KEY FEATURES
• DSPLL eliminates external VCXO and
analog loop filter components
• Supports JESD204B clocking: DCLK and
SYSREF
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The Si5380 is a high performance, integer-based (M/N) jitter attenuator for small cell
applications which demand the highest level of integration and phase noise performance. Based on Silicon Laboratories’ 4th generation DSPLL™ technology, the Si5380
combines frequency synthesis and jitter attenuation in a highly integrated digital solution that eliminates the need for external VCXO and loop filter components. The fixed
frequency oscillator provides frequency stability for free-run and holdover modes. This
all-digital solution provides superior performance that is highly immune to external
board disturbances such as power supply noise.
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12 Output JESD204B Wireless Jitter Attenuator/ Clock Multiplexor with Ultra-low Phase Noise
D
Si5380 Rev D Data Sheet
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Applications:
• JESD204B clock generation
• Remote Radio Units (RRU), Remote Access Networks (RAN), picocells, small cells
• Wireless base stations (3G, GSM, W-CDMA, 4G/LTE, LTE-A)
• Remote Radio Head (RRH), wireless repeaters, wireless backhaul
• Data conversion sampling clocks (ADC, DAC, DDC, DUC)
• Ultra-low jitter of 65 fs
• Input frequency range:
• Differential: 11.52 MHz to 737.28 MHz
• LVCMOS: 11.52 MHz to 245.76 MHz
• Output frequency range:
• Differential: 480 kHz to 1.47456 GHz
• LVCMOS: 480 kHz to 245.76 MHz
• Status monitoring
• Hitless switching
• Si5380: 4 input, 12 output, 64-QFN 9×9 mm
54 MHz XTAL
XA
XB
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OSC
÷INT
IN1
÷INT
IN2
÷INT
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IN0
R
4 Input
Clocks
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IN3/FB_IN
INT N
DSPLL
INT N
INT N
÷INT
INT N
Status Flags
I2C / SPI
Status Monitor
Control
INT N
NVM
÷INT
OUT0A
÷INT
OUT0
÷INT
OUT1
÷INT
OUT2
÷INT
OUT3
÷INT
OUT4
÷INT
OUT5
÷INT
OUT6
÷INT
OUT7
÷INT
OUT8
÷INT
OUT9
÷INT
OUT9A
Device and
System Clocks
Si5380
1
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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1
Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Ordering Guide
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
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3.2 External Reference (XA/XB)
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.10
3.3 Inputs (IN0, IN1, IN2, IN3/FB_IN) . . . . . . . . .
3.3.1 Input Configuration and Terminations . . . . . .
3.3.2 Manual Input Selection (IN0, IN1, IN2, IN3/FB_IN) .
3.3.3 Automatic Input Switching (IN0, IN1, IN2, IN3/FB_IN)
3.3.4 Hitless Input Switching . . . . . . . . . . .
3.3.5 Ramped Input Switching . . . . . . . . . .
3.3.6 Glitchless Input Switching . . . . . . . . . .
3.3.7 Zero Delay Mode . . . . . . . . . . . . .
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.10
.11
.12
.12
.12
.12
.12
.13
3.4 Fault Monitoring . . . .
3.4.1 Input LOS Detection. .
3.4.2 XA/XB LOS Detection .
3.4.3 OOF Detection . . .
3.4.4 Precision OOF Monitor .
3.4.5 Fast OOF Monitor . .
3.4.6 LOL Detection . . . .
3.4.7 Interrupt Pin INTRb . .
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.14
.14
.14
.15
.15
.15
.16
.17
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.17
.17
.17
.18
.18
.19
.19
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.19
.19
.20
.20
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3.5 Outputs . . . . . . . . . . . . . . . . . . . .
3.5.1 Output Crosspoint . . . . . . . . . . . . . . .
3.5.2 Output Signal Format . . . . . . . . . . . . . .
3.5.3 Output Terminations . . . . . . . . . . . . . . .
3.5.4 Programmable Common Mode Voltage For Differential Outputs
3.5.5 LVCMOS Output Terminations . . . . . . . . . . .
3.5.6 LVCMOS Output Impedance and Drive Strength Selection . .
3.5.7 LVCMOS Output Signal Swing . . . . . . . . . . .
3.5.8 LVCMOS Output Polarity . . . . . . . . . . . . .
3.5.9 Output Enable/Disable . . . . . . . . . . . . . .
3.5.10 Output Disable During LOL . . . . . . . . . . . .
3.5.11 Output Disable During XAXB_LOS . . . . . . . . .
3.5.12 Output Driver State When Disabled . . . . . . . . .
2
D
3.1 Frequency Configuration . . . . . . . . . . .
3.1.1 Si5380 LTE Frequency Configuration . . . . . .
3.1.2 Si5380 Configuration for JESD204B Clock Generation
3.1.3 DSPLL Loop Bandwidth . . . . . . . . . .
3.1.4 Fastlock . . . . . . . . . . . . . . . .
3.1.5 Modes of Operation . . . . . . . . . . . .
3.1.6 Initialization and Reset . . . . . . . . . . .
3.1.7 Freerun Mode . . . . . . . . . . . . . .
3.1.8 Lock Acquisition . . . . . . . . . . . . .
3.1.9 Locked Mode . . . . . . . . . . . . . .
3.1.10 Holdover Mode . . . . . . . . . . . . .
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3. Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2021
6
6
7
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9
2
3.5.13 Synchronous Enable/Disable Feature .
3.5.14 Output Divider (R) Synchronization . .
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.20
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.20
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3.7 In-Circuit Programming .
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3.8 Serial Interface .
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.20
3.9 Custom Factory Preprogrammed Devices .
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.21
3.10 Enabling Features and/or Configuration Settings Not Available in ClockBuilder Pro for Factory
Pre-programmed Devices . . . . . . . . . . . . . . . . . . . . . . . .
.
.21
4. Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
5. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . .
24
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3.6 Power Management . . . .
3.6.1 Power Down Pin (PDNb) .
38
7. Detailed Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . .
39
8. Typical Operating Characteristics (Phase Noise & Jitter) . . . . . . . . . . . . . .
40
9. Pin Description
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
42
10. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
47
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6. Typical Application Diagrams . . . . . . . . . . . . . . . . . . . . . . . .
48
12. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
49
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11. PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . .
50
14. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
51
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13. Device Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2021
3
Si5380 Rev D Data Sheet • Feature List
1. Feature List
The Si5380-D features are listed below:
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• Optional Zero Delay mode
• Independent output clock supply pins: 3.3, 2.5, or 1.8 V
• Core voltage:
• VDD = 1.8 V ±5%
• VDDA = 3.3 V ±5%
• Automatic free-run, lock, and holdover modes
• Programmable jitter attenuation bandwidth: 0.1 Hz to 100 Hz
• Hitless input clock switching
• Status monitoring (LOS, OOF, LOL)
• Serial interface: I2C or SPI In-circuit programmable with nonvolatile OTP memory
• ClockBuilder Pro software simplifies device configuration
• Si5380: 4 input, 12 output, 64-QFN 9×9 mm
• Temperature range: –40 to +85 °C
• Pb-free, RoHS-6 compliant
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• Digital frequency synthesis eliminates external VCXO and
analog loop filter components
• Supports JESD204B clocking: DCLK and SYSREF
• Ultra-low jitter:
• 65 fs typ (12 kHz to 20 MHz)
• Input frequency range:
• Differential: 11.52 MHz to 737.28 MHz
• LVCMOS: 11.52 MHz to 245.76 MHz
• Output frequency range:
• Differential: up to 1.47456 GHz
• LVCMOS: up to 245.76 MHz
• Phase noise floor: –159 dBc/Hz
• Spur performance: –103 dBc max (relative to a 122.88 MHz
carrier)
• Configurable outputs:
• Signal swing: 200 to 3200 mVpp
• Compatible with LVDS, LVPECL
• LVCMOS 3.3, 2.5, or 1.8 V
• Output-output skew using same N-divider: 65 ps (Max)
4
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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4
Si5380 Rev D Data Sheet • Ordering Guide
2. Ordering Guide
Table 2.1. Ordering Guide
Number of
Outputs
Output Clock
Frequency
Range
Package
RoHS-6, Pb-Free
12
0.480 MHz to
1464.56 MHz
64-Lead 9x9 mm QFN
Yes
Si5380A-D-GM
Si5380-D-EVB
Evaluation Board
Temperature
Range
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Ordering Part Number
–40 to +85 °C
Figure 2.1. Ordering Part Number Fields
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D
Note:
1. Add an “R” at the end of the device to denote tape and reel options.
2. Custom, factory pre-programmed devices are available. Ordering part numbers are assigned by ClockBuilder Pro. Part number
format is: Si5380A-Dxxxxx-GM, where “xxxxx” is a unique numerical sequence representing the pre-programmed configuration.
5
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2021
5
Si5380 Rev D Data Sheet • Functional Description
3. Functional Description
The Si5380 is a high performance clock generator that is capable of synthesizing up to 10 unique integer related frequencies at any of
the device’s 12 outputs. The output clocks can be generated in free-run mode or synchronized to any one of the four external inputs.
Clock generation is provided by Silicon Laboratories’ 4th generation DSPLL technology which combines frequency synthesis and jitter
attenuation in a highly integrated digital solution that eliminates the need for external VCXO and loop filter components. The Si5380
device is fully configurable using the I2C or SPI serial interface and has in-circuit programmable non-volatile memory.
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3.1 Frequency Configuration
D
The DSPLL provides the synthesis for generating the output clock frequencies which are synchronous to the selected input clock
frequency or free-running XTAL. It consists of a phase detector, a programmable digital loop filter, a high-performance ultra-low phase
noise analog 15 GHz VCO, and a user configurable feedback divider. An internal oscillator (OSC) provides the DSPLL with a stable
low-noise clock source for frequency synthesis and for maintaining frequency accuracy in the free-run or holdover modes. The oscillator
simply requires an external, low cost 54 MHz fundamental mode crystal to operate. No other external components are required for
frequency generation. A key feature of this DSPLL is that it provides immunity to external noise coupling from power supplies and other
uncontrolled noise sources that normally exist on printed circuit boards.
3.1.1 Si5380 LTE Frequency Configuration
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The device’s frequency configuration is fully programmable through the serial interface and can also be stored in non-volatile memory.
The combination of flexible integer dividers and a high frequency VCO allows the device to generate multiple output clock frequencies
for applications that require ultra-low phase noise and spurious performance. At the core of the device are the N dividers which
determine the number of unique frequencies that can be generated from the device. The table below shows a list of some possible
output frequencies for LTE applications. The Si5380’s DSPLL core can generate up to five unique top frequencies. These frequencies
are distributed to the output dividers using a configurable crosspoint mux. The R dividers allow further division for up to 10 unique integer-ratio related frequencies on the Si5380. The ClockBuilder Pro software utility provides a simple means of automatically calculating
the optimum divider values (P, M, N and R) for the frequencies listed in the table below.
