Ultra Series™ Crystal Oscillator (VCXO)
Si569 Data Sheet
Ultra Low Jitter I2C Programmable VCXO (100 fs), 0.2 to
3000 MHz
KEY FEATURES
• I2C programmable to any frequency from 0.2 to
3000 MHz with < 1 ppb resolution
The Si569 Ultra Series™ voltage-controlled crystal oscillator utilizes Skyworks Solutions’ advanced 4th generation DSPLL® technology to provide an
ultra-low jitter, low phase noise clock at any output frequency. The device is
user-programmed via simple I2C commands to provide any frequency from
0.2 to 3000 MHz with 50 MHz
—
—
450
ps
HCSL-Fast, FCLK >50 MHz
—
—
275
ps
All formats
45
—
55
%
TA
FCLK
VDD
IDD
Temperature Stability1
Rise/Fall Time
(20% to 80% VPP)
Test Condition/Comment
TR/TF
Duty Cycle
DC
Output Enable (OE)
Frequency Select (FS)2
VIH
0.7 × VDD
—
—
V
VIL
—
—
0.3 × VDD
V
Powerup Time
Powerup VDD Ramp Rate
LVPECL Output Option3
3
TD
Output Disable Time, FCLK >10 MHz
—
—
3
µs
TE
Output Enable Time, FCLK >10 MHz
—
—
20
µs
TFS
Settling Time after FS Change
—
—
10
ms
tOSC
Time from 0.9 × VDD until output frequency (FCLK) within spec
—
—
10
ms
VRAMP
Fastest VDD ramp rate allowed on
startup
—
—
100
V/ms
VOC
Mid-level
VDD – 1.42
—
VDD – 1.25
V
VO
Swing (diff, FCLK < 1.5 GHz)
1.1
—
1.9
VPP
Swing (diff, FCLK > 1.5 GHz)6
0.55
—
1.7
VPP
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Si569 Data Sheet • Electrical Specifications
Parameter
LVDS Output Option4
Symbol
Test Condition/Comment
Min
Typ
Max
Unit
VOC
Mid-level (2.5 V, 3.3 V VDD)
1.125
1.20
1.275
V
Mid-level (1.8 V VDD)
0.8
0.9
1.0
V
Swing (diff, FCLK < 1.4 GHz)
0.6
0.7
0.9
VPP
Swing (diff, FCLK > 1.4 GHz) 6
0.25
0.5
0.8
VPP
Swing (diff, FCLK < 1.6 GHz) 7
0.6
0.8
1.0
VPP
VOH
Output voltage high
660
800
850
mV
VOL
Output voltage low
–150
0
150
mV
VC
Crossing voltage
250
410
550
mV
VO
Swing (diff, FCLK < 1.5 GHz)
0.6
0.8
1.0
VPP
Swing (diff, FCLK > 1.5 GHz)6
0.3
0.55
0.9
VPP
VOH
IOH = 8/6/4 mA for 3.3/2.5/1.8V VDD
0.85 × VDD
—
—
V
VOL
IOL = 8/6/4 mA for 3.3/2.5/1.8V VDD
—
—
0.15 × VDD
V
VO
HCSL Output Option5
HCSL-Fast Output Option5
CML Output Option (AC-Coupled)
CMOS Output Option
Notes:
1. Min APR includes ±20 ppm temperature stability, initial accuracy, load pulling, VDD variation, and aging for 20 yrs at 70 ºC.
2. OE includes a 50 kΩ pull-up to VDD for OE active high, or includes a 50 kΩ pull-down to GND for OE active low. FS pin includes
a 50 kΩ pull-up to VDD.
3. Rterm = 50 Ω to VDD – 2.0 V (see Figure 4.1). Additional DC current from the output driver will flow through the 50 Ω resistors,
resulting in a shift in common mode voltage. The measurements in this table have accounted for this.
4. Rterm = 100 Ω (differential) (see Figure 4.2).
5. Rterm = 50 Ω to GND (see Figure 4.2).
6. Refer to the figure below for Typical Clock Output Swing Amplitudes vs Frequency.
7. High drive LVDS swing is supported when following the method shown in section 5.8 Configuring High Drive LVDS Swing.
Figure 2.1. Typical Clock Output Swing Amplitudes vs. Frequency
4
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Si569 Data Sheet • Electrical Specifications
Table 2.2. I2C Characteristics
VDD = 1.8, 2.5, or 3.3 V ± 5%, TA = –40 to 85 ºC
Parameter
Symbol
Test Condition/Comment
Min
Typ
Max
Unit
SDA, SCL Input Voltage High
VIH
0.70 x
VDD
—
—
V
SDA, SCL Input Voltage Low
VIL
—
—
0.30 x
VDD
V
MRES
—
0.026
—
ppb
From center frequency
-950
—
+950
ppm
Settling Time for Small Frequency Change
< ±950 ppm from center frequency
—
—
100
μs
Settling Time for Large Frequency Change
(Output Squelched during Frequency Transition). Includes 30 ms for internal VCO calibration to new frequency (FCAL). See Table 5.7.
> ±950 ppm from center frequency
—
—
40
ms
Frequency Reprogramming Resolution
Frequency Range for Small Frequency
Change (Continuous Glitchless Output)
Note: For best performance, place the Si569 on a dedicated I2C bus, or isolate it via an I2C bus multiplexer to minimize noise.
Table 2.3. VC Control Voltage Input
VDD = 1.8, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC
Parameter
Symbol
Control Voltage Range
VC
Control Voltage Tuning Slope
(Vc = 10% VDD to 90% VDD)
Kv
Kv Variation
Test Condition
Positive slope, ordering option
Kv_var
Typ
Max
Unit
0.1 x
VDD
VDD/2
0.9 x
VDD
V
60, 75, 105, 150, 180, 225
ppm/V
—
—
±10
%
–1.5
±0.5
+1.5
%
Control Voltage Linearity
LVC
Modulation Bandwidth
BW
—
10
—
kHz
Vc Input Impedance
ZVC
500
—
—
kΩ
5
Best Straight Line fit
Min
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Si569 Data Sheet • Electrical Specifications
Table 2.4. Clock Output Phase Jitter and PSNR
VDD = 1.8 V, 2.5 or 3.3 V ± 5%, TA = –40 to 85 ºC
Parameter
Phase Jitter (RMS, 12 kHz - 20 MHz)1
All Differential Formats, FCLK ≥ 200 MHz
Phase Jitter (RMS, 12 kHz - 20 MHz) 1
All Diff Formats, 100 MHz ≤ FCLK < 200 MHz
Phase Jitter (RMS, 12 kHz - 20 MHz)1
LVDS, FCLK = 156.25 MHz
Phase Jitter (RMS, 12 kHz - 20 MHz)1
CMOS / Dual CMOS Formats
Spurs Induced by External Power Supply
Noise, 50 mVpp Ripple. LVDS 156.25 MHz
Output
Symbol
Test Condition/Comment
Min
Typ
Max
Unit
ϕJ
Kv = 60 ppm/V
—
100
150
fs
Kv = 75 ppm/V
—
103
—
fs
Kv = 105 ppm/V
—
110
—
fs
Kv = 150 ppm/V
—
123
—
fs
Kv = 180 ppm/V
—
132
—
fs
Kv = 225 ppm/V
—
150
—
fs
Kv = 60 ppm/V
—
115
180
fs
Kv = 75 ppm/V
—
118
—
fs
Kv = 105 ppm/V
—
125
—
fs
Kv = 150 ppm/V
—
138
—
fs
Kv = 180 ppm/V
—
147
—
fs
Kv = 225 ppm/V
—
165
—
fs
Kv = 60 ppm/V
—
110
130
fs
Kv = 75 ppm/V
—
113
—
fs
Kv = 105 ppm/V
—
120
—
fs
Kv = 150 ppm/V
—
133
—
fs
Kv = 180 ppm/V
—
142
—
fs
Kv = 225 ppm/V
—
160
—
fs
10 MHz ≤ FCLK < 250 MHz
—
200
—
fs
ϕJ
ϕJ
ϕJ
PSNR
100 kHz sine wave
-83
200 kHz sine wave
-83
500 kHz sine wave
-82
1 MHz sine wave
-85
dBc
Note:
