SI3018-KT

Si3056 Si 3 0 1 8 / 1 9 /10 GLOBAL SERIAL INTERFACE DIRECT ACCESS ARRANGEMENT Features Complete DAA includes the following: Programmable line interface Pulse dialing support Overload detection 3.3 V power supply Direct interface to DSPs Serial interface control for up to eight devices >5000 V isolation Proprietary isolation technology Parallel handset detection +3.2 dBm TX/RX level mode Programmable digital hybrid for nearend echo reduction Low-profile SOIC package Lead-free/RoHS-compliant packages available AC termination DC termination Ring detect threshold Ringer impedance 80 dB dynamic range TX/RX paths Integrated codec and 2- to 4-wire hybrid Integrated ring detector Type I and II caller ID support Line voltage monitor Loop current monitor Polarity reversal detection Programmable digital gain Clock generation Applications V.92 modems Voice mail systems Multi-function printers Set-top boxes Fax machines Internet appliances Personal digital assistants Description The Si3056 is an integrated direct access arrangement (DAA) with a programmable line interface to meet global telephone line requirements. Available in two 16-pin small outline packages, it eliminates the need for an analog front end (AFE), isolation transformer, relays, opto-isolators, and a 2- to 4-wire hybrid. The Si3056 dramatically reduces the number of discrete components and cost required to achieve compliance with global regulatory requirements. The Si3056 interfaces directly to standard modem DSPs. Functional Block Diagram Si3056 MCLK SCLK FSYNC SDI SDO FC/RGDT Si3018/19/10 RX Digital Interface Hybrid and dc Termination Isolation Interface RGDT/FSD/M1 OFHK M0 RESET AOUT/INT Rev. 1.03 2/05 Control Interface Isolation Interface Ring Detect Off-Hook IB SC DCT VREG VREG2 DCT2 DCT3 Ordering Information See page 88. Pin Assignments Si3056 MCLK 1 16 OFHK FSYNC 2 15 SCLK 3 4 14 13 RGDT/FSD/M1 M0 12 SDI 5 6 11 AOUT/INT FC/RGDT RESET 7 8 10 9 C1A C2A VD SDO VA GND Si3018/19/10 QE 1 16 DCT2 DCT RX IB 2 15 IGND 3 4 14 13 DCT3 C1B C2B 5 6 12 QB QE2 11 SC VREG 7 8 10 9 VREG2 RNG2 RNG1 US Patent # 5,870,046 US Patent # 6,061,009 Other Patents Pending RNG1 RNG2 QB QE QE2 Copyright © 2005 by Silicon Laboratories Si3056 Si3056 Si3018/19/10 2 Rev. 1.03 Si3056 Si3018/19/10 TA B L E O F C O N T E N TS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4. AOUT PWM Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.1. Upgrading from the Si3034/35/44 to Si3056 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.2. Line-Side Device Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.3. Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.4. Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 5.5. Isolation Barrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.6. Transmit/Receive Full Scale Level (Si3019 Line-Side Only) . . . . . . . . . . . . . . . . . . . 25 5.7. Parallel Handset Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.8. Line Voltage/Loop Current Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.9. Off-Hook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.10. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.11. DC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.12. AC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5.13. Transhybrid Balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.14. Ring Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.15. Ring Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 5.16. Ringer Impedance and Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.17. Pulse Dialing and Spark Quenching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.18. Billing Tone Protection and Receive Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.19. Billing Tone Filter (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.20. On-Hook Line Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 5.21. Caller ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 5.22. Overload Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 5.23. Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 5.24. Filter Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 5.25. Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 5.26. Digital Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 5.27. Multiple Device Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 5.28. Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.29. Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 5.30. In-Circuit Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.31. Exception Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 5.32. Revision Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 6. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Appendix—UL1950 3rd Edition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 7. Pin Descriptions: Si3056 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84 8. Pin Descriptions: Si3018/19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Rev. 1.03 3 Si3056 Si3018/19/10 9. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 10. Evaluation Board Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 11. Product Selection and Identification Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 12. Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 13. Package Outline: 16-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92 Silicon Laboratories Si3056 Support Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96 4 Rev. 1.03 Si3056 Si3018/19/10 1. Electrical Specifications Table 1. Recommended Operating Conditions Parameter1 Symbol Test Condition Min2 Typ Max2 Unit Ambient Temperature TA K-Grade 0 25 70 °C Si3056 Supply Voltage, Digital3 VD 3.0 3.3 3.6 V Notes: 1. The Si3056 specifications are guaranteed when the typical application circuit (including component tolerance) and the Si3056 and any Si3018 or Si3019 are used. See Figure 17 on page 18 for typical application schematic. 2. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise stated. 3. 3.3 V applies to both the digital and serial interface and the digital signals RGDT/FSD, OFHK, RESET, M0, and M. Rev. 1.03 5 Si3056 Si3018/19/10 Table 2. Loop Characteristics (VD = 3.0 to 3.6 V, TA = 0 to 70 °C for K-Grade, see Figure 1) Parameter Symbol Test Condition Min Typ Max Unit DC Termination Voltage VTR IL = 20 mA, MINI = 11, ILIM = 0, DCV = 00, DCR = 0 — — 6.0 V DC Termination Voltage VTR IL = 120 mA, MINI = 11, ILIM = 0, DCV = 00, DCR = 0 9 — — V DC Termination Voltage VTR IL = 20 mA, MINI = 00, ILIM = 0, DCV = 11, DCR = 0 — — 7.5 V DC Termination Voltage VTR IL = 120 mA, MINI = 00, ILIM = 0, DCV = 11, DCR = 0 9 — — V DC Termination Voltage VTR IL = 20 mA, MINI = 00, ILIM = 1, DCV = 11, DCR = 0 — — 7.5 V DC Termination Voltage VTR IL = 60 mA, MINI = 00, ILIM = 1, DCV = 11, DCR = 0 40 — — V DC Termination Voltage VTR IL = 50 mA, MINI = 00, ILIM = 1, DCV = 11, DCR = 0 — — 40 V On Hook Leakage Current ILK VTR = –48 V — — 5 µA Operating Loop Current ILP MINI = 00, ILIM = 0 10 — 120 mA Operating Loop Current ILP MINI = 00, ILIM = 1 10 — 60 mA DC current flowing through ring detection circuitry — 1.5 3 µA DC Ring Current Ring Detect Voltage* VRD RT = 0 13.5 15 16.5 Vrms Ring Detect Voltage* VRD RT = 1 19.35 21.5 23.65 Vrms FR 13 — 68 Hz REN — — 0.2 Ring Frequency Ringer Equivalence Number *Note: The ring signal is guaranteed to not be detected below the minimum. The ring signal is guaranteed to be detected above the maximum. TIP + 600 Ω Si3018 IL VTR 10 µF RING – Figure 1. Test Circuit for Loop Characteristics 6 Rev. 1.03 Si3056 Si3018/19/10 Table 3. DC Characteristics, VD = 3.3 V (VD = 3.0 to 3.6 V, TA = 0 to 70 °C) Parameter Symbol Test Condition Min Typ Max Unit High Level Input Voltage VIH 2.4 — — V Low Level Input Voltage VIL — — 0.8 V High Level Output Voltage VOH IO = –2 mA 2.4 — — V Low Level Output Voltage VOL IO = 2 mA — — 0.35 V –10 — 10 µA Input Leakage Current IL Power Supply Current, Digital1 ID VD pin — 15 — mA ID PDN = 1, PDL = 0 — 9 — mA ID PDN = 1, PDL = 1 — 1 — mA Total Supply Current, Sleep Mode1 Total Supply Current, Deep Sleep 1,2 Notes: 1. All inputs at 0.4 or VD – 0.4 (CMOS levels). All inputs are held static except clock and all outputs unloaded (Static IOUT = 0 mA). 