6
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2021
6
Si5380 Rev D Data Sheet • Functional Description
Table 3.1. Example of Possible LTE Clock Frequencies
LTE Device Clock Frequencies Fout (MHz)2
15.36
15.36
19.20
19.20
30.72
30.72
38.40
38.40
61.44
61.44
76.80
76.80
122.88
122.88
153.60
153.60
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FIN (MHz)1
184.32
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184.32
245.76
245.76
307.20
307.20
368.64
368.64
614.40
737.28
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—
491.52
fo
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491.52
614.40
737.28
983.04
—
1228.80
—
1474.56
Note:
1. The Si5380 locks to any one of the frequencies listed in the FIN column and generates LTE device clock frequencies.
2. R output dividers allow other frequencies to be generated. These are useful for applications like JESD204B SYSREF clocks.
om
3.1.2 Si5380 Configuration for JESD204B Clock Generation
The Si5380 supports JESD204B Subclass 0 and Subclass 1 DCLK/SYSREF clock generation. For Subclass 1, the Si5380 only supports applications that require phase matched DCLK/SYSREF pairs. DCLK/SYSREF should be generated from the same Multisynth.
ec
For new designs and any applications that require phase adjust capability between DCLK and SYSREF, use the Si5386 wireless jitter
attenuator. For more information, refer to AN1165.
R
3.1.3 DSPLL Loop Bandwidth
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The DSPLL loop bandwidth determines the amount of input clock jitter attenuation. Register configurable DSPLL loop bandwidth
settings in the range of 0.1 Hz to 100 Hz are available for selection. The DSPLL will always remain stable with less than 0.1 dB of
peaking regardless of the DSPLL loop bandwidth selection.
3.1.4 Fastlock
Selecting a low DSPLL loop bandwidth (e.g., 1 Hz) will generally lengthen the lock acquisition time. The fastlock feature allows setting
a temporary fastlock loop bandwidth that is used during the lock acquisition process. Higher fastlock loop bandwidth settings will enable
the DSPLL to lock faster. Once lock acquisition has completed, the DSPLL’s loop bandwidth will automatically revert to the DSPLL Loop
Bandwidth setting. Fastlock loop bandwidth settings in the range of 100 Hz to 4 kHz are available for selection. The fastlock feature can
be enabled or disabled by register configuration.
7
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Rev. 1.1 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2021
7
Si5380 Rev D Data Sheet • Functional Description
3.1.5 Modes of Operation
Once initialization is complete, the Si5380 operates in one of four modes: Free-run Mode, Lock Acquisition Mode, Locked Mode, or
Holdover Mode. A state diagram showing the modes of operation is shown in the figure below. The following sections describe each of
these modes in greater detail.
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Power-Up
Reset and
Initialization
No valid
input clocks
selected
Valid input clock
selected
Lock Acquisition
(Fast Lock)
Locked
Mode
Holdover
Mode
Input Clock
Switch
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No valid input
clocks available
for selection
Phase lock on
selected input
clock is achieved
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An input is
qualified and
available for
selection
D
Free-run
Selected input
clock fails
Yes
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Yes
No
Holdover
History
Valid?
Other Valid
Clock Inputs
No Available?
Figure 3.1. Modes of Operation
3.1.6 Initialization and Reset
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When power is applied, the device begins an initialization period where it downloads default register values and configuration data
from NVM and performs other initialization tasks. Communicating with the device through the serial interface is possible once this
initialization period is complete. No clocks will be generated until the initialization is complete. There are two types of resets available. A
hard reset is functionally similar to a device power-up. All registers will be restored to the values stored in NVM and all circuits, including
the serial interface, will be restored to their initial state. A hard reset is initiated using the RSTb pin or by asserting the hard reset bit. A
soft reset bypasses the NVM download. It is simply used to initiate register configuration changes.
R
3.1.7 Freerun Mode
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Once power is applied to the Si5380 and initialization is complete, the device will automatically enter freerun mode. Output clocks
will be generated on the outputs with their configured frequencies. The frequency accuracy of the generated output clocks in freerun
mode is dependent on the frequency accuracy of the external crystal or reference clock on the XA/XB pins. For example, if the crystal
frequency is ±100 ppm, then all the output clocks will be generated at their configured frequency ±100 ppm in freerun mode. Any
change or drift of the crystal frequency or external reference on the XA/XB pins will be tracked at the output clock frequencies.
3.1.8 Lock Acquisition
If a valid input clock is selected for synchronization, the DSPLL will automatically start the lock acquisition process. If the fast lock
feature is enabled, the DSPLL will acquire lock using the Fastlock Loop Bandwidth setting and then transition to the DSPLL Loop
Bandwidth setting when lock acquisition is complete. During lock acquisition the outputs will generate a clock that follows the VCO
frequency change as it pulls-in to the input clock frequency.
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Si5380 Rev D Data Sheet • Functional Description
3.1.9 Locked Mode
Once lock is achieved, the Si5380 will generate output clocks that are both frequency and phase locked to the input clock. The DSPLL
will provide jitter attenuation of the input clock using the selected DSPLL loop bandwidth. At this point, any XTAL frequency drift inside
of the loop bandwidth will not affect the output frequencies. When lock is achieved, the LOLb pin will output a logic high level. The LOL
status bit and LOLb status pin will also indicate that the DSPLL is locked. See the 3.4.6 LOL Detection section for more details on LOLb
detection time.
es
ig
ns
3.1.10 Holdover Mode
Clock Failure
and Entry into
Holdover
time
fo
r
Historical Frequency Data Collected
N
ew
Figure 3.2. Programmable Holdover Window
D
The DSPLL will automatically enter holdover mode when the selected input clock becomes invalid and no other valid input clocks are
available for selection. The DSPLL uses an averaged input clock frequency as its final holdover frequency to minimize the disturbance
of the output clock phase and frequency when an input clock suddenly fails. The holdover circuit stores up to 120 seconds of historical
frequency data while the DSPLL is locked to a valid clock input. The final averaged holdover frequency value is calculated from a
programmable window within the stored historical frequency data. Both the window size and the delay are programmable as shown in
the figure below. The window size determines the amount of holdover frequency averaging. The delay value allows ignoring frequency
data that may be corrupt just before the input clock failure.
Programmable historical data window
used to determine the final holdover value
m
en
de
d
120 seconds
Programmable delay
0
When entering holdover, the DSPLL will pull the output clock frequencies referred to the calculated averaged holdover frequency. While
in holdover, the output frequency drift is entirely dependent on the external crystal or external reference clock connected to the XA/XB
pins. If a new clock input becomes valid, the DSPLL will automatically exit the holdover mode and re-acquire lock to the new input
clock. This process involves pulling the output clock frequencies to achieve frequency and phase lock with the new input clock. This
pull-in process is glitchless and its rate is controlled by the DSPLL bandwidth and the Fastlock bandwidth. These options are register
programmable.
ec
om
The DSPLL output frequency when exiting holdover can be ramped (recommend). Just before the exit is initiated, the difference
between the current holdover frequency and the new desired frequency is measured. Using the calculated difference and a user-selectable ramp rate, the output is linearly ramped to the new frequency. The ramp rate can be 0.2 ppm/s, 40,000 ppm/s, or any of about 40
values in between. The DSPLL loop BW does not limit or affect ramp rate selections (and vice versa). CBPro defaults to ramped exit
from holdover. The same ramp rate settings are used for both exit from holdover and ramped input switching. For more information on
ramped input switching, see 3.3.5 Ramped Input Switching.
N
ot
R
Note: If ramped holdover exit is not selected, the holdover exit is governed either by (1) the DSPLL loop BW or (2) a user-selectable
holdover exit BW.
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Si5380 Rev D Data Sheet • Functional Description
3.2 External Reference (XA/XB)
es
ig
ns
An external crystal (XTAL) is used in combination with the internal oscillator (OSC) to produce an ultra-low phase noise reference
clock for the DSPLL and for providing a stable reference for the free-run and holdover modes. A simplified diagram is shown in the
figure below. The Si5380 includes internal XTAL loading capacitors which eliminates the need for external capacitors and also has
the benefit of reduced noise coupling from external sources. Refer to the Table 5.12 Crystal Specifications on page 35 for crystal
specifications. A crystal frequency of 54 MHz is required, with a total accuracy of ±100 ppm* recommended for best performance.
The Si5380 includes built-in XTAL load capacitors (CL) of 8 pF, which are switched out of the circuit when using an external XO. The
Si5380 Reference Manual provides additional information on PCB layout recommendations for the crystal to ensure optimum jitter
performance. To achieve optimal jitter performance and minimize BOM cost, a crystal is recommended on the XA/XB reference input.
A clock (e.g., XO) may be used in lieu of the crystal, but it may result in higher output jitter. See the Si5380 Reference Manual for
more information. Selection between the external XTAL or REFCLK is controlled by register configuration. The internal crystal loading
capacitors (CL) are disabled in this mode. It is important to note that when using the REFCLK option the phase noise of the outputs
is directly affected by the phase noise of the external XO reference. Refer to the Table 5.3 Input Clock Specifications on page 26 for
REFCLK requirements when using the REFCLK mode.
D
Note: Including initial frequency tolerance and frequency variation over the full operating temperature range, voltage range, load
conditions, and aging.
25-54 MHz
XO/Clock
LVCMOS
XA
2xCL
X1
0.1 uf
nc
om
2xCL
OSC
Differential XO/Clock
Connection
÷ PREF
R2
R1
0.1 uf
nc
X1
XA
2xCL
÷ PREF
Crystal Resonator
Connection
50
XB
2xCL
OSC
50
0.1 uf
m
en
de
d
XB
Note: See Pin
Descriptions for
X1/X2 connections
fo
r
0.1 uf
25-54 MHz
XTAL
X2
0.1 uf
N
ew
25-54 MHz
XO/Clock
0.1 uf
XB
X2
C1 is recommended to
increase the slew rate
at Xa
C1
See the Reference Manual for the
recommended R1, R2, C1 values
nc
2xCL
nc
X1
XA
X2
2xCL
OSC
÷ PREF
LVCMOS XO/Clock
Connection
ec
Figure 3.3. XAXB Crystal Resonator and External Reference Clock Connection Options
R
Note: See Table 5.3 Input Clock Specifications on page 26 and the Si5380-D Reference Manual for more information.
3.3 Inputs (IN0, IN1, IN2, IN3/FB_IN)
N
ot
Four clock inputs are available to synchronize the DSPLL. The inputs are compatible with both single-ended and differential signals.
Input selection can be manual (pin or register controlled) or automatic with definable priorities.
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Si5380 Rev D Data Sheet • Functional Description
3.3.1 Input Configuration and Terminations
Each of the inputs can be configured as differential or single-ended LVCMOS. The recommended input termination schemes are
shown in the figure below. Standard 50% duty cycle signals must be ac-coupled, while low duty cycle Pulsed CMOS signals can be
dc-coupled. Unused inputs can be disabled and left unconnected when not in use.