1. Guaranteed by characterization. Jitter inclusive of any spurs, I2C lines not active.
6
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Si569 Data Sheet • Electrical Specifications
Table 2.5. 3.2 x 5 mm Clock Output Phase Noise (Typical)
Offset Frequency (f)
156.25 MHz LVDS
200 MHz LVDS
644.53125 MHz LVDS
100 Hz
–73
–71
–60
1 kHz
–102
–102
–93
10 kHz
–130
–128
–118
100 kHz
–141
–139
–129
1 MHz
–150
–148
–138
10 MHz
–159
–160
–153
20 MHz
–160
–162
–154
Offset Frequency (f)
156.25 MHz
LVPECL
200 MHz
LVPECL
644.53125 MHz
LVPECL
100 Hz
–72
–71
–60
1 kHz
–103
–101
–92
10 kHz
–130
–127
–117
100 kHz
–142
–139
–129
1 MHz
–150
–148
–138
10 MHz
–160
–162
–154
20 MHz
–161
–162
–156
Unit
dBc/Hz
Unit
dBc/Hz
Figure 2.2. Phase Jitter vs. Output Frequency
Phase jitter measured with Agilent E5052 using a differential-to-single ended converter (balun or buffer). Measurements collected for
>700 commonly used frequencies. Phase noise plots for specific frequencies are available using our free, online Oscillator Phase Noise
Lookup Tool at https://www.skyworksinc.com/-/media/Skyworks/SL/documents/public/user-guides/ug298-si5xxuc-evb-ug.pdf.
7
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Si569 Data Sheet • Electrical Specifications
Table 2.6. Environmental Compliance and Package Information
Parameter
Test Condition
Mechanical Shock
MIL-STD-883, Method 2002
Mechanical Vibration
MIL-STD-883, Method 2007
Solderability
MIL-STD-883, Method 2003
Gross and Fine Leak
MIL-STD-883, Method 1014
Resistance to Solder Heat
MIL-STD-883, Method 2036
Moisture Sensitivity Level (MSL): 3.2 x 5, 5 x 7 packages
1
Moisture Sensitivity Level (MSL): 2.5 x 3.2 package
2
Contact Pads: 3.2x5, 5x7 packages
Au/Ni (0.3 - 1.0 µm / 1.27 - 8.89 µm)
Contact Pads: 2.5x3.2 packages
Au/Pd/Ni (0.03 - 0.12 µm / 0.1 - 0.2 µm / 3.0 - 8.0 µm)
Note:
1. For additional product information not listed in the data sheet (e.g. RoHS Certifications, MDDS data, qualification data, REACH
Declarations, ECCN codes, etc.), refer to our "Corporate Request For Information" portal found here: www.skyworksinc.com/quality.
Table 2.7. Thermal Conditions1
Max Junction Temperature = 125° C
Package
2.5 x 3.2 mm
8-pin DFN2
3.2 × 5 mm
8-pin CLCC
5 × 7 mm
8-pin CLCC
Parameter
Symbol
Test Condition
Value
Unit
Thermal Resistance Junction to Ambient
ΘJA
Still Air, 85 °C
72
ºC/W
Thermal Parameter Junction to Board
ΨJB
Still Air, 85 °C
38
ºC/W
Thermal Parameter Junction to Top Center
ΨJT
Still Air, 85 °C
15
ºC/W
Thermal Resistance Junction to Ambient
ΘJA
Still Air, 85 °C
55
ºC/W
Thermal Parameter Junction to Board
ΨJB
Still Air, 85 °C
20
ºC/W
Thermal Parameter Junction to Top Center
ΨJT
Still Air, 85 °C
20
ºC/W
Thermal Resistance Junction to Ambient
ΘJA
Still Air, 85 °C
53
ºC/W
Thermal Parameter Junction to Board
ΨJB
Still Air, 85 °C
26
ºC/W
Thermal Parameter Junction to Top Center
ΨJT
Still Air, 85 °C
26
ºC/W
Note:
1. Based on PCB Dimensions: 4.5" x 7", PCB Thickness: 1.6 mm, Number of Cu Layers: 4.
2. For best 2.5x3.2mm thermal performance, use 2 GND vias as shown in the Si5xxUC-EVB eval board layout
8
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Si569 Data Sheet • Electrical Specifications
Table 2.8. Absolute Maximum Ratings1
Parameter
Symbol
Rating
Unit
TAMAX
95
ºC
TS
–55 to 125
ºC
Supply Voltage
VDD
–0.5 to 3.8
ºC
Input Voltage
VIN
–0.5 to VDD + 0.3
V
ESD HBM (JESD22-A114)
HBM
2.0
kV
Solder Temperature2
TPEAK
260
ºC
TP
20–40
sec
Maximum Operating Temp.
Storage Temperature
Solder Time at TPEAK2
Notes:
1. Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation specification
compliance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device
reliability.
2. The device is compliant with JEDEC J-STD-020.
9
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Si569 Data Sheet • Dual CMOS Buffer
3. Dual CMOS Buffer
Dual CMOS output format ordering options support either complementary or in-phase signals for two identical frequency outputs. This
feature enables replacement of multiple VCXOs with a single Si569 device.
~
~
Complementary
Outputs
In-Phase
Outputs
Figure 3.1. Integrated 1:2 CMOS Buffer Supports Complementary or In-Phase Outputs
10
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Si569 Data Sheet • Recommended Output Terminations
4. Recommended Output Terminations
The output drivers support both AC-coupled and DC-coupled terminations as shown in figures below.
VDD
VDD (3.3V, 2.5V)
CLK+
Rp
R1
R1
CLK+
50 Ω
CLK-
Si56x
VDD
VDD (3.3V, 2.5V)
Rp
R2
R2
LVPECL
Receiver
VDD (3.3V, 2.5V)
CLK+
CLK-
Si56x
Rp
50 Ω
Rp
R2
VDD (3.3V, 2.5V)
R1
CLK+
50 Ω
VTT
LVPECL
Receiver
LVPECL
Receiver
AC-Coupled LVPECL - 50 Ω w/VTT Bias
50 Ω
VDD – 2.0V
CLK-
50 Ω
R2
R2
DC-Coupled LVPECL – Thevenin Termination
50 Ω
VDD
50 Ω
Si56x
AC-Coupled LVPECL – Thevenin Termination
R1
50 Ω
CLK-
50 Ω
R1
50 Ω
50 Ω
50 Ω
Si56x
LVPECL
Receiver
DC-Coupled LVPECL - 50 Ω w/VTT Bias
Figure 4.1. LVPECL Output Terminations
AC-Coupled LVPECL
Termination Resistor Values
11
DC-Coupled LVPECL
Termination Resistor Values
VDD
R1
R2
Rp
VDD
R1
R2
3.3 V
82.5 Ω
127 Ω
130 Ω
3.3 V
127 Ω
82.5 Ω
2.5 V
62.5 Ω
250 Ω
90 Ω
2.5 V
250 Ω
62.5 Ω
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Si569 Data Sheet • Recommended Output Terminations
(3.3V, 2.5V, 1.8V)
VDD
CLK+
(3.3V, 2.5V, 1.8V)
VDD
50 Ω
CLK+ 33 Ω
100 Ω
CLK50 Ω
Si56x
LVDS
Receiver
CLK+
50 Ω
HCSL
Receiver
Source Terminated HCSL
(3.3V, 2.5V, 1.8V)
VDD
50 Ω
CLK+
100 Ω
CLK50 Ω
Si56x
50 Ω
50 Ω
Si56x
DC-Coupled LVDS
(3.3V, 2.5V, 1.8V)
VDD
50 Ω
CLK- 33 Ω
50 Ω
CLK-
LVDS
Receiver
50 Ω
50 Ω
Si56x
AC-Coupled LVDS
50 Ω
HCSL
Receiver
Destination Terminated HCSL
Figure 4.2. LVDS and HCSL Output Terminations
(3.3V, 2.5V, 1.8V)
VDD
CLK+
VDD (3.3V, 2.5V, 1.8V)
50 Ω
CLK
10 Ω
100 Ω
CLK-
NC
50 Ω
Si56x
CML
Receiver
CLK+
Si56x
Single CMOS Termination
VDD (3.3V, 2.5V, 1.8V)
50 Ω
50 Ω
CLK+
50 Ω
CLK-
VCM
CLK-
CMOS
Receiver
Si56x
CML Termination without VCM
(3.3V, 2.5V, 1.8V)
VDD
50 Ω
50 Ω
CML
Receiver
CML Termination with VCM
10 Ω
10 Ω
50 Ω
50 Ω
Si56x
CMOS
Receivers
Dual CMOS Termination
Figure 4.3. CML and CMOS Output Terminations
12
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Si569 Data Sheet • Configuring Si569 via I2C
5. Configuring Si569 via I2C
The Si569 VCXO device contains a fixed frequency crystal and frequency synthesis IC using Skyworks patented DSPLLTM technology,
all enclosed in a standard hermetically sealed voltage controlled crystal oscillator (VCXO) package. The internal crystal provides the
reference frequency used by the DSPLL frequency synthesis IC. The center output frequency of the Si569 voltage controlled oscillator
is set via I2C register settings in the DSPLL frequency synthesis IC. The output frequency is then pulled higher or lower by applying a
voltage above or below VDD/2 to the VC pin. The amount of output frequency change per volt is based on a programmed ppm/V (Kv)
register setting. DSPLL technology provides unmatched frequency flexibility with superior output jitter/phase noise performance and
part per trillion frequency accuracy. This section describes how to calculate the required Si569 register values used to set device output
frequency and Kv gain, and how to load these values into the Si569 device.