2. RGDT is not functional in this state. Rev. 1.03 7 Si3056 Si3018/19/10 Table 4. AC Characteristics (VD = 3.0 to 3.6 V, TA = 0 to 70 °C for K-Grade; see Figure 17 on page 18) Parameter Symbol Test Condition Min Typ Max Unit Fs Fs = FPLL2/5120 7.2 — 16 kHz FPLL1 FPLL1 = (FMCLK x M)/N — 98.304 — MHz Transmit Frequency Response Low –3 dBFS Corner — 0 — Hz Receive Frequency Response Low –3 dBFS Corner, FILT = 0 — 5 — Hz Receive Frequency Response Low –3 dBFS Corner, FILT = 111 — 200 — Hz FULL = 0 (0 dBm) — 1.1 — VPEAK FULL = 111(3.2 dBm) — 1.58 — VPEAK FULL2 = 1 (6.0 dBm) — 2.16 — VPEAK Sample Rate1 PLL Output Clock Frequency1 Transmit Full Scale Level2,3 Receive Full Scale Level2,4 VFS VFS FULL = 0 (0 dBm) 1.1 VPEAK 11 FULL = 1 (3.2 dBm) — 1.58 — VPEAK FULL2 = 1 (6.0 dBm) — 2.16 — VPEAK 5,6,7 DR ILIM = 0, DCV = 11, DCR = 0, IL = 100 mA, MINI = 00 — 80 — dB Dynamic Range5,6,7 DR ILIM = 0, DCV = 00, DCR = 0, IL = 20 mA, MINI = 11 — 80 — dB Dynamic Range5,6,7 DR ILIM = 1, DCV = 11, DCR = 0, IL = 50 mA, MINI = 00 — 80 — dB Transmit Total Harmonic Distortion8,9 THD ILIM = 0, DCV = 11, DCR = 0, IL = 100 mA, MINI = 00 — –72 — dB Transmit Total Harmonic Distortion8,9 THD ILIM = 0, DCV = 00, DCR = 0, IL = 20 mA, MINI = 11 — –78 — dB Dynamic Range Notes: 1. See Figure 26 on page 37. 2. Measured at TIP and RING with 600 Ω termination at 1 kHz, as shown in Figure 1. 3. With FULL = 1, the transmit and receive full scale level of +3.2 dBm can be achieved with a 600 Ω ac termination, while the transmit and receive level in dBm varies with reference impedance, the DAA will transmit and receive 1 dBV into all reference impedances in “FULL” mode. With FULL2 = 1, the transmit and receive full scale level of +6.0 dBm can be achieved with a 600 Ω ac termination. In “FULL2” mode, the DAA will transmit and receive +1.5 dBV into all reference impedances. 4. Receive full scale level produces –0.9 dBFS at SDO. 5. DR = 20 x log (RMS VFS/RMS VIN).+ 20 x log (RMS VIN/RMS noise). The RMS noise measurement excludes harmonics. VFS is the 0 dBm full-scale level. 6. Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths. VIN = 1 kHz, –3 dBFS, Fs = 10300 Hz. 7. When using the Si3010 line-side, the typical DR values will be approximately 10 dB lower. 8. THD = 20 x log (RMS distortion/RMS signal). VIN = 1 kHz, –3 dBFS, Fs = 10300 Hz. 9. When using the Si3010 line-side, the typical THD values will be approximately 10 dB higher. 10. DRCID = 20 x log (RMS VCID/RMS VIN) + 20 x log(RMS VIN/RMS noise). VCID is the 6 V full-scale level for the typical application circuit in Figure 17. With the enhanced CID circuit, the VCID full-scale level is 1.5 V peak, and DRCID increases to 62 dB. 11. Available on the Si3019 line-side device only. 8 Rev. 1.03 Si3056 Si3018/19/10 Table 4. AC Characteristics (Continued) (VD = 3.0 to 3.6 V, TA = 0 to 70 °C for K-Grade; see Figure 17 on page 18) Parameter Symbol Test Condition Min Typ Max Unit Receive Total Harmonic Distortion8,9 THD ILIM = 0, DCV = 00, DCR = 0, IL = 20 mA, MINI = 11 — –78 — dB Receive Total Harmonic Distortion8,9 THD ILIM = 1, DCV = 11, DCR = 0, IL = 50 mA, MINI = 00 — –78 — dB DRCID VIN = 1 kHz, –13 dBFS — 50 — dB — 6 — VPEAK AOUT Low Level Current — — 10 mA AOUT High Level Current — — 10 mA Dynamic Range (caller ID mode)10,7 Caller ID Full Scale Level10 VCID Notes: 1. See Figure 26 on page 37. 2. Measured at TIP and RING with 600 Ω termination at 1 kHz, as shown in Figure 1. 3. With FULL = 1, the transmit and receive full scale level of +3.2 dBm can be achieved with a 600 Ω ac termination, while the transmit and receive level in dBm varies with reference impedance, the DAA will transmit and receive 1 dBV into all reference impedances in “FULL” mode. With FULL2 = 1, the transmit and receive full scale level of +6.0 dBm can be achieved with a 600 Ω ac termination. In “FULL2” mode, the DAA will transmit and receive +1.5 dBV into all reference impedances. 4. Receive full scale level produces –0.9 dBFS at SDO. 5. DR = 20 x log (RMS VFS/RMS VIN).+ 20 x log (RMS VIN/RMS noise). The RMS noise measurement excludes harmonics. VFS is the 0 dBm full-scale level. 6. Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths. VIN = 1 kHz, –3 dBFS, Fs = 10300 Hz. 7. When using the Si3010 line-side, the typical DR values will be approximately 10 dB lower. 8. THD = 20 x log (RMS distortion/RMS signal). VIN = 1 kHz, –3 dBFS, Fs = 10300 Hz. 9. When using the Si3010 line-side, the typical THD values will be approximately 10 dB higher. 10. DRCID = 20 x log (RMS VCID/RMS VIN) + 20 x log(RMS VIN/RMS noise). VCID is the 6 V full-scale level for the typical application circuit in Figure 17. With the enhanced CID circuit, the VCID full-scale level is 1.5 V peak, and DRCID increases to 62 dB. 11. Available on the Si3019 line-side device only. Rev. 1.03 9 Si3056 Si3018/19/10 Table 5. Absolute Maximum Ratings Parameter Symbol Value Unit DC Supply Voltage VD –0.5 to 3.6 V Input Current, Si3056 Digital Input Pins IIN ±10 mA VIND –0.3 to (VD + 0.3) V TA –40 to 100 °C TSTG –65 to 150 °C Digital Input Voltage Operating Temperature Range Storage Temperature Range Note: Permanent device damage can occur if the above absolute maximum ratings are exceeded. Restrict functional operation to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods might affect device reliability. Table 6. Switching Characteristics—General Inputs (VD = 3.0 to 3.6 V, TA = 70 °C for K-Grade, CL = 20 pF) Symbol Min Typ Max Unit Cycle Time, MCLK tmc 16.67 — 1000 ns MCLK Duty Cycle tdty 40 50 60 % MCLK Jitter Tolerance tjitter — — ±2 ns Rise Time, MCLK tr — — 5 ns Fall Time, MCLK tf — — 5 ns tmr 10 — — cycles trl 250 — — ns tmxr 20 — — ns Parameter1 MCLK Before RESET ↑ RESET Pulse Width2 M0, M Before RESET↑3 Notes: 1. All timing (except Rise and Fall time) is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V. Rise and fall times are referenced to the 20% and 80% levels of the waveform. 2. The minimum RESET pulse width is the greater of 250 ns or 10 MCLK cycle times. 3. M0 and M are typically connected to VD or GND and should not be changed during normal operation. tm c tr M CLK V IH V IL tm r RESET t rl M 0, M1 t m xr Figure 2. General Inputs Timing Diagram 10 tf Rev. 1.03 Si3056 Si3018/19/10 Table 7. Switching Characteristics—Serial Interface (Master Mode, DCE = 0) (VD = 3.0 to 3.6 V, TA = 70 °C for K-Grade, CL = 20 pF) Parameter Symbol Min Typ Max Unit Cycle time, SCLK tc 244 1/256 Fs — ns SCLK Duty Cycle tdty — 50 — % Delay Time, SCLK↑ to FSYNC↓ td1 — — 20 ns Delay Time, SCLK↑ to SDO Valid td2 — — 20 ns Delay Time, SCLK↑ to FSYNC↑ td3 — — 20 ns Setup Time, SDI Before SCLK ↓ tsu 25 — — ns Hold Time, SDI After SCLK ↓ th 20 — — ns Setup Time, FC↑ Before SCLK↑ tsfc 40 — — ns Hold time, FC↑ After SCLK↑ thfc 40 — — ns Note: All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V. SCLK tc VOH VOL td1 td3 FSYNC (mode 0) FSYNC (mode 1) 16-Bit SDO td3 td2 D15 D14 tsu 16-Bit SDI D15 D1 D0 D0 D1 D0 th D14 tsfc thfc FC Figure 3. Serial Interface Timing Diagram (DCE = 0) Rev. 1.03 11 Si3056 Si3018/19/10 Table 8. Switching Characteristics—Serial Interface (Master Mode, DCE = 1, FSD = 0) (VA = Charge Pump, VD = 3.0 to 3.6 V, TA = 0 to 70 °C for K-Grade, CL = 20 pF) Symbol Min Typ Max Unit Cycle Time, SCLK tc 244 1/256 Fs — ns SCLK Duty Cycle tdty — 50 — % Delay Time, SCLK↑ to FSYNC↑ td1 — — 20 ns Delay Time, SCLK↑ to FSYNC↓ td2 — — 20 ns Delay Time, SCLK↑ to SDO valid td3 — — 20 ns Delay Time, SCLK↑ to SDO Hi-Z td4 — — 20 ns Delay Time, SCLK↑ to FSD↓ td5 — — 20 ns Delay Time, SCLK↑ to FSD↑ td6 — — 20 ns Setup Time, SDO Before SCLK↓ tsu 25 — — ns Hold Time, SDO After SCLK↓ th 20 — — ns Parameter1,2 Notes: 1. All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V. 2. See "5.27.Multiple Device Support" on page 38 for functional details. 