC
4.7μF
RPGOOD1
10kȍ
PGOOD1
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VIN
VOUT1
C1-C4
22ȝF
25V
CSS1
0.1μF
RTEMP
100kȍ
TEMP
VOUTS1
RUN1
SW1
RUN2
VFB1
TRACK1
VFB2
TRACK2
COMP1
MxL7225
fSET
CSS2
0.1μF
COUT2
470ȝF
6.3V
RFB1
40.2kȍ
SW2
GND
PGOOD2
DIFFN DIFFOUT
DIFFP
VOUT1
1.5V 25A
CFF2
100pF
VOUT2
1.2V 25A
VOUTS2
VOUT2
SGND
RFB2
60.4kȍ
COMP2
PHASMD
RFSET
121kȍ
CFF1
100pF
COUT1
100ȝF
6.3V
COUT3
INTVCC
100ȝF
RPGOOD2 6.3V
10kȍ
PGOOD2
COUT4
470ȝF
6.3V
LOAD
VIN
Figure 18: Typical 4.5VIN to 15VIN, 1.5V and 1.2V at 25A Outputs, MxL7225
INTVCC
INTVCC
CVCC
4.7μF
RPGOOD1
10kȍ
PGOOD1
C1-C4
22ȝF
25V
CSS1
0.1μF
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VIN
VOUT1
RTEMP
100kȍ
TEMP
VOUTS1
RUN1
SW1
RUN2
VFB1
TRACK1
VFB2
TRACK2
COMP1
fSET
CSS2
0.1μF
MxL7225-1
VOUTS2
VOUT2
SW2
SGND
GND
DIFFP
2.55kȍ 2.2nF
COMP2
PHASMD
RFSET
121kȍ
CFF1
100pF
COUT1
100ȝF
6.3V
PGOOD2
DIFFN DIFFOUT
RFB2
60.4kȍ
2.55kȍ 2.2nF
COUT3
100ȝF
RPGOOD2 6.3V
10kȍ
PGOOD2
INTVCC
COUT2
470ȝF
6.3V
RFB1
40.2kȍ
VOUT1
1.5V 25A
CFF2
100pF
VOUT2
1.2V 25A
COUT4
470ȝF
6.3V
LOAD
VIN
Figure 19: Typical 4.5VIN to 15VIN, 1.5V and 1.2V at 25A Outputs, MxL7225-1
June 9, 2021
201DSR04
15
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Output Voltage Programming
Output Voltage Programming
Pulse-Skipping Mode Operation
The PWM controller has an internal 0.6V reference. A
resistor RFB between the VFB and SGND pins programs
the output voltage. A 60.4kΩ internal feedback resistor is
connected from VOUTS1 to VFB1 and from VOUTS2 to VFB2,
as illustrated in the functional block diagram.
The pulse-skipping mode enables the module to skip
cycles at light loads which reduces switching losses and
increases efficiency at low to intermediate currents. To
enable this mode, connect the MODE_PLLIN pin to the
INTVCC pin.
RFB values for corresponding standard VOUT values are
shown in Table 6. Use the following equation to determine
the RFB value for other VOUT levels:
Forced Continuous Operation
R FB
0.6V 60.4k
= --------------------------------------V OUT – 0.6V
Equation 1
In the case of paralleling multiple channels and devices,
when all VFB pins are tied together and only one VOUTS pin
is connected to the output, a common RFB resistor may be
used. Select the RFB as explained above. Note that each
VFB pin has an IFB max of 20nA. To reduce VOUT error due
to IFB, use an additional RFB and connect the
corresponding VOUTS to VOUT as shown in Figure 21.
Table 6: VFB Resistor Table vs. Various Output Voltages
VOUT
0.6V
0.8V
1.0V
1.2V
1.5V
1.8V
RFB
Open
182k
90.9k
60.4k
40.2k
30.2k
Input Capacitors
Use four 22µF ceramic input capacitors to reduce RMS
ripple current on the regulator input.
A bulk input capacitor is required if the source impedance is
high or the source capacitance is low. For additional bulk
input capacitance, use a surface mount 47µF to 100µF
aluminum electrolytic bulk capacitor.
Output Capacitors
The output capacitors, denoted as COUT, need to have low
enough equivalent series resistance (ESR) to meet output
voltage ripple and transient requirements. The MxL7225
can use low ESR tantalum capacitors, low ESR polymer
capacitors, ceramic capacitors or a combination of those
for COUT. Refer to Table 7 for COUT recommendations that
optimize performance for different output voltages.
June 9, 2021
Forced continuous operation is recommended when fixed
frequency is more important than light load efficiency, and
when the lowest output ripple is desired. To enable this
mode, connect the MODE_PLLIN pin to GND.
Multiphase Operation
Multiphase operation is used to achieve output currents
greater than 25A. It can be used with both MxL7225
channels to achieve one 50A output. It can also be used by
paralleling multiple MxL7225s and running them out of
phase to attain one single high current output, up to 300A.
Ripple current in both the input and output capacitors is
substantially lower using a multiphase design, especially
when the number of phases multiplied by the output
voltage is less than the input voltage. Input RMS ripple
current and output ripple amplitude is reduced by the
number of phases used while the effective ripple frequency
is multiplied by the number of phases used. The MxL7225
is a peak current mode controlled device which results in
very good current sharing between parallel modules and
balances the thermal loading. Figure 20 shows an example
of a 2-module, 4-phase, single output regulator that can
handle load current up to 100A.
