Si3460
IEEE 802.3af PSE INTERFACE
AND
DC-DC CONTROLLER
Features
3-point detection
algorithm eliminates false
detection events
IEEE-compliant classification
IEEE-compliant disconnect
Inrush current control
Short-circuit output fault
protection
LED status signal (detect,
power good, output fault)
UNH Interoperability Test Lab test
report available
Extended operating range
(–40 to +85 °C)
11-Pin Quad Flat No-Lead (QFN)
Tiny 3 x 3 mm PCB footprint;
Pb-free, RoHS-compliant
Pin Assignments
Robust
Si3460
11
11
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
IEEE 802.3af™ compliant PSE and
dc-dc controller
Autonomous operation requires no
host processor interface
Complete reference design
available, including Si3460 controller,
PSE firmware, and schematic:
Low-cost BOM with compact PCB
footprint
Operates directly from a +12 or
+15 V isolated supply
DC-DC controller generates –48 V
PSE output for SELV compatibility
with telephony interfaces
Supports up to 15.4 W maximum
output power (Class 0)
GATE
1
10
CTRL1
2
9
ISENSE
VDD
3
8
RST
CTRL2
4
7
VSENSE
250KHZ
5
6
DETA
11
11
GND
STATUS
11-pin QFN (3x3 mm)
Top View—Pads on bottom of package
Applications
IEEE 802.3af endpoints and
midspans
Environment A and B PSEs
Embedded PSEs
Set-top boxes
FTTH media converters
Cable modem and DSL
gateways
Description
The Si3460 is a single-port, –48 V power management controller for
IEEE 802.3af-compliant Power Sourcing Equipment (PSE). Designed
to minimize system cost and ease implementation in embedded PSE
endpoint (switches) or midspan (power injector) applications, the
Si3460 operates directly from a 12 or 15 V input supply and integrates
a digital PWM-based dc-dc converter for generating the –48 V PSE
output supply. The IEEE-required Powered Device (PD) detection
feature uses a robust 3-point algorithm to avoid false detection events.
The Si3460's reference design kit also provides full IEEE-compliant
classification and PD disconnect. Intelligent protection circuitry
includes input undervoltage lockout (UVLO), classification-based
current limiting, and output short-circuit protection. The Si3460 is
designed to operate completely independently of host processor
control. An LED status signal is provided to indicate the port status,
including detect, power good, and output fault event information for
use within the host system. The Si3460 is pin-programmable to
support endpoint and midspan applications as well as each of the
different classification power levels specified by the IEEE 802.3af
standard. A comprehensive reference design kit is available (Si3460EVB), including a complete schematic and BOM (Bill-of-Materials) for
the dc-dc converter and PSE functions.
Rev. 1.2 3/13
Copyright © 2013 by Silicon Laboratories
Si3460
Si3460
Block Diagram
OTP
Memory
PWM DC/DC
Controller:
Osc.
Config.
& LED
I/F
PSE
Controller:
250KHZ
VSENSE
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
State
Machine
Control
UVLO,
Current Limiting,
Short Circuit
Protection
GATE
RST
STATUS
Detection
Classification
Disconnect
2
Rev. 1.2
ISENSE
CTRL1
CTRL2
DETA
Si3460
TABLE O F C ONTENTS
Section
Page
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
1. Si3460-EVB Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.1. Si3460-EVB Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
2. Si3460 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
3. Si3460-EVB Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3.1. PSE Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3.2. DC-DC Converter Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
4. Si3460-EVB Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1. Reset State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
4.2. Operating Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3. Operating Mode Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5. Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
5.1. Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2. External Component Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3. Input DC Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
5.4. STATUS and RESET Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6. Si3460 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8. Package Outline: 11-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.1. Solder Paste Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.2. PCB Landing Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.3. Device Marking of Production Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Rev. 1.2
3
Si3460
1. Si3460-EVB Application Diagram
VDD
ISENSE
V OUT
GATE
V IN
CTRL1
DETA
RST
Si3460
250KHZ
-48 V
PWM
BOM
PSE
output
(to port
magnetics)
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
+11V
to
16V
Detect
BOM
CTRL2
VSENSE
GND
STATUS
DETECT
FAULT
PGOOD
V EE
Note: Refer to the Si3460-EVB User Guide for complete schematic details
Figure 1. Si3460-EVB Application Diagram
4
Rev. 1.2
Si3460
1.1. Si3460-EVB Performance Characteristics
When implemented according to the recommended external components and layout guidelines for the Si3460EVB, the Si3460 enables the following performance specifications in single-port PSE applications. Please refer to
the Si3460-EVB User’s Guide and schematics for details.