Fvco
Fosc
VC
ADC
OE
Control
Logic
and NVM
Digital
Phase
Detector
Phase
Error
Cancellation
Digital
Loop
Filter
Digital
VCO
HSDIV
LSDIV
Driver
OSC
Out+
Out-
Fout
Δf
Phase Error
I2C / FS
FBDIV
Δf
Power
Supply
Processing
VDD GND
Figure 5.1. Si569 Block Diagram
The figure above is a simplified high-level block diagram of the Si569 VCXO device. The output frequency is set by a combination of
three divider blocks highlighted in the above block diagram.
1. FBDIV - DSPLLTM Feedback Divider used to set Digital VCO frequency
2. HSDIV - High-Speed Output Divider
3. LSDIV - Low-Speed Output Divider
The final device output frequency (Fout) is based on the digital VCO frequency (Fvco) divided by the product of the HSDIV and LSDIV
divider values. The digital VCO frequency is based on the crystal reference frequency (OSC) multiplied by the feedback divider setting
(FBDIV). The FBDIV value is set via I2C registers and is modulated depending on the voltage on the Vc pin. The amount of digital
VCO frequency variation for a given Vc voltage in ppm/V depends on the Kv register setting. The limits of each of these internal blocks
(digital VCO and dividers) determines the valid operating frequency range of the device.
The FBDIV divider is a fractional fixed-point divider with a total length of 43 bits consisting of an 11-bit integer field (FBINT) and a 32 bit
fractional field (FBFRAC) where total FBDIV = [FBINT].[FBFRAC] with an implied decimal point as shown. This bit format is known as
an 11.32 fixed point format where the integer portion is 11 bits and fractional portion is 32 bits, for a total of 43 bits.
The HSDIV divider is an integer divider, 11 bits in length, containing a binary divider value. One noteworthy feature of the HSDIV divider
is a special duty cycle correction circuit that allows odd divide ratios of lower divider values (4-33 only) with 50% duty cycle output. This
feature is useful when LSDIV divide ratio is set to 1.
The LSDIV divider performs power-of-2 divides ranging from divide by 1 (20) to divide by 32 (25). The register controlling the LSDIV
divider is 3 bits in length, holding the power-of-2 divide ratio (divider exponent). For example, if the LSDIV register = 3 the LSDIV divide
ratio is 2^3 = 8. Note that LSDIV has a maximum value of 32 and therefore LSDIV register settings of 5, 6 or 7 will all result in the
maximum divide-by-32 LSDIV operation.
The tables below summarize the divider limits for LSDIV, HSDIV, FBDIV. These limits and restrictions must be observed when deriving
divider register values as will be explained in later sections.
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Si569 Data Sheet • Configuring Si569 via I2C
Table 5.1. Si569 Divider Range Limits
Divider
Upper Limit
Lower Limit
HSDIV[10:0] (unsigned)
2046
4
LSDIV[2:0]1 (unsigned)
32 (2^5)
1 (2^0)
FBDIV[42:0] hex (unsigned)
7FDFFFFFFFF
03C00000000
FBDIV[42:0] int.frac (unsigned)
2045.99999999976
60.0
Note:
1. LSDIV is power of 2 divider. See LSDIV table below for actual divide ratio based on LSDIV register value.
Table 5.2. Additional LSDIV and HSDIV Divider Restrictions
LSDIV
Divide Ratio
HSDIV Value Restrictions
Register Value
0
1
1
2
2
4
3
8
5-33 even or odd values 1 ,
4
16
34-2046 even values only
5
32
6
32
7
32
Note:
1. HSDIV can implement low value (5-33) odd divide ratios while providing a 50% duty cycle output due to special duty cycle
correction circuit.
Note that all divider values (FBDIV, HSDIV, LSDIV) are unsigned and contain only positive values.
The Si569 high-performance VCXO family has four different speed grade offerings, each covering a specific frequency range. The table
below outlines the output frequency range coverage by each speed grade, the corresponding min and max VCO frequency for that
speed grade, and the nominal crystal frequency. The information in the table below is needed when calculating divider settings for a
given device, speed grade, and output frequency.
Table 5.3. Si569 Speed Grades, Crystal Frequency, and VCO Range Limits
14
Device
Speed Grade
Xtal freq (MHz)
Min Output Freq
(MHz)
Max Output
Freq (MHz)
Min Fvco (GHz)
Max Fvco (GHz)
Si569
A
152.6
0.2
3000
10.8
13.122222022
B
152.6
0.2
1500
10.8
12.511886114
C
152.6
0.2
800
10.8
12.206718160
D
152.6
0.2
325
10.8
12.206718160
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Si569 Data Sheet • Configuring Si569 via I2C
5.1 Output Frequency and Kv Gain Calibration Equations
The basic equations used to derive the output frequency are given below and can be inferred from the device block diagram in Figure
5.2 Si569 Frequency Definition Block Diagram on page 15. Equation 1 is the relationship between the output frequency (Fout), and
the VCO frequency (Fvco) and total output divider ratio (HSDIV * LSDIV). Equation 2 is the relationship between the VCO frequency
(Fvco), the fixed crystal oscillator frequency (Fosc), and the feedback divider (FBDIV). Equation 2 also includes frequency adjustment
(Δf) using the input control voltage (Vc) and the ppm/V control voltage gain (Kv).
Fout = Fvco / (HSDIV x LSDIV)
Equation 1
Fvco = (Fosc x FBDIV) x (1 + Δf) (offset freq in ppm)
Equation 2a
Fvco = (Fosc x FBDIV) x (1 + [(Vc - VDD/2) * Kv])
Equation 2b
Fvco
Fosc
VC
ADC
OE
Control
Logic
and NVM
Digital
Phase
Detector
Phase
Error
Cancellation
Digital
Loop
Filter
Digital
VCO
HSDIV
Driver
OSC
LSDIV
Out+
Out-
Fout
Δf
Phase Error
I2C / FS
Power
Supply
Processing
FBDIV
Δf
VDD GND
Figure 5.2. Si569 Frequency Definition Block Diagram
Equation 3a is a rearranged Equation 1 to solve for the total output divider (HSDIV *LSDIV) given Fout and Fvco. Equation 3b is
rearranged again solving for Fvco given Fout and (HSDIV * LSDIV).
(HSDIV x LSDIV) = Fvco / Fout
Equation 3a
Fvco = Fout x (HSDIV x LSDIV)
Equation 3b
Equation 4a is a rearranged Equation 2b to now solve for FBDIV given Fvco, Vc, VDD, Kv, and Fosc. Equation 4b simplifies Equation
4a to determine the FBDIV value for the center output frequency when Vc = VDD/2.
FBDIV = (Fvco / Fosc) / [1 + (Vc - VDD/2) * Kv]
Equation 4a
FBDIV = Fvco / Fosc for Vc = VDD/2 (center frequency)
Equation 4b
Equations 3a, 3b, 4a, and 4b will be used in the process of deriving the required divider values to provide a desired center output
frequency (Fout). The basic process is outlined in the next section.
