DATA SHEET
SKY65126-21: 800-900 MHz High Linearity 2 W Power
Amplifier
Applications
• WCDMA/CDMA/TDMA/GSM/LTE
• Repeaters
• WLL and ISM band transmitters
• Mobile radios
• Femto cell base stations
Features
Figure 1. SKY65126-21 Block Diagram
• High linearity: OIP3 > +48 dBm
• P1dB = +32.5 dBm
Description
• ACLR ≤ –45 dBc for POUT = +24.5 dBm
Skyworks SKY65126-21 is a fully-matched, surface mount Power
Amplifier (PA) designed for WCDMA, CDMA, TDMA, GSM, and LTE
radio, repeaters, transmitters, mobile radios, and Femto cell base
station applications operating in the 800 to 900 MHz band.
• EVM < 3% for POUT = +25 dBm (OFDM, 64-QAM)
• High efficiency: PAE = 29%
• Output power detector: 20 dB dynamic range
• High gain = 32 dB
• Internal RF match and bias circuits
• Single DC supply: 5 V
• Small footprint, MCM (20-pin, 6 x 6 mm) SMT package (MSL3,
260 °C per JEDEC J-STD-020)
The device is fabricated using Skyworks GaAs Heterojunction
Bipolar Transistor (HBT) process, which allows for single supply
operation while maintaining high efficiency and good linearity.
A block diagram of the SKY65126-21 is shown in Figure 1. The
device package and pinout for the 20-pin MCM are shown in
Figure 2.
Figure 2. SKY65126-21 Pinout – 20-Pin MCM
(Top View)
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Table 1. SKY65126-21 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
GND
Ground
11
VCC2
Stage 2 collector voltage
2
GND
Ground
12
N/C
No connection
3
GND
Ground
13
VCC1
Stage 1 collector voltage
4
VC_BIAS
Bias voltage
14
N/C
No connection
5
N/C
No connection
15
N/C
No connection
6
VREF1
Bias reference voltage 1
16
RF_IN
RF input
7
VREF2
Bias referance voltage 2
17
GND
Ground
8
GND
Ground
18
N/C
No connection
9
RF_OUT
RF output
19
GND
Ground
10
GND
Ground
20
GND
Ground
Table 2. SKY65126-21 Absolute Maximum Ratings
Maximum
Units
RF input power
Parameter
PIN
Symbol
Minimum
0
dBm
Supply voltage
VC_BIAS, VREF1, VREF2,
VCC1, and VCC2
6
V
Operating temperature
TOP
–40
+85
°C
Storage temperature
TST
–55
+125
°C
Junction temperature
TJ
+150
°C
Thermal resistance
ΘJC
20
°C/W
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This
device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the
human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all
times.
Technical Description
Electrical and Mechanical Specifications
The SKY65126-21 PA contains two amplifier stages. The
matching circuits for the input stage, interstage, and output stage
are contained within the device. An on-chip active bias circuit is
included within the device for both input and output stages, which
provides excellent gain tracking over temperature and voltage
variations.
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SKY65126-21 are provided in Table 2. Recommended operating
conditions are specified in Table 3 and electrical specifications
are provided in Table 4.
The SKY65126-21 is internally matched for optimum linearity and
efficiency. The input and output stages are independently
supplied using the VCC1 and VCC2 supply lines (pins 13 and 11,
respectively). The bias reference voltages for stages 1 and 2 are
supplied using common lines VREF1 and VREF2 (pins 6 and 7,
respectively). The DC control voltage that sets the bias to stages 1
and 2 is supplied by the VC_BIAS signal (pin 4).
Typical performance characteristics are shown in Figures 3
through 7.
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Table 3. SKY65126-21 Recommended Operating Conditions
Parameter
Symbol
Minimum
Supply voltage
VC_BIAS, VREF1,
VREF2, VCC1, and
VCC2
Operating frequency
f
800
Operating temperature
TOP
–40
Typical
Maximum
Units
5
V
+25
900
MHz
+85
°C
Table 4. SKY65126-21 Electrical Specifications (Note 1)
(VCC1 = VCC2 = VREF1 = VREF2 = VC_BIAS = 5 V, TC = +25 °C, f = 850 MHz, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
900
MHz
Frequency
f
800
Small signal gain
|S21|
30
Input return loss (small signal)
|S11|
9
11
dB
Output return loss (small signal)
|S22|
12
17
dB
1 dB Output Compression Point
OP1dB
CW
+30.5
+32.5
dBm
OIP3
POUT/tone = +19 dBm,
tone spacing = 1 MHz
+45
+48
dBm
rd
3 Order Output Intercept Point
32
dB
Noise Figure
NF
CW
4.5
6.0
dB
Adjacent Channel Leakage Ratio
@ POUT = +24.5 dBm
ACLR
WCDMA test tone #1:
64 DPCH, Δf = 5 MHz
–47
–45
dBc
Quiescent Current
ICCQ
No RF signal
283
340
mA
Operational current
IOP
POUT = +25 dBm
540
650
mA
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Typical Performance Characteristics
(VCC1 = VCC2 = VREF1 = VREF2 = VC_BIAS = 5 V, TC = +25 °C, f = 850 MHz, Unless Otherwise Noted)
Figure 3. S-Parameters vs Frequency
Figure 4. Gain vs Output Power
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Figure 5. OIP3 vs Output Power
(Tone Spacing = 1 MHz)
Figure 6. Noise Figure vs Frequency
Figure 7. ACLR vs Output Power
(WCDMA Test Tone #1, 64 DPCH, Δf = 5 MHz
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Evaluation Board Description
The SKY65126-21 Evaluation Board is used to test the
performance of the SKY65126-21 PA. An Evaluation Board
schematic diagram is provided in Figure 8. Table 5 provides the
Bill of Materials (BOM) list for Evaluation Board components.
