DATA SHEET
SKY65386-11: 2575 to 2735 MHz Variable Gain Amplifier
Applications
Description
Base stations/transmit chains
Repeater transmit chains
Femto cells
The SKY65386-11 is a high linearity, Variable Gain Amplifier
(VGA). The device includes an input linear amplifier, a Variable
Voltage Attenuator (VVA), and an output Power Amplifier (PA). The
two amplifiers and voltage attenuator are optimized for superior
ACLR performance with WCDMA signals.
Features
The high linearity (high OP1dB, OIP3, and ACLR) and high
efficiency of this device make it ideal for use at the final stage (or
close to the final stage) of a wireless transmit chain.
Frequency range: 2575 to 2735 MHz
High gain: 25.5 dB
Attenuation range: 38 dB
OP1dB: +28.5 dBm
OIP3: +44 dBm
ACLR < –70 dBc (typical) for POUT = +12 dBm
Single DC supply: +5 V
The output of the first PA (PA1) is matched to the input of the VCA.
The output of the VCA is matched to the input of the second PA
(PA2). The RF_IN and RF_OUT signals (pins 1 and 8, respectively)
are both internally matched, including DC blocking capacitors.
The SKY65386-11 VGA uses low-cost Surface Mount Technology
(SMT) in the form of a compact, 8.385 x 8.385 mm 12-pin MultiChip Module (MCM), which allows for a highly manufacturable
low-cost solution. A functional block diagram is shown in
Figure 1. The pin configuration and package are shown in
Figure 2. Signal pin assignments and functional pin descriptions
are provided in Table 1.
Small MCM (12-pin, 8.385 x 8.385 mm) SMT package (MSL3,
260 C per JEDEC J-STD-020)
Skyworks Pb-free products are compliant with
all applicable legislation. For additional
information, refer to Skyworks Definition of
Lead (Pb)-Free, document number SQ04-0073.
VCTRL
RF_IN
Input Match
PA1
PA2
Output Match
RF_OUT
Variable Attenuator
S2326
Figure 1. SKY65386-11 Block Diagram
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VCC_AMP1
12
11
VCC_AMP2
GND
DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
10
GND
GND
2
8
RF_OUT
VCTRL
3
7
GND
4
5
6
GND
9
GND
1
GND
RF_IN
S2328
Figure 2. SKY65386-11 Pinout – 12-Pin MCM
(Top View)
Table 1. SKY65386-11 Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
RF_IN
RF input
7
GND
Ground
2
GND
Ground
8
RF_OUT
RF output
3
VCTRL
Variable attenuator control voltage
9
GND
Ground
4
GND
Ground
10
VCC_AMP2
Voltage supply for PA2 (after the variable
voltage attenuator)
5
GND
Ground
11
VCC_AMP1
Voltage supply for PA1 (before the variable
voltage attenuator)
6
GND
Ground
12
GND
Ground
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY65386-11 are provided
in Table 2. The recommended operating conditions are specified
in Table 3 and electrical specifications are provided in Table 4.
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DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
Table 2. SKY65386-11 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
Supply voltage
VCC_AMP1,
VCC_AMP2
5.5
V
Control voltage
VCTL
5.0
V
RF output power (CW)
POUT
+31
dBm
Thermal resistance
ΘJC
35
C/W
Operating case temperature
TC
–40
+85
C
Storage case temperature
TSTG
–55
+125
C
Junction temperature
TJ
+150
C
Thermal resistance
RTH
27
C/W
Electrostatic discharge:
ESD
250
250
50
V
V
V
Charged Device Model (CDM), Class 4
Human Body Model (HBM), Class 1A
Machine Model (MM), Class A
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65386-11 Recommended Operating Conditions
Parameter
Frequency range
Symbol
f
RF output power (CW)
POUT
Supply voltage, measured at terminals of
Evaluation Board
VCC_AMP1,
VCC_AMP2
Variable voltage attenuator control range
VCTRL
Ruggedness, load VSWR with no permanent
damage (@ P1dB)
PMAX_LOAD
Operating case temperature
TC
Minimum
Typical
2575
Maximum
Units
2735
MHz
+12
4.75
0
–40
5.00
dBm
5.25
V
3.3
V
10:1
–
+85
C
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DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
Table 4. SKY65386-11 Electrical Specifications (Note 1)
(VCC_AMP1 = VCC_AMP2 = 5 V, VCTRL = 0 V, f = 2650 MHz, Tc = +25 C, Characteristic Impedance [Zo] = 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Frequency range
f
Small signal gain
S21
VCTL = 0 V
VCTL = 3.3 V
Attenuation control range
ATTN_RANGE
Output 1dB Compression Point
rd
3 Order Output Intercept Point
Min
Typical
2575
Max
Units
2735
MHz
+24.0
+25.5
–13.0
dB
dB
CW
33
38
dB
OP1dB
CW
+27.5
+28.5
dBm
OIP3
PTONE = +12 dBm,
Δf = 1 MHz
+41.5
+44.0
dBm
Adjacent Channel Leakage Ratio
ACLR
WCDMA, test mode 1,
POUT = +12 dBm
–70
–65
dBc
Noise Figure
NF
At maximum gain,