Table 1. Selected Electrical Specifications (Si3460-EVB)
Symbol
Test Condition
VIN input supply range
VIN
VIN input UVLO voltage
UVLO
Parameter
Min
Typ
Max
Unit
–40 to +85 °C ambient range
11
12, 15
16
V
UVLO turn-off voltage at VIN
10
—
—
V
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
Power Supplies
VDD supply voltage range
VDD UVLO voltage
Output supply voltage
Supply current
VDD
Si3460 supply voltage range
2.7
3.3
3.6
V
VDDmin
Si3460 UVLO turn-off voltage
2.7
—
—
V
VOUT
PSE output voltage at
VIN = 11 V (min) to 16 V (max)
–54
–50
–46
V
IIN
Current into VDD
(including gate drive and detect)
—
5
—
mA
Detection Specifications
Minimum signature resistance
RDETmin
15
17
19
k
Maximum signature resistance
RDETmax
26.5
29
33
k
Classification Specifications
Classification voltage
VCLASS
0 mA < ICLASS < 45 mA
–20.5
—
–15.5
V
Classification current limit
ICLASS
Measured with 200 across VOUT
55
—
95
mA
Class 0
0
—
5
mA
Classification current region
ICLASS_REGION
Class 1
8
—
13
mA
Class 2
16
—
21
mA
Class 3
25
—
31
mA
Class 4
35
—
45
mA
Class 0/3/4
15,400/
VOUT
340
400
mA
Class 1
5000/
VOUT
88
98
mA
Class 2
7000/
VOUT
154
180
mA
Protection and Current Control
Overload current threshold
ICUT
Overload current limit
ILIM
All class levels;
Output = 100 across VOUT
400
425
450
mA
Overload time
TLIM
Output = 100 across VOUT
50
60
75
ms
Output power at overload
PLIM
15.4
17
—
W
Disconnect current
IMIN
Disconnect current
5
7.5
10
mA
(PIN @ VIN) to (POUT @ VOUT)
—
75
—
%
Efficiency
System efficiency
Rev. 1.2
5
Si3460
2. Si3460 Electrical Specifications
The following specifications apply to the Si3460 controller. Refer to Tables 1, 5, 6, and 7, the Si3460-EVB User’s
Guide, and schematics for additional details about the electrical specifications of the Si3460-EVB reference design.
Table 2. Recommended Operating Conditions*
Description
Symbol
TA
Thermal impedance
JA
No airflow
Min
Typ
Max
Unit
–40
25
+85
°C
—
75
—
°C/W
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
Operating temperature range
Test Conditions
VDD input supply voltage
VDD
During all operating modes
(detect, classification, disconnect)
2.7
3.3
3.6
V
*Note: VDD = 2.7 to 3.6 V, –40 to +85 °C unless otherwise specified.