Whenever the Fvco frequency is modified from the factory default, it is necessary to re-calibrate Kv gain. This is because the Vc ADC
input sampling rate is tied to Fvco and is factory calibrated to 80 MHz based on the factory Fvco setting. Whenever Fvco is modified to
change the output center frequency, the Vc ADC sampling rate is also changed so the full-scale Kv gain must be re-calculated.
15
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Si569 Data Sheet • Configuring Si569 via I2C
CADC_FSGAIN = round (128 * nominal Vc ADC sampling rate / new Vc ADC sampling rate)
Equation 5a
CADC_FSGAIN = round (128 * 80e6 / (Fvco / NFXDIV / 8))
Equation 5b
Equations 5a and 5b are used along with the table below to re-calculate the Kv full scale gain. This process is also outlined in the next
section.
Table 5.4. Si569 NFXDIV Values for Different FBDIV Integer Values
FBDIV Min
FBDIV Max
NFXDIV Value
—
71.999999…
16
72.000000…
78.999999…
18
79.000000…
85.999999…
20
86.000000…
—
22
5.2 General Process Steps for Divider Calculations and Kv Gain Calibration
1. Estimate a theoretical total output divider value (HSDIV * LSDIV) based on desired Fout while targeting the minimum valid Fvco
frequency using Equation 3a and Table 5.3 Si569 Speed Grades, Crystal Frequency, and VCO Range Limits on page 14. Use
floating point calculations for this step.
• Result: Floating point value of total output divider (HSDIV * LSDIV) for Fvco minimum.
2. Derive a valid LSDIV divider value based on LSDIV and HSDIV divider limitations. Use the lowest possible integer value for LSDIV.
For example, if the floating point output divider (HSDIV * LSDIV) for Fvco minimum = 8.22, use LSDIV = 1 and HSDIV = 8.22
versus LSDIV = 2 and HSDIV = 4.11.
• Result: Valid integer LSDIV value.
3. Using the LSDIV value from #2 above, find the nearest valid integer HSDIV divider value resulting in Fvco being equal to or
greater than Fvco min, observing all HSDIV limitations. Use Equations 3a/3b as necessary.
• Result: Valid integer HSDIV value.
4. With valid integer HSDIV and LSDIV values, calculate the target Fvco center frequency with Equation. 3b. (Fvco must remain in the
valid range per Table 5.3 Si569 Speed Grades, Crystal Frequency, and VCO Range Limits on page 14.)
• Result: Valid Fvco frequency.
5. With the derived valid Fvco frequency, use Equation 4b to calculate the required FBDIV based on the device specific Fosc
frequency from Table 5.3 Si569 Speed Grades, Crystal Frequency, and VCO Range Limits on page 14. Assume Vc = VDD/2 to
calculate an FBDIV value for the center Fout frequency.
• Result: Valid fractional FBDIV value
6. At this point all FBDIV, HSDIV and LSDIV values required to generate the desired center output frequency have been calculated.
These three divider values must be now be appropriately formatted to fit the register format expected by the device. This is
described in a later section.
• Result: Valid register values for FBDIV, HSDIV, LSDIV
7. To re-calibrate Kv gain, first determine the integer portion of the new FBDIV value in step #5 above using truncation (not rounding)
and then use that value to select the correct NFXDIV value using Table 5.4 Si569 NFXDIV Values for Different FBDIV Integer
Values on page 16.
• Result: Valid NFXDIV value
8. To complete Kv gain calibration, calculate the new Kv gain calibration value (CADC_FSGAIN) using Equation 5b. This Kv gain
calibration value must be appropriately formatted to fit the register format expected by the device. This is described in a later
section.
• Result: Valid CADC_FSGAIN value
16
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Si569 Data Sheet • Configuring Si569 via I2C
5.3 Example: Deriving Si569 Divider Settings for 156.75 MHz Output
The general process of deriving divider values for a specific output frequency is outlined in the previous section and now will be used
in this example. To reiterate, all calculations must be done while observing divider limits and valid VCO frequency range limits for your
device. In this example, the device is Si569 and with a desired output frequency of 156.75 MHz, the speed grade required will be “D”
or better. (One important note: All divider and register settings derived for any speed grade will work without modification for all faster
speed grades on the same base part number device.)
Example VB code that implements the following divider calculation process is given in 5.10 Si569 Frequency Planner VB Code
and can be used for implementing any supported output frequency.
Step 1: Find the valid theoretical lower limit of the total output divider (HSDIV*LSDIV) based on the desired output frequency and
lowest valid VCO frequency. This will bias the divider solution to the lowest possible VCO frequency since this will provide the best
performance solution.
Given the valid Si569 VCO range is 10.8000 GHz to 13.1222 GHz, the minimum theoretical values for (HSDIV * LSDIV) for the example
156.75 MHz output frequency are given in Equation 3:
Minimum (HSDIV*LSDIV) = (10.8000 GHz / 156.75 MHz) = 68.89952…
Step 2: Find valid LSDIV divisor value given minimum (HSDIV*LSDIV) from step 1. For best performance, preference should be given
to implementation of the total output divider (HSDIV*LSDIV) using HSDIV with LSDIV divide ratio = 1, if possible. Use LSDIV divide
ratios > 1 only if HSDIV alone cannot implement the required output divider. Since the total (HSDIV*LSDIV) value of 68.8995… is less
than the HSDIV maximum divider value of 2046, the LSDIV divide ratio value will be 1, which corresponds to a LSDIV register setting
of 0, since the LSDIV divider can only be a power of 2 value (see Table 5.2 Additional LSDIV and HSDIV Divider Restrictions on page
14 for valid LSDIV settings).
LSDIV divide ratio = 1, therefore LSDIV register value = 0
Step 3: Find HSDIV divisor value. Given LSDIV = 1, HSDIV must implement 68.8995… or greater. Since HSDIV is an integer divider,
the next greatest integer is 69. But, checking valid HSDIV values when LSDIV divide ratio = 1, we see 69 is NOT valid since it is greater
than 33 and an odd value. This means the next greater integer value must be used, which is 70 (now even value). Note that 68 would
not be valid since 68 is less than 68.8995… and would result in a VCO frequency below the lower VCO frequency limit.
HSDIV divide ratio = 70, which gives HSDIV register value = 70 decimal (or hex value = 0x46)
Step 4: Calculate a valid VCO frequency and corresponding floating point FBDIV value. Given the calculated output divider value
(HSDIV*LSDIV) = 70, the VCO frequency must be set to (156.75 MHz * 70) = 10.9725 GHz. Note that 10.9725 GHz is indeed within the
valid VCO frequency range per Table 5.3 Si569 Speed Grades, Crystal Frequency, and VCO Range Limits on page 14.
Fvco = 10.9725 GHz
Step 5: Calculate the FBDIV value necessary to provide a 10.9725 GHz Fvco using a 152.6 MHz crystal as reference (Si569 device).
The floating point FBDIV value required to attain 10.9725 GHz with a 152.6 MHz crystal reference can be calculated as follows:
FBDIV (float) = 10.9725 GHz / 152.6 MHz = 71.9036697247707
Step 6: Format each divider value into the required register format. LSDIV and HSDIV are simply binary values and can be directly
used. FBDIV must first be put into 11.32 fixed point format. Converting the floating point FBDIV value into the 11.32 fixed point hex
value required by the Si569 is done as follows:
Integer value = 71 decimal. Convert 71 to 11 bit hex = 0x047. This is FBINT.
Fractional value = 0.9036697247707. Multiply fractional value by 2^32 = 3881231914.2752. Now extract only the integer part of the
result which is 3881231914. Convert 3881231914 to 32 bit hex = 0xE756E62A. This is FBFRAC.
The resulting 11.32 fixed point hex number is therefore:
FBDIV = FBINT.FBFRAC = 0x047E756E62A
17
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Si569 Data Sheet • Configuring Si569 via I2C
At this point we have calculated all the required divider values. The table below summarizes the resulting divider values for implementing a 156.75 MHz output clock on the Si569.