Up to 12 phases can be paralleled by using each MxL7225
channel’s PHASMD, MODE_PLLIN and CLKOUT pins.
When the CLKOUT pin is connected to the following
stage’s MODE_PLLIN pin, the frequency and the phase of
both devices are locked. Phase difference can be obtained
between MODE_PLLIN and CLKOUT of 120 degrees, 60
degrees or 90 degrees respectively by connecting the
PHASMD pin to INTVCC, SGND or by floating it. Figure 21
shows an example of parallel operation and Figure 22
shows examples of 2-phase, 4-phase and 6-phase
designs.
201DSR04
16
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
INTVCC
INTVCC
C10
4.7μF
CLK1
VIN = 4.5V to 15V
Multiphase Operation
R2
5k
PGOOD
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VIN
VOUT1
CIN1
22μF
25V x3
R6
100k
TEMP
RUN
TRACK
VOUTS1
RUN1
SW1
RUN2
VFB1
TRACK1
VFB2
TRACK2
COMP1
MxL7225
fSET
COMP2
PHASMD
VFB
COUT2
470μF
6.3V
COUT1
100μF
6.3V
COUT2
470μF
6.3V
R5
60.4k
COMP
VOUT2
VOUTS2
SW2
R4
121k
SGND
COUT1
100μF
6.3V
GND
DIFFP
PGOOD2
DIFFN DIFFOUT
PGOOD
VOUT
1.2V
100A
C16
4.7μF
CLK1
PGOOD
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VIN
VOUT1
CIN2
22μF
25V x3
R9
100k
TEMP
VOUTS1
RUN1
SW1
RUN
RUN2
VFB1
TRACK
TRACK1
VFB2
TRACK2
COMP1
MxL7225
fSET
C19
0.22μF
COUT1
100μF
6.3V
COUT2
470μF
6.3V
COUT1
100μF
6.3V
COUT2
470μF
6.3V
VFB
COMP
COMP2
PHASMD
VOUTS2
VOUT2
SW2
R10
121k
SGND
GND
DIFFP
PGOOD2
DIFFN DIFFOUT
PGOOD
INTVCC
Figure 20: MxL7225 2-Module, 4-Phase, 1.2V, 100A Regulator
June 9, 2021
201DSR04
17
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
VOUT1
VOUT2
COMP1
COMP2
4 Paralleled Outputs
for 1.2V at 100A
60.4k VOUTS1
VOUTS2
Optional Connection
When paralleling multiple channels and devices:
■
■
■
VFB1
60.4k
VFB2
TRACK1
TRACK2
Optional
RFB
60.4k
VOUT1
VOUT2
COMP1
COMP2
60.4k VOUTS1
VOUTS2
VFB2
TRACK2
CSS
0.1μF
RFB
60.4k
Tie all RUN pins together.
Connect only one of the VOUTS pins to VOUT (or
DIFFOUT in the case of remote sensing). In this case,
only the RFB corresponding to that VOUTS pin should
be populated. Refer to Output Voltage Programming for
the calculation of RFB. All other VOUTS pins should be
left floating.
If VOUT offset created by IFB (20nA max per channel) is
a concern, additional RFB resistors may be populated
to mitigate the effect. In such a configuration, each RFB
should be the same resistance value as that in the
single RFB case, and the corresponding VOUTS pin
should be connected to VOUT (or DIFFOUT in the case
of remote sensing).
■
If remote sensing, only one differential amplifier should
be used.
■
In MxL7225-1, external RC and CC components are
required. Only one RC and one CC are needed given
that all COMP pins are tied together.
60.4k
TRACK1
Tie all VFB pins together.
■
Use to lower
total equivalent
resistance to lower
IFB voltage error
VFB1
Multiphase Operation
Figure 21: 4-Phase Parallel Configuration
PHASMD SGND FLOAT INTVCC
0
0
0
2-PHASE DESIGN
CHANNEL1
FLOAT
CLKOUT
MODE_PLLIN
0 PHASE
180 PHASE
VOUT1
VOUT2
PHASMD
CHANNEL2
180
180
240
CLKOUT
60
90
120
4-PHASE DESIGN
90 DEGREE
CLKOUT
MODE_PLLIN
0 PHASE
180 PHASE
VOUT1
VOUT2
FLOAT
PHASMD
CLKOUT
MODE_PLLIN
90 PHASE
270 PHASE
VOUT1
VOUT2
FLOAT
PHASMD
6-PHASE DESIGN
60 DEGREE
60 DEGREE
CLKOUT
MODE_PLLIN
0 PHASE
180 PHASE
VOUT1
VOUT2
SGND
PHASMD
CLKOUT
MODE_PLLIN
60 PHASE
240 PHASE
VOUT1
VOUT2
SGND
PHASMD
CLKOUT
MODE_PLLIN
120 PHASE
300 PHASE
VOUT1
VOUT2
FLOAT
PHASMD
Figure 22: Examples of 2-Phase, 4-Phase and 6-Phase Operation with PHASMD Table
June 9, 2021
201DSR04
18
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Input Ripple Current Cancellation
Input Ripple Current Cancellation
Figure 23 illustrates the RMS ripple current reduction that is expected as a function of the number of interleaved phases.