Table 3. Absolute Maximum Ratings*
Conditions
Max Rating
Unit
Ambient temperature under bias
–55 to +125
°C
Storage Temperature
–65 to +150
°C
–0.3 to 5.8
V
Voltage on VDD with respect to GND
–0.3 to 4.2
V
Maximum total current through VDD
and GND
500
mA
Maximum output current into GATE, CTRL1,
CTRL2, 250KHZ, STATUS, ISENSE, RST,
VSENSE, DETA (any I/O pin)
100
mA
Human Body Model
–2 kV to +2 kV
V
Soldering, 10 seconds maximum
260
°C
Parameter
VDD > 2.2 V
Voltage on RST or any I/O pin with respect to GND
ESD tolerance
Lead Temperature
*Note: Stresses above those listed in this table may cause permanent device damage. This is a stress rating only, and
functional operation of the devices at these or any conditions above those indicated in the operational listings of this
specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
6
Rev. 1.2
Si3460
Table 4. Electrical Characteristics*
Description
Symbol
Test Conditions
Min
Typ
Max
Unit
—
—
—
V
0.6
0.1
—
V
Digital Pins: GATE, CTRL1, CTRL2, 250KHZ, STATUS (Output mode), RST
Output high voltage
VOH
IOH = –3 mA
IOH = –10 µA
IOH = –10 mA
Output low voltage
VOL
IOL = 8.5 mA
IOL = 10 µA
IOL = 25 mA
—
—
—
Input high voltage
VIH
Any digital pin
0.7 x VDD
Input low voltage
VIL
Any digital pin
—
—
0.3 x VDD
V
Input leakage current
IIL
VIN = 0 V
—
±1
—
µA
—
5
—
pF
—
±1
—
µA
0.8 x VDD
—
VDD – 0.1
—
—
0.7 x VDD
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
—
—
0.4 x VDD
V
Analog Pins: ISENSE, VSENSE, DETA, STATUS (Input mode)
Input capacitance
Input leakage current
IIL
*Note: VDD = 2.7 to 3.6 V, –40 to +85 °C unless otherwise specified.
Rev. 1.2
7
Si3460
3. Si3460-EVB Performance Characteristics
When implemented in accordance with the recommended external components and layout guidelines, the Si3460
controller enables the following typical performance characteristics in single-port PSE applications. Refer to the
Si3460-EVB applications note, schematics, and user's guide for more details.
Table 5. PSE Performance Characteristics1
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
400
425
450
mA
15,400/
VOUT
340
400
mA
Class 1
5000/
VOUT
88
98
mA
Class 2
7000/
VOUT
154
180
mA
Protection and Current Control
ILIM
Output = 100 across VOUT
Overload current threshold3
ICUT
Class 0/3/4
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
Overload current limit
Overload current limit
ILIM
All class levels;
Output = 100 across VOUT
400
425
450
mA
Overload time
TLIM
Output = 100 across VOUT
50
60
75
ms
Output power at overload
PLIM
15.4
17
—
W
Disconnect current
IMIN
Disconnect current
5
7.5
10
mA
VDET
Detection point 1 (w/ 10 k source)
Detection point 2 (w/ 10 k source)
Detection point 3 (w/ 10 k source)
—
—
—
4.5
7.5
4.5
—
—
—
V
Detection Specifications2
Detection voltage
Minimum signature
resistance
RDETmin
15
17
19
k
Maximum signature
resistance
RDETmax
26.5
29
33
k
–20.5
—
–15.5
V
55
—
95
mA
0
8
16
25
35
—
—
—
—
—
5
13
21
31
45
mA
mA
mA
mA
mA
Classification Specifications2
Classification voltage
VCLASS
0 mA < ICLASS < 45 mA
Classification current limit
ICLASS
Measured with 200 across VOUT
Classification current
region
ICLASS_REGION
Class 0
Class 1
Class 2
Class 3
Class 4
Notes:
1. Typical specifications are based on an ambient operating temperature of 25 ºC and VIN = +12 V unless otherwise
specified.
2. See “3. Si3460-EVB Performance Characteristics” for more details.
3. Absolute classification current limits are configurable.See section "4.3.2. Classification" on page 12.
8
Rev. 1.2
Si3460
3.1. PSE Timing Characteristics
When implemented in accordance with the recommended external components and layout guidelines, the Si3460
controller enables the following typical performance characteristics in single-port PSE applications. Refer to the
Si3460-EVB applications note, schematics, and user's guide for more details.
Table 6. PSE Timing*
Description
Test Conditions
Min
Typ
Max
Unit
tDET_CYCLE
Time from PD connection to port to
completion of detection process.
70
—
400
ms
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
Endpoint detection delay
cycle
Symbol
Detection time
Classification delay cycle
Classification time
tDETECT
Time required to measure PD
signature resistance.
—
70
—
ms
tCLASS_CYCLE
Time from successful detect mode
to classification complete.
10
—
50
ms
10
—
50
ms
—
30
—
ms
tCLASS
Power-up turn-on delay
tPWRUP
Time from when a valid detection is
completed until VOUT power is
applied
Midspan detect backoff time
tBOM
2
—
—
s
Current limit time
tLIM
—
60
—
ms
Disconnect delay
tDC_DIS
—
350
—
ms
*Note: These typical specifications are based on an ambient operating temperature of 25 ºC and VIN = +12 V.