Table 5.5. Divider Register Values for Si569 Configured for 156.75 MHz Output Clock
Divider Register
Decimal Value
Hex Value
Reg Length (bits)
LSDIV
0
0x0
3
HSDIV
70
0x046
11
FBDIV
71.9036697247707
0x047E756E62A
43 (11+32)
5.4 Example: Deriving Si569 Kv Gain Settings for 156.75 MHz Output
Whenever the Fvco frequency is modified from the factory default it is necessary to re-calibrate Kv gain.
Step 1: Find the Fvco and FBDIV values from the new configuration to be used for Equation 5b.
Fvco = 10.9725 GHz
FBDIV (float) = 10.9725 GHz / 152.6 MHz = 71.9036697247707
Step 2: Use the integer portion of FBDIV to find the correct value for NFXDIV using Table 5.4 Si569 NFXDIV Values for Different FBDIV
Integer Values on page 16. Do not round up the integer portion of FBDIV, instead truncate FBDIV down via the floor function.
FBDIV (int) = floor (10.9725 GHz / 152.6 MHz) = floor (71.9036697247707) = 71
Excerpt from Table 5.4 Si569 NFXDIV Values for Different FBDIV Integer Values on page 16:
FBDIV Min
FBDIV Max
NFXDIV Value
—
71.999999…
16
72.000000…
78.999999…
18
Step 3: Calculate the new CADC_FSGAIN calibration value using Fvco, FBDIV (int) and NFXDIV.
CADC_FSGAIN = round (128 * 80e6 / (Fvco / NFXDIV / 8))
CADC_FSGAIN = round (128 * 80e6 / (10.9725e9 / 16 / 8))
CADC_FSGAIN = round (119.455) = 119 = 0x77
18
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Si569 Data Sheet • Configuring Si569 via I2C
5.5 Mapping Divider Settings into Register Values
For the previous 156.75 MHz example, the divider value to register mapping is shown in the table below. Note that Register 24 is a
packed register and contains bits from both LSDIV and HSDIV registers as follows: LSDIV[2:0] maps into Reg24[6:4] and HSDIV[10:8]
maps into Reg24[2:0]. Note that bits Reg24[7] and Reg24[3] are not used and indicated with ‘x’ in the RegName field below. See also
the Register Map Reference section for specific bit positioning within registers.
Table 5.6. Si569 Divider Register Values for 156.75 MHz Output Clock Configuration
19
Register (Decimal)
Hex Value
Reg Name
23
46
HSDIV[7:0]
24
00
x:LSDIV[2:0]:x:HSDIV[10:8]
26
2A
FBDIV[7:0]
27
E6
FBDIV[15:8]
28
56
FBDIV[23:16]
29
E7
FBDIV[31:24]
30
47
FBDIV[39:32]
31
00
FBDIV[42:40]
35
77
CADC_FSGAIN[7:0]
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Si569 Data Sheet • Configuring Si569 via I2C
5.6 I2C Register Write Procedure to Set Output Frequency
After the frequency setting registers (Reg 23-Reg31) are calculated, there is a procedure that must be followed involving other specific
control registers for the device to properly use the new frequency setting registers. Simply writing Reg23-Reg31 is not enough. The
following procedure must be performed as shown to properly configure the Si569 for the desired output frequency. In other words, all
the following register writes must be done, and in the exact sequence shown.
This programming sequence consists of three distinct phases.
1. Writing to specific registers to get the device ready to be updated.
2. Writing the calculated frequency (divider) settings for the desired output frequency.
3. Writing to specific registers necessary to start-up the device after divider registers have been updated. The new output frequency
will appear on output.
The divider values shown in the table below are for the previously described Si569 example for an output frequency of 156.75 MHz (for
other frequencies, replace the divider values in registers 23-31 with values specific to your frequency requirements).
Table 5.7. Si569 Register Write Sequence to Set Output Frequency
20
Register (decimal)
Write Data (hex)
Description
Purpose
255
0x00
Set page register to point to
page 0
Get Device Ready for Update
69
0x00
Disable FCAL override (to allow
FCAL for this Freq Update)
17
0x00
Synchronously disable output
23
0x46
HSDIV[7:0]
24
0x00
LSDIV[2:0]:HSDIV[10:8]
26
0x2A
FBDIV[7:0]
27
0xE6
FBDIV[15:8]
28
0x56
FBDIV[23:16]
29
0xE7
FBDIV[31:24]
30
0x47
FBDIV[39:32]
31
0x00
FBDIV[42:40]
35
0x77
CADC_FSGAIN[7:0]
Update Kv Gain
7
0x08
Start FCAL using new divider
values
Startup Device
—
—
Internal FCAL VCO calibration
(30 ms delay)
17
0x01
Synchronously enable output
Update Dividers
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Si569 Data Sheet • Configuring Si569 via I2C
5.7 Digitally Controlled Oscillator – ADPLL: Small, Fast Frequency Changes
The Si569 can make small, fast frequency adjustments over a range of +/- 950 ppm (parts-per-million) around the device output
frequency (set as described in previous sections). This mode is typically used in applications requiring a digitally controlled oscillator
(DCO) for digital PLL or other types of frequency control loops. We refer to this type of application as an all-digital PLL or ADPLL.
For ADPLL applications and superior ADPLL performance, Skyworks recommends the Si548 I2C oscillator. The Si548 is a 6-pin device
that features lower jitter than the Si569 while I2C lines are active, due to the different physical location of the SDA/SCL pins on the
package.
The ADPLL mode uses a single 24 bit register, ADPLL_DELTA_M[23:0], to add an offset to the VCO frequency to affect the small
frequency change. This offset is added in a synchronous fashion to prevent frequency discontinuities and can be updated as fast as the
max I2C bus speed of 1 MHz will allow. The frequency offset can be positive or negative over a range of -950 ppm to +950 ppm with
0.0001164 ppm resolution.
The equation for this frequency change is simply,
ADPLL_DELTA_M[23:0] = ∆ FoutPPM / 0.0001164
Where ∆ FoutPPM is the desired ppm change in output frequency, ADPLL_DELTA_M[23:0] is a two’s complement 24 bit value, and
0.0001164 is a constant per-bit ppm value. The 24 bit ADPLL_DELTA_M[23:0] value is written into three sequential 8 bit registers in
LSByte to MSByte order via I2C. Upon writing the MSByte, the frequency change takes effect. Below is an example VB to implement
this feature. (Note that writing ADPLL_DELTA_M[23:0] = 0x000 will result in no frequency offset and return to the nominal output
frequency.)
VB Code example for ADPLL (small frequency change) calculation and operation:
nAddr = Device I2C address
PPM_Delta = desired PPM frequency shift
Function Set_ADPLL(ByVal nAddr As UInteger, ByVal PPM_Delta As Double) As Integer
Dim ADPLL_PPM_StepSize As Double = 0.0001164
Dim ADPLL_Delta_M As Integer
Dim Reg231 As UInteger = 0
Dim Reg232 As UInteger = 0
Dim Reg233 As UInteger = 0
Dim ReturnCode As Integer = 0 '1=OK, -1 PPM requested is out of bounds
If (PPM_Delta = -950) Then
ADPLL_Delta_M = (PPM_Delta / ADPLL_PPM_StepSize)
Reg231 = (ADPLL_Delta_M And &HFF)
Reg232 = (ADPLL_Delta_M >> 8) And &HFF
Reg233 = (ADPLL_Delta_M >> 16) And &HFF
I2C_Write(nAddr, 0, 231, Reg231)
'write “Reg231” value to register 231 at nAddr, page 0 (LSByte)
I2C_Write(nAddr, 0, 232, Reg232)
'write “Reg232” value to register 232 at nAddr, page 0
I2C_Write(nAddr, 0, 233, Reg233)
'write “Reg233” value to register 233 at nAddr, page 0
(MSByte)
ReturnCode = 1
Else
ReturnCode = -1
End If
Return (ReturnCode)
End Function
5.8 Configuring High Drive LVDS Swing
The Si569 LVDS clock output swing can be increased 100 mV via I2C to have the same swing as AC-coupled CML. This is done by
programming the three registers as shown in the table below.
