RM008

RM008 PA Module for Dual-band GSM900 and DCS1800 Applications The RM008 is a dual-band Power Amplifier Module (PAM) designed in a compact form factor for Class 4 GSM900 and Class 1 DCS1800 operation. The PAM consists of two Gallium Arsenide (GaAs) Heterojunction Bipolar Transistor (HBT) power amplifiers and internal components that match the RF input and output ports to 50 ohms, which reduces the number of external components for a dual-band design. Optimized for lithium-ion battery operation, both PAs share common power supply pins to distribute current. The RM008 dual PAM has extremely low standby current, which maximizes handset standby time. A block diagram of the RM008 is shown below. The Analog Power Control (APC) pins (GSM APC and DCS APC), control output power level. Table 4 of this data sheet shows the complete signal pin assignments and descriptions of the RM008 dual-band Power Amplifier Module. Distinguishing Features • High efficiency GSM 50% DCS 45% Input and output matching 50 ohms internal Small outline 9.1 mm x 11.61 mm Low profile 1.64 mm • • • Applications • Class 4 GSM900 and Class 1 DCS1800 dual-band cellular handsets Functional Block Diagram DCS IN HBT DCS OUT DCS APC GSM APC GSM IN HBT GSM OUT Data Sheet Skyworks Solutions, Inc. Proprietary © 1999–2002 Skyworks Solutions, Inc., All Rights Reserved. 100781D July 26, 2002 Electrical Characteristics RM008 PA Module for Dual-band GSM900 and DCS1800 Applications Electrical Characteristics The following tables list the electrical characteristics of the RM008 Power Amplifier. Table 1 depicts the absolute maximum ratings and Table 2 specifies the recommended operating conditions to achieve the performance specifications in Table 3. Table 1. Absolute Maximum Ratings Parameter Supply Voltage (VCC) Storage Temperature Minimum — –55 Maximum 7 +125 Units V °C Table 2. Recommended Operating Conditions Parameter Supply Voltage (VCC) Temperature Minimum 2.9 –30 Typical 3.3 — Maximum 4.6 +85 Units V °C Table 3. Electrical Specifications for Nominal Operating Conditions (1 of 2) Parameter Test Conditions Symbol Minimum Typical Maximum Units GSM Mode (f = 880–915 MHz and PIN = 8 to 13 dBm) Frequency Range Input Power Control Voltage Range Control Current Into VAPC Leakage Current Efficiency 2nd Harmonic Distortion 3rd–7th Harmonic Distortion Output Power VCC = 4.6 V VAPC = 0 V PINGSM = 10 dBm POUTGSM = 34 dBm POUTGSM = 34.5 dBm POUTGSM = 34.5 dBm PINGSM = 10 dBm PINGSM = 10 dBm VCC = 2.9 V TCASE = –30 °C to +85 °C Input VSWR All VGSMAPC — — — f1 PINGSM VAPC lGSMAPC ILEAKAGE ηGSM H2GSM H3–H7 POUTGSM POUTDCS 880 8 0.2 — — — — — 34.0 32.5 — 10 — 40 — 50 — — 34.5 33.0 915 13 2.5 70 25 — –5 –7 — — MHz dBm V mA µA % dBm dBm dBm dBm VSWR(IN) — 1.5:1 2:1 — 2 Skyworks Solutions, Inc. Proprietary 100781D July 26, 2002 RM008 PA Module for Dual-band GSM900 and DCS1800 Applications Table 3. Electrical Specifications for Nominal Operating Conditions (2 of 2) Parameter Isolation Stability Condition VSWR(load) (no spurious oscillation > –35 dBm) Load Mismatch VSWR(load) (no damage/degradation) Noise Floor Electrical Characteristics Test Conditions PINGSM = 10 dBm APC = 0.5 V — — PINGSM = 10 dBm BW = 100 kHz fO ±20 MHz offset POUTGSM = 34.5 dBm Symbol — — — — Minimum — — — — Typical — — — — Maximum –30 8:1 all angles 10:1 all angles –85 Units dBm — — dBm Full Power Control Voltage — — 2.0 — — DCS Mode (f = 1710–1785 MHz and PIN = 6 to 11 dBm) Frequency Range Input Power Control Voltage Range Control Current Into VAPC Leakage Current Efficiency 2nd Harmonic Distortion 3rd–7th Harmonic Distortion Output Power VCC = 4.6 V VAPC = 0 V PINDCS = 8 dBm POUTDCS = 32 dBm POUTDCS = 32.5 dBm POUTDCS = 32.5 dBm PINDCS = 8 dBm PINDCS = 8 dBm VCC = 2.9 V TCASE = –30 °C to +85 °C Input VSWR Isolation Stability Condition VSWR (load) no spurious oscillation > –35 