0.60
0.55
0.50
1-Phase
2-Phase
3-Phase
4-Phase
6-Phase
RMS Input Ripple Current
DC Load Current
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Duty Factor (VOUT/VIN)
Figure 23: Input RMS Current to DC Load Current Ratio as a Function of Duty Cycle
Frequency Selection and Phase-Locked Loop
To increase efficiency, the MxL7225 works over a range of
frequencies. For lower output voltages or duty cycles, lower
frequencies are recommended to lower MOSFET switching
losses and improve efficiency. For higher output voltages or
duty cycles, higher frequencies are recommended to limit
inductor ripple current. Refer to the efficiency graphs and
their operating frequency conditions. When selecting an
operating frequency, keep the highest output voltage in
mind.
Use an external resistor between the fSET pin and SGND to
set the switching frequency. An accurate 10µA current
source into the resistor sets a voltage that programs the
frequency. Alternatively, a DC voltage can be applied to
June 9, 2021
fSET to program the frequency. Figure 24 illustrates the
operating frequency versus the fSET pin voltage.
An external clock with a frequency range of 400kHz to
780kHz and a voltage range of 0V to INTVCC can be
connected to the MODE_PLLIN pin. The high level
threshold of the clock input is 1.6V and the low level
threshold of the clock input is 1V.
The MxL7225 integrates the PLL loop filter components.
Ensure that the initial switching frequency is set with an
external resistor before locking to an external clock. Both
regulators will operate in continuous mode while being
synchronized to an external clock signal.
201DSR04
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
The PLL phase detector output charges and discharges the
internal filter network with a pair of complementary current
sources. When an external clock is connected, an internal
switch disconnects the external fSET resistor. The switching
frequency then locks to the incoming external clock. If no
external clock is connected, then the internal switch is on,
which connects the external fSET resistor.
900
700
Soft-Start and Output Voltage
Tracking
A capacitor CSS can be connected from the TRACK pin to
ground to implement soft-start. The TRACK pin is charged
by a 1.25µA current source up to the reference voltage and
then on to INTVCC. The MxL7225 has a smooth transition
from TRACK to VOUT as shown in Figure 25. If the RUN pin
is below 1.2V, the TRACK pin is pulled low. The following
equation can be used to calculate soft-start time, defined
as when PGOOD asserts:
C SS
t SOFTSTART = ------------------- 0.65V
1.25A
600
500
400
Equation 3
1000
300
900
VTRACK
200
800
VOUT = 0.6V
100
0
0.0
0.5
1.0
1.5
2.0
2.5
Voltage (V)
Voltage (mV)
Frequency (kHz)
800
Minimum On-Time
Figure 24: Operating Frequency vs. fSET Pin Voltage
700
600
500
400
300
200
100
0
Minimum On-Time
0
Minimum On-Time tON(MIN) is the shortest time that the
controller can turn on the high-side MOSFET of either
channel. Approaching this time may be more of an issue in
low duty cycle applications. Use the following equation to
make sure the on-time is above this minimum:
V OUT
--------------------------------t
V IN FREQ ON MIN
Equation 2
If the on-time falls below this minimum, the channel will
start to skip cycles. In this case, the output voltage
continues to regulate, however output ripple increases.
Lowering the switching frequency increases on-time. The
minimum on-time specified in the electrical characteristics
is 90ns.
1
2
3
4
5
6
7
8
9
10
time (ms)
Figure 25: VOUT and VTRACK versus Time
The MODE_PLLIN pin selects between forced continuous
mode or pulse-skipping mode during steady-state
operation. Regardless of the mode selected, the module
channels will always start in the pulse-skipping mode up to
TRACK = 0.54V, beyond which point the operation mode
will follow the MODE_PLLIN setting.
The TRACK pins can be used to externally program the
output voltage tracking. The output may be tracked up and
down with another regulator. The master regulator’s output
is divided down with an external resistor divider that is the
same as the slave regulator’s feedback divider to
implement coincident tracking. Note that each MxL7225
channel has an internal accurate 60.4kΩ for the top
feedback resistor. Refer to the equation below, which is
applicable for VTRACK(SLAVE) < 0.8V. An example of
coincident tracking is shown in Figure 26.
60.4k
V OUT SLAVE = 1 + --------------- V TRACK SLAVE
R TA
Equation 4
June 9, 2021
201DSR04
20
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
INTVCC
Power Good
INTVCC
CVCC
4.7μF
RPGOOD1
10kȍ
PGOOD1
CIN
CSS
0.1μF
RTEMP
RTB
60.4kȍ
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VIN
VOUT1
MASTER
TEMP
CFF1
33pF
VOUTS1
RUN1
SW1
RUN2
VFB1
TRACK1
VFB2
TRACK2
COMP1
MxL7225
fSET
RTA
60.4kȍ
PHASMD
RFB1
40.2kȍ
VOUT1
1.5V
SW2
121kȍ
GND
DIFFP
PGOOD2
DIFFN DIFFOUT
VOUT1
1.5V 25A
COUT2
470ȝF
6.3V
CFF2
100pF
VOUT2
VOUTS2
VOUT2
SGND
RFB2
60.4kȍ
COMP2
COUT1
100ȝF
6.3V
SLAVE 1.2V 25A
COUT3
100ȝF
RPGOOD2 6.3V
10kȍ
PGOOD2
INTVCC
COUT4
470ȝF
6.3V
LOAD
VIN
Figure 26: Example of Output Tracking Application Circuit
Power Good
Each channel’s open drain PGOOD pin can be used to
monitor if its respective VOUT is outside ±10% of the set
point. The PGOOD pin is pulled low when the output of the
corresponding channel is outside the monitoring window,
the RUN pin is below its threshold (1.25V), or the MxL7225
is in the soft-start or tracking phase. The PGOOD pin will
go high impedance immediately after VFB voltage is within
the monitoring window. Note that there is an internal 20µs
glitch filtering in PGOOD when VFB voltage goes out of the
monitoring window.