32 SCLKs 16 SCLKs tc 16 SCLKs SCLK td1 td2 td2 FSYNC (mode 1) td2 td6 td2 FSYNC (mode 0) td3 SDO (master) tsu D15 th D14 td4 D13 D0 td3 SDO (slave 1) D15 td5 FSYNC (Mode 0) td5 FSYNC (Mode 1) tsu SDI D15 th D14 D13 D0 Figure 4. Serial Interface Timing Diagram (DCE = 1, FSD = 0) 12 Rev. 1.03 Si3056 Si3018/19/10 Table 9. Switching Characteristics—Serial Interface (Master Mode, DCE = 1, FSD = 1) (VD = 3.0 to 3.6 V, TA = 70 °C for K-Grade, CL = 20 pF) Symbol Min Typ Max Unit Cycle Time, SCLK tc 244 1/256 Fs — ns SCLK Duty Cycle tdty — 50 — % Delay Time, SCLK↑ to FSYNC↑ td1 — — 20 ns Delay Time, SCLK↑ to FSYNC↓ td2 — — 20 ns Delay Time, SCLK↑ to SDO Valid td3 — — 20 ns Delay Time, SCLK↑ to SDO Hi-Z td4 — — 20 ns Delay Time, SCLK↑ to FSD↓ td5 — — 20 ns Setup Time, SDO Before SCLK↓ tsu 25 — — ns Hold Time, SDO After SCLK↓ th 20 — — ns Parameter1, 2 Notes: 1. All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V. 2. See "5.27.Multiple Device Support" on page 38 for functional details. tc SCLK td1 td2 FSYNC (mode 1) SDO (master) td3 tsu th D15 D14 td4 D13 D0 td3 SDO (slave 1) D15 td5 FSD tsu SDI D15 th D14 D1 D0 Figure 5. Serial Interface Timing Diagram (DCE = 1, FSD = 1) Rev. 1.03 13 Si3056 Si3018/19/10 Table 10. Switching Characteristics—Serial Interface (Slave Mode, DCE = 1, FSD = 1) (VA = Charge Pump, VD = 3.0 to 3.6 V, TA = 0 to 70 °C for K-Grade, CL = 20 pF) Symbol Min Typ Max Unit tc 244 1/256 Fs — ns Setup Time, FSYNC↑ before MCLK↓* tsu1 — — 20 ns Delay Time, FSYNC↑ after MCLK↓* td1 — — 20 ns Setup Time, SDI before MCLK↓ tsu3 — — 20 ns Hold Time, SDI After MCLK↓ th2 — — 20 ns Delay Time, MCLK↑ to SDO td3 — — 20 ns Delay Time, MCLK↑ to FSYNC↑ td1 — — 20 ns Delay Time, MCLK↑ to FSYNC↓ td2 — — 20 ns Parameter Cycle Time, MCLK *Note: Tsu1 and Th1 are listed for applications where the controller drives the MCLK and FSYNC instead of a master DAA. tC MCLK td1 tSU1 th1 td1 FSYNC (mode 1) FSYNC (mode 0) td2 tsu3 th2 SDI D15 D14 D0 D15 D14 D0 td3 SDO Figure 6. Serial Interface Timing Diagram (Slave Mode, DCE = 1, FSD = 1) 14 Rev. 1.03 Si3056 Si3018/19/10 Table 11. Digital FIR Filter Characteristics—Transmit and Receive (VD = 3.0 to 3.6 V, Sample Rate = 8 kHz, TA = 70 °C for K-Grade) Parameter Symbol Min Typ Max Unit Passband (0.1 dB) F(0.1 dB) 0 — 3.3 kHz F(3 dB) 0 — 3.6 kHz –0.1 — 0.1 dB — 4.4 — kHz –74 — — dB — 12/Fs — s Passband (3 dB) Passband Ripple Peak-to-Peak Stopband Stopband Attenuation Group Delay tgd Note: Typical FIR filter characteristics for Fs = 8000 Hz are shown in Figures 7, 8, 9, and 10. Table 12. Digital IIR Filter Characteristics—Transmit and Receive (VD = 3.0 to 3.6 V, Sample Rate = 8 kHz, TA = 70 °C for K-Grade) Parameter Passband (3 dB) Symbol Min Typ Max Unit F(3 dB) 0 — 3.6 kHz –0.2 — 0.2 dB — 4.4 — kHz –40 — — dB — 1.6/Fs — s Passband Ripple Peak-to-Peak Stopband Stopband Attenuation Group Delay tgd Note: Typical IIR filter characteristics for Fs = 8000 Hz are shown in Figures 11, 12, 13, and 14. Figures 15 and 16 show group delay versus input frequency. Rev. 1.03 15 Si3056 Si3018/19/10 Figure 7. FIR Receive Filter Response Figure 9. FIR Transmit Filter Response Figure 8. FIR Receive Filter Passband Ripple Figure 10. FIR Transmit Filter Passband Ripple For Figures 7–10, all filter plots apply to a sample rate of Fs = 8 kHz. 16 Rev. 1.03 Si3056 Si3018/19/10 Figure 11. IIR Receive Filter Response Figure 14. IIR Transmit Filter Passband Ripple Figure 12. IIR Receive Filter Passband Ripple Figure 15. IIR Receive Group Delay Figure 13. IIR Transmit Filter Response Figure 16. IIR Transmit Group Delay Rev. 1.03 17 18 AOUT SDO SDI FC RESETb MCLK FSYNCb SCLK M0 RGDTb OFHKb C50 Decoupling cap for U1 VD VD R53 VD 1 2 3 4 5 6 7 8 R51 U1 MCLK FSYNC SCLK VD SDO SDI FC/RGDT RESET R52 Si3056 C51 Rev. 1.03 R13 R12 C2 C1 R9 C5 R1 1 2 3 4 5 6 7 8 U2 Si3018/19 QE DCT2 DCT IGND RX DCT3 IB QB C1B QE2 C2B SC VREG VREG2 RNG1 RNG2 R33 R8 C6 R2 R31 R7 Optional CID Enhancement 16 15 14 13 12 11 10 9 R3 R30 C30 C31 R32 Q5 R11 Q4 R4 D1 D2 C3 C7 R5 Z1 Q1 Figure 17. Typical Application Circuit for the Si3056 and Si3018/19/10 (Refer to AN67 for recommended layout guidelines) Decoupling cap for U1 VA OFHK RGDT/FSD/M1 M0 VA GND AOUT/INT C1A C2A 16 15 14 13 12 11 10 9 C4 + R10 No Ground Plane In DAA Section FB1 FB2 Q2 Q3 R6 C10 C8 C9 R15 R16 RV1 TIP RING Si3056 Si3018/19/10 2. Typical Application Schematic Si3056 Si3018/19/10 3. Bill of Materials Component(s) C1, C2 1 C3 C4 C5, C6, C50, C51 C7 C8, C9 C10 3 C30, C31 2 D1, D2 FB1, FB2 Q1, Q3 Q2 Q4, Q5 RV1 R1 R2 R3 R4 R5, R6 3 R7, R8 R9 R10 R11 R12, R13 4 R15, R16 3 R30, R32 3 R31, R33 R51, R52 U1 U2 Z1 Value 33 pF, Y2, X7R, ±20% 10 nF, 250 V, X7R, ±10% 1.0 uF, 50 V, Elec/Tant, ±20% 0.1 uF, 16V, X7R, ±20% 2.7 nF, 50V, X7R, 20% 680 pF, Y2, X7R, ±10% 0.01 uF, 16 V, X7R, ±20% Not installed, 120 pF, 250V, X7R, ±10% Dual Diode, 225 mA, 300 V, CMPD2004S Ferrite Bead, BLM18AG601SN1B NPN, 300 V, MMBTA42 PNP, 300 V, MMBTA92 NPN, 60 V, 330 mW, MMBT2484 Sidactor, 275 V, 100 A 1.07 kohm, 1/2 W, 1% 150 ohm, 1/16 W, 5% 3.65 kohm, 1/2 W, 1% 2.49 kohm, 1/2 W, 1% 100 kohm, 1/16 W, 5% 20 Mohm, 1/16 W, 5% 1 Mohm, 1/16 W, 1% 536 ohm, 1/4 W, 1% 73.2 ohm, 1/2 W, 1% 56.2 ohm, 1/16 W, 1% 0 ohm, 1/16 W Not installed, 15 Mohm,, 1/8 W, 5% Not installed, 5.1 Mohm,, 1/8 W, 5% 4.7 kohm,, 1/10 W, 5% Si3056 Si3018/19/10 Zener Diode, 43 V, 1/2 W, ZMM43 Supplier(s) Panasonic, Murata, Vishay Venkel, SMEC Panasonic Venkel, SMEC Venkel, SMEC Panasonic, Murata, Vishay Venkel, SMEC Venkel, SMEC Central Semiconductor Murata OnSemi, Fairchild OnSemi, Fairchild OnSemi, Fairchild Teccor, Protek, ST Micro Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Venkel, SMEC, Panasonic Silicon Labs Silicon Labs General Semiconductor 1. Value for C3 above is recommended for use with the Si3018. In voice appliations, a C3 value of 3.9 nF (250 V, X7R, 20%) is recommended to improve return loss performance 2. Several diode bridge configurations are acceptable, parts such as a single DF-04S or four 1N4004 diodes may be used (suppliers include General Semiconductor, Diodes Inc., etc.) 3. C30-31 and R30-33 can be substitued for R7-8 to implent the enhanced caller ID circuit. 4. Murata BLM18AG601SN1B may be substituted for R15-R16 (0 ohm) to decrease emissions. Rev. 1.03 19 Si3056 Si3018/19/10 4. AOUT PWM Output Figure 18 illustrates an optional circuit to support the pulse width modulation (PWM) output capability of the Si3056 for call progress monitoring purposes. Set the PWME bit (Register 1, bit 3) to enable this mode. +5 VA LS1 Q6 NPN R41 AOUT C41 Figure 18. AOUT PWM Circuit for Call Progress Table 13. Component Values—AOUT PWM Component Value Supplier LS1 Speaker BRT1209PF-06 Intervox Q6 NPN KSP13 Fairchild C41 0.1 µF, 16 V, X7R, ±20% Venkel, SMEC R41 150 Ω, 1/16 W, ±5% Venkel, SMEC, Panasonic Registers 20 and 21 allow the receive and transmit paths to be attenuated linearly. When these registers are set to all 1s, the receive and transmit paths are muted. These registers affect the call progress output only and do not affect transmit and receive operations on the telephone line. The PWMM[1:0] bits (Register 1, bits 5:4) select one of the three different PWM output modes for the AOUT signal, including a delta-sigma data stream, a conventional 32 kHz return to zero PWM output, and balanced 32 kHz PWM output. 