VCTRL = 0 V
3.9
5.0
dB
Input return loss
|S11|
PIN = +30 dBm
8
7
13
dB
Output return loss
|S22|
Quiescent current
IQ
No RF
327
13
380
mA
dB
Operating current
IOP
POUT = +12 dBm, CW
340
390
mA
Maximum VSWR for stable operation
VSWR_MAX
CW
8:1
–
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Evaluation Board Description
The Skyworks SKY65386-11 Evaluation Board is used to test the
performance of the SKY65386-11 VGA. An Evaluation Board
schematic diagram is provided in Figure 3. An assembly drawing
for the Evaluation Board is shown in Figure 4 and the layer detail
is provided in Figure 5. The layer detail physical characteristics
are noted in Figure 6.
Capacitors C1, C2, and C3 provide DC bias decoupling and RF
bypass for VCC_AMP1 (pin 11). Capacitors C4, C5, and C6 provide
DC bias decoupling and RF bypass for VCC_AMP2 (pin 10).
Capacitor C7 provides decoupling for VCTRL (pin 3).
Pins 1 and 8 are the RF input and output signals, respectively.
Pins 2, 4, 5, 6, 7, 9, 12, and the package backside metal are
ground pins that provide the DC, RF, and thermal ground.
the amplifier. As such, design the connection to the ground pad
to dissipate the maximum wattage produced to the circuit
board. Multiple vias to the grounding layer are required. Filled or
capped vias are recommended.
It is recommended that the layout for the VCC_AMP1 and
VCC_AMP2 signals follow what is shown in Figure 4. The
VCC_AMP1 and VCC_AMP2 traces can be tied together to share
the same power supply. The connecting node should not be
placed close to the package pins. The connecting node should
be connected closer to components C1 and C4 (see Figure 3).
This is to provide isolation between VCC_AMP1 and VCC_AMP2.
NOTE: Junction temperature (Tj) of the device increases with a
poor connection to the ground pad and ground. This
reduces the life of the device.
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration.
Proper isolation must be provided between the VCC_AMP1 and
VCC_AMP2 pins.
Paths to ground should be made as short as possible.
The ground pad of the SKY65386-11 VGA has special electrical
and thermal grounding requirements. This pad is the main
thermal conduit for heat dissipation. Since the circuit board acts
as the heat sink, it must shunt as much heat as possible from
Testing Procedure
Use the following procedure to set up the SKY65386-11
Evaluation Board for testing:
1. Connect a 5.0 V supply to the VCC_AMP1 and VCC_AMP2
pins. Connect the VCTRL signal to a power supply and set the
power supply to 0 V. If available, enable the current limiting
function of the power supply to 450 mA.
2. Connect a signal generator to the RF signal input port. Set it to
the desired RF frequency at a power level of –20 dBm or less
to the Evaluation Board but do NOT enable the RF signal.
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DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
6. Take measurements.
The SKY65386-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
CAUTION: If any of the output signals exceed the rated
maximum values, the SKY65386-11 Evaluation Board
can be permanently damaged.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Package and Handling Information
Package Dimensions
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The PCB footprint drawing for the SKY65386-11 is shown in
Figure 7. Package dimensions for the 12-pin MCM are shown in
Figure 8, and tape and reel dimensions are provided in Figure 9.
3. Connect a spectrum analyzer to the RF signal output port.
4. Enable the power supply.
5. Enable the RF signal.
J3
2
VCTRL VDD
1
VCC
4-Header
11
GND
12
J1
1
RF Input
RF_IN
10
VCC_AMP2
3
VCC_AMP1
4
C3
DNI
C2
1000 pF
C1
10 μF
C6
22 pF
C5
1000 pF
C4
10 μF
PA1 Voltage
Supply
PA2 Voltage
Supply
9
GND
J2
8
2
GND
3
7
GND
4
5
GND
VCTRL
GND
C7
1000 pF
GND
Variable Attenuator
Control Voltage
RF Output
RF_OUT
6
S2329
Figure 3. SKY65386-11 Evaluation Board Schematic
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DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
J3
J1
J2
S2330
Figure 4. SKY65386-11 Evaluation Board Assembly Drawing
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DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
Layer 1: Top – Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
S2331
Figure 5. SKY65386-11 Evaluation Board Layer Detail
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DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
Cross Section
Name Thickness (mm) Material
εr
Pri
0.035
Cu-1 oz.