50
INx
Standard
100
INxb
50
LVDS, LVPECL,
CML
Pulsed CMOS
D
Note: See Table 5.3 for input clock specifications
C1
R1
50
N
ew
Standard AC-Coupled LVCMOS (IN0-IN3)
RS
INx
R2
Standard
INxb
fo
r
3.3V, 2.5V, 1.8V
LVCMOS
es
ig
ns
Standard AC-Coupled Differential (IN0-IN3)
Pulsed CMOS
m
en
de
d
Note: (1) When 3.3V LVCMOS driver is present, C1, R1 and R2 may be needed to keep
the signal at INx < 3.6 Vpp_se. See the reference manual for details.
(2) RS matches the CMOS driver to a 50 ohm transmission line (if used)
(3) See Table 5.3 for input clock specifications.
Pulsed CMOS DC Coupled Single Ended (only for Frequencies < 1MHz)
RS
R1
om
50
R2
Standard
INxb
Pulsed CMOS
Note: (1) See the reference manual for details on R1 and R2
(2) RS matches the CMOS driver to a 50 ohm transmission line (if used)
(3) See Table 5.3 for input clock specifications.
Figure 3.4. Termination of Differential and LVCMOS Input Signals
N
ot
R
ec
3.3V, 2.5V, 1.8V
LVCMOS
INx
Note: See Table 5.3 Input Clock Specifications on page 26 and the Si5380-D Reference Manual for more information.
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Si5380 Rev D Data Sheet • Functional Description
3.3.2 Manual Input Selection (IN0, IN1, IN2, IN3/FB_IN)
Input clock selection can be made manually using the IN_SEL[1:0] pins or through a register. A register bit determines input selection
as pin selectable or register selectable. The IN_SEL pins are selected by default. If there is no clock signal on the selected input, the
device will automatically enter free-run or holdover mode.
Table 3.2. Manual Input Selection Using IN_SEL[1:0] Pins
IN_SEL[1:0]
es
ig
ns
* NOTE: When the zero delay mode is enabled, IN3 becomes the feedback input (FB_IN) and is not available for selection as a clock
input.
Selected Input
0
1
1
0
1
1
IN0
IN1
IN2
D
0
IN3*
N
ew
0
3.3.3 Automatic Input Switching (IN0, IN1, IN2, IN3/FB_IN)
fo
r
An automatic input selection state machine is available in addition to the manual switching option. In automatic mode, the selection
criteria is based on reference qualification, input priority, and the revertive option. Only references which are valid can be selected
by the automatic state machine. If there are no valid references available, the DSPLL will enter the holdover mode. With revertive
switching enabled, the highest priority input with a valid reference is always selected. If an input with a higher priority becomes valid,
then an automatic switchover to that input will be initiated. With non-revertive switching, the active input will always remain selected
while it is valid. If it becomes invalid, an automatic switchover to a valid input with the highest priority will be initiated.
3.3.4 Hitless Input Switching
m
en
de
d
Hitless switching is a feature that prevents a phase transient from propagating to the output when switching between two frequency
locked clock inputs that have a fixed phase difference between them. A hitless switch can only occur when the two input frequencies
are frequency locked meaning that they have to be exactly at the same frequency, or have an integer frequency relationship to
each other. When this feature is enabled, the DSPLL simply absorbs the phase difference between the two input clocks during an
input switch. When disabled (glitchless switching), the phase difference between the two inputs is propagated to the output at a rate
determined by the DSPLL loop bandwidth.
3.3.5 Ramped Input Switching
ec
om
When switching between two plesiochronous input clocks (i.e., the frequencies are "almost the same" but not quite), ramped input
switching should be enabled to ensure a smooth transition between the two inputs. Ramped input switching avoids frequency transients
and overshoot when switching between frequencies and so is the default switching mode in CBPro. The feature should be turned
off when switching between input clocks that are always frequency locked (i.e., are always the same exact frequency). The same
ramp rate settings are used for both holdover exit and clock switching. For more information on ramped exit from holdover, see
3.1.10 Holdover Mode.
3.3.6 Glitchless Input Switching
N
ot
R
The DSPLL has the ability of switching between two input clocks that are up to 40 ppm apart in frequency. The DSPLL will pull-in to the
new frequency using the DSPLL loop bandwidth or using the Fastlock loop bandwidth if it is enabled. The loss of lock (LOL) indicator
will be asserted while the DSPLL is pulling-in to the new clock frequency. There will be no output runt pulses generated at the output.
Glitchless input switching is available regardless of whether the hitless switching feature is enabled or disabled.
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Si5380 Rev D Data Sheet • Functional Description
3.3.7 Zero Delay Mode
Si5380
÷P0
DSPLL
÷P1
IN2
PD
÷P2
IN2b
LPF
÷M
IN3/FB_IN
100
÷P3
÷5
N
ew
IN1
IN1b
D
IN0
IN0b
es
ig
ns
A zero delay mode is available for applications that require fixed and consistent minimum delay between the selected input and outputs.
The zero delay mode is configured by opening the internal feedback loop through software configuration and closing the loop externally
as shown in the figure below. All outputs that come from the same N divider that is used as the feedback clock will meet zero delay
mode input-to-output delay specifications. This helps to cancel out the internal delay introduced by the dividers, the crosspoint, the
input, and the output drivers. Any one of the outputs can be fed back to the IN3/FB_IN pins, although using the output driver that
achieves the shortest trace length will help to minimize the input-to-output delay. The OUT9A and IN3/FB_IN pins are recommended
for the external feedback connection. The FB_IN input pins must be terminated and ac-coupled when zero delay mode is used. A
differential external feedback path connection is necessary for best performance. The order of the OUT9A and FB_IN polarities is such
that they may be routed on the device side of the PCB without requiring vias or needing to cross each other.
VDDO0
IN3b/FB_INb
t0
÷N1
t1
÷N2
t2
÷N3
t3
÷N4
t4
OUT0A
OUT0Ab
÷R0
OUT0
OUT0b
÷R2
VDDO2
OUT2
OUT2b
÷R8
VDDO8
OUT8
OUT8b
÷R9
OUT9
OUT9b
÷R9A
OUT9A
OUT9Ab
VDDO9
External Feedback Path
Figure 3.5. Si5380 Zero Delay Mode Set-up
N
ot
R
ec
om
m
en
de
d
fo
r
÷N0
÷R0A
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Si5380 Rev D Data Sheet • Functional Description
3.4 Fault Monitoring
All four input clocks (IN0, IN1, IN2, IN3/FB_IN) are monitored for loss of signal (LOS) and out-of-frequency (OOF) as shown in the
figure below. The reference at the XA/XB pins is also monitored for LOS since it provides a critical reference clock for the DSPLL. The
DSPLL also has a Loss Of Lock (LOL) indicator, which is asserted when the DSPLL has lost synchronization with the selected input
clock.
es
ig
ns
XA XB
Si5380
OSC
IN1
IN1b
IN2
IN2b
IN3/FB_IN
IN3b/FB_INb
LOS
OOF
Precision
Fast
÷P1
LOS
OOF
Precision
Fast
÷P2
LOS
OOF
Precision
Fast
÷P3
LOS
OOF
LOS
XAXB
DSPLL
LOL
PD
D
IN0b
÷P0
LPF
N
ew
IN0
Feedback
Clock
Precision
Fast
÷M
÷5
fo
r
Figure 3.6. Si5380 Fault Monitors
3.4.1 Input LOS Detection
m
en
de
d
The loss of signal monitor measures the period of each input clock cycle to detect phase irregularities or missing clock edges. Each of
the input LOS circuits have their own programmable sensitivity which allows ignoring missing edges or intermittent errors. Loss of signal
sensitivity is configurable using the ClockBuilder Pro utility. The LOS status for each of the monitors is accessible by reading a status
register. The live LOS register always displays the current LOS state and a sticky register always stays asserted until cleared. An option
to disable any of the LOS monitors is also available.
Monitor
LOS
LOS
LOS
Live
Figure 3.7. LOS Status Indicators
ec
om
en
Sticky
3.4.2 XA/XB LOS Detection
N
ot
R
An LOS monitor is available to ensure that the external crystal or reference clock is valid. By default, the output clocks are disabled
when XAXB LOS is detected. This feature can be disabled such that the device will continue to produce output clocks when XAXB LOS
is detected. See the 3.5.11 Output Disable During XAXB_LOS section for details.
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Si5380 Rev D Data Sheet • Functional Description
3.4.3 OOF Detection
Each input clock is monitored for frequency accuracy with respect to a OOF reference which it considers as its “0_ppm” reference. This
OOF reference can be selected as either: XAXB, IN0, IN1, IN2 or IN3. IN3 is only available as the OOF reference when not in ZDM.
The final OOF status is determined by the combination of both a precise OOF monitor and a fast OOF monitor as shown in the figure
below. An option to disable either monitor is also available. The live OOF register always displays the current OOF state, and its sticky
register bit stays asserted until cleared.
Sticky
en
Precision
OOF
es
ig
ns
Monitor
LOS
OOF
Fast
Live
en
D
Figure 3.8. OOF Status Indicator
3.4.4 Precision OOF Monitor
OOF Declared
Hysteresis
OOF Cleared
-4 ppm
(Clear)
0 ppm
OOF
Reference
m
en
de
d
-6 ppm
(Set)
fo
r
N
ew
The Precision OOF monitor circuit measures the frequency of all input clocks to within ±1 ppm accuracy with respect to the frequency
at the XA/XB pins. The OOF monitor considers the frequency at the XA/XB pins as its 1/16 ppm OOF reference. A valid input frequency
is one that remains within the OOF frequency range which is register configurable up to ±500 ppm in steps of 1/16 ppm. A configurable
amount of hysteresis is also available to prevent the OOF status from toggling at the failure boundary. An example is shown in the
figure below. In this case the OOF monitor is configured with a valid frequency range of ±6 ppm and with 2 ppm of hysteresis. An
option to use one of the input pins (IN0–IN3) as the 0 ppm OOF reference instead of the XA/XB pins is available. This option is register
configurable.
fIN
Hysteresis
+4 ppm
(Clear)
+6 ppm
(Set)
Figure 3.9. Example of Precise OOF Monitor Assertion and De-assertion Triggers
3.4.5 Fast OOF Monitor
N
ot
R
ec
om
Because the precision OOF monitor needs to provide 1/16 ppm of frequency measurement accuracy, it must measure the monitored
input clock frequencies over a relatively long period of time. This may be too slow to detect an input clock that is quickly ramping
in frequency. An additional level of OOF monitoring called the Fast OOF monitor runs in parallel with the precision OOF monitors to
quickly detect a ramping input frequency. The Fast OOF monitor asserts OOF on an input clock frequency that has changed by 1,000 to
16,000 ppm.
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Si5380 Rev D Data Sheet • Functional Description
3.4.6 LOL Detection
LOL Monitor
RS Latch
LOL
Clear
Timer
Reset
Sticky
LOL
LOL
Q
Live
LOL
Set
Set
es
ig
ns
A loss of lock (LOL) monitor asserts the LOL bit when the DSPLL has lost synchronization with the selected input clock. There is
also a dedicated active-low LOLb pin which reflects the loss of lock condition. The LOL monitor measures the frequency difference
between the input and feedback clocks at the phase detector. There are two LOL frequency monitors, one that sets the LOL indicator
(LOL Set) and another that clears the indicator (LOL Clear). A block diagram of the LOL monitor is shown in the figure below. The live
LOL register always displays the current LOL state and a sticky register always stays asserted until cleared. The LOLb pin reflects the
current state of the LOL monitor.