20 Rev. 1.03 Si3056 Si3018/19/10 5. Functional Description New features have been added to the Si3056 including more ac terminations, a programmable hybrid, finer gain/attenuation step resolution, finer resolution loop current monitoring capability, ring validation, more HW interrupts, a 200 Hz low frequency filter pole. (See the appropriate functional descriptions.) The secondary communication data format (see "5.26.Digital Interface" on page 37). The low-power sleep mode, and system requirements to support wake-on-ring. (See "5.28.Power Management" on page 39.) The Si3056 is an integrated direct access arrangement (DAA) that provides a programmable line interface to meet global telephone line interface requirements. The Si3056 implements Silicon Laboratories® patented isolation technology and offers the highest level of integration by replacing an analog front end (AFE), an isolation transformer, relays, opto-isolators, and a 2- to 4-wire hybrid with two 16-pin packages (SOIC or TSSOP). The Si3056 DAA is software programmable to meet global requirements and is compliant with FCC, TBR21, JATE, and other country-specific PTT specifications as shown in Table 16 on page 26. In addition, the Si3056 meets the most stringent worldwide requirements for out-of-band energy, emissions, immunity, high-voltage surges, and safety, including FCC Part 15 and 68, EN55022, EN55024, and many other standards. 5.2. Line-Side Device Support Three different line-side devices can be used with the Si3056 system-side device: 5.1. Upgrading from the Si3034/35/44 to Si3056 The Si3056 offers Silicon Laboratories® customers currently using Si3034/35/44 standard serial interface DAA chipsets with an upgrade path for use in new designs. The Si3056 digital interface is similar to the Si3034/35/44 DAAs, thus the Si3056 retains the ability to connect to many widely available DSPs. This also allows customers to leverage software developed for existing Si3034/35/44 designs. More importantly, the Si3056 also offers a number of new features not provided in the Si3034/35/44 DAAs. An overview of the feature differences between the Si3044 and the Si3056 is presented in Table 14. Finally, the globally-compliant Si3056 can be implemented with roughly half the external components required in the already highly integrated Si3034/35/44 DAA application circuits. The following items have changed in the Si3056 as compared to the Si3034/35/44 DAAs: The pinout, the application circuit, and the bill of materials. The Si3056 is not pin compatible with Si3034/35/44 DAA chipsets. Rev. 1.03 Globally-compliant line-side device—Targets global DAA requirements. Use the Si3018 global line-side device for this configuration. This line-side device supports both FCC-compliant countries and nonFCC-compliant countries. Globally-compliant, enhanced features line-side device—Targets embedded and voice applications with global DAA requirements. Use the Si3019 lineside device for this configuration. The Si3019 contains all the features available on the Si3018, plus the following additional features/enhancements: Sixteen selectable ac terminations to increase return loss and trans-hybrid loss performance. Higher transmit and receive level mode. Selectable 200 Hz low frequency pole. –16 to 13.5 dB digital gain/attenuation adjustment in 0.1 dB increments for the transmit and receive paths. Programmable line current/voltage threshold interrupt. Globally-compliant, low-speed only line-side device—Targets embedded 2400 bps soft modem applications. Use the Si3010 line-side device for this configuration. The Si3010 contains all the features available on the Si3018, except the transmit and receive paths are optimized and tested only for modem connect rates up to 2400 bps. 21 Si3056 Si3018/19/10 Table 14. New Si3056 Features Chipset Si3044 System-Side Part # Si3021 Line-Side Part # Si3015 Si3010 Si3018 Si3019 Global DAA Yes Yes Yes Yes Digital Interface SSI SSI SSI SSI 3.3 V or 5 V 3.3 V 3.3 V 3.3 V 56 kbps 2400 bps 56 kbps 56 kbps Data Bus Width 16-bit 16-bit 16-bit 16-bit Control Register Addressing 6-bit 8-bit 8-bit 8-bit 11.025 kHz 16 kHz 16 kHz 16 kHz 2 4 4 16 3 dB steps 3 dB steps 3 dB steps 0.1 dB steps Loop Current Monitoring 3 mA/bit 1.1 mA/bit 1.1 mA/bit 1.1 mA/bit Line Voltage Monitoring 2.75 V per bit 1 V per bit 1 V per bit 1 V per bit Power Supply Max Modem Connect Rate Max Sampling Frequency AC Terminations Programmable Gain Si3056 Polarity Reversal Detection Yes (SW polling) Yes (HW interrupt) Yes (HW interrupt) Yes (HW interrupt) Line I/V Threshold Detection No No No Yes Ring Qualification No Yes Yes Yes Wake-on-Ring Support Yes Yes (MCLK active) Yes (MCLK active) Yes (MCLK active) Ring detect only 7 HW interrupts 7 HW interrupts 8 HW interrupts Integrated Fixed Analog Hybrid Yes Yes Yes Yes Programmable Digital Hybrid No Yes Yes Yes Full Scale Transmit/Receive Level +3.2 dBm 0 dBm 0 dBm +3.2 dBm HW Interrupts 22 Rev. 1.03 Si3056 Si3018/19/10 Table 15. Country Specific Register Settings Register Country Argentina Australia4 Austria Bahrain Belgium Brazil Bulgaria Canada Chile China5 Colombia Croatia Cyprus Czech Republic Denmark Ecuador Egypt El Salvador Finland France Germany Greece Guam Hong Kong Hungary Iceland India Indonesia Ireland Israel Italy Japan Jordan Kazakhstan Kuwait Latvia Lebanon Note: 1. 2. 3. 4. 5. 16 31 16 16 26 OHS OHS2 RZ RT ILIM 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 1 0 0 0 0 1 1 1 1 0 1 0 1 1 1 1 0 0 1 1 0 0 1 1 1 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 1 0 0 0 0 1 1 1 1 0 1 0 1 1 1 1 0 0 1 1 0 0 1 1 1 0 0 0 0 1 1 26 26 DCV[1:0] MINI[1:0] 11 01 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 01 01 11 11 11 11 00 01 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 01 01 00 00 00 00 302 163 ACIM[3:0] ACT ACT2 0000 0011 0010 0010 0010 0000 0011 0000 0000 0000/1010 0000 0010 0010 0010 0010 0000 0010 0000 0010 0010 0010 0010 0000 0000 0010 0010 0000 0000 0010 0010 0010 0000 0000 0000 0000 0010 0010 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 0 1 0 0 0 0 1 1 1 1 0 1 0 1 1 1 1 0 0 1 1 0 0 1 1 1 0 0 0 0 1 1 Supported for loop current ≥ 20 mA. Available with Si3019 line-side only. Available with Si3018 line-side only. See "5.11.DC Termination" on page 27 for DCV and MINI settings. ACIM is 0000 for data applications and 1010 for voice applications. Rev. 1.03 23 Si3056 Si3018/19/10 Table 15. Country Specific Register Settings (Continued) Register Country Luxembourg Macao Malaysia1 Malta Mexico Morocco Netherlands New Zealand Nigeria Norway Oman Pakistan Peru Philippines Poland Portugal Romania Russia Saudi Arabia Singapore Slovakia Slovenia South Africa South Korea Spain Sweden Switzerland Taiwan TBR21 Thailand UAE United Kingdom USA Yemen Note: 1. 2. 3. 4. 5. 24 16 31 16 16 26 OHS OHS2 RZ RT ILIM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 1 0 1 1 0 1 1 0 0 0 0 1 1 1 0 0 0 1 1 0 0 1 1 1 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 1 0 1 1 0 1 1 0 0 0 0 1 1 1 0 0 0 1 1 0 0 1 1 1 0 1 0 0 1 0 0 26 DCV[1:0] MINI[1:0] 11 11 01 11 11 11 11 11 11 11 01 01 11 01 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 01 11 11 11 11 Supported for loop current ≥ 20 mA. Available with Si3019 line-side only. Available with Si3018 line-side only. See "5.11.DC Termination" on page 27 for DCV and MINI settings. ACIM is 0000 for data applications and 1010 for voice applications. Rev. 1.03 26 00 00 01 00 00 00 00 00 00 00 01 01 00 01 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 01 00 00 00 00 302 163 ACIM[3:0] ACT ACT2 0010 0000 0000 0010 0000 0010 0010 0100 0010 0010 0000 0000 0000 0000 0010 0010 0010 0000 0000 0000 0010 0010 0011 0000 0010 0010 0010 0000 0010 0000 0000 0101 0000 0000 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 1 0 0 1 0 1 1 1 1 1 0 0 0 0 1 1 1 0 0 0 1 1 0 0 1 1 1 0 1 0 0 1 0 0 Si3056 Si3018/19/10 5.3. Power Supplies The Si3056 system-side device operates from a 3.0– 3.6 V power supply. The Si3056 input pins are 5 V tolerant. The Si3056 output pins only drive 3.3 V. The line-side device derives its power from two sources: The Si3056 and the telephone line. The Si3056 supplies power over the patented isolation link between the two devices, allowing the line-side device to communicate with the Si3056 while on-hook and perform other onhook functions such as line voltage monitoring. When off-hook, the line-side device also derives power from the line current supplied from the telephone line. This feature is exclusive to DAAs from Silicon Laboratories® and allows the most cost-effective implementation for a DAA while still maintaining robust performance over all line conditions. 