–
Die1
0.250
Rogers 4350
–
L2
0.035
Cu-1 oz.
–
Die2
0.200
FR4
4.0
L3
0.035
Cu-1 oz.
–
Die3
0.250
FR4
4.0
Sec
0.035
Cu-1 oz.
–
S2631
Figure 6. Layer Detail Physical Characteristics
Pin 12
Stencil aperture size of 80% to 100%
of the module/pkg solder mask openings
8.685
4X 1.65 Pitch
Pin 1 Indicator
0.20 X 0.20
12X 1.091
Pin 1
12X 0.81
25X 0.875
8.685
4X 1.91 Pitch
Exposed Center Pad
Component
Outline
0.125 Typ
25X 0.875
Stencil Aperture
Top View
8.685
Thermal Via Array,
∅0.3 mm on 0.6 mm pitch
will improve thermal performance.
NOTE: thermal vias should
be tented with solder mask,
30-35 mm Cu plating recommended.
Pin 12
Pin 12
8.785
1.65 Pitch
4X 1.65 Pitch
Pin 1 Indicator
0.20 X 0.20
12X 1.191
0.25 Typ.
Pin 1
Pin 1
12X 0.91
8.685
8.785
4X 1.91 Pitch
2X 2.4375
0.6 Pitch
5X 0.81
Component
Outline
Component
Outline
5X 1.091
Exposed Center Pad
Metallization
Top View
2X 2.4375
Solder Mask Opening
Top View
S2367
All dimensions are in millimeters
Figure 7. SKY65386-11 PCB Layout Footprint
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Opening size of
60% to 100% of
exposed center
opening shown
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B
Pin 1
Indicator
C
10X 2
8.385
6X 4.0925
DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
Pin 1 Indicator
See Detail B
6X 4.0925
Pin 1
10X 2
10X 1
8.385
0
A
0.15 A B C
0.10
12x SMT Pad
0.1 M A B C
Side View
Top View
0.841 ± 0.1
10X 1
A
1.35 ± 0.1
(0.1)
0.875
0
4X 1.65
4X 1.91
24X Solder Mask Opening
See Detail C
0.2 A B C
Bottom View
0.875
0.2 x 0.2
Metal Pad Edge
0.81 ± 0.05
0.875
0.875
5X R0.05 Max
Soldermask Edges
Detail A
Pad
Scale: 2X
4X R0.05 Max
Soldermask Edges
Detail B
24X Detail C
Scale: 2X
Scale: 2X
1X This Rotation
24X This Rotation
3X This Rotation
3X Rotated 180°
3X Rotated 90° CW
3X Rotated 90° CCW
Dimensioning and tolerancing according to ASME Y14.5M-1994.
Pads are metal defined.
All measurements are in millimeters
S2366
Figure 8. SKY65386-11 12-Pin MCM Package Dimensions
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DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
Pin #1
∅1.50 ± 0.10
2.00 ± 0.10
12.00 ± 0.10
4.00 ± 0.10
0.318 ± 0.013 T
1.75 ± 0.10
B
A
A
7.50 ± 0.10
5° Max
8.88 ± 0.10 (Bo)
16.00 +0.30/–0.10
B
2.14 ± 0.10 (Ko)
∅1.50 ± 0.25
B
8° Max
8.89 ± 0.10 (Ao)
A
Notes:
1. Carrier tape material: black conductive polycarbonate
or polystyrene.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 13.3 mm width.
4. Typical ESD surface resistivity is ≤108 Ohms/square per EIA, JEDEC
tape and reel specification.
5. Tolerance: .XX = ±0.10 mm.
6. All measurements are in millimeters.
Figure 9. SKY65386-11 Tape and Reel Dimensions
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S2630
DATA SHEET • SKY65386-11 VARIABLE GAIN AMPLIFIER
Ordering Information
Model Name
SKY65386-11 2575-2735 MHz Variable Gain Amplifier
Manufacturing Part Number
SKY65386-11
Evaluation Board Part Number
TW16-D590
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