XR-T3588/89
...the analog plus
V.35 Interface
Receiver/Transmitter
company TM
June 1997-3
FEATURES
APPLICATIONS
Compatible with ITU-T V.35 and Bell 306 Interface
Requirements
High Speed Data Transmission Systems
TTL Input Compatibility
Short Haul Modems
High Common Mode Output Voltage Range
Signal Converters and Adapters
Excellent Stability over Supply and Temperature
Range
Network and Diagnostic Systems
High Speed Operation (up to 10Mbps)
Matrix Switches
Individual Receive/Transmit Power Down Capability
Modem Emulators
GENERAL DESCRIPTION
This V.35 chip set consists of two bipolar chips, one
performing a receive function, the other a transmit
function according to the specification requirements laid
down in Appendix 11 of the V.35 ITU-T Recommendation
and Bell 306 modem interface specification.
approximately 22mA or each output stage to meet ITU-T
specifications), power-down functions are included in
both devices, allowing any of the three receive/transmit
circuits to be disabled. All inputs and outputs are TTL
compatible and designed to offer maximum versatility and
performance.
Typical applications require three transmit and receive
pairs to establish the link between distant DTE’s at data
rates ranging from 48Kbps to 10Mbps. To conserve
power (especially in the transmitter, which requires
Both the transmitter and receiver require termination
resistors external to each device, to meet the V.35
specification tolerance.
ORDERING INFORMATION
Part No.
Package
Operating
Temperature Range
XR-T3588CN
18 Lead 300 Mil CDIP
0°C to 70°C
XR-T3588CP
18 Lead 300 Mil PDIP
0°C to 70°C
XR-T3589CN
14 Lead 300 Mil CDIP
0°C to 70°C
Rev. 1.05
1997
EXAR Corporation, 48720 Kato Road, Fremont, CA 94538 (510) 668-7000 FAX (510) 668-7017
1
XR-T3588/89
BLOCK DIAGRAM
I/P 1
TTL INPUT
GND
vCC
1
7
vEE
9
INP
4
16
VREF 1
17
O/P 1B
18
O/P 1A
13
VREF 2
15
O/P 2B
14
O/B 2A
10
VREF 3
12
O/P 3B
11
O/B 3A
vee
I/P 2
TTL INPUT
5
INP
vee
I/P 3
TTL INPUT
6
INP
vee
SELA
2
SELB
3
1
SELECTOR
2
3
BIAS
8
BIAS
Figure 1. XR-T3588 Block Diagram
Rev. 1.05
2
XR-T3588/89
GND
1
I/P 1B
12
+
1/P 1A
13
–
I/P 2B
10
+
1/P 2A
11
–
I/P 3B
8
+
1/P 13
9
–
SELA
2
VCC
VEE
14
7
3
SELB
2
1
Selector
3
Figure 2. XR-T3588 Block Diagram
Rev. 1.05
3
4
O/P 1
5
O/P 2
6
O/P 3
XR-T3588/89
PIN CONFIGURATION
GND
SELA
SELB
I/P1
I/P2
I/P3
vCC
BIAS
vEE
1
18
2
17
3
16
4
15
5
14
6
13
7
12
8
11
9
10
O/P1A
O/P1B
VREF1
O/P2B
O/P2A
VREF2
O/P3B
O/P3A
VREF3
GND
SELA
SELB
O/P1
O/P2
O/P3
VEE
18 Lead PDIP, CDIP (0.300”)
XR–T3588
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
I/P1A
I/P1B
1/P2A
1/P2B
I/P3A
I/P3B
14 Lead CDIP (0.300”)
XR–T3589
PIN DESCRIPTION FOR XR-T3588
Pin #
Symbol
Type
Description
1
GND
2
SELA
I
Ground (0V).
Channel Enable Select A Input. TTL compatible input used in conjunction with SELB to
power down individual receiver channels. (see table 2).
3
SELB
I
Channel Enable Select B Input. TTL compatible input used in conjunction with SELA to
power down individual receiver channels (see table 2).
4
I/P1
I
Channel 1 Input. TTL compatible.
5
I/P2
I
Channel 2 Input. TTL compatible.
6
I/P3
I
Channel 3 Input. TTL compatible.
7
VCC
8
BIAS
9
VEE
10
VREF3
O
Channel 3 Voltage Regulator. Provides 3.3V regulated supply for connection of channel 3
transmit termination network (see Figure 6). If the driver is disabled, the voltage output at this
pin will be Vcc - 0.7V.
