540ACC125M000BBG

Ultra Series™ Crystal Oscillator Si540 Data Sheet Ultra Low Jitter Any-Frequency XO (125 fs), 0.2 to 1500 MHz KEY FEATURES The Si540 Ultra Series™ oscillator utilizes Skyworks Solutions’ advanced 4th generation DSPLL® technology to provide an ultra-low jitter, low phase noise clock at any output frequency. The device is factory-programmed to any frequency from 0.2 to 1500 MHz with 6 digits Notes: 1. Contact Skyworks for non-standard configurations. 2. Total stability includes temp stability, initial accuracy, load pulling, VDD variation, and 20 year aging at 70 °C. 3. For example: 156.25 MHz = 156M250; 25 MHz = 25M0000. Create custom part numbers at https://www.skyworksinc.com/Products/Timing-Oscillators. 1.1 Technical Support Frequently Asked Questions (FAQ) https://www.skyworksinc.com/products/timing/ultra-series-crystal-oscillators-xo/ si540 Oscillator Phase Noise Lookup Utility https://www.skyworksinc.com/tools/oscillator-phase-noise Quality and Reliability https://www.skyworksinc.com/Quality Development Kits https://www.skyworksinc.com/Products/Timing-Oscillators 2 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 2 Si540 Data Sheet • Electrical Specifications 2. Electrical Specifications Table 2.1. Electrical Specifications VDD = 1.8 V, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC Parameter Temperature Range Frequency Range Supply Voltage Supply Current Symbol Rise/Fall Time (20% to 80% VPP) Min Typ Max Unit –40 — 85 ºC LVPECL, LVDS, CML 0.2 — 1500 MHz HCSL 0.2 — 400 MHz CMOS, Dual CMOS 0.2 — 250 MHz 3.3 V 3.135 3.3 3.465 V 2.5 V 2.375 2.5 2.625 V 1.8 V 1.71 1.8 1.89 V LVPECL (output enabled) — 100 145 mA LVDS/CML (output enabled) — 75 111 mA HCSL (output enabled) — 80 125 mA HCSL-Fast (output enabled) — 88 137 mA CMOS (output enabled) — 74 108 mA Dual CMOS (output enabled) — 80 125 mA Tristate Hi-Z (output disabled) — 64 100 mA Frequency stability Grade A –20 — 20 ppm Frequency stability Grade B –10 — 10 ppm Frequency stability Grade C –7 — 7 ppm Frequency stability Grade A –50 — 50 ppm Frequency stability Grade B –25 — 25 ppm Frequency stability Grade C –20 — 20 ppm LVPECL/LVDS/CML — — 350 ps CMOS / Dual CMOS (CL = 5 pF) — 0.5 1.5 ns HCSL, FCLK >50 MHz — — 550 ps HCSL-Fast, FCLK >50 MHz — — 275 ps All formats 45 — 55 % TA FCLK VDD IDD Temperature Stability Total Stability1 Test Condition/Comment FSTAB TR/TF Duty Cycle DC Output Enable (OE)2 VIH 0.7 × VDD — — V VIL — — 0.3 × VDD V Powerup Time 3 TD Output Disable Time, FCLK >10 MHz — — 3 µs TE Output Enable Time, FCLK >10 MHz — — 20 µs tOSC Time from 0.9 × VDD until output frequency (FCLK) within spec — — 10 ms Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 3 Si540 Data Sheet • Electrical Specifications Parameter Symbol Test Condition/Comment Min Typ Max Unit VRAMP Fastest VDD ramp rate allowed on startup — — 100 V/ms VOC Mid-level VDD – 1.42 — VDD – 1.25 V VO Swing (diff) 1.1 — 1.9 VPP VOC Mid-level (2.5 V, 3.3 V VDD) 1.125 1.20 1.275 V Mid-level (1.8 V VDD) 0.8 0.9 1.0 V Swing (FCLK ≤ 1.4 GHz) 0.6 0.7 0.9 VPP Swing (FCLK > 1.4 GHz) 0.5 0.7 0.9 VPP VOH Output voltage high 660 750 850 mV VOL Output voltage low –150 0 150 mV VC Crossing voltage 250 350 550 mV CML Output Option (AC-Coupled) VO Swing (diff) 0.6 0.8 1.0 VPP CMOS Output Option VOH IOH = 8/6/4 mA for 3.3/2.5/1.8V VDD 0.85 × VDD — — V VOL IOL = 8/6/4 mA for 3.3/2.5/1.8V VDD — 0.15 × VDD V Powerup VDD Ramp Rate LVPECL Output Option3 LVDS Output Option4 VO HCSL Output Option5 HCSL-Fast Output Option5 — Notes: 1. Total Stability includes temperature stability, initial accuracy, load pulling, VDD variation, and aging for 20 yrs at 70 ºC. 2. OE includes a 50 kΩ pull-up to VDD for OE active high. Includes a 50 kΩ pull-down to GND for OE active low. NC (No Connect) pins include a 50 kΩ pull-down to GND. 3. 