XRP1117ESETR-33-F

XRP1117 800mA Low Dropout Positive Voltage Regulator May 2013 Rev. 1.0.0 GENERAL DESCRIPTION APPLICATIONS The XRP1117 is a low power positive-voltage low dropout regulator capable of providing up to 800mA of output load current. This device is available in a fixed 3.3V output voltage and an adjustable output voltage version. The XRP1117 is optimized for low voltage operations where transient response and minimum input voltage are critical. Dropout voltage is guaranteed at a maximum of 1.3V at 800mA, decreasing at lower load currents. As the load current decreases, the quiescent current flows into the load effectively increasing the efficiency of the regulator. On chip trimming adjusts the reference/output voltage to within ± 1%. Built-in over temperature and over-current protection insures safe operation under abnormal operating conditions. The XRP1117 is available in a RoHS compliant, green/halogen free space-saving and low profile 3-pin SOT223 package. • Desktop PC Server • Graphic/Video Card • Industrial Equipment • Power Supplies Post Regulation FEATURES • Guaranteed 800mA Output Current − 1A Peak Current − 1.35A Typical Current Limit • Adjustable and 3.3V Fixed Output Voltage Options − ±1% Accuracy • 1.2V Low Dropout Voltage • Low Quiescent Current • Over Current and Thermal Protection • Lead Free, RoHS Compliant SOT223 Package FUNCTIONAL DIAGRAM Fig. 1: XRP1117 Application Diagram Exar Corporation 48720 Kato Road, Fremont CA 94538, USA www.exar.com Tel. +1 510 668-7000 – Fax. +1 510 668-7001 XRP1117 800mA Low Dropout Positive Voltage Regulator ABSOLUTE MAXIMUM RATINGS OPERATING RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Input Voltage VIN .................................................... 15V Operating Junction Temperature ...............-40°C to 125°C Maximum Output Current.............................. 800mA min Thermal Resistance ..................................................... θJC....................................................................................................... 15°C/W θJA (see Thermal Characteristics in the Application Information) Input Supply Voltage VIN ......................................... 18V Junction Temperature .......................................... 150°C Lead Temperature (Soldering, 10 sec) ................... 260°C Storage Temperature .............................. -65°C to 150°C ESD Rating (HBM - Human Body Model) .................... 2kV ELECTRICAL SPECIFICATIONS Specifications are for an Operating Ambient Temperature of TA = TJ = 25°C only; limits applying over the full Operating Junction Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise indicated, VIN = VOUT + 2V, IOUT = 10mA, TA = TJ = 25°C. Parameter Min. Typ. Max. 3.267 3.235 3.300 3.333 3.365 6 10 15 Units Conditions 3.3V Version Output Voltage 0.5 Line Regulation Load Regulation 2 V mV • • 1.5V≤(VIN–VOUT)≤10V 1.5V≤(VIN–VOUT)≤10V mV Adjustable Voltage Version Load Regulation 0.4 1.262 1.270 0.1 0.2 1 Adjust Pin Current 60 120 µA • Adjust Pin Current Change 0.2 5 µA • 1.5V≤(VIN–VOUT)≤10V Minimum Load Current 1.7 5 mA • 1.5V≤(VIN–VOUT)≤10V 1.2 1.3 V Reference Voltage 1.238 1.225 1.250 0.001 Line Regulation V % • • 1.5V≤(VIN–VOUT)≤10V 1.5V≤(VIN–VOUT)≤10V % All Voltage Options Dropout Voltage Current Limit 1.35 A Ripple Rejection 70 dB Output Voltage Temperature Stability 0.5 % 1.0 IOUT=800mA, ∆VREF=1%2 f=120Hz, COUT=22µF, IOUT=300mA, (VIN–VOUT)=3V RMS Output Noise 0.003 % % of VOUT, 10Hz≤f≤10kHz Thermal Shutdown 160 °C Junction temperature 16 °C Thermal Shutdown Hysteresis Note 2: Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage with respect to the nominal output voltage at VIN=VOUT+2V © 2013 Exar Corporation 2/9 Rev. 1.0.0 XRP1117 800mA Low Dropout Positive Voltage Regulator PIN ASSIGNMENT Fig. 2: XRP1117 Pin Assignment (Top View, TAB connected to VOUT) ORDERING INFORMATION Part Number Temperature Range XRP1117ESETR-F -40°C≤TJ≤+125°C XRP1117ESETR-33-F -40°C≤TJ≤+125°C Marking 1117ESE YYWWF 1117ESE 33YYWWF Package Packing Quantity Note 1 SOT223-3 2.5K/Tape & Reel Halogen Free SOT223-3 2.5K/Tape & Reel Halogen Free Note 2 Adjustable Output Voltage 3.3V Output Voltage “YY” = Year – “WW” = Work Week – “F” = Halogen Free Indicator - “X” = Lot Number © 2013 Exar Corporation 3/9 Rev. 1.0.0 XRP1117 800mA Low Dropout Positive Voltage Regulator TYPICAL PERFORMANCE CHARACTERISTICS