dBm) Load Mismatch VSWR(load) (no damage/degradation) Noise Floor DCS1800 All PINDCS = 8 dBm APC = 0.5 V — — PINDCS = 8 dBm BW = 100 kHz fO ±20 MHz offset POUTDCS = 32.5 dBm VDCSAPC — — — f2 PINDCS VAPC lDCSAPC ILEAKAGE ηDCS H2DCS H3–H7 POUTDCS POUTDCS 1710 6 0.2 — — — — — 32.0 30.5 — 8.0 — 30 — 45 — — 32.5 31.0 1785 11 2.5 70 25 — –7 –7 — — MHz dBm V mA µA % dBm dBm dBm dBm VSWR(IN) — — — — — — — — — 1.5:1 — — — — 2:1 –35 8:1 all angles 10:1 all angles –77 — dBm — — dBm Full Power Control Voltage otherwise — — 2.0 — — NOTE(S): TCASE = 25 °C, RL = 50Ω, pulsed operation with pulse width = 577 µsec and duty cycle of 1:8, VCC = 3.3 V unless specified 100781D July 26, 2002 Skyworks Solutions, Inc. Proprietary 3 Electrical Characteristics RM008 PA Module for Dual-band GSM900 and DCS1800 Applications Figure 1. Typical RM008 PAM Application C 10 µ F TANTALUM DCS IN 2 HBT Vbat DCS OUT 12 10 pF B GSM APC from PAC GSM APC B B DCS APC from PAC DCS APC 14 B 16 GSM OUT GSM IN 4 HBT 33 pF 10 8 VCC2 100 pF A 10 nF A Vcc C 6 VCC1 9 GND A B C Place caps at closest proximity to PA module with the capacitor ground directly connected to the PAM grounds. Optional depending on PAC circuit. Common connect Vbat to all Vcc pins. 101585_003 4 Skyworks Solutions, Inc. Proprietary 100781D July 26, 2002 RM008 PA Module for Dual-band GSM900 and DCS1800 Applications Package Dimensions and Pin Descriptions Package Dimensions and Pin Descriptions Figure 2 provides the package dimensions for the 16-pin RM008 leadless MCM. Figure 3 shows the device pin configuration and Table 4 lists the pins and signal descriptions. Figure 2. RM008 Package Dimensions—16-pin PAM (All Views) R0.381 Typ PIN 1 2.286 ± 0.051 0.762 Typ R0.860 Typ 0.127 Ref 1.905 ± 0.051 0.737 ± 0.051 9.10 +0.20, -0.08 TOP VIEW SIDE VIEW 1.905 ± 0.051 3.899 ± 0.051 BOTTOM VIEW 11.60 +0.20, -0.08 1.02 Typ 1.64 max. FRONT VIEW NOTE(S): 1. All contact points are gold plated, lead free-surfaces. 2. All dimensions are in millimeters. 100781_004 100781D July 26, 2002 Skyworks Solutions, Inc. Proprietary 2.286 ± 0.051 5 Package Dimensions and Pin Descriptions RM008 PA Module for Dual-band GSM900 and DCS1800 Applications Figure 3. RM008 Pin Configuration–16-Pin Leadless PAM (Top View) DCS APC GND GND GSM APC 1 16 15 14 13 GND DCS IN 2 3 12 DCS OUT GND 11 GND GSM IN 4 10 GSM OUT GND 5 6 VCC1 7 GND 8 VCC2 9 GND 100781_002 Table 4. RM008 Pin and Signal Descriptions PIN 1 2 3 4 5 6 7 8 NAME GND DCS IN GND GSM IN GND VCC2 GND VCC2 Ground DESCRIPTION PIN 9 10 11 12 13 14 15 16 NAME GND GSM OUT GND DCS OUT GND GSM APC GND DCS APC DESCRIPTION Ground GSM RF output (DC coupled) Ground DCS RF output (DC coupled) Ground GSM analog power control Ground DCS analog power control RF input to DCS PA Ground RF input to GSM PA Ground Power supply for PA driver stages Ground Power supply for PA output stages 6 Skyworks Solutions, Inc. Proprietary 100781D July 26, 2002 RM008 PA Module for Dual-band GSM900 and DCS1800 Applications Package and Handling Information Package and Handling Information Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The RM008 is capable of withstanding an MSL 3/240 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second; maximum temperature should not exceed 240 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 240 °C for more than 10 seconds. For details on both attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J–STD–020A. Figure 4. Typical Case Markings SKYWORKS Mark Pin 1 Identifier RM008-NN NXXXXX.XX YYWW MEX Manufacturing Part Number–Revision Number Lot Number YY = Manufacture Year WW = Week Package Sealed MEX = Country Code 100781_006 100781D July 26, 2002 Skyworks Solutions, Inc. Proprietary 7 Package and Handling Information RM008 PA Module for Dual-band GSM900 and DCS1800 Applications Production quantities of this product are shipped in the