XRP2524IDTR-F

XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch October 2012 Rev. 1.0.0 GENERAL DESCRIPTION APPLICATIONS The XRP2524 is a dual channel integrated high-side power distribution switch optimized for self or bus-powered USB applications and it is compliant with the latest USB 3.0 specification. It accepts an input voltage between 2.7V and 6.5V allowing for operations from industry standard 3.3V and 5V power rails. The XRP2524 is provided with an enable pin while an error flag is available to indicate fault conditions. With a low quiescent current as well as a small package, the XRP2524 is ideal for battery powered applications. The powerswitch rise and fall times are controlled to minimize current surges during turn on/off. Built-in over current, reverse current and over temperature protections insure safe operations under abnormal operating conditions. XRP2524 is offered in a RoHS compliant “green”/halogen free 8-pin NSOIC package.  Self Powered USB 2.0 and 3.0 Hubs  USB Compliant VBUS Power Distribution  Portable Equipment FEATURES  Dual Channel Current Switch  1A continuous load current per channel  1.5A Typical Over-current Limit  2.7V to 6.5V Input Voltage Range  USB 2.0 and USB 3.0 Compliant  Active High Enable  Soft Start  Channel Error Flag Indicator  9ms Blanking Time  UVLO, Reverse Current, Short circuit and Thermal Shutdown Protection  RoHS Compliant, Green/Halogen Free 8-Pin NSOIC Package TYPICAL APPLICATION DIAGRAM Fig. 1: XRP2524 Application Diagram Exar Corporation 48720 Kato Road, Fremont CA 94538, USA www.exar.com Tel. +1 510 668-7000 – Fax. +1 510 668-7001 XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch ABSOLUTE MAXIMUM RATINGS OPERATING RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Input Voltage Range VIN ............................... 2.7V to 6.5V Ambient Temperature Range ..................... -40°C to 85°C Thermal Resistance θJA .....................................160ºC/W VIN ...................................................................... 7.0V VENX, VFLGX ................................................ -0.3V to 7.0V Storage Temperature .............................. -65°C to 150°C Junction Temperature .......................................... 150°C Power Dissipation ................................ Internally Limited Lead Temperature (Soldering, 10 sec).................... 260°C ESD Rating (HBM - Human Body Model) .................... 2kV ELECTRICAL SPECIFICATIONS Specifications are for an Operating Temperature of TA = TJ = 25°C only; limits applying over the full Operating Ambient Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at T A = 25°C, and are provided for reference purposes only. Unless otherwise indicated, V IN = 5V, CIN = COUT = 1µF, TA = 25°C. Parameter Input Supply Voltage Min. Typ. 2.7 Max. Units 6.5 V Conditions Input Quiescent Current 80 160 µA VIN=5V, No load Both channels enabled Input Shutdown Current 0.2 2 µA VIN=5V, No load, Switch OFF Maximum Output Current per channel A 1 Output Leakage Current 0.5 1 µA VEN=0V, VOUT=0V Output MOSFET Resistance 90 110 mΩ IOUT=0.1A Output turn-on rise time 1000 2500 µs RL=10Ω each output, COUT not used Output turn-off fall time 0.7 20 µs RL=10Ω each output, COUT not used 1.5 2 A Current limit threshold EN input threshold 1 1.3 1.8 V EN Input Current 0.01 0.1 µA Over temperature shutdown threshold 150 °C Over temperature shutdown threshold hysteresis 30 °C 0.6 Under-voltage lockout threshold 2.3 V Under-voltage lockout hysteresis 200 mV FLG blanking time FLG Leakage Current © 2012 Exar Corporation 9 0.01 EN = HIGH Temperature rising VIN rising ms 1 2/10 µA VFLG=5V Rev. 1.0.0 XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch BLOCK DIAGRAM Fig. 2: XRP2524 Block Diagram PIN ASSIGNMENT XRP2524 ENA 1 8 OUTA FLGA 2 7 IN FLGB 3 6 GND ENB 4 5 OUTB NSOIC-8L Fig. 3: XRP2524 Pin Assignment © 2012 Exar Corporation 3/10 Rev. 1.0.0 XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch PIN DESCRIPTION Name Pin Number Description ENX 1, 4 Channel Enable Input Active High FLGX 2, 3 Error Flag Signal Active low open drain output. Active on over-current, over-temperature or short-circuit conditions. GND 6 Ground Signal IN 7 Voltage Input Pin OUTX 5, 8 Voltage Output Pin ORDERING INFORMATION Part Number XRP2524IDTR-F XRP2524EVB Temperature Range -40°C≤TA≤+85°C Marking 2524ID YYWWF XXX Package NSOIC-8 Packing Quantity Note 1 Note 2 Dual Channel 2.5K/Tape & Reel RoHS Compliant Active high Halogen Free XRP2524 Evaluation Board “YY” = Year – “WW” = Work Week – “X” = Lot Number; when applicable. © 2012 Exar Corporation 4/10 Rev. 1.0.0 XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch TYPICAL PERFORMANCE CHARACTERISTICS All data taken at VIN = 5V, C IN = 1µF, COUT = 1µF, TJ = TA = 25°C, unless otherwise specified - Schematic and BOM from Application Information section of this datasheet. Fig. 4: Output On-Resistance vs. Supply Voltage Fig. 