All data taken at TA = TJ = 25°C, unless otherwise specified - Schematic and BOM from Application Information section of this datasheet. Fig. 3: Reference Voltage vs Juction Temperature XRP1117ESETR-F, VIN=4.5V, IOUT=10mA Fig. 4: Minimum Load Current vs Junction Temperature XRP1117ESETR-F, VIN=4.5V Fig. 5: Dropout Voltage vs. Output Current Fig. 6: Line Transient Response Fig. 7: Load Transient Response, 10mA-800mA Fig. 8: PSRR vs. Frequency © 2013 Exar Corporation 4/9 Rev. 1.0.0 XRP1117 800mA Low Dropout Positive Voltage Regulator Fig. 9: Current Limit vs. Junction Temperature VIN=4.5V, no heatsink, VOUT= VOUT(nom)x98% Fig. 10: Dropout Voltage vs. Junction Temperature APPLICATION INFORMATION 5.0mA minimum regulation. OUTPUT VOLTAGE For fixed voltage option, the resistors R1 and R2 are included in the regulator. The typical application circuits for the adjustable output regulator are shown below in Figures 15. is required for INPUT CAPACITOR A XRP1117 device located more than a few inches away from the power source may require an input bypass capacitor Cin for regulator stability. This capacitor will reduce the circuit’s sensitivity when powered from a complex source impedance and significantly enhance the output transient response. The input bypass capacitor should be mounted with the shortest possible traces as close as possible to the regulator’s input and ground terminals. A 10µF ceramic or tantalum capacitor should be adequate for most applications. The adjustable output voltage device is a floating voltage regulator. The XRP1117 develops and maintains a nominal 1.25 V reference voltage between the output and adjust pins. The reference voltage is programmed to a constant current source by resistor R1, and this current flows through R2 to ground to set the output voltage. The output of the adjustable regulator can be set to any voltage between 1.25V and 15V. The value of VOUT can be quickly approximated using the formula 1.25 OUTPUT CAPACITOR The XRP1117 requires an output capacitor of at least 22µF (tantalum or ceramic or Aluminum Electrolytic) to ensure stability. The value may change based on the application requirements of the output load or temperature range. The value of ESR can vary based on the type of capacitor used in the applications to guarantee stability. The recommended value for ESR is 0.5Ω or less. A larger value of output capacitance (up to 100µF) can improve the loop stability and load A small correction to this formula is required depending on the values of resistors R1 and R2, since the adjustable pin current (approx 50µA) flows through R2. When IADJ is taken into account, the formula becomes Where VREF=1.25V The programmed current level is usually selected to be greater than the specified © 2013 Exar Corporation that 5/9 Rev. 1.0.0 XRP1117 800mA Low Dropout Positive Voltage Regulator transient response as well as reducing output noise. and input pins of the device can withstand microsecond surge currents. A combination of large output capacitors and an input pin instantaneously shorted to ground may cause some damage to the device; under these conditions, a diode between the output (anode) and input (cathode) pins is recommended. SOLDERING METHODS The XRP1117 SOT-223 package is designed to be compatible with infrared reflow or vaporphase reflow soldering techniques. During soldering, the non-active or mildly active fluxes may be used. The XRP1117 die is attached to the heatsink lead which exits opposite the input, output, and ground pins. Fig. 11: Load Step Response 10mA to 800mA VIN=3.3V, VOUT=1.8V, CIN=10µF, COUT=22µF Ceramic ch1=VOUT, ch4=ILOAD, time=100us/div Hand soldering and wave soldering should be avoided since these methods can cause damage to the device with excessive thermal gradients on the package. The SOT-223 recommended soldering method are as follows: vapor phase reflow and infrared reflow with the component preheated to within 65°C of the soldering temperature range. THERMAL CHARACTERISTICS The junction-to-ambient thermal resistance (θJA) of XRP1117 is dependent on the PCB layout. The XRP1117 features an internal thermal limiting circuitry to protect the device during overload conditions. Special care needs to be taken during continuous load conditions such that the maximum junction temperature does not exceed 125 °C. Thermal protection is activated at >160°C and deactivated at