MASTER OUTPUT
OUTPUT
VOLTAGE
SLAVE OUTPUT
TIME
Figure 27: Output Coincident Tracking Waveform
The ramping voltage is applied to the track pin of the slave.
Since the same resistor values are used to divide down the
output of the master and to set the output of the slave, the
slave tracks with the master coincidentally until its final
value is achieved. The master continues from the slave’s
regulation point to its final value. In Figure 26, RTA is equal
to RFB2 for coincident tracking.
June 9, 2021
If desired, a pullup resistor can be connected from the
PGOOD pins to a supply voltage with a maximum level of
6V.
Stability and Compensation
The MxL7225 module is internally compensated for stability
over a wide range of operating conditions. Refer to Table 7
for recommended configurations. For other configurations
or for MxL7225-1 loop compensation, please consult a
Maxlinear Field Applications Engineer.
201DSR04
21
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Enabling Channels
Enabling Channels
RUN threshold. Equation 5 shows the relationship between
R1, R2 and VIN(TH) which is the VIN value when the RUNx
voltage crosses 1.26V:
There are two supported methods to enable and disable
each channel.
Method 1
Method 1 is to drive the RUNx pin of the channel to be
enabled (CHx) with a logic signal as shown in Figure 28.
R1
V IN TH
1 + ------- = ------------------R2
1.26V
Equation 5
Select R1 and R2 by letting VIN(TH) = 5V.
4.5V to 15V
If the application is for VIN = 12V, the choice of VIN(TH) for
Equation 5 can be higher than 5V but less than the
minimum of the VIN tolerance band. For example, if VIN is
12V ± 10%, then choose a VIN(TH) between 5V and 10V. A
zener diode from RUNx pin to ground is optional for
protection of the RUNx pin (to clamp RUNx to 5V) in the
event of the R2 resistor not being connected due to a board
level fault.
VIN
RUNx
Figure 28: RUNx Pin Driven by a Logic Signal
VIN should be in the operating range (4.5V to 15V) before
the logic signal at RUNx goes high. The logic high level
must be above 1.3V in order to ensure that the RUNx
threshold is crossed. To disable a channel (CHx), the logic
signal at the corresponding RUNx pin must be brought
down to 1.1V or below.
Figure 30 shows the self-start method for an application
where VIN is in the range of 4.5V to 5.5V.
4.5V to 5.5V
R1
Method 2
10k
1%
VIN
RUNx
Method 2 is a self-start method. This method uses a
resistor divider to divide down VIN and drive the RUNx pin
with the divided voltage. The choice of the resistor divider
ratio depends on the VIN range.
R2
3.24k
1%
A combination of Method 1 and Method 2 is also
recommended where an open drain output drives the
RUNx pin with the voltage divider (R1 and R2) in place.
Criteria for the selection of R1 and R2 must be followed as
described above.
VIN
RUNx
DZ
EXTVCC
In an application where VIN is the range of 4.5V to 5.5V, it is
required to connect VIN to EXTVCC. Select R1 and R2
based on Equation 5, but use 4V for VIN(TH).
5.5V to 15V
10k
1%
4.53k
1%
Figure 30: Self-Start for VIN Range of 4.5V to 5.5V
Figure 29 shows the self-start method for an application
where VIN is in the range of 5.5V to 15V.
R1
R2
It is important to note that starting up the channels with
RUNx floating is not allowed.
Figure 29: Self-Start for VIN Range of 5.5V to 15V
Resistors R1 and R2 divide VIN down and the divided
voltage drives the RUNx pin. The R1 and R2 values are
chosen such that VIN reaches 5V before RUNx crosses the
June 9, 2021
201DSR04
22
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
INTVCC and EXTVCC
INTVCC and EXTVCC
Temperature Monitoring (TEMP)
The VIN input voltage powers an internal 5V low dropout
linear regulator. The regulator output (INTVCC) provides
voltage to the control circuitry of the module. Alternatively,
the EXTVCC pin allows an external 5V supply to be used to
eliminate the 5V LDO power dissipation in power sensitive
applications.
An internal temperature sensing diode / PNP transistor is
used to monitor its VBE voltage over temperature, thus
serving as a temperature monitor. Its forward voltage and
temperature coefficient are shown in the electrical
characteristics section and plotted in Figure 31. It is
connected to VIN through a pullup resistor RTEMP to limit
the current to 100μA. It is recommended to set a 60µA
minimum current in applications where VIN varies over a
wide range. See Figure 32 for an example on how to use
this feature.
The MxL7225’s differential remote sense amplifier can be
used to accurately sense voltages at the load. This is
particularly useful in high current load conditions. The
DIFFP and DIFFN pins must be connected properly to the
remote load point, and the DIFFOUT pin must be
connected to the corresponding VOUTS1 or VOUTS2 pin. The
differential amplifier is able to handle an input up to 3.3V.