D
LOLb
DSPLL
PD
LPF
÷M
÷5
Si5380
fo
r
Feedback
Clock
N
ew
fIN
Figure 3.10. LOL Status Indicators
m
en
de
d
Each of the frequency monitors have adjustable sensitivity which is register configurable from 0.1 ppm to 10,000 ppm. Having two
separate frequency monitors allows for hysteresis to help prevent chattering of LOL status. An example configuration where LOCK is
indicated when there is less than 0.1 ppm frequency difference at the inputs of the phase detector and LOL is indicated when there is
more than 1 ppm frequency difference is shown in the figure below.
Clear LOL
Threshold
Set LOL
Threshold
Lock Acquisition
om
LOL
Hysteresis
Lost Lock
R
ec
LOCKED
0
0.1
1
10,000
Phase Detector Frequency Difference (ppm)
Figure 3.11. LOL Set and Clear Thresholds
N
ot
An optional timer is available to delay clearing of the LOL indicator to allow additional time for the DSPLL to completely phase lock
to the input clock. The timer is also useful to prevent the LOL indicator from toggling or chattering as the DSPLL completes lock
acquisition. The configurable delay value depends on frequency configuration and loop bandwidth of the DSPLL and is automatically
calculated using the ClockBuilder Pro utility.
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Si5380 Rev D Data Sheet • Functional Description
3.4.7 Interrupt Pin INTRb
An interrupt pin INTRb indicates a change in state of the status indicators shown in the figure below. All of the status indicators are
maskable to prevent assertion of the interrupt pin. The state of the INTRb pin is reset by clearing the status register that caused
the interrupt. The sticky version of the fault monitors is used for this function to ensure that the fault condition is still available when
responding to the interrupt.
es
ig
ns
Si5380
LOS_FLG 0x0012[0]
IN0
OOF_FLG 0x0012[4]
LOS_FLG 0x0012[1]
IN1
D
OOF_FLG 0x0012[5]
IN2
OOF_FLG 0x0012[6]
LOS_FLG 0x0012[3]
IN3
LOL_FLG 0x0013[1]
HOLD_FLG 0x0013[5]
INTRb
fo
r
OOF_FLG 0x0012[7]
N
ew
LOS_FLG 0x0012[2]
PLL
m
en
de
d
CAL_FLG 0x0014[5]
SYSINCAL_FLG 0x0011[0]
LOSXAXB_FLG 0x0011[1]
LOSREF_FLG 0x0011[2]
Device
XAXB_ERR_FLG 0x0011[3]
Figure 3.12. Interrupt Triggers and Masks
ec
om
SMBUS_TIMEOUT_FLG 0x0011[5]
3.5 Outputs
R
The Si5380 supports 12 differential output drivers which can be independently configured as differential or LVCMOS.
N
ot
3.5.1 Output Crosspoint
The output crosspoint allows any of the N dividers to connect to any of the clock outputs.
3.5.2 Output Signal Format
The differential output amplitude and common mode voltage are both fully programmable covering a wide variety of signal formats
including LVPECL, LVDS, HCSL, and CML. In addition to supporting differential signals, any of the outputs can be configured as
LVCMOS (3.3 V, 2.5 V, or 1.8 V) drivers providing up to 24 single-ended outputs, or any combination of differential and single-ended
outputs.
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Si5380 Rev D Data Sheet • Functional Description
3.5.3 Output Terminations
The output drivers support both ac-coupled and dc-coupled terminations as shown in the following figure.
DC Coupled LVDS/LVPECL
LVDS: VDDO = 3.3V, 2.5V, 1.8V
LVPECL: VDDO = 2.5V, 1.8V
es
ig
ns
50
OUTx
100
OUTxb
50
Si5380
AC Coupled LVDS/LVPECL
D
VDDO = 3.3V, 2.5V, 1.8V
50
OUTx
50
Si5380
N
ew
100
OUTxb
Internally
self-biased
AC Coupled LVPECL/CML
fo
r
VDD – 1.3V
VDDO = 3.3V, 2.5V
50
50
50
OUTx
m
en
de
d
OUTxb
50
Si5380
AC Coupled HCSL
VDDRX
VDDO = 3.3V, 2.5V, 1.8V
R1
om
OUTx
R
ec
Si5380
OUTxb
R1
50
50
R2
R2
Standard
HCSL
Receiver
Note: See Si5380 Rev D Family Reference Manual for Resitor Values
Figure 3.13. Supported Output Terminations
N
ot
3.5.4 Programmable Common Mode Voltage For Differential Outputs
The common mode voltage (VCM) for the differential modes is programmable and depends on the voltage available at the output’s
VDDO pin. Setting the common mode voltage is useful when dc-coupling the output drivers.
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Si5380 Rev D Data Sheet • Functional Description
3.5.5 LVCMOS Output Terminations
LVCMOS outputs are dc-coupled with source-side series termination as shown in the figure below.
DC-Coupled LVCMOS
50
OUTx
Rs
OUTxb
50
Si5380
Rs
Figure 3.14. LVCMOS Output Terminations
3.5.6 LVCMOS Output Impedance and Drive Strength Selection
N
ew
D
Note: See the Si5380-D Reference Manual for resistor values.
es
ig
ns
3.3V, 2.5V, 1.8V
LVCMOS
VDDO = 3.3V, 2.5V, 1.8V
Each LVCMOS driver has a configurable output impedance to accommodate different trace impedances and drive strengths. A
source termination resistor is recommended to help match the selected output impedance to the trace impedance. There are three
programmable output impedance selections for each VDDO options as shown in the table below.
VDDO
fo
r
Table 3.3. Typical Output Impedance (ZS)
CMOS_DRIVE_Selection
OUTx_CMOS_DRV = 2
m
en
de
d
OUTx_CMOS_DRV = 1
3.3 V
2.5 V
1.8 V
OUTx_CMOS_DRV = 3
38 Ω
30 Ω
22 Ω
43 Ω
35 Ω
24 Ω
—
46 Ω
31 Ω
3.5.7 LVCMOS Output Signal Swing
om
The signal swing (VOL/VOH) of the LVCMOS output drivers is set by the voltage on the VDDO pins. Each output driver has its own
VDDO pin allowing a unique output voltage swing for each of the LVCMOS drivers. OUT0 and OUT0A share the same VDDO pin.
OUT9 and OUT9A also share the VDDO pin. All other outputs have their own individual VDDO pins.
3.5.8 LVCMOS Output Polarity
R
ec
When a driver is configured as an LVCMOS output it generates a clock signal on both pins (OUTx and OUTxb). By default the clock
on the OUTxb pin is generated with the same polarity (in phase) with the clock on the OUTx pin. The polarity of these clocks is
configurable enabling complimentary clock generation and/or inverted polarity with respect to other output drivers.
3.5.9 Output Enable/Disable
N
ot
The OEb pin provides a convenient method of disabling or enabling all of the output drivers at the same time. When the OEb pin is held
high all outputs will be disabled. When held low, the outputs will all be enabled. Outputs in the enabled state can still be individually
disabled through register control.
3.5.10 Output Disable During LOL
By default, a DSPLL that is out of lock will generate either free-running clocks or generate clocks in holdover mode. There is an option
to disable the outputs when a DSPLL is LOL. This option can be useful to force a downstream PLL into holdover.
19
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Si5380 Rev D Data Sheet • Functional Description
3.5.11 Output Disable During XAXB_LOS
3.5.12 Output Driver State When Disabled
The disabled state of an output driver is configurable as either disable low or disable high.
3.5.13 Synchronous Enable/Disable Feature
es
ig
ns
The internal oscillator circuit (OSC) in combination with the external crystal (XTAL) provides a critical function for the operation of the
DSPLLs. In the event of a crystal failure, the device will assert an XAXB_LOS alarm. By default, all outputs will be disabled during
assertion of the XAXB_LOS alarm. There is an option to leave the outputs enabled during an XAXB_LOS alarm, but the frequency
accuracy and stability will be indeterminate during this fault condition.The internal oscillator circuit (OSC) in combination with the
external crystal (XTAL) provides a critical function for the operation of the DSPLLs. In the event of a crystal failure, the device will assert
an XAXB_LOS alarm. By default, all outputs will be disabled during assertion of the XAXB_LOS alarm. There is an option to leave the
outputs enabled during an XAXB_LOS alarm, but the frequency accuracy and stability will be indeterminate during this fault condition.
N
ew
D
The output drivers provide a selectable synchronous enable/disable feature. Output drivers with synchronous disable active will wait
until a clock period has completed before the driver is disabled or enabled. This prevents unwanted shortened pulses from occurring
when enabling or disabling an output. When this feature is turned off, the output clock will disable immediately without waiting for the
clock period to complete.
3.5.14 Output Divider (R) Synchronization
All the output R dividers are reset to a known state during the power-up initialization period. This ensures consistent and repeatable
phase alignment across all output drivers. Resetting the device using the RSTb pin or asserting the reset bit will have the same result.
fo
r
3.6 Power Management
Unused inputs and output drivers can be powered down when unused. Consult the Si5380 Reference Manual and ClockBuilder Pro
configuration utility for details.
m
en
de
d
3.6.1 Power Down Pin (PDNb)
A power down pin is provided to force the device in a low power mode. The device’s configuration will be maintained but no output
clocks will be generated. Most of the internal blocks will be shut down but device communication via the serial interface will still be
available. When the PDNb pin is pulled low the outputs will shut down without glitching (the clock’s complete period will be generated
before shutting down). When PDNb is released the device will start generating clocks without glitches. The device will generate
free-running clocks until the DSPLL has acquired lock to the selected input clock source.
3.7 In-Circuit Programming
ec
om
The Si5380 is fully configurable using the serial interface (I2C or SPI). At power-up, the device downloads its default register values
from internal non-volatile memory (NVM). Application specific default configurations can be written into NVM allowing the device to
generate specific clock frequencies at power-up. Writing default values to NVM is in-circuit programmable with normal operating power
supply voltages applied to its VDD and VDDA pins. The NVM is writable two times. Once a new configuration has been written to NVM,
the old configuration is no longer accessible. Refer to the Si5380 Reference Manual for a detailed procedure for writing registers to
NVM.
R
3.8 Serial Interface
N
ot
Configuration and operation of the Si5380 is controlled by reading and writing registers using the I2C or SPI interface. The I2C_SEL pin
selects I2C or SPI operation. The Si5380 supports communication with a 3.3 V or 1.8 V host by setting the IO_VDD_SEL configuration
bit. The SPI mode supports 4-wire or 3-wire by setting the SPI_3WIRE configuration bit. See the Si5380 Reference Manual for details.
