515BCA20M0000AAGR

End of Life April-2020 - Alternative Device: VSMY2890RGX01, VSMY2890GX01 VSMF2890RGX01, VSMF2890GX01 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 890 nm, GaAlAs, DH VSMF2890RGX01 FEATURES VSMF2890GX01 • Package type: surface-mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 • AEC-Q101 qualified • Peak wavelength: λp = 890 nm • High reliability • High radiant power • High radiant intensity • Angle of half intensity: ϕ = ± 12° • Low forward voltage • Suitable for high pulse current operation • Terminal configurations: gullwing or reserve gullwing DESCRIPTION • Package matches with detector VEMD2000X01 series VSMF2890RG(G)X01 series are infrared, 890 nm emitting diodes in GaAlAs (DH) technology with high radiant power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). • Floor life: 4 weeks, MSL 2a, according to J-STD-020 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • IrDA compatible data transmission • 3D TV • Miniature light barrier • Photointerrupters • Optical switch • Shaft encoders • IR emitter source for proximity applications PRODUCT SUMMARY Ie (mW/sr) ϕ (deg) λp (nm) tr (ns) VSMF2890RGX01 40 ± 12 890 30 VSMF2890GX01 40 ± 12 890 30 COMPONENT Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMF2890RGX01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMF2890GX01 Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note • MOQ: minimum order quantity Rev. 1.2, 30-Sep-2019 Document Number: 85163 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life April-2020 - Alternative Device: VSMY2890RGX01, VSMY2890GX01 VSMF2890RGX01, VSMF2890GX01 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER SYMBOL VALUE Reverse voltage TEST CONDITION VR 5 UNIT V Forward current IF 100 mA mA Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 Surge forward current tp = 100 μs IFSM 1 A PV 160 mW Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb -40 to +85 °C °C Storage temperature range Tstg -40 to +100 According to Fig. 9, J-STD-020 Tsd 260 °C J-STD-051, leads 7 mm, soldered on PCB RthJA 250 K/W Soldering temperature Thermal resistance junction-to-ambient 120 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 140 120 100 RthJA = 250 K/W 80 60 40 100 80 60 RthJA = 250 K/W 40 20 20 0 0 0 10 21343 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 0 10 21344 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of φe TEST CONDITION SYMBOL MIN. TYP. MAX. IF = 100 mA, tp = 20 ms VF 1.25 1.4 1.6 UNIT V IF = 1 A, tp = 100 μs VF - 2.3 - V IF = 1 mA TKVF - -1.8 - mV/K IF = 100 mA TKVF - -1.1 - mV/K VR = 5 V IR - 10 μA VR = 0 V, f = 1 MHz, E = 0 mW/cm2 CJ - 125 - pF IF = 100 mA, tp = 20 ms Ie 20 40 60 mW/sr mW/sr IF = 1 A, tp = 100 μs Ie - 350 - IF = 100 mA, tp = 20 ms φe - 40 - mW IF = 100 mA TKφe - -0.35 - %/K ϕ - ± 12 - deg Angle of half intensity Peak wavelength IF = 30 mA λp 870 890 910 nm Spectral bandwidth IF = 30 mA Δλ - 40 - nm Temperature coefficient of λp IF = 30 mA TKλp - 0.25 - nm/K Rise time IF = 100 mA, 20 % to 80 % tr - 30 - ns Fall time IF = 100 mA, 20 % to 80 % tf - 30 - ns IDC = 70 mA, IAC = 30 mA pp fc - 12 - MHz d - 1.5 - mm Cut-off frequency Virtual source diameter Rev. 1.2, 30-Sep-2019 Document Number: 85163 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life April-2020 - Alternative Device: VSMY2890RGX01, VSMY2890GX01 VSMF2890RGX01, VSMF2890GX01 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1.25 Φe rel - Relative Radiant Power 100 tp = 100 µs tp/T = 0.001 10 1.0 0.75 0.5 0.25 1 0 1 2 3 Fig. 3 - Forward Current vs. Forward Voltage 1000 900 λ - Wavelength (nm) 20082 VF - Forward Voltage (V) 18873_1 0 800 4 Fig. 6 - Relative Radiant Power vs. Wavelength 0° 10° 20° 30° 108 106 104 102 IF = 100 mA 100 IF = 10 mA 98 tp = 20 ms 96 94 IF = 1 mA 92 Ie rel - Relative Radiant Intensity VF, rel - Relative Forward Voltage (%) 110 40° 1.0 50° 0.9 60° 0.8 70° ϕ - Angular Displacement IF - Forward Current (mA) 