DATA SHEET
RFX2401C: 2.4 GHz ZigBee®/ISM Front-End Module
Applications
ZigBee extended range devices
CTX
CRX
ZigBee smart power
Wireless sound and audio systems
Logic
Control
Home and industrial automation
Wireless sensor networks
PA
Custom 2.4 GHz radio systems
TXRX
ANT
Features
LNA
2.4 GHz ZigBee high-power single-chip, single-die RF
front-end IC
Single-ended 50 Ω input and output ports
204359-001
Figure 1. RFX2401C Block Diagram
Integrated PA with up to +22 dBm output power
Integrated LNA with 2.5 dB noise figure
Transmit/receive switch circuitry
Description
High transmit signal linearity meeting standards for OQPSK
modulation
The RFX2401C is a fully integrated front-end module that
incorporates all the RF functionality needed for IEEE
802.15.4/ZigBee, wireless sensor network, and any other wireless
systems in the 2.4 GHz ISM band. The RFX2401C architecture
integrates the PA, LNA, transmit and receive switching circuitry,
and the associated matching network, all in a single package.
Low voltage (1.2 V) CMOS control logic
ESD protection circuitry on all ports
DC decoupled RF ports
Full on-chip matching and decoupling circuitry
Market proven CMOS technology
Small QFN, 16-pin (3 x 3 x 0.55 mm) package with exposed
ground pad (MSL1, 260 C per JEDEC J-STD-020)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Typical high-power applications include home and industrial
automation, smart power, and RF4CE among others. Combining
superior performance, high sensitivity and efficiency, low noise,
small form factor, and low cost, the RFX2401C is the perfect
solution for applications requiring extended range and bandwidth.
RFX2401C has simple and low-voltage CMOS control logic, and a
wide operating supply voltage range.
The device is provided in a compact, 16-pin 3 x 3 mm Quad Flat
No-Lead (QFN) package. A functional block diagram is shown in
Figure 1. The pin configuration and package are shown in
Figure 2. Signal pin assignments and functional pin descriptions
are provided in Table 1.
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DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
VDD
16
N/C
15
VDD
14
DNC
13
N/C 1
12 N/C
GND 2
11 GND
17
GND
GND 3
10 ANT
TXRX 4
9 GND
5
6
TXEN
RXEN
7
N/C
8
GND
204359-002
Figure 2. RFX2401C Pinout
(Top View)
Table 1. RFX2401C Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
N/C
Not connected internally
9
GND
Ground
2
GND
Ground
10
ANT
Connect to 50 Ω antenna (DC shorted to GND)
3
GND
Ground
11
GND
Ground
4
TXRX
RF signal to/from the transceiver (DC shorted to GND)
12
N/C
Not connected internally
5
TXEN
CMOS input to control TX enable
13
DNC
Do not connect
6
RXEN
CMOS input to control RX enable
14
VDD
Alternate supply pin, internally connected to pin 16
7
N/C
Not connected internally
15
N/C
Not connected internally
8
GND
Ground
16
VDD
Voltage supply connection
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DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
Electrical and Mechanical Specifications
The absolute maximum ratings of the RFX2401C are provided in
Table 2. The recommended operating conditions are specified
in Table 3.
The electrical specifications are provided in Tables 4 and 5. The
state of the RFX2401C is determined by the logic provided in
Table 6.
Table 2. RFX2401C Absolute Maximum Ratings1
Parameter
Conditions
Minimum
Maximum
Units
0
4.0
V
DC VDD voltage supply
DC control pin voltage
Through 1 kΩ resistor
3.6
V
DC VDD current consumption
Through VDD pins when TX is “ON”
0
350
mA
1
μA
TX RF input power
All operating modes
+5
dBm
ANT RF input power
When RX is “ON”
+5
dBm
150
°C
DC control pin current consumption
Junction temperature
Storage ambient temperature
No RF and DC voltages applied
-50
+150
o
3250
V
C
Electrostatic discharge:
Human Body Model (HBM)
1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters
set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. All maximum RF input power ratings assume 50 Ω terminal
impedance.
ESD HANDLING: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device.
This device must be protected at all times from ESD when handling or transporting. Static charges may easily produce
potentials of several kilovolts on the human body or equipment, which can discharge without detection.
Industry-standard ESD handling precautions should be used at all times.