5.4. Initialization When the Si3056 is powered up, assert the RESET pin. When the RESET pin is deasserted, the registers have default values. This reset condition guarantees the lineside device is powered down without the possibility of loading the line (i.e., off-hook). An example initialization procedure is outlined in the following list: 1. Program the PLL with registers 8 and 9 (N[7:0], M[7:0]) to the appropriate divider ratios for the supplied MCLK frequency and the sample rate in register 7 (SRC), as defined in "5.25.Clock Generation" on page 36. The capacitive communications link is disabled by default. To enable it, the PDL bit (Register 6, bit 4) must be cleared. No communication between the systemside and line-side can occur until this bit is cleared. The clock generator must be programmed to an acceptable sample rate before clearing the PDL bit. 5.6. Transmit/Receive Full Scale Level (Si3019 Line-Side Only) The Si3056 supports programmable maximum transmit and receive levels. The default signal level supported by the Si3056 is 0 dBm into a 600 Ω load. Two additional modes of operation offer increased transmit and receive level capability to enable use of the DAA in applications that require higher signal levels. The full scale mode is enabled by setting the FULL bit in Register 31. With FULL = 1, the full scale signal level increases to +3.2 dBm into a 600 Ω load, or 1 dBV into all reference impedances. The enhanced full scale mode (or 2X full scale) is enabled by setting the FULL2 bit in Register 30. Will FULL2 = 1, the full scale signal level increases to +6.0 dBm into a 600 Ω load, or 1.5 dBV into all reference impedances. The full scale and enhanced full scale modes provide the ability to trade off TX power and TX distortion for a peak signal. By using the programmable digital gain registers in conjunction with the enhanced full scale signal level mode, a specific power level (+3.2 dBm for example) could be achieved across all ACT settings. 5.7. Parallel Handset Detection 2. Wait 1 ms until the PLL is locked. 3. Write a 00H into Register 6 to power up the line-side device. 4. Set the required line interface parameters (i.e., DCV[1:0], MINI[1:0], ILIM, DCR, ACT and ACT2 or ACIM[3:0], OHS, RT, RZ, ATX[2:0] or TGA2 and TXG2) as defined by “Country Specific Register Settings” shown in Table 15. When this procedure is complete, the Si3056 is ready for ring detection and off-hook. 5.5. Isolation Barrier The Si3056 achieves an isolation barrier through lowcost, high-voltage capacitors in conjunction with Silicon Laboratories® proprietary signal processing techniques. These techniques eliminate signal degradation from capacitor mismatches, common mode interference, or noise coupling. As shown in Figure 17 on page 18, the C1, C2, C8, and C9 capacitors isolate the Si3056 (system-side) from the line-side device. Transmit, receive, control, ring detect, and caller ID data are passed across this barrier. Y2 class capacitors can be used to achieve surge performance of 5 kV or greater. The Si3056 can detect a parallel handset going offhook. When the Si3056 is off-hook, the loop current can be monitored with the LCS bits. A significant drop in loop current signals that a parallel handset is going offhook. If a parallel handset causes the LCS bits to read all 0s, the Drop-Out Detect (DOD) bit can be checked to verify a valid line exists. The LVS bits can be read to determine the line voltage when on-hook and off-hook. Significant drops in line voltage can signal a parallel handset. For the Si3056 to operate in parallel with another handset, the parallel handset must have a sufficiently high dc termination to support two off-hook DAAs on the same line. Improved parallel handset operation can be achieved by changing the dc impedance from 50 to 800 Ω and reducing the DCT pin voltage with the DVC[1:0] bits. 5.8. Line Voltage/Loop Current Sensing The Si3056 can measure loop current and line voltage with the Si3010, Si3018, and the Si3019 line-side devices. The 8-bit LCS2[7:0] and LCS[4:0] registers report loop current. The 8-bit LVS[7:0] register reports line voltage. Rev. 1.03 25 Si3056 Si3018/19/10 These registers can help determine the following: When on-hook, detect if a line is connected. When on-hook, detect if a parallel phone is off-hook. When off-hook, detect if a parallel phone goes on or off-hook. Detect if enough loop current is available to operate. When used in conjunction with the OPD bit, detect if an overcurrent condition exists. (See "5.22.Overload Detection" on page 35.) 5.8.1. Line Voltage Measurement The Si3056 device reports line voltage with the LVS[7:0] bits (Register 29) in both on- and off-hook states with a resolution of 1 V per bit. The accuracy of these bits is approximately ±10%. Bits 0 through 6 of this register indicate the value of the line voltage in 2s compliment format. Bit 7 of this register indicates the polarity of the tip/ring voltage. If the INTE bit (Register 2) and the POLM bit (Register 3) are set, a hardware interrupt is generated on the AOUT/INT pin when bit 7 of the LVS register changes state. The edge-triggered interrupt is cleared by writing 0 to the POLI bit (Register 4). The POLI bit is set each time bit 7 of the LVS register changes state and must be written to 0 to clear it. The default state of the LVS register forces the LVS bits to 0 when the line voltage is 3 V or less. The LVFD bit (Register 31, bit 0) disables the force-to-zero function and allows the LVS register to display non-zero values of 3 V and below. This register might display unpredictable values at line voltages between 0 to 2 V. At 0 V, the LVS register displays all 0s. 5.8.2. Loop Current Measurement When the Si3056 is off-hook, the LCS2[7:0] and LCS[4:0] bits measure loop current in 1.1 mA/bit and 3.3 mA/bit resolution respectively. These bits enable detection of another phone going off-hook by monitoring the dc loop current. The LCS bits are decoded from LCS2; so, both are available at the same time. The line current sense transfer function is shown in Figure 19 and detailed in Table 16. The LCS and LCS2 bits report loop current down to the minimum operating loop current for the DAA. Below this threshold, the reported value of loop current is unpredictable. Table 16. Loop Current Transfer Function LCS[4:0] Condition 00000 Insufficient line current for normal operation. Use the DOD bit (Register 19, bit 1) to determine if a line is connected. 00100 Minimum line current for normal operation. 11111 Loop current is greater than 127 mA. An overcurrent situation may exist. 