3.1.1. PSE Timing Diagrams
The basic sequence of applying power is shown in Figure 2. Following is the description of the function that must
be performed in each phase.
57 V
Voltage
44 V
20.5 V
15.5 V
10 V
Time
(msec)
2.8 V
tDET_CYCLE
tCLASS_CYCLE
tPWRUP
Figure 2. Detection, Classification, Powerup, and Disconnect Sequence
Rev. 1.2
9
Si3460
3.2. DC-DC Converter Performance Characteristics
The dc-dc converter utilizes a digital control loop architecture operating at 250 kHz. The complete converter is
comprised of the Si3460 controller and the external components in the Si3460-EVB schematics. The performance
specifications in Table 7 are typical for the Si3460-EVB reference design.
Table 7. DC-DC Performance1
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
—
250
—
kHz
DC-DC Controller Performance Characteristics2
fPWM
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
PWM operating frequency
VIN to VOUT
—
75
—
%
Load regulation
RLOAD
Minimum to maximum load
—
±1
—
%
Line regulation
RLINE
For VIN ranging from 11 to 16 V
—
±1
—
%
R
250 kHz PWM frequency
< 500 Hz
—
—
100
200
—
—
mV
Efficiency
Output ripple
Notes:
1. Typical specifications are based on an ambient operating temperature of 25 ºC and VIN = +12 V.
2. See “3. Si3460-EVB Performance Characteristics” for more details.
10
Rev. 1.2
Si3460
4. Si3460-EVB Functional Description
In combination with low-cost external components, the Si3460 controller provides a complete PSE solution for
embedded PoE applications. Included in the Si3460-EVB reference design is a digital PWM controller-based dc-dc
converter that simplifies overall system design by generating the –48 V PSE supply voltage. An isolated 11 to 16 V
input dc supply is all that is needed to supply the Si3460-EVB reference design. Refer to the Si3460-EVB User’s
Guide and schematics for descriptions in the following sections.
4.1. Reset State
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
At powerup or if reset is held low, the Si3460 is in an inactive state with the PWM turned off (the switcher FET, M1,
is off) and the pass FET, M2, is off.
4.2. Operating Mode Configuration
At powerup, the Si3460 reads the voltage on the STATUS pin, which is set by a resistor divider from VEE to chip
ground. The STATUS pin voltage level configures all of the Si3460's operating modes as summarized in Table 8.
Table 8. Operating Modes
Operating Mode
STATUS
Pin Voltage
Power Level
Supported (W)
Classes Supported
Midspan/
Endpoint
Restart Action on
Fault or Overload
Event Condition
Pin voltage at VEE
(no resistors populated)
15.4
All class levels
Endpoint
Auto restart after 2 s
3.0 V
7.0
Class 1 or 2
Endpoint
Auto restart after 2 s
2.75 V
4.0
Class 1
Endpoint
Auto restart after 2 s
2.5 V
15.4
All class levels
Endpoint
Restart on RST
2.25 V
7.0
Class 1 or 2
Endpoint
Restart on RST
2.0 V
4.0
Class 1
Endpoint
Restart on RST
1.75 V
4.0
Class 1
Midspan
Restart on RST
1.5 V
7.0
Class 1 or 2
Midspan
Restart on RST
1.25 V
15.4
All class levels
Midspan
Restart on RST
1.0 V
4.0
Class 1
Midspan
Auto restart after 2 s
0.5 V
7.0
Class 1 or 2
Midspan
Auto restart after 2 s
< 0.25 V
(pullup resistor only)
15.4
All class levels
Midspan
Auto restart after 2 s
After powerup, the STATUS pin drives the base of a PNP transistor that controls an LED. To maintain an accurate
voltage level at the transistor base, it is recommended that the parallel resistance setting the pin voltage be less
than 1 k.
Rev. 1.2
11
Si3460
4.3. Operating Mode Sequencing
4.3.1. Detection
After powerup and passing the UVLO threshold voltage of 10 V, the Si3460 enters into the detection state, with
FET M2 off and the dc-dc converter disabled so as to generate no output. Prior to turning on the PSE output FET
M2 and enabling the 250 kHz square wave for the dc-dc converter, a valid detection sequence must take place.