Table 3. RFX2401C Recommended Operating Conditions1
Parameter
Conditions
Min
Typ
Max
Units
3.3
3.6
V
DC VDD voltage supply
All VDD pins
2.0
Control voltage “high”
Through 1 kΩ resistor
1.2
VDD
V
0
0.3
V
-40
+125
Control voltage “low”
Operating ambient temperature
ja
Note 2
35
o
o
C
C/W
1 During production test, devices will be tested at 5 V.
2 For operation above +85 °C, use the ja as guidance for system design to assure the junction temperature will not exceed the maximum of +150 °C.
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DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
Table 4. RFX2401C Electrical Specifications1 (VDD = 3.3 V, All Unused Ports Terminated with 50 Ω, TA = 25 °C, Unless Otherwise Noted)
Parameter
Frequency range
Symbol
Test Condition
f
Min
Typ
2.4
Max
Units
2.525
GHz
Transmit Mode
Saturated output power
+22
Small-signal gain
21.5
25
dBm
26.5
dB
Second harmonic
POUT = +20 dBm, IEEE 802.15.4
OQPSK modulation signal
–10
dBm/MHz
Third harmonic
POUT = +20 dBm, IEEE 802.15.4
OQPSK modulation signal
–20
dBm/MHz
Input return loss
–10
dB
Output return loss
–6
dB
Input / output impedance single-ended
50
Ω
TX quiescent current
No RF applied
17
mA
TX high-power current
POUT = +20 dBm
90
mA
Load VSWR for stability
(POUT = +20 dBm)
All non-harmonically related spurs
less than –43 dBm/MHz
6:1
N/A
Load VSWR for ruggedness
(POUT = +20 dBm)
No damage
10:1
N/A
Receive Mode
Gain
12
dB
Noise figure
2.5
dB
Input return loss
–10
dB
Output return loss
–12
dB
Rf port impedance
50
Ω
Rx quiescent current
No RF applied
8
mA
Input p1db
At ANT pin
–8
dBm
1 Performance is guaranteed only under the conditions listed in this table.
Table 5. RFX2401C Standby Mode Technical Parameters
Parameter
Symbol
Test Condition
Min
Typ
DC shutdown current
Max
1
TXRX-ANT insertion loss (S21)
μA
Pin < -20 dBm
–50
–50
dB
From TXRX port
–1.5
dB
Transmit-receive switching time
800
nsec
Shutdown and “ON” State switching
time
800
nsec
ANT-TXRX insertion loss (S21)
Return loss (S11)
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Units
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dB
DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
Table 6. RFX2401C Control Logic1
Mode
TX active
TXEN
RXEN
1
x
RX active
0
1
Shutdown
0
0
1 “1” denotes high voltage state (> 1.2 V)
“0” denotes low voltage stage (< 0.3 V) at control pins
“X” denotes do not care: either “1” or “0” can be applied
Application Schematic Board Description
A suggested RFX2401C FEM application schematic diagram is
shown in Figure 3. A schematic of the Evaluation Board is shown
in Figure 4.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
Paths to ground should be made as short as possible.
If the transceiver TXRX port has DC present, use a capacitor to
block this voltage from reaching the RFX2401C.
The ground pad of the RFX2401C has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Because the circuit board acts as
the heat sink, it must shunt as much heat as possible from the
device.
Locate the bypass capacitors as close as possible to the
ground pad. Use two ground vias.
The VDD (pin 14) is an optional VDD pin, internally connected to
pin 16.
The N/C pins 1, 7, 12, and 15 may be left open or connected to
GND.
If the antenna circuits have DC present, use a capacitor to
block this voltage from reaching the RFX2401C.
NOTE: A poor connection between the ground pad and ground
increases junction temperature (TJ), which reduces the life
of the device..
Multiple vias to the grounding layer are required.Use thermal
vias to assure efficient heat dissipation.
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DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
4
3
2
1
J1
Harmonic Filtering
Performance is sensitive to PCB parasitics. Therefore,
custom PCB layout should emulate the reference PCB
layout attached to this design as closely as possible.
C2
220 pF
C1
1 uF
C3 is always required to filter the 5th harmonic. It
must be located as close as possible to ANT pin.