5.9. Off-Hook The communication system generates an off-hook command by applying a logic 0 to the OFHK pin or by setting the OH bit (Register 5, bit 0).The OFHK pin must be enabled by setting the OHE bit (Register 5, bit 1). The polarity of the OFHK pin is selected by the OPOL bit (Register 5, bit 4). With OFHK asserted, the system is in an off-hook state. The off-hook state seizes the line for incoming/outgoing calls and also can be used for pulse dialing. With OFHK deasserted, negligible dc current flows through the hookswitch. When the OFHK pin is asserted, the hookswitch transistor pair, Q1 and Q2, turn on. This applies a termination impedance across TIP and RING and causes dc loop current to flow. The termination impedance has an ac and dc component. Possible Overload 30 25 20 LCS BITS 15 10 5 0 0 3.3 6.6 9.9 13.2 16.5 19.8 23.1 26.4 29.7 33 36.3 39.6 42.9 46.2 49.5 52.8 56.1 59.1 62.7 66 69.3 72.6 75.9 79.2 82.5 85.8 89.1 92.4 95.7 Loop Current (mA) 99 102.3 127 Figure 19. Typical Loop Current LCS Transfer Function 26 Rev. 1.03 Si3056 Si3018/19/10 Several events occur in the DAA when the OFHK pin is asserted or the OH bit is set. There is a 250 µs latency to allow the off-hook command to be communicated to the line-side device. Once the line-side device goes offhook, an off-hook counter forces a delay for line transients to settle before transmission or reception occurs. This off-hook counter time is controlled by the FOH[1:0] bits (Register 31, bits 6:5). The default setting for the off-hook counter time is 128 ms, but can be adjusted up to 512 ms or down to either 64 or 8 ms. After the off-hook counter has expired, a resistor calibration is performed for 17 ms. This allows circuitry internal to the DAA to adjust to the exact conditions present at the time of going off-hook. This resistor calibration can be disabled by setting the RCALD bit (Register 25, bit 5). After the resistor calibration is performed, an ADC calibration is performed for 256 ms. This calibration helps to remove offset in the A/D sampling the telephone line. This ADC calibration can be disabled by setting the CALD bit (Register 17, bit 5). See “5.29.Calibration” on page 39. for more information on automatic and manual calibration. Registers 43 and 44 contain the line current/voltage threshold interrupt. This interrupt will trigger when either the measured line voltage or current in the LVS or LCS2 registers, as selected by the CVS bit (Register 44, bit 2), crosses the threshold programmed into the CVT[7:0] bits. An interrupt can be programmed to occur when the measured value rises above or falls below the threshold. Only the magnitude of the measured value is used to compare to the threshold programmed into the CVT[7:0] bits, and thus only positive numbers should be used as a threshold. This line current/voltage threshold interrupt is only available with the Si3019 line-side device. 5.11. DC Termination The DAA has programmable settings for dc impedance, minimum operational loop current, and TIP/RING voltage. The dc impedance of the DAA is normally represented with a 50 Ω slope as shown in Figure 20, but can be changed to an 800 Ω slope by setting the DCR bit. This higher dc termination presents a higher resistance to the line as loop current increases. . Silicon Laboratories® recommends that the resistor and the ADC calibrations not be disabled except when a fast response is needed after going off-hook, such as when responding to a Type II caller-ID signal. See “5.21.Caller ID” on page 32. Voltage Across DAA (V) 12 To calculate the total time required to go off-hook and start transmission or reception, the digital filter delay (typically 1.5 ms with the FIR filter) should be included in the calculation. 5.10. Interrupts The AOUT/INT pin can be used as a hardware interrupt pin by setting the INTE bit (Register 2, bit 7). When this bit is set, the call progress output function (AOUT) is not available. The default state of this interrupt output pin is active low, but active high operation can be enabled by setting the INTP bit (Register 2, bit 6). This pin is an open-drain output when the INTE bit is set, and requires a 4.7 kΩ pullup or pulldown for correct operation. If multiple INT pins are connected to a single input, the combined pullup or pulldown resistance should equal 4.7 kΩ. Bits 7–2, and 0 in Register 3 and bit 1 in Register 44 can be set to enable hardware interrupt sources. When one or more of these bits are set, the AOUT/INT pin becomes active and stays active until the interrupts are serviced. If more than one hardware interrupt is enabled in Register 3, software polling determines the cause of the interrupts. Register 4 and bit 3 of Register 44 contain sticky interrupt flag bits. Clear these bits after being set to service the interrupt. FCC DCT Mode 11 10 9 8 7 6 .01 .02 .03 .04 .05 .06 .07 .08 .09 .1 .11 Loop Current (A) Figure 20. FCC Mode I/V Characteristics, DCV[1:0] = 11, MINI[1:0] = 00, ILIM = 0 For applications that require current limiting per the TBR21 standard, the ILIM bit can be set to select this mode. In the current limiting mode, the dc I/V curve is changed to a 2000 Ω slope above 40 mA, as shown in Figure 21. The DAA operates with a 50 V, 230 Ω feed, which is the maximum line feed specified in the TBR21 standard. Rev. 1.03 27 Si3056 Si3018/19/10 Voltage Across DAA (V) 45 Table 17. AC Termination Settings for the Si3010 and Si3018 Line-Side Devices TBR21 DCT Mode 40 35 30 ACT ACT2 0 0 Real, nominal 600 Ω termination that satisfies the impedance requirements of FCC part 68, JATE, and other countries. 1 0 Complex impedance that satisfies global impedance requirements. 0 1 Complex impedance that satisfies global impedance requirements EXCEPT New Zealand. Achieves higher return loss for countries requiring complex ac termination. [220 Ω + (820 Ω || 120 nF) and 220 Ω + (820 Ω || 115 nF)] 25 20 15 10 5 .015 .02 .025 .03 .035 .04 .045 .05 .055 .06 Loop Current (A) Figure 21. TBR21 Mode I/V Characteristics, DCV[1:0] = 11, MINI[1:0] = 00, ILIM = 1 AC Termination The MINI[1:0] bits select the minimum operational loop 1 1 Complex impedance for use in New current for the DAA, and the DCV[1:0] bits adjust the Zealand. [370 Ω + (620 Ω || 310 nF)] DCT pin voltage, which affects the TIP/RING voltage of the DAA. These bits permit important trade-offs for the Table 18. AC Termination Settings for the system designer. Increasing the TIP/RING voltage Si3019 Line-Side Device provides more signal headroom, while decreasing the TIP/RING voltage allows compliance to PTT standards ACIM[3:0] AC Termination in low-voltage countries such as Japan. Increasing the minimum operational loop current above 10 mA also 0000 600 Ω increases signal headroom and prevents degradation of the signal level in low-voltage countries. 0001 900 Ω Finally, Australia has separate dc termination 0010 270 Ω + (750 Ω || 150 nF) and 275 Ω requirements for line seizure versus line hold. Japan + (780 Ω || 150 nF) mode may be used to satisfy both requirements. However, if a higher transmit level for modem operation 0011 220 Ω + (820 Ω || 120 nF) and is desired, switch to FCC mode 500 ms after the initial 220 Ω + (820 Ω || 115 nF) off-hook. This satisfies the Australian dc termination 0100 370 Ω + (620 Ω || 310 nF) requirements. 0101 320 Ω + (1050 Ω || 230 nF) 5.12. AC Termination The Si3056 has four ac termination impedances with the Si3018 line-side device and sixteen ac termination impedances with the Si3019 line-side device. The ACT and ACT2 bits select the ac impedance on the Si3018 line-side device. The ACIM[3:0] bits select the ac impedance on the Si3019. The available ac termination settings are listed for the line-side devices in Tables 17 and 18. The most widely used ac terminations are available as register options to satisfy various global PTT requirements. The real 600 Ω impedance satisfies the requirements of FCC part 68, JATE, and many other countries. The 270 Ω+ (750 Ω || 150 nF) satisfies the requirements of TBR21 (ACT = 0, ACT = 1, or ACIM [3:0] = 0010). 