Table 5.8. LVDS and CML Output Drive Settings
21
Register Address (dec)
Output Drive
LVDS (dec)
High Drive LVDS / CML (dec)
16 [5:0]
OD_DRV_TRIM_V3P3[5:0]
17
20
125 [5:0]
OD_DRV_TRIM_V2P5[5:0]
20
23
126 [5:0]
OD_DRV_TRIM_V1P8[5:0]
22
25
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Si569 Data Sheet • Configuring Si569 via I2C
5.9 Register Map Reference
Table 5.9. Register Map Reference Summary
Register
(decimal)
Register Bit
7
6
5
4
0
7
2
1
RESET
= 3'b000
MS_ICAL
2
= 3'b000
23
ODC_OE
HSDIV[7:0]
LSDIV[2:0]
Reset
Value
R
0x45
R/W
0x00
R/W
0x01
R/W
0x54
R/W
0x00
0
DEVICE_TYPE[7:0]
17
24
3
Type
HSDIV[10:8]
26
FBDIV[7:0]
R/W
0x00
27
FBDIV[15:8]
R/W
0x00
28
FBDIV[23:16]
R/W
0x00
29
FBDIV[31:24]
R/W
0x00
30
FBDIV[39:32]
R/W
0x64
R/W
0x00
R/W
0x06
R/W
0x80
R/W
0x01
31
32
35
69
FBDIV[42:40]
KV_VCXO[4:0]
CADC_FSGAIN[7:0]
FCAL_OVR
= 7'b0000001
231
ADPLL_DELTA_M[7:0]
R/W
0x00
232
ADPLL_DELTA_M[15:8]
R/W
0x00
233
ADPLL_DELTA_M[23:16]
R/W
0x00
R/W
0x00
255
= 6'b000000
PAGE[1:0]
Table 5.10. Register Bit Field Summary
Register Bit Field Name
Bit Field (#bits)
Register
Description
DEVICE_TYPE[7:0]
8
0
Read only value of 69 (dec) which represents the device type (Si569)
RESET
1
7
Set to 1 to reset device. Self clearing.
MS_ICAL2
1
7
Set to 1 to initiate FCAL. Self clearing.
ODC_OE
1
17
Set to 0 to disable the output clock, and
remove output enable/disable control from
the external OE or OEB pin.
Set to 1 to return enable/disable control
back to the OE or OEB pin.
HSDIV[10:0]
22
11
23-24
HSDIV is High-speed output divider value
in unsigned 11-bit binary format. Valid divide values are from 5 to 2046, with values
of 5-33 even or odd, and values 34-2046
restricted to even values only.
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Si569 Data Sheet • Configuring Si569 via I2C
23
Register Bit Field Name
Bit Field (#bits)
Register
Description
LSDIV[2:0]
3
24
LSDIV sets a power-of-2 output divider.
Values of 0,1,2,3,4,5,6,7 result in divide ratio of 1,2,4,8,16,32,32,32 respectively. Note
that a value of 0 (divide-by-1) essentially
bypasses this divider.
FBDIV[42:0]
43
26-31
The main DSPLL system feedback divide
(FBDIV) value for Si56x. This 43 bit value
is composed of an unsigned 11-bit integer
value (FBDIV[42:32]) concatenated with a
32-bit fractional value (FBDIV[31:0]), for an
11.32 fixed point binary format. The valid
range of the 11-bit integer part is from 60 to
2045.
KV_VCXO[4:0]
5
32
Sets Vc voltage control gain Kv (ppm/V).
Multiply the register value in decimal by 7.5
to get the actual Kv in ppm/V.
CADC_FSGAIN[7:0]
8
35
Full-scale Kv gain parameter. Used to set
the (ppm/V) full-scale of the Vc input depending on the programmed VCO frequency.
FCAL_OVR
1
69
FCAL Override: If set to 1, FCAL is bypassed. Clear to 0 to allow FCAL.
ADPLL_DELTA_M[23:0]
24
231-233
Digital word to effect small frequency shifts
to base frequency. Value is 24 bit 2's complement causing a 0.0001164 ppm per
bit shift in frequency. Positive values =
positive freq shift, negative values = negative freq shift. Valid range is -8161513 to
+8161512, representing a max PPM shift
range of -950 ppm to +950 ppm, with 0
value representing 0 PPM shift. Writing a
new ADPLL_DELTA_M value will take effect upon writing to the MSByte (Register
233). Therefore, value updates should follow the sequence of writing in register order
Reg 231...Reg 232...Reg 233.
PAGE[1:0]
2
255
Sets which page of registers the I2C port is
reading/writing. The size of a page is 256
bytes which is the addressable range of
an I2C "set address" command. The value
of PAGE is multiplied by 256 and added
to what "set address" has set. Physically,
the 2 PAGE bits become bits [9:8] of the
device's internal register map address. This
mechanism allows for more than 256 registers to be addressed within the 8 bit I2C
"set address" limitation.
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Si569 Data Sheet • Configuring Si569 via I2C
5.10 Si569 Frequency Planner VB Code
-------------------------------------------------------------------------------------------------Module Main
'
' Si56x Frequency Planner Code
'
'
'Set Target device type, Speed grade, and desired output frequency
'
Public Device As Integer = 569
'
Public SpeedGrade As String = "D" 'Can only be "A" or "B" or "C" or “D”
Public Output_Freq As Double = 312500000.0 'Output frequency in Hz (initially set to 312.5 MHz)
'Set in 'SetLimits" function...
Public Fvco_max As Double 'Fvco Max per Table 5.3
Public Fvco_min As Double 'Fvco Min per Table 5.3
Public Xtal_freq As Double 'Xtal_Freq per Table 5.3
Public Fout_min As Double 'Minimum output frequency
Public Fout_max As Double 'Maximum output frequency
Sub Main()
'
' Device divider limits (see Tables 5.1 & 5.2)
'
Dim HSDIV_UpperLimit As Integer = 2046
Dim HSDIV_LowerLimit As Integer = 4
Dim HSDIV_LowerLimit_Odd As Integer = 5
'min count for odd HSDIV divisor
Dim HSDIV_UpperLimit_Odd As Integer = 33
'max count for odd HSDIV divisor
Dim LSDIV_UpperLimit As Integer = 5
Dim LSDIV_LowerLimit As Integer = 0
Dim FBDIV_UpperLimit As Double = 2045 + ((2 ^ 32 - 1) / (2 ^ 32))
Dim FBDIV_LowerLimit As Double = 60.0
'
' Working variables
'
Dim Min_HSLS_Div As Double
Dim LSDIV_Div As Double
' actual LSDIV divide ratio
Dim LSDIV_Reg As Integer
' LSDIV as encoded in power of 2 for device register use
Dim HSDIV As Double
Dim FBDIV As Double
Dim Fvco As Double
Dim FBDIV_Int As UInteger
Dim FBDIV_Frac As UInteger
Dim Reg23 As UInteger = 0
'HSDIV[7:0]
Dim Reg24 As UInteger = 0
'OD_LSDIV[2:0],HSDIV[10:8]
(*2^4,/2^8)
Dim Reg26 As UInteger = 0
'FBDIV[7:0]
Dim Reg27 As UInteger = 0
'FBDIV[15:8]
(/2^8)
Dim Reg28 As UInteger = 0
'FBDIV[23:16] (/2^16)
Dim Reg29 As UInteger = 0
'FBDIV[31:24] (/2^24)
Dim Reg30 As UInteger = 0
'FBDIV[39:32] (/2^32)
Dim Reg31 As UInteger = 0
'FBDIV[42:40] (/2^40)
'
' Set device limits based on device type and speed grade.
' (Checks if desired output frequency is valid based on device and speed grade)
'
If SetLimits(Device, SpeedGrade, Output_Freq) = 0 Then
'
' If limits are set and output frequency is valid, calculate frequency plan...
'***********************************************************************************************
' Step 1: Find theoretical HSDIV *LSDIV value based on lowest valid VCO frequency...
'
(Assumes "Output_Freq" has been tested and is in valid range for the device grade
according to Table 5.3)
'
Min_HSLS_Div = Fvco_min / Output_Freq
' Floating point HS*LS div value. Remember to first
bounds check Output_Freq!