13
ANT
L1
2.4 nH
9
C3
0.3 pF
C4
1.5 pF
L2
2.4 nH
C5
1.5 pF
C6
1.5 pF
C7
1.5 pF
4
2
11
10
J3
SMA
1
8
N/C
GND
GND
RXEN
TXRX
12
5
14
15
N/C
VDD
DNC
GND
GND
5
All inductors and capacitors must be populated. Use ceramic multi-layer
inductors for effective filtering.
(Murata LPQ series, SEMCO, Johanson/ACX)
Depending on layout, all inductor and capacitor values may require minor
value tweaks for optimum impedance matching.
3
GND
7
4
N/C
U1
RFX2401C
2
4
1
3
N/C
TXEN
J2
SMA
3
5
2
PAD
6
1
VDD
16
Option 1: Discrete LC Filter
17
FL1
1
2
3
IN
GND4
OUT
GND2
GND3
2.45 GHz LP
6
5
4
Option 2: Ceramic Filter
FL1 represents the option to replace the discrete pi filters by a
ceramic low pass filter solution as follows:
Populate FL1. (ACX LF1608-B2R4KCBB or Johanson 2450LP14A100T)
Populate L2 with 0 Ohm resistor (=jumpers).
C3 is still required to filter the 5th harmonic.
Do Not Populate C4, C5, C6, and C7.
Do Not Populate L1.
1
3
4
2
R2
10 kΩ
R1
10 kΩ
GND1
204359-003
J4
Figure 3. RFX2401C Application Schematic
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DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
4
3
VDD
2
HDR4
1
J1
Harmonic Filtering
C2
220 pF
13
DNC1
ANT
GND3
4
J3
SMA
1
C3
DNI
C4
DNI
C5
DNI
C6
DNI
C7
DNI
8
TXEN
5
9
L2
0Ω
GND5
GND6
GND4
TXRX
L1
0Ω
11
10
2
GND7
RFX2401C
5
GND2
12
3
DNC2
14
15
GND9
VDD
GND8
RXEN
4
GND1
2
DNI
1
R1
10 kΩ
R2
10 kΩ
2
3
GND1
IN
GND4
OUT
GND2
GND3
6
5
4
2.45 GHz LP
1
3
5
7
4
1
3
C3 is always required to filter the 5th harmonic. It
must be located as close as possible to ANT pin.
J5
HEADER 4X2
2
4
6
8
J2
SMA
3
5
2
7
1
GND10
6
17
16
U1
Performance is sensitive to PCB parasitics. Therefore
custom PCB layout should emulate the reference PCB
layout attached to this design as closely as possible.
C1
1 uF
204359-004
VLOGIC
Figure 4. RFX2401C Evaluation Board Schematic
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DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
Package Dimensions
Package and Handling Information
The PCB layout footprint for the RFX2401C is shown in Figure 5.
Typical part markings are shown in Figure 6. Package
dimensions are shown in Figure 7, and tape and reel
dimensions are provided in Figure 8.
Instructions on the shipping container label regarding exposure
to moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The RFX2401C is rated to Moisture Sensitivity Level 1 (MSL1) at
260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
0.25 mm
0.5 mm
0.25 mm
0.65 mm
1.7 mm x
1.7 mm
3.5 mm
3.0 mm
204359-004
Figure 5. RFX2401C PCB Layout Footprint
(Top View)
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DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
Pin 1
Indicator
2401C
LLLL.L
UHYYWW
Skyworks
Part Number
Lot Code
Date Code
204359-006
Figure 6. Typical Part Markings
(Top View)
204359-007
Figure 7. RFX2401C Package Dimensions
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DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
4.00 ±0.10
2.00 ±0.05
Ø1.50 +0.10
–0.00
3.30 ±0.10
5.50 ±0.05
1.75 ±0.10
12.00 ±0.30
0.30 ±0.05
Pin 1
8.00 ±0.10
Ø1.50 Min
0.75 ±0.10
3.30 ±0.10
All measurements are in millimeters.
204359-008
Figure 8. RFX2401C Tape and Reel Dimensions
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DATA SHEET • RFX2401C: 2.4 GHz ZIGBEE/ISM FRONT-END MODULE
Ordering Information
Model Name
RFX2401C: 2.4 GHz ZigBee/ISM Front-End Module
Manufacturing Part Number
RFX2401C
Evaluation Board Part Number
RFX2401C-EK1
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