1000 80° 0.7 90 - 40 - 20 0 20 40 60 80 100 0.6 0.4 0.2 0 21550 Tamb - Ambient Temperature (°C) 21443 Fig. 4 - Relative Forward Voltage vs. Ambient Temperature Fig. 7 - Relative Radiant Intensity vs. Angular Displacement 0.02 100 10 1 1 0.001 0.01 0.1 1 IF - Forward Current (A) Fig. 5 - Radiant Intensity vs. Forward Current Rev. 1.2, 30-Sep-2019 Tamb < 50 °C tp/T = 0.01 1000 tp = 100 µs IF - Forward Current (mA) Ie - Radiant Intensity (mW/sr) 1000 0.05 0.1 0.2 0.5 100 0.01 16031 0.1 1 10 100 tp - Pulse Duration (ms) Fig. 8 - Pulse Forward Current vs. Pulse Duration Document Number: 85163 3 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life April-2020 - Alternative Device: VSMY2890RGX01, VSMY2890GX01 VSMF2890RGX01, VSMF2890GX01 www.vishay.com Vishay Semiconductors SOLDER PROFILE DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Axis Title 10000 300 Max. 260 °C 255 °C 240 °C 217 °C 245 °C FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, according to J-STD-020. 1000 200 Max. 30 s 1st line 2nd line 2nd line Temperature (°C) 250 150 Max. 120 s Max. 100 s 100 Max. ramp down 6 °C/s 100 DRYING Max. ramp up 3 °C/s 50 In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. 10 0 0 50 100 150 200 300 250 Time (s) 19841 Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 PACKAGE DIMENSIONS in millimeters: VSMF2890RGX01 0.3 Ø 1.8 ± 0.1 Z 1.6 0.19 2.77 ± 0.2 0.05 ± 0.1 0.4 2.2 2.2 5.8 ± 0.2 Z 20:1 1.1 ± 0.1 0.4 0.5 2.3 ± 0.2 0.254 exposed copper 2.3 ± 0.2 Cathode Pin ID 1.7 Anode 0.75 Solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.1 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5391.02-4 Issue: 2; 18.03.10 21517 Rev. 1.2, 30-Sep-2019 Document Number: 85163 4 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life April-2020 - Alternative Device: VSMY2890RGX01, VSMY2890GX01 VSMF2890RGX01, VSMF2890GX01 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMF2890GX01 Ø 1.8 2.77 ± 0.2 0.3 0.4 0.19 0.05 1.6 X 2.2 2.2 4.2 ± 0.2 X 20:1 exposed copper 0.6 Cathode 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 Anode Pin ID technical drawings according to DIN specifications 0.75 Solder pad proposal acc. IPC 7351 Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.02-4 Issue: 4; 18.03.10 21488 Rev. 1.2, 30-Sep-2019 Document Number: 85163 5 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life April-2020 - Alternative Device: VSMY2890RGX01, VSMY2890GX01 VSMF2890RGX01, VSMF2890GX01 www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMF2890RGX01 Unreel direction X 2. Ø 62 ± 0.5 Reel 0 5± Ø 13 ± 0.5 Ø 330 ± 1 .5 Tape position coming out from reel 6000 pcs/reel Label posted here Technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Device Lead I Lead II Collector Emitter Cathode Anode Anode Cathode Ø 1.55 ± 0.05 I VEMT2000 VEMT2500 X 2:1 4 ± 0.1 2 ± 0.05 VEMD2000 5.5 ± 0.05 VEMD2500 VSMB2000 VSMG2000 VSMY2850RG 3.05 ± 0.1 II 12 ± 0.3 Terminal position in tape 1.75 ± 0.1 Empty (400 mm min.) 4 ± 0.1 Drawing-No.: 9.800-5100.01-4 Issue: 2; 18.03.10 21572 Rev. 1.2, 30-Sep-2019 Document Number: 85163 6 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life April-2020 - Alternative Device: VSMY2890RGX01, VSMY2890GX01 VSMF2890RGX01, VSMF2890GX01 www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMF2890GX01 Reel X Unreel direction 5± Ø 62 ± 0.5 2. Ø 13 ± 0.5 Ø 330 ± 1 0.5 Tape position coming out from reel 6000 pcs/reel Label posted here technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Ø 1.55 ± 0.05 Device Lead I Lead II Collector Emitter Cathode Anode Anode Cathode I VEMT2020 VEMT2520 X 2:1 4 ± 0.1 2 ± 0.05 VSMB2020 VEMD2020 VEMD2520 VSMY2850G 3.05 ± 0.1 II 4 ± 0.1 5.5 ± 0.05 VSMG2020 12 ± 0.3 Terminal position in tape 1.75 ± 0.1 Empty (400 mm min.) Drawing-No.: 9.800-5091.01-4 Issue: 3; 18.03.10 21571 Rev. 1.2, 30-Sep-2019 Document Number: 85163 7 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2019 1 Document Number: 91000