50 Ω to VDD – 2.0 V. Additional DC current from the output driver will flow through the 50Ω resistors, resulting in a shift in common mode voltage. The measurements in this table have accounted for this. 4. Rterm = 100 Ω (differential). 5. 50 Ω to GND. Table 2.2. Clock Output Phase Jitter and PSNR VDD = 1.8 V, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC Parameter Phase Jitter (RMS, 12kHz - 20MHz)1 2.5 x 3.2 mm, 3.2 x 5 mm, FCLK ≥ 100 MHz Symbol Test Condition/Comment Min Typ Max Unit ϕJ Differential Formats — 125 200 fs CMOS, Dual CMOS — 200 — fs Differential Formats — 150 200 fs CMOS, Dual CMOS — 200 — fs 100 kHz sine wave — -83 — 200 kHz sine wave — -83 — 500 kHz sine wave — -82 — 1 MHz sine wave — -85 — Phase Jitter (RMS, 12kHz - 20MHz)1 5 x 7 mm, FCLK ≥ 100 MHz Spurs Induced by External Power Supply Noise, 50 mVpp Ripple. LVDS 156.25 MHz Output PSNR dBc Note: 1. Guaranteed by characterization. Jitter inclusive of any spurs. 4 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 4 Si540 Data Sheet • Electrical Specifications Table 2.3. 3.2 x 5 mm Clock Output Phase Noise (Typical, 50ppm Total Stability Option) Offset Frequency (f) 156.25 MHz LVDS 200 MHz LVDS 644.53125 MHz LVDS 100 Hz –110 –107 –99 1 kHz –121 –120 –109 10 kHz –132 –130 –121 100 kHz –139 –137 –127 1 MHz –151 –149 –138 10 MHz –160 –161 –155 20 MHz –161 –162 –157 Offset Frequency (f) 156.25 MHz LVPECL 200 MHz LVPECL 644.53125 MHz LVPECL 100 Hz –113 –110 –100 1 kHz –123 –120 –110 10 kHz –133 –130 –119 100 kHz –139 –137 –127 1 MHz –151 –149 –138 10 MHz –162 –166 –156 20 MHz –163 –167 –157 Unit dBc/Hz Unit dBc/Hz Phase jitter measured with Agilent E5052 using a differential-to-single ended converter (balun or buffer). Measurements collected for >700 commonly used frequencies. Phase noise plots for specific frequencies are available using our onlineOscillator Phase Noise Lookup Tool. Figure 2.1. Phase Jitter vs. Output Frequency 5 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 5 Si540 Data Sheet • Electrical Specifications Table 2.4. Environmental Compliance and Package Information Parameter Test Condition Mechanical Shock MIL-STD-883, Method 2002 Mechanical Vibration MIL-STD-883, Method 2007 Solderability MIL-STD-883, Method 2003 Gross and Fine Leak MIL-STD-883, Method 1014 Resistance to Solder Heat MIL-STD-883, Method 2036 Moisture Sensitivity Level (MSL): 3.2 x 5, 5 x 7 packages 1 Moisture Sensitivity Level (MSL): 2.5 x 3.2 package 2 Contact Pads: 3.2x5, 5x7 packages Au/Ni (0.3 - 1.0 µm / 1.27 - 8.89 µm) Contact Pads: 2.5x3.2 packages Au/Pd/Ni (0.03 - 0.12 µm / 0.1 - 0.2 µm / 3.0 - 8.0 µm) Note: 1. For additional product information not listed in the data sheet (e.g. RoHS Certifications, MDDS data, qualification data, REACH Declarations, ECCN codes, etc.), refer to our "Corporate Request For Information" portal found here: www.skyworksinc.com/quality. Table 2.5. Thermal Conditions Max Junction Temperature = 125° C Package 2.5 x 3.2 mm 6-pin DFN 3.2 × 5 mm 6-pin CLCC 5 × 7 mm 6-pin CLCC Parameter Symbol Test Condition Value Unit Thermal Resistance Junction to Ambient ΘJA Still Air, 85 °C 80 ºC/W Thermal Parameter Junction to Board ΨJB Still Air, 85 °C 39 ºC/W Thermal Parameter Junction to Top Center ΨJT Still Air, 85 °C 17 ºC/W Thermal Resistance Junction to Ambient ΘJA Still Air, 85 °C 55 ºC/W Thermal Parameter Junction to Board ΨJB Still Air, 85 °C 20 ºC/W Thermal Parameter Junction to Top Center ΨJT Still Air, 85 °C 20 ºC/W Thermal Resistance Junction to Ambient ΘJA Still Air, 85 °C 53 ºC/W Thermal Parameter Junction to Board ΨJB Still Air, 85 °C 26 ºC/W Thermal Parameter Junction to Top Center ΨJT Still Air, 85 °C 26 ºC/W Note: 1. Based on PCB Dimensions: 4.5" x 7", PCB Thickness: 1.6 mm, Number of Cu Layers: 4. 