standard tape and reel format illustrated in Figure 5. Figure 5. RM008 Tape and Reel – 9.1 mm x 11.6 mm 12.00 ± 0.10 4.00 ± 0.10 1.50 ± 0.10 2.00 ± 0.10 1.75 ± 0.10 11.50 ± 0.10 PIN 1 INDICATOR 1.50 ± 0.25 8˚ MAX. 0.330 ± 0.013 5˚ MAX. 8˚ 45˚ MAX 9.40 ± 0.10 2.02 ± 0.10 45˚ MAX 11.90 ± 0.10 A0 K0 B0 3M Carrier Tape NOTE(S): 1. Carrier tape material: Black conductive polycarbonate 2. Carrier tape part number: US 042 281 3. Cover tape material: Conductive Pressure Sensitive Adhesive (PSA) 4. Cover tape width: 21.3 mm 5. Number of parts per 330 mm (diameter) x 24 mm reel: 2000 6. All diagram dimensions in millimeters 100781_005 8 Skyworks Solutions, Inc. Proprietary 100781D July 26, 2002 24.00 -0.10 +0.30 RM008 PA Module for Dual-band GSM900 and DCS1800 Applications Electrostatic Discharge Sensitivity Electrostatic Discharge Sensitivity The RM008 is a Class I device. Figure 6 lists the Electrostatic Discharge (ESD) immunity level for each pin of the RM008 product. The numbers in Figure 6 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. Since 2000 volts represents the maximum measurement limit of the test equipment used, pins marked > 2000 V pass 2000V ESD stress. Figure 6. ESD Sensitivity Ares (Top View) > +2000 V < –2000 V DCS APC GND > +2000 V < –2000 V GND GSM APC 1 16 15 14 13 GND > +2000 V DCS IN < –2000 V GND 2 3 12 > +2000 V DCS OUT < –2000 V RM008 11 GND +600 V GSM IN –1650 V 4 10 > +2000 V GSM OUT < –2000 V GND 5 6 7 8 VCC2 > +2000 V < –2000 V 9 GND VCC1 GND > +2000 V < –2000 V 100781_007 Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards which fail devices only after “the pin fails the electrical specification limits” or “the pin becomes completely non-functional”. Skyworks employs most stringent criteria, fails devices as soon as the pin begins to show any degradation on a curve tracer. To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD handling precautions listed in Table 5. Table 5. Precautions for GaAs ICs with ESD Thresholds Greater Than 200 V But Less Than 2000 V Personnel Grounding Wrist Straps Conductive Smocks, Gloves and Finger Cots Antistatic ID Badges Protective Workstation Dissipative Table Tops Protective Test Equipment (Properly Grounded) Grounded Tip Soldering Irons Conductive Solder Suckers Static Sensors Facility Relative Humidity Control and Air Ionizers Dissipative Floors (less than 109 Ω to GND) Protective Packaging & Transportation Bags and Pouches (Faraday Shield) Protective Tote Boxes (Conductive Static Shielding) Protective Trays Grounded Carts Protective Work Order Holders 100781D July 26, 2002 Skyworks Solutions, Inc. Proprietary 9 Electrostatic Discharge Sensitivity RM008 PA Module for Dual-band GSM900 and DCS1800 Applications 10 Skyworks Solutions, Inc. Proprietary 100781D July 26, 2002 Ordering Information Model Number RM008 Manufacturing Part Number RM008–23 Product Revision 23 Package Operating Temperature –30 °C to +85 °C Revision History Revision A B C D Level Date October 1999 October 2000 May 2001 July 26, 2002 Initial Release Description Revise: Table 4; Figure 4 Revise: Converted to standard format; Figure 1 Add: ESD data; Packaging and Handling Information Revise: Part Number to RM008–23; ESD data, Package and Handling Add: New Figure 5 References Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 JEDEC Standard J–STD–020A. © 1999–2002, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. Skyworks™ products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling Skyworks™ products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks™, the Skyworks symbol, and "Breakthrough Simplicity"™. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Thirdparty brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference. General Information: Skyworks Solutions, Inc. 4311 Jamboree Rd. Newport Beach, CA. 92660-3007 www.skyworksinc.com