11
O/P3A
O
Channel 3 Differential Output A. Open collector current output. Current sink capability 22mA
nominal (defined by Rbias). When terminated with network to VREF3 provides an output voltage
with inverse phase to I/P3. DC level with TX and RX termination +/-O.275V nominal.
12
O/P3B
O
Channel 3 Differential Output B. Open collector current output. Current sink capability
22mA nominal (defined by Rbias). When terminated with network to VREF3 provides an output voltage in phase with I/P3. DC level with TX and RX termination +/-O.275V nominal.
13
VREF2
O
Channel 2 Voltage Regulator. Provides 3.3V regulated supply for connection of channel 2
transmit termination network (see Figure 6). If the driver is disabled, the voltage output at this
pin will be Vcc - 0.7V.
14
O/P2A
O
Channel 2 Differential Output A. Open collector current output. Current sink capability 22mA
Nominal (Defined by Rbias). When terminated with network to VREF2 provides an output voltage
with inverse phase to I/P2. DC level with TX and RX termination +/-o.275V nominal.
15
O/P2B
O
Channel 2 Differential Output B. Open collector current output. Current sink capability
22mA nominal (defined by Rbias). When terminated with network to VREF2 provides an output voltage in phase with I/P2. DC level with TX and RX termination +/-O.275V nominal.
Positive Supply (5V).
I
Bias Current Input. DC level 1.1V nominal. Connect external resistor from pin to ground to
define transmitter output current levels (Rbias 3.9k for Iout=22mA).
Negative Supply (-5V).
Rev. 1.05
4
XR-T3588/89
PIN DESCRIPTION FOR XR-T3588 (CONT’D)
Pin #
Symbol
Type
Description
16
VREF1
O
Channel 1 Voltage Regulator. Provides 3.3V regulated supply for connection of channel 1
transmit termination network (see Figure 6). If the driver is disabled, the voltage output at this
pin will be Vcc - 0.7V.
17
O/Pl B
O
Channel I Differential Output B. Open collector current output. Current sink capability 22mA
nominal (defined by Rbias). When terminated with network to VREF1 provides an output voltage in phase with I/P2. DC level with TX and RX termination +/-O.275V nominal.
18
O/Pl A
O
Channel 1 Differential Output A. Open collector current output. Current sink capability 22mA
nominal (defined by Rbias). When terminated with network to VREF2 provides an output voltage
with inverse phase to I/Pl. DC level with TX and RX termination +/-O.275V nominal.
PIN DESCRIPTION FOR XR-T3589
Pin #
Symbol
Type
Description
1
GND
2
SELA
I
Channel Enable Select A Input. TTL compatible input used in conjunction with SELB to
power down individual receiver channels. (see table 2).
3
SELB
I
Channel Enable Select B Input. TTL compatible input used in conjunction with SELA to
power down individual receiver channels (see table 2).
4
O/P1
O
Channel 1 Output. TTL compatible.
5
O/P2
O
Channel 2 Output. TTL compatible.
6
O/P3
O
Channel 3 Output. TTL compatible.
7
VEE
8
I/P3B
I
Channel 3 Differential Input B. Rin 4kL2 nominal. Should be terminated with an external
network to GND (see Figure 8).
9
I/P3A
I
Channel 3 Differential Input A. Rin 4k.Q nominal. Should be terminated with an external
network to GND (see Figure 8).
10
VP2B
I
Channel 2 Differential Input B. Rin 4kL2 nominal. Should be terminated with an external
network to GND (see Figure 8).
11
I/P2A
I
Channel 2 Differential Input A. Rin 4kQ nominal. Should be terminated with an external
network to GND (see Figure 8).
12
I/Pl B
I
Channel I Differential Input B. Rin 4k.Q nominal. Should be terminated with an external
network to GND (see Figure 8).
13
I/PlA
I
Channel I Differential Input A. Rin 4k.Q nominal. Should be terminated with an external
network to GND (see Figure 8).
14
VCC
Ground (0V).
Negative Supply (-5V).
Positive Supply (5V).
Rev. 1.05
5
XR-T3588/89
XR-T3588 ELECTRICAL CHARACTERISTICS
Test Conditions: VCC = 5V ±5%, VEE = -5V ±5%, TA = 0°C to 70°C
Symbol
Parameter
Min.