An assembly drawing for the Evaluation Board is shown in
Figure 9. An Evaluation Board layer detail drawing is shown in
Figure 10. Layer detail physical characteristics are noted in
Figure 11.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65126-21 has special electrical
and thermal grounding requirements. This pad is the main
thermal conduit for heat dissipation. Since the circuit board
acts as the heat sink, it must shunt as much heat as possible
from the device. Therefore, design the connection to the
ground pad to dissipate the maximum wattage produced by
the circuit board. Multiple vias to the grounding layer are
required.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device.
Evaluation Board Test Procedure
Step 1: Connect RF test equipment to the input/output SMA
connectors.
Step 2: Connect DC ground.
Step 3: Connect all VDD, VREG, and VC_BIAS lines to a +5 V
supply. Verify that the ICCQ current is approximately
271 mA.
Step 4: Apply RF signal data at –20 dBm and observe that the
output level is approximately +11.5 dBm or that the gain
of the device is approximately 31.5 dB.
NOTE: It is important to adjust the VCC1 and VCC2 voltage
sources so that +5 V is measured at the board. High
collector currents drop the collector voltage significantly if
long leads are used. Adjust the bias voltage to
compensate.
Figure 8. SKY65126-21 Evaluation Board Schematic
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Table. 5. SKY65126-21 Evaluation Board Bill of Materials (BOM)
Component
Value
Size
0603
Product #
C1, C6, C11
3300 pF
SK204-000-007
C2, C3, C7, C10
68 pF
0603
5404R23-023
C8, C12, C13
10 μF
1206
5404R91-005
R1
360 Ω
0603
5424R20-038
R2
330 Ω
0603
5424R20-037
Manufacturer
Murata
Manufacturer’s Part #
Characteristics
GRM188R71H332KA01D
X7R, 50 V, ±10%
Murata
GRM1885C1H680JA01D
C0G, 50 V, ±5%
TDK
C3216X5R0J106KT
X5R, 6 V, ±10%
Rohm
MCR03EZHUJ360
50 V, 0.63 W, ±5%
Rohm
MCR03EZHUF330
50 V, 0.63 W, ±5%
Figure 9. Evaluation Board Assembly Drawing
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Figure 10. Evaluation Board Layer Detail
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Figure 11. Layer Detail Physical Characteristics
Application Circuit Notes
Center Ground. It is extremely important to sufficiently ground
the bottom ground pad of the device for both thermal and stability
reasons. Multiple small vias are acceptable and will work well
under the device if solder migration is an issue.
GND (pins 1, 2, 3, 8, 10, 17, 19, and 20). Attach all ground pins
to the RF ground plane with the largest diameter and lowest
inductance via that the layout allows. Multiple small vias are
acceptable and will work well under the device if solder migration
is an issue.
Figure 8) should be placed in the approximate location shown on
the Evaluation Board, although exact placement is not critical.
RF_IN (pin 16). Amplifier RF input pin (ZO = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
Package Dimensions
N/C (pins 5, 14, 15, and 18). These pins are open and may or
may not be connected to ground.
The PCB layout footprint for the SKY65152-11 is shown in
Figure 12. Typical case markings are shown in Figure 13.
Package dimensions for the 20-pin MCM are shown in Figure 14,
and tape and reel dimensions are provided in Figure 15.
VC_BIAS (pin 4). The bias supply voltage for stages 1 and 2,
typically set to +5 V.
Package and Handling Information
VREF1 (pin 6). Bias reference voltage for amplifier stage 1. This
signal should be operated over the same voltage range as VCC
with a nominal voltage of +5 V.
VREF2 (pin 7). Bias reference voltage for amplifier stage 2. This
signal should be operated over the same voltage range as VCC
with a nominal voltage of +5 V.
RF_OUT (pin 9). Amplifier RF output pin (ZO = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
VCC2 (pin 11). Supply voltage for the output (final) stage collector
bias (typically +5 V). To bypass VCC2, capacitors C10, C11, and
C12 (see Figure 8) should be placed in the approximate location
shown on the Evaluation Board, although exact placement is not
critical.
VCC1 (pin 13). Supply voltage for the first stage collector bias
(typically +5 V). To bypass VCC1, capacitors C6, C7, and C8 (see
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY65126-21 is rated to Moisture Sensitivity Level 3 (MSL3)
at 250 °C. It can be used for lead or lead-free soldering. For
additional information, refer to Skyworks Application Note, PCB
Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Figure 12. SKY65126-21 PCB Layout Footprint
Figure 13. SKY65126-21 Typical Case Markings
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Figure 14. SKY65126-21 20-Pin MCM Package Dimensions
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Figure 15. SKY65126-21 20-Pin MCM Tape and Reel Dimensions
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DATA SHEET • SKY65126-21 800-900 MHZ HIGH LINEARITY PA
Ordering Information
Model Name
SKY65126-21 Power Amplifier
Manufacturing Part Number
SKY65126-21
Evaluation Board Part Number
TW16-D190-001
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