If a CFF feed-forward capacitor is desirable in a channel
employing the differential amplifier, connect the capacitor
between VFB and DIFFP instead of DIFFOUT.
0.80
I = 100μA
0.75
0.70
0.65
V TEMP (V)
Differential Remote Sense Amplifier
0.60
0.55
0.50
0.45
0.40
0.35
SW Pins
0.30
-60
Use the SW pins to monitor the switching node of each
channel. These pins are generally used for testing or
monitoring. During normal operation, these pins should be
unconnected and left floating. However, in conjunction with
an external series R-C snubber circuit, these pins can be
used to dampen ringing on the switch node caused by LC
parasitics in the switched current paths.
June 9, 2021
-40
-20
0
20
40
60
80
100
120
140
Temperature (ࣙC)
Figure 31: Diode Voltage vs. Temperature
For accurate temperature measurement, the temperature
sensing diode should first be characterized in a controlled
temperature environment such as an oven. Without
powering up the module, push a constant current such as
100µA into the TEMP pin and out the GND. Measure the
diode voltage at two extreme temperature points. TEMP
voltage vs diode temperature for said current is simply a
straight line between those two points.
201DSR04
23
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Temperature Monitoring (TEMP)
INTVCC
VIN – 0.6V VIN
RTEMP =
100μA
RTEMP
INTVCC
CVCC
4.7μF
RPGOOD
10k
A/D
PGOOD
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VIN
VOUT1
VIN = 4.5V to 15V
CIN
TEMP
VOUTS1
RUN1
SW1
RUN2
VFB1
TRACK1
VFB2
TRACK2
COMP1
MxL7225
fSET
CSS
0.1μF
PHASMD
COUT1
RFB
90.9k
COMP2
VOUTS2
VOUT
1V 50A
VOUT2
SW2
121k
SGND
GND
DIFFP
PGOOD2
DIFFN DIFFOUT
PGOOD
COUT2
Figure 32: 2-Phase, 1V at 50A with Temperature Monitoring
June 9, 2021
201DSR04
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MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Fault Protection
Fault Protection
Thermal Considerations and Output
Current Derating
The MxL7225 module has built-in overcurrent, output
overvoltage, and over-temperature protection.
The overcurrent triggers at a nominal load of 35A.
Overcurrent during four consecutive switching cycles
initiates a hiccup mode. During hiccup, the high-side and
low-side MOSFETs are turned off for 100ms. A soft-start is
attempted following the hiccup. If the overcurrent persists,
the hiccup will continue.
The overvoltage triggers when the output voltage is 10%
above the set-point. In overvoltage mode, the gate-source
voltage of the top FET is kept at 0V and the bottom FET is
kept on.
The over-temperature triggers at 145°C. In an overtemperature state, both top and bottom FETs are kept off.
When the temperature cools down below 130°C, the
module soft-starts.
Since an output overvoltage event is likely caused by a top
FET that has failed short, in the case of an input supply that
is capable of delivering high power, it is recommended that
a fuse be used at the input. This is so that the bottom FET
when kept on would cause high input current to flow
through the fuse and quickly disengage the input supply
and therefore de-energize the faulty module, preventing
further damage to the end product.
The design of the MxL7225 module removes heat from the
bottom side of the package effectively. Thermal resistance
from the bottom substrate material to the printed circuit
board is very low.
Proper thermal design is critical in controlling device
temperatures and in achieving robust designs. There are
many factors that affect the thermal performance. One key
factor is the temperature rise of the devices in the package,
which is a function of the thermal resistances of the devices
inside the package and the power being dissipated. The
thermal resistances of the MxL7225 are shown in the
Operating Conditions section of this datasheet. The
JEDEC ѲJA thermal resistance provided is based on tests
that comply with the JESD51-2A “Integrated Circuit
Thermal Test Method Environmental Conditions – Natural
Convection” standard. JESD51 is a group of standards
whose intent is to provide comparative data based on a
standard test condition which includes a defined board
construction. Since the actual board design in the final
application will be different from the board defined in the
standard, the thermal resistances in the final design may
be different from those shown.
Figure 33: Thermal Image 12V to 1V, 50A with No Air Flow(1)
1. Based on a 6-layer 3.9" x 5.1" Printed Circuit Board with 2oz copper on the outer layers and 1 oz copper on all internal layers).
June 9, 2021
201DSR04
25
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Power Derating
Power Derating
The current derating curves in Figure 39 through Figure 42
were acquired with the test setup in Figure 34. The EVK
(see details in Figure 33) was placed in a 0.5 cubic feet
enclosed space with no forced air flow. The EVK was
configured as a dual-phase single-output converter. The
EVK was first loaded to 50A at room temperature. Ambient
temperature was then gradually elevated until the module's
temperature sensing diode reached 125°C. This is where
Load Current starts to decrease from 50A in the curves.
Beyond this point as ambient temperature increased, Load
Current was decreased to maintain the 125°C diode
temperature. These curves are accurate for the test setup
in Figure 34 and natural convection.
Figure 37 and Figure 38 are the corresponding power
dissipation in the module at room temperature.