Typ.
Max.
Unit
Conditions
DC Electrical Characteristics
VCC
Positive Supply Voltage
4.75
5
5.25
V
VEE
Negative Supply Voltage
-4.75
-5
-5.25
V
ICC
Input Current
86
124
mA
1
IEE
Input Current
mA
1
lPCC
Power Down ICC
0.2
10.2
mA
2
IPEE
Power Down lEE
-1.0
-14.0
mA
2
VDIH
High Level Input Voltage
2
VCC
V
Data Inputs
IDIL
Low Level Input Voltage
0
0.8
V
Data Inputs
IDIH
Input Current High
A
Data Inputs
IDIL
Input Current Low
mA
Data Inputs
VSIH
Selector High Level Voltage
2
VCC
V
VSIL
Selector Low Level Voltage
0
0.6
V
ISIL
Selector Input Current Low
-0.6
-132
1.0
-2.1
ISIH
Selector Input Current High
VOL
Output Low Voltage
VOH
Output High Voltage
ZS
Source Impedance
90
RGND
Resistance to Ground
IODIFF
VREF
AC Electrical
-92
mA
50
A
V
3
0.85
V
3
100
110
Ω
Per CCITT V.354,5,6
135
150
165
Ω
Per CCITT V.354,5,6
Output Current Differential
20.2
22.0
23.8
mA
Transmitter Reference Voltage
3.0
3.3
3.6
V
Characteristics6
-0.91
With 3.9K Bias Resistor
Voltage Output
(see Figure 3)
tPLHT
Input to Output
25
50
ns
tPHLT
Input to Output
25
50
ns
tRT
TX Rise Time
10
20
ns
tFT
TX Fall Time
10
20
ns
Notes
1 With extemal transmit network (Figure 6) connected to each transmitter output and select A, select B both high.
2 All transmitter outputs open-circuit and select A, select B both low.
3 With extemal transmit network terminated with 100Ω (Figure 7).
4 Differential impedance between O/P A and O/P B. extemal transmit network (Figure 6) connected to transmitter output.
5 O/P A’s and O/P Bs connected together, resistance measured to ground, extemal transmit network ((Figure 6) present.
6 O/P terminated with extemal transmit network terminated with 100Ω (See Figure 7).
Specifications are subject to change without notice
Rev. 1.05
6
XR-T3588/89
XR-T3589 ELECTRICAL CHARACTERISTICS
Test Conditions: VCC = 5V ±5%, VEE = -5V ±5%, TA = 0°C to 70°C
Symbol
Parameter
Min.
Typ.
Max.
Unit
Conditions
DC Electrical Characteristics
Vcc
Supply Voltage
4.75
5
5.25
V
VEE
Supply Voltage
-5.25
-5
-4.75
V
ICC
Input Current
40
60
mA
Select A, Select B, Both High
IEE
Input Current
7
9
mA
Select A, Select B, Both High
IOH
Output High Level Current
A
VOH ≥ 2.4V
IOL
Output Low Level Current
40
mA
VOL < 0.4V
VOH
High Level Output
VOL
Low Level Output
VIN
Input Sensitivity
400
mV
Differential2
ZINO
Input Impedance
8
kΩ
Differential2
ZINT
Input Impedance
90
100
110
Ω
Per ITU-T V.351, 2
RGND
Resistance to GND
135
150
165
Ω
Per ITU-T V.351, 2
VSIH
Select High Level Voltage
VCC
V
-1.6
2.4
0.4
VSIL
Select Low Level Voltage
lPCC
Power Down ICC Current
IPEE
Power Down IEE Current
2
0.8
1.1
V
at IOH < 40A
V
at IOL < 1.6mA
V
mA
-0.3
Select A, Select B, Both Low
mA
AC Electrical Characteristics (see Figure 4)