6 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 6 Si540 Data Sheet • Electrical Specifications Table 2.6. Absolute Maximum Ratings1 Parameter Symbol Rating Unit TAMAX 95 ºC TS –55 to 125 ºC Supply Voltage VDD –0.5 to 3.8 ºC Input Voltage VIN –0.5 to VDD + 0.3 V ESD HBM (JESD22-A114) HBM 2.0 kV Solder Temperature2 TPEAK 260 ºC TP 20–40 sec Maximum Operating Temp. Storage Temperature Solder Time at TPEAK2 Notes: 1. Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device reliability. 2. The device is compliant with JEDEC J-STD-020. 7 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 7 Si540 Data Sheet • Dual CMOS Buffer 3. Dual CMOS Buffer Dual CMOS output format ordering options support either complementary or in-phase signals for two identical frequency outputs. This feature enables replacement of multiple XOs with a single Si540 device. ~ ~ Complementary Outputs In-Phase Outputs Figure 3.1. Integrated 1:2 CMOS Buffer Supports Complementary or In-Phase Outputs 8 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 8 Si540 Data Sheet • Recommended Output Terminations 4. Recommended Output Terminations The output drivers support both AC-coupled and DC-coupled terminations as shown in figures below. VDD VDD (3.3V, 2.5V) CLK+ Rp R1 R1 CLK+ 50 Ω CLK- Si54x VDD VDD (3.3V, 2.5V) Rp R2 R2 LVPECL Receiver VDD (3.3V, 2.5V) CLK+ VDD Si54x Rp Rp 50 Ω R2 VDD (3.3V, 2.5V) R1 VTT CLK+ 50 Ω LVPECL Receiver LVPECL Receiver AC-Coupled LVPECL - 50 Ω w/VTT Bias 50 Ω VDD – 2.0V CLK- 50 Ω R2 R2 DC-Coupled LVPECL – Thevenin Termination 50 Ω CLK- 50 Ω Si54x AC-Coupled LVPECL – Thevenin Termination R1 50 Ω CLK- 50 Ω R1 50 Ω 50 Ω 50 Ω Si54x LVPECL Receiver DC-Coupled LVPECL - 50 Ω w/VTT Bias Figure 4.1. LVPECL Output Terminations AC Coupled LVPECL Termination Resistor Values 9 DC Coupled LVPECL Termination Resistor Values VDD R1 R2 Rp VDD R1 R2 3.3 V 82.5 Ω 127 Ω 130 Ω 3.3 V 127 Ω 82.5 Ω 2.5 V 62.5 Ω 250 Ω 90 Ω 2.5 V 250 Ω 62.5 Ω Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 9 Si540 Data Sheet • Recommended Output Terminations (3.3V, 2.5V, 1.8V) VDD CLK+ (3.3V, 2.5V, 1.8V) VDD 50 Ω CLK+ 33 Ω 100 Ω CLK50 Ω Si54x LVDS Receiver CLK+ 50 Ω HCSL Receiver Source Terminated HCSL (3.3V, 2.5V, 1.8V) VDD 50 Ω CLK+ 100 Ω CLK50 Ω Si54x 50 Ω 50 Ω Si54x DC-Coupled LVDS (3.3V, 2.5V, 1.8V) VDD 50 Ω CLK- 33 Ω 50 Ω CLK- LVDS Receiver 50 Ω 50 Ω Si54x AC-Coupled LVDS 50 Ω HCSL Receiver Destination Terminated HCSL Figure 4.2. LVDS and HCSL Output Terminations (3.3V, 2.5V, 1.8V) VDD CLK+ VDD (3.3V, 2.5V, 1.8V) 50 Ω CLK 10 Ω 100 Ω CLK- NC 50 Ω Si54x CML Receiver CLK+ Si54x Single CMOS Termination VDD (3.3V, 2.5V, 1.8V) 50 Ω 50 Ω CLK+ 50 Ω CLK- VCM CLK- CMOS Receiver Si54x CML Termination without VCM (3.3V, 2.5V, 1.8V) VDD 50 Ω 50 Ω CML Receiver CML Termination with VCM 10 Ω 10 Ω Si54x 50 Ω 50 Ω CMOS Receivers Dual CMOS Termination Figure 4.3. CML and CMOS Output Terminations 10 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 10 Si540 Data Sheet • Package Outline 5. Package Outline 5.1 Package Outline (5×7 mm) The figure below illustrates the package details for the 5×7 mm Si540. The table below lists the values for the dimensions shown in the illustration. Figure 5.1. Si540 (5×7 mm) Outline Diagram Table 