12”
12”
Thermocouple for TAMBIENT
1”
X
3”
Module
EVK
1.5” Stand Off
Figure 34: Current Derating Curves Measurement Setup
June 9, 2021
201DSR04
26
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
INTVCC
Power Derating
INTVCC
CVCC
4.7μF
RPGOOD
10k
PGOOD
VIN
5.5V to 15V
10k
MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1
VIN
VOUT1
TEMP
VOUTS1
CIN
RTEMP
RUN1
RUN2
TRACK1
3.24k
SW1
fSET
PHASMD
MxL7225
MxL7225-1
COMP2
VOUTS2
VOUT2
SW2
PGOOD2
RFSET
SGND
GND
DIFFP
CFF
VFB1
VFB2
COMP1
TRACK2
CSS
0.1μF
MxL7225-1 ONLY
DIFFOUT
RC
CC
CP
RFB
VOUT
PGOOD
COUT
DIFFN
Figure 35: Two-Phase Single Output Configuration
June 9, 2021
201DSR04
27
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Power Derating
Table 7: MxL7225 Load Step Response vs. Components, 2-Phase, 1 Output (refer to Figure 35)
CIN
Vendors
BULK
Panasonic
CERAMIC
Murata
Wurth
COUT
Part Number
Value
Vendors
25SVPF330M
330µF, 25V
Panasonic
ETPF470M5H
470µF, 2.5V, 5mΩ
Murata
GRM32ER60J227M
220µF, 6.3V, 1206, X5R
Wurth
885012109004
100µF, 6.3V, 1210, X5R
GRM31CR61E226KE15L 22µF, 25V, 1206, X5R
885012109014
22µF, 25V, 1210, X5R
Part Number
Value
25% Load Step (0 to 12.5A, 10A/µs), Ceramic Output Capacitor Only Solutions
(mV)(1)
Feedback
Loop
Bandwidth
(kHz)
Phase
Margin
(deg)
RFB
(kΩ)
PWM Freq
(kHz)
220
48
52
46
90.9kΩ
500kHz
220µF x8
220
53
54
46
60.4kΩ
500kHz
None
220µF x8
150
55
51
55
40.2kΩ
600kHz
None
220µF x8
150
56
50
62
30.2kΩ
600kHz
VIN
VOUT
CIN
(BULK)
CIN
(Ceramic)
COUT
(BULK)
COUT
(MLCC)
CFF
(pF)
12V
1.0V
330µF
22µF x4
None
220µF x8
12V
1.2V
330µF
22µF x4
None
12V
1.5V
330µF
22µF x4
12V
1.8V
330µF
22µF x4
P-P
Deviation
25% Load Step (0 to 12.5A, 10A/µs), Bulk + Ceramic Output Capacitor Solutions
VIN
VOUT
CIN
(BULK)
12V
1.0V
330µF
CIN
(Ceramic)
COUT
(BULK)
COUT
(MLCC)
CFF
(pF)
22µF x4
470µF x2
220µF x3
100
(mV)(1)
Feedback
Loop
Bandwidth
(kHz)
Phase
Margin
(deg)
RFB
(kΩ)
PWM Freq
(kHz)
61
48
63
90.9kΩ
500kHz
P-P
Deviation
12V
1.2V
330µF
22µF x4
470µF x2
220µF x3
100
62
49
64
60.4kΩ
500kHz
12V
1.5V
330µF
22µF x4
470µF x2
220µF x3
100
66
47
76
40.2kΩ
600kHz
12V
1.8V
330µF
22µF x4
470µF x2
220µF x3
100
64
43
82
30.2kΩ
600kHz
1. Worst case.
June 9, 2021
201DSR04
28
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Power Derating
Table 8: MxL7225-1 Load Step Response vs. Components, 2-Phase, 1 Output (refer to Figure 35)
CIN (Ceramic)
Vendors Value
COUT (Ceramic)
Part Number
Vendors Value
COUT (Bulk)
Vendors
Value
Part Number
Murata
100µF, 6.3V,
GRM32ER60J107ME20L
X5R, 1210
Panasonic
680µF,
2.5V, 6mΩ
2R5TPF680M6L
22µF, 16V,
GRM31CR61C226KE15K
X5R, 1206
Murata
220µF, 6.3V,
GRM32ER60J227ME05L
X5R, 1210
Panasonic
470µF,
2.5V, 3mΩ
EEFGX0E471R
22µF, 16V,
C3225X5R1C226M250AA
X5R, 1210
Wurth
100µF, 6.3V,
885012109004
X5R, 1210
Murata
22µF, 16V,
GRM32ER61C226KE20L
X5R, 1210
Murata
TDK
Part Number
25% Load Step (0A to 12.5A, 10A/µs) Ceramic Output Capacitor Only Solutions
VIN
VOUT
CIN
(BULK)
CIN
(Ceramic)
COUT
(BULK)
COUT
(MLCC)
CP
(pF)
RC
(kΩ)
CC
(nF)
CFF
(pF)
P-P
Deviation
(mV)(1)
Feedback
Phase
Loop
Margin
Bandwidth
(deg)
(kHz)
RFB
(kΩ)
PWM
Freq
(kHz)
12V
1V
330µF
22µF x 4
None
220µFx 6
None
3.24
10
68
55
80
45
90.9
500
12V
1.2V
330µF
22µF x 4
None
220µFx 5
None
2.55
10
68
65
79
50
60.4
500
12V
1.5V
330µF
22µF x 4
None
220µFx 4
None
2.55
10
68
70
87
53
40.2
600
12V
1.8V
330µF
22µF x 4
None
220µFx 4
None
2.55
10
68
72
98
60
30.2
600
RFB
(kΩ)
PWM
Freq
(kHz)
90.9
500
25% Load Step (0A to 12.5A, 10A/µs) Bulk + Ceramic Output Capacitor Solutions
CIN
(Ceramic)
COUT
(BULK)
COUT
(MLCC)
CP
(pF)
RC
(kΩ)
CC
(nF)
CFF
(pF)
47
P-P
Deviation
Feedback
Phase
Loop
Margin
Bandwidth
(deg)
(kHz)
VIN
VOUT
CIN
(BULK)
12V
1V
330µF
22µF x 4
470µFx 2
100µFx 4
None
4.52
4.7
12V
1.2V
330µF
22µF x 4
470µFx 2
100µFx 4
None
4.52
4.7
47
58
82
59
60.4
500
12V
1.5V
330µF
22µF x 4
470µFx 2
100µFx 4
None
5.11
4.7
None
64
70
46
40.2
600
12V
1.8V
330µF
22µF x 4
470µFx 2
100µFx 4
None
5.11
4.7
None
68
69
51
30.2
600
(mV)(1)