tPLHR
Input to Output
50
70
ns
tPHLR
Input to Output
50
70
ns
tRR
RX Rise Time
18
40
ns
tFR
RX Fall Time
12
30
ns
Notes
1 I/P terminated to circuit 102 (see Figure 8.)
2 Pins 8-9, 10-11, 12-13.
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS
Supply Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7V
Storage Temperature . . . . . . . . . . . . -65°C to + 150°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
XR-T3588CN . . . . . . . . . . . . . . . . . . . 1000mW
XR-T3589CN . . . . . . . . . . . . . . . . . . . . 300mW
Rev. 1.05
7
XR-T3588/89
I/P
O/PB
O/PA
90%
10%
tPLHT
tPHLT
tRT
tFT
Figure 3. Transmitter Waveforms
I/P B
I/P A
90%
10%
O/P
tPLHR
tPHLR
tRR
tFR
Figure 4. Receiver Waveforms
SYSTEM DESCRIPTION
XR–T3588
XR–T3589
The function of the transmitter is to take a TTL input signal
at a maximum bit rate of 1OMbps and output a balanced
differential signal with a peak amplitude of 0.55V and a
maximum DC offset of 0.6V. An internal buffer provides
the regulated output voltage to set the mean level of the
transmitters to less than 0.6V. Figure 5 shows a simplified
circuit for the output stage.
The XR-T3589 Line Receiver contains three identical
receive circuits to complement the XR-T3588 Line
Transmitter. Received differential signals are converted
into a single TTL compatible output. The input stage is
designed to meet the full V.35 noise and common mode
input specification.
To meet the pulse shape and offset requirements laid
down in the V.35 specification, the transmitter employs an
internal temperature compensated voltage generator to
provide reference voltages for both offset control and
output current generation. Load resistors for the output
stage, which provide the required source impedance for
the transmitter, are external to the IC and are required to
meet the V.35 specified tolerance.
Individual receivers may be shut down to achieve power
savings for applications not requiring three channels. Two
TTL compatible inputs provide four combinations of
transmitter configurations, as defined in table 2. If either of
the select pins is left open a high state is adopted, hence
with no inputs applied, all channels are powered up.
However it is recommended to tie all select inputs to either
GND or VCC.
Rev. 1.05
8
XR-T3588/89
Transmitter
SEL A
SEL B
Transmitter
SEL A
SEL B
1-2-3
ON
HIGH
HIGH
1-2-3
ON
HIGH
HIGH
1-2
ON
HIGH
LOW
1-2
ON
HIGH
LOW
1
ON
LOW
HIGH
1
ON
LOW
HIGH
ALL
OFF
LOW
LOW
ALL
OFF
LOW
LOW
Table 1. Transmitter Selectors
Table 2. Receiver Selectors
TYPICAL APPLICATIONS
qJA for the ceramic package of 80°C/W, and a maximum
ambient temperature of 70°C the junction temperature is;
Figure 9 shows a schematic for a typical application of the
XR-T3588/T3589. In this application the termination
resistor network is fed from the chip on-board regulator.
The regulator provides a voltage of 3.3V.
Tjunction = 70 + 80 - 0.672 = 1 34°C
If the device is used in an enclosure without forced cooling
where the ambient temperature could approach or
exceed 70°C, the power dissipation of the part should be
reduced for improved reliability.
The major issue is the power dissipation of the XR-T3588.
Following is a discussion of the power that is dissipated by
the XR-T3588 when all three drivers are active
simultaneously. The power used by the XR-T3588 is
given by;
Pd = (VCC - ICC + VEE - IEE) - 3 - (Rterm -
Figure 10 shows an implementation using an external
reference voltage made with two resistors of values 180Ω
and 360Ω. This implementation offers the advantage of
eliminating the feeding current to the termination network
from the on chip reference, thereby reducing the
dissipation in the XR-T3588.
(Iterm)2)
Where: VCC, ICC, VEE and IEE are the positive and
negative supply voltages and currents, whose
values may be found in the typical column of the
DC Characteristics,
The formula to calculate the on chip power dissipation is
now;
Rterm is the equivalent impedance of the
termination network,
Pd = (VCC - IGG + VEE - IEE) - 3 - ((VCC - 3.3) lterm + Rterm - (iterm)2)
lterm is the current flow through the
termination network.
Where the term “3 - (VCC - 3.3) - (Iterm)” is the power
previously dissipated in the XR-T3588 internal voltage
regulator.
In the case of the three drivers enabled and terminated,
the typical power dissipation is;
Pd = (5 - 0.086 + (5 - 0.092)) - 3 - (150 - (0.022)2)
= 672.2mW
The revised value of power dissipation is;
Pd = (5 - 0.086) + (5 - 0.092) - 3 - ((5 - 3.3) - 0.022 +
150 - (0.022)2) = 560mW
The junction temperature of the part is given by;
Tjunction= Tambient + (qJA - Pd)
The total on chip power saving is;
3 - (5 - 3.3) - 0.022, i.e. 112.2 mW.
where: Tjunction is junction temperature,
Tambient is ambient temperature,
qJA is package thermal impedance.