'Step 2: Find LSDIV divisor value given Min_HSLS_Div value
'
LSDIV_Div = Math.Ceiling(Min_HSLS_Div / HSDIV_UpperLimit)
24
' Divisor value of LSDIV, NOT yet
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Si569 Data Sheet • Configuring Si569 via I2C
encoded as power of 2
If (LSDIV_Div > 32) Then LSDIV_Div = 32 ' clip at 32 (max LSDIV divisor)
'
'Encode LSDIV divisor value into next nearest 'power of 2' value if not already. This will be
LSDIV_Reg
'
LSDIV_Reg = Math.Ceiling(Math.Log(LSDIV_Div, 2))
' LSDIV_Reg now encoded as proper power of
2. Will range from 0 to 5.
' Adjust LSDIV_Div (holder of divisor) based on rounded power of 2 value in LSDIV_Reg
LSDIV_Div = 2 ^ LSDIV_Reg 'LSDIV_Div divisor now synchronized to actual LSDIV_Reg.
'
'Step 3: Find HSDIV divisor value using known LSDIV divisor
'
HSDIV = Math.Ceiling(Min_HSLS_Div / LSDIV_Div)
If ((HSDIV >= HSDIV_LowerLimit_Odd) And (HSDIV Fout_max)) Then
ReturnCode = -1
End If
ElseIf SpeedGrade = "B" Then
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Si569 Data Sheet • Configuring Si569 via I2C
Fvco_min = 10800000000.0
Fvco_max = 12511886114.0
Fout_min = 200000.0
Fout_max = 1500000000.0
If ((Output_Freq < Fout_min) Or (Output_Freq > Fout_max)) Then
ReturnCode = -1
End If
ElseIf SpeedGrade = "C" Then
Fvco_min = 10800000000.0
Fvco_max = 12206718160.0
Fout_min = 200000.0
Fout_max = 800000000.0
If ((Output_Freq < Fout_min) Or (Output_Freq > Fout_max)) Then
ReturnCode = -1
End If
ElseIf SpeedGrade = "D" Then
Fvco_min = 10800000000.0
Fvco_max = 12206718160.0
Fout_min = 200000.0
Fout_max = 325000000.0
If ((Output_Freq < Fout_min) Or (Output_Freq > Fout_max)) Then
ReturnCode = -1
End If
Else
ReturnCode = -1
'Speed Grade not found
End If
Else
ReturnCode = -1
'Device type not found
End If
Return (ReturnCode)
End Function
End Module
--------------------------------------------------------------------------
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Si569 Data Sheet • Configuring Si569 via I2C
5.11 Table of Common Frequencies for Si569 (152.6 MHz xtal)
Fout (MHz) LSDIV HSDIV FBDIV
Fvco (GHz)
Reg 23 Reg 24 Reg 26 Reg 27 Reg 28 Reg 29 Reg 30 Reg 31
70.656
0
154
71.30422018 10.881024
9Ah
00h
BAh
5Fh
E1h
4Dh
47h
00h
100
0
108
70.77326343 10.8
6Ch
00h
A7h
97h
F4h
C5h
46h
00h
122.88
0
88
70.86133683 10.81344
58h
00h
04h
92h
80h
DCh
46h
00h
125
0
88
72.08387942 11
58h
00h
34h
1Fh
79h
15h
48h
00h
148.351648 0
74
71.93985552 10.97802195 4Ah
00h
07h
5Fh
9Ah
F0h
47h
00h
148.5
0
74
72.01179554 10.989
4Ah
00h
63h
08h
05h
03h
48h
00h
148.945454 0
74
72.22780862 11.0219636
4Ah
00h
7Dh
AAh
51h
3Ah
48h
00h
150
0
72
70.77326343 10.8
48h
00h
A7h
97h
F4h
C5h
46h
00h
153.6
0
72
72.47182176 11.0592
48h
00h
84h
4Fh
C9h
78h
48h
00h
155.52
0
70
71.33944954 10.8864
46h
00h
46h
2Ah
E6h
56h
47h
00h
156.25
0
70
71.67431193 10.9375
46h
00h
D8h
B4h
9Fh
ACh
47h
00h
168.04
0
66
72.67785059 11.09064
42h
00h
C2h
9Dh
87h
ADh
48h
00h
168.75
0
64
70.77326343 10.8
40h
00h
A7h
97h
F4h
C5h
46h
00h
200
0
54
70.77326343 10.8
36h
00h
A7h
97h
F4h
C5h
46h
00h
212.5
0
52
72.41153342 11.05
34h
00h
17h
41h
5Ah
69h
48h
00h
245.76
0
44
70.86133683 10.81344
2Ch
00h
04h
92h
80h
DCh
46h
00h
250
0
44
72.08387942 11
2Ch
00h
34h
1Fh
79h
15h
48h
00h
270
0
40
70.77326343 10.8
28h
00h
A7h
97h
F4h
C5h
46h
00h
311.04
0
36
73.37771953 11.19744
24h
00h
1Ch
3Ah
B2h
60h
49h
00h
312.5
0
36
73.72214941 11.25
24h
00h
A3h
C8h
DEh
B8h
49h
00h
322.265625 0
34
71.80230177 10.95703125 22h
00h
14h
A6h
63h
CDh
47h
00h
400
0
27
70.77326343 10.8
1Bh
00h
A7h
97h
F4h
C5h
46h
00h
425
0
26
72.41153342 11.05
1Ah
00h
17h
41h
5Ah
69h
48h
00h
491.52
0
22
70.86133683 10.81344
16h
00h
04h
92h
80h
DCh
46h
00h
500
0
22
72.08387942 11
16h
00h
34h
1Fh
79h
15h
48h
00h
614.4
0
18
72.47182176 11.0592
12h
00h
84h
4Fh
C9h
78h
48h
00h
622.08
0
18
73.37771953 11.19744
12h
00h
1Ch
3Ah
B2h
60h
49h
00h
644.53125
0
17
71.80230177 10.95703125 11h
00h
14h
A6h
63h
CDh
47h
00h
750
0
15
73.72214941 11.25
0Fh
00h
A3h
C8h
DEh
B8h
49h
00h
800
0
14
73.39449541 11.2
0Eh
00h
C0h
A6h
FDh
64h
49h
00h
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Si569 Data Sheet • Configuring Si569 via I2C
5.12 I2C Interface
Configuration and operation of the Si569 is controlled by reading and writing to the RAM space using the I2C interface. The device
operates in slave mode with 7-bit addressing and can operate in Standard-Mode (100 kbps), Fast-Mode (400 kbps), or Fast-Mode Plus
(1 Mbps). Burst data transfer with auto address increments are also supported.
The I2C bus consists of a bidirectional serial data line (SDA) and a serial clock input (SCL). Both the SDA and SCL pins must be
connected to the VDD supply via an external pull-up as recommended by the I2C specification. The Si569 7-bit I2C slave address is
user-customized during the part number configuration process.
Data is transferred MSB first in 8-bit words as specified by the I2C specification. A write command consists of a 7-bit device (slave)
address + a write bit, an 8-bit register address, and 8 bits of data as shown in the figure below.
A write burst operation is also shown where every additional data word is written using an auto-incremented address.
Write Operation – Single Byte
S
Slv Addr [6:0]
0
A Reg Addr [7:0] A
Data [7:0]
A
P
A
Data [7:0]
Write Operation - Burst (Auto Address Increment)
S
Slv Addr [6:0]
0
A Reg Addr [7:0] A
Data [7:0]
A
P
Reg Addr +1
1 – Read
0 – Write
A – Acknowledge (SDA LOW)
N – Not Acknowledge (SDA HIGH)
S – START condition
P – STOP condition
From slave to master
From master to slave
Figure 5.3. I2C Write Operation
A read operation is performed in two stages. A data write is used to set the register address, then a data read is performed to retrieve
the data from the set address. A read burst operation is also supported. This is shown in the figure below.
Read Operation – Single Byte
S
Slv Addr [6:0]
0
A Reg Addr [7:0] A
S
Slv Addr [6:0]
1
A
Data [7:0]
P
N P
Read Operation - Burst (Auto Address Increment)
S
Slv Addr [6:0]
0
A Reg Addr [7:0] A
S
Slv Addr [6:0]
1
A
Data [7:0]
A
P
Data [7:0]
N P
Reg Addr +1
From slave to master
From master to slave
1 – Read
0 – Write
A – Acknowledge (SDA LOW)
N – Not Acknowledge (SDA HIGH)
S – START condition
P – STOP condition
Figure 5.4. I2C Read Operation
The timing specifications and timing diagram for the I2C bus is compatible with the I2C-Bus standard. SDA timeout is supported for
compatibility with SMBus interfaces.