20
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Si5380 Rev D Data Sheet • Functional Description
3.9 Custom Factory Preprogrammed Devices
For applications where a serial interface is not available for programming the device, custom pre-programmed parts can be ordered
with a specific configuration written into NVM. A factory pre-programmed device will generate clocks at power-up. Custom, factory-preprogrammed devices are available. Use the ClockBuilder Pro custom part number wizard (www.silabs.com/clockbuilderpro) to quickly
and easily request and generate a custom part number for your configuration.
es
ig
ns
In less than three minutes, you will be able to generate a custom part number with a detailed data sheet addendum matching your
design’s configuration. Once you receive the confirmation email with the data sheet addendum, simply place an order with your local
Silicon Labs sales representative. Samples of your pre-programmed device will ship to you typically within two weeks.
3.10 Enabling Features and/or Configuration Settings Not Available in ClockBuilder Pro for Factory Pre-programmed Devices
As with essentially all software utilities, ClockBuilder Pro is continuously updated and enhanced. By registering at www.silabs.com and
opting in for updates to software, you will be notified whenever changes are made and what the impact of those changes are. This
update process will ultimately enable ClockBuilder Pro users to access all features and register setting values documented in this data
sheet and the Si5380 Reference Manual .
N
ew
D
However, if you must enable or access a feature or register setting value so that the device starts up with this feature or a register
setting, but the feature or register setting is NOT yet available in CBPro, you must contact a Silicon Labs applications engineer for
assistance. Examples of this type of feature or custom setting are the customizable output amplitude and common voltages for the
clock outputs. After careful review of your project file and custom requirements, all Silicon Labs applications engineer will email back
your CBPro project file with your specific features and register settings enabled, using what is referred to as the manual "settings
override" feature of CBPro. "Override" settings to match your request(s) will be listed in your design report file. Examples of setting
"overrides" in a CBPro design report are shown below:
Name
Type
Target
Dec Value
Hex Value
0x0535[0]
FORCE_HOLD
No NVM
N/A
1
0x1
0128[6:4]
OUT6_AMPL
User
OPN and EVB
5
0x5
m
en
de
d
Location
fo
r
Table 3.4. Setting Overrides
N
ot
R
ec
om
Once you receive the updated design file, simply open it in CBPro. After you create a custom OPN, the device will begin operation after
startup with the values in the NVM file, including the Silicon Labs-supplied override settings.
21
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Si5380 Rev D Data Sheet • Functional Description
Place sample
order
Do I need a
pre-programmed device
with a feature or setting
which is unavailable in
ClockBuilder Pro?
No
Configure device
using CBPro
N
ew
m
en
de
d
Receive
updated CBPro
project file
from
Silicon Labs
with “Settings
Override”
Yes
fo
r
Contact Silicon Labs
Technical Support
to submit & review
your
non-standard
configuration
request & CBPro
project file
D
Yes
Generate
Custom OPN
in CBPro
es
ig
ns
Start
Load project file
into CBPro and test
Does the updated
CBPro Project file
match your
requirements?
Figure 3.15. Flowchart to Order Custom Parts with Features not Available in CBPro
N
ot
R
ec
om
Note: Contact Silicon Labs Technical Support at www.silabs.com/support/Pages/default.aspx.
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Si5380 Rev D Data Sheet • Register Map
4. Register Map
N
ot
R
ec
om
m
en
de
d
fo
r
N
ew
D
es
ig
ns
For a complete list of registers and settings, pleas e refer to the Si5380 Reference Manual.
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Si5380 Rev D Data Sheet • Electrical Specifications
5. Electrical Specifications
Table 5.1. Recommended Operating Conditions 1
Maximum Junction Temperature
Core Supply Voltage
Min
Typ
Max
Unit
TA
–40
25
85
°C
TJMAX
—
—
125
°C
VDD
1.71
1.80
1.89
V
VDDA
3.14
3.30
3.47
V
3.14
3.30
3.47
V
2.37
2.50
2.62
V
1.71
1.80
1.89
V
VDDO
Output Driver Supply Voltage
es
ig
ns
Ambient Temperature
Symbol
D
Parameter
N
ot
R
ec
om
m
en
de
d
fo
r
N
ew
Note:
1. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical
values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted.
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Si5380 Rev D Data Sheet • Electrical Specifications
Table 5.2. DC Characteristics
Symbol
Core Supply Current 1,2
Test Condition
Min
Typ
Max
Unit
IDD
—
190
310
mA
IDDA
—
125
135
mA
—
36
—
22
—
25
LVPECL Output 3
@ 1474.56 MHz
LVPECL Output 3
LVDS Output 3
D
@ 153.6 MHz
@ 1474.56 MHz
LVDS Output 3
IDDO
@ 153.6 MHz
3.3 V LVCMOS Output 4
@ 153.6 MHz
mA
26
mA
29
mA
15
18
mA
—
22
30
mA
—
18
23
mA
—
12
16
mA
—
1300
1600
mW
fo
r
2.5 V LVCMOS Output 4
41
—
N
ew
Output Buffer Supply
Current 2, 5
es
ig
ns
Parameter
@ 153.6 MHz
1.8 V LVCMOS Output 4
m
en
de
d
@ 153.6 MHz
Total Power Dissipation 1, 2
Pd
Typical Outputs
om
Notes:
1. Si5380 test configuration: 3 × 3.3 V LVPECL outputs enabled at 122.88 MHz, 2 × 3.3 V LVPECL outputs enabled at 491.52 MHz,
1 × 3.3 V LVPECL output enabled at 983.04 MHz. Excludes power in termination resistors.
2. Detailed power consumption for any configuration can be estimated using ClockBuilder Pro when an evaluation board (EVB) is
not available. All EVBs support detailed current measurements for any configuration.
3. Differential outputs terminated into an ac-coupled 100 Ω load.
4. LVCMOS outputs measured into a 5-inch 50 Ω PCB trace with 5 pF load. The LVCMOS outputs were set to
OUTx_CMOS_DRV=3, which is the strongest driver setting. Refer to the Si5380 Reference Manual for more details on register
settings.
5. VDDO0 supplies power to both OUT0 and OUT0A buffers. Similarly, VDDO9 supplies power to both OUT9 and OUT9A buffers.
LVCMOS Output Test Configuration
IDDO
ec
Differential Output Test Configuration
R
OUT
50
N
ot
IDDO
100
OUTb
25
Trace length 5
inches
0.1 uF
50
0.1 uF
50
OUT
OUTb
499 Ω
4.7 pF
50
499 Ω
4.7 pF
0.1 uF
50 Ω Scope Input
56 Ω
0.1 uF
50 Ω Scope Input
56 Ω
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Si5380 Rev D Data Sheet • Electrical Specifications
Table 5.3. Input Clock Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
737.28
MHz
fIN_DIFF
Input Frequency Range
fIN_SE
Differential
All Single-ended Signals
(including LVCMOS)
Differential AC-coupled
FIN < 245.76 MHz
11.52
—
11.52
—
100
—
225
—
Voltage Swing1
VIN
245.76 MHz < FIN <
737.28 MHz
1800
mVpp_se
1800
mVpp_se
—
3600
mVpp_se
400
—
—
V/µs
40
—
60
%
—
2.4
—
pF
—
16
—
kΩ
—
8
—
kΩ
11.52
—
245.76
MHz
VIL
—
—
0.4
V
VIH
0.8
—
—
V
SR
400
—
—
V/µs
1.6
—
—
ns
—
8
—
kΩ
—
54
—
MHz
SR
Duty Cycle
DC
Capacitance
CIN
RIN_DIFF
m
en
de
d
RIN_SE
fo
r
Slew Rate 2, 3
Input Resistance Single-Ended
MHz
100
FIN < 245.76 MHz
Input Resistance Differential
N
ew
Single-Ended AC-coupled
245.76
D
Differential AC-coupled
es
ig
ns
Standard Input Buffer with Differential or Single-Ended/LVCMOS—AC-coupled (IN0, IN1, IN2, IN3/FB_IN)
Pulsed CMOS Input Buffer—DC-coupled (IN0, IN1, IN2, IN3/FB_IN) 4
fIN_PULSED_CM
Input Frequency
OS
Input Voltage Thresholds4
Slew Rate 2, 3
Input Resistance
PW
om
Minimum Pulse Width
Pulse Input
RIN
ec
REFCLK (applied to XA/XB)
Frequency required for optimum performance
fIN_REF
Total Frequency Tolerance 6
fRANGE
–100
—
+100
ppm
VIN_SE
365
—
2000
mVpp_se
VIN_DIFF
365
—
2500
mVpp_diff
400
—
—
V/µs
40
—
60
%
R
REFCLK Frequency 5
N
ot
Input Voltage Swing
Slew Rate 2 , 3
SR
Input Duty Cycle
DC
26
Imposed for best phase
noise performance
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Si5380 Rev D Data Sheet • Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Notes:
1. Voltage swing is specified as single-ended mVpp.
OUTx
Vcm
Vpp_se
Vcm
Vpp_se
Vpp_diff = 2*Vpp_se
OUTxb
es
ig
ns
2. Recommended for specified jitter performance. Jitter performance can degrade if the minimum slew rate specification is not met
(see Family Reference Manual).
3. Rise and fall times can be estimated using the following simplified equation: tr/tf80-20 = ((0.8 – 0.2) * VIN_Vpp_se) / SR.
N
ew
D
4. Pulsed CMOS mode is intended primarily for single-end LVCMOS input clocks < 1 MHz, which must be dc-coupled, having a
duty cycle significantly less than 50%. A common application example is a low frequency video frame sync pulse. Since the
input thresholds (VIL, VIH) of the input buffer are non-standard (0.40 and 0.80 V, respectively), refer to the input attenuator
circuit for dc-coupled Pulsed LVCMOS in the Si5380 Reference Manual. Otherwise, for standard LVCMOS input clocks, use the
"AC-coupled Single-Ended" mode as shown in Figure 3.13 Supported Output Terminations on page 18.
5. The REFCLK frequency for the Si5380 is fixed at 54 MHz. Contact Silicon Labs technical support for more information.
6. Includes initial tolerance, drift after reflow, change over temperature (–40 °C to +85 °C), VDD variation, load pulling, and aging.
Table 5.4. Serial and Control Input Pin Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
VIL
Input Voltage Thresholds
Input Resistance
Minimum Pulse Width
—
—
0.3xVDDIO1
V
0.7 x
VDDIO1
—
—
V
CIN
—
2
—
pF
IL
—
20
—
kΩ
100
—
—
ns
VIH
m
en
de
d
Input Capacitance
fo
r
Si5380 Serial and Control Input Pins (I2C_SEL, IN_SEL[1:0], RSTb, OEb, SYNCb, PDNb, A1/SDO, SDA/SDIO, SCLK, A0/CSb)
PW
RSTb, SYNCb, PDNb
N
ot
R
ec
om
Note:
1. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. See the Si5380 Reference Manual for more details
on the register settings.