According to the IEEE specifications, the detection process consists of sensing a nominal 25 k signature
resistance in parallel with up to 0.15 µF of capacitance. To eliminate the possibility of false detection events, the
Si3460-EVB reference design performs a robust 3-point detection sequence by varying the voltage across the
sense bridge R1, R2, and R3. The fourth leg of the sense bridge is the load that connects to the drain of M2 and
returns to VEE via D8 and L1.
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
At the beginning of the detection sequence, VOUT is at zero output voltage for 250 ms. With a 10 k source
impedance, VOUT is then varied from 4.5 to 7.5 V and then back to 4.5 V for 20 ms at each level. If the PD's
signature resistance is in the RGOOD range of 19 to 26.5 k, the Si3460 proceeds to classification and powerup. If
the PD resistance is not in this range, the detection sequence repeats continuously.
Detection is sequenced approximately every 320 msec and repeats until RGOOD is sensed, indicating a valid PD
has been detected. The STATUS LED (D13) is flashed at the 320 ms rate in synchronization with the detection
process to indicate the PSE is searching for a valid PD.
4.3.2. Classification
After a valid PD is detected, the pass transistor, M2, and the PWM controller are turned on and programmed for an
output voltage of 18 V with a current limit of 75 mA. The current measured during the classification process
determines the class level of the PD. If the class level of the PD is not within the supported level as set by the initial
voltage on the Si3460's STATUS pin (refer to the Operating Mode Configuration section above), an error is
declared and the LED blinks rapidly. This is referred to as classification-based power denial. If the class level is in
the supported range, the Si3460 proceeds to powerup. This is referred to as classification-based power granting.
Classification level is determined according to the current at ISENSE as shown in Table 9.
Table 9. Classification Levels
ISENSE Current
(Nominal)
Classification
Level
Minimum Power
Level
Overload Current
Threshold ICUT (Max)
Overload Current
Limit ILIM (Max)
< 6.5 mA
Class 0
15.4 W
400 mA
450 mA
6.5mA to 14.5 mA
Class 1
4W
98 mA
450 mA
14.5 mA to 23 mA
Class 2
7W
180 mA
450 mA
> 23 mA
Class 3 or 4
15.4 W
400 mA
450 mA
If the classification level is at a greater power than can be supported based on R28 and R30, an error condition is
reported by flashing the LED at a 10 Hz rate for two seconds before the state machine goes back to the detection
cycle.
4.3.3. Classification-Based Current Limiting
Current limits (ICUT)are set based on the classification voltage on the STATUS pin at powerup. Refer to Table 9 for
current limits.
12
Rev. 1.2
Si3460
4.3.4. DC-DC Converter Ramp-Up
After the optional classification sequence, the dc-dc converter is powered up to –50 V with a current limit
corresponding to the values indicated in Table 9. After powerup, power is applied to VOUT as long as there is not an
overcurrent fault, disconnect, or input undervoltage (UVLO) condition. The STATUS LED is continuously lit when
power is applied. If the output power exceeds the level determined by the initial voltage of the STATUS pin, the
Si3460 will declare an error and shut down the port, flashing the LED rapidly to indicate the error (for either two
seconds or until reset as determined by the initial voltage on the STATUS pin).
4.3.5. DC-DC Converter Soft Start
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
The PWM control loop of the dc-dc converter is designed to produce a gradual rise in output voltage to eliminate
any inrush current issues. The nominal set point of the dc-dc converter is –50 V. VOUT at –50 V results in 0.930 V
at the VSENSE pin. It is possible for there to be almost no load on the dc-dc converter; so, the duty cycle is ramped
slowly up to the dc set point. The duty cycle is initially set to zero (dc-dc converter off). Once the desired voltage set
point is reached, the feedback path from VSENSE is enabled, and the converter is allowed to regulate at the
desired set point.