52
89
58
1. Worst case.
June 9, 2021
201DSR04
29
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Layout Guidelines and Example
Layout Guidelines and Example
The MxL7225’s high level of integration simplifies PCB
board design. However, some layout considerations are
still recommended for optimal electrical and thermal
performance.
■
Use large PCB copper areas for high current paths,
including VIN, VOUT1 and VOUT2 and GND to minimize
conduction loss and thermal stress in the PCB.
■
Use a dedicated power ground layer, placed under the
module.
■
Use multiple vias to interconnect the top layer and
other power layers to minimize via conduction loss and
module thermal stress.
■
Cap or plate over any vias that are directly placed on
the pad.
■
Use a separated SGND ground copper area for
components that are connected to the signal pins. The
SGND to GND should be connected underneath the
module.
■
Place high frequency ceramic input and output
capacitors next to the VIN, VOUT and PGND pins to
minimize high frequency noise.
■
When paralleling modules, connect the VFB, VOUT, and
COMP pins together closely with an internal layer. For
soft-start mode, the TRACK pins may be tied together
via a common capacitor.
■
Test points can be brought out for monitoring the signal
pins. Only bring out signals for testing purposes when
absolutely necessary. Keep test points as close as
possible to the module, if possible, to minimize
chances of noise coupling.
■
COMP1 and COMP2 are sensitive nodes. Make every
effort to avoid overlapping a COMP trace with a signal
that has fast edges, such as the CLKOUT, the
synchronization clock, and the SW. If overlapping is
unavoidable, place the COMP trace and the fast edge
signal on layers that are separated by a ground plane.
An example layout for the top PCB layer for the BGA
package is recommended in Figure 36.
BGA
CIN1
CIN2
VIN
M
L
K
GND
GND
J
H
G
SGND
F
COUT1
COUT2
E
D
C
B
A
1
2
3
4
5
VOUT1
6
7
8
9
GND
CNTRL
10
11
12
VOUT2
CNTRL
Figure 36: Recommended PCB Layout
June 9, 2021
201DSR04
30
10
10
9
9
8
8
7
Power Loss (W)
Power Loss (W)
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
6
5
4
3
2
VIN = 12V
1
0
10
20
30
40
7
6
5
4
3
2
VIN = 12V
1
VIN = 5V
0
Layout Guidelines and Example
VIN = 5V
0
50
0
10
Load Current (A)
30
40
50
Figure 38: 1.5V Output Power Loss
50
50
40
40
Load Current (A)
Load Current (A)
Figure 37: 0.9V Output Power Loss
30
20
10
30
20
10
0LFM
0LFM
0
0
25
35
45
55
65
75
85
95
105
25
115
35
45
55
65
75
85
95
105
115
Ambient Temperature (°C)
Ambient Temperature (°C)
Figure 40: 12V to 0.9V Current Derating
Figure 39: 12V to 1.5V Current Derating
50
50
40
40
Load Current (A)
Load Current (A)
20
Load Current (A)
30
20
10
30
20
10
0LFM
0LFM
0
0
25
35
45
55
65
75
85
95
105
115
Figure 41: 5V to 1.5V Current Derating
June 9, 2021
25
35
45
55
65
75
85
95
105
115
Ambient Temperature (°C)
Ambient Temperature (°C)
Figure 42: 5V to 0.9V Current Derating
201DSR04
31
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Mechanical Dimensions
Mechanical Dimensions
16mm x 16mm x 5.01mm BGA
#
$
%
&
3: "":
3: :
-5')%:
()':
&4:
:
-0(: ) :
8:
-1-0,0 : 0 !$( --:
:
')%: 0 !$( --:
:
:
:
%%: !' 0 ,:
%%: )+ (!( :
:
:
%%: +!0 :
%%: )1(0:
8:
)5: (0 ,: 0 : )(00: %%:
:
%%: 7!0 :
: %%: (0 ,: 0 : (0 ,:
:
9:
-:
. :
:
:
:
:
:
')%: %0( --:
:
+$ : : 0)% ,( :
)'&)(: !' (-!)(-:
'!(:
0)0:%: 0 !$( --:
)5: -!6 :
)+%(,:!0
: 5:
%%: ) - 0: +$ :
%%: ) - 0: %2:
/*:
:
:%A05-C 7C
C
)@0=075C C
Figure 43: Mechanical Dimensions, BGA
June 9, 2021
201DSR04
32
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Recommended Land Pattern and Stencil
Recommended Land Pattern and Stencil
16mm x 16mm x 5.01mm BGA
'*)%=W
%( %W
###%W
" (% W
*% W
'"%W
'"%W