28 0110 370 Ω + (820 Ω || 110 nF) 0111 275 Ω + (780 Ω || 115 nF) 1000 120 Ω + (820 Ω || 110 nF) 1001 350 Ω + (1000 Ω || 210 nF) 1010 200 Ω + (680 Ω || 100 nF) 1011 600 Ω + 2.16 µF 1100 900 Ω + 1 µF 1101 900 Ω + 2.16 µF 1110 600 Ω + 1 µF 1111 Global complex impedance Rev. 1.03 Si3056 Si3018/19/10 There are two selections that are useful for satisfying non-standard ac termination requirements. The 350 Ω + (1000 Ω || 210 nF) impedance selection is the ANSI/ EIA/TIA 464 compromise impedance network for trunks. The last ac termination selection, ACIM[3:0] = 1111, is designed to satisfy minimum return loss requirements for every country in the world that requires a complex termination. For any of the ac termination settings, the programmable hybrid can be used to further reduce near-end echo. See “5.13.Transhybrid Balance” for more details. 5.13. Transhybrid Balance The Si3056 contains an on-chip analog hybrid that performs the 2- to 4-wire conversion and near-end echo cancellation. This hybrid circuit is adjusted for each ac termination setting selected. The Si3056 also offers a digital filter stage for additional near-end echo cancellation. For each ac termination setting selected, the eight programmable hybrid registers (Registers 45-52) can be programmed with coefficients to provide increased cancellation of realworld line anomalies. This digital filter can produce 10 dB or greater of near-end echo cancellation in addition to the echo cancellation provided by the analog hybrid circuitry. 5.14. Ring Detection The ring signal is resistively coupled from TIP and RING to the RNG1 and RNG2 pins. The Si3056 supports either full- or half-wave ring detection. With full-wave ring detection, the designer can detect a polarity reversal of the ring signal. See “5.21.Caller ID” on page 32. The ring detection threshold is programmable with the RT bit (Register 16, bit 0) and RT2 bit (Register 17, bit 4). The ring detector output can be monitored in three ways. The first method uses the RGDT pin. The second method uses the register bits, RDTP, RDTN, and RDT (Register 5). The final method uses the DTX output. The ring detector mode is controlled by the RFWE bit (Register 18, bit 1). When the RFWE bit is 0 (default mode), the ring detector operates in half-wave rectifier mode. In this mode, only positive ring signals are detected. A positive ring signal is defined as a voltage greater than the ring threshold across RNG1-RNG2. Conversely, a negative ring signal is defined as a voltage less than the negative ring threshold across RNG1-RNG2. When the RFWE bit is 1, the ring detector operates in full-wave rectifier mode. In this mode, both positive and negative ring signals are detected. The first method to monitor ring detection output uses the RGDT pin. When the RGDT pin is used, it defaults to active low, but can be changed to active high by setting the RPOL bit (Register 14, bit 1). This pin is a standard CMOS output. If multiple RGDT pins are connected to a single input, the combined pullup or pulldown resistance should equal 4.7 kΩ. When the RFWE bit is 0, the RGDT pin is asserted when the ring signal is positive, which results in an output signal frequency equal to the actual ring frequency. When the RFWE bit is 1, the RGDT pin is asserted when the ring signal is positive or negative. The output then appears to be twice the frequency of the ring waveform. The second method to monitor ring detection uses the ring detect bits (RDTP, RDTN, and RDT). The RDTP and RDTN behavior is based on the RNG1-RNG2 voltage. When the signal on RNG1-RNG2 is above the positive ring threshold, the RDTP bit is set. When the signal on RNG1-RNG2 is below the negative ring threshold, the RDTN bit is set. When the signal on RNG1-RNG2 is between these thresholds, neither bit is set. The RDT behavior is also based on the RNG1-RNG2 voltage. When the RFWE bit is 0, a positive ring signal sets the RDT bit for a period of time. When the RFWE bit is 1, a positive or negative ring signal sets the RDT bit. The RDT bit acts like a one shot. When a new ring signal is detected, the one shot is reset. If no new ring signals are detected prior to the one shot counter reaching 0, then the RDT bit clears. The length of this count is approximately 5 seconds. The RDT bit is reset to 0 by an off-hook event. If the RDTM bit (Register 3, bit 7) is set, a hardware interrupt occurs on the AOUT/INT pin when RDT is triggered. This interrupt can be cleared by writing to the RDTI bit (Register 4, bit 7). When the RDI bit (Register 2, bit 2) is set, an interrupt occurs on both the beginning and end of the ring pulse. Ring validation may be enabled when using the RDI bit. The third method to monitor detection uses the DTX data samples to transmit ring data. If the communications link is active (PDL = 0) and the device is not off-hook or in on-hook line monitor mode, the ring data is presented on DTX. The waveform on DTX depends on the state of the RFWE bit. When RFWE is 0, DTX is –32768 (0x8000) while the RNG1-RNG2 voltage is between the thresholds. When a ring is detected, DTX transitions to +32767 when the ring signal is positive, then goes back to –32768 when the ring is near 0 and negative. Thus a near square wave is presented on DTX that swings from –32768 to +32767 in cadence with the ring signal. Rev. 1.03 29 Si3056 Si3018/19/10 When RFWE is 1, DTX sits at approximately +1228 while the RNG1-RNG2 voltage is between the thresholds. When the ring becomes positive, DTX transitions to +32767. When the ring signal goes near 0, DTX remains near 1228. As the ring becomes negative, the DTX transitions to –32768. This repeats in cadence with the ring signal. crossing. Delay period between when the ring signal is validated and when a valid ring signal is indicated to accommodate distinctive ringing. The RNGV bit (Register 24, bit 7) enables or disables the ring validation feature in normal operating mode and low-power sleep mode. To observe the ring signal on DTX, watch the MSB of the data. The MSB toggles at the same frequency as the ring signal independent of the ring detector mode. This method is adequate for determining the ring frequency. Ring validation affects the behavior of the RDT status bit, the RDTI interrupt, the INT pin, and the RGDT pin. 5.15. Ring Validation This feature prevents false triggering of a ring detection by validating the ring frequency. Invalid signals, such as a line voltage change when a parallel handset goes offhook, pulse dialing, or a high-voltage line test are ignored. Ring validation can be enabled during normal operation and in low power sleep mode. The external MCLK signal is required in low power sleep mode for ring validation. 1. When ring validation is enabled, the status bit seen in the RDT read-only bit (r5.2), represents the detected envelope of the ring. The ring validation parameters are configurable so that this envelope may remain high throughout a distinctive-ring sequence. 2. The RDTI interrupt fires when a validated ring occurs. If RDI is zero (default), the interrupt occurs on the rising edge of RDT. If RDI is set, the interrupt occurs on both rising and falling edges of RDT. 3. The INT pin follows the RDTI bit with configurable polarity. The ring validation circuit operates by calculating the time between alternating crossings of positive and negative ring thresholds to validate that the ring frequency is within tolerance. High and low frequency tolerances are programmable in the RAS[5:0] and RMX[5:0] fields. The RCC[2:0] bits define how long the ring signal must be within tolerance. The RGDT pin can be configured to follow the ringing signal envelope detected by the ring validation circuit by setting RFWE to 0. If RFWE is set to 1, the RGDT pin follows an unqualified ring detect one-shot signal initiated by a ring-threshold crossing and terminated by a fixed counter timeout of approximately 5 seconds. (This information is shown in Register 18). Once the duration of the ring frequency is validated by the RCC bits, the circuitry stops checking for frequency tolerance and begins checking for the end of the ring signal, which is defined by a lack of additional threshold crossings for a period of time configured by the RTO[3:0] bits. When the ring frequency is first validated, a timer defined by the RDLY[2:0] bits is started. If the RDLY[2:0] timer expires before the ring timeout, then the ring is validated and a valid ring is indicated. If the ring timeout expires before the RDLY[2:0] timer, a valid ring is not indicated. 