4.3.6. Disconnect
The Si3460 implements a robust disconnect algorithm. If the output current level drops below 7.5 mA (nominal) for
more than 350 ms, the Si3460 will declare a PD disconnect, and the dc-dc converter clock (250 kHz) and FET M1
will be turned off. As set by the initial voltage on the STATUS pin, the Si3460 will then automatically resume the
detection process after 250 ms for "endpoint mode" and two seconds for "midspan mode." The difference in these
two backoff timings is specified by the IEE 802.3af standard for the midspan and endpoint operating modes.
4.3.7. Current Limit Control
The Si3460's overcurrent trip point is determined by the output power set during the classification stage power
granting process. If the output current exceeds the threshold, a timer counts up towards a time-out of 60 ms. If the
current drops below the set threshold, the timer counts down towards zero at 1/16th the rate. If the timer reaches
60 ms, an overcurrent fault is declared, and the channel is shut down by turning off the dc-dc converter clock and
then turning off the FET M1. After an overcurrent fault event, the LED will flash rapidly.
As set by the initial voltage on the STATUS pin at powerup, the Si3460 will then automatically resume the detection
process for "automatic restart configuration" unless the Si3460 is configured in a "restart after a RESET condition"
mode and a fault condition is detected; in that case, the LED will flash rapidly, and the detection process will
automatically start again after 2.2 seconds. Power will not be provided until an open-circuit condition is detected.
Once the Si3460-EVB detects an open-circuit condition (normally by removing the Ethernet cable from the Si3460EVB’s RJ-45 jack labelled “To PD”), the detection process begins, the status LED blinks at the rate of 3 times per
second, and the Si3460 is then allowed to go into classification and powerup mode if a valid PD signature
resistance is detected.
4.3.8. UVLO
The Si3460-EVB reference design is optimized for 12 to 15 V nominal input voltages (11 V min to 16 V maximum).
If the input voltage drops below 10 V in detection mode or if the output voltage drops below 10 V in classification or
powerup mode, a UVLO condition is declared, which generates the error condition (LED flashing rapidly). An
undervoltage event is a fault condition reported through the status LED as a rapid blinking of 10 flashes per
second. The UVLO condition is continuously monitored in all operating states.
4.3.9. Status LED Function
During the normal detection sequence, the STATUS LED flashes at approximately 3 times per second as the
detection process continues. After successful power up, the LED glows continuously. If there is an error condition
(i.e., class level is beyond programmed value, or a fault or over current condition has been detected), the LED
flashes rapidly at 10 times per second). This occurs for two seconds for normal error delay and, in the case of the
"restart after a RESET condition", the LED will flash rapidly, and the detection process will automatically start again
after 2.2 s and power will not be provided until an open circuit condition is detected. Once the Si3460-EVB detects
an open circuit condition, the LED blinks at 3 times per second.
If the Powered Device (PD) is disconnected so that a disconnect event occurs, the LED will start flashing at 3 times
per second once the detect process resumes.
Rev. 1.2
13
Si3460
5. Design Considerations
5.1. Isolation
The Si3460-EVB's PSE output power at VOUT is not isolated from the input power source (VIN). Isolation of PSE
output power requires that the input be isolated from earth ground. Typically, an ac to dc power supply or "wall
wart" is used to provide the 12 V power so the output of this supply is isolated from earth ground.
5.2. External Component Selection
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
Detailed notes on external component selection are provided in the Si3460-EVB User's Guide schematics and
BOM. In general, these recommendations must be followed closely to ensure output power stability and ripple
(power stage components), surge protection (surge protection diode), and overall IEEE 802.3 compliance.
5.3. Input DC Supply
The input power supply should be rated for at least 25% higher power level than the output power level chosen.
This is primarily to account for the 75 to 80% nominal efficiency performance of the Si3460-EVB reference design.
For example, to support a Class 0 PSE, for example, the input supply should be capable of supplying 19.25 W
(15.4 W x 1.25 = 19.25 W).
5.4. STATUS and RESET Interface
To reference the RESET and STATUS pins to system ground, the level shifting method shown in Figure 3 can be
used. Refer to the schematic in the Si3460-EVB document.