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Si5380 Rev D Data Sheet • Electrical Specifications
Table 5.5. Differential Clock Output Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
0.480
—
1474.56
MHz
f ≤ 400 MHz
48
—
52
%
f > 400 MHz
45
—
55
%
fOUT
Duty Cycle
DC
Output-Output Skew
TSK
Outputs at 737.28 MHz
connected to the same
"N-divider"
—
—
75
ps
TSK_OUT
Measured from the positive
to negative output pins
—
0
50
ps
VDDO =
3.3 V or
VOUT
LVDS
2.5 V or
1.8 V
900
VDDO =
LVDS
1.10
1.2
1.3
1.90
2.0
2.1
1.1
1.2
1.3
0.8
0.9
1.00
tR/tF
—
100
150
ps
ZO
—
100
—
Ω
10 kHz sinusoidal noise
—
–101
—
dBc
100 kHz sinusoidal noise
—
–96
—
dBc
500 kHz sinusoidal noise
—
–99
—
dBc
1 MHz sinusoidal noise
—
–97
—
dBc
Measured spur from adjacent output
—
–72
—
dB
VDDO =
LVPECL
LVDS
om
ec
PSRR
XTALK
sub-LVDS
V
R
Output-Output Crosstalk3
LVPECL
m
en
de
d
2.5 V
fo
r
750
VCM
Power Supply Noise Rejection 2
mVpp_se
640
1.8 V
Differential Output Impedance
510
LVPECL
VDDO =
Rise and Fall Times (20% to
80%)
430
VDDO = 3.3 V
or 2.5 V
3.3 V
Common Mode Voltage1
350
N
ew
Output Voltage Amplitude
1
D
OUT-OUTb Skew
es
ig
ns
Output Frequency
N
ot
Notes:
1. Output amplitude and common mode voltage are programmable through register settings and can be stored in NVM. Each output
driver can be programmed independently. The maximum LVDS single-ended amplitude can be up to 110 mV higher than the
TIA/EIA-644 maximum. Refer to the Si5380 Reference Manual for recommended output register settings. Not all combinations of
voltage amplitude and common mode voltages settings are possible.
2. Measured for 153.6 MHz carrier frequency. 100 mVpp of sinewave noise added to VDDO when programmed at 3.3 V.
3. Measured across two adjacent outputs, both in LVDS mode, with the victim running at 155.52 MHz and the aggressor at 156.25
MHz. These output frequencies are generated using non-production engineering modes only for test. Refer to application note,
"AN862: Optimizing Si534x Jitter Performance in Next Generation Internet Infrastructure Systems", for guidance on crosstalk
optimization. Note that all active outputs must be terminated when measuring crosstalk
28
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Si5380 Rev D Data Sheet • Electrical Specifications
Table 5.6. LVCMOS Clock Output Specifications
Symbol
Test Condition
Min
Typ
Max
Unit
0.480
—
245.76
MHz
fOUT < 100 MHz
48
—
52
100 MHz < fOUT < 245.76 MHz
45
—
Output Frequency
Duty Cycle
DC
VDDO = 3.3 V
IOH = –10 mA
OUTx_CMOS_DRV=2
IOH = –12 mA
OUTx_CMOS_DRV=3
IOH = –17 mA
—
VDDO x 0.85
VDDO = 2.5 V
VOH
OUTx_CMOS_DRV=1
IOH = –6 mA
OUTx_CMOS_DRV=2
IOH = –8 mA
OUTx_CMOS_DRV=3
IOH = –11 mA
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
N
ew
Output Voltage High 1, 2, 3
55
D
es
OUTx_CMOS_DRV=1
VDDO x 0.85
%
ig
ns
Parameter
V
V
VDDO = 1.8 V
IOH = –4 mA
OUTx_CMOS_DRV=3
IOH = –5 mA
fo
r
OUTx_CMOS_DRV=2
VDDO x 0.85
V
Output Voltage Low 1, 2, 3
OUTx_CMOS_DRV=1
IOL = 10 mA
—
—
OUTx_CMOS_DRV=2
IOL = 12 mA
—
—
OUTx_CMOS_DRV=3
IOL = 17 mA
—
—
om
ec
R
N
ot
LVCMOS Rise and Fall
Times 3
(20% to 80%)
29
tr/tf
VDDO x 0.15
V
VDDO x 0.15
V
VDDO x 0.15
V
VDDO = 2.5 V
IOL = 6 mA
—
—
OUTx_CMOS_DRV=2
IOL = 8 mA
—
—
OUTx_CMOS_DRV=3
IOL = 11 mA
—
—
OUTx_CMOS_DRV=1
m
VOL
en
de
d
VDDO = 3.3 V
VDDO = 1.8 V
OUTx_CMOS_DRV=2
IOL = 4 mA
—
—
OUTx_CMOS_DRV=3
IOL = 5 mA
—
—
VDDO = 3.3 V
—
400
600
ps
VDDO = 2.5 V
—
450
600
ps
VDDO = 1.8 V
—
550
750
ps
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Si5380 Rev D Data Sheet • Electrical Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Notes:
1. Driver strength is a register programmable setting and stored in NVM. Options are OUTx_CMOS_DRV = 1, 2, 3. Refer to the
Si5380 Reference Manual for recommended output register settings.
2. IOL/IOH is measured at VOL/VOH as shown in the DC test configuration
AC Output Test Configuration
DC Test Configuration
Trace length 5 inches
IOL/IOH
IDDO
50
OUT
Zs
499 Ω
4.7 pF
0.1 uF
50 Ω Scope Input
56 Ω
OUTb
VOL/VOH
499 Ω
0.1 uF
50
50 Ω Scope Input
D
56 Ω
N
ot
R
ec
om
m
en
de
d
fo
r
N
ew
4.7 pF
es
ig
ns
3. A 5 pF capacitive load is assumed. The LVCMOS outputs were set to OUTx_CMOS_DRV = 3.
30
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Si5380 Rev D Data Sheet • Electrical Specifications
Table 5.7. Output Serial and Status Pin Specifications
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
—
V
VDDIO x
0.15
V
VOH
IOH = –2 mA
VDDIO x
0.85
—
VOL
IOL = 2 mA
—
—
Output Voltage 1, 2
es
ig
ns
Si5380 Output Serial and Status Pins (LOLb, INTRb, SDA/SDIO2, A1/SDO)
Notes:
1. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. See the Si5380 Reference Manual for more details
on the register settings.
N
ew
D
2. The VOH specification does not apply to the open-drain SDA/SDIO output when the serial interface is in I2C mode or is unused,
with I2C_SEL pulled high internally. VOL remains valid in all cases.
Table 5.8. Performance Characteristics
PLL Bandwidth Programming
Range 1
PLL Lock Time2
Max
Unit
fBW
Bandwidth is register
programmable
0.1
—
4000
Hz
tSTART
Time from power-up to
when the device generates free-running clocks
—
370
450
ms
—
280
300
ms
—
—
15
ms
Measured with a frequency plan running a 24.576
MHz input, 24.576 MHz
output, and a Loop Bandwidth of 4 Hz
—
—
0.1
dB
JTOL
Compliant with G.8262
Options 1 and 2 Carrier Frequency = 2.103125
GHz; Jitter Modulation
Frequency = 10 Hz
—
3180
—
UI pk-pk
tSWITCH
Manual or automatic
switch between two input
clocks at same frequency7
—
—
2.0
ns
–20
—
20
ppm
—
—
200
ps
—
65
80
fs rms
Fastlock enabled
Pull-in Range
Input-to-Output Delay Variation
RMS Phase Jitter 4
FIN = 19.2 MHz
tRDY
om
ec
R
Maximum Phase Transient During a Hitless Switch
N
ot
Typ
JPK
Jitter Peaking
31
Min
tACQ
POR to Serial Interface Ready 3
Jitter Tolerance
Test Condition
m
en
de
d
Initial Start-Up Time
Symbol
fo
r
Parameter
ωP
tZDELAY
In Zero Delay Mode, Note
5
12 kHz to 20 MHz
JGEN
(measured @ 983.04
MHz)
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Si5380 Rev D Data Sheet • Electrical Specifications
Symbol
Phase Noise Performance 4
PN
(122.88 MHz Carrier
Frequency)
Spur Performance 4 (122.88
MHz Carrier Frequency)
Min
Typ
Max
Unit
10Hz
—
–72
—
dBc/Hz
100 Hz
—
–98
—
dBc/Hz
1 kHz
—
–126
—
dBc/Hz
10 kHz
—
–140
—
dBc/Hz
100 kHz
—
–148
—
dBc/Hz
1 MHz
—
–154
—
dBc/Hz
10 MHz
—
–165
—
dBc/Hz
Up to 1 MHz offset
—
–103
—
dBc
From 1 MHz to 30 MHz
offset
—
–95
—
dBc
D
SPUR
Test Condition
es
ig
ns
Parameter
N
ot
R
ec
om
m
en
de
d
fo
r
N
ew
Notes:
1. Actual loop bandwidth might be lower; refer to ClockBuilder Pro for actual value on your frequency plan.
2. Lock Time can vary significantly depending on several parameters, such as bandwidths, LOL thresholds, etc. For this case, lock
time was measured with nominal and fastlock bandwidths both set to 100 Hz, LOL set/clear thresholds of 3/0.3 ppm respectively,
using IN0 as clock reference by removing the reference and enabling it again, then measuring the delta time between the first
rising edge of the clock reference and the LOL indicator de-assertion.
3. Measured as time from valid VDD/VDDA rails (both >90% of settled voltage) to when the serial interface is ready to respond to
commands.
4. Jitter generation test conditions: fIN = 30.72 MHz, 3.3 V LVPECL, DSPLL LBW = 100 Hz. Jitter integrated from 12 kHz to 20 MHz
offset. Does not include jitter from PLL input reference.
5. In Zero Delay Mode, the maximum time difference between the input clock and the feedback input with both clocks at 10 MHz
and having the same slew rate. External input clock must have a rise time of < 200 ps. Fpfd < 128 kHz is not allowed as this may
increase the IO delay variation.
