XRD8785
CMOS 8-Bit High Speed
Analog-to-Digital Converter
April 2002
FEATURES
• 8-Bit Resolution
• 20-Pin Package Available: XRD8775
• 3V Version: XRD87L85
• Up to 20 MHz Sampling Rate
• Internal S/H Function
• Single Supply: 5V
• VIN DC Range: 0V to VDD
• VREF DC Range: 1V to VDD
• Low Power: 75mW typ. (excluding reference)
APPLICATIONS
• Digital Color Copiers
• Cellular Telephones
• CCDs and Scanners
• Video Capture Boards
• Latch-Up Free
• ESD Protection: 2000V Minimum
GENERAL DESCRIPTION
The XRD8785 is an 8-bit Analog-to-Digital Converter.
Designed using an advanced 5V CMOS process, this
part offers excellent performance, low power consumption, and latch-up free operation.
This device uses a two-step flash architecture to
maintain low power consumption at high conversion
rates. The input circuitry of the XRD8785 includes an
on-chip S/H function which allows the user to digitize
analog input signals between AGND and AVDD. Careful
design and chip layout have achieved a low analog
input capacitance. This reduces “kickback” and eases
the requirements of the buffer/amplifier used to drive
the XRD8785. The designer can choose the internally
generated reference voltages by connecting VRB to
VRBS and VRT to VRTS, or provide external reference
voltages to the VRB and VRT pins. The internal reference
generates 0.6V at VRB and 2.6 V at VRT. Providing
external reference voltages allows easy interface to
any input signal range between AGND and AVDD. This
also allows the system to adjust these voltages to
cancel zero scale and full scale errors, or to change the
input range as needed.
The device operates from a single +5V supply. Power
consumption is 75mW at FS = 15MHz. Specified for
operation over the commercial/industrial (–40 to
+85°C) temperature range, the XRD8785 is available in
Plastic Dual-in-line (PDIP), Surface Mount (SOIC) and
Small Outline (SOP) packages in EIAJ and JEDEC.
SIMPLIFIED BLOCK AND TIMING DIAGRAM
Rev. 3.00
EXAR Corporation, 48720 Kato Road, Fremont, CA 94538 • (510) 668-7000 • FAX (510) 668-7017
XRD8785
ORDERING INFORMATION
Package
Type
Temperature
Range
Part No.
DNL
(LSB)
INL
(LSB)
SOIC (Jedec)
–40 to +85°C
XRD8785AID
+/- 0.75
+/-1.5
SOP (EIAJ)
–40 to +85°C
XRD8785AIK
+/- 0.75
+/-1.5
Plastic Dip (300MIL)
–40 to +85°C
XRD8785AIP
+/- 0.75
+/-1.5
PIN CONFIGURATIONS
See Packaging Section for Package Dimensions
24-Pin SOP (EIAJ, 5.4mm) – K24
24-Pin SOIC (Jedec, 300 MIL) – D24
24-Pin PDIP (300 MIL) - P24
PIN OUT DEFINITIONS
NAME
DESCRIPTION
PIN NO.
1
OE
Output Enable
2
DGND
PIN NO.
NAME
DESCRIPTION
13
DVDD
Digital Power Supply
Digital Ground
14
AVDD
Analog Power Supply
AVDD
Analog Power Supply
3
DB0
Data Output Bit 0 (LSB)
15
4
DB1
Data Output Bit 1
16
VRTS
Generates 2.6 V if tied to VRT
5
DB2
Data Output Bit 2
17
VRT
Top Reference
6
DB3
Data Output Bit 3
18
AVDD
Analog Power Supply
7
DB4
Data Output Bit 4
19
VIN
Analog Input
8
DB5
Data Output Bit 5
20
AGND
Analog Ground
9
DB6
Data Output Bit 6
21
AGND
Analog Ground
10
DB7
Data Output Bit 7 (MSB)
22
VRBS
Generates 0.6 V if tied to VRB
VRB
Bottom Reference
DGND
Digital Ground
11
DVDD
Digital Power Supply
23
12
CLK
Sampling Clock Input
24
Rev. 3.00
2
XRD8785
ELECTRICAL CHARACTERISTICS TABLE
UNLESS OTHERWISE SPECIFIED: AVDD = DVDD = 5V, FS = 15MHZ (50% DUTY CYCLE),
VRT = 2.6V, VRB = 0.6V, TA = 25°C
25°C
Parameter
Symbol
Min
FS
0.1
Typ
Max
Units
15
20
MHz
Test Conditions/Comments
KEY FEATURES
Resolution
8
Sampling Rate
Bits
ACCURACY
Differential Non-Linearity
DNL
Differential Non-Linearity
DNL
+/-0.75
Integral Non-Linearity
INL
Zero Scale Error
EZS
+3
LSB
Full Scale Error
EFS
-2
LSB
+/-0.5
+/-1.5
LSB
@ 15MHz
LSB
@ 10MHz
LSB
Best Fit Line
(Max INL – Min INL)/2
REFERENCE VOLTAGES
Positive Ref. Voltage
VRT
Negative Ref. Voltage
VRB
Differential Ref. Voltage3
Ladder Resistance
Ladder Temp. Coefficient
2.6
AGND
V REF
1.0
RL
245
AVDD
V
AVDD
V
550
Ω