5.1. Package Diagram Dimensions (mm) Dimension Min Nom Max Dimension Min Nom Max A 1.13 1.28 1.43 L 1.17 1.27 1.37 A2 0.50 0.55 0.60 L1 0.05 0.10 0.15 A3 0.50 0.55 0.60 p 1.70 — 1.90 b 1.30 1.40 1.50 R 0.70 REF c 0.50 0.60 0.70 aaa 0.15 bbb 0.15 ccc 0.08 D D1 5.00 BSC 4.30 4.40 4.50 e 2.54 BSC ddd 0.10 E 7.00 BSC eee 0.05 E1 6.10 6.20 6.30 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 11 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 11 Si540 Data Sheet • Package Outline 5.2 Package Outline (3.2×5 mm) The figure below illustrates the package details for the 3.2×5 mm Si540. The table below lists the values for the dimensions shown in the illustration. Figure 5.2. Si540 (3.2×5 mm) Outline Diagram Table 5.2. Package Diagram Dimensions (mm) Dimension Min Nom Max A 1.06 1.17 1.33 b 0.54 0.64 0.74 c 0.35 0.45 0.55 D D1 3.20 BSC 2.55 2.60 e 1.27 BSC E 5.00 BSC 2.65 E1 4.35 4.40 4.45 H 0.45 0.55 0.65 L 0.80 0.90 1.00 L1 0.05 0.10 0.15 p 1.36 1.46 1.56 R 0.32 REF aaa 0.15 bbb 0.15 ccc 0.08 ddd 0.10 eee 0.05 Notes: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 12 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 12 Si540 Data Sheet • Package Outline 5.3 Package Outline (2.5x3.2 mm) The figure below illustrates the package details for the 2.5x3.2 mm Si540. The table below lists the values for the dimensions shown in the illustration. Figure 5.3. Si540 (2.5×3.2 mm) Outline Diagram Table 5.3. Package Diagram Dimensions (mm) Dimension Min Nom Max A 0.85 0.90 1.00 A1 0.36 REF A2 0.53 REF W 0.55 0.60 D 3.2 BSC E 2.5 BSC e 1.10 BSC L 0.65 0.70 n 5 D1 2.2 BSC E1 1.589 BSC aaa 0.10 bbb 0.10 ddd 0.08 0.65 0.75 Notes: 1. The dimensions in parentheses are reference. 2. All dimensions in millimeters (mm). 3. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 13 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 13 Si540 Data Sheet • PCB Land Pattern 6. PCB Land Pattern 6.1 PCB Land Pattern (5×7 mm) The figure below illustrates the 5×7 mm PCB land pattern for the Si540. The table below lists the values for the dimensions shown in the illustration. Figure 6.1. Si540 (5×7 mm) PCB Land Pattern Table 6.1. PCB Land Pattern Dimensions (mm) Dimension (mm) C1 4.20 E 2.54 X1 1.55 Y1 1.95 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 14 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 14 Si540 Data Sheet • PCB Land Pattern 6.2 PCB Land Pattern (3.2×5 mm) The figure below illustrates the 3.2×5.0 mm PCB land pattern for the Si540. The table below lists the values for the dimensions shown in the illustration. Figure 6.2. Si540 (3.2×5 mm) PCB Land Pattern Table 6.2. PCB Land Pattern Dimensions (mm) Dimension (mm) C1 2.60 E 1.27 X1 0.80 Y1 1.70 Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 15 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 15 Si540 Data Sheet • PCB Land Pattern 6.3 PCB Land Pattern (2.5×3.2 mm) The figure below illustrates the 2.5×3.2 mm PCB land pattern for the Si540. The table below lists the values for the dimensions shown in the illustration. Figure 6.3. Si540 (2.5×3.2 mm) PCB Land Pattern Table 6.3. PCB Land Pattern Dimensions (mm) Dimension Description Value (mm) X1 Width - leads on long sides 0.85 Y1 Height - leads on long sides 0.7 D1 Pitch in X directions of XLY1 leads 1.639 E1 Lead pitch XLY1 leads 1.10 Notes: The following notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine-tune their SMT process as required for their application and tooling. General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on the IPC-7351 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 0.8:1 for the pads. Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 16 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 16 Si540 Data Sheet • Top Marking (5x7 and 3.2x5 Packages) 7. Top Marking (5x7 and 3.2x5 Packages) The figure below illustrates the mark specification for the Si540 5x7 and 3.2x5 package sizes. The table below lists the line information. Figure 7.1. Mark Specification Table 7.1. Si540 Top Mark Description Line Position Description 1 1–8 "Si540", xxx = Ordering Option 1, Option 2, Option 3 (e.g. Si540AAA) 2 1–7 Frequency Code (e.g. 100M000 or 6-digit custom code as described in the Ordering Guide) 3 17 Trace Code Position 1 Pin 1 orientation mark (dot) Position 2 Product Revision (C) Position 3–5 Tiny Trace Code (3 alphanumeric characters per assembly release instructions) Position 6–7 Year (last two digits of the year), to be assigned by assembly site (ex: 2017 = 17) Position 8–9 Calendar Work Week number (1–53), to be assigned by assembly site Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 17 Si540 Data Sheet • Top Marking (2.5x3.2 Package) 8. Top Marking (2.5x3.2 Package) The figure below illustrates the mark specification for the Si540 2.5x3.2 package sizes. The table below lists the line information. A C CC CC T TTT TT Y Y WW Figure 8.1. Mark Specification Table 8.1. Si540 Top Mark Description Line Position 1 1–6 2 18 A = Si540, CCCCC = Custom Mark Code Trace Code 1–6 3 Description Position 1 Six-digit trace code per assembly release instructions Pin 1 orientation mark (dot) Position 2–3 Year (last two digits of the year), to be assigned by assembly site (exp: 2017 = 17) Position 4–5 Calendar Work Week number (1–53), to be assigned by assembly site Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 18 Si540 Data Sheet • Revision History 9. Revision History Revision 206609A May, 2023 • Updated Min and Nom package diagram dimensions specs in 5.3 Package Outline (2.5x3.2 mm). Revision 1.3 June, 2021 • Updated Ordering Guide and Topmark for Rev. C silicon • Added HCSL-Fast (faster tR/tF) ordering option • Updated Table 2.1, Powerup VDD Ramp Rate Revision 1.2 September, 2020 • Updated Table 2.1, Powerup VDD Ramp Rate and LVDS Swing Revision 1.1 November, 2019 • Added 2.5x3.2 mm package option Revision 1.0 July, 2018 • Added 20 ppm total stability option. Revision 0.75 March, 2018 • Added 25 ppm total stability option. Revision 0.71 December, 2017 • Added 5x7 package and land pattern. Revision 0.7 June, 2017 • Initial release. 19 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 206609A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 26, 2023 19 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. Available for Windows and iOS (CBGo only). skyworksinc.com/CBPro Portfolio SW/HW Quality Support & Resources skyworksinc.com skyworksinc.com/CBPro skyworksinc.com/quality skyworksinc.com/support Copyright © 2022 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. 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Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of Skyworks’ published specifications or parameters. Skyworks, the Skyworks symbol, Sky5®, SkyOne®, SkyBlue™, Skyworks Green™, ClockBuilder®, DSPLL®, ISOmodem®, ProSLIC®, and SiPHY® are trademarks or registered trademarks of Skyworks Solutions, Inc. or its subsidiaries in the United States and other countries. Third-party brands and names are for identification purposes only and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. | Nasdaq: SWKS | sales@skyworksinc.com | www.skyworksinc.com USA: 781-376-3000 | Asia: 886-2-2735 0399 | Europe: 33 (0)1 43548540