+12V
R40
(332 )
R22
(1 k)
R8
(66.5 k)
U1
Si3460
Shunt
Regulator
VDD
STATUS
TLV431
RST
GND
R7
(40.2 k)
1 uF/
6.3 V
+8.7V
Status
Output
RST CONTROL
R*3.3/2.7
405
806
System Gnd
Figure 3. STATUS and RESET Pin Interface when Referenced to System Ground
14
Rev. 1.2
Si3460
6. Si3460 Pin Descriptions
Si3460 pin functionality is described in Table 10. Note that the information applies to the Si3460 device pins, while
the Si3460-EVB User’s Guide describes the inputs and outputs of the evaluation system.
11
11
The electrical characteristics of the Si3460-EVB are summarized in Table 1 on page 5. Refer to the complete
Si3460-EVB schematics and BOM listing for information about the external components needed for the complete
PSE and dc-dc controller application circuit.
1
10
STATUS
CTRL1
2
9
ISENSE
VDD
3
8
RST
CTRL2
4
7
VSENSE
250KHZ
5
6
DETA
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
GATE
11
11
GND
Table 10. Si3460 Pin Functionality
Pin #
Pin Name
Pin Type
1
GATE
Digital output
A logic low on this pin turns on the output FET to enable the PSE
output voltage. Refer to the Si3460-EVB schematics for the circuit
connections between the external FET and this pin.
2
CTRL1
Digital output
The output of this pin is averaged with CTRL2 to control PWM duty
cycle for the dc-dc controller. This output also controls the dc output
for the detection circuitry.
3
VDD
Power
4
CTRL2
Digital output
The output of this pin is averaged with CTRL1 to control PWM duty
cycle for the dc-dc controller. This output also controls the dc output
for the detection circuitry.
Digital output
This is a 250 kHz square wave (50% duty cycle) that is filtered into
a triangular wave signal for the dc-dc controller. The 250 kHz output
on this pin is gated off when it is desired to keep the switcher FET
off.
5
250KHZ
Pin Function
3.3 V power supply input.
6
DETA
Analog input
DETA is an analog input pin. During the detection process, the
CTRL1 and CTRL2 pin duty cycle is varied to generate filtered dc
voltages across a resistive bridge. The null indicator for this bridge
is connected to pin DETA.
7
VSENSE
Analog input
VSENSE is an analog input used for sensing the PSE output voltage.
Rev. 1.2
15
Si3460
Table 10. Si3460 Pin Functionality (Continued)
Pin #
Pin Name
Pin Type
Pin Function
8
RST
Digital input
Active low reset input. When low (to GND), places the Si3460
device into an inactive state. The dc-dc converter is disabled. When
pulled high, the device begins the detection process sequence. The
dc-dc begins to function after a valid RGOOD signature is detected,
indicating a valid PD has been detected.
9
ISENSE
Analog input
ISENSE is an analog input connected to a current sense resistor for
output current sensing.
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
At powerup, the voltage on this pin is sensed to configure the classification level, mid span timing mode, and the device’s restart
behavior when a fault condition is detected. Refer to "4.2. Operating
Mode Configuration" on page 11 and "4.3.9. Status LED Function"
on page 13 for more information. After reading the voltage present
at this pin at powerup, the STATUS pin becomes a digital output
used to control an external LED, which indicates when a detect,
power good, or output fault condition has occurred. A logic low
turns the LED on, and logic high turns the LED off.
16
10
STATUS
Analog in/Digital out
11
GND
GND
Ground connection for the Si3460. This is NOT earth ground.
Refer to the Si3460-EVB schematics for more information.
Rev. 1.2
Si3460
7. Ordering Guide
Ordering Part Number
Firmware
Revision
Description
Package
Information
Ambient
Temperature
Range
Si3460-E02-GM
0.6.7
0.6.8
11-pin,
3 mm 3 mm QFN.
–40 to 85 °C
Si3460-E03-GM
Single-port PSE controller
with integrated dc-dc converter for embedded applications
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
RoHs compliant.
Si3460-EVB
N/A
Si3460 evaluation board
and reference design
Evaluation board
N/A
Notes:
1. Add “R” to part number to denote tape-and-reel option (e.g., Si3460-E03-GMR).
2. The ordering part number above is not the same as the device mark. See"8.3. Device Marking of Production Devices"
on page 21 for more information.