*% W
" (% W
###% W
%( % W
'*)% W
U ##RW V'T%W
'*)% W
%( %
W
###%
W
" (%W
*%W
'"%
W
'"%
W
*%W
" (%W
###% W
%( % W
'*)%
W
##RW V%(T%W
/L>QDHBW 6I,W 87/ $+W
9@PDMDJH,W .W
Figure 44: Recommended Land Pattern and Stencil, BGA
June 9, 2021
201DSR04
33
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Module Pinout
Module Pinout
Table 9: Module Pinout
Pin ID
Function
Pin ID
Function
Pin ID
Function
Pin ID
Function
Pin ID
Function
Pin ID
Function
A1
VOUT1
B1
VOUT1
C1
VOUT1
D1
GND
E1
GND
F1
GND
A2
VOUT1
B2
VOUT1
C2
VOUT1
D2
GND
E2
GND
F2
GND
A3
VOUT1
B3
VOUT1
C3
VOUT1
D3
GND
E3
GND
F3
GND
A4
VOUT1
B4
VOUT1
C4
VOUT1
D4
GND
E4
GND
F4
MODE_PLLIN
A5
VOUT1
B5
VOUT1
C5
VOUTS1
D5
VFB1
E5
TRACK1
F5
RUN1
A6
GND
B6
GND
C6
fSET
D6
SGND
E6
COMP1
F6
SGND
A7
GND
B7
GND
C7
SGND
D7
VFB2
E7
COMP2
F7
SGND
A8
VOUT2
B8
VOUT2
C8
VOUTS2
D8
TRACK2
E8
DIFFP
F8
DIFFOUT
A9
VOUT2
B9
VOUT2
C9
VOUT2
D9
GND
E9
DIFFN
F9
RUN2
A10
VOUT2
B10
VOUT2
C10
VOUT2
D10
GND
E10
GND
F10
GND
A11
VOUT2
B11
VOUT2
C11
VOUT2
D11
GND
E11
GND
F11
GND
A12
VOUT2
B12
VOUT2
C12
VOUT2
D12
GND
E12
GND
F12
GND
G1
GND
H1
GND
J1
GND
K1
GND
L1
GND
M1
GND
G2
SW1
H2
GND
J2
VIN
K2
VIN
L2
VIN
M2
VIN
G3
GND
H3
GND
J3
VIN
K3
VIN
L3
VIN
M3
VIN
G4
PHASMD
H4
GND
J4
VIN
K4
VIN
L4
VIN
M4
VIN
G5
CLKOUT
H5
GND
J5
GND
K5
GND
L5
VIN
M5
VIN
G6
SGND
H6
GND
J6
TEMP
K6
GND
L6
VIN
M6
VIN
G7
SGND
H7
GND
J7
EXTVCC
K7
GND
L7
VIN
M7
VIN
G8
PGOOD2
H8
INTVCC
J8
GND
K8
GND
L8
VIN
M8
VIN
G9
PGOOD1
H9
GND
J9
VIN
K9
VIN
L9
VIN
M9
VIN
G10
GND
H10
GND
J10
VIN
K10
VIN
L10
VIN
M10
VIN
G11
SW2
H11
GND
J11
VIN
K11
VIN
L11
VIN
M11
VIN
G12
GND
H12
GND
J12
GND
K12
GND
L12
GND
M12
GND
June 9, 2021
201DSR04
34
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Ordering Information
Ordering Information
Table 10: Ordering Information
Ordering Part Number
MxL7225-ABA-T
MxL7225-1-ABA-T
MxL7225-EVK-1
MxL7225-EVK-2
Operating Temperature Range
MSL Rating
Lead-Free
Package
Packaging Method
-40°C ≤ TJ ≤ 125°C
3
Yes
BGA144 16x16
Tray
MxL7225 Evaluation Board, Single Device, Dual Output
MxL7225 Evaluation Board, 4 Devices, Multiphase
MxL7225-1-EVK-1
MxL7225-1 Evaluation Board, Single Device, Dual Output
MxL7225-1-EVK-2
MxL7225-1 Evaluation Board, 4 Devices, Multiphase
For most up-to-date ordering information and additional information on environmental rating, go to www.maxlinear.com/MxL7225.
June 9, 2021
201DSR04
35
MxL7225 / MxL7225-1 Dual 25A or Single 50A Power Module Data Sheet
Disclaimer
MaxLinear, Inc.
5966 La Place Court, Suite 100
Carlsbad, CA 92008
Tel.: +1 (760) 692-0711
Fax: +1 (760) 444-8598
www.maxlinear.com
The content of this document is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by
MaxLinear, Inc. MaxLinear, Inc. assumes no responsibility or liability for any errors or inaccuracies that may appear in the informational content contained in this
guide. Complying with all applicable copyright laws is the responsibility of the user. Without limiting the rights under copyright, no part of this document may be
reproduced into, stored in, or introduced into a retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying, recording, or
otherwise), or for any purpose, without the express written permission of MaxLinear, Inc.
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expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless
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potential liability of MaxLinear, Inc. is adequately protected under the circumstances.
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as expressly provided in any written license agreement from MaxLinear, Inc., the furnishing of this document does not give you any license to these patents,
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