32
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Si5380 Rev D Data Sheet • Electrical Specifications
Table 5.9. I2C Timing Specifications (SCL, SDA)
Parameter
Symbol
Standard Mode
Fast Mode
100 kbps
400 kbps
Test Condition
Unit
Max
Min
—
100
—
400
kHz
25
35
25
35
ms
tHD:STA
4.0
—
0.6
—
µs
Low Period of the SCL Clock
tLOW
4.7
—
1.3
—
µs
HIGH Period of the SCL
Clock
tHIGH
4.0
—
—
µs
Set-up Time for a Repeated
START Condition
tSU:STA
4.7
—
0.6
—
µs
Data Hold Time
tHD:DAT
100
—
100
—
ns
Data Set-up Time
tSU:DAT
250
—
100
—
ns
Rise Time of Both SDA and
SCL Signals
tr
—
1000
20
300
ns
Fall Time of Both SDA and
SCL Signals
tf
—
300
—
300
ns
tSU:STO
4.0
—
0.6
—
µs
tBUF
4.7
—
1.3
—
µs
tVD:DAT
—
3.45
—
0.9
µs
tVD:ACK
—
3.45
—
0.9
µs
Set-up Time for STOP Condition
Bus Free Time between a
STOP and START Condition
Data Valid Time
0.6
N
ot
R
ec
om
Data Valid Acknowledge
Time
m
en
de
d
Hold Time (Repeated)
START Condition
When Timeout is Enabled
N
ew
—
fo
r
SMBus Timeout
D
fSCL
SCL Clock Frequency
Max
es
ig
ns
Min
33
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N
ew
D
es
ig
ns
Si5380 Rev D Data Sheet • Electrical Specifications
fo
r
Figure 5.1. I2C Serial Prot Timing Standard and Fast Modes
Symbol
Min
Typ
Max
Unit
fSPI
—
—
20
MHz
TDC
40
—
60
%
TC
50
—
—
ns
Delay Time, SCLK Fall to SDO Active
TD1
—
—
18
ns
Delay Time, SCLK Fall to SDO
TD2
—
—
15
ns
Delay Time, CSb Rise to SDO Tri-State
TD3
—
—
15
ns
Setup Time, CSb to SCLK
TSU1
5
—
—
ns
ec
Parameter
m
en
de
d
Table 5.10. SPI Timing Specifications (4-Wire)
Hold Time, SCLK Fall to CSb
TH1
5
—
—
ns
Setup Time, SDI to SCLK Rise
TSU2
5
—
—
ns
Hold Time, SDI to SCLK Rise
TH2
5
—
—
ns
Delay Time Between Chip Selects (CSb)
TCS
2
—
—
Tc
SCLK Frequency
SCLK Duty Cycle
N
ot
R
om
SCLK Period
34
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Si5380 Rev D Data Sheet • Electrical Specifications
TSU1
TD1
TC
SCLK
TH1
CSb
TH2
TCS
es
ig
ns
TSU2
SDI
TD2
TD3
SDO
D
Figure 5.2. 4-Wire SPI Serial Interface Timing
Symbol
fSPI
SCLK Duty Cycle
TDC
SCLK Period
TC
Delay Time, SCLK Fall to SDIO Turn-on
TD1
Delay Time, SCLK Fall to SDIO Next-bit
TD2
m
en
de
d
SCLK Frequency
Min
Typ
Max
Unit
—
—
20
MHz
40
—
60
%
50
—
—
ns
—
—
20
ns
—
—
15
ns
fo
r
Parameter
N
ew
Table 5.11. SPI Timing Specifications (3-Wire)
Delay Time, CSb Rise to SDIO Tri-State
TD3
—
—
15
ns
Setup Time, CSb to SCLK
TSU1
5
—
—
ns
TH1
5
—
—
ns
TSU2
5
—
—
ns
TH2
5
—
—
ns
TCS
2
—
—
Tc
Hold Time, SCLK Fall to CSb
Setup Time, SDI to SCLK Rise
Hold Time, SDI to SCLK Rise
om
Delay Time Between Chip Selects (CSb)
TSU1
TH1
TD1
ec
SCLK
TC
TD2
CSb
TH2
TCS
R
TSU2
N
ot
SDIO
Parameter
Crystal Frequency 1
35
TD3
Figure 5.3. 3-Wire SPI Serial Interface Timing
Table 5.12. Crystal Specifications
Symbol
fXTAL
Test Condition
Min
Typ
Max
Unit
—
54
—
MHz
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Si5380 Rev D Data Sheet • Electrical Specifications
Symbol
Total Frequency Tolerance 2
Min
Typ
Max
Unit
fRANGE
–100
—
+100
ppm
CL
—
8
—
pF
Load Capacitance
rESR
Equivalent Series Resistance
Shunt Capacitance
CO
Crystal Drive Level
dL
Test Condition
Refer to the Family Reference Manual to determine ESR and shunt capacitance.
The crystal resonator
must be able to tolerate
300 µW of drive level
—
—
es
ig
ns
Parameter
300
µW
Parameter
N
ew
Table 5.13. Thermal Characteristics 1
Symbol
ƟJA
Junction to Ambient
Junction to Case
Thermal Resistance
Junction to Board
Thermal Resistance
Junction to Board
Thermal Resistance
Still Air
22
Air Flow 1 m/s
19.4
Air Flow 2 m/s
18.3
ƟJC
9.5
ƟJB
9.4
ΨJB
9.3
ΨJT
0.2
Unit
°C/W
om
Junction to Top Center
Value
m
en
de
d
Thermal Resistance
Test Condition
fo
r
Si5380–64QFN
Thermal Resistance
D
Notes:
1. See the Si534x/8x Recommended Crystal, TCXO, and OCXO Reference Manual for a list of qualified 54 MHz crystals. The
Si5380 is designed to work with crystals that meet these specifications.
2. Includes initial tolerance, drift after reflow, change over temperature (–40 °C to +85 °C), VDD variation, load pulling, and aging.
N
ot
R
ec
Note:
1. Based on PCB Dimension: 3x4.5”, PCB Thickness: 1.6 mm, PCB Land/Via: 36, Number of Cu Layers: 4.
36
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Si5380 Rev D Data Sheet • Electrical Specifications
Table 5.14. Absolute Maximum Ratings 1, 2, 3, 4
Symbol
DC Supply Voltage
Test Condition
Value
Unit
VDD
–0.5 to 3.8
V
VDDA
–0.5 to 3.8
V
VDDO
VI15
IN0-IN3/FB_IN
IN_SEL[1:0],
RSTb, PDNb,OEb, SYNCb,
VI2
I2C_SEL, SCLK,
–0.5 to 3.8
V
–1.0 to 3.8
V
–0.5 to 3.8
V
D
Input Voltage Range
es
ig
ns
Parameter
A0/CSb, A1/SDO,
N
ew
SDA/SDIO
VI3
LU
ESD Tolerance
HBM
Storage Temperature Range
TSTG
Max Junction Temperature in Operation
TJCT
Soldering Temperature (Pb-free profile) 4
TPEAK
m
en
de
d
Soldering Temperature Time at TPEAK (Pbfree profile) 4
100 pF, 1.5 kΩ
fo
r
Latch-up Tolerance
XA/XB
TP
–0.5 to 2.7
V
JESD78 Compliant
2.0
kV
–55 to 150
°C
125
°C
260
°C
20 to 40
sec
N
ot
R
ec
om
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted
to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2. 64-QFN is RoHS-6 compliant.
3. For MSL rating and additional packaging information, go to http://www.silabs.com/support/quality/pages/RoHSInformation.aspx.
4. The device is compliant with JEDEC J-STD-020.
5. The minimum voltage at these pins can be as low as –1.0 V when an ac input signal is applied. See Table 5.3 Input Clock
Specifications on page 26 spec for Single-ended ac-coupled fIN < 245.76 MHz.
37
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Si5380 Rev D Data Sheet • Typical Application Diagrams
6. Typical Application Diagrams
IEEE
1588
GPS
N
Rx
ADC
LNA
0
90
N
ASIC
ADC
es
ig
ns
Stratum 3/
3E DPLL
CPRI
Tx
ASIC
N
DAC
0
90
OCXO
N
DAC
RF
Synth
D
Recovered Clock
30.72MHz x N
Base Band Unit
PA
LTE
Sampling
Clocks
N
ew
RF
Synth
Remote Radio
Head
JESD
204B
GPS
A/D
Stratum 3/
3E DPLL
ASIC
CPRI
m
en
de
d
JESD
204B
ASIC
SYSREF
DCLK
DCLK
Base Band Unit
LNA
Tx
PA
D/A
JESD
204B
OCXO
Rx
0
90
A/D
JESD
204B
SYSREF
IEEE
1588
fo
r
Figure 6.1. LTE Base Station Remote Radio Head
0
90
D/A
RF
Synth
RF
Synth
DCLK
SYSREF
SYSREF
DCLK
SYSREF
Recovered Clock
30.72MHz x N
Remote Radio
Head
Figure 6.2. LTE Base Station Using JESD204B Data Converters
N
ot
R
ec
om
DCLK
38
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Si5380 Rev D Data Sheet • Detailed Block Diagram
7. Detailed Block Diagram
54MHz
XTAL
IN_SEL
XB
Si5380
es
ig
ns
XA
OSC
÷R0A
÷P0
IN1
÷P1
IN2
÷P2
IN3/
FB_IN
÷P3
OUT0A
÷R0
DSPLL
OUT1
N
ew
÷R1
OUT0
D
IN0
÷R2
OUT2
÷R3
OUT3
÷R4
OUT4
÷R5
OUT5
÷R6
OUT6
÷R7
OUT7
÷R8
OUT8
÷R9
OUT9
÷R9A
OUT9A
fo
r
÷N0
I2C_SEL
SDA/SDI
÷N1
I2C/
SPI
m
en
de
d
A1/SDO
SCLK
÷N2
A0/CSb
NVM
÷N3
om
÷N4
INTRb
Status Monitor
N
ot
R
ec
LOLb
39
PDNb
RSTb
SYNCb
OEb
Figure 7.1. Si5380 Block Diagram
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Si5380 Rev D Data Sheet • Typical Operating Characteristics (Phase Noise & Jitter)
fo
r
N
ew
D
es
ig
ns
8. Typical Operating Characteristics (Phase Noise & Jitter)
N
ot
R
ec
om
m
en
de
d
Figure 8.1. Input = 61.44 MHz; Output = 983.04 MHz, 3.3 V LVPECL
Figure 8.2. Input = 61.44 MHz; Output = 1,474.56 MHz, 3.3 V LVPECL
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fo
r
N
ew
D
es
ig
ns
Si5380 Rev D Data Sheet • Typical Operating Characteristics (Phase Noise & Jitter)
N
ot
R
ec
om
m
en
de
d
Figure 8.3. Input = 61.44 MHz; Output = 245.76 MHz, 3.3 V LVPECL
41
Figure 8.4. Input = 61.44 MHz; Output = 122.88 MHz, 3.3 V LVPECL
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Si5380 Rev D Data Sheet • Pin Description
IN0
IN3b/FB_INb
IN3/FB_IN
VDD
OUT9A
OUT9Ab
VDDO9
OUT9
OUT9b
OUT8
OUT8b
VDDO8
OUT7
OUT7b
VDDO7
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
IN1
1
48
SYNCb
IN1b
2
47
IN_SEL0
3
46
LOLb
VDD
IN_SEL1
4
45
OUT6
PDNb
5
44
OUT6b
RSTb
6
43
VDDO6
X1
7
42
OUT5
XA
8
41
OUT5b
GND
Pad
es
ig
ns
IN0b
64
9. Pin Description
29
30
31
32
VDDO2
OUT2b
OUT2
VDD
D
N
ew
28
27
OUT1b
OUT1
26
VDDO1
36
VDDO4
35
OUT3
34
OUT3b
33
VDDO3
m
en
de
d
fo
r
25
RSVD
16
24
15
OUT0
IN2b
SCLK
23
14
OUT0b
IN2
22
13
VDDO0
OUT4b
VDDA
21
37
OUT0A
12
20
OUT4
INTRb
OUT0Ab
38
19
11
A0/CSb
I2C_SEL
OEb
18
VDDO5
39
17
40
10
A1/SDO
9
X2
SDA/SDIO
XB
N
ot
R
ec
om
Figure 9.1. Si5380 64-QFN Top View
42
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Si5380 Rev D Data Sheet • Pin Description
Table 9.1. Pin Descriptions
Pin Name
Pin Number
Pin Type1
XA
8
I
XB
9
I
X1
7
I
X2
10
I
IN0
63
I
IN0b
64
I
IN1
1
I
IN1b
2
I
IN2
14
I
IN2b
15
I
IN3/FB_IN
61
I
IN3b/FB_INb
62
I
es
ig
ns
Crystal Input. Input pin for external crystal (XTAL). Alternatively these pins can be driven with an external reference
clock (REFCLK). An internal register bit selects XTAL or
REFCLK mode. Default is XTAL mode. Single-ended inputs
must be connected to the XA pin, with the XB pin appropriately terminated.