5: Output On-Resistance vs. Temperature Fig. 6: ON-State Supply Current vs. Supply Voltage Fig. 7: ON-State Supply Current vs. Temperature Fig. 8: Current Limit Threshold vs. Supply Voltage Fig. 9: Current Limit Threshold vs. Temperature © 2012 Exar Corporation 5/10 Rev. 1.0.0 XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch Fig. 10: Flag Delay Time vs. Supply Voltage Fig. 11: Flag Delay Time vs. Temperature Fig. 12: Enable Threshold vs. Supply Voltage Fig. 13: UVLO Threshold Voltage vs. Temperature Fig. 14: Output Rising Time vs. Temperature Fig. 15: Short circuit protection VIN = 5.0V © 2012 Exar Corporation 6/10 Rev. 1.0.0 XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch Fig. 16: Turn-On/Off Characteristics COUT=1µF, RLOAD=10Ω Fig. 17: Turn-On/Off Characteristics COUT=1µF, RLOAD =5.1Ω Fig. 18: Current Limit Operation VIN = 5.5V, RLOAD = 3.3Ω © 2012 Exar Corporation 7/10 Rev. 1.0.0 XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch APPLICATION INFORMATION condition persists continuously for longer than the blanking time of 9ms typical. The blanking time prevents erroneous reporting of current faults due to brief output current spikes. The XRP2524 device is a dual channel integrated high-side power distribution switch that can be used in any self or bus powered USB applications. It is compliant with the latest USB 3.0 specifications. The reverse current protection feature prevents current to flow from OUT to IN when the device is disabled. Once activated, the error flag signal remains low until all fault conditions have been removed. CURRENT LIMIT The current limit threshold is preset internally. It protects the output MOSFET switch from damages resulting from undesirable short circuit conditions or excess inrush current, which is often encountered during hot plug-in. The low limit of the current limit threshold of the XRP2524 allows a minimum current of 1A through the MOSFET switch. INPUT & OUTPUT It is important to place a 1μF ceramic bypass capacitor from IN to GND as close as possible to the device in order to control supply transients. A high capacitor value and short wires from power supply to VIN can further reduce voltage droop on the input. An over-current condition is detected once the current limit threshold is exceeded, and output current is then limited to a constant current value. Triggering the current limit function is signaled by the Error Flag after 9ms of blanking time period. Placing bulk capacitance of at least 22μF at the output pin reduces power supply transients under heavy current load conditions. Furthermore, bypassing the output pin with a 0.1μF to 1μF ceramic capacitor placed close to OUT and PGND improves the device response to short-circuit transients. UNDER-VOLTAGE LOCKOUT Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply exceeds 2.3V typically, even if the switch is enabled. Upon detection of an input voltage below approximately 2.1V, the power switch is turned off. ENABLE CONTROL The device is disabled when the enable pin is in logic low condition. During this condition, the internal circuitry and the switch are turned off thereby reducing the supply current to 0.1µA typical. Enable must be driven logic high for a clearly defined input. Floating the input may cause unpredictable operation. THERMAL PROTECTION Internal thermal sensing circuitry monitors the operating temperature of the device. Upon detection of a temperature in excess of 145°C, the power switch is disabled preventing any damages to the device while a fault condition is reported by the error flag signal. A built-in 30°C hysteresis allows the device to cool down to 130°C before resuming normal operation by turning the switch on. At this time, the error flag signal is cleared. ERROR FLAG The error flag signal (FLG output pin) is an open-drain output and is pulled low (active low) upon detection of the following fault conditions:    Over-current condition Over-temperature condition Short-circuit condition Over–current, over-temperature and shortcircuit conditions are reported only if the © 2012 Exar Corporation 8/10 Rev. 1.0.0 XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch TEST CIRCUIT PACKAGE SPECIFICATION 8-PIN NSOIC © 2012 Exar Corporation 9/10 Rev. 1.0.0 XRP2524 1A Dual Channel USB 3.0 Power Distribution Switch REVISION HISTORY Revision Date 1.0.0 11/05/2012 Description Initial release of datasheet FOR FURTHER ASSISTANCE Email: customersupport@exar.com powertechsupport@exar.com Exar Technical Documentation: http://www.exar.com/TechDoc/default.aspx? EXAR CORPORATION HEADQUARTERS AND SALES OFFICES 48720 Kato Road Fremont, CA 94538 – USA Tel.: +1 (510) 668-7000 Fax: +1 (510) 668-7030 www.exar.com NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user’s specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. or its in all Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. © 2012 Exar Corporation 10/10 Rev. 1.0.0