The I2C bus can be operated at a bus voltage of 1.71 to 3.63 V and should be the same voltage as the Si569 VDD.
28
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Si569 Data Sheet • Package Outline
6. Package Outline
6.1 Package Outline (5x7 mm)
The figure below illustrates the package details for the 5x7 mm Si569. The table below lists the values for the dimensions shown in the
illustration.
Figure 6.1. Si569 (5x7 mm) Outline Diagram
Table 6.1. Package Diagram Dimensions (mm)
Dimension
Min
Nom
Max
Dimension
Min
Nom
Max
A
1.07
1.18
1.33
L
1.07
1.17
1.27
A2
0.40
0.50
0.60
L1
1.00
1.10
1.20
A3
0.45
0.55
0.65
L2
0.05
0.10
0.15
b
1.30
1.40
1.50
L3
0.15
0.20
0.25
b1
0.50
0.60
0.70
p
1.70
--
1.90
c
0.50
0.60
0.70
R
0.70 REF
aaa
0.15
bbb
0.15
D
D1
5.00 BSC
4.30
4.40
4.50
e
2.54 BSC
ccc
0.08
E
7.00 BSC
ddd
0.10
eee
0.05
E1
6.10
6.20
6.30
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
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Si569 Data Sheet • Package Outline
6.2 Package Outline (3.2x5 mm)
The figure below illustrates the package details for the 3.2x5 mm Si569. The table below lists the values for the dimensions shown in
the illustration.
Figure 6.2. Si569 (3.2x5 mm) Outline Diagram
Table 6.2. Package Diagram Dimensions (mm)
Dimension
MIN
NOM
MAX
Dimension
MIN
NOM
MAX
A
1.02
1.17
1.33
E1
A2
0.50
0.55
0.60
L
0.8
0.9
1.0
A3
0.45
0.50
0.55
L1
0.45
0.55
0.65
b
0.54
0.64
0.74
L2
0.05
0.10
0.15
b1
0.54
0.64
0.75
L3
0.15
0.20
0.25
2.85 BSC
D
5.00 BSC
aaa
0.15
D1
4.65 BSC
bbb
0.15
e
1.27 BSC
ccc
0.08
e1
1.625 TYP
ddd
0.10
E
3.20 BSC
eee
0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
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Si569 Data Sheet • Package Outline
6.3 Package Outline (2.5x3.2 mm)
The figure below illustrates the package details for the 2.5x3.2 mm Si569. The table below lists the values for the dimensions shown in
the illustration.
Figure 6.3. Si569 (2.5x3.2 mm) Outline Diagram
Table 6.3. Package Diagram Dimensions (mm)
Dimension
MIN
NOM
MAX
Dimension
MIN
NOM
MAX
A
0.85
0.90
1.00
L1
0.35
0.4
0.45
A1
0.36 REF
e
1.1 BSC
A2
0.53 REF
n
5
D
3.2 BSC
n1
2
E
2.5 BSC
D1
2.2 BSC
W
0.55
0.6
0.65
aaa
0.10
L
0.5
0.55
0.6
bbb
0.10
W1
0.35
0.4
0.45
ddd
0.08
Notes:
1. The dimensions in parentheses are reference.
2. All dimensions shown are in millimeters (mm) unless otherwise noted.
3. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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Si569 Data Sheet • PCB Land Pattern
7. PCB Land Pattern
7.1 PCB Land Pattern (5x7 mm)
The figure below illustrates the 5x7 mm PCB land pattern for the Si569. The table below lists the values for the dimensions shown in
the illustration.
Figure 7.1. Si569 (5x7 mm) PCB Land Pattern
Table 7.1. PCB Land Pattern Dimensions (mm)
Dimension
(mm)
Dimension
(mm)
C1
4.20
Y1
1.95
C2
6.05
X2
1.80
E
2.54
Y2
0.75
X1
1.55
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a
Fabrication Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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Si569 Data Sheet • PCB Land Pattern
7.2 PCB Land Pattern (3.2x5 mm)
The figure below illustrates the 3.2x5.0 mm PCB land pattern for the Si569. The table below lists the values for the dimensions shown
in the illustration.
Figure 7.2. Si569 (3.2x5 mm) PCB Land Pattern
Table 7.2. PCB Land Pattern Dimensions (mm)
Dimension
(mm)
Dimension
(mm)
C1
2.70
X2
0.90
E
1.27
Y1
1.60
E1
4.30
Y2
0.70
X1
0.74
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a
Fabrication Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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Si569 Data Sheet • PCB Land Pattern
7.3 PCB Land Pattern (2.5x3.2 mm)
The figure below illustrates the 2.5x3.2 mm PCB land pattern for the Si569. The table below lists the values for the dimensions shown
in the illustration.
Figure 7.3. Si569 (2.5x3.2 mm) PCB Land Pattern
Table 7.3. PCB Land Pattern Dimensions (mm)
34
Dimension
Description
Value (mm)
X1
Width - leads on long sides
0.7
Y1
Height - leads on long sides
0.7
X2
Width - single leads on short sides
0.5
Y2
Height - single leads on short sides
0.55
D1
Pitch in X directions of XL, Y1 leads
1.80
E1
Lead pitch X1, Y1 leads
1.10
E2
Lead pitch X2,Y2 leads
2.65
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Si569 Data Sheet • PCB Land Pattern
Dimension
Description
Value (mm)
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a
Fabrication Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 0.8:1 for the pads.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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Si569 Data Sheet • Top Markings
8. Top Markings
8.1 Top Marking (5x7 and 3.2x5 Packages)
The figure below illustrates the mark specification for the Si569 5x7 and 3.2x5 package sizes. The table below lists the line information.
Figure 8.1. Mark Specification
Table 8.1. Si569 Top Mark Description
Line
Position
Description
1
1–8
2
1
x = Frequency Range Supported as described in the 1. Ordering Guide
2–7
6-digit custom Frequency Code as described in the 1. Ordering Guide
"Si569", xxx = Ordering Option 1, Option 2, Option 3 (e.g. Si569AAA)
3
36
Trace Code
Position 1
Pin 1 orientation mark (dot)
Position 2
Product Revision (C)
Position 3–5
Tiny Trace Code (3 alphanumeric characters per assembly release instructions)
Position 6–7
Year (last two digits of the year), to be assigned by assembly site (ex: 2017 = 17)
Position 8–9
Calendar Work Week number (1–53), to be assigned by assembly site
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Si569 Data Sheet • Top Markings
8.2 Top Marking (2.5x3.2 Package)
The figure below illustrates the mark specification for the Si569 2.5x3.2 package sizes. The table below lists the line information.
SC CC CC
T TTT TT
Y Y WW
Figure 8.2. Mark Specification
Table 8.2. Si569 Top Mark Description
Line
Position
1
1–6
2
37
S = Si569, CCCCC = Custom Mark Code
Trace Code
1–6
3
Description
Position 1
Six-digit trace code per assembly release instructions
Pin 1 orientation mark (dot)
Position 2–3
Year (last two digits of the year), to be assigned by assembly site (exp: 2017 = 17)
Position 4–5
Calendar Work Week number (1–53), to be assigned by assembly site
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Si569 Data Sheet • Revision History
9. Revision History
Revision 206626A
May, 2023
• Updated Min and Nom package diagram dimensions specs in 6.3 Package Outline (2.5x3.2 mm).
Revision 1.3
June, 2021
• Updated Ordering Guide and Top Mark for Rev C silicon.
• Added HCSL-Fast (faster tR/tF) ordering option.
• Updated Table 2.1, Powerup VDD Ramp Rate.
• Updated Table 2.2, Settling Time for Large Frequency Change.
Revision 1.2
September, 2020
• Added 2.5x3.2 mm package option
• Updated Table 2.1, Powerup VDD Ramp Rate and LVDS Swing.
Revision 1.1
September, 2018
• Updated Electrical Specifications table to include high drive LVDS swing.
• Added section 5.8 Configuring High Drive LVDS Swing.
Revision 1.0
June, 2018
• Initial release.
38
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206626A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 30, 2023
38
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