XR46000
N-Channel Power MOSFET
Description
The XR46000 is a silicon N-channel enhanced power MOSFET.
With low conduction loss, good switching performance and high
avalanche energy, it is suitable for various power supply system,
especially for AC step driving application for LED lighting.
The package type is SOT-223, which comply with the RoHS standard.
APPLICATIONS
■■ LED lighting applications
Downlight
High bay
Specialty
Architectural
Key Parameters
VDSS
600V
ID
1.5A
PD (TC = 25°C)
20W
RDS,ON,typ
7.0Ω
FEATURES
■■ Fast switching
■■ ESD improved capability
■■ Low gate charge (Typ. 7.5nC)
■■ Low reverse transfer capacitance
(Typ. 5.0pF)
Equivalent Circuit
Pin Configuration
Drain
Drain
1
Gate
Gate
2
3
Drain Source
SOT-223, Top View
Source
Figure 1. Equivalent Cirucit
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XR46000
Absolute Maximum Ratings
Operating Conditions
Stresses beyond the limits listed below may cause
permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect
device reliability and lifetime.
TJ operating junction temperature.............................. 150°C
TA operating ambient temperature................. -40°C to 85°C
TC = 25°C unless otherwise noted.
VDSS drain-to-source voltage....................................... 600V
ID continuous drain current (TC = 25°C)........................ 1.5A
ID continuous drain current (TC = 100°C).................... 0.85A
IDM pulsed drain current................................................... 6A
VGS gate-to-source voltage.......................................... ±30V
PD power dissipation (TC = 25°C)................................. 20W
PD derating factor above 25°C.............................. 0.16W/°C
TSTORAGE storage temperature range.......... -65°C to 150°C
EAS single pulse avalanche energy..............................80mJ
NOTE:
Unless otherwise noted, all tests are pulsed tests at the specified temperature,
therefore: TJ = TC = TA.
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XR46000
Electrical Characteristics
TC = 25°C unless otherwise noted.
Symbol
Parameter
Conditions
Min
600
Typ
Max
Units
OFF Characteristic
BVDSS
Drain to source breakdown voltage
VGS = 0V, ID = 250µA
∆BVDSS/∆TJ
Breakdown voltage temperature coefficient
ID = 250µA, reference 25°C
IDSS
Drain to source leakage current
IGSS(F)
IGSS(R)
V
0.71
V/°C
VDS = 600V, VGS = 0V, TA = 25°C
25
VDS = 600V, VGS = 0V, TA = 125°C
250
Gate to source forward leakage
VGS = 30V
12
Gate to source reverse leakage
VGS = -28V
-12
µA
µA
ON Characteristic (pulse width tp ≤ 380µs, б ≤ 2%)
RDS(ON)
Drain to source on-resistance
VGS = 10V, ID = 0.75A
VGS(TH)
Gate threshold voltage
VDS = VGS, ID = 250µA
7.0
2.0
8.0
Ω
4.0
V
Dynamic Characteristic
gfs
Forward transconductance
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer capacitance
VDS = 15V, ID = 0.75A
1.0
s
170
VGS = 0V, VDS = 25V, f = 1MHz
27
pF
5
Resistive Switching Characteristic
td(ON)
Turn-on delay time
8
tr
Rise time
td(OFF)
Turn-off delay time
tf
Fall time
55
Qg
Total gate charge
7.5
Qgs
Gate to source charge
Qgd
Gate to drain “Miller” charge
ID = 1.5A, VDD = 300V, VGS = 10V,
RG = 4.7Ω
ID = 1.5A, VDD = 480V, VGS = 10V
30
ns
22
nC
1.7
4.0
Source-Drain Diode Characteristics (pulse width tp ≤ 380us, б ≤ 2%)
IS
Continuous source current (body diode)
1.5
ISM
Maximun source current (body diode)
6.0
VSD
Diode forward voltage
Trr
Reverse recovery time
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
A
IS = 1.5A, VGS =0V
ID = 1.5A, TJ = 25°C, dIF/dt = 100A/µs,
VGS = 0V
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1.5
V
530
ns
1100
nC
4.4
A
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XR46000
Typical Performance Characteristics
ID, Drain Current (A)
10
10μs
1
10ms
100ms
0.1
Operation in this area may
be limited by RDS(ON)
0.01
TJ = 150°C
TC = 25°C
Single Pulse
0.001
DC
10
100
VDS, Drain-to-Source Voltage (V)
1
1000
Figure 2. Safe Operating Area
12
RDS(ON), Drain-to-Source
ON Resistance (Ω)
11
ID = 1.5A
10
Pulse duration = 10µs
Duty factor = 0.5% Max
TC = 25°C
ID = 0.75A
9
ID = 0.375A
8
7
6
6
4
8
10
VGS, Gate-to-Source Voltage (V)
12
14
Figure 3. Typical Drain-to-Source ON Resistance vs. Gate Voltage and Drain Current
RDS(ON), Drain-to-Source
ON Resistance, Normalized
2.5
2
VGS = 10V
ID = 250µA
1.5
1
0.5
0
-100
-50
0
100
50
TJ, Junction Temperature (°C)
150
200
Figure 4. Typical Drain-to-Source ON Resistance vs. Junction Temperature
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XR46000
Package Description
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XR46000
Ordering Information
Part Number
Operating
Temperature Range
Environmental Rating
XR46000ESE
XR46000ESETR
-40°C ≤ TJ ≤ 150°C
RoHS compliant and Green(1)
XR46000ECF
Package
Packaging Method
SOT-223
Bulk
SOT-223
Tape and reel
Dice
Wafer
NOTE:
1. Visit www.exar.com for more information.
Revision History
Revision
Date
Description
1A
Aug 2016
Initial release
www.exar.com
48760 Kato Road
Fremont, CA 94538
USA
Tel.: +1 (510) 668-7000
Fax: +1 (510) 668-7001
Email: LEDtechsupport@exar.com
Exar Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. Exar Corporation conveys
no license under any patent or other right and makes no representation that the circuits are free of patent infringement. While the information in this publication has been
carefully checked, no responsibility, however, is assumed for inaccuracies.
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to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Exar Corporation
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©2016 Exar Corporation
XR46000_DS_081716
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