Rev. 1.2
17
Si3460
8. Package Outline: 11-Pin QFN
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
Figure 4 illustrates the package details for the Si3460. Table 11 lists the values for the dimensions shown in the
illustration. The Si3460 is packaged in an industry-standard, 3x3 mm, RoHS-compliant, Pb-free, 11-pin QFN
package.
Figure 4. QFN-11 Package Drawing
Table 11. Package Diagram Dimensions
Dimension
Min
Nom
Max
A
0.80
0.90
1.00
A1
0.03
0.07
0.11
A3
b
0.25 REF
0.18
0.25
D
D2
0.30
3.00 BSC.
1.30
1.35
e
0.50 BSC.
E
3.00 BSC.
1.40
E2
2.20
2.25
2.30
L
.45
.55
.65
aaa
—
—
0.15
bbb
—
—
0.15
ddd
—
—
0.05
eee
—
—
0.08
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC outline MO-243, variation VEED except for
custom features D2, E2, and L which are toleranced per supplier designation.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C
specification for Small Body Components.
18
Rev. 1.2
Si3460
8.1. Solder Paste Mask
0.10 mm
b
0.10 mm
LT
0.50 mm
D4
0.35 mm
0.50 mm
0.30 mm
0.35 mm
L
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
0.20 mm
0.30 mm
D
b
D2
0.20 mm
E2
0.70 mm
e
0.60 mm
0.20 mm
0.30 mm
D4
LB
k
e
E
Figure 5. Solder Paste Mask
Rev. 1.2
19
Si3460
8.2. PCB Landing Pattern
0.10 mm
b
0.10 mm
0.35 mm
D4
LT
0.50 mm
0.30 mm
L
D
b
D2
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
0.20 mm
e
E2
0.20 mm
0.30 mm
D4
LB
k
0.10 mm
e
E
Figure 6. Typical QFN-11 Landing Diagram
20
Rev. 1.2
Si3460
8.3. Device Marking of Production Devices
Line 1 is the part number, line 2 is the lot code, and line 3 is the date code. The part number marking is different for
Si3460-E02 devices and Si3460-E03. The silicon revision letter is the first letter of the lot code ("E" for both Si3460E02 and Si3460-E03 devices). Figure 8 shows how to decode the top side marking.
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
6003
ETTT
YWW+
Figure 7. QFN 11 Top Marking
Table 12. Top Marking Explanation
Line 1 Marking:
Pin 1 Identifier
Circle = 0.25 mm Diameter
Product ID
6003
60 = Si3460; 03 = Firmware Revision 03
Line 2 Marking:
ETTT = Trace Code
Assembly trace code
E = Product revision
TTT = Assembly trace code
Line 3 Marking:
YWW = Date Code
Assigned by the Assembly contractor.
Y = Last Digit of Current Year (ex: 2009 = 9)
WW = Current Work Week
Lead-Free Designator
+
Rev. 1.2
21
Si3460
DOCUMENT CHANGE LIST
Revision 0.4 to Revision 1.0
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
Added Table 1 specification values on page 5.
Updated Table 5 specification values for ICUT limits
on page 8.
Revised “4.3.2. Classification” text description on
page 12.
Added ICUT and ILIM current limits to Table 9 on
page 12.
Added "4.3.3. Classification-Based Current Limiting"
on page 12.
Updated “4.3.4. DC-DC Converter Ramp-Up” text
description on page 13.
Updated “4.3.7. Current Limit Control” text
description on page 13.
Updated "8. Package Outline: 11-Pin QFN" on page
18.
Revision 1.0 to Revision 1.1
Updated "7. Ordering Guide" on page 17.
Updated "8.3. Device Marking of Production
Devices" on page 21.
Updated Figure 7, “QFN 11 Top Marking,” on page
21.
Revision 1.1 to Revision 1.2
22
Added custom watermark.
Rev. 1.2
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
Si3460
NOTES:
Rev. 1.2
23
Si3460
CONTACT INFORMATION
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Pl No
ea t
se Re
C com
on
si me
de n
r S de
i3 d f
46 or
2 N
fo ew
rN D
ew es
D ign
es s.
ig
ns
.
Please visit the Silicon Labs Technical Support web page:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx
and register to submit a technical support request.
Patent Notice
Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analogintensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team.
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized
application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.
Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.
Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.
24
Rev. 1.2