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SP2526A-1EN-L

SP2526A-1EN-L

  • 厂商:

    SIPEX(迈凌)

  • 封装:

    NSOIC8_150MIL

  • 描述:

    IC PWR SWITCH N-CHAN 1:2 8SOIC

  • 数据手册
  • 价格&库存
SP2526A-1EN-L 数据手册
SP2526A Dual Channel USB Power Distribution Switch January 2020 Rev. 2.1.1 GENERAL DESCRIPTION APPLICATIONS • Self Powered USB 2.0 and 3.0 Hubs The SP2526A device is a dual +3.0V to +5.5V USB Supervisory Power Control Switch ideal for self-powered and bus-powered Universal Serial Bus (USB) applications. • USB Compliant VBUS Power Distribution • Audio-Video Equipments • Generic Power Switching Each switch has low on-resistance (110mΩ typical) and can supply 500mA minimum. The fault currents are limited to 1.0A typical and the flag output pin for each switch is available to indicate fault conditions to the USB controller. The thermal shutdown feature will prevent damage to the device when subjected to excessive current loads. The undervoltage lockout feature will ensure that the device will remain off unless there is a valid input voltage present. FEATURES • +3.0V to +5.5V Input Voltage Range • Two Independent Power Switches • Two Error Flag Outputs, Open Drain • 2.6V Undervoltage Lockout • 1.25A Short Circuit Current Limit The SP2526A is offered in a RoHS compliant “green”/halogen free 8-pin NSOIC package. • 150mΩ Maximum On-Resistance • 110μA On-State Supply Current • 1μA Shutdown Current • Output can be Forced Higher than Input (Off-State) • Thermal Shutdown • 1ms Soft Start Power Up, Fast Turn Off • Active-high Version: SP2526A-1 • Active-low Version: SP2526A-2 • RoHS Compliant, Green/Halogen Free 8-Pin NSOIC Package TYPICAL APPLICATION DIAGRAM Fig. 1: SP2526A Application Diagram – Two Port Self Powered Hub 1/9 Rev. 2.1.1 SP2526A Dual Channel USB Power Distribution Switch ABSOLUTE MAXIMUM RATINGS OPERATING RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Ambient Temperature Range ..................... -40°C to 85°C Supply Voltage VIN ................................................. 7.0V Fault Flag Voltage VFLG ........................................... 7.0V Fault Flag Current IFLG ........................................... 50mA Enable Input VEN ......................................... -0.3V to 15V Storage Temperature .............................. -65°C to 150°C Soldering Temperature (10sec) ............................. 260°C Maximum Junction Temperature ............................ 125°C Power Dissipation (NSOIC-8) ......................................... (derate 6.14mW/°C above 70°C)...................... 500mW ELECTRICAL SPECIFICATIONS Specifications with standard type are for an Operating Ambient Temperature of TA = 25°C only; limits applying over the full Operating Junction Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TA = 25°C, and are provided for reference purposes only. Unless otherwise indicated, VIN = 5.0V, TA= 25°C. Parameter Min. Supply Current Enable Input Voltage 0.8 Enable Input Current Typ. Max. 0.75 5.0 110 160 1.7 2.0 2.4 0.01 1 0.01 1 1 Enable Input Capacitance Output MOSFET Resistance 110 Output turn-on delay 100 Units µA V µA Conditions VEN = Logic “0” OUT =open VEN = Logic “1” OUT =open VEN = Logic “0” VEN = Logic “1” VEN = Logic “0” VEN = Logic “1” pF 150 mΩ µs RL=10Ω, each output 1000 4000 µs RL=10Ω, each output Output turn-off delay 0.8 20 µs RL=10Ω, each output Output turn-off fall time 0.7 20 µs RL=10Ω, each output 10 µA Output turn-on rise time Output Leakage Current Current limit threshold Over temperature shutdown threshold Error Flag Output Resistance Error Flag Current UVLO threshold 0.6 1.0 1.25 135 A °C 125 Temperature TJ raising Temperature TJ decreasing 10 25 15 40 0.01 1 2.6 Ω µA V 2.4 2/9 VIN=5V, IL=10mA VIN=3.3V, IL=10mA VFLAG=5V VIN increasing VIN decreasing Rev. 2.1.1 SP2526A Dual Channel USB Power Distribution Switch BLOCK DIAGRAM Fig. 2: SP2526A Block Diagram PIN ASSIGNMENT Fig. 3: SP2526A Pin Assignment 3/9 Rev. 2.1.1 SP2526A Dual Channel USB Power Distribution Switch PIN DESCRIPTION Name Pin Number Description ENA 1 Enable Input for channel A. Active High for SP2526A-1 and Active Low for SP2526A-2 FLGA 2 An active-low and open-drained fault flag output for channel A. It can indicate current limit ENA is active. In normal mode operation (ENA and/or ENB is active), it also can indicate thermal shutdown or under voltage FLGB 3 An active-low and open-drained fault flag output for channel B. It can indicate current limit ENA is active. In normal mode operation (ENA and/or ENB is active), it also can indicate thermal shutdown or under voltage ENB 1 Enable Input for channel B. Active High for SP2526A-1 and Active Low for SP2526A-2 OUTB 5 Output for Channel B. This is the output pin of the MOSFET source of channel B, typically connected to the switched side of the load GND 6 Ground IN 7 Power Supply Input OUTA 8 Output for Channel A. This is the output pin of the MOSFET source of channel A, typically connected to the switched side of the load ORDERING INFORMATION(1) Part Number Temperature Range Package Packing Method Lead Free(2) SP2526A-1EN-L/TR -40°C ≤ TA ≤ +85°C NSOIC8 Tape & Reel Yes Enable Active High Note 1 SP2526A-2EN-L/TR -40°C ≤ TA ≤ +85°C NSOIC8 Tape & Reel Yes Enable Active Low Notes: 1. Refer to www.maxlinear.com/SP2526A for most up-to-date Ordering Information. 2. Visit www.maxlinear.com for additional information on Environmental Rating. 