0.6
350
V
RTCO
2000
ppm/°C
Short VRB and VRBS
VRB
0.6
V
Short VRT and VRTS
VRT-VRB
2
V
2.3
V
VREF = VRT – VRB
Self Bias 1
Self Bias 2
VRB = AGND,
VRT
Short VRT and VRTS
ANALOG INPUT
Input Bandwidth (–1 dB)2, 4
BW
Input Voltage Range
VIN
Input Capacitance
5
Aperture Delay2
50
VRB
MHz
VRT
V
CIN
16
pF
tAP
3
ns
DIGITAL INPUTS
Logical “1” Voltage
VIH
Logical “0” Voltage
VIL
DC Leakage Currents 6
IIN
4.0
V
1.0
V
VIN =DGND to DVDD
CLK
5
OE
5
µA
µA
5
pF
Input Capacitance
Clock Timing ( See Figure 1.)7
Clock Period
1/FS
50
66.7
ns
High Pulse Width
tPWH
25
33.3
ns
Low Pulse Width
tPWL
25
33.3
ns
Logical “1” Voltage
VOH
4.5
Logical “0” Voltage
VOL
3-state Leakage
IOZ
Data Valid Delay 8
t DL
Data Enable Delay
Data 3-state Delay
C OUT =15 pF
DIGITAL OUTPUTS
V
I LOAD = 4 mA
V
I LOAD = 4 mA
10
µA
V OUT =DGND to DVDD
10
ns
tDEN
5
ns
tDHZ
5
ns
0.4
Rev. 3.00
3
XRD8785
ELECTRICAL CHARACTERISTICS TABLE (CONT'D)
UNLESS OTHERWISE SPECIFIED: AVDD = DVDD = 5V, FS = 15MHZ (50% DUTY CYCLE),
VRT = 2.6V, VRB = 0.6V, TA = 25°C
25°C
Parameter
Symbol
Min
Typ
Max
Units
Test Conditions/Comments
AC PARAMETERS
Differential Gain Error
dg
2
%
FS = 4 x NTSC
Differential Phase Error
dph
1
Degree
FS = 4 x NTSC
POWER SUPPLIES
Operating Voltage (AVDD, DVDD)9
VDD
Current (AGND + DGND)
I DD
4.5
5
5.5
V
15
25
mA
Does not include ref. current
NOTES
1. The difference between the measured and the ideal code width (VREF/256) is the DNL error (Figure 3). The INL error is the maximum distance (in LSBs) from the best fit line to any transition
voltage (Figure 4). Accuracy is a function of the sampling rate (FS).
2. Guaranteed, not tested
3. Specified values guarantee functionality. Refer to other parameters for accuracy.
4. –1dB bandwidth is a measure of performance of the A/D input stage (S/H + amplifier). Refer to other parameters for accuracy within the specified bandwidth.
5. See VIN input equivalent circuit (Figure 5). Switched capacitor analog input requires driver with low output resistance.
6. All inputs have diodes to DVDD and DGND. Input DC currents will not exceed specified limits for any input voltage between DGND and DVDD .
7. tR , tF should be limited to >5ns for best results.
8. Depends on the RC load connected to the output pin.
9. AGND & DGND pins are connected through the silicon substrate. Connect together at the package and to the analog ground plane.
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted)1, 2, 3
VDD to GND .......................................................... 7V
Storage Temperature .........................–65 to +150°C
VRT & V RB ......................... VDD +0.5 to GND –0.5V
Lead Temperature (Soldering 10 seconds) ... +300°C
VIN ..................................... VDD +0.5 to GND –0.5V
Package Power Dissipation Rating @ 75°C
All Inputs ............................ VDD +0.5 to GND –0.5V
PDIP, SOIC, SOP ................................. 675mW
All Outputs ......................... VDD +0.5 to GND –0.5V
Derates above 75°C ........................... 12mW/°C
NOTES:
1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification
is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
2. Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies. All inputs have protection
diodes which will protect the device from short transients outside the supplies of less than 100mA for less than 100ms.
3. VDD refers to AVDD and DVDD. GND refers to AGND and DGND.
Rev. 3.00
4
XRD8785
Figure 1. XRD8785 Timing Diagram
Figure 2. Output Enable/Disable Timing Diagram
Figure 3. DNL Measurement
Figure 4. INL Error Calculation
Rev. 3.00
5
XRD8785
Figure 5. Equivalent Input Circuit
Figure 6. Typical Circuit Connections
APPLICATION NOTES
Signals should not exceed VDD +0.5V or go below GND
–0.5V. All pins have internal protection diodes that will
protect them from short transients (
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