XTAL Shield. Connect these pins directly to the crystal
ground pins. Both the X1/X2 pins and Crystal ground pins
should be separated from the PCB ground plane. Refer to
the Reference Manual for layout guidelines.
N
ew
D
Clock Inputs. These pins accept an input clock for synchronizing the device. They support both differential and
single-ended clock signals. Refer to 3.3.1 Input Configuration and Terminations for input termination options. These
pins are high-impedance and must be terminated externally,
when being used. The negative side of the differential input
must be ac-grounded when accepting a single-ended clock.
Unused inputs may be left unconnected.
m
en
de
d
fo
r
Clock Input 3/External Feedback Input.
By default, these pins are used as the 4th clock input (IN3/
IN3b). They can also be used as the external feedback
input (FB_IN/FB_INb) for the optional zero delay mode. See
section 5.3.6 for details on the optional zero delay mode.
N
ot
R
ec
om
Outputs
Function
43
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Si5380 Rev D Data Sheet • Pin Description
Pin Name
Pin Number
Pin Type1
OUT0A
21
O
OUT0Ab
20
O
OUT0
24
O
OUT0b
23
O
OUT1
28
O
OUT1b
27
O
OUT2
31
O
OUT2b
30
O
OUT3
35
O
OUT3b
34
O
OUT4
38
O
OUT4b
37
O
OUT5
42
O
OUT5b
41
O
OUT6
45
O
OUT6b
44
O
OUT7
51
O
OUT7b
50
O
OUT8b
OUT9
OUT9b
OUT9A
54
O
53
O
56
O
55
O
59
O
58
O
om
OUT9Ab
es
ig
ns
D
N
ew
I
I2C Select. This pin selects the serial interface mode as I2C
(I2C_SEL = 1) or SPI (I2C_SEL = 0). This pin is internally
pulled high.
18
I/O
Serial Data Interface. This is the bidirectional data pin
(SDA) for the I2C mode, the bidirectional data pin (SDIO)
in the 3-wire SPI mode, or the input data pin (SDI) in 4-wire
SPI mode. When in I2C mode or unused, this pin must be
pulled-up using an external resistor of >= 1 kΩ. No pull-up
resistor is needed when in SPI mode.
A1/SDO
17
I/O
Address Select 1/Serial Data Output. In I2C mode this pin
functions as the A1 address input pin. In 4-wire SPI mode,
this is the serial data output (SDO) pin. This pin should be
externally pulled up or down when unused.
SCLK
16
I
Serial Clock Input. This pin functions as the serial clock
input for both I2C and SPI modes. When in I2C mode or unused, this pin must be pulled-up using an external resistor
of >= 1 kΩ. No pull-up resistor is needed when in SPI mode.
N
ot
R
SDA/SDIO
44
fo
r
39
ec
I2C_SEL
Output Clocks. These output clocks support programmable signal amplitude and common mode voltage. Desired output signal format is configurable using register control. Termination recommendations are provided
in 3.5.5 LVCMOS Output Terminations. Unused outputs
should be left unconnected.
m
en
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Serial Interface
Function
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Si5380 Rev D Data Sheet • Pin Description
Pin Name
Pin Number
Pin Type1
Function
A0/CSb
19
I
Address Select 0/Chip Select. This pin functions as the
hardware controlled address A0 in I2C mode. In SPI mode,
this pin functions as the chip select input (active low). This
pin is internally pulled-up.
INTRb
12
O
Interrupt. 2 This pin is asserted low when a change in device status has occurred. This pin must be pulled-up externally using a resistor of >= 1 kΩ. It should be left unconnected when not in use.
PDNb
5
I
Power Down. 2 The device enters into a low power mode
when this pin is pulled low. This pin is internally pulled-up. It
can be left unconnected when not in use.
RSTb
6
I
Device Reset. 2 Active low input that performs power-on
reset (POR) of the device. Resets all internal logic to a
known state and forces the device registers to their default
values. Clock outputs are disabled during reset. This pin is
internally pulled-up.
OEb
11
I
Output Enable. 2 This pin disables all outputs when held
high. This pin is internally pulled low and can be left unconnected when not in use.
LOLb
47
O
Loss Of Lock. 2 This output pin indicates when the DSPLL
is locked (high) or out-of-lock (low). When in use, this pin
must be pulled-up using an external resistor of >= 1 kΩ. It
can be left unconnected when not in use.
SYNCb
48
I
Output Clock Synchronization. 2 An active low signal on
this pin resets the output dividers for the purpose of realigning the output clocks. This pin is internally pulled-up
and can be left unconnected when not in use.
3
I
4
I
Input Reference Select. 2 The IN_SEL[1:0] pins are used
in manual pin controlled mode to select the active clock
input as shown in Table 3.2 Table 6.2 on page 12. These
pins are internally pulled-down and may be left unconnected when unused.
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Control/Status
IN_SEL0
IN_SEL1
Power
VDD
25
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RSVD
32
P
46
P
VDD
60
P
VDDA
13
P
Core Supply Voltage. The device operates from a 1.8 V
supply. A 1 µF bypass capacitor should be placed very
close to each pin.
Core Supply Voltage 3.3 V. This core supply pin requires
a 3.3 V power source. A 1 µF bypass capacitor should be
placed very close to this pin.
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VDD
Reserved. Leave disconnected.
45
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45
Si5380 Rev D Data Sheet • Pin Description
Pin Name
Pin Number
Pin Type1
VDDO0
22
P
VDDO1
26
P
VDDO2
29
P
VDDO3
33
P
VDDO4
36
P
VDDO5
40
P
VDDO6
43
P
VDDO7
49
P
VDDO8
52
P
VDDO9
57
P
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Output Clock Supply Voltage. Supply voltage (3.3 V, 2.5
V, 1.8 V) for OUTx, OUTxb Outputs. Note that VDDO0
supplies power to OUT0 and OUT0A; VDDO9 supplies
power to OUT9 and OUT9A. Leave VDDO pins of unused
output drivers unconnected. An alternative option is to connect the VDDO pin to a power supply and disable the output driver to minimize current consumption. A 1 µF bypass
capacitor should be placed very close to each connected
VDDO pin.
P
Ground Pad. This pad provides connection to ground and
must be connected for proper operation.
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GND PAD
Function
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Note:
1. I = Input, O = Output, P = Power
2. The IO_VDD_SEL control bit (0x0943 bit 0) selects 3.3 V or 1.8 V operation.
3. All status pins except I2C and SPI are push-pull.
46
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46
Si5380 Rev D Data Sheet • Package Outline
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10. Package Outline
Figure 10.1. Si5380 9x9 mm 64-QFN Package Diagram
MIN
A
A1
b
D
D2
MAX
0.80
0.85
0.90
0.00
0.02
0.05
0.18
0.25
0.30
5.10
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E2
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Dimension
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Table 10.1. Package Diagram Dimensions
9.00 BSC
5.20
5.30
0.50 BSC
9.00 BSC
5.10
5.20
5.30
0.30
0.40
0.50
—
—
0.15
bbb
—
—
0.10
ccc
—
—
0.08
ddd
—
—
0.10
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aaa
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Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
47
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Si5380 Rev D Data Sheet • PCB Land Pattern
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11. PCB Land Pattern
Figure 11.1. 9x9 mm 64-QFN Land Pattern
Dimension
C1
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Table 11.1. PCB Land Pattern Dimensions
8.90
C2
8.90
E
0.50
X1
0.30
Y1
0.85
X2
5.30
Y2
5.30
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Notes:
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General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition is calculated based on a fabrication
Allowance of 0.05 mm.
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Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 μm
minimum, all the way around the pad.
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Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 3x3 array of 1.25 mm square openings on 1.80 mm pitch should be used for the center ground pad.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
48
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48
Si5380 Rev D Data Sheet • Top Marking
64-QFN
D
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Si5380ARxxxxx-GM
YYWWTTTTTT
e4
TW
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12. Top Marking
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Figure 12.1. Si5380 Top Marking
Table 12.1. Top Marking Explanation
Characters
1
Si5380A-
Description
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Line
Base part number for Ultra Low Phase Noise, 12-output JESD204B Clock Generator:
Si5380A: 12-output clock generator; 64-QFN
– = Dash character.
2
Rxxxxx-GM
R = Product revision. (See Ordering Guide for current ordering revision).
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xxxxx = Customer specific NVM sequence number. Optional NVM code assigned for
custom, factory pre-programmed devices.
Circle w/ 1.6 mm diameter
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R
4
YYWWTTTTTT
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3
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Characters are not included for standard, factory default configured devices. See
Ordering Guide for more information.
-GM = Package (QFN) type and temperature range (–40 to +85 °C).
YYWW = Characters correspond to the year (YY) and work week (WW) of package
assembly.
TTTTTT = Manufacturing trace code.
Pin 1 indicator; left-justified
e4
Pb-free symbol; Center-Justified
TW
TW = Taiwan; Country of Origin (ISO Abbreviation)
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49
Si5380 Rev D Data Sheet • Device Errata
13. Device Errata
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Log in or register at www.silabs.com to access the device errata document.
50
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50
Si5380 Rev D Data Sheet • Revision History
14. Revision History
Revision 1.1
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February, 2020
• Refer to AN1006 for a list of changes from Rev B to Rev D.
• Updated Section 3.1.2. Si5380 Configuration for JESD204B Clock Generation.
• Updated Figure 3.3 XAXB Crystal Resonator and External Reference Clock Connection Options on page 10.
• Updated Figure 3.4 Termination of Differential and LVCMOS Input Signals on page 11.
• Updated Figure 3.13 Supported Output Terminations on page 18.
• Updated Figure 3.14 LVCMOS Output Terminations on page 19
• Updated Table 5.3 Input Clock Specifications on page 26.
• Updated Capacitance specification typical value to 2.4 pF.
• Updated Table 5.8 Performance Characteristics on page 31.
• Updated Table 5.12 Crystal Specifications on page 35.
• Updated Table 5.14 Absolute Maximum Ratings 1, 2, 3, 4 on page 37.
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Revision 1.0
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July 19, 2016
• Initial release.
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51
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