5.16. Ringer Impedance and Threshold Ring validation requires five parameters: Timeout parameter to place a lower limit on the frequency of the ring signal on the RAS[5:0] bits (Register 24). This is measured by calculating the time between crossings of positive and negative ring thresholds. Minimum count to place an upper limit on the frequency on the RMX[5:0] bits (Register 22). Time interval over which the ring signal must be the correct frequency on the RCC[2:0] bits (Register 23). Timeout period that defines when the ring pulse has ended based on the most recent ring threshold 30 The ring detector in many DAAs is ac coupled to the line with a large 1 µF, 250 V decoupling capacitor. The ring detector on the Si3056 is resistively coupled to the line. This produces a high ringer impedance to the line of approximately 20 MΩ to meet the majority of country PTT specifications, including FCC and TBR21. Several countries including Poland, and South Africa, may require a maximum ringer impedance that can be met with an internally synthesized impedance by setting the RZ bit (Register 16, bit 1). Some countries also specify ringer thresholds differently. The RT bit (Register 16, bit 0) selects between two different ringer thresholds: 15 V ±10% and 21.5 V ±10%. These two settings satisfy ringer threshold requirements worldwide. The thresholds are set so that a ring signal is guaranteed to not be detected below the minimum, and a ring signal is guaranteed to be detected above the maximum. Rev. 1.03 Si3056 Si3018/19/10 5.17. Pulse Dialing and Spark Quenching Pulse dialing results from going off- and on-hook to generate make and break pulses. The nominal rate is 10 pulses per second. Some countries have strict specifications for pulse fidelity that include make and break times, make resistance, and rise and fall times. In a traditional solid-state dc holding circuit, there are many problems in meeting these requirements. The Si3056 dc holding circuit actively controls the onhook and off-hook transients to maintain pulse dialing fidelity. Spark quenching requirements in countries such as Italy, the Netherlands, South Africa, and Australia deal with the on-hook transition during pulse dialing. These tests provide an inductive dc feed resulting in a large voltage spike. This spike is caused by the line inductance and the sudden decrease in current through the loop when going on-hook. The traditional solution to the problem is to put a parallel resistive capacitor (RC) shunt across the hookswitch relay. However, the capacitor required is large (~1 µF, 250 V) and relatively expensive. In the Si3056, loop current can be controlled to achieve three distinct on-hook speeds to pass spark quenching tests without additional BOM components. Through settings of four bits in three registers, OHS (Register 16), OHS2 (Register 31), SQ1 and SQ0 (Register 59), a slow ramp down of loop current can be achieved which induces a delay between the time OH bit is cleared and the time the DAA actually goes onhook. To ensure proper operation of the DAA during pulse dialing, disable the automatic resistor calibration that is performed each time the DAA enters the off-hook state by setting the RCALD bit (Register 25, bit 5). 5.18. Billing Tone Protection and Receive Overload “Billing tones” or “metering pulses” generated by the Central Office can cause modem connection difficulties. The billing tone is typically either a 12 or 16 kHz signal and is sometimes used in Germany, Switzerland, and South Africa. Depending on line conditions, the billing tone might be large enough to cause major errors in the line data. The Si3056 chipset can provide feedback indicating the beginning and end of a billing tone. Billing tone detection is enabled with the BTE bit (Register 17, bit 2). Billing tones less than 1.1 VPK on the line are filtered out by the low pass digital filter on the Si3056. The ROV bit is set when a line signal is greater than 1.1 VPK, indicating a receive overload condition. The BTD bit is set when a billing tone is large enough to excessively reduce the line-derived power supply of the line-side device. The OVL bit (Register 19) can be polled following a billing tone detection. The OVL bit indicates that the billing tone has passed when it returns to 0. The BTD and ROV bits are sticky, and must be written to 0 to be reset. After the billing tone passes, the DAA initiates an auto-calibration sequence that must complete before data can be transmitted or received. Certain line events, such as an off-hook event on a parallel phone or a polarity reversal, can trigger the ROV or the BTD bits. Look for multiple events before qualifying if billing tones are present. After the billing tone passes, the DAA initiates an auto-calibration sequence that must complete before data can be transmitted or received. Although the DAA remains off-hook during a billing tone event, the received data from the line is corrupted when a large billing tone occurs. If the user wishes to receive data through a billing tone, an external LC filter must be added. A manufacturer can provide this filter to users in the form of a dongle that connects on the phone line before the DAA. This prevents the manufacturer from having to include a costly LC filter to support multiple countries and customers. Alternatively, when a billing tone is detected, the system software notifies the user that a billing tone has occurred. Notification prompts the user to contact the telephone company to disable billing tones or to purchase an external LC filter. Disturbance on the line other than billing tones can also cause a receive overload. Some conditions may result in a loop current collapse to a level below the minimum required operating current of the DAA. When this occurs, the dropout detect bit (DOD) is set, and an interrupt will be generated if the dropout detect interrupt mask bit (DODM) is set. 5.19. Billing Tone Filter (Optional) To operate without degradation during billing tones in Germany, Switzerland, and South Africa, requires an external LC notch filter. The Si3056 can remain off-hook during a billing tone event, but line data is lost in the presence of large billing tone signals. The notch filter design requires two notches, one at 12 kHz and one at 16 kHz. Because these components are expensive and few countries utilize billing tones, this filter is typically placed in an external dongle or added as a population option for these countries. Figure 22 shows an example billing tone filter. Rev. 1.03 31 Si3056 Si3018/19/10 5.21. Caller ID C1 The Si3056 can pass caller ID data from the phone line to a caller ID decoder connected to the serial port. C2 5.21.1. Type I Caller ID Type I Caller ID sends the CID data while the phone is on-hook. L1 TIP From Line L2 In systems where the caller ID data is passed on the phone line between the first and second rings, utilize the following method to capture the caller ID data: To DAA 1. After identifying a ring signal using one of the methods described in "5.14.Ring Detection" on page 29, determine when the first ring is complete. C3 RING Figure 22. Billing Tone Filter L1 must carry the entire loop current. The series resistance of the inductors is important to achieve a narrow and deep notch. This design has more than 25 dB of attenuation at both 12 kHz and 16 kHz. Table 19. Component Values—Optional Billing Tone Filters Symbol Value C1,C2 0.027 µF, 50 V, ±10% C3 0.01 µF, 250 V, ±10% L1 3.3 mH, >120 mA, 40 mA,