Figure 11 shows the demo board schematic.
For reliable operation, the absolute maximum junction
temperature must be maintained below 150°C. With a
To obtain a
representative.
Rev. 1.05
9
demo
board,
call
your
local
XR-T3588/89
VREF 1 (3.3V Nominal)
Pin 16
VREF
125
125
50
50
50
Pin 18
O/P 1A
50
Pin 17
O/P 1B
O/P A
Pin 8
Sets Current
Source Value
Bias
↓22mA
3.9K
O/B B
VEE
Figure 5. XR-T3588 Output Stage
Simplified Circuit
Figure 6. External Transmit Network
I/P A
VREF
125
I/P B
50
50
50
50
O/P A
125
100
O/P B
Figure 7. XR-T3588 Output Stage
Simplified Circuit
Figure 8. External Receive Network
Rev. 1.05
10
XR-T3588/89
Rev. 1.05
11
XR-T3588/89
Rev. 1.05
12
XR-T3588/89
18 LEAD CERAMIC DUAL-IN-LINE
(300 MIL CDIP)
Rev. 1.00
18
10
1
9
E
E1
D
A1
Base
Plane
Seating
Plane
A
L
c
e
B
α
B1
INCHES
SYMBOL
MILLIMETERS
MIN
MAX
MIN
MAX
A
0.100
0.200
2.54
5.08
A1
0.015
0.070
0.38
1.78
B
0.014
0.026
0.36
0.66
B1
0.045
0.065
1.14
1.65
c
0.008
0.018
0.20
0.46
D
0.860
0.960
21.84
24.38
E1
0.250
0.310
6.35
7.87
E
0.300 BSC
7.62 BSC
e
0.100 BSC
2.54 BSC
L
0.125
0.200
3.18
5.08
α
0°
15°
0°
Note: The control dimension is the inch column
15°
Rev. 1.05
13
XR-T3588/89
18 LEAD PLASTIC DUAL-IN-LINE
(300 MIL PDIP)
Rev. 1.00
18
10
1
9
E1
E
D
Seating
Plane
A2
A
L
α
A1
B
e
INCHES
SYMBOL
eA
eB
B1
MILLIMETERS
MIN
MAX
MIN
MAX
A
0.145
0.210
3.68
5.33
A1
0.015
0.070
0.38
1.78
A2
0.115
0.195
2.92
4.95
B
0.014
0.024
0.36
0.56
B1
0.030
0.070
0.76
1.78
C
0.008
0.014
0.20
0.38
D
0.845
0.925
21.46
23.50
E
0.300
0.325
7.62
8.26
E1
0.240
0.280
6.10
7.11
e
0.100 BSC
2.54 BSC
eA
0.300 BSC
7.62 BSC
eB
0.310
0.430
7.87
10.92
L
0.115
0.160
2.92
4.06
α
0°
15°
0°
15°
Note: The control dimension is the inch column
Rev. 1.05
14
C
XR-T3588/89
14 LEAD CERAMIC DUAL-IN-LINE
(300 MIL CDIP)
Rev. 1.00
14
8
1
7
E
E1
D
A1
Base
Plane
Seating
Plane
A
L
e
c
B
α
B1
INCHES
SYMBOL
MILLIMETERS
MIN
MAX
MIN
MAX
A
0.100
0.200
2.54
5.08
A1
0.015
0.060
0.38
1.52
B
0.014
0.026
0.36
0.66
B1
0.045
0.065
1.14
1.65
c
0.008
0.018
0.20
0.46
D
0.685
0.785
17.40
19.94
E1
0.250
0.310
6.35
7.87
E
0.300 BSC
7.62 BSC
e
0.100 BSC
2.54 BSC
L
0.125
0.200
3.18
5.08
α
0°
15°
0°
Note: The control dimension is the inch column
15°
Rev. 1.05
15
XR-T3588/89
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are
free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary
depending upon a user’s specific application. While the information in this publication has been carefully checked;
no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly
affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation
receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the
user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Copyright 1997 EXAR Corporation
Datasheet June 1997
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
Rev. 1.05
16