4/9 Rev. 2.1.1 SP2526A Dual Channel USB Power Distribution Switch TYPICAL PERFORMANCE CHARACTERISTICS All data taken at VIN = 5.0V, TA = 25°C, unless otherwise specified - Schematic and BOM from Application Information section of this datasheet. Fig. 4: Output On-Resistance vs Supply Voltage Fig. 5: Output On-Resistance vs Temperature Fig. 6: UVLO Threshold vs Temperature Fig. 7: On-state Supply Current vs Supply Voltage Fig. 8: On-state Supply Current vs Temperature Fig. 9: Off-state Supply Current vs Temperature 5/9 Rev. 2.1.1 SP2526A Dual Channel USB Power Distribution Switch Fig. 11: Control Threshold vs Supply Voltage Fig. 10: Off-state Supply Current vs Supply Voltage Fig. 12: Turn-on/Turn-off Characteristics 6/9 Rev. 2.1.1 SP2526A Dual Channel USB Power Distribution Switch APPLICATION INFORMATION lead inductance) which can damage internal control circuitry. ERROR FLAG TRANSIENT REQUIREMENTS An open-drained output of an N-channel MOSFET, the FLG output is pulled low to signal the following fault conditions: input undervoltage, output current limit, and thermal shutdown. USB supports dynamic attachment (hot plugin) of peripherals. A current surge is caused by the input capacitance of a downstream device. Ferrite beads are recommended in series with all power and ground connector pins. Ferrite beads reduce EMI and limit the inrush current during hotattachment by filtering high-frequency signals. CURRENT LIMIT The current limit threshold is preset internally. It protects the output MOSFET switches from damage resulting from undesirable short circuit conditions or excess inrush current, which is often encountered during hot plug-in. The low limit of the current limit threshold of the SP2526A allows a minimum current of 0.6A through the MOSFET switches. A current limit condition will signal the Error Flag. SHORT CIRCUIT TRANSIENT Bulk capacitance provides the short-term transient current needed during a hotattachment event. A 33μF/16V tantalum or a 100μF/10V electrolytic capacitor mounted close to the downstream connector at each port should provide sufficient transient drop protection. THERMAL SHUTDOWN When the chip temperature exceeds 135ºC for any reason other than overcurrent fault of either one of the two MOSFETs, the thermal shutdown function turns off both MOSFET switches and signals the error flag. A hysteresis of 10ºC prevents the MOSFETs from turning back on until the chip temperature drops below 125ºC. However, if thermal shutdown is triggered by chip temperature rise resulting from overcurrent fault condition of either one of the MOSFET switches, the thermal shutdown function will only turn off the switch that is in overcurrent condition and the other switch can still remain its normal operation. In other words, the thermal shutdown function of the two switches is independent of each other in the case of overcurrent fault. PRINTED CIRCUIT LAYOUT The Power circuitry of USB printed circuit boards requires a customized layout to maximize thermal dissipation and to minimize voltage drop and EMI. TEST CIRCUIT SUPPLY FILTERING A 0.1μF to 1μF bypass capacitor from IN to GND, located near the device, is strongly recommended to control supply transients. Without a bypass capacitor, an output short may cause ringing on the input (from supply 7/9 Rev. 2.1.1 SP2526A Dual Channel USB Power Distribution Switch PACKAGE SPECIFICATION 8-PIN NSOIC 8/9 Rev. 2.1.1 SP2526A Dual Channel USB Power Distribution Switch REVISION HISTORY Revision Date Description 2.0.0 11/19/2010 Reformat of datasheet 2.1.0 11/04/2011 Updated package specification 2.1.1 01/22/2020 Updated to MaxLinear logo. Updated Ordering Information. CORPORATE HEADQUARTERS: 5966 La Place Court Suite 100 Carlsbad, CA 92008 Tel.: +1 (760) 692-0711 Fax: +1 (760) 444-8598 www.maxlinear.com The content of this document is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Maxlinear, Inc. Maxlinear, Inc. Assumes no responsibility or liability for any errors or inaccuracies that may appear in the informational content contained in this guide. Complying with all applicable copyright laws is the responsibility of the user. Without limiting the rights under copyright, no part of this document may be reproduced into, stored in, or introduced into a retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), or for any purpose, without the express written permission of Maxlinear, Inc. Maxlinear, Inc. Does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Maxlinear, Inc. Receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of Maxlinear, Inc. Is adequately protected under the circumstances. Maxlinear, Inc. May have patents, patent applications, trademarks, copyrights, or other intellectual property rights covering subject matter in this document. Except as expressly provided in any written license agreement from Maxlinear, Inc., the furnishing of this document does not give you any license to these patents, trademarks, copyrights, or other intellectual property. Maxlinear, the Maxlinear logo, and any Maxlinear trademarks, MxL, Full-Spectrum Capture, FSC, G.now, AirPHY and the Maxlinear logo are all on the products sold, are all trademarks of Maxlinear, Inc. or one of Maxlinear’s subsidiaries in the U.S.A. and other countries. All rights reserved. Other company trademarks and product names appearing herein are the property of their respective owners. © 2011 - 2020 Maxlinear, Inc. All rights reserved. 9/9 Rev. 2.1.1
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